WO2023109974A1 - 一种用于电子元器件的带电可靠性测试系统 - Google Patents

一种用于电子元器件的带电可靠性测试系统 Download PDF

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Publication number
WO2023109974A1
WO2023109974A1 PCT/CN2023/073683 CN2023073683W WO2023109974A1 WO 2023109974 A1 WO2023109974 A1 WO 2023109974A1 CN 2023073683 W CN2023073683 W CN 2023073683W WO 2023109974 A1 WO2023109974 A1 WO 2023109974A1
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test
temperature
processing unit
control
monitoring
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PCT/CN2023/073683
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English (en)
French (fr)
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刘冬喜
陈宽勇
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海拓仪器(江苏)有限公司
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Publication of WO2023109974A1 publication Critical patent/WO2023109974A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means

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  • the invention relates to a live reliability testing system for electronic components, which is suitable for the technical field of reliability testing of electronic components.
  • Reliability testing is an indispensable step in the testing of electronic components. It is mainly to test the status and performance indicators of electronic components in complex environments. This step requires electronic components to be exposed to high temperature, high temperature and high humidity or Power-on operation in low-temperature and other environments, the high-temperature test environment can usually reach above 150°C, and the low-temperature test environment can usually reach below -50°C. Electronic components operate in this extreme environment, and monitor their performance during power-on operation. Electrical variables, as well as chemical or physical changes, etc., in order to screen out defective products.
  • the data acquisition module is exposed to a high-humidity environment, it will cause a short circuit, so this type of equipment cannot simulate a high-humidity test environment; further, some test equipment will separate the data acquisition module from the tested components to reduce the test environment.
  • this type of equipment can only be used for high-temperature electrification tests. If high-temperature, high-humidity or low-temperature electrification tests are to be performed, serious water leakage or frost will occur on the side where the data acquisition module is located, which will cause the data acquisition module to damage or short circuit.
  • an existing component carrier board can usually place 10 ⁇ 25 electronic components under test but is only controlled by one power supply.
  • the present invention proposes a live reliability testing system for electronic components.
  • the technical solution adopted in the present invention is: a live reliability test system for electronic components, including a test room, a control room, a test subsystem for monitoring the working status of components, and a test system for controlling the temperature and humidity in the test room.
  • the control subsystem, the heating device for heating the test chamber, the refrigeration device for cooling the test chamber, the humidifying device for humidifying the test chamber and the circulation fan for forming a circulating air in the test chamber, the present invention can realize Integrating various test environments such as high temperature, high temperature, high humidity, and low temperature, it can not only reduce the test cost, but also improve the test efficiency.
  • the heating device can raise the temperature in the test chamber to 180°C
  • the refrigeration device can test The temperature in the room is lowered to -80°C.
  • Several component carrier boards are installed inside the test room, and several numerical control boards corresponding to the component carrier boards are installed inside the control room.
  • the test room is adjacent to the control room and separated by a thermal insulation partition.
  • the surface of the thermal insulation partition is covered with a sealing plate at the position corresponding to the adapter plate. Both ends pass through the corresponding sealing board and extend to the inside of the test room and the control room.
  • Each CNC board is connected to the corresponding component carrier board through an adapter board, so that the thickness of the insulation partition can be increased at will Ensure the thermal insulation effect of the test room, and the sealing plate can be used to ensure the sealing of the test room and the control room, preventing the environment in the test room from causing high temperature, frost or humidity in the control room, so that the CNC board can carry out data collection in a normal temperature and humidity environment.
  • the periphery of the test room is provided with a circulating air duct communicating with the test room.
  • the heat output part of the heating device, the cold output part of the refrigeration device and the circulating fan are all arranged in the circulating air duct.
  • the output end of the humidifying device is connected to the The circulating air duct is connected, and the rapid temperature rise, humidity increase or cooling in the test room can be realized through uninterrupted circulating air.
  • the test subsystem includes a first processing unit for processing information and issuing instructions, several interfaces for connecting components, several monitoring units connected to the interfaces in one-to-one correspondence, and connected to the interfaces in one-to-one correspondence Several power supply units, control units connected with several monitoring units and several power supply units.
  • the monitoring unit can monitor the components connected to the corresponding interface in real time, and send the monitoring results to the first processing unit through the control unit.
  • the first processing unit After receiving the monitoring results, the first processing unit performs calculation comparison and generates control
  • the instruction is sent to the control unit, and the control unit controls the monitoring unit and the power supply unit to take corresponding actions after receiving the control instruction.
  • control subsystem includes: The second processing unit is used to process information and issue instructions, and the second processing unit is in communication connection with the first processing unit;
  • the temperature control unit is used to receive the heating or cooling instruction issued by the second processing unit and forward it to the heating device or the cooling device.
  • the temperature control unit includes a temperature controller connected to the second processing unit for detecting the temperature of the test chamber and sending The temperature controller sends the temperature sensor of the temperature detection result, the temperature controller forwards the temperature detection result to the second processing unit, and the second processing unit sends a heating or cooling instruction according to the temperature detection result;
  • the humidity control unit is used to receive the humidification or stop instruction sent by the second processing unit and forward it to the humidification device.
  • the humidity sensor that sends the humidity detection result, the humidity controller forwards the humidity detection result to the second processing unit, and the second processing unit sends a humidification or stop instruction according to the humidity detection result;
  • I/O control unit the I/O control unit is connected with the second processing unit, the I/O control unit is provided with a remote start-stop module that communicates with the mobile device and is used to control the work of the test system, and can be connected to the remote start-up module through the mobile device Stop the module, view or control the operation of the test system on the mobile device;
  • the system protection unit is used to monitor the working status of the test system.
  • the system protection unit includes an over-temperature protection module for monitoring the working status of the heating device, an overload protection module for monitoring the working status of the refrigeration device, and a monitoring module for remaining water in the humidifying device.
  • the water shortage protection module, the phase sequence protection module used to protect the circuit of the test system, and the fan control module used to monitor the working status of the circulating fan can control the system to shut down when the system is abnormal during operation, so as to prevent continuous operation after the failure. Equipment damage.
  • the material of the thermal insulation partition is aluminum silicate thermal insulation material, and the thickness of the thermal insulation partition is not less than 50mm, a silicone gasket is arranged between the sealing plate and the thermal insulation partition, and the edge of the sealing plate is close to the thermal insulation partition and The parts where the sealing plate is in contact with the adapter plate are sealed and fixed by sealant, which further improves the thermal insulation and sealing effect of the test room.
  • each monitoring unit includes a DUT temperature measurement module for monitoring the temperature of the component itself, a current monitoring module for monitoring the working current of the component, and an indication module for indicating the working status of the component, which can monitor the temperature of the component in real time. Measure the working temperature and working current of the components, and prompt whether the running status of the components under test is abnormal in real time.
  • each power supply unit includes a DC/DC power supply module for supplying power to components to ensure that the output voltage of the power supply unit is stable and accurate.
  • control unit includes a microcontroller connected to the monitoring unit and the power supply unit and controlling the work of the monitoring unit and the power supply unit, and a communication module connected to the microcontroller for communicating with the first processing unit.
  • the module realizes the control connection between the first processing unit and other lower-level devices, and controls and coordinates the actions of the lower-level units through the microcontroller.
  • the second processing unit includes a CPU for processing information, a memory for storing information data, and a human-computer interaction display connected to the CPU for receiving and sending signals, and the test system can be viewed and controlled through the display. run.
  • the inside of the test room is provided with several layers of hollow brackets arranged up and down for carrying component carrier boards.
  • the bottom surface of the hollow brackets is provided with a plurality of air inlets, and each layer of air inlets is connected with the air inlets below it. There is a one-to-one correspondence between the interfaces on the component carrier board.
  • the inner wall of the test room is provided with a number of return air outlets connected with the circulating air duct. Several return air outlets are respectively arranged between the hollow brackets.
  • the air duct, the circulating fan is set between the air intake duct and the return air duct, the air intake duct is connected to the air inlet, and the return air duct is connected to the return air duct, so that each component under test has a constant and Consistent airflow ensures that the test temperature and humidity of each component under test are in the optimal range, preventing uneven temperature and humidity among the components under test, and avoiding self-heating and accumulated temperature of the components under test during high-power operation , affecting the accuracy of the test.
  • the temperature sensor is set on the component carrier board, and each component carrier board is provided with at least one temperature sensor, which can accurately measure the ambient temperature around the component under test, and the humidity sensor is set on the circulating air In the road, improve the accuracy of the measured humidity value.
  • the temperature control range of the test system is -80°C ⁇ 180°C.
  • the charging reliability test system for electronic components of the present invention can integrate various test environments such as high temperature, high temperature and high humidity, and low temperature, which not only reduces the test cost caused by the need to purchase various equipment, but also improves the test environment.
  • it ensures the sealing and heat preservation after the integration of various test environments, so that the CNC board can collect data in a normal temperature environment, and prevent the ultra-high temperature, ultra-low temperature or high humidity environment inside the test chamber from affecting the CNC board.
  • it solves the problem of frosting in low-temperature tests, enabling low-temperature electrification tests to be realized.
  • each component under test is powered and monitored by the corresponding power supply unit and monitoring unit.
  • the monitoring unit can give feedback and the control unit controls the power supply unit corresponding to the defective product to be powered off.
  • the rest of the tested components can continue to be tested, further improving the test efficiency.
  • the control subsystem communicated with the test subsystem can realize automatic control of test devices with multiple functions such as high and low temperature, humidity, and electrification, and can be operated remotely through mobile devices to improve the convenience of use of the test system.
  • FIG. 1 is the structural representation of an embodiment of test system in the present invention
  • Fig. 2 is a side sectional view of the embodiment shown in Fig. 1
  • Fig. 3 is the structural representation of insulation partition in the embodiment shown in Fig. 1
  • Fig. 4 is a logical control diagram of the test subsystem in the embodiment shown in Fig. 1
  • Fig. 5 is a logical control diagram of the control subsystem in the embodiment shown in Fig.
  • Test room 11. Component carrier board; 12. Hollow bracket; 13. Air inlet; 14. Return air outlet; 2. Control room; 21. Numerical control board; 3. Test subsystem; 31. First processing unit ; 32, monitoring unit; 33, power supply unit; 34, control unit; 4, control subsystem; 41, second processing unit; 42, temperature control unit; 43, humidity control unit; 431, humidity sensor; 44, I/ O control unit; 45. System protection unit; 5. Heating device; 6. Refrigerating device; 7. Humidifying device; 8. Circulating fan; Gasket; 10, circulating air duct; 101, air intake duct; 102, return air duct.
  • connection is a connection in a broad sense, and can be According to the specific technical content, it is understood as a communication connection, an electrical connection, or a mechanical connection, etc.
  • connection is a connection in a broad sense, and can be According to the specific technical content, it is understood as a communication connection, an electrical connection, or a mechanical connection, etc.
  • the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.
  • present embodiment provides a kind of electrification reliability test system for electronic components and parts, comprises test room 1, control room 2, the test subsystem 3 for monitoring the working state of components and parts, for A control subsystem 4 for controlling the temperature and humidity in the test chamber 1, a heating device 5 for heating the test chamber 1, a refrigeration device 6 for cooling the test chamber 1, a humidifying device 7 for humidifying the test chamber 1, and
  • the circulating fan 8 used to form the circulating air in the test chamber 1, the present invention can realize the integration of various test environments such as high temperature, high temperature, high humidity, and low temperature, which can not only reduce the test cost, but also improve the test efficiency.
  • the test temperature range in the test chamber is -80°C ⁇ 180°C.
  • the interior of the test room 1 is provided with a number of component carrier boards 11, and the interior of the control room 2 is provided with a number of numerical control boards 21 corresponding to the component carrier boards 11.
  • the test room 1 is adjacent to the control room 2 and passes through the insulation partition.
  • 9 partitions specifically, the thermal insulation partition 9 is made of aluminum silicate thermal insulation material, and the thickness of the thermal insulation partition 9 is not less than 50 mm, so as to ensure the thermal insulation effect of the test room 1, and several adapter plates are embedded in the thermal insulation partition 9 91, the position of the surface of the thermal insulation partition 9 corresponding to the adapter plate 91 is covered with a sealing plate 92, and the two ends of each adapter plate 91 respectively pass through the corresponding sealing plate 92 and extend to the test room 1 and the control room 2, each numerical control board 21 is connected to the corresponding component carrier board 11 through an adapter board 91, so that the thickness of the insulation partition 9 can be increased at will to ensure the insulation effect of the test chamber 1, and the sealing board can be used to 92 to
  • the periphery of the test chamber 1 is provided with a circulation air duct 10 communicating with the test chamber 1.
  • the heat output part of the heating device 5, the cold output part of the refrigeration device 6, and the circulation fan 8 are all arranged in the circulation air duct 10.
  • the humidifier 7 The output end of the test chamber 1 is communicated with the circulating air duct 10, and the rapid temperature rise, humidity increase or temperature reduction in the test chamber 1 can be realized through the uninterrupted circulating air.
  • the test subsystem 3 includes a first processing unit 31 for processing information and issuing instructions, a number of interfaces for connecting components, a number of monitoring units 32 connected to the interfaces in one-to-one correspondence, and connected to the interfaces in one-to-one correspondence A plurality of power supply units 33, a control unit 34 connected with a plurality of monitoring units 32 and a plurality of power supply units 33.
  • the interface is set on the component carrier board 11 , and the monitoring unit 32 , the power supply unit 33 and the control unit 34 are all set on the numerical control board 21 .
  • each monitoring unit 32 includes a DUT temperature measurement module for monitoring the temperature of the component itself, a current monitoring module for monitoring the working current of the component, and an indicating module for indicating the working state of the component, which can monitor the temperature of the component in real time.
  • the control unit 34 is connected with the first processing unit 31, and the control unit 34 includes a microcontroller connected with the monitoring unit 32 and the power supply unit 33 and controlling the work of the monitoring unit 32 and the power supply unit 33, and the microcontroller
  • the connected communication module used to communicate with the first processing unit 31 realizes the control connection between the first processing unit 31 and other lower-level devices through the communication module, and controls and coordinates the actions of the lower-level units through the microcontroller.
  • the monitoring unit 32 can monitor the components connected to the corresponding interface in real time, and send the monitoring results to the first processing unit 31 via the control unit 34. After receiving the monitoring results, the first processing unit 31 performs calculation comparison and generates control The instruction is sent to the control unit 34, and the control unit 34 controls the monitoring unit 32 and the power supply unit 33 to take corresponding actions after receiving the control instruction.
  • the control subsystem 4 includes a second processing unit 41 for processing information and issuing instructions, a temperature control unit 42 for receiving heating or cooling instructions issued by the second processing unit 41 and forwarding them to the heating device 5 or the cooling device 6, and using After receiving the humidification or stop instruction issued by the second processing unit 41 and forwarding it to the humidity control unit 43 of the humidifying device 7, the I/O control unit 44 connected to the second processing unit 41, used to monitor the working state of the test system System protection unit 45 .
  • the second processing unit 41 is communicatively connected with the first processing unit 31.
  • the second processing unit 41 includes a CPU for processing information, a memory for storing information data, and a device connected to the CPU for receiving and sending signals.
  • the temperature control unit 42 includes a temperature controller connected to the second processing unit 41, a device for detecting the temperature of the test chamber and sending the temperature detection result to the temperature controller
  • the temperature sensor, the temperature controller forwards the temperature detection result to the second processing unit 41, and the second processing unit 41 sends a heating or cooling instruction according to the temperature detection result
  • the humidity control unit 43 includes a humidity controller connected to the second processing unit 41 .
  • the humidity sensor 431 used to detect the humidity of the test chamber and send the humidity detection result to the humidity controller.
  • the humidity controller forwards the humidity detection result to the second processing unit 41, and the second processing unit 41 sends a humidification or stop instruction according to the humidity detection result ;
  • the I/O control unit 44 is provided with a remote start-stop module connected with the mobile device communication and used to control the work of the test system, which can be connected to the remote start-stop module through the mobile device to view or control the operation of the test system on the mobile device;
  • system protection Unit 45 includes an over-temperature protection module for monitoring the working state of the heating device 5, an overload protection module for monitoring the working state of the refrigeration device 6, a water shortage protection module for monitoring the remaining water of the humidifying device 7, and a circuit for protecting the test system
  • the phase sequence protection module and the fan control module used to monitor the working status of the circulating fan 8 can control the shutdown of the test system when the test system is abnormal during operation, so as to prevent the continuous operation of the system after the failure and cause equipment damage.
  • a silica gel gasket 93 is arranged between the sealing plate 92 and the thermal insulation partition 9, and the edge of the sealing plate 92 is close to the thermal insulation partition 9 and the sealing plate 92 and the adapter plate 91
  • the parts in contact are sealed and fixed by sealant to ensure the airtightness of the test chamber 1 and prevent the environment in the test chamber 1 from affecting the outside.
  • the interior of the test chamber 1 is provided with several layers of hollow brackets 12 arranged up and down for carrying the component carrier board 11, and the bottom surface of the hollow bracket 12 is provided with a plurality of air inlets. 13. Each layer of air inlets 13 corresponds to the interface on the component carrier board 11 located below it one by one.
  • the inner wall of the test chamber 1 is provided with a number of return air outlets 14 communicating with the circulating air duct 10.
  • the circulating air duct 10 includes an air intake duct 101 and a return air duct 102
  • the circulating fan 8 is arranged between the intake air duct 101 and the return air duct 102
  • the air intake duct 101 It communicates with the air inlet 13
  • the return air duct 102 communicates with the return air outlet 14, so that there is a constant and consistent air flow above each tested component, ensuring that the test temperature and humidity of each tested component are at the best range, to prevent uneven temperature and humidity among the tested components, and to avoid self-heating and accumulated temperature of the tested components during high-power operation, which affects the accuracy of the test.
  • the temperature sensor is arranged on the component carrier 11, and each component carrier 11 is provided with at least one temperature sensor, which can accurately measure the temperature around the component under test.
  • Ambient temperature and humidity sensors 431 are arranged in the circulating air duct 10, which can improve the accuracy of the measured humidity value.
  • the charging reliability test system for electronic components of the present invention can integrate various test environments such as high temperature, high temperature and high humidity, and low temperature, which not only reduces the test cost caused by the need to purchase various equipment, but also improves the test environment.
  • it ensures the sealing and heat preservation after the integration of various test environments, so that the CNC board can collect data in a normal temperature environment, and prevent the ultra-high temperature, ultra-low temperature or high humidity environment inside the test chamber from affecting the CNC board.
  • it solves the problem of frosting in low-temperature tests, enabling low-temperature electrification tests to be realized.
  • each component under test is powered and monitored by the corresponding power supply unit and monitoring unit.
  • the monitoring unit can give feedback and the control unit controls the power supply unit corresponding to the defective product to be powered off.
  • the rest of the tested components can continue to be tested, further improving the test efficiency.
  • the control subsystem communicated with the test subsystem can realize automatic control of test devices with multiple functions such as high and low temperature, humidity, and electrification, and can be operated remotely through mobile devices to improve the convenience of use of the test system.

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Abstract

一种用于电子元器件的带电可靠性测试系统，包括测试室（1）、控制室（2）、测试元器件的测试子系统（3）、控制测试室（1）内温湿度的控制子系统（4），测试室（1）内设有元器件载板（11），控制室（2）内设有数控板（21），测试室（1）与控制室（2）通过保温隔板（9）分隔，保温隔板（9）内设有转接板（91），数控板（21）通过转接板（91）与元器件载板（11）连接，测试室（1）外围设有与测试室（1）连通的循环风道（10），循环风道（10）内设有加热装置（5）、制冷装置（6）、加湿装置（7）及循环风机（8），集高温、高湿、低温、带电等多种测试环境于一体，并保证测试过程不受测试环境影响，不仅节约成本，还确保了测试结果的准确性；测试子系统（3）可对每个被测元器件单独监控，提高测试效率；控制子系统（4）可以实现自动化控制，提高使用便捷性。

Description

一种用于电子元器件的带电可靠性测试系统 技术领域
本发明涉及一种用于电子元器件的带电可靠性测试系统，适用于电子元器件可靠性测试技术领域。
 背景技术
随着光通信技术、5G通信技术等前沿技术产业的持续发展，被广泛应用于此类行业的芯片、光模块等电子元器件的重要性也日益凸显，因此，能够把控此类电子元器件产品质量的测试环节就显得尤为重要。
可靠性测试作为电子元器件测试环节必不可少的一个步骤，主要是测试电子元器件在复杂环境下的通电运行的状态及性能指标等，此步骤需要使电子元器件处于高温、高温高湿或低温等环境下进行通电运行，其高温测试环境通常可达150℃以上，而低温测试环境通常可达-50℃以下，电子元器件在这种极端环境下运行，监测其在通电运行过程中的电变量，以及发生的化学或物理变化等，以便于筛选出其中的不良品。
目前对电子元器件进行可靠性测试的设备大多只能进行普通的高低温测试，如申请号为CN201910391645.5的专利所公开的设备，只能将少量产品放置在测试箱内，使用高温或者低温的气体不断冲击，进而形成对应的高低温环境，此类设备无法对元器件进行带电测试，其测试结果有很大的局限性；而现有技术中可以对元器件进行高低温带电测试的设备需要将数据采集模块放置在测试室内，如申请号为CN202110511300.6的专利所公开的设备，其数据采集模块与被测元器件共同处于复杂环境下，这样会造成数据采集模块的使用寿命缩短，并且由于数据采集模块暴露在高湿环境中会造成短路，所以此类设备无法模拟高湿测试环境；进一步地，部分测试设备会将数据采集模块与被测元器件分隔开，以减少测试环境对数据采集模块的影响，但是此类设备只能进行高温带电测试，若要进行高温高湿或低温带电测试，数据采集模块所在的一侧会产生严重的漏水或结霜，进而造成数据采集模块损坏或短路。再有，现有的一块元器件载板通常可放置10~25只被测电子元器件但仅由1个电源控制，当其中出现不良品时，整块载板都会断电，等待一个测试周期完成后才能将不良品取出，同一载板上的其余产品需要再次进行测试，效率非常低下。并且，目前也缺少完善的控制系统来满足具有高低温、湿度、带电等多种功能的测试装置的自动化控制需求。
 发明内容
为了解决上述现有技术存在的缺陷，本发明提出了一种用于电子元器件的带电可靠性测试系统。
本发明采用的技术方案是：一种用于电子元器件的带电可靠性测试系统，包括测试室、控制室、用于监测元器件工作状态的测试子系统、用于控制测试室内的温湿度的控制子系统、用于为测试室加热的加热装置、用于为测试室降温的制冷装置、用于为测试室加湿的加湿装置以及用于令测试室内形成循环风的循环风机，本发明可以实现集高温、高温高湿、低温等多种测试环境于一体，不仅可以减少测试成本，还提高了测试效率，具体的，加热装置可将测试室内的温度升高至180℃，制冷装置可将测试室内的温度降低至-80℃，测试室的内部设置有若干元器件载板，控制室的内部设置有若干与元器件载板一一对应的数控板。 
测试室与控制室相邻且通过保温隔板分隔，保温隔板内嵌设有若干转接板，保温隔板的表面对应转接板的位置处均覆盖有密封板，每个转接板的两端均分别穿过对应的密封板并延伸至测试室与控制室的内部，每个数控板均通过转接板与相对应的元器件载板连接，由此可以随意增加保温隔板的厚度确保测试室的保温效果，并且可以通过密封板保证测试室与控制室密封，防止测试室内的环境引起控制室高温、结霜或潮湿，使得数控板可以在常温常湿的环境下进行数据采集，提高其使用寿命，测试室的外围设置有与测试室连通的循环风道，加热装置的热量输出部件、制冷装置的冷量输出部件以及循环风机均设置在循环风道内，加湿装置的输出端与循环风道连通，通过不间断的循环风实现测试室内快速升温、提高湿度或降温。
进一步地，测试子系统包括用于处理信息并发出指令的第一处理单元、若干用于连接元器件的接口、一一对应地与接口相连接的若干监测单元、一一对应地与接口相连接的若干供电单元、与若干监测单元及若干供电单元均相连接的控制单元，接口设置在元器件载板上，监测单元、供电单元以及控制单元均设置在数控板上，控制单元与第一处理单元相连接，监测单元可以实时监控与之对应的接口上所连接的元器件，并将监测结果经由控制单元发送至第一处理单元，第一处理单元收到监测结果后进行运算对比并生成控制指令发送至控制单元，控制单元接收到控制指令后控制监测单元与供电单元做出相应的动作。
进一步地，控制子系统包括：
第二处理单元，用于处理信息并发出指令，第二处理单元与第一处理单元通讯连接；
温度控制单元，用于接收第二处理单元发出的加热或降温指令并转发至加热装置或制冷装置，温度控制单元包括与第二处理单元相连接的温度控制器、用于检测测试腔温度并向温度控制器发送温度检测结果的温度传感器，温度控制器将温度检测结果转发至第二处理单元，第二处理单元根据温度检测结果发出加热或降温指令；
湿度控制单元，用于接收第二处理单元发出的加湿或停止指令并转发至加湿装置，湿度控制单元包括与第二处理单元相连接的湿度控制器、用于检测测试腔湿度并向湿度控制器发送湿度检测结果的湿度传感器，湿度控制器将湿度检测结果转发至第二处理单元，第二处理单元根据湿度检测结果发出加湿或停止指令；
I/O控制单元，I/O控制单元与第二处理单元相连接，I/O控制单元设置有与移动设备通讯连接并用于控制测试系统工作的远程启停模块，可以通过移动设备连接远程启停模块，在移动设备上查看或控制测试系统的运行；
系统保护单元，用于监测测试系统的工作状态，系统保护单元包括用于监测加热装置工作状态的超温保护模块、用于监测制冷装置工作状态的过载保护模块、用于监测加湿装置剩余水量的缺水保护模块、用于保护测试系统电路的相序保护模块以及用于监测循环风机的工作状态的风机控制模块，当系统在运行过程中出现异常时可以控制系统停机，防止故障后持续运行导致设备损坏。
进一步地，保温隔板材质为硅酸铝保温材料，且保温隔板的厚度不小于50mm，密封板与保温隔板之间设置有硅胶密封垫，密封板的边缘的贴近保温隔板的部位以及密封板与转接板相接触的部位均通过密封胶密封固定，进一步提高测试室的保温密封效果。
更进一步地，每个监测单元均包括用于监测元器件自身温度的DUT测温模块、用于监测元器件工作电流的电流监测模块、用于指示元器件工作状态的指示模块，可以实时监测被测元器件的工作温度与工作电流，并实时提示被测元器件的运行状态是否异常。
更进一步地，每个供电单元均包括用于为元器件供电的DC/DC电源模块，保证供电单元输出的电压稳定、精准。
更进一步地，控制单元包括与监测单元及供电单元相连接的并控制监测单元及供电单元工作的微控制器、与微控制器相连接的用于与第一处理单元通讯的通讯模块，通过通讯模块实现第一处理单元与其余下级设备之间的控制连接，并通过微控制器控制协调下级单元的动作。
更进一步地，第二处理单元包括用于处理信息的CPU、用于储存信息数据的存储器以及与CPU相连接的用于收取与发送信号的人机交互显示器，可以通过显示器查看并控制测试系统的运行。
更进一步地，测试室的内部设置有若干层上下排布的用于承载元器件载板的中空托架，中空托架的底面开设有多个进风口，每层进风口均与位于其下方的元器件载板上的接口一一对应，测试室的内壁上开设有若干与循环风道连通的回风口，若干回风口分别设置在中空托架之间，循环风道包括进风风道和回风风道，循环风机设置在进风风道和回风风道之间，进风风道与进风口连通，回风风道与回风口连通，使得每个被测元器件上方均有恒定且一致的气流，确保每个被测元器件的测试温度、湿度均处在最佳范围，防止被测元器件之间的温湿度不均匀，也避免了被测元器件高功率运行时自身发热积温，影响测试的准确性。
更进一步地，温度传感器设置在元器件载板上，且每个元器件载板上均设置有至少一个温度传感器，可以精准的测出被测元器件周围的环境温度，湿度传感器设置在循环风道内，提高测出湿度值的准确性。
进一步地，测试系统的温度控制范围为-80℃~180℃。
由于上述技术方案运用，本发明相较现有技术具有以下优点：
本发明的用于电子元器件的带电可靠性测试系统，可以集高温、高温高湿、低温等多种测试环境于一体，不仅减少了需要购置多种设备所产生的测试成本，还提高了测试的效率；并且，确保了将多种测试环境整合后的密封及保温，使得数控板可以在常温环境中进行数据采集，防止测试室内部的超高温、超低温或高湿环境对数控板造成影响，尤其是解决了低温测试结霜的问题，使得低温带电测试得以实现。进一步地，每一个被测元器件均由对应的供电单元和监测单元进行供电和监控，当其中出现不良品时，监测单元可进行反馈并由控制单元控制该不良品对应的供电单元断电，其余被测元器件仍可继续进行测试，进一步提高测试效率。另外，与测试子系统通讯连接的控制子系统可以实现具有高低温、湿度、带电等多种功能的测试装置的自动化控制，并且可以通过移动设备远程操作，提高测试系统的使用便捷性。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的组件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是本发明中测试系统一个实施例的结构示意图；
图2是图1所示实施例的侧面剖视图；
图3是图1所示实施例中保温隔板的结构示意图；
图4是图1所示实施例中测试子系统的逻辑控制图；
图5是图1所示实施例中控制子系统的逻辑控制图；
其中，附图标记说明如下：
1、测试室；11、元器件载板；12、中空托架；13、进风口；14、回风口；2、控制室；21、数控板；3、测试子系统；31、第一处理单元；32、监测单元；33、供电单元；34、控制单元；4、控制子系统；41、第二处理单元；42、温度控制单元；43、湿度控制单元；431、湿度传感器；44、I/O控制单元；45、系统保护单元；5、加热装置；6、制冷装置；7、加湿装置；8、循环风机；9、保温隔板；91、转接板；92、密封板；93、硅胶密封垫；10、循环风道；101、进风风道；102、回风风道。
实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性；术语“连接”为广义范围的连接，可以根据具体的技术内容理解为通讯连接、电连接或者机械连接等等。此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
参考附图1-5，本实施例提供了一种用于电子元器件的带电可靠性测试系统，包括测试室1、控制室2、用于监测元器件工作状态的测试子系统3、用于控制测试室1内的温湿度的控制子系统4、用于为测试室1加热的加热装置5、用于为测试室1降温的制冷装置6、用于为测试室1加湿的加湿装置7以及用于令测试室1内形成循环风的循环风机8，本发明可以实现集高温、高温高湿、低温等多种测试环境于一体，不仅可以减少测试成本，还提高了测试效率，具体的，测试室内的测试温度范围为-80℃~180℃。
测试室1的内部设置有若干元器件载板11，控制室2的内部设置有若干与元器件载板11一一对应的数控板21，测试室1与控制室2相邻且通过保温隔板9分隔，具体的，保温隔板9材质为硅酸铝保温材料，且保温隔板9的厚度不小于50mm，以确保测试室1的保温效果，保温隔板9内嵌设有若干转接板91，保温隔板9的表面对应转接板91的位置处均覆盖有密封板92，每个转接板91的两端均分别穿过对应的密封板92并延伸至测试室1与控制室2的内部，每个数控板21均通过转接板91与相对应的元器件载板11连接，由此可以随意增加保温隔板9的厚度确保测试室1的保温效果，并且可以通过密封板92保证测试室1与控制室2密封，防止测试室1内的环境引起控制室2高温、结霜或潮湿，使得数控板21可以在常温常湿的环境下进行数据采集，提高其使用寿命，测试室1的外围设置有与测试室1连通的循环风道10，加热装置5的热量输出部件、制冷装置6的冷量输出部件以及循环风机8均设置在循环风道10内，加湿装置7的输出端与循环风道10连通，可以通过不间断的循环风实现测试室1内快速升温、提高湿度或降温。
测试子系统3包括用于处理信息并发出指令的第一处理单元31、若干用于连接元器件的接口、一一对应地与接口相连接的若干监测单元32、一一对应地与接口相连接的若干供电单元33、与若干监测单元32及若干供电单元33均相连接的控制单元34。接口设置在元器件载板11上，监测单元32、供电单元33以及控制单元34均设置在数控板21上。具体的，每个监测单元32均包括用于监测元器件自身温度的DUT测温模块、用于监测元器件工作电流的电流监测模块、用于指示元器件工作状态的指示模块，可以实时监测被测元器件的工作温度与工作电流，并实时提示被测元器件的运行状态是否异常；每个供电单元33均包括用于为元器件供电的DC/DC电源模块，保证供电单元33输出的电压稳定、精准；控制单元34与第一处理单元31相连接，控制单元34包括与监测单元32及供电单元33相连接的并控制监测单元32及供电单元33工作的微控制器、与微控制器相连接的用于与第一处理单元31通讯的通讯模块，通过通讯模块实现第一处理单元31与其余下级设备之间的控制连接，并通过微控制器控制协调下级单元的动作。监测单元32可以实时监控与之对应的接口上所连接的元器件，并将监测结果经由控制单元34发送至第一处理单元31，第一处理单元31收到监测结果后进行运算对比并生成控制指令发送至控制单元34，控制单元34接收到控制指令后控制监测单元32与供电单元33做出相应的动作。
控制子系统4包括用于处理信息并发出指令的第二处理单元41、用于接收第二处理单元41发出的加热或降温指令并转发至加热装置5或制冷装置6的温度控制单元42、用于接收第二处理单元41发出的加湿或停止指令并转发至加湿装置7的湿度控制单元43、与第二处理单元41相连接的I/O控制单元44、用于监测测试系统的工作状态的系统保护单元45。第二处理单元41与第一处理单元31通讯连接，具体的，第二处理单元41包括用于处理信息的CPU、用于储存信息数据的存储器以及与CPU相连接的用于收取与发送信号的人机交互显示器，可以通过显示器查看并控制测试系统的运行；温度控制单元42包括与第二处理单元41相连接的温度控制器、用于检测测试腔温度并向温度控制器发送温度检测结果的温度传感器，温度控制器将温度检测结果转发至第二处理单元41，第二处理单元41根据温度检测结果发出加热或降温指令；湿度控制单元43包括与第二处理单元41相连接的湿度控制器、用于检测测试腔湿度并向湿度控制器发送湿度检测结果的湿度传感器431，湿度控制器将湿度检测结果转发至第二处理单元41，第二处理单元41根据湿度检测结果发出加湿或停止指令；I/O控制单元44设置有与移动设备通讯连接并用于控制测试系统工作的远程启停模块，可以通过移动设备连接远程启停模块，在移动设备上查看或控制测试系统的运行；系统保护单元45包括用于监测加热装置5工作状态的超温保护模块、用于监测制冷装置6工作状态的过载保护模块、用于监测加湿装置7剩余水量的缺水保护模块、用于保护测试系统电路的相序保护模块以及用于监测循环风机8的工作状态的风机控制模块，当测试系统在运行过程中出现异常时可以控制测试系统停机，防止故障后系统持续运行导致设备损坏。
在一种更为优选的实施方案中，密封板92与保温隔板9之间设置有硅胶密封垫93，密封板92的边缘的贴近保温隔板9的部位以及密封板92与转接板91相接触的部位均通过密封胶密封固定，确保测试室1的密封性，防止测试室1内的环境对外部造成影响。
在一种更为优选的实施方案中，测试室1的内部设置有若干层上下排布的用于承载元器件载板11的中空托架12，中空托架12的底面开设有多个进风口13，每层进风口13均与位于其下方的元器件载板11上的接口一一对应，测试室1的内壁上开设有若干与循环风道10连通的回风口14，若干回风口14分别设置在中空托架12之间，循环风道10包括进风风道101和回风风道102，循环风机8设置在进风风道101和回风风道102之间，进风风道101与进风口13连通，回风风道102与回风口14连通，使得每个被测元器件上方均有恒定且一致的气流，确保每个被测元器件的测试温度、湿度均处在最佳范围，防止被测元器件之间的温湿度不均匀，也避免了被测元器件高功率运行时自身发热积温，影响测试的准确性。
在一种更为优选的实施方案中，温度传感器设置在元器件载板11上，且每个元器件载板11上均设置有至少一个温度传感器，可以精准的测出被测元器件周围的环境温度，湿度传感器431设置在循环风道10内，可以提高测出湿度值的准确性。
由于上述技术方案的运用，本发明相较现有技术具有以下优点：
本发明的用于电子元器件的带电可靠性测试系统，可以集高温、高温高湿、低温等多种测试环境于一体，不仅减少了需要购置多种设备所产生的测试成本，还提高了测试的效率；并且，确保了将多种测试环境整合后的密封及保温，使得数控板可以在常温环境中进行数据采集，防止测试室内部的超高温、超低温或高湿环境对数控板造成影响，尤其是解决了低温测试结霜的问题，使得低温带电测试得以实现。进一步地，每一个被测元器件均由对应的供电单元和监测单元进行供电和监控，当其中出现不良品时，监测单元可进行反馈并由控制单元控制该不良品对应的供电单元断电，其余被测元器件仍可继续进行测试，进一步提高测试效率。另外，与测试子系统通讯连接的控制子系统可以实现具有高低温、湿度、带电等多种功能的测试装置的自动化控制，并且可以通过移动设备远程操作，提高测试系统的使用便捷性。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围，凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (7)

  1. 一种用于电子元器件的带电可靠性测试系统，包括测试室（1）、控制室（2）、用于监测所述元器件工作状态的测试子系统（3）、用于控制所述测试室（1）内的温湿度的控制子系统（4）、用于为所述测试室（1）加热的加热装置（5）、用于为所述测试室（1）降温的制冷装置（6）、用于为所述测试室（1）加湿的加湿装置（7）以及用于令所述测试室（1）内形成循环风的循环风机（8），所述测试室（1）的内部设置有若干元器件载板（11），所述控制室（2）的内部设置有若干与所述元器件载板（11）一一对应的数控板（21），其特征在于：
    所述测试室（1）与所述控制室（2）相邻且通过保温隔板（9）分隔，所述保温隔板（9）材质为硅酸铝保温材料，且所述保温隔板（9）的厚度不小于50mm，所述保温隔板（9）内嵌设有若干转接板（91），所述保温隔板（9）的表面对应所述转接板（91）的位置处均覆盖有密封板（92），所述密封板（92）与所述保温隔板（9）之间设置有硅胶密封垫（93），每个所述转接板（91）的两端均分别穿过对应的所述密封板（92）并延伸至所述测试室（1）与所述控制室（2）的内部，所述密封板（92）的边缘的贴近所述保温隔板（9）的部位以及所述密封板（92）与所述转接板（91）相接触的部位均通过密封胶密封固定，每个所述数控板（21）均通过所述转接板（91）与相对应的所述元器件载板（11）连接，所述测试室（1）的外围设置有与所述测试室（1）连通的循环风道（10），所述加热装置（5）的热量输出部件、所述制冷装置（6）的冷量输出部件以及所述循环风机（8）均设置在所述循环风道（10）内，所述加湿装置（7）的输出端与所述循环风道（10）连通，所述测试系统的温度控制范围为-80℃~180℃；
    所述测试子系统（3）包括用于处理信息并发出指令的第一处理单元（31）、若干用于连接所述元器件的接口、一一对应地与所述接口相连接的若干监测单元（32）、一一对应地与所述接口相连接的若干供电单元（33）、与若干所述监测单元（32）及若干所述供电单元（33）均相连接的控制单元（34），所述接口设置在所述元器件载板（11）上，所述监测单元（32）、所述供电单元（33）以及所述控制单元（34）均设置在所述数控板（21）上，所述控制单元（34）与所述第一处理单元（31）相连接，每个所述监测单元（32）均包括用于监测所述元器件自身温度的DUT测温模块、用于监测所述元器件工作电流的电流监测模块、用于指示所述元器件工作状态的指示模块，每个所述供电单元（33）均包括用于为所述元器件供电的DC/DC电源模块。
  2. 根据权利要求1所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述控制子系统（4）包括：
    第二处理单元（41），用于处理信息并发出指令，所述第二处理单元（41）与所述第一处理单元（31）通讯连接；
    温度控制单元（42），用于接收所述第二处理单元（41）发出的加热或降温指令并转发至所述加热装置（5）或所述制冷装置（6），所述温度控制单元（42）包括与所述第二处理单元（41）相连接的温度控制器、用于检测所述测试室（1）温度并向所述温度控制器发送温度检测结果的温度传感器，所述温度控制器将所述温度检测结果转发至所述第二处理单元（41），所述第二处理单元（41）根据所述温度检测结果发出所述加热或降温指令；
    湿度控制单元（43），用于接收所述第二处理单元（41）发出的加湿或停止指令并转发至所述加湿装置（7），所述湿度控制单元（43）包括与所述第二处理单元（41）相连接的湿度控制器、用于检测所述测试室（1）湿度并向所述湿度控制器发送湿度检测结果的湿度传感器（431），所述湿度控制器将所述湿度检测结果转发至所述第二处理单元（41），所述第二处理单元（41）根据所述湿度检测结果发出所述加湿或停止指令；
    I/O控制单元（44），所述I/O控制单元（44）与所述第二处理单元（41）相连接，所述I/O控制单元（44）设置有与移动设备通讯连接并用于控制所述测试系统工作的远程启停模块；
    系统保护单元（45），用于监测所述测试系统的工作状态，所述系统保护单元（45）包括用于监测所述加热装置（5）工作状态的超温保护模块、用于监测所述制冷装置（6）工作状态的过载保护模块、用于监测所述加湿装置（7）剩余水量的缺水保护模块、用于保护所述测试系统电路的相序保护模块以及用于监测所述循环风机（8）的工作状态的风机控制模块。
  3. 根据权利要求1所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述控制单元（34）包括与所述监测单元（32）及所述供电单元（33）相连接的并控制所述监测单元（32）及所述供电单元（33）工作的微控制器、与所述微控制器相连接的用于与所述第一处理单元（31）通讯的通讯模块。
  4. 根据权利要求2所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述第二处理单元（41）包括用于处理信息的CPU、用于储存信息数据的存储器以及与所述CPU相连接的用于收取与发送信号的人机交互显示器。
  5. 根据权利要求1所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述测试室（1）的内部设置有若干层上下排布的用于承载所述元器件载板（11）的中空托架（12），所述中空托架（12）的底面开设有多个进风口（13），每层所述进风口（13）均与位于其下方的所述元器件载板（11）上的所述接口一一对应，所述测试室（1）的内壁上开设有若干与所述循环风道（10）连通的回风口（14），若干所述回风口（14）分别设置在所述中空托架（12）之间。
  6. 根据权利要求5所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述循环风道（10）包括进风风道（101）和回风风道（102），所述循环风机（8）设置在所述进风风道（101）和回风风道（102）之间，所述进风风道（101）与所述进风口（13）连通，所述回风风道（102）与所述回风口（14）连通。
  7. 根据权利要求2所述的用于电子元器件的带电可靠性测试系统，其特征在于：所述温度传感器设置在所述元器件载板（11）上，且每个所述元器件载板（11）上均设置有至少一个所述温度传感器，所述湿度传感器（431）设置在所述循环风道（10）内。
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