WO2019184364A1

WO2019184364A1 - Thermal management assembly for power battery pack

Info

Publication number: WO2019184364A1
Application number: PCT/CN2018/114379
Authority: WO
Inventors: 韩振亚
Original assignee: 精进电动科技股份有限公司
Priority date: 2018-03-28
Filing date: 2018-11-07
Publication date: 2019-10-03
Also published as: CN108470959A

Abstract

Disclosed in the present invention is a thermal management assembly for a power battery pack, for use in solving the technical problem in the prior art of adjusting the temperature of a power battery pack by means of a refrigerant medium. The thermal management assembly comprises battery modules; several cells arranged side by side are provided in each battery module; a heat conducting plate is provided adjacent to each cell for heat transfer; an end of the heat conducting plate is provided with a bent and extending heat conducting portion; the heat conducting portion contacts a vapor chamber for heat transfer; a thermoelectric cooler is provided in the battery module, and the thermoelectric cooler comprises two heat conducting surfaces; the inner heat conducting surface contacts the vapor chamber for heat transfer, and the outer heat conducting surface contacts a heat dissipation plate for heat transfer. The present invention can effectively improve the thermal management level of a battery pack, ensure the battery pack to work in an appropriate temperature range, improve the performance of the battery pack, and prolong the service life of the battery, and can also make an energy storage system lighter.

Description

Power battery package heat management assembly

Technical field

The invention relates to a power battery pack thermal management assembly for heating and cooling management of a vehicle battery system.

Background of the invention

Among various energy storage technologies, lithium-ion batteries are becoming the best choice for industrial and automotive energy storage devices due to their high energy density characteristics and high commercialization prospects. However, the performance of large-capacity, high-power energy storage battery systems is sensitive to temperature changes. Long-term high and low temperature environments and system temperature differences can affect battery life and performance. Therefore, for high-power energy storage battery systems, special cooling devices must be used to dissipate heat while ensuring that the system is in the proper temperature range.

At present, the mainstream thermal management system adopts air cooling (heating), liquid cooling (heating), or air conditioning refrigerant direct cooling (heating), as shown in Figure 1, Figure 2, Figure 1 is the prior art air-cooled power The structure diagram of the battery pack thermal management assembly, and FIG. 2 is a schematic structural diagram of the liquid-cooled power battery pack thermal management assembly in the prior art. However, these thermal management methods have different degrees of defects in heat transfer efficiency, temperature control uniformity and conversion speed.

The air-cooling conversion speed is fast, but the air heat transfer efficiency is low and the uniformity is poor. The air-conditioning refrigerant has low heat capacity and high heat transfer efficiency, but the uniformity is insufficient; the liquid-cooling heat transfer efficiency is high and the uniformity is good, but the system heat capacity is high. The coolant needs to be heated or cooled first, the energy utilization rate is low, and it is not possible to quickly switch between heating and cooling states. At the same time, these thermal management systems inevitably need to add auxiliary devices such as compressors, fans, evaporators/condensers, water tanks, pipes, pumps and valves to the battery pack to achieve complete thermal management functions. The system is complicated and introduces more problems. For example, air cooling cannot communicate with the outside air, and IP67 protection level cannot be achieved. This is a requirement that the battery pack design must meet; the liquid cooling system exists in the pipeline inside the battery pack. Risk of leakage, etc.

Summary of the invention

In view of the above problems in the prior art, the present invention provides a power battery pack thermal management assembly, which uses a semiconductor refrigeration sheet to directly heat and cool a battery, does not require cold medium heat transfer, and can realize cooling by controlling a current direction. Quickly switch between heating and heating to ensure that the battery pack works in the proper temperature range, improve battery pack performance and extend battery life.

In order to achieve the above object, the technical solution of the present invention is implemented as follows:

The invention provides a power battery package thermal management assembly, comprising a battery module, wherein the battery module is provided with a plurality of groups of single cells arranged side by side, and a heat conducting plate is disposed adjacent to each group of the single cells. Heat transfer, the heat conducting plate end portion is provided with a bent and extended heat conducting portion, and the heat conducting portion is in contact with the heat equalizing plate for heat transfer;

The battery module is provided with a semiconductor refrigerating sheet. The semiconductor refrigerating sheet includes two heat conducting surfaces, and the inner heat conducting surface is in contact with the soaking plate for heat transfer, and the outer heat conducting surface is in contact with the heat dissipating plate for heat transfer.

Optionally, the heat conducting portions of the heat conducting plates are located on the same plane, and the heat conducting portions of the adjacent heat conducting plates overlap a portion of the regions for heat transfer.

Optionally, the heat conducting plate between the adjacent single cells is in contact with the single cells on both sides for heat transfer.

Optionally, the thermal management assembly further includes a control circuit, the control circuit includes a main circuit, and the plurality of sets of the battery modules are connected in parallel or in series on the main circuit.

Optionally, one or several sets of semiconductor cooling sheets are disposed in the battery module, and a plurality of sets of semiconductor cooling sheets are connected in parallel or in series.

Optionally, a relay control on/off is disposed on the main circuit, and a current sampling point is disposed on the main circuit.

Optionally, the main circuit is electrically connected to the plurality of parallel branches, and each of the semiconductor cooling fins connected in parallel is connected to a set of parallel branches, and the switch group is provided with a switch group to control on and off, on and off The duration and current direction are provided with current sampling points on the branch.

Optionally, the current sampling point sets a voltage dividing resistor or a current sensor to monitor the current value.

Optionally, the thermal management module further includes an intelligent management module, the smart management module monitors a current value of the main loop, controls the relay to implement on and off of the main loop, and the intelligent management module monitors the The current value of the branch is controlled to control the on/off, on-off duration and current direction of the branch.

Optionally, the intelligent management module is communicatively coupled to a battery pack management system (BMS).

Optionally, the temperature equalizing plate and the heat dissipation plate are both provided with a temperature sensor collecting temperature, and the temperature signal is sent to the intelligent management module, and the intelligent management module monitors the heat equalizing plate and the The temperature value of the heat sink is controlled to control the on/off, the on-off duration and the current direction of the branch.

Optionally, a fuse is disposed on the main circuit, and the switch group adopts a MOS type switch circuit or an IGBT type switch circuit.

Optionally, the unit battery is installed in a battery box, and an outer side surface of the heat dissipation board is in contact with a box of the battery box, and the box body exchanges heat with an external environment.

Optionally, between the unit cell and the heat conducting plate, between the heat equalizing plate and the heat conducting plate, between the semiconductor refrigerating sheet and the heat equalizing plate and the heat dissipating plate, A heat conductive pad or a thermal conductive adhesive is filled between the heat dissipation plate and the casing of the battery case.

Optionally, a heat insulating pad is disposed between the heat equalizing plate and the heat dissipation plate.

Optionally, the box of the battery box is made of cast aluminum or aluminum profiles, and the battery module uses the box body as a heat exchanger for heat exchange with the external environment.

Optionally, heat dissipation fins may be disposed on the outside of the box to enhance heat exchange effects.

Optionally, a spoiler is disposed outside the box, and the spoiler adjusts a flow of air through the heat dissipating fins to enhance a heat exchange effect.

Optionally, the heat conducting plate, the heat equalizing plate, and the heat dissipating plate are all made of high thermal conductivity metal.

The present invention adopting the above configuration has the following advantages:

The invention can be integrated in the battery pack without external auxiliary facilities, which is beneficial to the weight reduction of the battery system.

The invention adopts a method in which a semiconductor refrigeration sheet directly heats or cools a battery, and has high heat transfer efficiency.

The additional device of the present invention has a small heat capacity and a small heat loss.

The invention can perform feedback control and state monitoring through the intelligent module, and has high control precision and high fault tolerance.

The soaking plate, the semiconductor refrigerating sheet and the heat dissipating plate in the invention can be integrated into the battery module structure, which is beneficial to improving the generalization and standardization of the module.

BRIEF DESCRIPTION OF THE DRAWINGS

1 is a schematic structural view of a prior art air-cooled power battery pack thermal management assembly;

2 is a schematic structural view of a liquid-cooled power battery pack thermal management assembly in the prior art;

3 is a schematic structural view of a semiconductor refrigeration sheet in an embodiment of the present invention;

4 is a schematic structural view of a power battery pack thermal management assembly according to an embodiment of the present invention;

Figure 5 is an enlarged view of the switch block of Figure 4;

6 is a schematic structural view of a battery module according to an embodiment of the present invention;

Figure 7 is an enlarged view of a portion A in Figure 6;

FIG. 8 is a control flowchart of an intelligent management unit in an embodiment of the present invention.

In the figure: 1. Intelligent management module; 2. Fuse; 3. Relay; 4. Current sampling point; 4-n. Current sampling point; 5. Switch group; 5-n-1. Switch; 5-n-2 Switch; 5-n-3. switch; 5-n-4. switch; 6. battery module; 6-1. heat conducting plate; 6-2. single cell; 6-3. heat conducting portion; Hot plate; 8. Semiconductor refrigeration chip; 8-1. N type or P type semiconductor; 8-2. Metal conductor; 8-3. Insulating ceramic piece; 9. Insulation pad; 10. Heat sink;

Mode for carrying out the invention

The invention adopts the semiconductor refrigeration sheet to directly heat and cool the battery, does not need cold medium heat transfer, and can quickly switch between cooling and heating by controlling the current direction, ensuring that the battery pack works in a suitable temperature range, and improving the performance of the battery pack. And extend battery life.

The system of the invention is integrated in the battery pack, can quickly heat or cool according to the state of the battery pack without external auxiliary setting, and can quickly switch between cooling and heating.

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

Example 1

As shown in FIG. 4, FIG. 6, and FIG. 8, the embodiment provides a power battery pack thermal management assembly, including a battery module 6, and a plurality of battery cells 6-2 arranged side by side in the battery module 6 are disposed. A heat conducting plate 6-1 is disposed adjacent to each of the unit cells 6-2 for heat transfer, and one end of the heat conducting plate 6-1 is provided with a heat conduction portion 6-3 which is bent and extended, and a heat conducting portion 6-3 and a heat equalizing plate 7 contact for heat transfer.

The battery module 6 is provided with a semiconductor refrigerating sheet 8, which includes two heat transfer surfaces, the inner heat transfer surface and the heat equalizing plate 7 are in contact with each other for heat transfer, and the outer heat transfer surface is in contact with the heat sink 10 for heat transfer.

The structure of the semiconductor refrigerating sheet 8 used in this embodiment is as shown in FIG. 3. The N-type semiconductor 8-1 and the P-type semiconductor 8-1 are arranged at intervals, and the metal conductors 8-2 are arranged in series at both ends, and the metal conductor 8-2 is provided. The outside is in contact with the insulating ceramic sheet 8-3 for heat transfer.

The semiconductor refrigerating sheet is also called a thermoelectric cooling sheet, and has the advantages of no sliding parts, unlimited application space, high reliability requirements, and no refrigerant contamination. The principle is to use the Pel tier effect of the semiconductor material (Peltier effect). When the direct current is passed through a series of galvanic couples of different semiconductor materials, the heat can be absorbed and the heat is released at both ends of the galvanic couple. The purpose of cooling or heating.

As shown in FIG. 3, when an N-type semiconductor material and a P-type semiconductor material are coupled into a galvanic pair, after the DC current is turned on in the circuit, energy transfer can be generated, and the current flows from the N-type component to the P-type. The joint of the element (the upper metal conductor 8-2) absorbs heat and becomes a cold end, and the junction of the P-type element flowing to the N-type element (the lower metal conductor 8-2) releases heat, and becomes a hot end. Conversely, change the direction of the current, and the cold and hot ends are swapped. The heat absorption and exothermic power are determined by the magnitude of the current and the number of components of the semiconductor materials N and P.

As shown in FIG. 6, the heat conducting portions 6-3 of the heat conducting plate 6-1 are located on the same plane to ensure effective contact with the heat equalizing plate 7, and the heat conducting portion 6-3 of the adjacent heat conducting plate 6-1 is superimposed on a portion of the area. Heat further improves the balance of heat transfer between each other.

The heat equalizing plate 7 can be installed in the battery module 6 as an attachment or a structural member. The heat equalizing plate 7 may be in the form of a flat plate that contacts one side of the battery module 6, such as a bottom surface. The heat equalizing plate 7 can also contact the plurality of sides of the battery module 6 for heat transfer to enhance the heat transfer effect. For example, it is designed in a U shape, contacts three sides of the battery module 6, or is designed in a groove shape to contact the five sides of the battery module 6.

The heat conducting plate 6-1 between the adjacent unit cells 6-2 is in contact with both of the unit cells 6-2 on both sides for heat transfer.

For the outermost unit cell 6-2, a heat transfer plate 6-1 may be provided on the outer side thereof, and the heat transfer plate 6-1 here is only in contact with the outermost unit cell 6-2 for heat transfer.

As shown in FIG. 4, the thermal management assembly further includes a control circuit including a main circuit, the main circuit is electrically connected to the plurality of parallel branches, and the thermal management assembly includes a plurality of battery modules 6, each of which is configured Group 6 of semiconductor refrigeration sheets 8 are connected to a set of parallel branches.

In FIG. 4, the main circuit is electrically connected to n sets of parallel branches, and the thermal management assembly includes n sets of battery modules 6.

It is also possible to connect several groups of battery modules 6 in series and then into the main circuit or a group of parallel branches.

One or several sets of semiconductor refrigerating sheets 8 are disposed in each set of battery modules 6, and a plurality of sets of semiconductor refrigerating sheets 8 are in a parallel relationship. When a plurality of sets of semiconductor refrigerating sheets 8 are provided, a plurality of sets of semiconductor refrigerating sheets 8 use the same heat equalizing plate 7, and the same heat dissipating plate 10.

In FIG. 4, only the parallel branch of the control battery module 6 is schematically shown. In fact, each group of semiconductor cooling fins 8 connected in parallel can be connected to a set of parallel branches, so that the intelligent management module 1 It is possible to control the on-off, on-off duration and current direction of each group of semiconductor refrigerating sheets 8, and the isolated semiconductor refrigerating sheets 8 can be individually isolated.

It is also possible to connect several sets of semiconductor cooling fins 8 in series and then into a set of parallel branches, in order to adapt to the demand of high voltage. For example, if the whole vehicle uses a 24V power supply system and the semiconductor refrigeration chip 8 has an operating voltage of 12V, it is necessary to connect two sets of semiconductor cooling sheets 8 in series to adapt the vehicle voltage.

As shown in Fig. 4, the main circuit is provided with a relay 3 for controlling on and off, and a current sampling point 4 is provided on the main circuit.

The switch group 5 is provided with a switch group 5 for controlling on-off, on-off duration and current direction, and a current sampling point 4-n is arranged on the branch.

A voltage dividing resistor or a current sensor can be set to monitor the current value at both the current sampling point 4 and the current sampling point 4-n.

The thermal management assembly further includes an intelligent management module 1. The intelligent management module 1 monitors the current value of the main circuit, that is, collects a current signal at the current sampling point 4, controls the relay 3 to realize the on/off of the main circuit, and the intelligent management module 1 monitors the branch. The current value, that is, the current signal is collected at the current sampling point 4-n, and the control switch group 5 realizes the on/off, the on-off duration and the current direction of the branch. The intelligent management module 1 is equivalent to the overall controller of the control circuit.

The intelligent management module 1 is in communication with a battery pack management system (BMS), receives control commands of the battery pack management system (BMS), and implements heating and cooling of different powers according to the requirements of the battery pack management system (BMS).

The intelligent management module 1 can control the number of opening of the battery module 6 or the semiconductor refrigerating sheet 8 through the switch group 5, isolate the faulty battery module 6 or the semiconductor refrigerating sheet 8, and report the fault state to the battery pack management system (BMS).

As shown in FIG. 5, when the switches 5-n-1, 5-n-3 are turned on and the switches 5-n-2, 5-n-4 are kept open, the current in the branch is one direction, this When the semiconductor refrigerating sheet 8 is in a heating or cooling state, when the switches 5-n-1, 5-n-3 are turned off and the switches 5-n-2, 5-n-4 are kept turned on, the current in the branch In the opposite direction, the semiconductor cooling sheet 8 is in a state of being cooled or heated.

In this embodiment, the temperature sensor acquisition temperature is set on the heat equalizing plate 7 and the heat dissipation plate 10, and the temperature signal is sent to the intelligent management module 1, and the intelligent management module 1 monitors the temperature values of the heat equalizing plate 7 and the heat dissipation plate 10. The control switch group 5 realizes the on/off, the on-off duration and the current direction of the branch.

By collecting the temperature values of the heat equalizing plate 7 and the heat sink 10, the intelligent management module 1 can implement closed loop control to prevent the battery module 6 from being too cold or overheated.

If a certain group of semiconductor refrigerating sheets 8 is always in a high temperature or low temperature state and does not respond to the control of the switch group 5, the intelligent management module 1 can judge that the group of semiconductor refrigerating sheets 8 is in a fault state, cut off the switch group 5, and isolate it. .

As shown in Fig. 4, a fuse 2 (fuse) is also provided on the main circuit, and the fuse 2 is used as a passive protection system.

The switch group 5 adopts a MOS type switch circuit or an IGBT type switch circuit, and the controlled battery module 6 or the semiconductor refrigeration chip 8 uses a MOS type switch circuit when the voltage is low, and the controlled battery module 6 or the semiconductor refrigeration chip 8 voltage is compared. When using IGBT type switching circuit at high time, the circuit principle is shown in Figure 5.

The unit cell 6-2 is mounted in the battery case 11, and the outer surface of the heat sink 10 is in contact with the case of the battery case 11, and is radiated through the case of the battery case 11.

Between the unit cell 6-2 and the heat conducting plate 6-1, between the heat equalizing plate 7 and the heat conducting plate 6-1, between the semiconductor refrigerating sheet 8 and the soaking plate 7 and the heat dissipating plate 10, the heat dissipating plate 10 and the battery case The housings of the 11 are filled with thermal pads, and the thermal pads fill the gaps between the components, which can reduce the thermal resistance between these components and achieve good heat transfer.

A heat insulating mat 9 is disposed between the heat equalizing plate 7 and the heat radiating plate 10 for thermally isolating between the heat equalizing plate 7 and the heat radiating plate 10, preventing heat transfer between the heat equalizing plate 7 and the heat radiating plate 10, resulting in a semiconductor The heating/cooling function of the cooling fin 8 is disabled.

The box of the battery box 11 is made of cast aluminum or aluminum profiles, and the battery module 6 uses the box body as a heat exchanger for heat exchange with the external environment.

The outer part of the box is provided with heat dissipating fins to enhance the heat exchange effect.

The outside of the cabinet may also be provided with a spoiler, and the spoiler adjusts the airflow through the heat dissipating fins, and the airflow can efficiently pass through the heat dissipating fins when the vehicle is running to enhance the heat exchange capability with the external environment.

The heat conducting plate 6-1, the heat equalizing plate 7, and the heat radiating plate 10 are all made of a highly thermally conductive metal, such as an aluminum plate, and have good thermal conductivity.

The control flow of the intelligent management module 1 is as shown in FIG. 8. In this embodiment, there are two working conditions of cooling and heating.

Refrigeration conditions:

The battery module 6 is at a high temperature, and the intelligent management module 1 receives the temperature information and the working condition information transmitted from the BMS CAN, closes the refrigeration circuit relay 3, and selects the number of the cooling channels and the number of cooling sheets to be opened according to the cooling demand. Taking the module n in FIG. 4 as an example, 5-n-1, 5-n-3 are closed, and 5-n-2 and 5-n-4 are kept off. At this time, the semiconductor refrigerating sheet 8 refrigerates the heat equalizing plate 7, and the soaking plate 7 further cools the battery module 6; the semiconductor refrigerating sheet 8 simultaneously heats the heat dissipating plate 10, and the heat dissipating plate 10 transfers heat to the bottom case of the battery case 11 through the thermal pad. The bottom case of the battery case 11 as a whole heats up heat exchange with the ambient air to achieve module cooling.

Heating conditions:

The battery module 6 is at a low temperature, and the intelligent management module 1 receives the temperature information and the working condition information transmitted from the BMS CAN, closes the refrigeration circuit relay 3, and selects the number of the cooling channels and the number of cooling plates to be opened according to the cooling demand. Taking the module n in FIG. 4 as an example, 5-n-2, 5-n-4 are closed, and 5-n-1, 5-n-3 are kept off. At this time, the semiconductor refrigerating sheet 8 heats the soaking plate 7, and the soaking plate 7 further heats the battery module 6; the semiconductor refrigerating sheet 8 simultaneously cools the heat dissipating plate 10, and the heat dissipating plate 10 cools the bottom case of the battery case 11 through the thermal pad. The heat sink of the bottom case of the battery case 11 as a whole heats up with the ambient air to achieve module heating.

The invention has the advantages of small occupied space, no refrigerant pollution, no need of cold medium heat transfer, no need of external auxiliary setting; the system can quickly heat or cool according to the state of the battery pack, and can quickly switch between cooling and heating, thereby further Accurate and rapid response to battery pack temperature changes.

The invention can effectively improve the heat management level of the battery pack, ensure the battery pack works in a suitable temperature range, improve the performance of the battery pack, and prolong the service life of the battery, and can also greatly improve the light weight level of the energy storage system.

Example 2

Embodiment 2 of the present invention is an improvement made on the basis of Embodiment 1. The difference between Embodiment 2 of the present invention and Embodiment 1 is that between the single battery 6-2 and the heat conducting plate 6-1, the heat equalizing plate 7 is interposed between the heat conducting plate 6-1, the semiconductor cooling sheet 8 and the heat equalizing plate 7 and the heat radiating plate 10, and between the heat radiating plate 10 and the casing of the battery case 11 with a thermal conductive adhesive.

The thermal paste fills the gap between these components, which also reduces the thermal resistance between these components for good heat transfer.

Other contents of the power battery pack thermal management assembly in Embodiment 2 of the present invention are the same as those in Embodiment 1, and the description thereof will not be repeated here.

Example 3

Embodiment 3 of the present invention is an improvement made on the basis of Embodiment 1. The difference between Embodiment 3 of the present invention and Embodiment 1 is that both ends of the heat conducting plate 6-1 are provided with a heat conduction portion 6 bent and extended. 3. The heat conducting plate 6-1 has a U shape or a Z shape.

Accordingly, components such as the heat equalizing plate 7, the semiconductor refrigerating sheet 8, and the heat radiating plate 10 are provided on both sides of the unit cell 6-2.

Accordingly, heat is exchanged between the two sides of the battery case 11 and the outside air.

With the above structure, heat conduction can be performed on both sides of the single cell 6-2, and the temperature adjustment of the battery module 6 is more balanced and faster.

Other contents of the power battery pack thermal management assembly in Embodiment 3 of the present invention are the same as those in Embodiment 1, and the description thereof will not be repeated here.

The above is only a specific embodiment of the present invention, and other improvements or modifications may be made by those skilled in the art based on the above embodiments. It should be understood by those skilled in the art that the foregoing detailed description of the invention is intended to provide a better understanding of the scope of the invention.

Claims

A power battery pack thermal management assembly includes a battery module, wherein the battery module is provided with a plurality of groups of single cells arranged side by side, wherein a heat conducting plate is disposed adjacent to each group of the single cells Performing heat transfer, the end of the heat conducting plate is provided with a bent and extended heat conducting portion, and the heat conducting portion is in contact with the heat equalizing plate for heat transfer;

The battery module is provided with a semiconductor refrigerating sheet. The semiconductor refrigerating sheet includes two heat conducting surfaces, and the inner heat conducting surface is in contact with the soaking plate for heat transfer, and the outer heat conducting surface is in contact with the heat dissipating plate for heat transfer.
The thermal battery pack thermal management assembly according to claim 1, wherein the heat conducting portions of the heat conducting plates are located on the same plane, and the heat conducting portions of the adjacent heat conducting plates overlap a portion of the regions for heat transfer;

The heat conducting plate between the adjacent single cells is in contact with the single cells on both sides for heat transfer.
The power battery pack thermal management assembly according to claim 1, wherein said thermal management assembly further comprises a control circuit, said control circuit comprising a main circuit, said plurality of said groups being connected in parallel or in series on said main circuit Battery module

One or several sets of semiconductor refrigerating sheets are disposed in the battery module, and a plurality of sets of semiconductor refrigerating sheets are connected in parallel or in series.
The power battery pack thermal management assembly according to claim 3, wherein the main circuit is provided with a relay control on/off, and the main circuit is provided with a current sampling point;

The main circuit is electrically connected to a plurality of sets of parallel branches, and each group of the semiconductor refrigeration fins connected in parallel is connected to a group of parallel branches, and the switch group is provided with a switch group to control on-off, on-off duration and current direction. The branch is provided with a current sampling point.
The power battery pack thermal management assembly according to claim 4, wherein the thermal management assembly further comprises an intelligent management module, wherein the intelligent management module monitors a current value of the main loop, and controls the relay to implement The on/off of the main circuit, the intelligent management module monitors a current value of the branch, and controls the switch group to implement on-off, on-off duration and current direction of the branch;

The intelligent management module is communicatively coupled to the battery pack management system.
The power battery pack thermal management assembly according to claim 5, wherein the heat equalizing plate and the heat dissipating plate are both provided with a temperature sensor collecting temperature, and the temperature signal is sent to the intelligent management a module, the intelligent management module monitors temperature values of the heat equalizing plate and the heat dissipation plate, and controls the switch group to implement on-off, on-off duration, and current direction of the branch.
The power battery pack thermal management assembly according to claim 4, wherein the main circuit is provided with a fuse, and the switch group is a MOS type switch circuit or an IGBT type switch circuit.
The power battery pack thermal management assembly according to claim 1, wherein the unit battery is installed in a battery case, and an outer side surface of the heat dissipation plate is in contact with a case of the battery case, The cabinet exchanges heat with the external environment.
The power battery pack thermal management assembly according to claim 8, wherein the unit cell and the heat conducting plate, between the heat equalizing plate and the heat conducting plate, and the semiconductor refrigerating sheet And a thermal pad or a thermal adhesive is filled between the heat equalizing plate and the heat dissipating plate, and between the heat dissipating plate and the box of the battery box;

A heat insulating mat is disposed between the heat equalizing plate and the heat radiating plate.
The power battery pack thermal management assembly according to claim 8, wherein the box of the battery box is made of cast aluminum or aluminum profiles, and the heat dissipating fins are arranged outside the box to enhance the change. Thermal effect

A spoiler is disposed outside the casing, and the spoiler adjusts a flow of air through the heat dissipating fins to enhance a heat exchange effect.