WO2023176332A1 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
WO2023176332A1
WO2023176332A1 PCT/JP2023/006238 JP2023006238W WO2023176332A1 WO 2023176332 A1 WO2023176332 A1 WO 2023176332A1 JP 2023006238 W JP2023006238 W JP 2023006238W WO 2023176332 A1 WO2023176332 A1 WO 2023176332A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
electronic device
distance
sealing resin
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/006238
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
遼平 梅野
弘招 松原
登茂平 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2024507644A priority Critical patent/JPWO2023176332A1/ja
Publication of WO2023176332A1 publication Critical patent/WO2023176332A1/ja
Priority to US18/883,587 priority patent/US20250006621A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/537—Multiple bond wires having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Definitions

  • the third root portion 412 is the root portion of the third outer portion 41. As shown in FIGS. 1 and 2, the third root portion 412 is located at the end of the third outer portion 41 on the sealing resin 7 side in the first direction y. The third root portion 412 is located closer to the sealing resin 7 than the third mounting portion 411 and the third relay portion 413 in the first direction y. The third root portion 412 is located above the third mounting portion 411 in the thickness direction z, and protrudes from the central portion of the sealing resin 7 in the thickness direction z. The plurality of third root portions 412 are arranged at the same (or substantially the same) position in the thickness direction z.
  • the dimensions W41B and W41C are the same (or substantially the same) as the dimension W21 of the first outer part 21 and the dimension W31 of the second outer part 31, respectively.
  • the dimension (width) along the second direction x of the part (boundary 49 part) where the third outer part 41 and the third inner part 42 are connected is, for example, 0. It is 15 mm or more and 0.5 mm or less.
  • the width of the boundary 49 portion of each inner lead 4A is the same (or substantially the same) as the dimension W41A of the third outer portion 41 of each inner lead 4A.
  • the wire 61 is joined to the electrode 511 of the first chip 51 and the second inner part 32, and electrically connects the first chip 51 and the second lead 3. That is, the second outer part 31 of the second lead 3 is electrically connected to the first chip 51 of the electronic component 5 via the second inner part 32 and the wire 61.
  • the resin main surface 71 and the resin back surface 72 are spaced apart from each other in the thickness direction z.
  • the resin main surface 71 faces one direction in the thickness direction z, and the resin back surface 72 faces the other direction in the thickness direction z.
  • the main resin surface 71 is the upper surface of the sealing resin 7
  • the resin back surface 72 is the lower surface of the sealing resin 7 .
  • the length of the wire 61 is 65% or less of the average value of the distance d11 and the distance d12 in plan view. According to this configuration, it is possible to suppress an increase in the size of the electronic device A1 (an increase in the size of the sealing resin 7). Therefore, the electronic device A1 suppresses deformation or disconnection of the wire 61 by setting the length of the wire 61 in a plan view to 25% or more and 65% or less of the average value of the distance d11 and the distance d12. Enlargement of the electronic device A1 (enlargement of the sealing resin 7) can be suppressed.
  • the electronic component 5 of the electronic device A3 has a power conversion function rather than a voltage detection function.
  • the first chip 51 and the second chip 52 in this embodiment are each switching elements.
  • each of the first chip 51 and the second chip 52 is configured with an IGBT (Insulated Gate Bipolar Transistor), but instead of an IGBT, it is a MOSFET (Metal-Oxide-Semiconductor Field). Effect Transistor) or other transistors such as bipolar transistors.
  • the plurality of wires 64 are respectively joined to the electrode 522 and the second inner part 32 of the second lead 3 to electrically connect them. Thereby, the second lead 3 is electrically connected to the electrode 522 via the plurality of wires 64.
  • the sealing resin has a second resin side face facing the other side of the first direction,

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
PCT/JP2023/006238 2022-03-17 2023-02-21 電子装置 Ceased WO2023176332A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024507644A JPWO2023176332A1 (https=) 2022-03-17 2023-02-21
US18/883,587 US20250006621A1 (en) 2022-03-17 2024-09-12 Electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022043110 2022-03-17
JP2022-043110 2022-03-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/883,587 Continuation US20250006621A1 (en) 2022-03-17 2024-09-12 Electronic device

Publications (1)

Publication Number Publication Date
WO2023176332A1 true WO2023176332A1 (ja) 2023-09-21

Family

ID=88023338

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/006238 Ceased WO2023176332A1 (ja) 2022-03-17 2023-02-21 電子装置

Country Status (3)

Country Link
US (1) US20250006621A1 (https=)
JP (1) JPWO2023176332A1 (https=)
WO (1) WO2023176332A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025164246A1 (ja) * 2024-01-31 2025-08-07 ローム株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047955A (ja) * 2002-05-22 2004-02-12 Matsushita Electric Ind Co Ltd 半導体装置
JP2016207714A (ja) * 2015-04-16 2016-12-08 ローム株式会社 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047955A (ja) * 2002-05-22 2004-02-12 Matsushita Electric Ind Co Ltd 半導体装置
JP2016207714A (ja) * 2015-04-16 2016-12-08 ローム株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025164246A1 (ja) * 2024-01-31 2025-08-07 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
US20250006621A1 (en) 2025-01-02
JPWO2023176332A1 (https=) 2023-09-21

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