WO2023137961A1 - 烧结设备及其气氛可控的压力烧结机构 - Google Patents

烧结设备及其气氛可控的压力烧结机构 Download PDF

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Publication number
WO2023137961A1
WO2023137961A1 PCT/CN2022/099299 CN2022099299W WO2023137961A1 WO 2023137961 A1 WO2023137961 A1 WO 2023137961A1 CN 2022099299 W CN2022099299 W CN 2022099299W WO 2023137961 A1 WO2023137961 A1 WO 2023137961A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sintering
telescopic tube
assembly
support plate
Prior art date
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PCT/CN2022/099299
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English (en)
French (fr)
Inventor
杨友志
邹贵生
戚国强
刘磊
刘元
王文淦
许建磊
王帅奇
潘兵
黄辰潇
吴永超
杜荣葆
Original Assignee
快克智能装备股份有限公司
清华大学
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Application filed by 快克智能装备股份有限公司, 清华大学 filed Critical 快克智能装备股份有限公司
Publication of WO2023137961A1 publication Critical patent/WO2023137961A1/zh
Priority to US18/466,018 priority Critical patent/US20230417487A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/04—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated adapted for treating the charge in vacuum or special atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27M—INDEXING SCHEME RELATING TO ASPECTS OF THE CHARGES OR FURNACES, KILNS, OVENS OR RETORTS
    • F27M2003/00—Type of treatment of the charge
    • F27M2003/04—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Definitions

  • the present invention relates to the technical field of sintering equipment, in particular to an atmosphere-controllable pressure sintering mechanism.
  • the invention also relates to a sintering equipment comprising the above-mentioned atmosphere-controllable pressure sintering mechanism.
  • connection between the chip and the substrate is generally realized by the sintering bonding process, which is also a crucial process in the entire semiconductor chip packaging process;
  • the existing sintering bonding equipment is mainly composed of a sintering chamber and two indenters for applying pressure to the product.
  • the sintering chamber is a closed chamber, which is used to maintain the products to be sintered and bonded in a controllable atmosphere, and is divided into rigid structure and flexible structure;
  • the main defect is that two sets of driving devices are required, one driving device is used to close the sintering chamber with a rigid structure, and the other driving device needs to drive the indenter to apply pressure, resulting in the problems of many parts and high cost in the whole equipment;
  • the key is how to obtain the pressure on the chip.
  • a sintering cavity with a flexible structure formed by a sealing ring and two indenters is directly used.
  • both the sealing ring and the chip will be compressed when the indenter is pressurized.
  • the sealing ring tends to share too much pressure, so that the pressure on the chip cannot be known; therefore, currently for sintering
  • the sintering bonding equipment with a flexible cavity structure is only suitable for the second pressure (more than 1 ton pressure) working range.
  • the pressure on the sealing ring is 1-2 orders of magnitude smaller than that of the chip. It can be approximately considered that all the pressure of the pressure head is applied to the chip.
  • the technical problem to be solved by the present invention is: in order to solve the problem that the flexible sintering chamber structure cannot be used in the sintering and bonding equipment with the full pressure working range in the prior art, an atmosphere-controllable pressure sintering mechanism is now provided.
  • the present invention also provides a sintering equipment including the above-mentioned atmosphere-controllable pressure sintering mechanism.
  • a pressure sintering mechanism with controllable atmosphere comprising:
  • a telescopic tube at least a part of which is a bellows segment capable of elastic expansion and contraction;
  • the telescopic tube is arranged between the two pressurization assemblies.
  • the two pressurization assemblies are used to block the nozzle at the end of the telescopic tube when they are close to each other, so that the inside of the telescopic tube forms a closed sintering chamber, and is used to apply pressure to the product in the sintering chamber;
  • the telescopic tube is used to cooperate with two pressurized components to form a flexible closed sintering chamber, so as to realize the controllable atmosphere, and because the telescopic tube has a bellows segment that can be elastically stretched, the elastic modulus of the telescopic tube is very low.
  • the telescopic tube can seal the formed sintering cavity with a small pressure.
  • it only needs to measure the pressure of the pressurized component, which is convenient to know the pressure loaded on the chip, and then can meet the sintering bonding of the full pressure working range, and has a wide range of applications to know the pressure loaded on the chip.
  • both ends of the telescopic tube are dynamic sealing structures, which will greatly increase the difficulty of sealing.
  • the two ends of the telescopic tube are respectively fixed ends and free ends. Difficulty, improving the sealing effect, the free end of the fixed end of the telescopic tube is not fixed with the pressurized component, it is for the convenience of picking and placing the product to be sintered and bonded.
  • the two pressurization assemblies are an upper pressurization assembly and a lower pressurization assembly, the upper pressurization assembly is located above the lower pressurization assembly, the fixed end of the telescopic tube is fixedly connected to the upper pressurization assembly, and a sealing ring is provided between each other;
  • the two pressurization components are designed to be arranged up and down, so that the lower pressurization component can be loaded with products in a supporting manner. Compared with the horizontal layout of the two pressurization components, there is no need to set up additional loading structures, thereby improving the compactness of the structure;
  • the telescopic tube is fixed on the upper pressurizing component, it is not easy to interfere with the telescopic tube when taking and placing the product, thereby improving the convenience of operation.
  • the upper pressurizing assembly includes an upper pressure head, and an extension protrudes downward from the lower surface of the upper pressure head, and the extension part extends into the telescopic tube;
  • the heating assembly includes an upper heating element, and the upper heating element is installed on the upper pressing head;
  • the telescopic tube can have a longer length, so the bellows section can also have a longer length, so as to achieve a larger compression amount of the telescopic tube.
  • the extension part is located in the bellows, and the heat on it is not easy to dissipate, so as to improve the heating effect; in addition, the extension part also has the function of positioning to prevent the large-scale distortion of the telescopic tube.
  • an upper heating chamber is opened downwards on the upper surface of the upper pressing head, the bottom end of the upper heating chamber is located in the extension part, and the upper heating element is installed on the bottom end of the upper heating chamber; in this way, the installation of the upper heating element is realized, and the distance between the upper heating element and the lower surface of the extension part is greatly shortened, so as to improve the heating effect;
  • the upper pressurization assembly also includes an upper indenter base located above the upper indenter, the upper indenter base is fixedly connected with the upper indenter, and blocks the upper opening of the upper heating chamber, and the fixed end of the telescopic tube is fixedly connected with the upper indenter base or the upper indenter.
  • the lower pressurization assembly includes a lower pressure head, the lower pressure head has a lower heating chamber and a heat insulation ventilation groove surrounding the outside of the lower heating chamber, the opening of the lower heating chamber faces downward, and the opening of the heat insulation ventilation groove faces upward, and when the telescopic tube forms a sintering chamber, the heat insulation ventilation groove communicates with the sintering chamber;
  • the upper surface of the lower pressure head or the free end of the telescopic tube is provided with an annular groove, and a sealing ring is embedded in the annular groove, and the heat insulation ventilation groove is located inside the sealing ring;
  • the heating assembly includes a lower heating element, and the lower heating element is arranged in the lower heating chamber;
  • An air inlet and an air outlet are provided on the outer wall of the lower pressure head, and both the air inlet and the air outlet communicate with the heat-insulating ventilation groove;
  • the design of the heat insulation ventilation groove on the one hand, provides a passage for air intake and outlet, and on the other hand, it plays a role of heat insulation to avoid damage to the sealing ring on the lower pressure head due to excessive temperature.
  • the lower pressing head protrudes upwards corresponding to the upper surface of the lower heating chamber, and the heat-insulating ventilation groove is located outside the protrusion; the upper surface of the protrusion corresponds to the working surface on which the product is placed.
  • the lower pressing head After the lower pressing head is processed, it first needs to be plated with hard chrome as a whole, and then the working surface is finely ground to ensure the flatness and hardness of the working surface. Therefore, the design of the convex part can be convenient for fine grinding.
  • two separators are arranged in the heat-insulation ventilation groove, and the inlet groove and the gas outlet groove are formed by separating the two separators, the inlet and the inlet groove are connected, and the gas outlet and the outlet groove are connected;
  • the process gas entering the gas inlet must pass through the gas inlet groove, the sintering chamber and the gas outlet groove in sequence, and finally flow out from the gas outlet, so as to ensure that the sintering chamber forms a preset inert atmosphere.
  • the upper opening of the heat-insulating ventilation groove is covered with a rectifying plate, and the upper surface of the rectifying plate penetrates downwards with a number of through holes distributed along the circumferential direction of the heat-insulating ventilation groove, and the through holes communicate with the heat-insulating ventilation groove.
  • the present invention also provides a sintering device, comprising the above-mentioned pressure sintering mechanism with controllable atmosphere.
  • it also includes a frame, a driving device, a guide rail, a fixed support plate and a movable support plate;
  • the guide rail is fixedly installed on the frame, and the movable support plate is slidably installed on the guide rail;
  • the frame supports the fixed support plate, and a pressure sensor is arranged between the frame and the fixed support plate;
  • the two pressurizing components are respectively fixed on the movable support plate and the fixed support plate;
  • the output end of the driving device is in transmission connection with the pressurizing assembly slidably installed on the guide rail, and is used to drive the pressurizing assembly to make linear reciprocating motion along the guide rail.
  • a heat insulation board is provided between the movable support plate and the pressurizing assembly on it, and a heat insulation board is also provided between the fixed support plate and the pressurization assembly thereon.
  • the beneficial effect of the present invention is that: the pressure sintering mechanism with controllable atmosphere of the present invention has a bellows segment that can be elastically stretched, so the elastic modulus of the telescopic tube is very low.
  • the telescopic tube can seal the sintering chamber formed with a small pressure.
  • the pressure on the telescopic tube is much smaller than the pressure on the product.
  • it can also accurately measure the working range of the larger second pressure, and then can meet the sintering bonding of the full pressure working range, and has a wide range of applications.
  • Fig. 1 is the three-dimensional schematic diagram of the pressure sintering mechanism with controllable atmosphere of the present invention
  • Fig. 2 is a schematic front view of an atmosphere-controllable pressure sintering mechanism of the present invention
  • Fig. 3 is a schematic sectional view of A-A in Fig. 2;
  • Fig. 4 is a schematic sectional view of B-B in Fig. 3;
  • Fig. 5 is a schematic diagram of forming a sintering chamber in the present invention.
  • Fig. 6 is a three-dimensional schematic diagram of the upper pressurizing assembly in the present invention.
  • Fig. 7 is a schematic cross-sectional view of the upper pressurizing assembly of the present invention.
  • Fig. 8 is an explosion schematic diagram of the middle and lower pressurized components of the present invention.
  • Fig. 9 is a three-dimensional schematic diagram of the middle and lower pressurization components of the present invention.
  • Fig. 10 is a schematic cross-sectional view of the middle and lower pressurization assembly of the present invention.
  • Fig. 11 is a schematic diagram of sintering equipment in the present invention.
  • expansion tube 101, fixed end, 102, bellows section, 103, free end;
  • Lower pressure assembly 301, lower pressure head, 3011, lower heating chamber, 3012, heat insulation ventilation groove, 3012a, air inlet groove, 3012b, air outlet groove, 3013, annular groove, 3014, air inlet, 3015, air outlet, 3016, partition, 3017, protrusion, 302, rectifying plate, 3021, through hole;
  • an atmosphere-controlled pressure sintering mechanism includes:
  • the telescopic tube 1 has at least a part of a bellows segment 102 that can be elastically expanded and contracted;
  • the telescopic tube 1 is arranged between the two pressurization components.
  • the two pressurization components are used to block the nozzle at the end of the telescopic tube 1 when they are close to each other, so that the inside of the telescopic tube 1 forms a closed sintering chamber 4, and is used to apply pressure to the product 15 in the sintering chamber 4;
  • a heating assembly for heating the product 15 in the sintering cavity 4 .
  • the two pressurized components are horizontally distributed in the horizontal direction, which belongs to the horizontal structure, but in order to conveniently place the product 15 to be sintered and bonded between the two pressurized components, a loading structure for loading the product 15 needs to be provided on the pressurized component, or the product 15 to be sintered and bonded can be directly placed in the telescopic tube 1 to realize loading;
  • the second is that the two pressurizing components are distributed up and down, and belong to the vertical structure.
  • the two pressurizing components are the upper pressing component 2 and the lower pressing component 3 respectively, and the upper pressing component 2 is located above the lower pressing component 3; so that the lower pressing component 3 can be loaded with the product 15 in a supporting manner; in order to facilitate the layout and improve the compactness of the structure, this embodiment specifically adopts this vertical structure;
  • one of the two pressurizing assemblies is sealed and fixedly connected with the fixed end 101 of the telescopic tube 1, so as to block the mouth of the fixed end 101 of the telescopic pipe 1, and the other is set opposite to the mouth of the free end 103 of the telescopic tube 1;
  • the fixed end 101 of the telescopic tube 1 is fixedly connected with the upper pressurizing assembly 2, so as to improve the convenience of operation;
  • the fixed end 101 and the free end 103 of the telescopic tube 1 both have a flange ring structure, and the central hole formed by the inner peripheral wall of the flange ring structure communicates with the tube hole of the telescopic tube 1.
  • the junction between the upper surface of the fixed end 101 and the central hole is the tube hole of the fixed end 101, and the junction between the lower surface of the free end 103 and the central hole is the tube hole of the free end 103;
  • the telescopic tube 1 can be regarded as a bellows; the material of the telescopic tube 1 can be specifically metal;
  • the heating assembly includes an upper heating element 6 and a lower heating element 7, and both the upper heating element 6 and the lower heating element 7 can use electric heating elements, such as electric heating coils or electric heating sheets; the installation positions of the upper heating element 6 and the lower heating element 7 can be specifically referred to in the following description;
  • the upper pressing assembly 2 includes an upper pressing head 201 and an upper pressing head base 202.
  • the upper pressing head base 202 is located above the upper pressing head 201 and is fixedly connected with the upper pressing head 201.
  • the fixed end 101 of the telescopic tube 1 is fixedly connected with the upper pressing head base 202 or the upper pressing head 201.
  • a sealing ring 5 is arranged between the fixed end 101 of the telescopic tube 1 and the lower surface of the upper pressing head 201.
  • the sealing ring 5 here can specifically be made of fluorine rubber.
  • the sealing ring, the fixed end 101 of the telescopic tube 1 has a flange hole, and the screw passes through the flange hole and is threadedly connected with the upper pressure head base 202 or the upper pressure head 201, and the sealing ring 5 is compressed and deformed by the fixed end 101 of the telescopic tube 1 and the lower surface of the upper pressure head 201 to realize the upper sealing;
  • the fixed end 101 of the telescopic tube 1 can also be fixedly connected with the upper pressing head base 202 by means of riveting, welding or the like.
  • the lower surface of the upper pressure head 201 protrudes downwards with an extension 2011.
  • the extension 2011 extends into the telescopic tube 1.
  • the shape of the outer contour of the cross section of the extension 2011 is preferably determined by the inner contour of the cross section of the telescopic tube 1.
  • the shape of the outer contour of the cross section of the extension 2011 can be circular, or square, oval, etc.; the design of the extension 2011 allows the telescopic tube 1 to have a longer length.
  • the bellows section 102 can also have a longer length, so that the telescopic tube 1 has a larger compression amount; at the same time, the distance between the sealing ring 5 of the fixed end 101 and the upper heating element 6 is correspondingly extended to prevent the temperature of the sealing ring 5 here from being too high; moreover, the extension part 2011 is located in the bellows section 102, and the heat on it is not easy to dissipate, so as to improve the heating effect;
  • the upper surface of the upper ram 201 is downwardly provided with an upper heating chamber 2012, the upper ram base 202 blocks the upper opening of the upper heating chamber 2012, the bottom of the upper heating chamber 2012 is located in the extension 2011, and the upper heating element 6 is installed on the bottom of the upper heating chamber 2012; in this way, the installation of the upper heating element 6 is realized, and the distance between the upper heating element 6 and the lower surface of the extension 2011 is greatly shortened, so as to improve the heating effect;
  • the lower pressurization assembly 3 in this embodiment includes a lower pressure head 301, which has a lower heating chamber 3011 and a heat-insulating ventilation groove 3012 surrounding the outside of the lower heating chamber 3011. 12 communicates with the sintering chamber 4; the upper surface of the lower pressure head 301 or the end of the free end 103 of the telescopic tube 1 is provided with an annular groove 3013, and a sealing ring 5 is embedded in the annular groove 3013.
  • the sealing ring 5 here can specifically be a fluorine rubber sealing ring.
  • the lower pressure head 301 protrudes upwards corresponding to the upper surface of the lower heating chamber 3011 with a protrusion 3017 , and the heat insulation ventilation groove 3012 is located outside the protrusion 3017 .
  • the outer wall of the lower pressure head 301 is provided with an air inlet 3014 and an air outlet 3015, and both the air inlet 3014 and the air outlet 3015 are in communication with the heat-insulating ventilation groove 3012;
  • the design of the heat-insulation ventilation groove 3012 on the one hand, provides a passage for air intake and air outlet, and on the other hand plays a role of heat insulation to avoid damage to the sealing ring 5 of the lower pressure head 301 due to excessive temperature;
  • Two separators 3016 are arranged in the heat-insulation ventilation groove 3012, and are separated by two separators 3016 to form an air inlet groove 3012a and an air outlet groove 3012b.
  • the separator 3016 can be integrally formed with the lower pressure head 301; or, the separator 3016 is welded or clamped and fixed in the heat-insulation ventilation groove 3012; the air inlet 3014 communicates with the air inlet groove 3012a, and the air outlet 3015 and the air outlet groove 30 12b; so that the process gas introduced into the inlet 3014 must pass through the inlet groove 3012a, the sintering chamber 4 and the gas outlet groove 3012b in sequence, and finally flow out from the gas outlet 3015, so as to ensure that the sintering chamber 4 forms a preset inert atmosphere.
  • the upper opening of the heat insulation ventilation groove 3012 is covered with a rectifying plate 302, and the upper surface of the rectification plate 302 penetrates downwards with a number of through holes 3021 distributed at equal intervals along the circumference of the heat insulation ventilation groove 3012.
  • the lower pressing assembly 3 can be supported by the frame 8, or placed on the workbench; the upper pressing assembly 2 is connected to the output end of the driving device 9;
  • the product 15 to be sintered and bonded (such as a chip and a substrate) is placed on the upper surface of the lower pressing head 301, and then the driving device 9 drives the upper pressing head 201 to move downward and first makes the free end 103 of the telescopic tube 1 contact the upper surface of the lower pressing head 301, and the sealing ring 5 is compressed to form the sintering chamber 4; ;
  • the modulus of elasticity of the telescopic tube 1 is very low.
  • the pressure when sealing with the telescopic tube 1 is about 1-2 kg, which is far less than the pressure on the chip.
  • the reading of the pressure sensor 14 is the pressure on the chip, so that only the pressure of the pressurized component is measured, so that the pressure loaded on the chip can be easily known.
  • the working range of the larger second pressure can also be accurately measured.
  • the sintering bonding of the full pressure working range can be satisfied; wherein, the pressure of the pressurizing assembly can be measured by directly installing the pressure sensor 14 on the upper pressing assembly 2 or the lower pressing assembly 3 .
  • a sintering device including the pressure sintering mechanism with controllable atmosphere in the above-mentioned embodiment 1;
  • It also includes a frame 8, a driving device 9, a guide rail 10, a fixed support plate 11 and a movable support plate 12;
  • the guide rail 10 is fixedly installed on the frame 8, and the movable support plate 12 is slidably installed on the guide rail 10;
  • the upper pressing assembly 2 is fixed on the movable supporting plate 12, and the lower pressing assembly 3 is fixed on the fixed supporting plate 11;
  • the frame 8 supports the fixed support plate 11, and a pressure sensor 14 is provided between the frame 8 and the fixed support plate 11, and the pressure sensor 14 detects the loading pressure of the upper pressure head 201 on the product 15;
  • the output end of the driving device 9 is connected to the upper pressurizing assembly 2 slidingly installed on the guide rail 10, and is used to drive the pressurizing assembly to make a linear reciprocating motion along the guide rail 10;
  • the driving device 9 in this embodiment can use a screw nut mechanism, a rack and pinion mechanism, and an air cylinder;
  • Screw nut mechanism the motor drives the screw to rotate, and the nut on the screw moves linearly, so that the power is transmitted to the movable support plate 12 by the nut to realize the pressurization of the upper pressurizing assembly 2;
  • Rack and pinion mechanism the motor drives the gear to rotate after increasing the torque through the reducer, the gear meshes with the rack, and the rack reciprocates in a straight line, so that the power is transmitted to the movable support plate 12 by the rack to realize the pressurization of the upper pressurization component 2;
  • Cylinder the cylinder body of the cylinder is fixed on the frame 8, and the piston rod of the cylinder transmits power to the movable support plate 12 to realize the pressurization of the upper pressurizing assembly 2;
  • a heat shield 13 is provided between the movable support plate 12 and the pressurized components on it, and a heat shield 13 is also provided between the fixed support plate 11 and the pressurized components on it;

Abstract

本发明涉及烧结设备技术领域，尤其是一种烧结设备及其气氛可控的压力烧结机构，该气氛可控的压力烧结机构包括伸缩管、加压组件及加热组件，伸缩管至少存在一部分为能够弹性伸缩的波纹管段，伸缩管配置在两个加压组件之间，由于伸缩管具有能够弹性伸缩的波纹管段，故而伸缩管的弹性模量很低，对于第一压力工作范围，伸缩管能够以较小的压力密封形成的烧结腔，同时在伸缩管能够弹性伸缩的特性影响下，伸缩管所受的压力远小于产品所受的压力，因此，可近似认为加压组件上的所有压力都施加在了产品上，从而只需测得加压组件的压力，便于获知加载在芯片上的压力，进而能够满足全压力工作范围的烧结键合，适用范围广。

Description

烧结设备及其气氛可控的压力烧结机构 技术领域
本发明涉及烧结设备技术领域，尤其是一种气氛可控的压力烧结机构，此外，本发明还涉及一种包括上述气氛可控的压力烧结机构的烧结设备。
背景技术
在半导体芯片封装领域，芯片与基板之间的连接普遍采用烧结键合工艺来实现，这也是整个半导体芯片封装流程中至关重要的工序；
现有的烧结键合设备主要由烧结腔及两个用于产品进行施加压力的压头构成，烧结腔为密闭腔体，用于维持待烧键结合的产品处于可控的气氛中，并分为刚性结构和柔性结构；
对于烧结腔为刚性结构的烧结键合设备，其主要存在的缺陷是，需要配备两套驱动装置，一套驱动装置用于使刚性结构的烧结腔闭合，另一套驱动装置则需要驱动压头进行施压，导致整个设备存在零部件多及成本高等问题；
对于烧结腔为柔性结构的烧结键合设备，其关键是如何获得加在芯片上的压力，现有技术中直接采用的是密封圈与两个压头形成柔性结构的烧结腔，此类直接用密封圈形成烧结腔的结构，虽然理论上也可以，但是压头在加压时，密封圈和芯片都会受压，对于第一压力(小于100公斤的压力)工作范围，密封圈容易分担过多的压力，导致无法得知加压在芯片上的压力；因此，目前对于烧结腔为柔性结构的烧结键合设备仅仅适应用于第二压力(大于1吨的压力)工作范围，密封圈所受压力比芯片小1-2个数量级，可近似认为压头的所有压力都加在了芯片上。
发明内容
本发明要解决的技术问题是：为了解决现有技术中全压力工作范围的烧结键合设备无法采用柔性烧结腔的结构，现提供一种气氛可控的压力烧结机构，此外，本发明还提供一种包括上述气氛可控的压力烧结机构的烧结设备。
本发明解决其技术问题所采用的技术方案是：一种气氛可控的压力烧结机构，包括：
伸缩管，至少存在一部分为能够弹性伸缩的波纹管段；
加压组件，具有两个，且彼此相对设置，伸缩管配置在两个加压组件之间，两个所述加压组件用于在其相互靠拢时封堵住伸缩管端部的管口使伸缩管的内部形成密闭的烧结腔，并用于对烧结腔内的产品施加压力；
以及加热组件，用于对烧结腔内的产品进行加热；
本方案中采用伸缩管与两个加压组件进行配合构成柔性的密闭烧结腔，实现气氛可控，且由于伸缩管具有能够弹性伸缩的波纹管段，故而伸缩管的弹性模量很低，对于第一压力工作范围，伸缩管能够以较小的压力密封形成的烧结腔，随着加压组件的继续施压，在伸缩管能够弹性伸缩的特性影响下，伸缩管所受的压力远小于产品所受的压力，因此，可近似认为加压组件上的所有压力都施加在了产品上，从而只需测得加压组件的压力，便于获知加载在芯片上的压力，进而能够满足全压力工作范围的烧结键合，适用范围广便于获知加载在芯片上的压力。
如果伸缩管的两端均不与加压组件进行固定连接，伸缩管的两端则均为动密封结构，这将大幅度提高密封的难度，鉴于此，为了提高密封的可靠性，进一步地，所述伸缩管的两端分别为固定端和自由端，两个所述加压组件中的一者与伸缩管的固定端密封固定连接，以封堵住伸缩管的固定端的管口，另一者与伸缩管的自由端的管口相对设置；从而可在伸缩管的固定端形成静密封结构， 以降低密封难度，提高密封效果，伸缩管的固定端的自由端不与加压组件进行固定，则是为了便于取放待烧结键合的产品。
为了便于提高结构的紧凑性和操作的便利性，进一步地，两个所述加压组件分别为上加压组件和下加压组件，上加压组件位于下加压组件的上方，所述伸缩管的固定端和上加压组件固定连接，且彼此之间设置有密封圈；
首先，将两个加压组件设计为上下布局，使下加压组件能够以托持的方式装载产品，相对于两个加压组件在水平方向上呈左右布局而言，无须额外设置装载结构，从而提高结构的紧凑性；
其次，由于伸缩管为固定在上加压组件上，因此，取放产品时也不易与伸缩管产生干涉，从而提高操作的便利性。
为了提高伸缩管的伸缩性能，进一步地，所述上加压组件包括上压头，所述上压头的下表面向下凸出有延伸部，所述延伸部伸入至伸缩管内；
所述加热组件包括上加热元件，所述上加热元件安装在上压头上；
利用延伸部的设计，使伸缩管能够拥有较长的长度，故而波纹管段也能够拥有更长的长度，从而实现伸缩管有较大的压缩量，同时，延伸部位于波纹管内，其上的热量不易散发，以此提高加热效果；此外，延伸部亦具有定位的作用，防止伸缩管发生较大幅度的歪斜。
为了便于安装上加热元件以及提高加热效果，进一步地，所述上压头的上表面向下开设有上加热腔，所述上加热腔的底端位于延伸部中，所述上加热元件安装在上加热腔的底端；以此实现上加热元件的安装，且大幅度缩短上加热元件与延伸部下表面之间的距离，以此提高加热效果；
所述上加压组件还包括位于上压头上方的上压头基座，所述上压头基座与上压头固定连接，并封堵住上加热腔的上端开口，所述伸缩管的固定端与上压 头基座或上压头固定连接。
为了提高结构的紧凑性及使用寿命，进一步地，所述下加压组件包括下压头，所述下压头中具有下加热腔及环绕于下加热腔外侧的隔热通气槽，下加热腔的开口朝下，隔热通气槽的开口朝上，当伸缩管形成烧结腔时，所述隔热通气槽与烧结腔连通；
所述下压头的上表面或伸缩管的自由端端部开设有环形槽，所述环形槽内嵌入有密封圈，所述隔热通气槽位于密封圈的内侧；
所述加热组件包括下加热元件，所述下加热元件配置在下加热腔内；
所述下压头的外壁上设有进气口和出气口，所述进气口和出气口均与隔热通气槽连通；
隔热通气槽的设计，一方面提供了进气和出气的通路，另一方面起到隔热的作用，避免下压头上的密封圈温度过高而发生损坏。
为了保证工作面的平整度，进一步地，所述下压头对应于下加热腔的上表面向上凸出有凸出部所述隔热通气槽位于凸出部的外侧；凸出部的上表面对应为放置产品的工作面，下压头加工完成后首先需要进行整体镀硬铬，然后再对工作面进行精磨，来保证工作面的平整度和硬度，因此，凸出部的设计可方便精磨。
为了防止通入到隔热通气槽内的工艺气体直接从出气口流出，进一步地，所述隔热通气槽内设置有两个隔板，并由两个隔板分隔形成进气槽和出气槽，所述进气口和进气槽连通，所述出气口和出气槽连通；
从而使进气口通入的工艺气体必须依次途经进气槽、烧结腔及出气槽后，最后才能从出气口流出，以此确保烧结腔形成预设的惰性气氛。
为了提高进气的均匀性，进一步地，所述隔热通气槽的上端开口处盖设有 整流板，所述整流板的上表面向下贯穿有若干沿隔热通气槽的周向间隔分布的通孔，所述通孔与隔热通气槽连通。
本发明还提供一种烧结设备，包括上述的气氛可控的压力烧结机构。
进一步地，还包括机架、驱动装置、导轨、固定支撑板和活动支撑板；
所述导轨固定安装在机架上，所述活动支撑板滑动安装在导轨上；
所述机架支撑住所述固定支撑板，且机架与固定支撑板之间设有压力传感器；
两个所述加压组件分别固定在活动支撑板和固定支撑板上；
所述驱动装置的输出端和滑动安装在导轨上的加压组件传动连接，并用于带动加压组件沿导轨作直线往复运动。
为了防止热量向外扩散，进一步地，所述活动支撑板与其上的加压组件之间设有隔热板，所述固定支撑板与其上的加压组件之间也设有隔热板。
本发明的有益效果是：本发明气氛可控的压力烧结机构由于伸缩管具有能够弹性伸缩的波纹管段，故而伸缩管的弹性模量很低，对于第一压力工作范围，伸缩管能够以较小的压力密封形成的烧结腔，同时在伸缩管能够弹性伸缩的特性影响下，伸缩管所受的压力远小于产品所受的压力，因此，可近似认为加压组件上的所有压力都施加在了产品上，从而只需测得加压组件的压力，便于获知加载在芯片上的压力，同时，对于较大的第二压力的工作范围也能准确测量，进而能够满足全压力工作范围的烧结键合，适用范围广。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明气氛可控的压力烧结机构的三维示意图；
图2是本发明气氛可控的压力烧结机构的主视示意图；
图3是图2中A-A向剖视示意图；
图4是图3中B-B向剖视示意图；
图5是本发明中形成烧结腔的示意图；
图6是本发明中上加压组件的三维示意图；
图7是本发明中上加压组件的剖视示意图；
图8是本发明中下加压组件的爆炸示意图；
图9是本发明中下加压组件的三维示意图；
图10是本发明中下加压组件的剖视示意图；
图11是本发明中烧结设备的示意图。
图中：1、伸缩管，101、固定端，102、波纹管段，103、自由端；
2、上加压组件，201、上压头，2011、延伸部，2012、上加热腔，202、上压头基座；
3、下加压组件，301、下压头，3011、下加热腔，3012、隔热通气槽，3012a、进气槽，3012b、出气槽，3013、环形槽，3014、进气口，3015、出气口，3016、隔板，3017、凸出部，302、整流板，3021、通孔；
4、烧结腔，5、密封圈，6、上加热元件，7、下加热元件，8、机架，9、驱动装置，10、导轨，11、固定支撑板，12、活动支撑板，13、隔热板，14、压力传感器，15、产品。
具体实施方式
现在结合附图对本发明作进一步详细的说明。这些附图均为简化的示意图，仅以示意方式说明本发明的基本结构，因此其仅显示与本发明有关的构成，方向和参照(例如，上、下、左、右、等等)可以仅用于帮助对附图中的特征的描述。因此，并非在限制性意义上采用以下具体实施方式，并且仅仅由所附权利要求及其等同形式来限定所请求保温的主题的范围。
如图1-11所示，一种气氛可控的压力烧结机构，包括：
伸缩管1，至少存在一部分为能够弹性伸缩的波纹管段102；
加压组件，具有两个，且彼此相对设置，伸缩管1配置在两个加压组件之间，两个加压组件用于在其相互靠拢时封堵住伸缩管1端部的管口使伸缩管1的内部形成密闭的烧结腔4，并用于对烧结腔4内的产品15施加压力；
以及加热组件，用于对烧结腔4内的产品15进行加热。
关于两个加压组件的布局具体可采用以下两种结构：
其一为，两个加压组件在水平方向上呈左右分布，属于卧式结构，但为了方便将待烧结键合的产品15放置在两个加压组件之间，则需要在加压组件上设置用于装载产品15的装载结构，亦可直接将待烧结键合的产品15放置在伸缩管1内实现上料；
其二为，两个加压组件呈上下分布，属于立式结构，如图1-4所示，两个加压组件分别为上加压组件2和下加压组件3，上加压组件2位于下加压组件3的上方；使得下加压组件3能够以托持的方式装载产品15；为了便于布局以及提高结构的紧凑性，本实施例具体采用该种立式结构；
本实施例中两个加压组件中的一者与伸缩管1的固定端101密封固定连接，以封堵住伸缩管1的固定端101的管口，另一者与伸缩管1的自由端103的管口相对设置；也就是说，伸缩管1即可为固定安装在上加压组件2上，也可以 为固定安装在下加压组件3上；为了防止在下加压组件3上取放产品15时操作人员的手部或转移机械手与伸缩管1产生干涉，本实施例中具体采用将伸缩管1的固定端101和上加压组件2固定连接，以提高操作的便利性；
本实施例中伸缩管1的固定端101和自由端103均为法兰环结构，法兰环结构的内周壁围合而成的中心孔与伸缩管1的管孔连通，固定端101的上表面与中心孔的交界处便为固定端101的管孔，自由端103的下表面与中心孔的交界处便为自由端103的管孔；当波纹管段102占据伸缩管1除两端法兰环结构以外的全部位置时，该伸缩管1可视为波纹管；对于伸缩管1的材质具体可采用金属；
本实施例中加热组件包括上加热元件6和下加热元件7，上加热元件6和下加热元件7均可采用电加热元件，例如电加热线圈或电加热片；上加热元件6和下加热元件7的安装位置具体可参见下文说明；
如图6和7所示，本实施例中上加压组件2包括上压头201和上压头基座202，上压头基座202位于上压头201的上方，并与上压头201固定连接，伸缩管1的固定端101与上压头基座202或上压头201固定连接，伸缩管1的固定端101与上压头201的下表面之间设置有密封圈5，此处的密封圈5具体可采用氟橡胶密封圈，伸缩管1的固定端101具有法兰孔，螺钉穿过法兰孔后与上压头基座202或上压头201螺纹连接，密封圈5随之被伸缩管1的固定端101与上压头201的下表面压缩变形，实现上侧密封；值得注意的是，本实施例中伸缩管1的固定端101亦可设置外螺纹，上压头基座202上设置内螺纹，从而使得伸缩管1可以直接以螺纹拧紧的方式固定在上压头基座202上；伸缩管1的固定端101还可采用铆接、焊接等方式与上压头基座202固定连接。
上压头201的下表面向下凸出有延伸部2011，延伸部2011伸入至伸缩管1 内，延伸部2011的横截面的外轮廓线的形状优选为随伸缩管1横截面的内轮廓线而定，本实施例中延伸部2011的横截面的外轮廓线的形状均体可采用圆形，亦可采用方形、椭圆形等；利用延伸部2011的设计，使伸缩管1能够拥有较长的长度，故而波纹管段102也能够拥有更长的长度，从而实现伸缩管1具有较大的压缩量；同时，也相应的延长了固定端101的密封圈5与上加热元件6之间的距离，防止此处的密封圈5温度过高；再有，延伸部2011位于波纹管段102内，其上的热量不易散发，以此提高加热效果；此外，延伸部2011亦具有定位的作用，防止伸缩管1发生较大幅度的歪斜。
上压头201的上表面向下开设有上加热腔2012，上压头基座202封堵住上加热腔2012的上端开口，上加热腔2012的底端位于延伸部2011中，上加热元件6安装在上加热腔2012的底端；以此实现上加热元件6的安装，且大幅度的缩短了上加热元件6与延伸部2011下表面之间的距离，以此提高加热效果；
如图8-10所示，本实施例中下加压组件3包括下压头301，下压头301中具有下加热腔3011及环绕于下加热腔3011外侧的隔热通气槽3012，下加热腔3011的开口朝下，下加热元件7配置在下加热腔3011内的顶端，隔热通气槽3012的开口朝上，当伸缩管1形成烧结腔4时，隔热通气槽3012与烧结腔4连通；下压头301的上表面或伸缩管1的自由端103端部开设有环形槽3013，环形槽3013内嵌入有密封圈5，此处的密封圈5具体可采用氟橡胶密封圈，下压头301上表面的密封圈5的数量可视具体情况而定，为了提升密封性能，可进行增设；隔热通气槽3012位于密封圈5的内侧，以减少烧结腔4内的热量向密封圈5进行传递，提高密封圈5的使用寿命；在伸缩管1的自由端103的抵住下压头301上表面的密封圈5时，实现下侧密封，上压头201、伸缩管1及下压头301之间形成烧结腔4。
如图10所示，下压头301对应于下加热腔3011的上表面向上凸出有凸出部3017，隔热通气槽3012位于凸出部3017的外侧。
下压头301的外壁上设有进气口3014和出气口3015，进气口3014和出气口3015均与隔热通气槽3012连通；隔热通气槽3012的设计，一方面提供了进气和出气的通路，另一方面起到隔热的作用，避免下压头301的密封圈5温度过高而发生损坏；
隔热通气槽3012内设置有两个隔板3016，并由两个隔板3016分隔形成进气槽3012a和出气槽3012b，隔板3016具体可与下压头301一体成型；或者，隔板3016为焊接或卡接固定在隔热通气槽3012内；进气口3014和进气槽3012a连通，出气口3015和出气槽3012b连通；从而使进气口3014通入的工艺气体必须依次途经进气槽3012a、烧结腔4及出气槽3012b后，最后才能从出气口3015流出，以此确保烧结腔4形成预设的惰性气氛。
隔热通气槽3012的上端开口处盖设有整流板302，整流板302的上表面向下贯穿有若干沿隔热通气槽3012的周向等间隔分布的通孔3021，通孔3021与隔热通气槽3012连通；从而提高气流流向烧结腔4时的均匀性。
本实施例中的气氛可控的压力烧结机构工作原理为：
下加压组件3可由机架8进行支撑，或放置在工作台上；上加压组件2连接驱动装置9的输出端；
工作时，将待烧结键合的产品15(如芯片和基板)置于下压头301的上表面，然后驱动装置9带动上压头201向下移动并首先使得伸缩管1的自由端103与下压头301的上表面接触，密封圈5被压缩，形成烧结腔4；然后驱动装置9带动上压头201继续向下移动，伸缩管1的波纹管段102压缩，直至上压头201与产品15接触加压；
接着采用真空泵对烧结腔4抽真空，随后向烧结腔4内通入Ar气形成惰性气氛，最后按照所需要的工艺要求通入所需要的气氛并进行加压烧结，在此过程中可根据工艺要求，进行相应的开启上加热元件6和下加热元件7进行加热。
由于采用具有波纹管段102的伸缩管1的设计，因此伸缩管1的弹性模量很低，对于第一压力(小于100公斤的压力)工作范围，用伸缩管1实现密封时的压力在1-2kg左右，远小于加压在芯片上的压力，这样可以认为压力传感器14的读数即为加在芯片上的压力，从而只需测得加压组件的压力，便于获知加载在芯片上的压力，当然对于较大的第二压力的工作范围也能准确测量，进而能够满足全压力工作范围的烧结键合；其中，直接在上加压组件2或下加压组件3上安装压力传感器14即可测出加压组件的压力。
实施例2
如图11，一种烧结设备，包括上述实施例1中的气氛可控的压力烧结机构；
还包括机架8、驱动装置9、导轨10、固定支撑板11和活动支撑板12；
导轨10固定安装在机架8上，活动支撑板12滑动安装在导轨10上；
上加压组件2固定在活动支撑板12上，下加压组件3固定在固定支撑板11上；
机架8支撑住固定支撑板11，且机架8与固定支撑板11之间设有压力传感器14，由压力传感器14来检测上压头201对产品15的加载压力；
驱动装置9的输出端和滑动安装在导轨10上的上加压组件2传动连接，并用于带动加压组件沿导轨10作直线往复运动；本实施例中的驱动装置9可采用丝杆螺母机构、齿轮齿条机构及气缸等；
丝杆螺母机构：由电机带动丝杆转动，丝杆上的螺母作直线运动，以此由 螺母将动力传递至活动支撑板12，实现上加压组件2的加压；
齿轮齿条机构：电机通过减速器提高扭矩后带动齿轮转动，齿轮与齿条啮合，齿条作直线往复运动，以此由齿条将动力传递至活动支撑板12，实现上加压组件2的加压；
气缸：气缸的缸体的固定在机架8上，气缸的活塞杆将动力传递至活动支撑板12，实现上加压组件2的加压；
活动支撑板12与其上的加压组件之间设有隔热板13，固定支撑板11与其上的加压组件之间也设有隔热板13；以减少热量向外扩散，并避免机架8温度过高，提高安全系数。
上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (12)

  1. 一种气氛可控的压力烧结机构，其特征在于：包括：
    伸缩管(1)，至少存在一部分为能够弹性伸缩的波纹管段(102)；
    加压组件，具有两个，且彼此相对设置，伸缩管(1)配置在两个加压组件之间，两个所述加压组件用于在其相互靠拢时封堵住伸缩管(1)端部的管口使伸缩管(1)的内部形成密闭的烧结腔(4)，并用于对烧结腔(4)内的产品(15)施加压力；
    以及加热组件，用于对烧结腔(4)内的产品(15)进行加热。
  2. 根据权利要求1所述的气氛可控的压力烧结机构，其特征在于：所述伸缩管(1)的两端分别为固定端(101)和自由端(103)，两个所述加压组件中的一者与伸缩管(1)的固定端(101)密封固定连接，以封堵住伸缩管(1)的固定端(101)的管口，另一者与伸缩管(1)的自由端(103)的管口相对设置。
  3. 根据权利要求2所述的气氛可控的压力烧结机构，其特征在于：两个所述加压组件分别为上加压组件(2)和下加压组件(3)，上加压组件(2)位于下加压组件(3)的上方，所述伸缩管(1)的固定端(101)和上加压组件(2)固定连接，且彼此之间设置有密封圈(5)。
  4. 根据权利要求3所述的气氛可控的压力烧结机构，其特征在于：所述上加压组件(2)包括上压头(201)，所述上压头(201)的下表面向下凸出有延伸部(2011)，所述延伸部(2011)伸入至伸缩管(1)内；
    所述加热组件包括上加热元件(6)，所述上加热元件(6)安装在上压头(201)上。
  5. 根据权利要求4所述的气氛可控的压力烧结机构，其特征在于：所述上压头(201)的上表面向下开设有上加热腔(2012)，所述上加热腔(2012)的底端位于延伸部(2011)中，所述上加热元件(6)安装在上加热腔(2012)的 底端；
    所述上加压组件(2)还包括位于上压头(201)上方的上压头基座(202)，所述上压头基座(202)与上压头(201)固定连接，并封堵住上加热腔(2012)的上端开口，所述伸缩管(1)的固定端(101)与上压头基座(202)或上压头(201)固定连接。
  6. 根据权利要求3所述的气氛可控的压力烧结机构，其特征在于：所述下加压组件(3)包括下压头(301)，所述下压头(301)中具有下加热腔(3011)及环绕于下加热腔(3011)外侧的隔热通气槽(3012)，下加热腔(3011)的开口朝下，隔热通气槽(3012)的开口朝上，当伸缩管(1)形成烧结腔(4)时，所述隔热通气槽(3012)与烧结腔(4)连通；
    所述下压头(301)的上表面或伸缩管(1)的自由端(103)端部开设有环形槽(3013)，所述环形槽(3013)内嵌入有密封圈(5)，所述隔热通气槽(3012)位于密封圈(5)的内侧；
    所述加热组件包括下加热元件(7)，所述下加热元件(7)配置在下加热腔(3011)内；
    所述下压头(301)的外壁上设有进气口(3014)和出气口(3015)，所述进气口(3014)和出气口(3015)均与隔热通气槽(3012)连通。
  7. 根据权利要求6所述的气氛可控的压力烧结机构，其特征在于：所述下压头(301)对应于下加热腔(3011)的上表面向上凸出有凸出部(3017)，所述隔热通气槽(3012)位于凸出部(3017)的外侧。
  8. 根据权利要求6所述的气氛可控的压力烧结机构，其特征在于：所述隔热通气槽(3012)内设置有两个隔板(3016)，并由两个隔板(3016)分隔形成进气槽(3012a)和出气槽(3012b)，所述进气口(3014)和进气槽(3012a) 连通，所述出气口(3015)和出气槽(3012b)连通。
  9. 根据权利要求6或8所述的气氛可控的压力烧结机构，其特征在于：所述隔热通气槽(3012)的上端开口处盖设有整流板(302)，所述整流板(302)的上表面向下贯穿有若干沿隔热通气槽(3012)的周向间隔分布的通孔(3021)，所述通孔(3021)与隔热通气槽(3012)连通。
  10. 一种烧结设备，其特征在于：包括如权利要求1-9任一项所述的气氛可控的压力烧结机构。
  11. 根据权利要求10所述的烧结设备，其特征在于：还包括机架(8)、驱动装置(9)、导轨(10)、固定支撑板(11)和活动支撑板(12)；
    所述导轨(10)固定安装在机架(8)上，所述活动支撑板(12)滑动安装在导轨(10)上；
    所述机架(8)支撑住所述固定支撑板(11)，且机架(8)与固定支撑板(11)之间设有压力传感器(14)；
    两个所述加压组件分别固定在活动支撑板(12)和固定支撑板(11)上；
    所述驱动装置(9)的输出端和滑动安装在导轨(10)上的加压组件传动连接，并用于带动加压组件沿导轨(10)作直线往复运动。
  12. 根据权利要求10所述的烧结设备，其特征在于：所述活动支撑板(12)与其上的加压组件之间设有隔热板(13)，所述固定支撑板(11)与其上的加压组件之间也设有隔热板(13)。
PCT/CN2022/099299 2022-01-24 2022-06-17 烧结设备及其气氛可控的压力烧结机构 WO2023137961A1 (zh)

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