WO2023145593A1 - 光回路基板 - Google Patents

光回路基板 Download PDF

Info

Publication number
WO2023145593A1
WO2023145593A1 PCT/JP2023/001463 JP2023001463W WO2023145593A1 WO 2023145593 A1 WO2023145593 A1 WO 2023145593A1 JP 2023001463 W JP2023001463 W JP 2023001463W WO 2023145593 A1 WO2023145593 A1 WO 2023145593A1
Authority
WO
WIPO (PCT)
Prior art keywords
face
optical
core
circuit board
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/001463
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
晃史 相良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to CN202380019026.8A priority Critical patent/CN118633046A/zh
Priority to US18/832,153 priority patent/US20250155636A1/en
Priority to KR1020247025546A priority patent/KR20240129197A/ko
Priority to JP2023576845A priority patent/JP7818626B2/ja
Publication of WO2023145593A1 publication Critical patent/WO2023145593A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Definitions

  • the present disclosure relates to an optical circuit board and an optical component mounting structure using the same.
  • optical fibers that can transmit large amounts of data at high speed have been used for information communication.
  • Optical signals are transmitted and received between this optical fiber and an optical component (silicon photonics device).
  • An optical fiber and an optical component are connected via an optical waveguide as described in Patent Documents 1 and 2, for example.
  • An optical circuit board includes a wiring board having an upper surface including a mounting area for optical components, and an optical waveguide located on the wiring board.
  • the optical waveguide is positioned adjacent to the mounting area and includes a lower clad, a core and an upper clad from the upper surface side of the wiring substrate.
  • the optical waveguide has a first end face facing the mounting region, and a second end face including the end face of the lower clad, the end face of the core and the end face of the upper clad in the same plane and located on the opposite side of the first end face.
  • the second end face at least a part of the end face of the lower clad and the end face of the upper clad have protrusions that protrude beyond the end face of the core.
  • An optical component mounting structure includes the above-described optical circuit board and an optical component located in the mounting area and having an optical transmission path, and includes an end surface of the core at the first end surface and an optical transmission line. It faces the end face of the road.
  • FIG. 1 is a plan view showing an optical component mounting structure in which optical components and electronic components are mounted on an optical circuit board according to an embodiment of the present disclosure
  • FIG. 2 is an enlarged explanatory view for explaining a cross section of a region X shown in FIG. 1
  • FIG. FIG. 3 is an enlarged explanatory view for explaining an example of a cross section of a region Y shown in FIG. 2
  • 3 is an enlarged explanatory view for explaining another example of the cross section of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining an example in which the second end face of the optical waveguide has a curved shape in the cross section of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining that the conductor layer has the largest thickness at the second end surface of the optical waveguide in the cross section of the region Y shown in FIG. 2;
  • FIG. 2 is an enlarged explanatory view for explaining a cross section of a region X shown in
  • the optical circuit board according to the present disclosure as described above, at least a part of the end face of the lower clad and the end face of the upper clad have protrusions that protrude beyond the end face of the core. As a result, according to the optical circuit board according to the present disclosure, it is possible to reduce the risk of damaging the end surface of the optical waveguide, and reduce the transmission loss of the optical signal.
  • FIG. 1 is a plan view showing an optical component mounting structure 10 in which an optical component 4 is mounted on an optical circuit board 1 according to an embodiment of the present disclosure.
  • An optical circuit board 1 includes a wiring board 2 and an optical waveguide 3.
  • a wiring board 2 included in the optical circuit board 1 according to one embodiment, a wiring board generally used for an optical circuit board can be used.
  • such a wiring board 2 includes, for example, a core board and buildup layers laminated on both sides of the core board.
  • the core substrate is not particularly limited as long as it is an insulating material. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • the core substrate usually has through-hole conductors for electrically connecting the upper and lower surfaces of the core substrate.
  • the core substrate may contain a reinforcing material.
  • reinforcing materials include insulating cloth materials such as glass fibers, glass nonwoven fabrics, aramid nonwoven fabrics, aramid fibers, and polyester fibers. Two or more reinforcing materials may be used in combination.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the core substrate.
  • the buildup layer has a structure in which insulating layers and conductor layers are alternately laminated.
  • a part of the conductor layer positioned on the outermost surface (the conductor layer positioned on the upper surface of the wiring board 2) includes a conductor layer 21a on which the optical waveguide 3 is positioned.
  • the conductor layer 21a is made of metal such as copper.
  • the insulating layer included in the buildup layer is not particularly limited as long as it is an insulating material, like the core substrate. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • each insulating layer may be made of the same resin or different resins.
  • the insulating layer and the core substrate included in the buildup layer may be made of the same resin or different resins.
  • the buildup layers usually have via-hole conductors for electrically connecting the layers.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the insulating layer included in the buildup layer.
  • the optical waveguide 3 included in the optical circuit board 1 is located on the surface of the conductor layer 21 a present on the surface of the wiring board 2 .
  • FIG. 2 is an enlarged explanatory view explaining a cross section of the region X shown in FIG.
  • the optical waveguide 3 has a structure in which a lower clad 31, an optical waveguide core 32 and an upper clad 33 are laminated in this order from the conductor layer 21a side.
  • the lower clad 31 included in the optical waveguide 3 is located on the surface of the wiring substrate 2, specifically, on the surface of the conductor layer 21a present on the surface of the optical waveguide formation region of the wiring substrate 2.
  • the material forming the lower clad 31 is not limited, and examples thereof include resins such as epoxy resin and silicon resin.
  • the upper clad 33 included in the optical waveguide 3 is also made of resin such as epoxy resin or silicone resin.
  • the lower clad 31 and the upper clad 33 may be made of the same material or different materials.
  • the lower clad 31 and the upper clad 33 may have the same thickness or different thicknesses.
  • the lower clad 31 and the upper clad 33 each have a thickness of approximately 5 ⁇ m or more and 150 ⁇ m or less, for example.
  • the optical waveguide core 32 included in the optical waveguide 3 is a portion through which light entering the optical waveguide 3 propagates.
  • the side surface of the optical transmission line 41 included in the optical component 4 mounted in the mounting area of the wiring board 2 and the side surface of the optical waveguide core 32 of the optical waveguide 3 are positioned to face each other.
  • the side surface of the optical waveguide 3 including the side surface of the optical waveguide core 32 facing the mounting area (optical component 4) of the wiring board 2 is defined as a first end surface 3a.
  • Optical signals are transmitted and received between the optical waveguide core 32 and the optical transmission line 41 on the first end face 3a.
  • the material forming the optical waveguide core 32 is not limited, and is appropriately set in consideration of, for example, light transmittance and wavelength characteristics of propagating light. Examples of materials include resins such as epoxy resins and silicone resins.
  • the optical waveguide core 32 has a thickness of, for example, about 3 ⁇ m or more and 50 ⁇ m or less.
  • the side surface opposite to the first end face 3a is the second end face 3b, which includes the end face of the lower clad 31, the end face of the optical waveguide core 32, and the end face of the upper clad 33 in the same plane.
  • the side surface of the optical waveguide 3 facing the optical connector 5a is the second end surface 3b.
  • the second end surface 3b may have a curved surface portion 11 including the end surface of the lower clad 31, the end surface of the optical waveguide core 32 and the end surface of the upper clad 33 in the same plane. .
  • the curved surface portion 11 refers to, for example, an arch shape in cross section in which the end surface of the lower clad 31, the end surface of the optical waveguide core 32, and the end surface of the upper clad 33 are in contact with each other continuously without steps. At this time, the top of the arch shape is located on the side opposite to the optical connector 5a. Having such a curved surface portion 11 is advantageous in that damage to the end face of the optical waveguide core 32 can be reduced.
  • the second end surface 3b of the optical waveguide 3 is formed on a portion of the end surface of the lower clad 31 and protrudes from the end surface of the optical waveguide core 32.
  • a portion 34 is provided.
  • FIG. 3 is an enlarged explanatory view for explaining an example of a cross section of the region Y shown in FIG.
  • the optical circuit board 1 reduces the risk of scratching the end surface of the optical waveguide 3 (the second end surface 3b, especially the end surface of the optical waveguide core 32) by having such a protruding portion 34. It is possible to reduce the transmission loss of the optical signal.
  • the protruding portion 34 positioned on the end surface of the lower clad 31 may be referred to as a first protruding portion 341 .
  • the projecting portion 34 (first projecting portion 341) is made of the same material as the lower clad 31, for example, and may be molded integrally with the lower clad 31.
  • the first projecting portion 341 may be positioned below the intermediate portion (wiring board 2 side) in the thickness direction of the lower clad 31, and directly above the conductor layer 21a (lowermost portion of the lower clad 31). may be located. By positioning the first projecting portion 341 at such a location, the first projecting portion 341 is supported and reinforced by the relatively strong conductor layer 21a. When the first protruding portion 341 is positioned directly above the conductor layer 21a (at the lowest part of the lower clad 31), the support effect of the conductor layer 21a becomes greater.
  • the transmission of the optical signal is less likely to be hindered, and the second end surface of the optical waveguide 3 (in particular, the optical waveguide core 32) edge) can be protected.
  • the length of the protrusion 34 that is, the length L1 from the end surface of the optical waveguide core 32 to the tip of the protrusion 34 may be, for example, 1 ⁇ m or more and 3.5 ⁇ m or less. In the case of one protrusion 341, for example, it may be 1.2 ⁇ m or more and 3.3 ⁇ m or less.
  • the end face of the conductor layer 21a may be located directly below the second end face 3b of the optical waveguide 3. Further, for example, as shown in FIG. 3, the conductor layer end face is located between the end face of the optical waveguide core 32 and the tip of the projection 34 in the direction S in which the projection 34 shown in FIG. may These may be appropriately set in consideration of the connectability with the optical connector 5a.
  • the “tip of the projecting portion 34 ” means the tip of the projecting portion 34 that is the longest from the end face of the optical waveguide core 32 to the tip of the projecting portion 34 .
  • the thickness L3 of the conductor layer 21a may be the largest at the conductor layer end surface.
  • the length from the end surface of the optical waveguide core 32 to the conductor layer end surface may be, for example, 0.7 ⁇ m or more and 2 ⁇ m or less.
  • the protruding portion 34 need not be positioned only on the end face of the lower clad 31 as shown in FIG. 3, but may be positioned only on the end face of the upper clad 33. 31 and the end surface of the upper clad 33 .
  • FIG. 4 is an enlarged explanatory view for explaining another example of the cross section of the region Y shown in FIG. As shown in FIG. 4 , the protrusion 34 located on the end surface of the upper clad 33 is referred to as a second protrusion 342 .
  • the second projecting portion 342 is preferably positioned above the end surface of the upper clad 33 , and for example, the second projecting portion 342 may be positioned continuously on the upper surface of the upper clad 33 .
  • “The second protrusion is positioned continuously on the upper surface of the upper clad” means that the upper portion of the base of the second protrusion 342 is substantially flush with the upper surface of the upper clad 33 .
  • the length L2 from the end surface of the optical waveguide core 32 to the tip of the second projecting portion 342 may be, for example, 1 ⁇ m or more and 3.5 ⁇ m or less.
  • the second protruding portion 342 has such a length, it is possible to sufficiently protect the second end surface of the optical waveguide 3 (in particular, the end surface of the optical waveguide core 32), and to prevent transmission of optical signals. Efficiency can be fully demonstrated.
  • the length L2 of the second protrusion 342 may be longer than the length L1 of the first protrusion 341 (the length from the end face of the optical waveguide core 32 to the tip of the second protrusion 342).
  • Such a configuration can further reduce the possibility that the end surface of the optical waveguide 3 is damaged.
  • solder resist may be partially located on the surface of the wiring board 2 .
  • the solder resist is made of a resin such as an acrylic-modified epoxy resin.
  • the end face (substrate end face) of the wiring board 2 may be located between the second end face 3b of the optical waveguide core 32 and the tip of the projection 34 in the direction in which the projection 34 projects.
  • the "tip of the protrusion 34" means the tip of the protrusion 34 that is the longest from the end surface of the optical waveguide core 32 to the tip of the protrusion 34, as described above.
  • the wiring board 2 is prepared.
  • the wiring board 2 has a mounting area for the optical component 4 and an optical waveguide forming area adjacent to each other on its upper surface.
  • the optical waveguide formation region of the wiring board 2 includes a conductor layer 21a which is a part of the conductor layer located on the outermost surface (the conductor layer located on the upper surface of the wiring board 2).
  • the mounting area of the wiring board 2 includes pads 21b that are part of the conductor layer located on the outermost surface.
  • the conductor layer 21a and the pads 21b are made of metal such as copper.
  • a lower clad 31 is formed in the optical waveguide formation region. Specifically, a resin layer made of resin such as epoxy resin or silicon resin is laminated so as to cover the optical waveguide formation region. Then, it is exposed and developed to form the lower clad 31 .
  • an optical waveguide core 32 is formed along the upper surface of the lower clad 31 .
  • the optical waveguide core 32 is formed into a predetermined shape by applying or adhering epoxy resin, silicon resin, or the like to the lower clad 31 as described above, followed by exposure and development.
  • an upper clad 33 covering the upper surface of the lower clad 31 and the optical waveguide core 32 is formed.
  • the upper clad 33 is also formed by exposing and developing a resin such as epoxy resin or silicon resin.
  • the lower clad 31 and the upper clad 33 may be made of the same material or different materials.
  • the lower clad 31 and the upper clad 33 may have the same thickness or different thicknesses.
  • both end surfaces of the lower clad 31, the optical waveguide core 32 and the upper clad 33 are cut by, for example, a dicer to form the first end surface 3a and the second end surface 3b.
  • Compressive stress is applied to the positions where the projections 34 are to be formed when cutting with a dicer.
  • a dicing blade may be used to roll up the conductor layer 21a to apply compressive stress.
  • a compressive stress may be applied when the dicing blade is brought into contact.
  • the accumulated compressive stress is released, a part of at least one of the lower clad 31 and the upper clad 33 protrudes, and the protruding portion 34 (at least one of the first protruding portion 341 and the second protruding portion 341 ) is formed.
  • the heat treatment may be performed, for example, at 120° C. or higher and 160° C. or lower for 30 minutes or longer and 60 minutes or shorter.
  • An optical component mounting structure 10 according to an embodiment of the present disclosure, as shown in FIG. 1, has a structure in which optical components 4 and electronic components 6 are mounted on an optical circuit board 1 according to an embodiment.
  • An optical component 4 mounted on the optical component mounting structure 10 includes an optical transmission line 41 .
  • Examples of the optical component 4 including such an optical transmission line 41 include a silicon photonics device.
  • Examples of the electronic component 6 include an ASIC (Application Specific Integrated Circuit) and a driver IC.
  • the optical component 4 is electrically connected to the pad 21b located in the mounting area of the optical component 4 on the wiring board 2 via the solder 7.
  • Pads 21 b are part of a conductor layer located on the upper surface of wiring board 2 .
  • a silicon photonics device will be described as an example of the optical component 4 .
  • a silicon photonics device is, for example, one type of optical component having an optical transmission line 41 with a core made of silicon (Si) and a clad made of silicon dioxide (SiO 2 ).
  • the silicon photonics device includes a Si waveguide as the optical transmission line 41, and further includes a passivation film, a light source section, a light detection section, and the like (not shown).
  • the optical transmission line 41 (Si waveguide 41 ) is positioned at one end of the optical waveguide 3 so as to face the optical waveguide core 32 included in the optical waveguide 3 .
  • an electrical signal from the wiring board 2 is propagated through the solder 7 to the light source included in the optical component 4 (silicon photonics device).
  • the light source unit that receives the propagated electrical signal emits light.
  • the emitted optical signal is propagated through the optical transmission line 41 (Si waveguide 41) and the optical waveguide core 32 to the optical fiber 5 connected through the optical connector 5a.
  • the optical component mounting structure 10 in the second end surface 3b of the optical waveguide 3 included in the optical circuit board 1, at least a part of the end surface of the lower clad 31 and the end surface of the upper clad 33 is a light guide. It has a protrusion 34 that protrudes from the end face of the wave path core 32 . Therefore, the second end surface 3b of the optical waveguide 3 (in particular, the end surface of the optical waveguide core 32) is less likely to be damaged. As a result, the optical component mounting structure 10 according to one embodiment can reduce transmission loss of optical signals.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/JP2023/001463 2022-01-31 2023-01-19 光回路基板 Ceased WO2023145593A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202380019026.8A CN118633046A (zh) 2022-01-31 2023-01-19 光电路基板
US18/832,153 US20250155636A1 (en) 2022-01-31 2023-01-19 Optical circuit board
KR1020247025546A KR20240129197A (ko) 2022-01-31 2023-01-19 광회로 기판
JP2023576845A JP7818626B2 (ja) 2022-01-31 2023-01-19 光回路基板および光学部品実装構造体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-013040 2022-01-31
JP2022013040 2022-01-31

Publications (1)

Publication Number Publication Date
WO2023145593A1 true WO2023145593A1 (ja) 2023-08-03

Family

ID=87471786

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/001463 Ceased WO2023145593A1 (ja) 2022-01-31 2023-01-19 光回路基板

Country Status (6)

Country Link
US (1) US20250155636A1 (https=)
JP (1) JP7818626B2 (https=)
KR (1) KR20240129197A (https=)
CN (1) CN118633046A (https=)
TW (1) TWI866040B (https=)
WO (1) WO2023145593A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025186328A1 (en) * 2024-03-08 2025-09-12 Ams-Osram International Gmbh Optoelectronic component and method of manufacturing an optoelectronic component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095586A (ja) * 1995-06-26 1997-01-10 Fujitsu Ltd 光学装置
JP2007310363A (ja) * 2006-04-21 2007-11-29 Fujifilm Corp 光デバイス
JP2009086238A (ja) * 2007-09-28 2009-04-23 Nec Corp 平面光波回路及びその製造方法並びに光導波路デバイス
JP2011247945A (ja) * 2010-05-24 2011-12-08 Nitto Denko Corp 光接続構造およびこれに用いる光導波路の製法
US20110317961A1 (en) * 2010-06-29 2011-12-29 Juniper Networks, Inc. Fixed attenuation air gap interface for a multimode optical fiber interconnection
JP2017134228A (ja) * 2016-01-27 2017-08-03 日本電信電話株式会社 光導波路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001330762A (ja) 2000-05-24 2001-11-30 Oki Electric Ind Co Ltd 光モジュール
JP5608125B2 (ja) * 2011-03-29 2014-10-15 日東電工株式会社 光電気混載基板およびその製法
FR2974413B1 (fr) * 2011-04-21 2014-06-13 Commissariat Energie Atomique Detecteur de gaz photoacoustique a cellule de helmholtz
JP2014238491A (ja) * 2013-06-07 2014-12-18 日東電工株式会社 光電気混載モジュール
KR101744281B1 (ko) * 2015-02-13 2017-06-08 주식회사 우리로 광도파로 내부에 광경로 전환용 마이크로 거울을 내장한 광집적회로 및 그 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095586A (ja) * 1995-06-26 1997-01-10 Fujitsu Ltd 光学装置
JP2007310363A (ja) * 2006-04-21 2007-11-29 Fujifilm Corp 光デバイス
JP2009086238A (ja) * 2007-09-28 2009-04-23 Nec Corp 平面光波回路及びその製造方法並びに光導波路デバイス
JP2011247945A (ja) * 2010-05-24 2011-12-08 Nitto Denko Corp 光接続構造およびこれに用いる光導波路の製法
US20110317961A1 (en) * 2010-06-29 2011-12-29 Juniper Networks, Inc. Fixed attenuation air gap interface for a multimode optical fiber interconnection
JP2017134228A (ja) * 2016-01-27 2017-08-03 日本電信電話株式会社 光導波路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025186328A1 (en) * 2024-03-08 2025-09-12 Ams-Osram International Gmbh Optoelectronic component and method of manufacturing an optoelectronic component

Also Published As

Publication number Publication date
CN118633046A (zh) 2024-09-10
TWI866040B (zh) 2024-12-11
JPWO2023145593A1 (https=) 2023-08-03
US20250155636A1 (en) 2025-05-15
JP7818626B2 (ja) 2026-02-20
TW202346929A (zh) 2023-12-01
KR20240129197A (ko) 2024-08-27

Similar Documents

Publication Publication Date Title
US20240168226A1 (en) Optical circuit board and optical component mounting structure using same
CN114127601B (zh) 光电路基板以及使用了该光电路基板的电子部件安装构造体
JP2002006161A (ja) 光配線基板および光配線モジュール並びにそれらの製造方法
JP7818626B2 (ja) 光回路基板および光学部品実装構造体
JP7744501B2 (ja) 光回路基板
US20230408777A1 (en) Optical circuit board and electronic component mounting structure using same
US12481109B2 (en) Optical circuit board and electronic component mounting structure using the same
JP7710784B2 (ja) 光回路基板および光学部品実装構造体
TWI876309B (zh) 光迴路基板
WO2025182787A1 (ja) 光回路基板および実装構造体
TWI828314B (zh) 光迴路基板及使用該光迴路基板的光學零件安裝構造體
TWI917915B (zh) 光迴路基板及安裝構造體
WO2025205531A1 (ja) 光回路基板および実装構造体
WO2025206001A1 (ja) 光回路基板および実装構造体
WO2024204111A1 (ja) 光回路基板および実装構造体
WO2024143134A1 (ja) 光回路基板、光学部品実装構造体および光回路基板の製造方法
WO2024117023A1 (ja) 光回路基板、光学部品実装構造体および光回路基板の製造方法
WO2025183093A1 (ja) 光回路基板および実装構造体
WO2023095768A1 (ja) 光回路基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23746806

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202380019026.8

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 20247025546

Country of ref document: KR

Kind code of ref document: A

Ref document number: 2023576845

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 23746806

Country of ref document: EP

Kind code of ref document: A1

WWP Wipo information: published in national office

Ref document number: 18832153

Country of ref document: US