WO2023145537A1 - Ensemble de composition de résine photosensible, guide d'ondes optique et son procédé de production, carte hybride photoélectrique, ensemble de feuilles, composition de résine pour noyaux, composition de résine pour gaines, et feuille de résine - Google Patents

Ensemble de composition de résine photosensible, guide d'ondes optique et son procédé de production, carte hybride photoélectrique, ensemble de feuilles, composition de résine pour noyaux, composition de résine pour gaines, et feuille de résine Download PDF

Info

Publication number
WO2023145537A1
WO2023145537A1 PCT/JP2023/001168 JP2023001168W WO2023145537A1 WO 2023145537 A1 WO2023145537 A1 WO 2023145537A1 JP 2023001168 W JP2023001168 W JP 2023001168W WO 2023145537 A1 WO2023145537 A1 WO 2023145537A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
core
layer
clad
resin
Prior art date
Application number
PCT/JP2023/001168
Other languages
English (en)
Japanese (ja)
Inventor
成弘 唐川
祐一 中原
恵 山田
洋 海塩
Original Assignee
味の素株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 味の素株式会社 filed Critical 味の素株式会社
Publication of WO2023145537A1 publication Critical patent/WO2023145537A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Definitions

  • the present invention relates to a photosensitive resin composition set, an optical waveguide and its manufacturing method, an opto-electric hybrid board, a sheet set, a core resin composition, a clad resin composition, and a resin sheet.
  • JP 2019-211540 A Japanese Patent No. 5771978
  • Silicon photonics is highly compatible with conventional LSI manufacturing processes. Therefore, by utilizing silicon photonics, it is expected that it will be possible to form nanometer-sized thin wire waveguides at low cost based on the technology cultivated in electronic circuit integration technology.
  • an optical integrated circuit will be formed on a chip using a thin wire waveguide.
  • an optical waveguide is provided in the opto-electric hybrid board in order to take out signal light from the thin wire waveguide in the chip to the outside of the chip and connect it to wiring between chips. is required.
  • an optical waveguide formed using a conventional photosensitive resin composition has a large transmission loss.
  • the present invention has been invented in view of the above problems, and includes a photosensitive resin composition set capable of producing an optical waveguide with small transmission loss; an optical waveguide capable of reducing transmission loss and a method for producing the same; It is an object of the present invention to provide an opto-electric hybrid board, a sheet set, a core resin composition, a clad resin composition, and a resin sheet capable of forming an optical waveguide with low transmission loss.
  • the present inventors have made extensive studies to solve the above problems. As a result, the present inventors found that a core resin composition containing (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent, (a) a phenolic resin, (b) a photoacid generator and (c) In combination with a cladding resin composition containing a cross-linking agent, the inventors have found that light transmission loss can be suppressed when an optical waveguide having a numerical aperture NA within a specific range is produced, and have completed the present invention. . That is, the present invention includes the following.
  • a photosensitive resin composition set including a core resin composition and a clad resin composition;
  • the core resin composition comprises (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent;
  • the cladding resin composition contains (a) a phenolic resin, (b) a photoacid generator, and (c) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • R e1 and R e2 combine to form a ring; is also good.
  • [5] The photosensitive resin composition set according to any one of [1] to [4], which is a photosensitive resin composition set for manufacturing an optical waveguide.
  • the photosensitive resin composition set according to any one of [1] to [6] which is a photosensitive resin composition set for manufacturing a single-mode optical waveguide.
  • An optical waveguide comprising a core layer and a clad layer;
  • the core layer comprises a cured product of a core resin composition containing (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent;
  • the cladding layer comprises a cured product of a cladding resin composition containing (a) a phenolic resin, (b) a photoacid generator and (c) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • the core resin composition comprises (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent;
  • the cladding resin composition contains (a) a phenolic resin, (b) a photoacid generator, and (c) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • a sheet set including a core resin sheet and a clad resin sheet The core resin sheet comprises a core resin composition layer containing a core resin composition containing (A) a phenol resin, (B) a photoacid generator, and (C) a cross-linking agent
  • the clad resin sheet comprises a clad resin composition layer containing a clad resin composition containing (a) a phenol resin, (b) a photoacid generator and (c) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • the core resin composition comprises (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • the cladding resin composition contains (a) a phenolic resin, (b) a photoacid generator, and (c) a cross-linking agent;
  • n core represents the refractive index of the cured product of the core resin composition
  • n clad represents the refractive index of the cured product of the clad resin composition.
  • a resin sheet comprising a resin composition layer containing the clad resin composition of [16].
  • a photosensitive resin composition set capable of producing an optical waveguide with small transmission loss; an optical waveguide capable of reducing transmission loss and a method for producing the same; an opto-electric hybrid board comprising the optical waveguide;
  • a sheet set capable of forming a small optical waveguide, a core resin composition, a clad resin composition, and a resin sheet can be provided.
  • FIG. 1 is a perspective view schematically showing an optical waveguide according to one embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view for explaining step (I) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view for explaining step (III) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view for explaining step (IV) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view for explaining step (V) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view for explaining step (VI) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view for explaining the step (VII) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view for explaining the step (VIII) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view for explaining the step (X) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • (meth)acrylic acid includes acrylic acid, methacrylic acid and combinations thereof
  • (meth)acrylate includes acrylates, methacrylates and combinations thereof.
  • a photosensitive resin composition set according to an embodiment of the present invention includes a core resin composition and a clad resin composition.
  • the core resin composition and the clad resin composition are used for manufacturing an optical waveguide comprising a core layer containing a cured core resin composition and a clad layer containing a cured clad resin composition. can be done.
  • the core resin composition contains (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent.
  • the clad resin composition contains (a) a phenolic resin, (b) a photoacid generator, and (c) a cross-linking agent. Then, the numerical aperture NA defined by the following formula (1) from the refractive index n core of the cured product of the core resin composition and the refractive index n clad of the cured product of the clad resin composition is within a specific range. be.
  • an optical waveguide with low transmission loss can be manufactured.
  • an optical waveguide comprising a core layer and a clad layer is produced by forming a core layer from a cured core resin composition and forming a clad layer from a cured clad resin composition. can be done.
  • An optical waveguide manufactured in this manner can suppress transmission loss of light transmitted through the optical waveguide.
  • the core resin composition and the clad resin composition are photosensitive resin compositions, it is usually possible to efficiently produce fine optical waveguides by a method including exposure and development. Also, the optical waveguide can generally have excellent reflow resistance.
  • the core resin composition contains (A) a phenolic resin, (B) a photoacid generator and (C) a cross-linking agent. Since the core resin composition can be a photosensitive resin composition, a core layer having a desired pattern can be formed by a method including exposure and development. Unless otherwise specified, the "pattern" of the core layer represents the shape of the core layer viewed in the thickness direction.
  • the photoacid generator can generate an acid when exposed to light.
  • the acid can accelerate the cross-linking reaction of (C) the cross-linking agent. Therefore, the solubility of the core resin composition in the developing solution can be lowered in the portion irradiated with light (hereinafter sometimes referred to as "exposed portion"). Therefore, the core resin composition is capable of forming a latent image by exposure.
  • a finely patterned core layer can be formed by a method including exposure and development.
  • This core layer can be combined with a clad layer formed of a cured resin composition for clad to produce an optical waveguide capable of transmitting light so as to pass through the core layer.
  • an optical waveguide including a combination of the core layer and the clad layer can suppress transmission loss of light.
  • the core resin composition usually has excellent resolution. Furthermore, the cured product of the resin composition for the core is generally excellent in mechanical strength such as elongation at break and heat resistance such as reflow resistance.
  • the core resin composition contains (A) a phenolic resin as the (A) component.
  • the phenolic resin is soluble in a suitable type of developer, and particularly well soluble in an alkaline developer.
  • the phenolic resin can preferably react with (C) the cross-linking agent to bond, the reaction reacts with the (C) cross-linking agent to effectively improve the solubility of the core composition in the developer. can be lowered.
  • Phenolic resin contains phenolic hydroxyl groups in the molecule.
  • a phenolic hydroxyl group represents a hydroxyl group bonded to an aromatic ring such as a benzene ring or a naphthalene ring.
  • the number of phenolic hydroxyl groups possessed by the phenolic resin may be one or two or more per molecule.
  • C from the viewpoint of promoting the cross-linking reaction by the cross-linking agent and from the viewpoint of increasing the degree of cross-linking to increase the mechanical strength of the cured product,
  • the phenolic resin has two or more phenolic hydroxyl groups per molecule. It is preferred to have
  • Phenolic resins may be used singly or in combination of two or more.
  • Preferred examples of the phenol resin include a compound containing a structure represented by the following formula (A-1), a compound having a structure represented by formula (A-2), and formula (A-3).
  • a compound having a structure represented by is mentioned.
  • a compound containing a structure represented by formula (A-1), a compound having a structure represented by formula (A-2), and a compound having a structure represented by formula (A-3) The compounds are sometimes referred to as (A-1) component, (A-2) component and (A-3) component, respectively.
  • these components (A-1) to (A-3) are used, the transmission loss of the optical waveguide can be effectively suppressed, and usually, the resolution of the core resin composition and the core resin The mechanical strength and heat resistance of the cured product of the composition can be particularly improved.
  • each R 1 independently represents a divalent hydrocarbon group which may have a substituent
  • each X 1 independently represents an optionally substituted represents an alkyl group, an aryl group which may have a substituent, a halogen atom, or a monovalent heterocyclic group which may have a substituent
  • n1 represents an integer of 0 to 4
  • m1 represents It represents an integer from 1 to 200. * represents a bond.
  • R 2 is a divalent group represented by the following formula (r-1), a divalent group represented by the following formula (r-2), the following formula (r-3 ) represents a divalent group represented by or a combination thereof, and X 2 and X 3 are each independently an alkyl group optionally having a substituent, a substituent represents an aryl group which may be substituted, a halogen atom, or a monovalent heterocyclic group which may have a substituent.
  • n2 and n3 each independently represent an integer of 0 to 4;
  • R 3 is a divalent group represented by the following formula (r-1), a divalent group represented by the following formula (r-2), and the following formula (r-3 ) represents a divalent group represented by or a combination thereof, and X 4 and X 5 each independently have an optionally substituted alkyl group and a substituent represents an aryl group which may be substituted, a halogen atom, or a monovalent heterocyclic group which may have a substituent.
  • n4 and n5 each independently represent an integer of 0 to 3; )
  • R 11 and R 12 are each independently a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or a substituted represents a monovalent heterocyclic group, an amino group, a carbonyl group, a carboxyl group, or a group consisting of a combination thereof, which may be substituted, and R 11 and R 12 may combine with each other to form a ring.
  • * represents a bond.
  • each X 11 independently represents an optionally substituted alkyl group.
  • p1 represents an integer from 0 to 4; * represents a bond.
  • X 12 and X 13 each independently represent an optionally substituted alkyl group.
  • p2 and p3 each independently represents an integer of 0 to 4; * represents a bond.
  • (A-1) component a compound containing a structure represented by formula (A-1)-
  • the (A-1) component represents a compound containing a structure represented by the following formula (A-1).
  • Component (A-1) may be used singly or in combination of two or more.
  • each R 1 independently represents a divalent hydrocarbon group which may have a substituent
  • each X 1 independently represents an optionally substituted represents an alkyl group, an aryl group which may have a substituent, a halogen atom, or a monovalent heterocyclic group which may have a substituent
  • n1 represents an integer of 0 to 4
  • m1 represents represents an integer from 1 to 200. * represents a bond.
  • each X 1 is independently an optionally substituted alkyl group, an optionally substituted aryl group, a halogen atom, or a substituted represents a monovalent heterocyclic group which may be Among them, X 1 is preferably an optionally substituted alkyl group, an optionally substituted aryl group, a halogen atom, an optionally substituted alkyl group, and An optionally substituted aryl group is more preferred, and an optionally substituted alkyl group is even more preferred.
  • the alkyl group may be a linear, branched or cyclic alkyl group.
  • the cyclic alkyl group may be monocyclic or polycyclic.
  • an alkyl group having 1 to 10 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an alkyl group having 1 to 3 carbon atoms is even more preferable.
  • alkyl groups include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group, s-butyl group, t-butyl group, 2-methylpropyl group, 3-heptyl group and the like.
  • a methyl group is particularly preferred.
  • the aryl group is preferably an aryl group having 6 to 30 carbon atoms, more preferably an aryl group having 6 to 20 carbon atoms, and even more preferably an aryl group having 6 to 10 carbon atoms.
  • aryl groups include phenyl groups and naphthyl groups.
  • the halogen atom includes a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, etc., and a fluorine atom is preferable.
  • the monovalent heterocyclic group is preferably a monovalent heterocyclic group having 3 to 21 carbon atoms, more preferably a monovalent heterocyclic group having 3 to 15 carbon atoms, and 1 having 3 to 9 carbon atoms. More preferred are valent heterocyclic groups.
  • Monovalent heterocyclic groups also include monovalent aromatic heterocyclic groups (heteroaryl groups). Examples of monovalent heterocyclic groups include thienyl, pyrrolyl, furanyl, furyl, pyridyl, pyridazinyl, pyrimidyl, pyrazinyl, triazinyl, pyrrolidyl, piperidyl, quinolyl, and isoquinolyl groups. is mentioned. Among them, a pyrrolidyl group is preferred.
  • a monovalent heterocyclic group refers to a group obtained by removing one hydrogen atom from a heterocyclic ring of a heterocyclic compound.
  • the alkyl group, aryl group and monovalent heterocyclic group represented by X 1 may have a substituent.
  • Substituents include, for example, a halogen atom such as a fluorine atom, —OH, —O—C 1-6 alkyl group, —N(C 1-6 alkyl group) 2 , C 1-6 alkyl group, C 6-10 aryl group, —NH 2 , —NH(C 1-6 alkyl group), —CN, —C(O)O—C 1-6 alkyl group, —C(O)H, —NO 2 and the like.
  • a halogen atom such as a fluorine atom, —OH, —O—C 1-6 alkyl group, —N(C 1-6 alkyl group) 2 , C 1-6 alkyl group, C 6-10 aryl group, —NH 2 , —NH(C 1-6 alkyl group), —CN, —C(O)
  • the expression “optionally substituted” means unsubstituted or having a substituent unless otherwise specified.
  • the number of substituents may be one, or two or more. In one example, the number of substituents can generally be 1 to 5 (preferably 1, 2 or 3). When having multiple substituents, those substituents may be the same or different.
  • the term “C p ⁇ q ” (where p and q are positive integers and satisfies p ⁇ q) means that the number of carbon atoms of the organic group described immediately after this term is Represents p to q.
  • the expression "C 1-6 alkyl group” indicates an alkyl group having from 1 to 6 carbon atoms.
  • each R 1 independently represents a divalent hydrocarbon group which may have a substituent.
  • each R 1 independently represents a divalent group represented by formula (r-1).
  • R 11 and R 12 are each independently a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or a substituted represents a monovalent heterocyclic group, an amino group, a carbonyl group, a carboxyl group, or a group consisting of a combination thereof, which may be substituted, and R 11 and R 12 may combine with each other to form a ring.
  • * represents a bond.
  • R 11 and R 12 each independently represent a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or a substituted a monovalent heterocyclic group, an amino group, a carbonyl group, a carboxyl group, or a group consisting of a combination thereof, wherein R 11 and R 12 may combine with each other to form a ring.
  • a hydrogen atom and an alkyl group are preferred.
  • the optionally substituted alkyl group, optionally substituted aryl group, and optionally substituted monovalent heterocyclic group represented by R 11 and R 12 are represented by the formula An optionally substituted alkyl group represented by X 1 in (A-1), an optionally substituted aryl group, and an optionally substituted monovalent hetero It can be the same as the ring group.
  • Examples of the group consisting of a combination of these include, for example, a group consisting of a combination of an alkyl group and a carbonyl group, a group consisting of a combination of an aryl group and a carbonyl group, a group consisting of a combination of an alkyl group, an amino group and a carbonyl group, Examples thereof include a group consisting of a combination of an aryl group, an amino group and a carbonyl group.
  • R 11 and R 12 may combine with each other to form a ring.
  • the ring structures that R 11 and R 12 may form include spiro rings and condensed rings.
  • R 11 and R 12 are a group forming a cyclopentane ring, a group forming a cyclohexane ring, a group forming a 2,2-dimethyl-4-methylcyclohexane ring, a group forming a fluorene ring, and a pyrrolidine ring. or a group forming a ⁇ -lactam ring.
  • divalent group represented by formula (r-1) include the following groups.
  • "*" represents a bond.
  • each R 1 may independently be a divalent group represented by formula (r-4).
  • R 13 and R 14 each independently represent an alkylene group
  • X 14 each independently represents an optionally substituted alkyl group
  • p4 is 0 to represents an integer of 4
  • m2 represents an integer of 1 to 3. * represents a bond.
  • R 13 and R 14 each independently represent an alkylene group.
  • the number of carbon atoms in the alkylene group is usually 1 or more, preferably 18 or less, more preferably 12 or less, still more preferably 6 or less, and particularly preferably 4 or less.
  • Examples of the alkylene group include methylene group, ethylene group, propylene group, and butylene group.
  • X 14 each independently represents an optionally substituted alkyl group. X 14 may be the same as the optionally substituted alkyl group represented by X 1 in formula (A-1).
  • p4 represents an integer of 0 to 4, preferably an integer of 0 to 3, more preferably 0 or 1, and particularly preferably 0.
  • m2 represents an integer of 1 to 3, preferably an integer of 1 to 2, and particularly preferably 2.
  • X 15 each independently represents an optionally substituted alkyl group, p5 represents an integer of 0 to 12. * represents a bond.
  • X 15 each independently represents an optionally substituted alkyl group. X 15 may be the same as the optionally substituted alkyl group represented by X 1 in formula (A-1).
  • p5 represents an integer of 0 to 12, preferably an integer of 0 to 2, more preferably 0 or 1, and particularly preferably 0.
  • R 1 is preferably bonded at either the ortho-, meta-, or para-position relative to the OH group of the phenolic moiety in formula (A-1), and is either at the meta-position or the para-position. It is more preferable that those bonded to the meta-position and the para-position are mixed.
  • the mixing ratio (m:p) is preferably 1:0.1 to 1:10, more preferably 1:0.1 to 1:5, even more preferably 1:0.1 to 1:2. , 1:0.5 to 1:1 are particularly preferred.
  • the mixing ratio (m:p) is particularly preferably within the above range.
  • n1 represents an integer of 0 to 4, preferably an integer of 0 to 3, more preferably 0 or 1.
  • R 1 is a divalent group represented by formula (r-1)
  • n1 is particularly preferably 1.
  • R 1 is a divalent group represented by formula (r-4) or a divalent group represented by formula (r-5)
  • n1 is particularly preferably 0.
  • m1 represents an integer of 1-200. Specifically, m1 is usually 1 or more, and may be 2 or more. In addition, m1 is usually 200 or less, preferably 150 or less, more preferably 100 or less, and particularly preferably 50 or less.
  • component (A-1) examples include resins represented by the following formulas (A-1-1) to (A-1-3).
  • A-1-1-1 60% of the methylene groups are bonded to the meta position and 40% of the methylene groups are bonded to the para position with respect to the OH group of the phenol moiety. It is preferable that they are mixed in proportion.
  • n6, n7 and n8 represent integers of 1-200.
  • a commercially available product may be used as the component (A-1).
  • Specific examples of the commercially available component (A-1) include “TR4020G” manufactured by Asahi Organic Chemicals Co., Ltd. (resin represented by formula (A-1-1)); “TR4050G” and “TR4080G” manufactured by Asahi Organic Chemicals.
  • the range of the amount of component (A-1) is preferably 10% by mass or more, more preferably 30% by mass or more, still more preferably 40% by mass or more, relative to 100% by mass of the total phenolic resin (A). It is preferably 50% by mass or more, preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less.
  • the amount of the component (A-1) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and usually, the resolution of the core resin composition and the curing of the core resin composition are improved. The mechanical strength and heat resistance of the article can be particularly improved.
  • the range of the amount of component (A-1) is preferably 10% by mass or more, more preferably 20% by mass or more, and still more preferably 30% by mass or more, based on 100% by mass of non-volatile components in the core resin composition. It is more preferably 40% by mass or more, preferably 80% by mass or less, more preferably 70% by mass or less, and even more preferably 60% by mass or less.
  • the amount of the component (A-1) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and usually, the resolution of the core resin composition and the curing of the core resin composition are improved.
  • the mechanical strength and heat resistance of the article can be particularly improved.
  • (A-2) component compound having a structure represented by formula (A-2)-
  • the (A-2) component represents a compound having a structure represented by the following formula (A-2).
  • Component (A-2) may be used singly or in combination of two or more.
  • R 2 is a divalent group represented by the following formula (r-1), a divalent group represented by the following formula (r-2), the following formula (r- 3) represents a divalent group or a combination thereof, wherein X 2 and X 3 each independently represent an optionally substituted alkyl group, a substituted represents an aryl group which may be substituted, a halogen atom, or a monovalent heterocyclic group which may have a substituent.n2 and n3 each independently represent an integer of 0 to 4.)
  • R 11 and R 12 are each independently a hydrogen atom, an optionally substituted alkyl group, an optionally substituted aryl group, or a substituted represents a monovalent heterocyclic group, an amino group, a carbonyl group, a carboxyl group, or a group consisting of a combination thereof, which may be substituted, and R 11 and R 12 may combine with each other to form a ring.
  • * represents a bond.
  • each X 11 independently represents an optionally substituted alkyl group.
  • p1 represents an integer from 0 to 4; * represents a bond.
  • X 12 and X 13 each independently represent an optionally substituted alkyl group.
  • p2 and p3 each independently represents an integer of 0 to 4; * represents a bond.
  • R 2 is a divalent group represented by formula (r-1), a divalent group represented by formula (r-2), and a divalent group represented by formula (r-3). or a divalent group consisting of a combination thereof.
  • the divalent group represented by formula (r-1) is as described above.
  • X 11 , X 12 and X 13 in formulas (r-2) to (r-3) each independently represent an optionally substituted alkyl group.
  • X 11 to X 13 may be the same as the optionally substituted alkyl group represented by X 1 in formula (A-1).
  • p1, p2, and p3 in formulas (r-2) to (r-3) each independently represent an integer of 0 to 4, preferably an integer of 0 to 3, representing 0 or 1 is more preferred.
  • divalent group represented by formula (r-3) include the following groups.
  • "*" represents a bond.
  • a divalent group consisting of a combination of a divalent group represented by the formula (r-2) and a divalent group represented by the formula (r-1) and a divalent group represented by the formula (r-3 ) the following groups can be mentioned as specific examples of the divalent group formed in combination with the divalent group represented by ).
  • "*" represents a bond.
  • the OH group of the phenol moiety is preferably bonded to either the ortho-position, the meta-position, or the para-position with respect to R 2 , and either the meta-position or the para-position. is more preferably bonded to, and particularly preferably bonded to the para position.
  • X 2 and X 3 each independently represent an optionally substituted alkyl group, an optionally substituted aryl group, a halogen atom, or a substituent. represents a monovalent heterocyclic group which may be possessed; X 2 and X 3 can each independently be the same as X 1 in formula (A-1).
  • n2 and n3 each independently represent an integer of 0 to 4 and may be the same as n1 in formula (A-1).
  • component (A-2) include the following groups.
  • a commercially available product may be used as the component (A-2).
  • Specific examples of the commercially available component (A-2) include: Asahi Organic Chemicals Co., Ltd. "BisP-E”, “Bis-AF”; Honshu Chemical Co., Ltd. "BisE”, “BisP-TMC”; Mitsui Chemicals Fine Co., Ltd. "BisA”, “BisF”, “BisP-M”; Honshu Chemical Co., Ltd.
  • the range of the amount of component (A-2) is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more, relative to 100% by mass of the total phenolic resin (A). , preferably 60% by mass or less, more preferably 50% by mass or less, and even more preferably 40% by mass or less.
  • the amount of the component (A-2) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the curing of the core resin composition are usually improved.
  • the mechanical strength and heat resistance of the article can be particularly improved.
  • the amount of component (A-2) is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 5% by mass or more, based on 100% by mass of non-volatile components in the core resin composition. Yes, preferably 40% by mass or less, more preferably 30% by mass or less, and even more preferably 25% by mass or less.
  • the amount of the component (A-2) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the curing of the core resin composition are usually improved.
  • the mechanical strength and heat resistance of the article can be particularly improved.
  • the mass of component (A-1) with respect to 100% by mass of the total phenol resin is Wa1
  • the mass of component (A-2) with respect to the total 100% by mass of (A) phenolic resin is Wa2
  • mass ratio Wa2/Wa1 is preferably within a specific range.
  • the mass ratio Wa2/Wa1 is preferably 0.01 or more, more preferably 0.05 or more, more preferably 0.1 or more, preferably 4 or less, more preferably 2 or less, It is more preferably 1 or less.
  • the mass ratio Wa2/Wa1 is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and usually, the resolution of the core resin composition and the mechanical properties of the cured product of the core resin composition are improved. The physical strength and heat resistance can be particularly improved.
  • (A-3) component compound having a structure represented by formula (A-3)-
  • the (A-3) component represents a compound having a structure represented by the following formula (A-3).
  • Component (A-3) may be used alone or in combination of two or more.
  • R 3 is a divalent group represented by the formula (r-1), a divalent group represented by the formula (r-2), the formula (r- 3) represents a divalent group or a combination thereof, wherein X 4 and X 5 each independently represent an optionally substituted alkyl group, a substituted represents an aryl group which may be substituted, a halogen atom, or a monovalent heterocyclic group which may have a substituent.n4 and n5 each independently represents an integer of 0 to 3.)
  • R 3 is a divalent group represented by formula (r-1), a divalent group represented by formula (r-2), and a divalent group represented by formula (r-3). or a divalent group consisting of a combination thereof. From a divalent group represented by the formula (r-1), a divalent group represented by the formula (r-2), a divalent group represented by the formula (r-3), and combinations thereof The divalent group is as described above.
  • X 4 and X 5 are each independently an optionally substituted alkyl group, an optionally substituted aryl group, a halogen atom, or a represents a monovalent heterocyclic group which may be X 4 and X 5 can each independently be the same as X 1 in formula (A-1).
  • n4 and n5 each independently represent an integer of 0 to 3. n4 and n5 each independently more preferably represent 0 or 1, with 0 being particularly preferred.
  • component (A-3) include the following groups.
  • a commercially available product may be used as the component (A-3).
  • Specific examples of the commercially available component (A-3) include "TBIS-RX” manufactured by Taoka Chemical Co., Ltd., and the like.
  • the range of the amount of component (A-3) is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more, relative to 100% by mass of the total phenolic resin (A). , preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.
  • the amount of the component (A-3) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the curing of the core resin composition are usually improved.
  • the mechanical strength and heat resistance of the article can be particularly improved.
  • the amount of component (A-3) is preferably 1% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more, based on 100% by mass of non-volatile components in the core resin composition. Yes, preferably 40% by mass or less, more preferably 30% by mass or less, and even more preferably 20% by mass or less.
  • the amount of the component (A-3) is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the curing of the core resin composition are usually improved.
  • the mechanical strength and heat resistance of the article can be particularly improved.
  • -(A-4) component compounds other than (A-1) component to formula (A-3) component-
  • As the phenolic resin compounds other than the components (A-1) to (A-3) may be used.
  • Examples of (A) phenolic resin (hereinafter sometimes referred to as “(A-4) component”) other than (A-1) component to formula (A-3) component include “Maruka” manufactured by Maruzen Chemical Co., Ltd. Linker M" (polyparahydroxystyrene), JFE Chemical's "SPDI”, and the like.
  • the weight average molecular weight of the phenolic resin is not particularly limited. As a preferred range, the weight average molecular weight of (A) the phenol resin is preferably 150 or more, more preferably 160 or more, particularly preferably 170 or more, preferably less than 15000, more preferably 14000 or less, and particularly preferably It is 13000 or less, and may be less than 2500.
  • the weight average molecular weight can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.
  • the phenolic hydroxyl equivalent of the phenolic resin is preferably 50 g/eq. above, more preferably 100 g/eq. or more, preferably 3000 g/eq. less than, more preferably 1000 g/eq. Below, more preferably 500 g/eq. Below, particularly preferably 300 g/eq. It is below.
  • the phenolic hydroxyl group equivalent of the phenolic resin represents the mass of the (A) phenolic resin per equivalent of the phenolic hydroxyl group.
  • the refractive index n core of the cured product of the core resin composition can be adjusted, for example, by the composition of (A) the phenolic resin.
  • the refractive index n core of the cured product of the core resin composition can be lowered, and when a large amount of (A) phenolic resin with a high refractive index is used, The refractive index n core of the cured product of the core resin composition can be increased.
  • a specific refractive index of the phenolic resin can be calculated by the Lorentz-Lorenz formula.
  • the type and amount of (A) phenolic resin may be selected based on the refractive index of (A) phenolic resin derived based on the Lorentz-Lorenz equation.
  • Lorentz-Lorenz formula for example, "Refractive index control of optical polymers: theoretical prediction and molecular design method” (Shinji Ando, “Optics” 2015 Vol. 44 No. 8, pp298-303), “Optical properties of transparent polymers and high performance” (Yoshihisa Tanio, “Industrial Materials” March 2021, pp. 16-18).
  • a phenolic resin containing fluorine atoms tends to lower the refractive index n core of the cured product.
  • a phenolic resin containing fluorine atoms may be referred to as a "fluorinated phenolic resin”.
  • the (A) phenolic resin of the core resin composition preferably contains the same one or two or more phenolic resins contained in the clad resin composition. That is, it is preferable that one or more phenolic resins are contained in both the core resin composition and the clad resin composition.
  • the core resin composition and the clad resin composition contain a common phenol resin, the affinity between the core layer and the clad layer can be enhanced. Therefore, since the smoothness of the interface between the core layer and the clad layer can be improved, attenuation of light due to scattering at the interface can be effectively suppressed, and therefore transmission loss can be effectively suppressed.
  • the adhesion of the interface between the core layer and the clad layer can be enhanced, the mechanical strength and heat resistance of the optical waveguide can be improved. Furthermore, since the coefficient of thermal expansion of the core layer and the coefficient of thermal expansion of the clad layer can be brought close to each other, deformation of the optical waveguide due to thermal change can be suppressed.
  • a phenolic resin commonly contained in both the core resin composition and the clad resin composition is sometimes referred to as a "common phenolic resin".
  • the range of the amount of the common phenolic resin contained in the (A) phenolic resin is preferably 40% by mass or more, more preferably 50% by mass, with respect to the total 100% by mass of the (A) phenolic resin in the core resin composition. More preferably, it is 60% by mass or more, and usually 100% by mass or less, preferably 99% by mass or less, more preferably 97% by mass or less, and particularly preferably 95% by mass or less.
  • the range of the amount of the phenol resin is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more, based on 100% by mass of the non-volatile components of the core resin composition. , preferably 90% by mass or less, more preferably 80% by mass or less, and may be 70% by mass or less.
  • the amount of the phenolic resin is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the cured product of the core resin composition are usually improved. The mechanical strength and heat resistance of can be particularly improved.
  • the core resin composition contains (B) a photoacid generator as the (B) component.
  • the photoacid generator generates an acid when irradiated with actinic rays such as ultraviolet rays, and the generated acid can promote the cross-linking reaction of the (C) cross-linking agent. Therefore, the exposure can effectively lower the solubility of the core resin composition in the developer, so that the formation of the negative pattern by the exposure can be effectively advanced.
  • the photoacid generator may be used singly or in combination of two or more.
  • photoacid generator a compound that generates an acid upon exposure to actinic rays can be used.
  • photoacid generators include halogen-containing compounds, onium salt compounds, diazoketone compounds, sulfone compounds, sulfonic acid compounds, sulfonimide compounds, diazomethane compounds, and oxime ester compounds. Among them, oxime ester compounds are preferred.
  • Preferred specific examples of halogen-containing compounds include 2-[2-(furan-2-yl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(5-methylfuran -2-yl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-(methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(4 -methoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine, 2-[2-(3,4-dimethoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-s-triazine , 1,10-d
  • halogen-containing compounds can be used, and examples of commercially available products include “TFE-triazine”, “TME-triazine”, “MP-triazine”, “MOP-triazine”, “dimethoxy” manufactured by Sanwa Chemical Co., Ltd. triazine” (halogen-containing compound-based photoacid generator having a triazine skeleton) and the like.
  • Onium salt compounds that can be suitably used as photoacid generators include, for example, iodonium salts, sulfonium salts, phosphonium salts, diazonium salts, pyridinium salts and the like.
  • Preferred specific examples of onium salt compounds include tris(4-methylphenyl)sulfonium trifluoromethanesulfonate, tris(4-methylphenyl)sulfonium hexafluorophosphonate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium p-toluenesulfonate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate, diphenyliodonium tetrafluoroborate, triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium
  • onium salt compounds can be used, and examples of commercially available products include “TS-01” and “TS-91” manufactured by Sanwa Chemical Co., Ltd.; “CPI-110A” and “CPI-210S” manufactured by San-Apro. , “HS-1", “LW-S1", “IK-1”, “CPI-310B”; Sanshin Chemical Industry Co., Ltd. "SI-110L”, “SI-180L”, “SI-100L” etc. mentioned.
  • Preferred specific examples of diazoketone compounds include 1,2-naphthoquinonediazide-4-sulfonic acid ester compounds of phenols.
  • Preferred specific examples of sulfone compounds include 4-trisphenacylsulfone, mesitylphenacylsulfone, bis(phenacylsulfonyl)methane, and the like.
  • Preferred specific examples of the sulfonic acid compound include benzoin tosylate, pyrogalloltrifluoromethanesulfonate, o-nitrobenzyltrifluoromethanesulfonate, o-nitrobenzyl p-toluenesulfonate and the like.
  • a commercially available diazomethane compound can be used.
  • Examples of commercially available products include "PAG103", “PAG121", “PAG169", and "PAG203" manufactured by BASF.
  • the (B) photoacid generator of the core resin composition is the same one or two or more photoacid generators contained in the clad resin composition. preferably included. That is, it is preferable that one or more photoacid generators are contained in both the core resin composition and the clad resin composition.
  • a photoacid generator commonly contained in both the core resin composition and the clad resin composition is sometimes referred to as a "common photoacid generator”.
  • the range of the amount of the common photoacid generator contained in the (B) photoacid generator is preferably 80% by mass or more with respect to 100% by mass of the total photoacid generator (B) in the core resin composition. More preferably 90% by mass or more, particularly preferably 100% by mass.
  • the range of the amount of the photoacid generator is preferably 0.01% by mass or more, more preferably 0.01% by mass or more, based on 100% by mass of non-volatile components in the core resin composition as the photosensitive resin composition. 05% by mass or more, more preferably 0.1% by mass or more, preferably 3% by mass or less, more preferably 2% by mass or less, and particularly preferably 1.5% by mass or less.
  • the core resin composition contains (C) a cross-linking agent as the (C) component.
  • the cross-linking agent is capable of undergoing a cross-linking reaction. Due to the cross-linking reaction of the cross-linking agent (C), the core resin composition can be made insoluble in a developer or cured to form a core layer. However, (C) the cross-linking agent does not include those corresponding to (A) the phenolic resin.
  • the amino resin is combined with (A) the phenol resin, a photosensitive resin composition having excellent photosensitivity can be obtained. Therefore, it is possible to improve the photosensitivity of the core resin composition.
  • the (C) cross-linking agent those capable of causing a cross-linking reaction with the (A) phenol resin are preferable.
  • the (C) cross-linking agent (A) capable of causing a cross-linking reaction with the phenol resin include compounds containing an alkoxymethyl group in the molecule.
  • the alkoxymethyl group represents a group represented by formula (C-1) below.
  • "*" represents a bond.
  • R 21 represents an optionally substituted alkyl group.
  • Alkyl groups may be straight chain, branched chain, or cyclic alkyl groups.
  • the cyclic alkyl group may be monocyclic or polycyclic.
  • an alkyl group having 1 to 10 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and an alkyl group having 1 to 4 carbon atoms is even more preferable.
  • alkyl groups include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group, s-butyl group, t-butyl group, and the like. is mentioned. Among them, a methyl group and a butyl group are preferable, and a methyl group is more preferable.
  • the alkyl group represented by R 21 may have a substituent.
  • the alkoxymethyl group is preferably contained in an alkoxymethylamino group represented by the following formula (C-1'). Therefore, (C) the cross-linking agent preferably contains an alkoxymethylamino group represented by formula (C-1′), and the alkoxymethylamino group represented by formula (C-1′) is contained in the molecule. It is more preferable to contain two or more. In the formula, "*" represents a bond.
  • R 22 is the same as R 21 in formula (C-1).
  • R represents a hydrogen atom or an alkoxymethyl group.
  • an amino resin containing two or more alkoxymethyl groups in the molecule is particularly preferable.
  • amino resins containing two or more alkoxymethyl groups in the molecule include melamine resins and urea resins, with melamine resins being preferred.
  • melamine resin for example, a melamine resin having a structure represented by the following formula (C-2) is preferable.
  • X 21 , X 22 , X 23 and X 24 each independently represent a hydrogen atom or an alkoxymethyl group.
  • R 50 is a hydrogen atom, an amino group, an optionally substituted alkyl group, an optionally substituted aryl group, or an alkoxymethylamino group represented by formula (C-1′) represents However, when R 50 represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aryl group, X 21 , X 22 , X 23 and X 24 At least two are alkoxymethyl groups.
  • the alkoxymethyl group represented by X 21 to X 24 can be the same as the group represented by formula (C-1).
  • R 50 represents a hydrogen atom, an optionally substituted alkyl group, or an optionally substituted aryl group
  • at least two of X 21 to X 24 are alkoxymethyl groups.
  • R 50 represents a hydrogen atom, an amino group, an optionally substituted alkyl group, or an optionally substituted aryl group
  • two or more of X 21 to X 24 are is an alkoxymethyl group.
  • At least three of X 21 to X 24 are preferably alkoxymethyl groups, more preferably at least four of X 21 to X 24 are alkoxymethyl groups.
  • R 50 is a hydrogen atom, an amino group, an optionally substituted alkyl group, an optionally substituted aryl group, or an alkoxymethylamino group represented by formula (C-1′) represents R 50 is an optionally substituted aryl group, preferably an alkoxymethylamino group represented by formula (C-1′), and an alkoxymethylamino group represented by formula (C-1′) is more preferred.
  • the optionally substituted alkyl group represented by R 50 can be the same as the optionally substituted alkyl group represented by X 1 in formula (A-1).
  • the optionally substituted aryl group represented by R 50 can be the same as the optionally substituted aryl group represented by X 1 in formula (A-1).
  • a melamine resin having a structure represented by formula (C-2) is preferably a melamine resin having a structure represented by formula (C-2').
  • X 25 , X 26 , X 27 , X 28 , X 29 and X 30 each independently represent a hydrogen atom or an alkoxymethyl group. However, at least two of X25 , X26 , X27 , X28 , X29 and X30 are alkoxymethyl groups.
  • the alkoxymethyl group represented by X 25 to X 30 can be the same as the group represented by formula (C-1). At least two of X 25 to X 30 are alkoxymethyl groups, preferably at least three of X 25 to X 30 are alkoxymethyl groups, and at least four of X 25 to X 30 are alkoxymethyl groups is more preferred, and it is even more preferred that all of X 25 to X 30 are alkoxymethyl groups.
  • melamine resins include the following melamine resins.
  • melamine resins may be used. Examples of commercially available products include “MW-390”, “MW-100LM” and “MX-750LM” manufactured by Sanwa Chemical Co., Ltd.; Cymel series manufactured by Allnex Japan.
  • urea resin for example, a urea resin having either a structure represented by the following formula (C-3) or a structure represented by the following formula (C-4) is preferable.
  • X 31 , X 32 , X 33 and X 34 each independently represent a hydrogen atom or an alkoxymethyl group. However, at least two of X 31 , X 32 , X 33 and X 34 are alkoxymethyl groups. At least three of X 31 to X 34 are preferably alkoxymethyl groups, more preferably at least four of X 31 to X 34 are alkoxymethyl groups. In formula (C-4), X 35 and X 36 each represent an alkoxymethyl group. The alkoxymethyl group represented by X 31 to X 36 can be the same as the group represented by formula (C-1).
  • a commercially available product may be used as the urea resin.
  • Examples of commercially available products include “MX-270”, “MX-279” and “MX-280” manufactured by Sanwa Chemical Co., Ltd.; Cymel series manufactured by Allnex Japan Co., Ltd.;
  • the cross-linking agent may be used alone or in combination of two or more.
  • the cross-linking agent may contain a cross-linkable group such as an alkoxymethyl group as a group capable of causing a cross-linking reaction.
  • the crosslinkable group equivalent of the crosslinker is preferably 50 g/eq. above, more preferably 100 g/eq. or more, preferably 3000 g/eq. less than, more preferably 1000 g/eq. Below, more preferably 500 g/eq. Below, particularly preferably 300 g/eq. It is below.
  • the crosslinkable group equivalent of the crosslinker represents the mass of the (C) crosslinker per equivalent of the crosslinkable group.
  • the amount of (C) the cross-linking agent is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 20% by mass or more, based on 100% by mass of the non-volatile components of the core resin composition. , preferably 40% by mass or less, more preferably 35% by mass or less, and particularly preferably 30% by mass or less.
  • the amount of the cross-linking agent is within the above range, the transmission loss of the optical waveguide can be effectively suppressed, and the resolution of the core resin composition and the cured product of the core resin composition are usually improved. The mechanical strength and heat resistance of can be particularly improved.
  • the resin composition for the core may optionally contain a polymer (D) in combination with the components (A) to (C) described above.
  • the (D) polymer as component (D) usually has a weight average molecular weight of 2,500 or more. Specifically, the range of the weight average molecular weight of the (D) polymer is usually 2,500 or more, more preferably 5,000 or more, particularly preferably 10,000 or more, preferably 100,000 or less, more preferably 80,000 or less, more preferably 60,000 or less.
  • the core resin composition contains the polymer (D)
  • the smoothness of the surface of the core layer can be improved, and the smoothness of the interface between the core layer and the clad layer can be improved, thus reducing the transmission loss of the optical waveguide.
  • the polymer may be a homopolymer or a copolymer.
  • Examples of (D) polymers include acrylic resins, phenoxy resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyimide resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, and polycarbonates. resins, polyetheretherketone resins, polyester resins, and the like. Among them, acrylic resin is preferable.
  • the acrylic resin can be a polymer containing repeating units having a structure formed by polymerizing acrylic monomers such as acrylic acid, acrylate, methacrylic acid, and methacrylate.
  • the acrylic resin may be a homopolymer of acrylic monomers, or a copolymer of two or more acrylic monomers, and may be acrylic monomers other than acrylic monomers. It may be a copolymer with any monomer of
  • an acrylic resin is used as the (D) polymer, the heat resistance and flexibility of the core layer can be effectively enhanced, and the transparency of the core layer can be enhanced to effectively suppress the transmission loss of the optical waveguide.
  • Specific examples of acrylic resins include "Alfon” (registered trademark) manufactured by Toagosei Co., Ltd.; "ART CURE” manufactured by Negami Kogyo Co., Ltd.;
  • phenoxy resin examples include Mitsubishi Chemical's "1256” and “4250” (both phenoxy resins containing bisphenol A skeleton), “YX8100” (phenoxy resin containing bisphenol S skeleton), “YX6954” (bisphenolacetophenone skeleton containing phenoxy resin), “YX7553”, “YL6794”, “YL7213”, “YL7290” and “YL7482”;
  • polyvinyl acetal resins examples include polyvinyl formal resins and polyvinyl butyral resins, with polyvinyl butyral resins being preferred.
  • Specific examples of polyvinyl acetal resins include Denka Butyral 4000-2, Denka Butyral 5000-A, Denka Butyral 6000-C, and Denka Butyral 6000-EP; Sekisui Chemical Co., Ltd. S-LEC BH series, BX series, KS series, BL series, BM series, etc. manufactured by the company.
  • polyimide resins include “Ricacoat SN20” and “Ricacoat PN20” manufactured by Shin Nippon Rika.
  • polyimide resins include linear polyimide obtained by reacting bifunctional hydroxyl group-terminated polybutadiene, diisocyanate compound and tetrabasic acid anhydride (described in JP-A-2006-37083), polysiloxane Examples include modified polyimides such as skeleton-containing polyimides (described in JP-A-2002-12667 and JP-A-2000-319386).
  • polyamide-imide resins include “Vylomax HR11NN” and “Vylomax HR16NN” manufactured by Toyobo Co., Ltd.
  • polyamideimide resins include modified polyamideimides such as polysiloxane skeleton-containing polyamideimides "KS9100” and “KS9300” manufactured by Hitachi Chemical Co., Ltd.
  • polyethersulfone resin examples include “PES5003P” manufactured by Sumitomo Chemical Co., Ltd.
  • polysulfone resins include polysulfone "P1700” and “P3500” manufactured by Solvay Advanced Polymers.
  • the (D) polymer may be used singly or in combination of two or more.
  • the polymer preferably does not contain a functional group capable of forming a bond by reacting with a phenolic hydroxyl group or a crosslinkable group.
  • the functional group equivalent weight of the (D) polymer represents the mass of the (D) polymer per functional group equivalent.
  • the functional group equivalent of the (D) polymer is preferably 3000 g/eq. above, more preferably 4000 g/eq. above, particularly preferably 5000 g/eq. That's it.
  • the range of the phenolic hydroxyl group equivalent weight of the (D) polymer can be the same as the range of the functional group equivalent weight of the (D) polymer.
  • the phenolic hydroxyl group equivalent of the (D) polymer represents the mass of the (D) polymer per equivalent of the phenolic hydroxyl group.
  • the range of crosslinkable group equivalents of the (D) polymer can be the same as the range of functional group equivalents of the (D) polymer.
  • the crosslinkable group equivalent of the (D) polymer represents the mass of the (D) polymer per equivalent of the crosslinkable group.
  • the polymer (D) preferably has no functional group, and therefore preferably does not have a phenolic hydroxyl group, and preferably does not have a crosslinkable group.
  • the (D) polymer of the core resin composition preferably contains the same one or two or more polymers contained in the clad resin composition. That is, it is preferable that one or more polymers are contained in both the core resin composition and the clad resin composition.
  • a polymer commonly contained in both the core resin composition and the clad resin composition is sometimes referred to as a "common polymer".
  • the range of the amount of the common polymer contained in the (D) polymer is preferably 80% by mass or more, more preferably 90% by mass or more, relative to 100% by mass of the (D) polymer in the core resin composition. , particularly preferably 100% by mass.
  • the range of the amount of the polymer (D) may be 0% by mass or more than 0% by mass, preferably 1% by mass or more, more preferably 1% by mass or more, with respect to 100% by mass of the non-volatile components of the core resin composition. It is 2% by mass or more, particularly preferably 5% by mass or more, preferably 30% by mass or less, more preferably 20% by mass or less, and particularly preferably 10% by mass or less.
  • the core resin composition may further contain (E) a compound represented by the following formula (E-1) as an optional component in combination with the components (A) to (D) described above.
  • the compound (E) represented by the formula (E-1) as the component (E) is hereinafter sometimes referred to as "(E) amine compound".
  • the amine compound functions as a quencher in the core resin composition, and can suppress the diffusion rate of the acid generated by the (B) photoacid generator in the resin composition. Therefore, (E) the amine compound can improve the resolution of the core resin composition.
  • the amine compound does not include those corresponding to the above-described components (A) to (D).
  • R e1 , R e2 and R e3 each independently represent a hydrogen atom or a hydrocarbon group.
  • the hydrocarbon group may be either an aliphatic hydrocarbon group or an aromatic hydrocarbon group.
  • the aliphatic hydrocarbon group may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group.
  • the hydrocarbon group may contain a ring.
  • an aliphatic hydrocarbon group may be an alicyclic hydrocarbon group.
  • the number of carbon atoms in the hydrocarbon group is generally 1 or more, preferably 2 or more, particularly preferably 5 or more, and preferably 20 or less, more preferably 18 or less, and particularly preferably 12 or less.
  • hydrocarbon groups examples include alkyl groups such as methyl group, ethyl group, hexyl group, octyl group and decyl group; cycloalkyl groups such as cyclopentyl group and cyclohexyl group; aryl groups such as phenyl group and naphthyl group; Groups in which these are combined, and the like are included.
  • R e1 and R e2 may combine to form a ring.
  • amine compounds include ammonia, primary aliphatic amine compounds, secondary aliphatic amine compounds, tertiary aliphatic amine compounds, aromatic amine compounds, and the like.
  • Examples of primary aliphatic amine compounds include methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, sec-butylamine, tert-butylamine, pentylamine, tert-pentylamine and cyclopentylamine. , hexylamine, cyclohexylamine, heptylamine, octylamine, nonylamine, decylamine, dodecylamine, cetylamine and the like.
  • Secondary aliphatic amine compounds include, for example, dimethylamine, diethylamine, di-n-propylamine, diisopropylamine, di-n-butylamine, diisobutylamine, di-sec-butylamine, dipentylamine, dicyclopentylamine, dihexyl amine, dicyclohexylamine, diheptylamine, dioctylamine, dinonylamine, didecylamine, didodecylamine, dicetylamine, pyrrolidine and the like.
  • tertiary aliphatic amine compounds include trimethylamine, triethylamine, tri-n-propylamine, triisopropylamine, tri-n-butylamine, triisobutylamine, tri-sec-butylamine, tripentylamine, and tricyclopentylamine. , trihexylamine, tricyclohexylamine, triheptylamine, trioctylamine, trinonylamine, tridecylamine, tridodecylamine, tricetylamine, dimethylethylamine, methylethylpropylamine and the like.
  • aromatic amine compounds include benzylamine, phenethylamine, benzyldimethylamine, diphenyl(p-tolyl)amine, methyldiphenylamine, triphenylamine, naphthylamine; aniline; N-methylaniline, N-ethylaniline, N-propyl Aniline derivatives such as aniline, N,N-dimethylaniline, 2-methylaniline, 3-methylaniline, 4-methylaniline, ethylaniline, propylaniline, trimethylaniline, N,N-dimethyltoluidine; pyrrole; 2H-pyrrole, pyrrole derivatives such as 1-methylpyrrole, 2,4-dimethylpyrrole, 2,5-dimethylpyrrole and N-methylpyrrole;
  • the (E) amine compound of the core resin composition should contain the same one or two or more amine compounds contained in the clad resin composition. is preferred. That is, it is preferable that one or more amine compounds are contained in both the core resin composition and the clad resin composition.
  • An amine compound commonly contained in both the core resin composition and the clad resin composition is sometimes referred to as a "common amine compound".
  • the range of the amount of the common amine compound contained in the (E) amine compound is preferably 80% by mass or more, more preferably It is 90% by mass or more, and particularly preferably 100% by mass.
  • the range of the amount of the amine compound may be 0% by mass, may be greater than 0% by mass, and is preferably 0.01% by mass or more with respect to 100% by mass of the non-volatile components of the core resin composition. , more preferably 0.05% by mass or more, particularly preferably 0.1% by mass or more, preferably 5% by mass or less, more preferably 2% by mass or less, and particularly preferably 1% by mass or less.
  • the resin composition for the core may further contain (F) any additive as an optional component in combination with the above-described components (A) to (E) within a range that does not significantly impair the effects of the present invention. .
  • This (F) optional additive does not include those corresponding to the above-described components (A) to (E).
  • Any additive may be used alone or in combination of two or more.
  • optional additives include UV absorbers, silane coupling agents, plasticizers, flame retardants, antistatic agents, anti-aging agents, antibacterial agents, antifoaming agents, leveling agents, thickeners, adhesion properties-imparting agents, thixotropic properties-imparting agents, release agents, surface treating agents, dispersants, surface modifiers, stabilizers, and the like.
  • the optional additive may contain inorganic particles.
  • the refractive index of the cured product of the core resin composition can be increased.
  • the amount of the inorganic particles contained in the core resin composition is preferably small.
  • the range of the amount of the inorganic particles is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less with respect to 100% by mass of the non-volatile components of the core resin composition. and ideally 0% by mass. Therefore, the core resin composition preferably does not contain inorganic particles.
  • the core resin composition may contain (G) a solvent as a volatile component in combination with the non-volatile components such as components (A) to (F) described above.
  • the (G) solvent as the (G) component can adjust the viscosity of the core resin composition.
  • Solvents include, for example, organic solvents.
  • Examples of (G) solvents include ketone solvents such as ethyl methyl ketone and cyclohexanone; aromatic hydrocarbon solvents such as toluene, xylene and tetramethylbenzene; methyl cellosolve, butyl cellosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ether solvents such as ether, dipropylene glycol monoethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether; ester solvents such as ethyl acetate, butyl acetate, butyl cellosolve acetate, carbitol acetate, ethyl diglycol acetate; propylene Ether ester solvents such as glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, ⁇ -but
  • the amount of solvent is preferably adjusted appropriately from the viewpoint of coating properties of the core resin composition.
  • the core resin composition can be produced by mixing each component to be contained in the core resin composition. Therefore, the core resin composition can be produced by mixing components (A) to (C) and, if necessary, components (D) to (G). At the time of mixing, if necessary, kneading may be performed using a kneading device such as a triple roll, ball mill, bead mill, or sand mill, or stirring may be performed using a stirring device such as a super mixer or planetary mixer. There is no restriction on the order of mixing each component. Moreover, you may cool or heat in the process of mixing each component.
  • the core resin composition preferably has excellent resolution.
  • L/S (line/space) of 10 ⁇ m/10 ⁇ m, 5 ⁇ m/50 ⁇ m and 3 ⁇ m were measured using the resin composition for the core by the method described in [Evaluation of resolution of resin composition] in Examples described later.
  • /3 ⁇ m line layer the aspect ratio of each line layer can be preferably 0.6 or more, more preferably 1 or more.
  • L (line) represents the width of the line layer
  • S (space) represents the interval between the line layers.
  • the aspect ratio of the line layer represents the ratio represented by "layer thickness/line width" of the line layer. According to the core resin composition having such excellent resolution, it is possible to form a core layer having a small width and a small interval, and to achieve miniaturization of the optical waveguide.
  • the core resin composition described above can be cured by exposure and, if necessary, heating. Therefore, a cured product can be obtained from the core resin composition.
  • volatile components such as (G) solvent can volatilize due to heat during drying or curing, but nonvolatile components such as components (A) to (F) do not. Therefore, the cured product of the core resin composition may contain the non-volatile component of the core resin composition or its reaction product.
  • the core resin composition a cured product having a refractive index suitable for forming an optical waveguide can be obtained.
  • the specific refractive index n core of the cured product of the core resin composition is not limited as long as an optical waveguide with a desired aperture NA can be obtained.
  • the refractive index n core of the cured core resin composition at a measurement wavelength of 1310 nm is preferably 1.4500 or more, more preferably 1.5000 or more, particularly preferably 1.6000 or more, and preferably 1.6000 or more. It is 7000 or less, more preferably 1.6500 or less, and particularly preferably 1.6150 or less.
  • the refractive index of the resin composition for the core can be measured by the method described in [Measurement of refractive index of cured product of resin composition] in Examples below.
  • the core resin composition a cured product with excellent mechanical strength can be obtained.
  • the elongation at break of the cured product is measured by the method described in [Measurement of elongation at break of cured product of resin composition] in Examples described later, the elongation at break is preferably 1% or more. can have
  • a cured product with excellent heat resistance can be obtained.
  • the cured product obtained under the conditions described in Examples described later is heat-treated under the conditions described in "(Observation of appearance after reflow)"
  • the generation of voids can be suppressed.
  • the surface of the cured product can be made highly smooth. Therefore, according to the core resin composition, it is possible to form a core layer having a smooth surface and effectively suppress transmission loss.
  • the arithmetic mean roughness of the core layer can be reduced.
  • the arithmetic surface roughness of the core layer is preferably 200 nm or less, more preferably 180 nm or less, and particularly preferably 150 nm or less.
  • the lower limit is not particularly limited, and can be, for example, 10 nm or more.
  • the surface roughness of the core layer can be measured by the method described in [Measurement of Surface Roughness of Core Layer] in Examples below.
  • the core resin composition can be used as a photosensitive resin composition for forming the core layer of the optical waveguide.
  • the core resin composition can be used to form an optical waveguide capable of transmitting light with a wavelength of 1300 nm to 1320 nm.
  • the core resin composition is preferably used for forming a single-mode optical waveguide, for example, preferably for forming a single-mode optical waveguide for light with a wavelength of 1310 nm.
  • the solution of the core resin composition preferably has a low absorbance at a wavelength of 1310 nm.
  • the absorbance of a resin composition solution is low, the absorbance of a cured product of the resin composition is low.
  • the absorbance of a 20% by weight solution of the resin composition for the core obtained under the conditions described in Examples described later is small.
  • the absorbance of the core resin composition solution at an optical path length of 1 cm which is measured by the method described in [Measurement of Absorbance of Resin Composition Solution] in Examples, is preferably 0.020 or less. , more preferably 0.018 or less, and particularly preferably 0.015 or less.
  • the clad resin composition contains (a) a phenolic resin, (b) a photoacid generator and (c) a cross-linking agent. Since the clad resin composition can be a photosensitive resin composition, the clad layer can be formed by a method including exposure. Moreover, the clad resin composition may form a clad layer having a desired pattern by a method including exposure and development in the same manner as the core resin composition.
  • the “pattern” of the clad layer represents the shape of the clad layer viewed from the thickness direction, unless otherwise specified.
  • the cladding layer can be combined with a core layer formed from a cured core resin composition to produce an optical waveguide capable of transmitting light through the core layer.
  • an optical waveguide including a combination of the core layer and the clad layer can suppress transmission loss of light.
  • the clad resin composition usually has excellent resolution. Furthermore, the cured product of the clad resin composition is usually excellent in mechanical strength such as elongation at break and heat resistance such as reflow resistance.
  • the clad resin composition contains (a) a phenol resin as the (a) component.
  • the (a) phenolic resin for the clad resin composition those in the same range as the (A) phenolic resin for the core resin composition can be used.
  • the range of the amount of (a) phenolic resin contained in the clad resin composition may be the same as the range of the amount of (A) phenolic resin contained in the core resin composition.
  • the range of the amount of (a) phenolic resin relative to 100% by mass of the non-volatile components of the resin composition for the cladding is the same as the range of the amount of (A) the phenolic resin relative to 100% by mass of the non-volatile components of the resin composition for the core. sell.
  • the range of the amounts of the components (A-1), (A-2) and (A-3) with respect to 100% by mass of the non-volatile components of the resin composition for the cladding are the non-volatile components of the resin composition for the core. It can be the same as the range of the amounts of the components (A-1), (A-2) and (A-3) with respect to 100% by mass.
  • the (a) phenolic resin contained in the clad resin composition and the (A) phenolic resin contained in the core resin composition may be the same or different.
  • the refractive index n clad of the cured clad resin composition can be adjusted by (a) the composition of the phenolic resin. Therefore, the specific type and amount of (a) the phenol resin can be set according to the range of the refractive index n clad of the cured product of the clad resin composition. Therefore, from the viewpoint of obtaining an optical waveguide having a desired aperture NA by adjusting the composition of (a) the phenolic resin, at least part of the (a) phenolic resin in the clad resin composition is the same as the core resin composition. (A) is preferably different from the phenol resin.
  • At least part of the phenolic resin (a) in the clad resin composition is preferably the same as (A) the phenolic resin of the core resin composition. That is, it is preferable that one or more common phenolic resins are contained in both the core resin composition and the clad resin composition.
  • the common phenolic resin contained in the (a) phenolic resin (that is, both the core resin composition and the clad resin composition
  • the amount of the phenolic resin commonly contained in the resin) may be 100% by mass or less, but is preferably in a specific range of less than 100% by mass.
  • the range of the amount of the common phenolic resin contained in (a) the phenolic resin is preferably 40% by mass or more, more preferably 50% by mass or more, particularly preferably 60% by mass or more, and preferably 99% by mass. It is 0% by mass or less, more preferably 98.5% by mass or less, and particularly preferably 98.0% by mass or less.
  • a preferred combination of (A) the phenolic resin of the core resin composition and (a) the phenolic resin of the clad resin composition includes, for example, (A) a phenolic resin containing a structure having a function of increasing the refractive index.
  • a combination of a phenolic resin and (a) a phenolic resin that does not contain the phenolic resin containing the structure having the effect of increasing the refractive index can be mentioned.
  • a phenolic resin containing a phenolic resin e.g., a fluorine-based phenolic resin
  • a phenolic resin containing a structure having an effect of lowering the refractive index e.g., a fluorine-based phenolic resin
  • a phenolic resin containing a structure having an effect of lowering the refractive index e.g., a fluorine-based phenolic resin
  • A a phenolic resin that does not contain
  • A) phenolic resin and (a) phenolic resin preferably contain one or more common phenolic resins.
  • the range of the amount of the fluorine-based phenolic resin with respect to 100% by mass of the total phenolic resin (a) is preferably 0.1% by mass or more, More preferably 0.2% by mass or more, particularly preferably 0.5% by mass or more, preferably 40% by mass or less, more preferably 30% by mass or less, and particularly preferably 20% by mass or less.
  • the range of the mass of fluorine atoms contained in the resin composition for cladding is preferably 0.01% by mass or more, more preferably 0.02% by mass, relative to 100% by mass of the non-volatile components of the resin composition for cladding. above, particularly preferably 0.03% by mass or more, preferably 10% by mass or less, more preferably 7% by mass or less, still more preferably 5% by mass or less, 1.0% by mass or less, and 0.9% by mass % or less, or 0.8 mass % or less.
  • the clad resin composition contains (b) a photoacid generator as the (b) component.
  • a photoacid generator of the clad resin composition those in the same range as the (B) photoacid generator of the core resin composition can be used.
  • the range of the amount of the (b) photoacid generator contained in the clad resin composition may be the same as the range of the amount of the (B) photoacid generator contained in the core resin composition.
  • the range of the amount of the photoacid generator (b) with respect to 100% by mass of the nonvolatile components of the resin composition for the cladding is the range of the amount of the photoacid generator (B) with respect to 100% by mass of the nonvolatile components of the resin composition for the core.
  • the use of (b) the photoacid generator can provide the clad resin composition with the same advantages as the core resin composition provided by the (B) photoacid generator.
  • the (b) photoacid generator contained in the clad resin composition and the (B) photoacid generator contained in the core resin composition may be the same or different.
  • the (b) photoacid generator of the clad resin composition is the same one or two or more common photoacid generators contained in the core resin composition. is preferably included.
  • the amount of the common photoacid generator contained in the (b) photoacid generator is preferably 80% by mass or more, more preferably 80% by mass or more, relative to the total 100% by mass of the (b) photoacid generator in the clad resin composition. is 90% by mass or more, particularly preferably 100% by mass.
  • the clad resin composition contains (c) a cross-linking agent as the (c) component.
  • the (c) cross-linking agent for the clad resin composition those in the same range as the (C) cross-linking agent for the core resin composition can be used.
  • the range of the amount of the (c) cross-linking agent contained in the clad resin composition may be the same as the range of the amount of the (C) cross-linking agent contained in the core resin composition.
  • the range of the amount of the (c) cross-linking agent relative to 100% by mass of the non-volatile components of the resin composition for the cladding is the same as the range of the amount of the (C) cross-linking agent relative to 100% by mass of the non-volatile components of the resin composition for the core. sell.
  • the use of (c) the cross-linking agent can provide the clad resin composition with the same advantages as the core resin composition provided by the (C) cross-linking agent.
  • the (c) cross-linking agent contained in the clad resin composition and the (C) cross-linking agent contained in the core resin composition may be the same or different.
  • the (c) cross-linking agent of the clad resin composition may contain the same one or two or more common cross-linking agents as contained in the core resin composition.
  • the amount of the common crosslinking agent contained in the (c) crosslinking agent is preferably 80% by mass or more, more preferably 90% by mass or more, relative to 100% by mass of the total (c) crosslinking agent in the clad resin composition. Yes, particularly preferably 100% by mass.
  • the clad resin composition may contain (d) a polymer as an optional component in combination with the components (a) to (c) described above.
  • the (d) polymer as the (d) component of the clad resin composition those in the same range as the (D) polymer of the core resin composition can be used.
  • the range of the amount of the (d) polymer contained in the clad resin composition may be the same as the range of the amount of the (D) polymer contained in the core resin composition.
  • the range of the amount of the (d) polymer relative to 100% by mass of the non-volatile components of the resin composition for the cladding can be the same as the range of the amount of the (D) polymer relative to 100% by mass of the non-volatile components of the resin composition for the core.
  • the (d) polymer provides the same advantages in the cladding resin composition as the (D) polymer provides in the core resin composition.
  • the (d) polymer contained in the clad resin composition and the (D) polymer contained in the core resin composition may be the same or different.
  • the (d) polymer of the clad resin composition preferably contains the same one or two or more common polymers contained in the core resin composition.
  • the amount of the common polymer contained in the (d) polymer is preferably 80% by mass or more, more preferably 90% by mass or more, relative to the total 100% by mass of the (d) polymer in the clad resin composition, and particularly Preferably it is 100% by mass.
  • the clad resin composition contains (e) an amine-based compound (that is, a compound represented by formula (E-1)) as an optional component in combination with the components (a) to (d) described above.
  • an amine-based compound that is, a compound represented by formula (E-1)
  • You can As the (e) amine-based compound as the (e) component of the clad resin composition those in the same range as the (E) amine-based compound of the core resin composition can be used.
  • the range of the amount of (e) the amine compound contained in the clad resin composition may be the same as the range of the amount of (E) the amine compound contained in the core resin composition.
  • the range of the amount of the (e) amine compound relative to 100% by mass of the nonvolatile components of the resin composition for the cladding is the same as the range of the amount of the (E) amine compound relative to 100% by mass of the nonvolatile components of the resin composition for the core.
  • (e) an amine compound can provide the clad resin composition with the same advantages as the core resin composition provided by the (E) amine compound.
  • the (e) amine compound contained in the clad resin composition and the (E) amine compound contained in the core resin composition may be the same or different.
  • the (e) amine-based compound of the clad resin composition contains one or more common amine-based compounds that are the same as those contained in the core resin composition. is preferred.
  • the amount of the common amine-based compound contained in the (e) amine-based compound is preferably 80% by mass or more, more preferably 90% by mass, with respect to 100% by mass of the (e) amine-based compound in the clad resin composition. % or more, particularly preferably 100% by mass.
  • the clad resin composition may further contain (f) any additive as an optional component in combination with the above-described components (a) to (e).
  • the (f) optional additive as the (f) component of the clad resin composition those in the same range as the (F) optional additive of the core resin composition can be used.
  • the range of the amount of the optional additive (f) contained in the resin composition for the clad may be the same as the range of the amount of the optional additive (F) contained in the resin composition for the core.
  • the clad resin composition may contain (g) a solvent as a volatile component in combination with the non-volatile components such as components (a) to (f) described above.
  • a solvent as a volatile component in combination with the non-volatile components such as components (a) to (f) described above.
  • the (g) solvent as the (g) component of the clad resin composition those in the same range as the (G) solvent of the core resin composition can be used.
  • the range of the amount of the (g) solvent contained in the clad resin composition may be the same as the range of the (G) solvent contained in the core resin composition.
  • the use of the (g) solvent can provide the clad resin composition with the same advantages as the use of the (G) solvent for the core resin composition.
  • the clad resin composition can be produced by mixing each component to be contained in the clad resin composition. Therefore, the clad resin composition can be produced by mixing components (a) to (c) and, if necessary, components (d) to (g). The mixing method may be the same as in the production of the core resin composition.
  • the clad resin composition preferably has excellent resolution.
  • the aspect ratio of each line layer can be preferably 0.6 or more, more preferably 1 or more.
  • the clad resin composition described above can be cured by exposure and, if necessary, heating. Therefore, a cured product can be obtained from the clad resin composition.
  • volatile components such as (g) solvent can volatilize due to heat during drying or curing, but nonvolatile components such as components (a) to (f) volatilize do not. Therefore, the cured product of the clad resin composition may contain the non-volatile component of the clad resin composition or its reaction product.
  • the resin composition for clad a cured product having a refractive index suitable for forming an optical waveguide can be obtained.
  • the specific refractive index n clad of the cured product of the clad resin composition is not limited as long as an optical waveguide with a desired aperture NA can be obtained.
  • the refractive index n clad of the cured product of the clad resin composition at a measurement wavelength of 1310 nm is preferably 1.4000 or more, more preferably 1.5000 or more, particularly preferably 1.5900 or more, and preferably 1.5900 or more. It is 6500 or less, more preferably 1.61000 or less, and particularly preferably 1.6006 or less.
  • the refractive index of the resin composition for cladding can be measured by the method described in [Measurement of refractive index of cured product of resin composition] in Examples described later.
  • the elongation at break of the cured product is measured by the method described in [Measurement of elongation at break of cured product of resin composition] in Examples described later, the elongation at break is preferably 1% or more. can have
  • a cured product with excellent heat resistance can be obtained.
  • the cured product obtained under the conditions described in Examples described later is heat-treated under the conditions described in "(Observation of appearance after reflow)"
  • the generation of voids can be suppressed.
  • peeling of the cured product from a base material such as a silicon wafer can be suppressed.
  • the clad resin composition can be used as a photosensitive resin composition for forming the clad layer of the optical waveguide.
  • the clad resin composition can be used to form an optical waveguide capable of transmitting light with a wavelength of 1300 nm to 1320 nm.
  • the clad resin composition is preferably used for forming a single-mode optical waveguide, for example, for forming a single-mode optical waveguide for light with a wavelength of 1310 nm.
  • n core represents the refractive index of the cured core resin composition
  • n clad represents the refractive index of the cured clad resin composition.
  • the measurement wavelength of refractive index n core and refractive index n clad is the wavelength of the light transmitted through the optical waveguide, eg, 1310 nm.
  • the numerical aperture NA is usually larger than 0.05, preferably larger than 0.06, particularly preferably larger than 0.065, and usually smaller than 0.4, preferably 0.35 or less. , more preferably 0.3 or less, particularly preferably 0.2 or less.
  • the refractive index of a cured product of a photosensitive resin composition can be measured by the following method.
  • the photosensitive resin composition is exposed with an optimum exposure amount of 3000 mJ, and then heated at 90° C. for 3 minutes.
  • a 2.38% by mass tetramethylammonium hydroxide aqueous solution at 23° C. is sprayed at a spray pressure of 0.1 MPa for 30 seconds for development.
  • ultraviolet irradiation of 3 J/cm 2 is performed, and heat treatment is performed at 190° C. for 90 minutes in a nitrogen atmosphere to obtain a cured product.
  • the refractive index of this cured product is measured at normal temperature and normal pressure (23° C. and 1 atm).
  • the method described in [Measurement of refractive index of cured product of resin composition] in Examples can be adopted.
  • an optical waveguide comprising a core layer containing a cured product of the core resin composition and a clad layer containing a cured product of the clad resin composition suppresses light transmission loss.
  • the transmission loss of light at the measurement wavelength of the refractive indices n core and n clad is preferably 2.0 dB/cm or less, more preferably 1.8 dB/cm or less, and particularly preferably 1.6 dB/cm or less.
  • the lower limit of transmission loss is ideally 0.0 dB/cm, but is usually 0.1 dB/cm or more.
  • the transmission loss of the optical waveguide can be measured by the method described in [Evaluation of Optical Waveguide] in Examples described later.
  • the optical waveguide usually has excellent heat resistance, and thus can have excellent reflow resistance. Specifically, when the optical waveguide is subjected to heat treatment using a reflow device, the formation of voids can generally be suppressed. Furthermore, usually, when the above heat treatment is performed, the optical waveguide can be prevented from peeling off from the base material (for example, silicon wafer) on which the optical waveguide is provided.
  • the heat treatment using a reflow device can be performed, for example, by the method described in [Evaluation of Optical Waveguide] in Examples to be described later.
  • factors that cause transmission loss in an optical waveguide include attenuation due to absorption of light by the material contained in the core layer, and attenuation due to reflection of light at the interface between the core layer and the clad layer. included.
  • a cured product of a core resin composition containing a combination of components (A) to (C) can suppress light absorption.
  • the numerical aperture NA is within the above-described specific range, attenuation during reflection at the interface between the core layer and the clad layer can be suppressed.
  • heat is applied to the core resin composition and the clad resin composition when forming an optical waveguide. Therefore, although the core layer and the clad layer are given a thermal history, this thermal history may become locally non-uniform in a part of the optical waveguide. In this case, the difference in refractive index between the core layer and the clad layer may be too small at that portion, and the reflection at the interface at that portion may be insufficient.
  • the numerical aperture NA is within the above-mentioned specific range, even if a portion with uneven thermal history occurs, the refractive index difference between the core layer and the clad layer can be stably increased. It can suppress the attenuation of time.
  • the refractive index of part or all of the cured product may fluctuate due to stress applied during handling. If the refractive index fluctuates and there is a portion where the refractive index difference between the core layer and the clad layer is too small, reflection at the interface may be insufficient at that portion.
  • the numerical aperture NA is equal to or higher than the lower limit of the above range, the refractive index difference between the core layer and the clad layer can be stably increased even if stress is applied during handling. Therefore, attenuation during reflection at the interface can be suppressed.
  • the cured product of the core resin composition and the cured product of the clad resin composition should have a similar refractive index and therefore have a similar composition. can be done. Therefore, even if the refractive index fluctuates due to the effects of heat, moisture, etc., applied during manufacturing and use, the fluctuation can occur in the core layer and the clad layer to the same degree. Therefore, fluctuations in the refractive index difference between the core layer and the clad layer can be suppressed, and the refractive index difference can be stably increased, so that attenuation at the time of reflection at the interface can be suppressed.
  • the affinity between the core layer and the clad layer can be enhanced, so that the smoothness of the interface can be improved to a high degree. can be enhanced. Therefore, since it is possible to suppress the occurrence of a portion where the incident angle of light to the interface becomes small when viewed microscopically, it is possible to suppress leakage of light in the core layer to the clad layer, and attenuation at the time of reflection at the interface can be suppressed. can be suppressed.
  • the numerical apertures of commonly used light collection modules are relatively small.
  • the optical waveguide having the above numerical aperture NA can suppress light leakage when transmitting light to the light condensing module having a small numerical aperture as described above. Therefore, since it is possible to suppress the connection loss on the output side of the optical waveguide, it is also possible to suppress the transmission loss. Therefore, suppression of transmission loss can be achieved.
  • the cured product of the core resin composition and the cured product of the clad resin composition can usually have high heat resistance themselves. Furthermore, since the cured product of the core resin composition and the cured product of the clad resin composition can have a high affinity, it is possible to achieve smooth adhesion between the core layer and the clad layer. Air can be suppressed from remaining on the interface between the layers. Furthermore, since the adhesion between the core layer and the clad layer can be enhanced, peeling at the interface between the core layer and the clad layer can be suppressed. Therefore, formation of voids during heat treatment can be suppressed.
  • the cured product of the core resin composition and the cured product of the clad resin composition can have high mechanical strength, it is possible to suppress the occurrence of peeling (delamination) that accompanies resin breakage. It is possible to suppress peeling from. Therefore, it can usually have high heat resistance.
  • the core layer and the clad layer have similar properties such as linear thermal expansion coefficient (CTE) and stretchability. be able to. Therefore, in durability tests such as long-term heat resistance tests and wet heat tests, the core layer and the clad layer can exhibit similar refractive index fluctuation behavior. Therefore, since the heat resistance and moist heat resistance of the optical waveguide can be improved, it is possible to suppress the numerical aperture NA from unintentionally deviating from the design range due to the durability test, thereby suppressing the transmission loss.
  • CTE linear thermal expansion coefficient
  • the difference ⁇ CTE between the linear thermal expansion coefficient of the cured product of the core resin composition and the linear thermal expansion coefficient of the cured product of the clad resin composition should be small. preferable.
  • the specific range of the difference ⁇ CTE in linear thermal expansion coefficients is preferably 20 ppm/°C or less, more preferably 18 ppm/°C or less, and particularly preferably 15 ppm/°C or less.
  • the linear thermal expansion coefficient of the cured product of the core resin composition may be greater than the linear thermal expansion coefficient of the cured product of the clad resin composition. It is preferably larger than the coefficient of linear thermal expansion of the cured product of the resin composition.
  • the wavelength of the light transmitted by the optical waveguide manufactured using the core resin composition and the clad resin composition described above can be selected from various options.
  • preferred wavelength ranges for transmitted light may be 840 nm-860 nm (eg, 850 nm), 1300 nm-1320 nm (eg, 1310 nm), 1540 nm-1560 nm (eg, 1550 nm), and the like.
  • the core resin composition and the clad resin composition described above are preferably used for manufacturing an optical waveguide capable of transmitting light with a wavelength of 1300 nm to 1320 nm.
  • Optical waveguides include single-mode optical waveguides and multi-mode optical waveguides.
  • the core resin composition and the clad resin composition described above may be used for manufacturing a single-mode optical waveguide, or may be used for manufacturing a multi-mode optical waveguide.
  • the core resin composition and the clad resin composition described above are preferably used for manufacturing a single-mode optical waveguide. Therefore, for example, it is preferably used for manufacturing a single-mode optical waveguide for light in the preferred wavelength range.
  • the photosensitive resin composition such as the core resin composition and the clad resin composition described above may be used as a resin sheet.
  • a resin sheet is a sheet provided with a resin composition layer containing a photosensitive resin composition. Therefore, a resin sheet having a resin composition layer containing the core resin composition (hereinafter sometimes referred to as "core resin sheet”) is obtained from the core resin composition. Further, from the clad resin composition, a resin sheet having a resin composition layer containing the clad resin composition (hereinafter sometimes referred to as "clad resin sheet”) is obtained. Then, a sheet set including the core resin sheet and the clad resin sheet can be obtained as a sheet set for manufacturing an optical waveguide.
  • the same advantages as those of the above-described photosensitive resin composition set, core resin composition and clad resin composition can be obtained. Since the optical waveguide can be manufactured by the lamination method, the optical waveguide can be easily manufactured.
  • the resin composition layer of the core resin sheet usually contains the core resin composition, and preferably contains only the core resin composition.
  • the thickness of the resin composition layer of the core resin sheet can be set according to the thickness of the core layer. Specifically, the thickness of the resin composition layer of the core resin sheet is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, still more preferably 3 ⁇ m or more, and more preferably 100 ⁇ m or less. 50 ⁇ m or less, particularly preferably 20 ⁇ m or less.
  • the core resin sheet may have a support.
  • the core resin sheet may comprise a support and a resin composition layer formed on the support.
  • the support include polyethylene terephthalate film, polyethylene naphthalate film, polypropylene film, polyethylene film, polyvinyl alcohol film, triacetyl acetate film and the like, and polyethylene terephthalate film is particularly preferred.
  • Commercially available supports include, for example, product names “Alphan MA-410” and “E-200C” manufactured by Oji Paper Co., Ltd., polypropylene films manufactured by Shin-Etsu Film Co., Ltd., and product name “PS-25” manufactured by Teijin Limited. and polyethylene terephthalate films such as PS series.
  • the surface of the support may be coated with a release agent such as an alkyd release agent or a silicone coating agent.
  • the thickness of the support is preferably in the range of 5 ⁇ m to 100 ⁇ m, more preferably in the range of 10 ⁇ m to 50 ⁇ m.
  • the core resin sheet may be provided with a protective film that protects the resin composition layer.
  • the protective film is provided on the opposite side of the resin composition layer to the support.
  • the protective film for example, a film made of the same material as the support can be used.
  • the adhesive strength between the protective film and the resin composition layer is preferably smaller than the adhesive strength between the support and the resin composition layer.
  • the core resin sheet is usually used after peeling off the protective film.
  • the core resin sheet can be produced, for example, by coating a core resin composition on a support. From the viewpoint of smooth application, a varnish-like core resin composition containing a solvent may be prepared, and the varnish-like core resin composition may be applied. When a core resin composition containing a solvent is applied, it may be dried after application, if necessary.
  • the resin composition layer included in the core resin sheet may contain a solvent, but the amount of the solvent is preferably small.
  • the range of the amount of solvent contained in the resin composition layer is preferably 10% by mass or less, more preferably 5% by mass or less, and 2% by mass or less with respect to the total amount of 100% by mass of the resin composition layer. More preferred.
  • the resin composition layer of the clad resin sheet usually contains the clad resin composition, and preferably contains only the clad resin composition.
  • the thickness of the resin composition layer of the clad resin sheet can be set according to the thickness of the clad layer. Specifically, the thickness of the resin composition layer of the clad resin sheet is preferably 5 ⁇ m or more, more preferably 7 ⁇ m or more, still more preferably 10 ⁇ m or more, and preferably 40 ⁇ m or less, more preferably 30 ⁇ m or less. , particularly preferably 20 ⁇ m or less.
  • the clad resin sheet may be the same as the core resin sheet, except that the resin composition layer containing the clad resin composition is provided instead of the resin composition layer containing the core resin composition. Therefore, the clad resin sheet may include a support.
  • the support for the clad resin sheet may be the same as the support for the core resin sheet.
  • the clad resin sheet may be provided with a protective film.
  • the protective film of the clad resin sheet may be the same as the protective film of the core resin sheet. Usually, the clad resin sheet is used after peeling off the protective film.
  • the clad resin sheet can be produced by the same method as the core resin sheet, except that the clad resin composition is used instead of the core resin composition.
  • the core resin composition, the core resin sheet, the clad resin composition, the clad resin sheet, the photosensitive resin composition set, and the sheet set described above can be used for manufacturing an optical waveguide.
  • embodiments of the optical waveguide will be described with reference to the drawings.
  • FIG. 1 is a perspective view schematically showing an optical waveguide 10 according to one embodiment of the invention.
  • the optical waveguide 10 has a core layer 100 and a clad layer 200 .
  • the core layer 100 contains a cured core resin composition, and preferably contains only a cured core resin composition.
  • the clad layer 200 contains a cured product of the clad resin composition, and preferably contains only a cured product of the clad resin composition.
  • wavelengths of light that can be transmitted by the optical waveguide 10 can be selected.
  • preferred wavelength ranges for transmitted light may be 840 nm-860 nm (eg, 850 nm), 1300 nm-1320 nm (eg, 1310 nm), 1540 nm-1560 nm (eg, 1550 nm), and the like.
  • the wavelength range of the light transmitted through the optical transmission line 10 is preferably 1300 nm to 1320 nm.
  • the optical waveguide 10 may be a single-mode optical waveguide or a multi-mode optical waveguide, but is preferably a single-mode optical waveguide.
  • the optical waveguide 10 is preferably a single-mode optical waveguide for light within the preferred wavelength range described above.
  • optical waveguide 10 is preferably a single-mode optical waveguide for 1310 nm light.
  • the width L of the core layer 100 is desirably set appropriately within a range in which light can be transmitted.
  • the range of the line width L of the core layer 100 is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, particularly preferably 2 ⁇ m or more, preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less, and particularly preferably 20 ⁇ m. or less, and may be 10 ⁇ m or less or 5 ⁇ m or less.
  • the width L of the core layer 100 corresponds to the line width (line) of the core layer 100 when viewed in the thickness direction.
  • the range of the thickness T of the core layer 100 is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, particularly preferably 2 ⁇ m or more, and preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less, and particularly preferably 20 ⁇ m or less. and may be 10 ⁇ m or less.
  • the thickness of the cladding layer 200 is usually greater than the thickness of the core layer 100.
  • the specific thickness of the cladding layer 200 is preferably 5 ⁇ m or more, more preferably 7 ⁇ m or more, particularly preferably 10 ⁇ m or more, and preferably 100 ⁇ m or less, more preferably 60 ⁇ m or less, still more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m. Below, it is particularly preferably 20 ⁇ m or less.
  • optical waveguide 10 may include arbitrary elements other than the core layer 100 and the clad layer 200 as required.
  • optical waveguide 10 may comprise substrate 300 .
  • a clad layer 200 is normally provided on the base material 300 and a core layer 100 is provided within the clad layer 200 .
  • a hard substrate such as a glass substrate, a metal substrate, a ceramics substrate, a wafer, or a circuit substrate
  • Wafers include, for example, silicon wafers, gallium arsenide (GaAs) wafers, indium phosphide (InP) wafers, gallium phosphide (GaP) wafers, gallium nitride (GaN) wafers, gallium tellurium (GaTe) wafers, and zinc selenide (ZnSe) wafers.
  • GaAs gallium arsenide
  • InP indium phosphide
  • GaP gallium phosphide
  • GaN gallium nitride
  • GaTe gallium tellurium
  • ZnSe zinc selenide
  • a wafer, a semiconductor wafer such as a silicon carbide (SiC) wafer, or a pseudo-wafer may be used.
  • a plate-like member including mold resin and electronic components embedded in the mold resin can be used.
  • circuit boards include glass epoxy boards, metal boards, polyester boards, polyimide boards, BT resin boards, and thermosetting polyphenylene ether boards.
  • circuit board refers to a board having a patterned conductor layer (circuit) formed on one side or both sides of the board as described above.
  • the substrate 300 a film made of a plastic material such as polyethylene terephthalate, polyimide, or polyester may be used. Additionally, a flexible circuit board may be employed as the substrate 300 .
  • the optical waveguide 10 may also include a protective layer (not shown) that protects the core layer 100 and the clad layer 200 as an optional element.
  • the protective layer may be provided, for example, so as to cover the surface of the cladding layer 200 opposite to the substrate 300 .
  • the optical waveguide 10 can have small transmission loss as described above.
  • the optical waveguide 10 usually has excellent heat resistance, and can have, for example, excellent reflow resistance.
  • the optical waveguide 10 can be formed using a core resin composition and a clad resin composition having excellent resolution, fine wiring of the core layer is possible, and the line width is small as described above. L can be formed.
  • the optical waveguide 10 can be manufactured by using a combination of the core resin composition and the clad resin composition described above.
  • the optical waveguide 10 is Step (I) of forming a first composition layer containing a clad resin composition; Step (II) of subjecting the first composition layer to exposure treatment; Step (III) of curing the first composition layer; Step (IV) of forming a second composition layer containing the core resin composition on the first composition layer; A step (V) of exposing the second composition layer to light; A step (VI) of developing the second composition layer; a step (VII) of curing the second composition layer; A step (VIII) of forming a third composition layer containing a clad resin composition on the second composition layer; a step (IX) of exposing the third composition layer; Step (X) of curing the third composition layer; in this order.
  • FIG. 2 is a schematic cross-sectional view for explaining step (I) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (I) of forming a first composition layer 210 containing a clad resin composition.
  • step (I) of forming a first composition layer 210 on the substrate 300 will be described.
  • the clad resin composition may be applied in one step or in multiple steps. Moreover, you may implement combining a different coating method. In order to avoid contamination with foreign substances, it is preferable to carry out coating in an environment such as a clean room where foreign substances are less likely to occur.
  • the first composition layer 210 may be dried, if necessary. Drying can be performed using a drying device such as a hot air oven or a far-infrared oven. It is preferable to appropriately set the drying conditions according to the composition of the clad resin composition.
  • the drying temperature is preferably 50°C or higher, more preferably 70°C or higher, particularly preferably 80°C or higher, preferably 150°C or lower, more preferably 130°C or lower, and particularly preferably 120°C. It is below.
  • the drying time is preferably 30 seconds or longer, more preferably 60 seconds or longer, particularly preferably 120 seconds or longer, and preferably 60 minutes or shorter, more preferably 20 minutes or shorter, and particularly preferably 5 minutes or shorter.
  • the first composition layer 210 may be formed using a clad resin sheet.
  • the first composition layer 210 can be formed on the substrate 300 by laminating the resin composition layer of the clad resin sheet on the substrate 300 .
  • Lamination is usually performed by pressing the resin composition layer of the resin sheet onto the substrate 300 while heating. This lamination is preferably carried out under reduced pressure by a vacuum lamination method.
  • a preheating treatment for heating the resin sheet and the base material may be performed.
  • the lamination conditions are, for example, a pressure bonding temperature (laminating temperature) of 70° C. to 140° C., a pressure of 1 kgf/cm 2 to 11 kgf/cm 2 (9.8 ⁇ 10 4 N/m 2 to 107.9 ⁇ 10 4 N/ m 2 ) and a crimping time of 5 seconds to 300 seconds.
  • lamination is preferably performed under a reduced pressure of 20 mmHg (26.7 hPa) or less.
  • the lamination may be performed in batch mode or continuously using rolls.
  • the vacuum lamination method can be performed using a commercially available vacuum laminator.
  • Commercially available vacuum laminators include, for example, a vacuum applicator manufactured by Nikko Materials, a vacuum pressurized laminator manufactured by Meiki Seisakusho, a roll-type dry coater manufactured by Hitachi Industries, and a vacuum laminator manufactured by Hitachi AIC. be able to.
  • the support is usually peeled off at an appropriate time before step (IV).
  • the first composition layer 210 formed on the substrate 300 in step (I) usually contains the clad resin composition, and preferably contains only the clad resin composition.
  • the amount of light exposure is desirably set so that the curing of the first composition layer 210 in step (III) can proceed.
  • the specific exposure dose range is preferably 10 mJ/cm 2 or more, more preferably 50 mJ/cm 2 or more, particularly preferably 200 mJ/cm 2 or more, and preferably 10,000 mJ/cm 2 or less. It is more preferably 8,000 mJ/cm 2 or less, still more preferably 4,000 mJ/cm 2 or less, and particularly preferably 1,000 mJ/cm 2 or less.
  • first composition layer 210 is formed using a clad resin sheet having a support
  • a support (not shown) must be present on first composition layer 210 in step (II).
  • the exposure may be performed through the support, or the exposure may be performed after the support is peeled off.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (III) of curing the first composition layer 210 after step (II).
  • This step (III) usually includes heat-treating the first composition layer 210 .
  • the first composition layer 210 can be cured by promoting the cross-linking reaction of the cross-linking agent (c) using the acid generated in step (II) as a catalyst.
  • the heat treatment conditions may be selected according to the type and amount of the resin component in the clad fat composition, preferably 150° C. to 250° C. for 20 minutes to 180 minutes, more preferably 160° C. to 230° C. °C for 30 minutes to 120 minutes.
  • the heat treatment is preferably performed in an inert atmosphere such as a nitrogen atmosphere.
  • FIG. 3 is a schematic cross-sectional view for explaining the step (III) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • a cured first composition layer 220 is obtained on the substrate 300, as shown in FIG.
  • This cured first composition layer 220 forms part of the clad layer 200 and is hereinafter sometimes referred to as the “lower clad layer” 220 .
  • FIG. 4 is a schematic cross-sectional view for explaining step (IV) of the method for manufacturing an optical waveguide according to one embodiment of the present invention.
  • step (IV) of forming a second composition layer 110 comprising:
  • the method of forming the second composition layer 110 is not particularly limited.
  • the second composition layer 110 may be formed by coating the core resin composition on the lower clad layer 220 .
  • a varnish-like core resin composition containing a solvent may be prepared, and the varnish-like core resin composition may be applied.
  • the core resin composition can be applied in the same manner as the clad resin composition.
  • the second composition layer 110 may be dried, if necessary. The drying of the second composition layer 110 can employ the same method and conditions as the drying of the first composition layer 210 .
  • the second composition layer 110 may be formed using a core resin sheet.
  • the second composition layer 110 can be formed on the lower clad layer 220 by laminating the resin composition layer of the core resin sheet to the lower clad layer 220 .
  • the core resin sheet can be laminated in the same manner as the cladding resin sheet.
  • the support is usually peeled off at an appropriate time before step (VI).
  • the second composition layer 110 formed on the lower clad layer 220 in step (IV) usually contains the core resin composition, and preferably contains only the core resin composition.
  • FIG. 5 is a schematic cross-sectional view for explaining the step (V) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (V) of exposing the second composition layer 110 after step (IV), as shown in FIG.
  • a latent image is formed on the second composition layer 110 by exposure processing. Specifically, in the exposure process, a specific portion of the second composition layer 110 is selectively irradiated with the light P. Therefore, when exposed to light, the second composition layer 110 is provided with exposed portions 111 irradiated with light and non-exposed portions 112 not irradiated with light. Since the core resin composition usually functions as a negative photosensitive resin composition, the exposed portion 111 forms a latent image corresponding to the core layer.
  • the exposure processing in step (V) is usually performed using the mask 400 .
  • the second composition layer 110 is irradiated with light P through a mask 400 having a light transmitting portion 410 and a light blocking portion 420 .
  • the light P passes through the translucent portion 410 and enters the exposed portion 111 , but cannot pass through the light blocking portion 420 and therefore cannot enter the non-exposed portion 112 . Therefore, the exposed portion 111 and the non-exposed portion 112 corresponding to the translucent portion 410 and the light shielding portion 420 can be provided in the second composition layer 110 .
  • the mask 400 may be adhered to the second composition layer 110 as shown in FIG. 5 (contact exposure method), or may be exposed using parallel light without being adhered (non-contact exposure method). .
  • the light transmitting portion 410 of the mask 400 is formed to have a planar shape corresponding to the core layer of the optical waveguide. Therefore, the light shielding portion 420 of the mask 400 is formed to have a planar shape corresponding to the portion of the optical waveguide where the core layer is absent.
  • a "planar shape” represents a shape viewed from the thickness direction unless otherwise specified.
  • the light-transmitting portion 410 formed in a planar shape corresponding to the core layer may be hereinafter referred to as a "mask pattern".
  • actinic rays in the same range as in the exposure treatment for the first composition layer 210 in step (II) can be used.
  • the exposure amount of light P is preferably set so that a desired core layer can be formed after curing in step (VII).
  • the specific exposure dose range in step (V) may be the same range as the exposure dose for the first composition layer 210 in step (II).
  • the support (not shown) must be present on the second composition layer 110 in step (V).
  • the exposure may be performed through the support, or the exposure may be performed after the support is peeled off.
  • the photoacid generator Since the core resin composition functions as a negative photosensitive resin composition, (B) the photoacid generator generates acid in the exposed portion 111 . Then, since the acid acts as a catalyst, the cross-linking reaction of the cross-linking agent (C) proceeds and the solubility in the developer decreases. On the other hand, in the non-exposed portion 112, since the (B) photoacid generator does not generate acid, the cross-linking reaction of the (C) cross-linking agent does not proceed or progresses only slightly, and thus the solubility in the developer is high. Using the difference in solubility between the exposed portion 111 and the non-exposed portion 112, development processing is performed in the subsequent step (VI).
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention may include a step (XI) of heating the second composition layer 110 after step (V) and before step (VI).
  • the heating in step (XI) can promote the cross-linking reaction of the cross-linking agent (C). Therefore, the solubility of the exposed portion 111 in the developer can be rapidly lowered.
  • Heating in step (XI) may be performed with a hot plate or in an oven.
  • the heating temperature can be, for example, 40° C. or higher and 110° C. or lower.
  • the heating time can be, for example, 30 seconds or more and 60 minutes or less.
  • FIG. 6 is a schematic cross-sectional view for explaining the step (VI) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (VI) of developing the second composition layer 110 after step (V). According to the development process, the latent image formed in step (V) can be developed. Since the core resin composition functions as a negative photosensitive resin composition, as shown in FIG. 6, the exposed portions 111 are not removed by the development treatment, while the non-exposed portions 112 (see FIG. 5) are removed. be.
  • the exposed portion 111 of the second composition layer 110 remaining after development may have the same planar shape as the mask pattern of the transparent portion 410 (see FIG. 5) of the mask 400 used in step (V).
  • the development method is usually a wet development method in which the second composition layer 110 is brought into contact with a developer.
  • the developer include an alkaline aqueous solution, an aqueous developer, an organic solvent, and the like.
  • an alkaline aqueous solution as a developer is an aqueous solution of an alkali metal compound.
  • alkali metal compounds include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide and potassium hydroxide; alkali metal carbonates and bicarbonates such as sodium carbonate and sodium bicarbonate; sodium phosphate; , alkali metal phosphates such as potassium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate;
  • the alkaline aqueous solution include aqueous solutions of organic bases containing no metal ions, such as tetraalkylammonium hydroxide.
  • alkaline aqueous solution may be used alone, or two or more types may be used in combination. Among them, an aqueous solution of tetramethylammonium hydroxide (TMAH) is preferable because it does not contain metal ions.
  • TMAH tetramethylammonium hydroxide
  • the pH range of the alkaline aqueous solution is preferably 8 or higher, more preferably 9 or higher, preferably 14 or lower, more preferably 12 or lower, and particularly preferably 11 or lower.
  • the base concentration of the alkaline aqueous solution is preferably 0.1% by mass to 10% by mass.
  • Examples of the organic solvent as the developer include acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono butyl ether and the like.
  • An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more types.
  • the concentration of the organic solvent is usually 2% by mass or more, preferably 50% by mass or more, more preferably 70% by mass or more, and particularly preferably 90% by mass or more, relative to the total amount of the developer. 100% by weight of the developer may be an organic solvent.
  • Organic solvent-based developers used alone include, for example, 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and ⁇ -butyrolactone.
  • the developer may, if necessary, contain additives such as surfactants and antifoaming agents in order to improve the development action.
  • the development time is preferably 10 seconds to 5 minutes.
  • the temperature of the developer during development is not particularly specified, but is preferably 20° C. or higher, preferably 50° C. or lower, and more preferably 40° C. or lower.
  • Examples of developing methods include paddle method, spray method, immersion method, brushing method, slapping method, and ultrasonic method.
  • the spray method is suitable for improving the resolution.
  • the spray pressure is preferably 0.05 MPa to 0.3 MPa.
  • the second composition layer 110 may be rinsed.
  • Rinsing is preferably done with a solvent different from the developer.
  • the same type of solvent or water that is included in the core resin composition may be used for rinsing.
  • Rinsing time is preferably 5 seconds to 1 minute.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (VII) of curing the second composition layer 110 after step (VI).
  • This step (VII) usually includes heat-treating the second composition layer 110 .
  • the second composition layer 110 can be cured by promoting the cross-linking reaction of the (C) cross-linking agent.
  • the heat treatment conditions may be selected according to the type and amount of the resin component in the core fat composition.
  • the heat treatment conditions in step (VII) may be the same as the heat treatment conditions for the first composition layer 210 in step (III).
  • FIG. 7 is a schematic cross-sectional view for explaining the step (VII) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view for explaining the step (VIII) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention forms a third composition layer 230 containing a clad resin composition on the core layer 100 after step (VII). including step (VIII).
  • the third composition layer 230 is generally formed to cover the entire peripheral surface of the core layer 100 that is not in contact with the lower clad layer 220 . Therefore, the third composition layer 230 is formed to cover the core layer 100 and also on the lower clad layer 220 .
  • the method of forming the third composition layer 230 is not particularly limited.
  • the third composition layer 230 may be formed by applying a clad resin composition onto the core layer 100 .
  • the clad resin composition may be applied to the lower clad layer 220 as necessary.
  • the coating of the clad resin composition for forming the third composition layer 230 can be performed in the same manner as the coating of the clad resin composition for forming the first composition layer 210 .
  • the third composition layer 230 may be dried, if necessary. The drying of the third composition layer 230 can employ the same method and conditions as the drying of the first composition layer 210 .
  • the third composition layer 230 may be formed using a clad resin sheet.
  • the third composition layer 230 can be formed on the core layer 100 by laminating the resin composition layer of the clad resin sheet on the core layer 100 .
  • the resin composition layer of the clad resin sheet may be laminated to the lower clad layer 220 if necessary.
  • the clad resin sheet for forming the third composition layer 230 can be laminated in the same manner as the clad resin sheet for forming the first composition layer 210 .
  • the support may be removed in any step.
  • the third composition layer 230 formed on the core layer 100 in step (VIII) usually contains the clad resin composition, and preferably contains only the clad resin composition.
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (IX) of exposing the third composition layer 230 after step (VIII).
  • the third composition layer 230 is irradiated with light.
  • the (b) photoacid generator generates acid in the third composition layer 230 .
  • the exposure treatment for the third composition layer 230 can be performed in the same manner as the exposure treatment for the first composition layer 210 .
  • the method for manufacturing an optical waveguide according to one embodiment of the present invention includes step (X) of curing the third composition layer 230 after step (IX).
  • This step (X) usually includes heat-treating the third composition layer 230 .
  • the third composition layer 230 can be cured by promoting the cross-linking reaction of the cross-linking agent (c) using the acid generated in step (IX) as a catalyst.
  • the heat treatment for the third composition layer 230 can be performed in the same manner as the heat treatment for the first composition layer 210 .
  • FIG. 9 is a schematic cross-sectional view for explaining the step (X) of the optical waveguide manufacturing method according to one embodiment of the present invention.
  • a cured third composition layer 240 is obtained on the core layer 100 as shown in FIG.
  • This cured third composition layer 240 forms part of the clad layer 200 and is hereinafter sometimes referred to as the “upper clad layer” 240 .
  • the clad layer 200 is formed from the upper clad layer 240 and the lower clad layer 220 . Therefore, the optical waveguide 10 including the clad layer 200 including the lower clad layer 220 and the upper clad layer 240 and the core layer 100 provided within the clad layer 200 can be obtained.
  • the method for manufacturing the optical waveguide 10 may further include arbitrary steps in combination with the steps described above.
  • the method of manufacturing the optical waveguide 10 may include, for example, a step of forming a protective layer (not shown).
  • the method for manufacturing the optical waveguide 10 may include, for example, a step of dicing the manufactured optical waveguide 10 .
  • the method for manufacturing the optical waveguide 10 may repeat the steps described above. For example, steps (I) to (XI) may be repeated to manufacture a multi-layered optical waveguide having core layers and clad layers alternately formed on the substrate 300 in the thickness direction.
  • An opto-electric hybrid board includes the optical waveguide described above.
  • An opto-electric hybrid board usually includes an optical waveguide and an electric circuit board.
  • An electric circuit board may include electronic components and wiring connected to the electronic components. Examples of electronic components include passive components such as capacitors, inductors, and resistors; active components such as semiconductor chips;
  • the optical waveguide and the wiring of the electric circuit board can be connected via the photoelectric conversion element.
  • a photoelectric conversion element can include a combination of a light-emitting element capable of converting electricity into light (for example, a surface-emitting type light-emitting diode) and a light-receiving element capable of converting light into electricity (for example, a photodiode).
  • the opto-electric hybrid board may include an optical element such as a mirror for optical path adjustment.
  • a preferred example of an opto-electric hybrid board is one having a chip in which an optical integrated circuit is formed on a silicon wafer. This chip is expected to be put into practical use at an early stage using silicon photonics, and is expected to be mounted on a semiconductor package, for example.
  • An opto-electric hybrid board including this chip includes, for example, an electric circuit board, a chip mounted on the electric circuit board, and an optical waveguide. An optical waveguide can be used to connect wires on an electric circuit board and a chip, or to connect a plurality of chips.
  • Chips manufactured with silicon photonics generally use light with wavelengths of 1310 nm and 1550 nm, with 1310 nm being the mainstream (Sho Yoshida, Daisuke Suganuma, Takaaki Ishigure, "Single Mode Polymer Conduction by Mosquito Method”). Fabrication of Wave Paths and Reduction of Loss", 28th Spring Meeting of the Japan Institute of Electronics Packaging, 2014). Therefore, the optical waveguide is preferably capable of transmitting light with wavelengths of 1310 nm and 1550 nm or near them, for example, light with wavelengths of 1300 nm to 1320 nm. According to the optical waveguides according to the above-described embodiments, it is possible to transmit light of these wavelengths.
  • a single-mode optical waveguide is preferable as an optical waveguide applied to an opto-electric hybrid circuit.
  • the width of the core layer is small.
  • an optical waveguide having a core layer with such a small width is preferable from the viewpoint of increasing the degree of freedom in package design when the optical waveguide is applied to a semiconductor package. According to the optical waveguide according to the embodiment described above, it is possible to reduce the width of the core layer as described above.
  • single-mode optical waveguides are generally desired to have a small numerical aperture NA. Since the optical waveguides according to the above-described embodiments can have a small numerical aperture NA, application to a single mode is possible also from the viewpoint of the numerical aperture NA.
  • those boards may be connected via optical fibers.
  • a plurality of opto-electric hybrid boards may be installed in a rack and connected to each other by optical fibers.
  • Optical fibers that connect substrates in this way are mainly multimode. Therefore, from the viewpoint of enabling connection with the optical fiber, a multimode optical waveguide may be employed as the optical waveguide provided on the opto-electric hybrid board.
  • the optical waveguide be applicable to both single mode and multimode. Furthermore, it is desirable to reduce the minimum width of the core layer of these optical waveguides to increase the flexibility of the line width of the core layer.
  • the optical waveguide according to the above-described embodiment by using the core resin composition and the clad resin composition as photosensitive resin compositions with excellent resolution, it is possible to achieve high fine wiring forming ability. The minimum width of the core layer can be reduced.
  • both single-mode and multi-mode optical waveguides can be obtained. Therefore, the optical waveguide according to the embodiment described above can be applied in a wide range. In addition to being applicable to such a wide range, the optical waveguide according to the above-described embodiments is suitable for application to an opto-electric hybrid board because it can suppress the transmission loss of light.
  • the modes of the optical waveguides to be connected are preferably the same, and the numerical apertures NA are preferably close.
  • NA1 ⁇ Na2 when light is transmitted from a first optical waveguide having a numerical aperture NA1 to a second optical waveguide having a numerical aperture NA2, it is desirable that NA1 ⁇ Na2 from the viewpoint of suppressing light leakage at the connecting portion. Therefore, when connecting a plurality of optical waveguides provided on one opto-electric hybrid board, it is desirable to appropriately set the numerical aperture NA of these optical waveguides as described above.
  • the optical waveguide when connecting an optical waveguide and an optical fiber, preferably has a numerical aperture NA within an appropriate range corresponding to the numerical aperture of the optical fiber.
  • NA the numerical aperture of the optical fiber.
  • the single-mode optical waveguide have a numerical aperture NA that is approximately equal to or less than the numerical aperture of the optical fiber.
  • the optical waveguides according to the above-described embodiments since transmission loss can be suppressed at a numerical aperture NA of 0.35 or less, they can be preferably applied to optical waveguides connected to single-mode optical fibers.
  • SPDI Spirobindanphenol manufactured by JFE Chemical Company.
  • TIS-RX manufactured by Taoka Chemical Co., Ltd., spiro[fluorene-9,9′-xanthene]-3′,6′-diol.
  • a polyethylene terephthalate film (“Lumirror T6AM” manufactured by Toray Industries, Inc., thickness 38 ⁇ m, softening point 130° C.) was prepared as a support.
  • a resin varnish is evenly applied to the support with a die coater so that the thickness of the resin composition layer after drying becomes 5 ⁇ m, 6.5 ⁇ m, 8 ⁇ m, 10 ⁇ m, 15 ⁇ m or 20 ⁇ m, and the temperature is maintained at 80° C. to 110° C. (maximum temperature 110° C.) for 7 minutes to form a resin composition layer.
  • a cover film (biaxially oriented polypropylene film, "MA-411” manufactured by Oji F-Tex Co., Ltd.) is placed on the surface of the resin composition layer and laminated at 80 ° C. to form a support/resin composition layer/ A resin sheet having a three-layer structure of a cover film was produced.
  • the refractive index of the cured product of the resin composition contained in the resin varnish produced in the production example described above was measured using a resin sheet by the following method.
  • the cover film was peeled off from the resin sheet having a resin composition layer with a thickness of 6.5 ⁇ m. After that, the resin sheet was laminated on a silicon wafer at 80° C., the support was peeled off, and a resin composition layer having a thickness of 6.5 ⁇ m was formed on the silicon wafer. Thereafter, the resin composition layer was exposed with an optimum exposure amount of 3000 mJ using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.). After exposure, after heating at 90° C.
  • a 2.38% by mass tetramethylammonium hydroxide aqueous solution at 23° C. was sprayed as a developer onto the resin composition layer at a spray pressure of 0.1 MPa for 30 seconds. Then, spray development was performed. After spray development, the resin composition layer was irradiated with ultraviolet rays at 3 J/cm 2 and further heat-treated at 190° C. for 90 minutes in a nitrogen atmosphere to obtain a sample formed of a cured product of the resin composition. .
  • the refractive index n (1310 nm) of the obtained sample was measured at room temperature and normal pressure using a 1310 nm laser beam with a 2010M prism coupler (manufactured by Metricon).
  • the copper layer of a glass epoxy substrate (copper-clad laminate) having a copper layer with a thickness of 18 ⁇ m was roughened with a surface treatment agent containing an organic acid (CZ8100, manufactured by MEC) to prepare a substrate. .
  • the cover film was peeled off from the resin sheet prepared in Production Example 1, laminated on the previous substrate at 100° C., and the support was peeled off to form a resin composition layer. Then, using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.), the entire surface of the resin composition layer was exposed at an optimum exposure amount of 3000 mJ. After exposure, the resin composition layer is heated at 90° C.
  • the resin composition layer was irradiated with ultraviolet rays at 3 J/cm 2 and heat-treated at 190° C. for 90 minutes in a nitrogen atmosphere to form a lower clad layer on the copper-clad laminate.
  • the cover film was peeled off from the resin sheet provided with the resin composition layer having a thickness of 10 ⁇ m produced in each production example described above.
  • a resin sheet is placed on the lower clad layer so that the resin composition layer of the resin sheet and the lower clad layer are in contact with each other, and a vacuum laminator ("VP160" manufactured by Nikko Materials Co., Ltd.) is used to laminate the lower clad.
  • a resin composition layer was formed on the layer.
  • Lamination conditions were as follows: vacuuming time of 30 seconds, compression temperature of 100° C., compression pressure of 0.7 MPa, and pressurization time of 30 seconds. As a result, a laminate having a copper-clad laminate, a lower clad layer, and a resin sheet in this order was obtained. After that, the support was peeled off to expose the resin composition layer.
  • the obtained sample was observed with a scanning electron microscope (SEM) (2000x magnification) to measure the minimum fine line formation width (the width of the line layer with the smallest width among the formed line layers).
  • the aspect ratio was calculated by dividing the line layer thickness by the minimum fine line formation width. If all line layers having a line width of 10 ⁇ m or less have an aspect ratio of 1 or more, the resolution is “excellent”, and all line layers having a line width of 10 ⁇ m or less have an aspect ratio of 0.6 or more and less than 1. If any, the resolution was evaluated as "good”, and if the aspect ratio of at least one line layer having a line width of 10 ⁇ m or less was less than 0.6, the resolution was evaluated as "poor".
  • the line width represents the width of the line layer.
  • the cover film was peeled off from the resin film provided with the resin composition layer having a thickness of 15 ⁇ m produced in the production example described above. Thereafter, the resin composition layer was subjected to ultraviolet irradiation of 1000 mJ and heating at 190° C. for 90 minutes in a nitrogen atmosphere to thermally cure the resin composition layer. Thereafter, the support was peeled off to obtain a sample film formed of the cured product of the resin composition.
  • the resulting sample film was subjected to a tensile test in accordance with Japanese Industrial Standards (JIS K7127) using a Tensilon universal testing machine ("RTC-1250A" manufactured by Orientec) to measure the elongation at break.
  • RTC-1250A Tensilon universal testing machine
  • “Excellent” The elongation at break is 1% or more.
  • “Poor” Elongation at break is less than 1%.
  • thermomechanical analysis was performed on the test piece by a tensile load method.
  • thermomechanical analysis after the test piece was mounted on the apparatus, measurements were continuously performed twice under the measurement conditions of a load of 1 g and a heating rate of 5° C./min.
  • the linear thermal expansion coefficient of the cured product was measured by calculating the average linear thermal expansion coefficient (ppm) from 25°C to 150°C in the second measurement.
  • the surface roughness of the cured product of the resin composition contained in the resin varnish produced in the production example described above was measured using a resin sheet by the following method. That is, the cover film was peeled off from the resin film provided with the resin composition layer having a thickness of 15 ⁇ m produced in Production Example. After that, the resin sheet was placed on a 4-inch silicon wafer so that the resin composition layer and the silicon wafer were in contact with each other, and laminated using a vacuum laminator ("VP160" manufactured by Nikko Materials Co., Ltd.). Lamination conditions were as follows: vacuuming time of 30 seconds, compression temperature of 100° C., compression pressure of 0.7 MPa, and pressurization time of 30 seconds.
  • the support was peeled off, and exposure was performed with ultraviolet rays of 3000 mJ using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.). After exposure, heating was performed at 90° C. for 3 minutes, and then a 2.38% by mass tetramethylammonium hydroxide aqueous solution at 23° C. was sprayed as a developer onto the resin composition layer at a spray pressure of 0.1 MPa for 30 seconds. Then, spray development was performed. After spray development, the film was placed in a clean oven, heated from room temperature to 190° C., and after reaching 190° C., heat treatment was performed for 90 minutes in a nitrogen atmosphere to cure the resin composition layer. The surface state of this cured product was evaluated with a non-contact interference microscope (manufactured by WYKO Bruker AXS), and the arithmetic mean roughness Ra was measured as the surface roughness of the cured product.
  • Tables 1 and 2 below show the compositions and physical properties of the resin compositions produced in the above production examples.
  • amounts of reagents represent parts by weight.
  • abbreviations have the following meanings.
  • F content Amount of fluorine atoms (% by mass) with respect to 100% by mass of non-volatile components in the resin composition.
  • n (1310 nm) Refractive index of the cured product of the resin composition at a measurement wavelength of 1310 nm. Abs: Absorbance of a resin composition solution at a measurement wavelength of 1310 nm.
  • CTE coefficient of linear thermal expansion of a cured resin composition.
  • Example 1 (1-1. Formation of lower clad layer)
  • the cover film was peeled off from the resin sheet having a resin composition layer with a thickness of 10 ⁇ m produced in Production Example 5.
  • a resin sheet was placed on a 4-inch silicon wafer so that the resin composition layer and the silicon wafer were in contact with each other, and laminated using a vacuum laminator (“VP160” manufactured by Nikko Materials Co., Ltd.).
  • Lamination conditions were as follows: vacuuming time of 30 seconds, compression temperature of 100° C., compression pressure of 0.7 MPa, and pressurization time of 30 seconds. After that, the support was peeled off to obtain an intermediate laminate I comprising a silicon wafer and a resin composition layer.
  • the resin composition layer of the intermediate laminate I was exposed to ultraviolet rays of 3000 mJ using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.). After the exposure, the intermediate laminate I was placed in a clean oven, heated from room temperature to 190° C., and after reaching 190° C., heat-treated for 90 minutes in a nitrogen atmosphere to cure the resin composition layer. .
  • a lower clad layer was formed by curing the resin composition layer to obtain an intermediate laminate II comprising a silicon wafer and a lower clad layer.
  • the cover film was peeled off from the resin sheet having a resin composition layer with a thickness of 5 ⁇ m produced in Production Example 1.
  • a resin sheet was placed on the surface of the lower clad layer of the intermediate laminate II so that the resin composition layer and the lower clad layer were in contact with each other, and laminated using a vacuum laminator (“VP160” manufactured by Nikko Materials Co., Ltd.). Lamination conditions were as follows: vacuuming time of 30 seconds, compression temperature of 100° C., compression pressure of 0.7 MPa, and pressurization time of 30 seconds. Thereafter, the support was peeled off to obtain an intermediate laminate III comprising a silicon wafer, a lower clad layer (underlying clad layer) and a resin composition layer in this order.
  • the resin composition layer of the intermediate laminate III was exposed to ultraviolet rays using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.) at an optimum exposure amount of 200 mJ to 2000 mJ.
  • a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 5 ⁇ m/100 ⁇ m and a length of 1 cm, and a plurality of straight lines with an L/S (line/space) of 5 ⁇ m/100 ⁇ m and a length of 2 cm were formed.
  • a quartz glass mask having a mask pattern capable of drawing and a mask pattern capable of drawing a plurality of straight lines with L/S (line/space) of 5 ⁇ m/100 ⁇ m and a length of 3 cm was used.
  • the line corresponds to the width of the core layer and the space corresponds to the interval between the core layers.
  • heating was performed at 90° C. for 3 minutes, and then a 2.38% by mass tetramethylammonium hydroxide aqueous solution at 23° C. was sprayed as a developer onto the resin composition layer at a spray pressure of 0.1 MPa for 30 seconds. Then, spray development was performed.
  • the intermediate laminate III is placed in a clean oven, heated from room temperature to 190° C., and after reaching 190° C., heat treatment is performed for 90 minutes in a nitrogen atmosphere to cure the resin composition layer.
  • rice field A core layer was formed by curing the resin composition layer to obtain an intermediate laminate IV comprising a silicon wafer, a lower clad layer and a core layer in this order.
  • the cover film was peeled off from the resin sheet having a resin composition layer with a thickness of 20 ⁇ m produced in Production Example 5.
  • a resin sheet was placed on the core layer of the intermediate laminate IV so that the resin composition layer and the core layer were in contact with each other, and laminated using a vacuum laminator (“VP160” manufactured by Nikko Materials Co., Ltd.). Lamination conditions were as follows: vacuuming time of 30 seconds, compression temperature of 100° C., compression pressure of 0.7 MPa, and pressurization time of 30 seconds. After that, the support was peeled off to obtain an intermediate laminate V comprising a silicon wafer, a lower clad layer, a core layer and a resin composition layer in this order.
  • the resin composition layer of the intermediate laminate V was exposed to ultraviolet rays of 3000 mJ using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.). After the exposure, the intermediate laminate V was placed in a clean oven, the temperature was raised from room temperature to 190° C., and after reaching 190° C., heat treatment was performed for 90 minutes in a nitrogen atmosphere to cure the resin composition layer. .
  • An upper clad layer was formed by curing the resin composition layer to obtain a sample laminate comprising a silicon wafer, a lower clad layer, a core layer and an upper clad layer in this order.
  • the combination of the lower clad layer and the upper clad layer constituted the clad layer. Therefore, an optical waveguide including the clad layer and the core layer in the clad layer was obtained.
  • the core layer has linear patterns of lengths 1 cm, 2 cm and 3 cm corresponding to the mask pattern of the quartz glass mask. The width (line width) and spacing (space) of the core layer matched the width (line width) and spacing (space) of the mask pattern.
  • Example 2 (2-1. Formation of lower clad layer) Silicon An intermediate laminate II comprising a wafer and an underlying cladding layer was produced.
  • Example 3 (3-1. Formation of lower clad layer) An intermediate laminate II comprising a silicon wafer and a lower clad layer was produced by the same method as the step (1-1) of Example 1.
  • the resin composition layer of the intermediate laminate III was exposed using a projection exposure apparatus ("UFX-2240" manufactured by Ushio Inc.) at an optimum exposure amount of 200 mJ to 2000 mJ.
  • a quartz glass mask having a mask pattern capable of drawing and a mask pattern capable of drawing a plurality of straight lines with L/S (line/space) of 3 ⁇ m/100 ⁇ m and a length of 3 cm was used.
  • Example 4 (4-1. Formation of lower clad layer) A silicon An intermediate laminate II comprising a wafer and an underlying cladding layer was produced.
  • Formation of the resin composition layer using the resin varnish produced in Production Example 4 was performed by the following method. That is, the resin varnish produced in Production Example 4 is applied onto a 4-inch silicon wafer using a spin coater (“MS-B100” manufactured by Mikasa Co., Ltd.), and dried by heating on a hot plate at 110° C. for 3 minutes. to form a resin composition layer having a thickness of 10 ⁇ m.
  • a spin coater (“MS-B100” manufactured by Mikasa Co., Ltd.
  • a resin sheet for forming a core layer As a resin sheet for forming a core layer, a resin sheet having a resin composition layer with a thickness of 8 ⁇ m produced in Production Example 1 was used. Further, a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 2 cm.
  • a quartz glass mask having a mask pattern capable of drawing a plurality of straight lines and a mask pattern capable of drawing a plurality of straight lines having an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 3 cm was changed.
  • a core layer was formed on the surface of the lower cladding layer of the intermediate laminate II obtained in the step (5-1) by the same method as in the step (1-2) of Example 1 except for the above matters, and silicon An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • the step (5- An upper clad layer was formed on the core layer of the intermediate laminate IV obtained in 2) to obtain a sample laminate comprising a silicon wafer, a lower clad layer, a core layer and an upper clad layer in this order.
  • Formation of the resin composition layer using the resin varnish produced in Production Example 4 was performed by the following method. That is, the resin varnish produced in Production Example 4 is applied to the surface of the core layer of the intermediate laminate IV using a spin coater (“MS-B100” manufactured by Mikasa Co., Ltd.), and heated on a hot plate at 110° C. for 3 minutes. Drying was performed to form a resin composition layer having a thickness of 20 ⁇ m.
  • a spin coater (“MS-B100” manufactured by Mikasa Co., Ltd.
  • Example 6 (6-1. Formation of lower clad layer) An intermediate laminate II comprising a silicon wafer and a lower clad layer was produced by the same method as the step (1-1) of Example 1.
  • the thickness of the core layer was changed to 5 ⁇ m by changing the coating thickness of the resin varnish.
  • a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 2 cm.
  • a quartz glass mask having a mask pattern capable of drawing a plurality of straight lines and a mask pattern capable of drawing a plurality of straight lines having an L/S (line/space) of 8 ⁇ m/100 ⁇ m and a length of 3 cm was changed.
  • a core layer is formed on the surface of the lower clad layer of the intermediate laminate II obtained in the step (6-1) by the same method as the step (3-2) of Example 3 except for the above items, and silicon An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • Example 7 (7-1. Formation of lower clad layer) An intermediate laminate II comprising a silicon wafer and a lower clad layer was produced by the same method as the step (1-1) of Example 1.
  • the thickness of the core layer was changed to 3 ⁇ m by changing the coating thickness of the resin varnish.
  • a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with a L/S (line/space) of 4.5 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with a L/S (line/space) of 4.5 ⁇ m/100 ⁇ m. Changed to a quartz glass mask having a mask pattern capable of drawing a plurality of straight lines with a length of 2 cm and a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 4.5 ⁇ m/100 ⁇ m and a length of 3 cm. bottom.
  • a core layer is formed on the surface of the lower clad layer of the intermediate laminate II obtained in the step (7-1) by the same method as the step (3-2) of Example 3 except for the above matters, and silicon An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • Example 8 (8-1. Formation of lower clad layer) A silicon An intermediate laminate II comprising a wafer and an underlying cladding layer was produced.
  • the thickness of the core layer was changed to 3 ⁇ m by changing the coating thickness of the resin varnish.
  • a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with a L/S (line/space) of 4.5 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with a L/S (line/space) of 4.5 ⁇ m/100 ⁇ m. Changed to a quartz glass mask having a mask pattern capable of drawing a plurality of straight lines with a length of 2 cm and a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 4.5 ⁇ m/100 ⁇ m and a length of 3 cm. bottom.
  • a core layer is formed on the surface of the lower clad layer of the intermediate laminate II obtained in the step (8-1) by the same method as in the step (3-2) of Example 3 except for the above matters, and silicon An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • Example 9 (9-1. Formation of lower clad layer) An intermediate laminate II comprising a silicon wafer and a lower clad layer was produced by the same method as the step (1-1) of Example 1.
  • a resin sheet for forming a core layer As a resin sheet for forming a core layer, a resin sheet having a resin composition layer with a thickness of 15 ⁇ m produced in Production Example 1 was used. Further, a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 15 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with an L/S (line/space) of 15 ⁇ m/100 ⁇ m and a length of 2 cm.
  • a quartz glass mask having a mask pattern capable of drawing a plurality of straight lines and a mask pattern capable of drawing a plurality of straight lines having an L/S (line/space) of 15 ⁇ m/100 ⁇ m and a length of 3 cm was changed.
  • a core layer is formed on the surface of the lower clad layer of the intermediate laminate II obtained in the step (9-1) by the same method as the step (1-2) of Example 1 except for the above matters, and silicon
  • An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • Example 10 (10-1. Formation of lower clad layer) Silicon An intermediate laminate II comprising a wafer and an underlying cladding layer was produced.
  • Example 11 (11-1. Formation of lower clad layer) Silicon An intermediate laminate II comprising a wafer and an underlying cladding layer was produced.
  • Example 12 (12-1. Formation of lower clad layer) An intermediate laminate II comprising a silicon wafer and a lower clad layer was produced by the same method as the step (1-1) of Example 1.
  • a polyethylene terephthalate film having a rough surface (“PTH-25” manufactured by Unitika Ltd., thickness 25 ⁇ m) was prepared as a support.
  • the resin varnish produced in Production Example 1 was evenly applied to the rough surface of the support with a die coater so that the thickness of the resin composition layer after drying was 10 ⁇ m, and 110° C.) for 7 minutes to form a resin composition layer.
  • a cover film (biaxially oriented polypropylene film, "MA-411" manufactured by Oji F-Tex Co., Ltd.) is placed on the surface of the resin composition layer and laminated at 80 ° C. to form a support/resin composition layer/
  • a resin sheet having a three-layer structure of a cover film was produced.
  • the support-side surface of the resin composition layer included in the resin sheet manufactured in this manner was pressed against the rough surface of the support, resulting in increased roughness. Therefore, the resin sheet may be hereinafter referred to as a "roughened resin sheet".
  • the roughened resin sheet was used as the resin sheet for forming the core layer. Further, a quartz glass mask was formed with a mask pattern capable of drawing a plurality of straight lines with an L/S (line/space) of 10 ⁇ m/100 ⁇ m and a length of 1 cm, and a mask pattern with an L/S (line/space) of 10 ⁇ m/100 ⁇ m and a length of 2 cm. A quartz glass mask having a mask pattern capable of drawing a plurality of straight lines and a mask pattern capable of drawing a plurality of straight lines having an L/S (line/space) of 10 ⁇ m/100 ⁇ m and a length of 3 cm was changed.
  • a core layer is formed on the surface of the lower clad layer of the intermediate laminate II obtained in the step (12-1) by the same method as the step (1-2) of Example 1 except for the above matters, and silicon An intermediate laminate IV comprising a wafer, a lower clad layer and a core layer in this order was obtained.
  • Example 13 When curing the resin composition layer in a clean oven in each step of forming the lower clad layer, forming the core layer, and forming the upper clad layer, the heat treatment conditions were changed as follows. That is, the temperature is raised from room temperature to 100° C., and after reaching 100° C., heat treatment is performed for 60 minutes, then the temperature is raised to 190° C., and after reaching 190° C., heat treatment is performed for 90 minutes in a nitrogen atmosphere. to cure the resin composition layer. Except for the above, the same operation as in Example 12 was performed to obtain a sample laminate comprising a silicon wafer, a lower clad layer, a core layer and an upper clad layer in this order. In this Example 13, the shape of the rough surface of the support was reflected more greatly on the surface of the core layer by changing the curing conditions of the resin composition by heat treatment. Therefore, the surface roughness of the core layer was larger than that of Example 12.
  • Example 3 As the resin sheet for forming the lower cladding layer, the resin sheet having a resin composition layer with a thickness of 10 ⁇ m produced in Production Example 13 was used. As the resin sheet for forming the upper cladding layer, the resin sheet having a resin composition layer with a thickness of 20 ⁇ m produced in Production Example 13 was used. A sample laminate comprising a silicon wafer, a lower clad layer, a core layer and an upper clad layer in this order was manufactured in the same manner as in Example 1 except for the above items.
  • the arithmetic mean roughness Ra was measured as the surface roughness of the core layer after forming the core layer and before forming the upper clad layer.
  • a surface roughness meter (“WYKO NT3300” manufactured by Bcoinstruments) was used for the measurement, and the Ra value was determined from the numerical values obtained with a 50-fold lens in the VSI mode and a measurement range of 121 ⁇ m ⁇ 92 ⁇ m. Each sample was measured by averaging 10 randomly selected points.
  • a test substrate was placed on a vibration isolation table covered with a blackout curtain.
  • a light collecting module (numerical aperture 0.18) was connected to one end (incident end) of the optical waveguide of the test board, and a light source (1310 nm light source, THORLABS Co., Ltd.) was connected to the light collecting module via an optical fiber (incident fiber).
  • LPSC-1310-FC was connected.
  • another light collecting module (numerical aperture 0.18) is connected to the other end (output end) of the optical waveguide of the test substrate, and the optical receiver is connected to the light collecting module via an optical fiber (output fiber).
  • Optical power meter "N7742" manufactured by Keysight Corporation) was connected.
  • the light emitted from the light source passes through the optical fiber (incident fiber), the light collecting module, the optical waveguide, the light collecting module, and the optical fiber (output fiber) in this order, and then enters the light receiver. got the system.
  • this optical system may be referred to as a sample optical system.
  • the light source was made to emit light, and the intensity of the light entering the light receiver was measured by the light receiver to measure the loss of the sample optical system.
  • the loss of the optical waveguide included in the test substrate was obtained by subtracting the loss of the calibration optical system from the loss of the sample optical system.
  • the loss of the optical waveguide was measured for each of a 1 cm long optical waveguide, a 2 cm long optical waveguide, and a 3 cm long optical waveguide. Then, the measurement results were plotted on a coordinate system with the length of the optical waveguide on the horizontal axis and the loss of the optical waveguide on the vertical axis to obtain three points representing the measurement results. An approximation straight line of these three points was calculated by the method of least squares, and the slope of the approximation straight line was obtained as the loss (transmission loss) per unit distance of the optical waveguide.
  • test substrate was subjected to heat treatment five times using a reflow device (“HAS6116” manufactured by Antom Co., Ltd.) (reflow temperature profile conforms to IPC/JEDEC J-STD-020C). After the treatment, the test substrate was observed, and if there were no voids or peeling in the substrate, the reflow resistance was judged to be “excellent.” Moreover, when there were voids or peeling in the substrate, the reflow resistance was determined as "poor".
  • optical waveguide 100 core layer 110 second composition layer 111 exposed portion 112 non-exposed portion 200 clad layer 210 first composition layer 220 cured first composition layer (lower clad layer) 230 third composition layer 240 cured third composition layer (upper clad layer) 300 base material 400 mask 410 translucent part 420 light shielding part

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

La présente invention concerne un ensemble de compositions de résine photosensible qui est capable de produire un guide d'ondes optique qui a une faible perte de transmission. La présente invention concerne un ensemble de composition de résine photosensible qui comprend une composition de résine pour noyaux et une composition de résine pour gaines, la composition de résine pour noyaux contenant (A) une résine phénolique, (B) un générateur de photoacide et (C) un agent de réticulation ; la composition de résine pour gaines contient (a) une résine phénolique, (b) un générateur de photoacide et (c) un agent de réticulation ; et l'ouverture numérique NA obtenue à partir de l'indice de réfraction d'un produit durci de la composition de résine pour noyaux et l'indice de réfraction d'un produit durci de la composition de résine pour des gaines se situe dans une plage spécifique.
PCT/JP2023/001168 2022-01-27 2023-01-17 Ensemble de composition de résine photosensible, guide d'ondes optique et son procédé de production, carte hybride photoélectrique, ensemble de feuilles, composition de résine pour noyaux, composition de résine pour gaines, et feuille de résine WO2023145537A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022011100 2022-01-27
JP2022-011100 2022-01-27

Publications (1)

Publication Number Publication Date
WO2023145537A1 true WO2023145537A1 (fr) 2023-08-03

Family

ID=87471347

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/001168 WO2023145537A1 (fr) 2022-01-27 2023-01-17 Ensemble de composition de résine photosensible, guide d'ondes optique et son procédé de production, carte hybride photoélectrique, ensemble de feuilles, composition de résine pour noyaux, composition de résine pour gaines, et feuille de résine

Country Status (2)

Country Link
TW (1) TW202340771A (fr)
WO (1) WO2023145537A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005080458A1 (fr) * 2004-02-25 2005-09-01 Kansai Paint Co., Ltd. Composition de résine durcissable pour guide de lumière, film sec durcissable pour guide de lumière, guide de lumière et méthode pour former la partie centrale d'un guide de lumière
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP2008077057A (ja) * 2006-08-21 2008-04-03 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品
JP2010078924A (ja) * 2008-09-26 2010-04-08 Nec Corp ポリマー光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP2010210851A (ja) * 2009-03-10 2010-09-24 Toray Ind Inc 感光性樹脂組成物
WO2020121818A1 (fr) * 2018-12-11 2020-06-18 日東電工株式会社 Composition de résine époxy photosensible pour guides d'ondes optiques, film photosensible pour guides d'ondes optiques, guide d'ondes optiques et carte hybride photoélectrique
JP2021117330A (ja) * 2020-01-24 2021-08-10 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005080458A1 (fr) * 2004-02-25 2005-09-01 Kansai Paint Co., Ltd. Composition de résine durcissable pour guide de lumière, film sec durcissable pour guide de lumière, guide de lumière et méthode pour former la partie centrale d'un guide de lumière
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP2008077057A (ja) * 2006-08-21 2008-04-03 Jsr Corp 感光性絶縁樹脂組成物及びその硬化物並びにそれを備える電子部品
JP2010078924A (ja) * 2008-09-26 2010-04-08 Nec Corp ポリマー光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP2010210851A (ja) * 2009-03-10 2010-09-24 Toray Ind Inc 感光性樹脂組成物
WO2020121818A1 (fr) * 2018-12-11 2020-06-18 日東電工株式会社 Composition de résine époxy photosensible pour guides d'ondes optiques, film photosensible pour guides d'ondes optiques, guide d'ondes optiques et carte hybride photoélectrique
JP2021117330A (ja) * 2020-01-24 2021-08-10 信越化学工業株式会社 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法

Also Published As

Publication number Publication date
TW202340771A (zh) 2023-10-16

Similar Documents

Publication Publication Date Title
US7892720B2 (en) Negative photosensitive fluorinated aromatic resin composition
JP4810911B2 (ja) エポキシ樹脂組成物、エポキシ樹脂フィルム、光導波路、光・電気混載配線基板並びに電子デバイス
JP2007084765A (ja) 硬化性エポキシ樹脂フィルム、これを用いた光導波路及び光電気複合基板
KR102539141B1 (ko) 수지 조성물
JP2008164763A (ja) フィルム状光導波路
JP2008203694A (ja) フィルム状光導波路の製造方法
WO2023145537A1 (fr) Ensemble de composition de résine photosensible, guide d'ondes optique et son procédé de production, carte hybride photoélectrique, ensemble de feuilles, composition de résine pour noyaux, composition de résine pour gaines, et feuille de résine
JP2007119585A (ja) 硬化性エポキシ樹脂フィルム
TWI653505B (zh) Photocurable resin composition for optical waveguide, photocurable thin film for forming optical waveguide core layer, optical waveguide using the same, and hybrid flexible printed wiring board for photoelectric transmission
WO2019026458A1 (fr) Composition de résine siloxane, adhésif l'utilisant, dispositif d'affichage, dispositif à semi-conducteurs et dispositif d'éclairage
JP6844962B2 (ja) 積層体、その製造方法、電子部品の製造方法、及び積層体において分離層と基板との接着性を向上させる方法
TWI653286B (zh) Photocurable resin composition for optical waveguide, photocurable thin film for forming optical waveguide core layer, optical waveguide using the same, and hybrid flexible printed wiring board for photoelectric transmission
JP2018091878A (ja) ドライフィルム、硬化物、半導体装置及びレジストパターンの形成方法
JP2019113690A (ja) 感光性接着剤組成物および構造体
JP7191622B2 (ja) 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品
WO2018070489A1 (fr) Élément photosensible, dispositif à semi-conducteur et procédé de formation de motif de réserve
US8586286B2 (en) Resin composition for optical waveguide, and optical waveguide produced by using the resin composition
JP2024001798A (ja) 感光性樹脂組成物
JP2023160657A (ja) 感光性樹脂組成物
JP2023160658A (ja) 感光性樹脂組成物
JP2024066347A (ja) 感光性樹脂組成物
WO2016157605A1 (fr) Composition de résine photosensible, élément photosensible, produit durci et procédé de formation de motif de produit de réserve
JP2024001786A (ja) 支持体付き樹脂シート
WO2016159160A1 (fr) Composition de résine photosensible, élément photosensible, produit durci, et procédé de formation d'un motif de réserve
JP7319381B2 (ja) ネガ型硬化性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23746751

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023576808

Country of ref document: JP