CN115061550B - Distributed thermal management device based on thermoelectric refrigerator and control method - Google Patents
Distributed thermal management device based on thermoelectric refrigerator and control method Download PDFInfo
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- CN115061550B CN115061550B CN202210697281.5A CN202210697281A CN115061550B CN 115061550 B CN115061550 B CN 115061550B CN 202210697281 A CN202210697281 A CN 202210697281A CN 115061550 B CN115061550 B CN 115061550B
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000110 cooling liquid Substances 0.000 claims abstract description 33
- 238000012544 monitoring process Methods 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 5
- 239000012809 cooling fluid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Abstract
The invention belongs to the field of server and data center liquid cooling heat dissipation, and discloses a distributed heat management device and a control method based on a thermoelectric refrigerator, wherein the distributed heat management device comprises a base, the thermoelectric refrigerator, a first cold plate, a second cold plate, a main inlet, a main outlet and a pipeline; the base is horizontally placed on a monitoring target, the thermoelectric refrigerator and the first cold plate are horizontally placed on the base side by side, the second cold plate is stacked on the thermoelectric refrigerator, the cold end of the thermoelectric refrigerator faces the base and the hot end of the thermoelectric refrigerator faces the second cold plate, the pipeline is used for interconnecting the main inlet, the first cold plate, the second cold plate and the main outlet, cooling liquid enters the device from the main inlet and leaves the device from the main outlet, and a plurality of electric valves are arranged on the pipeline and used for controlling the flow direction of the cooling liquid. According to the invention, the series-parallel switching of the two cold plates is realized by controlling the electric valve, so that heat generated by the hot end during the working of the thermoelectric refrigerator is prevented from being reversely conducted to the processor, and the refrigeration efficiency is improved.
Description
Technical Field
The invention belongs to the field of liquid cooling and heat dissipation of servers and data centers, and particularly relates to a distributed heat management device and a control method based on a thermoelectric cooler.
Background
As computing power demands increase, server and data center operating loads increase, and demands on heat dissipation systems are increasing. Liquid cooling is a high-performance and low-energy-consumption heat dissipation mode, and is increasingly focused and applied. The liquid cooling system uses liquid in the closed pipeline as a medium to exchange heat between the inside of the server and the outside, and two ways of adjusting the heat exchange amount are available: regulating the flow rate of the liquid and regulating the temperature of the liquid. It is known that a general server only has one CDU (Cooling Distribution Unit, liquid cooling distribution device), and even a plurality of servers share one CDU, so that only the inlet liquid flow and the inlet liquid temperature of the server can be regulated uniformly, and independent regulation can not be realized for each processor unit inside the server. However, in most cases, the working loads of the processors are different, and the heating values are also different, so that the unified adjustment inevitably causes the partial refrigerating capacity to be insufficient and the partial refrigerating capacity to overflow.
Patent US20180275730A1 discloses a cooler with built-in pumps, one cooler is arranged on each processor, and the built-in pump body can independently regulate the flow of the cooling liquid in the path. The disadvantage of this device is that the micropump is costly and bulky.
Patent CN112650373a discloses an heterogeneous liquid cooling server with a semiconductor dehumidifying device, which is located at the total inlet of the cooling liquid of the server, is a device for concentrated cooling and dehumidifying, and cannot realize distributed thermal management.
Disclosure of Invention
The invention aims to provide a distributed thermal management device based on a thermoelectric refrigerator and a control method thereof, so as to solve the technical problems.
In order to solve the technical problems, the specific technical scheme of the distributed heat management device and the control method based on the thermoelectric refrigerator is as follows:
A distributed thermal management device based on a thermoelectric cooler comprises a base, the thermoelectric cooler, a first cold plate, a second cold plate, a main inlet, a main outlet and a pipeline; the base is horizontally placed on a monitoring target, the thermoelectric refrigerator and the first cold plate are horizontally placed on the base side by side, the second cold plate is stacked on the thermoelectric refrigerator, the cold end of the thermoelectric refrigerator faces the base and the hot end of the thermoelectric refrigerator faces the second cold plate, the pipeline is used for interconnecting the main inlet, the first cold plate, the second cold plate and the main outlet, cooling liquid enters the device from the main inlet and leaves the device from the main outlet, and a plurality of electric valves are arranged on the pipeline and used for controlling the flow direction of the cooling liquid.
Further, the first cold plate and the second cold plate are respectively provided with a pair of cooling liquid inlets and outlets, namely a first inlet, a first outlet, a second inlet and a second outlet; the main inlet and the first inlet, the first outlet and the main outlet, the main inlet and the second inlet, the second outlet and the main outlet, and the first outlet and the second inlet are all connected through pipelines; and each electric valve is respectively controlled to be opened or closed by an electric signal.
Further, the cooling liquid flows in through the first inlet and flows out of the first cold plate through the first outlet; the cooling liquid flows in through the second inlet and flows out of the second cold plate through the second outlet; the main inlet is communicated with the first inlet and the second inlet, the main outlet is communicated with the first outlet and the second outlet, and the first outlet is communicated with the second inlet; the first electric valve is located between the total inlet and the second inlet, the second electric valve is located between the first outlet and the total outlet, and the third electric valve is located between the first outlet and the second inlet.
Further, a gap is formed between the thermoelectric cooler and the first cold plate.
Further, the base and monitoring target contact surface, the thermoelectric cooler and base contact surface, the first cold plate and base contact surface, and the thermoelectric cooler and second cold plate contact surface are filled with a heat-conducting interface material.
Further, the base, the first cold plate and the second cold plate are made of heat-conducting metal materials.
Further, the size of the base is larger than or equal to the size of the monitoring target, and the base completely covers the surface of the CPU.
Further, the thermoelectric cooler floor area is less than the base surface area.
Furthermore, the device is arranged on each processor in the server, and controls the corresponding thermoelectric refrigerator and the electric valve switch according to the utilization rate and the temperature change of each processor, so as to realize distributed heat management.
The invention also discloses a distributed heat control method based on the thermoelectric refrigerator, which comprises the following steps:
when the monitoring target is in an initial state or the temperature is lower than the safety line, the thermoelectric refrigerator is kept powered off, the first electric valve and the second electric valve are closed, the third electric valve is opened, the cooling liquid sequentially flows through the first cooling plate and the second cooling plate, heat generated by the monitoring target is conducted to the first cooling plate and the second cooling plate through the base, and then the heat is taken away by the cooling liquid flowing through the cooling plates;
When the utilization rate of the monitoring target rises and the temperature reaches a safety threshold, the thermoelectric refrigerator is electrified, the first electric valve and the second electric valve are opened, the third electric valve is closed, the cooling liquid is divided into two flows which respectively flow through the first cold plate and the second cold plate and finally flow together, the cold end absorbs heat generated by the monitoring target through the base, the heat is transferred to the second cold plate through the hot end, and the heat is taken away by the cooling liquid.
The distributed heat management device and the control method based on the thermoelectric refrigerator have the following advantages:
(1) The accurate and rapid temperature control of the processor is realized by utilizing the characteristic that the thermoelectric refrigerator is electrified, namely refrigeration;
(2) The corresponding heat management device of part of the overheat processor is opened pertinently, so that the energy efficiency is improved, and the energy consumption input is saved;
(3) The serial-parallel switching of the two cold plates is realized by controlling the electric valve, so that heat generated by the hot end of the thermoelectric refrigerator during working is prevented from being reversely conducted to the processor, and the refrigerating efficiency is improved.
Drawings
FIG. 1 is a schematic view of the structure of the device of the present invention;
FIG. 2 is a schematic illustration of the coolant piping and valve arrangement of the device of the present invention;
FIG. 3 is a schematic diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is de-energized;
FIG. 4 is a schematic block diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is de-energized;
FIG. 5 is a schematic diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is energized;
FIG. 6 is a schematic block diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is energized;
The figure indicates: 1. a base; 2. a thermoelectric refrigerator; 3. a first cold plate; 4. a second cold plate; 5. a main inlet; 6. a general outlet; 7. a first electrically operated valve; 8. a second electrically operated valve; 9. a third electrically operated valve; 10. a pipe; 31. a first inlet; 32. a first outlet; 41. a second inlet; 42. a second outlet.
Detailed Description
For a better understanding of the objects, structures and functions of the present invention, a distributed thermal management device and control method based on thermoelectric coolers of the present invention will be described in further detail with reference to the accompanying drawings.
The invention adopts the thermoelectric refrigerator with small volume and low cost, and the thermoelectric refrigerator and the traditional cold plate are combined into the liquid cooling device, so that the temperature of each CPU/GPU can be independently controlled, and the distributed heat management of the server and the data center is realized.
As shown in fig. 1, the distributed thermal management device based on the thermoelectric refrigerator of the present invention comprises a base 1, the thermoelectric refrigerator 2, a first cold plate 3, a second cold plate 4, a total inlet 5, a total outlet 6, a first electrically operated valve 7, a second electrically operated valve 8, a third electrically operated valve 9 and a pipeline 10. The base 1 is horizontally placed on a monitoring target (CPU/GPU), the thermoelectric refrigerator 2 and the first cold plate 3 are horizontally placed on the base 1 side by side, and the second cold plate 4 is stacked on the thermoelectric refrigerator 2. Wherein the cold side of the thermoelectric cooler 2 is directed towards the base 1 and the hot side is directed towards the second cold plate 4. Said duct 10 is used for the interconnection between the main inlet 5, the first cold plate 3, the second cold plate 4 and the main outlet 6, from which main inlet 5 the cooling liquid enters the device, from which main outlet 6 the cooling liquid leaves the device. The first cooling plate 3 and the second cooling plate 4 each have a pair of coolant inlets and outlets, namely, a first inlet 31, a first outlet 32, a second inlet 41, and a second outlet 42. The total inlet 5 and the first inlet 31, the first outlet 32 and the total outlet 6, the total inlet 5 and the second inlet 41, the second outlet 42 and the total outlet 6, the first outlet 32 and the second inlet 41 are all connected by the pipe 10. And each electric valve is respectively arranged between the main inlet 5 and the second inlet 41, between the first outlet 32 and the main outlet 6 and between the first outlet 32 and the second inlet 41, and each electric valve is respectively controlled to be opened or closed by an electric signal.
A gap is provided between the thermoelectric cooler 2 and the first cold plate 3 to prevent heat transfer.
Each contact surface needing heat conduction, such as the contact surface of the base 1 and the CPU, the contact surface of the thermoelectric cooler 2 and the base 1, the contact surface of the first cold plate 3 and the base 1, the contact surface of the thermoelectric cooler 2 and the second cold plate 4, and the like, is filled with a heat conduction interface material, such as heat conduction silicone grease, heat conduction gel, and the like.
The base 1, the first cold plate 3 and the second cold plate 4 are made of metal materials with good heat conduction performance, such as aluminum or copper.
The size of the base 1 is larger than or equal to the size of the monitoring target, and the base 1 completely covers the surface of the CPU.
The bottom area of the thermoelectric cooler 2 is smaller than the surface area of the base 1, and preferably, the bottom area of the thermoelectric cooler 2 occupies half of the surface area of the base 1.
In this embodiment, in combination with fig. 2, the first cold plate 3 and the second cold plate 4 are communicated through a pipe 10, and the cooling liquid flows in the pipe 10. The cooling liquid flows into the device through the main inlet 5 and out of the device through the main outlet 6. The cooling liquid flows in through the first inlet 31 and out of the first cold plate 3 through the first outlet 32. The cooling liquid flows in through the second inlet 41 and out of the second cold plate 4 through the second outlet 42. The total inlet 5 communicates with the first and second inlets 31, 41, the total outlet 6 communicates with the first and second outlets 32, 42, and the first outlet 32 communicates with the second inlet 41. The first electrically operated valve 7 is located between the main inlet 5 and the second inlet 41, the second electrically operated valve 8 is located between the first outlet 32 and the main outlet 6, and the third electrically operated valve 9 is located between the first outlet 32 and the second inlet 41.
The electrically operated valve may be any valve which can be controlled to be opened and closed by an electric signal, and the type of the valve is not limited herein.
The present embodiment achieves temperature control of the monitoring target by:
Assuming that the monitoring target (CPU/GPU) low usage status is "initial status" or the temperature is lower than the safety line, the thermoelectric cooler 2 remains powered off, the first electrically operated valve 7 and the second electrically operated valve 8 are closed, and the third electrically operated valve 9 is opened, at which time the coolant flows through the first cold plate 3 and the second cold plate 4 in sequence, as shown in fig. 3. For simplicity of the row, this flow pattern is hereinafter referred to as "series". As shown in fig. 4, heat generated by the monitoring target is conducted to the first cold plate 3 and the second cold plate 4 through the base 1, and then is taken away by the cooling liquid flowing through the cold plates. When the usage rate of the monitoring target (CPU/GPU) increases and the temperature reaches the safety threshold, the thermoelectric refrigerator 2 is energized, the first electrically operated valve 7 and the second electrically operated valve 8 are opened, the third electrically operated valve 9 is closed, and at this time, the coolant flows through the first cold plate 3 and the second cold plate 4 respectively in a flow path shown in fig. 5, and finally, the coolant is merged and flows out again, as shown in fig. 6, and this flow mode is hereinafter referred to as "parallel connection". Those skilled in the art will appreciate that thermoelectric coolers, when energized, absorb heat at one end and release heat at the other end, thereby forming a cold end and a hot end. In this embodiment, the cold end absorbs heat generated by the monitoring target through the base 1, and the heat is transferred to the second cold plate 4 from the hot end, and is taken away by the cooling liquid. In this embodiment, the power of the thermoelectric refrigerator is controlled by PWM (Pulse width modulation ) to balance the heat absorption amount with the heat generation increase amount due to the increase of the usage rate of the monitoring target, so that the temperature of the monitoring target is controlled within the safety threshold.
In this embodiment, the following discusses the beneficial effects of controlling the cooling fluid "series" and "parallel:
The thermal resistance is larger in the power-off state of the thermoelectric cooler, and the heat is conducted to the second cold plate from the monitoring target through the thermoelectric cooler, so that the loss of the heat directly conducted to the first cold plate is smaller, the heat exchange efficiency of the first cold plate is high, and the heat exchange efficiency of the second cold plate is low. Therefore, the series connection mode is adopted, and the cooling liquid firstly flows through the first cold plate to complete full heat exchange and then flows into the second cold plate to assist heat exchange. If the parallel connection is adopted, half of the cooling liquid enters the first cold plate, and the other half enters the second cold plate, so that the heat exchange is insufficient, and the cooling efficiency is low. In the electrified state of the thermoelectric refrigerator, heat is absorbed from the cold end and released from the hot end, and the heat released from the hot end is the sum of the heat absorbed by the cold end and the input electric energy, namely, the heat released from the hot end is larger than the heat released by the CPU. Therefore, if a serial connection mode is adopted, heat generated by the hot end of the thermoelectric refrigerator is reversely transmitted back to the monitoring target through the cooling liquid, so that the cooling efficiency is reduced; the parallel connection mode is adopted, so that the heat transfer between the two cold plates is not affected.
The device is arranged on each CPU/GPU in the server, and controls the corresponding thermoelectric refrigerator and the electric valve switch according to the utilization rate and the temperature change of each CPU/GPU, so as to realize distributed heat management.
It will be understood that the application has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the application. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the application without departing from the essential scope thereof. Therefore, it is intended that the application not be limited to the particular embodiment disclosed, but that the application will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. A method of distributed control of a thermoelectric cooler based distributed thermal management device comprising a base (1), a thermoelectric cooler (2), a first cold plate (3), a second cold plate (4), a total inlet (5), a total outlet (6) and a conduit (10); the base (1) is horizontally placed on a monitoring target, the thermoelectric refrigerator (2) and the first cold plate (3) are horizontally placed on the base (1) side by side, the second cold plate (4) is stacked on the thermoelectric refrigerator (2), the cold end of the thermoelectric refrigerator (2) faces the base (1) and the hot end of the thermoelectric refrigerator faces the second cold plate (4), the pipeline (10) is used for interconnecting the main inlet (5), the first cold plate (3), the second cold plate (4) and the main outlet (6), cooling liquid enters the device from the main inlet (5) and leaves the device from the main outlet (6), a plurality of electric valves are arranged on the pipeline (10) and are used for controlling the flow direction of the cooling liquid, and the first cold plate (3) and the second cold plate (4) are respectively provided with a pair of cooling liquid inlets and outlets, namely a first inlet (31), a first outlet (32), a second inlet (41) and a second outlet (42); the main inlet (5) and the first inlet (31), the first outlet (32) and the main outlet (6), the main inlet (5) and the second inlet (41), the second outlet (42) and the main outlet (6), and the first outlet (32) and the second inlet (41) are all connected through a pipeline (10); an electric valve is arranged between the main inlet (5) and the second inlet (41), between the first outlet (32) and the main outlet (6) and between the first outlet (32) and the second inlet (41), and each electric valve is respectively controlled to be opened or closed by an electric signal; the cooling liquid flows in through the first inlet (31) and flows out of the first cold plate (3) through the first outlet (32); the cooling liquid flows in through the second inlet (41) and flows out of the second cold plate (4) through the second outlet (42); the main inlet (5) is communicated with a first inlet (31) and a second inlet (41), the main outlet (6) is communicated with a first outlet (32) and a second outlet (42), and the first outlet (32) is communicated with the second inlet (41); the first electric valve (7) is positioned between the main inlet (5) and the second inlet (41), the second electric valve (8) is positioned between the first outlet (32) and the main outlet (6), and the third electric valve (9) is positioned between the first outlet (32) and the second inlet (41);
characterized in that the method comprises the following steps:
When the monitoring target is in an initial state or the temperature is lower than a safety line, the thermoelectric refrigerator (2) is kept powered off, the first electric valve (7) and the second electric valve (8) are closed, the third electric valve (9) is opened, cooling liquid sequentially flows through the first cooling plate (3) and the second cooling plate (4), and heat generated by the monitoring target is conducted to the first cooling plate (3) and the second cooling plate (4) through the base (1) and then is taken away by the cooling liquid flowing through the cooling plates;
When the utilization rate of the monitoring target rises and the temperature reaches a safety threshold, the thermoelectric refrigerator (2) is electrified, the first electric valve (7) and the second electric valve (8) are opened, the third electric valve (9) is closed, the cooling liquid is divided into two flows which respectively flow through the first cold plate (3) and the second cold plate (4) and finally are converged and discharged, the cold end absorbs heat generated by the monitoring target through the base (1), the heat is transferred to the second cold plate (4) through the hot end, and the heat is taken away by the cooling liquid.
2. The method according to claim 1, characterized in that the thermoelectric cooler (2) and the first cold plate (3) have a gap between them.
3. The method according to claim 1, characterized in that the base (1) and monitoring target contact surface, the thermoelectric cooler (2) and base (1) contact surface, the first cold plate (3) and base (1) contact surface, the thermoelectric cooler (2) and second cold plate (4) contact surface are filled with a thermally conductive interface material.
4. The method according to claim 1, characterized in that the base (1), the first cold plate (3) and the second cold plate (4) are of a thermally conductive metallic material.
5. The method according to claim 1, wherein the size of the base (1) is equal to or larger than the size of the monitoring target, and the base (1) completely covers the CPU surface.
6. The method according to claim 1, characterized in that the thermoelectric cooler (2) has a bottom area smaller than the surface area of the base (1).
7. The method of claim 1, wherein the device is installed on each processor in the server, and the corresponding thermoelectric cooler and electrically operated valve switch are controlled according to the usage rate and temperature change of each processor, so as to realize distributed heat management.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210697281.5A CN115061550B (en) | 2022-06-20 | Distributed thermal management device based on thermoelectric refrigerator and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210697281.5A CN115061550B (en) | 2022-06-20 | Distributed thermal management device based on thermoelectric refrigerator and control method |
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| Publication Number | Publication Date |
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| CN115061550A CN115061550A (en) | 2022-09-16 |
| CN115061550B true CN115061550B (en) | 2024-04-26 |
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