KR20250002132A - 와이어 본딩기에서 와이어 루프의 높이 및 높이 프로파일을 결정하는 방법 - Google Patents

와이어 본딩기에서 와이어 루프의 높이 및 높이 프로파일을 결정하는 방법 Download PDF

Info

Publication number
KR20250002132A
KR20250002132A KR1020247029174A KR20247029174A KR20250002132A KR 20250002132 A KR20250002132 A KR 20250002132A KR 1020247029174 A KR1020247029174 A KR 1020247029174A KR 20247029174 A KR20247029174 A KR 20247029174A KR 20250002132 A KR20250002132 A KR 20250002132A
Authority
KR
South Korea
Prior art keywords
wire
wire loop
loop
contact
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247029174A
Other languages
English (en)
Korean (ko)
Inventor
바실 밀턴
웨이 친
즈지에 왕
블라디미르 프리불라
파벨 슈사린
Original Assignee
쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 filed Critical 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Publication of KR20250002132A publication Critical patent/KR20250002132A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H01L24/85—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H01L22/12—
    • H01L24/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H01L2224/789—
    • H01L2224/859—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
KR1020247029174A 2022-04-14 2023-03-23 와이어 본딩기에서 와이어 루프의 높이 및 높이 프로파일을 결정하는 방법 Pending KR20250002132A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263331130P 2022-04-14 2022-04-14
US63/331,130 2022-04-14
PCT/US2023/015989 WO2023200565A1 (en) 2022-04-14 2023-03-23 Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine

Publications (1)

Publication Number Publication Date
KR20250002132A true KR20250002132A (ko) 2025-01-07

Family

ID=88308027

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247029174A Pending KR20250002132A (ko) 2022-04-14 2023-03-23 와이어 본딩기에서 와이어 루프의 높이 및 높이 프로파일을 결정하는 방법

Country Status (6)

Country Link
US (1) US12538759B2 (https=)
JP (1) JP2025512239A (https=)
KR (1) KR20250002132A (https=)
CN (1) CN118786326A (https=)
TW (1) TW202407292A (https=)
WO (1) WO2023200565A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118287809B (zh) * 2024-06-06 2024-07-26 深圳市中顺半导体照明有限公司 Led半导体焊线生成指定线弧的动态调节方法及系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3370547B2 (ja) 1997-03-17 2003-01-27 株式会社新川 ボンディングワイヤ高さ検査装置
KR200174667Y1 (ko) 1997-03-25 2000-03-02 유무성 와이어 루프의 높이 측정 장치
US6189765B1 (en) 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
ATE344445T1 (de) * 2002-02-01 2006-11-15 F & K Delvotec Bondtech Gmbh Testvorrichtung zur ausführung eines pulltests
US7145162B2 (en) * 2003-10-31 2006-12-05 Asm Assembly Automation Ltd. Wire loop height measurement apparatus and method
US7481351B2 (en) * 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
US7188759B2 (en) 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4787374B2 (ja) * 2010-01-27 2011-10-05 株式会社新川 半導体装置の製造方法並びにワイヤボンディング装置
KR20220049482A (ko) * 2020-10-14 2022-04-21 이미지 이큅먼트 피티이. 엘티디. 오버랩된 본드 와이어의 루프 길이 측정

Also Published As

Publication number Publication date
US20230335532A1 (en) 2023-10-19
US12538759B2 (en) 2026-01-27
JP2025512239A (ja) 2025-04-17
CN118786326A (zh) 2024-10-15
TW202407292A (zh) 2024-02-16
WO2023200565A1 (en) 2023-10-19

Similar Documents

Publication Publication Date Title
KR102336343B1 (ko) 반도체 소자의 본딩에 관한 평행도를 결정하고 조정하기 위한 시스템과 방법
US12255109B2 (en) Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US8091761B2 (en) Bonding apparatus and bonding method
KR102788904B1 (ko) 본딩 와이어 및 와이어 본딩 기계의 본딩 위치 사이의 본딩 검출 방법
KR20250002132A (ko) 와이어 본딩기에서 와이어 루프의 높이 및 높이 프로파일을 결정하는 방법
US11935864B2 (en) Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
US20220270937A1 (en) Methods of determining shear strength of bonded free air balls on wire bonding machines
US5991436A (en) Apparatus and method for inspecting wirebonds on leads
US20250372455A1 (en) Methods of imaging a wire structure on a wire bonding system
US12553937B2 (en) Methods of testing bonded wires on wire bonding machines
US20250022122A1 (en) Methods of detecting a crack in a semiconductor element, and related wire bonding systems
US20250201765A1 (en) Methods of operating wire bonding systems, including methods of detecting and/or preventing wire fly-out on such systems
US20250277877A1 (en) Methods of testing a process window, and automatically optimizing a process, on a wire bonding system
JP2006294710A (ja) 傾き補正方法、ワイヤボンディング方法及びワイヤボンディング装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000