WO2023182218A1 - Substrate treatment device and substrate treatment method - Google Patents

Substrate treatment device and substrate treatment method Download PDF

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Publication number
WO2023182218A1
WO2023182218A1 PCT/JP2023/010642 JP2023010642W WO2023182218A1 WO 2023182218 A1 WO2023182218 A1 WO 2023182218A1 JP 2023010642 W JP2023010642 W JP 2023010642W WO 2023182218 A1 WO2023182218 A1 WO 2023182218A1
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WO
WIPO (PCT)
Prior art keywords
component liquid
supply
component
liquid
storage tank
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PCT/JP2023/010642
Other languages
French (fr)
Japanese (ja)
Inventor
陸太 青木
貴大 山口
亨 遠藤
涼介 続木
昭司 上前
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2023182218A1 publication Critical patent/WO2023182218A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • a substrate processing apparatus that processes a substrate is known.
  • the substrate processing apparatus is suitably used for processing semiconductor substrates.
  • a substrate processing apparatus processes a substrate using a processing liquid.
  • Patent Document 1 describes a substrate processing apparatus in which the flow rate is controlled so that the time for supplying hydrofluoric acid and pure water to a mixing tank is the same in order to generate a processing liquid at a constant concentration.
  • the present invention has been made in view of the above problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can quickly control component liquids supplied to a storage tank.
  • the substrate processing apparatus includes a first component liquid supply unit that supplies a first component liquid via a first pipe, and a flow rate of the first component liquid flowing through the first pipe.
  • a second component liquid supply section that supplies the second component liquid via a second pipe, and a second flow meter that measures the flow rate of the second component liquid flowing through the second pipe;
  • a storage tank for storing a mixed liquid in which the first component liquid supplied from the first component liquid supply section and the second component liquid supplied from the second component liquid supply section;
  • a substrate processing unit that processes a substrate with the mixed liquid supplied from a tank; a concentration sensor that detects the concentration of a target component in the mixed liquid in the storage tank;
  • a control unit that controls the first component liquid supply unit and the second component liquid supply unit, and the control unit connects the first piping from the first component liquid supply unit based on the measurement result of the first flowmeter.
  • the first supply amount of the first component liquid supplied to the storage tank via the second component liquid supply section calculates a first supply amount of the first component liquid supplied to the storage tank via the second component liquid supply section, and calculate the first supply amount of the first component liquid supplied to the storage tank from the second component liquid supply section through the second piping based on the measurement result of the second flowmeter.
  • a second supply amount of the second component liquid supplied to the storage tank is calculated, and a period during which the first component liquid supply section supplies the first component liquid via the first piping and the second component liquid is calculated.
  • the first supply amount is determined based on the first supply amount and the second supply amount.
  • the component liquid supply section and the second component liquid supply section are controlled.
  • control unit controls the flow rate of the first component liquid flowing through the first pipe and the second pipe based on the first supply amount and the second supply amount during the component liquid supply period. controlling at least one of the flow rates of the second component liquid flowing through the second component liquid.
  • the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the control unit includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the controller is configured to control the flow rate of the second component liquid flowing through the second pipe based on the first supply amount and the second supply amount in the component liquid supply period.
  • the opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
  • control unit is configured such that the first component liquid supply unit does not supply the first component liquid to the storage tank, and the second component liquid supply unit supplies the second component to the storage tank.
  • the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
  • control unit calculates the first supply amount over a first supply period in which the first component liquid supply unit supplies the first component liquid to the storage tank via the first piping. Then, the second supply amount is calculated over a second supply period during which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping.
  • control unit causes the first component liquid to flow through the first pipe before the first supply period starts, and the first component liquid to flow after the first supply period ends.
  • the second component liquid flows through the first pipe, the second component liquid flows through the second pipe before the second supply period begins, and the second component liquid flows through the second pipe after the second supply period ends.
  • the first component liquid supply section and the second component liquid supply section are controlled so that the first component liquid supply section and the second component liquid supply section flow through the second pipe.
  • the controller controls the first component liquid supply so that the first supply period starts at the same time as the second supply period, and the first supply period ends at the same time as the second supply period. and the second component liquid supply section.
  • control unit starts supplying the first component liquid by the first component liquid supply unit simultaneously with supply of the second component liquid by the second component liquid supply unit, and starts the supply of the first component liquid by the first component liquid supply unit, and
  • the first component liquid supply section and the second component liquid supply section are arranged such that the supply of the first component liquid by the liquid supply section is stopped at the same time as the supply of the second component liquid by the second component liquid supply section.
  • control unit detects, by the concentration sensor, a calculated concentration of the target component in the mixed liquid in the storage tank based on the first supply amount and the second supply amount. If the difference from the concentration is greater than a threshold, driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit is stopped.
  • the first component liquid includes hydrofluoric acid
  • the second component liquid includes a diluent
  • the substrate processing method includes a step in which a first component liquid supply unit supplies a first component liquid to a storage tank via a first pipe, and a step in which the first component liquid a first flow rate measurement step of measuring the flow rate flowing through the piping; a step in which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping; and a step in which the second component liquid is supplied to the second piping. a second flow rate measurement step of measuring the flow rate flowing through the first component liquid, the first component liquid supplied in the step of supplying the first component liquid, and the second component liquid supplied in the step of supplying the second component liquid.
  • a step of storing a mixed liquid in the storage tank a step of processing a substrate in a substrate processing unit with the mixed liquid supplied from the storage tank, and a target contained in the mixed liquid in the storage tank.
  • a step of detecting the concentration of the component with a concentration sensor a detection control step of controlling the first component liquid supply section and the second component liquid supply section based on the detection result of the concentration sensor, and measuring the first flow rate.
  • the first component liquid supply unit calculates a first supply amount of the first component liquid supplied to the storage tank via a first pipe based on the measurement result of the step; and a second flow rate measurement step.
  • the method includes a calculation control step of controlling the first component liquid supply section and the second component liquid supply section based on the first supply amount and the second supply amount.
  • the calculation control step determines the flow rate of the first component liquid flowing through the first pipe and the second component liquid based on the first supply amount and the second supply amount during the component liquid supply period. At least one of the flow rates of the second component liquid flowing through the piping is controlled.
  • the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the calculation control step includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the calculation control step is configured to adjust the flow rate of the second component liquid flowing through the second pipe to the first supply amount and the second supply amount during the component liquid supply period. Based on this, the opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
  • the detection control step includes the first component liquid supply unit not supplying the first component liquid to the storage tank, and the second component liquid supply unit supplying the second component liquid to the storage tank. During a period in which the component liquid is not supplied, the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
  • the first component liquid supply section supplies the first component liquid to the storage tank via the first pipe, over a first supply period
  • a second supply period in which the second component liquid supply unit supplies the second component liquid to the storage tank via the second piping. The second supply amount is calculated over the period of time.
  • the substrate processing method includes a first component liquid pre-supply in which the first component liquid supply section supplies the first component liquid via the first pipe before the start of the first supply period. a first component liquid post-supply step in which the first component liquid supply unit supplies the first component liquid via the first piping after the first supply period ends; A second component liquid pre-supply step in which the second component liquid supply unit supplies the second component liquid via the second piping before the start, and a second component liquid pre-supply step in which the second component liquid is supplied via the second piping, and after the second component liquid supply period ends, the second component liquid The method further includes a second component liquid post-supply step in which the supply unit supplies the second component liquid via the second pipe.
  • the first supply period starts at the same time as the second supply period, and the first supply period starts at the same time as the second supply period. 2 supply period ends at the same time.
  • the supply of the first component liquid by the first component liquid supply section in the first component liquid pre-supply step is performed by the second component liquid supply section by the second component liquid supply section in the second component liquid pre-supply step.
  • the supply of the first component liquid by the first component liquid supply unit in the first component liquid post-supply step is started simultaneously with the supply of the component liquid
  • the supply of the first component liquid by the first component liquid supply unit in the second component liquid post-supply process is started by the second component liquid supply unit in the second component liquid post-supply process.
  • the supply of the second component liquid is stopped simultaneously with the supply of the second component liquid.
  • a calculated concentration of a target component in the mixed liquid in the storage tank is detected by the concentration sensor based on the first supply amount and the second supply amount.
  • the method further includes the step of stopping driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit when the difference between the concentration and the concentration is larger than a threshold value.
  • the first component liquid in the step of supplying the first component liquid, includes hydrofluoric acid, and in the step of supplying the second component liquid, the second component liquid includes a diluent. .
  • the component liquids supplied to the storage tank can be quickly controlled.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus of this embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • FIG. 1 is a block diagram of a substrate processing apparatus according to the present embodiment.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • (a) and (c) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid, and
  • (b) is a graph showing changes over time in the concentration of the mixed liquid in the storage tank.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • (a) and (b) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 1 is a schematic plan view of a substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 processes the substrate W.
  • the substrate processing apparatus 100 processes the substrate W to perform at least one of etching, surface treatment, imparting properties, forming a treated film, removing at least a portion of the film, and cleaning.
  • the substrate W is used as a semiconductor substrate.
  • Substrate W includes a semiconductor wafer.
  • the substrate W has a substantially disk shape.
  • the substrate processing apparatus 100 processes the substrates W one by one.
  • the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports LP, an indexer robot IR, and a center robot CR. , and a control device 101.
  • the control device 101 controls the load port LP, indexer robot IR, and center robot CR.
  • Control device 101 includes a control section 102 and a storage section 104.
  • Each of the load ports LP accommodates a plurality of stacked substrates W.
  • the indexer robot IR transports the substrate W between the load port LP and the center robot CR.
  • the center robot CR transports the substrate W between the indexer robot IR and the substrate processing unit 10.
  • Each of the substrate processing units 10 processes the substrate W by discharging a processing liquid onto the substrate W.
  • the treatment liquid includes a chemical liquid, a cleaning liquid, a removal liquid, and/or a water repellent.
  • the processing liquid cabinet 110 stores processing liquid. Note that the processing liquid cabinet 110 may contain gas.
  • the plurality of substrate processing units 10 form a plurality of towers TW (four towers TW in FIG. 1) arranged so as to surround the center robot CR in plan view.
  • Each tower TW includes a plurality of substrate processing units 10 (three substrate processing units 10 in FIG. 1) stacked one above the other.
  • Each processing liquid box 120 corresponds to a plurality of towers TW.
  • the liquid in the processing liquid cabinet 110 is supplied via one of the processing liquid boxes 120 to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120. Further, the gas in the processing liquid cabinet 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120 via one of the processing liquid boxes 120.
  • a boundary wall is arranged between the area where the central robot CR and the substrate processing unit 10 are installed and the area where the processing liquid cabinet 110 is installed.
  • the processing liquid cabinet 110 has a storage tank (tank) for preparing the processing liquid.
  • the processing liquid cabinet 110 may have a storage tank for one type of processing liquid, or may have storage tanks for multiple types of processing liquids.
  • the processing liquid cabinet 110 includes a pump, a valve, and/or a filter for distributing the processing liquid.
  • the control device 101 controls various operations of the substrate processing apparatus 100.
  • the substrate processing unit 10 processes the substrate W under the control of the control device 101 .
  • the control device 101 includes a control section 102 and a storage section 104.
  • Control unit 102 has a processor.
  • the control unit 102 includes, for example, a central processing unit (CPU).
  • the control unit 102 may include a general-purpose computing machine.
  • the storage unit 104 stores data and computer programs.
  • the data includes recipe data.
  • the recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents and processing procedures for the substrate W.
  • the storage unit 104 includes a main storage device and an auxiliary storage device.
  • the main storage device is, for example, a semiconductor memory.
  • the auxiliary storage device is, for example, a semiconductor memory and/or a hard disk drive.
  • Storage unit 104 may include removable media.
  • the control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
  • FIG. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.
  • the substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.
  • the chamber 11 accommodates the substrate W.
  • the substrate holding section 20 holds the substrate W.
  • the chamber 11 is approximately box-shaped with an internal space.
  • the chamber 11 accommodates the substrate W.
  • the substrate processing apparatus 100 is a single-wafer type that processes substrates W one by one, and the chamber 11 accommodates one substrate W at a time.
  • the substrate W is accommodated within the chamber 11 and processed within the chamber 11 .
  • the chamber 11 accommodates at least a portion of each of the substrate holding section 20 and the processing liquid supply section 30 .
  • the substrate holding section 20 holds the substrate W.
  • the substrate holding unit 20 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. Further, the substrate holding unit 20 rotates the substrate W while holding the substrate W.
  • the upper surface Wa of the substrate W is provided with a stacked structure in which a recess is formed. The substrate holder 20 rotates the substrate W while holding it.
  • the substrate holder 20 may be a clamping type that clamps the edge of the substrate W.
  • the substrate holding section 20 may have any mechanism for holding the substrate W from the back surface Wb.
  • the substrate holding section 20 may be of a vacuum type.
  • the substrate holding unit 20 holds the substrate W horizontally by adsorbing the center portion of the back surface Wb of the substrate W, which is a non-device forming surface, to the upper surface.
  • the substrate holding section 20 may combine a clamping type in which a plurality of chuck pins are brought into contact with the peripheral end surface of the substrate W and a vacuum type.
  • the substrate holder 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25.
  • the chuck member 22 is provided on the spin base 21.
  • the chuck member 22 chucks the substrate W.
  • the spin base 21 is provided with a plurality of chuck members 22.
  • the shaft 23 is a hollow shaft.
  • the shaft 23 extends vertically along the rotation axis Ax.
  • a spin base 21 is coupled to the upper end of the shaft 23.
  • the substrate W is placed above the spin base 21 .
  • the spin base 21 is disk-shaped and supports the substrate W horizontally.
  • the shaft 23 extends downward from the center of the spin base 21.
  • the electric motor 24 provides rotational force to the shaft 23.
  • the electric motor 24 rotates the substrate W and the spin base 21 about the rotation axis Ax by rotating the shaft 23 in the rotational direction.
  • Housing 25 surrounds shaft 23 and electric motor 24 .
  • the processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply section 30 is accommodated within the chamber 11.
  • the processing liquid supply unit 30 supplies a processing liquid to the upper surface Wa of the substrate W.
  • the treatment liquid may also include a so-called chemical solution.
  • the chemical solution contains hydrofluoric acid.
  • hydrofluoric acid may be heated to 40°C or more and 70°C or less, or may be heated to 50°C or more and 60°C or less.
  • hydrofluoric acid does not need to be heated.
  • the chemical solution may contain water or phosphoric acid.
  • the chemical solution may include hydrogen peroxide solution.
  • the chemical solution may include SC1 (ammonia hydrogen peroxide solution mixture), SC2 (hydrochloric acid hydrogen peroxide solution mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid).
  • the processing liquid may include a so-called cleaning liquid (rinsing liquid).
  • the cleaning liquid may be deionized water (DIW), carbonated water, electrolyzed ionized water, ozone water, ammonia water, hydrochloric acid water at a diluted concentration (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water). It may also include any of the following.
  • the processing liquid supply section 30 includes a pipe 32, a nozzle 34, and a valve 36.
  • the nozzle 34 discharges the processing liquid onto the upper surface Wa of the substrate W.
  • Nozzle 34 is connected to piping 32.
  • a processing liquid is supplied to the piping 32 from a supply source.
  • the valve 36 opens and closes the flow path within the pipe 32.
  • the nozzle 34 is configured to be movable relative to the substrate W.
  • the valve 36 opens and closes the flow path within the pipe 32.
  • the valve 36 adjusts the opening degree of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32.
  • the valve 36 includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the nozzle 34 may be movable.
  • the nozzle 34 can be moved horizontally and/or vertically according to a movement mechanism controlled by the control unit 102. Note that in this specification, the moving mechanism is omitted to avoid making the drawings excessively complex.
  • the substrate processing unit 10 further includes a cup 80.
  • the cup 80 collects the processing liquid scattered from the substrate W.
  • the cup 80 moves up and down. For example, the cup 80 rises vertically upward to the side of the substrate W over a period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 descends vertically downward from the side of the substrate W.
  • control device 101 includes the control section 102 and the storage section 104.
  • the control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and/or the cup 80.
  • controller 102 controls electric motor 24, valve 36, and/or cup 80.
  • the substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor.
  • a conductive layer and an insulating layer are laminated on a base material.
  • the substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
  • the processing liquid supply section 30 can supply one type of processing liquid.
  • the processing liquid supply unit 30 may supply multiple types of processing liquids.
  • the processing liquid supply unit 30 may be able to sequentially supply a plurality of types of processing liquids for different uses to the substrate W.
  • the processing liquid supply unit 30 may be able to simultaneously supply a plurality of types of processing liquids for different purposes to the substrate W.
  • FIG. 3 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118.
  • the first component liquid supply section 112, the second component liquid supply section 114, the storage tank 116, and the concentration sensor 118 are all arranged within the processing liquid cabinet 110.
  • the first component liquid supply section 112 supplies the first component liquid.
  • the first component liquid supplied from the first component liquid supply section 112 flows to the storage tank 116 and is stored in the storage tank 116 .
  • the second component liquid supply section 114 supplies the second component liquid.
  • the second component liquid supplied from the second component liquid supply section 114 flows to the storage tank 116 and is stored in the storage tank 116 .
  • the first component liquid and the second component liquid are mixed in the storage tank 116 to form a mixed liquid.
  • the mixed liquid is used as a processing liquid in the substrate processing unit 10. Note that the mixed liquid does not need to contain the first component liquid and the second component liquid in a mixed state.
  • the mixed liquid may be the result of a reaction caused by mixing the first component liquid and the second component liquid.
  • one of the first component liquid and the second component liquid may be used after being diluted with the other of the first component liquid and the second component liquid.
  • one of the first component liquid and the second component liquid may be a chemical liquid, and the other of the first component liquid and the second component liquid may be a diluent liquid.
  • the first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c.
  • the first component liquid is supplied to the first pipe 112a from a supply source.
  • the first flow meter 112b is arranged in the first pipe 112a.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the valve 112c opens and closes the flow path within the first pipe 112a.
  • the valve 112c adjusts the opening degree of the first pipe 112a to adjust the flow rate of the first component liquid flowing through the first pipe 112a.
  • the valve 112c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the valve 112c may be a motorized needle valve.
  • the flow rate of the processing liquid flowing through the first pipe 112a may be adjusted by adjusting the opening degree of the valve 112c based on the measurement result of the first flowmeter 112b.
  • the second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c.
  • the second component liquid is supplied to the second pipe 114a from a supply source.
  • the second flow meter 114b is arranged in the second pipe 114a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • the valve 114c opens and closes the flow path within the second pipe 114a.
  • the valve 114c adjusts the opening degree of the second pipe 114a to adjust the flow rate of the processing liquid flowing through the second pipe 114a.
  • the valve 114c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the valve 114c may be a motorized needle valve.
  • the flow rate of the processing liquid flowing through the second pipe 114a may be adjusted by adjusting the opening degree of the valve 114c based on the measurement result of the second flowmeter 114b.
  • the first component liquid that has flowed through the first pipe 112a is supplied to the storage tank 116. Further, the second component liquid that has flowed through the second pipe 114a is supplied to the storage tank 116. Therefore, the first component liquid and the second component liquid are mixed in the storage tank 116.
  • the storage tank 116 stores a mixed liquid obtained by mixing the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a.
  • Piping 117 connects storage tank 116 and piping 32. Specifically, the pipe 117 connects the storage tank 116 and the pipes 32a to 32c. The mixed liquid stored in the storage tank 116 flows through the pipe 117 and the pipe 32 and is supplied to the substrate processing unit 10.
  • the concentration sensor 118 detects the concentration of the target component in the mixed liquid stored in the storage tank 116.
  • the concentration sensor 118 may detect the concentration of a predetermined component in the first component liquid.
  • the concentration sensor 118 may detect the concentration of a predetermined component in the second component liquid.
  • the concentration sensor 118 may detect the concentration of the target component in the liquid mixture.
  • the concentration sensor 118 may detect the concentration of a target component newly generated by mixing the first component liquid and the second component liquid. Note that in this specification, the concentration of the target component in the liquid mixture may be simply referred to as "concentration of the liquid mixture.”
  • the substrate processing unit 10 includes substrate processing units 10a to 10c. Typically, substrate processing units 10a-10c have the same shape and the same function.
  • the substrate processing unit 10a includes a processing liquid supply section 30a. As shown in FIG. 2, the processing liquid supply section 30a includes a pipe 32a, a nozzle 34a, and a valve 36a.
  • the nozzle 34a discharges the processing liquid onto the upper surface Wa of the substrate W.
  • Nozzle 34a is connected to piping 32a.
  • a processing liquid is supplied to the pipe 32a from a supply source.
  • the valve 36a opens and closes the flow path within the pipe 32a.
  • the nozzle 34a is configured to be movable relative to the substrate W.
  • the substrate processing unit 10b has a processing liquid supply section 30b.
  • the processing liquid supply section 30b includes a pipe 32b, a nozzle 34b, and a valve 36b.
  • the substrate processing unit 10c includes a processing liquid supply section 30c.
  • the processing liquid supply section 30c includes a pipe 32c, a nozzle 34c, and a valve 36c.
  • the supply amount of the first component liquid supplied to the storage tank 116 is calculated from the measurement result of the first flow meter 112b that detects the flow rate of the first component liquid flowing through the first pipe 112a. Then, the amount of the second component liquid supplied to the storage tank 116 is calculated from the measurement result of the second flow meter 114b that detects the flow rate of the second component liquid flowing through the second pipe 114a. Therefore, before the concentration sensor 118 detects the concentration of the mixed liquid in the storage tank 116, the supply amount of the first component liquid flowing through the first pipe 112a and the supply amount of the second component liquid flowing through the second pipe 114a are detected. Based on this, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled. Furthermore, even if the concentration sensor 118 fails, the concentration of the mixed liquid in the storage tank 116 can be prevented from being controlled unintentionally.
  • a mixed liquid in which the first component liquid and the second component liquid are mixed can be supplied to the substrate processing unit 10 as a processing liquid in the storage tank 116.
  • the substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor.
  • a conductive layer and an insulating layer are laminated on a base material.
  • the substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
  • FIG. 4 is a block diagram of the substrate processing apparatus 100.
  • the control device 101 controls various operations of the substrate processing apparatus 100.
  • the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding section 20, the processing liquid supply section 30, and the cup 80.
  • the control device 101 transmits control signals to the indexer robot IR, center robot CR, substrate holding section 20, processing liquid supply section 30, and cup 80, thereby controlling the indexer robot IR, center robot CR,
  • the substrate holding section 20, the processing liquid supply section 30, and the cup 80 are controlled.
  • the storage unit 104 stores computer programs and data.
  • the data includes recipe data.
  • the recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents, processing procedures, and substrate processing conditions for the substrate W.
  • the control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
  • the control unit 102 controls the indexer robot IR and transfers the substrate W by the indexer robot IR.
  • the control unit 102 controls the center robot CR and transfers the substrate W by the center robot CR.
  • the central robot CR receives an unprocessed substrate W and carries the substrate W into one of the plurality of chambers 11.
  • the center robot CR receives the processed substrate W from the chamber 11 and carries out the substrate W.
  • the control unit 102 controls the substrate holding unit 20 to start the rotation of the substrate W, change the rotation speed, and stop the rotation of the substrate W.
  • the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20.
  • the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 24 of the substrate holding unit 20.
  • the control unit 102 can control the valve 36 of the processing liquid supply unit 30 to switch the state of the valve 36 between an open state and a closed state. Specifically, the control unit 102 controls the valve 36 of the processing liquid supply unit 30 to open the valve 36, thereby allowing the processing liquid flowing in the pipe 32 toward the nozzle 34 to pass. can. Further, the control unit 102 can stop the supply of the processing liquid flowing in the pipe 32 toward the nozzle 34 by controlling the valve 36 of the processing liquid supply unit 30 and closing the valve 36. .
  • the control unit 102 may control the cup 80 to move the cup 80 relative to the substrate W. Specifically, the control unit 102 raises the cup 80 vertically upward to the side of the substrate W over a period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. Further, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 80 vertically downward from the side of the substrate W.
  • the control unit 102 functions as a first supply amount calculation unit 102a and a second supply amount calculation unit 102b.
  • the first supply amount calculation unit 102a calculates the supply amount of the first processing liquid that flows through the first pipe 112a and is supplied to the storage tank 116 from the measurement result of the first flowmeter 112b.
  • the second supply amount calculation unit 102b calculates the supply amount of the second processing liquid flowing through the second pipe 114a and supplied to the storage tank 116 from the measurement result of the second flowmeter 114b.
  • the control section 102 includes a first supply amount calculation section 102a and a second supply amount calculation section 102b.
  • the substrate processing apparatus 100 of this embodiment is suitably used for forming semiconductor elements.
  • the substrate processing apparatus 100 is suitably used to process a substrate W used as a semiconductor element having a stacked structure.
  • the semiconductor element is a so-called 3D structured memory (storage device).
  • the substrate W is suitably used as a NAND flash memory.
  • FIG. 5 is a flow diagram of the substrate processing method of this embodiment.
  • step S110 supply of the first component liquid and the second component liquid is started.
  • the first component liquid supply unit 112 starts supplying the first component liquid to the storage tank 116 via the first pipe 112a.
  • the second component liquid supply unit 114 starts supplying the second component liquid to the storage tank 116 via the second pipe 114a.
  • the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply unit 114 to open the valve 112c and the valve 114c. Note that the supply amount of the first component liquid scheduled to be supplied to the storage tank 116 in the first component liquid supply section 112, the supply amount of the second component liquid scheduled to be supplied to the storage tank 116 in the second component liquid supply section 114, Further, it is preferable that the amount and concentration of the mixed liquid supplied to the storage tank 116 are set in advance.
  • the timing at which the first component liquid supply section 112 starts supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply section 114 starts supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 starts supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 starts supplying the second component liquid. .
  • step S120 the flow rates of the first component liquid and the second component liquid are measured.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • step S130 the supply amount of the first component liquid and the supply amount of the second component liquid are calculated.
  • the first supply amount calculation unit 102a calculates the supply amount of the first component liquid based on the measurement result of the flow rate of the first component liquid.
  • the second supply amount calculation unit 102b calculates the supply amount of the second component liquid based on the measurement result of the flow rate of the second component liquid.
  • step S140 the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the control unit 102 controls the supply of the first component liquid from the first component liquid supply unit 112 and/or the second component liquid supply unit 114 based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the supply of the second component liquid is controlled.
  • the flow rate of the first component liquid and/or the flow rate of the second component liquid is adjusted by at least one of the first component liquid supply section 112 and the second component liquid supply section 114.
  • the control unit 102 controls the flow rate of the first component liquid and/or the flow rate of the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the control unit 102 controls whether the flow rate of the first component liquid increases and/or the second component liquid At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate of the component liquid supply section 112 and the second component liquid supply section 114 is decreased.
  • the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112 and/or decreases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to extend the time for supplying the first component liquid and/or shorten the time for supplying the second component liquid. at least one of the sections 114.
  • the control unit 102 increases the time that the valve 112c of the first component liquid supply unit 112 is open, and/or decreases the time that the valve 114c of the second component liquid supply unit 114 is open.
  • the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
  • the control unit 102 determines whether the flow rate of the first component liquid decreases and/or the amount of the second component liquid decreases. At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate increases. For example, the control unit 102 reduces the opening degree of the valve 112c of the first component liquid supply unit 112 and/or increases the opening degree of the valve 114c of the second component liquid supply unit 114. Alternatively, the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to shorten the time for supplying the first component liquid and/or increase the time to supply the second component liquid.
  • the control unit 102 reduces the time that the valve 112c of the first component liquid supply unit 112 is open, and/or increases the time that the valve 114c of the second component liquid supply unit 114 is open. In this case as well, the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
  • control unit 102 controls the first component liquid supply unit 112, the second component liquid supply unit 114, and Driving of the substrate processing unit 10 is stopped.
  • step S140 the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the calculated first supply amount and second supply amount.
  • control may be referred to as a calculation control step.
  • step S150 it is determined whether the supply of the component liquid to the storage tank 116 is completed.
  • a liquid amount detection sensor (not shown) detects the amount of the mixed liquid in the storage tank 116.
  • the liquid level detection sensor includes a liquid level sensor. If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
  • step S150 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160. On the other hand, if the supply of the component liquid to the storage tank 116 is not completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
  • step S160 the supply of the first component liquid and the second component liquid is stopped.
  • the first component liquid supply unit 112 stops supplying the first component liquid to the storage tank 116 via the first pipe 112a.
  • the second component liquid supply unit 114 stops supplying the second component liquid to the storage tank 116 via the second pipe 114a.
  • the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. .
  • step S170 processing of the substrate W is started.
  • the substrate processing unit 10 starts processing the substrate W using a mixed liquid in which the first component liquid and the second component liquid are mixed in the storage tank 116.
  • the process advances to step S172.
  • step S172 it is determined whether the amount of the mixed liquid in the storage tank 116 is greater than a threshold value.
  • a liquid amount detection sensor detects the amount of the mixed liquid in the storage tank 116.
  • the control unit 102 compares the amount of the mixed liquid in the storage tank 116 with a threshold value.
  • step S172 If the amount of the mixed liquid is larger than the threshold (Yes in step S172), the process proceeds to step S180. On the other hand, if the amount of the mixed liquid is less than or equal to the threshold (No in step S172), the process returns to step S110. At this time, it is preferable that the control unit 102 sets the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
  • step S180 the concentration of the mixed liquid in the storage tank 116 is detected.
  • Concentration sensor 118 detects the concentration of the target component in the liquid mixture stored in storage tank 116 .
  • step S182 it is determined whether the concentration of the mixed liquid is within an acceptable range.
  • the control unit 102 compares the concentration of the target component with the tolerance range stored in the storage unit 104.
  • the control unit 102 stops driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10.
  • step S182 If the concentration of the mixed liquid is within the allowable range (Yes in step S182), the process proceeds to step S184.
  • step S184 it is determined whether the concentration of the mixed liquid in the storage tank 116 is to be adjusted.
  • the control unit 102 determines whether to adjust the concentration of the mixed liquid in the storage tank 116 by determining whether the concentration of the target component in the mixed liquid is within a normal range. For example, if the concentration of the target component is within the normal range, the control unit 102 determines not to adjust the concentration of the mixed liquid in the storage tank 116. If the concentration of the mixed liquid is not within the normal range, the control unit 102 determines that the concentration of the mixed liquid in the storage tank 116 should be adjusted.
  • step S184 If it is determined that the concentration of the target component is not adjusted (No in step S184), the process proceeds to step S190. On the other hand, if it is determined that the concentration of the mixed liquid is adjusted (Yes in step S184), the process returns to step S110. At this time, it is preferable that the control unit 102 calculates the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
  • step S182 and step S184 the substrate processing apparatus 100 including the first component liquid supply section 112 and the second component liquid supply section 114 is controlled based on the concentration measured by the concentration sensor 118.
  • the process of controlling using the concentration measured by the concentration sensor 118 in this manner may be referred to as a detection control process.
  • step S190 it is determined whether or not to end the substrate processing. If the substrate processing is not finished (No in step S190), the process returns to step S180. Thereafter, in step S180, the concentration of the mixed liquid is detected. Here, it is repeatedly determined whether the concentration of the mixed liquid is within an allowable range and whether the concentration of the mixed liquid is to be adjusted until the substrate processing is completed. On the other hand, if the substrate processing is to be ended (Yes in step S190), the processing is ended.
  • the substrate W is processed using a mixed liquid obtained by mixing the first component liquid and the second component liquid as the processing liquid.
  • the flow rate of the first component liquid and/or the flow rate of the second component liquid is controlled. Therefore, before the first component liquid and the second component liquid are mixed in the storage tank 116 and the concentration of the target component in the first component liquid or the second component liquid with respect to the mixed liquid is detected by the concentration sensor 118, the first component liquid and the second component liquid are mixed in the storage tank 116.
  • One component liquid supply section 112 and second component liquid supply section 114 can be controlled.
  • the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the concentration detected by the concentration sensor 118. . Thereby, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
  • FIGS. 1 to 6(a) and 6(c) are graphs showing time changes in the flow rate of the first processing liquid and the flow rate of the second processing liquid
  • FIG. 6(b) shows the graph of the mixed liquid in the storage tank 116.
  • 2 is a graph showing changes in concentration over time.
  • the first flow meter 112b measures the flow rate Va of the first component liquid.
  • the flow rate Va of the first component liquid changes in a pulsed manner according to the opening and closing of the valve 112c. In this case, when the valve 112c is opened at time Ta1, the first component liquid starts flowing through the first pipe 112a, and the flow rate Va of the first component liquid increases.
  • valve 112c when the valve 112c is closed at time Ta2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. In this way, the first component liquid flows through the first pipe 112a over the first supply period Pa from time Ta1 to time Ta2.
  • the control unit 102 calculates the supply amount Sa of the first component liquid based on the temporal change in the flow rate Va of the first component liquid.
  • the supply amount of the first component liquid may be referred to as a first supply amount Sa.
  • the first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
  • the second flow meter 114b measures the flow rate Vb of the second component liquid.
  • the flow rate Vb of the second component liquid changes in a pulsed manner according to the opening and closing of the valve 114c. In this case, when the valve 114c is opened at time Tb1, the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
  • the control unit 102 calculates the supply amount Sb of the second component liquid based on the temporal change in the flow rate Vb of the second component liquid.
  • the supply amount of the second component liquid may be referred to as a second supply amount Sb.
  • the second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
  • the component liquid supply period P1 includes a first supply period Pa and a second supply period Pb.
  • the component liquid supply period P1 is a period during which the first component liquid and the second component liquid are supplied to the storage tank 116.
  • one of the first component liquid and the second component liquid is supplied to the storage tank 116, and then the other of the first component liquid and the second component liquid is supplied to the storage tank 116. This indicates the period until the supply is completed.
  • the component liquid supply period P1 is a period in which the first component liquid and the second component liquid are supplied between the period when the first component liquid is supplied to the storage tank 116 and the period when the second component liquid is supplied to the storage tank 116.
  • Either may include a period in which the water is not supplied to the storage tank 116. Further, during the component liquid supply period P1, after one of the first component liquid and the second component liquid is supplied to the storage tank 116, neither the first component liquid nor the second component liquid is supplied to the storage tank 116. It may also include a period.
  • At least one of the first component liquid and the second component liquid is supplied to the storage tank 116 during the component liquid supply period P1. Therefore, at least one of the concentration and the amount of the mixed liquid in the storage tank 116 changes during the component liquid supply period P1.
  • the component liquid non-supply period P2 is a period in which neither the first component liquid nor the second component liquid is supplied to the storage tank 116.
  • the component liquid non-supply period P2 may start immediately after the later of the first supply period Pa and the second supply period Pb ends.
  • the component liquid non-supply period P2 may start after a predetermined period has elapsed after the later of the first supply period Pa and the second supply period Pb ends.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b can calculate the first supply amount and the second supply amount in the component liquid supply period P1. Therefore, the control unit 102 can control the first component liquid supply unit 112 and the second component liquid supply unit 114 based on the first supply amount and the second supply amount during the component liquid supply period P1. For example, when the ratio of the first supply amount and the second supply amount deviates from a predetermined value, the control unit 102 controls the first component supply amount based on the first supply amount and the second supply amount during the component liquid supply period P1.
  • the liquid supply section 112 and the second component liquid supply section 114 can be controlled.
  • FIG. 6(b) shows the change over time of the measurement results obtained by measuring the concentration of the mixed liquid in the storage tank 116 with the concentration sensor 118.
  • the concentration measured by the concentration sensor 118 changes not during the component liquid supply period P1 but during the component liquid non-supply period P2.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116. Therefore, by using the first supply amount and the second supply amount, the situation of the mixed liquid in the storage tank 116 can be obtained more quickly than when the concentration sensor 118 measures it.
  • the first supply period Pa and the second supply period Pb may overlap.
  • the first supply period Pa may start at the same timing as the second supply period Pb, and may end at the same timing as the second supply period Pb.
  • the valve 112c is opened at time Tc1
  • the first component liquid starts flowing through the first pipe 112a
  • the flow rate Va of the first component liquid increases.
  • the valve 112c and the valve 114c are opened at time Tc1
  • the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
  • valve 112c when the valve 112c is closed at time Tc2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. Further, when the valve 112c and the valve 114c are closed at time Tc2, the flow of the second component liquid in the second pipe 114a is stopped, and the flow rate Vb of the second component liquid is reduced.
  • control unit 102 mainly controls the first component liquid supply unit 112 and the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the liquid supply unit 114 is controlled, the present embodiment is not limited thereto.
  • the control unit 102 may calculate the concentration of the mixed liquid based on the amount and concentration of the mixed liquid stored in the storage tank 116, the supply amount of the first component liquid, and the supply amount of the second component liquid. .
  • FIG. 7 is a flow diagram of the substrate processing method of this embodiment.
  • the flowchart in FIG. 7 is the same as the flowchart shown in FIG. 5, except that the concentration of the mixed liquid is calculated from the supply amount of the first component liquid and the supply amount of the second component liquid. Duplicate explanations will be omitted to avoid confusion.
  • steps S110 to S130 are similar to steps S110 to S130 in FIG. 5. After step S130, the process proceeds to step S132.
  • step S132 the concentration of the mixed liquid is calculated.
  • the control unit 102 may calculate the concentration of the liquid mixture added to the storage tank 116 based on the first supply amount and the second supply amount.
  • the concentration of the newly added liquid mixture can be calculated from the first supply amount calculated by the first supply amount calculation section 102a and the second supply amount calculated by the second supply amount calculation section 102b.
  • the concentration of a newly added liquid mixture may be referred to as an additional calculated concentration.
  • control unit 102 determines the current concentration and amount of the mixed liquid in the storage tank 116 based on the concentration and amount of the mixed liquid added to the storage tank 116 (additional calculated concentration) and the amount of the liquid.
  • concentration of the mixed liquid in the storage tank 116 after adding the mixed liquid may be calculated.
  • the process proceeds to step S140. Steps after step S140 are the same as steps after step S140 in FIG.
  • control unit 102 controls the storage tank 116 based on the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b.
  • concentration of the mixed liquid added to the storage tank 116 or the mixed liquid after being added to the storage tank 116 can be calculated. Thereby, the mixed liquid can be adjusted using the concentration standard that controls the mixed liquid in the storage tank 116.
  • FIGS. 8(a) and 8(b) are graphs showing changes in the concentration of the mixed liquid in the storage tank 116 over time.
  • the concentration is set to the target value Gv.
  • the concentration is maintained at the target value Gv during the component liquid supply period P1.
  • the concentration often varies slightly with respect to the target value Gv. Note that the target value Gv itself may change during the component liquid supply period P1.
  • a permissible range is set for the concentration of the mixed liquid.
  • the allowable range is from the lower threshold Th1 to the upper threshold Th2.
  • the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100.
  • the concentration of the mixed liquid is equal to or higher than the upper limit threshold Th2
  • the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100.
  • the concentration is within the allowable range (that is, if the concentration is greater than or equal to the lower threshold Th1 and smaller than the upper threshold Th2), the control unit 102 continues to drive the substrate processing apparatus 100.
  • the lower threshold Th1 and the upper threshold Th2 may be set as values shifted by a predetermined value with respect to the target value Gv.
  • a normal range is set for the concentration.
  • the normal range is from the lower limit threshold Tha to the upper limit threshold Thb.
  • the control unit 102 drives the substrate processing apparatus 100 so that the concentration increases.
  • the concentration is equal to or higher than the upper limit threshold Thb, the control unit 102 drives the substrate processing apparatus 100 so that the concentration decreases.
  • the concentration of the mixed liquid in the storage tank 116 changes. For example, when the concentration of the mixed liquid falls below the lower limit threshold Tha, the control unit 102 changes the opening degree of the valve 112c to increase the concentration of the mixed liquid. On the other hand, when the concentration of the mixed liquid becomes equal to or higher than the upper limit threshold Thb, the control unit 102 changes the opening degree of the valve 112c to reduce the concentration of the mixed liquid.
  • the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a increases. Further, when the concentration becomes equal to or higher than the upper limit threshold Thb, the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a decreases. Note that when the concentration returns to the target value Gv as a result of increasing the opening degree of the valve 112c, the control unit 102 may control the valve 112c to return the opening degree of the valve 112c.
  • FIG. 8(b) shows the additional calculated concentration Ca together with the concentration Cs measured by the concentration sensor 118.
  • the additional calculated concentration Ca indicates the concentration of the newly added liquid mixture.
  • the additional calculated concentration Ca changes temporally faster than the concentration Cs measured by the concentration sensor 118. Therefore, the situation of the mixed liquid supplied to the storage tank 116 can be quickly grasped based on the additional calculated concentration Ca.
  • the concentration calculated from the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b is , when the additional calculated concentration Ca1 exceeds the upper limit threshold Th2, the driving of the first component liquid supply section 112, the second component liquid supply section 114, and the substrate processing unit 10 can be immediately stopped. Thereby, occurrence of troubles in the substrate processing apparatus 100 can be suppressed.
  • the calculated concentration is the concentration detected by the concentration sensor 118 ( It is preferable to compare with the detected concentration). For example, if the difference between the calculated concentration and the detected concentration is larger than a threshold value, the control unit 102 may stop driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10. .
  • the first pipe 112a and the second pipe 114a are separated from each other, but the present embodiment is not limited to this.
  • the first pipe 112a may be connected to the second pipe 114a.
  • the mixed liquid in the storage tank 116 may be circulated in the circulation path.
  • FIG. 9 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 in FIG. 9 mainly includes that the first component liquid supply section 112 and the second component liquid supply section 114 each have two types of valves, and that the first pipe 112a is connected to the second pipe 114a.
  • the concentration sensor 118 is arranged in the circulation channel
  • the mixed liquid in the storage tank 116 can be circulated
  • the processing liquid supply section further includes a flow meter
  • the valve 36 has two types of valves. Except for this, it has the same configuration as the substrate processing apparatus 100 shown in FIG. 3, and redundant description will be omitted for the purpose of avoiding redundancy.
  • the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, and a concentration sensor 118.
  • the first component liquid supply unit 112 supplies hydrofluoric acid.
  • the second component liquid supply unit 114 supplies a diluting liquid.
  • the diluent includes water or deionized water (DIW).
  • the first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c.
  • the second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c.
  • the valve 112c includes a supply valve 112c1 and a flow rate adjustment valve 112c2.
  • the supply valve 112c1 and the flow rate adjustment valve 112c2 are arranged in the first pipe 112a.
  • the supply valve 112c1 opens or closes the first pipe 112a to switch between starting and stopping the supply of the first component liquid to the storage tank 116.
  • the supply valve 112c1 is, for example, a relief valve.
  • the flow rate adjustment valve 112c2 adjusts the flow rate of the first component liquid flowing through the first pipe 112a.
  • the flow rate adjustment valve 112c2 is, for example, a motor needle valve.
  • the valve 114c includes a supply valve 114c1 and a flow rate adjustment valve 114c2.
  • the supply valve 114c1 and the flow rate adjustment valve 114c2 are arranged in the second pipe 114a.
  • the supply valve 114c1 opens or closes the second pipe 114a to switch between starting and stopping the supply of the second component liquid to the storage tank 116.
  • the supply valve 114c1 is, for example, a relief valve.
  • the flow rate adjustment valve 114c2 adjusts the flow rate of the second component liquid flowing through the second pipe 114a.
  • the flow rate adjustment valve 114c2 is, for example, a motor needle valve.
  • the substrate processing apparatus 100 has a pipe 113 that connects to a first pipe 112a and a second pipe 114a. Piping 113 is connected to one end of first piping 112a and one end of second piping 114a. The first pipe 112a and the second pipe 114a are connected to one end of the pipe 113.
  • Either the first component liquid, the second component liquid, or the mixed liquid flows through the pipe 113.
  • the first component liquid flows into the pipe 113.
  • the valve 112c is closed and the valve 114c is opened, the second component liquid flows into the pipe 113.
  • the mixed liquid flows into the pipe 113.
  • the first component liquid flows to the storage tank 116 via the first pipe 112a and the pipe 113.
  • the second component liquid flows into the storage tank 116 via the second pipe 114a and the pipe 113. Note that when the first component liquid and the second component liquid flow through the pipe 113 at the same time, the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a are mixed in the pipe 113. .
  • the mixed liquid in the storage tank 116 can be circulated in the circulation path.
  • One end of the pipe 117 is connected to the storage tank 116 , and the other end of the pipe 117 is connected to the storage tank 116 .
  • the mixed liquid in the storage tank 116 can be circulated through the pipe 117.
  • the concentration sensor 118 can stably measure the concentration of the mixed liquid.
  • Concentration sensor 118 is placed in the circulation channel.
  • the processing liquid supply section 30 includes a flow meter 38 in addition to a pipe 32, a nozzle 34, and a valve 36.
  • the processing liquid supply section 30a includes a flow meter 38a in addition to a pipe 32a, a nozzle 34a, and a valve 36a.
  • the processing liquid supply section 30b includes a flow meter 38b in addition to a pipe 32b, a nozzle 34b, and a valve 36b.
  • the processing liquid supply section 30c includes a flow meter 38c in addition to a pipe 32c, a nozzle 34c, and a valve 36c.
  • the valve 36a includes a supply valve 36a1 and a flow rate adjustment valve 36a2.
  • the supply valve 36a1 and the flow rate adjustment valve 36a2 are arranged in the piping 32a.
  • the supply valve 36a1 opens or closes the pipe 32a to switch between starting and stopping the supply of the first component liquid to the nozzle 34a.
  • the supply valve 36a1 is, for example, a relief valve.
  • the flow rate adjustment valve 36a2 adjusts the flow rate of the first component liquid flowing through the pipe 32a.
  • the flow rate adjustment valve 36a2 is, for example, a motor needle valve.
  • valve 36b includes a supply valve 36b1 and a flow rate adjustment valve 36b2.
  • valve 36c includes a supply valve 36c1 and a flow rate adjustment valve 36c2.
  • the first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a are all supplied to the storage tank 116; Embodiments are not limited thereto.
  • the first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a may be selectively discarded without being supplied to the storage tank 116.
  • FIG. 10 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 in FIG. 10 is similar to the substrate processing apparatus 100 shown in FIG. 9, except that it further includes a waste liquid mechanism for discarding the first component liquid, the second component liquid, and the mixed liquid. It has a structure, and redundant explanation will be omitted for the purpose of avoiding redundancy.
  • the substrate processing apparatus 100 further includes a waste liquid tank 119 in addition to a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118.
  • Waste liquid tank 119 is arranged within processing liquid cabinet 110 .
  • the first component liquid flows into the waste liquid tank 119 from the first component liquid supply section 112
  • the second component liquid flows into the waste liquid tank 119 from the second component liquid supply section 114 .
  • the pipe 113 communicates the connection point between the first pipe 112a and the second pipe 114a and the storage tank 116.
  • a valve 113a is arranged in the pipe 113.
  • the valve 113a opens and closes the flow path within the pipe 113.
  • the valve 113a adjusts the opening degree of the pipe 113 to adjust the flow rate of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113.
  • a pipe 113d is connected to the pipe 113.
  • the connection point between the pipe 113 and the pipe 113d is located upstream of the valve 113a.
  • Piping 113d connects piping 113 and waste liquid tank 119.
  • a valve 113b is arranged in the pipe 113d. The valve 113b opens and closes the flow path within the pipe 113d. The valve 113b adjusts the opening degree of the pipe 113d to adjust the flow of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113d.
  • a pipe 119a is connected to the bottom of the storage tank 116.
  • a valve 119b is arranged in the pipe 119a.
  • Valve 119b opens and closes the flow path within piping 119a.
  • Piping 119a connects storage tank 116 and waste liquid tank 119.
  • the first component liquid, the second component liquid, and the mixed liquid can selectively flow into the waste liquid tank 119.
  • the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid change into rectangular shapes, but this embodiment is limited to this. Not done.
  • the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually increase.
  • the valves 112c and 114c are changed from the open state to the closed state, the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually decrease. In this case, a portion where the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid have a large change may be discarded without being supplied to the storage tank 116.
  • FIGS. 11(a) and 11(b) are graphs showing changes in the flow rates of the first processing liquid and the second processing liquid.
  • the flow rate Va of the first component liquid changes with time.
  • the first flow meter 112b measures the flow rate Va of the first component liquid.
  • the valve 112c opens, the flow rate Va of the first component liquid increases with time. Thereafter, when the valve 112c is completely opened, the flow rate Va of the first component liquid reaches a peak.
  • the flow rate Va of the first component liquid varies. Thereafter, when the valve 112c is closed, the flow rate Va of the first component liquid gradually decreases.
  • the flow rate Vb of the second component liquid changes with time.
  • the second flow meter 114b measures the flow rate Vb of the second component liquid.
  • the valve 114c opens, the flow rate Vb of the second component liquid increases with time. Thereafter, when the valve 114c is completely opened, the flow rate Vb of the second component liquid reaches a peak.
  • the flow rate Vb of the second component liquid varies. Thereafter, when the valve 114c is closed, the flow rate Vb of the second component liquid gradually decreases.
  • the first supply amount calculation unit 102a may count the first supply amount as the first supply amount after the flow rate Va of the first component liquid exceeds a predetermined value. Further, the first supply amount calculation unit 102a does not need to count the first supply amount after the control unit 102 outputs a signal to close the valve 112c.
  • the second supply amount calculation unit 102b may count the second supply amount as the second supply amount after the flow rate Vb of the second component liquid exceeds a predetermined value. Further, the second supply amount calculation unit 102b does not need to count the second supply amount after the control unit 102 outputs a signal to close the valve 112c. In this case, the valve 113b may be closed and the valve 113a may be opened at the same timing when the first supply amount calculation unit 102a starts calculating the supply amount.
  • the first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid within the range from time T1 to time T2.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
  • the second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid within the range from time T1 to time T2.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid from a value from a certain time T1 to another time T2.
  • the value may be used as the basis for calculating the first supply amount Sa and the second supply amount Sb.
  • the liquid will flow to the waste liquid tank 119 without any waste.
  • the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb.
  • Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 before Vb is sometimes referred to as pre-drain.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of pre-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb.
  • the pre-drain period is 1 second or more and 5 seconds or less.
  • the first component liquid supply unit 112 supplies the first component liquid to the first pipe 112a before time T1.
  • this step by the first component liquid supply section 112 may be referred to as a first component liquid pre-supply step.
  • the second component liquid supply unit 114 supplies the second component liquid to the second pipe 114a before time T1.
  • this step by the second component liquid supply unit 114 may be referred to as a second component liquid pre-supply step.
  • the first component liquid flowing through the first pipe 112a is The first component liquid and the second component liquid flowing through the second pipe 114a flow into the waste liquid tank 119 without flowing into the storage tank 116.
  • the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb. Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 after Vb is sometimes referred to as post-drain.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of post-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb.
  • the post-drain period is greater than or equal to 1 second and less than or equal to 5 seconds.
  • the first component liquid from the first component liquid supply section 112 flows through the second pipe 114a after time T2.
  • the process in which the first component liquid flows from the first component liquid supply section 112 in this manner may be referred to as a first component liquid post-supply process.
  • the second component liquid from the second component liquid supply section 114 flows through the second pipe 114a after time T2.
  • the process in which the second component liquid flows from the second component liquid supply section 114 in this manner may be referred to as a second component liquid post-supply process.
  • FIGS. 12A and 12B are flowcharts of the substrate processing method of this embodiment. Note that the flowcharts in FIGS. 12A and 12B are similar to the flowchart shown in FIG. 7 except that pre-draining and post-draining are mainly performed, and redundant explanation will be omitted for the purpose of avoiding redundancy.
  • step S110a pre-draining is started in step S110a.
  • the control unit 102 closes the valve 113a and opens the valve 113b.
  • step S110 proceeds to step S110.
  • step S110 supply of the first component liquid and the second component liquid is started.
  • the first component liquid supply unit 112 starts supplying the first component liquid via the first pipe 112a.
  • the second component liquid supply unit 114 starts supplying the second component liquid via the second pipe 114a.
  • the control unit 102 opens the supply valve 112c1 and flow rate adjustment valve 112c2 of the first component liquid supply unit 112, and also opens the supply valve 114c1 and flow rate adjustment valve 114c2 of the second component liquid supply unit 114.
  • the first component liquid and the second component liquid flow to the waste liquid tank 119 via the pipe 113d.
  • the process proceeds to step S110b.
  • step S110b the flow rates of the first component liquid and the second component liquid are measured.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • the process proceeds to step S110c.
  • step S110c it is determined whether the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions. Specifically, the control unit 102 determines whether the flow rate Va of the first component liquid exceeds a threshold value. Further, the control unit 102 determines whether the flow rate Vb of the second component liquid exceeds a threshold value.
  • step S110c If the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions (Yes in step S110c), the process proceeds to step S110e. On the other hand, if either the flow rate Va of the first component liquid or the flow rate Vb of the second component liquid does not satisfy the conditions (No in step S110c), the process proceeds to step S110d.
  • step S110d the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled based on the flow rate of the first component liquid and the flow rate of the second component liquid. For example, when the flow rate of the first component liquid is less than the threshold value, the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. For example, the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
  • the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the process returns to step S110c.
  • the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled until the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions.
  • step S110e the concentration of the mixed liquid flowing through the pipe 113d is calculated from the flow rate of the first component liquid and the flow rate of the second component liquid.
  • the control unit 102 calculates the concentration of the mixed liquid flowing through the pipe 113d based on the ratio of the flow rate of the first component liquid and the flow rate of the second component liquid.
  • step S110f the process proceeds to step S110f.
  • step S110f it is determined whether the calculated density (calculated density) satisfies the condition. For example, the control unit 102 determines whether the calculated concentration is within a normal range.
  • step S110f If the calculated density satisfies the conditions (Yes in step S110f), the process proceeds to step S110h. On the other hand, if the calculated concentration does not satisfy the conditions (No in step S110f), the process proceeds to step S110g.
  • step S110g the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the calculated concentration.
  • the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. .
  • the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
  • the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the process returns to step S110f.
  • the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled until the concentration of the mixed liquid flowing through the pipe 113d satisfies the conditions.
  • step S110h the pre-drain is finished.
  • the control unit 102 opens the valve 113a and closes the valve 113b. Thereby, the first component liquid and the second component liquid flow into the storage tank 116 via the pipe 113.
  • step S120 Steps S120 to S150 are the same as those in FIG.
  • step S150 it is determined whether the supply of the component liquid to the storage tank 116 is completed.
  • a liquid amount detection sensor that detects the amount of the mixed liquid in the storage tank 116 detects the amount of the mixed liquid in the storage tank 116 . If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
  • step S150 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160a. On the other hand, if the supply of the component liquid to the storage tank 116 is completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
  • step S160a post drain is started.
  • the control unit 102 closes the valve 113a and opens the valve 113b.
  • the control section 102g may control the valve 112c of the first component liquid supply section 112 and the valve 114c of the second component liquid supply section 114 to close.
  • the process proceeds to step S160.
  • step S160 the flow of the first component liquid and the second component liquid is stopped.
  • the supply of the first component liquid to the storage tank 116 via the first pipe 112a is stopped.
  • the supply of the second component liquid to the storage tank 116 via the second pipe 114a is stopped.
  • step S160b the post drain ends.
  • the control unit 102 closes the valve 113a and the valve 113b.
  • step S170 the process proceeds to step S170. Steps S170 to S190 are the same as those in FIG. 7.
  • pre-draining and post-draining are performed before and after supplying the first component liquid and the second component liquid to the storage tank 116.
  • the calculation control is performed while avoiding the influence of the pre-drain period and the post-drain period in which the flow rate changes significantly, so that the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
  • the substrate processing unit 10 is a single-wafer type, and the mixed liquid in the storage tank 116 is supplied to the substrate W in the chamber 11. is not limited to this.
  • the substrate processing unit 10 is of a batch type, and the mixed liquid in the storage tank 116 may be supplied to the processing tank.
  • FIG. 13 is a schematic diagram of the substrate processing apparatus 100.
  • the substrate processing apparatus 100 includes substrate processing units 10A to 10C as the substrate processing unit 10.
  • the substrate processing units 10A to 10C are batch type.
  • the substrate processing unit 10A includes a processing tank 40a and a lifter 50a.
  • the processing tank 40a stores a processing liquid for processing the substrate W.
  • a mixed liquid is supplied as a processing liquid to the processing tank 40a.
  • the mixed liquid in the storage tank 116 is supplied to the processing tank 40a via the pipe 32a.
  • the lifter 50a holds the substrate W.
  • the normal direction of the main surface of the substrate W held by the lifter 50a is parallel to the horizontal direction.
  • the plurality of substrates W are arranged in a line along the horizontal direction.
  • the plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
  • the lifter 50a holds a plurality of substrates W together. For example, the lifter 50a moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
  • the substrate processing unit 10B like the substrate processing unit 10A, includes a processing tank 40b and a lifter 50b. Further, the substrate processing unit 10C includes a processing tank 40c and a lifter 50c similarly to the substrate processing unit 10A.
  • the component liquids supplied to the storage tank 116 can be quickly controlled.
  • the substrate processing unit 10 is a batch type, but the present embodiment is not limited to this.
  • the storage tank 116 is a batch type processing tank and may also be used as the substrate processing unit 10.
  • FIG. 14 is a schematic diagram of the substrate processing apparatus 100.
  • the substrate processing apparatus 100 includes a storage tank 116 as the substrate processing unit 10.
  • the storage tank 116 functions as a so-called batch type processing tank.
  • the substrate processing apparatus 100 includes a storage tank 116 and a lifter 60.
  • the storage tank 116 stores a processing liquid for processing the substrate W.
  • a mixed liquid is supplied to the storage tank 116 as a processing liquid.
  • the first component liquid and the second component liquid are supplied to the storage tank 116 via the first pipe 112a, the second pipe 114a, and the pipe 113.
  • the lifter 60 holds the substrate W.
  • the normal direction of the main surface of the substrate W held by the lifter 60 is parallel to the horizontal direction.
  • the plurality of substrates W are arranged in a line along the horizontal direction.
  • the plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
  • the lifter 60 holds a plurality of substrates W together. For example, the lifter 60 moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
  • the substrate processing apparatus 100 of this embodiment even if the storage tank 116 is a batch type processing tank, the component liquids supplied to the storage tank 116 can be quickly controlled.
  • the present invention is suitably used in a substrate processing apparatus and a substrate processing method.

Abstract

In a substrate treatment device (100), a control unit (102): calculates, on the basis of a measurement result of a first flowmeter (112b), a first supply amount of a first component liquid supplied from a first component liquid supply unit (112) to a storage tank (116) via a first pipe (112a); calculates, on the basis of a measurement result of a second flowmeter (114b), a second supply amount of a second component liquid supplied from a second component liquid supply unit (114) to the storage tank (116) via a second pipe (114a); and controls the first component liquid supply unit (112) and the second component liquid supply unit (114) on the basis of the first supply amount and the second supply amount during a component liquid supply period that is at least one period among a period during which the first component liquid supply unit (112) supplies a first component via the first pipe (112a) and a period during which the second component liquid supply unit (114) supplies a second component via the second pipe (114a)

Description

基板処理装置および基板処理方法Substrate processing equipment and substrate processing method
　本発明は、基板処理装置および基板処理方法に関する。 The present invention relates to a substrate processing apparatus and a substrate processing method.
　基板を処理する基板処理装置が知られている。基板処理装置は、半導体基板の処理に好適に用いられる。典型的には、基板処理装置は、処理液を用いて基板を処理する。 A substrate processing apparatus that processes a substrate is known. The substrate processing apparatus is suitably used for processing semiconductor substrates. Typically, a substrate processing apparatus processes a substrate using a processing liquid.
　例えば、処理液として複数種の成分液を混合した混合液が用いられることがある。この場合、複数の基板を均一に処理するために、混合タンク内の混合液の濃度を一定に維持することが検討されている（特許文献１）。特許文献１には、一定濃度の処理液を生成するために、フッ酸および純水混合タンクに供給する時間が同一になるように流量を制御した基板処理装置が記載されている。 For example, a mixed solution of a plurality of component solutions may be used as the processing solution. In this case, in order to uniformly process a plurality of substrates, it has been considered to maintain a constant concentration of the mixed liquid in a mixing tank (Patent Document 1). Patent Document 1 describes a substrate processing apparatus in which the flow rate is controlled so that the time for supplying hydrofluoric acid and pure water to a mixing tank is the same in order to generate a processing liquid at a constant concentration.
特開２００３－２７５５６９号公報Japanese Patent Application Publication No. 2003-275569
　しかしながら、特許文献１の基板処理装置でも、制御された流量が変動することがある。この場合、貯留槽内の混合液の濃度を適切に調整できない。 However, even in the substrate processing apparatus of Patent Document 1, the controlled flow rate may fluctuate. In this case, the concentration of the mixed liquid in the storage tank cannot be adjusted appropriately.
　本発明は上記課題に鑑みてなされたものであり、その目的は、貯留槽に供給される成分液を速やかに制御可能な基板処理装置および基板処理方法を提供することにある。 The present invention has been made in view of the above problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can quickly control component liquids supplied to a storage tank.
　本発明の一局面によれば、基板処理装置は、第１配管を介して第１成分液を供給する第１成分液供給部と、前記第１成分液が前記第１配管を流れる流量を測定する第１流量計と、第２配管を介して第２成分液を供給する第２成分液供給部と、前記第２成分液が前記第２配管を流れる流量を測定する第２流量計と、前記第１成分液供給部から供給される前記第１成分液と、前記第２成分液供給部から供給される前記第２成分液とが混合された混合液を貯留する貯留槽と、前記貯留槽から供給された前記混合液によって基板を処理する基板処理ユニットと、前記貯留槽内の前記混合液における対象成分の濃度を検知する濃度センサーと、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する制御部とを備え、前記制御部は前記第１流量計の測定結果に基づいて前記第１成分液供給部から前記第１配管を介して前記貯留槽に供給された前記第１成分液の第１供給量を算出し、前記第２流量計の測定結果に基づいて前記第２成分液供給部から前記第２配管を介して前記貯留槽に供給された前記第２成分液の第２供給量を算出し、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する期間および前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する期間の少なくとも一方の期間である成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する。 According to one aspect of the present invention, the substrate processing apparatus includes a first component liquid supply unit that supplies a first component liquid via a first pipe, and a flow rate of the first component liquid flowing through the first pipe. a second component liquid supply section that supplies the second component liquid via a second pipe, and a second flow meter that measures the flow rate of the second component liquid flowing through the second pipe; a storage tank for storing a mixed liquid in which the first component liquid supplied from the first component liquid supply section and the second component liquid supplied from the second component liquid supply section; a substrate processing unit that processes a substrate with the mixed liquid supplied from a tank; a concentration sensor that detects the concentration of a target component in the mixed liquid in the storage tank; a control unit that controls the first component liquid supply unit and the second component liquid supply unit, and the control unit connects the first piping from the first component liquid supply unit based on the measurement result of the first flowmeter. calculate a first supply amount of the first component liquid supplied to the storage tank via the second component liquid supply section, and calculate the first supply amount of the first component liquid supplied to the storage tank from the second component liquid supply section through the second piping based on the measurement result of the second flowmeter. A second supply amount of the second component liquid supplied to the storage tank is calculated, and a period during which the first component liquid supply section supplies the first component liquid via the first piping and the second component liquid is calculated. In the component liquid supply period, which is at least one of the periods in which the supply unit supplies the second component liquid via the second piping, the first supply amount is determined based on the first supply amount and the second supply amount. The component liquid supply section and the second component liquid supply section are controlled.
　ある実施形態では、前記制御部は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１配管を流れる前記第１成分液の流量および前記第２配管を流れる前記第２成分液の流量の少なくとも一方を制御する。 In one embodiment, the control unit controls the flow rate of the first component liquid flowing through the first pipe and the second pipe based on the first supply amount and the second supply amount during the component liquid supply period. controlling at least one of the flow rates of the second component liquid flowing through the second component liquid.
　ある実施形態では、前記第１成分液供給部は、前記第１配管を流れる前記第１成分液の流量を開度に応じて調整可能なバルブを含み、前記第２成分液供給部は、前記第２配管を流れる前記第２成分液の流量を開度に応じて調整可能なバルブを含み、前記制御部は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部の前記バルブおよび前記第２成分液供給部のバルブの少なくとも一方の開度を制御する。 In one embodiment, the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree, and the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe, and the second component liquid supply unit The control unit includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the controller is configured to control the flow rate of the second component liquid flowing through the second pipe based on the first supply amount and the second supply amount in the component liquid supply period. The opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
　ある実施形態では、前記制御部は、前記第１成分液供給部が前記貯留槽に前記第１成分液を供給せず、かつ、前記第２成分液供給部が前記貯留槽に前記第２成分液を供給しない成分液非供給期間において、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する。 In one embodiment, the control unit is configured such that the first component liquid supply unit does not supply the first component liquid to the storage tank, and the second component liquid supply unit supplies the second component to the storage tank. During a component liquid non-supply period in which no liquid is supplied, the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
　ある実施形態では、前記制御部は、前記第１成分液供給部が前記第１配管を介して前記第１成分液を前記貯留槽に供給する第１供給期間にわたって、前記第１供給量を算出し、前記第２成分液供給部が前記第２配管を介して前記第２成分液を前記貯留槽に供給する第２供給期間にわたって、前記第２供給量を算出する。 In one embodiment, the control unit calculates the first supply amount over a first supply period in which the first component liquid supply unit supplies the first component liquid to the storage tank via the first piping. Then, the second supply amount is calculated over a second supply period during which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping.
　ある実施形態では、前記制御部は、前記第１供給期間が開始する前に前記第１成分液が前記第１配管を介して流れ、前記第１供給期間が終了した後に前記第１成分液が前記第１配管を介して流れ、前記第２供給期間が開始する前に前記第２成分液が前記第２配管を介して流れ、前記第２供給期間が終了した後に前記第２成分液が前記第２配管を介して流れるように、前記第１成分液供給部および前記第２成分液供給部を制御する。 In one embodiment, the control unit causes the first component liquid to flow through the first pipe before the first supply period starts, and the first component liquid to flow after the first supply period ends. the second component liquid flows through the first pipe, the second component liquid flows through the second pipe before the second supply period begins, and the second component liquid flows through the second pipe after the second supply period ends. The first component liquid supply section and the second component liquid supply section are controlled so that the first component liquid supply section and the second component liquid supply section flow through the second pipe.
　ある実施形態では、前記制御部は、前記第１供給期間が前記第２供給期間と同時に開始し、前記第１供給期間が前記第２供給期間と同時に終了するように、前記第１成分液供給部および前記第２成分液供給部を制御する。 In one embodiment, the controller controls the first component liquid supply so that the first supply period starts at the same time as the second supply period, and the first supply period ends at the same time as the second supply period. and the second component liquid supply section.
　ある実施形態では、前記制御部は、前記第１成分液供給部による前記第１成分液の供給を前記第２成分液供給部による前記第２成分液の供給と同時に開始し、前記第１成分液供給部による前記第１成分液の供給を前記第２成分液供給部による前記第２成分液の供給と同時に停止するように、前記第１成分液供給部および前記第２成分液供給部を制御する。 In one embodiment, the control unit starts supplying the first component liquid by the first component liquid supply unit simultaneously with supply of the second component liquid by the second component liquid supply unit, and starts the supply of the first component liquid by the first component liquid supply unit, and The first component liquid supply section and the second component liquid supply section are arranged such that the supply of the first component liquid by the liquid supply section is stopped at the same time as the supply of the second component liquid by the second component liquid supply section. Control.
　ある実施形態では、前記制御部は、前記第１供給量と前記第２供給量に基づいて前記貯留槽内の前記混合液における前記対象成分の濃度を算出した算出濃度が前記濃度センサーによって検知された前記濃度との差が閾値よりも大きい場合、前記第１成分液供給部、前記第２成分液供給部および前記基板処理ユニットの駆動を停止する。 In one embodiment, the control unit detects, by the concentration sensor, a calculated concentration of the target component in the mixed liquid in the storage tank based on the first supply amount and the second supply amount. If the difference from the concentration is greater than a threshold, driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit is stopped.
　ある実施形態では、前記第１成分液は、フッ酸を含み、前記第２成分液は、希釈液を含む。 In one embodiment, the first component liquid includes hydrofluoric acid, and the second component liquid includes a diluent.
　本発明の別の局面によれば、基板処理方法は、第１成分液供給部が第１配管を介して貯留槽に第１成分液を供給する工程と、前記第１成分液が前記第１配管を流れる流量を測定する第１流量測定工程と、第２成分液供給部が第２配管を介して貯留槽に第２成分液を供給する工程と、前記第２成分液が前記第２配管を流れる流量を測定する第２流量測定工程と、第１成分液を供給する工程において供給された前記第１成分液と、前記第２成分液を供給する工程において供給された前記第２成分液とを前記貯留槽において混合した混合液を貯留する工程と、前記貯留槽から供給された前記混合液によって基板を基板処理ユニットで処理する工程と、前記貯留槽内の前記混合液に含まれる対象成分の濃度を濃度センサーで検知する工程と、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する検知制御工程と、前記第１流量測定工程の測定結果に基づいて前記第１成分液供給部が第１配管を介して前記貯留槽に供給された前記第１成分液の第１供給量を算出する工程と、前記第２流量測定工程の測定結果に基づいて前記第２成分液供給部が第２配管を介して前記貯留槽に供給された前記第２成分液の第２供給量を算出する工程と、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する期間および前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する期間の少なくとも一方の期間である成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する算出制御工程とを包含する。 According to another aspect of the present invention, the substrate processing method includes a step in which a first component liquid supply unit supplies a first component liquid to a storage tank via a first pipe, and a step in which the first component liquid a first flow rate measurement step of measuring the flow rate flowing through the piping; a step in which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping; and a step in which the second component liquid is supplied to the second piping. a second flow rate measurement step of measuring the flow rate flowing through the first component liquid, the first component liquid supplied in the step of supplying the first component liquid, and the second component liquid supplied in the step of supplying the second component liquid. a step of storing a mixed liquid in the storage tank, a step of processing a substrate in a substrate processing unit with the mixed liquid supplied from the storage tank, and a target contained in the mixed liquid in the storage tank. a step of detecting the concentration of the component with a concentration sensor, a detection control step of controlling the first component liquid supply section and the second component liquid supply section based on the detection result of the concentration sensor, and measuring the first flow rate. a step in which the first component liquid supply unit calculates a first supply amount of the first component liquid supplied to the storage tank via a first pipe based on the measurement result of the step; and a second flow rate measurement step. a step in which the second component liquid supply section calculates a second supply amount of the second component liquid supplied to the storage tank via a second pipe based on the measurement result of the first component liquid supply section; is at least one of a period in which the first component liquid is supplied via the first pipe and a period in which the second component liquid supply section supplies the second component liquid via the second pipe. In the liquid supply period, the method includes a calculation control step of controlling the first component liquid supply section and the second component liquid supply section based on the first supply amount and the second supply amount.
　ある実施形態では、前記算出制御工程は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１配管を流れる前記第１成分液の流量および前記第２配管を流れる前記第２成分液の流量の少なくとも一方を制御する。 In one embodiment, the calculation control step determines the flow rate of the first component liquid flowing through the first pipe and the second component liquid based on the first supply amount and the second supply amount during the component liquid supply period. At least one of the flow rates of the second component liquid flowing through the piping is controlled.
　ある実施形態では、前記第１成分液供給部は、前記第１配管を流れる前記第１成分液の流量を開度に応じて調整可能なバルブを含み、前記第２成分液供給部は、前記第２配管を流れる前記第２成分液の流量を開度に応じて調整可能なバルブを含み、前記算出制御工程は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部の前記バルブおよび前記第２成分液供給部のバルブの少なくとも一方の開度を制御する。 In one embodiment, the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree, and the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe, and the second component liquid supply unit The calculation control step includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the calculation control step is configured to adjust the flow rate of the second component liquid flowing through the second pipe to the first supply amount and the second supply amount during the component liquid supply period. Based on this, the opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
　ある実施形態では、前記検知制御工程は、前記第１成分液供給部が前記貯留槽に前記第１成分液を供給せず、かつ、前記第２成分液供給部が前記貯留槽に前記第２成分液を供給しない期間において、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する。 In one embodiment, the detection control step includes the first component liquid supply unit not supplying the first component liquid to the storage tank, and the second component liquid supply unit supplying the second component liquid to the storage tank. During a period in which the component liquid is not supplied, the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
　ある実施形態では、前記第１供給量を算出する工程において、前記第１成分液供給部が前記第１配管を介して前記第１成分液を前記貯留槽に供給する第１供給期間にわたって、前記第１供給量を算出し、前記第２供給量を算出する工程において、前記第２成分液供給部が前記第２配管を介して前記第２成分液を前記貯留槽に供給する第２供給期間にわたって、前記第２供給量を算出する。 In one embodiment, in the step of calculating the first supply amount, the first component liquid supply section supplies the first component liquid to the storage tank via the first pipe, over a first supply period, In the step of calculating a first supply amount and calculating the second supply amount, a second supply period in which the second component liquid supply unit supplies the second component liquid to the storage tank via the second piping. The second supply amount is calculated over the period of time.
　ある実施形態では、前記基板処理方法は、前記第１供給期間の開始前に、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する第１成分液前供給工程と、前記第１供給期間の終了後に、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する第１成分液後供給工程と、前記第２供給期間の開始前に、前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する第２成分液前供給工程と、前記第２供給期間の終了後に、前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する第２成分液後供給工程とをさらに包含する。 In one embodiment, the substrate processing method includes a first component liquid pre-supply in which the first component liquid supply section supplies the first component liquid via the first pipe before the start of the first supply period. a first component liquid post-supply step in which the first component liquid supply unit supplies the first component liquid via the first piping after the first supply period ends; A second component liquid pre-supply step in which the second component liquid supply unit supplies the second component liquid via the second piping before the start, and a second component liquid pre-supply step in which the second component liquid is supplied via the second piping, and after the second component liquid supply period ends, the second component liquid The method further includes a second component liquid post-supply step in which the supply unit supplies the second component liquid via the second pipe.
　ある実施形態では、前記第１供給量を算出する工程および前記第２供給量を算出する工程において、前記第１供給期間は前記第２供給期間と同時に開始し、前記第１供給期間は前記第２供給期間と同時に終了する。 In one embodiment, in the step of calculating the first supply amount and the step of calculating the second supply amount, the first supply period starts at the same time as the second supply period, and the first supply period starts at the same time as the second supply period. 2 supply period ends at the same time.
　ある実施形態では、前記第１成分液前供給工程において前記第１成分液供給部による前記第１成分液の供給を前記第２成分液前供給工程において前記第２成分液供給部による前記第２成分液の供給と同時に開始し、前記第１成分液後供給工程において前記第１成分液供給部による前記第１成分液の供給を前記第２成分液後供給工程において前記第２成分液供給部による前記第２成分液の供給と同時に停止する。 In one embodiment, the supply of the first component liquid by the first component liquid supply section in the first component liquid pre-supply step is performed by the second component liquid supply section by the second component liquid supply section in the second component liquid pre-supply step. The supply of the first component liquid by the first component liquid supply unit in the first component liquid post-supply step is started simultaneously with the supply of the component liquid, and the supply of the first component liquid by the first component liquid supply unit in the second component liquid post-supply process is started by the second component liquid supply unit in the second component liquid post-supply process. The supply of the second component liquid is stopped simultaneously with the supply of the second component liquid.
　ある実施形態では、前記基板処理方法は、前記第１供給量と前記第２供給量に基づいて前記貯留槽内の前記混合液における対象成分の濃度を算出した算出濃度が前記濃度センサーによって検知された前記濃度との差が閾値よりも大きい場合、前記第１成分液供給部、前記第２成分液供給部および前記基板処理ユニットの駆動を停止する工程をさらに包含する。 In one embodiment, in the substrate processing method, a calculated concentration of a target component in the mixed liquid in the storage tank is detected by the concentration sensor based on the first supply amount and the second supply amount. The method further includes the step of stopping driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit when the difference between the concentration and the concentration is larger than a threshold value.
　ある実施形態では、前記第１成分液を供給する工程において、前記第１成分液は、フッ酸を含み、前記第２成分液を供給する工程において、前記第２成分液は、希釈液を含む。 In one embodiment, in the step of supplying the first component liquid, the first component liquid includes hydrofluoric acid, and in the step of supplying the second component liquid, the second component liquid includes a diluent. .
　本発明によれば、貯留槽に供給される成分液を速やかに制御できる。 According to the present invention, the component liquids supplied to the storage tank can be quickly controlled.
本実施形態の基板処理装置の模式図である。FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment. 本実施形態の基板処理装置における基板処理ユニットの模式図である。FIG. 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus of this embodiment. 本実施形態の基板処理装置における配管構成を示す模式図である。FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment. 本実施形態の基板処理装置のブロック図である。FIG. 1 is a block diagram of a substrate processing apparatus according to the present embodiment. 本実施形態の基板処理方法のフロー図である。FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment. （ａ）および（ｃ）は、第１処理液および第２処理液の流量の変化を示したグラフであり、（ｂ）は、貯留槽内の混合液の濃度の時間変化を示すグラフである。(a) and (c) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid, and (b) is a graph showing changes over time in the concentration of the mixed liquid in the storage tank. . 本実施形態の基板処理方法のフロー図である。FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment. （ａ）および（ｂ）は、貯留槽内の混合液の濃度の時間変化を示すグラフである。(a) and (b) are graphs showing temporal changes in the concentration of the liquid mixture in the storage tank. 本実施形態の基板処理装置における配管構成を示す模式図である。FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment. 本実施形態の基板処理装置における配管構成を示す模式図である。FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment. （ａ）および（ｂ）は、第１処理液および第２処理液の流量の変化を示したグラフである。(a) and (b) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid. 本実施形態の基板処理方法のフロー図である。FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment. 本実施形態の基板処理方法のフロー図である。FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment. 本実施形態の基板処理装置の模式図である。FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment. 本実施形態の基板処理装置の模式図である。FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
　以下、図面を参照して、本発明による基板処理装置および基板処理方法の実施形態を説明する。なお、図中、同一または相当部分については同一の参照符号を付して説明を繰り返さない。なお、本願明細書では、発明の理解を容易にするため、互いに直交するＸ軸、Ｙ軸およびＺ軸を記載することがある。典型的には、Ｘ軸およびＹ軸は水平方向に平行であり、Ｚ軸は鉛直方向に平行である。 Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. In addition, in the drawings, the same or corresponding parts are given the same reference numerals and the description will not be repeated. Note that in this specification, in order to facilitate understanding of the invention, an X-axis, a Y-axis, and a Z-axis that are perpendicular to each other may be described. Typically, the X and Y axes are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction.
　まず、図１を参照して、本発明による基板処理装置１００の実施形態を説明する。図１は、本実施形態の基板処理装置１００の模式的な平面図である。 First, with reference to FIG. 1, an embodiment of a substrate processing apparatus 100 according to the present invention will be described. FIG. 1 is a schematic plan view of a substrate processing apparatus 100 of this embodiment.
　基板処理装置１００は、基板Ｗを処理する。基板処理装置１００は、基板Ｗに対して、エッチング、表面処理、特性付与、処理膜形成、膜の少なくとも一部の除去および洗浄のうちの少なくとも１つを行うように基板Ｗを処理する。 The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W to perform at least one of etching, surface treatment, imparting properties, forming a treated film, removing at least a portion of the film, and cleaning.
　基板Ｗは、半導体基板として用いられる。基板Ｗは、半導体ウエハを含む。例えば、基板Ｗは略円板状である。ここでは、基板処理装置１００は、基板Ｗを一枚ずつ処理する。 The substrate W is used as a semiconductor substrate. Substrate W includes a semiconductor wafer. For example, the substrate W has a substantially disk shape. Here, the substrate processing apparatus 100 processes the substrates W one by one.
　図１に示すように、基板処理装置１００は、複数の基板処理ユニット１０と、処理液キャビネット１１０と、処理液ボックス１２０と、複数のロードポートＬＰと、インデクサーロボットＩＲと、センターロボットＣＲと、制御装置１０１とを備える。制御装置１０１は、ロードポートＬＰ、インデクサーロボットＩＲおよびセンターロボットＣＲを制御する。制御装置１０１は、制御部１０２および記憶部１０４を含む。 As shown in FIG. 1, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports LP, an indexer robot IR, and a center robot CR. , and a control device 101. The control device 101 controls the load port LP, indexer robot IR, and center robot CR. Control device 101 includes a control section 102 and a storage section 104.
　ロードポートＬＰの各々は、複数枚の基板Ｗを積層して収容する。インデクサーロボットＩＲは、ロードポートＬＰとセンターロボットＣＲとの間で基板Ｗを搬送する。センターロボットＣＲは、インデクサーロボットＩＲと基板処理ユニット１０との間で基板Ｗを搬送する。基板処理ユニット１０の各々は、基板Ｗに処理液を吐出して、基板Ｗを処理する。処理液は、薬液、洗浄液、除去液および／または撥水剤を含む。処理液キャビネット１１０は、処理液を収容する。なお、処理液キャビネット１１０は、ガスを収容してもよい。 Each of the load ports LP accommodates a plurality of stacked substrates W. The indexer robot IR transports the substrate W between the load port LP and the center robot CR. The center robot CR transports the substrate W between the indexer robot IR and the substrate processing unit 10. Each of the substrate processing units 10 processes the substrate W by discharging a processing liquid onto the substrate W. The treatment liquid includes a chemical liquid, a cleaning liquid, a removal liquid, and/or a water repellent. The processing liquid cabinet 110 stores processing liquid. Note that the processing liquid cabinet 110 may contain gas.
　具体的には、複数の基板処理ユニット１０は、平面視においてセンターロボットＣＲを取り囲むように配置された複数のタワーＴＷ（図１では４つのタワーＴＷ）を形成している。各タワーＴＷは、上下に積層された複数の基板処理ユニット１０（図１では３つの基板処理ユニット１０）を含む。処理液ボックス１２０は、それぞれ、複数のタワーＴＷに対応している。処理液キャビネット１１０内の液体は、いずれかの処理液ボックス１２０を介して、処理液ボックス１２０に対応するタワーＴＷに含まれる全ての基板処理ユニット１０に供給される。また、処理液キャビネット１１０内のガスは、いずれかの処理液ボックス１２０を介して、処理液ボックス１２０に対応するタワーＴＷに含まれる全ての基板処理ユニット１０に供給される。 Specifically, the plurality of substrate processing units 10 form a plurality of towers TW (four towers TW in FIG. 1) arranged so as to surround the center robot CR in plan view. Each tower TW includes a plurality of substrate processing units 10 (three substrate processing units 10 in FIG. 1) stacked one above the other. Each processing liquid box 120 corresponds to a plurality of towers TW. The liquid in the processing liquid cabinet 110 is supplied via one of the processing liquid boxes 120 to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120. Further, the gas in the processing liquid cabinet 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120 via one of the processing liquid boxes 120.
　基板処理装置１００において、センターロボットＣＲおよび基板処理ユニット１０の設置された領域と、処理液キャビネット１１０の設置された領域との間には、境界壁が配置される。 In the substrate processing apparatus 100, a boundary wall is arranged between the area where the central robot CR and the substrate processing unit 10 are installed and the area where the processing liquid cabinet 110 is installed.
　典型的には、処理液キャビネット１１０は、処理液を調製するための貯留槽（タンク）を有する。処理液キャビネット１１０は、一種類の処理液のための貯留槽を有してもよく、複数種類の処理液のための貯留槽を有してもよい。また、処理液キャビネット１１０は、処理液を流通するためのポンプ、バルブおよび／またはフィルターを有する。 Typically, the processing liquid cabinet 110 has a storage tank (tank) for preparing the processing liquid. The processing liquid cabinet 110 may have a storage tank for one type of processing liquid, or may have storage tanks for multiple types of processing liquids. Furthermore, the processing liquid cabinet 110 includes a pump, a valve, and/or a filter for distributing the processing liquid.
　制御装置１０１は、基板処理装置１００の各種動作を制御する。制御装置１０１により、基板処理ユニット１０は基板Ｗを処理する。 The control device 101 controls various operations of the substrate processing apparatus 100. The substrate processing unit 10 processes the substrate W under the control of the control device 101 .
　制御装置１０１は、制御部１０２および記憶部１０４を含む。制御部１０２は、プロセッサーを有する。制御部１０２は、例えば、中央処理演算機（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ：ＣＰＵ）を有する。または、制御部１０２は、汎用演算機を有してもよい。 The control device 101 includes a control section 102 and a storage section 104. Control unit 102 has a processor. The control unit 102 includes, for example, a central processing unit (CPU). Alternatively, the control unit 102 may include a general-purpose computing machine.
　記憶部１０４は、データおよびコンピュータープログラムを記憶する。データは、レシピデータを含む。レシピデータは、複数のレシピを示す情報を含む。複数のレシピの各々は、基板Ｗの処理内容および処理手順を規定する。 The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents and processing procedures for the substrate W.
　記憶部１０４は、主記憶装置と、補助記憶装置とを含む。主記憶装置は、例えば、半導体メモリである。補助記憶装置は、例えば、半導体メモリおよび／またはハードディスクドライブである。記憶部１０４はリムーバブルメディアを含んでいてもよい。制御部１０２は、記憶部１０４の記憶しているコンピュータープログラムを実行して、基板処理動作を実行する。 The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and/or a hard disk drive. Storage unit 104 may include removable media. The control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
　次に、図２を参照して、本実施形態の基板処理装置１００における基板処理ユニット１０を説明する。図２は、基板処理装置１００における基板処理ユニット１０の模式図である。 Next, with reference to FIG. 2, the substrate processing unit 10 in the substrate processing apparatus 100 of this embodiment will be described. FIG. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.
　基板処理ユニット１０は、チャンバー１１と、基板保持部２０と、処理液供給部３０とを備える。チャンバー１１は、基板Ｗを収容する。基板保持部２０は、基板Ｗを保持する。 The substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30. The chamber 11 accommodates the substrate W. The substrate holding section 20 holds the substrate W.
　チャンバー１１は、内部空間を有する略箱形状である。チャンバー１１は、基板Ｗを収容する。ここでは、基板処理装置１００は、基板Ｗを１枚ずつ処理する枚葉型であり、チャンバー１１には基板Ｗが１枚ずつ収容される。基板Ｗは、チャンバー１１内に収容され、チャンバー１１内で処理される。チャンバー１１には、基板保持部２０および処理液供給部３０のそれぞれの少なくとも一部が収容される。 The chamber 11 is approximately box-shaped with an internal space. The chamber 11 accommodates the substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes substrates W one by one, and the chamber 11 accommodates one substrate W at a time. The substrate W is accommodated within the chamber 11 and processed within the chamber 11 . The chamber 11 accommodates at least a portion of each of the substrate holding section 20 and the processing liquid supply section 30 .
　基板保持部２０は、基板Ｗを保持する。基板保持部２０は、基板Ｗの上面（表面）Ｗａを上方に向け、基板Ｗの裏面（下面）Ｗｂを鉛直下方に向くように基板Ｗを水平に保持する。また、基板保持部２０は、基板Ｗを保持した状態で基板Ｗを回転させる。例えば、基板Ｗの上面Ｗａには、リセスの形成された積層構造が設けられている。基板保持部２０は、基板Ｗを保持したまま基板Ｗを回転させる。 The substrate holding section 20 holds the substrate W. The substrate holding unit 20 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. Further, the substrate holding unit 20 rotates the substrate W while holding the substrate W. For example, the upper surface Wa of the substrate W is provided with a stacked structure in which a recess is formed. The substrate holder 20 rotates the substrate W while holding it.
　例えば、基板保持部２０は、基板Ｗの端部を挟持する挟持式であってもよい。あるいは、基板保持部２０は、基板Ｗを裏面Ｗｂから保持する任意の機構を有してもよい。例えば、基板保持部２０は、バキューム式であってもよい。この場合、基板保持部２０は、非デバイス形成面である基板Ｗの裏面Ｗｂの中央部を上面に吸着させることにより基板Ｗを水平に保持する。あるいは、基板保持部２０は、複数のチャックピンを基板Ｗの周端面に接触させる挟持式とバキューム式とを組み合わせてもよい。 For example, the substrate holder 20 may be a clamping type that clamps the edge of the substrate W. Alternatively, the substrate holding section 20 may have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding section 20 may be of a vacuum type. In this case, the substrate holding unit 20 holds the substrate W horizontally by adsorbing the center portion of the back surface Wb of the substrate W, which is a non-device forming surface, to the upper surface. Alternatively, the substrate holding section 20 may combine a clamping type in which a plurality of chuck pins are brought into contact with the peripheral end surface of the substrate W and a vacuum type.
　例えば、基板保持部２０は、スピンベース２１と、チャック部材２２と、シャフト２３と、電動モーター２４と、ハウジング２５とを含む。チャック部材２２は、スピンベース２１に設けられる。チャック部材２２は、基板Ｗをチャックする。典型的には、スピンベース２１には、複数のチャック部材２２が設けられる。 For example, the substrate holder 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 chucks the substrate W. Typically, the spin base 21 is provided with a plurality of chuck members 22.
　シャフト２３は、中空軸である。シャフト２３は、回転軸Ａｘに沿って鉛直方向に延びている。シャフト２３の上端には、スピンベース２１が結合されている。基板Ｗは、スピンベース２１の上方に載置される。 The shaft 23 is a hollow shaft. The shaft 23 extends vertically along the rotation axis Ax. A spin base 21 is coupled to the upper end of the shaft 23. The substrate W is placed above the spin base 21 .
　スピンベース２１は、円板状であり、基板Ｗを水平に支持する。シャフト２３は、スピンベース２１の中央部から下方に延びる。電動モーター２４は、シャフト２３に回転力を与える。電動モーター２４は、シャフト２３を回転方向に回転させることにより、回転軸Ａｘを中心に基板Ｗおよびスピンベース２１を回転させる。ハウジング２５は、シャフト２３および電動モーター２４を取り囲んでいる。 The spin base 21 is disk-shaped and supports the substrate W horizontally. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 provides rotational force to the shaft 23. The electric motor 24 rotates the substrate W and the spin base 21 about the rotation axis Ax by rotating the shaft 23 in the rotational direction. Housing 25 surrounds shaft 23 and electric motor 24 .
　処理液供給部３０は、基板Ｗに処理液を供給する。典型的には、処理液供給部３０は、基板Ｗの上面Ｗａに処理液を供給する。処理液供給部３０の少なくとも一部は、チャンバー１１内に収容される。 The processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply section 30 is accommodated within the chamber 11.
　処理液供給部３０は、基板Ｗの上面Ｗａに処理液を供給する。処理液は、いわゆる薬液を含んでもよい。薬液は、フッ酸を含む。例えば、フッ酸は、４０℃以上７０℃以下に加熱されてもよく、５０℃以上６０℃以下に加熱されてもよい。ただし、フッ酸は、加熱されなくてもよい。また、薬液は、水または燐酸を含んでもよい。 The processing liquid supply unit 30 supplies a processing liquid to the upper surface Wa of the substrate W. The treatment liquid may also include a so-called chemical solution. The chemical solution contains hydrofluoric acid. For example, hydrofluoric acid may be heated to 40°C or more and 70°C or less, or may be heated to 50°C or more and 60°C or less. However, hydrofluoric acid does not need to be heated. Moreover, the chemical solution may contain water or phosphoric acid.
　さらに、薬液は、過酸化水素水を含んでもよい。また、薬液は、ＳＣ１（アンモニア過酸化水素水混合液）、ＳＣ２（塩酸過酸化水素水混合液）または王水（濃塩酸と濃硝酸との混合物）を含んでもよい。 Furthermore, the chemical solution may include hydrogen peroxide solution. Further, the chemical solution may include SC1 (ammonia hydrogen peroxide solution mixture), SC2 (hydrochloric acid hydrogen peroxide solution mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid).
　または、処理液は、いわゆる洗浄液（リンス液）を含んでもよい。例えば、洗浄液は、脱イオン水（Ｄｅｉｏｎｉｚｅｄ　Ｗａｔｅｒ：ＤＩＷ）、炭酸水、電解イオン水、オゾン水、アンモニア水、希釈濃度（例えば、１０ｐｐｍ～１００ｐｐｍ程度）の塩酸水、または、還元水（水素水）のいずれかを含んでもよい。 Alternatively, the processing liquid may include a so-called cleaning liquid (rinsing liquid). For example, the cleaning liquid may be deionized water (DIW), carbonated water, electrolyzed ionized water, ozone water, ammonia water, hydrochloric acid water at a diluted concentration (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water). It may also include any of the following.
　処理液供給部３０は、配管３２と、ノズル３４と、バルブ３６とを含む。ノズル３４は基板Ｗの上面Ｗａに処理液を吐出する。ノズル３４は、配管３２に接続される。配管３２には、供給源から処理液が供給される。バルブ３６は、配管３２内の流路を開閉する。ノズル３４は、基板Ｗに対して移動可能に構成されていることが好ましい。 The processing liquid supply section 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 discharges the processing liquid onto the upper surface Wa of the substrate W. Nozzle 34 is connected to piping 32. A processing liquid is supplied to the piping 32 from a supply source. The valve 36 opens and closes the flow path within the pipe 32. Preferably, the nozzle 34 is configured to be movable relative to the substrate W.
　バルブ３６は、配管３２内の流路を開閉する。バルブ３６は、配管３２の開度を調節して、配管３２に供給される処理液の流量を調整する。具体的には、バルブ３６は、弁座が内部に設けられたバルブボディ（図示しない）と、弁座を開閉する弁体と、開位置と閉位置との間で弁体を移動させるアクチュエータ（図示しない）とを含む。 The valve 36 opens and closes the flow path within the pipe 32. The valve 36 adjusts the opening degree of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32. Specifically, the valve 36 includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
　ノズル３４は移動可能であってもよい。ノズル３４は、制御部１０２によって制御される移動機構にしたがって水平方向および／または鉛直方向に移動できる。なお、本明細書において、図面が過度に複雑になることを避けるために移動機構を省略していることに留意されたい。 The nozzle 34 may be movable. The nozzle 34 can be moved horizontally and/or vertically according to a movement mechanism controlled by the control unit 102. Note that in this specification, the moving mechanism is omitted to avoid making the drawings excessively complex.
　基板処理ユニット１０は、カップ８０をさらに備える。カップ８０は、基板Ｗから飛散した処理液を回収する。カップ８０は昇降する。例えば、カップ８０は、処理液供給部３０が基板Ｗに処理液を供給する期間にわたって基板Ｗの側方にまで鉛直上方に上昇する。この場合、カップ８０は、基板Ｗの回転によって基板Ｗから飛散する処理液を回収する。また、カップ８０は、処理液供給部３０が基板Ｗに処理液を供給する期間が終了すると、基板Ｗの側方から鉛直下方に下降する。 The substrate processing unit 10 further includes a cup 80. The cup 80 collects the processing liquid scattered from the substrate W. The cup 80 moves up and down. For example, the cup 80 rises vertically upward to the side of the substrate W over a period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 descends vertically downward from the side of the substrate W.
　上述したように、制御装置１０１は、制御部１０２および記憶部１０４を含む。制御部１０２は、基板保持部２０、処理液供給部３０および／またはカップ８０を制御する。一例では、制御部１０２は、電動モーター２４、バルブ３６および／またはカップ８０を制御する。 As described above, the control device 101 includes the control section 102 and the storage section 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and/or the cup 80. In one example, controller 102 controls electric motor 24, valve 36, and/or cup 80.
　本実施形態の基板処理装置１００は、半導体の設けられた半導体素子の作製に好適に用いられる。典型的には、半導体素子において、基材の上に導電層および絶縁層が積層される。基板処理装置１００は、半導体素子の製造時に、導電層および／または絶縁層の洗浄および／または加工（例えば、エッチング、特性変化等）に好適に用いられる。 The substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor. Typically, in a semiconductor device, a conductive layer and an insulating layer are laminated on a base material. The substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
　なお、図２に示した基板処理ユニット１０では、処理液供給部３０は、１種類の処理液を供給可能である。ただし、本実施形態はこれに限定されない。処理液供給部３０は、複数種類の処理液を供給してもよい。例えば、処理液供給部３０は、用途の異なる複数種類の処理液を基板Ｗに順次供給可能であってもよい。あるいは、処理液供給部３０は、用途の異なる複数種類の処理液を基板Ｗに同時に供給可能であってもよい。 Note that in the substrate processing unit 10 shown in FIG. 2, the processing liquid supply section 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 may supply multiple types of processing liquids. For example, the processing liquid supply unit 30 may be able to sequentially supply a plurality of types of processing liquids for different uses to the substrate W. Alternatively, the processing liquid supply unit 30 may be able to simultaneously supply a plurality of types of processing liquids for different purposes to the substrate W.
　次に、図１～図３を参照して、本実施形態の基板処理装置１００における配管構成を説明する。図３は、本実施形態の基板処理装置１００における配管構成を示す模式図である。 Next, the piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 3. FIG. 3 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
　図３に示すように、基板処理装置１００は、第１成分液供給部１１２と、第２成分液供給部１１４と、貯留槽１１６と、配管１１７と、濃度センサー１１８とを備える。第１成分液供給部１１２、第２成分液供給部１１４、貯留槽１１６および濃度センサー１１８は、いずれも処理液キャビネット１１０内に配置される。 As shown in FIG. 3, the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118. The first component liquid supply section 112, the second component liquid supply section 114, the storage tank 116, and the concentration sensor 118 are all arranged within the processing liquid cabinet 110.
　第１成分液供給部１１２は、第１成分液を供給する。第１成分液供給部１１２から供給された第１成分液は、貯留槽１１６まで流れて貯留槽１１６に貯留される。 The first component liquid supply section 112 supplies the first component liquid. The first component liquid supplied from the first component liquid supply section 112 flows to the storage tank 116 and is stored in the storage tank 116 .
　第２成分液供給部１１４は、第２成分液を供給する。第２成分液供給部１１４から供給された第２成分液は、貯留槽１１６まで流れて貯留槽１１６に貯留される。 The second component liquid supply section 114 supplies the second component liquid. The second component liquid supplied from the second component liquid supply section 114 flows to the storage tank 116 and is stored in the storage tank 116 .
　貯留槽１１６において第１成分液および第２成分液が混合されて混合液となる。混合液は、基板処理ユニット１０における処理液として用いられる。なお、混合液は、第１成分液および第２成分液が混合された状態のまま含有しなくてもよい。混合液は、第１成分液および第２成分液の混合によって反応した結果物であってもよい。 The first component liquid and the second component liquid are mixed in the storage tank 116 to form a mixed liquid. The mixed liquid is used as a processing liquid in the substrate processing unit 10. Note that the mixed liquid does not need to contain the first component liquid and the second component liquid in a mixed state. The mixed liquid may be the result of a reaction caused by mixing the first component liquid and the second component liquid.
　また、第１成分液および第２成分液のうちの一方は、第１成分液および第２成分液のうちの他方に希釈されて用いられてもよい。例えば、第１成分液および第２成分液の一方は薬液であり、第１成分液および第２成分液の他方は希釈液であってもよい。 Furthermore, one of the first component liquid and the second component liquid may be used after being diluted with the other of the first component liquid and the second component liquid. For example, one of the first component liquid and the second component liquid may be a chemical liquid, and the other of the first component liquid and the second component liquid may be a diluent liquid.
　第１成分液供給部１１２は、第１配管１１２ａと、第１流量計１１２ｂと、バルブ１１２ｃとを含む。第１配管１１２ａには、供給源から第１成分液が供給される。第１流量計１１２ｂは、第１配管１１２ａに配置される。第１流量計１１２ｂは、第１配管１１２ａを流れる第１成分液の流量を測定する。 The first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c. The first component liquid is supplied to the first pipe 112a from a supply source. The first flow meter 112b is arranged in the first pipe 112a. The first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
　バルブ１１２ｃは、第１配管１１２ａ内の流路を開閉する。バルブ１１２ｃは、第１配管１１２ａの開度を調節して、第１配管１１２ａを流れる第１成分液の流量を調整する。具体的には、バルブ１１２ｃは、弁座が内部に設けられたバルブボディ（図示しない）と、弁座を開閉する弁体と、開位置と閉位置との間で弁体を移動させるアクチュエータ（図示しない）とを含む。 The valve 112c opens and closes the flow path within the first pipe 112a. The valve 112c adjusts the opening degree of the first pipe 112a to adjust the flow rate of the first component liquid flowing through the first pipe 112a. Specifically, the valve 112c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
　バルブ１１２ｃは、モーターニードルバルブであってもよい。例えば、第１流量計１１２ｂの測定結果に基づいてバルブ１１２ｃの開度を調整することによって、第１配管１１２ａを流れる処理液の流量を調整してもよい。 The valve 112c may be a motorized needle valve. For example, the flow rate of the processing liquid flowing through the first pipe 112a may be adjusted by adjusting the opening degree of the valve 112c based on the measurement result of the first flowmeter 112b.
　第２成分液供給部１１４は、第２配管１１４ａと、第２流量計１１４ｂと、バルブ１１４ｃとを含む。第２配管１１４ａには、供給源から第２成分液が供給される。第２流量計１１４ｂは、第２配管１１４ａに配置される。第２流量計１１４ｂは、第２配管１１４ａを流れる第２成分液の流量を測定する。 The second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c. The second component liquid is supplied to the second pipe 114a from a supply source. The second flow meter 114b is arranged in the second pipe 114a. The second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
　バルブ１１４ｃは、第２配管１１４ａ内の流路を開閉する。バルブ１１４ｃは、第２配管１１４ａの開度を調節して、第２配管１１４ａを流れる処理液の流量を調整する。具体的には、バルブ１１４ｃは、弁座が内部に設けられたバルブボディ（図示しない）と、弁座を開閉する弁体と、開位置と閉位置との間で弁体を移動させるアクチュエータ（図示しない）とを含む。 The valve 114c opens and closes the flow path within the second pipe 114a. The valve 114c adjusts the opening degree of the second pipe 114a to adjust the flow rate of the processing liquid flowing through the second pipe 114a. Specifically, the valve 114c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
　バルブ１１４ｃは、モーターニードルバルブであってもよい。例えば、第２流量計１１４ｂの測定結果に基づいてバルブ１１４ｃの開度を調整することによって、第２配管１１４ａを流れる処理液の流量を調整してもよい。 The valve 114c may be a motorized needle valve. For example, the flow rate of the processing liquid flowing through the second pipe 114a may be adjusted by adjusting the opening degree of the valve 114c based on the measurement result of the second flowmeter 114b.
　貯留槽１１６には、第１配管１１２ａを流れた第１成分液が供給される。また、貯留槽１１６には、第２配管１１４ａを流れた第２成分液が供給される。このため、貯留槽１１６において、第１成分液および第２成分液が混合される。貯留槽１１６は、第１配管１１２ａを流れた第１成分液と第２配管１１４ａを流れた第２成分液とを混合した混合液を貯留する。 The first component liquid that has flowed through the first pipe 112a is supplied to the storage tank 116. Further, the second component liquid that has flowed through the second pipe 114a is supplied to the storage tank 116. Therefore, the first component liquid and the second component liquid are mixed in the storage tank 116. The storage tank 116 stores a mixed liquid obtained by mixing the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a.
　配管１１７は、貯留槽１１６と配管３２とを接続する。詳細には、配管１１７は、貯留槽１１６と配管３２ａ～３２ｃとを接続する。貯留槽１１６に貯留された混合液は、配管１１７および配管３２を流れて基板処理ユニット１０に供給される。 Piping 117 connects storage tank 116 and piping 32. Specifically, the pipe 117 connects the storage tank 116 and the pipes 32a to 32c. The mixed liquid stored in the storage tank 116 flows through the pipe 117 and the pipe 32 and is supplied to the substrate processing unit 10.
　濃度センサー１１８は、貯留槽１１６に貯留された混合液内の対象成分の濃度を検知する。濃度センサー１１８は、第１成分液内の所定成分の濃度を検知してもよい。または、濃度センサー１１８は、第２成分液内の所定成分の濃度を検知してもよい。あるいは、濃度センサー１１８は、混合液内における対象成分の濃度を検知してもよい。一例では、濃度センサー１１８は、第１成分液および第２成分液の混合によって新たに生成される対象成分の濃度を検知してもよい。なお、本明細書において、混合液内における対象成分の濃度を単に「混合液の濃度」と記載することがある。 The concentration sensor 118 detects the concentration of the target component in the mixed liquid stored in the storage tank 116. The concentration sensor 118 may detect the concentration of a predetermined component in the first component liquid. Alternatively, the concentration sensor 118 may detect the concentration of a predetermined component in the second component liquid. Alternatively, the concentration sensor 118 may detect the concentration of the target component in the liquid mixture. In one example, the concentration sensor 118 may detect the concentration of a target component newly generated by mixing the first component liquid and the second component liquid. Note that in this specification, the concentration of the target component in the liquid mixture may be simply referred to as "concentration of the liquid mixture."
　基板処理ユニット１０は、基板処理ユニット１０ａ～１０ｃを含む。典型的には、基板処理ユニット１０ａ～１０ｃは、同一の形状および同一の機能を有する。基板処理ユニット１０ａは、処理液供給部３０ａを有する。図２に示したように、処理液供給部３０ａは、配管３２ａと、ノズル３４ａと、バルブ３６ａとを含む。ノズル３４ａは基板Ｗの上面Ｗａに処理液を吐出する。ノズル３４ａは、配管３２ａに接続される。配管３２ａには、供給源から処理液が供給される。バルブ３６ａは、配管３２ａ内の流路を開閉する。ノズル３４ａは、基板Ｗに対して移動可能に構成されていることが好ましい。 The substrate processing unit 10 includes substrate processing units 10a to 10c. Typically, substrate processing units 10a-10c have the same shape and the same function. The substrate processing unit 10a includes a processing liquid supply section 30a. As shown in FIG. 2, the processing liquid supply section 30a includes a pipe 32a, a nozzle 34a, and a valve 36a. The nozzle 34a discharges the processing liquid onto the upper surface Wa of the substrate W. Nozzle 34a is connected to piping 32a. A processing liquid is supplied to the pipe 32a from a supply source. The valve 36a opens and closes the flow path within the pipe 32a. Preferably, the nozzle 34a is configured to be movable relative to the substrate W.
　同様に、基板処理ユニット１０ｂは、処理液供給部３０ｂを有する。処理液供給部３０ｂは、配管３２ｂと、ノズル３４ｂと、バルブ３６ｂとを含む。また、基板処理ユニット１０ｃは、処理液供給部３０ｃを有する。処理液供給部３０ｃは、配管３２ｃと、ノズル３４ｃと、バルブ３６ｃとを含む。 Similarly, the substrate processing unit 10b has a processing liquid supply section 30b. The processing liquid supply section 30b includes a pipe 32b, a nozzle 34b, and a valve 36b. Further, the substrate processing unit 10c includes a processing liquid supply section 30c. The processing liquid supply section 30c includes a pipe 32c, a nozzle 34c, and a valve 36c.
　本実施形態の基板処理装置１００では、第１配管１１２ａを流れる第１成分液の流量を検知する第１流量計１１２ｂの測定結果から貯留槽１１６に供給された第１成分液の供給量を算出し、第２配管１１４ａを流れる第２成分液の流量を検知する第２流量計１１４ｂの測定結果から貯留槽１１６に供給された第２成分液の供給量を算出する。このため、濃度センサー１１８が貯留槽１１６の混合液の濃度を検知するよりも前に、第１配管１１２ａを流れる第１成分液の供給量および第２配管１１４ａを流れる第２成分液の供給量に基づいて、第１成分液供給部１１２および第２成分液供給部１１４を制御できる。また、仮に、濃度センサー１１８が故障しても、貯留槽１１６内の混合液の濃度が意図に反して制御されることを抑制できる。 In the substrate processing apparatus 100 of this embodiment, the supply amount of the first component liquid supplied to the storage tank 116 is calculated from the measurement result of the first flow meter 112b that detects the flow rate of the first component liquid flowing through the first pipe 112a. Then, the amount of the second component liquid supplied to the storage tank 116 is calculated from the measurement result of the second flow meter 114b that detects the flow rate of the second component liquid flowing through the second pipe 114a. Therefore, before the concentration sensor 118 detects the concentration of the mixed liquid in the storage tank 116, the supply amount of the first component liquid flowing through the first pipe 112a and the supply amount of the second component liquid flowing through the second pipe 114a are detected. Based on this, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled. Furthermore, even if the concentration sensor 118 fails, the concentration of the mixed liquid in the storage tank 116 can be prevented from being controlled unintentionally.
　また、基板処理装置１００では、貯留槽１１６において、第１成分液および第２成分液が混合した混合液を処理液として基板処理ユニット１０に供給できる。 Furthermore, in the substrate processing apparatus 100, a mixed liquid in which the first component liquid and the second component liquid are mixed can be supplied to the substrate processing unit 10 as a processing liquid in the storage tank 116.
　本実施形態の基板処理装置１００は、半導体の設けられた半導体素子の作製に好適に用いられる。典型的には、半導体素子において、基材の上に導電層および絶縁層が積層される。基板処理装置１００は、半導体素子の製造時に、導電層および／または絶縁層の洗浄および／または加工（例えば、エッチング、特性変化等）に好適に用いられる。 The substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor. Typically, in a semiconductor device, a conductive layer and an insulating layer are laminated on a base material. The substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
　次に、図１～図４を参照して、本実施形態の基板処理装置１００を説明する。図４は、基板処理装置１００のブロック図である。 Next, the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 4. FIG. 4 is a block diagram of the substrate processing apparatus 100.
　図４に示すように、制御装置１０１は、基板処理装置１００の各種動作を制御する。制御装置１０１は、インデクサーロボットＩＲ、センターロボットＣＲ、基板保持部２０、処理液供給部３０およびカップ８０を制御する。具体的には、制御装置１０１は、インデクサーロボットＩＲ、センターロボットＣＲ、基板保持部２０、処理液供給部３０およびカップ８０に制御信号を送信することによって、インデクサーロボットＩＲ、センターロボットＣＲ、基板保持部２０、処理液供給部３０およびカップ８０を制御する。 As shown in FIG. 4, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding section 20, the processing liquid supply section 30, and the cup 80. Specifically, the control device 101 transmits control signals to the indexer robot IR, center robot CR, substrate holding section 20, processing liquid supply section 30, and cup 80, thereby controlling the indexer robot IR, center robot CR, The substrate holding section 20, the processing liquid supply section 30, and the cup 80 are controlled.
　また、記憶部１０４は、コンピュータープログラムおよびデータを記憶する。データは、レシピデータを含む。レシピデータは、複数のレシピを示す情報を含む。複数のレシピの各々は、基板Ｗの処理内容、処理手順および基板処理条件を規定する。制御部１０２は、記憶部１０４の記憶しているコンピュータープログラムを実行して、基板処理動作を実行する。 Additionally, the storage unit 104 stores computer programs and data. The data includes recipe data. The recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents, processing procedures, and substrate processing conditions for the substrate W. The control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
　制御部１０２は、インデクサーロボットＩＲを制御して、インデクサーロボットＩＲによって基板Ｗを受け渡しする。 The control unit 102 controls the indexer robot IR and transfers the substrate W by the indexer robot IR.
　制御部１０２は、センターロボットＣＲを制御して、センターロボットＣＲによって基板Ｗを受け渡しする。例えば、センターロボットＣＲは、未処理の基板Ｗを受け取って、複数のチャンバー１１のうちのいずれかに基板Ｗを搬入する。また、センターロボットＣＲは、処理された基板Ｗをチャンバー１１から受け取って、基板Ｗを搬出する。 The control unit 102 controls the center robot CR and transfers the substrate W by the center robot CR. For example, the central robot CR receives an unprocessed substrate W and carries the substrate W into one of the plurality of chambers 11. Moreover, the center robot CR receives the processed substrate W from the chamber 11 and carries out the substrate W.
　制御部１０２は、基板保持部２０を制御して、基板Ｗの回転の開始、回転速度の変更および基板Ｗの回転の停止を制御する。例えば、制御部１０２は、基板保持部２０を制御して、基板保持部２０の回転速度を変更することができる。具体的には、制御部１０２は、基板保持部２０の電動モーター２４の回転速度を変更することによって、基板Ｗの回転速度を変更できる。 The control unit 102 controls the substrate holding unit 20 to start the rotation of the substrate W, change the rotation speed, and stop the rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 24 of the substrate holding unit 20.
　制御部１０２は、処理液供給部３０のバルブ３６を制御して、バルブ３６の状態を開状態と閉状態とに切り替えることができる。具体的には、制御部１０２は、処理液供給部３０のバルブ３６を制御して、バルブ３６を開状態にすることによって、ノズル３４に向かって配管３２内を流れる処理液を通過させることができる。また、制御部１０２は、処理液供給部３０のバルブ３６を制御して、バルブ３６を閉状態にすることによって、ノズル３４に向かって配管３２内を流れる処理液の供給を停止させることができる。 The control unit 102 can control the valve 36 of the processing liquid supply unit 30 to switch the state of the valve 36 between an open state and a closed state. Specifically, the control unit 102 controls the valve 36 of the processing liquid supply unit 30 to open the valve 36, thereby allowing the processing liquid flowing in the pipe 32 toward the nozzle 34 to pass. can. Further, the control unit 102 can stop the supply of the processing liquid flowing in the pipe 32 toward the nozzle 34 by controlling the valve 36 of the processing liquid supply unit 30 and closing the valve 36. .
　制御部１０２は、カップ８０を制御して基板Ｗに対してカップ８０を移動させてもよい。具体的には、制御部１０２は、処理液供給部３０が基板Ｗに処理液を供給する期間にわたって基板Ｗの側方にまで鉛直上方にカップ８０を上昇させる。また、制御部１０２は、処理液供給部３０が基板Ｗに処理液を供給する期間が終了すると、基板Ｗの側方から鉛直下方にカップ８０を下降させる。 The control unit 102 may control the cup 80 to move the cup 80 relative to the substrate W. Specifically, the control unit 102 raises the cup 80 vertically upward to the side of the substrate W over a period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. Further, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 80 vertically downward from the side of the substrate W.
　コンピュータープログラムの実行により、制御部１０２は、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂとして機能する。第１供給量算出部１０２ａは、第１流量計１１２ｂの測定結果から、第１配管１１２ａを流れて貯留槽１１６に供給される第１処理液の供給量を算出する。第２供給量算出部１０２ｂは、第２流量計１１４ｂの測定結果から、第２配管１１４ａを流れて貯留槽１１６に供給される第２処理液の供給量を算出する。このため、制御部１０２は、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂを備える。 By executing the computer program, the control unit 102 functions as a first supply amount calculation unit 102a and a second supply amount calculation unit 102b. The first supply amount calculation unit 102a calculates the supply amount of the first processing liquid that flows through the first pipe 112a and is supplied to the storage tank 116 from the measurement result of the first flowmeter 112b. The second supply amount calculation unit 102b calculates the supply amount of the second processing liquid flowing through the second pipe 114a and supplied to the storage tank 116 from the measurement result of the second flowmeter 114b. For this reason, the control section 102 includes a first supply amount calculation section 102a and a second supply amount calculation section 102b.
　本実施形態の基板処理装置１００は、半導体素子を形成するために好適に用いられる。例えば、基板処理装置１００は、積層構造の半導体素子として用いられる基板Ｗを処理するために好適に利用される。半導体素子は、いわゆる３Ｄ構造のメモリ（記憶装置）である。一例として、基板Ｗは、ＮＡＮＤ型フラッシュメモリとして好適に用いられる。 The substrate processing apparatus 100 of this embodiment is suitably used for forming semiconductor elements. For example, the substrate processing apparatus 100 is suitably used to process a substrate W used as a semiconductor element having a stacked structure. The semiconductor element is a so-called 3D structured memory (storage device). As an example, the substrate W is suitably used as a NAND flash memory.
　次に、図１～図５を参照して、本実施形態の基板処理方法を説明する。図５は、本実施形態の基板処理方法のフロー図である。 Next, the substrate processing method of this embodiment will be described with reference to FIGS. 1 to 5. FIG. 5 is a flow diagram of the substrate processing method of this embodiment.
　図５に示すように、ステップＳ１１０において、第１成分液および第２成分液の供給を開始する。ここでは、第１成分液供給部１１２は、第１配管１１２ａを介して貯留槽１１６への第１成分液の供給を開始する。また、第２成分液供給部１１４は、第２配管１１４ａを介して貯留槽１１６への第２成分液の供給を開始する。 As shown in FIG. 5, in step S110, supply of the first component liquid and the second component liquid is started. Here, the first component liquid supply unit 112 starts supplying the first component liquid to the storage tank 116 via the first pipe 112a. Further, the second component liquid supply unit 114 starts supplying the second component liquid to the storage tank 116 via the second pipe 114a.
　制御部１０２は、バルブ１１２ｃおよびバルブ１１４ｃを開くように第１成分液供給部１１２および第２成分液供給部１１４を制御する。なお、第１成分液供給部１１２において貯留槽１１６に供給する予定の第１成分液の供給量、第２成分液供給部１１４において貯留槽１１６に供給する予定の第２成分液の供給量、ならびに、貯留槽１１６に供給される混合液の液量および濃度があらかじめ設定されていることが好ましい。 The control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply unit 114 to open the valve 112c and the valve 114c. Note that the supply amount of the first component liquid scheduled to be supplied to the storage tank 116 in the first component liquid supply section 112, the supply amount of the second component liquid scheduled to be supplied to the storage tank 116 in the second component liquid supply section 114, Further, it is preferable that the amount and concentration of the mixed liquid supplied to the storage tank 116 are set in advance.
　なお、第１成分液供給部１１２が第１成分液の供給を開始するタイミングは、第２成分液供給部１１４が第２成分液の供給を開始するタイミングと同じであっても、異なってもよい。また、第１成分液供給部１１２が第１成分液の供給を開始するタイミングは、第２成分液供給部１１４が第２成分液の供給を開始するタイミングよりも早くても、遅くてもよい。 Note that the timing at which the first component liquid supply section 112 starts supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply section 114 starts supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 starts supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 starts supplying the second component liquid. .
　ステップＳ１２０において、第１成分液および第２成分液の流量を測定する。第１流量計１１２ｂは、第１配管１１２ａを流れる第１成分液の流量を測定する。第２流量計１１４ｂは、第２配管１１４ａを流れる第２成分液の流量を測定する。 In step S120, the flow rates of the first component liquid and the second component liquid are measured. The first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a. The second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
　ステップＳ１３０において、第１成分液の供給量および第２成分液の供給量を算出する。第１供給量算出部１０２ａは、第１成分液の流量の測定結果に基づいて、第１成分液の供給量を算出する。第２供給量算出部１０２ｂは、第２成分液の流量の測定結果に基づいて、第２成分液の供給量を算出する。 In step S130, the supply amount of the first component liquid and the supply amount of the second component liquid are calculated. The first supply amount calculation unit 102a calculates the supply amount of the first component liquid based on the measurement result of the flow rate of the first component liquid. The second supply amount calculation unit 102b calculates the supply amount of the second component liquid based on the measurement result of the flow rate of the second component liquid.
　ステップＳ１４０において、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液供給部１１２および／または第２成分液供給部１１４を制御する。制御部１０２は、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液供給部１１２からの第１成分液の供給および／または第２成分液供給部１１４からの第２成分液の供給を制御する。 In step S140, the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the supply amount of the first component liquid and the supply amount of the second component liquid. The control unit 102 controls the supply of the first component liquid from the first component liquid supply unit 112 and/or the second component liquid supply unit 114 based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply of the second component liquid is controlled.
　例えば、第１成分液供給部１１２および第２成分液供給部１１４の少なくとも一方により、第１成分液の流量および／または第２成分液の流量を調整する。制御部１０２は、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液の流量および／または第２成分液の流量を制御する。 For example, the flow rate of the first component liquid and/or the flow rate of the second component liquid is adjusted by at least one of the first component liquid supply section 112 and the second component liquid supply section 114. The control unit 102 controls the flow rate of the first component liquid and/or the flow rate of the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid.
　一例では、第２成分液の供給量に対して第１成分液の供給量が比較的少ない場合、制御部１０２は、第１成分液の流量が増加するか、および／または、第２成分液の流量が低下するように第１成分液供給部１１２および第２成分液供給部１１４の少なくとも一方を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃの開度を増やすか、および／または、第２成分液供給部１１４のバルブ１１４ｃの開度を減らす。または、制御部１０２は、第１成分液を供給する時間を延長するか、および／または、第２成分液を供給する時間を短縮するように第１成分液供給部１１２および第２成分液供給部１１４の少なくとも一方を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃが開いている時間を増加するか、および／または、第２成分液供給部１１４のバルブ１１４ｃが開いている時間を減らす。もちろん、制御部１０２は、第１成分液供給部１１２の流量および供給時間、第２成分液供給部１１４の流量および供給時間のいずれかを調整してもよい。 In one example, when the supply amount of the first component liquid is relatively small compared to the supply amount of the second component liquid, the control unit 102 controls whether the flow rate of the first component liquid increases and/or the second component liquid At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate of the component liquid supply section 112 and the second component liquid supply section 114 is decreased. For example, the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112 and/or decreases the opening degree of the valve 114c of the second component liquid supply unit 114. Alternatively, the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to extend the time for supplying the first component liquid and/or shorten the time for supplying the second component liquid. at least one of the sections 114. For example, the control unit 102 increases the time that the valve 112c of the first component liquid supply unit 112 is open, and/or decreases the time that the valve 114c of the second component liquid supply unit 114 is open. Of course, the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
　または、第２成分液の供給量に対して第１成分液の供給量が比較的多い場合、制御部１０２は、第１成分液の流量が低下するか、および／または、第２成分液の流量が増加するように第１成分液供給部１１２および第２成分液供給部１１４の少なくとも一方を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃの開度を減らすか、および／または、第２成分液供給部１１４のバルブ１１４ｃの開度を増やす。または、制御部１０２は、第１成分液を供給する時間を短縮するか、および／または、第２成分液を供給する時間を増加するように第１成分液供給部１１２および第２成分液供給部１１４の少なくとも一方を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃが開いている時間を減らすか、および／または、第２成分液供給部１１４のバルブ１１４ｃが開いている時間を増やす。この場合も、制御部１０２は、第１成分液供給部１１２の流量および供給時間、第２成分液供給部１１４の流量および供給時間のいずれかを調整してもよい。 Alternatively, when the supply amount of the first component liquid is relatively large compared to the supply amount of the second component liquid, the control unit 102 determines whether the flow rate of the first component liquid decreases and/or the amount of the second component liquid decreases. At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate increases. For example, the control unit 102 reduces the opening degree of the valve 112c of the first component liquid supply unit 112 and/or increases the opening degree of the valve 114c of the second component liquid supply unit 114. Alternatively, the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to shorten the time for supplying the first component liquid and/or increase the time to supply the second component liquid. at least one of the sections 114. For example, the control unit 102 reduces the time that the valve 112c of the first component liquid supply unit 112 is open, and/or increases the time that the valve 114c of the second component liquid supply unit 114 is open. In this case as well, the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
　あるいは、第１成分液の供給量および第２成分液の供給量の比率を所定の範囲内に調整できない場合、制御部１０２は、第１成分液供給部１１２、第２成分液供給部１１４および基板処理ユニット１０の駆動を停止する。 Alternatively, if the ratio of the supply amount of the first component liquid and the supply amount of the second component liquid cannot be adjusted within a predetermined range, the control unit 102 controls the first component liquid supply unit 112, the second component liquid supply unit 114, and Driving of the substrate processing unit 10 is stopped.
　このように、ステップＳ１４０では、算出された第１供給量および第２供給量に基づいて第１成分液供給部１１２および第２成分液供給部１１４を制御する。本明細書においてこのような制御を算出制御工程と記載することがある。 In this way, in step S140, the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the calculated first supply amount and second supply amount. In this specification, such control may be referred to as a calculation control step.
　ステップＳ１５０において、貯留槽１１６への成分液の供給を完了するか否かを判定する。例えば、液量検知センサー（図示せず）が、貯留槽１１６内の混合液の液量を検知する。液量検知センサーは、液面センサーを含む。検知した液量が閾値よりも大きい場合、制御部１０２は、貯留槽１１６への成分液の供給を完了すると判定する。一方、検知した液量が閾値以下の場合、制御部１０２は、貯留槽１１６への成分液の供給を継続すると判定する。 In step S150, it is determined whether the supply of the component liquid to the storage tank 116 is completed. For example, a liquid amount detection sensor (not shown) detects the amount of the mixed liquid in the storage tank 116. The liquid level detection sensor includes a liquid level sensor. If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
　貯留槽１１６への成分液の供給を完了する場合（ステップＳ１５０においてＹｅｓ）、処理は、ステップＳ１６０に進む。一方、貯留槽１１６への成分液の供給を完了しない場合（ステップＳ１５０おいてＮｏ）、処理は、ステップＳ１４０に戻る。この場合、貯留槽１１６への成分液の供給が完了するまで、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液供給部１１２および／または第２成分液供給部１１４を制御する。 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160. On the other hand, if the supply of the component liquid to the storage tank 116 is not completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
　ステップＳ１６０において、第１成分液および第２成分液の供給を停止する。ここでは、第１成分液供給部１１２は、第１配管１１２ａを介して貯留槽１１６への第１成分液の供給を停止する。また、第２成分液供給部１１４は、第２配管１１４ａを介して貯留槽１１６への第２成分液の供給を停止する。 In step S160, the supply of the first component liquid and the second component liquid is stopped. Here, the first component liquid supply unit 112 stops supplying the first component liquid to the storage tank 116 via the first pipe 112a. Further, the second component liquid supply unit 114 stops supplying the second component liquid to the storage tank 116 via the second pipe 114a.
　なお、第１成分液供給部１１２が第１成分液の供給を停止するタイミングは、第２成分液供給部１１４が第２成分液の供給を停止するタイミングと同じであっても、異なってもよい。また、第１成分液供給部１１２が第１成分液の供給を停止するタイミングは、第２成分液供給部１１４が第２成分液の供給を停止するタイミングよりも早くても、遅くてもよい。 Note that the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. .
　ステップＳ１７０において、基板Ｗの処理を開始する。基板処理ユニット１０は、貯留槽１１６において第１成分液および第２成分液が混合された混合液を用いて基板Ｗの処理を開始する。処理は、ステップＳ１７２に進む。 In step S170, processing of the substrate W is started. The substrate processing unit 10 starts processing the substrate W using a mixed liquid in which the first component liquid and the second component liquid are mixed in the storage tank 116. The process advances to step S172.
　ステップＳ１７２において、貯留槽１１６内の混合液の液量が閾値よりも多いか否かを判定する。液量検知センサーが、貯留槽１１６内の混合液の液量を検知する。制御部１０２は、貯留槽１１６内の混合液の液量と閾値とを比較する。 In step S172, it is determined whether the amount of the mixed liquid in the storage tank 116 is greater than a threshold value. A liquid amount detection sensor detects the amount of the mixed liquid in the storage tank 116. The control unit 102 compares the amount of the mixed liquid in the storage tank 116 with a threshold value.
　混合液の液量が閾値よりも大きい場合（ステップＳ１７２においてＹｅｓ）、処理は、ステップＳ１８０に進む。一方、混合液の液量が閾値以下である場合（ステップＳ１７２においてＮｏ）、処理は、ステップＳ１１０に戻る。このとき、制御部１０２は、貯留槽１１６に新たに供給される混合液の液量および濃度を設定することが好ましい。 If the amount of the mixed liquid is larger than the threshold (Yes in step S172), the process proceeds to step S180. On the other hand, if the amount of the mixed liquid is less than or equal to the threshold (No in step S172), the process returns to step S110. At this time, it is preferable that the control unit 102 sets the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
　ステップＳ１８０において、貯留槽１１６内の混合液の濃度を検知する。濃度センサー１１８は、貯留槽１１６に貯留された混合液内の対象成分の濃度を検知する。 In step S180, the concentration of the mixed liquid in the storage tank 116 is detected. Concentration sensor 118 detects the concentration of the target component in the liquid mixture stored in storage tank 116 .
　ステップＳ１８２において、混合液の濃度が許容範囲にあるか否かを判定する。制御部１０２は、対象成分の濃度と記憶部１０４に記憶された許容範囲とを比較する。 In step S182, it is determined whether the concentration of the mixed liquid is within an acceptable range. The control unit 102 compares the concentration of the target component with the tolerance range stored in the storage unit 104.
　混合液の濃度が許容範囲内にない場合（ステップＳ１８２においてＮｏ）、処理は、終了する。この場合、制御部１０２は、第１成分液供給部１１２、第２成分液供給部１１４および基板処理ユニット１０の駆動を停止する。 If the concentration of the mixed liquid is not within the allowable range (No in step S182), the process ends. In this case, the control unit 102 stops driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10.
　混合液の濃度が許容範囲内にある場合（ステップＳ１８２においてＹｅｓ）、処理は、ステップＳ１８４に進む。 If the concentration of the mixed liquid is within the allowable range (Yes in step S182), the process proceeds to step S184.
　ステップＳ１８４において、貯留槽１１６内の混合液の濃度を調整するか否かを判定する。制御部１０２は、混合液内の対象成分の濃度が正常範囲内にあるか否か判定することによって貯留槽１１６内の混合液の濃度を調整するか否かを判定する。例えば、対象成分の濃度が正常範囲内にある場合、制御部１０２は、貯留槽１１６内の混合液の濃度を調整しないと判定する。混合液の濃度が正常範囲内にない場合、制御部１０２は、貯留槽１１６内の混合液の濃度を調整すると判定する。 In step S184, it is determined whether the concentration of the mixed liquid in the storage tank 116 is to be adjusted. The control unit 102 determines whether to adjust the concentration of the mixed liquid in the storage tank 116 by determining whether the concentration of the target component in the mixed liquid is within a normal range. For example, if the concentration of the target component is within the normal range, the control unit 102 determines not to adjust the concentration of the mixed liquid in the storage tank 116. If the concentration of the mixed liquid is not within the normal range, the control unit 102 determines that the concentration of the mixed liquid in the storage tank 116 should be adjusted.
　対象成分の濃度を調整しないと判定される場合（ステップＳ１８４においてＮｏ）、処理は、ステップＳ１９０に進む。一方、混合液の濃度を調整すると判定される場合（ステップＳ１８４においてＹｅｓ）、処理は、ステップＳ１１０に戻る。このとき、制御部１０２は、貯留槽１１６に新たに供給される混合液の液量および濃度を算出することが好ましい。 If it is determined that the concentration of the target component is not adjusted (No in step S184), the process proceeds to step S190. On the other hand, if it is determined that the concentration of the mixed liquid is adjusted (Yes in step S184), the process returns to step S110. At this time, it is preferable that the control unit 102 calculates the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
　なお、ステップＳ１８２およびステップＳ１８４では、濃度センサー１１８によって測定された濃度に基づいて第１成分液供給部１１２、第２成分液供給部１１４を含む基板処理装置１００を制御する。本明細書において、このように濃度センサー１１８によって測定された濃度を利用して制御する工程を検知制御工程と記載することがある。 Note that in step S182 and step S184, the substrate processing apparatus 100 including the first component liquid supply section 112 and the second component liquid supply section 114 is controlled based on the concentration measured by the concentration sensor 118. In this specification, the process of controlling using the concentration measured by the concentration sensor 118 in this manner may be referred to as a detection control process.
　ステップＳ１９０において、基板処理を終了するか否かを判定する。基板処理を終了しない場合（ステップＳ１９０おいてＮｏ）、処理は、ステップＳ１８０に戻る。その後、ステップＳ１８０において混合液の濃度を検知する。ここでは、基板処理が終了するまで、混合液の濃度が許容範囲か、および、混合液の濃度を調整するかを繰り返し判定する。一方、基板処理を終了する場合（ステップＳ１９０においてＹｅｓ）、処理は、終了する。 In step S190, it is determined whether or not to end the substrate processing. If the substrate processing is not finished (No in step S190), the process returns to step S180. Thereafter, in step S180, the concentration of the mixed liquid is detected. Here, it is repeatedly determined whether the concentration of the mixed liquid is within an allowable range and whether the concentration of the mixed liquid is to be adjusted until the substrate processing is completed. On the other hand, if the substrate processing is to be ended (Yes in step S190), the processing is ended.
　以上のようにして、本実施形態では、第１成分液および第２成分液を混合した混合液を処理液として基板Ｗを処理する。本実施形態では、第１成分液および第２成分液が貯留槽１１６に供給される間、第１成分液の流量および／または第２成分液の流量を制御する。このため、第１成分液および第２成分液が貯留槽１１６において混合されて、混合液に対する第１成分液または第２成分液における対象成分の濃度が濃度センサー１１８に検知される前に、第１成分液供給部１１２および第２成分液供給部１１４を制御できる。また、第１成分液および第２成分液が貯留槽１１６に供給されない期間では、濃度センサー１１８において検知された濃度に基づいて第１成分液供給部１１２および第２成分液供給部１１４を制御する。これにより、高精度に第１成分液供給部１１２および第２成分液供給部１１４を制御できる。 As described above, in this embodiment, the substrate W is processed using a mixed liquid obtained by mixing the first component liquid and the second component liquid as the processing liquid. In this embodiment, while the first component liquid and the second component liquid are being supplied to the storage tank 116, the flow rate of the first component liquid and/or the flow rate of the second component liquid is controlled. Therefore, before the first component liquid and the second component liquid are mixed in the storage tank 116 and the concentration of the target component in the first component liquid or the second component liquid with respect to the mixed liquid is detected by the concentration sensor 118, the first component liquid and the second component liquid are mixed in the storage tank 116. One component liquid supply section 112 and second component liquid supply section 114 can be controlled. In addition, during a period when the first component liquid and the second component liquid are not supplied to the storage tank 116, the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the concentration detected by the concentration sensor 118. . Thereby, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
　次に、図１～図６を参照して、本実施形態の基板処理装置１００を説明する。図６（ａ）および図６（ｃ）は、第１処理液の流量および第２処理液の流量の時間変化を示したグラフであり、図６（ｂ）は、貯留槽１１６内の混合液の濃度の時間変化を示すグラフである。 Next, the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 6. 6(a) and 6(c) are graphs showing time changes in the flow rate of the first processing liquid and the flow rate of the second processing liquid, and FIG. 6(b) shows the graph of the mixed liquid in the storage tank 116. 2 is a graph showing changes in concentration over time.
　図６（ａ）において、第１流量計１１２ｂは、第１成分液の流量Ｖａを測定する。ここでは、説明が過度に複雑化することを避けるために、バルブ１１２ｃの開閉に応じて第１成分液の流量Ｖａはパルス状に変化している。この場合、時間Ｔａ１においてバルブ１１２ｃを開くと、第１成分液が第１配管１１２ａを流れ始め、第１成分液の流量Ｖａが増加する。 In FIG. 6(a), the first flow meter 112b measures the flow rate Va of the first component liquid. Here, in order to avoid overly complicating the explanation, the flow rate Va of the first component liquid changes in a pulsed manner according to the opening and closing of the valve 112c. In this case, when the valve 112c is opened at time Ta1, the first component liquid starts flowing through the first pipe 112a, and the flow rate Va of the first component liquid increases.
　一方、時間Ｔａ２においてバルブ１１２ｃを閉じると、第１配管１１２ａ内の第１成分液の流れが停まり、第１成分液の流量Ｖａは低下する。このように、第１成分液は、時間Ｔａ１から時間Ｔａ２までの第１供給期間Ｐａにわたって第１配管１１２ａを流れる。 On the other hand, when the valve 112c is closed at time Ta2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. In this way, the first component liquid flows through the first pipe 112a over the first supply period Pa from time Ta1 to time Ta2.
　制御部１０２は、第１成分液の流量Ｖａの時間変化に基づいて、第１成分液の供給量Ｓａを算出する。本明細書において、第１成分液の供給量を第１供給量Ｓａと記載することがある。第１供給量算出部１０２ａは、第１成分液の流量Ｖａの時間変化に基づいて、第１供給量Ｓａを算出する。第１供給量算出部１０２ａは、第１成分液の流量Ｖａの時間変化を積分することによって第１供給量Ｓａを算出できる。例えば、第１供給量算出部１０２ａは、第１成分液の流量Ｖａを積算することによって第１供給量Ｓａを算出できる。 The control unit 102 calculates the supply amount Sa of the first component liquid based on the temporal change in the flow rate Va of the first component liquid. In this specification, the supply amount of the first component liquid may be referred to as a first supply amount Sa. The first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid. The first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid. For example, the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
　同様に、第２流量計１１４ｂは、第２成分液の流量Ｖｂを測定する。ここでは、説明が過度に複雑化することを避けるために、バルブ１１４ｃの開閉に応じて第２成分液の流量Ｖｂはパルス状に変化している。この場合、時間Ｔｂ１においてバルブ１１４ｃを開くと、第２成分液が第２配管１１４ａを流れ始め、第２成分液の流量Ｖｂが増加する。 Similarly, the second flow meter 114b measures the flow rate Vb of the second component liquid. Here, in order to avoid overly complicating the explanation, the flow rate Vb of the second component liquid changes in a pulsed manner according to the opening and closing of the valve 114c. In this case, when the valve 114c is opened at time Tb1, the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
　一方、時間Ｔｂ２においてバルブ１１４ｃを閉じると、第２配管１１４ａ内の第２成分液の流れが停まり、第２成分液の流量Ｖｂは低下する。このように、第２成分液は、時間Ｔｂ１から時間Ｔｂ２までの第２供給期間Ｐｂにわたって第２配管１１４ａを流れる。 On the other hand, when the valve 114c is closed at time Tb2, the flow of the second component liquid in the second pipe 114a stops, and the flow rate Vb of the second component liquid decreases. In this way, the second component liquid flows through the second pipe 114a over the second supply period Pb from time Tb1 to time Tb2.
　制御部１０２は、第２成分液の流量Ｖｂの時間変化に基づいて、第２成分液の供給量Ｓｂを算出する。本明細書において、第２成分液の供給量を第２供給量Ｓｂと記載することがある。第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂの時間変化に基づいて、第２供給量Ｓｂを算出する。第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂの時間変化を積分することによって第２供給量Ｓｂを算出できる。例えば、第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂを積算することによって第２供給量Ｓｂを算出できる。 The control unit 102 calculates the supply amount Sb of the second component liquid based on the temporal change in the flow rate Vb of the second component liquid. In this specification, the supply amount of the second component liquid may be referred to as a second supply amount Sb. The second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid. The second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid. For example, the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
　成分液供給期間Ｐ１は、第１供給期間Ｐａおよび第２供給期間Ｐｂを含む。成分液供給期間Ｐ１は、第１成分液および第２成分液が貯留槽１１６に供給される期間である。ここでは、成分液供給期間Ｐ１は、第１成分液および第２成分液のうちの一方が貯留槽１１６に供給されてから、第１成分液および第２成分液のうちの他方が貯留槽１１６に供給されるまでの期間を示す。なお、成分液供給期間Ｐ１は、第１成分液が貯留槽１１６に供給される期間と第２成分液が貯留槽１１６に供給される期間との間に第１成分液および第２成分液のいずれも貯留槽１１６に供給されない期間を含んでもよい。また、成分液供給期間Ｐ１は、第１成分液および第２成分液のうちの一方が貯留槽１１６に供給された後で第１成分液および第２成分液のいずれも貯留槽１１６に供給されない期間を含んでもよい。 The component liquid supply period P1 includes a first supply period Pa and a second supply period Pb. The component liquid supply period P1 is a period during which the first component liquid and the second component liquid are supplied to the storage tank 116. Here, during the component liquid supply period P1, one of the first component liquid and the second component liquid is supplied to the storage tank 116, and then the other of the first component liquid and the second component liquid is supplied to the storage tank 116. This indicates the period until the supply is completed. Note that the component liquid supply period P1 is a period in which the first component liquid and the second component liquid are supplied between the period when the first component liquid is supplied to the storage tank 116 and the period when the second component liquid is supplied to the storage tank 116. Either may include a period in which the water is not supplied to the storage tank 116. Further, during the component liquid supply period P1, after one of the first component liquid and the second component liquid is supplied to the storage tank 116, neither the first component liquid nor the second component liquid is supplied to the storage tank 116. It may also include a period.
　なお、成分液供給期間Ｐ１において貯留槽１１６には、第１成分液および第２成分液の少なくとも一方が供給される。このため、成分液供給期間Ｐ１において貯留槽１１６内の混合液の濃度および液量の少なくとも一方が変動する。 Note that at least one of the first component liquid and the second component liquid is supplied to the storage tank 116 during the component liquid supply period P1. Therefore, at least one of the concentration and the amount of the mixed liquid in the storage tank 116 changes during the component liquid supply period P1.
　成分液非供給期間Ｐ２は、第１成分液および第２成分液のいずれも貯留槽１１６に供給されない期間である。典型的には、成分液非供給期間Ｐ２は、第１供給期間Ｐａおよび第２供給期間Ｐｂのうちの遅く終了する方が終了した後にすぐに開始してもよい。ただし、成分液非供給期間Ｐ２は、第１供給期間Ｐａおよび第２供給期間Ｐｂのうちの遅く終了する方が終了した後から、所定期間経過した後に開始してもよい。 The component liquid non-supply period P2 is a period in which neither the first component liquid nor the second component liquid is supplied to the storage tank 116. Typically, the component liquid non-supply period P2 may start immediately after the later of the first supply period Pa and the second supply period Pb ends. However, the component liquid non-supply period P2 may start after a predetermined period has elapsed after the later of the first supply period Pa and the second supply period Pb ends.
　なお、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂは、成分液供給期間Ｐ１において第１供給量および第２供給量を算出できる。このため、制御部１０２は、成分液供給期間Ｐ１において、第１供給量および第２供給量に基づいて第１成分液供給部１１２および第２成分液供給部１１４を制御できる。例えば、第１供給量および第２供給量の割合が所定の値よりもずれた場合、制御部１０２は、成分液供給期間Ｐ１において、第１供給量および第２供給量に基づいて第１成分液供給部１１２および第２成分液供給部１１４を制御できる。 Note that the first supply amount calculation unit 102a and the second supply amount calculation unit 102b can calculate the first supply amount and the second supply amount in the component liquid supply period P1. Therefore, the control unit 102 can control the first component liquid supply unit 112 and the second component liquid supply unit 114 based on the first supply amount and the second supply amount during the component liquid supply period P1. For example, when the ratio of the first supply amount and the second supply amount deviates from a predetermined value, the control unit 102 controls the first component supply amount based on the first supply amount and the second supply amount during the component liquid supply period P1. The liquid supply section 112 and the second component liquid supply section 114 can be controlled.
　図６（ｂ）は、貯留槽１１６内の混合液の濃度を濃度センサー１１８で測定した測定結果の時間変化を示す。濃度センサー１１８に測定された濃度は、成分液供給期間Ｐ１ではなく成分液非供給期間Ｐ２に変化する。 FIG. 6(b) shows the change over time of the measurement results obtained by measuring the concentration of the mixed liquid in the storage tank 116 with the concentration sensor 118. The concentration measured by the concentration sensor 118 changes not during the component liquid supply period P1 but during the component liquid non-supply period P2.
　図６（ａ）と図６（ｂ）との比較から理解されるように、濃度センサー１１８は、貯留槽１１６内の混合液の濃度を測定する。典型的には、第１配管１１２ａにおける第１流量計１１２ｂから貯留槽１１６まで所定の距離があり、第２配管１１４ａにおける第２流量計１１４ｂから貯留槽１１６まで所定の距離がある。また、貯留槽１１６において第１成分液および第２成分液が混合された後で、混合液の濃度が濃度センサー１１８に測定されるまでにタイムラグがある。このため、第１供給量および第２供給量を利用することにより、貯留槽１１６内の混合液の状況を、濃度センサー１１８によって測定するよりも早く取得できる。 As understood from a comparison between FIG. 6(a) and FIG. 6(b), the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116. Typically, there is a predetermined distance from the first flow meter 112b in the first pipe 112a to the storage tank 116, and there is a predetermined distance from the second flow meter 114b to the storage tank 116 in the second pipe 114a. Further, after the first component liquid and the second component liquid are mixed in the storage tank 116, there is a time lag before the concentration of the mixed liquid is measured by the concentration sensor 118. Therefore, by using the first supply amount and the second supply amount, the situation of the mixed liquid in the storage tank 116 can be obtained more quickly than when the concentration sensor 118 measures it.
　なお、図６（ａ）では、第１供給期間Ｐａおよび第２供給期間Ｐｂは重なっていないが、本実施形態はこれに限定されない。 Note that in FIG. 6(a), the first supply period Pa and the second supply period Pb do not overlap, but the present embodiment is not limited to this.
　図６（ｃ）に示すように、第１供給期間Ｐａおよび第２供給期間Ｐｂは重なってもよい。例えば、第１供給期間Ｐａは、第２供給期間Ｐｂと同じタイミングで開始し、第２供給期間Ｐｂと同じタイミングで終了してもよい。この場合、時間Ｔｃ１においてバルブ１１２ｃを開くと、第１成分液が第１配管１１２ａを流れ始め、第１成分液の流量Ｖａが増加する。また、時間Ｔｃ１においてバルブ１１２ｃとともにバルブ１１４ｃを開くと、第２成分液が第２配管１１４ａを流れ始め、第２成分液の流量Ｖｂが増加する。 As shown in FIG. 6(c), the first supply period Pa and the second supply period Pb may overlap. For example, the first supply period Pa may start at the same timing as the second supply period Pb, and may end at the same timing as the second supply period Pb. In this case, when the valve 112c is opened at time Tc1, the first component liquid starts flowing through the first pipe 112a, and the flow rate Va of the first component liquid increases. Further, when the valve 112c and the valve 114c are opened at time Tc1, the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
　一方、時間Ｔｃ２においてバルブ１１２ｃを閉じると、第１配管１１２ａ内の第１成分液の流れが停まり、第１成分液の流量Ｖａは低下する。また、時間Ｔｃ２においてバルブ１１２ｃとともにバルブ１１４ｃを閉じると、第２配管１１４ａ内の第２成分液の流れが停まり、第２成分液の流量Ｖｂは低下する。 On the other hand, when the valve 112c is closed at time Tc2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. Further, when the valve 112c and the valve 114c are closed at time Tc2, the flow of the second component liquid in the second pipe 114a is stopped, and the flow rate Vb of the second component liquid is reduced.
　なお、図１～図６を参照した説明では、制御部１０２は、主として、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液供給部１１２および第２成分液供給部１１４を制御したが、本実施形態はこれに限定されない。制御部１０２は、貯留槽１１６内に貯留された混合液の液量および濃度、第１成分液の供給量、第２成分液の供給量に基づいて、混合液の濃度を算出してもよい。 In the explanation with reference to FIGS. 1 to 6, the control unit 102 mainly controls the first component liquid supply unit 112 and the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid. Although the liquid supply unit 114 is controlled, the present embodiment is not limited thereto. The control unit 102 may calculate the concentration of the mixed liquid based on the amount and concentration of the mixed liquid stored in the storage tank 116, the supply amount of the first component liquid, and the supply amount of the second component liquid. .
　次に、図１～図７を参照して、本実施形態の基板処理装置１００を説明する。図７は、本実施形態の基板処理方法のフロー図である。なお、図７のフロー図は、第１成分液の供給量および第２成分液の供給量から混合液の濃度を算出する点を除いて、図５に示したフロー図と同様であり、冗長を避ける目的で重複する説明を省略する。 Next, the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 7. FIG. 7 is a flow diagram of the substrate processing method of this embodiment. The flowchart in FIG. 7 is the same as the flowchart shown in FIG. 5, except that the concentration of the mixed liquid is calculated from the supply amount of the first component liquid and the supply amount of the second component liquid. Duplicate explanations will be omitted to avoid confusion.
　図７に示すように、ステップＳ１１０～ステップＳ１３０は、図５のステップＳ１１０～ステップＳ１３０と同様である。ステップＳ１３０の後、処理は、ステップＳ１３２に進む。 As shown in FIG. 7, steps S110 to S130 are similar to steps S110 to S130 in FIG. 5. After step S130, the process proceeds to step S132.
　ステップＳ１３２において、混合液の濃度を算出する。制御部１０２は、第１供給量および第２供給量に基づいて、貯留槽１１６に追加される混合液の濃度を算出してもよい。第１供給量算出部１０２ａによって算出された第１供給量、および、第２供給量算出部１０２ｂによって算出された第２供給量から、新たに追加される混合液の濃度を算出できる。本明細書において、新たに追加される混合液の濃度を追加算出濃度と記載することがある。 In step S132, the concentration of the mixed liquid is calculated. The control unit 102 may calculate the concentration of the liquid mixture added to the storage tank 116 based on the first supply amount and the second supply amount. The concentration of the newly added liquid mixture can be calculated from the first supply amount calculated by the first supply amount calculation section 102a and the second supply amount calculated by the second supply amount calculation section 102b. In this specification, the concentration of a newly added liquid mixture may be referred to as an additional calculated concentration.
　あるいは、制御部１０２は、貯留槽１１６に追加される混合液の濃度（追加算出濃度）および液量に加えて、現在の貯留槽１１６内の混合液の濃度および液量に基づいて、今回の混合液を追加した後の貯留槽１１６内の混合液の濃度を算出してもよい。次に、処理は、ステップＳ１４０に進む。ステップＳ１４０以降は、図５のステップＳ１４０以降と同様である。 Alternatively, the control unit 102 determines the current concentration and amount of the mixed liquid in the storage tank 116 based on the concentration and amount of the mixed liquid added to the storage tank 116 (additional calculated concentration) and the amount of the liquid. The concentration of the mixed liquid in the storage tank 116 after adding the mixed liquid may be calculated. Next, the process proceeds to step S140. Steps after step S140 are the same as steps after step S140 in FIG.
　本実施形態では、制御部１０２は、第１供給量算出部１０２ａによって算出された第１供給量、および、第２供給量算出部１０２ｂによって算出された第２供給量に基づいて、貯留槽１１６に追加される混合液または貯留槽１１６に追加された後の混合液の濃度を算出できる。これにより、貯留槽１１６内の混合液を制御する濃度の基準を利用して、混合液を調整できる。 In this embodiment, the control unit 102 controls the storage tank 116 based on the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b. The concentration of the mixed liquid added to the storage tank 116 or the mixed liquid after being added to the storage tank 116 can be calculated. Thereby, the mixed liquid can be adjusted using the concentration standard that controls the mixed liquid in the storage tank 116.
　次に、図１～図８を参照して、本実施形態の基板処理装置１００を説明する。図８（ａ）および図８（ｂ）は、貯留槽１１６内の混合液の濃度の時間変化を示すグラフである。 Next, the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 8. FIGS. 8(a) and 8(b) are graphs showing changes in the concentration of the mixed liquid in the storage tank 116 over time.
　図８（ａ）に示すように、濃度は、目標値Ｇｖに設定される。理想的には、成分液供給期間Ｐ１において、濃度は目標値Ｇｖに維持される。ただし、実際には、濃度は、目標値Ｇｖに対して若干変動することが多い。なお、成分液供給期間Ｐ１において、目標値Ｇｖ自体が変化してもよい。 As shown in FIG. 8(a), the concentration is set to the target value Gv. Ideally, the concentration is maintained at the target value Gv during the component liquid supply period P1. However, in reality, the concentration often varies slightly with respect to the target value Gv. Note that the target value Gv itself may change during the component liquid supply period P1.
　混合液の濃度には、許容範囲が設定されている。ここでは、許容範囲は、下限閾値Ｔｈ１から上限閾値Ｔｈ２内である。混合液の濃度が下限閾値Ｔｈ１よりも低い場合、制御部１０２は、混合液の濃度を異常と判断して基板処理装置１００の駆動を停止する。また、混合液の濃度が上限閾値Ｔｈ２以上である場合も、制御部１０２は、混合液の濃度を異常と判断して基板処理装置１００の駆動を停止する。反対に、濃度が許容範囲内である場合（すなわち、濃度が、下限閾値Ｔｈ１以上であり上限閾値Ｔｈ２よりも小さい場合）、制御部１０２は、基板処理装置１００の駆動を継続する。 A permissible range is set for the concentration of the mixed liquid. Here, the allowable range is from the lower threshold Th1 to the upper threshold Th2. When the concentration of the mixed liquid is lower than the lower limit threshold Th1, the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100. Also, when the concentration of the mixed liquid is equal to or higher than the upper limit threshold Th2, the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100. On the other hand, if the concentration is within the allowable range (that is, if the concentration is greater than or equal to the lower threshold Th1 and smaller than the upper threshold Th2), the control unit 102 continues to drive the substrate processing apparatus 100.
　例えば、下限閾値Ｔｈ１および上限閾値Ｔｈ２は、目標値Ｇｖに対して所定の値だけシフトした値として設定されてもよい。 For example, the lower threshold Th1 and the upper threshold Th2 may be set as values shifted by a predetermined value with respect to the target value Gv.
　また、濃度には、正常範囲が設定されている。ここでは、正常範囲は、下限閾値Ｔｈａから上限閾値Ｔｈｂ内である。濃度が下限閾値Ｔｈａよりも低い場合、制御部１０２は、濃度が上昇するように基板処理装置１００を駆動する。また、濃度が上限閾値Ｔｈｂ以上である場合、制御部１０２は、濃度が低下するように基板処理装置１００を駆動する。 Also, a normal range is set for the concentration. Here, the normal range is from the lower limit threshold Tha to the upper limit threshold Thb. When the concentration is lower than the lower limit threshold Tha, the control unit 102 drives the substrate processing apparatus 100 so that the concentration increases. Further, when the concentration is equal to or higher than the upper limit threshold Thb, the control unit 102 drives the substrate processing apparatus 100 so that the concentration decreases.
　例えば、下限閾値Ｔｈａおよび上限閾値Ｔｈｂは、目標値Ｇｖに対して所定の値だけシフトした値として設定されてもよい。 For example, the lower threshold Tha and the upper threshold Thb may be set as values shifted by a predetermined value with respect to the target value Gv.
　貯留槽１１６に供給される第１成分液および第２成分液の流量が変動すると、貯留槽１１６内の混合液の濃度が変動する。例えば、混合液の濃度が下限閾値Ｔｈａよりも低下すると、制御部１０２は、バルブ１１２ｃの開度を変更して、混合液の濃度を増加させる。一方、混合液の濃度が上限閾値Ｔｈｂ以上になると、制御部１０２は、バルブ１１２ｃの開度を変更して、混合液の濃度を低下させる。 When the flow rates of the first component liquid and the second component liquid supplied to the storage tank 116 change, the concentration of the mixed liquid in the storage tank 116 changes. For example, when the concentration of the mixed liquid falls below the lower limit threshold Tha, the control unit 102 changes the opening degree of the valve 112c to increase the concentration of the mixed liquid. On the other hand, when the concentration of the mixed liquid becomes equal to or higher than the upper limit threshold Thb, the control unit 102 changes the opening degree of the valve 112c to reduce the concentration of the mixed liquid.
　例えば、混合液の濃度が下限閾値Ｔｈａよりも低くなると、制御部１０２は、第１配管１１２ａの開度が増加するようにバルブ１１２ｃを制御する。また、濃度が上限閾値Ｔｈｂ以上になると、制御部１０２は、第１配管１１２ａの開度が低下するようにバルブ１１２ｃを制御する。なお、バルブ１１２ｃの開度を増加した結果、濃度が目標値Ｇｖに戻る場合、制御部１０２は、バルブ１１２ｃの開度を戻すようにバルブ１１２ｃを制御してもよい。 For example, when the concentration of the mixed liquid becomes lower than the lower limit threshold Tha, the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a increases. Further, when the concentration becomes equal to or higher than the upper limit threshold Thb, the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a decreases. Note that when the concentration returns to the target value Gv as a result of increasing the opening degree of the valve 112c, the control unit 102 may control the valve 112c to return the opening degree of the valve 112c.
　図８（ｂ）に、追加算出濃度Ｃａを濃度センサー１１８によって測定された濃度Ｃｓと併せて示す。上述したように、追加算出濃度Ｃａは、新たに追加される混合液の濃度を示す。追加算出濃度Ｃａは、濃度センサー１１８によって測定された濃度Ｃｓよりも時間的に早く変動する。このため、追加算出濃度Ｃａにより、貯留槽１１６に供給される混合液の状況を速やかに把握できる。 FIG. 8(b) shows the additional calculated concentration Ca together with the concentration Cs measured by the concentration sensor 118. As described above, the additional calculated concentration Ca indicates the concentration of the newly added liquid mixture. The additional calculated concentration Ca changes temporally faster than the concentration Cs measured by the concentration sensor 118. Therefore, the situation of the mixed liquid supplied to the storage tank 116 can be quickly grasped based on the additional calculated concentration Ca.
　また、本実施形態によれば、仮に、第１供給量算出部１０２ａによって算出された第１供給量、および、第２供給量算出部１０２ｂによって算出された第２供給量から算出された濃度が、追加算出濃度Ｃａ１に示すように上限閾値Ｔｈ２を超えた場合、速やかに第１成分液供給部１１２、第２成分液供給部１１４および基板処理ユニット１０の駆動を停止できる。これにより、基板処理装置１００におけるトラブルの発生を抑制できる。 Further, according to the present embodiment, if the concentration calculated from the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b is , when the additional calculated concentration Ca1 exceeds the upper limit threshold Th2, the driving of the first component liquid supply section 112, the second component liquid supply section 114, and the substrate processing unit 10 can be immediately stopped. Thereby, occurrence of troubles in the substrate processing apparatus 100 can be suppressed.
　なお、第１供給量と第２供給量を利用して貯留槽１１６内の混合液における対象成分の濃度を算出する場合、算出した濃度（算出濃度）は、濃度センサー１１８によって検知された濃度（検知濃度）と比較することが好ましい。例えば、算出濃度と検知濃度との差が閾値よりも大きい場合、制御部１０２は、第１成分液供給部１１２、第２成分液供給部１１４および基板処理ユニット１０の駆動を停止してもよい。 Note that when calculating the concentration of the target component in the mixed liquid in the storage tank 116 using the first supply amount and the second supply amount, the calculated concentration (calculated concentration) is the concentration detected by the concentration sensor 118 ( It is preferable to compare with the detected concentration). For example, if the difference between the calculated concentration and the detected concentration is larger than a threshold value, the control unit 102 may stop driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10. .
　なお、図３に示した基板処理装置１００では、第１配管１１２ａおよび第２配管１１４ａは互いに分離されていたが、本実施形態はこれに限定されない。第１配管１１２ａは第２配管１１４ａと接続してもよい。また、図３に示した基板処理装置１００では、貯留槽１１６の混合液は、循環経路において循環されてもよい。 Note that in the substrate processing apparatus 100 shown in FIG. 3, the first pipe 112a and the second pipe 114a are separated from each other, but the present embodiment is not limited to this. The first pipe 112a may be connected to the second pipe 114a. Further, in the substrate processing apparatus 100 shown in FIG. 3, the mixed liquid in the storage tank 116 may be circulated in the circulation path.
　次に、図１～図９を参照して、本実施形態の基板処理装置１００における配管構成を説明する。図９は、本実施形態の基板処理装置１００における配管構成を示す模式図である。図９の基板処理装置１００は、主に、第１成分液供給部１１２および第２成分液供給部１１４がそれぞれ２種のバルブを有すること、第１配管１１２ａが第２配管１１４ａと接続すること、濃度センサー１１８が循環流路に配置されていること、貯留槽１１６の混合液が循環可能であること、および、処理液供給部が流量計をさらに備えるとともにバルブ３６が２種のバルブを有することを除いて、図３に示した基板処理装置１００と同様の構成を有しており、冗長を避ける目的で重複する説明を省略する。 Next, the piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 9. FIG. 9 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 in FIG. 9 mainly includes that the first component liquid supply section 112 and the second component liquid supply section 114 each have two types of valves, and that the first pipe 112a is connected to the second pipe 114a. , the concentration sensor 118 is arranged in the circulation channel, the mixed liquid in the storage tank 116 can be circulated, the processing liquid supply section further includes a flow meter, and the valve 36 has two types of valves. Except for this, it has the same configuration as the substrate processing apparatus 100 shown in FIG. 3, and redundant description will be omitted for the purpose of avoiding redundancy.
　図９に示すように、基板処理装置１００は、第１成分液供給部１１２、第２成分液供給部１１４、貯留槽１１６および濃度センサー１１８を有する。ここでは、第１成分液供給部１１２は、フッ酸を供給する。また、第２成分液供給部１１４は、希釈液を供給する。例えば、希釈液は、水または脱イオン水（Ｄｅｉｏｎｉｚｅｄ　Ｗａｔｅｒ：ＤＩＷ）を含む。 As shown in FIG. 9, the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, and a concentration sensor 118. Here, the first component liquid supply unit 112 supplies hydrofluoric acid. Further, the second component liquid supply unit 114 supplies a diluting liquid. For example, the diluent includes water or deionized water (DIW).
　第１成分液供給部１１２は、第１配管１１２ａと、第１流量計１１２ｂと、バルブ１１２ｃとを含む。第２成分液供給部１１４は、第２配管１１４ａと、第２流量計１１４ｂと、バルブ１１４ｃとを含む。 The first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c. The second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c.
　バルブ１１２ｃは、供給バルブ１１２ｃ１と、流量調整バルブ１１２ｃ２とを含む。供給バルブ１１２ｃ１および流量調整バルブ１１２ｃ２は、第１配管１１２ａに配置される。供給バルブ１１２ｃ１は、第１配管１１２ａを開放または閉塞して、貯留槽１１６に対する第１成分液の供給開始と供給停止とを切り替える。供給バルブ１１２ｃ１は、例えば、リリーフバルブである。 The valve 112c includes a supply valve 112c1 and a flow rate adjustment valve 112c2. The supply valve 112c1 and the flow rate adjustment valve 112c2 are arranged in the first pipe 112a. The supply valve 112c1 opens or closes the first pipe 112a to switch between starting and stopping the supply of the first component liquid to the storage tank 116. The supply valve 112c1 is, for example, a relief valve.
　流量調整バルブ１１２ｃ２は、第１配管１１２ａを流れる第１成分液の流量を調整する。流量調整バルブ１１２ｃ２は、例えば、モーターニードルバルブである。 The flow rate adjustment valve 112c2 adjusts the flow rate of the first component liquid flowing through the first pipe 112a. The flow rate adjustment valve 112c2 is, for example, a motor needle valve.
　バルブ１１４ｃは、供給バルブ１１４ｃ１と、流量調整バルブ１１４ｃ２とを含む。供給バルブ１１４ｃ１および流量調整バルブ１１４ｃ２は、第２配管１１４ａに配置される。供給バルブ１１４ｃ１は、第２配管１１４ａを開放または閉塞して、貯留槽１１６に対する第２成分液の供給開始と供給停止とを切り替える。供給バルブ１１４ｃ１は、例えば、リリーフバルブである。 The valve 114c includes a supply valve 114c1 and a flow rate adjustment valve 114c2. The supply valve 114c1 and the flow rate adjustment valve 114c2 are arranged in the second pipe 114a. The supply valve 114c1 opens or closes the second pipe 114a to switch between starting and stopping the supply of the second component liquid to the storage tank 116. The supply valve 114c1 is, for example, a relief valve.
　流量調整バルブ１１４ｃ２は、第２配管１１４ａを流れる第２成分液の流量を調整する。流量調整バルブ１１４ｃ２は、例えば、モーターニードルバルブである。 The flow rate adjustment valve 114c2 adjusts the flow rate of the second component liquid flowing through the second pipe 114a. The flow rate adjustment valve 114c2 is, for example, a motor needle valve.
　基板処理装置１００は、第１配管１１２ａおよび第２配管１１４ａと接続する配管１１３を有する。配管１１３は、第１配管１１２ａの一端および第２配管１１４ａの一端と接続する。第１配管１１２ａおよび第２配管１１４ａは、配管１１３の一端と接続する。 The substrate processing apparatus 100 has a pipe 113 that connects to a first pipe 112a and a second pipe 114a. Piping 113 is connected to one end of first piping 112a and one end of second piping 114a. The first pipe 112a and the second pipe 114a are connected to one end of the pipe 113.
　配管１１３には、第１成分液、第２成分液および混合液のいずれかが流れる。例えば、バルブ１１２ｃを開いてバルブ１１４ｃを閉じた場合、配管１１３には第１成分液が流れる。または、バルブ１１２ｃを閉じてバルブ１１４ｃを開いた場合、配管１１３には第２成分液が流れる。あるいは、バルブ１１２ｃおよびバルブ１１４ｃの両方を開いた場合、配管１１３には混合液が流れる。 Either the first component liquid, the second component liquid, or the mixed liquid flows through the pipe 113. For example, when the valve 112c is opened and the valve 114c is closed, the first component liquid flows into the pipe 113. Alternatively, when the valve 112c is closed and the valve 114c is opened, the second component liquid flows into the pipe 113. Alternatively, when both the valve 112c and the valve 114c are opened, the mixed liquid flows into the pipe 113.
　第１成分液は、第１配管１１２ａおよび配管１１３を介して貯留槽１１６に流れる。第２成分液は、第２配管１１４ａおよび配管１１３を介して貯留槽１１６に流れる。なお、第１成分液および第２成分液が同時に配管１１３を流れる場合、第１配管１１２ａを流れた第１成分液および第２配管１１４ａを流れた第２成分液は、配管１１３において混合される。 The first component liquid flows to the storage tank 116 via the first pipe 112a and the pipe 113. The second component liquid flows into the storage tank 116 via the second pipe 114a and the pipe 113. Note that when the first component liquid and the second component liquid flow through the pipe 113 at the same time, the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a are mixed in the pipe 113. .
　基板処理装置１００では、貯留槽１１６の混合液が循環経路において循環できる。配管１１７の一端は、貯留槽１１６と接続し、配管１１７の他端は、貯留槽１１６と接続する。これにより、貯留槽１１６の混合液は、配管１１７を介して循環できる。貯留槽１１６の混合液が循環することにより、濃度センサー１１８は、混合液の濃度を安定的に測定できる。濃度センサー１１８は、循環流路に配置される。 In the substrate processing apparatus 100, the mixed liquid in the storage tank 116 can be circulated in the circulation path. One end of the pipe 117 is connected to the storage tank 116 , and the other end of the pipe 117 is connected to the storage tank 116 . Thereby, the mixed liquid in the storage tank 116 can be circulated through the pipe 117. By circulating the mixed liquid in the storage tank 116, the concentration sensor 118 can stably measure the concentration of the mixed liquid. Concentration sensor 118 is placed in the circulation channel.
　処理液供給部３０は、配管３２、ノズル３４およびバルブ３６に加えて流量計３８を備える。詳細には、処理液供給部３０ａは、配管３２ａ、ノズル３４ａおよびバルブ３６ａに加えて流量計３８ａを備える。処理液供給部３０ｂは、配管３２ｂ、ノズル３４ｂおよびバルブ３６ｂに加えて流量計３８ｂを備える。処理液供給部３０ｃは、配管３２ｃ、ノズル３４ｃおよびバルブ３６ｃに加えて流量計３８ｃを備える。 The processing liquid supply section 30 includes a flow meter 38 in addition to a pipe 32, a nozzle 34, and a valve 36. Specifically, the processing liquid supply section 30a includes a flow meter 38a in addition to a pipe 32a, a nozzle 34a, and a valve 36a. The processing liquid supply section 30b includes a flow meter 38b in addition to a pipe 32b, a nozzle 34b, and a valve 36b. The processing liquid supply section 30c includes a flow meter 38c in addition to a pipe 32c, a nozzle 34c, and a valve 36c.
　バルブ３６ａは、供給バルブ３６ａ１と、流量調整バルブ３６ａ２とを含む。供給バルブ３６ａ１および流量調整バルブ３６ａ２は、配管３２ａに配置される。供給バルブ３６ａ１は、配管３２ａを開放または閉塞して、ノズル３４ａに対する第１成分液の供給開始と供給停止とを切り替える。供給バルブ３６ａ１は、例えば、リリーフバルブである。流量調整バルブ３６ａ２は、配管３２ａを流れる第１成分液の流量を調整する。流量調整バルブ３６ａ２は、例えば、モーターニードルバルブである。 The valve 36a includes a supply valve 36a1 and a flow rate adjustment valve 36a2. The supply valve 36a1 and the flow rate adjustment valve 36a2 are arranged in the piping 32a. The supply valve 36a1 opens or closes the pipe 32a to switch between starting and stopping the supply of the first component liquid to the nozzle 34a. The supply valve 36a1 is, for example, a relief valve. The flow rate adjustment valve 36a2 adjusts the flow rate of the first component liquid flowing through the pipe 32a. The flow rate adjustment valve 36a2 is, for example, a motor needle valve.
　同様に、バルブ３６ｂは、供給バルブ３６ｂ１と、流量調整バルブ３６ｂ２とを含む。また、バルブ３６ｃは、供給バルブ３６ｃ１と、流量調整バルブ３６ｃ２とを含む。 Similarly, the valve 36b includes a supply valve 36b1 and a flow rate adjustment valve 36b2. Further, the valve 36c includes a supply valve 36c1 and a flow rate adjustment valve 36c2.
　なお、図４および図９に示した基板処理装置１００では、第１配管１１２ａを流れる第１処理液および第２配管１１４ａを流れる第２処理液は、すべて貯留槽１１６に供給されたが、本実施形態はこれに限定されない。第１配管１１２ａを流れる第１処理液および第２配管１１４ａを流れる第２処理液は、選択的に貯留槽１１６に供給されずに廃棄されてもよい。 Note that in the substrate processing apparatus 100 shown in FIGS. 4 and 9, the first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a are all supplied to the storage tank 116; Embodiments are not limited thereto. The first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a may be selectively discarded without being supplied to the storage tank 116.
　次に、図１～図１０を参照して、本実施形態の基板処理装置１００における配管構成を説明する。図１０は、本実施形態の基板処理装置１００における配管構成を示す模式図である。なお、図１０の基板処理装置１００は、第１成分液、第２成分液および混合液を廃棄するための廃液機構をさらに備える点を除いて、図９に示した基板処理装置１００と同様の構成を有しており、冗長を避ける目的で重複する説明を省略する。 Next, the piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 10. FIG. 10 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment. Note that the substrate processing apparatus 100 in FIG. 10 is similar to the substrate processing apparatus 100 shown in FIG. 9, except that it further includes a waste liquid mechanism for discarding the first component liquid, the second component liquid, and the mixed liquid. It has a structure, and redundant explanation will be omitted for the purpose of avoiding redundancy.
　図１０に示すように、基板処理装置１００は、第１成分液供給部１１２、第２成分液供給部１１４、貯留槽１１６、配管１１７および濃度センサー１１８に加えて、廃液槽１１９をさらに備える。廃液槽１１９は、処理液キャビネット１１０内に配置される。 As shown in FIG. 10, the substrate processing apparatus 100 further includes a waste liquid tank 119 in addition to a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118. Waste liquid tank 119 is arranged within processing liquid cabinet 110 .
　廃液槽１１９には、第１成分液供給部１１２から第１成分液が流入し、第２成分液供給部１１４から第２成分液が流入する。 The first component liquid flows into the waste liquid tank 119 from the first component liquid supply section 112 , and the second component liquid flows into the waste liquid tank 119 from the second component liquid supply section 114 .
　配管１１３は、第１配管１１２ａと第２配管１１４ａとの接続点と貯留槽１１６とを連絡する。配管１１３にはバルブ１１３ａが配置される。バルブ１１３ａは、配管１１３内の流路を開閉する。バルブ１１３ａは、配管１１３の開度を調節して、配管１１３を流れる第１成分液、第２成分液および混合液のいずれかの流量を調整する。 The pipe 113 communicates the connection point between the first pipe 112a and the second pipe 114a and the storage tank 116. A valve 113a is arranged in the pipe 113. The valve 113a opens and closes the flow path within the pipe 113. The valve 113a adjusts the opening degree of the pipe 113 to adjust the flow rate of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113.
　配管１１３には、配管１１３ｄが接続される。配管１１３と配管１１３ｄとの接続箇所は、バルブ１１３ａよりも上流側に位置する。配管１１３ｄは、配管１１３と廃液槽１１９とを連絡する。配管１１３ｄにはバルブ１１３ｂが配置される。バルブ１１３ｂは、配管１１３ｄ内の流路を開閉する。バルブ１１３ｂは、配管１１３ｄの開度を調節して、配管１１３ｄを流れる第１成分液、第２成分液および混合液のいずれかの流れを調整する。 A pipe 113d is connected to the pipe 113. The connection point between the pipe 113 and the pipe 113d is located upstream of the valve 113a. Piping 113d connects piping 113 and waste liquid tank 119. A valve 113b is arranged in the pipe 113d. The valve 113b opens and closes the flow path within the pipe 113d. The valve 113b adjusts the opening degree of the pipe 113d to adjust the flow of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113d.
　貯留槽１１６の底部には、配管１１９ａが接続される。配管１１９ａにはバルブ１１９ｂが配置される。バルブ１１９ｂは、配管１１９ａ内の流路を開閉する。配管１１９ａは、貯留槽１１６と廃液槽１１９とを連絡する。 A pipe 119a is connected to the bottom of the storage tank 116. A valve 119b is arranged in the pipe 119a. Valve 119b opens and closes the flow path within piping 119a. Piping 119a connects storage tank 116 and waste liquid tank 119.
　本実施形態によれば、第１成分液、第２成分液および混合液を選択的に廃液槽１１９に流入できる。 According to this embodiment, the first component liquid, the second component liquid, and the mixed liquid can selectively flow into the waste liquid tank 119.
　なお、図６（ａ）および図６（ｃ）に示したグラフでは、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂは、矩形状に変化したが、本実施形態はこれに限定されない。実際には、バルブ１１２ｃおよびバルブ１１４ｃを閉状態から開状態に変化させると、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂは徐々に増加することがある。また、バルブ１１２ｃおよびバルブ１１４ｃを開状態から閉状態に変化させると、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂは徐々に減少することがある。この場合、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂの変化の大きい部分は、貯留槽１１６に供給せずに廃棄してもよい。 Note that in the graphs shown in FIGS. 6(a) and 6(c), the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid change into rectangular shapes, but this embodiment is limited to this. Not done. In reality, when the valves 112c and 114c are changed from the closed state to the open state, the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually increase. Further, when the valves 112c and 114c are changed from the open state to the closed state, the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually decrease. In this case, a portion where the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid have a large change may be discarded without being supplied to the storage tank 116.
　次に、図１～図１１を参照して、本実施形態の基板処理装置１００における配管構成を説明する。図１１（ａ）および図１１（ｂ）は、第１処理液および第２処理液の流量の変化を示したグラフである。 Next, the piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 11. FIGS. 11(a) and 11(b) are graphs showing changes in the flow rates of the first processing liquid and the second processing liquid.
　図１１（ａ）に示すように、第１成分液の流量Ｖａは、時間とともに変化する。ここでは、第１流量計１１２ｂは、第１成分液の流量Ｖａを測定する。バルブ１１２ｃが開くと、第１成分液の流量Ｖａは時間とともに増加する。その後、バルブ１１２ｃが完全に開くと、第１成分液の流量Ｖａはピークを示す。ここでは、第１成分液の流量Ｖａは変動する。その後、バルブ１１２ｃを閉じると、第１成分液の流量Ｖａは徐々に減少する。 As shown in FIG. 11(a), the flow rate Va of the first component liquid changes with time. Here, the first flow meter 112b measures the flow rate Va of the first component liquid. When the valve 112c opens, the flow rate Va of the first component liquid increases with time. Thereafter, when the valve 112c is completely opened, the flow rate Va of the first component liquid reaches a peak. Here, the flow rate Va of the first component liquid varies. Thereafter, when the valve 112c is closed, the flow rate Va of the first component liquid gradually decreases.
　同様に、第２成分液の流量Ｖｂは、時間とともに変化する。ここでは、第２流量計１１４ｂは、第２成分液の流量Ｖｂを測定する。バルブ１１４ｃが開くと、第２成分液の流量Ｖｂは時間とともに増加する。その後、バルブ１１４ｃが完全に開くと、第２成分液の流量Ｖｂはピークを示す。ここでは、第２成分液の流量Ｖｂは変動する。その後、バルブ１１４ｃを閉じると、第２成分液の流量Ｖｂは徐々に減少する。 Similarly, the flow rate Vb of the second component liquid changes with time. Here, the second flow meter 114b measures the flow rate Vb of the second component liquid. When the valve 114c opens, the flow rate Vb of the second component liquid increases with time. Thereafter, when the valve 114c is completely opened, the flow rate Vb of the second component liquid reaches a peak. Here, the flow rate Vb of the second component liquid varies. Thereafter, when the valve 114c is closed, the flow rate Vb of the second component liquid gradually decreases.
　なお、図１１（ａ）に示すように、制御部１０２がバルブ１１２ｃを開いても、第１成分液の流量Ｖａが速やかに立ち上がらず、制御部１０２がバルブ１１２ｃを閉じても、第１成分液の流量Ｖａが速やかに立ち下がらないことがある。同様に、制御部１０２がバルブ１１４ｃを開いても第２成分液の流量Ｖｂは速やかに立ち上がらず、制御部１０２がバルブ１１４ｃを閉じても第２成分液の流量Ｖｂが速やかに立ち下がらないことがある。 As shown in FIG. 11(a), even if the control unit 102 opens the valve 112c, the flow rate Va of the first component liquid does not rise quickly, and even if the control unit 102 closes the valve 112c, the first component liquid does not rise quickly. The liquid flow rate Va may not fall quickly. Similarly, even when the control unit 102 opens the valve 114c, the flow rate Vb of the second component liquid does not rise quickly, and even when the control unit 102 closes the valve 114c, the flow rate Vb of the second component liquid does not fall quickly. There is.
　この場合、第１供給量算出部１０２ａは、第１成分液の流量Ｖａが所定値を超えてから第１供給量としてカウントしてもよい。また、第１供給量算出部１０２ａは、制御部１０２がバルブ１１２ｃを閉じる信号を出力してから第１供給量としてカウントしなくてもよい。 In this case, the first supply amount calculation unit 102a may count the first supply amount as the first supply amount after the flow rate Va of the first component liquid exceeds a predetermined value. Further, the first supply amount calculation unit 102a does not need to count the first supply amount after the control unit 102 outputs a signal to close the valve 112c.
　同様に、第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂが所定値を超えてから第２供給量としてカウントしてもよい。また、第２供給量算出部１０２ｂは、制御部１０２がバルブ１１２ｃを閉じる信号を出力してから第２供給量としてカウントしなくてもよい。この場合、第１供給量算出部１０２ａが供給量の算出を開始するタイミングとともに、バルブ１１３ｂを閉じてバルブ１１３ａを開けてもよい。 Similarly, the second supply amount calculation unit 102b may count the second supply amount as the second supply amount after the flow rate Vb of the second component liquid exceeds a predetermined value. Further, the second supply amount calculation unit 102b does not need to count the second supply amount after the control unit 102 outputs a signal to close the valve 112c. In this case, the valve 113b may be closed and the valve 113a may be opened at the same timing when the first supply amount calculation unit 102a starts calculating the supply amount.
　図１１（ｂ）に示すように、第１供給量算出部１０２ａは、第１成分液の流量Ｖａの時間変化に基づいて、第１供給量Ｓａを算出する。第１供給量算出部１０２ａは、時間Ｔ１から時間Ｔ２までの範囲内で第１成分液の流量Ｖａの時間変化を積分することによって第１供給量Ｓａを算出できる。例えば、第１供給量算出部１０２ａは、第１成分液の流量Ｖａを積算することによって第１供給量Ｓａを算出できる。 As shown in FIG. 11(b), the first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid. The first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid within the range from time T1 to time T2. For example, the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
　同様に、第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂの時間変化に基づいて、第２供給量Ｓｂを算出する。第２供給量算出部１０２ｂは、時間Ｔ１から時間Ｔ２までの範囲内で第２成分液の流量Ｖｂの時間変化を積分することによって第２供給量Ｓｂを算出できる。例えば、第２供給量算出部１０２ｂは、第２成分液の流量Ｖｂを積算することによって第２供給量Ｓｂを算出できる。 Similarly, the second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid. The second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid within the range from time T1 to time T2. For example, the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
　このように、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂは、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂについて、ある時間Ｔ１からの値から別の時間Ｔ２までの値を、第１供給量Ｓａおよび第２供給量Ｓｂの算出の根拠としてもよい。 In this way, the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid from a value from a certain time T1 to another time T2. The value may be used as the basis for calculating the first supply amount Sa and the second supply amount Sb.
　なお、この場合、バルブ１１２ｃおよびバルブ１１４ｃが開き始めてから時間Ｔ１までの間に第１配管１１２ａを流れた第１成分液および第２配管１１４ａを流れた第２成分液は、貯留槽１１６に流れることなく廃液槽１１９に流れることになる。本明細書において、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂが第１供給量Ｓａおよび第２供給量Ｓｂの算出に用いる第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂの前において、第１成分液および第２成分液を貯留槽１１６に流すことなく廃液槽１１９に流すことをプレドレインと記載することがある。 In this case, the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a from the time when the valves 112c and 114c begin to open to the time T1 flow into the storage tank 116. The liquid will flow to the waste liquid tank 119 without any waste. In this specification, the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb. Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 before Vb is sometimes referred to as pre-drain.
　典型的には、プレドレイン時において、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂの変化が比較的大きい。このため、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂは、プレドレイン時の第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂを第１供給量Ｓａおよび第２供給量Ｓｂにカウントしないことが好ましい。例えば、プレドレイン期間は、１秒以上５秒以下である。 Typically, during pre-draining, changes in the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid are relatively large. Therefore, the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of pre-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb. For example, the pre-drain period is 1 second or more and 5 seconds or less.
　例えば、プレドレインでは、時間Ｔ１よりも前に第１成分液供給部１１２は第１成分液を第１配管１１２ａに供給する。本明細書において、第１成分液供給部１１２によるこの工程を第１成分液前供給工程と記載することがある。同様に、プレドレインでは、時間Ｔ１よりも前に第２成分液供給部１１４は第２成分液を第２配管１１４ａに供給する。本明細書において、第２成分液供給部１１４によるこの工程を第２成分液前供給工程と記載することがある。 For example, in the pre-drain, the first component liquid supply unit 112 supplies the first component liquid to the first pipe 112a before time T1. In this specification, this step by the first component liquid supply section 112 may be referred to as a first component liquid pre-supply step. Similarly, in the pre-drain, the second component liquid supply unit 114 supplies the second component liquid to the second pipe 114a before time T1. In this specification, this step by the second component liquid supply unit 114 may be referred to as a second component liquid pre-supply step.
　また、制御部１０２がバルブ１１２ｃおよびバルブ１１４ｃを閉める信号を出力した時間Ｔ２から第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂがゼロになるまでの間、第１配管１１２ａを流れる第１成分液および第２配管１１４ａを流れる第２成分液は、貯留槽１１６に流れることなく廃液槽１１９に流れる。本明細書において、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂが第１供給量Ｓａおよび第２供給量Ｓｂの算出に用いる第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂの後に、第１成分液および第２成分液を貯留槽１１６に流すことなく廃液槽１１９に流すことをポストドレインと記載することがある。 Further, from time T2 when the control unit 102 outputs a signal to close the valves 112c and 114c until the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid become zero, the first component liquid flowing through the first pipe 112a is The first component liquid and the second component liquid flowing through the second pipe 114a flow into the waste liquid tank 119 without flowing into the storage tank 116. In this specification, the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb. Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 after Vb is sometimes referred to as post-drain.
　典型的には、ポストドレイン時において、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂの変化は比較的大きい。このため、第１供給量算出部１０２ａおよび第２供給量算出部１０２ｂは、ポストドレイン時の第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂを第１供給量Ｓａおよび第２供給量Ｓｂにカウントしないことが好ましい。例えば、ポストドレイン期間は、１秒以上５秒以下である。 Typically, during post-draining, changes in the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid are relatively large. Therefore, the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of post-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb. For example, the post-drain period is greater than or equal to 1 second and less than or equal to 5 seconds.
　例えば、ポストドレインでは、時間Ｔ２よりも後に第１成分液供給部１１２からの第１成分液が第２配管１１４ａを流れる。本明細書において、このように第１成分液供給部１１２から第１成分液が流れる工程を第１成分液後供給工程と記載することがある。同様に、ポストドレインでは、時間Ｔ２よりも後に第２成分液供給部１１４からの第２成分液が第２配管１１４ａを流れる。本明細書において、このように第２成分液供給部１１４から第２成分液が流れる工程を第２成分液後供給工程と記載することがある。 For example, in the post drain, the first component liquid from the first component liquid supply section 112 flows through the second pipe 114a after time T2. In this specification, the process in which the first component liquid flows from the first component liquid supply section 112 in this manner may be referred to as a first component liquid post-supply process. Similarly, in the post drain, the second component liquid from the second component liquid supply section 114 flows through the second pipe 114a after time T2. In this specification, the process in which the second component liquid flows from the second component liquid supply section 114 in this manner may be referred to as a second component liquid post-supply process.
　次に、図１～図１２Ｂを参照して、本実施形態の基板処理装置１００における配管構成を説明する。図１２Ａおよび図１２Ｂは、本実施形態の基板処理方法のフロー図である。なお、図１２Ａおよび図１２Ｂのフロー図は、主としてプレドレインおよびポストドレインを行う点を除いて、図７に示したフロー図と同様であり、冗長を避ける目的で重複する説明を省略する。 Next, the piping configuration in the substrate processing apparatus 100 of this embodiment will be described with reference to FIGS. 1 to 12B. 12A and 12B are flowcharts of the substrate processing method of this embodiment. Note that the flowcharts in FIGS. 12A and 12B are similar to the flowchart shown in FIG. 7 except that pre-draining and post-draining are mainly performed, and redundant explanation will be omitted for the purpose of avoiding redundancy.
　図１２Ａに示すように、ステップＳ１１０ａにおいて、プレドレインを開始する。ここでは、制御部１０２は、バルブ１１３ａを閉じてバルブ１１３ｂを開ける。次に、処理は、ステップＳ１１０に進む。 As shown in FIG. 12A, pre-draining is started in step S110a. Here, the control unit 102 closes the valve 113a and opens the valve 113b. Next, the process proceeds to step S110.
　ステップＳ１１０において、第１成分液および第２成分液の供給を開始する。ここでは、第１成分液供給部１１２は、第１配管１１２ａを介して第１成分液の供給を開始する。また、第２成分液供給部１１４は、第２配管１１４ａを介して第２成分液の供給を開始する。制御部１０２は、第１成分液供給部１１２の供給バルブ１１２ｃ１および流量調整バルブ１１２ｃ２を開くとともに第２成分液供給部１１４の供給バルブ１１４ｃ１および流量調整バルブ１１４ｃ２を開く。これにより、第１成分液および第２成分液は、配管１１３ｄを介して廃液槽１１９に流れる。この場合、第１成分液が第１配管１１２ａを流れ始めるタイミングと第２成分液が第２配管１１４ａを流れ始めるタイミングを揃えることが好ましい。次に、処理は、ステップＳ１１０ｂに進む。 In step S110, supply of the first component liquid and the second component liquid is started. Here, the first component liquid supply unit 112 starts supplying the first component liquid via the first pipe 112a. Further, the second component liquid supply unit 114 starts supplying the second component liquid via the second pipe 114a. The control unit 102 opens the supply valve 112c1 and flow rate adjustment valve 112c2 of the first component liquid supply unit 112, and also opens the supply valve 114c1 and flow rate adjustment valve 114c2 of the second component liquid supply unit 114. Thereby, the first component liquid and the second component liquid flow to the waste liquid tank 119 via the pipe 113d. In this case, it is preferable to align the timing at which the first component liquid starts flowing through the first pipe 112a and the timing at which the second component liquid starts flowing through the second pipe 114a. Next, the process proceeds to step S110b.
　ステップＳ１１０ｂにおいて、第１成分液および第２成分液の流量を測定する。第１流量計１１２ｂは、第１配管１１２ａを流れる第１成分液の流量を測定する。第２流量計１１４ｂは、第２配管１１４ａを流れる第２成分液の流量を測定する。次に、処理は、ステップＳ１１０ｃに進む。 In step S110b, the flow rates of the first component liquid and the second component liquid are measured. The first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a. The second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a. Next, the process proceeds to step S110c.
　ステップＳ１１０ｃにおいて、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂが条件を満たすかを判定する。詳細には、制御部１０２は、第１成分液の流量Ｖａが閾値を超えるか否か判定する。また、制御部１０２は、第２成分液の流量Ｖｂが閾値を超えるか否か判定する。 In step S110c, it is determined whether the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions. Specifically, the control unit 102 determines whether the flow rate Va of the first component liquid exceeds a threshold value. Further, the control unit 102 determines whether the flow rate Vb of the second component liquid exceeds a threshold value.
　第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂが条件を満たす場合（ステップＳ１１０ｃにおいてＹｅｓ）、処理は、ステップＳ１１０ｅに進む。一方、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂのいずれかが条件を満たさない場合（ステップＳ１１０ｃにおいてＮｏ）、処理は、ステップＳ１１０ｄに進む。 If the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions (Yes in step S110c), the process proceeds to step S110e. On the other hand, if either the flow rate Va of the first component liquid or the flow rate Vb of the second component liquid does not satisfy the conditions (No in step S110c), the process proceeds to step S110d.
　ステップＳ１１０ｄにおいて、第１成分液の流量および第２成分液の流量に基づいて、第１成分液供給部１１２および／または第２成分液供給部１１４を制御する。例えば、第１成分液の流量が閾値よりも少ない場合、制御部１０２は、第１成分液の流量が増加するように第１成分液供給部１１２を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃの開度を増加させる。 In step S110d, the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled based on the flow rate of the first component liquid and the flow rate of the second component liquid. For example, when the flow rate of the first component liquid is less than the threshold value, the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. For example, the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
　あるいは、第２成分液の流量が閾値よりも少ない場合、制御部１０２は、第２成分液の流量が増加するように第２成分液供給部１１４を制御する。例えば、制御部１０２は、第２成分液供給部１１４のバルブ１１４ｃの開度を増加させる。次に、処理は、ステップＳ１１０ｃに戻る。これにより、第１成分液の流量Ｖａおよび第２成分液の流量Ｖｂが条件を満たすまで第１成分液供給部１１２および／または第２成分液供給部１１４が制御される。 Alternatively, when the flow rate of the second component liquid is less than the threshold value, the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114. Next, the process returns to step S110c. As a result, the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled until the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions.
　ステップＳ１１０ｅにおいて、第１成分液の流量および第２成分液の流量から配管１１３ｄを流れる混合液の濃度を算出する。例えば、制御部１０２は、第１成分液の流量および第２成分液の流量の比率に基づいて、配管１１３ｄを流れる混合液の濃度を算出する。次に、処理は、ステップＳ１１０ｆに進む。 In step S110e, the concentration of the mixed liquid flowing through the pipe 113d is calculated from the flow rate of the first component liquid and the flow rate of the second component liquid. For example, the control unit 102 calculates the concentration of the mixed liquid flowing through the pipe 113d based on the ratio of the flow rate of the first component liquid and the flow rate of the second component liquid. Next, the process proceeds to step S110f.
　ステップＳ１１０ｆにおいて、算出した濃度（算出濃度）が条件を満たすか否かを判定する。例えば、制御部１０２は、算出濃度が正常範囲内にあるか否か判定する。 In step S110f, it is determined whether the calculated density (calculated density) satisfies the condition. For example, the control unit 102 determines whether the calculated concentration is within a normal range.
　算出濃度が条件を満たす場合（ステップＳ１１０ｆにおいてＹｅｓ）、処理は、ステップＳ１１０ｈに進む。一方、算出濃度が条件を満たさない場合（ステップＳ１１０ｆにおいてＮｏ）、処理は、ステップＳ１１０ｇに進む。 If the calculated density satisfies the conditions (Yes in step S110f), the process proceeds to step S110h. On the other hand, if the calculated concentration does not satisfy the conditions (No in step S110f), the process proceeds to step S110g.
　ステップＳ１１０ｇにおいて、算出濃度に基づいて、第１成分液供給部１１２および／または第２成分液供給部１１４を制御する。一例では、第２成分液の流量に対して第１成分液の流量が比較的少ない場合、制御部１０２は、第１成分液の流量が増加するように第１成分液供給部１１２を制御する。例えば、制御部１０２は、第１成分液供給部１１２のバルブ１１２ｃの開度を増加させる。 In step S110g, the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the calculated concentration. In one example, when the flow rate of the first component liquid is relatively small compared to the flow rate of the second component liquid, the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. . For example, the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
　あるいは、第２成分液の流量に対して第１成分液の流量が比較的多い場合、制御部１０２は、第２成分液の流量が増加するように第２成分液供給部１１４を制御する。例えば、制御部１０２は、第２成分液供給部１１４のバルブ１１４ｃの開度を増加させる。次に、処理は、ステップＳ１１０ｆに戻る。これにより、配管１１３ｄを流れる混合液の濃度が条件を満たすまで第１成分液供給部１１２および／または第２成分液供給部１１４が制御される。 Alternatively, when the flow rate of the first component liquid is relatively larger than the flow rate of the second component liquid, the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114. Next, the process returns to step S110f. As a result, the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled until the concentration of the mixed liquid flowing through the pipe 113d satisfies the conditions.
　ステップＳ１１０ｈにおいて、プレドレインを終了する。ここでは、制御部１０２は、バルブ１１３ａを開けてバルブ１１３ｂを閉じる。これにより、第１成分液および第２成分液は、配管１１３を介して貯留槽１１６に流れる。次に、処理は、ステップＳ１２０に進む。ステップＳ１２０からステップＳ１５０までは図７と同様である。 In step S110h, the pre-drain is finished. Here, the control unit 102 opens the valve 113a and closes the valve 113b. Thereby, the first component liquid and the second component liquid flow into the storage tank 116 via the pipe 113. Next, the process proceeds to step S120. Steps S120 to S150 are the same as those in FIG.
　ステップＳ１５０において、貯留槽１１６への成分液の供給を完了するか否かを判定する。例えば、貯留槽１１６内の混合液の液量を検知する液量検知センサーが貯留槽１１６内の混合液の液量を検知する。検知した液量が閾値よりも大きい場合、制御部１０２は、貯留槽１１６への成分液の供給を完了すると判定する。一方、検知した液量が閾値以下の場合、制御部１０２は、貯留槽１１６への成分液の供給を継続すると判定する。 In step S150, it is determined whether the supply of the component liquid to the storage tank 116 is completed. For example, a liquid amount detection sensor that detects the amount of the mixed liquid in the storage tank 116 detects the amount of the mixed liquid in the storage tank 116 . If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
　貯留槽１１６への成分液の供給を完了する場合（ステップＳ１５０においてＹｅｓ）、処理は、ステップＳ１６０ａに進む。一方、貯留槽１１６への成分液の供給を完了する場合（ステップＳ１５０おいてＮｏ）、処理は、ステップＳ１４０に戻る。この場合、貯留槽１１６への成分液の供給が完了するまで、第１成分液の供給量および第２成分液の供給量に基づいて、第１成分液供給部１１２および／または第２成分液供給部１１４を制御する。 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160a. On the other hand, if the supply of the component liquid to the storage tank 116 is completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
　ステップＳ１６０ａにおいて、ポストドレインを開始する。ここでは、制御部１０２は、バルブ１１３ａを閉じてバルブ１１３ｂを開ける。このとき、制御部１０２ｇは、第１成分液供給部１１２のバルブ１１２ｃおよび第２成分液供給部１１４のバルブ１１４ｃを閉じるように制御してもよい。次に、処理は、ステップＳ１６０に進む。 In step S160a, post drain is started. Here, the control unit 102 closes the valve 113a and opens the valve 113b. At this time, the control section 102g may control the valve 112c of the first component liquid supply section 112 and the valve 114c of the second component liquid supply section 114 to close. Next, the process proceeds to step S160.
　ステップＳ１６０において、第１成分液および第２成分液の流れが停止する。ここでは、第１配管１１２ａを介して貯留槽１１６への第１成分液の供給が停止する。また、第２配管１１４ａを介して貯留槽１１６への第２成分液の供給が停止する。 In step S160, the flow of the first component liquid and the second component liquid is stopped. Here, the supply of the first component liquid to the storage tank 116 via the first pipe 112a is stopped. Furthermore, the supply of the second component liquid to the storage tank 116 via the second pipe 114a is stopped.
　ステップＳ１６０ｂにおいて、ポストドレインを終了する。ここでは、制御部１０２は、バルブ１１３ａおよびバルブ１１３ｂを閉じる。次に、処理は、ステップＳ１７０に進む。ステップＳ１７０からステップＳ１９０までは図７と同様である。 In step S160b, the post drain ends. Here, the control unit 102 closes the valve 113a and the valve 113b. Next, the process proceeds to step S170. Steps S170 to S190 are the same as those in FIG. 7.
　本実施形態によれば、第１成分液および第２成分液を貯留槽１１６に供給する前および後にプレドレインおよびポストドレインを行う。これにより、流量の変化が大きいプレドレイン期間およびポストドレイン期間の影響を避けて算出制御を行うため、高精度に第１成分液供給部１１２および第２成分液供給部１１４を制御できる。 According to the present embodiment, pre-draining and post-draining are performed before and after supplying the first component liquid and the second component liquid to the storage tank 116. Thereby, the calculation control is performed while avoiding the influence of the pre-drain period and the post-drain period in which the flow rate changes significantly, so that the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
　なお、図１および図２に示した基板処理装置１００では、基板処理ユニット１０は枚葉型であり、貯留槽１１６の混合液は、チャンバー１１内の基板Ｗに供給されたが、本実施形態はこれに限定されない。基板処理ユニット１０は、バッチ型であり、貯留槽１１６の混合液は、処理槽に供給されてもよい。 Note that in the substrate processing apparatus 100 shown in FIGS. 1 and 2, the substrate processing unit 10 is a single-wafer type, and the mixed liquid in the storage tank 116 is supplied to the substrate W in the chamber 11. is not limited to this. The substrate processing unit 10 is of a batch type, and the mixed liquid in the storage tank 116 may be supplied to the processing tank.
　次に、図１３を参照して、本実施形態の基板処理装置１００を説明する。図１３は、基板処理装置１００の模式図である。 Next, with reference to FIG. 13, the substrate processing apparatus 100 of this embodiment will be described. FIG. 13 is a schematic diagram of the substrate processing apparatus 100.
　図１３に示すように、基板処理装置１００は、基板処理ユニット１０として基板処理ユニット１０Ａ～１０Ｃを備える。ここでは、基板処理ユニット１０Ａ～１０Ｃは、バッチ型である。 As shown in FIG. 13, the substrate processing apparatus 100 includes substrate processing units 10A to 10C as the substrate processing unit 10. Here, the substrate processing units 10A to 10C are batch type.
　基板処理ユニット１０Ａは、処理槽４０ａと、リフター５０ａとを備える。処理槽４０ａは、基板Ｗを処理するための処理液を貯留する。処理槽４０ａに処理液として混合液が供給される。処理槽４０ａには、配管３２ａを介して貯留槽１１６の混合液が供給される。 The substrate processing unit 10A includes a processing tank 40a and a lifter 50a. The processing tank 40a stores a processing liquid for processing the substrate W. A mixed liquid is supplied as a processing liquid to the processing tank 40a. The mixed liquid in the storage tank 116 is supplied to the processing tank 40a via the pipe 32a.
　リフター５０ａは、基板Ｗを保持する。リフター５０ａによって保持された基板Ｗの主面の法線方向は水平方向に平行である。複数の基板Ｗは、水平方向に沿って一列に配列される。複数の基板Ｗは、水平方向に略平行に配列される。また、複数の基板Ｗの各々の法線は、水平方向に延びる。 The lifter 50a holds the substrate W. The normal direction of the main surface of the substrate W held by the lifter 50a is parallel to the horizontal direction. The plurality of substrates W are arranged in a line along the horizontal direction. The plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
　典型的には、リフター５０ａは、複数の基板Ｗをまとめて保持する。例えば、リフター５０ａは、基板Ｗを保持したまま鉛直方向に沿って鉛直上方または鉛直下方に移動する。 Typically, the lifter 50a holds a plurality of substrates W together. For example, the lifter 50a moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
　基板処理ユニット１０Ｂは、基板処理ユニット１０Ａと同様に、処理槽４０ｂと、リフター５０ｂとを備える。また、基板処理ユニット１０Ｃは、基板処理ユニット１０Ａと同様に、処理槽４０ｃと、リフター５０ｃとを備える。 The substrate processing unit 10B, like the substrate processing unit 10A, includes a processing tank 40b and a lifter 50b. Further, the substrate processing unit 10C includes a processing tank 40c and a lifter 50c similarly to the substrate processing unit 10A.
　本実施形態の基板処理装置１００によれば、基板処理ユニット１０がバッチ型であっても、貯留槽１１６に供給される成分液を速やかに制御できる。 According to the substrate processing apparatus 100 of this embodiment, even if the substrate processing unit 10 is a batch type, the component liquids supplied to the storage tank 116 can be quickly controlled.
　なお、図１３に示した基板処理装置１００では、基板処理ユニット１０がバッチ型であったが、本実施形態はこれに限定されない。貯留槽１１６が、バッチ型の処理槽であり、基板処理ユニット１０として兼用されてもよい。 Note that in the substrate processing apparatus 100 shown in FIG. 13, the substrate processing unit 10 is a batch type, but the present embodiment is not limited to this. The storage tank 116 is a batch type processing tank and may also be used as the substrate processing unit 10.
　次に、図１４を参照して、本実施形態の基板処理装置１００を説明する。図１４は、基板処理装置１００の模式図である。 Next, with reference to FIG. 14, the substrate processing apparatus 100 of this embodiment will be described. FIG. 14 is a schematic diagram of the substrate processing apparatus 100.
　図１４に示すように、基板処理装置１００は、基板処理ユニット１０として貯留槽１１６を備える。貯留槽１１６は、いわゆるバッチ型の処理槽として機能する。 As shown in FIG. 14, the substrate processing apparatus 100 includes a storage tank 116 as the substrate processing unit 10. The storage tank 116 functions as a so-called batch type processing tank.
　基板処理装置１００は、貯留槽１１６と、リフター６０とを備える。貯留槽１１６は、基板Ｗを処理するための処理液を貯留する。貯留槽１１６に処理液として混合液が供給される。貯留槽１１６には、第１配管１１２ａ、第２配管１１４ａおよび配管１１３を介して第１成分液および第２成分液が供給される。 The substrate processing apparatus 100 includes a storage tank 116 and a lifter 60. The storage tank 116 stores a processing liquid for processing the substrate W. A mixed liquid is supplied to the storage tank 116 as a processing liquid. The first component liquid and the second component liquid are supplied to the storage tank 116 via the first pipe 112a, the second pipe 114a, and the pipe 113.
　リフター６０は、基板Ｗを保持する。リフター６０によって保持された基板Ｗの主面の法線方向は水平方向に平行である。複数の基板Ｗは、水平方向に沿って一列に配列される。複数の基板Ｗは、水平方向に略平行に配列される。また、複数の基板Ｗの各々の法線は、水平方向に延びる。 The lifter 60 holds the substrate W. The normal direction of the main surface of the substrate W held by the lifter 60 is parallel to the horizontal direction. The plurality of substrates W are arranged in a line along the horizontal direction. The plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
　典型的には、リフター６０は、複数の基板Ｗをまとめて保持する。例えば、リフター６０は、基板Ｗを保持したまま鉛直方向に沿って鉛直上方または鉛直下方に移動する。 Typically, the lifter 60 holds a plurality of substrates W together. For example, the lifter 60 moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
　本実施形態の基板処理装置１００によれば、貯留槽１１６がバッチ型の処理槽であっても、貯留槽１１６に供給される成分液を速やかに制御できる。 According to the substrate processing apparatus 100 of this embodiment, even if the storage tank 116 is a batch type processing tank, the component liquids supplied to the storage tank 116 can be quickly controlled.
　以上、図面を参照して本発明の実施形態を説明した。ただし、本発明は、上記の実施形態に限られるものではなく、その要旨を逸脱しない範囲で種々の態様において実施することが可能である。また、上記の実施形態に開示される複数の構成要素を適宜組み合わせることによって、種々の発明の形成が可能である。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。図面は、理解しやすくするために、それぞれの構成要素を主体に模式的に示しており、図示された各構成要素の厚み、長さ、個数、間隔等は、図面作成の都合上から実際とは異なる場合もある。また、上記の実施形態で示す各構成要素の材質、形状、寸法等は一例であって、特に限定されるものではなく、本発明の効果から実質的に逸脱しない範囲で種々の変更が可能である。 The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the spirit thereof. Moreover, various inventions can be formed by appropriately combining the plurality of components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiments. Furthermore, components of different embodiments may be combined as appropriate. For ease of understanding, the drawing mainly shows each component schematically, and the thickness, length, number, spacing, etc. of each component shown in the diagram may differ from the actual one for convenience of drawing. may be different. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples, and are not particularly limited, and various changes can be made without substantially departing from the effects of the present invention. be.
　本発明は、基板処理装置および基板処理方法に好適に用いられる。 The present invention is suitably used in a substrate processing apparatus and a substrate processing method.
　　１０　　基板処理ユニット
　　１１　　チャンバー
　　２０　　基板保持部
　　３０　　処理液供給部
　１００　　基板処理装置
　１０１　　制御装置
　１０２　　制御部
　１０２ａ　第１供給量算出部
　１０２ｂ　第２供給量算出部
　１０４　　記憶部
　１１０　　処理液キャビネット
　１１２　　第１成分液供給部
　１１２ａ　第１配管
　１１２ｂ　第１流量計
　１１２ｃ　バルブ
　１１４　　第２成分液供給部
　１１４ａ　第２配管
　１１４ｂ　第２流量計
　１１４ｃ　バルブ
　１２０　　処理液ボックス
　　　Ｗ　　基板 10 Substrate processing unit 11 Chamber 20 Substrate holding section 30 Processing liquid supply section 100 Substrate processing apparatus 101 Control device 102 Control section 102a First supply amount calculation section 102b Second supply amount calculation section 104 Storage section 110 Processing liquid cabinet 112 First component Liquid supply section 112a First piping 112b First flow meter 112c Valve 114 Second component liquid supply section 114a Second piping 114b Second flow meter 114c Valve 120 Processing liquid box W Substrate

Claims (20)

  1. 　第１配管を介して第１成分液を供給する第１成分液供給部と、
    　前記第１成分液が前記第１配管を流れる流量を測定する第１流量計と、
    　第２配管を介して第２成分液を供給する第２成分液供給部と、
    　前記第２成分液が前記第２配管を流れる流量を測定する第２流量計と、
    　前記第１成分液供給部から供給される前記第１成分液と、前記第２成分液供給部から供給される前記第２成分液とが混合された混合液を貯留する貯留槽と、
    　前記貯留槽から供給された前記混合液によって基板を処理する基板処理ユニットと、
    　前記貯留槽内の前記混合液における対象成分の濃度を検知する濃度センサーと、
    　前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する制御部と
    を備え、
    　前記制御部は、
    　前記第１流量計の測定結果に基づいて前記第１成分液供給部から前記第１配管を介して前記貯留槽に供給された前記第１成分液の第１供給量を算出し、
    　前記第２流量計の測定結果に基づいて前記第２成分液供給部から前記第２配管を介して前記貯留槽に供給された前記第２成分液の第２供給量を算出し、
    　前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する期間および前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する期間の少なくとも一方の期間である成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する、基板処理装置。     a first component liquid supply section that supplies the first component liquid via the first piping;
    a first flow meter that measures the flow rate of the first component liquid flowing through the first piping;
    a second component liquid supply section that supplies the second component liquid via a second pipe;
    a second flow meter that measures the flow rate of the second component liquid flowing through the second piping;
    a storage tank that stores a mixed liquid obtained by mixing the first component liquid supplied from the first component liquid supply section and the second component liquid supplied from the second component liquid supply section;
    a substrate processing unit that processes a substrate with the mixed liquid supplied from the storage tank;
    a concentration sensor that detects the concentration of the target component in the mixed liquid in the storage tank;
    a control unit that controls the first component liquid supply unit and the second component liquid supply unit based on the detection result of the concentration sensor,
    The control unit includes:
    Calculating a first supply amount of the first component liquid supplied from the first component liquid supply unit to the storage tank via the first piping based on the measurement result of the first flowmeter;
    Calculating a second supply amount of the second component liquid supplied from the second component liquid supply unit to the storage tank via the second piping based on the measurement result of the second flowmeter;
    a period in which the first component liquid supply unit supplies the first component liquid via the first pipe and a period in which the second component liquid supply unit supplies the second component liquid via the second pipe; A substrate processing apparatus that controls the first component liquid supply section and the second component liquid supply section based on the first supply amount and the second supply amount in at least one component liquid supply period.
  2. 　前記制御部は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１配管を流れる前記第１成分液の流量および前記第２配管を流れる前記第２成分液の流量の少なくとも一方を制御する、請求項１に記載の基板処理装置。 The control unit controls the flow rate of the first component liquid flowing through the first pipe and the second component liquid flowing through the second pipe based on the first supply amount and the second supply amount during the component liquid supply period. The substrate processing apparatus according to claim 1, wherein at least one of the flow rates of the component liquids is controlled.
  3. 　前記第１成分液供給部は、前記第１配管を流れる前記第１成分液の流量を開度に応じて調整可能なバルブを含み、
    　前記第２成分液供給部は、前記第２配管を流れる前記第２成分液の流量を開度に応じて調整可能なバルブを含み、
    　前記制御部は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部の前記バルブおよび前記第２成分液供給部のバルブの少なくとも一方の開度を制御する、請求項２に記載の基板処理装置。     The first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree,
    The second component liquid supply unit includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the opening degree,
    In the component liquid supply period, the control unit controls at least one of the valve of the first component liquid supply unit and the valve of the second component liquid supply unit based on the first supply amount and the second supply amount. The substrate processing apparatus according to claim 2, wherein the opening degree of the substrate processing apparatus is controlled.
  4. 　前記制御部は、前記第１成分液供給部が前記貯留槽に前記第１成分液を供給せず、かつ、前記第２成分液供給部が前記貯留槽に前記第２成分液を供給しない成分液非供給期間において、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する、請求項１から３のいずれかに記載の基板処理装置。 The control unit is configured to control a component in which the first component liquid supply unit does not supply the first component liquid to the storage tank, and the second component liquid supply unit does not supply the second component liquid to the storage tank. 4. The substrate processing apparatus according to claim 1, wherein the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor during the liquid non-supply period.
  5. 　前記制御部は、
    　前記第１成分液供給部が前記第１配管を介して前記第１成分液を前記貯留槽に供給する第１供給期間にわたって、前記第１供給量を算出し、
    　前記第２成分液供給部が前記第２配管を介して前記第２成分液を前記貯留槽に供給する第２供給期間にわたって、前記第２供給量を算出する、請求項１から４のいずれかに記載の基板処理装置。     The control unit includes:
    Calculating the first supply amount over a first supply period in which the first component liquid supply unit supplies the first component liquid to the storage tank via the first piping,
    Any one of claims 1 to 4, wherein the second component liquid supply unit calculates the second supply amount over a second supply period for supplying the second component liquid to the storage tank via the second piping. The substrate processing apparatus described in .
  6. 　前記制御部は、
    　前記第１供給期間が開始する前に前記第１成分液が前記第１配管を介して流れ、
    　前記第１供給期間が終了した後に前記第１成分液が前記第１配管を介して流れ、
    　前記第２供給期間が開始する前に前記第２成分液が前記第２配管を介して流れ、
    　前記第２供給期間が終了した後に前記第２成分液が前記第２配管を介して流れるように、前記第１成分液供給部および前記第２成分液供給部を制御する、請求項５に記載の基板処理装置。     The control unit includes:
    Before the first supply period starts, the first component liquid flows through the first pipe,
    After the first supply period ends, the first component liquid flows through the first pipe,
    Before the second supply period starts, the second component liquid flows through the second pipe,
    6. The first component liquid supply section and the second component liquid supply section are controlled so that the second component liquid flows through the second piping after the second supply period ends. substrate processing equipment.
  7. 　前記制御部は、前記第１供給期間が前記第２供給期間と同時に開始し、前記第１供給期間が前記第２供給期間と同時に終了するように、前記第１成分液供給部および前記第２成分液供給部を制御する、請求項５または６に記載の基板処理装置。 The control unit controls the first component liquid supply unit and the second component liquid supply unit so that the first supply period starts at the same time as the second supply period, and the first supply period ends at the same time as the second supply period. The substrate processing apparatus according to claim 5 or 6, wherein the component liquid supply section is controlled.
  8. 　前記制御部は、前記第１成分液供給部による前記第１成分液の供給を前記第２成分液供給部による前記第２成分液の供給と同時に開始し、前記第１成分液供給部による前記第１成分液の供給を前記第２成分液供給部による前記第２成分液の供給と同時に停止するように、前記第１成分液供給部および前記第２成分液供給部を制御する、請求項１から７のいずれかに記載の基板処理装置。 The control unit causes the first component liquid supply unit to start supplying the first component liquid at the same time as the second component liquid supply unit starts supplying the second component liquid, and the first component liquid supply unit starts supplying the first component liquid at the same time as the second component liquid supply unit starts supplying the first component liquid by the first component liquid supply unit. The first component liquid supply section and the second component liquid supply section are controlled so that the supply of the first component liquid is stopped simultaneously with the supply of the second component liquid by the second component liquid supply section. 8. The substrate processing apparatus according to any one of 1 to 7.
  9. 　前記制御部は、前記第１供給量と前記第２供給量に基づいて前記貯留槽内の前記混合液における前記対象成分の濃度を算出した算出濃度が前記濃度センサーによって検知された前記濃度との差が閾値よりも大きい場合、前記第１成分液供給部、前記第２成分液供給部および前記基板処理ユニットの駆動を停止する、請求項１から８のいずれかに記載の基板処理装置。 The control unit is configured to determine whether the calculated concentration of the target component in the mixed liquid in the storage tank is different from the concentration detected by the concentration sensor based on the first supply amount and the second supply amount. 9. The substrate processing apparatus according to claim 1, wherein, when the difference is larger than a threshold value, driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit is stopped.
  10. 　前記第１成分液は、フッ酸を含み、
    　前記第２成分液は、希釈液を含む、請求項１から９のいずれかに記載の基板処理装置。     The first component liquid contains hydrofluoric acid,
    10. The substrate processing apparatus according to claim 1, wherein the second component liquid includes a diluent.
  11. 　第１成分液供給部が第１配管を介して貯留槽に第１成分液を供給する工程と、
    　前記第１成分液が前記第１配管を流れる流量を測定する第１流量測定工程と、
    　第２成分液供給部が第２配管を介して貯留槽に第２成分液を供給する工程と、
    　前記第２成分液が前記第２配管を流れる流量を測定する第２流量測定工程と、
    　第１成分液を供給する工程において供給された前記第１成分液と、前記第２成分液を供給する工程において供給された前記第２成分液とを前記貯留槽において混合した混合液を貯留する工程と、
    　前記貯留槽から供給された前記混合液によって基板を基板処理ユニットで処理する工程と、
    　前記貯留槽内の前記混合液に含まれる対象成分の濃度を濃度センサーで検知する工程と、
    　前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する検知制御工程と、
    　前記第１流量測定工程の測定結果に基づいて前記第１成分液供給部が第１配管を介して前記貯留槽に供給された前記第１成分液の第１供給量を算出する工程と、
    　前記第２流量測定工程の測定結果に基づいて前記第２成分液供給部が第２配管を介して前記貯留槽に供給された前記第２成分液の第２供給量を算出する工程と、
    　前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する期間および前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する期間の少なくとも一方の期間である成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する算出制御工程と
    を包含する、基板処理方法。     a step in which the first component liquid supply unit supplies the first component liquid to the storage tank via the first piping;
    a first flow rate measurement step of measuring the flow rate of the first component liquid flowing through the first pipe;
    a step in which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping;
    a second flow rate measurement step of measuring the flow rate of the second component liquid flowing through the second piping;
    A mixed liquid obtained by mixing the first component liquid supplied in the step of supplying the first component liquid and the second component liquid supplied in the step of supplying the second component liquid in the storage tank is stored. process and
    processing the substrate in a substrate processing unit with the mixed liquid supplied from the storage tank;
    a step of detecting the concentration of the target component contained in the mixed liquid in the storage tank with a concentration sensor;
    a detection control step of controlling the first component liquid supply section and the second component liquid supply section based on the detection result of the concentration sensor;
    a step in which the first component liquid supply unit calculates a first supply amount of the first component liquid supplied to the storage tank via a first pipe based on the measurement result of the first flow rate measurement step;
    a step in which the second component liquid supply section calculates a second supply amount of the second component liquid supplied to the storage tank via a second pipe based on the measurement result of the second flow rate measurement step;
    a period in which the first component liquid supply unit supplies the first component liquid via the first pipe and a period in which the second component liquid supply unit supplies the second component liquid via the second pipe; a calculation control step of controlling the first component liquid supply section and the second component liquid supply section based on the first supply amount and the second supply amount in a component liquid supply period that is at least one period; Substrate processing methods, including:
  12. 　前記算出制御工程は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１配管を流れる前記第１成分液の流量および前記第２配管を流れる前記第２成分液の流量の少なくとも一方を制御する、請求項１１に記載の基板処理方法。 The calculation control step includes determining the flow rate of the first component liquid flowing through the first pipe and the flow rate of the first component liquid flowing through the second pipe based on the first supply amount and the second supply amount during the component liquid supply period. The substrate processing method according to claim 11, wherein at least one of the flow rates of the two-component liquid is controlled.
  13. 　前記第１成分液供給部は、前記第１配管を流れる前記第１成分液の流量を開度に応じて調整可能なバルブを含み、
    　前記第２成分液供給部は、前記第２配管を流れる前記第２成分液の流量を開度に応じて調整可能なバルブを含み、
    　前記算出制御工程は、前記成分液供給期間において、前記第１供給量および前記第２供給量に基づいて、前記第１成分液供給部の前記バルブおよび前記第２成分液供給部のバルブの少なくとも一方の開度を制御する、請求項１２に記載の基板処理方法。     The first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree,
    The second component liquid supply unit includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the opening degree,
    In the calculation control step, in the component liquid supply period, based on the first supply amount and the second supply amount, at least the valve of the first component liquid supply section and the valve of the second component liquid supply section are adjusted. The substrate processing method according to claim 12, wherein one opening degree is controlled.
  14. 　前記検知制御工程は、前記第１成分液供給部が前記貯留槽に前記第１成分液を供給せず、かつ、前記第２成分液供給部が前記貯留槽に前記第２成分液を供給しない期間において、前記濃度センサーの検知結果に基づいて、前記第１成分液供給部および前記第２成分液供給部を制御する、請求項１１から１３のいずれかに記載の基板処理方法。 In the detection control step, the first component liquid supply section does not supply the first component liquid to the storage tank, and the second component liquid supply section does not supply the second component liquid to the storage tank. 14. The substrate processing method according to claim 11, wherein the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor during the period.
  15. 　前記第１供給量を算出する工程において、前記第１成分液供給部が前記第１配管を介して前記第１成分液を前記貯留槽に供給する第１供給期間にわたって、前記第１供給量を算出し、
    　前記第２供給量を算出する工程において、前記第２成分液供給部が前記第２配管を介して前記第２成分液を前記貯留槽に供給する第２供給期間にわたって、前記第２供給量を算出する、請求項１１から１４のいずれかに記載の基板処理方法。     In the step of calculating the first supply amount, the first component liquid supply section supplies the first component liquid to the storage tank via the first piping over a first supply period, and calculates the first supply amount. Calculate,
    In the step of calculating the second supply amount, the second component liquid supply unit supplies the second component liquid to the storage tank via the second piping, and calculates the second supply amount over a second supply period. The substrate processing method according to any one of claims 11 to 14, wherein the substrate processing method is calculated.
  16. 　前記第１供給期間の開始前に、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する第１成分液前供給工程と、
    　前記第１供給期間の終了後に、前記第１成分液供給部が前記第１配管を介して前記第１成分液を供給する第１成分液後供給工程と、
    　前記第２供給期間の開始前に、前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する第２成分液前供給工程と、
    　前記第２供給期間の終了後に、前記第２成分液供給部が前記第２配管を介して前記第２成分液を供給する第２成分液後供給工程と
    をさらに包含する、請求項１５に記載の基板処理方法。     a first component liquid pre-supply step in which the first component liquid supply section supplies the first component liquid via the first piping before the start of the first supply period;
    a first component liquid post-supply step in which the first component liquid supply section supplies the first component liquid via the first piping after the first supply period ends;
    a second component liquid pre-supply step in which the second component liquid supply section supplies the second component liquid via the second piping before the start of the second supply period;
    16. The method further includes a second component liquid post-supply step in which the second component liquid supply section supplies the second component liquid via the second piping after the second supply period ends. substrate processing method.
  17. 　前記第１供給量を算出する工程および前記第２供給量を算出する工程において、
    　前記第１供給期間は前記第２供給期間と同時に開始し、前記第１供給期間は前記第２供給期間と同時に終了する、請求項１５または１６に記載の基板処理方法。     In the step of calculating the first supply amount and the step of calculating the second supply amount,
    17. The substrate processing method according to claim 15 or 16, wherein the first supply period starts at the same time as the second supply period, and the first supply period ends at the same time as the second supply period.
  18. 　前記第１成分液前供給工程において前記第１成分液供給部による前記第１成分液の供給を前記第２成分液前供給工程において前記第２成分液供給部による前記第２成分液の供給と同時に開始し、
    　前記第１成分液後供給工程において前記第１成分液供給部による前記第１成分液の供給を前記第２成分液後供給工程において前記第２成分液供給部による前記第２成分液の供給と同時に停止する、請求項１６に記載の基板処理方法。     In the first component liquid pre-supply step, the first component liquid supply unit supplies the first component liquid, and in the second component liquid pre-supply process, the second component liquid supply unit supplies the second component liquid. start at the same time,
    In the first component liquid post-supply step, the first component liquid supply unit supplies the first component liquid, and in the second component liquid post-supply process, the second component liquid supply unit supplies the second component liquid. The substrate processing method according to claim 16, wherein the substrate processing method is stopped at the same time.
  19. 　前記第１供給量と前記第２供給量に基づいて前記貯留槽内の前記混合液における対象成分の濃度を算出した算出濃度が前記濃度センサーによって検知された前記濃度との差が閾値よりも大きい場合、前記第１成分液供給部、前記第２成分液供給部および前記基板処理ユニットの駆動を停止する工程をさらに包含する、請求項１１から１８のいずれかに記載の基板処理方法。 The difference between the calculated concentration of the target component in the mixed liquid in the storage tank based on the first supply amount and the second supply amount and the concentration detected by the concentration sensor is greater than a threshold value. 19. The substrate processing method according to claim 11, further comprising the step of stopping driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit.
  20. 　前記第１成分液を供給する工程において、前記第１成分液は、フッ酸を含み、
    　前記第２成分液を供給する工程において、前記第２成分液は、希釈液を含む、請求項１１から１９のいずれかに記載の基板処理方法。     In the step of supplying the first component liquid, the first component liquid contains hydrofluoric acid,
    20. The substrate processing method according to claim 11, wherein in the step of supplying the second component liquid, the second component liquid includes a diluent.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306089A (en) * 2007-06-11 2008-12-18 Panasonic Corp Immersion type cleaning device
JP2010232520A (en) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd Processing liquid feeder and method for feeding processing liquid
JP2020198357A (en) * 2019-05-31 2020-12-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306089A (en) * 2007-06-11 2008-12-18 Panasonic Corp Immersion type cleaning device
JP2010232520A (en) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd Processing liquid feeder and method for feeding processing liquid
JP2020198357A (en) * 2019-05-31 2020-12-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method

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