Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
  • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07183—Means for monitoring
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
  • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
  • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07521—Aligning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires

Definitions

• the invention relates to wire bonding operations, and in particular, to methods of determining a height value and a height profile of a wire loop on a wire bonding machine.
• wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). More specifically, using a wire bonder (also known as a wire bonding machine) wire loops are formed between respective locations to be electrically interconnected.
• the primary methods of forming wire loops are ball bonding and wedge bonding.
• bonding energy may be used, including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy, amongst others.
• Wire bonding machines e.g., stud bumping machines are also used to form conductive bumps from portions of wire.
• a height of a wire loop e.g., a maximum height, or another height at a given location along a length of a wire loop.
• International Patent Application Publication WO 2009/002345 (entitled “METHOD OF DETERMINING A HEIGHT PROFILE OF A WIRE LOOP ON A WIRE BONDING MACHINE") describes conventional techniques for performing height measurements of wire loops, and is herein incorporated by reference in its entirety. Such conventional techniques may be used to measure a height of a wire loop along a desired path; however, in certain the situations, the actual path of a wire loop may be different from a desired or "design" path. For example, wire sway or wire leaning may result in a variation of the actual path of the wire loop - making measurement of the height of such conventional techniques unreliable.
• a method of determining a height value of a wire loop on a wire bonding machine includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
• a method of determining a height profile of a wire loop on a wire bonding machine includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop; and (e) repeating steps (b), (c), and (d) for a plurality of additional contact portions of the wire loop such that a plurality of height values are determined.
• the methods of the present invention may also be embodied as an apparatus (e.g., as part of the intelligence of a wire bonding machine), or as computer program instructions on a computer readable carrier (e.g., a computer readable carrier used in connection with a wire bonding machine).
• FIG. 1A is a block diagram side view of a wire bonding machine, and a workpiece on the wire bonding machine, useful for illustrating various exemplary embodiments of the invention
• FIG. IB is a top view of the workpiece of FIG. 1A;
• FIGS. 2A-2G are block diagram side views of the wire bonding machine and the workpiece of FIG. 1A, illustrating a method of determining a height profile of a wire loop in accordance with an exemplary embodiment of the invention
• FIGS. 3A-3F are block diagram side views of the wire bonding machine and the workpiece of FIG. 1A, illustrating another method of determining a height profile of a wire loop in accordance with an exemplary embodiment of the invention
• FIGS. 4A-4B are block diagram side views of the wire bonding machine and the workpiece of FIG. 1A, illustrating a method of determining a height of a wire loop in accordance with an exemplary embodiment of the invention
• FIG. 5 is a flow diagram illustrating a method of determining a height of a wire loop in accordance with an exemplary embodiment of the invention.
• FIG. 6 is a flow diagram illustrating a method of determining a height profile of a wire loop in accordance with an exemplary embodiment of the invention.
• aspects of the invention use an imaging system (e.g., a camera) on a wire bonding machine (e.g., in connection with a computer on the wire bonding machine) to determine the actual path of a wire loop (including any wire sway or wire lean). With the actual path provided using the imaging system, the actual wire loop height may be determined.
• an imaging system e.g., a camera
• a wire bonding machine e.g., in connection with a computer on the wire bonding machine
• aspects of the invention use images provided by an imaging system to measure wire sway and/or wire lean defects of a wire loop to establish feedback of robust x-axis, y-axis, and/or z-axis information in order to enable closed-loop control of wire loop shapes.
• semiconductor element is intended to refer to any structure including (or configured to include at a later step) a semiconductor chip or die.
• Exemplary semiconductor elements include a bare semiconductor die, a semiconductor die on a substrate (e.g., a leadframe, a PCB, a carrier, etc.), a packaged semiconductor device, a flip chip semiconductor device, a die embedded in a substrate, a stack of semiconductor die, a plurality of semiconductor die on a substrate, amongst others.
• the semiconductor element may include an element configured to be bonded or otherwise included in a semiconductor package (e.g., a spacer to be bonded in a stacked die configuration, a substrate, etc.).
• the term “height value” may refer to an actual height value of a portion of a wire loop, or a relative height value of a wire loop.
• the term, "height profile” refers to a plurality of height values along a length of a wire loop.
• Wire bonding machine 100 includes a bond head 102 carrying an imaging system 106 (e.g., a camera). A wire bonding tool 104 is carried by bond head 102. A conductive wire 112 is illustrated through wire bonding tool 104, terminating at a free air ball (FAB) 112a seated at the tip of wire bonding tool 104. Wire bonding machine 100 also includes a detection system 120 (e.g., sometimes referred to as a BITS system, bond integrity test system).
• a detection system 120 e.g., sometimes referred to as a BITS system, bond integrity test system.
• Detection system 120 (which includes a computer, or a computer connection) is used to detect a conductive coupling or connection between free air ball 112a and a portion of a wire loop (e.g., wire loop 116) (where such a conductive coupling may be established by way of a wire clamp 122 shown in FIGS. 2D-2G).
• a semiconductor element 108 e.g., a semiconductor die
• Wire loops 116 and 118 are illustrated providing electrical interconnection between semiconductor element 108 (e.g., with a "first bond" at a bonding location 108a, as in FIG. IB) and substrate 110 (e.g., with a "second bond” at a bonding location 110a, as in FIG. IB).
• Substrate 110 e.g., a lead frame
• Substrate 110a includes a plurality of bonding locations 110a (e.g., leads of a leadframe).
• Semiconductor element 108 includes a plurality of bonding locations 108a (e.g., bond pads).
• Wire loops 116 and 118 are illustrated in a "dashed form” (to illustrate a "design” or “simulated” wire loop) and a "solid form” (to illustrate an "actual” or “formed” wire loop).
• imaging system 106 e.g., imaging system 106 of wire bonding machine 100
• imaging e.g., “scanning" along the length of wire loop 116 to capture a path of wire loop 116 (e.g., the path in the x-y plane).
• imaging system 106 is illustrated imaging a portion of wire loop 116, more specifically a portion including the "top” of wire loop 116 (e.g., the portion of the wire loop with the greatest "height" with respect to substrate 110).
• FIG. 2A also illustrates imaging system 106 imaging an area including a portion of semiconductor element 108 and/or a first bond location of wire loop 116.
• imaging system 106 and bond head 102 have been moved along an x-axis (i.e., along the +x-direction).
• imaging system 106 is illustrated scanning another portion of wire loop 116, more specifically a portion including the "middle" of wire loop 116.
• imaging system 106 and bond head 102 have been moved along an x-axis (i.e., along the +x-direction).
• imaging system 106 is illustrated scanning yet another portion of wire loop 116, more specifically a portion including the "outermost" portion of wire loop 116 (i.e., the portion farthest in the +x-direction).
• imaging system 106 is also illustrated imaging an area including a portion of substrate 110 and/or a second bond location of wire loop 116.
• FIGS. 2A-2C Through the imaging operation of FIGS. 2A-2C, a path of wire loop 116 is detected. That is, because the actual wire loop 116 may be different from a design wire loop 116 (see FIGS. 1A-1B) (e.g., because of wire sway and/or wire sweep), the imaging operation of FIGS. 2A-2C provides the actual path (e.g., the path in the x-y plane) of wire loop 116. This actual path can be used to measure the height value of portions of wire loop 166 (e.g., see FIGS. 2D-2G).
• FIGS. 1A-1B the actual path in the x-y plane
• wire loop 116 is illustrated in a "dashed form” (to illustrate a "design” or “simulated” wire loop) and a “solid form” (to illustrate an "actual” or “formed” wire loop). More specifically, the path determined through the imaging operation(s) may be used to determine the locations of the wire loop (e.g., the locations of the wire loop in the x-y plane) to be contacted during the height measurements.
• wire bonding tool 104 (e.g., of wire bonding machine 100) is illustrated along a plurality of positions along wire loop 116.
• wire bonding tool 104 has been lowered (e.g., in the -z-direction) such that free air ball 112a of conductive wire 112 contacts wire loop 116.
• Wire bonding tool 104 has been moved towards a first contact portion of the wire loop 116 (e.g., in the path of wire loop 116).
• Wire bonding tool 104 is lowered toward this first contact portion using position data (e.g., a position in the x-y plane) determined through the imaging operation(s) described above in connection with FIGS.
• position data e.g., a position in the x-y plane
• Detection system 120 (e.g., BITS) is used to detect when free air ball 112a (e.g., a portion of a conductive wire 112 engaged with the wire bonding tool 104) contacts the first contact portion of wire loop 116. This detection is accomplished, for example, by detecting an electrically conductive path between free air ball 112a and the first contact portion of wire loop 116 (where wire clamp 122, in a closed position, may be used in connection with establishing the electrically conductive path) (e.g., see the detection methods disclosed in International Patent Application Publication WO 2009/002345).
• the height is determined (e.g., is reported and stored in memory of the wire bonding machine).
• the height of wire loop 116 at the first contact portion can be determined using a z-encoder which is a conventional component of a wire bonding system for determining a z-height of the bonding tool (i.e., the height along the z-axis or vertical axis of the wire bonding operation).
• wire bonding tool 104 has been moved along an x-axis (i.e., along the +x-direction) and along a z-axis (i.e., along the +z-direction). More specifically, wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at the "top" of wire loop 116.
• wire bonding tool 104 has been moved along the x-axis (i.e., along the +x- direction) and along the z-axis (i.e., along the -z-direction).
• wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at a "middle" portion of wire loop 116.
• wire bonding tool 104 has been moved along the x-axis (i.e., along the +x-direction) and along the z-axis (i.e., along the -z-direction). More specifically, wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at an "outermost" portion of wire loop 116 (i.e., the portion farthest in the +x-direction). Throughout the movement illustrated in FIGS.
• detection system 120 is used to detect contact between conductive wire 112 and wire loop 116.
• the height of wire loop 116 at a particular portion may be determined based on the movement of wire bonding tool 104 and detection of contact between conductive wire 112 (via free air ball 112a) and wire loop 116. This may be repeated for a plurality of contact portions of wire loop 116 (e.g., wherein the plurality of contact portions of the wire loop may be spaced at predetermined increments between a first bonding point of the wire loop and a second bonding point of the wire loop) such that a height profile of wire loop 116 is determined.
• FIGS. 3A-3E a process similar to that described in FIGS. 2A-2G is illustrated, where like elements have like reference numerals.
• FIG. 3A the entire length of wire loop 116 is imaged in a single field of view of imaging system 106 (as compared to FIGS. 2A-2C, where wire loop 116 is imaged in a plurality of fields of view).
• imaging system 106 e.g., imaging system 106 of wire bonding machine 100
• imaging e.g., "scanning" the entirety of wire loop 116.
• the imaging illustrated in FIG. 3A includes various portions of wire loop 116 (e.g., the "top” of wire loop 116, a portion adjacent to semiconductor element 108 at a first bond location, a portion adjacent to substrate at a second bond location, a portion of semiconductor element 108, and a portion of substrate 110).
• a path of wire loop 116 is detected. That is, because the actual wire loop 116 may be different from a design wire loop 116 (see FIGS. 1A-1B) (e.g., because of wire sway and/or wire sweep), the imaging operation of FIG. 3A provides the actual path of wire loop 116. This actual path can be used to measure the height value of portions of wire loop 166 (e.g., see FIGS. 3B-3E).
• wire loop 116 is illustrated in a "dashed form" (to illustrate a "design” or “simulated” wire loop) and a "solid form” (to illustrate an "actual” or “formed” wire loop).
• wire bonding tool 104 (e.g., of wire bonding machine 100) is illustrated along a plurality of positions along wire loop 116.
• wire bonding tool 104 has been lowered (e.g., in the -z-direction) such that free air ball 112a of conductive wire 112 contacts wire loop 116.
• Wire bonding tool 104 has been moved towards a first contact portion of the wire loop 116 (e.g., in the path of wire loop 116).
• Detection system 120 (e.g., BITS) is used to detect when free air ball 112a (e.g., a portion of a conductive wire 112 engaged with the wire bonding tool 104) contacts the first contact portion of wire loop 116.
• free air ball 112a e.g., a portion of a conductive wire 112 engaged with the wire bonding tool 10
• wire bonding tool 104 has been moved along an x-axis (i.e., along the +x-direction) and along a z-axis (i.e., along the +z-direction). More specifically, wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at the "top" of wire loop 116.
• wire bonding tool 104 has been moved along the x-axis (i.e., along the -i-x-direction) and along the z-axis (i.e., along the -z-direction). More specifically, wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at a "middle" portion of wire loop 116. Referring now to FIG. 3E, wire bonding tool 104 has been moved along the x-axis (i.e., along the +x-direction) and along the z-axis (i.e., along the -z-direction).
• wire bonding tool 104 has been moved such that free air ball 112a is illustrated in contact with wire loop 116 at an "outermost" portion of wire loop 116 (i.e., the portion farthest in the +x-direction).
• detection system 120 is used to detect contact between conductive wire 112 (via free air ball 112a) and wire loop 116.
• the height of wire loop 116 at a particular portion may be determined based on the movement of wire bonding tool 104 and detection of contact between conductive wire 112 and wire loop 116.
• This may be repeated for a plurality of contact portions of wire loop 116 (e.g., wherein the plurality of contact portions of the wire loop may be spaced at predetermined increments between a first bonding point of the wire loop and a second bonding point of the wire loop) such that a height profile of wire loop 116 is determined.
• FIGS. 4A-4B illustrate a process of determining a single height value along a path of a wire loop.
• imaging system 106 e.g., imaging system 106 of wire bonding machine 100
• imaging e.g., "scanning" a portion of wire loop 116, specifically a portion including the "top” of wire loop 116 and/or a portion adjacent to semiconductor element 108 at a first bond location.
• wire bonding tool 104 has been lowered (e.g., in the -z-direction) such that free air ball 112a of conductive wire 112 contacts wire loop 116.
• Wire bonding tool 104 has been moved towards a first contact portion of the wire loop 116 (e.g., in the path of wire loop 116).
• Detection system 120 e.g., BITS
• free air ball 112a e.g., a portion of a conductive wire 112 engaged with the wire bonding tool 104 contacts the first contact portion of wire loop 116, thus determining a height value of wire loop 116.
• FIG. 5 is a flow diagram illustrating a method of determining a height of a wire loop
• FIG. 6 is a flow diagram illustrating a method of determining a height profile of a wire loop.
• certain steps included in the flow diagrams may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated - all within the scope of the invention.
• Step 500 at least a portion of a wire loop is imaged using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop (e.g., see FIGS. 2A-2C, FIG. 3A, and FIG. 4A).
• the detected path of the portion of the wire loop provides location data of the portion of the wire loop, in the x-y plane, for use in Step 502.
• Step 502 a wire bonding tool is moved towards a first contact portion of the wire loop in the path (e.g., see FIG. 2D, FIG. 3B, and FIG. 4B).
• Step 504 it is detected (e.g., using detection system 120) when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop (e.g., see FIG. 2D, FIG. 3B, and FIG. 4B).
• Step 506 a height value of the wire loop is determined at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
• Steps 502, 504, and 506 are repeated for a plurality of contact portions of the wire loop such that a plurality of height values are determined (e.g., see FIGS. 2D- 2G).
• Step 600 at least a portion of a wire loop is imaged using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop (e.g., see FIGS. 2A-2C, FIG. 3A, and FIG. 4A).
• the detected path of the portion of the wire loop provides location data of the portion of the wire loop, in the x-y plane, for use in Step 602.
• Step 602 a wire bonding tool is moved towards a first contact portion of the wire loop in the path (e.g., see FIG. 2D, FIG. 3B, and FIG. 4B).
• Step 604 it is detected when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop (e.g., see FIG. 2D, FIG. 3B, and FIG. 4B).
• Step 606 a height value of the wire loop is determined at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
• Steps 602, 604, and 606 are repeated for a plurality of contact portions of the wire loop such that a plurality of height values are determined.
• Wire loops may provide electrical interconnection in any type of workpiece (not just a semiconductor element on a substrate). Further, wire loops may have any number of bonded portions. For example, a wire loop may have two bonded portions (e.g., a first bond and a second bond, like wire loop 116), three bonded portions, etc. Further, a wire loop may have a single bonded portion (e.g., a conductive bump). That is, as used herein, the term "wire loop" may include a conductive bump formed using a portion of wire (e.g., see U.S. Patent No. 7,188,759).

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• 2023
  • 2023-03-23 US US18/125,152 patent/US12538759B2/en active Active
  • 2023-03-23 CN CN202380024265.2A patent/CN118786326A/zh active Pending
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