WO2023179283A1 - 控制器 - Google Patents

控制器 Download PDF

Info

Publication number
WO2023179283A1
WO2023179283A1 PCT/CN2023/077680 CN2023077680W WO2023179283A1 WO 2023179283 A1 WO2023179283 A1 WO 2023179283A1 CN 2023077680 W CN2023077680 W CN 2023077680W WO 2023179283 A1 WO2023179283 A1 WO 2023179283A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
chips
chip
thermally conductive
heat dissipation
Prior art date
Application number
PCT/CN2023/077680
Other languages
English (en)
French (fr)
Inventor
刘帅杰
施皆佩
蔡云跃
Original Assignee
蔚来汽车科技(安徽)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蔚来汽车科技(安徽)有限公司 filed Critical 蔚来汽车科技(安徽)有限公司
Publication of WO2023179283A1 publication Critical patent/WO2023179283A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the technical field of controllers, and specifically provides a controller.
  • the vehicle controller plays a decisive role in the normal and safe driving of the vehicle.
  • the controller on the existing vehicle includes multiple PCBA modules and heat dissipation structures.
  • the chips and other devices in the PCBA module will generate heat, which will increase the internal ambient temperature of the controller and affect the performance of the chip.
  • a commonly used method is to add a thermal pad between the chip and the heat dissipation structure, so that the heat in the chips with different heights is Both can be transferred to the same heat dissipation structure for heat dissipation.
  • this field needs a new controller to solve the problems existing in the existing technology.
  • the present invention aims to solve the above technical problems, that is, to solve the problem that the assembly tolerance between the chip and the heat dissipation structure in the existing PCBA module is large, which affects the heat dissipation effect of the chip.
  • the invention provides a controller, which includes a body and a PCBA module arranged on the body.
  • the PCBA module includes a PCB board and a chip fixed on the surface of the PCB board.
  • a thermal conductive member that can move in a direction perpendicular to the surface of the PCB board is disposed between the chip and the body, an elastic member is disposed between the thermal conductive member and the body, and a heat dissipation member is connected to the thermal conductive member.
  • the chip abuts on the first side of the thermally conductive member, one end of the elastic member abuts on the body, and the other end of the elastic member abuts on the thermally conductive member. on the second side of the member.
  • the chip is fixed on the PCB board, a thermal conductive member that can move in a direction perpendicular to the surface of the PCB board is disposed between the chip and the body, and an elastic member is disposed between the thermal conductive member and the body, In the installed state, one end of the elastic member is against the body, and the other end of the elastic member is against the thermally conductive member. Under the action of the rebound force of the elastic member, the thermally conductive member can always be closely and firmly connected to the chip.
  • the elastic member is a plurality of springs evenly arranged between the thermally conductive member and the body.
  • multiple springs are evenly arranged between the thermally conductive component and the body, thereby providing stable and powerful support to the thermally conductive component, so that the thermally conductive component can always be in close contact with the chip for effective heat dissipation, and in the PCBA module When subjected to vibration, multiple springs can have a good shock-absorbing effect, and the PCB board and chip are not easily damaged.
  • a layer of thermally conductive material is provided between the first side of the thermally conductive member and the chip.
  • the thermally conductive material layer between the first side of the thermally conductive member and the chip can be used to further dissipate heat from the PCB board and chip, increase the heat transfer speed of the chip, and avoid damage to the PCB board and chip due to overheating. This enables the chips on the PCB to run stably for a long time.
  • the elastic member is a bellows.
  • a cooling chamber is provided in the body, and an inlet and an outlet connected to the cooling chamber are provided on the body.
  • the inlet, the cooling chamber and the outlet form a supply chain. Cooling channels for coolant circulation.
  • the inlet, cooling cavity and outlet jointly form a cooling channel for the cooling liquid to circulate.
  • the cooling liquid has the largest heat capacity and the best heat dissipation effect.
  • the circulation of the cooling liquid can further accelerate the heat transfer in the cooling cavity and further improve The heat dissipation speed of the chip.
  • a thermally conductive partition is provided in the cooling cavity.
  • the heat transfer speed can be increased through the thermally conductive partition in the cooling cavity, and the heat dissipation efficiency can be further improved.
  • the heat dissipation component includes a heat pipe.
  • one side of the heat pipe is connected to the heat conductive member, and the other side of the heat pipe is against the body.
  • the heat pipe is in a ring shape, one side of the heat pipe is welded to the second side of the heat conductive member, and a part of the other side of the heat pipe is welded to the body.
  • the heat pipe is arranged in a ring shape, and one side of the heat pipe is welded to the heat-conducting member, and a part of the other side of the heat pipe is welded to the body, which can increase the contact area between the heat pipe, the heat-conducting member and the body, thereby increasing the heat dissipation speed. , and a part of the heat pipe is welded to the body, so that the heat pipe retains a part of the non-welded area to facilitate the movement of the heat-conducting component.
  • a guide structure is provided on the body, and the guide structure is used to limit the movement direction of the thermally conductive member.
  • connection stability of the thermally conductive component and the body can be improved through the guide structure, ensuring that the thermally conductive component and the chip can always be closely attached.
  • Figure 1 is a schematic structural diagram of a controller in an embodiment of the present invention
  • Figure 2 is a schematic structural diagram of a thermally conductive component in an embodiment of the present invention.
  • Figure 3 is an exploded view of the controller in an embodiment of the present invention.
  • Figure 4 is an exploded view 2 of the controller in an embodiment of the present invention.
  • Figure 5 is a cross-sectional view of a controller in an embodiment of the present invention.
  • the terms "setting”, “installation” and “connection” should be understood in a broad sense.
  • it can be a fixed connection or a fixed connection.
  • It is a detachable connection or an integral connection; it can be directly connected or indirectly connected through an intermediary, or it can be an internal connection between two components.
  • the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
  • the present invention provides a controller that aims to utilize the rebound force of the elastic member.
  • the thermally conductive component and the chip can always be in close and stable full contact, thereby transferring the heat generated on the chip to the thermally conductive component and the heat dissipation component for effective heat dissipation, improving the heat dissipation efficiency of the chip, extending the service life of the chip, and making the chip It can operate stably for a long time.
  • FIGS. 1 to 5 The controller of the present invention will be described in detail below with reference to FIGS. 1 to 5 .
  • Figure 1 is a schematic structural diagram of the controller in an embodiment of the present invention
  • Figure 2 is a schematic structural diagram of the thermal conductive component in an embodiment of the present invention
  • Figure 3 is an exploded view of the controller in an embodiment of the present invention.
  • Figure 4 is an exploded view of the controller in one embodiment of the present invention
  • Figure 5 is a cross-sectional view of the controller in one embodiment of the present invention.
  • the controller includes a body 1 and a PCBA module 2.
  • PCBA module 2 includes a middle layer board 20 and a PCB board 21 fixed on the surface of the middle layer board 20.
  • chips 22 are fixed on the PCB board 21.
  • the thermally conductive member 23 moves in the direction of the surface of the plate 21 .
  • those skilled in the art can flexibly adjust the number of chips 22 according to usage requirements.
  • the thermal conductive member 23 is a thermal conductive plate made of metal. Silver with a higher thermal conductivity can be used as the material of the heat conduction plate, or alloy aluminum with higher strength can be used as the material of the heat conduction plate. It should be noted that the above arrangement of the heat conduction component 23 is only an exemplary arrangement and does not apply. This constitutes a limitation on the scope of protection of the present invention. In practical applications, the shape and material of the thermally conductive member 23 can be flexibly adjusted, as long as the heat dissipation performance is ensured and it fits the shape of the chip 22 .
  • an elastic member 24 is provided between the thermal conductive member 23 and the body 1.
  • the elastic member 24 is a spring.
  • the spring is made of insulating material, or stainless steel or other materials suitable for springs.
  • the number of springs is 4. They are evenly arranged on the thermally conductive member 23 in a 2 ⁇ 2 array. In the installed state, one end of the spring abuts the body 1 and the other end of the spring abuts the thermally conductive member 23 .
  • the above arrangement is only an exemplary arrangement and does not limit the protection scope of the present invention. In practical applications, the number and position of springs and other characteristics can be flexibly adjusted. For example, the number of springs can be 6. According to A 2 ⁇ 3 array is provided on the thermally conductive member 23 .
  • the heat conductive member 23 is connected to a heat dissipation member 25 , the heat dissipation member 25 is a heat pipe, and the heat pipe is in the shape of a ring.
  • One side of the heat pipe is connected to the heat conductive member 23 , and the other side of the heat pipe is against the body 1 .
  • the heat pipe, the heat conductive member 23 and the body 1 may be connected together by welding or bonding. Specifically, one side of the ring-shaped heat pipe is fixed to the heat conductive member 23 through reflow soldering, and a part of the other side of the heat pipe is fixed to the body 1 through reflow soldering to maintain the flexibility of the heat pipe.
  • thermally conductive material layer is provided between the chip 22 and the first side of the thermally conductive member 23, and thermally conductive silicone grease, thermally conductive gel and other heat dissipation materials can be used. Apply thermally conductive silicone grease on the surface of the chip 22 , or set a compressible thermally conductive film about 1 mm thick on the surface of the chip 22 . Thermal grease may also be applied to the first side of the thermally conductive member 23 .
  • the main body 1 is provided with a guide structure 26 for limiting the moving direction of the thermally conductive member 23.
  • the guide structure 26 can fix the thermally conductive member 23 on the main body 1 by welding, or by screwing the thermally conductive member 23. 23 is fixed on the body 1.
  • a cooling chamber 3 is provided inside the body 1, and a cooling chamber 3 connected to the cooling chamber 3 is provided on the body 1.
  • the inlet 31 and the outlet 32 are connected, and the inlet 31, the cooling cavity 3 and the outlet 32 form a cooling channel for the cooling liquid to circulate, and the cooling channel is a planar loop cooling channel.
  • the coolant can be water or a mixture of water and alcohol.
  • the outlet 32 is arranged near the inlet 31 so that the overall flow direction of the cooling liquid tends to be the same as that of the cooling cavity 3 and the cooling is relatively uniform. It should be noted that the above-mentioned specific locations of the inlet 31 and the outlet 32 are only an exemplary arrangement. The specific locations of the inlet 31 and the outlet 32 can be flexibly adjusted according to actual applications, as long as they facilitate the circulation of coolant.
  • the cooling cavity 3 is provided with a thermally conductive partition 33.
  • the thermally conductive partition 33 can be made of materials with good thermal conductivity such as beryllium copper alloy.
  • the coolant directly contacts the thermally conductive partition 33, so that heat can be transferred quickly and the heat dissipation efficiency is improved.
  • the middle layer board 20 and the PCB board 21 and the chip 22 fixed thereto are fastened to the body 1, and the chip 22 is directly opposite to the thermal conductive member 23.
  • the chip 22 Under the action of the rebound force of the elastic member 24, the chip 22 can always be Tightly and firmly fit together with the thermally conductive member 23 to transfer heat.
  • the heat generated when the PCB board 21 and the chip 22 are running is first transferred to the thermally conductive silicone grease.
  • the thermally conductive silicone grease transfers the heat generated by the chip 22 to the thermally conductive member 23 and the heat dissipation member 25, thereby transferring the heat to the cooling cavity 3, using Coolant dissipates heat efficiently.
  • the rebound force of the elastic member 24 can be used to ensure that the pressure of the thermal conductive member 23 tightly against the surface of the chip 22 reaches a stable and balanced state, thereby effectively reducing its thermal resistance and improving the overall heat dissipation effect. Moreover, it avoids the situation that the large assembly tolerance between the chip 22 and the thermal conductive member 23 affects the heat dissipation effect of the PCB board 21 and the chip 22. At the same time, it can reduce the pressure on the chip 22 due to the large tolerance and improve the heat dissipation of the chip 22. The efficiency extends the service life of the chip 22, allowing the chip 22 to operate stably for a long time.
  • the main body 1 shown in Figure 1 is a rectangular parallelepiped, this is only a schematic illustration, and the shape of the main body 1 can be designed according to the shape of the PCB board 21, the shape of the work space and other specific conditions, for example, If the shape of the PCB board is circular, the main body can be a cylinder; the PCB board working space is a special-shaped space, and the main body can be designed into a corresponding special shape to facilitate the installation of PCB board components in the special-shaped space.
  • the elastic member 24 is only a preferred arrangement.
  • the elastic member 24 can also be an elastic diaphragm, or the spring can be replaced by a bellows, as long as the chip 22 can always be in contact with the bellows. It suffices that the thermally conductive members 23 are in close contact with each other.
  • the above-mentioned arrangement of the heat dissipation component 25 is only a preferred arrangement. In practical applications, those skilled in the art can choose to use heat dissipation fins for heat dissipation, or use heat pipes and heat dissipation fins to dissipate heat in another way. In a possible installation method, the heat dissipation component can also be a radiator with a fan.
  • cooling cavity 3 is only an exemplary arrangement.
  • the heating module can also be cooled and dissipated through cooling fins, and the cooling fins can be made of metallic copper or aluminum.
  • cooling cavity 3 and heat dissipation member 25 of the above embodiment may not be provided.
  • the controller provided in this embodiment can be applied to vehicles or other electronic devices, and can achieve the beneficial effects of the PCBA module in any of the above embodiments, which will not be described again here.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及控制器技术领域，旨在解决现有的PCBA模块中的芯片与散热结构之间的装配公差较大，影响芯片散热效果的问题，本发明提供一种控制器，包括本体及PCBA模块，PCBA模块包括PCB板及芯片，芯片与本体之间设有导热构件，导热构件与本体之间设有弹性构件，导热构件上连接有散热构件，芯片抵靠在导热构件的第一侧，弹性构件一端抵靠在本体上，弹性构件另一端抵靠在导热构件的第二侧。在弹性构件的反弹力下，导热构件始终与芯片紧密而稳固地充分接触，将芯片上的热量传递到导热构件上，通过散热构件有效地散热，避免导热构件与芯片之间的装配公差较大，影响芯片散热效果的情况发生，提高芯片的散热效率，使得芯片能够长久稳定地运行使用。

Description

控制器
本申请要求2022年03月23日提交的、发明名称为“控制器”的中国专利申请CN 202220652598.2的优先权，上述中国专利申请的全部内容通过引用并入本申请中。
技术领域
本发明涉及控制器技术领域，具体提供一种控制器。
背景技术
整车控制器作为车辆的重要电子控制单元，对车辆的正常、安全驾驶起到举足轻重的作用。现有车辆上的控制器中包括多个PCBA模块和散热结构，控制器运行时，PCBA模块中的芯片等器件会产生热量，使控制器内部环境温度升高，影响芯片的性能。由于PCBA模块中的芯片的高低有所差别，所以为了将芯片的热量传递到散热结构上，目前普遍采用的方法是在芯片和散热结构之间加导热垫，从而使得高度不同的芯片中的热量均能传递至同一散热结构以便散热，但在实际应用中，由于制造精度、装配精度等因素的限制，导热垫与芯片之间的装配公差较大，芯片与导热垫之间并不能良好接触，在一定程度上影响了芯片的散热效果。
相应地，本领域需要一种新的控制器来解决现有技术中所存在的问题。
发明内容
本发明旨在解决上述技术问题，即解决现有的PCBA模块中的芯片与散热结构之间的装配公差较大，影响芯片的散热效果的问题。
本发明提供一种控制器，包括本体以及设置在所述本体上的PCBA模块，所述PCBA模块包括PCB板以及固定在所述PCB板表面的芯片，所述 芯片与所述本体之间设置有能够沿垂直于所述PCB板表面的方向移动的导热构件，所述导热构件与所述本体之间设置有弹性构件，所述导热构件上连接有散热构件，在安装好的状态下，所述芯片抵靠在所述导热构件的第一侧上，所述弹性构件的一端抵靠在所述本体上，所述弹性构件的另一端抵靠在所述导热构件的第二侧上。
通过上述的设置，将芯片固定在PCB板上，在芯片和本体之间设置有能够沿垂直于所述PCB板表面的方向移动的导热构件，并且在导热构件和本体之间设置有弹性构件，在安装好的状态下，弹性构件的一端抵靠在本体上，弹性构件的另一端抵靠在导热构件上，在弹性构件的反弹力的作用下，导热构件能够始终与芯片紧密而稳固地充分接触，从而将芯片上产生的热量传递到导热构件上，通过与导热构件连接的散热构件进行有效地散热，避免了导热构件与芯片之间的装配公差较大，影响芯片的散热效果的情况发生，同时能够减轻芯片由于公差较大受到的压力，提高了芯片的散热效率，延长了芯片的使用寿命，使得芯片能够长久稳定地运行使用。
在上述控制器的优选技术方案中，所述弹性构件为均匀设置在所述导热构件与所述本体之间的多个弹簧。
通过上述的设置，将多个弹簧均匀地设置在导热构件与本体之间，从而给导热构件提供稳定且有力的支撑，使得导热构件能够始终与芯片紧贴在一起进行有效散热，并且在PCBA模块受到震动时，多个弹簧能够起到良好地减震效果，PCB板和芯片不易受损。
在上述控制器的优选技术方案中，所述导热构件的第一侧与所述芯片之间设有导热材料层。
通过上述的设置，能够利用导热构件的第一侧与芯片之间的导热材料层对PCB板和芯片进一步地散热，提高芯片的热传递速度，避免PCB板和芯片因为过热而损坏的情况发生，使得PCB板上的芯片能够长久稳定地运行使用。
在上述控制器的优选技术方案中，所述弹性构件为波纹管。
在上述控制器的优选技术方案中，所述本体内设置有冷却腔，所述本体上设置有与所述冷却腔连通的进口和出口，所述进口、所述冷却腔和所述出口形成供冷却液流通的冷却通道。
通过上述的设置，进口、冷却腔和出口共同形成了供冷却液流通的冷却通道，冷却液的热容最大，散热效果最好，冷却液的流通能够进一步加速冷却腔内的热量传递，进一步提高芯片的散热速度。
在上述控制器的优选技术方案中，所述冷却腔内设置有导热隔板。
通过上述的设置，能够通过冷却腔内的导热隔板提高热量的传递速度，进一步提高散热效率。
在上述控制器的优选技术方案中，所述散热构件包括热管。
在上述控制器的优选技术方案中，所述热管的一侧与所述导热构件连接，所述热管的另一侧抵靠在所述本体上。
通过上述的设置，提高热管的安装可靠性和散热稳定性。
在上述控制器的优选技术方案中，所述热管呈环形状，所述热管的一侧焊接在所述导热构件的第二侧，所述热管的另一侧的一部分焊接在所述本体上。
通过上述的设置，热管设置成环形状，并且热管的一侧焊接在导热构件上，热管的另一侧的一部分焊接在本体上，能够增加热管与导热构件和本体的接触面积，进而提高散热速度，并且热管的一部分焊接在本体上，使得热管保留了一部分非焊接区域，方便导热构件的移动。
在上述控制器的优选技术方案中，所述本体上设置有导向结构，所述导向结构用于限定所述导热构件的移动方向。
通过上述的设置，能够通过导向结构提高导热构件与本体的连接稳定性，保证导热构件与芯片之间始终能够紧密贴合。
附图说明
下面结合附图来描述本发明的优选实施方式，附图中：
图1是本发明一种实施例中控制器的结构示意图；
图2是本发明一种实施例中导热构件的结构示意图；
图3是本发明一种实施例中控制器的爆炸图一；
图4是本发明一种实施例中控制器的爆炸图二；
图5是本发明一种实施例中控制器的剖视图；
附图标记列表：
1、本体；2、PCBA模块；20、中层板；21、PCB板；22、芯片；
23、导热构件；24、弹性构件；25、散热构件；26、导向构件；3、冷却腔；31、进口；32、出口；33、导热隔板。
具体实施方式
下面参照附图来描述本发明的优选实施方式。本领域技术人员应当理解的是，这些实施方式仅仅用于解释本发明的技术原理，并非旨在限制本发明的保护范围。
需要说明的是，在本发明的描述中，术语“上”、“内”等指示的方向或位置关系的术语是基于附图所示的方向或位置关系，这仅仅是为了便于描述，而不是指示或暗示装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
此外，还需要说明的是，在本发明的描述中，除非另有明确的规定和限定，术语“设置”、“安装”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域技术人员而言，可根据具体情况理解上述术语在本发明中的具体含义。
基于背景技术中提到的现有的PCBA模块中的芯片与散热结构之间的装配公差较大，影响芯片的散热效果的问题，本发明提供一种控制器，旨在利用弹性构件的反弹力使得导热构件与芯片能够始终紧密而稳固地充分接触，从而将芯片上产生的热量传递到导热构件与散热构件上进行有效地散热，提高了芯片的散热效率，延长了芯片的使用寿命，使得芯片能够长久稳定地运行使用。
下面参照图1至图5对本发明的控制器进行详细描述。其中，图1是本发明一种实施例中控制器的结构示意图；图2是本发明一种实施例中导热构件的结构示意图；图3是本发明一种实施例中控制器的爆炸图一；图4是本发明一种实施例中控制器的爆炸图二；图5是本发明一种实施例中控制器的剖视图。
具体地，如图1至图4所示，控制器包括本体1以及设置在本体1上的 PCBA模块2，PCBA模块2包括中层板20以及固定在中层板20的表面上的PCB板21，PCB板21上固定有四个芯片22，芯片22与本体1之间设置有能够沿垂直于PCB板21表面的方向移动的导热构件23。在实际应用中，本领域技术人员可以根据使用需求来灵活调整芯片22的数量。
导热构件23为金属材质的导热板。可以选用热传导系数较高的银作为导热板的材质，也可以选用强度较大的合金铝作为导热板的材质，需要说明的是，上述导热构件23的设置只是一种示例性的设置方式，不构成对本发明的保护范围的限制，在实际应用中可以灵活调整导热构件23的形状和材质，只要在保证散热性能的同时，与芯片22的形状贴合即可。
参照图2，导热构件23与本体1之间设置有弹性构件24，弹性构件24选用的是弹簧，弹簧选用绝缘材料，或者选用不锈钢材或其它适合做弹簧的材料，弹簧的数量为4个，按照2×2的阵列形式均匀地设置在导热构件23上，在安装好的状态下，弹簧的一端抵靠在本体1上，弹簧的另一端抵靠在导热构件23上。需要说明的是，上述的设置只是一种示例性的设置方式，不构成对本发明的保护范围的限制，在实际应用中可以灵活调整弹簧的数量和位置等特征，例如弹簧可以为6个，按照2×3的阵列形式设置在导热构件23上。
参照图3至图5，导热构件23上连接有散热构件25，散热构件25为热管，热管呈环形状。热管的一侧与导热构件23连接，热管的另一侧抵靠在本体1上。热管与导热构件23和本体1可以通过焊接或者粘接连接在一起。具体地，将环形状的热管的一侧通过回流焊固定在导热构件23上，热管的另一侧的一部分通过回流焊固定在本体1上，以保持热管的柔性。
在芯片22和导热构件23的第一侧之间设有导热材料层，可以选用导热硅脂或者导热凝胶等散热材料。将导热硅脂涂抹在芯片22的表面上，或者，在芯片22的表面设置约1mm厚的可压缩的导热膜。也可将导热脂涂抹在导热构件23的第一侧上。
参照图2，本体1上设置有用于限定导热构件23的移动方向的导向结构26，导向结构26可以通过焊接的方式将导热构件23固定在本体1上，也可以通过螺接的方式将导热构件23固定在本体1上。
参照图5，本体1内部设置有冷却腔3，本体1上设置有与冷却腔3连 通的进口31和出口32，进口31、冷却腔3和出口32形成供冷却液流通的冷却通道，冷却通道为平面回路式冷却通道。冷却液可以选用水，或者将水与酒精的混合物作为冷却液。将出口32设置在进口31附近，使得冷却液总体流向与冷却腔3的走势趋于相同，冷却比较均匀。需要说明的是，上述进口31和出口32的具体设置位置仅是一种实例性的设置方式，进口31和出口32的具体位置可以根据实际应用进行灵活调整，只要便于冷却液的流通即可。
冷却腔3内设置有导热隔板33，导热隔板33可以选用铍铜合金等导热性良好的材料，冷却液直接与导热隔板33接触，使得热量能够快速传递，提高散热效率。
具体地，将中层板20以及固定在其上的PCB板21和芯片22与本体1扣合，将芯片22与导热构件23正对，在弹性构件24的反弹力的作用下，芯片22能够始终与导热构件23紧密且稳固地贴合在一起以传递热量。PCB板21和芯片22运行时产生的热量首先传递至导热硅脂上，导热硅脂将芯片22产生的热量传输至导热构件23和散热构件25上，从而将热量传输至冷却腔3内，利用冷却液进行高效地散热。
通过上述的设置方式，能够通过弹性构件24的反弹力，以确保导热构件23紧密抵靠在芯片22的表面上的压力达到稳定均衡状态，以有效减少其热阻，提高整体散热效果。并且避免了芯片22和导热构件23之间的装配公差较大，影响PCB板21和芯片22的散热效果的情况发生，同时能够减轻芯片22由于公差较大受到的压力，提高了芯片22的散热效率，延长了芯片22的使用寿命，使得芯片22能够长久稳定地运行使用。
需要说明的是，虽然图1中示出的本体1为长方体，但这仅是示意性图示，本体1的形状可以根据PCB板21的形状、工作空间的形状等具体情况进行设计，例如，PCB板的形状为圆形，则本体可以为圆柱体；PCB板工作空间为异形空间，可以将本体设计为相应的异形以便于将PCB板组件安装在该异形空间内。
上述弹性构件24的设置仅是一种优选的设置方式，在另一种可行的安装方式中，弹性构件24还可以是弹性膜片，或者将弹簧替换成波纹管，只要能够使得芯片22始终与导热构件23紧贴在一起即可。
需要说明的是，上述散热构件25的设置仅是一种优选的设置方式，在实际应用中，本领域技术人员可以选用散热翅片进行散热，或者选用热管和散热翅片共同散热，在另一种可行的安装方式中，散热构件还可以为带风扇的散热器。
上述的冷却腔3只是一种实例性的设置方式，在实际应用中，还可以通过冷却翅片对发热模块进行冷却散热，冷却翅片可以采用金属铜材料或者铝材料。
还需要说明的是，在其他可行的实施例中，也可以不设置上述实施例的冷却腔3和散热构件25。
本实施例中提供的控制器可以应用在车辆或者其他电子设备上，能够实现上述任意一种实施例中的PCBA模块的有益效果，在此不做赘述。
至此，已经结合附图所示的优选实施方式描述了本发明的技术方案，但是，本领域技术人员容易理解的是，本发明的保护范围显然不局限于这些具体实施方式。在不偏离本发明的原理的前提下，本领域技术人员可以对相关技术特征作出等同的更改或替换，这些更改或替换之后的技术方案都将落入本发明的保护范围之内。

Claims (10)

  1. 一种控制器，其特征在于，包括本体以及设置在所述本体上的PCBA模块，所述PCBA模块包括PCB板以及固定在所述PCB板表面的芯片，所述芯片与所述本体之间设置有能够沿垂直于所述PCB板表面的方向移动的导热构件，所述导热构件与所述本体之间设置有弹性构件，所述导热构件上连接有散热构件，在安装好的状态下，所述芯片抵靠在所述导热构件的第一侧上，所述弹性构件的一端抵靠在所述本体上，所述弹性构件的另一端抵靠在所述导热构件的第二侧上。
  2. 根据权利要求1所述的控制器，其特征在于，所述弹性构件为均匀设置在所述导热构件与所述本体之间的多个弹簧。
  3. 根据权利要求1所述的控制器，其特征在于，所述导热构件的第一侧与所述芯片之间设有导热材料层。
  4. 根据权利要求1所述的控制器，其特征在于，所述弹性构件为波纹管。
  5. 根据权利要求1所述的控制器，其特征在于，所述本体内设置有冷却腔，所述本体上设置有与所述冷却腔连通的进口和出口，所述进口、所述冷却腔和所述出口形成供冷却液流通的冷却通道。
  6. 根据权利要求5所述的控制器，其特征在于，所述冷却腔内设置有导热隔板。
  7. 根据权利要求1至6中任一项所述的控制器，其特征在于，所述散热构件包括热管。
  8. 根据权利要求7所述的控制器，其特征在于，所述热管的一侧与所述导热构件连接，所述热管的另一侧抵靠在所述本体上。
  9. 根据权利要求7所述的控制器，其特征在于，所述热管呈环形状，所述热管的一侧焊接在所述导热构件的第二侧，所述热管的另一侧的一部分焊接在所述本体上。
  10. 根据权利要求1所述的控制器，其特征在于，所述本体上设置有导向结构，所述导向结构用于限定所述导热构件的移动方向。
PCT/CN2023/077680 2022-03-23 2023-02-22 控制器 WO2023179283A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202220652598.2U CN217064419U (zh) 2022-03-23 2022-03-23 控制器
CN202220652598.2 2022-03-23

Publications (1)

Publication Number Publication Date
WO2023179283A1 true WO2023179283A1 (zh) 2023-09-28

Family

ID=82466148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/077680 WO2023179283A1 (zh) 2022-03-23 2023-02-22 控制器

Country Status (2)

Country Link
CN (1) CN217064419U (zh)
WO (1) WO2023179283A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217064419U (zh) * 2022-03-23 2022-07-26 蔚来汽车科技(安徽)有限公司 控制器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150095A1 (en) * 2003-01-30 2004-08-05 Endicott Interconnect Technologies, Inc. Stacked chip electronic package having laminate carrier and method of making same
CN110459512A (zh) * 2019-09-12 2019-11-15 东莞铭普光磁股份有限公司 散热主板及光模块
CN210381687U (zh) * 2019-09-09 2020-04-21 昆山汇仁氏电子有限公司 一种高散热的双层pcb板组件
CN217064419U (zh) * 2022-03-23 2022-07-26 蔚来汽车科技(安徽)有限公司 控制器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040150095A1 (en) * 2003-01-30 2004-08-05 Endicott Interconnect Technologies, Inc. Stacked chip electronic package having laminate carrier and method of making same
CN210381687U (zh) * 2019-09-09 2020-04-21 昆山汇仁氏电子有限公司 一种高散热的双层pcb板组件
CN110459512A (zh) * 2019-09-12 2019-11-15 东莞铭普光磁股份有限公司 散热主板及光模块
CN217064419U (zh) * 2022-03-23 2022-07-26 蔚来汽车科技(安徽)有限公司 控制器

Also Published As

Publication number Publication date
CN217064419U (zh) 2022-07-26

Similar Documents

Publication Publication Date Title
US10736235B2 (en) Cooling mechanism of high mounting flexibility
US7327570B2 (en) Fluid cooled integrated circuit module
JP5999665B2 (ja) 熱移動ユニットおよび温度調節装置
WO2023179283A1 (zh) 控制器
JPH0786471A (ja) 半導体モジュ−ル
CN111246706B (zh) 一种双面散热装置
US20200388555A1 (en) Apparatus for thermal management of electronic components
JP2002238238A (ja) リニアモータの冷却装置
EP4305937A1 (en) Cold plate with integrated sliding pedestal and processing system including the same
US11094611B2 (en) Liquid cooled heat dissipation device
JP2002064168A (ja) 冷却装置、冷却装置の製造方法および半導体装置
CN107509365B (zh) 一种超薄微波组件及热管散热装置
CN113316376B (zh) 散热装置及电子设备
CN113067963B (zh) 一种摄像机及其制冷装置
CN112748631B (zh) 一种激光光源及激光投影设备
CN220733332U (zh) 电子设备
CN218851204U (zh) 散热模块及制冷装置
CN221041113U (zh) 一种半导体用高效散热器
CN211152536U (zh) 高导热散热模组
CN216352178U (zh) 包覆导热式散热装置
CN221551176U (zh) 散热器及服务器
US20230180438A1 (en) Server and heat exchanger
CN117168085B (zh) 一种用于芯片高低温测试的散热冷却装置
TWI831707B (zh) 液冷板組件及伺服器
CN220020084U (zh) 一种散热组件及投影设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23773534

Country of ref document: EP

Kind code of ref document: A1