WO2023182218A1 - Dispositif de traitement de substrat et procédé de traitement de substrat - Google Patents

Dispositif de traitement de substrat et procédé de traitement de substrat Download PDF

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Publication number
WO2023182218A1
WO2023182218A1 PCT/JP2023/010642 JP2023010642W WO2023182218A1 WO 2023182218 A1 WO2023182218 A1 WO 2023182218A1 JP 2023010642 W JP2023010642 W JP 2023010642W WO 2023182218 A1 WO2023182218 A1 WO 2023182218A1
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WIPO (PCT)
Prior art keywords
component liquid
supply
component
liquid
storage tank
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PCT/JP2023/010642
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English (en)
Japanese (ja)
Inventor
陸太 青木
貴大 山口
亨 遠藤
涼介 続木
昭司 上前
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2023182218A1 publication Critical patent/WO2023182218A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method.
  • a substrate processing apparatus that processes a substrate is known.
  • the substrate processing apparatus is suitably used for processing semiconductor substrates.
  • a substrate processing apparatus processes a substrate using a processing liquid.
  • Patent Document 1 describes a substrate processing apparatus in which the flow rate is controlled so that the time for supplying hydrofluoric acid and pure water to a mixing tank is the same in order to generate a processing liquid at a constant concentration.
  • the present invention has been made in view of the above problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can quickly control component liquids supplied to a storage tank.
  • the substrate processing apparatus includes a first component liquid supply unit that supplies a first component liquid via a first pipe, and a flow rate of the first component liquid flowing through the first pipe.
  • a second component liquid supply section that supplies the second component liquid via a second pipe, and a second flow meter that measures the flow rate of the second component liquid flowing through the second pipe;
  • a storage tank for storing a mixed liquid in which the first component liquid supplied from the first component liquid supply section and the second component liquid supplied from the second component liquid supply section;
  • a substrate processing unit that processes a substrate with the mixed liquid supplied from a tank; a concentration sensor that detects the concentration of a target component in the mixed liquid in the storage tank;
  • a control unit that controls the first component liquid supply unit and the second component liquid supply unit, and the control unit connects the first piping from the first component liquid supply unit based on the measurement result of the first flowmeter.
  • the first supply amount of the first component liquid supplied to the storage tank via the second component liquid supply section calculates a first supply amount of the first component liquid supplied to the storage tank via the second component liquid supply section, and calculate the first supply amount of the first component liquid supplied to the storage tank from the second component liquid supply section through the second piping based on the measurement result of the second flowmeter.
  • a second supply amount of the second component liquid supplied to the storage tank is calculated, and a period during which the first component liquid supply section supplies the first component liquid via the first piping and the second component liquid is calculated.
  • the first supply amount is determined based on the first supply amount and the second supply amount.
  • the component liquid supply section and the second component liquid supply section are controlled.
  • control unit controls the flow rate of the first component liquid flowing through the first pipe and the second pipe based on the first supply amount and the second supply amount during the component liquid supply period. controlling at least one of the flow rates of the second component liquid flowing through the second component liquid.
  • the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the control unit includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the controller is configured to control the flow rate of the second component liquid flowing through the second pipe based on the first supply amount and the second supply amount in the component liquid supply period.
  • the opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
  • control unit is configured such that the first component liquid supply unit does not supply the first component liquid to the storage tank, and the second component liquid supply unit supplies the second component to the storage tank.
  • the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
  • control unit calculates the first supply amount over a first supply period in which the first component liquid supply unit supplies the first component liquid to the storage tank via the first piping. Then, the second supply amount is calculated over a second supply period during which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping.
  • control unit causes the first component liquid to flow through the first pipe before the first supply period starts, and the first component liquid to flow after the first supply period ends.
  • the second component liquid flows through the first pipe, the second component liquid flows through the second pipe before the second supply period begins, and the second component liquid flows through the second pipe after the second supply period ends.
  • the first component liquid supply section and the second component liquid supply section are controlled so that the first component liquid supply section and the second component liquid supply section flow through the second pipe.
  • the controller controls the first component liquid supply so that the first supply period starts at the same time as the second supply period, and the first supply period ends at the same time as the second supply period. and the second component liquid supply section.
  • control unit starts supplying the first component liquid by the first component liquid supply unit simultaneously with supply of the second component liquid by the second component liquid supply unit, and starts the supply of the first component liquid by the first component liquid supply unit, and
  • the first component liquid supply section and the second component liquid supply section are arranged such that the supply of the first component liquid by the liquid supply section is stopped at the same time as the supply of the second component liquid by the second component liquid supply section.
  • control unit detects, by the concentration sensor, a calculated concentration of the target component in the mixed liquid in the storage tank based on the first supply amount and the second supply amount. If the difference from the concentration is greater than a threshold, driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit is stopped.
  • the first component liquid includes hydrofluoric acid
  • the second component liquid includes a diluent
  • the substrate processing method includes a step in which a first component liquid supply unit supplies a first component liquid to a storage tank via a first pipe, and a step in which the first component liquid a first flow rate measurement step of measuring the flow rate flowing through the piping; a step in which the second component liquid supply section supplies the second component liquid to the storage tank via the second piping; and a step in which the second component liquid is supplied to the second piping. a second flow rate measurement step of measuring the flow rate flowing through the first component liquid, the first component liquid supplied in the step of supplying the first component liquid, and the second component liquid supplied in the step of supplying the second component liquid.
  • a step of storing a mixed liquid in the storage tank a step of processing a substrate in a substrate processing unit with the mixed liquid supplied from the storage tank, and a target contained in the mixed liquid in the storage tank.
  • a step of detecting the concentration of the component with a concentration sensor a detection control step of controlling the first component liquid supply section and the second component liquid supply section based on the detection result of the concentration sensor, and measuring the first flow rate.
  • the first component liquid supply unit calculates a first supply amount of the first component liquid supplied to the storage tank via a first pipe based on the measurement result of the step; and a second flow rate measurement step.
  • the method includes a calculation control step of controlling the first component liquid supply section and the second component liquid supply section based on the first supply amount and the second supply amount.
  • the calculation control step determines the flow rate of the first component liquid flowing through the first pipe and the second component liquid based on the first supply amount and the second supply amount during the component liquid supply period. At least one of the flow rates of the second component liquid flowing through the piping is controlled.
  • the first component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe according to the opening degree
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the second component liquid supply unit includes a valve that can adjust the flow rate of the first component liquid flowing through the first pipe
  • the calculation control step includes a valve that can adjust the flow rate of the second component liquid flowing through the second pipe according to the degree of opening, and the calculation control step is configured to adjust the flow rate of the second component liquid flowing through the second pipe to the first supply amount and the second supply amount during the component liquid supply period. Based on this, the opening degree of at least one of the valve of the first component liquid supply section and the valve of the second component liquid supply section is controlled.
  • the detection control step includes the first component liquid supply unit not supplying the first component liquid to the storage tank, and the second component liquid supply unit supplying the second component liquid to the storage tank. During a period in which the component liquid is not supplied, the first component liquid supply section and the second component liquid supply section are controlled based on the detection result of the concentration sensor.
  • the first component liquid supply section supplies the first component liquid to the storage tank via the first pipe, over a first supply period
  • a second supply period in which the second component liquid supply unit supplies the second component liquid to the storage tank via the second piping. The second supply amount is calculated over the period of time.
  • the substrate processing method includes a first component liquid pre-supply in which the first component liquid supply section supplies the first component liquid via the first pipe before the start of the first supply period. a first component liquid post-supply step in which the first component liquid supply unit supplies the first component liquid via the first piping after the first supply period ends; A second component liquid pre-supply step in which the second component liquid supply unit supplies the second component liquid via the second piping before the start, and a second component liquid pre-supply step in which the second component liquid is supplied via the second piping, and after the second component liquid supply period ends, the second component liquid The method further includes a second component liquid post-supply step in which the supply unit supplies the second component liquid via the second pipe.
  • the first supply period starts at the same time as the second supply period, and the first supply period starts at the same time as the second supply period. 2 supply period ends at the same time.
  • the supply of the first component liquid by the first component liquid supply section in the first component liquid pre-supply step is performed by the second component liquid supply section by the second component liquid supply section in the second component liquid pre-supply step.
  • the supply of the first component liquid by the first component liquid supply unit in the first component liquid post-supply step is started simultaneously with the supply of the component liquid
  • the supply of the first component liquid by the first component liquid supply unit in the second component liquid post-supply process is started by the second component liquid supply unit in the second component liquid post-supply process.
  • the supply of the second component liquid is stopped simultaneously with the supply of the second component liquid.
  • a calculated concentration of a target component in the mixed liquid in the storage tank is detected by the concentration sensor based on the first supply amount and the second supply amount.
  • the method further includes the step of stopping driving of the first component liquid supply section, the second component liquid supply section, and the substrate processing unit when the difference between the concentration and the concentration is larger than a threshold value.
  • the first component liquid in the step of supplying the first component liquid, includes hydrofluoric acid, and in the step of supplying the second component liquid, the second component liquid includes a diluent. .
  • the component liquids supplied to the storage tank can be quickly controlled.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 2 is a schematic diagram of a substrate processing unit in the substrate processing apparatus of this embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • FIG. 1 is a block diagram of a substrate processing apparatus according to the present embodiment.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • (a) and (c) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid, and
  • (b) is a graph showing changes over time in the concentration of the mixed liquid in the storage tank.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • FIG. 2 is a schematic diagram showing a piping configuration in the substrate processing apparatus of the present embodiment.
  • (a) and (b) are graphs showing changes in the flow rates of the first treatment liquid and the second treatment liquid.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 2 is a flow diagram of a substrate processing method according to the present embodiment.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 1 is a schematic diagram of a substrate processing apparatus of this embodiment.
  • FIG. 1 is a schematic plan view of a substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 processes the substrate W.
  • the substrate processing apparatus 100 processes the substrate W to perform at least one of etching, surface treatment, imparting properties, forming a treated film, removing at least a portion of the film, and cleaning.
  • the substrate W is used as a semiconductor substrate.
  • Substrate W includes a semiconductor wafer.
  • the substrate W has a substantially disk shape.
  • the substrate processing apparatus 100 processes the substrates W one by one.
  • the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports LP, an indexer robot IR, and a center robot CR. , and a control device 101.
  • the control device 101 controls the load port LP, indexer robot IR, and center robot CR.
  • Control device 101 includes a control section 102 and a storage section 104.
  • Each of the load ports LP accommodates a plurality of stacked substrates W.
  • the indexer robot IR transports the substrate W between the load port LP and the center robot CR.
  • the center robot CR transports the substrate W between the indexer robot IR and the substrate processing unit 10.
  • Each of the substrate processing units 10 processes the substrate W by discharging a processing liquid onto the substrate W.
  • the treatment liquid includes a chemical liquid, a cleaning liquid, a removal liquid, and/or a water repellent.
  • the processing liquid cabinet 110 stores processing liquid. Note that the processing liquid cabinet 110 may contain gas.
  • the plurality of substrate processing units 10 form a plurality of towers TW (four towers TW in FIG. 1) arranged so as to surround the center robot CR in plan view.
  • Each tower TW includes a plurality of substrate processing units 10 (three substrate processing units 10 in FIG. 1) stacked one above the other.
  • Each processing liquid box 120 corresponds to a plurality of towers TW.
  • the liquid in the processing liquid cabinet 110 is supplied via one of the processing liquid boxes 120 to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120. Further, the gas in the processing liquid cabinet 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid box 120 via one of the processing liquid boxes 120.
  • a boundary wall is arranged between the area where the central robot CR and the substrate processing unit 10 are installed and the area where the processing liquid cabinet 110 is installed.
  • the processing liquid cabinet 110 has a storage tank (tank) for preparing the processing liquid.
  • the processing liquid cabinet 110 may have a storage tank for one type of processing liquid, or may have storage tanks for multiple types of processing liquids.
  • the processing liquid cabinet 110 includes a pump, a valve, and/or a filter for distributing the processing liquid.
  • the control device 101 controls various operations of the substrate processing apparatus 100.
  • the substrate processing unit 10 processes the substrate W under the control of the control device 101 .
  • the control device 101 includes a control section 102 and a storage section 104.
  • Control unit 102 has a processor.
  • the control unit 102 includes, for example, a central processing unit (CPU).
  • the control unit 102 may include a general-purpose computing machine.
  • the storage unit 104 stores data and computer programs.
  • the data includes recipe data.
  • the recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents and processing procedures for the substrate W.
  • the storage unit 104 includes a main storage device and an auxiliary storage device.
  • the main storage device is, for example, a semiconductor memory.
  • the auxiliary storage device is, for example, a semiconductor memory and/or a hard disk drive.
  • Storage unit 104 may include removable media.
  • the control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
  • FIG. 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.
  • the substrate processing unit 10 includes a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.
  • the chamber 11 accommodates the substrate W.
  • the substrate holding section 20 holds the substrate W.
  • the chamber 11 is approximately box-shaped with an internal space.
  • the chamber 11 accommodates the substrate W.
  • the substrate processing apparatus 100 is a single-wafer type that processes substrates W one by one, and the chamber 11 accommodates one substrate W at a time.
  • the substrate W is accommodated within the chamber 11 and processed within the chamber 11 .
  • the chamber 11 accommodates at least a portion of each of the substrate holding section 20 and the processing liquid supply section 30 .
  • the substrate holding section 20 holds the substrate W.
  • the substrate holding unit 20 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (lower surface) Wb of the substrate W faces vertically downward. Further, the substrate holding unit 20 rotates the substrate W while holding the substrate W.
  • the upper surface Wa of the substrate W is provided with a stacked structure in which a recess is formed. The substrate holder 20 rotates the substrate W while holding it.
  • the substrate holder 20 may be a clamping type that clamps the edge of the substrate W.
  • the substrate holding section 20 may have any mechanism for holding the substrate W from the back surface Wb.
  • the substrate holding section 20 may be of a vacuum type.
  • the substrate holding unit 20 holds the substrate W horizontally by adsorbing the center portion of the back surface Wb of the substrate W, which is a non-device forming surface, to the upper surface.
  • the substrate holding section 20 may combine a clamping type in which a plurality of chuck pins are brought into contact with the peripheral end surface of the substrate W and a vacuum type.
  • the substrate holder 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25.
  • the chuck member 22 is provided on the spin base 21.
  • the chuck member 22 chucks the substrate W.
  • the spin base 21 is provided with a plurality of chuck members 22.
  • the shaft 23 is a hollow shaft.
  • the shaft 23 extends vertically along the rotation axis Ax.
  • a spin base 21 is coupled to the upper end of the shaft 23.
  • the substrate W is placed above the spin base 21 .
  • the spin base 21 is disk-shaped and supports the substrate W horizontally.
  • the shaft 23 extends downward from the center of the spin base 21.
  • the electric motor 24 provides rotational force to the shaft 23.
  • the electric motor 24 rotates the substrate W and the spin base 21 about the rotation axis Ax by rotating the shaft 23 in the rotational direction.
  • Housing 25 surrounds shaft 23 and electric motor 24 .
  • the processing liquid supply unit 30 supplies the processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies the processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply section 30 is accommodated within the chamber 11.
  • the processing liquid supply unit 30 supplies a processing liquid to the upper surface Wa of the substrate W.
  • the treatment liquid may also include a so-called chemical solution.
  • the chemical solution contains hydrofluoric acid.
  • hydrofluoric acid may be heated to 40°C or more and 70°C or less, or may be heated to 50°C or more and 60°C or less.
  • hydrofluoric acid does not need to be heated.
  • the chemical solution may contain water or phosphoric acid.
  • the chemical solution may include hydrogen peroxide solution.
  • the chemical solution may include SC1 (ammonia hydrogen peroxide solution mixture), SC2 (hydrochloric acid hydrogen peroxide solution mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid).
  • the processing liquid may include a so-called cleaning liquid (rinsing liquid).
  • the cleaning liquid may be deionized water (DIW), carbonated water, electrolyzed ionized water, ozone water, ammonia water, hydrochloric acid water at a diluted concentration (for example, about 10 ppm to 100 ppm), or reduced water (hydrogen water). It may also include any of the following.
  • the processing liquid supply section 30 includes a pipe 32, a nozzle 34, and a valve 36.
  • the nozzle 34 discharges the processing liquid onto the upper surface Wa of the substrate W.
  • Nozzle 34 is connected to piping 32.
  • a processing liquid is supplied to the piping 32 from a supply source.
  • the valve 36 opens and closes the flow path within the pipe 32.
  • the nozzle 34 is configured to be movable relative to the substrate W.
  • the valve 36 opens and closes the flow path within the pipe 32.
  • the valve 36 adjusts the opening degree of the pipe 32 to adjust the flow rate of the processing liquid supplied to the pipe 32.
  • the valve 36 includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the nozzle 34 may be movable.
  • the nozzle 34 can be moved horizontally and/or vertically according to a movement mechanism controlled by the control unit 102. Note that in this specification, the moving mechanism is omitted to avoid making the drawings excessively complex.
  • the substrate processing unit 10 further includes a cup 80.
  • the cup 80 collects the processing liquid scattered from the substrate W.
  • the cup 80 moves up and down. For example, the cup 80 rises vertically upward to the side of the substrate W over a period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid scattered from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the cup 80 descends vertically downward from the side of the substrate W.
  • control device 101 includes the control section 102 and the storage section 104.
  • the control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30, and/or the cup 80.
  • controller 102 controls electric motor 24, valve 36, and/or cup 80.
  • the substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor.
  • a conductive layer and an insulating layer are laminated on a base material.
  • the substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
  • the processing liquid supply section 30 can supply one type of processing liquid.
  • the processing liquid supply unit 30 may supply multiple types of processing liquids.
  • the processing liquid supply unit 30 may be able to sequentially supply a plurality of types of processing liquids for different uses to the substrate W.
  • the processing liquid supply unit 30 may be able to simultaneously supply a plurality of types of processing liquids for different purposes to the substrate W.
  • FIG. 3 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118.
  • the first component liquid supply section 112, the second component liquid supply section 114, the storage tank 116, and the concentration sensor 118 are all arranged within the processing liquid cabinet 110.
  • the first component liquid supply section 112 supplies the first component liquid.
  • the first component liquid supplied from the first component liquid supply section 112 flows to the storage tank 116 and is stored in the storage tank 116 .
  • the second component liquid supply section 114 supplies the second component liquid.
  • the second component liquid supplied from the second component liquid supply section 114 flows to the storage tank 116 and is stored in the storage tank 116 .
  • the first component liquid and the second component liquid are mixed in the storage tank 116 to form a mixed liquid.
  • the mixed liquid is used as a processing liquid in the substrate processing unit 10. Note that the mixed liquid does not need to contain the first component liquid and the second component liquid in a mixed state.
  • the mixed liquid may be the result of a reaction caused by mixing the first component liquid and the second component liquid.
  • one of the first component liquid and the second component liquid may be used after being diluted with the other of the first component liquid and the second component liquid.
  • one of the first component liquid and the second component liquid may be a chemical liquid, and the other of the first component liquid and the second component liquid may be a diluent liquid.
  • the first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c.
  • the first component liquid is supplied to the first pipe 112a from a supply source.
  • the first flow meter 112b is arranged in the first pipe 112a.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the valve 112c opens and closes the flow path within the first pipe 112a.
  • the valve 112c adjusts the opening degree of the first pipe 112a to adjust the flow rate of the first component liquid flowing through the first pipe 112a.
  • the valve 112c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the valve 112c may be a motorized needle valve.
  • the flow rate of the processing liquid flowing through the first pipe 112a may be adjusted by adjusting the opening degree of the valve 112c based on the measurement result of the first flowmeter 112b.
  • the second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c.
  • the second component liquid is supplied to the second pipe 114a from a supply source.
  • the second flow meter 114b is arranged in the second pipe 114a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • the valve 114c opens and closes the flow path within the second pipe 114a.
  • the valve 114c adjusts the opening degree of the second pipe 114a to adjust the flow rate of the processing liquid flowing through the second pipe 114a.
  • the valve 114c includes a valve body (not shown) in which a valve seat is provided, a valve body that opens and closes the valve seat, and an actuator that moves the valve body between an open position and a closed position. (not shown).
  • the valve 114c may be a motorized needle valve.
  • the flow rate of the processing liquid flowing through the second pipe 114a may be adjusted by adjusting the opening degree of the valve 114c based on the measurement result of the second flowmeter 114b.
  • the first component liquid that has flowed through the first pipe 112a is supplied to the storage tank 116. Further, the second component liquid that has flowed through the second pipe 114a is supplied to the storage tank 116. Therefore, the first component liquid and the second component liquid are mixed in the storage tank 116.
  • the storage tank 116 stores a mixed liquid obtained by mixing the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a.
  • Piping 117 connects storage tank 116 and piping 32. Specifically, the pipe 117 connects the storage tank 116 and the pipes 32a to 32c. The mixed liquid stored in the storage tank 116 flows through the pipe 117 and the pipe 32 and is supplied to the substrate processing unit 10.
  • the concentration sensor 118 detects the concentration of the target component in the mixed liquid stored in the storage tank 116.
  • the concentration sensor 118 may detect the concentration of a predetermined component in the first component liquid.
  • the concentration sensor 118 may detect the concentration of a predetermined component in the second component liquid.
  • the concentration sensor 118 may detect the concentration of the target component in the liquid mixture.
  • the concentration sensor 118 may detect the concentration of a target component newly generated by mixing the first component liquid and the second component liquid. Note that in this specification, the concentration of the target component in the liquid mixture may be simply referred to as "concentration of the liquid mixture.”
  • the substrate processing unit 10 includes substrate processing units 10a to 10c. Typically, substrate processing units 10a-10c have the same shape and the same function.
  • the substrate processing unit 10a includes a processing liquid supply section 30a. As shown in FIG. 2, the processing liquid supply section 30a includes a pipe 32a, a nozzle 34a, and a valve 36a.
  • the nozzle 34a discharges the processing liquid onto the upper surface Wa of the substrate W.
  • Nozzle 34a is connected to piping 32a.
  • a processing liquid is supplied to the pipe 32a from a supply source.
  • the valve 36a opens and closes the flow path within the pipe 32a.
  • the nozzle 34a is configured to be movable relative to the substrate W.
  • the substrate processing unit 10b has a processing liquid supply section 30b.
  • the processing liquid supply section 30b includes a pipe 32b, a nozzle 34b, and a valve 36b.
  • the substrate processing unit 10c includes a processing liquid supply section 30c.
  • the processing liquid supply section 30c includes a pipe 32c, a nozzle 34c, and a valve 36c.
  • the supply amount of the first component liquid supplied to the storage tank 116 is calculated from the measurement result of the first flow meter 112b that detects the flow rate of the first component liquid flowing through the first pipe 112a. Then, the amount of the second component liquid supplied to the storage tank 116 is calculated from the measurement result of the second flow meter 114b that detects the flow rate of the second component liquid flowing through the second pipe 114a. Therefore, before the concentration sensor 118 detects the concentration of the mixed liquid in the storage tank 116, the supply amount of the first component liquid flowing through the first pipe 112a and the supply amount of the second component liquid flowing through the second pipe 114a are detected. Based on this, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled. Furthermore, even if the concentration sensor 118 fails, the concentration of the mixed liquid in the storage tank 116 can be prevented from being controlled unintentionally.
  • a mixed liquid in which the first component liquid and the second component liquid are mixed can be supplied to the substrate processing unit 10 as a processing liquid in the storage tank 116.
  • the substrate processing apparatus 100 of this embodiment is suitably used for manufacturing a semiconductor element provided with a semiconductor.
  • a conductive layer and an insulating layer are laminated on a base material.
  • the substrate processing apparatus 100 is suitably used for cleaning and/or processing (eg, etching, changing characteristics, etc.) of conductive layers and/or insulating layers during the manufacture of semiconductor devices.
  • FIG. 4 is a block diagram of the substrate processing apparatus 100.
  • the control device 101 controls various operations of the substrate processing apparatus 100.
  • the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding section 20, the processing liquid supply section 30, and the cup 80.
  • the control device 101 transmits control signals to the indexer robot IR, center robot CR, substrate holding section 20, processing liquid supply section 30, and cup 80, thereby controlling the indexer robot IR, center robot CR,
  • the substrate holding section 20, the processing liquid supply section 30, and the cup 80 are controlled.
  • the storage unit 104 stores computer programs and data.
  • the data includes recipe data.
  • the recipe data includes information indicating multiple recipes. Each of the plurality of recipes defines processing contents, processing procedures, and substrate processing conditions for the substrate W.
  • the control unit 102 executes a computer program stored in the storage unit 104 to perform a substrate processing operation.
  • the control unit 102 controls the indexer robot IR and transfers the substrate W by the indexer robot IR.
  • the control unit 102 controls the center robot CR and transfers the substrate W by the center robot CR.
  • the central robot CR receives an unprocessed substrate W and carries the substrate W into one of the plurality of chambers 11.
  • the center robot CR receives the processed substrate W from the chamber 11 and carries out the substrate W.
  • the control unit 102 controls the substrate holding unit 20 to start the rotation of the substrate W, change the rotation speed, and stop the rotation of the substrate W.
  • the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20.
  • the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 24 of the substrate holding unit 20.
  • the control unit 102 can control the valve 36 of the processing liquid supply unit 30 to switch the state of the valve 36 between an open state and a closed state. Specifically, the control unit 102 controls the valve 36 of the processing liquid supply unit 30 to open the valve 36, thereby allowing the processing liquid flowing in the pipe 32 toward the nozzle 34 to pass. can. Further, the control unit 102 can stop the supply of the processing liquid flowing in the pipe 32 toward the nozzle 34 by controlling the valve 36 of the processing liquid supply unit 30 and closing the valve 36. .
  • the control unit 102 may control the cup 80 to move the cup 80 relative to the substrate W. Specifically, the control unit 102 raises the cup 80 vertically upward to the side of the substrate W over a period during which the processing liquid supply unit 30 supplies the processing liquid to the substrate W. Further, when the period in which the processing liquid supply unit 30 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 80 vertically downward from the side of the substrate W.
  • the control unit 102 functions as a first supply amount calculation unit 102a and a second supply amount calculation unit 102b.
  • the first supply amount calculation unit 102a calculates the supply amount of the first processing liquid that flows through the first pipe 112a and is supplied to the storage tank 116 from the measurement result of the first flowmeter 112b.
  • the second supply amount calculation unit 102b calculates the supply amount of the second processing liquid flowing through the second pipe 114a and supplied to the storage tank 116 from the measurement result of the second flowmeter 114b.
  • the control section 102 includes a first supply amount calculation section 102a and a second supply amount calculation section 102b.
  • the substrate processing apparatus 100 of this embodiment is suitably used for forming semiconductor elements.
  • the substrate processing apparatus 100 is suitably used to process a substrate W used as a semiconductor element having a stacked structure.
  • the semiconductor element is a so-called 3D structured memory (storage device).
  • the substrate W is suitably used as a NAND flash memory.
  • FIG. 5 is a flow diagram of the substrate processing method of this embodiment.
  • step S110 supply of the first component liquid and the second component liquid is started.
  • the first component liquid supply unit 112 starts supplying the first component liquid to the storage tank 116 via the first pipe 112a.
  • the second component liquid supply unit 114 starts supplying the second component liquid to the storage tank 116 via the second pipe 114a.
  • the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply unit 114 to open the valve 112c and the valve 114c. Note that the supply amount of the first component liquid scheduled to be supplied to the storage tank 116 in the first component liquid supply section 112, the supply amount of the second component liquid scheduled to be supplied to the storage tank 116 in the second component liquid supply section 114, Further, it is preferable that the amount and concentration of the mixed liquid supplied to the storage tank 116 are set in advance.
  • the timing at which the first component liquid supply section 112 starts supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply section 114 starts supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 starts supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 starts supplying the second component liquid. .
  • step S120 the flow rates of the first component liquid and the second component liquid are measured.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • step S130 the supply amount of the first component liquid and the supply amount of the second component liquid are calculated.
  • the first supply amount calculation unit 102a calculates the supply amount of the first component liquid based on the measurement result of the flow rate of the first component liquid.
  • the second supply amount calculation unit 102b calculates the supply amount of the second component liquid based on the measurement result of the flow rate of the second component liquid.
  • step S140 the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the control unit 102 controls the supply of the first component liquid from the first component liquid supply unit 112 and/or the second component liquid supply unit 114 based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the supply of the second component liquid is controlled.
  • the flow rate of the first component liquid and/or the flow rate of the second component liquid is adjusted by at least one of the first component liquid supply section 112 and the second component liquid supply section 114.
  • the control unit 102 controls the flow rate of the first component liquid and/or the flow rate of the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the control unit 102 controls whether the flow rate of the first component liquid increases and/or the second component liquid At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate of the component liquid supply section 112 and the second component liquid supply section 114 is decreased.
  • the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112 and/or decreases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to extend the time for supplying the first component liquid and/or shorten the time for supplying the second component liquid. at least one of the sections 114.
  • the control unit 102 increases the time that the valve 112c of the first component liquid supply unit 112 is open, and/or decreases the time that the valve 114c of the second component liquid supply unit 114 is open.
  • the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
  • the control unit 102 determines whether the flow rate of the first component liquid decreases and/or the amount of the second component liquid decreases. At least one of the first component liquid supply section 112 and the second component liquid supply section 114 is controlled so that the flow rate increases. For example, the control unit 102 reduces the opening degree of the valve 112c of the first component liquid supply unit 112 and/or increases the opening degree of the valve 114c of the second component liquid supply unit 114. Alternatively, the control unit 102 controls the first component liquid supply unit 112 and the second component liquid supply so as to shorten the time for supplying the first component liquid and/or increase the time to supply the second component liquid.
  • the control unit 102 reduces the time that the valve 112c of the first component liquid supply unit 112 is open, and/or increases the time that the valve 114c of the second component liquid supply unit 114 is open. In this case as well, the control unit 102 may adjust either the flow rate and supply time of the first component liquid supply unit 112 or the flow rate and supply time of the second component liquid supply unit 114.
  • control unit 102 controls the first component liquid supply unit 112, the second component liquid supply unit 114, and Driving of the substrate processing unit 10 is stopped.
  • step S140 the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the calculated first supply amount and second supply amount.
  • control may be referred to as a calculation control step.
  • step S150 it is determined whether the supply of the component liquid to the storage tank 116 is completed.
  • a liquid amount detection sensor (not shown) detects the amount of the mixed liquid in the storage tank 116.
  • the liquid level detection sensor includes a liquid level sensor. If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
  • step S150 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160. On the other hand, if the supply of the component liquid to the storage tank 116 is not completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
  • step S160 the supply of the first component liquid and the second component liquid is stopped.
  • the first component liquid supply unit 112 stops supplying the first component liquid to the storage tank 116 via the first pipe 112a.
  • the second component liquid supply unit 114 stops supplying the second component liquid to the storage tank 116 via the second pipe 114a.
  • the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be the same as or different from the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. good. Further, the timing at which the first component liquid supply unit 112 stops supplying the first component liquid may be earlier or later than the timing at which the second component liquid supply unit 114 stops supplying the second component liquid. .
  • step S170 processing of the substrate W is started.
  • the substrate processing unit 10 starts processing the substrate W using a mixed liquid in which the first component liquid and the second component liquid are mixed in the storage tank 116.
  • the process advances to step S172.
  • step S172 it is determined whether the amount of the mixed liquid in the storage tank 116 is greater than a threshold value.
  • a liquid amount detection sensor detects the amount of the mixed liquid in the storage tank 116.
  • the control unit 102 compares the amount of the mixed liquid in the storage tank 116 with a threshold value.
  • step S172 If the amount of the mixed liquid is larger than the threshold (Yes in step S172), the process proceeds to step S180. On the other hand, if the amount of the mixed liquid is less than or equal to the threshold (No in step S172), the process returns to step S110. At this time, it is preferable that the control unit 102 sets the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
  • step S180 the concentration of the mixed liquid in the storage tank 116 is detected.
  • Concentration sensor 118 detects the concentration of the target component in the liquid mixture stored in storage tank 116 .
  • step S182 it is determined whether the concentration of the mixed liquid is within an acceptable range.
  • the control unit 102 compares the concentration of the target component with the tolerance range stored in the storage unit 104.
  • the control unit 102 stops driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10.
  • step S182 If the concentration of the mixed liquid is within the allowable range (Yes in step S182), the process proceeds to step S184.
  • step S184 it is determined whether the concentration of the mixed liquid in the storage tank 116 is to be adjusted.
  • the control unit 102 determines whether to adjust the concentration of the mixed liquid in the storage tank 116 by determining whether the concentration of the target component in the mixed liquid is within a normal range. For example, if the concentration of the target component is within the normal range, the control unit 102 determines not to adjust the concentration of the mixed liquid in the storage tank 116. If the concentration of the mixed liquid is not within the normal range, the control unit 102 determines that the concentration of the mixed liquid in the storage tank 116 should be adjusted.
  • step S184 If it is determined that the concentration of the target component is not adjusted (No in step S184), the process proceeds to step S190. On the other hand, if it is determined that the concentration of the mixed liquid is adjusted (Yes in step S184), the process returns to step S110. At this time, it is preferable that the control unit 102 calculates the amount and concentration of the mixed liquid newly supplied to the storage tank 116.
  • step S182 and step S184 the substrate processing apparatus 100 including the first component liquid supply section 112 and the second component liquid supply section 114 is controlled based on the concentration measured by the concentration sensor 118.
  • the process of controlling using the concentration measured by the concentration sensor 118 in this manner may be referred to as a detection control process.
  • step S190 it is determined whether or not to end the substrate processing. If the substrate processing is not finished (No in step S190), the process returns to step S180. Thereafter, in step S180, the concentration of the mixed liquid is detected. Here, it is repeatedly determined whether the concentration of the mixed liquid is within an allowable range and whether the concentration of the mixed liquid is to be adjusted until the substrate processing is completed. On the other hand, if the substrate processing is to be ended (Yes in step S190), the processing is ended.
  • the substrate W is processed using a mixed liquid obtained by mixing the first component liquid and the second component liquid as the processing liquid.
  • the flow rate of the first component liquid and/or the flow rate of the second component liquid is controlled. Therefore, before the first component liquid and the second component liquid are mixed in the storage tank 116 and the concentration of the target component in the first component liquid or the second component liquid with respect to the mixed liquid is detected by the concentration sensor 118, the first component liquid and the second component liquid are mixed in the storage tank 116.
  • One component liquid supply section 112 and second component liquid supply section 114 can be controlled.
  • the first component liquid supply section 112 and the second component liquid supply section 114 are controlled based on the concentration detected by the concentration sensor 118. . Thereby, the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
  • FIGS. 1 to 6(a) and 6(c) are graphs showing time changes in the flow rate of the first processing liquid and the flow rate of the second processing liquid
  • FIG. 6(b) shows the graph of the mixed liquid in the storage tank 116.
  • 2 is a graph showing changes in concentration over time.
  • the first flow meter 112b measures the flow rate Va of the first component liquid.
  • the flow rate Va of the first component liquid changes in a pulsed manner according to the opening and closing of the valve 112c. In this case, when the valve 112c is opened at time Ta1, the first component liquid starts flowing through the first pipe 112a, and the flow rate Va of the first component liquid increases.
  • valve 112c when the valve 112c is closed at time Ta2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. In this way, the first component liquid flows through the first pipe 112a over the first supply period Pa from time Ta1 to time Ta2.
  • the control unit 102 calculates the supply amount Sa of the first component liquid based on the temporal change in the flow rate Va of the first component liquid.
  • the supply amount of the first component liquid may be referred to as a first supply amount Sa.
  • the first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
  • the second flow meter 114b measures the flow rate Vb of the second component liquid.
  • the flow rate Vb of the second component liquid changes in a pulsed manner according to the opening and closing of the valve 114c. In this case, when the valve 114c is opened at time Tb1, the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
  • the control unit 102 calculates the supply amount Sb of the second component liquid based on the temporal change in the flow rate Vb of the second component liquid.
  • the supply amount of the second component liquid may be referred to as a second supply amount Sb.
  • the second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
  • the component liquid supply period P1 includes a first supply period Pa and a second supply period Pb.
  • the component liquid supply period P1 is a period during which the first component liquid and the second component liquid are supplied to the storage tank 116.
  • one of the first component liquid and the second component liquid is supplied to the storage tank 116, and then the other of the first component liquid and the second component liquid is supplied to the storage tank 116. This indicates the period until the supply is completed.
  • the component liquid supply period P1 is a period in which the first component liquid and the second component liquid are supplied between the period when the first component liquid is supplied to the storage tank 116 and the period when the second component liquid is supplied to the storage tank 116.
  • Either may include a period in which the water is not supplied to the storage tank 116. Further, during the component liquid supply period P1, after one of the first component liquid and the second component liquid is supplied to the storage tank 116, neither the first component liquid nor the second component liquid is supplied to the storage tank 116. It may also include a period.
  • At least one of the first component liquid and the second component liquid is supplied to the storage tank 116 during the component liquid supply period P1. Therefore, at least one of the concentration and the amount of the mixed liquid in the storage tank 116 changes during the component liquid supply period P1.
  • the component liquid non-supply period P2 is a period in which neither the first component liquid nor the second component liquid is supplied to the storage tank 116.
  • the component liquid non-supply period P2 may start immediately after the later of the first supply period Pa and the second supply period Pb ends.
  • the component liquid non-supply period P2 may start after a predetermined period has elapsed after the later of the first supply period Pa and the second supply period Pb ends.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b can calculate the first supply amount and the second supply amount in the component liquid supply period P1. Therefore, the control unit 102 can control the first component liquid supply unit 112 and the second component liquid supply unit 114 based on the first supply amount and the second supply amount during the component liquid supply period P1. For example, when the ratio of the first supply amount and the second supply amount deviates from a predetermined value, the control unit 102 controls the first component supply amount based on the first supply amount and the second supply amount during the component liquid supply period P1.
  • the liquid supply section 112 and the second component liquid supply section 114 can be controlled.
  • FIG. 6(b) shows the change over time of the measurement results obtained by measuring the concentration of the mixed liquid in the storage tank 116 with the concentration sensor 118.
  • the concentration measured by the concentration sensor 118 changes not during the component liquid supply period P1 but during the component liquid non-supply period P2.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116.
  • the concentration sensor 118 measures the concentration of the mixed liquid in the storage tank 116. Therefore, by using the first supply amount and the second supply amount, the situation of the mixed liquid in the storage tank 116 can be obtained more quickly than when the concentration sensor 118 measures it.
  • the first supply period Pa and the second supply period Pb may overlap.
  • the first supply period Pa may start at the same timing as the second supply period Pb, and may end at the same timing as the second supply period Pb.
  • the valve 112c is opened at time Tc1
  • the first component liquid starts flowing through the first pipe 112a
  • the flow rate Va of the first component liquid increases.
  • the valve 112c and the valve 114c are opened at time Tc1
  • the second component liquid starts flowing through the second pipe 114a, and the flow rate Vb of the second component liquid increases.
  • valve 112c when the valve 112c is closed at time Tc2, the flow of the first component liquid in the first pipe 112a stops, and the flow rate Va of the first component liquid decreases. Further, when the valve 112c and the valve 114c are closed at time Tc2, the flow of the second component liquid in the second pipe 114a is stopped, and the flow rate Vb of the second component liquid is reduced.
  • control unit 102 mainly controls the first component liquid supply unit 112 and the second component liquid based on the supply amount of the first component liquid and the supply amount of the second component liquid.
  • the liquid supply unit 114 is controlled, the present embodiment is not limited thereto.
  • the control unit 102 may calculate the concentration of the mixed liquid based on the amount and concentration of the mixed liquid stored in the storage tank 116, the supply amount of the first component liquid, and the supply amount of the second component liquid. .
  • FIG. 7 is a flow diagram of the substrate processing method of this embodiment.
  • the flowchart in FIG. 7 is the same as the flowchart shown in FIG. 5, except that the concentration of the mixed liquid is calculated from the supply amount of the first component liquid and the supply amount of the second component liquid. Duplicate explanations will be omitted to avoid confusion.
  • steps S110 to S130 are similar to steps S110 to S130 in FIG. 5. After step S130, the process proceeds to step S132.
  • step S132 the concentration of the mixed liquid is calculated.
  • the control unit 102 may calculate the concentration of the liquid mixture added to the storage tank 116 based on the first supply amount and the second supply amount.
  • the concentration of the newly added liquid mixture can be calculated from the first supply amount calculated by the first supply amount calculation section 102a and the second supply amount calculated by the second supply amount calculation section 102b.
  • the concentration of a newly added liquid mixture may be referred to as an additional calculated concentration.
  • control unit 102 determines the current concentration and amount of the mixed liquid in the storage tank 116 based on the concentration and amount of the mixed liquid added to the storage tank 116 (additional calculated concentration) and the amount of the liquid.
  • concentration of the mixed liquid in the storage tank 116 after adding the mixed liquid may be calculated.
  • the process proceeds to step S140. Steps after step S140 are the same as steps after step S140 in FIG.
  • control unit 102 controls the storage tank 116 based on the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b.
  • concentration of the mixed liquid added to the storage tank 116 or the mixed liquid after being added to the storage tank 116 can be calculated. Thereby, the mixed liquid can be adjusted using the concentration standard that controls the mixed liquid in the storage tank 116.
  • FIGS. 8(a) and 8(b) are graphs showing changes in the concentration of the mixed liquid in the storage tank 116 over time.
  • the concentration is set to the target value Gv.
  • the concentration is maintained at the target value Gv during the component liquid supply period P1.
  • the concentration often varies slightly with respect to the target value Gv. Note that the target value Gv itself may change during the component liquid supply period P1.
  • a permissible range is set for the concentration of the mixed liquid.
  • the allowable range is from the lower threshold Th1 to the upper threshold Th2.
  • the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100.
  • the concentration of the mixed liquid is equal to or higher than the upper limit threshold Th2
  • the control unit 102 determines that the concentration of the mixed liquid is abnormal and stops driving the substrate processing apparatus 100.
  • the concentration is within the allowable range (that is, if the concentration is greater than or equal to the lower threshold Th1 and smaller than the upper threshold Th2), the control unit 102 continues to drive the substrate processing apparatus 100.
  • the lower threshold Th1 and the upper threshold Th2 may be set as values shifted by a predetermined value with respect to the target value Gv.
  • a normal range is set for the concentration.
  • the normal range is from the lower limit threshold Tha to the upper limit threshold Thb.
  • the control unit 102 drives the substrate processing apparatus 100 so that the concentration increases.
  • the concentration is equal to or higher than the upper limit threshold Thb, the control unit 102 drives the substrate processing apparatus 100 so that the concentration decreases.
  • the concentration of the mixed liquid in the storage tank 116 changes. For example, when the concentration of the mixed liquid falls below the lower limit threshold Tha, the control unit 102 changes the opening degree of the valve 112c to increase the concentration of the mixed liquid. On the other hand, when the concentration of the mixed liquid becomes equal to or higher than the upper limit threshold Thb, the control unit 102 changes the opening degree of the valve 112c to reduce the concentration of the mixed liquid.
  • the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a increases. Further, when the concentration becomes equal to or higher than the upper limit threshold Thb, the control unit 102 controls the valve 112c so that the opening degree of the first pipe 112a decreases. Note that when the concentration returns to the target value Gv as a result of increasing the opening degree of the valve 112c, the control unit 102 may control the valve 112c to return the opening degree of the valve 112c.
  • FIG. 8(b) shows the additional calculated concentration Ca together with the concentration Cs measured by the concentration sensor 118.
  • the additional calculated concentration Ca indicates the concentration of the newly added liquid mixture.
  • the additional calculated concentration Ca changes temporally faster than the concentration Cs measured by the concentration sensor 118. Therefore, the situation of the mixed liquid supplied to the storage tank 116 can be quickly grasped based on the additional calculated concentration Ca.
  • the concentration calculated from the first supply amount calculated by the first supply amount calculation unit 102a and the second supply amount calculated by the second supply amount calculation unit 102b is , when the additional calculated concentration Ca1 exceeds the upper limit threshold Th2, the driving of the first component liquid supply section 112, the second component liquid supply section 114, and the substrate processing unit 10 can be immediately stopped. Thereby, occurrence of troubles in the substrate processing apparatus 100 can be suppressed.
  • the calculated concentration is the concentration detected by the concentration sensor 118 ( It is preferable to compare with the detected concentration). For example, if the difference between the calculated concentration and the detected concentration is larger than a threshold value, the control unit 102 may stop driving the first component liquid supply unit 112, the second component liquid supply unit 114, and the substrate processing unit 10. .
  • the first pipe 112a and the second pipe 114a are separated from each other, but the present embodiment is not limited to this.
  • the first pipe 112a may be connected to the second pipe 114a.
  • the mixed liquid in the storage tank 116 may be circulated in the circulation path.
  • FIG. 9 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 in FIG. 9 mainly includes that the first component liquid supply section 112 and the second component liquid supply section 114 each have two types of valves, and that the first pipe 112a is connected to the second pipe 114a.
  • the concentration sensor 118 is arranged in the circulation channel
  • the mixed liquid in the storage tank 116 can be circulated
  • the processing liquid supply section further includes a flow meter
  • the valve 36 has two types of valves. Except for this, it has the same configuration as the substrate processing apparatus 100 shown in FIG. 3, and redundant description will be omitted for the purpose of avoiding redundancy.
  • the substrate processing apparatus 100 includes a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, and a concentration sensor 118.
  • the first component liquid supply unit 112 supplies hydrofluoric acid.
  • the second component liquid supply unit 114 supplies a diluting liquid.
  • the diluent includes water or deionized water (DIW).
  • the first component liquid supply section 112 includes a first pipe 112a, a first flowmeter 112b, and a valve 112c.
  • the second component liquid supply section 114 includes a second pipe 114a, a second flowmeter 114b, and a valve 114c.
  • the valve 112c includes a supply valve 112c1 and a flow rate adjustment valve 112c2.
  • the supply valve 112c1 and the flow rate adjustment valve 112c2 are arranged in the first pipe 112a.
  • the supply valve 112c1 opens or closes the first pipe 112a to switch between starting and stopping the supply of the first component liquid to the storage tank 116.
  • the supply valve 112c1 is, for example, a relief valve.
  • the flow rate adjustment valve 112c2 adjusts the flow rate of the first component liquid flowing through the first pipe 112a.
  • the flow rate adjustment valve 112c2 is, for example, a motor needle valve.
  • the valve 114c includes a supply valve 114c1 and a flow rate adjustment valve 114c2.
  • the supply valve 114c1 and the flow rate adjustment valve 114c2 are arranged in the second pipe 114a.
  • the supply valve 114c1 opens or closes the second pipe 114a to switch between starting and stopping the supply of the second component liquid to the storage tank 116.
  • the supply valve 114c1 is, for example, a relief valve.
  • the flow rate adjustment valve 114c2 adjusts the flow rate of the second component liquid flowing through the second pipe 114a.
  • the flow rate adjustment valve 114c2 is, for example, a motor needle valve.
  • the substrate processing apparatus 100 has a pipe 113 that connects to a first pipe 112a and a second pipe 114a. Piping 113 is connected to one end of first piping 112a and one end of second piping 114a. The first pipe 112a and the second pipe 114a are connected to one end of the pipe 113.
  • Either the first component liquid, the second component liquid, or the mixed liquid flows through the pipe 113.
  • the first component liquid flows into the pipe 113.
  • the valve 112c is closed and the valve 114c is opened, the second component liquid flows into the pipe 113.
  • the mixed liquid flows into the pipe 113.
  • the first component liquid flows to the storage tank 116 via the first pipe 112a and the pipe 113.
  • the second component liquid flows into the storage tank 116 via the second pipe 114a and the pipe 113. Note that when the first component liquid and the second component liquid flow through the pipe 113 at the same time, the first component liquid that has flowed through the first pipe 112a and the second component liquid that has flowed through the second pipe 114a are mixed in the pipe 113. .
  • the mixed liquid in the storage tank 116 can be circulated in the circulation path.
  • One end of the pipe 117 is connected to the storage tank 116 , and the other end of the pipe 117 is connected to the storage tank 116 .
  • the mixed liquid in the storage tank 116 can be circulated through the pipe 117.
  • the concentration sensor 118 can stably measure the concentration of the mixed liquid.
  • Concentration sensor 118 is placed in the circulation channel.
  • the processing liquid supply section 30 includes a flow meter 38 in addition to a pipe 32, a nozzle 34, and a valve 36.
  • the processing liquid supply section 30a includes a flow meter 38a in addition to a pipe 32a, a nozzle 34a, and a valve 36a.
  • the processing liquid supply section 30b includes a flow meter 38b in addition to a pipe 32b, a nozzle 34b, and a valve 36b.
  • the processing liquid supply section 30c includes a flow meter 38c in addition to a pipe 32c, a nozzle 34c, and a valve 36c.
  • the valve 36a includes a supply valve 36a1 and a flow rate adjustment valve 36a2.
  • the supply valve 36a1 and the flow rate adjustment valve 36a2 are arranged in the piping 32a.
  • the supply valve 36a1 opens or closes the pipe 32a to switch between starting and stopping the supply of the first component liquid to the nozzle 34a.
  • the supply valve 36a1 is, for example, a relief valve.
  • the flow rate adjustment valve 36a2 adjusts the flow rate of the first component liquid flowing through the pipe 32a.
  • the flow rate adjustment valve 36a2 is, for example, a motor needle valve.
  • valve 36b includes a supply valve 36b1 and a flow rate adjustment valve 36b2.
  • valve 36c includes a supply valve 36c1 and a flow rate adjustment valve 36c2.
  • the first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a are all supplied to the storage tank 116; Embodiments are not limited thereto.
  • the first processing liquid flowing through the first pipe 112a and the second processing liquid flowing through the second pipe 114a may be selectively discarded without being supplied to the storage tank 116.
  • FIG. 10 is a schematic diagram showing the piping configuration in the substrate processing apparatus 100 of this embodiment.
  • the substrate processing apparatus 100 in FIG. 10 is similar to the substrate processing apparatus 100 shown in FIG. 9, except that it further includes a waste liquid mechanism for discarding the first component liquid, the second component liquid, and the mixed liquid. It has a structure, and redundant explanation will be omitted for the purpose of avoiding redundancy.
  • the substrate processing apparatus 100 further includes a waste liquid tank 119 in addition to a first component liquid supply section 112, a second component liquid supply section 114, a storage tank 116, piping 117, and a concentration sensor 118.
  • Waste liquid tank 119 is arranged within processing liquid cabinet 110 .
  • the first component liquid flows into the waste liquid tank 119 from the first component liquid supply section 112
  • the second component liquid flows into the waste liquid tank 119 from the second component liquid supply section 114 .
  • the pipe 113 communicates the connection point between the first pipe 112a and the second pipe 114a and the storage tank 116.
  • a valve 113a is arranged in the pipe 113.
  • the valve 113a opens and closes the flow path within the pipe 113.
  • the valve 113a adjusts the opening degree of the pipe 113 to adjust the flow rate of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113.
  • a pipe 113d is connected to the pipe 113.
  • the connection point between the pipe 113 and the pipe 113d is located upstream of the valve 113a.
  • Piping 113d connects piping 113 and waste liquid tank 119.
  • a valve 113b is arranged in the pipe 113d. The valve 113b opens and closes the flow path within the pipe 113d. The valve 113b adjusts the opening degree of the pipe 113d to adjust the flow of any one of the first component liquid, the second component liquid, and the mixed liquid flowing through the pipe 113d.
  • a pipe 119a is connected to the bottom of the storage tank 116.
  • a valve 119b is arranged in the pipe 119a.
  • Valve 119b opens and closes the flow path within piping 119a.
  • Piping 119a connects storage tank 116 and waste liquid tank 119.
  • the first component liquid, the second component liquid, and the mixed liquid can selectively flow into the waste liquid tank 119.
  • the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid change into rectangular shapes, but this embodiment is limited to this. Not done.
  • the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually increase.
  • the valves 112c and 114c are changed from the open state to the closed state, the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid may gradually decrease. In this case, a portion where the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid have a large change may be discarded without being supplied to the storage tank 116.
  • FIGS. 11(a) and 11(b) are graphs showing changes in the flow rates of the first processing liquid and the second processing liquid.
  • the flow rate Va of the first component liquid changes with time.
  • the first flow meter 112b measures the flow rate Va of the first component liquid.
  • the valve 112c opens, the flow rate Va of the first component liquid increases with time. Thereafter, when the valve 112c is completely opened, the flow rate Va of the first component liquid reaches a peak.
  • the flow rate Va of the first component liquid varies. Thereafter, when the valve 112c is closed, the flow rate Va of the first component liquid gradually decreases.
  • the flow rate Vb of the second component liquid changes with time.
  • the second flow meter 114b measures the flow rate Vb of the second component liquid.
  • the valve 114c opens, the flow rate Vb of the second component liquid increases with time. Thereafter, when the valve 114c is completely opened, the flow rate Vb of the second component liquid reaches a peak.
  • the flow rate Vb of the second component liquid varies. Thereafter, when the valve 114c is closed, the flow rate Vb of the second component liquid gradually decreases.
  • the first supply amount calculation unit 102a may count the first supply amount as the first supply amount after the flow rate Va of the first component liquid exceeds a predetermined value. Further, the first supply amount calculation unit 102a does not need to count the first supply amount after the control unit 102 outputs a signal to close the valve 112c.
  • the second supply amount calculation unit 102b may count the second supply amount as the second supply amount after the flow rate Vb of the second component liquid exceeds a predetermined value. Further, the second supply amount calculation unit 102b does not need to count the second supply amount after the control unit 102 outputs a signal to close the valve 112c. In this case, the valve 113b may be closed and the valve 113a may be opened at the same timing when the first supply amount calculation unit 102a starts calculating the supply amount.
  • the first supply amount calculation unit 102a calculates the first supply amount Sa based on the temporal change in the flow rate Va of the first component liquid.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the temporal change in the flow rate Va of the first component liquid within the range from time T1 to time T2.
  • the first supply amount calculation unit 102a can calculate the first supply amount Sa by integrating the flow rate Va of the first component liquid.
  • the second supply amount calculation unit 102b calculates the second supply amount Sb based on the temporal change in the flow rate Vb of the second component liquid.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the temporal change in the flow rate Vb of the second component liquid within the range from time T1 to time T2.
  • the second supply amount calculation unit 102b can calculate the second supply amount Sb by integrating the flow rate Vb of the second component liquid.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid from a value from a certain time T1 to another time T2.
  • the value may be used as the basis for calculating the first supply amount Sa and the second supply amount Sb.
  • the liquid will flow to the waste liquid tank 119 without any waste.
  • the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb.
  • Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 before Vb is sometimes referred to as pre-drain.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of pre-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb.
  • the pre-drain period is 1 second or more and 5 seconds or less.
  • the first component liquid supply unit 112 supplies the first component liquid to the first pipe 112a before time T1.
  • this step by the first component liquid supply section 112 may be referred to as a first component liquid pre-supply step.
  • the second component liquid supply unit 114 supplies the second component liquid to the second pipe 114a before time T1.
  • this step by the second component liquid supply unit 114 may be referred to as a second component liquid pre-supply step.
  • the first component liquid flowing through the first pipe 112a is The first component liquid and the second component liquid flowing through the second pipe 114a flow into the waste liquid tank 119 without flowing into the storage tank 116.
  • the flow rate Va of the first component liquid and the flow rate of the second component liquid are used by the first supply amount calculation unit 102a and the second supply amount calculation unit 102b to calculate the first supply amount Sa and the second supply amount Sb. Flowing the first component liquid and the second component liquid into the waste liquid tank 119 without flowing into the storage tank 116 after Vb is sometimes referred to as post-drain.
  • the first supply amount calculation unit 102a and the second supply amount calculation unit 102b calculate the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid at the time of post-drain into the first supply amount Sa and the second supply amount Sa. It is preferable not to count it as Sb.
  • the post-drain period is greater than or equal to 1 second and less than or equal to 5 seconds.
  • the first component liquid from the first component liquid supply section 112 flows through the second pipe 114a after time T2.
  • the process in which the first component liquid flows from the first component liquid supply section 112 in this manner may be referred to as a first component liquid post-supply process.
  • the second component liquid from the second component liquid supply section 114 flows through the second pipe 114a after time T2.
  • the process in which the second component liquid flows from the second component liquid supply section 114 in this manner may be referred to as a second component liquid post-supply process.
  • FIGS. 12A and 12B are flowcharts of the substrate processing method of this embodiment. Note that the flowcharts in FIGS. 12A and 12B are similar to the flowchart shown in FIG. 7 except that pre-draining and post-draining are mainly performed, and redundant explanation will be omitted for the purpose of avoiding redundancy.
  • step S110a pre-draining is started in step S110a.
  • the control unit 102 closes the valve 113a and opens the valve 113b.
  • step S110 proceeds to step S110.
  • step S110 supply of the first component liquid and the second component liquid is started.
  • the first component liquid supply unit 112 starts supplying the first component liquid via the first pipe 112a.
  • the second component liquid supply unit 114 starts supplying the second component liquid via the second pipe 114a.
  • the control unit 102 opens the supply valve 112c1 and flow rate adjustment valve 112c2 of the first component liquid supply unit 112, and also opens the supply valve 114c1 and flow rate adjustment valve 114c2 of the second component liquid supply unit 114.
  • the first component liquid and the second component liquid flow to the waste liquid tank 119 via the pipe 113d.
  • the process proceeds to step S110b.
  • step S110b the flow rates of the first component liquid and the second component liquid are measured.
  • the first flow meter 112b measures the flow rate of the first component liquid flowing through the first pipe 112a.
  • the second flow meter 114b measures the flow rate of the second component liquid flowing through the second pipe 114a.
  • the process proceeds to step S110c.
  • step S110c it is determined whether the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions. Specifically, the control unit 102 determines whether the flow rate Va of the first component liquid exceeds a threshold value. Further, the control unit 102 determines whether the flow rate Vb of the second component liquid exceeds a threshold value.
  • step S110c If the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions (Yes in step S110c), the process proceeds to step S110e. On the other hand, if either the flow rate Va of the first component liquid or the flow rate Vb of the second component liquid does not satisfy the conditions (No in step S110c), the process proceeds to step S110d.
  • step S110d the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled based on the flow rate of the first component liquid and the flow rate of the second component liquid. For example, when the flow rate of the first component liquid is less than the threshold value, the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. For example, the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
  • the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the process returns to step S110c.
  • the first component liquid supply unit 112 and/or the second component liquid supply unit 114 are controlled until the flow rate Va of the first component liquid and the flow rate Vb of the second component liquid satisfy the conditions.
  • step S110e the concentration of the mixed liquid flowing through the pipe 113d is calculated from the flow rate of the first component liquid and the flow rate of the second component liquid.
  • the control unit 102 calculates the concentration of the mixed liquid flowing through the pipe 113d based on the ratio of the flow rate of the first component liquid and the flow rate of the second component liquid.
  • step S110f the process proceeds to step S110f.
  • step S110f it is determined whether the calculated density (calculated density) satisfies the condition. For example, the control unit 102 determines whether the calculated concentration is within a normal range.
  • step S110f If the calculated density satisfies the conditions (Yes in step S110f), the process proceeds to step S110h. On the other hand, if the calculated concentration does not satisfy the conditions (No in step S110f), the process proceeds to step S110g.
  • step S110g the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled based on the calculated concentration.
  • the control unit 102 controls the first component liquid supply unit 112 so that the flow rate of the first component liquid increases. .
  • the control unit 102 increases the opening degree of the valve 112c of the first component liquid supply unit 112.
  • the control unit 102 controls the second component liquid supply unit 114 so that the flow rate of the second component liquid increases. For example, the control unit 102 increases the opening degree of the valve 114c of the second component liquid supply unit 114.
  • the process returns to step S110f.
  • the first component liquid supply section 112 and/or the second component liquid supply section 114 are controlled until the concentration of the mixed liquid flowing through the pipe 113d satisfies the conditions.
  • step S110h the pre-drain is finished.
  • the control unit 102 opens the valve 113a and closes the valve 113b. Thereby, the first component liquid and the second component liquid flow into the storage tank 116 via the pipe 113.
  • step S120 Steps S120 to S150 are the same as those in FIG.
  • step S150 it is determined whether the supply of the component liquid to the storage tank 116 is completed.
  • a liquid amount detection sensor that detects the amount of the mixed liquid in the storage tank 116 detects the amount of the mixed liquid in the storage tank 116 . If the detected liquid amount is larger than the threshold value, the control unit 102 determines that supply of the component liquid to the storage tank 116 is completed. On the other hand, if the detected liquid amount is less than or equal to the threshold value, the control unit 102 determines to continue supplying the component liquid to the storage tank 116.
  • step S150 If the supply of the component liquid to the storage tank 116 is completed (Yes in step S150), the process proceeds to step S160a. On the other hand, if the supply of the component liquid to the storage tank 116 is completed (No in step S150), the process returns to step S140. In this case, until the supply of the component liquid to the storage tank 116 is completed, the first component liquid supply unit 112 and/or the second component liquid are supplied based on the supply amount of the first component liquid and the supply amount of the second component liquid. The supply unit 114 is controlled.
  • step S160a post drain is started.
  • the control unit 102 closes the valve 113a and opens the valve 113b.
  • the control section 102g may control the valve 112c of the first component liquid supply section 112 and the valve 114c of the second component liquid supply section 114 to close.
  • the process proceeds to step S160.
  • step S160 the flow of the first component liquid and the second component liquid is stopped.
  • the supply of the first component liquid to the storage tank 116 via the first pipe 112a is stopped.
  • the supply of the second component liquid to the storage tank 116 via the second pipe 114a is stopped.
  • step S160b the post drain ends.
  • the control unit 102 closes the valve 113a and the valve 113b.
  • step S170 the process proceeds to step S170. Steps S170 to S190 are the same as those in FIG. 7.
  • pre-draining and post-draining are performed before and after supplying the first component liquid and the second component liquid to the storage tank 116.
  • the calculation control is performed while avoiding the influence of the pre-drain period and the post-drain period in which the flow rate changes significantly, so that the first component liquid supply section 112 and the second component liquid supply section 114 can be controlled with high precision.
  • the substrate processing unit 10 is a single-wafer type, and the mixed liquid in the storage tank 116 is supplied to the substrate W in the chamber 11. is not limited to this.
  • the substrate processing unit 10 is of a batch type, and the mixed liquid in the storage tank 116 may be supplied to the processing tank.
  • FIG. 13 is a schematic diagram of the substrate processing apparatus 100.
  • the substrate processing apparatus 100 includes substrate processing units 10A to 10C as the substrate processing unit 10.
  • the substrate processing units 10A to 10C are batch type.
  • the substrate processing unit 10A includes a processing tank 40a and a lifter 50a.
  • the processing tank 40a stores a processing liquid for processing the substrate W.
  • a mixed liquid is supplied as a processing liquid to the processing tank 40a.
  • the mixed liquid in the storage tank 116 is supplied to the processing tank 40a via the pipe 32a.
  • the lifter 50a holds the substrate W.
  • the normal direction of the main surface of the substrate W held by the lifter 50a is parallel to the horizontal direction.
  • the plurality of substrates W are arranged in a line along the horizontal direction.
  • the plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
  • the lifter 50a holds a plurality of substrates W together. For example, the lifter 50a moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
  • the substrate processing unit 10B like the substrate processing unit 10A, includes a processing tank 40b and a lifter 50b. Further, the substrate processing unit 10C includes a processing tank 40c and a lifter 50c similarly to the substrate processing unit 10A.
  • the component liquids supplied to the storage tank 116 can be quickly controlled.
  • the substrate processing unit 10 is a batch type, but the present embodiment is not limited to this.
  • the storage tank 116 is a batch type processing tank and may also be used as the substrate processing unit 10.
  • FIG. 14 is a schematic diagram of the substrate processing apparatus 100.
  • the substrate processing apparatus 100 includes a storage tank 116 as the substrate processing unit 10.
  • the storage tank 116 functions as a so-called batch type processing tank.
  • the substrate processing apparatus 100 includes a storage tank 116 and a lifter 60.
  • the storage tank 116 stores a processing liquid for processing the substrate W.
  • a mixed liquid is supplied to the storage tank 116 as a processing liquid.
  • the first component liquid and the second component liquid are supplied to the storage tank 116 via the first pipe 112a, the second pipe 114a, and the pipe 113.
  • the lifter 60 holds the substrate W.
  • the normal direction of the main surface of the substrate W held by the lifter 60 is parallel to the horizontal direction.
  • the plurality of substrates W are arranged in a line along the horizontal direction.
  • the plurality of substrates W are arranged substantially parallel in the horizontal direction. Further, the normal line of each of the plurality of substrates W extends in the horizontal direction.
  • the lifter 60 holds a plurality of substrates W together. For example, the lifter 60 moves vertically upward or vertically downward along the vertical direction while holding the substrate W.
  • the substrate processing apparatus 100 of this embodiment even if the storage tank 116 is a batch type processing tank, the component liquids supplied to the storage tank 116 can be quickly controlled.
  • the present invention is suitably used in a substrate processing apparatus and a substrate processing method.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

L'invention concerne un dispositif de traitement de substrat (100), dans lequel une unité de commande (102) : calcule, sur la base d'un résultat de mesure d'un premier débitmètre (112b), une première quantité d'alimentation d'un premier composant liquide fourni par une première unité d'alimentation en composant liquide (112) à un réservoir de stockage (116) par l'intermédiaire d'un premier tuyau (112a); calcule, sur la base d'un résultat de mesure d'un second débitmètre (114b), une seconde quantité d'alimentation d'un second composant liquide fourni par une seconde unité d'alimentation en composant liquide (114) au réservoir de stockage (116) par l'intermédiaire d'un second tuyau (114a); et commande la première unité d'alimentation en composant liquide (112) et la seconde unité d'alimentation en composant liquide (114) sur la base de la première quantité d'alimentation et de la seconde quantité d'alimentation pendant une période d'alimentation en composant liquide qui est au moins une période parmi une période pendant laquelle la première unité d'alimentation en composant liquide (112) fournit un premier composant par l'intermédiaire du premier tuyau (112a) et une période pendant laquelle la seconde unité d'alimentation en composant liquide (114) fournit un second composant par l'intermédiaire du second tuyau (114a).
PCT/JP2023/010642 2022-03-25 2023-03-17 Dispositif de traitement de substrat et procédé de traitement de substrat WO2023182218A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306089A (ja) * 2007-06-11 2008-12-18 Panasonic Corp 浸漬式洗浄装置
JP2010232520A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 処理液供給装置および処理液供給方法
JP2020198357A (ja) * 2019-05-31 2020-12-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306089A (ja) * 2007-06-11 2008-12-18 Panasonic Corp 浸漬式洗浄装置
JP2010232520A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 処理液供給装置および処理液供給方法
JP2020198357A (ja) * 2019-05-31 2020-12-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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