WO2023189739A1 - Information processing device and circuit module - Google Patents

Information processing device and circuit module Download PDF

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Publication number
WO2023189739A1
WO2023189739A1 PCT/JP2023/010629 JP2023010629W WO2023189739A1 WO 2023189739 A1 WO2023189739 A1 WO 2023189739A1 JP 2023010629 W JP2023010629 W JP 2023010629W WO 2023189739 A1 WO2023189739 A1 WO 2023189739A1
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WO
WIPO (PCT)
Prior art keywords
substrate
information processing
processing device
electronic component
circuit module
Prior art date
Application number
PCT/JP2023/010629
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French (fr)
Japanese (ja)
Inventor
海 中尾根
晋平 山口
明穂 齋藤
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ソニーグループ株式会社
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Publication of WO2023189739A1 publication Critical patent/WO2023189739A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present technology relates to an information processing device and a circuit module having a heat dissipation structure.
  • Patent Document 1 discloses a mobile phone terminal including a Peltier element and a heat sink.
  • an object of the present technology is to provide an information processing device and a circuit module that are suitable for downsizing information processing devices and have a heat dissipation structure with excellent heat dissipation ability.
  • an information processing device includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
  • the second substrate faces the first substrate.
  • the connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
  • the electronic component is mounted on the first substrate or the second substrate and located within the space. The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
  • the electronic component may be an IC (Integrated Circuit).
  • the boiling point of the working fluid may be 80°C or higher and 120°C or lower.
  • the above-mentioned working fluid may be an insulating liquid.
  • the above-mentioned working fluid may be pure water.
  • the above-mentioned hydraulic fluid may be mineral oil.
  • the information processing device may further include an insulating layer that covers the inner peripheral surface of the space and the surface of the electronic component.
  • connection part may be an interposer.
  • connection portion may be soldered to the first board and the second board.
  • a circuit module includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
  • the second substrate faces the first substrate.
  • the connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
  • the electronic component is mounted on the first substrate or the second substrate and located within the space. The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
  • FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. It is a top view of the said circuit module.
  • FIG. 3 is a schematic diagram showing the operation of the circuit module.
  • FIG. 3 is a schematic diagram showing the operation of the circuit module.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device.
  • FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. It is a top view of the said circuit module.
  • FIG. 3 is a schematic diagram showing
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device.
  • FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 3 included in the information processing device.
  • FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
  • FIG. 1 is a perspective view of an information processing device 100 according to the present embodiment.
  • the information processing device 100 is a smartphone, and includes a display panel 110 and a housing 120.
  • the surface of the information processing device 100 on the display panel 110 side will be referred to as a front surface 100a, and the surface on the opposite side to the display panel 110 will be referred to as a back surface 100b.
  • FIG. 2 is a cross-sectional view of the circuit module 150 included in the information processing apparatus 100
  • FIG. 3 is a plan view of the circuit module 150.
  • the circuit module 150 includes a first substrate 151, a second substrate 152, a connecting portion 153, an electronic component 154, and a hydraulic fluid 155. Note that in FIG. 3, illustration of the second substrate 152 and the hydraulic fluid 155 is omitted.
  • the first board 151 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board.
  • the first substrate 151 is arranged to face the second substrate 152 and has a first main surface 151a on the second substrate 152 side and a second main surface 151b on the opposite side to the second substrate 152.
  • the first substrate 151 has a planar shape according to the arrangement of components within the information processing apparatus 100, and has a planar shape shown in FIG. 3, for example.
  • the second board 152 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board.
  • the second substrate 152 is arranged to face the first substrate 151 and has a third main surface 152a on the first substrate 151 side and a fourth main surface 152b on the opposite side to the first substrate 151.
  • the second substrate 152 has a planar shape that corresponds to the arrangement of components within the information processing device 100, and has, for example, the same planar shape as the first substrate 151 shown in FIG. 3.
  • the connecting portion 153 physically and electrically connects the first substrate 151 and the second substrate 152.
  • An interposer can be used as the connecting portion 153.
  • the connecting portion 153 has an annular shape as shown in FIG. 3, and is disposed between the first substrate 151 and the second substrate 152 as shown in FIG.
  • the connecting portion 153 is joined to the first main surface 151a and the third main surface 152a, and seals the space between the first substrate 151 and the second substrate 152.
  • the space surrounded by the first substrate 151, the second substrate 152, and the connecting portion 153 will be referred to as a sealed space R.
  • the surface of the connecting portion 153 on the side of the sealed space R is defined as a side surface 153a.
  • Wiring is provided in the connecting portion 153, and the wiring electrically connects the first substrate 151 and the second substrate 152 by contacting the electrodes provided on the first main surface 151a and the third main surface 152a.
  • the method of joining the connecting portion 153 to the first substrate 151 and the second substrate 152 may be any method as long as the sealed space R can be sealed and these can be electrically connected, and for example, soldering can be used.
  • the electronic component 154 is mounted on the first main surface 151a and located within the sealed space R.
  • the electronic component 154 is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • the electronic component 154 generates heat due to operations such as arithmetic processing, and the highest temperature at which the electronic component 154 can operate normally is defined as the heat generation temperature.
  • the exothermic temperature is generally 80°C or higher and 120°C or lower.
  • a plurality of electronic components 154 may be mounted on the first main surface 151a, or only one electronic component 154 may be mounted. Furthermore, one or more electronic components 154 may be mounted on the third main surface 152a.
  • the working fluid 155 is sealed in the sealed space R and causes the circuit module 150 to radiate heat.
  • the working fluid 155 is a liquid that evaporates due to heat generated by the electronic component 154. That is, the working fluid 155 is a liquid whose boiling point is lower than the heat generation temperature of the electronic component 154, specifically, a liquid whose boiling point is 80° C. or higher and 120° C. or lower.
  • Hydraulic fluid 155 is preferably an insulating liquid, such as pure water or mineral oil.
  • the circuit module 150 has the above configuration. Note that the first substrate 151 and the second substrate 152 are arranged so that one side is on the front surface 100a side of the information processing device 100 and the other side is on the back surface 100b side, but either one may be on the front surface 100a side.
  • FIG. 4 and 5 are schematic diagrams showing the operation of the circuit module 150.
  • the working fluid 155 evaporates.
  • the hydraulic fluid 155 removes heat from the electronic component 154 as shown by the arrow in FIG. 4, and the electronic component 154 is cooled.
  • the evaporated working fluid 155 is cooled when it comes into contact with the third main surface 152a and the side surface 153a, and returns to liquid on the third main surface 152a and the side surface 153a, as shown in FIG. At this time, the heat of the working fluid 155 is radiated from the second substrate 152 as shown by the arrow. Thereafter, the working fluid 155 repeats the above-described operation and circulates between liquid and gas, thereby continuously cooling the electronic component 154.
  • the circuit module 150 operates as described above. As the working fluid 155 circulates between liquid and gas as described above, the sealed space R functions as a heat pipe and can efficiently cool the electronic components 154, so the circuit module 150 has a heat dissipation capacity. Excellent in Further, the structure in which two substrates are connected by an interposer is suitable for downsizing information processing devices, and the circuit module 150 utilizes this structure as a heat dissipation structure. Since a heat dissipation structure is not separately provided, the circuit module 150 is suitable for downsizing the information processing device 100.
  • FIG. 6 is a schematic diagram showing the structure of a circuit module 250 according to a comparative example.
  • the circuit module 250 includes a first substrate 251, a second substrate 252, a connecting portion 253, an electronic component 254, and a heat dissipating gel 255.
  • the second substrate 252 is pressed toward the first substrate 251 side as shown by the arrow in the manufacturing process, and the heat dissipation gel 255 is applied to the second substrate. It is necessary to make it close to 252.
  • the process of pressing the second substrate 252 places a heavy burden on equipment.
  • the circuit module 150 may include an insulating layer.
  • FIG. 7 is a cross-sectional view of a circuit module 150 including an insulating layer 156.
  • the insulating layer 156 covers the inner peripheral surface of the sealed space R, that is, the first main surface 151a, the third main surface 152a, the side surface 153a, and the surface of the electronic component 154.
  • the insulating layer 156 is made of, for example, fluororesin.
  • FIG. 8 is a cross-sectional view of the circuit module 160 included in the information processing device 100.
  • the circuit module 160 includes a substrate 161, an electronic component 162, a thermally conductive gel 163, a shield 164, a frame 165, and a thermally conductive sheet 166.
  • the circuit module 160 can be placed on the back side of the display panel 110 in the information processing device 100.
  • the board 161 is a circuit board on which various components are mounted, and is, for example, a printed wiring board.
  • the electronic component 162 is mounted on the board 161 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • CPU Central Processing Unit
  • GPU Graphics Processing Unit
  • SoC System on a Chip
  • IC Integrated Circuit
  • the heat conductive gel 163 is placed between the electronic component 162 and the shield 164 and transfers the heat of the electronic component 162 to the shield 164.
  • the shield 164 covers the electronic component 162 and blocks radio waves emitted from the electronic component 162 and radio waves incident on the electronic component 162 from the outside.
  • the shield 164 is made of metal such as aluminum.
  • the frame 165 is a member that constitutes the casing 120 of the information processing device 100, and is sometimes called a cover main.
  • the frame 165 is made of metal such as aluminum and has an opening 165a.
  • the heat conductive sheet 166 transmits heat along the sheet surface.
  • the thermally conductive sheet 166 is made of a highly thermally conductive material such as graphite. As shown in FIG. 8, the shield 164 contacts the thermally conductive sheet 166 through the opening 165a.
  • thickness D1 the thickness of the circuit module 160
  • the heat of the electronic component 162 is transmitted to the shield 164 via the thermally conductive gel 163, and from the shield 164 to the thermally conductive sheet 166. Further, this heat is transferred from the heat conductive sheet 166 to the frame 165, and is radiated from the heat conductive sheet 166 and the frame 165.
  • FIG. 9 is a schematic diagram showing the structure of a circuit module 260 according to a comparative example.
  • the circuit module 260 includes a substrate 261, an electronic component 262, a first thermally conductive gel 263, a shield 264, a second thermally conductive gel 265, a frame 266, and a thermally conductive sheet 267.
  • Circuit module 260 can be placed on the back side of display panel 210, as shown in FIG.
  • An electronic component 262 mounted on a substrate 261 is bonded to a shield 264 via a first thermally conductive gel 263.
  • the frame 266 is not provided with an opening, and the shield 264 is joined to the frame 266 via the second thermally conductive gel 265.
  • the thickness D2 the thickness D2.
  • the heat of the electronic component 262 is transmitted to the shield 264 via the first thermally conductive gel 263, and is transferred to the frame 266 via the second thermally conductive gel 265. communicated. Further, this heat is transferred from the frame 266 to the heat conductive sheet 267, and is radiated from the frame 266 and the heat conductive sheet 267.
  • an opening 165a is provided in the frame 165, and the shield 164 directly contacts the heat conductive sheet 166. Therefore, the thickness of the frame 266 is reduced relative to the circuit module 260, and the thickness D1 becomes smaller than the thickness D2. Therefore, the circuit module 160 can be made thinner while maintaining heat dissipation performance.
  • FIG. 10 is a cross-sectional view of a circuit module 160 having another structure.
  • the circuit module 160 may include a first thermally conductive gel 167 and a second thermally conductive gel 168 instead of the thermally conductive gel 163.
  • the first thermally conductive gel 167 is placed between the electronic component 162 and the shield 164
  • the second thermally conductive gel 168 is placed between the shield 164 and the thermally conductive sheet 166.
  • the thickness of the frame 266 is reduced relative to the circuit module 260, it is possible to make the circuit module 160 thinner.
  • FIG. 11 is a cross-sectional view of the circuit module 170 included in the information processing device 100.
  • the circuit module 170 includes a substrate 171, an electronic component 172, a frame 173, a carbon nanotube member 174, and a heat conductive sheet 175.
  • the circuit module 170 can be placed on the rear surface 100b (see FIG. 1) side of the information processing device 100.
  • the board 171 is a circuit board on which various components are mounted, and is, for example, a printed wiring board.
  • the electronic component 172 is mounted on the board 171 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
  • the frame 173 is a member that constitutes the housing 120 of the information processing device 100, and is made of resin.
  • the carbon nanotube member 174 is a member made of multi-walled carbon nanotubes and has rubber-like elasticity.
  • the carbon nanotube member 174 has a convex shape that projects toward the electronic component 172, as shown in FIG. Further, the shape of the carbon nanotube member 174 is not limited to this, and may be a flat plate shape or the like.
  • the carbon nanotube member 174 is joined to the frame 173 by insert molding. Furthermore, the carbon nanotube member 174 may be joined to the frame 173 using an adhesive or the like.
  • the heat conductive sheet 175 transmits heat along the sheet surface.
  • the thermally conductive sheet 175 is made of a highly thermally conductive material such as graphite.
  • a substrate 171 is pressed and fixed to a frame 173 , and an electronic component 172 is pressed against a carbon nanotube member 174 . Since the carbon nanotube member 174 has rubber-like elasticity, it adheres closely to the electronic component 172 while being slightly deformed.
  • the heat of the electronic component 172 is transmitted to the heat conductive sheet 175 via the carbon nanotube member 174, and is radiated from the heat conductive sheet 175.
  • FIG. 12 is a schematic diagram showing the structure of a circuit module 270 according to a comparative example.
  • the circuit module 270 includes a substrate 271, an electronic component 272, a frame 273, a metal member 274, a thermally conductive gel 275, and a thermally conductive sheet 276.
  • the metal member 274 is joined to the frame 273 by insert molding or the like.
  • Thermal conductive gel 275 is placed between electronic component 272 and metal member 274 to transfer heat from electronic component 272 to metal member 274 .
  • the circuit module 270 in order to sufficiently transfer the heat of the electronic component 272 to the metal member 274, it is necessary to arrange a thermally conductive gel 275 between the electronic component 272 and the metal member 274.
  • the carbon nanotube member 174 in the circuit module 170 the heat of the electronic component 172 can be directly transferred to the carbon nanotube member 174, and there is no need to dispose a heat conductive gel or the like in between. Therefore, the circuit module 170 has excellent productivity and high heat dissipation.
  • the information processing device 100 may include at least one of the above-mentioned "heat radiation structure 1", “heat radiation structure 2", and “heat radiation structure 3". Further, the information processing device 100 is not limited to a smartphone, and can be any of various information processing devices.
  • the above electronic component is an IC (Integrated Circuit) information processing device.
  • the information processing device according to (1) or (2) above, The boiling point of the working fluid is 80°C or more and 120°C or less. Information processing device.
  • (4) The information processing device according to any one of (1) to (3) above, The above-mentioned working fluid is an insulating liquid.
  • Information processing equipment (5) The information processing device according to any one of (1) to (4) above, The above working fluid is pure water. Information processing equipment. (6) The information processing device according to any one of (1) to (4) above, The above working fluid is mineral oil. Information processing equipment. (7) The information processing device according to any one of (1) to (6) above, An information processing device further comprising: an insulating layer that covers an inner peripheral surface of the space and a surface of the electronic component. (8) The information processing device according to any one of (1) to (7) above, The above connection part is an interposer information processing device. (9) The information processing device according to any one of (1) to (8) above, The connecting portion is soldered to the first board and the second board. The information processing device.
  • a circuit module comprising: a working fluid sealed in the space and evaporated by heat generated by the electronic component.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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Abstract

[Problem] To provide: an information processing device having a heat dissipation structure which exhibits high heat dissipation capability and which is suited for miniaturizing the information processing device; and a circuit module. [Solution] An information processing device according to the present technique comprises: a first substrate; a second substrate; a connection part; an electronic component; and a working liquid. The second substrate faces the first substrate. The connection part is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and seals a space between the first substrate and the second substrate. The electronic component is mounted on the first substrate or the second substrate, and is positioned in said space. The working liquid is sealed in said space, and is evaporated by heat generated in the electronic component.

Description

情報処理装置及び回路モジュールInformation processing equipment and circuit modules
　本技術は、放熱構造を有する情報処理装置及び回路モジュールに関する。 The present technology relates to an information processing device and a circuit module having a heat dissipation structure.
　スマートフォン等の情報処理装置は、演算処理速度や通信速度の向上に伴って、内蔵する電子部品の発熱量が増加する傾向にあり、放熱能力の向上が求められている。例えば、特許文献１にはペルチェ素子及びヒートシンクを備える携帯電話端末が開示されている。 Information processing devices such as smartphones tend to generate more heat from their built-in electronic components as their arithmetic processing speeds and communication speeds improve, and there is a need for improvements in their heat dissipation capabilities. For example, Patent Document 1 discloses a mobile phone terminal including a Peltier element and a heat sink.
特開２０１０－１７１１８０号公報Japanese Patent Application Publication No. 2010-171180
　近年では情報処理装置の小型化に伴い、筐体の内部空間が減少している。このため、特許文献１に記載のように、サイズの大きい放熱用の部品を情報処理装置に搭載することは困難になりつつある。 In recent years, as information processing devices have become smaller, the internal space of their housings has decreased. For this reason, as described in Patent Document 1, it is becoming difficult to mount large-sized heat dissipation components on information processing devices.
　以上のような事情に鑑み、本技術の目的は、情報処理装置の小型化に適し、放熱能力に優れる放熱構造を有する情報処理装置及び回路モジュールを提供することにある。 In view of the above circumstances, an object of the present technology is to provide an information processing device and a circuit module that are suitable for downsizing information processing devices and have a heat dissipation structure with excellent heat dissipation ability.
　上記目的を達成するため、本技術の一形態に係る情報処理装置は、第１の基板と、第２の基板と、接続部と、電子部品と、作動液とを具備する。
　上記第2の基板は、上記第1の基板と対向する。
　上記接続部は、上記第１の基板と上記第２の基板の間に配置され、上記第１の基板と上記第２の基板を電気的に接続し、上記第１の基板と上記第２の基板の間の空間を封止する。
　上記電子部品は、上記第１の基板又は上記第２の基板に実装され、上記空間内に位置する。
　上記作動液は、上記空間内に封入され、上記電子部品の発熱により蒸発する。 In order to achieve the above object, an information processing device according to one embodiment of the present technology includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
The second substrate faces the first substrate.
The connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
The electronic component is mounted on the first substrate or the second substrate and located within the space.
The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
　上記電子部品はＩＣ（Integrated Circuit）であってもよい。 The electronic component may be an IC (Integrated Circuit).
　上記作動液の沸点は８０℃以上１２０℃以下であってもよい。 The boiling point of the working fluid may be 80°C or higher and 120°C or lower.
　上記作動液は絶縁性液体であってもよい。 The above-mentioned working fluid may be an insulating liquid.
　上記作動液は純水であってもよい。 The above-mentioned working fluid may be pure water.
　上記作動液は鉱油であってもよい。 The above-mentioned hydraulic fluid may be mineral oil.
　上記情報処理装置は、上記空間の内周面及び上記電子部品の表面を被覆する絶縁層をさらに具備してもよい。 The information processing device may further include an insulating layer that covers the inner peripheral surface of the space and the surface of the electronic component.
　上記接続部はインターポーザーであってもよい。 The above connection part may be an interposer.
　上記接続部は上記第１の基板及び上記第２の基板にハンダ付けされていてもよい。 The connection portion may be soldered to the first board and the second board.
　上記目的を達成するため、本技術の一形態に係る回路モジュールは、第１の基板と、第２の基板と、接続部と、電子部品と、作動液とを具備する。
　上記第2の基板は、上記第1の基板と対向する。
　上記接続部は、上記第１の基板と上記第２の基板の間に配置され、上記第１の基板と上記第２の基板を電気的に接続し、上記第１の基板と上記第２の基板の間の空間を封止する。
　上記電子部品は、上記第１の基板又は上記第２の基板に実装され、上記空間内に位置する。
　上記作動液は、上記空間内に封入され、上記電子部品の発熱により蒸発する。 In order to achieve the above object, a circuit module according to an embodiment of the present technology includes a first substrate, a second substrate, a connecting portion, an electronic component, and a hydraulic fluid.
The second substrate faces the first substrate.
The connecting portion is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate, and connects the first substrate and the second substrate. Sealing the space between the substrates.
The electronic component is mounted on the first substrate or the second substrate and located within the space.
The working fluid is sealed in the space and evaporates due to heat generated by the electronic component.
本技術の実施形態に係る情報処理装置の斜視図である。FIG. 1 is a perspective view of an information processing device according to an embodiment of the present technology. 上記情報処理装置が備える、放熱構造１に係る回路モジュールの断面図である。FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. 上記回路モジュールの平面図である。It is a top view of the said circuit module. 上記回路モジュールの動作を示す模式図である。FIG. 3 is a schematic diagram showing the operation of the circuit module. 上記回路モジュールの動作を示す模式図である。FIG. 3 is a schematic diagram showing the operation of the circuit module. 比較例に係る回路モジュールの断面図である。FIG. 3 is a cross-sectional view of a circuit module according to a comparative example. 上記情報処理装置が備える、放熱構造１に係る回路モジュールの断面図である。FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 1 included in the information processing device. 上記情報処理装置が備える、放熱構造２に係る回路モジュールの断面図である。FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device. 比較例に係る回路モジュールの断面図である。FIG. 3 is a cross-sectional view of a circuit module according to a comparative example. 上記情報処理装置が備える、放熱構造２に係る回路モジュールの断面図である。FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 2 included in the information processing device. 上記情報処理装置が備える、放熱構造３に係る回路モジュールの断面図である。FIG. 2 is a cross-sectional view of a circuit module related to a heat dissipation structure 3 included in the information processing device. 比較例に係る回路モジュールの断面図である。FIG. 3 is a cross-sectional view of a circuit module according to a comparative example.
　本技術の実施形態に係る情報処理装置について説明する。 An information processing device according to an embodiment of the present technology will be described.
　図１は本実施形態に係る情報処理装置１００の斜視図である。同図に示すように情報処理装置１００はスマートフォンであり、ディスプレイパネル１１０及び筐体１２０を備える。以下、情報処理装置１００のうちディスプレイパネル１１０側の面を表面１００ａとし、ディスプレイパネル１１０とは反対側の面を裏面１００ｂとする。 FIG. 1 is a perspective view of an information processing device 100 according to the present embodiment. As shown in the figure, the information processing device 100 is a smartphone, and includes a display panel 110 and a housing 120. Hereinafter, the surface of the information processing device 100 on the display panel 110 side will be referred to as a front surface 100a, and the surface on the opposite side to the display panel 110 will be referred to as a back surface 100b.
　［情報処理装置の放熱構造１］
　図２は情報処理装置１００が備える回路モジュール１５０の断面図であり、図３は回路モジュール１５０の平面図である。これらの図に示すように回路モジュール１５０は第１基板１５１、第２基板１５２、接続部１５３、電子部品１５４及び作動液１５５を備える。なお、図３では第２基板１５２及び作動液１５５の図示を省略している。 [Heat dissipation structure 1 of information processing device]
FIG. 2 is a cross-sectional view of the circuit module 150 included in the information processing apparatus 100, and FIG. 3 is a plan view of the circuit module 150. As shown in these figures, the circuit module 150 includes a first substrate 151, a second substrate 152, a connecting portion 153, an electronic component 154, and a hydraulic fluid 155. Note that in FIG. 3, illustration of the second substrate 152 and the hydraulic fluid 155 is omitted.
　第１基板１５１は、各種部品が実装される回路基板であり、例えばガラスエポキシ基板である。第１基板１５１は、第２基板１５２に対向して配置され、第２基板１５２側の第１主面１５１ａ及び第２基板１５２とは反対側の第２主面１５１ｂを有する。第１基板１５１は情報処理装置１００内の部品配置に応じた平面形状を有し、例えば図３に示す平面形状を有する。 The first board 151 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board. The first substrate 151 is arranged to face the second substrate 152 and has a first main surface 151a on the second substrate 152 side and a second main surface 151b on the opposite side to the second substrate 152. The first substrate 151 has a planar shape according to the arrangement of components within the information processing apparatus 100, and has a planar shape shown in FIG. 3, for example.
　第２基板１５２は、各種部品が実装される回路基板であり、例えばガラスエポキシ基板である。第２基板１５２は、第１基板１５１に対向して配置され、第１基板１５１側の第３主面１５２ａ及び第１基板１５１とは反対側の第４主面１５２ｂを有する。第２基板１５２は情報処理装置１００内の部品配置に応じた平面形状を有し、例えば図３に示す第１基板１５１と同様の平面形状を有する。 The second board 152 is a circuit board on which various components are mounted, and is, for example, a glass epoxy board. The second substrate 152 is arranged to face the first substrate 151 and has a third main surface 152a on the first substrate 151 side and a fourth main surface 152b on the opposite side to the first substrate 151. The second substrate 152 has a planar shape that corresponds to the arrangement of components within the information processing device 100, and has, for example, the same planar shape as the first substrate 151 shown in FIG. 3.
　接続部１５３は、第１基板１５１と第２基板１５２を物理的及び電気的に接続する。接続部１５３としてインターポーザーを用いることができる。接続部１５３は図３に示すように環状形状を有し、図２に示すように第１基板１５１と第２基板１５２の間に配置されている。接続部１５３は、第１主面１５１ａ及び第３主面１５２ａに接合され、第１基板１５１と第２基板１５２の間の空間を封止する。以下、この第１基板１５１、第２基板１５２及び接続部１５３に囲まれた空間を封止空間Ｒとする。また、接続部１５３の封止空間Ｒ側の面を側面１５３ａとする。 The connecting portion 153 physically and electrically connects the first substrate 151 and the second substrate 152. An interposer can be used as the connecting portion 153. The connecting portion 153 has an annular shape as shown in FIG. 3, and is disposed between the first substrate 151 and the second substrate 152 as shown in FIG. The connecting portion 153 is joined to the first main surface 151a and the third main surface 152a, and seals the space between the first substrate 151 and the second substrate 152. Hereinafter, the space surrounded by the first substrate 151, the second substrate 152, and the connecting portion 153 will be referred to as a sealed space R. Further, the surface of the connecting portion 153 on the side of the sealed space R is defined as a side surface 153a.
　接続部１５３には配線が設けられ、第１主面１５１ａ及び第３主面１５２ａに設けられた電極に当該配線が接触することにより、第１基板１５１と第２基板１５２を電気的に接続する。接続部１５３と第１基板１５１及び第２基板１５２の接合方法は封止空間Ｒを封止し、これらを電気的に接続できるものであればよく、例えばハンダ付けとすることができる。 Wiring is provided in the connecting portion 153, and the wiring electrically connects the first substrate 151 and the second substrate 152 by contacting the electrodes provided on the first main surface 151a and the third main surface 152a. . The method of joining the connecting portion 153 to the first substrate 151 and the second substrate 152 may be any method as long as the sealed space R can be sealed and these can be electrically connected, and for example, soldering can be used.
　電子部品１５４は第１主面１５１ａに実装され、封止空間Ｒ内に位置する。電子部品１５４は、ＣＰＵ（Central Processing Unit）、ＧＰＵ（Graphics Processing Unit）、ＳｏＣ（System on a Chip）又はその他のＩＣ（Integrated Circuit）を含むいずれかの電子部品である。電子部品１５４は演算処理等の動作により発熱するが、電子部品１５４が正常に動作可能な最高の温度を発熱温度とする。発熱温度は８０℃以上１２０℃以下が一般的である。電子部品１５４は図３に示すように第１主面１５１ａ上に複数が実装されてもよく、１つのみが実装されてもよい。また、電子部品１５４は、１つ又は複数が第３主面１５２ａ上に実装されてもよい。 The electronic component 154 is mounted on the first main surface 151a and located within the sealed space R. The electronic component 154 is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit). The electronic component 154 generates heat due to operations such as arithmetic processing, and the highest temperature at which the electronic component 154 can operate normally is defined as the heat generation temperature. The exothermic temperature is generally 80°C or higher and 120°C or lower. As shown in FIG. 3, a plurality of electronic components 154 may be mounted on the first main surface 151a, or only one electronic component 154 may be mounted. Furthermore, one or more electronic components 154 may be mounted on the third main surface 152a.
　作動液１５５は封止空間Ｒ内に封入され、回路モジュール１５０を放熱させる。作動液１５５は電子部品１５４の発熱により蒸発する液体である。即ち、作動液１５５は沸点が電子部品１５４の発熱温度以下の液体であり、具体的には沸点が８０℃以上１２０℃以下の液体である。作動液１５５は絶縁性液体が好適であり、例えば純水又は鉱油である。 The working fluid 155 is sealed in the sealed space R and causes the circuit module 150 to radiate heat. The working fluid 155 is a liquid that evaporates due to heat generated by the electronic component 154. That is, the working fluid 155 is a liquid whose boiling point is lower than the heat generation temperature of the electronic component 154, specifically, a liquid whose boiling point is 80° C. or higher and 120° C. or lower. Hydraulic fluid 155 is preferably an insulating liquid, such as pure water or mineral oil.
　回路モジュール１５０は以上のような構成を有する。なお、第１基板１５１と第２基板１５２は一方が情報処理装置１００の表面１００ａ側となり、他方が裏面１００ｂ側となるように配置されるが、どちらが表面１００ａ側となってもよい。 The circuit module 150 has the above configuration. Note that the first substrate 151 and the second substrate 152 are arranged so that one side is on the front surface 100a side of the information processing device 100 and the other side is on the back surface 100b side, but either one may be on the front surface 100a side.
　回路モジュール１５０の動作について説明する。図４及び図５は回路モジュール１５０の動作を示す模式図である。電子部品１５４の動作により電子部品１５４の温度が作動液１５５の沸点を超えると、作動液１５５は蒸発する。この際、作動液１５５は図４に矢印で示すように電子部品１５４から熱を奪い、電子部品１５４は冷却される。 The operation of the circuit module 150 will be explained. 4 and 5 are schematic diagrams showing the operation of the circuit module 150. When the temperature of the electronic component 154 exceeds the boiling point of the working fluid 155 due to the operation of the electronic component 154, the working fluid 155 evaporates. At this time, the hydraulic fluid 155 removes heat from the electronic component 154 as shown by the arrow in FIG. 4, and the electronic component 154 is cooled.
　蒸発した作動液１５５は、第３主面１５２ａ及び側面１５３ａに接触すると冷却され、図５に示すように、第３主面１５２ａ及び側面１５３ａ上で液体に戻る。その際、作動液１５５の熱は矢印で示すように第２基板１５２から放熱される。以降、作動液１５５は上述した動作を繰り返し、液体と気体の間で循環することにより、電子部品１５４を継続的に冷却する。 The evaporated working fluid 155 is cooled when it comes into contact with the third main surface 152a and the side surface 153a, and returns to liquid on the third main surface 152a and the side surface 153a, as shown in FIG. At this time, the heat of the working fluid 155 is radiated from the second substrate 152 as shown by the arrow. Thereafter, the working fluid 155 repeats the above-described operation and circulates between liquid and gas, thereby continuously cooling the electronic component 154.
　回路モジュール１５０は以上のように動作する。上記のように作動液１５５が液体と気体の間で循環することにより、封止空間Ｒはヒートパイプとして機能し、電子部品１５４を効率的に冷却することができるため、回路モジュール１５０は放熱能力に優れる。また、２枚の基板をインターポーザーで接続した構造は情報処理装置の小型化に適したものであるが、回路モジュール１５０はその構造を放熱構造として利用するものである。放熱構造を別途設けるものではないため、回路モジュール１５０は情報処理装置１００の小型化に適したものである。 The circuit module 150 operates as described above. As the working fluid 155 circulates between liquid and gas as described above, the sealed space R functions as a heat pipe and can efficiently cool the electronic components 154, so the circuit module 150 has a heat dissipation capacity. Excellent in Further, the structure in which two substrates are connected by an interposer is suitable for downsizing information processing devices, and the circuit module 150 utilizes this structure as a heat dissipation structure. Since a heat dissipation structure is not separately provided, the circuit module 150 is suitable for downsizing the information processing device 100.
　図６は比較例に係る回路モジュール２５０の構造を示す模式図である。同図に示すように回路モジュール２５０は、第１基板２５１、第２基板２５２、接続部２５３、電子部品２５４及び放熱ゲル２５５を備える。この構成で電子部品２５４の熱を第２基板２５２から放熱させるためには、製造工程において矢印で示すように、第２基板２５２を第１基板２５１側に押圧し、放熱ゲル２５５を第２基板２５２に密着させる必要がある。しかしながら、第２基板２５２を押圧する工程は設備的負担が大きい。一方、回路モジュール１５０の構成では、内部空間Ｒ内に作動液１５５を無負荷で注入すればよく、設備的負担は小さい。 FIG. 6 is a schematic diagram showing the structure of a circuit module 250 according to a comparative example. As shown in the figure, the circuit module 250 includes a first substrate 251, a second substrate 252, a connecting portion 253, an electronic component 254, and a heat dissipating gel 255. In order to dissipate the heat of the electronic component 254 from the second substrate 252 in this configuration, the second substrate 252 is pressed toward the first substrate 251 side as shown by the arrow in the manufacturing process, and the heat dissipation gel 255 is applied to the second substrate. It is necessary to make it close to 252. However, the process of pressing the second substrate 252 places a heavy burden on equipment. On the other hand, in the configuration of the circuit module 150, it is sufficient to inject the working fluid 155 into the internal space R without any load, and the load on the equipment is small.
　回路モジュール１５０は、絶縁層を備えるものであってもよい。図７は絶縁層１５６を備える回路モジュール１５０の断面図である。同図に示すように絶縁層１５６は、封止空間Ｒの内周面、即ち第１主面１５１ａ、第３主面１５２ａ及び側面１５３ａと電子部品１５４の表面を被覆する。絶縁層１５６は例えばフッ素樹脂からなる。絶縁層１５６を設けることにより、各部に作動液１５５が接触することが防止されるため、作動液１５５による短絡が生じず、導電性液体を作動液１５５として用いることが可能となる。一方、絶縁性液体を作動液１５５として用いる場合、絶縁層１５６は設けなくてもよい。 The circuit module 150 may include an insulating layer. FIG. 7 is a cross-sectional view of a circuit module 150 including an insulating layer 156. As shown in the figure, the insulating layer 156 covers the inner peripheral surface of the sealed space R, that is, the first main surface 151a, the third main surface 152a, the side surface 153a, and the surface of the electronic component 154. The insulating layer 156 is made of, for example, fluororesin. By providing the insulating layer 156, the working fluid 155 is prevented from coming into contact with each part, so that short circuits due to the working fluid 155 do not occur, and a conductive liquid can be used as the working fluid 155. On the other hand, when an insulating liquid is used as the working fluid 155, the insulating layer 156 may not be provided.
　［情報処理装置の放熱構造２］
　図８は情報処理装置１００が備える回路モジュール１６０の断面図である。同図に示すように回路モジュール１６０は基板１６１、電子部品１６２、熱伝導ゲル１６３、シールド１６４、フレーム１６５及び熱伝導シート１６６を備える。回路モジュール１６０は図８に示すように、情報処理装置１００においてディスプレイパネル１１０の裏側に配置することができる。 [Heat dissipation structure 2 of information processing device]
FIG. 8 is a cross-sectional view of the circuit module 160 included in the information processing device 100. As shown in the figure, the circuit module 160 includes a substrate 161, an electronic component 162, a thermally conductive gel 163, a shield 164, a frame 165, and a thermally conductive sheet 166. As shown in FIG. 8, the circuit module 160 can be placed on the back side of the display panel 110 in the information processing device 100.
　基板１６１は、各種部品が実装される回路基板であり、例えばプリント配線基板である。電子部品１６２は基板１６１上に実装され、ＣＰＵ（Central Processing Unit）、ＧＰＵ（Graphics Processing Unit）、ＳｏＣ（System on a Chip）又はその他のＩＣ（Integrated Circuit）を含むいずれかの電子部品である。 The board 161 is a circuit board on which various components are mounted, and is, for example, a printed wiring board. The electronic component 162 is mounted on the board 161 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit).
　熱伝導ゲル１６３は電子部品１６２とシールド１６４の間に配置され、電子部品１６２の熱をシールド１６４に伝達する。シールド１６４は電子部品１６２を被覆し、電子部品１６２から放出される電波と外部から電子部品１６２へ入射する電波を遮蔽する。シールド１６４はアルミニウム等の金属からなる。 The heat conductive gel 163 is placed between the electronic component 162 and the shield 164 and transfers the heat of the electronic component 162 to the shield 164. The shield 164 covers the electronic component 162 and blocks radio waves emitted from the electronic component 162 and radio waves incident on the electronic component 162 from the outside. The shield 164 is made of metal such as aluminum.
　フレーム１６５は情報処理装置１００の筐体１２０を構成する部材であり、カバーメイン（Cover Main）と呼ばれる場合もある。フレーム１６５はアルミニウム等の金属からなり、開口１６５ａを有する。熱伝導シート１６６はシート面に沿って熱を伝達する。熱伝導シート１６６はグラファイト等の熱伝導性の高い材料からなる。図８に示すようにシールド１６４は開口１６５ａを介して熱伝導シート１６６に当接する。以下、回路モジュール１６０の厚みを厚みＤ１とする。 The frame 165 is a member that constitutes the casing 120 of the information processing device 100, and is sometimes called a cover main. The frame 165 is made of metal such as aluminum and has an opening 165a. The heat conductive sheet 166 transmits heat along the sheet surface. The thermally conductive sheet 166 is made of a highly thermally conductive material such as graphite. As shown in FIG. 8, the shield 164 contacts the thermally conductive sheet 166 through the opening 165a. Hereinafter, the thickness of the circuit module 160 will be referred to as thickness D1.
　回路モジュール１６０では、電子部品１６２の動作により電子部品１６２が発熱すると、電子部品１６２の熱は熱伝導ゲル１６３を介してシールド１６４に伝達され、シールド１６４から熱伝導シート１６６に伝達される。さらに、この熱は熱伝導シート１６６からフレーム１６５に伝達され、熱伝導シート１６６及びフレーム１６５から放熱される。 In the circuit module 160, when the electronic component 162 generates heat due to its operation, the heat of the electronic component 162 is transmitted to the shield 164 via the thermally conductive gel 163, and from the shield 164 to the thermally conductive sheet 166. Further, this heat is transferred from the heat conductive sheet 166 to the frame 165, and is radiated from the heat conductive sheet 166 and the frame 165.
　図９は比較例に係る回路モジュール２６０の構造を示す模式図である。同図に示すように回路モジュール２６０は、基板２６１、電子部品２６２、第１熱伝導ゲル２６３、シールド２６４、第２熱伝導ゲル２６５、フレーム２６６及び熱伝導シート２６７を備える。回路モジュール２６０は図９に示すように、ディスプレイパネル２１０の裏側に配置することができる。基板２６１上に実装された電子部品２６２は第１熱伝導ゲル２６３を介してシールド２６４と接合されている。回路モジュール２６０ではフレーム２６６に開口が設けられておらず、シールド２６４は第２熱伝導ゲル２６５を介してフレーム２６６と接合されている。以下、回路モジュール２６０の厚みを厚みＤ２とする。 FIG. 9 is a schematic diagram showing the structure of a circuit module 260 according to a comparative example. As shown in the figure, the circuit module 260 includes a substrate 261, an electronic component 262, a first thermally conductive gel 263, a shield 264, a second thermally conductive gel 265, a frame 266, and a thermally conductive sheet 267. Circuit module 260 can be placed on the back side of display panel 210, as shown in FIG. An electronic component 262 mounted on a substrate 261 is bonded to a shield 264 via a first thermally conductive gel 263. In the circuit module 260, the frame 266 is not provided with an opening, and the shield 264 is joined to the frame 266 via the second thermally conductive gel 265. Hereinafter, the thickness of the circuit module 260 will be referred to as thickness D2.
　この構成では、電子部品２６２の動作により電子部品２６２が発熱すると、電子部品２６２の熱は第１熱伝導ゲル２６３を介してシールド２６４に伝達され、第２熱伝導ゲル２６５を介してフレーム２６６に伝達される。さらに、この熱はフレーム２６６から熱伝導シート２６７に伝達され、フレーム２６６及び熱伝導シート２６７から放熱される。 In this configuration, when the electronic component 262 generates heat due to the operation of the electronic component 262, the heat of the electronic component 262 is transmitted to the shield 264 via the first thermally conductive gel 263, and is transferred to the frame 266 via the second thermally conductive gel 265. communicated. Further, this heat is transferred from the frame 266 to the heat conductive sheet 267, and is radiated from the frame 266 and the heat conductive sheet 267.
　回路モジュール１６０と回路モジュール２６０を比較すると、回路モジュール１６０では、フレーム１６５に開口１６５ａが設けられており、シールド１６４が直接に熱伝導シート１６６に当接している。このため、回路モジュール２６０に対してフレーム２６６の厚み分が削減され、厚みＤ１が厚みＤ２より小さくなる。したがって、回路モジュール１６０は放熱性を維持したまま、薄型化が可能である。 Comparing the circuit module 160 and the circuit module 260, in the circuit module 160, an opening 165a is provided in the frame 165, and the shield 164 directly contacts the heat conductive sheet 166. Therefore, the thickness of the frame 266 is reduced relative to the circuit module 260, and the thickness D1 becomes smaller than the thickness D2. Therefore, the circuit module 160 can be made thinner while maintaining heat dissipation performance.
　なお、回路モジュール１６０は次のような構造とすることも可能である。図１０は他の構造を有する回路モジュール１６０の断面図である。同図に示すように回路モジュール１６０は、熱伝導ゲル１６３に代えて第１熱伝導ゲル１６７及び第２熱伝導ゲル１６８を備えるものであってもよい。第１熱伝導ゲル１６７は電子部品１６２とシールド１６４の間に配置され、第２熱伝導ゲル１６８はシールド１６４と熱伝導シート１６６の間に配置されている。この構造においても、回路モジュール２６０に対してフレーム２６６の厚み分が削減されるため、回路モジュール１６０の薄型化が可能である。 Note that the circuit module 160 can also have the following structure. FIG. 10 is a cross-sectional view of a circuit module 160 having another structure. As shown in the figure, the circuit module 160 may include a first thermally conductive gel 167 and a second thermally conductive gel 168 instead of the thermally conductive gel 163. The first thermally conductive gel 167 is placed between the electronic component 162 and the shield 164, and the second thermally conductive gel 168 is placed between the shield 164 and the thermally conductive sheet 166. Also in this structure, since the thickness of the frame 266 is reduced relative to the circuit module 260, it is possible to make the circuit module 160 thinner.
　［情報処理装置の放熱構造３］
　図１１は情報処理装置１００が備える回路モジュール１７０の断面図である。同図に示すように回路モジュール１７０は基板１７１、電子部品１７２、フレーム１７３、カーボンナノチューブ部材１７４及び熱伝導シート１７５を備える。回路モジュール１７０は、情報処理装置１００において裏面１００ｂ（図１参照）側に配置することができる。 [Heat dissipation structure 3 of information processing device]
FIG. 11 is a cross-sectional view of the circuit module 170 included in the information processing device 100. As shown in the figure, the circuit module 170 includes a substrate 171, an electronic component 172, a frame 173, a carbon nanotube member 174, and a heat conductive sheet 175. The circuit module 170 can be placed on the rear surface 100b (see FIG. 1) side of the information processing device 100.
　基板１７１は、各種部品が実装される回路基板であり、例えばプリント配線基板である。電子部品１７２は基板１７１上に実装され、ＣＰＵ（Central Processing Unit）、ＧＰＵ（Graphics Processing Unit）、ＳｏＣ（System on a Chip）又はその他のＩＣ（Integrated Circuit）を含むいずれかの電子部品である。フレーム１７３は情報処理装置１００の筐体１２０を構成する部材であり、樹脂からなる。 The board 171 is a circuit board on which various components are mounted, and is, for example, a printed wiring board. The electronic component 172 is mounted on the board 171 and is any electronic component including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), SoC (System on a Chip), or other IC (Integrated Circuit). The frame 173 is a member that constitutes the housing 120 of the information processing device 100, and is made of resin.
　カーボンナノチューブ部材１７４は多層カーボンナノチューブからなる部材であり、ゴム状の弾性を有する。カーボンナノチューブ部材１７４は図１１に示すように電子部品１７２に向かって突出する凸状形状を有する。また、カーボンナノチューブ部材１７４の形状はこれに限られず、平板状等であってもよい。カーボンナノチューブ部材１７４はフレーム１７３にインサート成形により接合されている。また、カーボンナノチューブ部材１７４はフレーム１７３に接着剤等によって接合されたものであってもよい。 The carbon nanotube member 174 is a member made of multi-walled carbon nanotubes and has rubber-like elasticity. The carbon nanotube member 174 has a convex shape that projects toward the electronic component 172, as shown in FIG. Further, the shape of the carbon nanotube member 174 is not limited to this, and may be a flat plate shape or the like. The carbon nanotube member 174 is joined to the frame 173 by insert molding. Furthermore, the carbon nanotube member 174 may be joined to the frame 173 using an adhesive or the like.
　熱伝導シート１７５はシート面に沿って熱を伝達する。熱伝導シート１７５はグラファイト等の熱伝導性の高い材料からなる。回路モジュール１７０では基板１７１がフレーム１７３に対して押圧された状態で固定されており、電子部品１７２はカーボンナノチューブ部材１７４に押圧されている。カーボンナノチューブ部材１７４はゴム状の弾性を有するため、若干変形しながら電子部品１７２に密着する。 The heat conductive sheet 175 transmits heat along the sheet surface. The thermally conductive sheet 175 is made of a highly thermally conductive material such as graphite. In the circuit module 170 , a substrate 171 is pressed and fixed to a frame 173 , and an electronic component 172 is pressed against a carbon nanotube member 174 . Since the carbon nanotube member 174 has rubber-like elasticity, it adheres closely to the electronic component 172 while being slightly deformed.
　回路モジュール１７０では、電子部品１７２の動作により電子部品１７２が発熱すると、電子部品１７２の熱はカーボンナノチューブ部材１７４を介して熱伝導シート１７５に伝達され、熱伝導シート１７５から放熱される。 In the circuit module 170, when the electronic component 172 generates heat due to the operation of the electronic component 172, the heat of the electronic component 172 is transmitted to the heat conductive sheet 175 via the carbon nanotube member 174, and is radiated from the heat conductive sheet 175.
　図１２は比較例に係る回路モジュール２７０の構造を示す模式図である。同図に示すように回路モジュール２７０は、基板２７１、電子部品２７２、フレーム２７３、金属部材２７４、熱伝導ゲル２７５及び熱伝導シート２７６を備える。金属部材２７４はインサート成形等によりフレーム２７３に接合されている。熱伝導ゲル２７５は電子部品２７２と金属部材２７４の間に配置され、電子部品２７２の熱を金属部材２７４に伝達する。 FIG. 12 is a schematic diagram showing the structure of a circuit module 270 according to a comparative example. As shown in the figure, the circuit module 270 includes a substrate 271, an electronic component 272, a frame 273, a metal member 274, a thermally conductive gel 275, and a thermally conductive sheet 276. The metal member 274 is joined to the frame 273 by insert molding or the like. Thermal conductive gel 275 is placed between electronic component 272 and metal member 274 to transfer heat from electronic component 272 to metal member 274 .
　回路モジュール２７０では、電子部品２７２の熱を金属部材２７４に十分に伝達させるため、電子部品２７２と金属部材２７４の間に熱伝導ゲル２７５を配置する必要がある。一方、回路モジュール１７０ではカーボンナノチューブ部材１７４を用いることにより、電子部品１７２の熱を直接カーボンナノチューブ部材１７４に伝達させることができ、熱伝導ゲル等を間に配置する必要がない。したがって、回路モジュール１７０は生産性に優れると共に、高い放熱性を有する。 In the circuit module 270, in order to sufficiently transfer the heat of the electronic component 272 to the metal member 274, it is necessary to arrange a thermally conductive gel 275 between the electronic component 272 and the metal member 274. On the other hand, by using the carbon nanotube member 174 in the circuit module 170, the heat of the electronic component 172 can be directly transferred to the carbon nanotube member 174, and there is no need to dispose a heat conductive gel or the like in between. Therefore, the circuit module 170 has excellent productivity and high heat dissipation.
　［情報処理装置について］
　情報処理装置１００は上記の「放熱構造１」、「放熱構造２」及び「放熱構造３」の少なくともいずれか１つを備えるものとすることができる。また、情報処理装置１００はスマートフォンに限られず、各種の情報処理装置とすることができる。 [About information processing equipment]
The information processing device 100 may include at least one of the above-mentioned "heat radiation structure 1", "heat radiation structure 2", and "heat radiation structure 3". Further, the information processing device 100 is not limited to a smartphone, and can be any of various information processing devices.
　［本開示について］
　本開示中に記載された効果はあくまで例示であって限定されるものでは無く、また他の効果があってもよい。上記の複数の効果の記載は、それらの効果が必ずしも同時に発揮されるということを意味しているのではない。条件等により、少なくとも上記した効果のいずれかが得られることを意味しており、本開示中に記載されていない効果が発揮される可能性もある。また、本開示中に記載された特徴部分のうち、少なくとも２つの特徴部分を組み合わせることも可能である。 [About this disclosure]
The effects described in this disclosure are merely examples and are not limiting, and other effects may also exist. The above description of a plurality of effects does not mean that those effects are necessarily exhibited simultaneously. This means that at least one of the above-mentioned effects can be obtained depending on the conditions and the like, and there is also a possibility that effects not described in the present disclosure will be exhibited. It is also possible to combine at least two of the features described in this disclosure.
　なお、本技術は以下のような構成もとることができる。 Note that the present technology can also have the following configuration.
　（１）
　第１の基板と、
　上記第１の基板と対向する第２の基板と、
　上記第１の基板と上記第２の基板の間に配置され、上記第１の基板と上記第２の基板を電気的に接続し、上記第１の基板と上記第２の基板の間の空間を封止する接続部と、
　上記第１の基板又は上記第２の基板に実装され、上記空間内に位置する電子部品と、
　上記空間内に封入され、上記電子部品の発熱により蒸発する作動液と
　を具備する情報処理装置。
　（２）
　上記（１）に記載の情報処理装置であって、
　上記電子部品はＩＣ（Integrated Circuit）である
　情報処理装置。
　（３）
　上記（１）又は（２）に記載の情報処理装置であって、
　上記作動液の沸点は８０℃以上１２０℃以下である
　情報処理装置。
　（４）
　上記（１）から（３）のうちいずれか１つに記載の情報処理装置であって、
　上記作動液は絶縁性液体である
　情報処理装置。
　（５）
　上記（１）から（４）のうちいずれか１つに記載の情報処理装置であって、
　上記作動液は純水である
　情報処理装置。
　（６）
　上記（１）から（４）のうちいずれか１つに記載の情報処理装置であって、
　上記作動液は鉱油である
　情報処理装置。
　（７）
　上記（１）から（６）のうちいずれか１つに記載の情報処理装置であって、
　上記空間の内周面及び上記電子部品の表面を被覆する絶縁層
　をさらに具備する情報処理装置。
　（８）
　上記（１）から（７）のうちいずれか１つに記載の情報処理装置であって、
　上記接続部はインターポーザーである
　情報処理装置。
　（９）
　上記（１）から（８）のうちいずれか１つに記載の情報処理装置であって、
　上記接続部は上記第１の基板及び上記第２の基板にハンダ付けされている
　情報処理装置。
　（１０）
　第１の基板と、
　上記第1の基板と対向する第２の基板と、
　上記第１の基板と上記第２の基板の間に配置され、上記第１の基板と上記第２の基板を電気的に接続し、上記第１の基板と上記第２の基板の間の空間を封止する接続部と、
　上記第１の基板又は上記第２の基板に実装され、上記空間内に位置する電子部品と、
　上記空間内に封入され、上記電子部品の発熱により蒸発する作動液と
　を具備する回路モジュール。 (1)
a first substrate;
a second substrate facing the first substrate;
a space between the first substrate and the second substrate, disposed between the first substrate and the second substrate, electrically connecting the first substrate and the second substrate; a connection part that seals the
an electronic component mounted on the first substrate or the second substrate and located in the space;
and a working fluid sealed in the space and evaporated by heat generated by the electronic component.
(2)
The information processing device according to (1) above,
The above electronic component is an IC (Integrated Circuit) information processing device.
(3)
The information processing device according to (1) or (2) above,
The boiling point of the working fluid is 80°C or more and 120°C or less. Information processing device.
(4)
The information processing device according to any one of (1) to (3) above,
The above-mentioned working fluid is an insulating liquid. Information processing equipment.
(5)
The information processing device according to any one of (1) to (4) above,
The above working fluid is pure water. Information processing equipment.
(6)
The information processing device according to any one of (1) to (4) above,
The above working fluid is mineral oil. Information processing equipment.
(7)
The information processing device according to any one of (1) to (6) above,
An information processing device further comprising: an insulating layer that covers an inner peripheral surface of the space and a surface of the electronic component.
(8)
The information processing device according to any one of (1) to (7) above,
The above connection part is an interposer information processing device.
(9)
The information processing device according to any one of (1) to (8) above,
The connecting portion is soldered to the first board and the second board. The information processing device.
(10)
a first substrate;
a second substrate facing the first substrate;
a space between the first substrate and the second substrate, disposed between the first substrate and the second substrate, electrically connecting the first substrate and the second substrate; a connection part that seals the
an electronic component mounted on the first substrate or the second substrate and located in the space;
A circuit module comprising: a working fluid sealed in the space and evaporated by heat generated by the electronic component.
　１００…情報処理装置
　１１０…ディスプレイパネル
　１２０…筐体
　１５０、１６０、１７０…回路モジュール
　１５１…第１基板
　１５２…第２基板
　１５３…接続部
　１５４、１６２、１７２…電子部品
　１５５…作動液
　１６１、１７１…基板
　１６３…熱伝導ゲル
　１６４…シールド
　１６５、１７３…フレーム
　１６６、１７５…熱伝導シート
　１６７…第１熱伝導ゲル
　１６８…第２熱伝導ゲル
　１７４…カーボンナノチューブ部材 100... Information processing device 110... Display panel 120... Housing 150, 160, 170... Circuit module 151... First board 152... Second board 153... Connection part 154, 162, 172... Electronic component 155... Working fluid 161, 171 ...Substrate 163...Heat conductive gel 164... Shield 165, 173... Frame 166, 175...Heat conductive sheet 167...First heat conductive gel 168...Second heat conductive gel 174...Carbon nanotube member

Claims (10)

  1. 　第１の基板と、
    　前記第１の基板と対向する第２の基板と、
    　前記第１の基板と前記第２の基板の間に配置され、前記第１の基板と前記第２の基板を電気的に接続し、前記第１の基板と前記第２の基板の間の空間を封止する接続部と、
    　前記第１の基板又は前記第２の基板に実装され、前記空間内に位置する電子部品と、
    　前記空間内に封入され、前記電子部品の発熱により蒸発する作動液と
    　を具備する情報処理装置。     a first substrate;
    a second substrate facing the first substrate;
    a space between the first substrate and the second substrate, which is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate; a connection part that seals the
    an electronic component mounted on the first substrate or the second substrate and located in the space;
    and a working fluid sealed in the space and evaporated by heat generated by the electronic component.
  2. 　請求項１に記載の情報処理装置であって、
    　前記電子部品はＩＣ（Integrated Circuit）である
    　情報処理装置。     The information processing device according to claim 1,
    The electronic component is an IC (Integrated Circuit). Information processing device.
  3. 　請求項１に記載の情報処理装置であって、
    　前記作動液の沸点は８０℃以上１２０℃以下である
    　情報処理装置。     The information processing device according to claim 1,
    The boiling point of the working fluid is 80°C or more and 120°C or less. Information processing device.
  4. 　請求項１に記載の情報処理装置であって、
    　前記作動液は絶縁性液体である
    　情報処理装置。     The information processing device according to claim 1,
    The information processing device, wherein the working fluid is an insulating liquid.
  5. 　請求項４に記載の情報処理装置であって、
    　前記作動液は純水である
    　情報処理装置。     The information processing device according to claim 4,
    The information processing device, wherein the working fluid is pure water.
  6. 　請求項４に記載の情報処理装置であって、
    　前記作動液は鉱油である
    　情報処理装置。     The information processing device according to claim 4,
    The information processing device, wherein the working fluid is mineral oil.
  7. 　請求項１に記載の情報処理装置であって、
    　前記空間の内周面及び前記電子部品の表面を被覆する絶縁層
    　をさらに具備する情報処理装置。     The information processing device according to claim 1,
    An information processing device further comprising: an insulating layer covering an inner peripheral surface of the space and a surface of the electronic component.
  8. 　請求項１に記載の情報処理装置であって、
    　前記接続部はインターポーザーである
    　情報処理装置。     The information processing device according to claim 1,
    An information processing device in which the connection section is an interposer.
  9. 　請求項１に記載の情報処理装置であって、
    　前記接続部は前記第１の基板及び前記第２の基板にハンダ付けされている
    　情報処理装置。     The information processing device according to claim 1,
    The connecting portion is soldered to the first board and the second board. The information processing device.
  10. 　第１の基板と、
    　前記第１の基板と対向する第２の基板と、
    　前記第１の基板と前記第２の基板の間に配置され、前記第１の基板と前記第２の基板を電気的に接続し、前記第１の基板と前記第２の基板の間の空間を封止する接続部と、
    　前記第１の基板又は前記第２の基板に実装され、前記空間内に位置する電子部品と、
    　前記空間内に封入され、前記電子部品の発熱により蒸発する作動液と
    　を具備する回路モジュール。     a first substrate;
    a second substrate facing the first substrate;
    a space between the first substrate and the second substrate, which is disposed between the first substrate and the second substrate, electrically connects the first substrate and the second substrate; a connection part that seals the
    an electronic component mounted on the first substrate or the second substrate and located in the space;
    and a working fluid sealed in the space and evaporated by heat generated by the electronic component.
PCT/JP2023/010629 2022-03-30 2023-03-17 Information processing device and circuit module WO2023189739A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116568A1 (en) * 2006-11-21 2008-05-22 The Boeing Company Direct semiconductor contact ebullient cooling package
KR20130012407A (en) * 2011-07-25 2013-02-04 주식회사 엘지화학 Secondary battery and power storage apparatus including the same
JP2019519848A (en) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． Data center cabinet and its pressure spray system
CN213341386U (en) * 2020-11-04 2021-06-01 秦皇岛旭升节能科技有限公司 Avoid circuit protection device for electrical equipment of electric leakage
US20210337659A1 (en) * 2020-04-27 2021-10-28 Fu Tai Hua Industry (Shenzhen) Co., Ltd. Heat dissipation structure and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080116568A1 (en) * 2006-11-21 2008-05-22 The Boeing Company Direct semiconductor contact ebullient cooling package
KR20130012407A (en) * 2011-07-25 2013-02-04 주식회사 엘지화학 Secondary battery and power storage apparatus including the same
JP2019519848A (en) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． Data center cabinet and its pressure spray system
US20210337659A1 (en) * 2020-04-27 2021-10-28 Fu Tai Hua Industry (Shenzhen) Co., Ltd. Heat dissipation structure and electronic device
CN213341386U (en) * 2020-11-04 2021-06-01 秦皇岛旭升节能科技有限公司 Avoid circuit protection device for electrical equipment of electric leakage

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