WO2023160114A1 - 耳机 - Google Patents

耳机 Download PDF

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Publication number
WO2023160114A1
WO2023160114A1 PCT/CN2022/137672 CN2022137672W WO2023160114A1 WO 2023160114 A1 WO2023160114 A1 WO 2023160114A1 CN 2022137672 W CN2022137672 W CN 2022137672W WO 2023160114 A1 WO2023160114 A1 WO 2023160114A1
Authority
WO
WIPO (PCT)
Prior art keywords
speaker unit
sound
housing
earphone according
earphone
Prior art date
Application number
PCT/CN2022/137672
Other languages
English (en)
French (fr)
Inventor
王传果
叶千峰
李运海
张海宏
张永华
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22888606.5A priority Critical patent/EP4258687A1/en
Publication of WO2023160114A1 publication Critical patent/WO2023160114A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016Earpieces of the intra-aural type
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1075Mountings of transducers in earphones or headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083Reduction of ambient noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/025Magnetic circuit

Definitions

  • the present application relates to the technical field of electronic products, in particular to an earphone.
  • the sound output effect of the earphone is poor and needs to be further improved.
  • the embodiment of the present application provides an earphone, which is beneficial to improve the sound output effect of the earphone.
  • the earphone provided according to the embodiment of the present application may include: a casing, a first speaker unit, and a second speaker unit.
  • the casing has a sound outlet; the first speaker unit and the second speaker unit are independently fixed in the casing, the first speaker unit emits sound toward the sound outlet, and the second speaker unit is located on the side of the first speaker unit away from the sound outlet , and set apart from the first speaker unit, the sound frequency of the second speaker unit is lower than the sound frequency of the first speaker unit; wherein, a cavity is formed between the first speaker unit, the second speaker unit and the inner wall of the housing, and the cavity Used as the front chamber of the second speaker unit, the front chamber communicates with the sound outlet through the sound outlet channel.
  • the sound output channel is formed in the first speaker unit.
  • the first speaker unit is in a ring shape to define a sound channel.
  • the earphone provided by the embodiment of the present application, by fixing the first speaker unit and the second speaker unit independently in the housing, when one of the first speaker unit and the second speaker unit fails, only the The damaged one can be removed, replaced or repaired, which avoids the need to disassemble and replace the first speaker unit and the second speaker unit as a whole due to the modularization of the first speaker unit and the second speaker unit, which is beneficial to reduce maintenance costs, and also Damage to the speaker unit that does not need to be replaced during disassembly can be avoided.
  • the first speaker unit and the second speaker unit are independently fixed in the casing, omitting the connection between the first speaker unit and the second speaker unit.
  • the connector can be physically connected by using the shell as the connector between the two, which is beneficial to save the space in the shell, facilitate the integration of more functional devices in the earphone, and also help to rationally optimize the structural layout in the earphone. Moreover, by using the characteristic that the sounding frequency of the first speaker unit is higher than that of the second speaker unit, the high-frequency loss of the earphone can be further improved, so that the earphone has better sound expressiveness in the range of different frequencies, and improves The sound effect of headphones.
  • the casing includes a front casing and a rear casing.
  • the front shell is detachably connected with the rear shell.
  • the sound outlet is formed in the front shell, and the first speaker unit and the second speaker unit are located in the front shell.
  • the front shell and the rear shell can be processed separately, which is beneficial to simplify the mold structure of the front shell and the rear shell, thereby reducing the difficulty of forming the front shell and the rear shell, and further reducing the difficulty of processing and manufacturing the shell. And it is also beneficial to disassemble the front shell and the rear shell, so as to facilitate the maintenance of the earphone.
  • the material of the front shell and/or is hard plastic. In this way, it is beneficial to reduce the weight of the earphone.
  • the front shell includes a main body and a mouthpiece, a first accommodation cavity may be formed in the main body, and a side of the first accommodation cavity adjacent to the rear shell is open.
  • the sound outlet is located on the side of the main body away from the rear case, and extends away from the rear case.
  • the sound outlet is in communication with the first accommodation cavity, and a sound outlet is formed at the end of the sound outlet away from the main body.
  • the sound outlet and setting the sound outlet on the sound outlet it is convenient for the sound outlet to extend into the ear canal of the human ear, so as to shorten the distance between the sound outlet of the earphone and the eardrum of the human ear, It is beneficial for the sound emitted by the earphone to be well received by the user, thereby improving the user experience.
  • a support step is formed on the inner peripheral surface of the housing, and the second speaker unit is supported and fixed on the support step. Such setting can facilitate the positioning and installation of the second speaker unit.
  • the second speaker unit is a dynamic speaker unit.
  • the second speaker unit includes a diaphragm group, a voice coil, a magnetic circuit system, and a basin frame.
  • One side of the pot frame facing the sound hole is open, and the diaphragm group is fixed on the open end of the pot frame.
  • the voice coil and magnet system are located in the frame.
  • the voice coil is connected to the diaphragm set.
  • the magnetic circuit system has a magnetic gap, and the end of the voice coil away from the diaphragm group extends into the magnetic gap.
  • the magnetic circuit system can cooperate with the voice coil to drive the diaphragm group to vibrate synchronously.
  • the inner peripheral surface of the open end of the pot frame is provided with an annular groove that is sunken in a direction away from the central axis of the pot frame.
  • the groove runs through to the end face of the open end of the pot frame, that is, the end face facing the sound outlet hole.
  • the outer edge of the diaphragm group is accommodated in the annular groove and fixed on the wall surface of the annular groove facing the sound hole.
  • annular groove it is beneficial to use the annular groove to effectively support the diaphragm group, and at the same time, it can also increase the volume of the space in the basin frame, which is conducive to setting the size of the diaphragm group to be larger, which in turn is conducive to increasing the size of the diaphragm group.
  • the effective vibration area improves the low-frequency effect of the second speaker unit.
  • the vibrating membrane group includes: a connecting section, a surrounding ring, and a dome surrounded by the surrounding ring.
  • the connecting sections are stacked on the wall of the annular groove facing the sound outlet.
  • the voice coil is attached to the dome.
  • the outer peripheral edge of the ring is connected to the inner peripheral edge of the connection section.
  • the ring protrudes toward the direction of the sound hole. In this way, it is beneficial to further reduce the volume of the front cavity, and the structure is compact.
  • the diaphragm is assembled as a one-piece molded piece. Such setting is beneficial to improve the structural strength of the diaphragm group, and facilitates the processing and manufacturing of the diaphragm group.
  • the magnetic circuit system includes: a side magnetic part and a first central magnetic part.
  • the side magnetic portion is located on the outer periphery of the first central magnetic portion to define a magnetic gap with the first central magnetic portion.
  • the magnetization directions of the side magnetic part and the first central magnetic part are opposite, so that the side magnetic part and the first central magnetic part can form a magnetic circuit for driving the voice coil to move.
  • the magnetic circuit system includes a second central magnetic part.
  • the second central magnetic part blocks one end of the side magnetic part away from the diaphragm group, and the first central magnetic part and the second central magnetic part are stacked.
  • the second central magnetic part may be a piece of magnetically permeable material. In this way, the second central magnetic portion can be used to restrict the leakage of the magnetic force lines, and increase the magnetic induction of the magnetic circuit system.
  • the magnetic circuit system further includes a magnetically permeable yoke.
  • the magnetically permeable yoke is arranged on the side of the first central magnetic part facing the diaphragm group, and is used to restrict the leakage of the magnetic force line, thereby improving the driving force to the diaphragm group.
  • the outer peripheral surface of the magnetic yoke is flush with the outer peripheral surface of the first central magnetic part in the axial direction of the magnetic circuit system. In this way, it is beneficial to further improve the confinement effect of the magnetic yoke on the magnetic force lines, increase the magnetic induction of the magnetic circuit system, and the magnetic yoke will not affect the magnetic gap, which is beneficial to improve the compatibility between the magnetic circuit system and the voice coil.
  • the first speaker unit is a piezoelectric ceramic speaker unit.
  • the piezoelectric ceramic speaker unit is thin, small in size, and has good high-frequency sound effects.
  • the first speaker unit includes a vibrating plate and a piezoelectric ceramic sheet. Both the vibrating plate and the piezoelectric ceramic sheet are annular flat plates.
  • the first loudspeaker unit is fixed in the casing through the vibrating plate.
  • the piezoelectric ceramic sheets are stacked on the side surface of the vibrating plate facing the sound hole.
  • the front cavity can be defined by the side surface of the vibrating plate facing the second speaker unit, the diaphragm group, and the inner wall surface of the housing, which is conducive to improving the regularity of the shape of the front cavity to further improve the performance of the second speaker. sound effects of the unit.
  • the vibrating plate includes a bearing part and a connecting part.
  • the carrying part is used for carrying the piezoelectric ceramic sheet and being connected with the piezoelectric ceramic sheet.
  • the connecting part is arranged around the outer periphery of the bearing part.
  • the first speaker unit is fixed by using the connecting portion. In this way, when the vibrating plate is connected to the housing, the piezoelectric ceramic sheet is suspended, and the bearing part of the vibrating plate is also in a suspended state, so that the piezoelectric ceramic sheet can facilitate the vibration of the vibrating plate.
  • the material of the vibrating plate includes but not limited to metal and plastic.
  • the earphone includes: a bracket, the bracket is located between the first speaker unit and the sound outlet, and the first speaker unit is fixed in the housing through the bracket.
  • the bracket By setting the bracket, the installation of the first speaker unit can be facilitated. And, setting the bracket between the first loudspeaker unit and the sound outlet can prevent the large problem that the front cavity needs to be set due to the setting of the bracket, and it is also beneficial to form a regular front cavity, so as to improve the second The sound effect of the speaker unit.
  • the bracket includes a ring-shaped fixing portion, and the outer peripheral edge of the first speaker unit is fixed on the inner peripheral surface of the casing by means of the fixing portion.
  • the connecting portion of the vibrating plate is stacked and fixed on the fixing portion, and the fixing portion is fixed on the inner peripheral surface of the casing.
  • a first step is formed on the inner peripheral surface of the housing, and the fixing part is supported and fixed on the first step.
  • the setting of the first step can facilitate the overall positioning and installation of the bracket and the first speaker unit.
  • the fixing part includes a fixing plate and an annular flange, the fixing plate is supported and fixed on the step surface of the first step facing the second speaker unit, and the annular flange is arranged around the edge of the fixing plate , and protrude toward the direction of the second speaker unit, and the outer peripheral edge of the first speaker unit is supported and fixed on the end surface of the ring flange on the side away from the sound hole.
  • the ring flange is fixed to the step surface of the first step facing the central axis of the second speaker unit, it is also beneficial to increase the connection area between the bracket and the casing, and improve the reliability of the connection between the two.
  • the material of the fixing part is a flexible material.
  • the vibration transmitted from the first speaker unit to the shell can be weakened by using the cushioning effect of the fixing portion, thereby improving the comfort of the user wearing the earphone and improving the sound generation effect of the first speaker unit.
  • the interference of the vibration of the housing on the vibration of the air in the front cavity can be avoided to a certain extent, which is beneficial to improve the sound producing effect of the second speaker unit.
  • the material of the fixing part is rubber or silicone.
  • the material of the entire bracket may be a flexible material.
  • the bracket is made of hard plastic.
  • the ring-shaped fixing part defines a sound transmission channel, and the sound transmission channel communicates with the sound outlet hole and the sound outlet channel. Thereby, the sound generation of the second speaker unit is facilitated.
  • the sound output channel and the sound transmission channel are arranged coaxially. In this way, the sound output channel and the sound transmission channel can be directly opposite, thereby improving the sound transmission effect of the sound transmission channel.
  • the first speaker unit is a piezoelectric ceramic speaker unit, and the sound transmission channel is used as a front sound chamber of the first speaker unit.
  • the first speaker unit has an external terminal facing the sound outlet.
  • the external terminal By making the external terminal face the sound hole, it is convenient to form the front cavity of the second speaker unit, and prevent the problem that the external terminal cannot be connected with the wiring because the external terminal is in the front cavity.
  • a part of the surface of the fixing portion facing the first speaker unit is recessed toward the sound outlet to form an avoidance groove, and the avoidance groove is used to avoid the external terminal. In this way, interference between the bracket and the external terminal is avoided.
  • the earphone includes: a first signal trace; the escape groove extends to the outer peripheral edge of the fixed part, one end of the first signal trace is fixed and electrically connected to the external terminal, and the first signal trace passes through The escape groove extends toward the direction of the second speaker unit. In this way, it is convenient for the first signal wiring to protrude from the sound transmission channel through the avoidance groove.
  • the outer peripheral surface of the first speaker unit has a first contour surface
  • the inner peripheral surface of the casing has a first area facing the first contour surface
  • the distance between the first contour surface and the first area is The spaces are spaced apart to form a first avoidance gap
  • the first avoidance gap communicates with the escape groove
  • the first avoidance gap is used to avoid the first signal trace.
  • the first contour surface is a plane.
  • the first contoured surface is an arcuate surface extending along the circumferential direction of the housing, and the first contoured surface arches toward the center of the first speaker unit.
  • the first region may be recessed in a direction away from the first contour surface to form a pit groove.
  • the housing has balancing holes.
  • the balance hole communicates with the front cavity and the outside of the shell. In this way, the balance hole can be used to balance the air pressure on the outside of the front cavity and the shell, so as to improve the comfort of the earphone.
  • an avoidance gap is formed at a position corresponding to the balance hole on the fixing part, and the avoidance gap communicates with the balance hole and the sound transmission channel. Thereby, communication between the front chamber and the atmosphere on the outside of the housing is achieved.
  • the earphone includes: a noise reduction microphone, the noise reduction microphone is located between the first speaker unit and the sound outlet, and the noise reduction microphone is fixed in the housing through a bracket.
  • the noise-cancelling microphone and the first speaker unit are fixed together by means of the bracket to form a modular design, so that when the first speaker unit, the bracket, and the noise-cancelling microphone are installed, the first speaker unit, the bracket, and the noise-cancelling microphone can be facilitated.
  • the noise microphone is installed in the shell as a whole, so that the first speaker unit and the noise reduction microphone do not need to be installed separately, the installation steps can be simplified, and the assembly efficiency can be improved, and the overall structure of the first speaker unit and the noise reduction microphone is relatively high.
  • the noise-canceling microphone is located between the first speaker unit and the sound outlet, which is conducive to setting the noise-canceling microphone close to the sound outlet, so as to improve the noise reduction effect of the earphone
  • the housing includes a main body and a mouthpiece, the main body has a first accommodation chamber, the first speaker unit and the second speaker unit are fixed in the first accommodation chamber, the mouthpiece and the second mouthpiece A receiving chamber communicates with one another.
  • a sound hole is formed at the end of the sound nozzle away from the main body, and at least part of the noise reduction microphone is located in the sound outlet. This setting is beneficial for the noise reduction microphone to be closer to the sound outlet, thereby improving the sound pickup effect of the microphone and further improving the noise reduction effect of the earphone.
  • the bracket includes a support plate and a ring-shaped fixing part, the outer peripheral edge of the first speaker unit is fixed on the inner peripheral surface of the housing by means of the fixing part, and the support plate is fixed on the fixing part and faces toward the sound outlet.
  • the direction of the hole extends, and the noise reduction microphone is fixed on the support plate. Therefore, it is beneficial to install the noise reduction microphone close to the sound outlet, improve the sound pickup effect of the noise reduction microphone, and improve the noise reduction effect of the earphone.
  • the support plate is located on the inner periphery of the fixing part and is connected to the inner peripheral wall of the fixing part. In this way, interference between the support plate and the inner wall of the housing can be prevented, thereby avoiding the problem of insufficient installation space for the noise-cancelling microphone due to interference between the noise-cancelling microphone and the inner wall of the housing, which is conducive to ensuring reliable installation of the noise-cancelling microphone.
  • the ring-shaped fixing portion defines a sound transmission channel, and the sound transmission channel communicates with the sound outlet hole and the sound outlet channel, and the orthographic projection of the support plate and the noise reduction microphone on the first speaker unit is at the exit position. the periphery of the sound channel. Therefore, it is possible to prevent the support plate and the noise reduction microphone from blocking the sound output of the second speaker unit, and ensure the sound output effect of the second speaker unit.
  • the orthographic projection of the support plate on the first speaker unit is between the orthographic projection of the noise reduction microphone on the first speaker unit and the sound output channel. Such arrangement is beneficial to further avoid interference between the support plate and the housing.
  • the earphone includes: a main board and a second signal wiring, and the noise reduction microphone is adapted to be electrically connected to the main board through the second signal wiring.
  • the main board is located on the side of the second speaker unit away from the sound outlet, and a clearance space is formed between the fixing part and the inner wall of the housing, and the second signal wires pass through the clearance space to the The direction of the motherboard extends. Therefore, it is convenient to avoid the second signal wiring, so as to facilitate the connection between the second signal wiring and the main board.
  • the outer peripheral surface of the first speaker unit has a second contour surface
  • the inner peripheral surface of the casing has a second area facing the second contour surface
  • the distance between the second contour surface and the second area is The spaces are spaced apart to form a second avoidance gap
  • the second avoidance gap is used to avoid the second signal trace.
  • the second contour surface is a plane.
  • the second contour surface is an arcuate surface extending along the circumference of the casing, and the second contour surface arches toward the center of the first speaker unit.
  • the second region may be recessed in a direction away from the second contour surface to form a recessed groove.
  • a part of the inner peripheral surface of the housing between the main board and the fixing part has a routing groove, and a part of the second signal routing is fixed in the routing groove. In this way, it is beneficial to improve the reliability of the second signal routing and avoid interference between the second signal routing and other structures in the casing.
  • a first positioning portion is formed on an outer peripheral wall of the fixing portion, a second positioning portion is formed on an inner peripheral surface of the housing, and the first positioning portion cooperates with the second positioning portion. This facilitates the overall installation and positioning of the bracket and the first speaker unit to prevent reverse or misplaced placement.
  • a third positioning portion is formed on an outer peripheral edge of the first speaker unit, a second positioning portion is formed on an inner wall of the casing, and the third positioning portion cooperates with the second positioning portion. This facilitates the installation and positioning of the first speaker unit to prevent reverse or misplaced placement.
  • the first speaker unit has an external terminal
  • the second speaker unit has a connection terminal
  • the external terminal and the connection terminal are electrically connected through a first signal wire.
  • a part of the inner peripheral surface of the housing between the second speaker unit and the first speaker unit has a wire slot, and the wire slot is used to avoid the first signal wire. In this way, it is beneficial to improve the reliability of the first signal wiring and avoid interference between the first signal wiring and other structures in the casing.
  • the first speaker unit and the second speaker unit are arranged coaxially. In this way, it is beneficial to improve the sound output effect of the sound output channel.
  • FIG. 1 is a schematic structural diagram of an earphone provided by some embodiments of the present application.
  • FIG. 2 is a schematic diagram of an exploded structure of the earphone shown in FIG. 1;
  • Fig. 3 is a schematic cross-sectional structural diagram after the cooperation of the front shell and the dynamic speaker unit in the earphone shown in Fig. 1-Fig. 2;
  • Fig. 4 is a partial structural schematic diagram of earphones provided according to other embodiments of the present application.
  • Fig. 5 is a schematic cross-sectional view at line A-A according to the partial structure of the earphone shown in Fig. 4;
  • Fig. 6 is a perspective view of a second speaker unit in the earphone shown in Fig. 4-Fig. 5;
  • FIG. 7 is a schematic cross-sectional view of the second speaker unit shown in FIG. 6;
  • Fig. 8 is a perspective view of the first speaker unit in the earphone shown in Fig. 4-Fig. 5;
  • Fig. 9 is a schematic cross-sectional view of the first speaker unit shown in Fig. 8 at the line B-B;
  • Fig. 10 is a schematic diagram showing the connection of the main board, the first speaker unit, the second speaker unit, the first signal traces and the conductive traces in the earphone shown in Figs. 4-5;
  • Fig. 11 is a partial structural schematic diagram of an earphone provided according to some further embodiments of the present application.
  • Fig. 12 is a schematic cross-sectional view at line C-C according to the partial structure of the earphone shown in Fig. 11;
  • Fig. 13 is a perspective view of the bracket in the earphone shown in Fig. 11-Fig. 12;
  • Fig. 14 is an enlarged view of the part circled at E according to the partial structure of the earphone shown in Fig. 12;
  • Fig. 15 is a schematic diagram of cooperation of the bracket, the first speaker unit and the noise reduction microphone in the earphone shown in Fig. 11-Fig. 12;
  • Fig. 16 is an enlarged view of the part circled at F according to the partial structure of the earphone shown in Fig. 12;
  • Fig. 17 is a schematic diagram of cooperation between the bracket shown in Fig. 11-Fig. 12 and the first speaker unit;
  • Fig. 18 is a schematic diagram of the cooperation of a part of the front shell, the bracket and the first speaker unit of the earphone shown in Fig. 11-Fig. 12;
  • Fig. 19 is a schematic view from another direction after cooperation of a part of the front shell of the earphone, the bracket and the first speaker unit shown in Fig. 18;
  • Fig. 20 is a schematic diagram of another direction after the bracket shown in Fig. 17 is matched with the first speaker unit;
  • Fig. 21 is a schematic cross-sectional view at the H-H line of the partial structure of the earphone shown in Fig. 11, wherein the first signal trace, the conductive trace and the main board are not shown;
  • Fig. 22 is a graph showing changes in frequency and sound pressure level of the earphone according to the embodiment of the present application.
  • Shell 10. Accommodating space; 101. First accommodating cavity; 1011. Supporting steps; 11. Front shell; 110. Sound outlet; 111. Main body; 1111. First area; 1112. Second area; 1113, wiring groove; 1114, wiring groove; 1115, second positioning part; 1116, balance hole; 112, sound outlet; 1121, limit rib; 113, first step; 12, rear shell; 102 103, the third housing chamber; 121, the cover body; 122, the rod body; 1221, the front rod body; 1222, the rear rod body; 123, the charging contact; 13, the contact sleeve;
  • 4a second speaker unit; 4a1, diaphragm group; 4a11, connecting section; 4a12, ring; 4a13, dome; 4a2, voice coil; 4a3, magnetic circuit system; 4a3a, magnetic gap; 4a31, edge magnetic part; 4a32, the first central magnetic part; 4a33, the second central magnetic part; 4a34, the magnetic yoke; 4a4, the basin frame; 4a43, the annular groove; 4a6, conductive traces;
  • first speaker unit 4b1, vibration plate; 4b11, bearing part; 4b12, connecting part; 4b13, first contour surface; 4b13a, first avoidance gap; 4b14, second contour surface; 4b14a, second avoidance gap; 4b15, third positioning part; 4b2, piezoelectric ceramic sheet; 4b21, first electrode layer; 4b22, second electrode layer; 4b23, piezoelectric body; 4b3, external terminal; 4b31, positive external terminal; 4b32, negative external terminal ; 4bb, sound channel;
  • bracket 71, support plate; 72, fixed part; 721, ring flange; 722, fixed plate; 723, sound transmission channel; 724, give way slot; 724a, give way space;
  • first”, “second”, and “third” are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features .
  • a feature defined as “first”, “second”, “third” and “fourth” may expressly or implicitly include one or more of such features.
  • connection can be detachable
  • connection can also be non-detachable connection; it can be a direct connection or an indirect connection through an intermediary.
  • fixed connection means that they are connected to each other and the relative positional relationship after connection remains unchanged.
  • Rotally connected refers to being connected to each other and capable of relative rotation after being connected.
  • Slide connection refers to being connected to each other and being able to slide relative to each other after being connected.
  • the term “comprising”, “comprising” or any other variation thereof is intended to cover a non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase “comprising a " does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.
  • the present application provides an earphone, which can be used in conjunction with electronic products such as mobile phones, tablet computers, and notebook computers to receive sound information provided by the electronic products and output them to users. Through the use of earphones in conjunction with electronic products, the sound of electronic products can be prevented from disturbing others.
  • the headset can be a wireless headset or a wired headset.
  • FIG. 1 is a schematic structural diagram of an earphone 100 provided by some embodiments of the present application
  • FIG. 2 is a schematic diagram of an exploded structure of the earphone 100 shown in FIG. 1
  • the earphone 100 shown in FIG. 1 and FIG. 2 is described by taking a wireless earphone as an example.
  • the earphone 100 may include a housing 1 , a main board 2 , a battery 3 , a wireless communication module (not shown in the figure) and a dynamic speaker unit 4 .
  • FIG. 1, FIG. 2 and the following related drawings only schematically show some components included in the earphone 100, and the actual shape, actual size, actual position and actual configuration of these components are not affected by FIG. 1 and FIG. 2. and the definitions of the figures below.
  • the earphone 100 is a wired earphone
  • the wired earphone may not include the battery 3 and the wireless communication module.
  • the housing 1 has an accommodating space 10 .
  • Functional components such as the main board 2 , the battery 3 , the wireless communication module and the dynamic speaker unit 4 can be arranged in the accommodating space 10 of the housing 1 .
  • the housing 1 can be used as a carrier of the functional devices in the earphone 100 to protect the functional devices located in the accommodating space 10 of the housing 1 .
  • the earphone 100 is in contact with the user's ear through the casing 1 . Therefore, in order to improve the comfort of wearing the earphone 100 for the user, the outer shell 1 can match the shape of the ear of the human body in terms of shape.
  • the housing 1 can have certain properties such as wear resistance, corrosion resistance and scratch resistance, or a layer of functional material for wear resistance, corrosion resistance and scratch resistance can be coated on the outer surface of the housing 1 .
  • the shell 1 can be used as a structural whole, that is to say, the shell 1 can be formed in one piece, and the integrally formed shell 1 has higher structural strength.
  • the housing 1 can also be formed by assembling a plurality of parts.
  • the housing 1 may include a front housing 11 and a rear housing 12 .
  • the front shell 11 faces the human ear when the earphone 100 is in use, and the rear shell 12 faces away from the human ear when the earphone 100 is in use.
  • the front shell 11 is detachably connected with the rear shell 12 . After the front shell 11 and the rear shell 12 are assembled, the accommodating space 10 mentioned above can be defined.
  • the front shell 11 can be fixedly connected to the rear shell 12 through a buckle.
  • the front shell 11 can also be connected to the rear shell 12 by screws.
  • the front shell 11 may also be fixedly connected to the rear shell 12 by glue.
  • the material of the front shell 11 includes but not limited to hard plastic, metal, and a combination of plastic and metal. In order to reduce the weight of the earphone 100, the material of the front shell 11 can be selected as hard plastic.
  • the front shell 11 may include a main body 111 and a mouthpiece 112 .
  • a first accommodating chamber 101 may be formed in the main body 111 , and a side of the first accommodating chamber 101 adjacent to the rear case 12 is open.
  • the mouthpiece 112 may be located on a side of the main body 111 away from the rear case 12 , and extend in a direction away from the rear case 12 .
  • the sound outlet 112 communicates with the first receiving cavity 101 , and a sound outlet 110 is formed at an end of the sound outlet 112 away from the main body 111 .
  • the sound outlet 112 and the sound outlet 110 By setting the sound outlet 112 and the sound outlet 110 on the sound outlet 112, it is more convenient for the sound outlet 112 to extend into the ear canal of the human ear, so as to shorten the connection between the sound outlet 110 of the earphone 100 and the human ear.
  • the distance between the eardrums is favorable for the sound emitted by the earphone 100 to be well received by the user, thereby improving the user experience.
  • the main body 111 and the mouthpiece 112 can be integrally formed. In this way, the connection strength between the main body 111 and the mouthpiece 112 can be improved, the processing technology can be simplified, and the production cost can be reduced.
  • the main body 111 and the mouthpiece 112 may also be processed separately, and then connected by buckling, screwing, welding or gluing. This can facilitate the processing of the main body 111 and the nozzle 112 separately, which is conducive to simplifying the mold structure of the main body 111 and the nozzle 112, thereby reducing the difficulty of forming the main body 111 and the nozzle 112, thereby reducing the processing of the front shell 11 manufacturing difficulty.
  • the front shell 11 may not include the sound outlet 112 , but the sound hole 110 is directly opened on the wall of the main body 111 .
  • the earphone 100 may also be provided with a contact sleeve 13 .
  • the contact sleeve 13 can be used to make contact with the user's ear.
  • the contact sleeve 13 can be arranged around the outer peripheral surface of the mouthpiece 112 , and the shape of the contact sleeve 13 can be similar to that of the human ear canal, so as to improve the compatibility of wearing the earphone 100 .
  • the material of the contact sleeve 13 includes but not limited to silicone and rubber, so as to improve the comfort of the user wearing the earphone 100 .
  • a limited convex rib 1121 can be formed, so that when the contact sleeve 13 is surrounded on the outer peripheral surface of the sound outlet 112, the contact sleeve 13 can be Part of it abuts between the limiting rib 1121 and the main body 111 , so as to limit the position of the contact sleeve 13 and reduce the probability of the contact sleeve 13 naturally falling off from the sound outlet 112 .
  • the earphone 100 may not include the contact sleeve 13 .
  • the material of the rear case 12 may be the same as that of the above-mentioned front case 11 . Certainly, the material of the rear case 12 may also be different from the material of the above-mentioned front case 11 . In order to reduce the weight of the earphone 100, the material of the rear shell 12 can be selected as hard plastic.
  • the rear shell 12 may include a cover body 121 and a rod body 122 .
  • the cover body 121 can be connected with the front shell 11 , and the rod body 122 can be disposed on a side of the cover body 121 away from the front shell 11 .
  • a second accommodating chamber 102 may be formed in the cover body 121 , and a side of the second accommodating chamber 102 adjacent to the front shell 11 is open, so that the second accommodating chamber 102 can communicate with the first accommodating chamber 101 .
  • the rod body 122 has a third receiving cavity 103 inside.
  • the third accommodating chamber 103 communicates with the second accommodating chamber 102 .
  • the third accommodation chamber 103 , the second accommodation chamber 102 and the first accommodation chamber 101 may together constitute the accommodation space 10 of the housing 1 .
  • the rod body 122 includes a front rod body 1221 and a rear rod body 1222 .
  • the front rod body 1221 is fixed on the cover body 121 .
  • the front rod body 1221 and the cover body 121 can be an integral structure. In this way, the manufacturing process of the rear shell 12 can be simplified, and the connection strength between the cover body 121 and the front rod body 1221 can be improved at the same time.
  • the rear rod body 1222 is detachably disposed on a side of the front rod body 1221 away from the main body 111 . And the front rod body 1221 cooperates with the rear rod body 1222 to define the third receiving cavity 103 .
  • the front rod body 1221 and the rear rod body 1222 may be connected by means of gluing, clamping, or screw connection.
  • the motherboard 2 can be accommodated in the accommodation space 10 of the housing 1 .
  • the mainboard 2 can be installed in the second accommodation cavity 102 .
  • the installation method of the main board 2 in the housing 1 includes but not limited to clamping, screwing or gluing.
  • the main board 2 is used to integrate control chips, etc., and the control chips can be, for example, application processors (application processor, AP), double data rate synchronous dynamic random access memory (double data rate, DDR) and universal flash storage (universal flash storage, UFS) )wait.
  • the main board 2 is electrically connected with functional devices such as the wireless communication module, the battery 3 and the dynamic speaker unit 4, so as to realize signal control and data signal processing among different functional devices.
  • the main board 2 can be a rigid circuit board, a flexible printed circuit (FPC), or a rigid-flex circuit board.
  • the main board 2 may use an FR-medium board, or a Rogers (Rogers) dielectric board, or a mixed media board of FR- and Rogers, and so on.
  • FR- is a code name of a flame-resistant material grade
  • the Rogers dielectric board is a high-frequency board.
  • a wireless communication module (not shown in the figure) can be integrated on the main board 2 .
  • the wireless communication module can be soldered and fixed on the main board 2 .
  • the wireless communication module can be a bluetooth, infrared or wifi module.
  • the earphone 100 can perform wireless signal interaction with the electronic product through the wireless communication module, so as to receive the sound information of the electronic product.
  • the battery 3 is used to provide power to the functional components in the earphone 100 such as the main board 2 , the wireless communication module, and the dynamic speaker unit 4 .
  • the battery 3 may include but not limited to nickel-cadmium batteries, nickel-metal hydride batteries, lithium batteries or other types of batteries. Moreover, the number of batteries 3 in the embodiment of the present application may be multiple or one.
  • the shape of the battery 3 includes, but is not limited to, a cuboid, a cylinder, or a truncated cone. In some examples, the battery 3 may be located in the second receiving chamber 102 , and the battery 3 is located on a side of the motherboard 2 close to the first receiving chamber 101 .
  • the battery 3 is located in the second accommodation chamber 102 , and the battery 3 is located on a side of the motherboard 2 away from the first accommodation chamber 101 .
  • the installation method of the battery 3 in the casing 1 includes but not limited to clamping, screwing or gluing.
  • a charging contact 123 is provided on the rod body 122 .
  • a charging circuit (not shown in the figure) is arranged in the third receiving chamber 103 , and the charging circuit electrically connects the charging contact 123 to the main board 2 in the second receiving chamber 102 .
  • the charging contact 123 is electrically connected to the interface of the external power source, the earphone 100 can be charged by the external power source.
  • the dynamic speaker unit 4 can be installed in the first housing cavity 101, so that the dynamic speaker unit 4 is located on the side of the battery 3 near the sound hole 110, and the dynamic speaker unit 4 can be placed It is set close to the sound outlet hole 110 so as to improve the sound output effect.
  • the assembling method between the moving coil speaker unit 4 and the housing 1 includes but not limited to clamping, screwing or gluing.
  • the dynamic speaker unit 4 is electrically connected to the main board 2 to obtain audio electrical signals such as music and voice, and the dynamic speaker unit 4 can convert audio electrical signals into sound signals to support audio output.
  • FIG. 3 is a schematic cross-sectional structural view of the front shell 11 of the earphone 100 shown in FIGS. 1-2 after being matched with the dynamic speaker unit 4 .
  • the cavity of the front shell 11 between the dynamic speaker unit 4 and the sound outlet 110 can be formed as the front cavity K1 of the dynamic speaker unit 4 .
  • the moving-coil speaker unit 4 used in the embodiments shown in FIGS. 1-3 above is a woofer. Although this can make the earphone 100 have low-frequency sound range performance, and make the cost of the earphone 100 cheap.
  • the vibration mass of the moving coil speaker unit 4 is large and the transient characteristics are not good, and the asymmetric distribution of the mass distribution, the compliance of the membrane and the BL electromagnetic driving force will produce different degrees of rocking vibrations and split vibrations of different frequencies, resulting in The high-frequency response produces serious peaks and valleys, and the performance of the high-frequency range cannot be realized, resulting in poor audio output performance of the earphone 100 and poor sound effects.
  • the front cavity K1 of the dynamic speaker unit 4 is formed by the cavity between the dynamic speaker unit 4 and the sound outlet 110 of the front shell 11, the volume of the front cavity K1 is larger, which is more unfavorable for the dynamic The high-frequency range performance of the type speaker unit 4.
  • FIG. 4 is a schematic diagram of a partial structure of an earphone 100 provided by another embodiment of the present application
  • FIG. 5 is a schematic cross-sectional view of the partial structure of the earphone 100 shown in FIG.
  • the earphone 100 no longer includes only one dynamic speaker unit 4 , but includes two speaker units, that is, a first speaker unit 4 b and a second speaker unit 4 a.
  • FIG. 4 and FIG. 5 and the following related drawings only schematically show some components included in the earphone 100, and the actual size, actual position and actual configuration of these components are not affected by FIG. 4 and FIG. 5 and the following related drawings. Drawings are limited.
  • the first speaker unit 4b and the second speaker unit 4a are independently fixed in the housing 1 . Specifically, the first speaker unit 4b and the second speaker unit 4a are independently fixed in the first accommodation space.
  • the first speaker unit 4b and the second speaker unit 4a are independently fixed in the casing 1
  • the first speaker unit 4b and the second speaker unit 4a are not fixed in the casing 1 as a whole , but the first loudspeaker unit 4b and the second loudspeaker unit 4a are installed separately and independently fixed in the housing 1 , and there is a sequence when they are installed in the housing 1 .
  • the second speaker unit 4 a is fixed in the casing 1 .
  • the first speaker unit 4 b is fixed in the casing 1 .
  • the earphone 100 of the embodiment of the present application by fixing the first speaker unit 4b and the second speaker unit 4a independently in the casing 1, when one of the first speaker unit 4b and the second speaker unit 4a fails When damaged, only the damaged one needs to be removed, replaced or repaired, avoiding the need to disassemble the first speaker unit 4b and the second speaker unit 4a as a whole due to the modularization of the first speaker unit 4b and the second speaker unit 4a Replacement is beneficial to reduce maintenance costs, and also avoids damage to the speaker unit that does not need to be replaced during the disassembly process.
  • the first speaker unit 4b and the second speaker unit 4a are independently fixed in the casing 1, and the first speaker unit 4b and the second speaker unit 4a are omitted.
  • the connector between the two speaker units 4a can be physically connected by using the shell 1 as the connector between the two, which is conducive to saving the space in the shell 1, so that more functional devices can be integrated in the earphone 100, and it is also conducive to reasonable
  • the structural layout in the earphone 100 is optimized.
  • the second speaker unit 4a is located on a side of the first speaker unit 4b away from the sound outlet 110, and the second speaker unit 4a is spaced apart from the first speaker unit 4b. Both the first speaker unit 4 b and the second speaker unit 4 a emit sound toward the sound outlet 110 .
  • the sound emission frequency of the first speaker unit 4b is higher than the sound emission frequency of the second speaker unit 4a.
  • the first speaker unit 4b is used as a tweeter.
  • the first speaker unit 4b may be a piezoelectric ceramic speaker unit.
  • the second speaker unit 4a can be a woofer or a mid-bass speaker.
  • the second speaker unit 4a may be the dynamic speaker unit 4 shown in FIGS. 1-3 above.
  • the second speaker unit 4a may also be a moving iron speaker unit or a planar voice coil speaker unit.
  • the first speaker unit 4 b , the second speaker unit 4 a and the inner wall of the casing 1 can form a cavity.
  • the cavity serves as the front cavity K1 of the second speaker unit 4a, and the front cavity K1 communicates with the sound outlet 110 through the sound outlet channel 4bb.
  • the cavity formed by the inner wall of the casing 1 is used as the front cavity K1 of the second speaker unit 4a, which is conducive to reducing the volume of the front cavity K1, thereby at least to a certain extent improving the performance of the second speaker unit 4a in a specific high-frequency band. High-frequency effect, and the compact structure is good.
  • the high-frequency loss of the earphone 100 in the above-mentioned embodiment can be further improved, so that the earphone 100 is uniform in the range of different frequencies. It has better sound expression and improves the sound output effect of the earphone 100 .
  • FIG. 6 is a perspective view of the second speaker unit 4a in the earphone 100 shown in FIG. 4-5;
  • FIG. 7 is a schematic cross-sectional view of the second speaker unit 4a shown in FIG.
  • the second speaker unit 4a is a moving coil speaker unit, and includes a diaphragm group 4a1, a voice coil 4a2, a magnetic circuit system 4a3, a frame 4a4 and a connection terminal 4a5.
  • FIG. 6 and FIG. 7 and the following related drawings only schematically show some components included in the second speaker unit 4a, and the actual size, actual position and actual configuration of these components are not affected by FIG. 6 and FIG. 7 . and the definitions of the figures below.
  • the second speaker unit 4a is fixed in the casing 1 (for example, the first accommodation cavity 101 ) by means of the frame 4a4.
  • the assembly method between the frame 4a4 and the housing 1 includes but not limited to clamping, screwing or gluing.
  • a supporting step 1011 (with reference to FIG. 5 ) is formed on the inner peripheral wall of the first accommodating cavity 101, and the second speaker unit 4a is supported and fixed on the supporting step 1011 by means of a basin frame 4a4, so that the second speaker unit 4a Positioning installation.
  • the basin frame 4a4 is used as a "supporting skeleton" of the second speaker unit 4a for supporting the diaphragm group 4a1, the voice coil 4a2 and the magnetic circuit system 4a3.
  • the material of the basin frame 4a4 includes but not limited to metal, plastic and a combination of metal and plastic.
  • the pot frame 4a4 can be a one-piece molding, that is to say, the pot frame 4a4 is an integral structure. In this way, it is beneficial to improve the connection strength of the frame 4a4.
  • pot frame 4a4 can also be formed by assembling different parts, and multiple different parts can be connected by clamping, screwing, gluing or welding.
  • the diaphragm set 4a1 is fixed on the open end of the frame 4a4 .
  • the inner peripheral surface of the open end of the frame 4a4 is provided with an annular groove 4a43 that is sunken in a direction away from the central axis of the frame 4a4.
  • the annular groove 4a43 extends in a ring along the circumference of the frame 4a4.
  • the annular groove 4a43 The end surface penetrating to the open end of the basin frame 4 a 4 is also the end surface facing the sound hole 110 .
  • the outer edge of the diaphragm group 4 a 1 is accommodated in the annular groove 4 a 43 and fixed on the wall of the annular groove 4 a 43 facing the sound hole 110 .
  • the annular groove 4a43 by accommodating the outer edge of the diaphragm group 4a1 in the annular groove 4a43 and fixing it on the wall surface of the annular groove 4a43 facing the sound hole 110, it is beneficial to use the annular groove 4a43 to
  • the diaphragm group 4a1 is effectively supported, and the setting of the annular groove 4a43 can increase the volume of the inner space of the basin frame 4a4, which is conducive to setting the size of the diaphragm group 4a1 to be larger, thereby helping to increase the size of the diaphragm group 4a1.
  • the effective vibration area improves the sound output effect of the second speaker unit 4a.
  • the annular groove 4a43 may not be provided on the frame 4a4, and the outer edge of the diaphragm group 4a1 may be fixedly connected with the end surface of the open end of the frame 4a4.
  • the front cavity K1 of the second speaker unit 4 a can be surrounded by the diaphragm group 4 a 1 , the first speaker unit 4 b and the inner wall of the casing 1 .
  • the rear cavity K2 of the second speaker unit 4a is located on the side of the diaphragm group 4a1 away from the front cavity K1.
  • the voice coil 4a2, the magnetic circuit system 4a3 and the frame 4a4 are located in the rear chamber K2.
  • the diaphragm group 4a1 includes: a connecting section 4a11 , a ring 4a12 and a dome 4a13 surrounded by the ring 4a12 .
  • the connecting section 4a11 is in the shape of an annular sheet.
  • the connecting segment 4a11 is in the form of a circular ring or a rectangular ring.
  • the connecting section 4a11 is stacked on the wall surface of the annular groove 4a43 facing the sound hole 110 , so that the diaphragm group 4a1 is connected to the frame 4a4 by means of the connecting section 4a11 .
  • the connection methods of the connecting section 4a11 and the annular groove 4a43 include but not limited to gluing, clamping, welding or screwing.
  • the outer peripheral edge of the ring 4a12 is connected to the inner peripheral edge of the connection section 4a11.
  • the cross-sectional shape of the ring 4a12 is arc-shaped or approximately arc-shaped.
  • the extension track of the ring 4a12 along the circumferential direction of the frame 4a4 is circular or rectangular. The ring 4a12 protrudes toward the direction of the sound hole 110 .
  • the edge ring 4a12 can be deformed when subjected to an external force, so that the dome 4a13 can vibrate along the axial direction of the diaphragm group 4a1 relative to the connecting section 4a11, and it is beneficial to further reduce the volume of the front chamber K1.
  • the ring 4 a 12 may also protrude in a direction away from the sound outlet 110 .
  • the diaphragm group 4a1 is a one-piece molding. That is to say, the connecting section 4a11, the ring 4a12 and the dome 4a13 are an integral structure. Such setting is beneficial to improve the structural strength of the diaphragm group 4a1, and facilitates the processing and manufacturing of the diaphragm group 4a1.
  • the connecting section 4a11, the ring 4a12 and the dome 4a13 can also be independent moldings, the connecting section 4a11 and the ring 4a12 can be connected by gluing, and the connection between the ring 4a12 and the dome 4a13 Can be connected by gluing.
  • the material of the diaphragm group 4a1 includes but not limited to metal, plastic, plant fiber and animal fiber.
  • the voice coil 4a2 is connected to the surface of the dome 4a13 facing away from the sound hole 110 .
  • the connection method between the voice coil 4a2 and the dome 4a13 includes but not limited to glue.
  • the magnetic circuit system 4a3 is fixed in the basin frame 4a4.
  • the magnetic system 4a3 has an annular magnetic gap 4a3a.
  • the end of the voice coil 4a2 away from the diaphragm group 4a1 can extend into the magnetic gap 4a3a. In this way, the magnetic circuit system 4a3 can cooperate with the voice coil 4a2 to drive the diaphragm group 4a1 to vibrate synchronously.
  • an induced magnetic field can be generated, and the magnetic circuit system 4a3 can respond to the induced magnetic field, so that the voice coil 4a2 is displaced by the magnetic force of the magnetic circuit system 4a3 to drive the diaphragm group 4a1 to generate Vibration pushes the air in the front chamber K1 to vibrate to form sound, which is output through the sound hole 110 .
  • the magnetic circuit system 4a3 includes: a side magnetic part 4a31 , a first central magnetic part 4a32 and a second central magnetic part 4a33 .
  • the side magnetic part 4a31 is located on the outer periphery of the first central magnetic part 4a32 to define a magnetic gap 4a3a with the first central magnetic part 4a32.
  • the magnetization directions of the side magnetic part 4a31 and the first central magnetic part 4a32 are opposite, so that the side magnetic part 4a31 and the first central magnetic part 4a32 can form a magnetic circuit for driving the voice coil 4a2 to move.
  • the magnetization direction of the side magnet part 4a31 is from north pole (N) to south pole (S)
  • the magnetization direction of the first center magnet part 4a32 is The magnetic direction is from South Pole (S) to North Pole (N).
  • the side magnetic portion 4a31 may be formed in a ring shape.
  • the side magnetic portion 4a31 is formed as a circular ring or a rectangular ring.
  • the side magnetic portion 4 a 31 may also be non-circular, and there are multiple side magnetic portions 4 a 31 , and the plurality of side magnetic portions 4 a 31 are distributed at intervals in the circumferential direction of the first central magnetic portion 4 a 32 .
  • the second central magnetic part 4a33 blocks one end of the side magnetic part 4a31 away from the diaphragm group 4a1, and the first central magnetic part 4a32 and the second central magnetic part 4a33 are stacked.
  • the second central magnetic part 4a33 and the side magnetic part 4a31 can be integrally formed. That is to say, the second central magnetic part 4a33 and the side magnetic part 4a31 can be a structurally integrated body.
  • the present application is not limited thereto, and the second central magnetic part 4a33 and the side magnetic part 4a31 may also be connected by means of gluing, clamping, screwing and the like.
  • the second central magnetic portion 4a33 may be a piece of magnetically permeable material.
  • the second central magnetic part 4a33 can be used to restrict the leakage of the magnetic force lines and increase the magnetic induction of the magnetic circuit system 4a3.
  • the present application is not limited thereto, and in some other examples, the second central magnetic part 4a33 may be a magnet.
  • the magnet is a magnet or a magnetic steel.
  • both the side magnetic part 4a31 and the first central magnetic part 4a32 may be magnets.
  • both the side magnetic part 4a31 and the first central magnetic part 4a32 are magnets or magnetic steel.
  • the present application is not limited thereto.
  • one of the side magnetic portion 4 a 31 and the first central magnetic portion 4 a 32 is a magnet, and the other is a magnetically permeable material.
  • the magnetic circuit system 4a3 further includes a magnetically permeable yoke 4a34.
  • the magnetically permeable yoke 4a34 is arranged on the side of the first central magnetic part 4a32 facing the diaphragm group 4a1, and is used to restrict the leakage of the magnetic force line, thereby improving the driving force to the diaphragm group 4a1.
  • the outer peripheral surface of the magnetic yoke 4a34 is flush with the outer peripheral surface of the first central magnetic part 4a32 in the axial direction of the magnetic circuit system 4a3. In this way, it is beneficial to further improve the constraint effect of the magnetic yoke 4a34 on the magnetic force lines, increase the magnetic induction of the magnetic circuit system 4a3, and the magnetic yoke 4a34 will not affect the magnetic gap 4a3a, which is conducive to improving the magnetic circuit system 4a3 and the voice coil 4a2 compatibility.
  • the terminal 4a5 is arranged on the basin frame 4a4.
  • the connecting terminal 4a5 is located on the outer side of the basin frame 4a4.
  • the connection terminal 4a5 may be protruded from the outer peripheral surface of the basin frame 4a4.
  • a groove may be formed on the outer peripheral surface of the basin frame 4a4, and the connection terminal 4a5 may be located in the groove.
  • the arrangement of the connection terminal 4a5 those skilled in the art can design according to actual needs, as long as the connection terminal 4a5 is located outside the basin frame 4a4.
  • the connection terminals 4a5 include a positive connection terminal 4a52 and a negative connection terminal 4a51.
  • the part of the positive terminal 4a52 located in the frame 4a4 is electrically connected to the positive lead wire of the voice coil 4a2.
  • the part of the positive terminal 4a52 inside the frame 4a4 and the positive lead of the voice coil 4a2 can be connected by welding.
  • the part of the negative terminal 4a51 located in the frame 4a4 can be electrically connected to the negative lead wire of the voice coil 4a2.
  • the part of the negative terminal 4a51 located in the frame 4a4 may be connected to the negative lead of the voice coil 4a2 by welding. In this way, it is convenient to realize the energization of the voice coil 4a2.
  • FIG. 8 is a perspective view of the first speaker unit 4 b in the earphone 100 shown in FIGS. 4-5 .
  • the first speaker unit 4b is a piezoelectric ceramic speaker unit.
  • the piezoelectric ceramic speaker unit is thin, small in size, and has good high-frequency sound effect.
  • the sound channel 4bb may be formed on the first speaker unit 4b. Specifically, please refer to FIG. 8 , there is one sound output channel 4bb, and the first speaker unit 4b is in a ring shape to define the one sound output channel 4bb.
  • the first speaker unit 4b and the second speaker unit 4a are coaxially arranged, and the sound channel 4bb is in the middle of the first speaker unit 4b. In this way, the vibration of the diaphragm group 4 a 1 pushes the air in the front chamber K1 to vibrate and the sound emitted can be transmitted toward the sound outlet 110 through the sound outlet channel 4 bb .
  • the multiple sound output channels 4bb there may be multiple sound output channels 4bb, the multiple sound output channels 4bb are formed in the first speaker unit 4b, and the multiple sound output channels 4bb are arranged at intervals.
  • the present application is not limited thereto.
  • the sound output channel 4bb may also be formed between the outer peripheral edge of the first speaker unit 4b and the inner wall of the housing 1 .
  • FIG. 9 is a schematic cross-sectional view of the first speaker unit 4 b shown in FIG. 8 at the line B-B.
  • the first speaker unit 4b includes a vibration plate 4b1 and a piezoelectric ceramic sheet 4b2.
  • FIG. 8 and FIG. 9 and the following related drawings only schematically show some components included in the first speaker unit 4b, and the actual shape, actual size, actual position and actual configuration of these components are not affected by FIG. and Fig. 9 and the following figures are defined.
  • the vibrating plate 4b1 has an annular flat plate shape.
  • the vibrating plate 4b1 is in the shape of an annular flat plate, a square annular flat plate or a special-shaped annular flat plate.
  • the outer peripheral contour of the vibrating plate 4b1 is adapted to the inner wall surface of the casing 1 .
  • the vibrating plate 4b1 is arranged opposite to the diaphragm group 4a1.
  • the vibration plate 4b1 is arranged parallel to the diaphragm group 4a1.
  • parallel means that the two are completely parallel, that is, the included angle is 0°, and it can also be within a certain error range, for example, the included angle between the two is between -10° and 10°.
  • the material of the vibrating plate 4b1 includes but not limited to metal and plastic.
  • the first speaker unit 4b is fixed in the casing 1 through the vibrating plate 4b1.
  • the first loudspeaker unit 4b is fixed in the first accommodation cavity 101 through the outer peripheral edge of the vibrating plate 4b1.
  • the vibrating plate 4b1 includes a bearing portion 4b11 and a connecting portion 4b12.
  • the carrying portion 4b11 is used to carry the piezoelectric ceramic sheet 4b2 and is opposite to the piezoelectric ceramic sheet 4b2.
  • the connecting portion 4b12 is disposed around the outer periphery of the bearing portion 4b11. Therefore, it is fixed to the inner wall surface of the case 1 by the connection part 4b12. In this way, when the vibrating plate 4b1 is connected to the housing 1, the piezoelectric ceramic sheet 4b2 is suspended, and the bearing portion 4b11 of the vibrating plate 4b1 is also in a suspended state, so that the piezoelectric ceramic sheet 4b2 can drive the vibrating plate 4b1 to vibrate.
  • a first step 113 is formed on the inner wall of the housing 1 , and the connecting portion 4b12 can be supported and fixed on the first step 113 .
  • the connection methods between the vibrating plate 4b1 and the inner wall surface of the housing 1 include but not limited to gluing, clamping, welding or screwing.
  • the material of the part of the front shell 11 fixed to the vibrating plate 4b1 can be a flexible material, for example, the material of this part is rubber or silicone. Of course, it is understandable that the material of this part may not be a flexible material.
  • the piezoelectric ceramic sheet 4b2 is stacked on the side surface of the vibrating plate 4b1 facing the sound hole 110 .
  • the front cavity K1 can be defined by the side surface of the vibration plate 4b1 facing the second speaker unit 4a, the diaphragm group 4a1, and the inner wall surface of the housing 1, thereby improving the regularity of the shape of the front cavity K1.
  • the piezoelectric ceramic sheet 4b2 may also be disposed on the side surface of the vibrating plate 4b1 facing the second speaker unit 4a.
  • piezoelectric ceramic sheets 4b2 are respectively provided on both surfaces in the thickness direction of the vibrating plate 4b1.
  • the connection method between the piezoelectric ceramic sheet 4b2 and the vibrating plate 4b1 includes but not limited to glue.
  • the piezoelectric ceramic sheet 4b2 is ring-shaped. It can be understood that the stacked ring-shaped piezoelectric ceramic sheet 4b2 and ring-shaped vibration plate 4b1 can jointly define the above-mentioned sound output channel 4bb.
  • the piezoelectric ceramic sheet 4b2 includes a piezoelectric body 4b23, a first electrode layer 4b21, and a second electrode layer 4b22.
  • the piezoelectric body 4b23, the first electrode layer 4b21, and the second electrode layer 4b22 are sequentially stacked.
  • the first electrode layer 4b21, the piezoelectric body 4b23, and the second electrode layer 4b22 may all be one layer.
  • the first electrode layer 4b21, the piezoelectric body 4b23 and the second electrode layer 4b22 can also be multi-layered respectively, and the multi-layer first electrode layer 4b21, the multi-layer piezoelectric body 4b23 layer and the multi-layer second electrode layer
  • the electrode layer 4b22 is arranged along the order of the first electrode layer 4b21, the piezoelectric body 4b23 and the second electrode layer 4b22, and it is only necessary to ensure that a layer of piezoelectric body 4b23 is arranged between two adjacent electrode layers.
  • the material of the piezoelectric body 4b23 includes but is not limited to aluminum nitride, zinc oxide, and rare earth element doped materials of the above materials (such as scandium doped with a certain atomic ratio), and lead zirconate, lead zirconate titanate, zirconium Lead lanthanum titanate, doped lead zirconate titanate, barium titanate, lithium niobate, lithium tantalate, polyvinylidene fluoride (pvdf), tungsten bronze structure compound, solid solution of barium titanate and bismuth ferrite, etc.
  • rare earth element doped materials of the above materials such as scandium doped with a certain atomic ratio
  • the first electrode layer 4b21 can be formed on the piezoelectric body 4b23 by evaporation, electroplating, sputtering and other processes.
  • the material of the first electrode layer 4b21 may be metal.
  • the material of the first electrode layer 4b21 includes but is not limited to molybdenum, aluminum, tungsten, ruthenium, gold, platinum, silver, copper, palladium, chromium, iron, tin, nickel and the like.
  • the second electrode layer 4b22 can be formed on the piezoelectric body 4b23 by evaporation, electroplating, sputtering and other processes.
  • the material of the second electrode layer 4b22 may be metal.
  • the material of the second electrode layer 4b22 includes, but is not limited to, molybdenum, aluminum, tungsten, ruthenium, gold, platinum, silver, copper, palladium, chromium, iron, tin, and nickel.
  • the material of the first electrode layer 4b21 and the material of the second electrode layer 4b22 may be the same or different.
  • the first speaker unit 4 b has an external terminal 4 b3 .
  • the external terminal 4b3 is located on a side of the first speaker unit 4b facing the sound outlet 110 .
  • the external terminal 4b3 By making the external terminal 4b3 on the side of the first speaker unit 4b facing the sound hole 110, it is convenient to form the front cavity K1 of the second speaker unit 4a, preventing the external terminal 4b3 from being unable to be placed in the front cavity K1. Problems connecting to signal traces.
  • the external terminal 4b3 may also face the second speaker unit 4a.
  • the external terminal 4b3 includes a positive external terminal 4b31 and a negative external terminal 4b32.
  • one of the positive external terminal 4b31 and the negative external terminal is disposed on the vibrating plate 4b1, and the vibrating plate 4b1 is conductive, and the second electrode layer 4b22 is electrically connected to the vibrating plate 4b1.
  • the other of the positive external terminal 4b31 and the negative external terminal 4b32 is provided on the surface layer of the first electrode layer 4b21.
  • one of the positive external terminal 4b31 and the negative external terminal may be connected to the vibrating plate 4b1 by welding, or by conductive adhesive bonding.
  • the other one of the positive external terminal 4b31 and the negative external terminal may be connected to the first electrode layer 4b21 by welding, or by conductive adhesive bonding.
  • the piezoelectric body 4b23 when an alternating current is applied to the piezoelectric ceramic speaker unit, the piezoelectric body 4b23 will undergo expansion and contraction deformation, thereby driving the vibrating plate 4b1 to vibrate, and pushing the air to vibrate and produce sound. Since the piezoelectric ceramic sheet 4b2 is a film structure, its longitudinal bending modulus is relatively small, so it can output relatively large sound pressure.
  • FIG. 10 is a schematic diagram of the connection of the main board 2, the first speaker unit 4b, the second speaker unit 4a, the first signal trace 5 and the conductive trace 4a6 in the earphone 100 shown in FIGS. 4-5. .
  • the external terminal 4b3 is electrically connected to the connection terminal 4a5 through the first signal wire 5 .
  • the connecting terminal 4a5 can be electrically connected to the main board 2 through the conductive wire 4a6.
  • the electrical connection between the second dynamic speaker unit 4 and the main board 2 can be realized by using the conductive wire 4a6.
  • the electrical connection between the first speaker unit 4 b and the main board 2 can be realized by using the conductive wire 4 a 6 and the first signal wire 5 . Therefore, the electrical connection relationship between the functional devices in the earphone 100 and the main board 2 can be simplified at least to a certain extent, avoiding the need to connect the first signal wiring 5 to the external terminal 4b3 by using the first signal wiring 5 to electrically connect the main board 2 to the external terminal 4b3. The problem with setting too long.
  • the conductive wire 4a6 may be an enameled wire.
  • the conductive wire 4a6 may also be a flexible printed circuit (FPC).
  • the first signal wire 5 may be an enameled wire.
  • the present application is not limited thereto, and the first signal wiring 5 may also be a flexible circuit board.
  • FIG. 11 is a schematic diagram of a partial structure of an earphone 100 according to some further embodiments of the present application
  • FIG. 12 is a schematic cross-sectional view of the partial structure of the earphone 100 shown in FIG.
  • the earphone 100 also includes a bracket 7 .
  • the bracket 7 is located between the first speaker unit 4 b and the sound outlet 110 .
  • the first speaker unit 4b is fixed on the inner wall surface of the casing 1 through the bracket 7 .
  • the bracket 7 the installation of the first speaker unit 4b can be facilitated.
  • setting the bracket 7 between the first speaker unit 4b and the sound outlet 110 can prevent the large problem that the front cavity K1 needs to be set due to the setting of the bracket 7, and also facilitates the formation of a regular front cavity K1 , so as to improve the sound effect of the second speaker unit 4a.
  • the earphone 100 also includes a noise reduction microphone 8 .
  • the noise reduction microphone 8 is located between the first speaker unit 4 b and the sound outlet 110 , and the noise reduction microphone 8 is electrically connected to the main board 2 .
  • Such setting is beneficial to arrange the noise reduction microphone 8 close to the sound outlet 110, so that the noise reduction microphone 8 picks up the background sound in the human ear canal, and feeds the background sound back to the main board 2, so as to improve the noise reduction of the earphone 100 Effect.
  • the noise reduction microphone 8 may be electrically connected to the main board 2 through the second signal wire 6 .
  • the second signal wire 6 may be an enameled wire.
  • the present application is not limited thereto, and the second signal wiring 6 may also be a flexible circuit board.
  • the noise reduction microphone 8 can extend into the mouthpiece 112 . Such setting is beneficial for the noise reduction microphone 8 to be closer to the sound outlet 110 , thereby improving the sound pickup effect of the microphone and further improving the noise reduction effect of the earphone 100 .
  • the noise reduction microphone 8 can be fixed in the housing 1 through the bracket 7 .
  • the noise reduction microphone 8 and the first speaker unit 4b are fixed together by the bracket 7 to form a modular design, so that when the first speaker unit 4b, the bracket 7 and the noise reduction microphone 8 are installed, the first speaker unit 4b can be facilitated.
  • Speaker unit 4b, support 7 and noise reduction microphone 8 are installed in the housing 1 as a whole, so that the first speaker unit 4b and noise reduction microphone 8 need not be installed separately, the installation steps can be simplified, and the assembly efficiency can be improved, and the first speaker unit 4b
  • the overall structure of the noise reduction microphone 8 is relatively compact.
  • the noise-canceling microphone 8 and the first speaker unit 4b may also be independently installed in the housing 1 .
  • the noise reduction microphone 8 can be fixed in the housing 1 without the support 7 .
  • Fig. 13 is a perspective view of the bracket 7 according to the earphone 100 shown in Fig. 11-Fig. magnified view of .
  • the bracket 7 includes a fixing portion 72 and a support plate 71 .
  • the fixing portion 72 has a ring shape extending along the circumferential direction of the housing 1 .
  • a first step 113 is formed on the inner peripheral surface of the housing 1 , and the fixing portion 72 is supported and fixed on the first step 113 .
  • the connection manner between the fixing part 72 and the first step 113 includes, but not limited to, gluing, clamping, welding or screwing.
  • the first speaker unit 4b is supported and fixed on the fixing portion 72 by the connecting portion 4b12 of the diaphragm 4b1.
  • the connection manner between the vibrating plate 4b1 and the fixing part 72 includes but not limited to gluing, clamping, welding or screwing.
  • the setting of the first step 113 can facilitate the overall positioning and installation of the bracket 7 and the first speaker unit 4b.
  • the annular fixing portion 72 can define a sound transmission channel 723, and the sound transmission channel 723 can communicate with the sound outlet hole 110 and the sound outlet channel 4bb, such that Now, on the one hand, the sound transmission channel 723 can be used as the front sound cavity of the first speaker unit 4b, and the vibration of the first speaker unit 4b drives the air in the front sound cavity to vibrate to produce sound; on the other hand, the sound transmission channel 723 can also be used as the first speaker unit 4b.
  • the sound transmission channel between the second speaker unit 4a and the sound outlet 110 is for the sound emission of the second speaker unit 4a.
  • the material of the fixing part 72 can be a flexible material.
  • the material of the fixing portion 72 is rubber or silicone.
  • the buffering effect of the fixing part 72 can be used to weaken the vibration transmitted from the first speaker unit 4b to the housing 1, thereby improving the comfort of the user wearing the earphone 100 and improving the sound effect of the first speaker unit 4b.
  • the interference of the vibration of the housing 1 to the vibration of the air in the front chamber K1 can be avoided to a certain extent, which is beneficial to improve the sound producing effect of the second speaker unit 4a.
  • the material of the entire bracket 7 can be a flexible material.
  • the bracket 7 is made of rubber or silicone.
  • the fixing portion 72 may be made of flexible material, and other structures on the bracket 7 such as the above-mentioned support plate 71 are made of inflexible material.
  • the bracket 7 can also be made of inflexible material.
  • the material of the bracket 7 includes but not limited to hard plastic and metal. In this way, the service life of the bracket 7 can be improved.
  • the material of the bracket 7 may be the same as that of the housing 1 .
  • the fixing portion 72 includes a fixing plate 722 and an annular flange 721 .
  • the fixing plate 722 is ring-shaped, and the fixing plate 722 is supported and fixed on the step surface of the first step 113 facing the second speaker unit 4a.
  • the ring flange 721 is disposed around the edge of the fixing plate 722 and protrudes toward the direction of the second speaker unit 4a.
  • the outer peripheral edge of the first speaker unit 4b (that is, the connecting portion 4b12 of the vibrating plate 4b1 ) is supported and fixed on the end surface of the ring flange 721 facing the sound hole 110 .
  • the first loudspeaker unit 4b and the fixed plate 722 can be spaced apart by the annular flange 721, so as to realize the suspension of the piezoelectric ceramic sheet and the bearing part 4b11, which is beneficial to improve the sound output effect of the first loudspeaker unit 4b; on the other hand, there is It is beneficial to design the size of the first speaker unit 4b to be larger, further improving the sound effect.
  • annular flange 721 is fixed to the step surface of the first step 113 facing the central axis of the second speaker unit 4a, it is also beneficial to increase the connection area between the bracket 7 and the casing 1, and improve the connection between the two. reliability.
  • the ring flange 721 and the ring fixing plate 722 jointly define a sound transmission channel 723 .
  • the structural form of the fixing portion 72 is not limited thereto, and the fixing portion 72 may not be provided with flanges. Support and be fixed on the fixed plate 722 .
  • the support plate 71 is fixed on the fixing portion 72 . And the support plate 71 extends toward the direction of the sound hole 110 . Thereby, it is beneficial to install the noise-reduction microphone 8 close to the sound outlet 110 and improve the sound pickup effect of the noise-reduction microphone 8 .
  • the support plate 71 protrudes into the sound outlet 112 . In this way, the noise reduction microphone 8 can be placed in the sound outlet 112 while the noise reduction microphone 8 is moduled with the first speaker unit 4 b.
  • the support plate 71 in order to facilitate the support plate 71 to extend into the sound outlet 112 without interfering with the housing 1 , the support plate 71 can be located at the inner periphery of the fixing portion 72 , and be connected to the fixing portion 72 The inner peripheral walls are connected, for example, the inner peripheral walls of the fixing plate 722 are connected.
  • the support plate 71 compared with the connection between the support plate 71 and the outer peripheral edge of the fixed portion 72, by connecting the support plate 71 to the inner peripheral wall of the fixed portion 72, interference between the support plate 71 and the inner wall of the housing 1 can be prevented, thereby avoiding a drop.
  • the interference between the noise microphone 8 and the inner wall of the housing 1 causes the problem of insufficient installation space for the noise reduction microphone 8 , which is beneficial to ensure the reliable installation of the noise reduction microphone 8 .
  • the inner peripheral wall of the fixing portion 72 is the inner peripheral wall of the sound transmission channel 723 .
  • FIG. 15 is the earphone 100 shown in FIGS. 11-12 A schematic diagram of cooperation of the bracket 7, the first speaker unit 4b and the noise reduction microphone 8 in .
  • the orthographic projection of the support plate 71 and the noise reduction microphone 8 on the first speaker unit 4b is located at the periphery of the sound output channel 4bb. Therefore, it is possible to prevent the support plate 71 and the noise reduction microphone 8 from blocking the sound output of the second speaker unit 4a, and ensure the sound output effect of the second speaker unit 4a.
  • the orthographic projection of the support plate 71 and the noise reduction microphone 8 on the first speaker unit 4b may also cover a part of the sound channel 4bb.
  • the orthographic projection of the support plate 71 on the first speaker unit 4b may be between the orthographic projection of the noise reduction microphone 8 on the first speaker unit 4b and the sound output channel 4bb. Such arrangement is beneficial to further disposing the support plate 71 close to the middle area of the sound outlet 112 , preventing interference between the support plate 71 and the sound outlet 112 .
  • the orthographic projection of the support plate 71 on the first speaker unit 4b may also be on the side of the orthographic projection of the noise reduction microphone 8 on the first speaker unit 4b away from the sound channel 4bb.
  • Fig. 16 is based on Fig. Part of the structure of the earphone 100 shown in 12 is an enlarged view of the part circled at F.
  • the fixing part 72 and the shell 1 A relief space 724a is formed between the inner walls, and the second signal trace 6 extends toward the motherboard 2 through the relief space 724a. Specifically, a relief space 724 a is formed between the fixing portion 72 and the first step 113 .
  • a part of the surface of the fixing portion 72 facing the first step 113 is recessed away from the first step 113 to form a relief groove 724.
  • the relief groove 724 and the first step 113 define a relief space 724a, and the relief space 724a is defined by the relief groove 724 and the first step 113.
  • a part of the groove 724 is on the fixing plate 722 , and another part is on the ring flange 721 .
  • a part of the step surface of the first step 113 is recessed away from the fixing part 72 to form a relief groove 724, and the relief groove 724 cooperates with the surface of the fixing part 72 facing the first step 113 to define a relief Space 724a.
  • FIG. 17 shows the bracket 7 and the first speaker unit 4b shown in FIG. matching diagram.
  • the outer peripheral surface of the first speaker unit 4b has a second contour surface 4b14, specifically, the outer peripheral surface of the vibration plate 4b1 has a second contour surface 4b14.
  • the inner peripheral surface of the housing 1 has a second area 1112 facing the second contour surface 4b14, the second contour surface 4b14 is spaced from the second area 1112 to form a second avoidance gap 4b14a, and the second avoidance gap 4b14a is in line with the relief space. Space 724a communicates.
  • the second signal wire 6 can pass through the relief space 724a and the second relief gap 4b14a in order to extend toward the motherboard 2 . In this way, it is beneficial to improve the reliability of the routing of the second signal routing 6 and avoid interference between the second signal routing 6 and other structures in the casing 1 .
  • the second contour surface 4b14 is a plane.
  • the second contour surface 4b14 is an arcuate surface extending along the circumference of the casing 1, and the second contour surface 4b14 arches toward the center of the first speaker unit 4b.
  • the second region 1112 may be recessed in a direction away from the second contour surface 4b14 to form a recessed groove.
  • FIG. 18 is a schematic diagram of cooperation of a part of the front shell 11 , the bracket 7 and the first speaker unit 4 b of the earphone 100 shown in FIGS. 11-12 .
  • the inner peripheral surface of the housing 1 that is, the portion of the inner peripheral surface of the front housing 11 between the main board 2 and the fixing portion 72 has a wire routing groove 1113 .
  • the wiring groove 1113 can communicate with the second escape gap 4b14a, and part of the second signal wiring 6 can be fixed in the wiring groove 1113 .
  • the second signal wiring 6 can pass through the relief space 724a, the second escape gap 4b14a and the wiring groove 1113 in order to extend toward the motherboard 2 .
  • the second signal wiring 6 can be fixed in the wiring groove 1113 by means of gluing, clamping or the like.
  • the wiring groove 1113 , the concave groove and the above-mentioned relief groove 724 formed on the housing 1 may be connected.
  • Such arrangement has a simple structure and is convenient for processing and manufacturing.
  • the bracket 7 Since the external terminal 4b3 of the first speaker unit 4b faces the sound hole 110, and the bracket 7 is between the first speaker unit 4b and the sound hole 110, in order to avoid interference between the bracket 7 and the external terminal 4b3, the first signal cannot be soldered.
  • a part of the surface of the fixing part 72 facing the first speaker unit 4b is recessed toward the direction of the sound outlet 110 to form an avoidance groove 725, which is used to avoid external contact Terminal 4b3. It can be understood that, when the first signal wire 5 is connected to the external terminal 4b3, the avoidance slot 725 can also play a role of avoiding the first signal wire 5 .
  • the avoidance groove 725 may extend to the outer peripheral edge of the fixing portion 72 . This makes it easier for the first signal wire 5 to protrude from the sound transmission channel 723 through the avoidance groove 725 and extend toward the direction of the second speaker unit 4a so as to be connected to the connection terminal 4a5 of the second speaker unit 4a.
  • FIG. 20 is a schematic diagram of another direction after the bracket 7 is matched with the first speaker unit 4 b shown in FIG. 17 .
  • the outer peripheral surface of the first speaker unit 4b has a first contour surface 4b13, specifically, the outer peripheral surface of the vibration plate 4b1 has a first contour surface 4b13.
  • the inner peripheral surface of the housing 1 has a first region 1111 facing the first contour surface 4b13.
  • the first contour surface 4b13 is spaced apart from the first region 1111 to form a first avoidance gap 4b13a.
  • the first escape gap 4b13a communicates with the escape groove 725 .
  • the first signal wire 5 can pass through the escape groove 725 and the first avoidance gap 4b13a in order to extend toward the direction of the second speaker unit 4a, so as to be connected to the connection terminal 4a5 of the second speaker unit 4a. In this way, it is beneficial to improve the reliability of the routing of the first signal routing 6 and avoid interference between the first signal routing 6 and other structures in the housing 1 .
  • the first contour surface 4b13 is a plane.
  • the first contoured surface 4b13 is an arcuate surface extending along the circumferential direction of the casing 1, and the first contoured surface 4b13 arches toward the center of the first speaker unit 4b.
  • the first region 1111 is a curved surface extending along the circumferential direction of the casing 1 , such as an arc surface.
  • the first region 1111 may be recessed in a direction away from the first contour surface 4b13 to form a pit.
  • the part of the inner peripheral surface of the housing 1 between the second speaker unit 4a and the first speaker unit 4b has a wiring groove 1114, and the wiring groove 1114 can be connected with the second speaker unit 4b.
  • the avoidance gap 4b13a is connected, part of the first signal wire 5 can be fixed in the wire groove 1114 , so that the wire groove 1114 is used to avoid the first signal wire 5 .
  • the first signal wire 5 can pass through the avoidance groove 725 , the first avoidance gap 4b13a and the wire groove 1114 in order to be connected to the connection terminal 4a5 to the second speaker unit 4a. In this way, it is beneficial to improve the reliability of the first signal wiring 5 and avoid interference between the first signal wiring 5 and other structures in the housing 1 .
  • the first signal wiring 5 can be fixed in the wiring slot 1114 by means of gluing, clamping or the like.
  • connection terminal 4a5 is opposite to the wiring groove 1114.
  • the outer peripheral wall of the fixing part 72 (such as the outer peripheral wall of the ring flange 721) ) is formed with a first positioning portion 726 , and a second positioning portion 1115 is formed on the inner wall surface of the housing 1 .
  • the first positioning portion 726 cooperates with the second positioning portion 1115 .
  • the first positioning portion 726 may be a positioning groove
  • the second positioning portion 1115 may be a protrusion protruding from the inner wall of the housing 1
  • the first positioning portion 726 may be a protrusion protruding from the outer peripheral wall of the fixing portion 72
  • the second positioning portion 1115 is a positioning groove formed on the inner wall of the housing 1 .
  • a third speaker unit 4b (such as the vibrating plate 4b1) is provided at a position corresponding to the first positioning portion 726 on the outer peripheral edge
  • the positioning part 4b15 , the third positioning part 4b15 and the first positioning part 726 cooperate with the second positioning part 1115 at the same time.
  • both the first positioning portion 726 and the third positioning portion 4b15 may be positioning grooves, and the second positioning portion 1115 may be a protrusion protruding from the inner wall of the housing 1 .
  • both the first positioning portion 726 and the third positioning portion 4b15 may be protrusions, and the second positioning portion 1115 is a positioning groove formed on the inner wall of the housing 1 .
  • the fixing part 72 may not be provided with the first positioning part 726, but the third positioning part 726 may be used.
  • the part 4b15 cooperates with the second positioning part 1115 to achieve positioning.
  • the first speaker unit 4b is not fixed in the housing 1 by means of the bracket 7, but the first speaker unit 4b is directly fixed in the housing 1, the first speaker unit 4b is connected to the second positioning part through the third positioning part 4b15. 1115 to realize the positioning installation of the first speaker unit 4b.
  • FIG. 21 is a schematic cross-sectional view at the line H-H of the partial structure of the earphone 100 shown in FIG.
  • the housing 1 has a balancing hole 1116 .
  • the balance hole 1116 communicates with the front chamber K1 and the outside of the housing 1 .
  • the sound hole 110 faces the user's ear canal, and the shell 1 will have a certain sealing effect on the user's ear canal.
  • the balance hole 1116 is located outside the ear canal. In this way, the balance hole 1116 can be used to balance the air pressure of the front chamber K1 and the outside of the housing 1 , improving the comfort of using the earphone 100 .
  • the balance hole is located at the above-mentioned first step 113 , and a avoidance gap 727 is formed at a position corresponding to the balance hole 1116 of the fixing portion 72 .
  • the escape notch 727 communicates with the balance hole 1116 and the sound transmission channel 723 . In this way, the communication between the front chamber K1 and the atmosphere outside the housing 1 is realized. It can be understood that when the balance hole 1116 is located at the position of the front chamber K1 , the avoidance notch 727 may not be provided on the fixing portion 72 .
  • FIG. 22 is a graph showing changes in frequency and sound pressure level of the earphone 100 in the embodiment of the present application, wherein the abscissa represents the frequency, and the unit is Hz. The ordinate represents the sound pressure level in dBSPL.
  • the curve S1 represents the variation relationship between the frequency and the sound pressure level corresponding to the earphone 100 shown in FIGS. 1-3 in this application.
  • the earphone 100 only has the dynamic speaker unit 4 .
  • Curve S2 represents the change relationship between frequency and sound pressure level corresponding to the earphone 100 with dual speaker units (ie, the first speaker unit 4 b and the second speaker unit 4 a ) in this application when the two speaker units work simultaneously.
  • Curve S3 represents the earphone 100 with dual speaker units (i.e. the first speaker unit 4b and the second speaker unit 4a) in the present application when the second speaker unit 4a is working and the corresponding frequency when the first speaker unit 4b is not working Variation with sound pressure level.
  • the first speaker unit 4b and the second speaker unit 4a) in the present application uses the first speaker unit 4b, the second speaker unit 4a and the cavity formed by the inner wall of the shell 1 as the front cavity K1 of the second speaker unit 4a, the high-frequency effect is better than that of the moving coil speaker unit 4 in the earphone 100 shown in FIGS. 1-3 when it works alone. frequency effect.
  • the sound pressure level of the curve S3 is lower than the sound pressure level of the curve S1.
  • the frequency of curve S3 is smaller than the frequency of curve S1. That is to say, although the curves S1 and S3 reflect the high frequency of the earphone 100 with dual speaker units (i.e. the first speaker unit 4b and the second speaker unit 4a) when the second speaker unit 4a makes sound in the frequency range of a to 20000 Hz The effect is not as good as the high-frequency effect when the dynamic speaker unit 4 in the earphone 100 shown in FIGS. 1-3 works alone.
  • the sound in the frequency band a ⁇ 20000Hz is less likely to be perceived by the human ear, and the closer the frequency is to 20000Hz, the less likely it is perceived by the human ear.
  • the first speaker unit 4a is added to make up for it. Specifically, combining the curves S1 and S2, it can be concluded that the sound pressure level of the earphone 100 with dual speaker units is greater than that shown in Figures 1-3 when the two speaker units work simultaneously in the higher frequency range of 10,000 Hz to 20,000 Hz. The sound pressure level when the dynamic speaker unit 4 in the earphone 100 shown is working alone.
  • the frequency of the earphone 100 with dual speaker units when the dual speaker units work simultaneously is higher than the frequency when the dynamic speaker unit 4 in the earphone 100 shown in FIGS. 1-3 works alone. Therefore, the overall high-frequency effect of the earphone 100 with dual speaker units (ie, the first speaker unit 4 b and the second speaker unit 4 a ) in this application is better.

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  • Headphones And Earphones (AREA)

Abstract

本申请提供一种耳机,包括:外壳、第一扬声器单元和第二扬声器单元。外壳具有出音孔;第一扬声器单元和第二扬声器单元分别独立地固定于外壳内,第一扬声器单元朝向出音孔发声,第二扬声器单元位于第一扬声器单元的远离出音孔的一侧,且与第一扬声器单元间隔设置,第二扬声器单元的发声频率小于第一扬声器单元的发声频率;其中,第一扬声器单元、第二扬声器单元以及外壳的内壁之间围合成一空腔,空腔用作第二扬声器单元的前腔,前腔通过出音通道与出音孔连通。

Description

耳机
本申请要求于2022年2月28日提交国家知识产权局、申请号为202210191140.6、发明名称为“耳机”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子产品技术领域,尤其是涉及一种耳机。
背景技术
电子产品在使用过程中,为了让用户在不干扰旁人的状况下聆听电子产品所提供的声音信息,耳机已成为电子产品的必要配件。
相关技术中,耳机的出音效果差,有待于进一步改进。
发明内容
本申请实施例提供一种耳机,有利于提高耳机的出音效果。
为达到上述目的,本申请的实施例采用如下技术方案:
根据本申请实施例提供的耳机,可以包括:外壳、第一扬声器单元和第二扬声器单元。外壳具有出音孔;第一扬声器单元和第二扬声器单元分别独立地固定于外壳内,第一扬声器单元朝向出音孔发声,第二扬声器单元位于第一扬声器单元的远离出音孔的一侧,且与第一扬声器单元间隔设置,第二扬声器单元的发声频率小于第一扬声器单元的发声频率;其中,第一扬声器单元、第二扬声器单元以及外壳的内壁之间围合成一空腔,空腔用作第二扬声器单元的前腔,前腔通过出音通道与出音孔连通。其中,出音通道形成于第一扬声器单元。具体的,第一扬声器单元呈环形以限定出出音通道。
根据本申请实施例提供的耳机,通过将第一扬声器单元和第二扬声器单元分别独立的固定于外壳内,当第一扬声器单元和第二扬声器单元中的其中一个出现故障损坏时,只需要将损坏的那个拆除更换或维修即可,避免了因将第一扬声器单元和第二扬声器单元模块化而需要将第一扬声器单元和第二扬声器单元整体拆卸下来更换,有利于降低维修成本,并且还可以避免了拆卸过程中对无需更换的那个扬声器单元所造成的损坏。此外,与将第一扬声器单元和第二扬声器单元模块化的设计相比,第一扬声器单元和第二扬声器单元的独立固定于外壳内,省略了第一扬声器单元和第二扬声器单元之间的连接件,利用外壳作为二者的连接件实现物理连接即可,有利于节省外壳内的空间,以便于耳机中集成更多的功能器件,还有利于合理优化耳机内的结构布局。并且,利用第一扬声器单元的发声频率大于第二扬声器单元的发声频率的特性,可以进一步地提高耳机的高频缺失,使得耳机在不同的频率的音域上均具有较好的声音表现力,提高耳机的出音效果。
在本申请提供的一些实施例中,外壳包括前壳和后壳。前壳与后壳可拆卸相连。出音孔形成于前壳,第一扬声器单元和第二扬声器单元处于前壳内。这样可以便于分别加工前壳和后壳,有利于简化前壳和后壳的模具结构,从而降低前壳和后壳的成型难度,进而降低外壳的加工制造难度。并且还有利于将前壳与后壳拆开,以便于耳机的维修。
在一些示例中,前壳和/或的材质为硬质塑料。这样,有利于实现耳机的轻量化。
具体的,前壳包括主体部和出音嘴,主体部内可以形成有第一容纳腔,第一容纳腔的邻近后壳的一侧敞开。出音嘴位于主体部的远离后壳的一侧,并向远离后壳的方向延伸。出音嘴与第一容纳腔连通,出音嘴的远离主体部的一端形成有出音孔。通过设置出音嘴,并且将出音孔设置在出音嘴上,可以便于出音嘴伸入到人耳的耳道处,以缩短耳机的出音孔与人耳的耳膜之间的距离,有利于耳机发出的声音被用户很好的接收,提高用户的使用体验。
在本申请提供的一些实施例中,外壳的内周面上形成有支撑台阶,第二扬声器单元支撑并固定于支撑台阶上。这样设置,可以便于第二扬声器单元的定位安装。
在本申请提供的一些实施例中,第二扬声器单元为动圈式扬声器单元。
在本申请提供的一些实施例中,第二扬声器单元包括振膜组、音圈、磁路系统和盆架。盆架的朝向出音孔的一侧敞开,振膜组固定于盆架的敞开端。音圈和磁路系统位于盆架内。音圈与振膜组相连。磁路系统具有磁间隙,音圈的远离振膜组的一端伸入磁间隙内。磁路系统可与音圈配合以驱动振膜组同步振动。由此,第二扬声器单元的结构简单。
在本申请提供的一些实施例中,盆架的敞开端的内周面设有朝向远离盆架的中心轴线的方向凹陷的环形凹槽,环形凹槽沿盆架的周向延伸成环形,环形凹槽贯穿至盆架敞开端的端面也即朝向出音孔的一端端面。振膜组外边缘收容于环形凹槽内并固定于环形凹槽的正对出音孔的壁面上。由此,利于利用环形凹槽对振膜组进行有效支撑,同时还可以增大盆架内空间的体积,有利于将振膜组的尺寸设置的更大,进而有利于增大振膜组的有效振动面积,提高第二扬声器单元的低频效果。
在本申请提供的一些实施例中,振膜组包括:连接段、折环和由折环围绕的球顶。连接段层叠设于环形凹槽的正对出音孔的壁面上。音圈与球顶相连。折环的外周边缘与连接段的内周边缘相连。折环朝向出音孔的方向凸出。这样,有利于进一步地减小前腔的体积,结构紧凑。
在一些示例中,振膜组为一体成型件。这样设置,有利于提高振膜组的结构强度,便于振膜组的加工制造。
在本申请提供的一些实施例中,磁路系统包括:边磁部和第一中心磁部。边磁部位于第一中心磁部的外周以与第一中心磁部限定出磁间隙。边磁部和第一中心磁部的充磁方向相反,这样边磁部和第一中心磁部可以形成用于驱动音圈移动的磁回路。
在本申请提供的一些实施例中,磁路系统包括第二中心磁部。第二中心磁部封堵边磁部的远离振膜组的一端,第一中心磁部与第二中心磁部层叠设置。第二中心磁部可以为导磁材料件。这样,可以利用第二中心磁部约束磁力线外漏,增大磁路系统的磁感应强度。
在本申请提供的一些实施例中,磁路系统还包括导磁轭。导磁轭设在第一中心磁部朝向振膜组的一侧,用于约束磁力线外漏,从而提高对振膜组的驱动力。
具体的,导磁轭的外周面与第一中心磁部的外周面在磁路系统的轴向上平齐。这样,有利于进一步地提高导磁轭对磁力线的约束效果,增大磁路系统的磁感应强度,并且导磁轭不会影响磁间隙,有利于提高磁路系统与音圈的配合性。
在本申请提供的一些实施例中,第一扬声器单元为压电陶瓷扬声器单元。压电陶瓷扬声器单元的厚度薄,体积小,而且具有良好的高频音效。
在本申请提供的一些实施例中,第一扬声器单元包括振动板和压电陶瓷片。振动板和压电陶瓷片均呈环形的平板状。第一扬声器单元通过振动板固定于外壳内。压电陶瓷片层叠设置于振动板的朝向出音孔的一侧表面上。这样一来,可以利用振动板的朝向第二扬声器单元的一侧表面与振膜组、和外壳的内壁面限定出前腔,从而有利于提高前腔的形状的规则性,以进一步提高第二扬声器单元的发声效果。
具体的,振动板包括承载部和连接部。其中,承载部用于承载压电陶瓷片且与压电陶瓷片。连接部环绕在承载部的外周设置。从而利用连接部固定第一扬声器单元。这样,当振动板与外壳连接时,压电陶瓷片悬空、振动板的承载部也处于悬空状态,从而可以便于压电陶瓷片带动振动板的振动。
示例性的,振动板的材质包括但不限于金属和塑料。
在本申请提供的一些实施例中,耳机包括:支架,支架位于第一扬声器单元与出音孔之间,第一扬声器单元通过支架固定于外壳内。通过设置支架,可以便于第一扬声器单元的安装。并且,将支架设置于第一扬声器单元与出音孔之间,可以防止因支架的设置而需要将前腔设置的较大的问题,同时还有利于形成规则的前腔,以利于提高第二扬声器单元的发声效果。
在本申请提供的一些实施例中,支架包括环状的固定部,第一扬声器单元的外周边缘借助固定部固定于外壳的内周面上。例如,振动板的连接部层叠固定于固定部上,固定部又固定于外壳的内周面上。
在本申请提供的一些实施例中,外壳的内周面上形成有第一台阶,固定部支撑并固定于第一台阶。第一台阶的设置可以便于支架和第一扬声器单元整体的定位安装。
在本申请提供的一些实施例中,固定部包括固定板和环形翻边,固定板支撑并固定于第一台阶的朝向第二扬声器单元的台阶面上,环形翻边设置于固定板的边缘一周,且向第二扬声器单元的方向凸出,第一扬声器单元的外周边缘支撑并固定于环形翻边的远离出音孔的一侧端面上。这样,有利于将第一扬声器单元的尺寸设计的更大,进一步地提高出音效果。此外,当环形翻边与第一台阶的朝向第二扬声器单元的中心轴线的台阶面固定时,还有利于提高支架与外壳之间的连接面积,提高二者之间连接的可靠性。
在本申请提供的一些实施例中,固定部的材质为柔性材质。这样一来,可以利用固定部的缓冲作用来减弱第一扬声器单元传递到外壳上的振动,从而提高用户佩戴耳机的舒适性,提高第一扬声器单元的发声效果。此外,还可以在一定程度上避免外壳的振动对前腔内空气振动的干扰,有利于提高第二扬声器单元的发声效果。
示例性的,固定部的材质为橡胶或硅胶。
为了简化整个支架的加工,保证支架的材质的一致性,整个支架的材质可以为柔性材质。
示例性的,支架的材质为硬质塑料。
在本申请提供的一些实施例中,环状的固定部限定出传音通道,传音通道连通出音孔与出音通道。从而便于第二扬声器单元的发声。
在本申请提供的一些实施例中,出音通道与传音通道同轴设置。这样,出音通道与传音通道可以是正对的,从而提高传音通道的传音效果。
在本申请提供的一些实施例中,第一扬声器单元为压电陶瓷扬声器单元,传音通道用作第一扬声器单元的前音腔。
在本申请提供的一些实施例中,第一扬声器单元具有朝向出音孔的外接端子。通过使得外接端子朝向出音孔,可以便于形成第二扬声器单元的前腔,防止因外接端子处于前腔内而无法与走线连接的问题。
在本申请提供的一些实施例中,固定部的朝向第一扬声器单元的表面的一部分向出音孔的方向凹陷以形成避让槽,避让槽用于避让外接端子。从而避免支架与外接端子产生干涉。
在本申请提供的一些实施例中,耳机包括:第一信号走线;避让槽延伸至固定部的外周边缘,第一信号走线的一端与外接端子固定并电连接,第一信号走线经过避让槽向第二扬声器单元的方向延伸。这样可以便于第一信号走线经过避让槽从传音通道内伸出。
在本申请提供的一些实施例中,第一扬声器单元的外周面具有第一轮廓面,外壳的内周面具有与第一轮廓面正对的第一区域,第一轮廓面与第一区域之间间隔开以形成第一避让间隙,第一避让间隙与避让槽连通,且第一避让间隙用于避让第一信号走线。这样一来,有利于提高第一信号走线走线的可靠性,避免第一信号走线与外壳内的其它结构之间的干涉。
为了实现第一轮廓面与第一区域间隔开,示例性的,第一轮廓面为平面。又示例性的,第一轮廓面为沿外壳的周向延伸的弧形面,且第一轮廓面朝向第一扬声器单元的中心的方向拱起。再示例性的,第一区域可以向远离第一轮廓面的方向凹陷以形成凹坑槽。
在本申请提供的一些实施例中,外壳具有平衡孔。平衡孔连通前腔和外壳的外侧。这样可以利用平衡孔来平衡前腔与外壳的外侧的气压,提高耳机使用的舒适性。
具体的,固定部的与平衡孔对应的位置处形成有避让缺口,避让缺口连通平衡孔和传音通道。从而实现前腔与外壳的外侧的大气的连通。
在本申请提供的一些实施例中,耳机包括:降噪麦克风,降噪麦克风位于第一扬声器单元与出音孔之间,降噪麦克风通过支架固定于外壳内。这样一来,降噪麦克风和第一扬声器单元借助支架固定在一起,形成模块化的设计,从而在安装第一扬声器单元、支架和降噪麦克风时,可以利于将第一扬声器单元、支架和降噪麦克风作为一个整体安装到外壳内,从而无需分别安装第一扬声器单元和降噪麦克风,可以简化安装步骤,提高装配效率,并且第一扬声器单元和降噪麦克风的整体的结构紧凑性较高。此外,降噪麦克风位于第一扬声器单元与出音孔之间,有利于将降噪麦克风设置的靠近出音孔,以便于提高耳机的降噪效果
在本申请提供的一些实施例中,外壳包括主体部和出音嘴,主体部具有第一容纳腔,第一扬声器单元和第二扬声器单元均固定于第一容纳腔内,出音嘴与第一容纳腔连通,出音嘴的远离主体部的一端形成有出音孔,降噪麦克风的至少部分位于出音嘴内。这样设置,有利于降噪麦克风更加靠近出音孔,从而提高麦克风的拾音效果,以 进一步提高耳机的降噪效果。
在本申请提供的一些实施例中,支架包括支撑板和环状的固定部,第一扬声器单元的外周边缘借助固定部固定于外壳的内周面上,支撑板固定于固定部且朝向出音孔的方向延伸,降噪麦克风固定于支撑板上。从而有利于将降噪麦克风安装的靠近出音孔,提高降噪麦克风的拾音效果,以提高耳机的降噪效果。
在本申请提供的一些实施例中,支撑板位于固定部的内周,并且与固定部的内周壁相连。由此,可以防止支撑板与外壳的内壁之间产生干涉,进而避免降噪麦克风与外壳的内壁产生干涉而带来降噪麦克风的安装空间不足的问题,有利于保证降噪麦克风的可靠安装。
在本申请提供的一些实施例中,环状的固定部限定出传音通道,传音通道连通出音孔与出音通道,支撑板和降噪麦克风在第一扬声器单元上的正投影处于出音通道的外周。从而可以防止支撑板和降噪麦克风对第二扬声器单元的出音遮挡,保证第二扬声器单元的出音效果。
在本申请提供的一些实施例中,支撑板在第一扬声器单元上的正投影处于降噪麦克风在所述第一扬声器单元上的正投影与出音通道之间。这样设置,有利于进一步避免支撑板与外壳之间产生干涉。
在本申请提供的一些实施例中,耳机包括:主板和第二信号走线,降噪麦克风适于通过第二信号走线与主板电连接。
在本申请提供的一些实施例中,主板处于第二扬声器单元的远离出音孔的一侧,固定部与外壳的内壁面之间形成有让位空间,第二信号走线经过让位空间向主板的方向延伸。从而便于对第二信号走线进行避让,以便于第二信号走线与主板的连接。
在本申请提供的一些实施例中,第一扬声器单元的外周面具有第二轮廓面,外壳的内周面具有与第二轮廓面正对的第二区域,第二轮廓面与第二区域之间间隔开以形成第二避让间隙,第二避让间隙用于避让第二信号走线。这样一来,有利于提高第二信号走线走线的可靠性,避免第二信号走线与外壳内的其它结构之间的干涉。
为了实现第二轮廓面与第二区域间隔开,示例性的,第二轮廓面为平面。又示例性的,第二轮廓面为沿外壳的周向延伸的弧形面,且第二轮廓面朝向第一扬声器单元的中心的方向拱起。再示例性的,第二区域可以向远离第二轮廓面的方向凹陷以形成凹陷槽。
在本申请提供的一些实施例中,外壳的内周面的处于主板与固定部之间的部分上具有走线凹槽,第二信号走线的部分固定于走线凹槽。这样一来,有利于提高第二信号走线走线的可靠性,避免第二信号走线与外壳内的其它结构之间的干涉。
在本申请提供的一些实施例中,固定部的外周壁上形成有第一定位部,外壳的内周面上形成有第二定位部,第一定位部与第二定位部配合。这样便于对支架、第一扬声器单元整体的安装定位,以防止放反或者放错位。
在本申请提供的一些实施例中,第一扬声器单元的外周边缘形成有第三定位部,外壳的内壁面上形成有第二定位部,第三定位部与第二定位部配合。这样便于对第一扬声器单元的安装定位,以防止放反或者放错位。
在本申请提供的一些实施例中,第一扬声器单元具有外接端子,第二扬声器单元 具有接线端子,外接端子与接线端子之间通过第一信号走线电连接。这样,可以简化第一扬声器单元、第二扬声器单元与主板之间的电连接关系。
在本申请提供的一些实施例中,外壳的内周面的处于第二扬声器单元与第一扬声器单元之间的部分具有走线槽,走线槽用于避让第一信号走线。这样一来,有利于提高第一信号走线的可靠性,避免第一信号走线与外壳内的其它结构之间的干涉。
在本申请提供的一些实施例中,第一扬声器单元与第二扬声器单元同轴设置。这样,有利于提高出音通道的出音效果。
附图说明
图1为本申请一些实施例所提供的耳机的结构示意图;
图2为图1中所示的耳机的分解结构示意图;
图3为根据图1-图2中所示的耳机中的前壳与动圈式扬声器单元的配合后的截面结构示意图;
图4为根据本申请另一些实施例所提供的耳机的部分结构示意图;
图5为根据图4所示的耳机的部分结构在A-A线处的截面示意图;
图6为根据图4-图5中所示的耳机中的第二扬声器单元的立体图;
图7为根据图6所示的第二扬声器单元的截面示意图;
图8为根据图4-图5中所示的耳机中的第一扬声器单元的立体图;
图9为根据图8所示的第一扬声器单元在B-B线处的截面示意图;
图10为根据图4-图5中所示的耳机中的主板、第一扬声器单元、第二扬声器单元、第一信号走线和导电走线的连接示意图;
图11为根据本申请再一些实施例提供的耳机的部分结构示意图;
图12为根据图11所示的耳机的部分结构在C-C线处的截面示意图;
图13为根据图11-图12中所示的耳机中的支架的立体图;
图14为根据图12中所示的耳机的部分结构在E处圈示部分的放大图;
图15为根据图11-图12中所示的耳机中的支架、第一扬声器单元和降噪麦克风的配合示意图;
图16为根据图12中所示的耳机的部分结构在F处圈示部分的放大图;
图17为根据图11-图12中所示的支架与第一扬声器单元的配合示意图;
图18为根据图11-图12中所示的耳机的前壳的一部分、支架和第一扬声器单元的配合示意图;
图19为根据图18所示的耳机的前壳的一部分、支架和第一扬声器单元的配合后的另一方向的示意图;
图20为根据图17所示的支架与第一扬声器单元的配合后的另一方向的示意图;
图21为根据图11所示的耳机的部分结构中在H-H线处的截面示意图,其中第一信号走线、导电走线和主板未示出;
图22为本申请实施例的耳机的频率和声压级的变化曲线图。
附图标记:
100、耳机;
1、外壳;10、容置空间;101、第一容纳腔;1011、支撑台阶;11、前壳;110、 出音孔;111、主体部;1111、第一区域;1112、第二区域;1113、走线凹槽;1114、走线槽;1115、第二定位部;1116、平衡孔;112、出音嘴;1121、限位凸筋;113、第一台阶;12、后壳;102、第二容纳腔;103、第三容纳腔;121、罩体;122、杆体;1221、前杆体;1222、后杆体;123、充电触点;13、接触套;
2、主板;
3、电池;
4、动圈式扬声器单元;K1、前腔;K2、后腔;
4a、第二扬声器单元;4a1、振膜组;4a11、连接段;4a12、折环;4a13、球顶;4a2、音圈;4a3、磁路系统;4a3a、磁间隙;4a31、边磁部;4a32、第一中心磁部;4a33、第二中心磁部;4a34、导磁轭;4a4、盆架;4a43、环形凹槽;4a5、接线端子;4a51、负极接线端子;4a52、正极接线端子;4a6、导电走线;
4b、第一扬声器单元;4b1、振动板;4b11、承载部;4b12、连接部;4b13、第一轮廓面;4b13a、第一避让间隙;4b14、第二轮廓面;4b14a、第二避让间隙;4b15、第三定位部;4b2、压电陶瓷片;4b21、第一电极层;4b22、第二电极层;4b23、压电体;4b3、外接端子;4b31、正极外接端子;4b32、负极外接端子;4bb、出音通道;
5、第一信号走线;
6、第二信号走线;
7、支架;71、支撑板;72、固定部;721、环形翻边;722、固定板;723、传音通道;724、让位槽;724a、让位空间;725、避让槽;726、第一定位部;727、避让缺口;
8、降噪麦克风。
具体实施方式
在本申请实施例中,术语“第一”、“第二”、“第三”、仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”、“第三”、“第四”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,“连接”可以是可拆卸地连接,也可以是不可拆卸地连接;可以是直接连接,也可以通过中间媒介间接连接。其中,“固定连接”是指彼此连接且连接后的相对位置关系不变。“转动连接”是指彼此连接且连接后能够相对转动。“滑动连接”是指彼此连接且连接后能够相对滑动。
本申请实施例中所提到的方位用语,例如,“内”、“外”等,仅是参考附图的方向,因此,使用的方位用语是为了更好、更清楚地说明及理解本申请实施例,而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请实施例的限制。此外,除非本申请中另有说明,否则本申请中所述的“多个”是指两个或两个以上。
在本申请实施例的描述中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要 素,并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
在本申请实施例中,“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。需要说明的是,本文中所涉及的振膜组的有效振动面积是指振膜组中能推动空气运动部分的面积。
本申请提供一种耳机,该耳机可以与手机、平板电脑、笔记本电脑等电子产品配合使用,以接收电子产品所提供的声音信息,并且输出至用户。通过耳机与电子产品的配合使用,可以避免电子产品的声音外放而干扰旁人。该耳机可以是无线耳机,也可以是有线耳机。
请参阅图1和图2,图1为本申请一些实施例所提供的耳机100的结构示意图;图2为图1中所示的耳机100的分解结构示意图。图1和图2所示的耳机100是以无线耳机为例进行的说明。在该实施例中,耳机100可以包括外壳1、主板2、电池3、无线通信模块(图未示出)和动圈式扬声器单元4。
可以理解的是,图1、图2以及下文相关附图仅示意性的示出了耳机100包括的一些部件,这些部件的实际形状、实际大小、实际位置和实际构造不受图1、图2以及下文各附图限定。此外,当耳机100为有线耳机时,该有线耳机可以不包括电池3和无线通信模块。
外壳1具有容置空间10。主板2、电池3、无线通信模块和动圈式扬声器单元4等功能器件可以设置于外壳1的容置空间10内。这样,外壳1可以作为耳机100中的功能器件的载体,用于保护位于外壳1的容置空间10内的功能器件。并且,在用户佩戴耳机100时,耳机100是通过外壳1与用户的耳部进行接触。因此,为了提高用户佩戴耳机100的舒适性,外壳1在外形上可以与人体耳部的形状相配合。
由于外壳1是直接暴露于外界环境中,与人体耳部接触。或者耳机100通过外壳1与其它的外界结构进行接触。这就不可避免地会导致外壳1的外表面出现刮蹭、腐蚀等问题。为了避免该技术问题,外壳1可以具有一定的耐磨耐蚀防刮等性能,或者在外壳1的外表面涂布一层用于耐磨耐蚀防刮的功能材料。
在一些实施例中,外壳1可以作为一个结构整体,也就是说,外壳1可以为一体成型件,一体成型的外壳1结构强度更高。在另一些实施例中,外壳1也可以由多个部分装配形成。请继续参阅图1和图2,在该实施例中,外壳1可以包括前壳11和后壳12。其中,该前壳11在耳机100使用时面向人耳,后壳12在耳机100使用时背向人耳。前壳11与后壳12可拆卸相连。前壳11与后壳12装配后可以限定出上述的容置空间10。这样可以便于分别加工前壳11和后壳12,有利于简化前壳11和后壳12的模具结构,从而降低前壳11和后壳12的成型难度,进而降低外壳1的加工制造难度。并且还有利于将前壳11与后壳12拆开,以便于耳机100的维修。具体的,前壳11可以通过扣合方式固定连接于后壳12。前壳11还可以通过螺钉连接于后壳12。或者,在其他实施方式中,前壳11还可以通过胶粘固定连接于后壳12。
前壳11的材质包括但不限于硬质塑料、金属、以及塑料与金属的结合。为了实现耳机100的轻量化,前壳11的材质可选为硬质塑料。
请参阅图2,前壳11可以包括主体部111和出音嘴112。主体部111内可以形成有第一容纳腔101,第一容纳腔101的邻近后壳12的一侧敞开。出音嘴112可以位于主体部111的远离后壳12的一侧,并向远离后壳12的方向延伸。出音嘴112与第一容纳腔101连通,出音嘴112的远离主体部111的一端形成有出音孔110。通过设置出音嘴112,并且将出音孔110设置在出音嘴112上,可以更加便于出音嘴112伸入到人耳的耳道处,以缩短耳机100的出音孔110与人耳的耳膜之间的距离,有利于耳机100发出的声音被用户很好的接收,提高用户的使用体验。
主体部111与出音嘴112可以为一体成型件。这样可以提高主体部111与出音嘴112之间的连接强度,简化加工工艺,降低生产成本。
当然,在其它的示例中,主体部111与出音嘴112还可以是分体加工,然后通过扣合、螺钉连接、焊接或胶粘等方式相连。这样可以便于分别加工主体部111与出音嘴112,有利于简化主体部111与出音嘴112的模具结构,从而降低主体部111与出音嘴112的成型难度,进而降低前壳11的加工制造难度。
可以理解的是,在另一些实施例中,前壳11也可以不包括出音嘴112,而是直接在主体部111的壁面上开设出音孔110。
为了提高用户佩戴耳机100的舒适性,请继续参阅图1和图2,耳机100还可以设置有接触套13。该接触套13可以用于与用户的耳部相接触。例如,接触套13可以围设于出音嘴112的外周面,且接触套13在外形上可以与人体耳道的形状相类似,以提高佩戴耳机100的配合性。接触套13的材质包括但不限于硅胶和橡胶,以提高用户佩戴耳机100的舒适性。
请参阅图2,出音嘴112的外周面的远离主体部111的一端上可以形成有限位凸筋1121,这样接触套13围设于出音嘴112的外周面时,可以使得接触套13的部分抵接于限位凸筋1121与主体部111之间,从而起到对接触套13进行限位的作用,降低接触套13从出音嘴112上自然脱落的概率。当然,为了降低成本,耳机100还可以不包括该接触套13。
后壳12的材质可与上述的前壳11的材质相同。当然,后壳12的材质与上述的前壳11的材质也可以不同。为了实现耳机100的轻量化,后壳12的材质可选为硬质塑料。
请继续参阅图2,后壳12可以包括罩体121和杆体122。罩体121可以与前壳11相连,杆体122可以设置于罩体121远离前壳11的一侧。罩体121内可以形成有第二容纳腔102,第二容纳腔102的邻近前壳11的一侧敞开,这样该第二容纳腔102可以与第一容纳腔101连通。杆体122内具有第三容纳腔103。第三容纳腔103与第二容纳腔102连通。并且第三容纳腔103、第二容纳腔102与第一容纳腔101可以共同组成外壳1的容置空间10。
杆体122包括前杆体1221和后杆体1222。前杆体1221固定于罩体121。前杆体1221与罩体121可以为一个整体结构。这样可以简化后壳12的加工制造工艺,同时提高罩体121与前杆体1221之间的连接强度。后杆体1222可拆卸的设置于前杆体1221的远离主体部111的一侧。并且前杆体1221与后杆体1222配合以限定出第三容纳腔103。前杆体1221与后杆体1222可以通过胶粘、卡接、或螺钉连接等方式相连。
主板2可以容纳在外壳1的容置空间10内。具体的,主板2可以安装于第二容纳腔102内。主板2在外壳1内的安装方式包括但不限于卡接、螺钉连接或胶粘。
主板2用于集成控制芯片等,控制芯片例如可以为应用处理器(application processor,AP)、双倍数据率同步动态随机存取存储器(double data rate,DDR)以及通用存储器(universal flash storage,UFS)等。主板2与无线通信模块、电池3和动圈式扬声器单元4等功能器件均电连接,以实现不同的功能器件之间的信号控制以及数据信号处理等操作。
主板2可以为硬质电路板,也可以为柔性电路板(flexible printed circuit,FPC),还可以为软硬结合电路板。主板2可以采用FR-介质板,也可以采用罗杰斯(Rogers)介质板,还可以采用FR-和Rogers的混合介质板,等等。这里,FR-是一种耐燃材料等级的代号,Rogers介质板为一种高频板。
无线通信模块(图未示出)可以集成在主板2上。示例性的,该无线通信模块可以焊接固定于主板2上。可选的,无线通信模块可以为蓝牙、红外或wifi模块。耳机100通过该无线通信模块可与电子产品之间进行无线信号交互,以接收电子产品的声音信息。
电池3用于向耳机100内诸如主板2、无线通信模块、动圈式扬声器单元4等功能器件提供电量。电池3可以包括但不限于镍镉电池、镍氢电池、锂电池或其他类型的电池。并且,本申请实施例中的电池3的数量可以为多个,也可以为一个。电池3的形状包括不限于长方体、圆柱体或圆台等。在一些示例中,电池3可以位于第二容纳腔102内,并且电池3位于主板2靠近第一容纳腔101的一侧。在其它示例中,电池3位于第二容纳腔102内,并且电池3位于主板2的背离第一容纳腔101的一侧。电池3在外壳1内的安装方式包括但不限于卡接、螺钉连接或胶粘。
为了实现对电池3的充电,在一些示例中,请参阅图1和图2,杆体122上设置有充电触点123。第三容纳腔103内设置有充电线路(图未示出),该充电线路将充电触点123电性连接至第二容纳腔102内的主板2上。当充电触点123与外部电源的接口电性导通时,可以实现外部电源对耳机100的充电。
请继续参阅图2,动圈式扬声器单元4可以安装于第一容纳腔101内,这样动圈式扬声器单元4位于电池3的靠近出音孔110的一侧,可以将动圈式扬声器单元4设置的靠近出音孔110,以便于提高出音效果。动圈式扬声器单元4与外壳1之间的装配方式包括但不限于卡接、螺纹连接或胶粘等。动圈式扬声器单元4与主板2电连接,以获取音乐、语音等音频电信号,并且动圈式扬声器单元4可以将音频电信号转换成声音信号,支持音频外放。
请参阅图3,图3为根据图1-图2中所示的耳机100中的前壳11与动圈式扬声器单元4配合后的截面结构示意图。前壳11的处于动圈式扬声器单元4与出音孔110之间的腔体可以形成为动圈式扬声器单元4的前腔K1。
上述图1-图3所示的实施例中采用的动圈式扬声器单元4为低音扬声器。这虽然能够使得耳机100具有低频音域表现,并且使得耳机100的造价便宜。但是,动圈式扬声器单元4的振动质量大而瞬态特性不好,质量分布、膜的顺性及BL电磁驱动力的不对称分布会产生不同程度的摇摆振动以及不同频率的分割振动,导致高频响应产 生严重的峰谷,无法实现高频音域表现,导致耳机100的音频外放性能较差,音效不好。并且,由于动圈式扬声器单元4的前腔K1由前壳11的处于动圈式扬声器单元4与出音孔110之间的腔体形成,前腔K1的体积较大,更加不利于动圈式扬声器单元4的高频音域表现。
请参阅图4和图5,图4为本申请另一些实施例所提供的耳机100的部分结构示意图;图5为根据图4所示的耳机100的部分结构在A-A线处的截面示意图。在该实施例中,耳机100不再是仅包括一个动圈式扬声器单元4,而是包括两个扬声器单元,即第一扬声器单元4b和第二扬声器单元4a。
可以理解的是,图4和图5以及下文相关附图仅示意性的示出了耳机100包括的一些部件,这些部件的实际大小、实际位置和实际构造不受图4和图5以及下文各附图限定。
第一扬声器单元4b和第二扬声器单元4a分别独立的固定于外壳1内。具体的,第一扬声器单元4b和第二扬声器单元4a分别独立的固定于第一容纳空间内。
需要说明的是,“第一扬声器单元4b和第二扬声器单元4a分别独立的固定于外壳1内”是指第一扬声器单元4b和第二扬声器单元4a并不是作为一个整体固定到外壳1内的,而是第一扬声器单元4b和第二扬声器单元4a分别安装,且独立的固定于外壳1内,二者安装到外壳1内时具有先后顺序。例如,在将第一扬声器单元4b固定于外壳1内之后,再将第二扬声器单元4a固定于外壳1内。又如,在将第二扬声器单元4a固定于外壳1内之后,再将第一扬声器单元4b固定于外壳1内。
在本申请实施例的耳机100中,通过将第一扬声器单元4b和第二扬声器单元4a分别独立的固定于外壳1内,当第一扬声器单元4b和第二扬声器单元4a中的其中一个出现故障损坏时,只需要将损坏的那个拆除更换或维修即可,避免了因将第一扬声器单元4b和第二扬声器单元4a模块化而需要将第一扬声器单元4b和第二扬声器单元4a整体拆卸下来更换,有利于降低维修成本,并且还可以避免了拆卸过程中对无需更换的那个扬声器单元所造成的损坏。
此外,与将第一扬声器单元4b和第二扬声器单元4a模块化的设计相比,第一扬声器单元4b和第二扬声器单元4a的独立固定于外壳1内,省略了第一扬声器单元4b和第二扬声器单元4a之间的连接件,利用外壳1作为二者的连接件实现物理连接即可,有利于节省外壳1内的空间,以便于耳机100中集成更多的功能器件,还有利于合理优化耳机100内的结构布局。
第二扬声器单元4a位于第一扬声器单元4b的远离出音孔110的一侧,并且第二扬声器单元4a与第一扬声器单元4b间隔设置。第一扬声器单元4b和第二扬声器单元4a均朝向出音孔110发声。第一扬声器单元4b的发声频率大于第二扬声器单元4a的发声频率。由此,通过使得耳机100包括发声频率不同的第一扬声器单元4b和第二扬声器单元4a,有利于利用第一扬声器单元4b和第二扬声器单元4a的发声频率差异,使得耳机100在不同的频率的音域上均具有较好的声音表现力,提高耳机100的出音效果。
在该实施例中,第一扬声器单元4b用作高音扬声器。具体的,第一扬声器单元4b可以为压电陶瓷扬声器单元。第二扬声器单元4a可以为低音扬声器或中低音扬声 器。具体的,第二扬声器单元4a可以为上述图1-图3中所示的动圈式扬声器单元4。当然,可以理解的是,在其它的示例中,第二扬声器单元4a还可以是动铁式扬声器单元或平面音圈扬声器单元。
请继续参阅图5,第一扬声器单元4b、第二扬声器单元4a以及外壳1的内壁之间可以围合成一个空腔。该空腔用作第二扬声器单元4a的前腔K1,该前腔K1通过出音通道4bb与出音孔110连通。这样一来,与上述图1-图3所示的实施例中在耳机100的外壳1中单独设置一个动圈式扬声器单元4相比,通过利用第一扬声器单元4b、第二扬声器单元4a以及外壳1的内壁围合成的空腔作为第二扬声器单元4a的前腔K1,有利于减小前腔K1的体积,从而可以至少在一定程度上提高特定的高频频段内的第二扬声器单元4a的高频效果,而且结结构紧凑性好。并且,利用第一扬声器单元4b的发声频率大于第二扬声器单元4a的发声频率的特性,可以进一步地提高上述实施例中的耳机100的高频缺失,使得耳机100在不同的频率的音域上均具有较好的声音表现力,提高耳机100的出音效果。
请参阅6和图7,图6为根据图4-图5中所示的耳机100中的第二扬声器单元4a的立体图;图7为图6所示的第二扬声器单元4a的截面示意图。在该实施例中,第二扬声器单元4a为动圈式扬声器单元,且包括振膜组4a1、音圈4a2、磁路系统4a3、盆架4a4和接线端子4a5。
可以理解的是,图6和图7以及下文相关附图仅示意性的示出了第二扬声器单元4a包括的一些部件,这些部件的实际大小、实际位置和实际构造不受图6和图7以及下文各附图限定。
具体的,第二扬声器单元4a借助盆架4a4固定于外壳1(例如第一容纳腔101)内。盆架4a4与外壳1之间的装配方式包括但不限于卡接、螺纹连接或胶粘等。示例性的,第一容纳腔101的内周壁上形成有支撑台阶1011(结合图5),第二扬声器单元4a借助盆架4a4支撑并固定于支撑台阶1011上,以便于第二扬声器单元4a的定位安装。
盆架4a4的朝向出音孔110的一侧敞开。盆架4a4用作第二扬声器单元4a的“支撑骨架”,用于支撑振膜组4a1、音圈4a2和磁路系统4a3。盆架4a4的材质包括但不限于金属、塑胶以及金属与塑料的结合。盆架4a4可以为一体成型件,也就是说,盆架4a4为一个整体式结构。这样,有利于提高盆架4a4的连接强度。
当然,本申请不限于此,盆架4a4还可以由不同的部件装配形成,多个不同的部件之间可以通过卡接、螺纹连接、胶粘或焊接等方式相连。
请继续参阅图7,振膜组4a1固定于盆架4a4的敞开端。具体的,盆架4a4的敞开端的内周面设有朝向远离盆架4a4的中心轴线的方向凹陷的环形凹槽4a43,环形凹槽4a43沿盆架4a4的周向延伸成环形,环形凹槽4a43贯穿至盆架4a4敞开端的端面也即朝向出音孔110的一端端面。振膜组4a1的外边缘收容于环形凹槽4a43内并固定于环形凹槽4a43的正对出音孔110的壁面上。
在本申请的实施例中,通过将振膜组4a1的外边缘收容于环形凹槽4a43内并固定于环形凹槽4a43的正对出音孔110的壁面上,有利于利用环形凹槽4a43对振膜组4a1进行有效支撑,同时环形凹槽4a43的设置可以增大盆架4a4内空间的体积,有利于将 振膜组4a1的尺寸设置的更大,进而有利于增大振膜组4a1的有效振动面积,提高第二扬声器单元4a的出音效果。可以理解的是,盆架4a4上也可以不设置环形凹槽4a43,振膜组4a1的外边缘可以与盆架4a4的敞开端的端面固定相连。
这样一来,第二扬声器单元4a的前腔K1可以由振膜组4a1、第一扬声器单元4b和外壳1的内壁所围合而成。可以理解的是,第二扬声器单元4a的后腔K2处于振膜组4a1的远离前腔K1的一侧。音圈4a2、磁路系统4a3和盆架4a4位于后腔K2内。
请继续参阅图7,振膜组4a1包括:连接段4a11、折环4a12和由折环4a12围绕的球顶4a13。
连接段4a11呈环形片状。例如,连接段4a11呈圆环或矩形环。连接段4a11层叠设于环形凹槽4a43的正对出音孔110的壁面上,从而使得振膜组4a1借助该连接段4a11与盆架4a4相连。连接段4a11与环形凹槽4a43的连接方式包括但不限于胶粘、卡接、焊接或螺钉连接。
折环4a12的外周边缘与连接段4a11的内周边缘相连。折环4a12的截面形状呈弧形或近似弧形。折环4a12沿盆架4a4的周向的延伸轨迹呈圆形或矩形。折环4a12朝向出音孔110的方向凸出。
这样,可以使得折环4a12受外力时能够发生形变,使得球顶4a13能够相对于连接段4a11沿着振膜组4a1的轴向振动,同时有利于进一步地减小前腔K1的体积。当然,可以理解的是,折环4a12还可以是朝向背离出音孔110的方向凸出的。
在一些示例中,振膜组4a1为一体成型件。也就是说,连接段4a11、折环4a12和球顶4a13为一个整体的结构。这样设置,有利于提高振膜组4a1的结构强度,便于振膜组4a1的加工制造。当然,本申请不限于此,连接段4a11、折环4a12和球顶4a13还可以为独立成型件,连接段4a11与折环4a12之间可以通过胶粘相连,折环4a12与球顶4a13之间可以通过胶粘相连。振膜组4a1的材质包括但不限于金属、塑料、植物纤维和动物纤维。
音圈4a2与球顶4a13的背离出音孔110的一侧表面相连。音圈4a2与球顶4a13之间的连接方式包括但不限于胶粘。
磁路系统4a3固定于盆架4a4内。磁路系统4a3具有环形的磁间隙4a3a。音圈4a2的远离振膜组4a1的一端可以伸入磁间隙4a3a内。这样磁路系统4a3可与音圈4a2配合以驱动振膜组4a1同步振动。具体而言,在音圈4a2通电后,可以产生感应磁场,磁路系统4a3可以响应于该感应磁场,从而使得音圈4a2受到磁路系统4a3的磁力作用发生位移,以驱动振膜组4a1产生振动,推动前腔K1内的空气振动形成声音,该声音由出音孔110输出。
请继续参阅图7,磁路系统4a3包括:边磁部4a31、第一中心磁部4a32和第二中心磁部4a33。边磁部4a31位于第一中心磁部4a32的外周以与第一中心磁部4a32限定出磁间隙4a3a。边磁部4a31和第一中心磁部4a32的充磁方向相反,这样边磁部4a31和第一中心磁部4a32可以形成用于驱动音圈4a2移动的磁回路。示例性的,沿着盆架4a4的轴向且朝向远离振膜组4a1的方向,边磁部4a31的充磁方向为由北极(N)到南极(S),第一中心磁部4a32的充磁方向为由南极(S)到北极(N)。
请继续参阅图7,边磁部4a31可以形成为环形。例如,边磁部4a31形成为圆环 或矩形环。当然,可以理解的是,边磁部4a31也可以是非环形,边磁部4a31为多个,多个边磁部4a31在第一中心磁部4a32的周向上间隔开分布。
第二中心磁部4a33封堵边磁部4a31的远离振膜组4a1的一端,第一中心磁部4a32与第二中心磁部4a33层叠设置。第二中心磁部4a33与边磁部4a31可以为一体成型件。也就是说,第二中心磁部4a33与边磁部4a31可以为一个结构整体。当然,本申请不限于此,第二中心磁部4a33与边磁部4a31还可以通过胶粘、卡接、螺纹连接等方式相连。
具体的,第二中心磁部4a33可以为导磁材料件。这样,可以利用第二中心磁部4a33约束磁力线外漏,增大磁路系统4a3的磁感应强度。当然,本申请不限于此,在另一些示例中,第二中心磁部4a33可以为磁体。具体的,该磁体为磁铁或磁钢。
在一些示例中,边磁部4a31和第一中心磁部4a32均可以为磁体。示例性的,边磁部4a31和第一中心磁部4a32均为磁铁或磁钢。当然,本申请不限于此,在其它的实施例中,边磁部4a31和第一中心磁部4a32的其中一个为磁体,且另一个为导磁材料件。
为了增大磁路系统4a3的磁感应强度,磁路系统4a3还包括导磁轭4a34。导磁轭4a34设在第一中心磁部4a32朝向振膜组4a1的一侧,用于约束磁力线外漏,从而提高对振膜组4a1的驱动力。
具体的,导磁轭4a34的外周面与第一中心磁部4a32的外周面在磁路系统4a3的轴向上平齐。这样,有利于进一步地提高导磁轭4a34对磁力线的约束效果,增大磁路系统4a3的磁感应强度,并且导磁轭4a34不会影响磁间隙4a3a,有利于提高磁路系统4a3与音圈4a2的配合性。
请参阅图6,接线端子4a5设在盆架4a4上。具体的,接线端子4a5位于盆架4a4的外侧。示例性的,接线端子4a5可以凸设于盆架4a4的外周面。又示例性的,盆架4a4的外周面上可以形成凹槽,接线端子4a5可以位于凹槽内。关于接线端子4a5的设置方式,本领域技术人员可以根据实际需要进行设计,只要保证接线端子4a5位于盆架4a4的外侧即可。
接线端子4a5包括正极接线端子4a52和负极接线端子4a51。正极接线端子4a52的位于盆架4a4内的部分与音圈4a2的正极引线电连接。在一些示例中,正极接线端子4a52的位于盆架4a4内的部分与音圈4a2的正极引线之间可以通过焊接相连。负极接线端子4a51的位于盆架4a4内的部分可与音圈4a2的负极引线电连接。在一些示例中,负极接线端子4a51的位于盆架4a4内的部分可与音圈4a2的负极引线之间可以通过焊接相连。这样可以便于实现对音圈4a2的通电。
请参阅图8,图8为根据图4-图5中所示的耳机100中的第一扬声器单元4b的立体图。在该实施例中,第一扬声器单元4b为压电陶瓷扬声器单元。在本申请的实施例中,压电陶瓷扬声器单元的厚度薄,体积小,而且具有良好的高频音效。
为了便于实现前腔K1与出音孔110的连通。出音通道4bb可以形成于第一扬声器单元4b上。具体的,请参阅图8,出音通道4bb为一个,第一扬声器单元4b呈环形,以限定出该一个出音通道4bb。
进一步的,为了提高出音通道4bb的出音效果,第一扬声器单元4b与第二扬声器 单元4a同轴设置,并且该出音通道4bb处于第一扬声器单元4b的中部。这样一来,这样,振膜组4a1振动推动前腔K1内的空气振动而发出的声音可以经过出音通道4bb朝向出音孔110传递。
在另一些示例中,出音通道4bb还可以为多个,多个出音通道4bb形成于第一扬声器单元4b,且多个出音通道4bb间隔开设置。当然,本申请不限于此,在其它的示例中,出音通道4bb还可以形成于第一扬声器单元4b的外周边缘与外壳1的内壁之间。
请继续参阅图8和图9,其中,图9为根据图8所示的第一扬声器单元4b在B-B线处的截面示意图。第一扬声器单元4b包括振动板4b1和压电陶瓷片4b2。
可以理解的是,图8和图9以及下文相关附图仅示意性的示出了第一扬声器单元4b包括的一些部件,这些部件的实际形状、实际大小、实际位置和实际构造不受图8和图9以及下文各附图限定。
振动板4b1呈环形的平板状。示例性的,振动板4b1呈圆环形形平板状、方环形平板状或异形环状平板状。振动板4b1的外周轮廓与外壳1的内壁面相适应。
振动板4b1与振膜组4a1相对设置。示例性的,振动板4b1与振膜组4a1平行设置。这里,“平行”是指二者之间完全平行即夹角为0°,也可以是在一定的误差范围内,例如二者之间的夹角在-10°~10°之间。振动板4b1的材质包括但不限于金属和塑料。
第一扬声器单元4b通过振动板4b1固定于外壳1内。具体的,第一扬声器单元4b通过振动板4b1的外周边缘固定于第一容纳腔101内。具体的,振动板4b1包括承载部4b11和连接部4b12。
其中,承载部4b11用于承载压电陶瓷片4b2且与压电陶瓷片4b2正对。连接部4b12环绕在承载部4b11的外周设置。从而利用连接部4b12与外壳1的内壁面固定。这样,当振动板4b1与外壳1连接时,压电陶瓷片4b2悬空、振动板4b1的承载部4b11也处于悬空状态,从而可以便于压电陶瓷片4b2带动振动板4b1的振动。
示例性的,外壳1的内壁面上形成有第一台阶113,连接部4b12可以支撑并固定于第一台阶113上。振动板4b1与外壳1的内壁面之间的连接方式包括但不限于胶粘、卡接、焊接或螺钉连接。
由于振动板4b1与外壳1相连,振动板4b1在压电陶瓷片4b2的带动下振动时势必会将振动传递给外壳1,而引起用户佩戴耳机100的舒适性差,同时还不利于第一扬声器单元4b的发声效果,为了解决该技术问题,前壳11的与振动板4b1固定的部分的材质可以为柔性材质,例如,该部分的材质为橡胶或硅胶。当然,可以理解的是,该部分的材质也可以不是柔性材质。
压电陶瓷片4b2层叠设置于振动板4b1的朝向出音孔110的一侧表面上。这样一来,可以利用振动板4b1的朝向第二扬声器单元4a的一侧表面与振膜组4a1、和外壳1的内壁面限定出前腔K1,从而有利于提高前腔K1的形状的规则性,以进一步提高第二扬声器单元4a的出音效果。当然,在其它的示例中,压电陶瓷片4b2还可以设置在振动板4b1的朝向第二扬声器单元4a的一侧表面上。又或者,振动板4b1的厚度方向的两侧表面分别设置有压电陶瓷片4b2。压电陶瓷片4b2与振动板4b1之间的连接方式包括但不限于胶粘。
压电陶瓷片4b2呈环形。可以理解的是,层叠设置的环形的压电陶瓷片4b2和环 形的振动板4b1可以共同限定出上述的出音通道4bb。
压电陶瓷片4b2包括压电体4b23、第一电极层4b21和第二电极层4b22。压电体4b23、第一电极层4b21和第二电极层4b22依次层叠设置。在一些示例中,第一电极层4b21、压电体4b23和第二电极层4b22可以均为一层。在另一些示例中,第一电极层4b21、压电体4b23和第二电极层4b22还可以分别为多层,且多层第一电极层4b21、多层压电体4b23层和多层第二电极层4b22,沿着第一电极层4b21、压电体4b23和第二电极层4b22的顺次排布,保证相邻的两层电极层之间布置有一层压电体4b23即可。
压电体4b23的材质包括但不限于氮化铝、氧化锌,以及上述材料的稀土元素参杂材料(如一定原子比的钪掺杂),也可采用锆酸铅、锆钛酸铅、锆钛酸铅镧、掺杂锆钛酸铅、钛酸钡、铌酸锂、钽酸锂、聚偏氟乙烯(pvdf)、钨青铜结构化合物、钛酸钡与铁酸铋的固溶体等。
第一电极层4b21可以通过蒸镀、电镀、溅射等工艺形成于压电体4b23上。第一电极层4b21的材料可以为金属。具体而言,例如,第一电极层4b21的材料包括但不限于钼、铝、钨、钌、金、铂、银、铜、钯、铬、铁、锡和镍等。
第二电极层4b22可以通过蒸镀、电镀、溅射等工艺形成于压电体4b23上。第二电极层4b22的材料可以为金属。具体而言,例如,第二电极层4b22的材料包括但不限于钼、铝、钨、钌、金、铂、银、铜、钯、铬、铁、锡和镍等。第一电极层4b21的材质和第二电极层4b22的材质可以相同,也可以不同。
请继续参阅图9,为了便于实现第一扬声器单元4b与主板2之间的电连接,第一扬声器单元4b具有外接端子4b3。外接端子4b3处于第一扬声器单元4b的朝向出音孔110的一侧。通过使得外接端子4b3处于第一扬声器单元4b的朝向出音孔110的一侧,可以便于形成第二扬声器单元4a的前腔K1,防止因外接端子4b3处于前腔K1内而无法将外接端子4b3与信号走线连接的问题。当然,可理解的是,在其它的示例中,外接端子4b3也可以朝向第二扬声器单元4a。
具体的,请参阅图9,并且结合图8,外接端子4b3包括正极外接端子4b31和负极外接端子4b32。其中,正极外接端子4b31和负极外端端子的其中一个设置于振动板4b1上,并且振动板4b1导电,第二电极层4b22与振动板4b1电连接。正极外接端子4b31和负极外接端子4b32的另一个设置于表层的第一电极层4b21上。这样设置,可以便于将正极外接端子4b31和负极外接端子4b32分开设置,避免出现短路问题。
示例性的,正极外接端子4b31和负极外端端子的其中一个与振动板4b1之间可以通过焊接相连,或者通过导电胶粘接相连。正极外接端子4b31和负极外端端子的另一个与第一电极层4b21之间可以通过焊接相连,或者通过导电胶粘接相连。
具体而言,当压电陶瓷扬声器单元施加交流电时,压电体4b23会产生伸缩变形,从而带动振动板4b1振动,而推动空气振动发声。由于压电陶瓷片4b2为薄膜结构,其纵向的弯曲模量较小,因此能够输出较大的声压。
请参阅图10,图10为根据图4-图5中所示的耳机100中主板2、第一扬声器单元4b、第二扬声器单元4a、第一信号走线5和导电走线4a6的连接示意图。在该实施例中,为了简化第一扬声器单元4b和第二扬声器单元4a与主板2之间的电连接关系。外接端子4b3与接线端子4a5之间通过第一信号走线5电连接。接线端子4a5可以通 过导电走线4a6电连接至主板2。
这样,利用导电走线4a6可以实现第二动圈式扬声器单元4与主板2之间的电连接。利用导电走线4a6和第一信号走线5可以实现第一扬声器单元4b与主板2之间的电连接。从而可以至少在一定程度上简化耳机100内功能器件与主板2之间的电连接关系,避免了因利用第一信号走线5电连接主板2和外接端子4b3而需要将第一信号走线5设置的过长的问题。
示例性的,导电走线4a6可以为漆包线。当然,本申请不限于此,导电走线4a6还可以为柔性电路板(flexible printed circuit,FPC)。第一信号走线5可以为漆包线。当然,本申请不限于此,第一信号走线5还可以为柔性电路板。
请参阅图11和图12,图11为根据本申请再一些实施例提供耳机100的部分结构的示意图,图12为根据图11所示的耳机100的部分结构在C-C线处的截面示意图。该实施例与上述实施例的区别在于,耳机100还包括支架7。支架7位于第一扬声器单元4b与出音孔110之间。并且第一扬声器单元4b通过支架7固定于外壳1的内壁面上。由此,通过设置支架7,可以便于第一扬声器单元4b的安装。并且,将支架7设置于第一扬声器单元4b与出音孔110之间,可以防止因支架7的设置而需要将前腔K1设置的较大的问题,同时还有利于形成规则的前腔K1,以利于提高第二扬声器单元4a的发声效果。
请继续参阅图11和图12,耳机100还包括降噪麦克风8。降噪麦克风8位于第一扬声器单元4b与出音孔110之间,并且降噪麦克风8与主板2电连接。这样设置,有利于将降噪麦克风8设置的靠近出音孔110,以便于降噪麦克风8拾取人耳耳道内的背景音,并且将背景音反馈给主板2,以便于提高耳机100的降噪效果。具体的,降噪麦克风8与主板2之间可以通过第二信号走线6电连接。
第二信号走线6可以为漆包线。当然,本申请不限于此,第二信号走线6还可以为柔性电路板。
为了提高降噪麦克风8的拾音效果,降噪麦克风8可以伸入出音嘴112内。这样设置,有利于降噪麦克风8更加靠近出音孔110,从而提高麦克风的拾音效果,进一步地提高耳机100的降噪效果。
为了便于实现降噪麦克风8的安装,请继续参阅图12,降噪麦克风8可以通过支架7固定于外壳1内。这样一来,降噪麦克风8和第一扬声器单元4b借助支架7固定在一起,形成模块化的设计,从而在安装第一扬声器单元4b、支架7和降噪麦克风8时,可以利于将第一扬声器单元4b、支架7和降噪麦克风8作为一个整体安装到外壳1内,从而无需分别安装第一扬声器单元4b和降噪麦克风8,可以简化安装步骤,提高装配效率,并且第一扬声器单元4b和降噪麦克风8的整体的结构紧凑性较高。
当然,可以理解的是,在其它的示例中,降噪麦克风8与第一扬声器单元4b也可以是分别独立的安装于外壳1内的。换言之,降噪麦克风8可以不借助支架7固定于外壳1内。
请参阅图13和图14,图13为根据图11-图12中所示的耳机100中的支架7的立体图;图14为根据图12所示的耳机100的部分结构在E处圈示部分的放大图。支架7包括固定部72和支撑板71。
固定部72呈沿外壳1的周向延伸的环形。外壳1的内周面上形成有第一台阶113,固定部72支撑并固定于第一台阶113上。示例性的,固定部72与第一台阶113之间的连接方式包括但不限于胶粘、卡接、焊接或螺钉连接。第一扬声器单元4b通过振动板4b1的连接部4b12支撑并固定于固定部72上。振动板4b1与固定部72之间的连接方式包括但不限于胶粘、卡接、焊接或螺钉连接。第一台阶113的设置可以便于支架7和第一扬声器单元4b整体的定位安装。
具体而言,由于出音通道4bb形成于第一扬声器单元4b上,环形的固定部72可以限定出传音通道723,该传音通道723可以连通出音孔110与出音通道4bb,这样一来,传音通道723一方面可以作为第一扬声器单元4b的前音腔来使用,第一扬声器单元4b振动带动前音腔内的空气振动而发声,另一方面传音通道723也可以作为第二扬声器单元4a与出音孔110之间的传声通道,以便于第二扬声器单元4a的发声。
由于振动板4b1通过固定部72与外壳1相连,振动板4b1在压电陶瓷片4b2的带动下振动时势必会将振动传递给外壳1,而引起用户佩戴耳机100的舒适性差的问题,同时还不利于第一扬声器单元4b的发声效果,为了解决该技术问题,固定部72的材质可以为柔性材质。例如,固定部72的材质为橡胶或硅胶。
这样一来,可以利用固定部72的缓冲作用来减弱第一扬声器单元4b传递到外壳1上的振动,从而提高用户佩戴耳机100的舒适性,提高第一扬声器单元4b的发声效果。此外,还可以在一定程度上避免外壳1的振动对前腔K1内空气振动的干扰,有利于提高第二扬声器单元4a的发声效果。
在此基础上,为了简化整个支架7的加工,保证支架7的材质的一致性,整个支架7的材质可以为柔性材质。例如,支架7的材质为橡胶或硅胶。在其它的示例中,在支架7中,可以仅仅是固定部72为柔性材质,支架7上的其它的结构例如上述的支撑板71等均为非柔性材质。当然,可以理解的是,支架7也可以是非柔性材质。例如,支架7的材质包括但不限于硬质塑料和金属等。这样,可以提高支架7的使用寿命。示例性的,支架7的材质可以与外壳1的材质相同。
请继续参阅图13和图14,固定部72包括固定板722和环形翻边721。固定板722呈环形,并且固定板722支撑并固定于第一台阶113的朝向第二扬声器单元4a的台阶面上。环形翻边721设置于固定板722的边缘一周,且向第二扬声器单元4a的方向凸出。第一扬声器单元4b的外周边缘(也即振动板4b1的连接部4b12)支撑并固定于环形翻边721的朝向出音孔110的一侧端面上。
在本申请的实施例中,通过将第一扬声器单元4b的外周边缘(也即振动板4b1的连接部4b12)支撑并固定于环形翻边721的朝向出音孔110的一侧端面上,一方面可以利用环形翻边721将第一扬声器单元4b和固定板722间隔开,以实现压陶瓷片和承载部4b11的悬空,有利于高第一扬声器单元4b的出音效果,另一方面还有利于将第一扬声器单元4b的尺寸设计的更大,进一步地提高出音效果。此外,当环形翻边721与第一台阶113的朝向第二扬声器单元4a的中心轴线的台阶面固定时,还有利于提高支架7与外壳1之间的连接面积,提高二者之间连接的可靠性。
可以理解的是,环形翻边721以及环形的固定板722共同限定出传音通道723。
当然,在其它的示例中,固定部72的结构形式不限于此,固定部72也可以不设 置翻边,这样,第一扬声器单元4b的外周边缘(也即振动板4b1的连接部4b12)可以支撑并固定于固定板722上。
请继续参阅图13,并且结合图12,支撑板71固定于固定部72上。并且支撑板71朝向出音孔110的方向延伸。从而有利于将降噪麦克风8安装的靠近出音孔110,提高降噪麦克风8的拾音效果。
进一步的,为了便于降噪麦克风8可以处于出音嘴112内,支撑板71伸入到出音嘴112内。这样可以实现在将降噪麦克风8与第一扬声器单元4b模块的同时,还可以使得降噪麦克风8处于出音嘴112内。
具体的,请继续参阅图13,为了便于支撑板71可以伸入到出音嘴112内,而不与外壳1产生干涉,支撑板71可以处于固定部72的内周,并且与固定部72的内周壁相连例如固定板722的内周壁相连。由此,与支撑板71与固定部72的外周边缘相连相比,通过将支撑板71与固定部72的内周壁相连,可以防止支撑板71与外壳1的内壁之间产生干涉,进而避免降噪麦克风8与外壳1的内壁产生干涉而带来降噪麦克风8的安装空间不足的问题,有利于保证降噪麦克风8的可靠安装。可以理解的是,固定部72的内周壁即为传音通道723的内周壁。
为了提高传音通道723的传音效果,防止支撑板71和降噪麦克风8对出音通道4bb的传音干涉,请参阅图15,图15为根据图11-图12中所示的耳机100中的支架7、第一扬声器单元4b和降噪麦克风8的配合示意图。支撑板71和降噪麦克风8在第一扬声器单元4b上的正投影处于出音通道4bb的外周。从而可以防止支撑板71和降噪麦克风8对第二扬声器单元4a的出音遮挡,保证第二扬声器单元4a的出音效果。当然,可以理解的是,在其它的示例中,支撑板71和降噪麦克风8在第一扬声器单元4b上的正投影也可以覆盖出音通道4bb的一部分。
在此基础上,请继续参阅图15,支撑板71在第一扬声器单元4b上的正投影可以处于降噪麦克风8在第一扬声器单元4b上的正投影与出音通道4bb之间。这样设置,有利于进一步将支撑板71设置的靠近出音嘴112的中部区域,防止支撑板71与出音嘴112之间产生干涉。当然,支撑板71在第一扬声器单元4b上的正投影还可以处于降噪麦克风8在第一扬声器单元4b上的正投影的远离出音通道4bb的一侧。
由于主板2处于第二扬声器单元4a的远离出音孔110的一侧,而降噪麦克风8处于固定部72与出音孔110之间,请继续参阅图15和图16,图16为根据图12中所示的耳机100的部分结构在F处圈示部分的放大图,为了便于连接在降噪麦克风8与主板2之间的第二信号走线6的设置,固定部72与外壳1的内壁面之间形成有让位空间724a,第二信号走线6经过让位空间724a向主板2的方向延伸。具体的,固定部72与第一台阶113之间形成有让位空间724a。
示例性的,固定部72的朝向第一台阶113的表面的一部分向远离第一台阶113的方向凹陷以形成让位槽724,让位槽724与第一台阶113限定出让位空间724a,让位槽724的一部分处于固定板722,且另一部分处于环形翻边721上。又示例性的,第一台阶113的台阶面的一部分向远离固定部72的方向凹陷以形成让位槽724,让位槽724与固定部72的朝向第一台阶113的表面配合以限定出让位空间724a。
在此基础上,为了进一步的对第二信号走线6进行避让,请继续参阅图16,并且 结合图17,图17为根据图11-图12中所示的支架7与第一扬声器单元4b的配合示意图。第一扬声器单元4b的外周面具有第二轮廓面4b14,具体的,振动板4b1的外周面具有第二轮廓面4b14。外壳1的内周面具有与第二轮廓面4b14正对的第二区域1112,第二轮廓面4b14与第二区域1112之间间隔开形成第二避让间隙4b14a,第二避让间隙4b14a与让位空间724a连通。这样,第二信号走线6可以依次经过让位空间724a和第二避让间隙4b14a而向主板2的方向延伸。这样一来,有利于提高第二信号走线6走线的可靠性,避免第二信号走线6与外壳1内的其它结构之间的干涉。
示例性的,为了实现第二轮廓面4b14与第二区域1112间隔开,示例性的,第二轮廓面4b14为平面。又示例性的,第二轮廓面4b14为沿外壳1的周向延伸的弧形面,且第二轮廓面4b14朝向第一扬声器单元4b的中心的方向拱起。
示例性的,为了实现第二轮廓面4b14与第二区域1112间隔开,第二区域1112可以向远离第二轮廓面4b14的方向凹陷以形成凹陷槽。
请参阅图18,图18为根据图11-图12中所示的耳机100的前壳11的一部分、支架7和第一扬声器单元4b的配合示意图。外壳1的内周面即前壳11的内周面的处于主板2与固定部72之间的部分具有走线凹槽1113。走线凹槽1113可以与第二避让间隙4b14a连通,第二信号走线6的部分可以固定于走线凹槽1113内。这样,第二信号走线6可以依次经过让位空间724a、第二避让间隙4b14a和走线凹槽1113而向主板2的方向延伸。这样一来,有利于提高第二信号走线6走线的可靠性,避免第二信号走线6与外壳1内的其它结构之间的干涉。
示例性的,第二信号走线6可以通过胶粘、或卡接等方式固定于走线凹槽1113内。
示例性的,走线凹槽1113、凹陷槽和上文中所述的形成于外壳1上的让位槽724可以是连通的。这样设置,结构简单,便于加工制造。
由于第一扬声器单元4b的外接端子4b3朝向出音孔110,并且支架7处于第一扬声器单元4b与出音孔110之间,为了避免支架7与外接端子4b3产生干涉,而无法焊接第一信号走线5,请继续参阅图17,并且结合图13,固定部72的朝向第一扬声器单元4b的表面的一部分向出音孔110的方向凹陷以形成避让槽725,避让槽725用于避让外接端子4b3。可以理解的是,在第一信号走线5与外接端子4b3连接时,避让槽725还可以起到避让第一信号走线5的作用。
具体的,为了进一步地提高避让槽725对第一信号走线5的避让效果,避让槽725可以延伸至固定部72的外周边缘。这样可以便于第一信号走线5经过避让槽725从传音通道723内伸出,并且向第二扬声器单元4a的方向延伸,以与第二扬声器单元4a的接线端子4a5相连。
在此基础上,为了进一步地对第一信号走线5进行避让,请参阅图19-图20,图19为根据图18所示的耳机100的前壳11的一部分、支架7和第一扬声器单元4b的配合后的另一方向的示意图。图20为根据图17所示的支架7与第一扬声器单元4b的配合后的另一方向的示意图。第一扬声器单元4b的外周面具有第一轮廓面4b13,具体的,振动板4b1的外周面具有第一轮廓面4b13。外壳1的内周面具有与第一轮廓面4b13正对的第一区域1111。第一轮廓面4b13与第一区域1111之间间隔开以形成 第一避让间隙4b13a。第一避让间隙4b13a与避让槽725连通。
这样,第一信号走线5可以依次经过避让槽725和第一避让间隙4b13a而向第二扬声器单元4a的方向延伸,以与第二扬声器单元4a的接线端子4a5相连。这样一来,有利于提高第一信号走线6走线的可靠性,避免第一信号走线6与外壳1内的其它结构之间的干涉。
为了实现第一轮廓面4b13与第一区域1111间隔开,示例性的,第一轮廓面4b13为平面。又示例性的,第一轮廓面4b13为沿外壳1的周向延伸的弧形面,且第一轮廓面4b13朝向第一扬声器单元4b的中心的方向拱起。
示例性的,为了实现第一轮廓面4b13与第一区域1111间隔开,第一区域1111为沿外壳1的周向延伸的曲面,例如弧形面。或者,第一区域1111可以向远离第一轮廓面4b13的方向凹陷以形成凹坑槽。
在此基础上,请继续参阅图19和图20,外壳1的内周面的处于第二扬声器单元4a与第一扬声器单元4b之间的部分具有走线槽1114,走线槽1114可与第一避让间隙4b13a连通,第一信号走线5的部分可以固定于走线槽1114内,从而利用走线槽1114避让第一信号走线5。
这样,第一信号走线5可以依次经过避让槽725、第一避让间隙4b13a和走线槽1114而与向第二扬声器单元4a的接线端子4a5相连。这样一来,有利于提高第一信号走线5的可靠性,避免第一信号走线5与外壳1内的其它结构之间的干涉。
示例性的,第一信号走线5可以通过胶粘、或卡接等方式固定于走线槽1114内。
为了节省第一信号走线5的长度,沿着第一扬声器单元4b和第二扬声器单元4a的排布方向,接线端子4a5与走线槽1114正对。
请继续参阅图19和图20,为了便于对支架7、第一扬声器单元4b整体的安装定位,以防止支架7放反或者放错位,固定部72的外周壁(例如环形翻边721的外周壁)上形成有第一定位部726,外壳1的内壁面上形成有第二定位部1115。第一定位部726与第二定位部1115配合。
示例性的,请继续参阅图19和图20,第一定位部726可以为定位槽,第二定位部1115可以为凸出于外壳1的内壁面的凸块。又示例性的,第一定位部726可以为凸出于固定部72的外周壁的凸块,第二定位部1115为形成于外壳1的内壁面的定位槽。
为了进一步地提高对支架7、第一扬声器单元4b整体的安装定位的便利性,第一扬声器单元4b(例如振动板4b1)的外周边缘的对应于第一定位部726的位置处设有第三定位部4b15,第三定位部4b15、第一定位部726同时与第二定位部1115配合。
示例性的,第一定位部726和第三定位部4b15均可以为定位槽,第二定位部1115可以为凸出于外壳1的内壁面的凸块。又示例性的,第一定位部726和第三定位部4b15均可以为凸块,第二定位部1115为形成于外壳1的内壁面的定位槽。
可以理解的是,在其它的示例中,在利用支架7将第一扬声器单元4b固定于外壳1内的基础上,固定部72上也可以不设置第一定位部726,而是利用第三定位部4b15与第二定位部1115配合来实现定位。又或者,在第一扬声器单元4b不借助支架7固定于外壳1内,而是第一扬声器单元4b直接固定于外壳1内时,第一扬声器单元4b通过第三定位部4b15与第二定位部1115的配合来实现对第一扬声器单元4b的定位安 装。
请参阅图21,图21为根据图11所示的耳机100的部分结构中在H-H线处的截面示意图,其中第一信号走线5、导电走线4a6和主板2未示出。外壳1具有平衡孔1116。平衡孔1116连通前腔K1和外壳1的外侧。具体而言,当用户佩戴耳机100时,出音孔110朝向用户的耳道内,外壳1会对用户的耳道有一定的封闭作用,通过设置平衡孔1116,平衡孔1116位于耳道的外侧,这样可以利用平衡孔1116来平衡前腔K1与外壳1的外侧的气压,提高耳机100使用的舒适性。
具体的,请继续参阅图21,并且结合图13和图20,平衡孔处于上述的第一台阶113处,固定部72的与平衡孔1116对应的位置处形成有避让缺口727。避让缺口727连通平衡孔1116和传音通道723。从而实现前腔K1与外壳1的外侧的大气的连通。可以理解的是,当平衡孔1116处于前腔K1所处位置上时,固定部72上也可以不设置避让缺口727。
下面结合本申请实施例中的耳机100的频率和声压级的变化关系对上述实施例进行进一步的说明。
请参阅图22,图22为本申请实施例中的耳机100的频率与声压级的变化曲线图,其中,横座标代表的是频率,单位为Hz。纵坐标代表的是声压级,单位是dBSPL。在图22中,曲线S1代表的是本申请中图1-图3所示的耳机100所对应的频率与声压级的变化关系,该耳机100中仅有动圈式扬声器单元4。曲线S2代表的是本申请中具有双扬声器单元(即第一扬声器单元4b和第二扬声器单元4a)的耳机100在双扬声器单元同时工作时所对应的频率与声压级的变化关系。曲线S3代表的是本申请中具有双扬声器单元(即第一扬声器单元4b和第二扬声器单元4a)的耳机100在第二扬声器单元4a工作,而第一扬声器单元4b不工作时所对应的频率与声压级的变化关系。
结合曲线S1和曲线S3可以得出,在高频段10000Hz~a之间,其中,a的取值介于16000Hz~18000Hz之间,在同一频率时,曲线S3的声压级大于曲线S1的声压级。在同一声压级时,曲线S3的频率大于曲线S1的频率。因此,综合声压级和频率这两项参数可知,本申请中具有双扬声器单元(即第一扬声器单元4b和第二扬声器单元4a)的耳机100在利用第一扬声器单元4b、第二扬声器单元4a以及外壳1的内壁围合成的空腔作为第二扬声器单元4a的前腔K1时的高频效果优于图1-图3所示的耳机100中动圈式扬声器单元4单独工作时的高频效果。
在a~20000Hz频段内,虽然在同一频率时,曲线S3的声压级小于曲线S1的声压级。在同一声压级时,曲线S3的频率小于曲线S1的频率。也就是说,虽然曲线S1和S3反映出在a~20000Hz频段内,具有双扬声器单元(即第一扬声器单元4b和第二扬声器单元4a)的耳机100在第二扬声器单元4a发声时的高频效果不如图1-图3所示的耳机100中动圈式扬声器单元4单独工作时的高频效果好。但是,一方面相比于频段10000Hz~a,a~20000Hz频段内的声音更不容易被人耳感知,越是靠近20000Hz的频率越是不容易被人耳感知,另一方面该部分差异可以通过第一扬声器单元4a的增加来弥补。具体而言,结合曲线S1和曲线S2可以得出,在较高的频段10000Hz~20000Hz之间,具有双扬声器单元的耳机100在双扬声器单元同时工作时的声压级大于图1-图3所示的耳机100中动圈式扬声器单元4单独工作时的声压级。在同一声压级时,具 有双扬声器单元的耳机100在双扬声器单元同时工作时的频率高于图1-图3所示的耳机100中动圈式扬声器单元4单独工作时的频率。因此,本申请中具有双扬声器单元(即第一扬声器单元4b和第二扬声器单元4a)的耳机100整体的高频效果更好。
在本说明书的描述中,具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是:以上实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (27)

  1. 一种耳机,其特征在于,包括:
    外壳,所述外壳具有出音孔;
    第一扬声器单元和第二扬声器单元,所述第一扬声器单元和第二扬声器单元分别独立地固定于所述外壳内,所述第一扬声器单元朝向所述出音孔发声,所述第二扬声器单元位于所述第一扬声器单元的远离所述出音孔的一侧,且与所述第一扬声器单元间隔设置,所述第二扬声器单元的发声频率小于所述第一扬声器单元的发声频率,所述第一扬声器单元呈环形以限定出出音通道;
    其中,所述第一扬声器单元、所述第二扬声器单元以及所述外壳的内壁之间围合成一空腔,所述空腔用作所述第二扬声器单元的前腔,所述前腔通过所述出音通道与所述出音孔连通。
  2. 根据权利要求1所述的耳机,其特征在于,包括:支架,所述支架位于所述第一扬声器单元与所述出音孔之间,所述第一扬声器单元通过所述支架固定于所述外壳内。
  3. 根据权利要求2所述的耳机,其特征在于,所述支架包括环状的固定部,所述第一扬声器单元的外周边缘借助所述固定部固定于所述外壳的内周面上。
  4. 根据权利要求3所述的耳机,其特征在于,所述外壳的内周面上形成有第一台阶,所述固定部支撑并固定于所述第一台阶。
  5. 根据权利要求4所述的耳机,其特征在于,所述固定部包括固定板和环形翻边,所述固定板支撑并固定于所述第一台阶的朝向所述第二扬声器单元的台阶面上,所述环形翻边设置于所述固定板的边缘一周,且向所述第二扬声器单元的方向凸出,所述第一扬声器单元的外周边缘支撑并固定于所述环形翻边的远离所述出音孔的一侧端面上。
  6. 根据权利要求3-5中任一项所述的耳机,其特征在于,所述固定部的材质为柔性材质。
  7. 根据权利要求3-6中任一项所述的耳机,其特征在于,环状的所述固定部限定出传音通道,所述传音通道连通所述出音孔与所述出音通道。
  8. 根据权利要求7所述的耳机,其特征在于,所述第一扬声器单元为压电陶瓷扬声器单元,所述传音通道用作所述第一扬声器单元的前音腔。
  9. 根据权利要求3-8中任一项所述的耳机,其特征在于,所述第一扬声器单元具有朝向所述出音孔的外接端子,所述固定部的朝向所述第一扬声器单元的表面的一部分向所述出音孔的方向凹陷以形成避让槽,所述避让槽用于避让所述外接端子。
  10. 根据权利要求9所述的耳机,其特征在于,包括:第一信号走线;
    所述避让槽延伸至所述固定部的外周边缘,所述第一信号走线的一端与所述外接端子固定并电连接,所述第一信号走线经过所述避让槽向所述第二扬声器单元的方向延伸。
  11. 根据权利要求10所述的耳机,其特征在于,所述第一扬声器单元的外周面具有第一轮廓面,所述外壳的内周面具有与所述第一轮廓面正对的第一区域,所述第一轮廓面与所述第一区域之间间隔开以形成第一避让间隙,所述第一避让间隙与所述避 让槽连通,且所述第一避让间隙用于避让所述第一信号走线。
  12. 根据权利要求7所述的耳机,其特征在于,所述外壳具有平衡孔,所述固定部的与所述平衡孔对应的位置处形成有避让缺口,所述避让缺口连通所述平衡孔和所述传音通道。
  13. 根据权利要求2-12中任一项所述的耳机,其特征在于,包括:降噪麦克风,所述降噪麦克风位于所述第一扬声器单元与所述出音孔之间,所述降噪麦克风通过所述支架固定于所述外壳内。
  14. 根据权利要求13所述的耳机,其特征在于,所述外壳包括前壳,所述前壳包括主体部和出音嘴,所述主体部具有第一容纳腔,所述第一扬声器单元和所述第二扬声器单元均固定于所述第一容纳腔内,所述出音嘴与所述第一容纳腔连通,所述出音嘴的远离所述主体部的一端形成有所述出音孔,所述降噪麦克风的至少部分位于所述出音嘴内。
  15. 根据权利要求13或14所述的耳机,其特征在于,所述支架包括支撑板和环状的固定部,所述第一扬声器单元的外周边缘借助所述固定部固定于所述外壳的内周面上,所述支撑板固定于所述固定部且朝向所述出音孔的方向延伸,所述降噪麦克风固定于所述支撑板上。
  16. 根据权利要求15所述的耳机,其特征在于,所述支撑板位于所述固定部的内周,并且与所述固定部的内周壁相连。
  17. 根据权利要求16所述的耳机,其特征在于,环状的所述固定部限定出传音通道,所述传音通道连通所述出音孔与所述出音通道,所述支撑板和所述降噪麦克风在所述第一扬声器单元上的正投影处于所述出音通道的外周。
  18. 根据权利要求15所述的耳机,其特征在于,包括:主板和第二信号走线,所述降噪麦克风适于通过所述第二信号走线与所述主板电连接。
  19. 根据权利要求18所述的耳机,其特征在于,所述主板处于所述第二扬声器单元的远离出音孔的一侧,所述固定部与所述外壳的内壁面之间形成有让位空间,所述第二信号走线经过所述让位空间向所述主板的方向延伸。
  20. 根据权利要求18或19所述的耳机,其特征在于,所述第一扬声器单元的外周面具有第二轮廓面,所述外壳的内周面具有与所述第二轮廓面正对的第二区域,所述第二轮廓面与所述第二区域之间间隔开以形成第二避让间隙,所述第二避让间隙用于避让所述第二信号走线。
  21. 根据权利要求18-20中任一项所述的耳机,其特征在于,所述外壳的内周面的处于所述主板与所述固定部之间的部分上具有走线凹槽,所述第二信号走线的部分固定于所述走线凹槽。
  22. 根据权利要求3-12以及15-21中任一项所述的耳机,其特征在于,所述固定部的外周壁上形成有第一定位部,所述外壳的内周面上形成有第二定位部,所述第一定位部与所述第二定位部配合。
  23. 根据权利要求1-22中任一项所述的耳机,其特征在于,所述第一扬声器单元的外周边缘具有第三定位部,所述外壳的内周面上形成有第二定位部,所述第三定位部与所述第二定位部配合。
  24. 根据权利要求1-23中任一项所述的耳机,其特征在于,所述第一扬声器单元具有外接端子,所述第二扬声器单元具有接线端子,所述外接端子与所述接线端子之间通过第一信号走线电连接。
  25. 根据权利要求24所述的耳机,其特征在于,所述外壳的内周面的处于所述第二扬声器单元与所述第一扬声器单元之间的部分具有走线槽,所述走线槽用于避让所述第一信号走线。
  26. 根据权利要求1-25中任一项所述的耳机,其特征在于,所述第一扬声器单元为压电陶瓷扬声器单元;和/或,所述第二扬声器单元为动圈式扬声器单元。
  27. 根据权利要求1-26中任一项所述的耳机,其特征在于,所述第一扬声器单元与所述第二扬声器单元同轴设置。
PCT/CN2022/137672 2022-02-28 2022-12-08 耳机 WO2023160114A1 (zh)

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Citations (5)

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CN105263077A (zh) * 2014-10-24 2016-01-20 太阳诱电株式会社 电声转换装置及电子设备
US20170325014A1 (en) * 2016-05-09 2017-11-09 Chi-Cheng WEN Dual audio earphone
CN107371077A (zh) * 2016-05-13 2017-11-21 宇音国际有限公司 动圈压电双音频扬声器的耳机
CN208112885U (zh) * 2018-04-17 2018-11-16 歌尔科技有限公司 双单元耳机以及电子设备
CN212086420U (zh) * 2020-06-29 2020-12-04 歌尔股份有限公司 一种出声装置以及头戴式电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105263077A (zh) * 2014-10-24 2016-01-20 太阳诱电株式会社 电声转换装置及电子设备
US20170325014A1 (en) * 2016-05-09 2017-11-09 Chi-Cheng WEN Dual audio earphone
CN107371077A (zh) * 2016-05-13 2017-11-21 宇音国际有限公司 动圈压电双音频扬声器的耳机
CN208112885U (zh) * 2018-04-17 2018-11-16 歌尔科技有限公司 双单元耳机以及电子设备
CN212086420U (zh) * 2020-06-29 2020-12-04 歌尔股份有限公司 一种出声装置以及头戴式电子设备

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