WO2023155634A1 - Écran d'affichage et dispositif électronique - Google Patents

Écran d'affichage et dispositif électronique Download PDF

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Publication number
WO2023155634A1
WO2023155634A1 PCT/CN2023/070729 CN2023070729W WO2023155634A1 WO 2023155634 A1 WO2023155634 A1 WO 2023155634A1 CN 2023070729 W CN2023070729 W CN 2023070729W WO 2023155634 A1 WO2023155634 A1 WO 2023155634A1
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Prior art keywords
layer
display panel
elastic material
projection
material layer
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PCT/CN2023/070729
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English (en)
Chinese (zh)
Inventor
陈英杰
刘俊彦
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华为技术有限公司
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Publication of WO2023155634A1 publication Critical patent/WO2023155634A1/fr

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present application relates to the field of display technology, in particular to a display panel and electronic equipment.
  • the display screen needs to have stretchability while maintaining the normal functions of the driving devices and light-emitting devices in the display panel.
  • the current display panels require the use of elastic materials with a lower modulus of elasticity to ensure stretchability, and the elastic materials with a lower modulus of elasticity cannot withstand higher process temperatures, thus limiting the process temperature of the devices in the display panel .
  • the invention relates to a display panel and electronic equipment, which can enable the display panel to have stretchability, and at the same time enable devices in the display panel to be prepared through a relatively high process temperature.
  • a display panel including: a plurality of pixel components arranged at intervals, each pixel component includes a stacked circuit layer and a light emitting device; a first elastic material layer, the first elastic material layer is filled in any adjacent Between the two pixel components; the stress release layer located on the side of the circuit layer away from the light-emitting device, in the direction perpendicular to the plane where the display panel is located, the projection of the stress release layer overlaps with the projection of each pixel component, the first elasticity
  • the elastic modulus of the material layer is smaller than the elastic modulus of the stress release layer;
  • a plurality of pixel components include a first pixel component and a second pixel component, and the first pixel component and the second pixel component are connected by signal lines;
  • the protective layer is perpendicular to In the direction of the plane where the display panel is located, the projection of the protective layer overlaps with the projection of each pixel component, and the projection of the protective layer overlaps with the projection of the first elastic material layer; the first
  • the first pixel component includes a first signal line connection part, the first signal line connection part is connected to the signal line, and the connection between the first signal line connection part and the signal line is the first connection point;
  • the second pixel assembly includes a second signal line connection part, the second signal line connection part is connected to the signal line, and the connection between the second signal line connection part and the signal line is the second connection point; in the direction perpendicular to the plane where the display panel is located Above, the projection of the first elastic material layer does not overlap with the projection of the first joint, and the projection of the first elastic material layer does not overlap with the projection of the second joint.
  • the projection of the stress release layer covers the projection of each pixel component.
  • the projection of the stress release layer does not overlap with the projection of the first elastic material layer.
  • the stress release layer includes a stress release portion and a connection portion, the stress release portion is located between each pixel component and the protection layer, and the connection portion is located between the first elastic material layer and the protection layer.
  • the thickness of the connection part is smaller than the thickness of the stress release part.
  • the projection of the connecting portion covers the projection of the first elastic material layer.
  • a first hollow area is provided on the connecting portion, and the first elastic material layer is filled in the first hollow area.
  • the display panel further includes: a second elastic material layer, the elastic modulus of the second elastic material layer is smaller than the elastic modulus of the stress release layer, and the second elastic material layer is located between the signal line and the first elastic material layer. The side of the material layer away from the protective layer.
  • the display panel further includes: an encapsulation layer, the encapsulation layer is located on the side of each pixel component away from the stress release layer, the encapsulation layer is provided with a second hollow area, and the second elastic material layer fills the first Two hollow areas.
  • the display panel further includes: a touch layer, the touch layer is located on the side of the encapsulation layer and the second elastic material layer away from the protective layer; a polarizer, the polarizer is located on the side of the touch layer away from the protective layer side.
  • the projection of the first elastic material layer does not overlap with the projection of the pixel component.
  • the pixel assembly sequentially includes: a buffer layer, a circuit layer and a light emitting device; from the stress release layer to the side away from the protective layer
  • the light-emitting device sequentially includes: an anode layer, a light-emitting layer and a cathode layer; in the direction from the anode layer to the cathode layer, a pixel definition layer and a support layer are sequentially included between the anode layer and the cathode layer.
  • the part of the signal line is located on the side of the support layer away from the pixel definition layer; in the direction perpendicular to the plane where the display panel is located, the surface of the first elastic material layer on the side away from the protective layer and the support layer The distance between the surfaces on the side away from the pixel definition layer is smaller than the thickness of the support layer.
  • an electronic device including the above-mentioned display panel.
  • the stress release of the pixel components during the stretching process can be realized.
  • the first elastic material layer with a lower elastic modulus is filled in between, so the first elastic material layer can be filled after the components that require a higher temperature process in the pixel assembly are completed, thus avoiding the impact of the higher temperature process on the first Due to the adverse effect of the elastic material layer, the tensile deformation of the display panel is realized through the first elastic material layer. Therefore, in the display panel of the embodiment of the present application, while the display panel has stretchability, the device in the pixel component of the display panel can be manufactured at a relatively high process temperature, thus taking into account the stretchability and pixel Higher process temperature requirements for devices in assemblies.
  • FIG. 1 is a top view of a partial area of a display panel in an embodiment of the present application
  • Fig. 2 is a schematic diagram of a cross-sectional structure of AA' direction in Fig. 1;
  • FIG. 3 is a schematic structural diagram of a pixel component in FIG. 2;
  • FIG. 4 is a schematic diagram of a process flow of the display panel in FIG. 2;
  • Fig. 5 is another kind of sectional structure schematic diagram of AA ' direction in Fig. 1;
  • Fig. 6 is another kind of sectional structure schematic diagram of AA ' direction in Fig. 1;
  • FIG. 7 is a schematic diagram of a process flow of the display panel in FIG. 6;
  • Fig. 8 is another kind of sectional structure schematic diagram of AA' direction in Fig. 1;
  • FIG. 9 is a schematic diagram of a process flow of the display panel in FIG. 8 .
  • a stretchable display panel it is usually an "island" design for all functional layers in the display panel, that is, the functional components in the display panel are set into multiple independent components, and each component includes a driving device and light-emitting devices, each component is disposed on an elastic material with a lower elastic modulus, and the elastic material is integrally connected to achieve stretchability.
  • the performance of the device made by the Low Temperature Poly-Silicon (LTPS) process is relatively high.
  • the glass transition point of the elastic material is usually very low, and as the elongation increases, the elastic modulus is lower, and the glass transition point is also lower. Therefore, after making an elastic material with a lower elastic modulus, if the LTPS If the drive device is made by a high-tech process, the elastic material will be destroyed due to the high temperature. Therefore, the display panel in the related art cannot balance the stretchability and the high process temperature of the device.
  • the embodiment of the present application provides a display panel, including: a plurality of pixel components 10 arranged at intervals, each pixel component 10 includes a stacked circuit layer 11 and a light emitting device 12,
  • the circuit layer 11 may include components such as transistors to realize the control of the light emitting device 12, and the light emitting device 12 is used to emit light; the first elastic material layer 21, the first elastic material layer 21 is filled between any two adjacent pixel components 10 Between; the stress release layer 3 located on the side of the circuit layer 11 away from the light-emitting device 12, in the direction perpendicular to the plane where the display panel is located, the projection of the stress release layer 3 overlaps with the projection of each pixel component 10, the first elastic material
  • the elastic modulus of the layer 21 is smaller than the elastic modulus of the stress release layer 3, and the elastic modulus of the first elastic material layer 21 is smaller, that is, the stretchability is stronger.
  • the first elastic material located between different pixel components 10 Layer 21 can be used to realize the stretching characteristics of the overall display panel, and the stress release layer 3 is used to release the stress at the pixel component 10 during the stretching process of the display panel, so as to protect the pixel component 10 and reduce the stress of the pixel component 10.
  • a plurality of pixel components 10 include a first pixel component 101 and a second pixel component 102, and the first pixel component 101 and the second pixel component 102 are connected by a signal line 4, in order to realize Stretch performance, multiple pixel components 10 are arranged at intervals, therefore, in order to realize the electrical connection between each pixel component 10, stretchable signal lines 4 can be set between different pixel components 10, in the embodiment of the present application, Only the signal line 4 between the first pixel component 101 and the second pixel component 102 is used as an example for illustration. In fact, many pixel components 10 in the display panel may be electrically connected through signal lines.
  • the display panel includes An array of pixel components 10 arranged in the row direction and the column direction.
  • any two adjacent pixel components 10 are electrically connected through the signal line 4.
  • the signal line 4 In the row direction, any two adjacent pixel components 10 The electrical connection is realized through the signal line 4; the protective layer 5, in the direction perpendicular to the plane where the display panel is located, the projection of the protective layer 5 overlaps with the projection of each pixel component 10, and the projection of the protective layer 5 overlaps with the first
  • the projections of the elastic material layers 21 overlap; the first elastic material layer 21 is located between the protective layer 5 and the signal line 4, that is, the protective layer 5 is located at the bottom of the display panel, and is used to protect the entire display panel.
  • the display panel is defined to include a pixel component area A and a spacer area B.
  • the pixel component area A is used to make pixels
  • the area of the component 10 and the interval area B is the interval area between the pixel assembly areas A.
  • the manufacturing process of the display panel includes:
  • Step S101 fabricate the stress release layer 3 and at least part of the relevant film layers of the pixel assembly 10 on the glass substrate 6, specifically, fabricate the stress release layer 3, the circuit layer 11, the anode layer (Anode) 121, and the pixel definition on the glass substrate 6 in sequence Layer (Pixel Define Layer, PDL) 122 and support layer (Photo Spacer, PS) 123.
  • the circuit layer 11 includes, for example, a thin film transistor (Thin Film Transistor, TFT).
  • the TFT includes a semiconductor layer, an insulating layer, and a source electrode, a drain electrode, and a gate electrode. The specific structure of the TFT is not shown in the drawings.
  • the stress release layer 3 in the interval area B and related film layers of the pixel assembly 10 are etched away, and only the stress release layer 3 and the pixel assembly 10 in the pixel assembly area A remain.
  • the TFT can be manufactured through the LTPS process at a relatively high temperature, and the stress release layer 3 can withstand a relatively high process temperature.
  • Step S102 filling the first elastic material layer 21 in the interval area B, so that the interval area B serves as the main deformation area when the display panel is stretched.
  • Step S102 is performed after step S101, since the fabrication of the circuit layer 11 has been completed before this step, that is, the fabrication of the TFT requiring a higher temperature process has been completed, therefore, the first elastic modulus with a lower modulus of elasticity will not be affected.
  • the material layer 21 causes adverse effects.
  • Step S103 forming a signal line 4 on the first elastic material layer 21.
  • the signal line 4 can be stretchable metal, and a part of the signal line 4 is located in the pixel component area A, so as to facilitate connection with the conductive structure on the pixel component 10 , to realize the electrical connection between different pixel components 10 .
  • two pixel components 10 such as the first pixel component 101 and the second pixel component 102 , they can be connected by a plurality of signal lines 4 to realize the transmission of signals with different functions.
  • Step S104 fabricating the light emitting layer 124 and the cathode layer (Cathode) 125 in sequence.
  • the signal line 4 is connected to the circuit layer 11 in the first pixel component 101 and the circuit layer 11 in the second pixel component 102 to realize different pixel components.
  • the electrical connection between the circuit layers 11 in 10, the signal line 4 can be used to transmit data signals, scan signals or other functional signals required by the circuit layer 11, for example.
  • the signal line 4 is connected to the cathode layer 125 of the first pixel component 101 and the cathode layer 125 of the second pixel component 102 .
  • Step S105 making an encapsulation layer 7 in the pixel component area A, the encapsulation layer 7 is, for example, a thin film encapsulation layer (Thin Film Encapsulation, TFE), and then coating the second elastic material layer 22, so as to use the second elastic material layer 22 to reduce the pixel The height difference between the film layers between module area A and spacer area B.
  • TFE Thin Film Encapsulation
  • Step S106 peel off the film layers produced in steps S101-S105 from the glass substrate 6, and fabricate the stress release layer 3 on the side away from the pixel component 10 and the first elastic material layer 21 on the side away from the signal line 4
  • the touch layer 8 and the polarizer 9 are fabricated on the side of the encapsulation layer 7 and the second elastic material layer 22 away from the protective layer 5 .
  • the lift-off process may be a laser lift-off (Laser Lift-Off, LLO) process.
  • the encapsulation layer 7 has the function of blocking water and oxygen and has stretchability, which can reduce the probability of water and oxygen intruding into the pixel component 10 and realize the protection function of the display panel.
  • Both the polarizer 9 and the touch layer 8 have stretchability.
  • the stress release of the pixel components during the stretching process can be realized, and the pixel components spaced apart from each other can be filled with elasticity.
  • the first elastic material layer with a lower modulus so the first elastic material layer can be filled in after the components that require a higher temperature process in the pixel assembly are completed, thus avoiding the impact of the higher temperature process on the first elastic material layer
  • the adverse effects of the first elastic material layer are used to realize the tensile deformation of the display panel. Therefore, in the display panel of the embodiment of the present application, while the display panel has stretchability, the device in the pixel component of the display panel can be manufactured at a relatively high process temperature, thus taking into account the stretchability and pixel Higher process temperature requirements for devices in assemblies.
  • the first pixel component 101 includes a first signal line connection part 1011, the first signal line connection part 1011 is connected to the signal line 4, and the connection between the first signal line connection part 1011 and the signal line 4 is the first The connection part 41;
  • the second pixel component 102 includes a second signal line connection part 1021, the second signal line connection part 1021 is connected to the signal line 4, and the connection part between the second signal line connection part and the signal line is the second connection part 42;
  • the projection of the first elastic material layer 21 does not overlap with the projection of the first joint 41, and the projection of the first elastic material layer 21 does not overlap with the projection of the second joint 42.
  • both the first signal line connecting portion 1011 and the second signal line connecting portion 1021 are part of the circuit layer 11, because after the first elastic material layer 21 is fabricated Make the signal line 4, therefore, because the first elastic material layer 21 can not cover the first joint 41 and the second joint 42, therefore, when making the signal line 4, the first elastic material layer 21 will not be on the signal line. 4 and the connection between the two connecting parts cause adverse effects.
  • the structure shown in FIG. 2 in the structure shown in FIG. 2, both the first signal line connecting portion 1011 and the second signal line connecting portion 1021 are part of the circuit layer 11, because after the first elastic material layer 21 is fabricated Make the signal line 4, therefore, because the first elastic material layer 21 can not cover the first joint 41 and the second joint 42, therefore, when making the signal line 4, the first elastic material layer 21 will not be on the signal line. 4 and the connection between the two connecting parts cause adverse effects.
  • the structure shown in FIG. 2 in the structure shown in FIG.
  • both the first signal line connecting portion 1011 and the second signal line connecting portion 1021 are part of the cathode layer 125, since the first elastic material layer 21 will not cover the first connection 41 and the second connection 42, so when the cathode layer 125 is made, it will not have adverse effects on the connection between the signal line 4 and the two connection parts.
  • the projection of the stress release layer 3 covers the projection of each pixel component 10 , so that the stress release layer 3 can release the stress at each position of the pixel component 10 .
  • the projection of the stress release layer 3 does not overlap with the projection of the first elastic material layer 21.
  • the first elastic material layer 21 is filled in In addition to the spaces between the pixel components 10, the space between the stress release layers 3 is also filled, so that the display panel has better stretchability.
  • the strain of the pixel component region A is small, so the device performance of the pixel component 10 is maintained, and the spacer region B serves as the main strain region.
  • the stress release layer 3 includes a stress release portion 31 and a connection portion 32, the stress release portion 31 is located between each pixel component 10 and the protective layer 5, and the connection portion 32 is located at the first Between the elastic material layer 21 and the protective layer 5, that is, in the direction perpendicular to the plane where the display panel is located, the stress relief portion 31 overlaps the pixel component 10, and the connecting portion 32 overlaps the first elastic material layer 21, that is to say , the stress releasing portion 31 is located in the pixel component area A, and the connecting portion 32 is located in the interval area B.
  • the manufacturing process of the display panel includes:
  • Step S201 fabricating the stress release layer 3 and at least part of the relevant film layers of the pixel component 10 on the glass substrate 6 . Etch away the relevant film layers of the pixel component 10 in the interval area B, retain the stress release layer 3 in the interval area B, or etch and thin the stress release layer 3 in the interval area B, and the stress release layer 3 is located in the pixel assembly area A
  • the part of the stress releasing layer 3 is the stress releasing part 31
  • the part of the stress releasing layer 3 located in the interval area B is the connecting part 32 .
  • the thickness of the connecting portion 32 may be smaller than that of the stress releasing portion 31 .
  • the TFT can be manufactured through the LTPS process at a relatively high temperature, and the stress release layer 3 can withstand a relatively high process temperature.
  • Step S202 filling the first elastic material layer 21 in the interval area B, since the stress release layer 3 includes the connecting portion 32 located in the interval area B, the first elastic material layer 21 will be located on the surface of the connecting portion 32, if connected If the thickness of the part 32 is smaller than the thickness of the stress release part 31, the stress release layer 3 will form a groove in the interval area B, and the first elastic material layer 21 will fill into the groove and fill the film layer of each pixel component 10 between.
  • Step S203 forming the signal line 4 on the first elastic material layer 21 .
  • Step S204 fabricating the light emitting layer 124 and the cathode layer 125 in sequence.
  • Step S205 making the encapsulation layer 7 in the pixel component area A, and then coating the second elastic material layer 22 .
  • Step S206 peeling off the film layers produced in steps S201 to S205 from the glass substrate 6 , and fabricating the protective layer 5 , the touch layer 8 and the polarizer 9 .
  • part of the stress release layer 3 is reserved in the spacer region B, so as to meet the requirement of stretchability and the stability of the device in the pixel component 10 .
  • the thickness of the connecting portion 32 can be adjusted according to the requirement of stretchability of the display panel. Since the stress release layer 3 occupies a larger area, in the process of peeling off the film layer produced in steps S201 to S205 from the glass substrate 6, the strength of the film layer of the overall display panel can be improved, and the stress caused by the film layer can be reduced. The softness will cause deformation during the peeling process and the probability of damaging the TFT or light emitting device in the pixel assembly 10; in addition, it can also reduce the probability of water and oxygen entering the pixel assembly 10 through the first elastic material layer 21.
  • the thickness of the connecting portion 32 is smaller than that of the stress releasing portion 31 , and on the premise of increasing the area of the stress releasing layer 3 , the connecting portion 32 is more conducive to stretching.
  • the projection of the connection portion 32 covers the projection of the first elastic material layer 21 to improve the protection and support effect of the connection portion 32 on the first elastic material layer 21 .
  • a first hollow area 100 is disposed on the connecting portion 32 , and the first elastic material layer 21 fills the first hollow area 100 .
  • the manufacturing process of the display panel includes:
  • Step S301 fabricating the stress release layer 3 and at least part of the relevant film layers of the pixel component 10 on the glass substrate 6 . Etch away the relevant film layers of the pixel component 10 in the interval area B, etch away the stress release layer 3 in the interval area B and form the first hollow area 100 by etching.
  • the portion of the stress release layer 3 located in the pixel component area A is the stress release portion 31
  • the portion of the stress release layer 3 located in the interval area B is the connection portion 32 .
  • the thickness of the connecting portion 32 may be smaller than that of the stress releasing portion 31 .
  • the TFT can be manufactured through the LTPS process at a relatively high temperature, and the stress release layer 3 can withstand a relatively high process temperature.
  • Step S302 filling the space area B with the first elastic material layer 21, since the stress release layer 3 includes the connection part 32 located in the space area B, and the connection part 32 is provided with the first hollow area 100, therefore, the first elastic material
  • the layer 21 is located on the surface of the connecting portion 32 and fills the first hollow area 100 .
  • Step S303 forming the signal line 4 on the first elastic material layer 21 .
  • Step S304 fabricating the light emitting layer 124 and the cathode layer 125 in sequence.
  • Step S305 making the encapsulation layer 7 in the pixel component area A, and then coating the second elastic material layer 22 .
  • Step S306 peeling off the film layers produced in steps S201 to S205 from the glass substrate 6 , and fabricating the protective layer 5 , the touch layer 8 and the polarizer 9 .
  • part of the stress release layer 3 is reserved in the spacer region B, so as to meet the requirement of stretchability and the stability of the device in the pixel component 10 .
  • the thickness and area of the connecting portion 32 can be adjusted according to the requirement of stretchability of the display panel. Since the stress release layer 3 occupies a larger area, in the process of peeling off the film layer produced in steps S301 to S305 from the glass substrate 6, the strength of the film layer of the overall display panel can be improved, and the stress caused by the film layer can be reduced. The softness will cause deformation during the peeling process and damage the TFT or light-emitting device in the pixel assembly 10; in addition, by setting the first hollow area 100 on the connection part 32, the tensile performance of the connection part 32 can be further improved.
  • the display panel further includes: a second elastic material layer 22, the elastic modulus of the second elastic material layer 22 is smaller than the elastic modulus of the stress release layer 3, and the second elastic material layer 22 It is located on the side away from the protective layer 5 of the signal line 4 and the first elastic material layer 21 .
  • the second elastic material layer 22 can realize the protection of the signal line 4 on the other side of the signal line 4 and realize the stretching function of the interval area B at the same time.
  • the display panel further includes: an encapsulation layer 7, the encapsulation layer 7 is located on the side of each pixel component 10 away from the stress release layer 3, the encapsulation layer 7 is provided with a second hollow area 200, the second elastic material layer 22 is filled in the second hollow area 200 .
  • the encapsulation layer 7 is composed of inorganic and organic stacked layers or inorganic layers, and is used to protect the light emitting device 12 from being damaged by moisture and air.
  • the encapsulation layer 7 is used to encapsulate the independent pixel components 10, since the encapsulation layer 7 is only located in the pixel component area A, but not in the interval area B, to reduce the adverse effect of the encapsulation layer 7 on the tensile performance, but the encapsulation layer 7 and There is a height difference between the first elastic material layer 21 and the signal line 4, therefore, the second elastic material layer 22 can be filled in the second hollow area 200 formed by the packaging layer 7 to reduce the height difference of the packaging layer 7 , so as to facilitate the fabrication of subsequent film layers.
  • the display panel further includes: a touch layer 8, the touch layer 8 is located on the side of the encapsulation layer 7 and the second elastic material layer 22 away from the protective layer 5; a polarizer 9, the polarizer 9 is located on the touch layer 8 away from the side of the protective layer 5 .
  • the polarizer 9 has the effect of stretching and reducing the reflectivity to reduce the adverse effect of reflected light on the display. It is not limited to the manufacturing process, for example, it can adopt the external mounting process or the embedded (On-Cell) process.
  • the touch layer 8 has a stretching property and a touch function, and is not limited to a manufacturing process, for example, an externally mounted process or an embedded (On-Cell) process may be used.
  • the projection of the first elastic material layer 21 does not overlap with the projection of the pixel component 10 . In this way, since the first elastic material layer 21 does not cover the position of the pixel component 10 during the process of manufacturing the light-emitting layer 124 through the evaporation process, it will not adversely affect the alignment accuracy in the evaporation process.
  • the pixel assembly 10 in the direction from the stress release layer 3 to the side away from the protective layer 5, includes in sequence: a buffer layer 13, a circuit layer 11 and a light emitting device 12; from the stress release layer 3 to the side away from the protective layer
  • the light emitting device 12 includes in turn: an anode layer 121, a light emitting layer 124 and a cathode layer 125; in the direction from the anode layer 121 to the cathode layer 125, between the anode layer 121 and the cathode layer 125 It includes a pixel definition layer 122 and a support layer 123 .
  • the buffer layer 13 is used as a buffer substrate for preparing the circuit layer 11 .
  • the circuit layer 11 is used to realize the control of the light emitting device 12, and the circuit layer 11 may include devices such as TFT or microchip (such as Micro IC).
  • the light emitting device 12 may specifically be an organic light emitting diode (Organic Light Emitting Diode, OLED) or a light emitting diode (Light Emitting Diode, LED).
  • the part of the signal line 4 is located on the side of the supporting layer 123 away from the pixel definition layer 122; in the direction perpendicular to the plane where the display panel is located, the surface of the first elastic material layer 21 on the side away from the protective layer 5 is in contact with
  • the distance between the surfaces of the support layer 123 away from the pixel definition layer 122 is smaller than the thickness of the support layer 123 . That is to say, for example, in FIGS. 2 , 4 to 9 , the distance between the upper surface of the first elastic material layer 21 and the upper surface of the supporting layer 123 is smaller than the thickness of the supporting layer 123 .
  • the first elastic material layer 21 needs to be provided.
  • the height difference between the surface and the surface of the support layer 123 is relatively small, which facilitates the manufacture of the signal line 4 and reduces the probability of disconnection of the signal line 4 .
  • An embodiment of the present application further provides an electronic device, including the display panel in any of the foregoing embodiments.
  • the specific structure and principle of the display panel are the same as those of the above-mentioned embodiments, and will not be repeated here.
  • the electronic device may be any type of display device such as a wearable device.
  • "at least one” means one or more, and “multiple” means two or more.
  • “And/or” describes the association relationship of associated objects, indicating that there may be three kinds of relationships, for example, A and/or B may indicate that A exists alone, A and B exist simultaneously, or B exists alone. Among them, A and B can be singular or plural.
  • the character “/” generally indicates that the contextual objects are an “or” relationship.
  • “At least one of the following” and similar expressions refer to any combination of these items, including any combination of single items or plural items.
  • At least one of a, b, and c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, and c may be single or multiple.

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Abstract

Des modes de réalisation de la présente invention concernent un écran d'affichage et un dispositif électronique, se rapportant au domaine technique de l'affichage. L'écran d'affichage peut avoir des propriétés de traction, et des dispositifs dans l'écran d'affichage peuvent être préparés à une température de traitement supérieure. L'écran d'affichage comprend : une pluralité d'ensembles de pixels agencés à des intervalles, chaque ensemble de pixels comprenant une couche de circuit et un dispositif électroluminescent qui sont agencés dans un mode empilé ; une première couche de matériau élastique, qui est remplie entre deux ensembles de pixels adjacents quelconques ; une couche de libération de contrainte, dont une projection chevauche une projection de chaque ensemble de pixels, le module élastique de la première couche de matériau élastique étant inférieur à celui de la couche de libération de contrainte ; et une couche de protection, dans une direction perpendiculaire au plan où se trouve l'écran d'affichage, la projection de la couche de protection chevauchant la projection de chaque ensemble de pixels, et la projection de la couche de protection chevauchant la projection de la première couche de matériau élastique. La première couche de matériau élastique est située entre la couche de protection et une ligne de signal.
PCT/CN2023/070729 2022-02-16 2023-01-05 Écran d'affichage et dispositif électronique WO2023155634A1 (fr)

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Application Number Priority Date Filing Date Title
CN202220318786.1U CN217767406U (zh) 2022-02-16 2022-02-16 显示面板和电子设备
CN202220318786.1 2022-02-16

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WO2023155634A1 true WO2023155634A1 (fr) 2023-08-24

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