WO2023191231A1 - Feuille de dissipation de chaleur ayant une conductivité thermique élevée et une résistance à la traction élevée, et son procédé de production - Google Patents

Feuille de dissipation de chaleur ayant une conductivité thermique élevée et une résistance à la traction élevée, et son procédé de production Download PDF

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Publication number
WO2023191231A1
WO2023191231A1 PCT/KR2022/018165 KR2022018165W WO2023191231A1 WO 2023191231 A1 WO2023191231 A1 WO 2023191231A1 KR 2022018165 W KR2022018165 W KR 2022018165W WO 2023191231 A1 WO2023191231 A1 WO 2023191231A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
particles
dissipation sheet
thermal conductivity
tensile strength
Prior art date
Application number
PCT/KR2022/018165
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English (en)
Korean (ko)
Inventor
최현석
박정현
한상효
Original Assignee
주식회사 에스엠티
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Publication of WO2023191231A1 publication Critical patent/WO2023191231A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a high thermal conductivity heat dissipation sheet having high tensile strength and a method of manufacturing the same. More specifically, the heat dissipation sheet has high thermal conductivity and excellent tensile strength by controlling the size and content of inorganic particles to a specific range. It relates to a high thermal conductivity heat dissipation sheet having a and a method of manufacturing the same.
  • a plasma processing device having a loading table for installing the wafer inside a vacuum chamber is used.
  • the diameter of semiconductor wafers has become larger and the processing precision has been refined, and in order to uniformly perform plasma processing on the wafer, it is necessary to apply a uniform temperature distribution. Therefore, a heater is installed on the outer periphery of the loading table, and a focus ring is installed on it through a heat conductive sheet to heat it.
  • a heat dissipation sheet with excellent heat dissipation properties has been developed in which a resin composition containing polyorganosiloxane and an inorganic filler is cured on the member.
  • the amount of inorganic filler charged is As the concentration increases above 80 vol%, the tensile strength of the heat dissipation sheet decreases, causing problems with workability when using the heat dissipation sheet. Therefore, there is a need for research and development on heat dissipation sheets that have high thermal conductivity properties and high tensile properties.
  • the present invention implements a thermal conductivity of 10 W/mK or more and provides workability and adhesion for mechanical processing such as punching, trimming, and routing work for applying heat dissipation sheets to components and modules.
  • the purpose is to provide a high thermal conductivity heat dissipation sheet that allows for ease of attachment/detachment work and rework after use, and has a high tensile strength that improves the tensile strength of the heat dissipation sheet by 0.2 MPa to 1.0 MPa, and a method of manufacturing the same.
  • the high thermal conductivity heat dissipation sheet having high tensile strength includes AlN particles having a particle size of 40 ⁇ m to 100 ⁇ m, Al 2 O 3 particles having a particle size of 2 ⁇ m to 10 ⁇ m, and 0.1 ⁇ m to 1 ⁇ m. It contains Al 2 O 3 particles with a particle size of .
  • the component amount of AlN particles having a particle size of 40 ⁇ m to 100 ⁇ m is If the component amount of Al 2 O 3 particles having is defined as Z parts by weight, the following relational equation (1) is satisfied.
  • the component amount of AlN particles having a particle size of 40 ⁇ m to 100 ⁇ m is If the component amount of Al 2 O 3 particles having is defined as Z parts by weight, the following relational equation (2) is satisfied.
  • the heat dissipation sheet has high tensile strength, characterized by a thermal conductivity of 10 W/mK or more.
  • the heat dissipation sheet having a tensile strength of 0.2 MPa or more is used.
  • the heat dissipation sheet is used that does not tear during press processing.
  • a method of manufacturing a high thermal conductivity heat dissipation sheet with high tensile strength which is an embodiment of the present invention, includes a first step of premixing AlN particles, inorganic particles containing Al 2 O 3 particles, a polymer binder, a surface treatment agent, and a catalyst; a second step of mixing with the polymer matrix; It includes a third step of manufacturing a thermally conductive sheet.
  • the inorganic particles contain AlN particles with a particle size of 40 ⁇ m to 100 ⁇ m, Al 2 O 3 particles with a particle size of 2 ⁇ m to 10 ⁇ m, and Al 2 O 3 particles with a particle size of 0.1 ⁇ m to 1 ⁇ m. .
  • the inorganic particles are used in an amount of 1500 to 1800 parts by weight, the polymer binder is used in an amount of 50 to 100 parts by weight, the catalyst is used in an amount of 0.1 to 3 parts by weight, and the surface treatment agent is used in an amount of 1 to 10 parts by weight.
  • the use of aluminum nitride compound and aluminum oxide as specific components of the inorganic pillar has the effect of having high thermal conductivity, high tensile strength, and high tear strength. Furthermore, it has the effect of having workability for mechanical processing, ease of work when attaching and detaching to an adherend, and reworkability after use of the heat conductive sheet.
  • the method for manufacturing a high thermal conductivity heat dissipation sheet with high tensile strength of the present invention is to premix a mixture containing an inorganic filler, a polymer binder, a surface treatment agent, and a catalyst, mix the premixed mixture with a polymer matrix, and then heat conductivity. It includes manufacturing a sheet.
  • the inorganic filler used in the high thermal conductivity heat dissipation sheet of the present invention preferably contains AlN particles and Al 2 O 3 particles and has high tensile strength and high tear strength while maintaining high thermal conductivity.
  • Tensile strength is a parameter that indicates the degree to which the high thermal conductivity heat dissipation sheet can withstand without breaking when pulled from both sides
  • tear strength is the force required to tear the high thermal conductivity heat dissipation sheet. It can be used to measure the performance of the seat.
  • a method of coating a surface treatment agent on an inorganic filler such as a wet method, a dry method, or an integral blend method, a method of mixing a surface-treated inorganic filler into a polymer matrix such as a continuous polymerization process or a batch polymerization process, and a thermally conductive sheet composition.
  • the mechanical properties of the high thermal conductivity heat dissipation sheet may vary depending on various process conditions, such as coating and curing methods on the substrate.
  • the AlN particles under condition i) have a size of 40 ⁇ m to 100 ⁇ m and contain 800 to 1100 parts by weight.
  • the AlN particles have a size of 40 ⁇ m to 100 ⁇ m and contain 900 to 1100 parts by weight in terms of thermal conductivity and tensile strength.
  • condition ii) the content of Al 2 O 3 particles with a size of 2 ⁇ m to 10 ⁇ m is preferably 450 to 550 parts by weight, and the content of Al 2 O 3 particles with a size of 2 ⁇ m to 10 ⁇ m is preferably 450 parts by weight. It is more preferable to contain from 500 parts by weight to 500 parts by weight.
  • condition iii) it is preferable that the Al 2 O 3 particles with a size of 0.1 ⁇ m to 1 ⁇ m contain 200 to 350 parts by weight, and the Al 2 O 3 particles with a size of 0.1 ⁇ m to 1 ⁇ m contain 200 parts by weight. Containing from 300 parts by weight to 300 parts by weight is good in terms of thermal conductivity and tensile strength.
  • the thermally conductive sheet of the present invention is composed of Defined as Z parts by weight of Al 2 O 3 particles having a particle size of , it is preferable to satisfy the following relational equation (1).
  • the thermally conductive sheet of the present invention is composed of Defined as Al 2 O 3 particles having a particle size of Z parts by weight, it is preferable to satisfy the following relational equation (2).
  • the thermal conductivity of the heat dissipation sheet can be obtained at least 10 W/mK, more preferably at least 14 W/mK, and most preferably at least 20 W/mK. You can.
  • the tensile strength of the heat dissipation sheet can be obtained at 0.2 MPa or more and 1.0 MPa or less, more preferably 0.3 MPa or more, and most preferably 0.5 MPa or more. If the tensile strength is less than the above range, there is a problem with workability, and if it exceeds the above range, the hardness or thermal resistance of the heat dissipation sheet is reduced.
  • Particles with a small diameter of the inorganic filler are filled between the large-diameter inorganic filler particles of the present invention, and the filling can be performed in a state close to close packing, thereby achieving high thermal conductivity. Therefore, when the inorganic filler is used, the mixture has high thermal conductivity, excellent electrical insulation, and is suitable for use as a raw material for a thermally conductive composition sheet.
  • the shape of the inorganic filler can be spherical, flat, polyhedral, etc. there is.
  • the inorganic filler of the present invention can be used in an amount of 80 vol% or more, more preferably 85 vol% or more, and most preferably 90 vol% or more, with respect to the thermal conductive composition sheet, to obtain a highly filled, high thermal conductive sheet.
  • the method for manufacturing a highly thermally conductive heat dissipation sheet of the present invention includes a first step of premixing AlN particles, inorganic particles containing Al 2 O 3 particles, a polymer binder, a surface treatment agent, and a catalyst; a second step of mixing with the polymer matrix; A third step of manufacturing a thermally conductive sheet may be included.
  • the surface treatment agent is preferably a silane compound or a partial hydrolyzate thereof.
  • silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, pentyltrimethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and octyltrimethoxysilane.
  • Treating the surface of an inorganic filler by surface treatment includes physical adsorption in addition to chemical bonding such as covalent bonding.
  • premixing may be performed by further including a solvent.
  • the solvent is water, N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, hexamethylenephosphonium triamide, acetonitrile, benzonitrile, etc.
  • Polar solvents represented by; Phenols represented by cresol, phenol, xylenol, etc.; Alcohols represented by methanol, ethanol, propanol, butanol, etc.; Ketones represented by acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.; Acetic acid Esters represented by ethyl, propyl acetate, butyl acetate, etc.; Hydrocarbons represented by hexane, heptane, benzene, toluene, xylene, etc.; Carboxylic acids represented by formic acid, acetic acid, etc.; Carbonates represented by ethylene carbonate, propylene carbonate, etc.
  • Ether compounds represented by dioxane, diethyl ether, etc. Chain ethers represented by ethylene glycol dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol dialkyl ether, polypropylene glycol dialkyl ether, etc.; 3-methyl Heterocyclic compounds represented by -2-oxazolidinone, etc.; Nitrile compounds represented by acetonitrile, glutarodinitrile, methoxyacetonitrile, propionitrile, benzonitrile, etc. can be suitably exemplified.
  • the type of solvent can be appropriately mixed and used. If a solvent with a low boiling point is used, the process temperature can be lowered during compounding in the post-process, and the process time can be reduced. can be shortened to increase productivity.
  • the catalyst is intended to promote curing during high temperature and vacuum compounding.
  • catalysts include platinum black, chloroplatinic acid, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, and a complex of chloroplatinic acid and olefins or vinylsiloxane.
  • platinum-based catalysts such as platinum biacetoacetate, palladium-based catalysts, and rhodium-based catalysts can be used.
  • the content of the catalyst may be any amount necessary for curing, and can be adjusted appropriately depending on the desired curing speed, etc.
  • the surface of the inorganic filler can be treated using a dry method, an integral blend method, or a semi-wet method, and after surface treatment of the inorganic filler, mixing with the polymer matrix is a continuous polymerization process (continuous compounding). It can be carried out by a polymerization process, and it can be carried out by a batch polymerization process, which is batch compounding.
  • the polymer matrix may contain silicone polymer.
  • silicone polymer organopolysiloxane containing a silicon atom bonded to an alkenyl group can be used. Additionally, an organopolysiloxane having 2 to 8 carbon atoms, such as a vinyl group or an allyl group, may be used in combination with the silicone polymer.
  • the molecular structure of the silicone polymer may be linear, cyclic, branched, or three-dimensional network, and the viscosity of the polymer matrix mixture can be adjusted by appropriately selecting the substituents or molecular structure.
  • the polymer matrix can be used as a mixture of an inorganic filler and an adhesive polymer to strengthen the bond between the polymer matrix, if necessary.
  • the thermally conductive sheet of the present invention Describing the process of manufacturing the thermally conductive sheet of the present invention, it can be obtained by coating a mixture from which the remaining solvent has been removed on a support, curing it through drying and heat treatment, and then peeling the cured material on the support.
  • the support can be a polyethylene terephthalate (PET) film, polyphenylene sulfide film, polyimide film, etc., and if necessary, the surface of the support is subjected to surface treatment with silicone, silane coupling agent, aluminum chelating agent, etc.
  • the adhesion and peelability of the thermally conductive sheet and the support can be improved.
  • methods of applying the mixture from which the residual solvent has been removed on the support include rotational application using a spinner, spray application, roll coating, screen printing, blade coater, die coater, calendar coater, meniscus coater, bar coater, and roll coater.
  • comma roll coater, gravure coater, screen coater, slit die coater, etc. can be appropriately selected considering application thickness and productivity.
  • ovens, hot plates, infrared rays, etc. can be used for drying and curing after application.
  • PDMS vinyl polydimethylsiloxane
  • B hydrogen polydimethylsiloxane
  • a platinum catalyst was used as the catalyst, and as a surface treatment agent.
  • Methyltrimethoxysilane (MTMS) was used.
  • the inorganic filler was mixed with AlN granule 80 ⁇ m, AlN granule 50 ⁇ m, Al 2 O 3 granule 5 ⁇ m, Al 2 O 3 granule 3 ⁇ m, and Al 2 O 3 granule 0.5 ⁇ m in the ratio shown in Table 1 to make a thermally conductive sheet.
  • Manufactured Thermal conductivity and tensile strength were measured, and workability was judged.
  • the component ratio represents parts by weight (g).
  • Example 1 As shown in Table 1, in Examples 1 to 4, AlN and Al 2 O 3 had excellent thermal conductivity, tensile strength, and tear strength within the above range, and did not have tearing properties during press processing. In particular, it was confirmed that Example 1 showed the best effect. However, in Comparative Examples 1 to 4, it was confirmed that the thermal conductivity was low and the tensile strength and tear strength were also low, resulting in tearing properties during press processing.
  • Example 1 Comparative Example 1 Comparative example 2 polymer bookbinder Silicone polymer (A) 50 50 52.5 52.5 silicon Polymer (B) 50 50 52.5 52.5 catalyst Platinum catalyst (g) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 surface treatment agent Silane (g) 5 5 0 0 weapon filler AIN filler 80 ⁇ m 980 500 980 500 AIN filler 50 ⁇ m 480 480 Al 2 O 3 filler 5 ⁇ m 450 450 450 450 Al 2 O 3 filler 3 ⁇ m Al 2 O 3 filler 0.5 ⁇ m 300 300 300 300 300 300 thermal conductivity W/mK 14.1 12.5 7.2 6.5 tensile strength MPa 0.35 0.32 0.05 0.03 Tear strength kgf/cm 0.11 0.09 0.01 0.01 Workability Press When processing tearing (PASS/NG) PASS PASS NG NG NG
  • Examples 1 and 2 had excellent thermal conductivity, tensile strength, and tear strength, and did not tear during press processing. However, in Comparative Examples 5 and 6, it was confirmed that the thermal conductivity was low and the tensile strength and tear strength were also low, resulting in tearing properties during press processing.
  • the thermal conductivity of the present invention was measured using Siemens Mentor Graphics DynTIM S (ASTM D5470), the tensile strength was measured using Instron 3367 (ASTM D412), and the tear strength was measured using Instron 3367 (ASTM D1004).
  • the present invention is not limited to the above-mentioned embodiments, but can be manufactured in various different forms, and those skilled in the art will be able to form other specific forms without changing the technical idea or essential features of the present invention. You will be able to understand that this can be implemented. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne une feuille de dissipation de chaleur ayant une conductivité thermique élevée et une résistance à la traction élevée, et son procédé de production, et concerne plus spécifiquement une feuille de dissipation de chaleur ayant une conductivité thermique élevée et une résistance à la traction élevée dans laquelle la taille et la quantité de particules inorganiques incluses ont été ajustées à une plage spécifique, ainsi la feuille de dissipation de chaleur a une conductivité thermique élevée et une excellente résistance à la traction, et son procédé de production.
PCT/KR2022/018165 2022-03-29 2022-11-17 Feuille de dissipation de chaleur ayant une conductivité thermique élevée et une résistance à la traction élevée, et son procédé de production WO2023191231A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220038867A KR20230140132A (ko) 2022-03-29 2022-03-29 고인장강도를 갖는 고열전도성 방열시트 및 이의 제조방법
KR10-2022-0038867 2022-03-29

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WO2023191231A1 true WO2023191231A1 (fr) 2023-10-05

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KR101271965B1 (ko) * 2011-07-13 2013-06-07 주식회사 노루코일코팅 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판
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KR102176129B1 (ko) 2019-04-03 2020-11-09 (주)이녹스첨단소재 방열시트 및 이를 포함하는 전자파 차폐-방열 복합시트
KR102660031B1 (ko) 2019-12-18 2024-04-22 후지고분시고오교오가부시끼가이샤 열전도성 조성물 및 그 제조 방법

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KR101271965B1 (ko) * 2011-07-13 2013-06-07 주식회사 노루코일코팅 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판
KR101436468B1 (ko) * 2012-11-30 2014-09-01 한국과학기술원 고강도 질화알루미늄(AlN) 소결체 및 이의 저온 소결방법
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