JPWO2023119469A1 - - Google Patents

Info

Publication number
JPWO2023119469A1
JPWO2023119469A1 JP2023568866A JP2023568866A JPWO2023119469A1 JP WO2023119469 A1 JPWO2023119469 A1 JP WO2023119469A1 JP 2023568866 A JP2023568866 A JP 2023568866A JP 2023568866 A JP2023568866 A JP 2023568866A JP WO2023119469 A1 JPWO2023119469 A1 JP WO2023119469A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023568866A
Other languages
Japanese (ja)
Other versions
JP7811596B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023119469A1 publication Critical patent/JPWO2023119469A1/ja
Application granted granted Critical
Publication of JP7811596B2 publication Critical patent/JP7811596B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023568866A 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置 Active JP7811596B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/047510 WO2023119469A1 (ja) 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置

Publications (2)

Publication Number Publication Date
JPWO2023119469A1 true JPWO2023119469A1 (https=) 2023-06-29
JP7811596B2 JP7811596B2 (ja) 2026-02-05

Family

ID=86901684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023568866A Active JP7811596B2 (ja) 2021-12-22 2021-12-22 電気回路形成方法、および電気回路形成装置

Country Status (4)

Country Link
US (1) US20240422917A1 (https=)
EP (1) EP4456680B1 (https=)
JP (1) JP7811596B2 (https=)
WO (1) WO2023119469A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (ja) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd 半導体装置の製造方法
JPH01226162A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 半導体チップの接続方法
JPH0730236A (ja) * 1993-07-08 1995-01-31 Hitachi Ltd 部品の搭載方法
JP2001332846A (ja) * 2000-05-23 2001-11-30 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装体
JP2004363434A (ja) * 2003-06-06 2004-12-24 Matsushita Electric Ind Co Ltd 電子回路装置およびその製造方法
WO2021075051A1 (ja) * 2019-10-18 2021-04-22 株式会社Ｆｕｊｉ 部品装着方法、および部品装着装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0794856A (ja) * 1993-09-20 1995-04-07 Hitachi Ltd 混成集積回路作製方法
JP2001007503A (ja) 1999-06-23 2001-01-12 Denso Corp 電子部品の実装方法
JPWO2008136419A1 (ja) * 2007-04-27 2010-07-29 日本電気株式会社 半導体装置及び製造方法並びにリペア方法
JP7083039B2 (ja) * 2018-10-16 2022-06-09 株式会社Fuji 回路形成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169433A (ja) * 1986-01-22 1987-07-25 Fuji Xerox Co Ltd 半導体装置の製造方法
JPH01226162A (ja) * 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 半導体チップの接続方法
JPH0730236A (ja) * 1993-07-08 1995-01-31 Hitachi Ltd 部品の搭載方法
JP2001332846A (ja) * 2000-05-23 2001-11-30 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装体
JP2004363434A (ja) * 2003-06-06 2004-12-24 Matsushita Electric Ind Co Ltd 電子回路装置およびその製造方法
WO2021075051A1 (ja) * 2019-10-18 2021-04-22 株式会社Ｆｕｊｉ 部品装着方法、および部品装着装置

Also Published As

Publication number Publication date
EP4456680A1 (en) 2024-10-30
EP4456680A4 (en) 2025-03-12
US20240422917A1 (en) 2024-12-19
WO2023119469A1 (ja) 2023-06-29
JP7811596B2 (ja) 2026-02-05
EP4456680B1 (en) 2025-09-17

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