WO2023189739A1 - Dispositif de traitement d'informations et module de circuit - Google Patents

Dispositif de traitement d'informations et module de circuit Download PDF

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Publication number
WO2023189739A1
WO2023189739A1 PCT/JP2023/010629 JP2023010629W WO2023189739A1 WO 2023189739 A1 WO2023189739 A1 WO 2023189739A1 JP 2023010629 W JP2023010629 W JP 2023010629W WO 2023189739 A1 WO2023189739 A1 WO 2023189739A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
information processing
processing device
electronic component
circuit module
Prior art date
Application number
PCT/JP2023/010629
Other languages
English (en)
Japanese (ja)
Inventor
海 中尾根
晋平 山口
明穂 齋藤
Original Assignee
ソニーグループ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニーグループ株式会社 filed Critical ソニーグループ株式会社
Publication of WO2023189739A1 publication Critical patent/WO2023189739A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present technology relates to an information processing device and a circuit module having a heat dissipation structure.
  • Patent Document 1 discloses a mobile phone terminal including a Peltier element and a heat sink.
  • an object of the present technology is to provide an information processing device and a circuit module that are suitable for downsizing information processing devices and have a heat dissipation structure with excellent heat dissipation ability.
  • an information processing device includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
  • the second substrate faces the first substrate.
  • the connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
  • the electronic component is mounted on the first substrate or the second substrate and located within the space. The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
  • the electronic component may be an IC (Integrated Circuit).
  • the boiling point of the working fluid may be 80°C or higher and 120°C or lower.
  • the above-mentioned working fluid may be an insulating liquid.
  • the above-mentioned working fluid may be pure water.
  • the above-mentioned hydraulic fluid may be mineral oil.
  • the information processing device may further include an insulating layer that covers the inner peripheral surface of the space and the surface of the electronic component.
  • connection part may be an interposer.
  • connection portion may be soldered to the first board and the second board.
  • a circuit module includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
  • the second substrate faces the first substrate.
  • the connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
  • the electronic component is mounted on the first substrate or the second substrate and located within the space. The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
  • FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. It is a top view of the said circuit module.
  • FIG. 3 is a schematic diagram showing the operation of the circuit module.
  • FIG. 3 is a schematic diagram showing the operation of the circuit module.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device.
  • FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. It is a top view of the said circuit module.
  • FIG. 3 is a schematic diagram showing
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 3 included in the information processing device.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 1 is a perspective view of an information processing device 100 according to the present embodiment.
  • the information processing device 100 is a smartphone, and includes a display panel 110 and a housing 120.
  • the surface of the information processing device 100 on the display panel 110 side will be referred to as a front surface 100a, and the surface on the opposite side to the display panel 110 will be referred to as a back surface 100b.
  • FIG. 2 is a cross-sectional view of the circuit module 150 included in the information processing apparatus 100
  • FIG. 3 is a plan view of the circuit module 150.
  • the circuit module 150 includes a first substrate 151, a second substrate 152, a connecting portion 153, an electronic component 154, and a hydraulic fluid 155. Note that in FIG. 3, illustration of the second substrate 152 and the hydraulic fluid 155 is omitted.
  • the first board 151 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board.
  • the first substrate 151 is arranged to face the second substrate 152 and has a first main surface 151a on the second substrate 152 side and a second main surface 151b on the opposite side to the second substrate 152.
  • the first substrate 151 has a planar shape according to the arrangement of components within the information processing apparatus 100, and has a planar shape shown in FIG. 3, for example.
  • the second board 152 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board.
  • the second substrate 152 is arranged to face the first substrate 151 and has a third main surface 152a on the first substrate 151 side and a fourth main surface 152b on the opposite side to the first substrate 151.
  • the second substrate 152 has a planar shape that corresponds to the arrangement of components within the information processing device 100, and has, for example, the same planar shape as the first substrate 151 shown in FIG. 3.
  • the connecting portion 153 physically and electrically connects the first substrate 151 and the second substrate 152.
  • An interposer can be used as the connecting portion 153.
  • the connecting portion 153 has an annular shape as shown in FIG. 3, and is disposed between the first substrate 151 and the second substrate 152 as shown in FIG.
  • the connecting portion 153 is joined to the first main surface 151a and the third main surface 152a, and seals the space between the first substrate 151 and the second substrate 152.
  • the space surrounded by the first substrate 151, the second substrate 152, and the connecting portion 153 will be referred to as a sealed space R.
  • the surface of the connecting portion 153 on the side of the sealed space R is defined as a side surface 153a.
  • Wiring is provided in the connecting portion 153, and the wiring electrically connects the first substrate 151 and the second substrate 152 by contacting the electrodes provided on the first main surface 151a and the third main surface 152a.
  • the method of joining the connecting portion 153 to the first substrate 151 and the second substrate 152 may be any method as long as the sealed space R can be sealed and these can be electrically connected, and for example, soldering can be used.
  • the electronic component 154 is mounted on the first main surface 151a and located within the sealed space R.
  • the electronic component 154 is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • the electronic component 154 generates heat due to operations such as arithmetic processing, and the highest temperature at which the electronic component 154 can operate normally is defined as the heat generation temperature.
  • the exothermic temperature is generally 80°C or higher and 120°C or lower.
  • a plurality of electronic components 154 may be mounted on the first main surface 151a, or only one electronic component 154 may be mounted. Furthermore, one or more electronic components 154 may be mounted on the third main surface 152a.
  • the working fluid 155 is sealed in the sealed space R and causes the circuit module 150 to radiate heat.
  • the working fluid 155 is a liquid that evaporates due to heat generated by the electronic component 154. That is, the working fluid 155 is a liquid whose boiling point is lower than the heat generation temperature of the electronic component 154, specifically, a liquid whose boiling point is 80° C. or higher and 120° C. or lower.
  • Hydraulic fluid 155 is preferably an insulating liquid, such as pure water or mineral oil.
  • the circuit module 150 has the above configuration. Note that the first substrate 151 and the second substrate 152 are arranged so that one side is on the front surface 100a side of the information processing device 100 and the other side is on the back surface 100b side, but either one may be on the front surface 100a side.
  • FIG. 4 and 5 are schematic diagrams showing the operation of the circuit module 150.
  • the working fluid 155 evaporates.
  • the hydraulic fluid 155 removes heat from the electronic component 154 as shown by the arrow in FIG. 4, and the electronic component 154 is cooled.
  • the evaporated working fluid 155 is cooled when it comes into contact with the third main surface 152a and the side surface 153a, and returns to liquid on the third main surface 152a and the side surface 153a, as shown in FIG. At this time, the heat of the working fluid 155 is radiated from the second substrate 152 as shown by the arrow. Thereafter, the working fluid 155 repeats the above-described operation and circulates between liquid and gas, thereby continuously cooling the electronic component 154.
  • the circuit module 150 operates as described above. As the working fluid 155 circulates between liquid and gas as described above, the sealed space R functions as a heat pipe and can efficiently cool the electronic components 154, so the circuit module 150 has a heat dissipation capacity. Excellent in Further, the structure in which two substrates are connected by an interposer is suitable for downsizing information processing devices, and the circuit module 150 utilizes this structure as a heat dissipation structure. Since a heat dissipation structure is not separately provided, the circuit module 150 is suitable for downsizing the information processing device 100.
  • FIG. 6 is a schematic diagram showing the structure of a circuit module 250 according to a comparative example.
  • the circuit module 250 includes a first substrate 251, a second substrate 252, a connecting portion 253, an electronic component 254, and a heat dissipating gel 255.
  • the second substrate 252 is pressed toward the first substrate 251 side as shown by the arrow in the manufacturing process, and the heat dissipation gel 255 is applied to the second substrate. It is necessary to make it close to 252.
  • the process of pressing the second substrate 252 places a heavy burden on equipment.
  • the circuit module 150 may include an insulating layer.
  • FIG. 7 is a cross-sectional view of a circuit module 150 including an insulating layer 156.
  • the insulating layer 156 covers the inner peripheral surface of the sealed space R, that is, the first main surface 151a, the third main surface 152a, the side surface 153a, and the surface of the electronic component 154.
  • the insulating layer 156 is made of, for example, fluororesin.
  • FIG. 8 is a cross-sectional view of the circuit module 160 included in the information processing device 100.
  • the circuit module 160 includes a substrate 161, an electronic component 162, a thermally conductive gel 163, a shield 164, a frame 165, and a thermally conductive sheet 166.
  • the circuit module 160 can be placed on the back side of the display panel 110 in the information processing device 100.
  • the board 161 is a circuit board on which various components are mounted, and is, for example, a printed wiring board.
  • the electronic component 162 is mounted on the board 161 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • CPU Central Processing Unit
  • GPU Graphics Processing Unit
  • SoC System on a Chip
  • IC Integrated Circuit
  • the heat conductive gel 163 is placed between the electronic component 162 and the shield 164 and transfers the heat of the electronic component 162 to the shield 164.
  • the shield 164 covers the electronic component 162 and blocks radio waves emitted from the electronic component 162 and radio waves incident on the electronic component 162 from the outside.
  • the shield 164 is made of metal such as aluminum.
  • the frame 165 is a member that constitutes the casing 120 of the information processing device 100, and is sometimes called a cover main.
  • the frame 165 is made of metal such as aluminum and has an opening 165a.
  • the heat conductive sheet 166 transmits heat along the sheet surface.
  • the thermally conductive sheet 166 is made of a highly thermally conductive material such as graphite. As shown in FIG. 8, the shield 164 contacts the thermally conductive sheet 166 through the opening 165a.
  • thickness D1 the thickness of the circuit module 160
  • the heat of the electronic component 162 is transmitted to the shield 164 via the thermally conductive gel 163, and from the shield 164 to the thermally conductive sheet 166. Further, this heat is transferred from the heat conductive sheet 166 to the frame 165, and is radiated from the heat conductive sheet 166 and the frame 165.
  • FIG. 9 is a schematic diagram showing the structure of a circuit module 260 according to a comparative example.
  • the circuit module 260 includes a substrate 261, an electronic component 262, a first thermally conductive gel 263, a shield 264, a second thermally conductive gel 265, a frame 266, and a thermally conductive sheet 267.
  • Circuit module 260 can be placed on the back side of display panel 210, as shown in FIG.
  • An electronic component 262 mounted on a substrate 261 is bonded to a shield 264 via a first thermally conductive gel 263.
  • the frame 266 is not provided with an opening, and the shield 264 is joined to the frame 266 via the second thermally conductive gel 265.
  • the thickness D2 the thickness D2.
  • the heat of the electronic component 262 is transmitted to the shield 264 via the first thermally conductive gel 263, and is transferred to the frame 266 via the second thermally conductive gel 265. communicated. Further, this heat is transferred from the frame 266 to the heat conductive sheet 267, and is radiated from the frame 266 and the heat conductive sheet 267.
  • an opening 165a is provided in the frame 165, and the shield 164 directly contacts the heat conductive sheet 166. Therefore, the thickness of the frame 266 is reduced relative to the circuit module 260, and the thickness D1 becomes smaller than the thickness D2. Therefore, the circuit module 160 can be made thinner while maintaining heat dissipation performance.
  • FIG. 10 is a cross-sectional view of a circuit module 160 having another structure.
  • the circuit module 160 may include a first thermally conductive gel 167 and a second thermally conductive gel 168 instead of the thermally conductive gel 163.
  • the first thermally conductive gel 167 is placed between the electronic component 162 and the shield 164
  • the second thermally conductive gel 168 is placed between the shield 164 and the thermally conductive sheet 166.
  • the thickness of the frame 266 is reduced relative to the circuit module 260, it is possible to make the circuit module 160 thinner.
  • FIG. 11 is a cross-sectional view of the circuit module 170 included in the information processing device 100.
  • the circuit module 170 includes a substrate 171, an electronic component 172, a frame 173, a carbon nanotube member 174, and a heat conductive sheet 175.
  • the circuit module 170 can be placed on the rear surface 100b (see FIG. 1) side of the information processing device 100.
  • the board 171 is a circuit board on which various components are mounted, and is, for example, a printed wiring board.
  • the electronic component 172 is mounted on the board 171 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • the frame 173 is a member that constitutes the housing 120 of the information processing device 100, and is made of resin.
  • the carbon nanotube member 174 is a member made of multi-walled carbon nanotubes and has rubber-like elasticity.
  • the carbon nanotube member 174 has a convex shape that projects toward the electronic component 172, as shown in FIG. Further, the shape of the carbon nanotube member 174 is not limited to this, and may be a flat plate shape or the like.
  • the carbon nanotube member 174 is joined to the frame 173 by insert molding. Furthermore, the carbon nanotube member 174 may be joined to the frame 173 using an adhesive or the like.
  • the heat conductive sheet 175 transmits heat along the sheet surface.
  • the thermally conductive sheet 175 is made of a highly thermally conductive material such as graphite.
  • a substrate 171 is pressed and fixed to a frame 173 , and an electronic component 172 is pressed against a carbon nanotube member 174 . Since the carbon nanotube member 174 has rubber-like elasticity, it adheres closely to the electronic component 172 while being slightly deformed.
  • the heat of the electronic component 172 is transmitted to the heat conductive sheet 175 via the carbon nanotube member 174, and is radiated from the heat conductive sheet 175.
  • FIG. 12 is a schematic diagram showing the structure of a circuit module 270 according to a comparative example.
  • the circuit module 270 includes a substrate 271, an electronic component 272, a frame 273, a metal member 274, a thermally conductive gel 275, and a thermally conductive sheet 276.
  • the metal member 274 is joined to the frame 273 by insert molding or the like.
  • Thermal conductive gel 275 is placed between electronic component 272 and metal member 274 to transfer heat from electronic component 272 to metal member 274 .
  • the circuit module 270 in order to sufficiently transfer the heat of the electronic component 272 to the metal member 274, it is necessary to arrange a thermally conductive gel 275 between the electronic component 272 and the metal member 274.
  • the carbon nanotube member 174 in the circuit module 170 the heat of the electronic component 172 can be directly transferred to the carbon nanotube member 174, and there is no need to dispose a heat conductive gel or the like in between. Therefore, the circuit module 170 has excellent productivity and high heat dissipation.
  • the information processing device 100 may include at least one of the above-mentioned "heat radiation structure 1", “heat radiation structure 2", and “heat radiation structure 3". Further, the information processing device 100 is not limited to a smartphone, and can be any of various information processing devices.
  • the above electronic component is an IC (Integrated Circuit) information processing device.
  • the information processing device according to (1) or (2) above, The boiling point of the working fluid is 80°C or more and 120°C or less. Information processing device.
  • (4) The information processing device according to any one of (1) to (3) above, The above-mentioned working fluid is an insulating liquid.
  • Information processing equipment (5) The information processing device according to any one of (1) to (4) above, The above working fluid is pure water. Information processing equipment. (6) The information processing device according to any one of (1) to (4) above, The above working fluid is mineral oil. Information processing equipment. (7) The information processing device according to any one of (1) to (6) above, An information processing device further comprising: an insulating layer that covers an inner peripheral surface of the space and a surface of the electronic component. (8) The information processing device according to any one of (1) to (7) above, The above connection part is an interposer information processing device. (9) The information processing device according to any one of (1) to (8) above, The connecting portion is soldered to the first board and the second board. The information processing device.
  • a circuit module comprising: a working fluid sealed in the space and evaporated by heat generated by the electronic component.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le problème décrit par la présente invention est de fournir : un dispositif de traitement d'informations ayant une structure de dissipation de chaleur qui présente une capacité de dissipation de chaleur élevée et qui est appropriée pour miniaturiser le dispositif de traitement d'informations ; et un module de circuit. La solution selon l'invention porte sur un dispositif de traitement d'informations qui comprend : un premier substrat ; un second substrat ; une partie de connexion ; un composant électronique ; et un liquide actif. Le second substrat fait face au premier substrat. La partie de connexion est disposée entre le premier substrat et le second substrat, connecte électriquement le premier substrat et le second substrat, et scelle un espace entre le premier substrat et le second substrat. Le composant électronique est monté sur le premier substrat ou le second substrat, et est disposé dans ledit espace. Le liquide actif est scellé dans ledit espace, et est évaporé par la chaleur générée dans le composant électronique.
PCT/JP2023/010629 2022-03-30 2023-03-17 Dispositif de traitement d'informations et module de circuit WO2023189739A1 (fr)

Applications Claiming Priority (2)

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JP2022055625 2022-03-30
JP2022-055625 2022-03-30

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WO2023189739A1 true WO2023189739A1 (fr) 2023-10-05

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116568A1 (en) * 2006-11-21 2008-05-22 The Boeing Company Direct semiconductor contact ebullient cooling package
KR20130012407A (ko) * 2011-07-25 2013-02-04 주식회사 엘지화학 이차 전지 및 이를 포함하는 전력 저장 장치
JP2019519848A (ja) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． データセンタキャビネット及びその圧力スプレーシステム
CN213341386U (zh) * 2020-11-04 2021-06-01 秦皇岛旭升节能科技有限公司 一种避免漏电的电气设备用电路保护装置
US20210337659A1 (en) * 2020-04-27 2021-10-28 Fu Tai Hua Industry (Shenzhen) Co., Ltd. Heat dissipation structure and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116568A1 (en) * 2006-11-21 2008-05-22 The Boeing Company Direct semiconductor contact ebullient cooling package
KR20130012407A (ko) * 2011-07-25 2013-02-04 주식회사 엘지화학 이차 전지 및 이를 포함하는 전력 저장 장치
JP2019519848A (ja) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． データセンタキャビネット及びその圧力スプレーシステム
US20210337659A1 (en) * 2020-04-27 2021-10-28 Fu Tai Hua Industry (Shenzhen) Co., Ltd. Heat dissipation structure and electronic device
CN213341386U (zh) * 2020-11-04 2021-06-01 秦皇岛旭升节能科技有限公司 一种避免漏电的电气设备用电路保护装置

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