WO2023160498A1

WO2023160498A1 - Head-mounted display device and heat dissipation method therefor

Info

Publication number: WO2023160498A1
Application number: PCT/CN2023/077204
Authority: WO
Inventors: 康艺
Original assignee: 维沃移动通信有限公司
Priority date: 2022-02-25
Filing date: 2023-02-20
Publication date: 2023-08-31
Also published as: CN114513939A

Abstract

Disclosed in the present application are a head-mounted display device and a heat dissipation method therefor. The head-mounted display device comprises: an device body, the device body comprising a front housing region, a temple region and a back head region; a liquid cooling pipe, arranged in the device body and located in the front housing region, the temple region and the back head region; and a micro pump, arranged in the liquid cooling pipe, and capable of driving a cooling working medium to flow in the liquid cooling pipe so as to form a cross-region circulating liquid cooling flow path between the front housing region, the temple region and the back head region.

Description

Head-mounted display device and cooling method thereof

Cross References to Related Applications

This application claims the priority of a Chinese patent application with application number 202210184685.4 and titled "Head Mounted Display Device and Its Heat Dissipation Method" filed with the China Patent Office on February 25, 2022, the entire contents of which are hereby incorporated by reference in this application .

technical field

The present application belongs to the field of head-mounted display technology, and in particular relates to a head-mounted display device and a heat dissipation method for the head-mounted display device.

Background technique

Head-mounted display devices, such as VR glasses, in order to enhance the user's sense of immersion and not be bound by data cables, VR glasses are developing towards VR all-in-one machines with independent computing, input and output functions. However, due to the addition of independent processor chips to provide independent computing functions, the overall power consumption of VR has doubled. If the heat dissipation function of VR cannot be improved, the performance of the chip will be affected, which will lead to the deterioration of the user's temperature comfort during use and weaken the user's sense of immersion.

The heat dissipation design of the existing head-mounted display devices only utilizes part of the area of the device for heat dissipation, and the heat dissipation is limited, which may easily cause the local temperature of the device to be too high and affect the user experience.

Contents of the invention

The present application aims to provide a head-mounted display device and a heat dissipation method thereof, which can at least solve the problem of limited heat dissipation of the head-mounted display device in the prior art, which easily leads to excessive local temperature of the device.

In order to solve the above-mentioned technical problems, the application is implemented as follows:

In the first aspect, the embodiment of the present application provides a head-mounted display device, including: a device body, the device body includes a front shell area, a temple area, and a back brain area; a liquid cooling pipeline, and the liquid cooling pipeline is set In the device body, and the liquid cooling pipeline is located in the front shell area, the temple area and the back of the head area; the micropump, the micropump is arranged in the liquid cooling pipeline, the The micropump can drive the cooling medium to flow in the liquid cooling pipeline, so as to form a cross-area circulating liquid cooling flow path between the front shell area, the temple area and the back of the head area.

In a second aspect, a heat dissipation method for a head-mounted display device is applied to the head-mounted display device described in the above embodiment, and the heat dissipation method includes the following steps:

Control the opening of the micropump to drive the cooling medium to flow in the liquid cooling pipeline;

The cooling working fluid is controlled to form a cross-regional circulating liquid cooling flow path among the front shell region, the temple region and the back of the head region.

In the embodiment of the present application, the liquid cooling pipeline is arranged in the device body and corresponds to the positions of the front shell area, the temple area and the back of the head area respectively, and the cooling medium is driven by a micropump in the front shell area, the temple area and the back brain area. A circulating liquid cooling circuit is formed between the back of the brain to realize cross-region heat dissipation of the head-mounted display device, make full use of the temple area and the back of the head of the head-mounted display device for heat dissipation, greatly improve the heat dissipation capacity of the whole machine, and ensure the uniformity of overall heat dissipation. Avoiding excessive local temperature is conducive to improving VR performance, ensuring user immersion, and improving user experience.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and understandable from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of a head-mounted display device according to Embodiment 1 of the present invention;

2 is a schematic structural diagram of a liquid cooling pipeline of a head-mounted display device according to Embodiment 1 of the present invention;

FIG. 3 is another structural schematic diagram of the head-mounted display device according to Embodiment 1 of the present invention;

FIG. 4 is another structural schematic diagram of the head-mounted display device according to Embodiment 1 of the present invention;

FIG. 5 is a schematic structural diagram of a head-mounted display device according to Embodiment 2 of the present invention;

6 is a schematic diagram of a single flow path of the front shell area of the head-mounted display device according to the embodiment of the present invention;

7 is a schematic diagram of multiple flow paths of the front shell area of the head-mounted display device according to the embodiment of the present invention;

Fig. 8 is a schematic diagram of a single flow path of the temple area of the head-mounted display device according to the embodiment of the present invention;

9 is a schematic diagram of multiple flow paths in the temple area of the head-mounted display device according to the embodiment of the present invention;

10 is a schematic diagram of a single flow path of the hindbrain region of the head-mounted display device according to the embodiment of the present invention;

Fig. 11 is a schematic diagram of multiple flow channels in the hindbrain region of the head-mounted display device according to the embodiment of the present invention;

Fig. 12 is a temperature control flow chart of the head-mounted display device according to the embodiment of the present invention;

Fig. 13 is another temperature control flowchart of the head-mounted display device according to the embodiment of the present invention;

Fig. 14 is another flow chart of temperature control of the head-mounted display device according to the embodiment of the present invention.

Reference signs:

Head-mounted display device 100;

Anterior shell region 11; Temple region 12; Hindbrain region 13;

Liquid cooling pipeline 20; front shell pipeline 21; temple pipeline 22; back brain pipeline 23;

micropump 30;

temperature sensor 40;

Solenoid valve 50;

fan 60; air outlet 61;

fins 71; high thermal conductivity substrate 72.

specific embodiment

Embodiments of the present invention will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The features of the terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and therefore should not be construed as limiting the invention.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. For those of ordinary skill in the art, can have The specific meanings of the above terms in the present invention should be understood according to specific circumstances.

The head-mounted display device 100 provided by the embodiment of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

As shown in FIGS. 1 to 14 , a head-mounted display device 100 according to an embodiment of the present invention includes a device body, a liquid cooling pipeline 20 and a micropump 30 .

Specifically, the device body includes a front shell area 11 , a temple area 12 and a back head area 13 . The liquid cooling pipeline 20 is arranged in the device body, and the liquid cooling pipeline 20 is located in the front shell area 11 , the temple area 12 and the back head area 13 . The micropump 30 is arranged in the liquid cooling pipeline 20, and the micropump 30 can drive the cooling medium to flow in the liquid cooling pipeline 20 to form a spanable area between the front shell area 11, the temple area 12 and the back of the head area 13. Circulating liquid cooling flow path.

In other words, referring to FIGS. 1 to 5 , a head-mounted display device 100 according to an embodiment of the present invention is mainly composed of a device body, a liquid cooling pipeline 20 and a micropump 30 . The head-mounted display device 100 may be AR/VR head-mounted display devices such as AR glasses, AR helmets, VR glasses, and VR helmets. In the following embodiments of the present application, the head-mounted display device 100 is taken as VR glasses as an example for specific description. Virtual reality (Virtual Reality, referred to as VR) is a combination of computer graphics technology, computer simulation technology, sensor technology, display technology, etc., to create a virtual information environment in the multi-dimensional information space, so that users can have a sense of immersion. Has a perfect ability to interact with the environment. VR technology is widely used in medicine, entertainment, military aerospace, interior design, real estate development, industrial simulation, etc.

In this application, the device body is mainly composed of the front shell area 11 , the temple area 12 and the back head area 13 . Among them, the front shell area 11 of the head-mounted display device 100 corresponds to the position of the forehead of the human body, the temple area 12 (the two temple parts are collectively referred to as the temple area 12) corresponds to the position of the auricle of the human body, and the back brain area 13 corresponds to the back of the human body. Location. The liquid cooling pipeline 20 is installed in the device body, and the liquid cooling pipeline 20 is respectively distributed in the corresponding positions of the front shell area 11, the temple area 12 and the back of the head area 13, which is convenient for the front shell area 11 of the head-mounted display device 100. , the temple area 12 and the back of the head area 13 conduct cross-regional heat dissipation. The micropump 30 is arranged in the liquid cooling pipeline 20, and the micropump 30 can drive the cooling medium to flow in the liquid cooling pipeline 20, thereby forming a spanable area between the front shell area 11, the temple area 12 and the back of the head area 13. The circulating liquid cooling flow path realizes the heat dissipation of the whole machine shell covering the front shell area 11, the temple area 12 and the back head area 13.

In the head-mounted display device 100 of the present application, heat sources (such as display screens, cameras, processing chips, etc.) are mainly concentrated in the front shell area 11, and heat sources such as display screens and cameras in the front shell area 11 can be passed through heat-conducting materials such as Thermal grease, thermal pads, etc. conduct heat to high thermal conductivity Behind the base plate 72 , the micropump 30 drives the cooling medium to circulate in the cooling pipeline to realize heat conduction across the front shell region 11 and the back of the brain region 13 . In this application, the cooling working fluid is a material with high specific heat capacity and thermal conductivity. During the circulation process of the liquid cooling flow path, heat is absorbed or released to realize cross-regional heat transfer. The cooling working fluid may be deionized water, ethanol and other working fluids. The micropump 30 can drive the flow of the cooling working fluid, and supports the adjustment of the rotation speed, so as to realize the flow control of the cooling working fluid. The micropump 30 has the characteristics of good heat conduction and low noise, and the micropump 30 can be a piezoelectric ceramic pump. The high thermal conductivity substrate 72 can be made of a pure copper plate, a VC plate, or an aluminum alloy with a graphite heat-spreading material on the back.

Therefore, according to the head-mounted display device 100 of the embodiment of the present invention, the liquid cooling pipeline 20 is arranged in the device body, and corresponds to the positions of the front shell area 11, the temple area 12, and the back of the head area 13 respectively, and the liquid cooling pipeline 20 is passed through the micropump 30. Drive the cooling medium to form a circulating liquid cooling circuit between the front shell area 11, the temple area 12 and the back of the head area 13, so as to realize cross-area heat dissipation of the head-mounted display device 100 and make full use of the temple area 12 of the head-mounted display device 100 And the back of the brain area 13 for heat dissipation, which greatly improves the heat dissipation capacity of the whole machine, ensures the uniformity of overall heat dissipation, and avoids excessive local temperature, which is conducive to improving VR performance, ensuring user immersion, and improving user experience.

According to an embodiment of the present invention, the liquid cooling pipeline 20 is a single flow pipeline, and the pipelines located in the front shell area 11 , the temple area 12 and the back of the head area 13 are connected in series to form the liquid cooling pipeline 20 .

That is to say, as shown in FIG. 6, FIG. 8 and FIG. 10, the liquid cooling pipeline 20 can adopt a single-flow pipeline, wherein the pipelines located in the front shell area 11, the temple area 12 and the back of the brain area 13 can all be It is a single-flow pipeline, and the single-flow pipelines located in the front shell region 11 , the temple region 12 and the back of the brain region 13 are connected in series to form a liquid cooling pipeline 20 connected in circulation. The cooling medium is driven by the micropump 30 to flow between the front shell area 11, the temple area 12 and the back of the head area 13, so as to realize cross-area heat dissipation of the head-mounted display device 100, and make full use of the temple area 12 and the back of the head-mounted display device 100. The back of the brain area 13 conducts heat dissipation, which greatly improves the heat dissipation capacity of the whole machine, ensures the uniformity of overall heat dissipation, and avoids excessive local temperature, which is conducive to improving VR performance, ensuring user immersion, and improving user experience.

In this application, the head-mounted display device 100 also includes a control module, which is installed in the device body. The control module can control the micropump 30 to be turned on or off according to the actual needs of the user, so as to meet the heat dissipation requirements in different scenarios.

According to one embodiment of the present invention, the pipeline located in the front shell area 11 is the front shell pipeline 21, the pipeline located in the temple area 12 is the temple pipeline 22, and the pipeline located in the back brain area 13 is the back brain pipeline 23 , the front shell pipeline 21, the temple pipeline 22 and the back of the brain pipeline 23 are connected in series to form a liquid-cooled Line 20. In other words, as shown in FIG. 2 , FIG. 3 and FIG. 5 , the pipeline located in the front shell area 11 can be called the front shell pipeline 21, and the pipeline located in the temple area 12 can be called the temple pipeline 22, The pipeline located in the backbrain area 13 can be called the backbrain pipeline 23 , and the parts of the front shell pipeline 21 , the temple pipeline 22 and the backbrain pipeline 23 can be connected in series to form a circulating liquid cooling pipeline 20 .

Optionally, at least one of the front shell pipeline 21 , the temple pipeline 22 and the backbrain pipeline 23 may be a multi-flow pipeline arranged in parallel (as shown in FIG. 7 , FIG. 9 and FIG. 11 ). For example, multi-flow pipelines arranged in parallel (as shown in FIG. 7 ) are arranged in the front shell area 11 , and then connected in parallel to the temple area 12 and the back of the head area 13 in series.

In this application, considering that the main heat source is concentrated in the screen, camera and main chip of the front shell area 11, the temple area 12 and the back of the head area 13 do not need heat sources with strong heat exchange requirements, and the whole machine tends to be thin and light. Therefore, the overall liquid cooling flow path design adopts a double flow path in the front shell area 11 and a single flow path in the temple area 12 and the back of the brain area 13 in series, so as to improve the overall heat dissipation efficiency of the head-mounted display device 100 .

In some specific embodiments of the present invention, the head-mounted display device 100 further includes: a temperature sensor 40 and a solenoid valve 50, the temperature sensor 40 is arranged in the device body, the solenoid valve 50 is arranged in the liquid cooling pipeline 20, and the temperature sensor When 40 detects that the temperature is less than the first threshold, the control module controls the micropump 30 to close, and the solenoid valve 50 closes; The pump 30 is turned on, and the solenoid valve 50 is turned off; when the temperature sensor 40 detects that the temperature ≥ the second threshold, the control module controls the micropump 30 to turn on, and the solenoid valve 50 is turned on.

That is to say, as shown in FIG. 4 and FIG. 5 , the head-mounted display device 100 further includes a temperature sensor 40 and a solenoid valve 50 , the temperature sensor 40 is disposed in the device body, and the solenoid valve 50 is disposed in the liquid cooling pipeline 20 . The temperature sensor 40 is a sensor with a negative temperature coefficient (Negative Temperature Coefficient Sensor, NTC for short). The electromagnetic valve 50 realizes the on-off of the liquid cooling flow path through the control of the opening degree. The solenoid valve 50 can also be replaced with an electronic flow valve with a flow regulating effect. By providing the solenoid valve 50 , it is convenient to switch the liquid cooling flow path by controlling the state of the solenoid valve 50 in the liquid cooling flow path, thereby realizing the switching of the heat transfer path.

NTC monitors the temperature of the chip device, the user's face, left and right auricles, and the back of the brain. Through the designed temperature control algorithm, the NTC temperature data in different areas, the front-end application scenario (performance demand) data and other information are collected and processed centrally, so as to uniformly issue device parameters such as the 50 opening degree of the control solenoid valve and the 30 speed speed of the micropump to realize automatic Adapt to the user's usage scenario, change the heat transfer path, adjust the heat dissipation of the whole VR machine, and adjust the heat dissipation of each area to ensure the comprehensive experience of user performance and thermal comfort.

Exemplarily, take the first threshold value of 33°C and the second threshold value of 36°C as an example (of course, in practical applications, the specific temperature values of the first threshold value and the second threshold value can be configured and adjusted according to needs, and are not specifically limited here ), specifically explain the automatic adaptation method of the solenoid valve 50 and the micropump 30. When the temperature sensor 40 detects that the temperature is lower than the first threshold (33° C.), the control module controls the micropump 30 to turn off, and the solenoid valve 50 to turn off. When the temperature sensor 40 detects that the temperature is greater than or equal to the first threshold (33° C.) and less than the second threshold (36° C.), the control module controls the micropump 30 to turn on and the solenoid valve 50 to turn off. When the temperature sensor 40 detects that the temperature is greater than or equal to the second threshold, the control module controls the micropump 30 to turn on, and the solenoid valve 50 to turn on. See Table 1 below for details:

Table I

In the present application, there may be multiple temperature sensors 40 and solenoid valves 50 , and at least one temperature sensor 40 may be provided in the front case region 11 , the temple region 12 and the back of the head region 13 . At least one solenoid valve 50 may be provided in the front shell pipeline 21 , the temple pipeline 22 and the back of the brain pipeline 23 respectively.

In this application, the selection of the flow path and the arrangement of the electromagnetic flow path on the flow path are carried out according to the heat source layout of the whole VR machine (VR glasses), the heat transfer requirements of each area, the temperature control accuracy requirements of each area, the weight of the whole machine, and the weight distribution of each area, etc. The number of valves 50. For example, the front shell region 11 can adopt a flow path design of single flow path or multiple flow paths. For devices with strong heat dissipation requirements arranged in the temple area 12 , a flow path design of a single flow path or multiple flow paths may be adopted. In addition, in the multi-flow path design of the temple area 12, three solenoid valves 50 can be arranged on three parallel flow paths. Through the opening of the solenoid valve 50 , the adjustment of the amount of heat transfer across regions can be realized, thereby assisting in the realization of precise temperature distribution control in the front shell region 11 , the temple region 12 , and the back of the head region 13 .

In this application, as shown in FIG. 3 , the channel branch near the bottom of the temple area 12 can be The electromagnetic valve 50 is added to the road. When it is detected that the temperature of the temple area 12 is too high, the two electromagnetic valves 50 of the temple area 12 can be controlled to close, so that the cooling fluid flowing in from the front shell area 11 only passes through the top of the temple. flow branch. The overall heat of the temple area 12 is reduced and the heat is concentrated near the top area, so that the temperature of the bottom shell surface of the temple near the auricle area no longer rises, and even the temperature decreases, realizing fine temperature control of the area.

In this application, by controlling the rotation speeds of the solenoid valve 50 and the micropump 30 in the head-mounted display device 100 , the transformation of the heat transfer path can be realized. This application designs a temperature control algorithm, which is used to automatically control the heat transfer path and heat dissipation in real time according to the user's usage scenario. Wherein, the input layer includes NTCs distributed in the front shell region 11, the temple region 12, and the back brain region 13, and at least one (or multiple) NTCs are arranged in each region, for example, 4 NTCs can be arranged to represent the forehead, The temperature of the left pinna, right pinna, and back of the brain. The control layer is a temperature control algorithm running on the chip, which mainly realizes the unified processing of the temperature parameters of the input layer, and sends out the software algorithm of the solenoid valve 50 opening degree and the micropump 30 speed parameters of the output layer. The output layer is the solenoid valve 50 and the micropump 30, and the adjustment of the heat transfer path and the amount of heat dissipation is realized by controlling the opening degree and rotation speed of the valve.

As shown in Figure 12 and Figure 13, when the detected temperature of one or more NTCs exceeds the temperature warning value (for example, the shell corresponding to the detection area is higher than 33°C), the temperature control algorithm starts to judge the current specific working temperature area and select Work mode type. Adjust the state of the electromagnetic valve 50 and the micropump 30 according to the default parameters of the working mode, and maintain the parameters, or finely adjust the speed of the micropump 30 according to the subdivided temperature zone level. Among them, the corresponding relationship between the set default parameter temperature zone and the working mode is shown in Table 1, and the cross-zone liquid cooling and heat dissipation of the working mode 3 is a unique mode provided by this application. The temperature control algorithm is used to judge the temperature in the working temperature zone. The default is the maximum value of NTC in all detection areas. Different weights can also be configured for NTC in different areas. The obtained weighted temperature is used to judge the temperature in the temperature zone and the temperature in Table 2 grade. The weight coefficient obtains the user's thermal comfort priority configuration for the forehead, auricle, and back of the brain. For the temperature zone 2 and temperature zone 3 corresponding to the working mode 2 and working mode 3, different temperature grade intervals can be set, and the user finely adjusts the micropump 30 speed in each temperature zone, so that the VR front shell, auricle and hindbrain Fine control of case temperature. Table two is as follows:

Table II

This application adopts the temperature grade classification in Table 2 (the temperature range corresponding to the temperature grade in Table 2 is only for illustration, and the specific temperature value can be modified through software configuration in the VR glasses). By turning on the solenoid valve 50 of the mirror leg and turning on the micropump 30 when the temperature is higher than 36°C, the heat is transferred from the front shell area 11 to the temple area 12 and the back of the head area 13, making full use of the heat dissipation area of the VR machine shell and improving Peak heat dissipation. And by increasing, maintaining or decreasing the rotation speed of the micropump 30, the heat dissipation requirement of the current usage scenario is adapted. When the temperature is lower than 34° C., or when the user chooses to switch the working mode, the solenoid valve 50 is closed, and the thermal comfort can be satisfied by dissipating heat through the front shell area 11 .

In some specific implementations of the present invention, the head-mounted display device 100 further includes: a fan 60 , the fan 60 is arranged in the front case area 11 , and the control module can control the fan 60 and the micropump 30 to work independently or simultaneously.

In other words, as shown in FIG. 5 , in the head-mounted display device 100 of the present application, the cross-zone liquid cooling and heat dissipation can be combined with air cooling. The cross-regional heat transfer of heat and the cooling working fluid driven by the micropump 30 further improves the cooling capacity of the whole machine. The fans 60 can be arranged in the front shell area 11 , the temple area 12 , and the back of the head area 13 according to heat dissipation requirements, and the number can be one or more. The front shell area 11 can be provided with air outlets 61 , and the temple area 12 and the back of the head area 13 can also be provided with air outlets.

In this application, in order to enhance the heat dissipation of the front shell area 11 , a fan 60 and a top air outlet 61 may be added to the front shell area 11 . Wherein, the fan 60 supports the speed condition, so as to realize the regulation and control of the amount of heat exchange. Therefore, there are 5 working modes in total, see Table 3:

Table three

Wherein, working modes 3 and 4 in Table 3 are unique working modes of this application. The overall framework of the temperature control algorithm adds parameters of user temperature comfort and noise priority at the input layer, and controls the fan 60 at the output layer.

As shown in Figure 12 and Figure 14, when the temperature is lower than the minimum value of temperature zone 4, that is, it belongs to temperature zone 1-3, the system temperature control process of realization 2 is consistent with that of realization 1, and the control parameters increase the speed of fan 60. And when the temperature belongs to temperature zone 4, that is, when the overall temperature of VR is high, the temperature control algorithm couples the user's selection of the temperature priority of the forehead, auricle, and back of the brain area 13 and the selection of noise experience priority to carry out working mode 4 And automatic switching of working mode 5. That is, when the thermal comfort of the front shell area 11 is more important than other areas, or when the noise experience requirements are high, switch to the micropump 30 with the solenoid valve 50 open, running at low noise, and the low speed running at low speed. The noise fan 60 realizes the working mode 4 of using the whole machine for heat dissipation with low noise across regions.

And when the user tends to experience the temperature comfort of the front shell or the back of the head and lowers the requirement for noise, he can choose to close the solenoid valve 50, operate the micropump 30 with low noise and the fan 60 with higher noise running at ultra-high speed to realize Concentrated heat dissipation in the front shell area 11 to optimize the temperature of the temple area 12 and the back of the head area 13 in the working mode 5 . Among them, regarding the temperature priority selection in different regions, The user parameters for noise experience priority selection are collected and saved in the temperature control algorithm through software interaction. It can realize the optimal comprehensive experience of heat and noise adapting to different user groups.

According to an embodiment of the present invention, the head-mounted display device 100 further includes: a pipeline fin 71 , and the pipeline fin 71 is arranged on the liquid cooling pipeline 20 .

That is to say, in the present application, fins 71 can be added to part or the whole of the liquid cooling pipeline 20 to enhance heat exchange. The fins 71 can be fixed on the high thermal conductivity temperature uniform component (high thermal conductivity substrate 72 ) or other supporting substrates with certain strength by means of welding, gluing or the like. Optionally, fins 71 can be added to the part of the pipeline near the top cover in the front shell area 11 to enhance the heat exchange effect in this area (such as arranging heat sources such as CPU and camera) and reduce the weight of the whole machine at the same time.

According to an embodiment of the present invention, the tube body of the liquid cooling pipeline 20 is a round tube or an oval tube, and the pipeline of the liquid cooling pipeline 20 located in the front shell area 11 is in the flow of the cooling working fluid. The direction extends in a curved line, and the pipeline of the liquid cooling pipeline 20 located in the hindbrain region 13 is a threaded pipe.

In other words, the material of the liquid cooling pipeline 20 can be made of high thermal conductivity materials, such as copper pipes. The overall shape is a round tube, an oval tube or a quasi-ellipse tube, etc. The thickness of the temple region 12 can be reduced by using an oval tube. The pipeline of the liquid cooling pipeline 20 located in the back of the head region 13 is a threaded tube, which is used to support the bending of the pipeline when wearing and adjusting. The pipeline of the liquid cooling pipeline 20 located in the front shell area 11 extends in a curved line in the flow direction of the cooling working medium, and the flow path of the front shell area 11 is designed with a certain radian to reduce the front shell area. 11 flow resistance. The cooling medium flows out from the outlet of the micropump 30, flows through the double flow paths of the front shell area 11 arranged near the top and bottom areas, exchanges heat with the welded high thermal conductivity substrate 72, and takes away part of the heat from the heat source of the front shell area 11. The opened two electromagnetic valves 50 flow through the temple area 12 and the back of the head area 13 . After natural heat exchange on the shell surface in this area, the flow returns to the inlet of the micropump 30 in the front shell area 11 .

In a word, the head-mounted display device 100 of the present invention realizes cross-region heat dissipation through the circulation of the cooling medium in the liquid cooling pipeline 20, thereby making full use of the temple area 12 and the back of the head area 13 of the head-mounted display device 100 for heat dissipation, greatly Increase the heat dissipation of the whole machine, so that it can bear the higher performance of VR and ensure the user's sense of immersion. At the same time, the present invention optimizes the design and control of the VR cross-region flow path, which can realize intelligent temperature control in different scenarios, such as users who can distinguish different thermal comfort area priorities (forehead, auricle, and back of the head) and noise experience priorities. , Intelligently adjust the control parameters of the flow path to achieve precise temperature control for thermal comfort requirements of different users in different scenarios.

According to a second aspect of the present invention, a heat dissipation method for a head-mounted display device 100 is provided, As shown in FIG. 1 to FIG. 14 , applied to the head-mounted display device 100 in the above embodiment, the heat dissipation method includes the following steps:

First, as shown in FIGS. 1 to 5 , a connected liquid cooling pipeline 20 is provided in the front shell area 11 , the temple area 12 and the back of the head area 13 of the device body. Then, the control micropump 30 is turned on to drive the cooling working fluid to flow in the liquid cooling pipeline 20 . Finally, control the cooling medium to form a cross-regional circulating liquid cooling flow path between the front shell region 11, the temple region 12, and the back of the head region 13, so as to realize cross-region heat dissipation of the head-mounted display device 100 and make full use of the head-mounted display device. The temple area 12 and the back of the head area 13 of the 100 dissipate heat, which greatly improves the heat dissipation capacity of the whole machine, ensures the uniformity of overall heat dissipation, and avoids local overheating, which is conducive to improving VR performance, ensuring user immersion, and improving user experience.

According to an embodiment of the present invention, the heat dissipation method of the head-mounted display device 100 further includes:

When the temperature sensor 40 detects that the temperature is less than the first threshold, the micropump 30 is controlled to close, and the solenoid valve 50 is closed; when the temperature sensor 40 detects that the temperature is greater than or equal to the first threshold and is less than the second threshold, the micropump is controlled 30 is turned on, and the solenoid valve 50 is turned off; when the temperature sensor 40 detects that the temperature is greater than or equal to the second threshold, the micropump 30 is controlled to turn on, and the solenoid valve 50 is turned on.

Wherein, there may be a plurality of temperature sensors 40 and electromagnetic valves 50 respectively, and at least one temperature sensor 40 may be respectively arranged in the front shell region 11 , the temple region 12 and the back of the head region 13 . At least one solenoid valve 50 may be provided in the front shell pipeline 21 , the temple pipeline 22 and the back of the brain pipeline 23 respectively.

In this application, the selection of the flow path and the arrangement of the electromagnetic flow path on the flow path are carried out according to the heat source layout of the whole VR machine (VR glasses), the heat transfer requirements of each area, the temperature control accuracy requirements of each area, the weight of the whole machine, and the weight distribution of each area, etc. The number of valves 50. For example, the front shell region 11 can adopt a flow path design of single flow path or multiple flow paths. For devices with strong heat dissipation requirements arranged in the temple area 12 , a flow path design of a single flow path or multiple flow paths may be adopted. In addition, in the multi-flow path design of the temple area 12, three solenoid valves 50 can be arranged on three parallel flow paths. Through the opening of the solenoid valve 50, the amount of heat transfer across the area can be adjusted, thereby assisting in the realization of the front shell area 11. , Temple area 12, back brain area 13 precise temperature zone distribution control.

In this application, a solenoid valve 50 can be added to the flow path branch near the bottom of the temple area 12, and when the temperature of the temple area 12 is detected to be too high, the two solenoid valves 50 in the temple area 12 can be controlled to close , so the cooling working fluid flowing in from the front shell region 11 only passes through the flow path branch near the top of the temple. The overall heat passing through the temple area 12 is reduced and the heat is concentrated near the top area, Therefore, the temperature of the shell surface at the bottom of the temple near the auricle area no longer rises, and even the temperature decreases, realizing fine temperature control in the area.

In this application, by controlling the rotation speeds of the solenoid valve 50 and the micropump 30 in the head-mounted display device 100 , the transformation of the heat transfer path can be realized. This application designs a temperature control algorithm, which is used to automatically control the heat transfer path and heat dissipation in real time according to the user's usage scenario. Wherein, the input layer includes NTCs distributed in the front shell region 11, the temple region 12, and the back brain region 13, and at least one (or multiple) NTCs are arranged in each region, for example, 4 NTCs can be arranged to represent the forehead, The temperature of the left pinna, right pinna, and back of the brain. The control layer is the temperature control algorithm running on the chip. It mainly realizes the unified processing of the temperature parameters of the input layer, and sends out the software algorithm of the solenoid valve 50 opening degree and the micro pump 30 speed parameters of the output layer. The output layer is the solenoid valve 50 and the micropump 30, and the adjustment of the heat transfer path and the amount of heat dissipation is realized by controlling the opening degree and rotation speed of the valve.

As shown in Figure 12 and Figure 13, when the detected temperature of one or more NTCs exceeds the temperature warning value (for example, the shell corresponding to the detection area is higher than 33°C), the temperature control algorithm starts to judge the current specific working temperature area and select Work mode type. Adjust the state of the electromagnetic valve 50 and the micropump 30 according to the default parameters of the working mode, and maintain the parameters, or finely adjust the speed of the micropump 30 according to the subdivided temperature zone level. Among them, the corresponding relationship between the set default parameter temperature zone and the working mode is shown in Table 1, and the cross-zone liquid cooling and heat dissipation of the working mode 3 is a unique mode provided by this application. The temperature control algorithm is used to judge the temperature in the working temperature zone. The default is the maximum value of NTC in all detection areas. Different weights can also be configured for NTC in different areas. The obtained weighted temperature is used to judge the temperature in the temperature zone and the temperature in Table 2 grade. The weight coefficient obtains the user's thermal comfort priority configuration for the forehead, auricle, and back of the brain. For the temperature zone 2 and temperature zone 3 corresponding to the working mode 2 and working mode 3, different temperature grade intervals can be set, and the user finely adjusts the micropump 30 speed in each temperature zone, so that the VR front shell, auricle and hindbrain Fine control of case temperature.

In some specific embodiments of the present invention, the heat dissipation method of the head-mounted display device 100 is characterized in that the heat dissipation method further includes:

According to the temperature detected by the temperature sensor 40 and/or user experience requirements, the fan 60 and the micropump 30 are controlled to work independently or simultaneously.

That is to say, in the head-mounted display device 100 of the present application, the cross-zone liquid cooling and heat dissipation can be combined with air cooling, and the air cooling flow channel is arranged near the heat source, and the air driven by the fan 60 realizes the forced convection heat exchange and the driving of the micropump 30 The cross-regional heat transfer of the cooling medium further improves the heat dissipation capacity of the whole machine. The fan 60 can be arranged in the front shell area 11, the temple area 12, and the back of the head area according to the heat dissipation requirements. 13. The quantity can be one or more.

And when the user tends to experience the temperature comfort of the front shell or the back of the head and lowers the requirement for noise, he can choose to close the solenoid valve 50, operate the micropump 30 with low noise and the fan 60 with higher noise running at ultra-high speed to realize Concentrated heat dissipation in the front shell area 11 to optimize the temperature of the temple area 12 and the back of the head area 13 in the working mode 5 . Among them, the user parameters of temperature priority selection in different areas and noise experience priority selection are collected and saved in the temperature control algorithm through software interaction. It can realize the optimal comprehensive experience of heat and noise adapting to different user groups.

In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims

A head-mounted display device, including:

A device body, the device body comprising a front shell region, a temple region and a back brain region;

A liquid cooling pipeline, the liquid cooling pipeline is arranged in the device body, and the liquid cooling pipeline is located in the front shell area, the temple area and the back head area;

A micropump, the micropump is arranged in the liquid cooling pipeline, and the micropump can drive the cooling medium to flow in the liquid cooling pipeline, so that A cross-regional circulating liquid cooling flow path is formed between the hindbrain regions.
The head-mounted display device according to claim 1, wherein the liquid cooling pipeline is a single-flow pipeline, and the pipelines located in the front shell area, the temple area, and the back of the head area are connected in series so as to The liquid cooling pipeline is formed.
The head-mounted display device according to claim 1, further comprising: a control module, the control module is arranged in the device body, and the control module can control the opening or closing of the micropump.
The head-mounted display device according to claim 3, wherein the pipeline located in the front shell area is a front shell pipeline, the pipeline located in the temple area is a temple pipeline, and the pipeline located in the back of the brain The pipeline is a backbrain pipeline, and the front shell pipeline, the temple pipeline and the backbrain pipeline are connected in series to form the liquid cooling pipeline.
The head-mounted display device according to claim 4, further comprising: a temperature sensor and a solenoid valve, the temperature sensor is arranged in the device body, the solenoid valve is arranged in the liquid cooling pipeline, and When the temperature sensor detects that the temperature is less than the first threshold, the control module controls the micropump to close, and the solenoid valve closes; when the temperature sensor detects that the temperature is greater than or equal to the first threshold and less than In the case of the second threshold, the control module controls the micropump to turn on and the solenoid valve to close; when the temperature sensor detects that the temperature is greater than or equal to the second threshold, the control module controls the The micropump is turned on, and the solenoid valve is turned on.
The head-mounted display device according to claim 5, wherein there are a plurality of said temperature sensors and said solenoid valves respectively, and at least one The temperature sensor, the front shell pipeline, the temple pipeline and the back of the head pipeline are respectively provided with at least one solenoid valve.
The head-mounted display device according to claim 3, further comprising: a fan, The fan is arranged in at least one region of the anterior shell region and the posterior brain region, and the control module can control the fan and the micropump to work independently or simultaneously.
The head-mounted display device according to claim 1, further comprising: pipeline fins, the pipeline fins being arranged on the liquid cooling pipeline.
The head-mounted display device according to claim 1, wherein the tube body of the liquid cooling pipeline is a round tube or an oval tube, and the pipeline of the liquid cooling pipeline located in the front shell area is in the The flow direction of the cooling working fluid extends in a curve, and the pipeline of the liquid cooling pipeline located in the back of the brain is a threaded pipe.
A heat dissipation method for a head-mounted display device, applied to the head-mounted display device according to any one of claims 1-9, wherein the heat dissipation method comprises the following steps:

Control the opening of the micropump to drive the cooling medium to flow in the liquid cooling pipeline;

The cooling working fluid is controlled to form a cross-regional circulating liquid cooling flow path among the front shell region, the temple region and the back of the head region.
The heat dissipation method for a head-mounted display device according to claim 10, wherein the heat dissipation method further comprises:

When the temperature sensor detects that the temperature is lower than the first threshold, the micropump is controlled to be closed, and the solenoid valve is closed;

When the temperature sensor detects that the temperature is greater than or equal to the first threshold and less than the second threshold, the micropump is controlled to be turned on, and the solenoid valve is turned off;

When the temperature sensor detects that the temperature is greater than or equal to the second threshold, the micropump is controlled to be turned on, and the solenoid valve is turned on.
The heat dissipation method for a head-mounted display device according to claim 11, wherein the heat dissipation method further comprises:

According to the temperature detected by the temperature sensor and/or user experience requirements, the fan and the micropump are controlled to work independently or simultaneously.