WO2023191594A1 - Plaque métallique, masque de dépôt l'utilisant et son procédé de fabrication - Google Patents

Plaque métallique, masque de dépôt l'utilisant et son procédé de fabrication Download PDF

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Publication number
WO2023191594A1
WO2023191594A1 PCT/KR2023/004397 KR2023004397W WO2023191594A1 WO 2023191594 A1 WO2023191594 A1 WO 2023191594A1 KR 2023004397 W KR2023004397 W KR 2023004397W WO 2023191594 A1 WO2023191594 A1 WO 2023191594A1
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WIPO (PCT)
Prior art keywords
metal plate
inclusions
less
size
deposition mask
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PCT/KR2023/004397
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English (en)
Korean (ko)
Inventor
이상윤
김지환
Original Assignee
스템코 주식회사
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Application filed by 스템코 주식회사 filed Critical 스템코 주식회사
Priority claimed from KR1020230042933A external-priority patent/KR20230141650A/ko
Publication of WO2023191594A1 publication Critical patent/WO2023191594A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Definitions

  • the present invention relates to a metal plate selected so that it can be used to manufacture an OLED display, a method of manufacturing a deposition mask using the metal plate, and a deposition mask manufactured according to the method.
  • OLED Organic Light Emitting Diodes
  • OLED Organic Light Emitting Diodes
  • a method of forming pixels in a desired pattern using a metal mask including through holes arranged in a desired pattern is known. Specifically, first, a metal mask is brought into close contact with a substrate for an OLED display, and then both the metal mask and the substrate brought into close contact are put into a vapor deposition apparatus, and organic materials, etc. are deposited. Metal masks can generally be manufactured by forming through holes in a metal plate by etching using photolithography techniques.
  • metal plates for metal masks can be manufactured by electroplating or rolling methods, and when the double rolling method is used, metal plates for metal masks with superior mechanical properties compared to electroplating methods can be manufactured.
  • the surface of the metal plate is scratched or scratched during rolling, or the metal plate contains inclusions of various sizes, and the shape of the through hole is damaged when the metal plate is etched.
  • the present invention aims to manage inclusions in a metal plate used to manufacture a high-resolution deposition mask.
  • the technical problem to be solved by the present invention is to provide a deposition mask manufacturing method for selecting a metal plate suitable for the inclusion management standards and manufacturing a deposition mask using the selected metal plate, and a deposition mask manufactured according to the method. It is done.
  • the metal plate of the present invention for achieving the above technical problem is a metal plate used to manufacture a deposition mask by forming a plurality of through holes.
  • the metal plate has a thickness t0 of 50 ⁇ m or less, and the thickness It is formed including a first surface and a second surface opposing each other with respect to the direction, and when the metal plate is composed of an alloy containing iron and nickel and a plurality of inclusions other than the iron and nickel, the metal plate
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area is 25,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 20,000 to 25,000.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 0 or more and 1,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 10 to 300 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1mm3 of unit area of the metal plate may be 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1mm3 of unit area of the metal plate may be 13,000 to 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1mm3 of unit area of the metal plate may be 1,000 or less.
  • the number of third inclusions with a size of 3 to 5 ⁇ m included per 1mm3 of unit area of the metal plate may be 200 or more and 300 or less.
  • the metal plate has an upper layer constituting 0 to 35% of the thickness t0 in the thickness direction from the first side, a lower layer constituting 0 to 35% of the thickness t0 in the thickness direction from the second side, and an interior between the upper layer and the lower layer. It may be formed including an intermediate layer that constitutes 35 to 60% of the thickness t0.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the middle layer of the metal plate may be greater than the number of first inclusions included in the upper or lower layer of the metal plate.
  • One aspect of the method for manufacturing a deposition mask of the present invention for achieving the above technical problem is a method for manufacturing a deposition mask having an effective area in which a plurality of through holes are formed and a peripheral area located around the effective area. , a step of preparing a metal plate having a thickness t0 of 50 ⁇ m or less and including first and second surfaces facing each other in the thickness direction, a resist pattern forming step of forming a resist pattern on the metal plate, an etching process of etching the metal plate using the resist pattern as a mask to form the through hole in a region of the metal plate forming the effective area, wherein the metal plate is an alloy containing iron and nickel and the iron When the metal plate further includes a plurality of inclusions other than nickel, the number of first inclusions less than 1 ⁇ m in size per 1 mm3 unit area of the metal plate is 25,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 20,000 to 25,000.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 0 or more and 1,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1 mm3 of unit area of the metal plate may be 10 to 300 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 13,000 to 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 1,000 or less.
  • the number of third inclusions with a size of 3 to 5 ⁇ m included per 1 mm3 of unit area of the metal plate may be 200 to 300.
  • the fourth inclusion with a size exceeding 5 ⁇ m included per 1 mm3 of unit area of the metal plate may not be included.
  • the metal plate has an upper layer constituting 0 to 35% of the thickness t0 in the thickness direction from the first side, and 0 to 35% of the thickness t0 in the thickness direction from the second side. It may be formed including a lower layer and an intermediate layer constituting 35 to 60% of the thickness t0, which constitutes the interior between the upper layer and the lower layer.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the middle layer of the metal plate may be greater than the number of first inclusions included in the upper or lower layer of the metal plate.
  • the intermediate layer of the metal plate may be used as the effective area.
  • One side of the deposition mask of the present invention for achieving the above technical problem is a deposition mask having an effective area in which a plurality of through holes are formed and a peripheral area located around the effective area, and the effective area of the deposition mask is and the surrounding area are formed on a metal plate including a first surface and a second surface opposing each other with respect to the thickness direction, and the metal plate further contains an alloy containing iron and nickel and a plurality of inclusions other than the iron and nickel.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate is 25,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 20,000 to 25,000.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 0 or more and 1,000 or less.
  • the number of first inclusions with a size of less than 1 ⁇ m included per 1mm3 of unit area of the metal plate may be 10 to 300 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 13,000 to 16,000 or less.
  • the number of second inclusions with a size of less than 1 to 3 ⁇ m included per 1 mm3 of unit area of the metal plate may be 1,000 or less.
  • the present invention analyzes the inclusions contained inside the raw material, selects and manufactures a metal plate according to the analysis results of the inclusions, and manufactures a deposition mask using the metal plate manufactured in this way, thereby achieving the following effects. there is.
  • FIG. 1 is a flowchart sequentially explaining a method of selecting a metal plate having inclusion conditions suitable for manufacturing a metal mask according to an embodiment of the present invention.
  • Figure 2 is a conceptual diagram showing the schematic structure of an inclusion analysis system applied to a metal plate selection method according to an embodiment of the present invention.
  • FIG. 3 is a conceptual diagram showing the schematic structure of a filtration device constituting the inclusion analysis system of FIG. 2.
  • Figure 4 is an example diagram for explaining a method of measuring inclusions in an inclusion measuring device that constitutes an inclusion analysis system.
  • Figure 5 is a conceptual diagram showing the relationship between an inclusion analysis system and a control unit applied to the metal plate selection method according to an embodiment of the present invention.
  • Figure 6 is a reference diagram for further explaining the surface treatment method applied to the metal plate sorting method according to an embodiment of the present invention.
  • Figure 7 is a flowchart sequentially explaining a method of selecting a metal plate having inclusion conditions suitable for manufacturing a metal mask according to another embodiment of the present invention.
  • Figure 8 is a flow chart sequentially explaining a method of manufacturing a metal mask using a metal plate.
  • Figure 9 is a diagram showing the results of an experiment to set a management level for inclusions contained in a metal plate according to the first embodiment.
  • Figure 10 is a diagram showing the results of an experiment to set a management level for inclusions contained in a metal plate according to the second embodiment.
  • the present invention analyzes inclusions contained in a metal plate to select a metal plate with inclusion conditions suitable for manufacturing a deposition mask, and uses the selected metal plate as described above to manufacture a high-resolution display. It is characterized by manufacturing a deposition mask to be used.
  • the metal plate used for inclusion analysis may be manufactured according to a rolling method.
  • the high-resolution display may be an Organic Light Emitting Diodes (OLED) display, for example, a display with a pixel density of 500ppi (pixels per inch) or more, or a display with a pixel density of 800ppi or more.
  • OLED Organic Light Emitting Diodes
  • a metal mask will be described as an example of a deposition mask.
  • the metal plate used to manufacture the metal mask may be made of an iron alloy containing iron and nickel.
  • the metal plate may further contain particles other than iron, nickel, cobalt, etc. due to additives (e.g., aluminum, silicon, etc.) added to remove impurities during the melting process of manufacturing the base material of the metal plate.
  • particles other than iron, nickel, cobalt, etc. contained in the metal plate are defined as inclusions.
  • inclusions contained in the metal plate may affect the manufacturing process of the metal mask. Specifically, the size of the inclusions can affect the manufacturing process of the metal mask, and the quantity of inclusions can also affect the manufacturing process of the metal mask.
  • the metal mask When manufacturing a metal mask using a metal plate, the metal mask can be manufactured by etching the metal plate to form a plurality of through holes. Through holes can be used to form pixels in a desired pattern in the display.
  • the size of the inclusions is larger than the appropriate size or the quantity of the inclusions is greater than the appropriate quantity, when the through hole is formed by etching, the inside of the metal plate is exposed by the through hole after etching, or the surface is etched and the metal plate As the inclusions remaining inside are separated from the metal plate and a pitted defect occurs, when forming a through hole in the metal plate, the shape of the through hole deviates from the designed value, and as a result, the through hole of the desired shape or the metal plate with the through hole is formed. It becomes impossible to form an appropriate level of durability (the level at which the metal plate can withstand the corresponding tensile force during the metal mask tensioning stage), and pixels cannot be formed in the desired pattern on the display.
  • the size and quantity of inclusions included in the metal plate are analyzed to select a metal plate with inclusion conditions suitable for manufacturing a metal mask, and a metal mask can be manufactured using the selected metal plate.
  • FIG. 1 is a flowchart sequentially explaining a method of selecting a metal plate having inclusion conditions suitable for manufacturing a metal mask according to an embodiment of the present invention.
  • each metal plate may be made of an alloy containing an iron component, a nickel component, a cobalt component, etc., and may be manufactured according to a rolling method. Additionally, each metal plate may be provided wound on a roll.
  • Each metal plate may have a predetermined thickness, preferably each metal plate may have a thickness of 50 ⁇ m or less (0 ⁇ m ⁇ thickness of metal plate ⁇ 50 ⁇ m). More preferably, each metal plate may have a thickness of 30 ⁇ m or less (0 ⁇ m ⁇ thickness of metal plate ⁇ 30 ⁇ m).
  • the thickness of the metal plate exceeds 50 ⁇ m, it may be difficult to implement the specifications or shape of the through hole required for the metal mask applied to the high-resolution display. More specifically, in the case of a high-resolution display, the spacing between the plurality of through holes formed in the metal mask must be narrow, or the size of the through holes must be smaller than that of the metal mask applied to the low-resolution display. .
  • samples are collected from each metal plate (S120), inclusions contained in the sample are analyzed, and the size and quantity of the inclusions are measured (S130).
  • the remaining components excluding the iron component and nickel component can be defined as inclusions.
  • the remaining components excluding the iron component, nickel component, and cobalt component may be defined as inclusions.
  • the inclusion may be, for example, an aluminum component, a magnesium component, a silicon component, a phosphorus component, a sulfur component, a chromium component, a zirconium component, etc., and may also be a compound containing a plurality of components.
  • compounds are defined as including oxides, sulfides, carbides, nitrides, and intermetallic compounds.
  • an inclusion analysis system that can measure the size and quantity of inclusions from a sample can be used. Below, the inclusion analysis system will be described.
  • Figure 2 is a conceptual diagram showing the schematic structure of an inclusion analysis system applied to a metal plate selection method according to an embodiment of the present invention.
  • the inclusion analysis system 200 may include a chemical solution 220, a mixing container 230, a filtration device 240, and an inclusion measurement device 250.
  • the chemical solution 220 is a substance used to dissolve each sample 210a, 210b, ..., 210n. Specifically, the chemical solution 220 may dissolve iron and nickel components and may not dissolve inclusions containing other components. Alternatively, the chemical solution 220 may dissolve the iron component, nickel component, and cobalt component, and may not dissolve inclusions containing other components. Inclusions are particles that are poorly soluble in the chemical solution 220, and the chemical solution 220 may be prepared as a solution containing, for example, a nitric acid component. Alternatively, it may be a solution containing sulfuric acid or hydrogen peroxide. The chemical solution 220 may be a solution containing other ingredients as long as it contains ingredients capable of dissolving iron and nickel.
  • the chemical solution 220 is introduced into the mixing container 230 together with each sample (210a, 210b, ..., 210n), and each sample (210a, 210b, ..., 210n) is dissolved to form each sample (210a, 210b). , ..., 210n) and a chemical solution (220) can be mixed to produce a mixture.
  • a magnetic material may be used.
  • the magnetic material may be provided as, for example, a magnetic plate.
  • the filtration device 240 serves to filter the mixture and extract inclusions from the mixture.
  • the filtration device 240 can extract inclusions from the mixture using vacuum filtration, but this embodiment is not necessarily limited to this method, and if inclusions can be effectively extracted from the mixture, vacuum filtration may be used. Other methods may also be used in this embodiment.
  • the filtration device 240 is a device that filters a mixture using vacuum filtration, as shown in FIG. 3, it includes a first container 310, a filter 320, a second container 330, and a pressurization module 340. It may be configured to include.
  • FIG. 3 is a conceptual diagram showing the schematic structure of a filtration device constituting the inclusion analysis system of FIG. 2.
  • the first container 310 is a container into which the mixture is added.
  • the first container 310 may include a filter 320 on its inner bottom to filter the mixture, and a second container located below the first container 310 to accommodate the liquid separated from the inclusions by the filter 320. It can be connected to (330).
  • the first container 310 may be provided as a funnel, for example, and a clamp may be used to fix the first container 310 on the second container 330.
  • the filter 320 may have micropores of uniform size formed in the membrane to filter the mixture.
  • the filter 320 may be installed inside the first container 310 while being mounted on a metal mesh, and may be provided as a membrane filter having a mesh shape.
  • the filter 320 and the fine holes can be selected and applied with appropriate sizes depending on the size of the samples 210a, 210b, ..., 210n.
  • the filter 320 may have a size of 30 mm to 40 mm.
  • the filter 320 may have a size of 40 mm to 50 mm.
  • the micropores may have a size of 0.2 ⁇ m or less (0 ⁇ m ⁇ micropore size ⁇ 0.2 ⁇ m).
  • the micropores may have a size of 0.1 ⁇ m or less (0 ⁇ m ⁇ micropore size ⁇ 0.1 ⁇ m).
  • the maximum capacity that the second container 330 can accommodate may be larger than that of the first container 310.
  • the second container 330 may have a maximum capacity of 1000 ml, and the first container 310 may have a maximum capacity of 300 ml.
  • this embodiment is not limited to this.
  • the first container 310 and the second container 330 may have the same maximum capacity, and the first container 310 may have a larger maximum capacity than the second container 330.
  • the second container 330 may form a vacuum state inside the second container 330 while the mixture is filtered by the filter 320.
  • the interior of the second container 330 may be connected to the pressurizing module 340 for this purpose, and may be provided as a bottle, that is, a filter bottle, for example.
  • the pressurizing module 340 serves to pressurize the interior of the second container 330.
  • the pressure module 340 may be provided as a pressure gauge for this purpose, and may be connected to the inside of the second container 330 through a tube of a predetermined length.
  • the pressurizing module 340 may be provided as, for example, a vacuum pump to form the interior of the second container 330 into a vacuum state.
  • the inclusion measuring device 250 serves to measure inclusions remaining on the filter 320.
  • Filter 320 may be dried to remove moisture after filtering the mixture.
  • the inclusion measuring device 250 can measure the size and quantity of inclusions by observing the surface of the filter 320.
  • the inclusion measuring device 250 may be provided, for example, with a scanning electron microscope (SEM) or an optical microscope.
  • SEM scanning electron microscope
  • the object may be a microscope with a magnification of 400 to 500 times. Alternatively, it is okay to apply a microscope that can observe the object to be measured at a higher magnification.
  • the filter 320 may be dried using a natural drying method to remove moisture, but may also be dried using a drying device to complete drying within a limited time.
  • the filter 320 may be dried using, for example, a drying device that supplies hot air.
  • the inclusion measuring device 250 may divide the filter 320 into a plurality of regions and then calculate the size and quantity of inclusions for the entire area of the filter 320 based on the measurement results for each region.
  • the filter 320 includes a first area 410, a second area 420, a third area 430, a fourth area 440, and a fifth area 450.
  • nine areas (410, 420, 430, 440, 450, 460, 470, 480, 490), including the sixth area (460), the seventh area (470), the eighth area (480), and the ninth area (490).
  • the inclusion measuring device 250 individually measures each of the nine areas (410, 420, 430, 440, 450, 460, 470, 480, 490), and based on the measurement results, the entire filter 320 The size and quantity of inclusions per area can be calculated.
  • a point refers to an image unit observed by the inclusion measurement device 250.
  • the point may be an image unit observed by the magnification of the scanning electron microscope.
  • the point may have a size of, for example, 0.2mm 2 to 1.0mm 2 .
  • the size of the point is not limited to the above range, and can be easily changed and applied depending on the size of the filter or the level of the sample extracted from the metal plate.
  • Figure 4 is an example diagram for explaining a method of measuring inclusions in an inclusion measuring device that constitutes an inclusion analysis system.
  • the inclusion measuring device 250 divides the filter 320 into a plurality of areas, selects several areas among them, measures the size and quantity of inclusions in the selected areas, and filters from there. It is also possible to estimate or convert the size and quantity of inclusions for the entire area of (320).
  • the inclusion measuring device 250 measures the size of the inclusions with respect to the entire area of the filter 320, assuming that the inclusions are uniformly distributed over the entire area of the filter 320. Quantity can be estimated.
  • the inclusion measuring device 250 is also capable of calculating the size and quantity of inclusions for the entire area of the filter 320 without dividing the filter 320 into a plurality of areas. For example, tens to hundreds of points can be designated in the entire area of the filter 320, and each point can be inspected using a scanning electron microscope to calculate the size and quantity of inclusions for the entire area of the filter 320. .
  • the inclusion measuring device 250 selects a partial area from the entire area of the filter 320, measures the size and quantity of inclusions for the selected area, and measures the size and quantity of the inclusions in the selected area, It is also possible to estimate the size and quantity of inclusions. In this case as well, the inclusion measuring device 250 can estimate the size and quantity of inclusions for the entire area of the filter 320 under the premise that the inclusions are uniformly distributed over the entire area of the filter 320.
  • each metal plate was analyzed based on the analysis results for each sample (210a, 210b, ..., 210n). Sort into good and defective products (S140).
  • each metal plate is classified as a good product. It can be sorted into defective products. Alternatively, each metal plate can be sorted into good and defective products by considering only the size of the inclusions. Alternatively, each metal plate can be sorted into good and defective products by considering only the quantity of inclusions.
  • each metal plate When classifying each metal plate as a good product or a defective product considering both the size of the inclusion and the quantity of the inclusion, if the size of the inclusion is less than the standard size and the quantity of inclusions of each size is less than the standard quantity, the metal plate is judged as a good product. can do.
  • each metal plate is classified as a good product or a defective product considering only the size of the inclusion, if the size of the inclusion is less than the standard size, the metal plate can be judged as a good product.
  • the metal plate When classifying each metal plate into a good product or a defective product considering only the quantity of inclusions, if the quantity of inclusions is less than the standard quantity, the metal plate can be judged as a good product.
  • the control unit 500 is connected to the inclusion analysis system 200 as shown in FIG. 5, and receives analysis results for each sample 210a, 210b, ..., 210n from the inclusion measurement device 250, respectively. Metal plates can be sorted into good and defective products.
  • the control unit 500 may be provided as a computer or server to perform calculation tasks.
  • Figure 5 is a conceptual diagram showing the relationship between an inclusion analysis system and a control unit applied to the metal plate selection method according to an embodiment of the present invention.
  • the task of sorting a metal plate into a good product or a defective product based on the analysis results provided from the inclusion measuring device 250 can be performed using other means without applying the control unit 500. do. For example, it is possible to select good/defective metal plates by an operator. Based on the analysis results provided from the inclusion measuring device 250, the worker manually compares the inclusion standards described later and determines that the metal plate winding body from which a sample that satisfies the standards is a good product and can be used for manufacturing a metal mask, and thereafter It is also possible to apply it to the process.
  • both sides of the metal plates selected as good products are surface treated (S150).
  • both sides of the metal plate can be surface treated through a slimming operation, and the upper and lower layers can be removed from the metal plate so that the middle layer can be used as an effective area.
  • the present embodiment is not limited to this, and if a metal plate of the final metal mask thickness level is prepared, the slimming operation may be omitted.
  • Inclusions included in the metal plate are 1 ⁇ m or less (size of inclusion ⁇ 1 ⁇ m), greater than 1 ⁇ m but less than 3 ⁇ m (1 ⁇ m ⁇ size of inclusion ⁇ 3 ⁇ m), greater than 3 ⁇ m and less than 10 ⁇ m ( It can be classified as 3 ⁇ m ⁇ size of inclusion ⁇ 10 ⁇ m), greater than 10 ⁇ m (size of inclusion > 10 ⁇ m), etc.
  • the metal plate is oriented in the height direction (i.e., in the third direction 30) between the upper layer (H Layer) constituting the upper surface, the lower layer (L Layer) constituting the lower surface, and the upper surface and lower surface.
  • the middle layer (M Layer) that constitutes the interior of The third inclusions 630 with a size of more than 10 ⁇ m, the fourth inclusions with a size of more than 10 ⁇ m 640, etc. are distributed in a biased manner in the upper layer (H Layer) and lower layer (L Layer), and the middle layer (M Layer), the first inclusions 610 having a size of approximately 1 ⁇ m or less are distributed.
  • the upper layer (H Layer) and the lower layer (L Layer) can be removed from each metal plate (S150).
  • an etching method may be used.
  • this embodiment is not limited to this, and any method other than the etching method may be used as long as the upper layer (H Layer) and the lower layer (L Layer) can be effectively removed from the metal plate.
  • Figure 6 is a reference diagram for further explaining the surface treatment method applied to the metal plate sorting method according to an embodiment of the present invention.
  • H Layer When surface treating both sides of a metal plate (S150), 0% to 35% of the total thickness can be removed from the upper surface as an upper layer (H Layer). Likewise, 0% to 35% of the total thickness can be removed from the lower surface as the lower layer (L Layer). In this case, 35% to 60% of the total thickness may remain as the middle layer (M Layer).
  • the thickness of the metal plate can be set to 30 ⁇ m or less as previously described. Alternatively, the thickness of the metal plate may be 50 ⁇ m or less.
  • the thickness of the middle layer (M Layer) can be formed to be 20 ⁇ m (0 ⁇ m ⁇ thickness of the middle layer (M Layer) ⁇ 20 ⁇ m).
  • the upper and lower layers (H Layer) and lower layers (L Layer) can be removed through uniform etching of the upper and lower sides or asymmetric etching of the upper and lower sides, respectively.
  • the height direction thickness (t1) of the upper layer (H Layer), the height direction thickness (t2) of the middle layer (M Layer), and the lower layer may vary. Selective adjustment of the effective area may be due to the measurement results of the inclusion measurement device 250.
  • control unit 500 can sort each metal plate into good and defective products (S140).
  • the control unit 500 may determine that a metal plate meeting certain conditions is a good product based on the measurement results of the inclusion measurement device 250.
  • an engineer it is not limited to this, and it is also possible for an engineer to collect a sample of a metal plate, filter and analyze inclusions, and then directly determine whether the sampled metal plate is good or bad.
  • the control unit 500 may determine the metal plate as a good product or a defective product by considering the size of the inclusion. In this case, the control unit 500 may determine that a metal plate containing only inclusions of a standard size or less is a good product. For example, the control unit 500 may determine that a metal plate containing only the first inclusion 610 is a good product. Alternatively, the control unit 500 may determine that a metal plate containing only the first inclusions 610 and the second inclusions 620 is a good product. Alternatively, the control unit 500 may determine that a metal plate including only the first inclusion 610, the second inclusion 620, and the third inclusion 630 is a good product. That is, the control unit 500 may determine that a metal plate that does not include the fourth inclusion 640 is a good product.
  • control unit 500 can determine the metal plate as good or defective by considering both the size and quantity of inclusions. In this case, the control unit 500 may determine that a metal plate that is less than the standard size or contains less than the standard number of inclusions is a good product.
  • the chemical solution 220 can be selectively used to dissolve iron, nickel, and cobalt components and not dissolve inclusions containing other components.
  • the measurement results of inclusions may be different even for the same metal plate depending on the type of chemical liquid, optimized conditions for determining whether the metal plate is good or defective must be selected and applied depending on the type of chemical liquid.
  • the first chemical solution is a chemical solution containing a sulfuric acid or hydrogen peroxide component
  • the first inclusions 610 of less than 1 ⁇ m are less than 25,000 per 1mm 3 .
  • the first inclusions 610 of less than 1 ⁇ m are included in the range of 20,000 to 25,000 per 1mm 3 and the second inclusions 620 in the range of 1 ⁇ m to 3 ⁇ m are included in the number of 13,000 to 16,000 or less per 1mm 3 It is appropriate to select a metal plate based on the conditions for determining good quality.
  • the first inclusions 610 of less than 1 ⁇ m are included in the range of 20,000 to 25,000 per 1mm 3 and the second inclusions 620 in the range of 1 ⁇ m to 3 ⁇ m are included in the number of 13,000 to 16,000 or less per 1mm 3 It is appropriate to select a metal plate containing less than 200 to 300 third inclusions 630 in the range of 3 ⁇ m to 5 ⁇ m per mm 3 as a condition for determining good products.
  • the first inclusions 610 of less than 1 ⁇ m are included in the range of 20,000 to 25,000 per 1mm 3 and the second inclusions 620 in the range of 1 ⁇ m to 3 ⁇ m are included in the number of 13,000 to 16,000 or less per 1mm 3
  • a metal plate containing 200 to 300 or less third inclusions 630 in the range of 3 ⁇ m to 5 ⁇ m per 1 mm 3 and not containing fourth inclusions 640 exceeding 5 ⁇ m is a condition for determining a good product. It is appropriate to select
  • the first inclusions 610 of less than 1 ⁇ m are 1mm. 3 It is appropriate to select metal plates containing less than 1,000 pieces per piece as a condition for determining good quality. Preferably, it is appropriate to select a metal plate containing 500 or less first inclusions 610 of less than 1 ⁇ m per 1mm 3 as a condition for determining a good product. More preferably, it is appropriate to select a metal plate containing 10 to 300 first inclusions 610 of less than 1 ⁇ m per 1mm 3 as a condition for determining good quality.
  • a metal plate containing 1,000 or less second inclusions 620 per 1 mm 3 in the range of 1 ⁇ m to 3 ⁇ m as a condition for determining a good product.
  • a metal plate containing 800 or less second inclusions 620 per 1mm 3 in the range of 1 ⁇ m to 3 ⁇ m as a condition for determining a good product.
  • a metal plate containing 500 or less second inclusions 620 of less than 2 ⁇ m per 1 mm 3 it is appropriate to select a metal plate containing 500 or less second inclusions 620 per 1 mm 3 of 1 ⁇ m or more and less than 2 ⁇ m as a condition for determining a good product.
  • a metal plate containing 600 or less third inclusions 630 per 1 mm 3 in the range of 3 ⁇ m to 5 ⁇ m is appropriate.
  • a metal plate containing 300 or less third inclusions 630 of less than 4 ⁇ m per 1 mm 3 it is appropriate to select a metal plate containing 300 or less third inclusions 630 of 3 ⁇ m or more and less than 4 ⁇ m per 1 mm 3 as a condition for determining a good product.
  • the metal plate can be determined to be a good product.
  • the control unit 500 may determine the metal plate as a good product or a defective product by considering the quantity of inclusions. In this case, the control unit 500 may determine that a metal plate containing a standard number of inclusions of a specific size or less is a good product. For example, the control unit 500 may determine that a metal plate containing 20,000 to 25,000 or less first inclusions 610 per 1 mm 3 is a good product. Alternatively, the control unit 500 may determine that a metal plate containing 13,000 to 16,000 or less second inclusions 620 per 1 mm 3 is a good product. Alternatively, the control unit 500 may determine that a metal plate containing 200 to 300 or less third inclusions 630 per 1 mm 3 is a good product.
  • the metal plate is judged as either a good product or a defective product, and then the upper layer (H Layer) and the lower layer (L Layer) are removed from the metal plate and the middle layer (M Layer) is extracted. did.
  • this embodiment is not limited to this. That is, in this embodiment, the upper layer (H Layer) and lower layer (L Layer) are removed from the metal plate, the middle layer (M Layer) is extracted, and then a sample is taken from the middle layer (M Layer) to classify the metal plate as either a good product or a defective product. It is also possible to determine.
  • Figure 7 is a flowchart sequentially explaining a method of selecting a metal plate having inclusion conditions suitable for manufacturing a metal mask according to another embodiment of the present invention.
  • the upper layer (H Layer) and lower layer (L Layer) are removed from each metal plate to use the middle layer (M Layer) as the effective area (S720).
  • the middle layer (M Layer) the height direction thickness (t1) of the upper layer (H Layer) and the height direction thickness of the middle layer (M Layer) ( t2) and the height direction thickness (t3) of the lower layer (L Layer) may vary.
  • samples (210a, 210b, ..., 210n) are collected from the middle layer (M Layer) of each metal plate, and inclusions are detected for the samples (210a, 210b, ..., 210n) using the inclusion analysis system 100. Analyze and measure the size and quantity of inclusions (S730).
  • each metal plate is sorted into good and defective products using the control unit 500 (S740).
  • the control unit 500 may determine that a metal plate meeting certain conditions is a good product based on the measurement results of the inclusion measurement device 250.
  • the selection of good/defective metal plates is not limited to being performed by the control unit 500, but can also be performed manually, for example, by an operator. That is, the worker compares the pre-established inclusion standards based on the analysis results provided from the inclusion measuring device 250 and determines that the metal plate winding body from which the sample satisfying the standard is taken is a good product and can be used for manufacturing a metal mask, and thereafter Can be applied to the process.
  • the upper layer (H Layer) and lower layer (L Layer) can be removed from the metal plate through double-sided etching.
  • this embodiment is not limited to this, and it is also possible to measure the size and quantity of inclusions for each metal plate after removing only one of the upper layer (H Layer) and lower layer (L Layer) through cross-sectional etching. do.
  • a good quality metal plate selected according to an embodiment of the present invention may have a high distribution density of small-sized inclusions on one side where the cross-sectional etching has progressed more.
  • a high distribution density of inclusions of less than 1 ⁇ m may be formed on one side of the metal mask in the direction in which small holes are formed.
  • Figure 8 is a flow chart sequentially explaining a method of manufacturing a metal mask using a metal plate. The following description refers to FIG. 8.
  • the metal plate may be manufactured and prepared according to the method described with reference to FIG. 5, and may also be manufactured and prepared according to the method described with reference to FIG. 7.
  • a mask-shaped metal foil (Metal Foil or Metal Leaf) is manufactured by casting the metal plate (S820).
  • the metal foil it becomes possible to manufacture the metal foil into a thin film.
  • the thickness of the metal foil may be 50 ⁇ m or less.
  • the thickness of the metal foil may be 30 ⁇ m or less. More preferably, the thickness of the metal foil may be 10 ⁇ m to 18 ⁇ m or less.
  • a metal mask is manufactured by forming a plurality of through holes in the mask-shaped metal foil (S830).
  • the present invention relates to a metal plate for a metal mask and a method of manufacturing the same.
  • the present invention also relates to a metal mask for OLED display devices and a method of manufacturing the same.
  • the distribution of inclusions in the raw material that is, the size and quantity of the inclusions from the surface to the inside are measured to derive the usable area (effective area), and the Based on the available area, metal plates for metal masks and metal masks for OLED displays can be manufactured sequentially.
  • a metal plate is manufactured by rolling, it is possible to select a metal plate for pattern formation by analyzing the size and distribution of inclusions according to the thickness of the metal plate. Accordingly, a metal mask can also be manufactured using the selected metal plate. there is.
  • Figure 9 is a diagram showing the results of an experiment to set a management level for inclusions contained in a metal plate according to the first embodiment.
  • Figure 10 is a diagram showing the results of an experiment to set the management level for inclusions included in the metal plate according to the second embodiment.
  • Figure 9 exemplarily shows standards for determining a metal plate as a good product when the first chemical liquid is mixed with the samples (210a, 210b, ..., 210n), and Figure 10 shows a sample of a second chemical liquid different from the first chemical liquid.
  • the standard for determining a metal plate as a good product is shown as an example.
  • the present invention can be applied to the field of manufacturing a display device using a deposition mask.

Abstract

Le but de la présente invention est de gérer une inclusion d'une plaque métallique utilisée pour fabriquer un masque de dépôt à haute résolution, et, par conséquent, la présente invention concerne : un procédé de sélection de plaque métallique pour sélectionner une plaque métallique appropriée pour une norme de gestion d'inclusion ; la plaque métallique selon le procédé ; un procédé de fabrication de masque de dépôt pour fabriquer un masque de dépôt à l'aide de la plaque métallique ; et le masque de dépôt fabriqué selon le procédé.
PCT/KR2023/004397 2022-03-31 2023-03-31 Plaque métallique, masque de dépôt l'utilisant et son procédé de fabrication WO2023191594A1 (fr)

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KR20220040681 2022-03-31
KR10-2022-0040681 2022-03-31
KR1020230042933A KR20230141650A (ko) 2022-03-31 2023-03-31 금속판과 이를 활용한 증착 마스크 및 그 제조 방법
KR10-2023-0042933 2023-03-31

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0813094A (ja) * 1994-06-24 1996-01-16 Sumitomo Metal Mining Co Ltd 二相ステンレス鋳鋼およびその製法
US20150017759A1 (en) * 2012-01-12 2015-01-15 Dai Nippon Printing., Ltd Method for producing multiple-surface imposition vapor deposition mask, multiple-surface imposition vapor deposition mask obtained therefrom, and method for producing organic semiconductor element
JP2015168884A (ja) * 2014-09-29 2015-09-28 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP2017101302A (ja) * 2015-12-03 2017-06-08 大日本印刷株式会社 蒸着マスク及び蒸着マスクの製造方法
JP2019026900A (ja) * 2017-07-31 2019-02-21 凸版印刷株式会社 蒸着マスク用基材、蒸着マスク用基材の製造方法、蒸着マスクの製造方法、および、表示装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0813094A (ja) * 1994-06-24 1996-01-16 Sumitomo Metal Mining Co Ltd 二相ステンレス鋳鋼およびその製法
US20150017759A1 (en) * 2012-01-12 2015-01-15 Dai Nippon Printing., Ltd Method for producing multiple-surface imposition vapor deposition mask, multiple-surface imposition vapor deposition mask obtained therefrom, and method for producing organic semiconductor element
JP2015168884A (ja) * 2014-09-29 2015-09-28 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
JP2017101302A (ja) * 2015-12-03 2017-06-08 大日本印刷株式会社 蒸着マスク及び蒸着マスクの製造方法
JP2019026900A (ja) * 2017-07-31 2019-02-21 凸版印刷株式会社 蒸着マスク用基材、蒸着マスク用基材の製造方法、蒸着マスクの製造方法、および、表示装置の製造方法

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