WO2023119469A1 - 電気回路形成方法、および電気回路形成装置 - Google Patents

電気回路形成方法、および電気回路形成装置 Download PDF

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Publication number
WO2023119469A1
WO2023119469A1 PCT/JP2021/047510 JP2021047510W WO2023119469A1 WO 2023119469 A1 WO2023119469 A1 WO 2023119469A1 JP 2021047510 W JP2021047510 W JP 2021047510W WO 2023119469 A1 WO2023119469 A1 WO 2023119469A1
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WO
WIPO (PCT)
Prior art keywords
curing
resin
electronic component
curable resin
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/047510
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English (en)
French (fr)
Japanese (ja)
Inventor
謙磁 塚田
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Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to EP21968906.4A priority Critical patent/EP4456680B1/en
Priority to US18/718,967 priority patent/US20240422917A1/en
Priority to PCT/JP2021/047510 priority patent/WO2023119469A1/ja
Priority to JP2023568866A priority patent/JP7811596B2/ja
Publication of WO2023119469A1 publication Critical patent/WO2023119469A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • the present invention relates to an electric circuit forming method and an electric circuit forming apparatus for electrically connecting metal wiring and electronic components.
  • the subject of this specification is to appropriately electrically connect metal wiring and electronic components.
  • the present specification provides a wiring forming step of forming metal wiring on a resin layer, and a first method of applying a conductive fluid to positions where electrodes of an electronic component are to be mounted on the metal wiring.
  • a coating step a first curing step of curing the conductive fluid coated in the first coating step, a second coating step of coating a curable resin on a planned mounting position of the component body of the electronic component; 2.
  • a method of forming an electrical circuit is disclosed that includes three curing steps.
  • the present specification also provides a wiring forming apparatus for forming metal wiring on a resin layer, and a conductive fluid for applying a conductive fluid to positions where electrodes of an electronic component are to be mounted on the metal wiring.
  • a mounting device that mounts the electronic component so that the component body is in contact with the curable resin, and the second curing device semi-cures after the electronic component is mounted by the mounting device.
  • an electrical circuit forming apparatus for curing a flexible resin Disclosed is an electrical circuit forming apparatus for curing a flexible resin.
  • a conductive fluid is applied to the positions where the electrodes of the electronic component are to be mounted on the metal wiring, and the conductive fluid is cured.
  • a curable resin is applied to the intended mounting position of the component body of the electronic component, and the curable resin is semi-cured.
  • the electronic component is mounted so that the electrodes are in contact with the hardened conductive fluid and the component main body is in contact with the semi-hardened hardening resin.
  • the semi-cured curable resin is cured. Thereby, the metal wiring and the electronic component can be appropriately electrically connected.
  • FIG. 4 is a cross-sectional view showing a heat-sensitive release film stuck on a base
  • FIG. 3 is a cross-sectional view showing a circuit board on which a resin laminate is formed
  • FIG. 4 is a cross-sectional view showing a circuit board in which wiring is formed on a resin laminate
  • FIG. 3 is a cross-sectional view showing a circuit board in which a conductive resin paste is applied on wiring
  • FIG. 2 is a cross-sectional view showing a circuit board on which electronic components are mounted so that electrodes are in contact with conductive resin paste
  • FIG. 4 is a cross-sectional view showing a heat-sensitive release film stuck on a base
  • FIG. 3 is a cross-sectional view showing a circuit board on which a resin laminate is formed
  • FIG. 4 is a cross-sectional view showing a circuit board in which wiring is formed on a resin laminate
  • FIG. 3 is a cross-sectional view showing a circuit board in which a conductive resin paste is applied on wiring
  • FIG. 4 is a cross-sectional view showing the circuit board in a state where a thermosetting resin is applied to a planned mounting position of the component body;
  • FIG. 2 is a cross-sectional view showing a circuit board on which electronic components are mounted so that electrodes are in contact with conductive resin paste and component bodies are in contact with thermosetting resin;
  • FIG. 4 is a cross-sectional view showing the circuit board being heated while being compressed;
  • FIG. 4 is a cross-sectional view showing a circuit board in which a thermosetting resin is discharged around electronic components;
  • FIG. 4 is a cross-sectional view showing the circuit board being heated while being compressed; It is a sectional view showing a circuit.
  • the circuit forming apparatus 10 includes a conveying device 20, a first shaping unit 22, a second shaping unit 23, a third shaping unit 24, a fourth shaping unit 25, a compression unit 26, a mounting unit 27, and a control unit. a device (see FIG. 2) 28;
  • the conveying device 20 , the first shaping unit 22 , the second shaping unit 23 , the third shaping unit 24 , the fourth shaping unit 25 , the compression unit 26 and the mounting unit 27 are arranged on the base 29 of the circuit forming device 10 .
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the lateral direction of the base 29 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other.
  • the direction will be referred to as the Z-axis direction for description.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 .
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 .
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction.
  • the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52 .
  • the Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36 .
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and by driving the electromagnetic motor 56, the stage 52 moves to any position in the Y-axis direction. As a result, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .
  • the stage 52 has a base 60, a holding device 62, an elevating device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface thereof.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Both edges of the substrate placed on the base 60 in the X-axis direction are sandwiched by the holding device 62, so that the substrate is fixedly held.
  • the lifting device 64 is arranged below the base 60 and lifts the base 60 up and down.
  • a heater 66 is built in the base 60 and heats the substrate placed on the base 60 to an arbitrary temperature.
  • the first shaping unit 22 is a unit that shapes the wiring of the circuit board, and has a first printing section 72 and a baking section 74 .
  • the first printing unit 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 linearly ejects the metal ink.
  • the metal ink is prepared by dispersing nanometer-sized metal particles such as silver particles in a solvent. The surfaces of the fine metal particles are coated with a dispersant to prevent aggregation in the solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using piezoelectric elements.
  • the baking unit 74 has an infrared irradiation device (see FIG. 2) 78.
  • the infrared irradiation device 78 is a device for irradiating the ejected metal ink with infrared rays, and the metal ink irradiated with the infrared rays is baked to form wiring.
  • Baking metal ink means that the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersing agent is decomposed, by applying energy, and the metal fine particles come into contact or fuse to become conductive. This is a phenomenon in which the rate increases. Then, by baking the metal ink, a metal wiring is formed.
  • the second molding unit 23 is a unit for molding the resin layer of the circuit board, and has a second printing section 84 and a curing section 86 .
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects ultraviolet curable resin.
  • An ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo system using piezoelectric elements, or a thermal system in which resin is heated to generate bubbles and ejected from a plurality of nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the surplus resin is scraped off with a roller or a blade. to make the thickness of the UV curable resin uniform.
  • the irradiation device 92 has a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.
  • the third molding unit 24 is a unit for molding the connecting portion between the electrodes of the electronic component and the wiring on the circuit board, and has the third printing portion 100 .
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 ejects a conductive resin paste.
  • the conductive resin paste is made by dispersing micrometer-sized metal particles in a resin that hardens when heated at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive resin paste is relatively higher than that of the metal ink.
  • the discharge amount of the conductive resin paste from the dispenser 106 is controlled by the inner diameter of the needle, the pressure during discharge, and the discharge time.
  • the conductive resin paste discharged by the dispenser 106 is heated by the heater 66 built in the base 60, and the resin in the heated conductive resin paste is cured. At this time, in the conductive resin paste, the resin hardens and shrinks, and the flake-like metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. Moreover, the resin of the conductive resin paste is an organic adhesive, and exerts its adhesive strength by being hardened by heating.
  • the fourth molding unit 25 is a unit for molding resin for fixing electronic components to circuit boards, and has a fourth printing unit 110 .
  • the fourth printing unit 110 has a dispenser (see FIG. 2) 116, and the dispenser 116 dispenses thermosetting resin.
  • a thermosetting resin is a resin that is cured by heating.
  • the dispenser 116 is, for example, a piezo system using a piezoelectric element. The thermosetting resin discharged by the dispenser 116 is heated by the heater 66 built in the base 60 and hardened.
  • the compression unit 26 is a unit for compressing the circuit board and has a compression section 120 .
  • the compression section 120 has a compression plate (see FIG. 10) 122, a rubber sheet (see FIG. 10) 124, and a cylinder (see FIG. 2) 126.
  • the rubber sheet 124 is made of silicone rubber and has a thick sheet shape.
  • the compression plate 122 is made of steel and has a plate shape.
  • a rubber sheet 124 is attached to the lower surface of the compression plate 122, and the compression plate 122 is pressed against the circuit board by the operation of the cylinder 126. As shown in FIG. As a result, the circuit board is compressed by the compression plate 122 via the rubber sheet 124 .
  • the force for compressing the substrate can be controllably changed.
  • the mounting unit 27 is a unit for mounting electronic components on the circuit board, and has a supply section 130 and a mounting section 132 .
  • the supply unit 130 has a plurality of tape feeders (see FIG. 2) 134 that feed taped electronic components one by one, and supplies the electronic components at the supply position.
  • the supply unit 130 is not limited to the tape feeder 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray.
  • the supply unit 130 may be configured to include both a tape type and a tray type, or other types of supply devices.
  • the mounting unit 132 has a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for sucking and holding the electronic component.
  • the suction nozzle is supplied with negative pressure from a positive/negative pressure supply device (not shown), and sucks and holds the electronic component by sucking air. Then, the electronic component is released by supplying a slight positive pressure from the positive/negative pressure supply device.
  • the moving device 138 moves the mounting head 136 between the position where the electronic components are supplied by the tape feeder 134 and the substrate placed on the base 60 .
  • the mounting section 132 the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • the control device 28 also includes a controller 140 and a plurality of drive circuits 142, as shown in FIG.
  • the plurality of drive circuits 142 includes the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, It is connected to dispenser 116 , cylinder 126 , tape feeder 134 , mounting head 136 and moving device 138 .
  • the controller 140 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 142 . Accordingly, the controller 140 controls the operations of the conveying device 20 , the first shaping unit 22 , the second shaping unit 23 , the third shaping unit 24 , the fourth shaping unit 25 , the compression unit 26 , and the mounting unit 27 .
  • the resin laminate is formed on the base 60 and wiring is formed on the upper surface of the resin laminate by the above-described configuration. Then, the electrodes of the electronic components are electrically connected to the wiring through the conductive resin paste, and the electronic components are fixed with resin to form the circuit board.
  • a heat-sensitive release film 150 is first laid as shown in FIG. Since the heat-sensitive peeling film 150 has adhesiveness, it adheres appropriately to the upper surface of the base 60 .
  • a circuit board is formed on the heat-sensitive peeling film 150, and the close contact of the heat-sensitive peeling film 150 to the base 60 prevents displacement of the circuit board during circuit formation. Since the adhesiveness of the heat-sensitive peeling film 150 is reduced by heating, the heat-sensitive peeling film 150 is heated after the circuit board is formed on the heat-sensitive peeling film 150, so that the heat-sensitive peeling film 150 is heated.
  • the heat-sensitive peeling film 150 can be easily peeled off from the base 60 together with the formed circuit board.
  • the resin layered body 152 has a cavity 154, and is formed by repeating ejection of the ultraviolet curable resin from the inkjet head 88 and irradiation of the ejected ultraviolet curable resin with ultraviolet rays from the irradiation device 92. .
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the upper surface of the heat-sensitive release film 150 .
  • the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform.
  • the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 155 is formed on the thermal release film 150 .
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin resin layer 155 .
  • the flattening device 90 flattens the thin film of the ultraviolet curable resin
  • the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film with ultraviolet rays, thereby forming a thin film on the resin layer 155 .
  • a thin film resin layer 155 is laminated. In this way, the discharge of the ultraviolet curable resin onto the thin resin layer 155 and the irradiation of ultraviolet rays are repeated, and the first laminate 156 is formed by laminating a plurality of resin layers 155 . be.
  • the inkjet head 88 ejects ultraviolet curable resin so that a predetermined portion of the upper surface of the first laminate 156 is exposed. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. Thereby, a resin thin film layer 157 is formed on the first laminate 156 .
  • the inkjet head 88 ejects the UV curable resin in a thin film only on the portion above the thin film layer 157 .
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film layer 157 so that a predetermined portion of the upper surface of the first laminate 156 is exposed.
  • the flattening device 90 flattens the thin film of the ultraviolet curable resin
  • the irradiation device 92 irradiates the ultraviolet curable resin discharged in the form of a thin film with ultraviolet rays, so that the thin film layer 157 is formed on the thin film layer 157 . are stacked.
  • the discharge of the ultraviolet curable resin onto the thin film layers 157 and the irradiation of ultraviolet rays are repeated, and a plurality of thin film layers 157 are laminated to form the second laminate 158 .
  • the second laminate 158 on the first laminate 156, the stepped portion between the first laminate 156 and the second laminate 158 functions as a cavity 154.
  • a body 152 is formed.
  • the stage 52 is moved below the first modeling unit 22 .
  • the inkjet head 76 applies the metal ink 160 to the cavity 154 of the resin laminate 152, that is, the upper surface of the first laminate 156, as shown in FIG. , linearly ejected according to the circuit pattern.
  • the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays in the baking section 74 of the first modeling unit 22 .
  • the metal ink 160 is baked to form the wiring 162 in the cavity 154 .
  • FIG. 5 three wirings 162 are formed, and when distinguishing between the three wirings 162, the wiring on the left side in FIG. 162c, and the wiring on the right side is described as wiring 162c.
  • the stage 52 is moved below the third modeling unit 24 .
  • the dispenser 106 is placed on both ends of the wiring 162b and on the wiring 162a and the wiring 162c facing both ends of the wiring 162b.
  • a conductive resin paste 166 is discharged onto the edge.
  • the resin layered body 152 is heated by the heater 66 built in the base 60 according to the heating conditions of the conductive resin paste.
  • the conductive resin paste 166 is heated through the resin laminate 152 and cured.
  • the heating conditions for the conductive resin paste are heating conditions for completely curing the conductive resin paste, and are set by the manufacturer of the conductive resin paste. Further, the heating conditions for the conductive resin paste are set according to the results of heating the conductive resin paste experimentally performed by the user of the conductive resin paste. In this manner, the conductive resin paste 166 is heated according to the heating conditions of the conductive resin paste and completely cured, thereby exhibiting conductivity.
  • an electronic component (see FIG. 7) 172 is supplied by the tape feeder 134 and the electronic component 172 is held by the suction nozzle of the mounting head 136 .
  • the electronic component 172 is composed of a component body 176 and two electrodes 178 arranged on the lower surface of the component body 176 .
  • the mounting head 136 is moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted on the upper surface of the resin laminate 152, as shown in FIG. In FIG.
  • two electronic components 172 are mounted on the top surface of the resin laminate 152, and the two electronic components 172 have different sizes. For this reason, a large-sized electronic component is described as an electronic component 172a, and a small-sized electronic component is described as an electronic component 172b.
  • the two electronic components 172a and 172b are connected so that the electronic component 172a is electrically connected to the two wires 162a and 162b and the electronic component 172b is electrically connected to the two wires 162b and 162c. is attached to the upper surface of the resin laminate 152 .
  • the electronic component 172a is mounted so that the electrodes 178 are in contact with the conductive resin paste 166 in a hardened state on the wirings 162a and 162b. Further, the electronic component 172b is mounted so that the electrodes 178 are in contact with the conductive resin paste 166 in a hardened state on the wirings 162b and 162c. As a result, the electronic component 172 and the wiring 162 are electrically connected via the conductive resin paste 166 in a hardened state.
  • the hardened conductive resin paste 166 has no adhesion to components and has a low Young's modulus
  • the electronic component 172 mounted in contact with the conductive resin paste 166 is separated from the conductive resin paste 166.
  • Young's modulus is the constant of proportionality between strain and stress in the elastic range, and is the ratio of stress to strain. Therefore, when an object with a high Young's modulus and an object with a low Young's modulus are deformed by the same stress, the object with a low Young's modulus deforms more than the object with a high Young's modulus. That is, an object with a low Young's modulus is easily deformed.
  • the electronic component is mounted so that the electrodes are in contact with the uncured conductive resin paste without heating the conductive resin paste.
  • the uncured conductive resin paste is crushed by the electrodes, and the film thickness of the conductive resin paste is reduced. Become thin. Even if the conductive resin paste is heated, it liquefies like solder and is not deformed into an optimal shape, and is crushed and joined in a thin state.
  • the resin laminate 152 on which electronic components are mounted is made of ultraviolet curable resin, as described above.
  • the coefficient of thermal expansion of the resin layered body 152 made of an ultraviolet curable resin is higher than that of a general circuit board, so a large stress is generated in the junction between the electrode and the wiring. Therefore, as described above, a conductive resin paste having a low Young's modulus is employed as the conductive resin paste sandwiched between the electrodes and the wiring.
  • a conductive resin paste having a low Young's modulus is employed as the conductive resin paste sandwiched between the electrodes and the wiring.
  • thermosetting resin is discharged to the intended mounting position of the component body of the electronic component, and the thermosetting resin is semi-cured. Then, after the electronic component is mounted on the resin laminate so that the electrodes are in contact with the conductive resin paste in a cured state and the component body is in contact with the thermosetting resin in a semi-cured state, the semi- The thermosetting resin in the cured state is fully cured.
  • thermosetting resin 180 is discharged onto the upper surface of the first laminate 156 and the upper surface of the first laminate 156 between the wiring 162b and the wiring 162c.
  • the viscosity of the thermosetting resin 180 is low, specifically, for example, 0.5 to 30 Pa s, it is possible to apply a very small amount, and even small gaps can be suitably filled. be able to.
  • thermosetting resin 180 is discharged onto the upper surface of the first laminate 156 , the resin laminate 152 is heated under predetermined heating conditions by the heater 66 incorporated in the base 60 . As a result, the thermosetting resin 180 is heated through the resin laminate 152 and cured.
  • the heating conditions are lower in heating temperature and shorter in heating time than the heating conditions for completely curing the thermosetting resin. Therefore, even if the resin layered body 152 is heated under a predetermined heating condition, the thermosetting resin is not completely cured, and is in an uncured state, that is, a semi-cured state. Therefore, the heating conditions here are described as semi-curing heating conditions for the thermosetting resin, and the heating conditions for completely curing the thermosetting resin are described as complete curing heating conditions.
  • the heating temperature for semi-curing the thermosetting resin may be lower than the heating condition for completely curing the thermosetting resin, and the heating time may be the same as that for the heating condition for completely curing the thermosetting resin.
  • the heating condition for semi-curing the thermosetting resin may be shorter than the heating condition for completely curing the thermosetting resin, and the heating temperature may be the same as the heating temperature for the complete curing heating condition.
  • thermosetting resin 180 when the thermosetting resin 180 is heated under the semi-curing heating conditions and semi-cured, the stage 52 is moved below the mounting unit 27 . Then, in the mounting unit 27, the electronic component 172 is mounted on the upper surface of the resin laminate 152, as shown in FIG. Specifically, the electronic component 172a is mounted so that the electrodes 178 are in contact with the conductive resin paste 166 in a hardened state on the wirings 162a and 162b. At this time, the component body 176 of the electronic component 172a contacts the semi-cured thermosetting resin 180 discharged between the wirings 162a and 162b.
  • the electronic component 172b is mounted so that the electrodes 178 are in contact with the conductive resin paste 166 in a hardened state on the wirings 162b and 162c.
  • the component body 176 of the electronic component 172b is discharged between the wirings 162b and 162c and comes into contact with the thermosetting resin 180 in a semi-cured state.
  • the conductive resin paste 166 is discharged to the position where the electrode 178 is to be mounted on the wiring 162, and the thermosetting resin 180 is discharged to the position where the component body 176 is to be mounted.
  • the electrodes 178 come into contact with the conductive resin paste 166 in a cured state on the wiring 162, and the component body 176 is thermally cured in a semi-cured state. contact with the adhesive resin 180 .
  • the electronic component 172a is electrically connected to the two wirings 162a and 162b
  • the electronic component 172b is electrically connected to the two wirings 162b and 162c. connected
  • the conductive resin paste 166 is not crushed by the electrodes 178 . Appropriate film thickness can be secured.
  • the electrode 178 contacts the conductive resin paste 166 in a hardened state, the contact area between the electrode 178 and the conductive resin paste 166 is small.
  • thermosetting resin 180 fixes the electronic component 172 to the upper surface of the resin laminate 152 in the component body 176 . As a result, it is possible to appropriately prevent the positional deviation of the electronic component 172 .
  • the electronic component 172 is resin-laminated such that the electrode 178 contacts the conductive resin paste 166 in a cured state on the wiring 162 and the component body 176 contacts the thermosetting resin 180 in a semi-cured state.
  • stage 52 is moved under compression unit 26 . 10
  • the electronic component 172 mounted on the resin laminate 152 is compressed downward by the compression plate 122 via the rubber sheet 124 in the compression section 120 of the compression unit 26.
  • the thermosetting resin 180 in contact with the lower surface of the component body 176 is also compressed downward, but the thermosetting resin 180 is semi-cured. Therefore, the seepage of the thermosetting resin 180 to the electrodes and the generation of voids are suppressed.
  • two electronic components 172 a and 172 b are mounted in the cavity 154 of the resin laminate 152 , but the depth dimension of the cavity 154 is smaller than the height dimension of the two electronic components 172 . For this reason, the upper surfaces of the two electronic components 172a,b extend upward from the cavity 154, and the two electronic components 172 can be compressed downward by the compression plate 122. FIG. Moreover, as described above, the two electronic components 172 are different in size, and therefore have different height dimensions. Accordingly, when the two electronic components 172a and 172b are compressed, the rubber sheet 124 is elastically deformed, so that the two electronic components 172a and 172b having different height dimensions can be appropriately compressed.
  • the heater 66 built in the base 60 heats the resin laminate 152 under the heating condition for completely curing the thermosetting resin.
  • the thermosetting resin 180 is heated under the complete curing heating condition via the resin laminate 152 and is completely cured. That is, the thermosetting resin 180 is completely cured while being sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176 .
  • the conductive resin paste in contact with the electrode 178 166 is deformed, and the contact area between electrode 178 and conductive resin paste 166 increases.
  • the conductive resin paste 166 having a low Young's modulus is pressed by the electrode 178 and is deformed. Increased contact area. This ensures electrical connection between the electronic component 172 and the wiring 162 .
  • the thermosetting resin 180 in contact with the component body 176 is also deformed, and the component body 176 and the thermosetting resin 180 are deformed.
  • the contact area with the adhesive resin 180 also increases. By increasing the contact area between the component body 176 and the thermosetting resin 180 in this manner, the electronic component 172 can be preferably fixed to the resin laminate 152 by the adhesive force of the thermosetting resin 180 .
  • the stage 52 is moved below the fourth modeling unit 25 .
  • the dispenser 116 spreads a thermosetting resin 190 around the electronic component 172 so as to cover the side surface of the component body 176 of the electronic component 172, as shown in FIG. to dispense.
  • the resin layered body 152 is heated by the heater 66 incorporated in the base 60 under heating conditions for completely curing the thermosetting resin.
  • the thermosetting resin 190 is heated under the complete curing heating condition via the resin laminate 152 and is completely cured.
  • the thermosetting resin 190 is cured while covering the side surface of the component body 176 .
  • thermosetting resins 180 and 190 are sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176, and the side surfaces of the component body 176 are sealed. It cures while covering the As a result, the electronic component 172 mounted on the upper surface of the resin laminate 152 is fixed by the cured resin.
  • the circuit board 200 is formed on the heat-sensitive release film 150 on the upper surface of the base 60 . Then, in order to peel off the heat-sensitive peeling film 150 from the formed circuit board 200, the heat-sensitive peeling film 150 is heated by the heater 66 incorporated in the base 60. At this time, the circuit board 200 is also heated. As a result, the circuit board 200 may be warped. Therefore, when heating the heat-sensitive peeling film 150 , the heat-sensitive peeling film 150 is heated while compressing the circuit board 200 .
  • the stage 52 is moved below the compression unit 26 . 12
  • the entire circuit board 200 is compressed downward by the compression plate 122 via the rubber sheet 124 in the compression section 120 of the compression unit 26.
  • the heat-sensitive release film 150 is heated by the heater 66 incorporated in the base 60 during compression by the compression plate 122 .
  • the adhesiveness of the heat-sensitive peeling film 150 is reduced, and the circuit board 200 can be easily peeled off from the base 60 together with the heat-sensitive peeling film 150 .
  • the circuit board 200 By forming the circuit board 200 by such a method, it is possible to secure an appropriate film thickness of the conductive resin paste 166 between the electrodes 178 of the electronic component 172 and the wiring 162, and to heat-harden the semi-hardened state.
  • the flexible resin 180 can appropriately prevent the positional displacement of the electronic component.
  • it is possible to form a circuit capable of appropriately relieving the stress generated in the joint portion between the electrode 178 and the wiring 162 and appropriately securing the electrical connection between the electronic component 172 and the wiring 162. can.
  • the controller 140 of the control device 28 includes a resin layer forming section 210, a wiring forming section 212, a first coating section 214, a first curing section 216, a second coating section 218, and a second curing section. 220 , a mounting portion 222 , a third curing portion 224 , a third applying portion 226 and a fourth curing portion 228 .
  • the resin layer forming part 210 is a functional part for forming the resin layered body 152 with an ultraviolet curable resin.
  • the wiring forming section 212 is a functional section for forming the wiring 162 with the metal ink 160 .
  • the first application part 214 is a functional part for applying the conductive resin paste 166 to the position where the electrode 178 on the wiring is to be mounted.
  • the first curing section 216 is a functional section for completely curing the conductive resin paste 166 applied on the wiring.
  • the second application section 218 is a functional section for applying the thermosetting resin 180 to the intended mounting position of the component body 176 .
  • the second curing section 220 is a functional section for semi-curing the thermosetting resin 180 applied to the intended mounting position of the component body.
  • the mounting portion 222 is a functional portion for mounting the electronic component 172 so that the electrodes 178 are in contact with the hardened conductive resin paste 166 and the component body 176 is in contact with the semi-hardened thermosetting resin 180 . .
  • the third curing section 224 is a functional section for completely curing the thermosetting resin 180 in contact with the component body while compressing the electronic component.
  • the third application section 226 is a functional section for applying the thermosetting resin 190 around the component body 176 .
  • the fourth curing section 228 is a functional section for completely curing the thermosetting resin 190 applied around the component body.
  • the circuit forming apparatus 10 in the above embodiment is an example of an electric circuit forming apparatus.
  • the first modeling unit 22 is an example of a wiring forming device.
  • the mounting unit 27 is an example of a mounting device.
  • the heater 66 is an example of a first curing device and a second curing device.
  • Dispenser 106 is an example of a first coating device.
  • Dispenser 116 is an example of a second coating device.
  • Rubber sheet 124 is an example of an elastic body.
  • the resin laminate 152 is an example of a resin layer.
  • the wiring 162 is an example of metal wiring.
  • Conductive resin paste 166 is an example of a conductive fluid.
  • Electronic component 172 is an example of an electronic component.
  • the component body 176 is an example of a component body.
  • Electrode 178 is an example of an electrode.
  • Thermosetting resin 180 is an example of a curable resin.
  • the process executed by the wiring forming section 212 is an example of the wiring forming process.
  • the process performed by the first coating section 214 is an example of the first coating process.
  • the process performed by the first curing section 216 is an example of a first curing process.
  • the process performed by the second coating section 218 is an example of the second coating process.
  • the process performed by the second curing section 220 is an example of the second curing process.
  • the process performed by the mounting part 222 is an example of the mounting process.
  • the process performed by the third curing section 224 is an example of a third curing process.
  • the process executed by the third coating section 226 is an example of the third coating process.
  • the process performed by the fourth curing section 228 is an example of a fourth curing process.
  • the present invention is not limited to the above embodiments, and can be implemented in various aspects with various modifications and improvements based on the knowledge of those skilled in the art.
  • the circuit board is compressed by the compression plate 122 via the rubber sheet 124, but the circuit board can be compressed by the compression plate 122 via various members as long as it is an elastically deformable member.
  • the circuit board may
  • silicon-based resin, urethane-based resin, or the like can be used as the elastically deformable member.
  • the conductive resin paste 166 is employed as the fluid for electrically connecting the wiring 162 and the electrode 178 of the electronic component 172, but various fluids may be used as long as they exhibit conductivity. can be adopted.
  • thermosetting resin is used as the curable resin for fixing the electronic component 172, but an ultraviolet curable resin, a two-liquid mixed curable resin, a thermoplastic resin, or the like may be used.
  • an ultraviolet curable resin is used as the resin forming the resin laminate 152 and a thermosetting resin is used as the resin for fixing the electronic component 172 . That is, although the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different curable resins, the resin forming the resin laminate 152 and the resin fixing the electronic component 172 are different. The same curable resin may be used.
  • the conductive resin paste is discharged by the dispenser 106, but may be transferred by a transfer device or the like. Alternatively, the conductive resin paste may be printed by screen printing.
  • circuit forming device (electrical circuit forming device) 22: first modeling unit (wiring forming device) 27: mounting unit (mounting device) 66: heater (first curing device) (second curing device) 106: dispenser (second 1 coating device) 116: Dispenser (second coating device) 124: Rubber sheet (elastic body) 152: Resin laminate (resin layer) 162: Wiring (metal wiring) 166: Conductive resin paste (conductive fluid) 172: Electronic component 176: Component body 178: Electrode 180: Thermosetting resin (hardening resin) 212: Wiring forming part (wiring forming process) 214: First coating part (first coating process) 216: First curing part (first 1 curing process) 218: 2nd coating part (2nd coating process) 220: 2nd curing part (2nd curing process) 222: Mounting part (mounting process) 224: 3rd curing part (3rd curing process) 226: Third application section (third application process) 228: Fourth cu

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2021/047510 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置 Ceased WO2023119469A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP21968906.4A EP4456680B1 (en) 2021-12-22 2021-12-22 Electrical circuit forming method and electrical circuit forming apparatus
US18/718,967 US20240422917A1 (en) 2021-12-22 2021-12-22 Electrical circuit forming method and electrical circuit forming apparatus
PCT/JP2021/047510 WO2023119469A1 (ja) 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置
JP2023568866A JP7811596B2 (ja) 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置

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PCT/JP2021/047510 WO2023119469A1 (ja) 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置

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Publication number Priority date Publication date Assignee Title
JPH0730236A (ja) * 1993-07-08 1995-01-31 Hitachi Ltd 部品の搭載方法
JP2001007503A (ja) 1999-06-23 2001-01-12 Denso Corp 電子部品の実装方法
JP2001332846A (ja) * 2000-05-23 2001-11-30 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装体
JP2004363434A (ja) * 2003-06-06 2004-12-24 Matsushita Electric Ind Co Ltd 電子回路装置およびその製造方法
WO2021075051A1 (ja) * 2019-10-18 2021-04-22 株式会社Ｆｕｊｉ 部品装着方法、および部品装着装置

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Publication number Priority date Publication date Assignee Title
JPS62169433A (ja) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd 半導体装置の製造方法
JPH01226162A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 半導体チップの接続方法
JPH0794856A (ja) * 1993-09-20 1995-04-07 Hitachi Ltd 混成集積回路作製方法
JPWO2008136419A1 (ja) * 2007-04-27 2010-07-29 日本電気株式会社 半導体装置及び製造方法並びにリペア方法
JP7083039B2 (ja) * 2018-10-16 2022-06-09 株式会社Fuji 回路形成方法

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Publication number Priority date Publication date Assignee Title
JPH0730236A (ja) * 1993-07-08 1995-01-31 Hitachi Ltd 部品の搭載方法
JP2001007503A (ja) 1999-06-23 2001-01-12 Denso Corp 電子部品の実装方法
JP2001332846A (ja) * 2000-05-23 2001-11-30 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装体
JP2004363434A (ja) * 2003-06-06 2004-12-24 Matsushita Electric Ind Co Ltd 電子回路装置およびその製造方法
WO2021075051A1 (ja) * 2019-10-18 2021-04-22 株式会社Ｆｕｊｉ 部品装着方法、および部品装着装置

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Title
See also references of EP4456680A4

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EP4456680A4 (en) 2025-03-12
US20240422917A1 (en) 2024-12-19
JPWO2023119469A1 (https=) 2023-06-29
JP7811596B2 (ja) 2026-02-05
EP4456680B1 (en) 2025-09-17

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