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Definitions

• the present invention relates to a novel silicon nitride powder. Specifically, the present invention provides a ⁇ -type silicon nitride powder with improved sinterability.
• a silicon nitride sintered body made by adding various sintering aids to silicon nitride powder and sintering it at a high temperature is lightweight among various ceramic sintered bodies, has high mechanical strength from room temperature to high temperature, and is durable. It has characteristics such as excellent chemical resistance and electrical insulation, and is used as a wear-resistant member such as a ball bearing and as a high-temperature structural member.
• auxiliary agent and sintering conditions it is possible to increase the thermal conductivity, so it has come to be used as a thin and high-strength substrate material for heat dissipation.
• Non-Patent Document 1 Japanese Patent Document 1
• ⁇ -type silicon nitride powder obtained by a combustion synthesis method or the like is said to have poor sinterability compared to ⁇ -type silicon nitride powder.
• a green sheet (body to be fired) containing 5 ⁇ m ⁇ -type silicon nitride powder and a sintering aid consisting of ytterbium oxide and magnesium silicon nitride powder is fired at 1900° C. for 2 to 24 hours in pressurized nitrogen at 10 atm.
• a method of obtaining a silicon nitride sintered body by bonding is proposed (see Patent Document 1).
• an object of the present invention is to provide a silicon nitride powder that is highly sinterable even at low temperatures.
• the inventors of the present invention have found that the above objects can be achieved by controlling the crystal strain of ⁇ -type silicon nitride that constitutes the powder, and have completed the present invention. came to.
• a silicon nitride powder having a ⁇ -conversion rate of 80% or more and a crystal strain of 1.0 ⁇ 10 ⁇ 3 or more.
• the silicon nitride powder of the present invention since it exhibits good sinterability even at a low firing temperature of about 1800 ° C., it is dense and dense without almost applying pressure to prevent decomposition of silicon nitride. It becomes possible to obtain a sintered body having high thermal conductivity and strength.
• the silicon nitride powder of the present invention has a ⁇ conversion rate of 80% or more, preferably 85% or more, more preferably 90% or more.
• the ⁇ -conversion ratio of silicon nitride powder is the peak intensity ratio of ⁇ -phase to the total of ⁇ -phase and ⁇ -phase in silicon nitride powder [100 ⁇ (peak intensity of ⁇ -phase) / (peak intensity of ⁇ -phase + ⁇ -phase peak intensity)], and is obtained by powder X-ray diffraction (XRD) measurement using CuK ⁇ rays. More specifically, C.I. P. Gazzara and D. R. Messier: Ceram. Bull. , 56 (1977), 777-780.
• the silicon nitride powder of the present invention has a crystal strain adjusted to 1.0 ⁇ 10 ⁇ 3 or more. That is, the present inventors' research has shown that crystal strain affects the sinterability of silicon nitride powder, and that adjusting the crystal strain to a specific value or more significantly improves the sinterability. turned out to appear.
• the crystal strain of the silicon nitride powder is preferably 2.0 ⁇ 10 ⁇ 3 or more, more preferably 3.0 ⁇ 10 ⁇ 3 or more, and still more preferably, from the viewpoint of enhancing the effect of improving sinterability. 5.0 ⁇ 10 ⁇ 3 or more.
• the crystal strain of the silicon nitride powder is preferably 5.0 ⁇ 10 ⁇ 2 or less, more preferably 3.0 ⁇ 10 ⁇ 2 or less.
• the crystal strain of the silicon nitride powder is a value calculated according to the following procedure by powder X-ray diffraction (XRD) using CuK ⁇ rays.
• silicon nitride powder of the present invention are not particularly limited, and may have the properties of known silicon nitride powders used for sintering.
• the average particle diameter D50 of the silicon nitride powder is preferably 0.5-3 ⁇ m, more preferably 0.7-1.7 ⁇ m.
• the use of silicon nitride powder having such an average particle size facilitates sintering.
• the average particle size D50 is the 50% value in the volume-based cumulative curve showing the particle size distribution obtained by measurement by the laser diffraction scattering method.
• D90 which is the 90% value in the volume-based cumulative curve showing the particle size distribution, is preferably 5 ⁇ m or less, preferably 2 to 5 ⁇ m.
• silicon nitride powder having such a particle size distribution makes it easier to obtain a dense silicon nitride sintered body with high thermal conductivity and strength, coupled with the effect of adjusting the crystal strain.
• the specific surface area of the silicon nitride powder is preferably 7 to 20 m 2 /g.
• the specific surface area of the silicon nitride powder is more preferably 12-15 m 2 /g.
• the specific surface area means the BET specific surface area measured using the BET one-point method by nitrogen gas adsorption.
• the total oxygen content of the silicon nitride powder of the present invention is not particularly limited, but preferably 1% by mass or more.
• the total amount of oxygen is the sum of the amount of dissolved oxygen (internal oxygen) and the amount of external oxygen. When the total oxygen content is at least these lower limits, an effect is exhibited in which, for example, silicon oxide on the surface of the particles facilitates sintering.
• the total oxygen content of the silicon nitride powder is preferably 10% by mass or less.
• the amount of dissolved oxygen in the silicon nitride powder of the present invention is preferably 0.2% by mass or less. If the dissolved oxygen content exceeds 0.2% by mass, the thermal conductivity of the silicon nitride sintered body obtained by firing under the firing conditions characterizing the present invention tends to be low. From the viewpoint of obtaining a silicon nitride sintered body with high thermal conductivity, the dissolved oxygen content of the silicon nitride powder is preferably 0.1% by mass or less.
• the amount of dissolved oxygen means the oxygen dissolved inside the particles of the silicon nitride powder (hereinafter also referred to as internal oxygen), and oxides such as SiO 2 that inevitably exist on the particle surface It does not include originating oxygen (hereinafter also referred to as external oxygen).
• the silicon nitride powder of the present invention can be obtained by pulverizing the silicon nitride powder for a relatively long period of time, as will be described later. is preferred.
• the content of iron and aluminum is 500 ppm or less, preferably 100 ppm or less, more preferably 50 ppm or less
• the total content of impurity metals including the above metals is 1000 ppm or less, preferably 300 ppm or less, More preferably, it is 200 ppm or less.
• the method for producing the silicon nitride powder of the present invention is not particularly limited as long as it can obtain the silicon nitride powder having the properties described above.
• Examples of methods for producing silicon nitride powder include a reduction nitridation method in which silica powder is used as a raw material and nitrogen gas is passed through in the presence of carbon powder to generate silicon nitride, and a direct nitridation method in which silicon powder and nitrogen react at high temperature.
• the direct nitriding method is preferable, and among them, the direct nitriding method using the self-combustion method can be applied. method (combustion synthesis method) is more preferred.
• the combustion synthesis method uses silicon powder as a raw material, forcibly ignites part of the raw material powder in a nitrogen atmosphere, and synthesizes silicon nitride by self-heating of the raw material compound.
• the combustion synthesis method is a known method, and for example, Japanese Unexamined Patent Application Publication No. 2000-264608, International Publication No. 2019/167879, etc. can be referred to.
• the raw material powder used in the combustion synthesis method contains at least silicon powder, preferably silicon powder and a diluent.
• the silicon nitride powder of the present invention can be easily obtained.
• the silicon powder contained in the raw material powder preferably has an average particle size of 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m.
• Silicon nitride powder is preferably used as diluent.
• the average particle size of the silicon nitride powder used as the diluent is preferably 0.1-10 ⁇ m, more preferably 0.5-5 ⁇ m.
• the average particle size of the silicon powder and the silicon nitride powder is the 50% value in the volume-based cumulative curve showing the particle size distribution measured by the laser diffraction scattering method.
• the silicon powder content in the raw material powder is preferably 50 to 95% by mass, more preferably 70 to 90% by mass.
• the content of the diluent in the raw material powder is preferably 5 to 50% by mass, more preferably 10 to 30% by mass. When the content of the diluent is at least these lower limits, heat generation of the raw material powder is reduced, and temperature control is facilitated. When the content of the diluent is not more than these upper limits, the nitriding combustion heat of the metal can be easily propagated throughout the raw material powder filled in the reaction vessel.
• the raw material powder may contain other ingredients other than the silicon powder and the diluent used as necessary.
• other components include chlorides such as sodium chloride and ammonium chloride, and oxides such as calcium oxide, yttrium oxide, and magnesium oxide.
• Other components are preferably 10% by mass or less, more preferably 5% by mass or less, still more preferably 1% by mass or less, still more preferably 0% by mass, based on the total amount of the raw material powder.
• the amount of dissolved oxygen can be kept low within the above range.
• a silicon powder that does not cause oxygen to form a solid solution therein it is preferable to use, as a raw material, a silicon powder that does not cause oxygen to form a solid solution therein.
• silicon powder typified by cutting dust generated when the silicon is processed such as by cutting.
• the semiconductor-grade silicon is typically polycrystalline silicon obtained by the so-called "Siemens method" in which high-purity trichlorosilane and hydrogen are reacted in a bell-jar reaction vessel.
• the raw material powder described above is filled in a reaction vessel (setter).
• the reaction vessel is preferably a heat-resistant reaction vessel made of ceramics, graphite, or the like.
• the bulk density of the raw material powder layer in the reaction vessel is preferably in the range of 0.1 to 1.0 g/cm 3 , more preferably 0.3 to 0.7 g. /cm 3 is preferable.
• the method for adjusting the crystal strain is not particularly limited, and by adopting the combustion synthesis method, a ⁇ -type silicon nitride powder having a somewhat large crystal strain can be obtained.
• the pulverizing method include a method of pulverizing until the crystal strain is obtained using a pulverizer such as a vibrating ball mill that is likely to be sheared.
• specific conditions for pulverization by a vibrating ball mill are as follows. 50 to 100%, preferably 60 to 80%, of the void after filling with balls, vibration width 4 to 16 mm, preferably 5 to 13 mm, vibration frequency 600 to 2000 times/minute, preferably 1000 to 1500 It is preferable to set the conditions to times/minute and a gravitational acceleration magnification of 4 to 10G, preferably 4 to 7G. Under the above conditions, pulverization is preferably carried out for 5 to 20 hours, preferably 10 to 15 hours. Further, it is more preferable to adjust the temperature during pulverization to 50 to 120°C.
• the balls are made of a material having a hardness almost equal to that of ⁇ -type silicon nitride, and more specifically, by using balls made of a sintered body of silicon nitride, it is possible to reduce the generation of fine powder when pulverization is carried out for a long period of time. It is preferable because the crystal strain can be adjusted while moderately suppressing it. Also, the use of the common material makes it possible to effectively prevent contamination from balls of the silicon nitride powder obtained by pulverization.
• a grinding aid such as ethanol can be used as necessary.
• the fine powder generated by the pulverization may be partially cut as necessary in order to adjust the particle size distribution.
• the present invention also provides a method for producing a silicon nitride sintered body, characterized by firing the silicon nitride powder compact in a nitrogen atmosphere.
• the shape of the sintered body is not particularly limited, but a typical example is a substrate. and the total content of aluminum elements adjusted to 800 ppm or less, under an inert gas atmosphere and a pressure of 0.1 MPa G or more and less than 0.5 MPa G, heated to a temperature of 1200 to 1800 ° C. and sintering the silicon nitride.
• the silicon nitride powder of the present invention having a specific crystal strain is used in spite of the fact that the silicon nitride powder has a high ⁇ -conversion rate, so that dense sintering can be performed at a low temperature and a low constant pressure. It is possible to obtain a silicon nitride sintered substrate having high thermal conductivity and strength.
• sintering aids are used without particular limitation, but it is particularly preferable to contain a sintering aid containing a compound that does not have oxygen. By using such a sintering aid, it is possible to prevent a decrease in the thermal conductivity of the resulting silicon nitride sintered body.
• a carbonitride-based compound containing a rare earth element or magnesium element (hereinafter also referred to as a specific carbonitride-based compound) is preferable.
• a specific carbonitride-based compound By using such a specific carbonitride-based compound, it becomes easier to obtain a silicon nitride sintered body having high thermal conductivity more effectively.
• the specific carbonitride-based compound functions as a getter agent that adsorbs oxygen contained in the silicon nitride powder, and as a result, a silicon nitride sintered body with high thermal conductivity is obtained.
• the rare earth elements are preferably Y (yttrium), La (lanthanum), Sm (samarium), Ce (cerium), and the like.
• Examples of carbonitride compounds containing rare earth elements include Y 2 Si 4 N 6 C, Yb 2 Si 4 N 6 C, Ce 2 Si 4 N 6 C, and the like.
• Y 2 Si 4 N 6 C and Yb 2 Si 4 N 6 C are preferred from the viewpoint of facilitating the production of a silicon nitride sintered body with a high yield.
• Examples of carbonitride compounds containing magnesium include MgSiN 2 and MgSi 4 N 6 C. These specific carbonitride-based compounds may be used singly or in combination of two or more.
• the sintering aid can further contain a metal oxide in addition to the oxygen-free compound.
• a metal oxide when the sintering aid contains a metal oxide, sintering of the silicon nitride powder is facilitated, and a denser and stronger sintered body can be easily obtained.
• metal oxides examples include yttria (Y 2 O 3 ), magnesia (MgO), and ceria (CeO). Among these, yttria is preferred.
• a metal oxide may be used individually by 1 type, and may use 2 or more types together.
• the mass ratio of the oxygen-free compound represented by the specific carbonitride-based compound to the metal oxide contained in the sintering aid is preferably 0. .2 to 4, more preferably 0.6 to 2. Within such a range, it becomes easier to obtain a denser silicon nitride sintered body with high thermal conductivity.
• the content of the sintering aid in the green sheet is preferably 3-20 parts by mass, more preferably 7-10 parts by mass, with respect to 100 parts by mass of the silicon nitride powder.
• the green sheet can be molded using a binder.
• the green sheet is prepared by molding a molding composition described later into a sheet, drying it if necessary, degreasing it under known conditions to remove the binder, and firing it.
• binders include, but are not limited to, polyvinyl alcohol, polyvinyl butyral, methylcellulose, alginic acid, polyethylene glycol, carboxymethylcellulose, ethylcellulose, and acrylic resins.
• the content of the binder used in the production of the green sheet is preferably 1 to 30 parts by mass with respect to 100 parts by mass of the silicon nitride powder, and the ratio may be appropriately determined according to the molding method.
• the total content (mass) of aluminum elements in the green sheet is preferably 800 ppm or less. That is, the green sheet used in the present invention has a very small amount of aluminum element, and the content of aluminum element in the silicon nitride sintered body obtained thereby can be kept low within this range, and high heat resistance can be obtained. It becomes possible to exhibit conductivity.
• the total content of aluminum elements in the green sheet is preferably 700 ppm or less, more preferably 600 ppm or less.
• the method of manufacturing the green sheet used in the present invention is not particularly limited, and examples thereof include a method of molding a molding composition containing at least silicon nitride powder and a sintering aid by known molding means.
• known molding means include a press molding method, an extrusion molding method, an injection molding method, a doctor blade method and the like, and the doctor blade method is particularly preferred.
• the molding composition may contain a solvent from the viewpoint of ease of handling and ease of molding.
• the solvent include, but are not particularly limited to, organic solvents such as alcohols and hydrocarbons, water, and the like.
• Water is preferably used in the present invention. That is, it is preferable to obtain a green sheet by molding a molding composition containing silicon nitride powder, a sintering aid, and water.
• the use of water as the solvent is preferable because the environmental load is reduced compared to the use of organic solvents.
• the green sheet is degreased as necessary and then fired under certain conditions to sinter the silicon nitride.
• the green sheet is generally coated in advance with a release material made of boron nitride powder.
• the firing is performed in an inert gas atmosphere.
• An inert gas atmosphere means, for example, a nitrogen atmosphere or an argon atmosphere.
• the firing be performed under a pressure of 0 MPa ⁇ G or more and less than 0.1 MPa ⁇ G in the inert gas atmosphere.
• the pressure is preferably 0 MPa ⁇ G or more and 0.05 MPa ⁇ G or less.
• G at the end of the pressure unit MPa ⁇ G means gauge pressure.
• high pressure is not required under such firing conditions, it can be performed in a batch furnace such as a muffle furnace or a tubular furnace, or in a continuous furnace such as a pusher furnace.
• the green sheet is fired by heating to a temperature of 1500-1800°C. If the temperature is less than 1500°C, sintering of silicon nitride will be difficult to proceed, and if it exceeds 1800°C, silicon nitride will easily decompose. From this point of view, the heating temperature for firing is preferably 1600 to 1800°C. Although the firing time is not particularly limited, it is preferably about 3 to 20 hours.
• the green sheet When a binder is used to form the green sheet, it is preferable to remove organic components such as the binder by providing a degreasing step.
• the degreasing conditions are not particularly limited, but for example, the green sheet may be heated to 450 to 650° C. in the air or in an inert atmosphere such as nitrogen or argon.
• the silicon nitride sintered substrate is subjected to a blasting treatment as necessary to remove adhering matter such as a mold release material made of boron nitride powder, and the product is made.
• ⁇ Conversion Rate of Silicon Nitride Powder The ⁇ conversion rate of silicon nitride powder was obtained by powder X-ray diffraction (XRD) measurement using CuK ⁇ rays. Specifically, C.I. P. Gazzara and D. R. Messier: Ceram. Bull. , 56 (1977), 777-780, the weight ratio of the ⁇ phase and the ⁇ phase in the silicon nitride powder was calculated to determine the ⁇ conversion rate.
• the crystal strain ( ⁇ ) was calculated from the slope of the straight line obtained by the least-squares method by plotting "2 sin ⁇ / ⁇ ” in the following formula 2 on the X axis and " ⁇ cos ⁇ / ⁇ " on the Y axis.
• ⁇ cos ⁇ / ⁇ ⁇ (2 sin ⁇ / ⁇ )+(1/Dc) (2) ( ⁇ : integral width (rad), ⁇ : Bragg angle (rad), ⁇ : crystal strain, ⁇ : X-ray wavelength, Dc: crystal diameter (nm))
• the silicon nitride powder of the sample is charged, and the silicon nitride powder is dispersed for 2 minutes at AMPLITUDE (amplitude) 50% (about 2 amperes) with an ultrasonic homogenizer (US-300E manufactured by Nippon Seiki Seisakusho Co., Ltd., tip diameter 26 mm). rice field. Dispersion was performed by inserting the tip of the tip into the beaker up to the position of the 20 mL marked line. Next, the particle size distribution of the resulting dispersion of silicon nitride powder was measured using a laser diffraction/scattering method particle size distribution analyzer (Microtrac MT3300EXII manufactured by Microtrac Bell Co., Ltd.).
• the particle diameter at which the cumulative curve of the volume-based particle diameter distribution measured in the above particle diameter distribution measurement is 50% is defined as D50
• the particle diameter at which the cumulative curve is 90% is defined as D90.
• the specific surface area of the silicon nitride powder was measured using a BET method specific surface area measuring device (Macsorb HM model-1201) manufactured by Mountec Co., Ltd. using the BET one-point method by nitrogen gas adsorption. It was measured.
• the silicon nitride powder to be measured was previously heat-treated in the air at 600°C for 30 minutes to remove organic substances adsorbed on the powder surface.
• the silicon nitride powder used in each example and comparative example was enclosed in a tin capsule (the tin capsule is a Tin Cupsule manufactured by LECO), introduced into a graphite crucible, heated at 5.5 kW for 20 seconds, and adsorbed gas. After degassing, the temperature was raised from 0.8 kW to 4 kW over 350 seconds after 0.8 kW for 10 seconds, and the amount of carbon dioxide generated during that time was measured and converted to the oxygen content.
• the tin capsule is a Tin Cupsule manufactured by LECO
• the oxygen that is generated initially is oxygen derived from the oxide present on the surface of the silicon nitride particles (external oxygen), and the oxygen that is generated later forms a solid solution in the silicon nitride crystals. Since it corresponds to oxygen (internal oxygen), the two peaks were separated by drawing a vertical line from the valleys of these two measured peaks after subtracting the previously measured background. By proportionally distributing the respective peak areas, the amount of dissolved oxygen (internal oxygen) and the amount of external oxygen were calculated.
• Amount of impurity metals in silicon nitride powder and molded body The amount of iron, aluminum elements and other impurity metals in the silicon nitride powder and molded body is measured by an inductively coupled plasma atomic emission spectrometer (Thermo Fisher Scientific Co., Ltd.). ("iCAP 6500 DUO").
• Density of molded body The density of each molded body was measured using an automatic hydrometer (manufactured by Shinko Denshi Co., Ltd.: DMA-220H model), and the average value of 15 pieces was taken as the density of the molded body.
• the above thermal conductivity was measured after blasting the surface of the silicon nitride sintered body and then coating the surface with Au and carbon.
• Silicon powder (semiconductor grade, average particle size 5 ⁇ m) and silicon nitride powder (average particle size 1.5 ⁇ m) as a diluent are mixed to obtain raw material powder (Si: 80% by mass, Si 3 N 4 : 20% by mass ).
• the raw material powder was filled in a reaction vessel to form a raw material powder layer.
• the reaction vessel was placed in a pressure-resistant closed reactor having an ignition device and a gas supply/exhaust mechanism, and the inside of the reactor was depressurized and degassed, and nitrogen gas was supplied to replace with nitrogen. After that, nitrogen gas was gradually supplied to raise the pressure to 0.7 MPa.
• the bulk density of the raw material powder was 0.5 g/cm 3 at the time when the predetermined pressure was reached (at the time of ignition). Thereafter, an end portion of the raw material powder in the reaction vessel was ignited to carry out a combustion synthesis reaction to obtain a mass of silicon nitride.
• the obtained lumpy product was pulverized by rubbing against each other, and then pulverized for 12 hours by putting an appropriate amount into a vibrating ball mill. Pulverization by the vibrating ball mill was carried out by filling balls made of silicon nitride sintered bodies with a diameter of 15 mm at an apparent filling rate of 85%, filling silicon nitride coarse powder so that the voids were 70%, and vibrating with a width of 8 mm.
• the vibration frequency was 1200 times/min
• the gravitational acceleration magnification was 5.6 G
• the temperature during pulverization was adjusted to about 100°C.
• the gravitational acceleration factor is a value calculated from the correlation between the frequency and the centrifugal effect of the amplitude.
• the crusher is provided with a urethane lining inside the container as a countermeasure against heavy metal contamination.
• 1% by mass of ethanol was added as a grinding aid immediately before the start of fine grinding. Table 1 shows the measurement results of the silicon nitride powder A thus obtained.
• a silicon nitride sintered substrate was produced by the following method. 100 parts by mass of silicon nitride powder A, 2 parts by mass of Y 2 Si 4 N 6 C, 4 parts by mass of MgSi 4 N 6 C and 3 parts by mass of yttria produced by the method described below were weighed as sintering aids. Mixing was carried out for 24 hours using water as a dispersion medium and a ball mill using a resin pot and silicon nitride balls. The water was weighed in advance so that the concentration of the slurry was 60 wt %, and was put into the resin pot.
• the viscosity of the molding composition was adjusted using a vacuum defoamer to prepare a coating slurry. After that, the viscosity-adjusted molding composition was subjected to sheet molding by a doctor blade method to obtain a sheet molding having a width of 75 cm and a thickness of 0.35 mm.
• the sheet molded body obtained as described above was degreased in dry air at a temperature of 550°C to obtain a degreased molded body. After that, the compact after degreasing was placed in a firing vessel and fired at 1780° C. for 9 hours under a nitrogen atmosphere and a pressure of 0.02 MPa ⁇ G to obtain a silicon nitride sintered body.
• Table 2 shows the physical properties of the obtained silicon nitride sintered substrate.
• MgSiN 2 powder Magnesium powder (Yamaishi Metal Co., Ltd.), silicon nitride powder obtained by the above method, and metal silicon powder (owned by the company) were synthesized by heating according to the following reaction formula.
• Yttria (Y2O3) powder manufactured by Shin-Etsu Chemical Co., Ltd.
• Example 2> (Silicon nitride powder B) In order to confirm the difference in sinterability due to the difference in crystal strain, in order to match the particle size distribution as much as possible with the silicon nitride powder C obtained in Comparative Example 1 described later, in the manufacturing method of the silicon nitride powder A, after grinding with a vibrating ball mill, A silicon nitride powder was produced by cutting a part of the fine powder from the powder.
• Table 1 shows the measurement results of the silicon nitride powder B thus obtained.
• a silicon nitride sintered substrate was manufactured in the same manner as in Example 1 using the silicon nitride powder B obtained above.
• Table 2 shows the physical properties of the obtained silicon nitride sintered substrate.
• Th (thorium) and U (uranium) in the obtained silicon nitride powder and silicon nitride sintered body were measured by the above method and found to be below the lower limit of determination (0.5 ppbw).
• Table 1 shows the measurement results of the silicon nitride powder C thus obtained.
• a silicon nitride sintered substrate was manufactured in the same manner as in Example 1 using the silicon nitride powder C obtained above.
• Table 2 shows the physical properties of the obtained silicon nitride sintered substrate.

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