CN114144045A - Liquid cooling circulation system - Google Patents

Liquid cooling circulation system Download PDF

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Publication number
CN114144045A
CN114144045A CN202111522710.7A CN202111522710A CN114144045A CN 114144045 A CN114144045 A CN 114144045A CN 202111522710 A CN202111522710 A CN 202111522710A CN 114144045 A CN114144045 A CN 114144045A
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CN
China
Prior art keywords
liquid
pipeline
liquid cooling
heat exchange
circulation system
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Pending
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CN202111522710.7A
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Chinese (zh)
Inventor
张晶
孙振
白文飞
吕风恩
田锋
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Great Wall Chaoyun Beijing Technology Co ltd
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Great Wall Chaoyun Beijing Technology Co ltd
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Priority to CN202111522710.7A priority Critical patent/CN114144045A/en
Publication of CN114144045A publication Critical patent/CN114144045A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the technical field of liquid cooling data centers, in particular to a liquid cooling circulation system which is used for cooling high-power density components in a server and comprises a first heat exchange pipeline and a second heat exchange pipeline, wherein the first heat exchange pipeline comprises a plurality of liquid cooling pipelines, the liquid cooling pipelines are arranged in one-to-one correspondence with the high-power density components in the server, the plurality of liquid cooling pipelines are arranged in parallel or in series, an input end and an output end of the first heat exchange pipeline are communicated to form a first loop, the input end and the output end of the first heat exchange pipeline are respectively communicated with two ends of the second heat exchange pipeline to form a second loop, and the first loop and the second loop are switched through a controller. This application flows into the liquid cooling pipeline and flows through the liquid cooling board and takes away the heat of the high power density part in the server through the coolant liquid, can carry out fine heat dissipation to the high power density part in the server.

Description

Liquid cooling circulation system
Technical Field
The invention relates to the technical field of liquid cooling data centers, in particular to a liquid cooling circulation system.
Background
As an important infrastructure for informatization development, with continuous development of technologies such as 5G edge computing, big data, artificial intelligence, cloud computing and block chaining, people continuously improve the computing performance requirements of the server, which also makes the power consumption design values of each component inside the server in a linear growth trend, for example: the heat flux density of the whole server is continuously improved to make the energy consumption problem more and more prominent, so that the construction requirements of a novel green, reliable and high-density data center are met.
The refrigeration system is the part with the largest energy consumption except the IT load in a data center machine room and also becomes one of key factors for restricting the power density of a single cabinet, the traditional server adopts an air cooling structure for heat dissipation, and the internal hardware of the server is as follows: the difference between the heat dissipation density of the CPU, the network card, the memory, the hard disk and the like and the heat dissipation density of the cabinet level is about one order of magnitude, and the problem of local heat island effect exists in the traditional air-cooled data center, so that the problem that the heat dissipation of the traditional server is not good enough needs to be solved.
Disclosure of Invention
The invention aims to provide a liquid cooling circulation system, which aims to solve the problem that the traditional server is not good enough in heat dissipation.
The technical scheme of the invention is realized as follows:
the utility model provides a liquid cooling circulation system for cool off the high power density part in the server, including first heat transfer pipeline and second heat transfer pipeline, first heat transfer pipeline includes many liquid cooling pipelines, the liquid cooling pipeline sets up with the high power density part one-to-one in the server, many the liquid cooling pipeline is parallelly connected or the series connection sets up, form first return circuit behind the input and the output intercommunication of first heat transfer pipeline, the input and the output of first heat transfer pipeline respectively with the both ends intercommunication of second heat transfer pipeline forms the second return circuit, first return circuit with the second return circuit switches through the controller.
Furthermore, be provided with the liquid cooling board on the liquid cooling pipeline, the part one-to-one setting in liquid cooling board and the server is gone into the liquid cooling pipeline and is flowed through the liquid cooling board and take away the heat of the high power density part in the server through the coolant liquid, can carry out fine heat dissipation to the high power density part in the server.
Further, still be provided with the electrodynamic balance governing valve on the liquid cooling pipeline, the electrodynamic balance governing valve sets up in being close to one side of the feed liquor end of liquid cooling board, the purpose that sets up like this is, the coolant liquid in the liquid cooling pipeline flows the in-process, overcomes because of the uneven condition that leads to the coolant liquid to distribute of resistance that produces in gravity potential difference and the liquid cooling pipeline along the journey resistance, and the same solution is different because of the heat transfer volume demand between the different liquid cooling boards in the server rack, leads to the unable condition that reaches required flow of circulation circuit because the coolant liquid flow resistance is uneven in each liquid cooling board.
Furthermore, the first loop further comprises a liquid inlet pipeline, a liquid outlet pipeline and a connecting pipeline, wherein the liquid cooling pipelines are arranged in parallel, the liquid outlet end of the liquid inlet pipeline is communicated with the liquid inlet ends of the liquid cooling pipelines through a liquid distributor, the liquid inlet end of the liquid outlet pipeline is communicated with the liquid outlet ends of the liquid cooling pipelines through a liquid collector, and the liquid inlet end of the liquid inlet pipeline is communicated with the liquid outlet end of the liquid outlet pipeline through the connecting pipeline.
Furthermore, the liquid inlet end of the liquid inlet pipeline is communicated with the liquid outlet end of the connecting pipeline and the liquid outlet end of the second heat exchange pipeline through a first three-way electric valve respectively, and the liquid outlet end of the liquid outlet pipeline is communicated with the liquid inlet end of the connecting pipeline and the liquid inlet end of the second heat exchange pipeline through a second three-way electric valve respectively.
Furthermore, be provided with the power pump on the feed liquor pipeline, the output of power pump passes through knockout and many the feed liquor end intercommunication of liquid cooling pipeline, the input of power pump with first tee bend motorised valve is connected.
Further, a flow mixer is arranged between the power pump and the first three-way electric valve.
Furthermore, at the output end of the power pump, namely, between the outlet position of the power pump and the liquid inlet end of the liquid separator, between each liquid outlet end of the liquid separator and the liquid inlet end of the corresponding liquid cooling plate, between each liquid inlet end of the liquid collector and the liquid outlet end of the corresponding liquid cooling plate, and between the outlet end of the liquid collector and the liquid outlet pipeline, quick connectors are preferably used for connection, so that the system loop can be quickly disconnected, liquid leakage cannot occur, the maintenance is convenient, and the overall safety of a machine room is improved.
Further, the first loop is further provided with an exhaust valve, the exhaust valve is preferably arranged on the liquid inlet pipeline and the liquid outlet pipeline, and the exhaust valve is preferably arranged at the highest point (the highest point is the highest position) on the first loop and used for exhausting the non-condensable gas in the first loop, so that the heat exchange performance of the first loop during operation is ensured.
Furthermore, be provided with flow sensor, first temperature sensor and first pressure sensor on the feed liquor pipeline for inside feed liquor temperature, pressure and the total flow state of real-time supervision feed liquor pipeline.
Furthermore, a second temperature sensor and a second pressure sensor are arranged on the liquid outlet pipeline and used for monitoring the liquid return temperature and the liquid return pressure in real time.
Furthermore, a heat exchanger component is arranged on the second heat exchange pipeline, and heat exchange is carried out on liquid discharged from the liquid return pipeline through the heat exchanger component, so that the liquid reaches a proper temperature.
Further, the heat exchanger component comprises a condenser and a variable-frequency speed regulation fan, and the heat exchanger component is used in cooperation with the variable-frequency speed regulation fan to achieve the heat exchange effect.
Further, a heat exchange pipe fitting is further arranged on the second heat exchange pipeline and used for connecting the heat exchanger assembly and the second three-way electric valve.
Furthermore, the heat exchange pipe adopts a solid-liquid phase change heat storage material body, the phase change temperature point of the solid-liquid phase change heat storage material body is determined according to the liquid inlet temperature detected by the first temperature sensor after entering the power pump and the highest temperature outside the local room, and the hot fluid after heat exchange with the high-power density part and the heat exchange pipe adopting the solid-liquid phase change heat storage material body firstly carry out primary heat exchange, so that the heat exchange performance is effectively improved, the energy consumption loss is reduced, and the system is more energy-saving.
Furthermore, the flow sensor, the first temperature sensor, the first pressure sensor, the electric balance regulating valve, the condenser, the variable frequency fan, the second temperature sensor, the second pressure sensor, the first three-way electric valve and the second three-way electric valve are electrically connected with the controller, and the controller controls the opening sizes and the passage conditions of the first three-way electric valve and the second three-way electric valve according to the liquid return temperature detected by the second temperature sensor in the liquid outlet pipeline and the liquid temperature condition after passing through the heat exchanger assembly, and dynamically regulates the actions of the variable frequency fan, the condenser and the power pump so as to ensure stable liquid inlet temperature and optimal energy utilization.
Compared with the prior art, the invention has the beneficial effects that:
this application is provided with many liquid cooling pipelines, is provided with the liquid cooling board on the liquid cooling pipeline, and the high power density part one-to-one in liquid cooling board and the server sets up, and through the pressure differential effect of power pump, the coolant liquid flows into the liquid cooling pipeline and flows through the liquid cooling board and takes away the heat of the high power density part in the server, can carry out fine heat dissipation to the high power density part in the server.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of an overall frame structure in embodiment 1 of the present invention.
In the figure:
1-a heat exchanger assembly; 2-liquid cooling plate; 3-a liquid separator; 4-a liquid inlet pipeline; 5-a liquid outlet pipeline; 6-connecting a pipeline; 7-a first three-way electric valve; 8-a second three-way electric valve; 9-a power pump; 10-a flow mixer; 11-an exhaust valve; 12-a flow sensor; 13-a first temperature sensor; 14-a first pressure sensor; 15-a second temperature sensor; 16-a second pressure sensor; 17-a liquid trap; 18-electrodynamic balance regulating valve; 19-an expansion tank; 20-heat exchange pipe fitting.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Example 1
Referring to fig. 1, a liquid cooling circulation system for cooling high power density parts in a server includes a first heat exchange pipeline and a second heat exchange pipeline, the first heat exchange pipeline includes a plurality of liquid cooling pipelines, the liquid cooling pipelines are arranged in one-to-one correspondence with the high power density parts in the server, and the liquid cooling pipelines are connected in parallel or in series, a first loop is formed after the input end and the output end of the first heat exchange pipeline are communicated, the input end and the output end of the first heat exchange pipeline are respectively communicated with the two ends of the second heat exchange pipeline to form a second loop, and the first loop and the second loop are switched through a controller.
It is worth noting that many liquid cooling pipelines of this application can parallelly connected also can establish ties, and the preferred part one-to-one that makes in liquid cooling board 2 and the server with parallelly connected mode sets up, realization heat dissipation that can be better, and the liquid cooling circulation system of this application can not only be to a server, can carry out the liquid cooling heat transfer with a plurality of servers parallelly connected moreover through many liquid cooling pipelines.
It should also be noted that each liquid cooling pipeline all is provided with electrodynamic balance governing valve 18, electrodynamic balance governing valve 18 sets up in the one side of the inlet end that is close to liquid cooling board 2, the purpose that sets up like this, the coolant liquid in the liquid cooling pipeline flows the in-process, overcome because of the uneven condition that leads to the coolant liquid distribution of the resistance that produces in gravity potential difference and the liquid cooling pipeline along journey resistance, the same solution is different because of the heat transfer volume demand between different liquid cooling boards 2 in the server rack, lead to the unable condition that reaches required flow of circulation circuit because the coolant liquid flow resistance is uneven in each liquid cooling board 2.
The input end and the output end of the first heat exchange pipeline are communicated to form a first loop, and cooling liquid in the liquid cooling pipeline passes through the liquid cooling plate 2 in the flowing process and takes away heat of the corresponding high-power-density component, so that the purpose of rapid heat dissipation is realized, and rapid heat exchange can be carried out on the high-power-density component in the server through the first loop.
The first loop can also include feed liquor pipeline 4, drain pipe 5 and connecting line 6, and the first loop sets up indoor (being the computer lab promptly), and the relation of connection between feed liquor pipeline 4, drain pipe 5 and connecting line 6 and many liquid cooling pipelines in the first loop is as follows:
the liquid outlet end of the liquid inlet pipeline 4 is communicated with the liquid inlet ends of the liquid cooling pipelines through the liquid separator 3, the liquid inlet end of the liquid outlet pipeline 5 is communicated with the liquid outlet ends of the liquid cooling pipelines through the liquid collector 17, the liquid inlet end of the liquid inlet pipeline 4 is communicated with the liquid outlet end of the liquid outlet pipeline 5 through the connecting pipeline 6, a complete first loop is formed, and the first loop is arranged indoors and is also called an indoor liquid cooling circulating system.
It is worth noting that when the liquid cooling circulation system described in the present application needs to connect a plurality of server cabinets in parallel and perform liquid cooling heat exchange, a plurality of liquid distributors 3 or liquid collectors 17 may be arranged to establish connection with a plurality of liquid cooling pipelines, and the number of branch pipes of all liquid distributors 3 and the number of branch pipes of all liquid collectors 17 are the same as that of the liquid cooling pipelines and are in one-to-one correspondence.
Wherein, be provided with power pump 9 on the feed liquor pipeline 4, power pump 9's output passes through the feed liquor end intercommunication of knockout 3 with many liquid cooling pipelines, and power pump 9 can connect in parallel and set up a plurality ofly and as power equipment, and power pump 9's quantity sets for according to actual need, and its quantity selection preferably adopts 2N's form to carry out redundancy setting, and wherein the redundancy sets up a plurality of parallelly connected power pumps 9, can improve system continuous operation reliability and maintain the convenience.
The first loop is further provided with a vent valve 11, preferably, the vent valves 11 are arranged on the liquid inlet pipeline 4 and the liquid outlet pipeline 5, and preferably, the vent valve 11 is arranged at the highest point (the highest point is the highest position) on the first loop to remove non-condensable gas in the first loop and ensure the heat exchange performance of the first loop during operation.
A flow sensor 12, a first temperature sensor 13 and a first pressure sensor 14 are arranged on the liquid inlet pipeline 4 and between the output end of the power pump 9 and the liquid inlet end of the liquid separator 3, and are used for monitoring the liquid inlet temperature, pressure and total flow state in the liquid inlet pipeline 4 in real time.
At the output end of power pump 9, namely between the exit position of power pump 9 and the inlet end of knockout 3, between each outlet end of knockout 3 and the inlet end of the liquid cooling plate 2 that corresponds, between each inlet end of liquid collector 17 and the outlet end of the liquid cooling plate 2 that corresponds, and between the outlet end of liquid collector 17 and outlet pipe 5, all preferably use quick connector to connect, can accomplish quick disconnection system circuit and leak-free, the easy access improves the whole security of computer lab.
An expansion tank 19 is arranged on the liquid outlet pipe 5, and the expansion tank 19 is used for maintaining the water balance in the system and preventing the equipment damage of the input end of the power pump 9 caused by cavitation.
And a second temperature sensor 15 and a second pressure sensor 16 are further arranged on the liquid outlet pipe 5 and used for monitoring the liquid return temperature and the liquid return pressure in real time.
The input and the output of first heat transfer pipeline communicate with the both ends of second heat transfer pipeline respectively, form the second return circuit, then connecting line 6 realizes parallelly connected with the second heat transfer pipeline, and its connected mode is: the liquid inlet end of the liquid inlet pipeline 4 is respectively communicated with the liquid outlet end of the connecting pipeline 6 and the liquid outlet end of the second heat exchange pipeline through a first three-way electric valve 7, the liquid outlet end of the liquid outlet pipeline 5 is respectively communicated with the liquid inlet end of the connecting pipeline 6 and the liquid inlet end of the second heat exchange pipeline through a second three-way electric valve 8, the second loop is arranged outdoors, and the second loop is also called as an outdoor side liquid cooling circulation system because the second loop is arranged outdoors.
It should be noted that a flow mixer 10 is arranged on the liquid inlet pipe 4 between the power pump 9 and the first three-way electric valve 7.
Be provided with heat exchanger assembly 1 on the heat transfer circuit, including condenser and variable frequency speed regulation fan, flow sensor 12, first temperature sensor 13, first pressure sensor 14, the condenser, variable frequency speed regulation fan, second temperature sensor 15, second pressure sensor 16, first tee bend motorised valve 7 and second tee bend motorised valve 8 all with controller electric connection, second temperature sensor 15 transmits the liquid temperature information that returns that detects for the controller, the controller receives signal drive condenser and variable frequency speed regulation fan operation, indirectly, condenser and variable frequency speed regulation fan can carry out automatically regulated according to the liquid temperature that returns in the liquid outlet pipe way 5, the realization is carried out the heat transfer to the liquid of drain pipe way 5 exhaust.
And a heat exchange pipe fitting 20 is further arranged on the second heat exchange pipeline and is used for connecting the heat exchanger component 1 with the second three-way electric valve 8. The heat exchange pipe 20 adopts a solid-liquid phase change heat storage material body, the phase change temperature point of the solid-liquid phase change heat storage material body is determined according to the liquid inlet temperature detected by the first temperature sensor 13 after entering the power pump 9 and the highest temperature outside the local room, and the hot fluid after heat exchange with the high-power density part and the heat exchange pipe 20 adopting the solid-liquid phase change heat storage material body firstly carry out primary heat exchange, so that the heat exchange performance is effectively improved, the energy consumption loss is reduced, and the system is more energy-saving.
The second loop is used for exchanging heat for fluid discharged by a plurality of liquid cooling pipelines, the first loop and the second loop are switched through the controller, the controller controls the opening sizes and the passage conditions of the first three-way electric valve 7 and the second three-way electric valve 8 according to the liquid return temperature detected by the second temperature sensor 15 in the liquid outlet pipeline 5 and the liquid temperature condition after passing through the heat exchanger assembly 1, and dynamically adjusts the actions of the variable frequency speed control fan, the condenser and the power pump 9 so as to ensure stable liquid inlet temperature and optimal energy utilization.
When the temperature of a high-power component in a server is high, cooling liquid with low temperature in the system is conveyed to the liquid inlet end of a liquid distributor 3 through a power pump 9 under the action of pressure difference, the cooling liquid with low temperature flows through a plurality of liquid cooling plates 2 in a server cabinet through a plurality of liquid cooling pipelines through the liquid distributor 3 to exchange heat with the high-power density component, the cooling liquid becomes hot fluid after heat exchange, and the hot fluid converges to a liquid outlet pipeline 5 through the liquid outlet end of a liquid collector 17, then enters a heat exchanger component 1 after being stabilized by an expansion tank 19 to exchange heat with a heat exchange pipe 20 made of solid-liquid phase change heat storage materials and then enters a heat exchanger component 1 to exchange heat with outdoor air through a variable-frequency speed fan to become liquid with proper temperature; when the temperature of the high-power component in the server is low, which results in low liquid return temperature, the liquid return temperature detected by the second temperature sensor 15 is low, the opening degree of the first three-way electric valve and the second three-way electric valve can be operated by the controller in combination with the design of the system loop, so that the system loop is switched, and the proper liquid inlet temperature is obtained after the cooling liquid of the first loop and the cooling liquid of the second loop are mixed by the flow mixer 10.
The working principle of this application does:
the controller controls the passage and the opening distribution of the first three-way electric valve 7 and the second three-way electric valve 8 through a first temperature sensor 13 arranged on the liquid inlet pipeline 4 and a second temperature sensor 15 arranged on the liquid outlet pipeline 5, when the temperature of a high-power density component in the server is lower, the temperature change ranges of the cooling liquid flowing into the liquid cooling plate 2 and the cooling liquid flowing out of the liquid cooling plate 2 are not large, and the fluid discharged from the liquid outlet pipeline 5 does not flow through the heat exchange loop for heat exchange by adopting a liquid cooling circulation mode of a first loop (namely indoor side liquid cooling circulation); when outdoor ambient temperature is lower, for the inlet liquid temperature of effectual control inflow power pump 9 to and prevent that the liquid cooling board 2 in the indoor server from taking place the condensation phenomenon with room temperature air contact side (because liquid cooling board 2 inside has the coolant liquid, cause the temperature of liquid cooling board 2 to be lower), the controller carries out the return circuit through controlling first tee bend motorised valve 7 and second tee bend motorised valve 8 and switches over, and through the coolant liquid proportion in the first return circuit of aperture distribution flow through and the heat transfer circuit, obtain suitable liquid temperature after rethread blender 10 carries out the mixed flow and flow to the input of power pump 9. The design of combining the liquid cooling circulation system of this application, can reduce system's energy consumption and obtain accurate inlet liquid temperature through good control strategy.
The technical scheme of the invention has the beneficial effects that:
the liquid cooling circulation system has higher heat exchange performance, besides, when the system is used for liquid cooling, the system basically operates at slightly higher than normal pressure, the safety is improved, and compared with the prior art, the liquid cooling circulation system does not need a compressor with a high-power component, and the whole machine room energy consumption can be effectively reduced so as to provide lower total cost.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a liquid cooling circulation system for high power density part to in the server cools off, its characterized in that, including first heat transfer pipeline and second heat transfer pipeline, first heat transfer pipeline includes many liquid cooling pipelines, the high power density part one-to-one setting in liquid cooling pipeline and the server is many the liquid cooling pipeline is parallelly connected or is established ties and sets up, form first return circuit behind the input and the output intercommunication of first heat transfer pipeline, the input and the output of first heat transfer pipeline respectively with the both ends intercommunication of second heat transfer pipeline forms the second return circuit, first return circuit with the second return circuit switches through the controller.
2. The liquid cooling circulation system of claim 1, wherein the liquid cooling pipeline is provided with liquid cooling plates (2), and the liquid cooling plates (2) are arranged in one-to-one correspondence with components in the server.
3. The liquid cooling circulation system of claim 2, wherein an electrodynamic balance regulating valve (18) is further arranged on the liquid cooling pipeline, and the electrodynamic balance regulating valve (18) is arranged on a side close to the liquid inlet end of the liquid cooling plate (2).
4. The liquid cooling circulation system of claim 1, wherein the first circuit further comprises a liquid inlet line (4), a liquid outlet line (5), and a connecting line (6);
the plurality of liquid cooling pipelines are arranged in parallel;
the liquid outlet end of the liquid inlet pipeline (4) is communicated with the liquid inlet ends of the plurality of liquid cooling pipelines through a liquid distributor (3), and the liquid inlet end of the liquid outlet pipeline (5) is communicated with the liquid outlet ends of the plurality of liquid cooling pipelines through a liquid collector (17);
the liquid inlet end of the liquid inlet pipeline (4) is communicated with the liquid outlet end of the liquid outlet pipeline (5) through a connecting pipeline (6).
5. The liquid cooling circulation system of claim 4, wherein a liquid inlet end of the liquid inlet pipeline (4) is respectively communicated with a liquid outlet end of the connecting pipeline (6) and a liquid outlet end of the second heat exchange pipeline through a first three-way electric valve (7), and a liquid outlet end of the liquid outlet pipeline (5) is respectively communicated with a liquid inlet end of the connecting pipeline (6) and a liquid inlet end of the second heat exchange pipeline through a second three-way electric valve (8).
6. The liquid cooling circulation system of claim 5, wherein a power pump (9) is disposed on the liquid inlet pipeline (4), an output end of the power pump (9) is communicated with liquid inlet ends of the plurality of liquid cooling pipelines through a liquid separator (3), and an input end of the power pump (9) is connected with the first three-way electric valve (7).
7. The liquid cooling circulation system of claim 4, wherein the liquid inlet line (4) is provided with a flow sensor (12), a first temperature sensor (13) and a first pressure sensor (14).
8. The liquid cooling circulation system of claim 4, wherein a second temperature sensor (15) and a second pressure sensor (16) are disposed on the liquid outlet line (5).
9. The liquid cooling circulation system of claim 5, wherein the second heat exchange line is provided with a heat exchanger assembly (1).
10. The liquid cooling circulation system of claim 9, wherein a heat exchange pipe (20) is further disposed on the second heat exchange pipeline, and the heat exchange pipe (20) is used for connecting the heat exchanger assembly (1) and the second three-way electric valve (8).
CN202111522710.7A 2021-12-13 2021-12-13 Liquid cooling circulation system Pending CN114144045A (en)

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CN202111522710.7A CN114144045A (en) 2021-12-13 2021-12-13 Liquid cooling circulation system

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Application Number Priority Date Filing Date Title
CN202111522710.7A CN114144045A (en) 2021-12-13 2021-12-13 Liquid cooling circulation system

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CN115061550A (en) * 2022-06-20 2022-09-16 之江实验室 Distributed thermal management device based on thermoelectric cooler and control method
CN115910464A (en) * 2022-10-18 2023-04-04 广东天枢新能源科技有限公司 Liquid cooling charging system for charging electric automobile
TWI827483B (en) * 2023-03-13 2023-12-21 元鈦科技股份有限公司 coolant flow distributor
WO2024045966A1 (en) * 2022-08-30 2024-03-07 北京比特大陆科技有限公司 Server cooling system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115046357A (en) * 2022-04-25 2022-09-13 湖南有色郴州氟化学有限公司 Pressurized circulating energy-saving system
CN115061550A (en) * 2022-06-20 2022-09-16 之江实验室 Distributed thermal management device based on thermoelectric cooler and control method
CN115061550B (en) * 2022-06-20 2024-04-26 之江实验室 Distributed thermal management device based on thermoelectric refrigerator and control method
WO2024045966A1 (en) * 2022-08-30 2024-03-07 北京比特大陆科技有限公司 Server cooling system
CN115910464A (en) * 2022-10-18 2023-04-04 广东天枢新能源科技有限公司 Liquid cooling charging system for charging electric automobile
CN115910464B (en) * 2022-10-18 2023-08-11 广东天枢新能源科技有限公司 Liquid cooling charging system for charging electric automobile
TWI827483B (en) * 2023-03-13 2023-12-21 元鈦科技股份有限公司 coolant flow distributor

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