KR20230097965A - Apparatus for treating substrate and method for processing a substrate - Google Patents

Abstract

The present invention provides a method of processing a substrate in a plurality of chambers. In the substrate processing method, the liquid is circulated in a circulation line, and liquid processing of the substrate located in the chamber is performed through a supply line connecting the circulation line and each of the plurality of chambers, downstream of a valve installed in the supply line. The flow rate per unit time of the liquid flowing in is kept constant as a reference flow rate, but based on the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the liquid flowing upstream of the circulation line rather than the supply lines. The reference flow rate may be maintained by adjusting an upstream flow rate, which is a flow rate per unit time, or a downstream flow rate, which is a flow rate per unit time, of the liquid flowing downstream of the circulation line rather than the supply lines.

Description

Substrate processing apparatus and substrate processing method {APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR PROCESSING A SUBSTRATE}

The present invention relates to an apparatus and method for processing a substrate, and more particularly, to a substrate processing apparatus and method for liquid processing a substrate.

In general, in order to manufacture a semiconductor device, various processes such as a photo process, an etching process, an ion implantation process, and a deposition process are performed. In addition, impurities such as particles and organic contaminants are generated in the process of performing these processes. These impurities adhere to the substrate and act as defect factors that directly affect the performance and yield of semiconductor devices. The manufacturing process of a semiconductor device necessarily involves a cleaning process to remove these impurities.

When the cleaning process is performed in the chamber, the flow rate of the liquid supplied to the substrate located in the chamber must be kept constant. When an excessive flow rate of liquid is supplied to the substrate, various thin films or patterns formed on the substrate are damaged. Conversely, when an insufficient flow rate of the liquid is supplied to the substrate, impurities adhering to the substrate are not removed. When a subsequent process is performed with impurities attached to the substrate, it is impossible to smoothly process the substrate in the subsequent process.

In general, a constant pressure valve is used to maintain a constant flow rate supplied to the substrate. However, when the flow rate per unit time of the liquid flowing into the constant pressure valve increases, the pressure of the liquid delivered to the constant pressure valve increases. When the pressure of the liquid delivered to the constant pressure valve increases, damage occurs to the constant pressure valve. The static pressure valve is damaged and particles are generated, and the particles are introduced into the chamber and attached to a substrate located in the chamber. As described above, this results in defects in the substrate. In addition, when the flow rate per unit time of the liquid flowing into the constant pressure valve decreases, the pressure of the liquid delivered to the constant pressure valve decreases, making it difficult to supply an appropriate flow rate to the substrate located in the chamber. As described above, impurities attached to the substrate are not efficiently removed, resulting in defects in the substrate in a subsequent process.

An object of the present invention is to provide a substrate processing apparatus and method capable of efficiently processing a substrate.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of supplying a liquid at a constant flow rate to a substrate.

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of maintaining a constant flow rate of liquid supplied to a chamber by adjusting the flow rate per unit time of liquid in a circulation line in which the liquid circulates.

In addition, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of maintaining a constant flow rate of liquid supplied into each chamber even if the number of chambers supplied with liquid is changed.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides a method of processing a substrate in a plurality of chambers. In the substrate processing method, the liquid is circulated in a circulation line, and liquid processing of the substrate located in the chamber is performed through a supply line connecting the circulation line and each of the plurality of chambers, downstream of a valve installed in the supply line. The flow rate per unit time of the liquid flowing in is kept constant as a reference flow rate, but based on the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the liquid flowing upstream of the circulation line rather than the supply lines. The reference flow rate may be maintained by adjusting an upstream flow rate, which is a flow rate per unit time, or a downstream flow rate, which is a flow rate per unit time, of the liquid flowing downstream of the circulation line rather than the supply lines.

According to one embodiment, a pump and a first electro-pneumatic regulator are installed upstream of the circulation line to supply the liquid to the downstream of the circulation line by using fluid pressure, and the first electro-pneumatic regulator feeds back the distribution flow rate data. And the upstream flow rate can be adjusted by changing the fluid pressure supplied to the pump.

According to an embodiment, a back pressure valve whose opening rate is changed according to pressure and a second electro-pneumatic regulator are installed downstream of the circulation line, and the second electro-pneumatic regulator feeds back the distribution flow rate data and supplies it to the back pressure valve. The downstream flow rate may be adjusted by changing the pressure and changing the opening rate according to the changed pressure.

According to an embodiment, the method may include a first state in which the liquid processing is performed in at least one of the plurality of chambers and a second state in which the liquid processing is performed in relatively fewer chambers than the first state. Including, in each of the first state and the second state, the upstream flow rate or the downstream flow rate may be adjusted differently from each other.

According to one embodiment, in the second state, the fluid pressure supplied to the pump is reduced than in the first state, and the upstream flow rate in the second state may be adjusted to be smaller than the upstream flow rate in the first state. there is.

According to an embodiment, in the second state, the pressure supplied to the back pressure valve is reduced compared to the first state and the opening rate is increased, and the downstream flow rate in the second state is the downstream flow rate in the first state. can be adjusted to a greater extent.

According to an embodiment, the upstream flow rate in the second state may be adjusted to be smaller than the upstream flow rate in the first state, and the downstream flow rate in the second state may be adjusted to be greater than the downstream flow rate in the first state. there is.

According to one embodiment, the valve is a constant pressure valve, a flow meter located upstream of the constant pressure valve is installed in each of the supply lines, the distribution flow rate is measured using the flow meter, and the opening rate of the constant pressure valve is It may be kept constant while the liquid treatment of the substrate is performed.

The invention also provides a method of processing a substrate. A method of treating a substrate is a method in which a liquid supplied from a pump is supplied to a substrate located in a chamber through a supply line connecting the circulation line and a chamber while being circulated in a circulation line, and the liquid flowing downstream of a valve installed in the supply line The flow rate per unit time of is kept constant at the reference flow rate, but according to the change in the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the downstream flow rate, which is the flow rate per unit time of the liquid flowing downstream of the circulation line It is possible to maintain the reference flow rate by varying it.

According to an embodiment, the downstream flow rate may vary in proportion to a change value of the distribution flow rate.

According to an embodiment, a back pressure valve and an electro-pneumatic regulator whose opening rate is changed according to pressure are installed downstream of the circulation line, and the pneumatic regulator adjusts the pressure supplied to the back pressure valve according to a change in the distribution flow rate. and the downstream flow rate may be varied by changing the opening rate according to the changed pressure.

According to an embodiment, when the distribution flow rate changes from a first flow rate to a second flow rate having a greater flow rate per unit time than the first flow rate, the electro-pneumatic regulator adjusts the pressure supplied to the back pressure valve so that the opening rate increases. It can be changed from the first pressure to a second pressure smaller than the first pressure.

According to an embodiment, when the distribution flow rate changes from a second flow rate to a first flow rate having a smaller flow rate per unit time than the second flow rate, the electro-pneumatic regulator adjusts the pressure supplied to the back pressure valve so that the opening rate decreases. It can be changed from the second pressure to the first pressure greater than the second pressure.

According to one embodiment, the distribution flow rate may vary according to the capacity of the pump or the number of chambers supplying the liquid to the substrate.

According to one embodiment, the valve is a constant pressure valve, a flow meter located upstream of the constant pressure valve is installed in each of the supply lines, the distribution flow rate is measured by the flow meter, and the opening rate of the constant pressure valve is measured by the substrate It can be kept constant while the liquid treatment of

In addition, the present invention provides an apparatus for processing a substrate. An apparatus for processing a substrate includes a chamber in which liquid processing of a substrate is performed, a circulation line in which the liquid circulates, a supply line having a constant pressure valve installed therein, and supplying the liquid to a substrate located in the chamber, and a controller, wherein the circulation line A pump installed upstream of the circulation line and supplying the liquid from the tank to the downstream of the circulation line by using fluid pressure, and a back pressure valve installed downstream of the circulation line and changing the opening rate according to pressure wherein the supply line is connected to a position of the circulation line between a position where the pump is installed and a position where the back pressure valve is installed in the circulation line, and the controller supplies the liquid to the chamber through the supply line While, based on the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the upstream flow rate, which is the flow rate per unit time of the liquid flowing upstream of the circulation line than the supply lines or the flow rate above the supply lines The downstream flow rate, which is the flow rate per unit time of the liquid flowing downstream of the circulation line, may be adjusted to maintain the flow rate per unit time of the liquid flowing downstream of the constant pressure valve at a constant reference flow rate.

According to an embodiment, a first electromechanical regulator for adjusting the upstream flow rate based on the distribution flow rate data is further installed upstream of the circulation line, and downstream of the circulation line, the downstream flow rate based on the distribution flow rate data. A second electromechanical regulator for adjusting the may be further installed.

According to an embodiment, the number of chambers is plural, the supply line connects the circulation line and each of the plurality of chambers independently of each other, and the controller controls the first electro-pneumatic regulator to feed back the distribution flow rate data. The fluid pressure supplied to the pump is changed to adjust the upstream flow rate, the second electro-pneumatic regulator is controlled to feedback the distribution flow rate data to change the pressure supplied to the back pressure valve, and the pressure supplied to the back pressure valve is changed according to the changed pressure. The reference flow rate may be maintained by adjusting the downstream flow rate by changing the opening rate.

According to an embodiment, in a first state in which the liquid processing is performed in at least one of the plurality of chambers and in a second state in which the liquid processing is performed in a relatively smaller number of chambers than the first state, The controller may control the first electro-pneumatic regulator or the second electro-pneumatic regulator so that the upstream flow rate in the second state is smaller than the upstream flow rate in the first state.

According to an embodiment, the controller may control the first electro-pneumatic regulator or the second electro-pneumatic regulator such that the downstream flow rate in the second state is greater than the downstream flow rate in the first state.

According to one embodiment of the present invention, the substrate can be efficiently processed.

In addition, according to one embodiment of the present invention, it is possible to supply a liquid at a constant flow rate to the substrate.

In addition, according to one embodiment of the present invention, the flow rate of the liquid supplied to the chamber can be maintained constant by adjusting the flow rate per unit time of the liquid in the circulation line through which the liquid circulates.

In addition, according to one embodiment of the present invention, even if the number of chambers to which the liquid is supplied is changed, the flow rate of the liquid supplied to each chamber can be maintained constant.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a diagram schematically showing an embodiment of a substrate processing apparatus of the present invention.
FIG. 2 is a schematic view of one embodiment of the chamber of FIG. 1 .
3 is a diagram schematically showing an embodiment of a liquid supply unit.
FIG. 4 is a view schematically showing how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a first state.
FIG. 5 is a view schematically showing an embodiment in which the liquid supply unit of FIG. 3 adjusts the flow rate of the liquid supplied to the chamber in the second state.
6 and 7 are diagrams schematically showing another embodiment in which the liquid supply unit of FIG. 3 adjusts the flow rate of the liquid supplied to the chamber in the second state.
FIG. 8 is a view schematically showing another embodiment of how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a first state.
FIG. 9 is a view schematically showing another embodiment of how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a second state.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited due to the examples described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes of components in the drawings are exaggerated to emphasize a clearer explanation.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, the second element may also be termed a first element, without departing from the scope of the present invention.

In this embodiment, a process of liquid treating a substrate by supplying a liquid such as a cleaning liquid to the substrate will be described as an example. However, the present embodiment described below is not limited to a cleaning process, and may be applied to various processes for treating the substrate W using a liquid, such as an etching process, an ashing process, or a developing process.

Hereinafter, an example of the substrate processing apparatus of the present invention will be described in detail with reference to FIGS. 1 to 9 .

1 is a plan view schematically showing an embodiment of a substrate processing apparatus of the present invention. Referring to FIG. 1 , a substrate processing apparatus 1 includes an index module 10 and a treating module 20 . According to one embodiment, the index module 10 and processing module 20 are disposed along one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are disposed is defined as a first direction 2 . When viewed from above, the direction perpendicular to the first direction (2) is referred to as the second direction (4), and the direction perpendicular to the plane including both the first direction (2) and the second direction (4) is referred to as the third direction. It is defined as (6).

The index module 10 transports the substrate W from the cassette C in which the substrate W is stored to the processing module 20 that processes the substrate W. The index module 10 stores the substrate W, which has been processed in the processing module 20, into a cassette C. In addition, the index module 10 accommodates the substrate W scheduled to be processed in the processing module 20 into the cassette C. The index module 10 may have a longitudinal direction parallel to the second direction 4 . The index module 10 has a load port 120 and an index frame 140 .

A cassette (C) in which a substrate (W) is accommodated is seated in the load port 120 . The load port 120 is located on the opposite side of the processing module 20 based on the index frame 140 . The index module 10 may have a plurality of load ports 120 . A plurality of load ports 120 may be arranged in a line along the second direction 4 . The number of load ports 120 may increase or decrease depending on process efficiency and footprint conditions of the processing module 20 .

A plurality of slots (not shown) are installed in the cassette (C). Substrates W may be seated in slots (not shown). A plurality of slots (not shown) may be arranged spaced apart from each other along the third direction (6). The substrates W may be placed in slots (not shown) and accommodated in the cassette C while being horizontally disposed on the ground.

A sealed container such as a front opening unified pod (FOUP) may be used as the cassette (C). Cassette C may be placed in the load port 120 by an operator or a transportation means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. there is.

An index rail 142 and an index robot 144 are positioned inside the index frame 140 . The index rail 142 has a longitudinal direction parallel to the second direction 4 within the index frame 140 . The index robot 144 conveys the substrate W. The index robot 144 may transport the substrate W between the index module 10 and a buffer unit 220 to be described later.

The indexing robot 144 includes an indexing hand 146 . The substrate W is seated on the index hand 146 . The index hand 146 may move along the second direction 4 on the index rail 142 . Accordingly, the index hand 146 may move forward and backward along the index rail 142 . Also, the index hand 146 may rotate in the third direction 6 as an axis. Also, the index hand 146 may vertically move along the third direction 6 . The index robot 144 may include a plurality of index hands 146 . Each of the plurality of index hands 146 may be spaced apart in a vertical direction. The plurality of index hands 146 may independently move forward, backward, and rotate.

The controller 15 may control the substrate processing apparatus 1 . The controller 15 includes a process controller composed of a microprocessor (computer) that controls the substrate processing apparatus 1, a keyboard through which an operator inputs commands to manage the substrate processing apparatus 1, and the like, and substrate processing. A user interface consisting of a display or the like that visualizes and displays the operation status of the apparatus 1, a control program for executing processes executed in the substrate processing apparatus 1 under the control of a process controller, and various data and processing conditions. A storage unit in which a program for executing a process, that is, a process recipe, is stored in each constituent unit may be provided. Also, the user interface and storage may be connected to the process controller. The processing recipe may be stored in a storage medium of the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or a DVD, or a semiconductor memory such as a flash memory.

The controller 15 may control the substrate processing apparatus 1 to perform a substrate processing method described below. For example, the controller 15 may control components included in the liquid supply unit 400 to be described later to perform a substrate processing method described below.

The processing module 20 includes a buffer unit 220 , a transfer frame 240 , and a chamber 300 . The buffer unit 220 provides a buffer space in which the substrate W carried into the processing module 20 and the substrate W taken out of the processing module 20 temporarily stay. The transport frame 240 provides a transport space for transporting the substrate W between the buffer unit 220 and the chamber 300 .

The chamber 300 may perform a liquid treatment process of liquid treating the substrate W. For example, the liquid treatment process performed in the chamber 300 may be a cleaning process of cleaning the substrate W by supplying a cleaning liquid to the substrate W. According to an embodiment, chemical treatment, rinsing treatment, and drying treatment may all be performed on the substrate W within the chamber 300 . However, unlike the above-described example, a drying chamber (not shown) different from the chamber 300 is coupled to the processing module 20, chemical treatment and rinsing treatment are performed on the substrate W in the chamber 300, and drying Drying treatment may be performed in a chamber (not shown).

The buffer unit 220 may be disposed between the index frame 140 and the transport frame 240 . The buffer unit 220 may be located at one end of the transport frame 240 in the longitudinal direction. A slot (not shown) in which the substrate W is placed is installed inside the buffer unit 220 . A plurality of slots (not shown) may be installed inside the buffer unit 220 . A plurality of slots (not shown) may be spaced apart from each other along the third direction 6 . The front face and rear face of the buffer unit 220 are open. The front side may be a side facing the index frame 140, and the rear side may be a side facing the transport frame 240. The index robot 144 may approach the buffer unit 220 through the front side, and the transfer robot 244 may approach the buffer unit 220 through the rear side.

The transport frame 240 may have a longitudinal direction parallel to the first direction 2 . Chambers 300 may be disposed on the side of the transport frame 240 . The transfer frame 240 and the chamber 300 may be disposed along the second direction 4 .

According to one example, the chambers 300 are disposed on both sides of the transport frame 240, and the chambers 300 travel in the first direction 2 and the third direction 6 from one side of the transport frame 240. According to this, it can be arranged in A X B (A and B are 1 or a natural number greater than 1, respectively) array. Here, A is the number of chambers 300 arranged in a line along the first direction 2, and B is the number of chambers 300 arranged in a line along the third direction 6.

For example, when four or six chambers 300 are provided on one side of the transport frame 240, the chambers 300 may be arranged in a 2 X 2 or 3 X 2 arrangement. The number of chambers 300 may increase or decrease. Unlike the above, the chamber 300 may be provided on only one side of the transport frame 240 . In addition, the chamber 300 may be provided in a single layer on one side and both sides of the transport frame 240 .

The transport frame 240 has a guide rail 242 and a transport robot 244 . The guide rail 242 and the transfer robot 244 are located inside the transfer frame 240 . The guide rail 242 may have a longitudinal direction parallel to the first direction 2 . The transfer robot 244 may linearly move along the first direction 2 on the guide rail 242 . The transfer robot 244 transfers the substrate W between the buffer unit 220 and the chamber 300 .

The transfer robot 244 includes a transfer hand 246 on which the substrate W is placed. The transfer hand 246 may move along the first direction 2 in the guide rail 242 . Accordingly, the conveying hand 246 may move forward and backward along the guide rail 242 . In addition, the conveying hand 246 may rotate in the third direction 6 as an axis. In addition, the conveying hand 246 may vertically move along the third direction (6). The transfer robot 244 may include a plurality of transfer hands 246 . A plurality of conveying hands 246 may be provided spaced apart from each other in the vertical direction. The plurality of conveying hands 246 may move forward, backward, and rotation independently of each other.

The chamber 300 may perform a liquid treatment process. The liquid treatment process may be a cleaning process that removes process by-products or byproducts such as particles attached to the substrate W. The chamber 300 may have various structures depending on the type of process for processing the substrate (W). Alternatively, each of the chambers 300 may have the same structure as each other.

FIG. 2 is a schematic view of one embodiment of the chamber of FIG. 1 . Referring to FIG. 2 , the chamber 300 may include a housing 310 , a processing vessel 320 , a support unit 330 , and a nozzle unit 340 .

The housing 310 has an inner space. The housing 310 may have a substantially rectangular parallelepiped shape. An opening (not shown) may be formed in one side wall of the housing 310 . The opening (not shown) functions as an entrance through which the substrate W is carried into or taken out of the inner space of the housing 310 by the transfer robot 244 . The processing container 320 , the support unit 330 , and the nozzle unit 340 are located in the inner space of the housing 310 .

The processing vessel 320 has a processing space with an open top. The processing vessel 320 may be a bowl having a processing space. The processing space functions as a space in which a support unit 330 to be described later supports and rotates the substrate W. In addition, the processing space functions as a space in which the nozzle unit 340, which will be described later, supplies a liquid to the substrate W to process the substrate W.

According to one example, the processing container 320 may have a guide wall 321 and a plurality of collection containers 323 , 325 , and 327 . Respective collection containers 323, 325, and 327 separate and collect different types of liquids among liquids used for processing the substrate W. The collection containers 323 , 325 , and 327 may each have a collection space for recovering liquid used for processing the substrate W.

The guide wall 321 and the collection containers 323 , 325 , and 327 are provided in an annular ring shape surrounding the support unit 330 . When liquid is supplied to the substrate (W), the liquid scattered by rotation of the substrate (W) enters the recovery space through inlets (323a, 325a, 327a) of the recovery containers (323, 325, 327), which will be described later. can be infiltrated. Different types of liquid may be introduced into the respective collection containers 323, 325, and 327.

The treatment container 320 has a guide wall 321 , a first collection container 323 , a second collection container 325 , and a third collection container 327 . The guide wall 321 has an annular ring shape surrounding the support unit 330 . The first collection container 323 has an annular ring shape surrounding the guide wall 321 . The second collection container 325 has an annular ring shape surrounding the first collection container 323 . The third collection container 327 has an annular ring shape surrounding the second collection container 325 .

A space between the guide wall 321 and the first collection container 323 functions as a first inlet 323a through which liquid flows. A space between the first recovery container 323 and the second collection container 325 functions as a second inlet 325a through which liquid flows. A space between the second recovery container 325 and the third collection container 327 functions as a third inlet 327a through which liquid flows. The second inlet 325a may be positioned above the first inlet 323a, and the third inlet 327a may be positioned above the second inlet 325a. The liquid flowing into the first inlet 323a, the liquid flowing into the second inlet 325a, and the liquid flowing into the third inlet 327a may be different types of liquid.

A space between the lower end of the guide wall 321 and the first collection container 323 functions as a first outlet 323b through which impurities and airflow generated from the liquid are discharged. A space between the lower end of the first collection container 323 and the second collection container 325 functions as a second outlet 325b through which impurities and airflow generated from the liquid are discharged. A space between the lower end of the second collection container 325 and the third collection container 327 functions as a third outlet 327b through which impurities and airflow generated from the liquid are discharged. Impurities and airflow discharged from the first outlet 323b, the second outlet 325b, and the third outlet 327b are discharged to the outside of the chamber 300 through an exhaust unit 370 described later.

Recovery lines 323c, 325c, and 327c extending downward are connected to the bottom surfaces of the respective recovery containers 323, 325, and 327. Each of the recovery lines 323c, 325c, and 327c discharges the liquid introduced through the respective recovery containers 323, 325, and 327. The discharged liquid may be recycled in an external regeneration system (not shown) and reused.

The support unit 330 supports and rotates the substrate W in the processing space. The support unit 330 may include a spin chuck 331 , a support pin 333 , a chuck pin 335 , a rotation shaft 337 , and an actuator 339 .

When viewed from the top, the spin chuck 331 has a substantially circular upper surface. An upper surface of the spin chuck 331 may have a larger diameter than the substrate W. A plurality of support pins 333 are disposed on the upper surface of the spin chuck 331 . The plurality of support pins 333 are spaced apart from each other at regular intervals on the upper surface edge region of the spin chuck 331 . The support pin 333 supports a rear edge region of the substrate W such that the substrate W is separated from the upper surface of the spin chuck 331 by a predetermined distance.

A plurality of chuck pins 335 are disposed on the upper surface of the spin chuck 331 . The chuck pin 335 is disposed relatively farther from the center of the spin chuck 331 than the support pin 333 . When the substrate W rotates, the chuck pin 335 supports the side surface of the substrate W so as not to be displaced laterally from the original position.

The rotating shaft 337 is coupled with the spin chuck 331 . The rotating shaft 337 is coupled to the lower surface of the spin chuck 331 . The rotating shaft 337 may have a longitudinal direction parallel to the third direction 6 . The rotating shaft 337 may rotate by receiving power from the driver 339 . The rotary shaft 337 is rotated by the driver 339, and the spin chuck 331 rotates via the rotary shaft 337. The driver 339 rotates the rotating shaft 337. The actuator 339 may vary the rotation speed of the rotation shaft 337 . The driver 339 may be a motor that generates a driving force. However, it is not limited thereto, and the driver 399 may be variously modified and provided as a known device that generates a driving force.

The nozzle unit 340 supplies liquid to the substrate (W). The nozzle unit 340 supplies liquid to the substrate W supported by the support unit 330 . The liquid supplied to the substrate W by the nozzle unit 340 may vary. The nozzle unit 340 may include a support rod 341 , an arm 342 , an actuator 343 , and a supply nozzle 344 .

The support rod 341 is located in the inner space of the housing 310 . The support rod 341 may be located on the side of the processing container 320 in the inner space. The support rod 341 may have a rod shape having a longitudinal direction parallel to the third direction 6 . The support rod 341 may be rotated in the third direction 6 as an axis by an actuator 343 to be described later.

The arm 342 is coupled to the upper end of the support rod 341 . The arm 342 extends in a direction perpendicular to the longitudinal direction of the support rod 341 . A supply nozzle 344 to be described below may be fixedly coupled to the end of the arm 342 . Arm 342 can move forward and backward along its length. The arm 342 may be swing-moved by the driver 343 rotating the support rod 341 via the support rod 341 .

The driver 343 is coupled to the support rod 341 . The driver 343 is disposed on the bottom surface of the housing 310 . The driver 343 generates a driving force for rotating the support rod 341 . The driver 343 may be a known motor that generates a driving force.

The supply nozzle 344 supplies liquid to the substrate W supported by the support unit 330 . The supply nozzle 344 supplies the liquid received from the liquid supply unit 400 to be described later to the substrate W. The supply nozzle 344 may supply the same type of liquid to the substrate (W). Optionally, the supply nozzle 344 may supply different types of liquid to the substrate (W). The supply nozzle 344 is coupled to the arm 342 and can be swing-moved between a process position and a stand-by position by rotation of the arm 342 . The process position may be a position facing the substrate W supported by the support unit 330 . According to an example, the process position may be a position where the center of the supply nozzle 344 and the center of the substrate W supported by the support unit 330 face each other. The standby position may be a position where the supply nozzle 344 does not overlap the substrate W when viewed from above.

Unlike the above-described embodiment of the present invention, a plurality of supply nozzles 344 are installed on the arm 342, and the plurality of supply nozzles 344 can supply different types of liquid to the substrate W. there is. Optionally, each of the plurality of supply nozzles 344 may independently have an arm, a support rod, and an actuator, and may independently swing, forward, and backward to move between a process position and a stand-by position.

The elevating unit 350 is disposed in the inner space of the housing 310 . The lifting unit 350 adjusts the relative height between the processing container 320 and the support unit 330 . The lifting unit 350 may linearly move the processing container 320 in the third direction 6 . Accordingly, since the heights of the collection containers 323, 325, and 327 for collecting the liquid are changed according to the type of liquid supplied to the substrate W, the liquids may be separately collected. Unlike the above, the processing container 320 is fixedly installed, and the lifting unit 350 moves the support unit 330 up and down to change the relative height between the support unit 330 and the processing container 320. can

The exhaust unit 370 exhausts impurities generated in the processing space. A pressure reducing unit (not shown) is installed in the exhaust unit 370 . The exhaust unit 370 may be coupled to the bottom surface of the processing container 320 . For example, the exhaust unit 370 may be coupled to a point between the rotating shaft 337 and the inner wall of the processing container 320 on the bottom surface of the processing container 320 .

3 is a diagram schematically showing an embodiment of a liquid supply unit. Referring to FIGS. 3 and 4 , the liquid supply unit 400 supplies liquid to the chamber 300 . The liquid supply unit 400 delivers liquid to the nozzle 344 . The nozzle 344 receiving the liquid from the liquid supply unit 400 supplies the liquid to the substrate W supported by the support unit 330 . The liquid delivered to the nozzle 344 by the liquid supply unit 400 may include various types of liquid.

According to an embodiment, the liquid supply unit 400 may deliver at least one of a chemical, a rinsing liquid, and an organic solvent to the supply nozzle 344 . For example, the chemical may include diluted sulfuric acid (H ₂ SO ₄ , Diluted Sulfuric Acid Peroxide), phosphoric acid (P ₂ O ₅ ), hydrofluoric acid (HF), and ammonium hydroxide (NH ₄ OH). For example, the rinse liquid may include pure water or deionized water (DIW). For example, the organic solvent may include alcohol such as isopropyl alcohol (IPA). However, it is not limited thereto, and the liquid delivered by the liquid supply unit 400 to the supply nozzle 344 may include various known liquids. Hereinafter, for convenience of understanding, a case in which the liquid supplied from the liquid supply unit 400 to the supply nozzle 344 is an organic solvent will be described as an example. In addition, in the following, when liquid flows from one point to another point, one point through which the liquid flows is defined as an upstream, and another point through which the liquid flows is defined as a downstream.

The liquid supply unit 400 may include a tank 410 , a circulation line 420 , a pump 430 , supply lines 440 , 450 , and 460 , and a back pressure valve 470 .

Tank 410 has a storage space therein. Liquid is stored in the storage space of the tank 410 . Level sensors (not shown) may be installed in the tank 410 . Level sensors (not shown) may detect the level of the liquid stored in the storage space.

The tank 410 is connected to the first discharge line 402 . A pressure reducing member (not shown) is installed in the first discharge line 402 to drain the liquid stored in the storage space of the tank 410 to the outside of the liquid supply unit 400 .

Tank 410 is also connected to a supply source 412 . The supply source 412 supplies liquid to the tank 410 . A first valve 414, a first pressure gauge 416, and a first filter 418 may be installed in the line 411 connecting the supply source 412 and the tank 410. The first valve 414, the first pressure gauge 416, and the first filter 418 may be sequentially installed in a direction from upstream to downstream of the line 411.

The first valve 414 may be an on/off valve that opens and closes the line 411 . When the first valve 414 is opened, the liquid stored in the supply source 412 flows into the tank 410 . The first pressure gauge 416 may measure the pressure of the liquid flowing through the line 411 . The flow rate per unit time of the liquid flowing through the line 411 may be determined from the pressure measured by the first pressure gauge 416 . The first filter 418 removes impurities that may be included in the liquid flowing through the line 411 .

Although not shown, a flow meter (not shown) capable of measuring the flow rate per unit time of the liquid flowing through the line 411 may be installed in the line 411 . In addition, when the liquid supplied to the supply nozzle 344 by the liquid supply unit 400 is an organic solvent, a nitrogen supply source (not shown) may be further connected to the tank 410 . A nitrogen source (not shown) may supply nitrogen gas to the tank 410 .

The circulation line 420 is connected to the tank 410 . The circulation line 420 circulates the liquid stored in the tank 410 . A pump 430 and a back pressure valve 470 are installed in the circulation line 420 . In addition, supply lines 440, 450, and 460 are connected to the circulation line 420. The supply lines 440 , 450 , and 460 are connected to the circulation line 420 between the location where the pump 430 is installed and the location where the back pressure valve 470 is installed in the circulation line 420 .

Hereinafter, upstream and downstream of the circulation line 420 are defined based on the supply lines 440 , 450 , and 460 connected to the circulation line 420 . For example, the circulation line 420 between the pump 430 and the supply lines 440, 450, and 460 is defined as upstream of the circulation line 420, and the supply lines 440, 450, and 460 and the back pressure valve ( The circulation line 420 between 470 is defined downstream of the circulation line 420 . The liquid stored in the tank 410 may flow back to the tank 410 through the pump 430 , the supply lines 440 , 450 , and 460 , and the back pressure valve 470 .

Upstream of the circulation line 420 is a pump 430, a second discharge line 404, a heater 433, a second pressure gauge 434, a second filter 435, a second valve 436, and a third A pressure gauge 437 may be installed.

The pump 430 is installed upstream of the circulation line 420 . The pump 430 provides fluidity in the circulation line 420 so that the liquid stored in the storage space of the tank 410 flows along the circulation line 420 . According to one embodiment, the pump 430 may be a bellows type pump using fluid pressure. The flow rate per unit time of the liquid flowing upstream of the circulation line 420 can be adjusted by changing the fluid pressure supplied to the pump 430 .

The fluid pressure supplied to the pump 430 may be changed by the first electro-pneumatic regulator 432 . The first electro-pneumatic regulator 432 may change the fluid pressure supplied to the pump 430 by feeding back distribution flow rate data measured by the flow meters 442 , 452 , and 462 to be described later. For example, the first electro-pneumatic regulator 432 changes the fluid pressure supplied to the pump 430 by receiving the flow control signal transmitted from the controller 15 according to the distribution flow rate measured by the flow meters 442, 452, and 462. can make it A detailed mechanism for this will be described later.

The second discharge line 404, the heater 433, the second pressure gauge 434, the second filter 435, the second valve 436, and the third pressure gauge 437 are installed downstream of the pump 430. It can be.

The second discharge line 404 is connected to the circulation line 420 . A pressure reducing member (not shown) is installed in the second discharge line 404 to drain the liquid flowing in the circulation line 420 to the outside of the circulation line 420 .

The heater 433 heats the liquid flowing through the circulation line 420 . For example, the heater 433 heats the liquid flowing upstream of the circulation line 420 so that the liquid is heated to a temperature suitable for process requirements. Although a single heater 433 is shown in the drawing, a plurality of heaters 433 may be installed upstream of the circulation line 420 . The second pressure gauge 434 may be installed at a position adjacent to the pump 430 in the upstream of the circulation line 420 . The second pressure gauge 434 may measure the pressure of the liquid flowing upstream of the circulation line 420 . The second filter 435 removes impurities that may be included in the liquid flowing upstream of the circulation line 420 .

The second valve 436 may be an on-off valve. When the second valve 436 is opened, liquid flows from upstream of the circulation line 420 to downstream of the circulation line 420 . In contrast, when the second valve 436 is closed, the flow of liquid from upstream of the circulation line 420 to downstream of the circulation line 420 is blocked. The third pressure gauge 437 may be installed downstream of the second valve 436 .

Unlike the above, the positions of the second discharge line 404, the heater 433, the second pressure gauge 434, the second filter 435, the second valve 436, and the third pressure gauge 437 are circular. Various changes can be made within line 420.

Supply lines 440 , 450 , 460 are connected to circulation line 420 . The first supply line 440 is connected to the circulation line 420 . The first supply line 440 connects the circulation line 420 and the first chamber 300a to each other. The second supply line 450 is connected to the circulation line 420 . The second supply line 450 connects the circulation line 420 and the second chamber 300b to each other. The third supply line 460 is connected to the circulation line 420 . The third supply line 460 connects the circulation line 420 and the third chamber 300c to each other. The first supply line 440 may be connected to the circulation line 420 closer to the pump 430 than the second supply line 450 . Also, the second supply line 450 may be connected to the circulation line 420 closer to the pump 430 than the third supply line 460 .

A first flow meter 442 , a first constant pressure valve 444 , and a first supply valve 446 may be installed in the first supply line 440 . The first flow meter 442 , the first pressure control valve 444 , and the first supply valve 446 may be sequentially installed from upstream of the first supply line 440 . The first flow meter 442 may measure the flow rate of the liquid per unit time flowing through the first supply line 440 . That is, the first flow meter 442 may measure the flow rate distributed from the circulation line 420 to the first supply line 440 . Hereinafter, the flow rate per unit time of the liquid flowing upstream of the first constant pressure valve 444 to be described later among the first supply lines 440 is defined as the first distribution flow rate. According to one embodiment, the first flow meter 442 measures the first distribution flow rate and communicates the first distribution flow data to the controller 15 .

According to one embodiment, the first constant pressure valve 444 may be a constant pressure valve. The liquid passing through the first constant pressure valve 444 may have a constant flow rate. The flow rate per unit time of the liquid passing through the first constant pressure valve 444 may be constantly maintained as a reference flow rate. According to one embodiment, the liquid having a standard flow rate passing through the first pressure control valve 444 is transferred to a supply nozzle installed in the first chamber 300a.

The first supply valve 446 is provided as an on-off valve. When the first supply valve 446 is opened, the liquid circulating in the circulation line 420 is transferred to the first chamber 300a via the first supply line 440 . In contrast, when the first supply valve 446 is opened, the liquid does not flow into the first supply line 440 and continues to circulate within the circulation line 420 .

A second flow meter 452 , a second constant pressure valve 454 , and a second supply valve 456 may be installed in the second supply line 450 . A third flow meter 462 , a third constant pressure valve 464 , and a third supply valve 466 may be installed in the third supply line 460 . The second flow meter 452 and the third flow meter 462 according to an embodiment are provided identically or similarly to the first flow meter 442 described above. In addition, the second constant pressure valve 454 and the third constant pressure valve 464 are provided identically or similarly to the first constant pressure valve 444 described above. In addition, the second supply valve 456 and the third supply valve 466 are provided identically or similarly to the first supply valve 446 described above. Accordingly, the second flow meter 452, the second constant pressure valve 454, the second supply valve 456, the third flow meter 462, the third constant pressure valve 464, and the third supply valve ( 466) is omitted.

A back pressure valve 470 and a third valve 438 may be installed downstream of the circulation line 420 .

A back pressure valve 470 is installed in the circulation line 420 . According to one embodiment, the back pressure valve 470 is installed downstream of the circulation line 420 . The back pressure valve 470 may adjust the flow rate per unit time of the liquid flowing downstream of the circulation line 420 . The back pressure valve 470 according to an embodiment may be a back pressure control valve (HIBV) whose opening rate is changed according to a change in pressure. For example, as the pressure applied to the back pressure valve 470 increases, the opening rate of the back pressure valve 470 may decrease. When the opening rate of the back pressure valve 470 decreases, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 may increase. In contrast, as the pressure applied to the back pressure valve 470 decreases, the opening rate of the back pressure valve 470 may increase.

The pressure applied to the back pressure valve 470 may be changed by the second electro-pneumatic regulator 472 . The second electro-pneumatic regulator 472 may change the pressure applied to the back pressure valve 470 by feeding back distribution flow rate data measured by the flow meters 442 , 452 , and 462 . For example, the second electro-pneumatic regulator 472 receives a flow control signal transmitted from the controller 15 according to the distribution flow rate measured by the flow meters 442, 452, and 462 and changes the pressure transmitted to the back pressure valve 470. can make it A detailed mechanism for this will be described later.

The third valve 438 may be installed downstream of the back pressure valve 470 . For example, the third valve 438 may be an open/close valve. When the third valve 438 is opened, liquid is returned to the tank 410 downstream of the circulation line 420 .

In the above-described embodiment, for convenience of understanding, three supply lines 440 , 450 , and 460 are connected to the circulation line 420 as an example, but it is not limited thereto. For example, two or at least four supply lines may be connected to the circulation line 420 .

Hereinafter, a substrate processing method according to an embodiment of the present invention will be described in detail. The substrate processing method described below may be performed in the liquid supply unit 400 described above. In addition, the controller 15 may control components of the liquid supply unit 400 to perform a substrate processing method described below.

FIG. 4 is a view schematically showing how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a first state. FIG. 5 is a view schematically showing an embodiment in which the liquid supply unit of FIG. 3 adjusts the flow rate of the liquid supplied to the chamber in the second state.

The liquid supply unit 400 may supply liquid to at least one or more chambers 300 . For example, as shown in FIG. 4 , the liquid supply unit 400 may supply liquid to the three chambers 300a, 300b, and 300c. Alternatively, as shown in FIG. 5 , the liquid supply unit 400 may supply liquid to the two chambers 300a and 300b.

Hereinafter, for convenience of understanding, a state in which the liquid supply unit 400 supplies liquid to the three chambers 300a, 300b, and 300c is defined as a first state as shown in FIG. A state in which liquid is supplied to the two chambers 300a and 300b is defined as a second state. However, it is not limited thereto, and the first state means a state in which the liquid supply unit 400 supplies liquid to at least one of the plurality of chambers 300, and the second state means a state in which the liquid is supplied to at least one of the plurality of chambers 300. This means a state in which the supply unit 400 supplies liquid to relatively fewer chambers 300 than the first state among the plurality of chambers 300 .

As shown in FIG. 4 , the flow rate per unit time of the liquid flowing upstream of the circulation line 420 in the first state may be the first flow rate F1. Also, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 in the first state may be the second flow rate F2. Also, in the first state, the liquid having the first distribution flow rate FD1 may pass through the first flow meter 442 . Also, in the first state, the liquid having the second distribution flow rate FD2 may pass through the second flow meter 452 . Also, in the first state, the liquid having the third distribution flow rate FD3 may pass through the third flow meter 462 . Also, in the first state, the flow rate per unit time of the liquid passing through the first constant pressure valve 444, the second constant pressure valve 454, and the third constant pressure valve 464 may all have the reference flow rate FS.

As shown in Figure 5, the liquid supply unit 400 is the first chamber (300a), the second chamber (300b), and the third chamber (300c) of the first chamber (300a) and the second chamber (300b) In the case of the second state in which the liquid is supplied, the liquid may not flow through the third supply line 460 . When the capacity of the pump 430 is constant and the pressure of the fluid supplied to the pump 430 and the pressure applied to the back pressure valve 470 are changed from the first state to the second state without change, upstream of the circulation line 420 and the differential pressure at the downstream, the first distribution flow rate FD1′ passing through the first flow meter 442 in the second state is the first distribution flow rate FD1 passing through the first flow meter 442 in the first state can be bigger Also, the second distribution flow rate FD2′ passing through the second flow meter 452 in the second state may be greater than the second distribution flow rate FD2 passing through the second flow meter 452 in the first state.

Accordingly, the controller 15 controls the second electro-pneumatic regulator 472 to vary the first distribution flow rate FD1′ passing through the first flow meter 442 in the second state. For example, the controller 15 controls the second electro-pneumatic regulator 472 so that the first distribution flow rate FD1′ in the second state is changed to the first distribution flow rate FD1 in the first state. Also, the controller 15 controls the second electro-pneumatic regulator 472 so that the second distribution flow rate FD2′ in the second state is changed to the second distribution flow rate FD2 in the first state.

The controller 15 according to an embodiment of the present invention receives distribution flow rate data, which is the flow rate per unit time of the liquid measured by the flow meters 442 , 452 , and 462 . The controller 15 determines a state change between the first state and the second state based on the received distribution flow data. When the controller 15 determines that the state has changed from the first state to the second state, the controller 15 transmits a flow control signal to the second electro-pneumatic regulator 472 . Upon receiving the flow control signal from the controller 15, the second electro-pneumatic regulator 472 changes the pressure applied to the back pressure valve 470.

According to one embodiment, when the first state is changed to the second state, the controller 15 transmits a downstream flow rate increase signal to the second electro-pneumatic regulator 472 . Accordingly, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470 . When the pressure applied to the back pressure valve 470 decreases, the opening rate of the back pressure valve 470 increases. As the opening rate of the back pressure valve 470 increases, the flow rate per unit time of the liquid passing through the back pressure valve 470 may increase. Accordingly, the flow rate per unit time of the liquid passing downstream of the circulation line 420 may increase. For example, the flow rate per unit time of the liquid passing downstream of the circulation line 420 changes from the second flow rate F2 in the first state to a fourth flow rate F4 greater than the second flow rate F2.

As the flow rate per unit time of the liquid flowing downstream of the circulation line 420 increases, the difference in pressure between the upstream and downstream sides of the circulation line 420 decreases, so in the second state, the first distribution flow rate FD1′ may decrease. . Accordingly, the first distribution flow rate FD1′ may change from the first state to the first distribution flow rate FD1. Also, in the second state, the second distribution flow rate FD2′ may decrease. Accordingly, the second distribution flow rate FD2′ may change from the first state to the second distribution flow rate FD2.

When the number of chambers 300 to which the liquid is supplied is changed, the flow rate per unit time of the liquid flowing into the constant pressure valves 444 , 454 , and 464 may vary. When the flow rate per unit time of the liquid flowing into the constant pressure valves 444, 454, and 464 increases, the flow rate per unit time of the liquid flowing out of the constant pressure valves 444, 454, and 464 may be maintained at the standard flow rate, but the constant pressure valve damage may be applied. If the flow rate per unit time of the liquid flowing out of the constant pressure valve does not maintain the standard flow rate due to damage to the constant pressure valve, the liquid cannot be supplied to the substrates located inside the chambers 300 at a constant flow rate. When the liquid having an excessive flow rate is supplied to the chamber 300 due to damage to the constant pressure valve, the substrate may be damaged. In addition, when a liquid having a small flow rate is supplied to the chamber 300 due to a breakage of the constant pressure valve, particles attached to the substrate may not be easily removed. In addition, particles generated when the constant pressure valve is damaged may flow into the chamber 300 together with the liquid and adhere to the substrate.

Therefore, according to the above-described embodiment of the present invention, even when the number of chambers 300 to which liquid is supplied is changed, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 is changed to flow into the constant pressure valve The distribution flow rate, which is the flow rate per unit time of the liquid, can be kept constant. Accordingly, it is possible to supply liquid having a constant flow rate to the chambers 300 while preventing damage to the constant pressure valve.

A substrate processing method described below is provided substantially the same as or similar to the substrate processing method according to the exemplary embodiment described with reference to FIG. 5 except for additionally described cases.

6 and 7 are diagrams schematically showing another embodiment in which the liquid supply unit of FIG. 3 adjusts the flow rate of the liquid supplied to the chamber in the second state.

Referring to FIG. 6 , the controller 15 controls the first electro-pneumatic regulator 432 to vary the first distribution flow rate FD1′ passing through the first flow meter 442 in the second state. For example, the controller 15 controls the first electro-pneumatic regulator 432 so that the first distribution flow rate FD1′ in the second state is changed to the first distribution flow rate FD1 in the first state. In addition, the controller 15 controls the first electro-pneumatic regulator 432 so that the second distribution flow rate FD2′ in the second state is changed to the second distribution flow rate FD2 in the first state.

The controller 15 according to an embodiment of the present invention receives distribution flow rate data, which is the flow rate per unit time of the liquid measured by the flow meters 442 , 452 , and 462 . The controller 15 determines a state change between the first state and the second state based on the received distribution flow data. When the controller 15 determines that the state has changed from the first state to the second state, the controller 15 transmits a flow control signal to the first electro-pneumatic regulator 432 . Upon receiving the flow control signal from the controller 15, the first electro-pneumatic regulator 432 changes the fluid pressure supplied to the pump 430.

According to one embodiment, when the first state is changed to the second state, the controller 15 transmits an upstream flow rate decrease signal to the first electro-pneumatic regulator 432 . Accordingly, the first electro-pneumatic regulator 432 reduces the fluid pressure supplied to the pump 430 . When the fluid pressure supplied to the pump 430 is reduced, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may decrease. For example, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 changes from the first flow rate F1 in the first state to a third flow rate F3 smaller than the first flow rate F1.

As the flow rate per unit time of the liquid flowing upstream of the circulation line 420 decreases, the pressure difference between the upstream and downstream sides of the circulation line 420 decreases, and thus the first distribution flow rate FD1′ in the second state may decrease. . Accordingly, the first distribution flow rate FD1′ may change from the first state to the first distribution flow rate FD1. Also, in the second state, the second distribution flow rate FD2′ may decrease. Accordingly, the second distribution flow rate FD2′ may change from the first state to the second distribution flow rate FD2.

According to one embodiment of the present invention described with reference to FIG. 6, even when the number of chambers 300 to which liquid is supplied is changed, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 is changed to a constant pressure valve. The distribution flow rate, which is the flow rate per unit time of the inflowing liquid, can be kept constant. Accordingly, it is possible to supply liquid having a constant flow rate to the chambers 300 while preventing damage to the constant pressure valve.

Referring to FIG. 7 , the controller 15 controls the first electro-pneumatic regulator 432 to vary the first distribution flow rate FD1′ passing through the first flow meter 442 in the second state. For example, the controller 15 controls the first electro-pneumatic regulator 432 so that the first distribution flow rate FD1′ in the second state is changed to the first distribution flow rate FD1 in the first state. In addition, the controller 15 controls the first electro-pneumatic regulator 432 so that the second distribution flow rate FD2′ in the second state is changed to the second distribution flow rate FD2 in the first state.

The controller 15 according to an embodiment of the present invention receives distribution flow rate data, which is the flow rate per unit time of the liquid measured by the flow meters 442 , 452 , and 462 . The controller 15 determines a state change between the first state and the second state based on the received distribution flow data. When the controller 15 determines that the state has changed from the first state to the second state, the controller 15 transmits a flow control signal to the first electro-pneumatic regulator 432 and the second electro-pneumatic regulator 472 . Upon receiving the flow control signal from the controller 15, the first electro-pneumatic regulator 432 changes the fluid pressure supplied to the pump 430. In addition, the second electro-pneumatic regulator 472 receiving the flow control signal from the controller 15 changes the pressure applied to the back pressure valve 470 .

According to one embodiment, when the first state is changed to the second state, the controller 15 transmits an upstream flow rate decrease signal to the first electro-pneumatic regulator 432 . Accordingly, the first electro-pneumatic regulator 432 reduces the fluid pressure supplied to the pump 430 . When the pressure of the fluid supplied to the pump 430 decreases, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 may decrease. For example, the flow rate per unit time of the liquid flowing upstream of the circulation line 420 is changed from the first flow rate F1 in the first state to a third flow rate F3 smaller than the first flow rate F1.

In addition, when the first state is changed to the second state, the controller 15 transmits a downstream flow rate increase signal to the second electro-pneumatic regulator 472 . Accordingly, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470 . When the pressure applied to the back pressure valve 470 decreases and the opening rate of the back pressure valve 470 increases, the flow rate per unit time of the liquid flowing downstream of the circulation line 420 may increase. For example, the flow rate per unit time of the liquid passing downstream of the circulation line 420 changes from the second flow rate F2 in the first state to a fourth flow rate F4 greater than the second flow rate F2.

As the flow rate per unit time of the liquid flowing upstream of the circulation line 420 decreases and the flow rate per unit time of the liquid flowing downstream of the circulation line 420 increases, the pressure difference between the upper and lower streams of the circulation line 420 decreases. do. Accordingly, the first distribution flow rate FD1′ may change from the first state to the first distribution flow rate FD1. Also, the second distribution flow rate FD2′ may change from the first state to the second distribution flow rate FD2.

According to one embodiment of the present invention described with reference to FIG. 7, even when the number of chambers 300 to which liquid is supplied is changed, the flow rate per unit time of the liquid flowing upstream and downstream of the circulation line 420 is varied, respectively. A pressure difference between upstream and downstream of the circulation line 420 may be more accurately varied. Accordingly, the distribution flow rate, which is the flow rate per unit time of the liquid flowing into the constant pressure valve, can be kept constant. Accordingly, it is possible to supply liquid having a constant flow rate to the chambers 300 while preventing damage to the constant pressure valve.

FIG. 8 is a view schematically showing another embodiment of how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a first state. FIG. 9 is a view schematically showing another embodiment of how the liquid supply unit of FIG. 3 supplies liquid to a chamber in a second state.

Referring to FIGS. 8 and 9 , the liquid supply unit 400 may supply liquid to the first chamber 300a. Hereinafter, for convenience of understanding, an example in which the liquid supply unit 400 supplies liquid only to the first chamber 300a is described as an example, but the liquid supply unit 400 simultaneously supplies liquid to a plurality of chambers without being limited thereto. can supply

The liquid supply unit 400 may have a first pump 432 and a second pump 434 . The first pump 432 may be a pump having a first capacity. The second pump 434 may be a pump having a second capacity. According to one embodiment, the first capacity may be less than the second capacity.

As shown in FIG. 8 , the liquid supply unit 400 may supply liquid to the circulation line 420 using the first pump 432 . The first pump 432 having the first capacity may deliver the liquid having the first flow rate F1 per unit time upstream of the circulation line 420 . Also, as shown in FIG. 9 , the liquid supply unit 400 may supply liquid to the circulation line 420 using the second pump 434 . The second pump 434 having the second capacity may deliver the liquid having the third flow rate F3 per unit time upstream of the circulation line 420 . According to one embodiment, the first flow rate F1 may be smaller than the third flow rate F3.

When the state of supplying liquid to the chamber 300 using the first pump 432 is changed to the state of supplying liquid to the chamber 300 using the second pump 434, the back pressure valve 470 When there is no change in the applied pressure, a change in the first distribution flow rate may occur due to a pressure differential between upstream and downstream of the circulation line 420 . For example, the first distribution flow rate FD1′ passing through the first flow meter 442 when using the second pump 434 is the first distribution flow rate FD1′ passing through the first flow meter 442 when using the first pump 432. It may be greater than 1 distribution flow rate (FD1).

Accordingly, the controller 15 controls the second electro-pneumatic regulator 472 to vary the first distribution flow rate FD1′ passing through the first flow meter 442. The controller 15 according to an embodiment of the present invention receives distribution flow rate data, which is the flow rate per unit time of the liquid measured by the first flow meter 442 . The controller 15 determines whether to change the capacity of the pump 430 based on the received distribution flow rate data. When the controller 15 determines that the capacities of the pumps 432 and 434 have changed, the controller 15 transmits a flow control signal to the second electro-pneumatic regulator 472 . Upon receiving the flow control signal from the controller 15, the second electro-pneumatic regulator 472 changes the pressure applied to the back pressure valve 470.

According to one embodiment, when the first pump 432 is changed to the second pump 434, the controller 15 transmits a downstream flow rate increase signal to the second electro-pneumatic regulator 472. Accordingly, the second electro-pneumatic regulator 472 reduces the pressure applied to the back pressure valve 470 . When the pressure applied to the back pressure valve 470 decreases, the opening rate of the back pressure valve 470 increases. As the opening rate of the back pressure valve 470 increases, the flow rate per unit time of the liquid passing through the back pressure valve 470 may increase. Accordingly, the flow rate per unit time of the liquid passing downstream of the circulation line 420 may increase. For example, the flow rate per unit time of the liquid passing downstream of the circulation line 420 is the second flow rate F2 which is the flow rate per unit time of the liquid passing downstream of the circulation line 420 when the first pump 422 is used. ) is changed to a fourth flow rate (F4) greater than that.

As the flow rate per unit time of the liquid flowing downstream of the circulation line 420 increases, the pressure difference between the upstream and downstream sides of the circulation line 420 decreases, and thus the first distribution flow rate FD1′ may decrease. That is, the controller 15 varies the first distribution flow rate FD1' according to the change value of the distribution flow rate. For example, the controller 15 may change the first distribution flow rate FD1′ to be similar to the first distribution flow rate FD1 when the first pump 422 is used.

Accordingly, according to one embodiment of the present invention described above, even if the flow rate per unit time of the liquid flowing upstream of the circulation line 420 is changed due to the change in the capacity of the pump 430, the liquid flowing downstream of the circulation line 420 By varying the flow rate per unit time, the distribution flow rate, which is the flow rate per unit time of the liquid flowing into the constant pressure valve, can be kept constant. Accordingly, it is possible to supply liquid having a constant flow rate to the chambers 300 while preventing damage to the constant pressure valve.

In one embodiment of the present invention described above, the change in the flow rate per unit time of the liquid flowing into the constant pressure valve according to the change in the number of chambers to which the liquid is supplied or the flow rate of the pump for supplying the liquid has been described as an example, but now It is not limited. For example, the same can be applied even when the flow rate per unit time of the liquid flowing through the circulation line 420 changes according to the opening and closing of the second discharge line 404 for discharging the liquid flowing through the circulation line 420 .

The above detailed description is illustrative of the present invention. In addition, the foregoing description is intended to indicate and describe preferred or various embodiments for implementing the technical idea of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well. These modified implementations should not be individually understood from the technical spirit or perspective of the present invention.

Index module: 10
Processing module: 20
Chamber: 300
Liquid supply unit: 400
Tank: 410
Circulation line: 420
Pump: 430
1st supply line: 440
2nd supply line: 450
3rd supply line: 460
Back pressure valve: 470
1st flow rate: F1
2nd flow rate: F2
3rd flow: F3
4th flow rate: F4
Reference flow: FS

Claims (20)

A method for processing a substrate in a plurality of chambers,
While the liquid circulates in the circulation line, liquid treatment of the substrate located in the chamber is performed through the supply line connecting the circulation line and each of the plurality of chambers, and the unit of the liquid flowing downstream of the valve installed in the supply line The flow rate per hour is kept constant at the standard flow rate,
Based on the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the upstream flow rate, which is the flow rate per unit time of the liquid flowing upstream of the circulation line from the supply lines or the circulation line of the supply lines The substrate processing method of maintaining the reference flow rate by adjusting the downstream flow rate, which is the flow rate per unit time of the liquid flowing downstream. According to claim 1,
A pump and a first electro-pneumatic regulator are installed upstream of the circulation line to supply the liquid to the downstream of the circulation line by using fluid pressure,
The first electro-pneumatic regulator controls the upstream flow rate by feeding back the distribution flow rate data and changing the fluid pressure supplied to the pump. According to claim 2,
Downstream of the circulation line, a back pressure valve and a second electro-pneumatic regulator whose opening rate is changed according to pressure are installed,
wherein the second electro-pneumatic regulator changes the pressure supplied to the back pressure valve by feeding back the distribution flow rate data, and the opening rate is changed according to the changed pressure to adjust the downstream flow rate. According to claim 3,
The method includes a first state in which the liquid treatment is performed in at least one of the plurality of chambers and a second state in which the liquid treatment is performed in a relatively smaller number of chambers than the first state,
In each of the first state and the second state, the upstream flow rate or the downstream flow rate is controlled differently from each other. According to claim 4,
In the second state, the fluid pressure supplied to the pump is reduced compared to the first state, and the upstream flow rate in the second state is adjusted to be smaller than the upstream flow rate in the first state. According to claim 4,
In the second state, the pressure supplied to the back pressure valve decreases compared to the first state, so that the opening ratio increases, and the downstream flow rate in the second state is adjusted to be greater than the downstream flow rate in the first state. method. According to claim 4,
The upstream flow rate in the second state is adjusted to be smaller than the upstream flow rate in the first state, and the downstream flow rate in the second state is adjusted to be greater than the downstream flow rate in the first state. According to any one of claims 1 to 7,
The valve is a constant pressure valve,
A flow meter located upstream of the constant pressure valve is installed in each of the supply lines,
The distribution flow rate is measured using the flow meter, and the opening rate of the constant pressure valve is maintained constant while liquid processing of the substrate is performed. In the method of treating the substrate,
The liquid supplied by the pump circulates in the circulation line and is supplied to the substrate located in the chamber through the supply line connecting the circulation line and the chamber, and the flow rate per unit time of the liquid flowing downstream of the valve installed in the supply line is based on Keep the flow rate constant,
Maintaining the reference flow rate by changing the downstream flow rate, which is the flow rate per unit time, of the liquid flowing downstream of the circulation line according to the change in the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve. According to claim 9,
The downstream flow rate is varied in proportion to the change value of the distribution flow rate. According to claim 10,
Downstream of the circulation line, a back pressure valve and an electro-pneumatic regulator whose opening rate is changed according to pressure are installed,
The electro-pneumatic regulator changes the pressure supplied to the back pressure valve according to the change value of the distribution flow rate, and the open rate of the downstream flow rate is changed and fluctuated according to the changed pressure. According to claim 11,
When the distribution flow rate changes from a first flow rate to a second flow rate having a larger flow rate per unit time than the first flow rate, the electro-pneumatic regulator increases the pressure supplied to the back pressure valve from the first pressure to the second flow rate so that the opening ratio increases. A substrate processing method of changing the second pressure to a lower pressure than the first pressure. According to claim 11,
When the distribution flow rate changes from a second flow rate to a first flow rate having a smaller flow rate per unit time than the second flow rate, the electro-pneumatic regulator reduces the pressure supplied to the back pressure valve from the second pressure to the second flow rate so that the opening rate becomes smaller. A substrate processing method of changing to a first pressure greater than two pressures. According to claim 9,
The distribution flow rate is varied according to the capacity of the pump or the number of chambers supplying the liquid to the substrate. According to any one of claims 9 to 14,
The valve is a constant pressure valve,
A flow meter located upstream of the constant pressure valve is installed in each of the supply lines,
The distribution flow rate is measured with the flow meter, and the opening rate of the constant pressure valve is maintained constant while liquid processing of the substrate is performed. In the apparatus for processing the substrate,
a chamber in which liquid processing of the substrate is performed;
a circulation line through which the liquid circulates;
a supply line having a constant pressure valve installed and supplying the liquid to the substrate located in the chamber; and
including a controller;
In the circulation line,
a pump installed upstream of the circulation line and supplying the liquid from a tank to a downstream side of the circulation line by using fluid pressure; and
A back pressure valve installed downstream of the circulation line and having an opening rate changed according to pressure;
The supply line is connected to a position in the circulation line between a position where the pump is installed and a position where the back pressure valve is installed in the circulation line;
The controller,
While supplying the liquid to the chamber through the supply line, based on the distribution flow rate, which is the flow rate per unit time of the liquid flowing upstream of the valve, the unit of the liquid flowing upstream of the circulation line rather than the supply lines. The upstream flow rate, which is the flow rate per hour, or the downstream flow rate, which is the flow rate per unit time, of the liquid flowing downstream of the circulation line rather than the supply lines is adjusted to maintain the flow rate per unit time of the liquid flowing downstream of the constant pressure valve at a constant reference flow rate. A substrate processing device that does. According to claim 16,
A first electro-pneumatic regulator for adjusting the upstream flow rate based on the distribution flow rate data is further installed upstream of the circulation line,
A second electro-pneumatic regulator for adjusting the downstream flow rate based on the distribution flow rate data is further installed downstream of the circulation line. According to claim 17,
The chamber is plural,
The supply line connects the circulation line and each of the plurality of chambers independently of each other,
The controller,
The upstream flow rate is adjusted by changing the fluid pressure supplied to the pump by feeding back the distribution flow rate data by controlling the first electro-mechanical regulator, and the back pressure by feeding back the distribution flow rate data by controlling the second electro-mechanical regulator. A substrate processing apparatus configured to change the pressure supplied to a valve, change the opening rate according to the changed pressure to adjust the downstream flow rate, and maintain the reference flow rate. According to claim 18,
In a first state in which the liquid treatment is performed in at least one of the plurality of chambers and in a second state in which the liquid treatment is performed in a relatively smaller number of chambers than the first state,
The controller,
and controlling the first electro-pneumatic regulator or the second electro-pneumatic regulator so that the upstream flow rate in the second state is adjusted to be smaller than the upstream flow rate in the first state. According to claim 19,
The controller,
and controlling the first electro-pneumatic regulator or the second electro-pneumatic regulator so that the downstream flow rate in the second state is adjusted to be greater than the downstream flow rate in the first state.

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