JP2025512239A - ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法 - Google Patents

ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法 Download PDF

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Publication number
JP2025512239A
JP2025512239A JP2024550230A JP2024550230A JP2025512239A JP 2025512239 A JP2025512239 A JP 2025512239A JP 2024550230 A JP2024550230 A JP 2024550230A JP 2024550230 A JP2024550230 A JP 2024550230A JP 2025512239 A JP2025512239 A JP 2025512239A
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Prior art keywords
wire
wire loop
loop
imaging
contact portion
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Pending
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JP2024550230A
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English (en)
Japanese (ja)
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JPWO2023200565A5 (https=
JP2025512239A5 (https=
Inventor
ミルトン、バジル
チン、ウェイ
ワン、ジージェ
プリブラ、ウラジミール
シュシャリン、パベル
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クリック アンド ソッファ インダストリーズ、インク．
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Application filed by クリック アンド ソッファ インダストリーズ、インク． filed Critical クリック アンド ソッファ インダストリーズ、インク．
Publication of JP2025512239A publication Critical patent/JP2025512239A/ja
Publication of JPWO2023200565A5 publication Critical patent/JPWO2023200565A5/ja
Publication of JP2025512239A5 publication Critical patent/JP2025512239A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

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  • Wire Bonding (AREA)
JP2024550230A 2022-04-14 2023-03-23 ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法 Pending JP2025512239A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263331130P 2022-04-14 2022-04-14
US63/331,130 2022-04-14
PCT/US2023/015989 WO2023200565A1 (en) 2022-04-14 2023-03-23 Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine

Publications (3)

Publication Number Publication Date
JP2025512239A true JP2025512239A (ja) 2025-04-17
JPWO2023200565A5 JPWO2023200565A5 (https=) 2025-09-18
JP2025512239A5 JP2025512239A5 (https=) 2025-09-18

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ID=88308027

Family Applications (1)

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JP2024550230A Pending JP2025512239A (ja) 2022-04-14 2023-03-23 ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法

Country Status (6)

Country Link
US (1) US12538759B2 (https=)
JP (1) JP2025512239A (https=)
KR (1) KR20250002132A (https=)
CN (1) CN118786326A (https=)
TW (1) TW202407292A (https=)
WO (1) WO2023200565A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118287809B (zh) * 2024-06-06 2024-07-26 深圳市中顺半导体照明有限公司 Led半导体焊线生成指定线弧的动态调节方法及系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370547B2 (ja) 1997-03-17 2003-01-27 株式会社新川 ボンディングワイヤ高さ検査装置
KR200174667Y1 (ko) 1997-03-25 2000-03-02 유무성 와이어 루프의 높이 측정 장치
US6189765B1 (en) 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
ATE344445T1 (de) * 2002-02-01 2006-11-15 F & K Delvotec Bondtech Gmbh Testvorrichtung zur ausführung eines pulltests
US7145162B2 (en) * 2003-10-31 2006-12-05 Asm Assembly Automation Ltd. Wire loop height measurement apparatus and method
US7481351B2 (en) * 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
US7188759B2 (en) 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4787374B2 (ja) * 2010-01-27 2011-10-05 株式会社新川 半導体装置の製造方法並びにワイヤボンディング装置
KR20220049482A (ko) * 2020-10-14 2022-04-21 이미지 이큅먼트 피티이. 엘티디. 오버랩된 본드 와이어의 루프 길이 측정

Also Published As

Publication number Publication date
US20230335532A1 (en) 2023-10-19
KR20250002132A (ko) 2025-01-07
US12538759B2 (en) 2026-01-27
CN118786326A (zh) 2024-10-15
TW202407292A (zh) 2024-02-16
WO2023200565A1 (en) 2023-10-19

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