CN218772822U

CN218772822U - Machine room integral heat dissipation system for data center server cabinet

Info

Publication number: CN218772822U
Application number: CN202222715674.2U
Authority: CN
Inventors: 孔伟; 赵培智
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-10-16
Filing date: 2022-10-16
Publication date: 2023-03-28
Anticipated expiration: 2032-10-16

Abstract

The utility model discloses a whole cooling system for data center server rack, including: the heat equalizing layer is arranged on devices on the upper parts of heating chips such as a storage array and a mainboard of a single server, and a power supply assembly after heat dissipation is optimized; and the cooling layer is butted with the air conditioning system, and the single cooling layer is connected in parallel through the cold and hot end header pipes of the air conditioning system in the cabinet to realize the functions of cooling the cabinet and recovering heat.

Description

Machine room integral heat dissipation system for data center server cabinet

Technical Field

The invention relates to a machine room integral heat dissipation system.

Background

Currently, the heat exchange medium of the data center server is air. Due to the characteristic of air heat capacity, the utilization method of waste heat generated by the center has the problems of large limitation, low utilization rate and the like.

By adding the heat dissipation layer to the single server to form a cabinet heat dissipation array and assisting air cooling to remove condensed water and the like, waste heat in the cabinet is efficiently led into a waste heat circulation system for living heating, power generation and the like.

Disclosure of Invention

The invention aims to: to the problem among the prior art, disclose a whole cooling system of computer lab for data center server rack, including setting up in the soaking layer subassembly on storage array, mainboard heating chip upper portion, the power supply module after soaking layer and heat dissipation are reformed transform, sets up the cooling layer of direct and air conditioner evaporimeter butt joint on soaking layer, heat dissipation power supply upper portion after reforming transform, and the cooling layer structure is the multilayer structure of soaking layer: the bottom layer of the cooling layer is a heat-conducting metal plate, the middle layer of the cooling layer is a high-efficiency copper heat pipe coil, and the flow of the input coolant is controlled by controlling the opening of the electric control regulating valve.

As the improvement, set up soaking layer subassembly at storage array, mainboard heating chip upper portion and carry out the heat dissipation transformation, with the stable, even conduction of the heat that produces of the device operation of soaking layer lower surface contact to its upper surface, prevent that the temperature sudden change that the uneven refrigeration of refrigeration subassembly caused from making the deformation of the device that generates heat impaired.

As an improvement, the air conditioner further comprises an auxiliary air cooling layer arranged on the upper portion of the cooling layer and a cooling circulation main pipeline of the cabinet, wherein the cooling circulation main pipeline of the cabinet is directly butted with the cold end and the hot end of the air conditioning system.

As an improvement, the cooling system adopts different placement modes aiming at different structural server placement modes.

As an improvement, the upper part of the cooling layer is an auxiliary air cooling layer. When the cooling layer is insufficiently cooled and fails, the air cooling is started in an emergency, and the equipment is changed to stop working and is in a standby state when running normally.

According to the invention, the heat dissipation layer is additionally arranged on the single server to form a cabinet heat dissipation array, and the method of assisting air cooling to remove condensed water and the like is adopted, so that the waste heat in the cabinet is efficiently led into the waste heat circulation system for living heating, power generation and the like.

Drawings

FIG. 1 illustrates a soaking layer structure;

FIG. 2 a cooling layer structure;

FIG. 3 is a diagram of a core assembly of the cabinet cooling system;

FIG. 4 is a view showing the installation of a soaking layer;

FIG. 5 a cooling layer installation diagram;

FIG. 6 is a single server heat sink assembly view;

FIG. 7 is a single set of cabinet assembly views;

the labels in the figure are: 11-soaking lower layer, 12-soaking middle layer, 13-soaking upper layer, 21-cooling lower layer, 22-cooling middle layer, 23-controllable flow valve, 24-heat conducting structural member, 25-axial flow fan set, 26-air cooling radiating fin, 27-ventilation baffle, 31-main flow valve and 32-cooling main pipe.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings.

The internal structure of the server is basically as follows: the heat generating components such as the south bridge, the power supply, the hard disk array and the like are actively cooled and radiated in a radiator and fan mode, and the heat radiating device has the advantages of simplicity, directness and convenience in realization, and has the defects of high heat radiating noise, high fire hazard when the heat radiating electrical component operates for 24 hours and incapability of recycling waste heat.

The heat dissipation transformation mode of this embodiment:

the heat-equalizing layer assembly is arranged on the upper parts of the heating chips of the storage array and the mainboard, and the heat generated by the operation of the heating device in contact with the lower surface of the heat-equalizing layer is stably and uniformly conducted to the upper surface of the heat-equalizing layer assembly, so that the deformation and damage of the heating device caused by the temperature mutation due to the uneven refrigeration of the refrigerating assembly are prevented. The heat equalizing layer is of a multilayer structure and comprises a heat equalizing lower layer 11, a heat equalizing middle layer 12 and a heat equalizing upper layer 13.

After the soaking layer is installed inside the server, the heating component is a power supply component formed by modifying the soaking layer and the heat dissipation.

And a cooling layer directly butted with the air-conditioning evaporator is arranged on the soaking layer and the upper part of the power supply after heat dissipation modification. The cooling layer structure is similar to the multilayer structure of the soaking layer: comprises a cooling lower layer, a cooling middle layer and a cooling upper layer 24-27.

The lower cooling layer 21 is a heat-conducting metal plate, the middle cooling layer 22 is a high-efficiency copper heat pipe coil, and the flow of the input coolant is controlled by controlling the opening of an electric control adjusting valve so as to accurately control the temperature of the equipment. Cooling layer lower structure as shown in fig. 5, a controllable flow valve 23 is connected to the cooling intermediate layer 22 to regulate the flow of coolant;

the upper part of the cooling layer is an auxiliary air cooling layer which comprises a heat conduction structural part 24, an axial flow fan set 25, an air cooling heat dissipation fin 26 and a ventilation baffle 27, wherein the heat conduction structural part 24 and the air cooling heat dissipation fin 26 are formed by processing a whole piece of high heat conduction metal, a fan installation position is reserved in the middle of the air cooling heat dissipation fin and used for installing the axial flow fan set 25), when the cooling layer is insufficiently cooled and fails, the axial flow fan set 25 is automatically and emergently started to perform forced air cooling according to the operation temperature of a device, and the normal operation of the equipment stops working and enters a standby state.

For a machine room of a plurality of servers in a data center, after the plurality of servers are assembled into a cabinet, the controllable flow valve 23 at the rear part of a single server is connected with the cooling main pipe 32, the heat of the single server is collected in the cooling main pipe 32 (as shown in fig. 7), and for a single stacked cabinet, for the placement mode of the servers with different structures, the cooling system also adopts the horizontal or vertical placement mode. And the waste heat of the multiple groups of cabinets is collected at the cold end of the air conditioning system through a header pipe, and is taken out of the machine room. The waste heat of the machine room can be secondarily applied to living heating, water heating, temperature difference power generation and the like.

Claims

1. The utility model provides a whole cooling system of computer lab for data center server rack which characterized in that, including: the heat equalizing layer (1) is of a three-layer structure and comprises a heat equalizing lower layer, a heat equalizing middle layer and a heat equalizing upper layer, the heat equalizing lower layer (11) and the heat equalizing upper layer (13) are made of high-heat-conductivity metal, and the heat equalizing lower layer (11) is in contact with the server storage array and the heating chip assembly to play roles in stabilizing the structure and conducting heat; the soaking middle layer (12) is a closed heat pipe structure with higher heat conductivity relative to the soaking lower layer, and the soaking upper layer (13) efficiently conducts the heat of the heating device from the bottom layer to the cooling layer in thermal conduction connection with the soaking upper layer (13);

the cooling layer (2) is of a three-layer structure and comprises a cooling lower layer and a cooling middle layer, wherein the cooling lower layer (21) is made of high-thermal-conductivity metal and is in thermal connection with the soaking upper layer (13); the cooling middle layer (22) is of a coil structure and is connected with an air conditioning system through a controllable flow valve (23); the cooling upper layer is an auxiliary air-cooling heat dissipation layer, and the heat conduction structural member (24) is provided with air-cooling heat dissipation fins (26), an axial fan set (25) and a ventilation baffle (27), so that the emergency heat dissipation effect can be achieved when the cooling middle layer (22) fails and cannot provide a cold source;

the cabinet cooling assembly (3) can be arranged longitudinally or transversely so as to be suitable for cabinets with different structures; the cooling main pipe (32) collects heat collected by the cooling middle layer (22) in the stacked servers and transmits the heat to the machine room air conditioning system through the main pipe flow valve (31).

2. The integral heat dissipation system for the machine room of the data center server cabinet as recited in claim 1, wherein: the cooling layer (2) is designed in an integrated liquid cooling and air cooling mode, the middle layer (22) is in butt joint with a cooling circulation main pipeline of the cabinet, the refrigerating capacity required by each server in the cabinet is accurately controlled by adjusting the opening degree of the controllable flow valve (23), and the accurate temperature control, environment protection and energy saving are achieved.

3. The integral heat dissipation system for the machine room of the data center server cabinet as recited in claim 2, wherein: the waste heat of each layer of server collected by the cabinet cooling assembly (3) through the controllable flow valve (23) is collected in the cooling main pipe (32), and the refrigeration and waste heat recovery functions of the single cabinet group are realized through the opening regulation of the main pipe flow valve (31); aiming at the placement modes of the servers with different structures, the cooling system is also placed in a longitudinal or transverse mode.