WO2023108909A1 - 封装结构、电路板组件和电子设备 - Google Patents

封装结构、电路板组件和电子设备 Download PDF

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Publication number
WO2023108909A1
WO2023108909A1 PCT/CN2022/078891 CN2022078891W WO2023108909A1 WO 2023108909 A1 WO2023108909 A1 WO 2023108909A1 CN 2022078891 W CN2022078891 W CN 2022078891W WO 2023108909 A1 WO2023108909 A1 WO 2023108909A1
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WO
WIPO (PCT)
Prior art keywords
substrate
package
support portion
supporting
cover
Prior art date
Application number
PCT/CN2022/078891
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English (en)
French (fr)
Inventor
陈时雨
杨丹
梅娜
孙拓北
Original Assignee
深圳市中兴微电子技术有限公司
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Publication of WO2023108909A1 publication Critical patent/WO2023108909A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present application relates to the technical field of semiconductor packaging, in particular to a packaging structure, circuit board assembly and electronic equipment.
  • Embodiments of the present application provide a packaging structure, a circuit board assembly, and an electronic device.
  • an embodiment of the present application provides a packaging structure, including: a substrate, the substrate has a first surface and a second surface opposite to each other; electronic components, the electronic components and the first surface of the substrate Connection; package cover, the package cover includes a top cover, a first support portion and a second support portion, the top cover is connected to the first support portion of the substrate through the first support portion and the second support portion On one surface, a first cavity is defined between the first support part and the second support part, and the top cover is provided with openings at positions corresponding to the electronic components, and the electronic components are at least partially exposed from the opening.
  • an embodiment of the present application provides a circuit board assembly, the circuit board assembly includes a circuit board and the packaging structure described in the first aspect above, and the packaging structure is connected to the circuit board.
  • an embodiment of the present application provides an electronic device, where the electronic device includes the circuit board assembly described in the second aspect above.
  • FIG. 1a and FIG. 1b are structural schematic diagrams of a packaging structure in the prior art
  • FIGS. 2a and 2b are structural schematic diagrams of another packaging structure in the prior art
  • 3a-3c are structural schematic diagrams of a packaging structure provided by an embodiment of the present application.
  • FIGS. 4a-4c are structural schematic diagrams of a packaging structure provided by another embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a packaging structure provided by another embodiment of the present application.
  • FIG. 6a and FIG. 6b are structural schematic diagrams of a packaging structure provided by another embodiment of the present application.
  • Fig. 7 is a comparative analysis table of substrate warpage and thermal resistance of electronic components under different types of covers.
  • 1-packaging structure 10-substrate; 20-electronic components; 30-reinforcing ring; 40-cover plate; 41-thermal conductive adhesive;
  • 50-encapsulation cover 510-top cover; 511-opening hole; 521-first support part; 522-second support part; 5221-support foot; 523-third support part; 524-notch; 530-first Cavity; 531-second cavity;
  • At least one of the following and similar expressions refer to any group of these items, including any group of single or plural items.
  • at least one of a, b, and c can represent: a, b, c, a and b, a and c, b and c, or, a and b and c, where a, b, c can be a single , or more than one.
  • connections described in the embodiments of the present application include direct connections and indirect connections through intermediate components.
  • the packaging structure includes: a substrate 10, an electronic component 20 and a stiffener ring 30 (Stiffener ring), wherein the electronic component 20 and the stiffener ring 30 are all arranged on the upper surface of the substrate 10, the stiffener ring 30 is a ring structure, and the electronic component The device 20 is exposed from the hollow portion of the reinforcement ring 30 .
  • the package structure shown in Figure 1a and Figure 1b controls the package warpage through the reinforcing ring 30 arranged on the substrate 10. In this package structure, the electronic components 20 can be in direct contact with the air or the heat sink, and the heat dissipation is better. Ring 30 is less capable of controlling package warpage.
  • the packaging structure includes: a substrate 10, an electronic component 20 and a cover 40 (Lid), wherein the electronic component 20 and the cover 40 are both arranged on the upper surface of the substrate 10, and there is a gap between the cover 40 and the electronic component 20.
  • Thermally conductive glue 41 (Tim glue) is provided, and the lower surface of the cover plate 40 has a ring-shaped support portion, and the cover plate 40 is connected to the substrate 10 through the ring-shaped support portion.
  • the package structure shown in Figure 2a and Figure 2b controls the package warpage through the cover plate 40 arranged on the substrate 10.
  • This package structure controls the package warpage relatively well, but the electronic components 20 and the air/radiator
  • the barrier thermal conductive adhesive 41 and cover plate 40 ) is added between them, resulting in an increase in the thermal resistance of heat transfer, making the heat dissipation capability of the package structure poor.
  • the embodiment of the present application provides a packaging structure, circuit board assembly and electronic equipment, which are used to effectively control the warpage of the packaging structure without affecting the heat dissipation of electronic components, ensuring Thermal efficiency of the package structure.
  • FIG. 3a is a schematic top view of the package structure 1
  • FIG. 3b is a schematic cross-sectional structure at point I in FIG. 3a
  • FIG. 3c is a schematic cross-sectional structure at point II in FIG. 3b
  • the package structure 1 includes: a substrate 10 , an electronic component 20 and a package cover 50 .
  • the substrate 10 has a first surface and a second surface opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10, and the package cover 50 includes a top cover 510, a first support portion 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second supporting parts 522, and the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20, and the electronic component 20 is at least partially formed from the opening. 511 exposed.
  • the substrate 10 is a carrier for packaging the electronic components 20 , and serves to provide electrical connection, protection, support, heat dissipation, and assembly for the packaged electronic components 20 .
  • the package structure 1 of the embodiment of the present application can be applied in a printed circuit board assembly (PCBA), and the first surface of the substrate 10 of the package structure 1 is used for mounting the electronic components 20 and the package cover 50 , the second surface of the substrate 10 of the packaging structure 1 is used to connect with a printed circuit board (PCB), and the packaging structure 1 and the circuit board form the above-mentioned circuit board assembly.
  • PCBA printed circuit board assembly
  • PCB printed circuit board
  • the circuit board assembly specifically includes an encapsulation structure 1 and a circuit board, and the encapsulation structure 1 is connected to the circuit board by the second surface of the substrate 10 .
  • multiple connecting portions 63 may be provided on the second surface of the substrate 10 , and the multiple connecting portions 63 are used for electrical connection with the circuit board, and the multiple connecting portions 63 are distributed on the second surface of the substrate 10 at intervals.
  • the connecting portion 63 may be a solder ball, and the solder ball may be made of metal materials such as tin and copper.
  • the connecting portion 63 can also be configured as a metal connecting post (such as a copper post).
  • the embodiment of the present application provides that the specific form of the connecting portion 63 is not limited too much.
  • the packaging structure 1 provided in the embodiment of the present application is electrically connected to the circuit board through a plurality of connecting parts 63, so as to realize the electrical interconnection between the packaging structure 1 and the circuit board, and further realize the assembly of the circuit board assembly.
  • the electronic component 20 may be an active device.
  • the active device includes a die or other devices/components that require an external power supply to work. It should be understood that in the field of semiconductor packaging, "die", “Chip” or “bare chip” may be considered synonyms.
  • the electronic component 20 may also be a passive device.
  • the passive device includes capacitors, inductors, mixers, filters and other devices/components that do not require an external power supply.
  • the electronic component 20 is used as a crystal grain for illustration.
  • the electronic component 20 is flip-chip soldered on the first surface of the substrate 10 through a plurality of bump contacts 62 (Bump).
  • the circuit of the electronic component 20 can be led out through the protruding contact 62 , so as to realize the electrical connection between the electronic component 20 and other active/passive devices on the substrate 10 .
  • an underfill 61 (Underfill) is disposed between the plurality of bump contacts 62 .
  • underfill glue 61 can be added on the surface where the electronic component 20 is connected to the substrate 10, and when the electronic component 20 is flip-chip soldered to the substrate 10, the melted underfill glue 61 will flow into the raised contacts due to the siphon effect. The bottom of the point 62, so that the protruding contact 62 is completely wrapped, and the function of protecting the protruding contact 62 is played.
  • the package cover 50 described in the embodiment of the present application is provided with openings 511 at positions corresponding to the electronic components 20 , so that when the package cover 50 is connected to the first part of the substrate 10 On the surface, the electronic component 20 can be exposed from the opening 511 of the package cover 50 .
  • the electronic component 20 can be in direct contact with the air or the heat sink, so that the heat generated by the electronic component 20 can be easily transferred and diffused, thereby enhancing the heat dissipation of the packaging structure.
  • the opening 511 of the package cover 50 can adopt different shapes, for example, it can be a circular opening, a square opening or an oval opening, and the size of the opening 511 can be adjusted based on the electronic components 20. match.
  • the embodiment of the present application does not specifically limit the specific shape and size of the opening 511 .
  • the package cover 50 described in the embodiment of the present application has a hollowed out part on the surface used to connect with the substrate 10.
  • the shape of the hollowed out area can be designed in advance, and then according to the hollowed out area
  • the shape of the packaging cover 50 is hollowed out to obtain the above-mentioned hollowed out part.
  • a first support portion 521 and a second support portion 522 may be formed on the surface of the package cover 50, as shown in FIG. 3b and FIG.
  • the first support portion 521 There is an interval between the first support part 521 and the second support part 522, the top cover 510 is connected above the first support part 521 and the second support part 522, and the first support part 521 and the second support part 522 are ring-shaped first cavity 530 .
  • the first support portion 521 is disposed on the outer edge region of the top cover 510
  • the second support portion 522 is disposed on the edge region of the opening 511 .
  • the top cover 510 is erected above the substrate 10 through the first support portion 521 and the second support portion 522 , and the first support portion 521 and the second support portion 522 define
  • the first cavity 530 is provided on the first surface of the substrate 10 to provide accommodating space for components other than the above-mentioned electronic components 20, and for systems with more components on the substrate 10
  • the package (system in package, SiP) has strong applicability, and is beneficial to reduce the package weight of the package structure 1 .
  • the shape of the hollowed-out area can be designed in advance as a ring shape surrounding the opening 511, and then the package cover 50 is hollowed out according to the pre-designed ring shape. After the package cover 50 is hollowed out, two holes are formed on the surface.
  • the two supporting parts are the first supporting part 521 and the second supporting part 522 , the first supporting part 521 is located at the outer edge area of the top cover 510 , and the second supporting part 522 is located at the edge area of the opening 511 .
  • the first support part 521 can be a ring structure such as a square ring, a circular ring, an oval ring, etc. Generally speaking, the first support part 521 only needs to be adapted to the substrate 10. There is no specific limitation in the embodiment of the present application.
  • the second support part 522 can be a ring structure such as a square ring, a circular ring, an oval ring, etc. Generally speaking, the second support part 522 only needs to be adapted to the opening 511. For a specific ring It is not specifically limited in the embodiment of this application.
  • first support part 521 and the second support part 522 may adopt different ring structures, for example, the first support part 521 is in the shape of a square ring, and the second support part 522 is in the shape of a circular ring.
  • first supporting portion 521 and the second supporting portion 522 may also adopt the same ring structure, for example, both the first supporting portion 521 and the second supporting portion 522 are in the shape of a square ring.
  • first support portion 521 and the second support portion 522 are adhered to the first surface of the substrate 10 respectively.
  • first support portion 521 and the second support portion 522 may be respectively bonded and fixed to the first surface of the substrate 10 with adhesive, so that between the first support portion 521 and the first surface of the substrate 10, Adhesive layers are respectively formed between the second supporting portion 522 and the first surface of the substrate 10 .
  • FIG. 4a is a schematic top view of the package structure 1
  • FIG. 4b is a schematic cross-sectional structure at III in FIG. 4a
  • FIG. 4c is a schematic cross-sectional structure at IV in FIG. 4b.
  • the package structure 1 includes: a substrate 10 , an electronic component 20 and a package cover 50 .
  • the substrate 10 has a first surface and a second surface opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10, and the package cover 50 includes a top cover 510, a first support portion 521, a second support part 522 and a third support part 523, the top cover 510 is connected to the first surface of the substrate 10 through the first support part 521, the second support part 522 and the third support part 523, so The top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20 , and the electronic component 20 is at least partially exposed from the opening 511 .
  • the package cover 50 is further provided with a third support between the first support part 521 and the second support part 522 part 523, the first support part 521, the second support part 522 and the third support part 523 are arranged at intervals, a first cavity 530 is defined between the first support part 521 and the second support part 522, and the second The three supporting parts 523 define at least two second cavities 531 in the first cavity 530 .
  • a third support between the first support part 521 and the second support part 522 part 523, the first support part 521, the second support part 522 and the third support part 523 are arranged at intervals, a first cavity 530 is defined between the first support part 521 and the second support part 522, and the second The three supporting parts 523 define at least two second cavities 531 in the first cavity 530 .
  • the first supporting part 521, the second supporting part 522 and the third supporting part 523 are all annular structures, and the first supporting part 521, the second supporting part 522 and the The third support portion 523 divides the surface of the package cover 50 for connecting with the substrate 10 into two annular second cavities 531 .
  • the specific principle of controlling the warping of the packaging cover 50 is to provide torque to the first supporting part 521 through the second supporting part 522 through the third supporting part 523, which is beneficial to disperse the stress of the packaging structure, thereby effectively reducing the warping of the packaging structure. Prevent problems and damage caused by warpage, and at the same time improve the throughput and stability of the packaging structure.
  • the number of supporting parts of the packaging cover 50 can be appropriately increased, for example, the third supporting part
  • the number of 523 can be set in multiples, and the distance between the supporting parts can be adjusted according to actual needs.
  • FIG. 5 shows a schematic cross-sectional structure diagram of a package structure 1 provided in another embodiment of the present application.
  • the package structure 1 of the embodiment shown in FIG. 5 includes: a substrate 10 , an electronic component 20 and a package cover 50 .
  • the substrate 10 has a first surface and a second surface opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10, and the package cover 50 includes a top cover 510, a first support portion 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second supporting parts 522, and the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20, and the electronic component 20 is at least partially formed from the opening. 511 exposed.
  • the package cover 50 includes a top cover 510, a first support portion 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second supporting parts 522, and the top cover 510 is provided with an opening 511 at
  • both the first support portion 521 and the second support portion 522 are annular structures, and the first support portion 521 is provided with a gap 524 separating the ring-shaped first support portion 521 , and the second The second support portion 522 is also provided with a notch 524 separating the ring-shaped second support portion 522 .
  • the notch 524 serves to provide wiring space for component wiring. For example, for electronic components 20 with photoelectric modules, it is often necessary to lead out cables. For this reason, gaps 524 are provided in the first supporting portion 521 and the second supporting portion 522 to provide space for routing cables.
  • the number of notches 524 corresponding to the first supporting portion 521 and the second supporting portion 522 is at least one. It should be noted that, in the embodiment shown in FIG. 5 , the number of notches 524 on the first support part 521 and the second support part 522 and the positions of the notches 524 are exemplary, and the number of notches 524 can be determined according to actual needs during actual implementation. and the position of the notch 524 for adaptive adjustment.
  • the notch 524 can also exist only in the first supporting part 521 or the second supporting part 522, for example, only the components and parts located in the first cavity 530 need to lead out cables, at this time, only the first supporting part 521 It is enough to open the notch 524 ; as another example, only the electronic component 20 needs to lead out the cable, and the cable does not need to be led out of the substrate 10 .
  • the embodiment of the present application does not make too much limitation on the specific setting manner of the notch 524 .
  • FIG. 6 a shows a schematic cross-sectional structure diagram of a package structure 1 provided by another embodiment of the present application.
  • the package structure 1 of the embodiment shown in FIG. 6 a includes: a substrate 10 , an electronic component 20 and a package cover 50 .
  • the substrate 10 has a first surface and a second surface opposite to each other, the electronic component 20 is connected to the first surface of the substrate 10, and the package cover 50 includes a top cover 510, a first support portion 521 and a second support portion 522, the top cover 510 is connected to the first surface of the substrate 10 through the first support portion 521 and the second support portion 522, the first support portion 521 and the A first cavity 530 is defined between the second supporting parts 522, and the top cover 510 is provided with an opening 511 at a position corresponding to the electronic component 20, and the electronic component 20 is at least partially formed from the opening. 511 exposed.
  • the second support portion 522 adopts a ring structure, and in the embodiment shown in FIG. distributed around the edge of the opening 511 at intervals. It can be understood that the opening 511 cannot actually be shown in the sectional view of FIG. 6 a , and a dotted line is used in FIG. 6 a to indicate the projected position of the opening 511 on the substrate 10 .
  • the second supporting portion 522 includes four square supporting feet 5221 , and the four supporting feet 5221 are distributed at four corners of the square opening 511 .
  • the shape, quantity and distribution state of the supporting feet 5221 are exemplary, and the shape, quantity and distribution state of the supporting feet 5221 can be appropriately changed according to the actual implementation.
  • the cross-sectional shape of the supporting feet 5221 is a right-angled shape, and four right-angled supporting feet 5221 are distributed at four corners of the square opening 511 .
  • the embodiment of the present application does not place too many restrictions on the specific arrangement form of the supporting feet 5221 .
  • FIG. 6 b a dotted line is used in FIG. 6 b to indicate the projected position of the opening 511 on the substrate 10 .
  • the structure of the package structure 1 is strengthened through the package cover 50 to reduce warpage.
  • the packaging cover 50 since the packaging cover 50 has a first cavity 530 that can provide accommodating space for components other than the above-mentioned electronic components 20, Therefore, it is beneficial to maximize the coverage area of the package cover 50 on the substrate 10 (thereby obtaining a larger coverage area than the reinforcement ring shown in FIG. 1a and FIG.
  • the specific principle of controlling the warping of the packaging cover 50 is to provide torque to the first supporting part 521 through the second supporting part 522 to reduce the stress of the packaging structure, thereby reducing the warping of the packaging structure and preventing problems caused by warping and damage, while improving the productivity and stability of the packaging structure.
  • the packaging cover 50 has a hollow opening 511, through which the electronic component 20 can directly contact with the air or the heat sink, The heat generated by the electronic components 20 is easy to transfer and diffuse. Compared with the scheme shown in FIG. 2a and FIG.
  • the cover plate seals the electronic components 20 on the substrate 10, and the package structure 1 of the embodiment of the present application has better heat dissipation. sex.
  • the package structure 1 of the embodiment of the present application can effectively reduce package warping and deformation on the premise of ensuring the heat dissipation of the package structure 1 .
  • the cover plate type is no cover plate, the reinforcement ring 30 (Stiffener ring) shown in Figure 1a- Figure 1b, and Figure 2a- Figure 2a
  • the modulus of the conventional cover (Lid) + thermal conductive glue (Tim glue) shown in 2b is 0.04Mpa
  • the modulus of the conventional cover (Lid) + thermal conductive glue (Tim glue) shown in Figure 2a- Figure 2b is 0.04Mpa
  • the package cover 50 provided in the embodiment shown in FIGS. 3a-3c is used as a comparison.
  • the warpage of the substrate 10 is measured at room temperature (25°C) and peak reflow (260°C).
  • the thermal resistance between the electronic component 20 take the crystal grain as an example
  • the air or the heat sink see the table shown in FIG. 7 for the results.
  • both the reinforcement ring and the conventional cover can suppress warpage to a certain extent, and the effect of the reinforcement ring on controlling warpage is weak, but it does not increase additional thermal resistance, and the heat dissipation is better;
  • the conventional cover The warpage control effect of the board is better than that of the reinforcing ring, but it is greatly affected by the modulus of the thermally conductive adhesive, and it will increase the thermal resistance of the thermally conductive adhesive and the cover itself, and the heat dissipation effect is poor;
  • the package cover provided by the embodiment of this application suppresses warpage The effect is good and stable, and it will not be affected by the change of the properties of the heat-conducting adhesive material, nor will it increase additional thermal resistance, and the heat dissipation effect is good.
  • the packaging process flow of the packaging structure 1 in the embodiment of the present application is as follows:
  • the crystal grain is flip-chip soldered to the first surface of the substrate 10 through the raised contact 62 (Bump);
  • underfill glue 61 (Underfill) around the crystal grain. Due to the siphon effect, the melted glue will flow into the bottom of the raised contact 62 and completely wrap the raised contact 62 to protect the raised contact 62. role;
  • the embodiment of the present application also provides a circuit board assembly, the circuit board assembly includes a circuit board and the packaging structure 1 as described in any of the above embodiments, and the packaging structure 1 is connected to the circuit board.
  • multiple connecting portions 63 may be provided on the second surface of the substrate 10 , and the multiple connecting portions 63 are used for electrical connection with the circuit board, and the multiple connecting portions 63 are distributed on the second surface of the substrate 10 at intervals.
  • the connecting portion 63 may be a solder ball, and the solder ball may be made of metal materials such as tin and copper.
  • the packaging structure 1 provided in the embodiment of the present application is electrically connected to the circuit board through a plurality of connecting parts 63, so as to realize the electrical interconnection between the packaging structure 1 and the circuit board, and further realize the assembly of the circuit board assembly.
  • the embodiment of the present application also provides an electronic device, the electronic device includes the circuit board assembly as described in any one of the above embodiments.
  • the electronic devices here can be mobile phones, tablet computers, laptops, vehicle-mounted devices, wearable devices, drones, routers and other products.
  • the electronic device may also be a device such as a power supply module or a network switching device.
  • the package structure includes a substrate, an electronic component and a package cover, wherein the substrate has a first surface and a second surface oppositely arranged, and the electronic component and the first surface of the substrate connected, the package cover includes a top cover, a first support portion and a second support portion, the top cover is connected to the first surface of the substrate through the first support portion and the second support portion,
  • the coverage area of the top cover on the substrate can be maximized, and the moment can be provided to the first support part through the second support part, so as to control the warpage of the substrate, so as to reduce the warping deformation of the packaging structure and prevent problems caused by warping and damage, while improving the productivity and stability of the packaging structure.
  • a first cavity is defined between the first support part and the second support part, and the first cavity provides accommodating space for components other than the above-mentioned electronic components on the substrate, which is convenient for such as capacitors, etc.
  • Other components are mounted on the substrate, which has strong applicability to System In a Package (SiP) with more components on the substrate, and can reduce the package weight; the top cover corresponds to the electronic
  • SiP System In a Package
  • the top cover corresponds to the electronic
  • the position of the component is provided with an opening, and the electronic component is exposed from the opening, and the electronic component can directly contact with the air or the heat sink, thereby ensuring the heat dissipation effect of the packaging structure.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
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Abstract

一种封装结构(1)、电路板组件和电子设备，其中，封装结构(1)包括基板(10)、电子元器件(20)和封装盖体(50)，基板(10)具有相对设置的第一表面和第二表面，所述电子元器件(20)与所述基板(10)的第一表面连接，所述封装盖体(50)包括顶盖(510)、第一支撑部(521)和第二支撑部(522)，所述顶盖(510)通过所述第一支撑部(521)和所述第二支撑部(522)连接于所述基板(10)的第一表面上，所述第一支撑部(521)和所述第二支撑部(522)之间限定出第一空腔(530)，所述顶盖(510)在对应所述电子元器件(20)的位置设置有开孔(511)，电子元器件(20)至少部分从所述开孔(511)中露出。

Description

封装结构、电路板组件和电子设备
相关申请的交叉引用
本申请基于申请号为202111548243.5、申请日为2021年12月17日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及半导体封装技术领域，特别是涉及一种封装结构、电路板组件和电子设备。
背景技术
随着科学技术的快速发展，对芯片要求越来越高，封装尺寸和芯片功耗都在快速增加。随着封装尺寸增加，封装翘曲随之增大，封装翘曲不仅会使封装内部应力增加，还会导致芯片与电路板焊接不良，产生如连锡、虚焊等问题。而芯片功耗增加使芯片产生并散发出更多的热量，对芯片封装散热提出了更高的要求。
发明内容
本申请实施例提供一种封装结构、电路板组件和电子设备。
第一方面，本申请实施例提供一种封装结构，包括：基板，所述基板具有相对设置的第一表面和第二表面；电子元器件，所述电子元器件与所述基板的第一表面连接；封装盖体，所述封装盖体包括顶盖、第一支撑部和第二支撑部，所述顶盖通过所述第一支撑部和所述第二支撑部连接于所述基板的第一表面上，所述第一支撑部和所述第二支撑部之间限定出第一空腔，所述顶盖在对应所述电子元器件的位置设置有开孔，所述电子元器件至少部分从所述开孔中露出。
第二方面，本申请实施例提供一种电路板组件，所述电路板组件包括电路板和如上第一方面所述的封装结构，所述封装结构与所述电路板连接。
第三方面，本申请实施例提供一种电子设备，所述电子设备包括如上第二方面所述的电路板组件。
附图说明
图1a和图1b为已有技术中的一种封装结构的结构示意图；
图2a和图2b为已有技术中的另一种封装结构的结构示意图；
图3a-图3c为本申请的一个实施例提供的封装结构的结构示意图；
图4a-图4c为本申请的另一个实施例提供的封装结构的结构示意图；
图5为本申请的另一个实施例提供的封装结构的结构示意图；
图6a和图6b为本申请的另一个实施例提供的封装结构的结构示意图；
图7为在不同类型盖板下的基板翘曲度、电子元器件热阻的对比分析表格。
附图标记：
1-封装结构；10-基板；20-电子元器件；30-加强环；40-盖板；41-导热胶；
50-封装盖体；510-顶盖；511-开孔；521-第一支撑部；522-第二支撑部；5221-支撑脚；523-第三支撑部；524-缺口；530-第一空腔；531-第二空腔；
61-底部填充胶；62-凸起触点；63-连接部。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应了解，在本申请实施例的描述中，如果有描述到“第一”、“第二”等只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示单独存在A、同时存在A和B、单独存在B的情况。其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项”及其类似表达，是指的这些项中的任意组，包括单项或复数项的任意组。例如，a、b和c中的至少一项可以表示：a，b，c，a和b，a和c，b和c，或者，a和b和c，其中a，b，c可以是单个，也可以是多个。
在本申请的描述中，术语“内”、“外”、“纵向”、“横向”、“上”、“下”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请而不是要求本申请必须以特定的方位构造和操作，因此不应当理解为对本申请的限制。
另外，本领域普通技术人员应当可以意识到，本申请实施例描述的连接包括直接连接和通过中间部件相连的间接连接。
随着科学技术的快速发展，对芯片要求越来越高，封装尺寸和芯片功耗都在快速增加。随着封装尺寸增加，封装翘曲几率随之增大，封装翘曲不仅会使封装内部应力增加，还会导致芯片与电路板焊接不良，产生如连锡、虚焊等问题。而芯片功耗增加使芯片产生并散发出更多的热量，对芯片封装散热提出了更高的要求。
请参见图1a和图1b，图1a和图1b分别示出了已有技术中的一种封装结构的俯视图和剖面图。该封装结构包括：基板10、电子元器件20和加强环30(Stiffener ring)，其中，电子元器件20和加强环30均设置在基板10的上表面，加强环30为环状结构，电子元器件20从加强环30的中空部位露出。图1a和图1b所示的封装结构通过设置在基板10上的加强环30来控制封装翘曲，这种封装结构，电子元器件20可与空气或散热器直接接触，散热性较好，加强环30对封装翘曲的控制能力较弱。
请参见图2a和图2b，图2a和图2b分别示出了已有技术中的另一种封装结构的俯视图和剖面图。该封装结构包括：基板10、电子元器件20和盖板40(Lid)，其中，电子元器件20和盖板40均设置在基板10的上表面，盖板40和电子元器件20之间还设置有导热胶41(Tim胶)，盖板40的下表面具有环状的支撑部，盖板40通过环状的支撑部与基板10连接。图2a和图2b所示的封装结构通过设置在基板10上的盖板40来控制封装翘曲，这种封装结 构对封装翘曲控制相对较好，但是在电子元器件20和空气/散热器之间增加了阻挡(导热胶41和盖板40)，导致热量传输的热阻增大，使得封装结构的散热能力较差。
为了克服已有技术的封装结构存在的缺点，本申请实施例提供了一种封装结构、电路板组件和电子设备，用以有效控制封装结构的翘曲，且不影响电子元器件的散热，确保封装结构的散热效率。
实施例1
请参见图3a、图3b和图3c，图3a、图3b和图3c示出了本申请的一个实施例提供的封装结构1的结构示意图。其中，图3a为封装结构1的俯视结构示意图，图3b为图3a中Ⅰ处的剖面结构示意图，图3c为图3b中Ⅱ处的剖面结构示意图。在图3a、图3b和图3c所示的实施例中，封装结构1包括：基板10、电子元器件20和封装盖体50。其中，所述基板10具有相对设置的第一表面和第二表面，所述电子元器件20与所述基板10的第一表面连接，所述封装盖体50包括顶盖510、第一支撑部521和第二支撑部522，所述顶盖510通过所述第一支撑部521和所述第二支撑部522连接于所述基板10的第一表面上，所述第一支撑部521和所述第二支撑部522之间限定出第一空腔530，所述顶盖510在对应所述电子元器件20的位置设置有开孔511，所述电子元器件20至少部分从所述开孔511中露出。
可以理解的是，基板10为电子元器件20封装的载体，起到为封装的电子元器件20提供电连接、保护、支撑、散热、组装等作用。
示例性的，本申请实施例的封装结构1可以应用于电路板组件(Printed Circuit Board Assembly，PCBA)中，封装结构1的基板10的第一表面用于安装电子元器件20和封装盖体50，封装结构1的基板10的第二表面用于与电路板(Printed Circuit Board，PCB)连接，封装结构1和电路板组成上述电路板组件。
电路板组件具体包括封装结构1和电路板，封装结构1以基板10的第二表面与电路板连接。
具体实现时，可以在基板10的第二表面设置多个连接部63，这里的多个连接部63均用以与电路板电连接，多个连接部63在基板10的第二表面间隔分布。示例性的，连接部63可以为焊球(Solder ball)，焊球可以为锡、铜等金属材料制成。连接部63也可以设置为金属连接柱(例如铜柱)。本申请实施例提供对连接部63的具体形式不作过多限制。本申请实施例提供的封装结构1通过多个连接部63与电路板电连接，实现封装结构1与电路板的电气互联，进而实现电路板组件的组装。
可以理解的是，本领域技术人员能够根据实际需求选择电子元器件20的种类。示例性的，电子元器件20可以是有源器件，这里，有源器件包括晶粒(Die)或者其他需要外加电源才能工作的器件/元件，需了解，在半导体封装领域，“晶粒”、“芯片”或“裸芯片”可以看作同义词。电子元器件20也可以是无源器件，这里，无源器件包括电容、电感、混频器、滤波器等不需要外加电源的器件/元件。在本申请实施例中，以电子元器件20为晶粒进行示例性说明。
在一个具体的实施例中，如图3b所示，电子元器件20通过多个凸起触点62(Bump)以倒装方式焊接在基板10的第一表面上。通过凸起触点62可以将电子元器件20的线路引出，实现电子元器件20与基板10上的其它有源/无源器件之间的电连接。
在一示例中，多个所述凸起触点62之间设置有底部填充胶61(Underfill)。具体实现 时，可以在电子元器件20与基板10连接的表面添加底部填充胶61，将电子元器件20倒装焊接于基板10时，由于虹吸作用，融化后的底部填充胶61流入凸起触点62底部，从而把凸起触点62完全包裹起来，起到保护凸起触点62的作用。
可以理解的是，如图3a所示，本申请实施例描述的封装盖体50在对应电子元器件20的位置设置有开孔511，这样，当将封装盖体50连接至基板10的第一表面时，电子元器件20可以从封装盖体50的开孔511中露出。通过该开孔511，电子元器件20能够与空气或散热器直接接触，使得电子元器件20产生的热量便于传递扩散，从而增强了封装结构的散热性。
可以理解的是，封装盖体50的开孔511可以采用不同的形状，例如，可以是圆形开孔、方形开孔或者椭圆形开孔，开孔511的尺寸可以基于电子元器件20进行适配。本申请实施例对于开孔511的具体形状和尺寸，不做具体限定。
可以理解的是，本申请实施例描述的封装盖体50在用以与基板10相连的表面上设有挖空部分，具体实现时，可以预先设计好挖空区的形状，然后按照挖空区的形状对封装盖体50进行挖空，得到上述挖空部分。并且，在将封装盖体50的表面挖空之后，可以在封装盖体50的表面上形成第一支撑部521和第二支撑部522，如图3b和图3c所示，第一支撑部521和第二支撑部522之间是具有间隔的，顶盖510连接在第一支撑部521和第二支撑部522的上方，第一支撑部521和第二支撑部522之间为环形的第一空腔530。
示例性的，第一支撑部521设置于所述顶盖510的外边缘区域，所述第二支撑部522设置于所述开孔511的边缘区域。
可以理解的是，在封装盖体50的结构中，顶盖510通过第一支撑部521和第二支撑部522架设在基板10的上方，第一支撑部521和第二支撑部522之间限定出第一空腔530，该第一空腔530在基板10的第一表面上为除上述电子元器件20之外的元器件提供了容置空间，对基板10上元器件较多的系统级封装(system in package，SiP)有很强的适用性，并且有利于减轻封装结构1的封装重量。
具体实现时，可以预先设计挖空区的形状为包围开孔511的环形形状，然后按照预先设计的环形形状对封装盖体50进行挖空，封装盖体50经过挖空处理后，表面形成两个环状结构的支撑部，两个支撑部之间的部分即为顶盖510。这里，两个支撑部即为第一支撑部521和第二支撑部522，第一支撑部521位于顶盖510的外边缘区域，第二支撑部522位于开孔511的边缘区域。
示例性的，第一支撑部521可以是方形环、圆形环、椭圆形环等环状结构，一般来说，第一支撑部521只需要与基板10适配即可，对于具体的环形在本申请实施例中不做具体限定。
示例性的，第二支撑部522可以是方形环、圆形环、椭圆形环等环状结构，一般来说，第二支撑部522只需要与开孔511适配即可，对于具体的环形在本申请实施例中不做具体限定。
可以理解的是，第一支撑部521和第二支撑部522可以采用不同的环状结构，例如，第一支撑部521为方形环状，第二支撑部522为圆形环状。当然，第一支撑部521和第二支撑部522也可以采用相同的环状结构，例如，第一支撑部521和第二支撑部522均为方形环状。
可以理解的是，所述第一支撑部521和所述第二支撑部522分别粘接于所述基板10的第一表面上。具体的，可以通过粘接胶将第一支撑部521和第二支撑部522分别与基板10的第一表面粘接固定，如此，在第一支撑部521与基板10的第一表面之间、第二支撑部522与基 板10的第一表面之间分别形成有粘接层。
实施例2
请参见图4a、图4b和图4c，图4a、图4b和图4c示出了本申请的一个实施例提供的封装结构1的结构示意图。其中，图4a为封装结构1的俯视结构示意图，图4b为图4a中Ⅲ处的剖面结构示意图，图4c为图4b中Ⅳ处的剖面结构示意图。在图4a-图4c所示的实施例中，封装结构1包括：基板10、电子元器件20和封装盖体50。其中，所述基板10具有相对设置的第一表面和第二表面，所述电子元器件20与所述基板10的第一表面连接，所述封装盖体50包括顶盖510、第一支撑部521、第二支撑部522和第三支撑部523，所述顶盖510通过第一支撑部521、第二支撑部522和第三支撑部523连接于所述基板10的第一表面上，所述顶盖510在对应所述电子元器件20的位置设置有开孔511，所述电子元器件20至少部分从所述开孔511中露出。
相比图3a-图3c所示的实施例，在图4a-图4c所示的实施例中，封装盖体50在第一支撑部521和第二支撑部522之间还设置有第三支撑部523，第一支撑部521、第二支撑部522和第三支撑部523相间隔设置，所述第一支撑部521和所述第二支撑部522之间限定出第一空腔530，第三支撑部523在所述第一空腔530内限定出至少两个第二空腔531。例如，在图4a-图4c所示的实施例中，第一支撑部521、第二支撑部522和第三支撑部523均为环状结构，第一支撑部521、第二支撑部522和第三支撑部523将封装盖体50用以与基板10连接的表面划分为两个环形的第二空腔531。
封装盖体50控制翘曲的具体原理是通过第二支撑部522经第三支撑部523向第一支撑部521提供力矩，有利于将封装结构的应力分散，从而有效减小封装结构翘曲，防止因翘曲所造成的问题及损坏，并同时提高封装结构的产能与稳定性。
可以理解，具体实现过程中，在保证除电子元器件20之外的其它元器件具有足够的装配空间的前提下，可以适当地增加封装盖体50的支撑部的数量，例如，第三支撑部523的数量可以设置为多个，并且可以根据实际需要调整支撑部之间的位置距离。
需说明的是，在图4a-图4c所示的实施例中，电子元器件20与基板10的具体连接方式、封装盖体50与基板10的具体连接方式、封装结构1与电路板的连接方式、封装盖体50的制作方式等均可参照图3a-图3c所示实施例的相关说明，在此不再赘述。
实施例3
请参照图5，图5示出了本申请的另一个实施例提供的封装结构1的横向剖面结构示意图。需说明的是，图5所示实施例的封装结构1的俯视结构和纵向剖面结构可以对应参照图3a、图3b所示实施例的结构，故在此省略。图5所示实施例的封装结构1包括：基板10、电子元器件20和封装盖体50。其中，所述基板10具有相对设置的第一表面和第二表面，所述电子元器件20与所述基板10的第一表面连接，所述封装盖体50包括顶盖510、第一支撑部521和第二支撑部522，所述顶盖510通过所述第一支撑部521和所述第二支撑部522连接于所述基板10的第一表面上，所述第一支撑部521和所述第二支撑部522之间限定出第一空腔530，所述顶盖510在对应所述电子元器件20的位置设置有开孔511，所述电子元器件20至少部分从所述开孔511中露出。在图5所示的实施例中，第一支撑部521和第二支撑部522均为环状结构，第一支撑部521设置有隔断环状的所述第一支撑部521的缺口524，第二支撑部522同样设置有隔断环状的所述第二支撑部522的缺口524，在本申请实施例中，缺 口524起到为元器件走线提供走线空间的作用。例如，对于带光电模块的电子元器件20，往往需要引出线缆，为此，通过在第一支撑部521、第二支撑部522设置缺口524，从而为引出线缆提供了走线的空间。
可以理解的是，第一支撑部521和第二支撑部522对应的缺口524数量为至少一个。需说明的是，图5所示的实施例中，第一支撑部521、第二支撑部522上的缺口524数量以及缺口524位置为示例性的，具体实现时，可以根据实际需要缺口524数量和缺口524位置进行适应性的调整。当然，缺口524也可以仅存在于第一支撑部521或者第二支撑部522，例如，只有位于第一空腔530中的元器件需要引出线缆，此时，只需在第一支撑部521开设缺口524即可；又例如，只有电子元器件20需要引出线缆，且线缆无需引至基板10之外，此时，只需在第二支撑部522开设缺口524即可。本申请实施例对缺口524的具体设置方式不作过多限定。
需说明的是，在图5所示的实施例中，电子元器件20与基板10的具体连接方式、封装盖体50与基板10的具体连接方式、封装结构1与电路板的连接方式、封装盖体50的制作方式等均可参照图3a-图3c所示实施例的相关说明，在此不再赘述。
实施例4
请参见图6a，图6a示出了本申请的另一个实施例提供的封装结构1的横向剖面结构示意图。需说明的是，图6a所示实施例的封装结构1的俯视结构和纵向剖面结构可以对应参照图3a、图3b所示实施例的结构，故在此省略。图6a所示实施例的封装结构1包括：基板10、电子元器件20和封装盖体50。其中，所述基板10具有相对设置的第一表面和第二表面，所述电子元器件20与所述基板10的第一表面连接，所述封装盖体50包括顶盖510、第一支撑部521和第二支撑部522，所述顶盖510通过所述第一支撑部521和所述第二支撑部522连接于所述基板10的第一表面上，所述第一支撑部521和所述第二支撑部522之间限定出第一空腔530，所述顶盖510在对应所述电子元器件20的位置设置有开孔511，所述电子元器件20至少部分从所述开孔511中露出。
相比图3a-图3c所示实施例中，第二支撑部522采用环状结构，在图6a所示的实施例中，第二支撑部522包括多个支撑脚5221，多个支撑脚5221围绕所述开孔511边缘间隔分布。可以理解，开孔511在图6a的剖面图中实际上并不能示出，在图6a中采用虚线表示开孔511在基板10上的投影位置。
具体地，如图6a所示，第二支撑部522包括四个方形的支撑脚5221，四个支撑脚5221分布在方形开孔511的四个角位。当然，在图6a所示的实施例中，支撑脚5221的形状、数量和分布状态均为示例性的，具体实现时，可以根据实际适应地改变支撑脚5221的形状、数量和分布状态。
例如，如图6b所示，支撑脚5221的截面形状为直角形状，四个直角形状的支撑脚5221分布在方形开孔511的四个角位。本申请实施例对支撑脚5221的具体设置形式不作过多限制。
可以理解，开孔511在图6b的剖面图中实际上并不能示出，在图6b中采用虚线表示开孔511在基板10上的投影位置。
需说明的是，在图6a/图6b所示的实施例中，电子元器件20与基板10的具体连接方式、封装盖体50与基板10的具体连接方式、封装结构1与电路板的连接方式、封装盖体50的制作方式等均可参照图3a-图3c所示实施例的相关说明，在此不再赘述。
可以理解的是，本申请实施例的方案通过封装盖体50实现封装结构1的结构加强，以减小翘曲。相比图1a、图1b所示的方案，本申请实施例的方案中，由于封装盖体50具有可以为除上述电子元器件20之外的元器件提供容置空间的第一空腔530，所以有利于封装盖体50在基板10上的覆盖面积最大化(从而得到比图1a、图1b所示加强环更大的覆盖面积)，使得封装盖体50具有更好的控制翘曲效果，封装盖体50控制翘曲的具体原理是通过第二支撑部522向第一支撑部521提供力矩，以减小封装结构的应力，从而减小封装结构翘曲，防止因翘曲所造成的问题及损坏，并同时提高封装结构的产能与稳定性。相比图2a、图2b所示的方案，本申请实施例的方案中，封装盖体50具有中空的开孔511，通过该开孔511，电子元器件20能够与空气或散热器直接接触，使得电子元器件20产生的热量便于传递扩散，相比图2a、图2b所示的方案中盖板将电子元器件20密封在基板10上，本申请实施例的封装结构1具有更优的散热性。综上可知，本申请实施例的封装结构1可以在保证封装结构1散热性的前提下有效减小封装翘曲变形。
为便于理解本申请实施例采用的封装盖体50所带来的技术效果，下面以盖板类型为无盖板、图1a-图1b所示的加强环30(Stiffener ring)、图2a-图2b所示的常规盖板(Lid)+导热胶(Tim胶)模量0.04Mpa、图2a-图2b所示的常规盖板(Lid)+导热胶(Tim胶)模量0.04Mpa、本申请在图3a-图3c所示实施例提供的封装盖体50作为对比，当采用不同的盖板类型时，测量基板10在室温(25℃)和回流焊峰值(260℃)时的翘曲度，以及电子元器件20(以晶粒为例)到空气或散热器间的热阻，结果参见图7所示表格。
从图7所示表格可以看出，加强环或者常规盖板均能在一定程度上抑制翘曲，加强环控制翘曲的效果较弱，但不会增加额外热阻，散热较好；常规盖板控制翘曲效果优于加强环，但是受导热胶的模量影响较大，且会增加导热胶和盖板本身热阻，散热效果较差；本申请实施例提供的封装盖体抑制翘曲效果好且稳定，不会受到导热胶材料属性变化的影响，也不会增加额外热阻，散热效果良好。
示例性的，以电子元器件20为晶粒为例，本申请实施例的封装结构1的封装工艺流程如下：
S1，晶粒通过凸起触点62(Bump)倒装焊接到基板10的第一表面上；
S2，在晶粒周围添加底部填充胶61(Underfill)，由于虹吸作用，融化后的胶将流入凸起触点62底部，把凸起触点62完全包裹起来，起到保护凸起触点62的作用；
S3，在晶粒上添加Tim胶(如有)，在基板10对应第一支撑部521、第二支撑部522的位置上添加粘接胶；
S4，将封装盖体50的第一支撑部521、第二支撑部522压在粘接胶上；
S5，在一定温度下固化粘接胶，使盖板和基板10粘接在一起；
S6，通过回流炉将焊球或者焊盘植在基板10的第二表面。
本申请实施例还提供了一种电路板组件，所述电路板组件包括电路板和如上任意实施例所述的封装结构1，所述封装结构1与所述电路板连接。
具体实现时，可以在基板10的第二表面设置多个连接部63，这里的多个连接部63均用以与电路板电连接，多个连接部63在基板10的第二表面间隔分布。示例性的，连接部63可以为焊球，焊球可以为锡、铜等金属材料制成。本申请实施例提供的封装结构1通过多个连接部63与电路板电连接，实现封装结构1与电路板的电气互联，进而实现电路板组件的组装。
本申请实施例还提供了一种电子设备，所述电子设备包括如上任一实施例所述的电路板组件。这里的电子设备可以是手机、平板电脑、笔记本电脑、车载设备、可穿戴设备、无人机、路由器等产品。电子设备也可以是功率电源模块或网络交换设备等设备。
本申请实施例的方案，封装结构包括基板、电子元器件和封装盖体，其中，所述基板具有相对设置的第一表面和第二表面，所述电子元器件与所述基板的第一表面连接，所述封装盖体包括顶盖、第一支撑部和第二支撑部，所述顶盖通过所述第一支撑部和所述第二支撑部连接于所述基板的第一表面上，可以令顶盖在基板上的覆盖面积最大化，通过第二支撑部向第一支撑部提供力矩，从而控制基板的翘曲，以减小封装结构翘曲变形，防止因翘曲所造成的问题及损坏，并同时提高封装结构的产能与稳定性。所述第一支撑部和所述第二支撑部之间限定出第一空腔，该第一空腔为基板上除上述电子元器件之外的元器件提供了容置空间，便于诸如电容等其他元器件贴装在基板上，对基板上元器件较多的系统级封装(System In a Package，SiP)有很强的适用性，并且可以减轻封装重量；所述顶盖在对应所述电子元器件的位置设置有开孔，所述电子元器件从所述开孔中露出，电子元器件可与空气或散热器直接接触，保证了封装结构的散热效果。
应能理解，本申请对各个实施例的描述都各有侧重，某个实施例中没有详述或记载的部分，可以参见其它实施例的相关描述。另外，本申请所描述的各个实施方式中所涉及到的技术特征，只要彼此之间未构成冲突就可以相互组合。
以上是对本申请的若干实施方式进行了具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请精神的共享条件下，还可作出种种等同的变形或替换，这些等同的变形或替换均包括在本申请权利要求所限定的范围内。

Claims (13)

  1. 一种封装结构，包括：
    基板，所述基板具有相对设置的第一表面和第二表面；
    电子元器件，所述电子元器件与所述基板的第一表面连接；
    封装盖体，所述封装盖体包括顶盖、第一支撑部和第二支撑部，所述顶盖通过所述第一支撑部和所述第二支撑部连接于所述基板的第一表面上，所述第一支撑部和所述第二支撑部之间限定出第一空腔，所述顶盖在对应所述电子元器件的位置设置有开孔，所述电子元器件至少部分从所述开孔中露出。
  2. 根据权利要求1所述的封装结构，其中，所述第一支撑部设置于所述顶盖的外边缘区域，所述第一支撑部为环状结构。
  3. 根据权利要求2所述的封装结构，其中，所述第一支撑部设置有至少一个隔断环状的所述第一支撑部的缺口。
  4. 根据权利要求1所述的封装结构，其中，所述第二支撑部设置于所述开孔的边缘区域，所述第二支撑部为环状结构。
  5. 根据权利要求4所述的封装结构，其中，所述第二支撑部设置有至少一个隔断环状的所述第二支撑部的缺口。
  6. 根据权利要求1所述的封装结构，其中，所述第二支撑部包括多个支撑脚，多个支撑脚围绕所述开孔边缘间隔分布。
  7. 根据权利要求1所述的封装结构，其中，所述封装盖体还包括至少一个第三支撑部，所述第三支撑部设置于所述第一支撑部和所述第二支撑部之间，所述第三支撑部与所述顶盖和所述基板的第一表面连接。
  8. 根据权利要求7所述的封装结构，其中，所述第三支撑部在所述第一空腔内限定出至少两个第二空腔。
  9. 根据权利要求1所述的封装结构，其中，所述电子元器件通过多个凸起触点与所述基板的第一表面连接，多个所述凸起触点之间设置有底部填充胶。
  10. 根据权利要求1所述的封装结构，其中，所述基板的第二表面设置有多个连接部，所述连接部被设置为连接电路板。
  11. 根据权利要求1所述的封装结构，其中，所述第一支撑部和所述第二支撑部分别粘接于所述基板的第一表面上。
  12. 一种电路板组件，包括电路板和权利要求1至11任一项所述的封装结构，所述封装结构与所述电路板连接。
  13. 一种电子设备，包括权利要求12所述的电路板组件。
PCT/CN2022/078891 2021-12-17 2022-03-02 封装结构、电路板组件和电子设备 WO2023108909A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062970A1 (en) * 2000-11-30 2002-05-30 International Business Machines Corporation I/c chip assembly
CN102177580A (zh) * 2006-08-31 2011-09-07 Ati科技无限责任公司 具有封装剂保持结构的反转芯片半导体封装及条带
US20140061893A1 (en) * 2012-08-29 2014-03-06 Broadcom Corporation Hybrid thermal interface material for ic packages with integrated heat spreader
US20140167243A1 (en) * 2012-12-13 2014-06-19 Yuci Shen Semiconductor packages using a chip constraint means
CN108346630A (zh) * 2017-01-25 2018-07-31 矽品精密工业股份有限公司 散热型封装结构
CN110854083A (zh) * 2019-11-22 2020-02-28 海光信息技术有限公司 半导体芯片的封装结构及其封装工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602740B1 (en) * 1999-11-24 2003-08-05 Tessera, Inc. Encapsulation of microelectronic assemblies
US20050121757A1 (en) * 2003-12-04 2005-06-09 Gealer Charles A. Integrated circuit package overlay
JP6421050B2 (ja) * 2015-02-09 2018-11-07 株式会社ジェイデバイス 半導体装置
TWI555147B (zh) * 2015-03-20 2016-10-21 矽品精密工業股份有限公司 散熱型封裝結構及其散熱件
TWI647802B (zh) * 2016-07-06 2019-01-11 矽品精密工業股份有限公司 散熱型封裝結構
DE102016124270A1 (de) * 2016-12-13 2018-06-14 Infineon Technologies Ag Halbleiter-package und verfahren zum fertigen eines halbleiter-package
JP7001445B2 (ja) * 2017-11-30 2022-01-19 ローム株式会社 半導体装置およびその製造方法
WO2021217319A1 (zh) * 2020-04-26 2021-11-04 华为技术有限公司 一种封装结构、电子设备及芯片封装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062970A1 (en) * 2000-11-30 2002-05-30 International Business Machines Corporation I/c chip assembly
CN102177580A (zh) * 2006-08-31 2011-09-07 Ati科技无限责任公司 具有封装剂保持结构的反转芯片半导体封装及条带
US20140061893A1 (en) * 2012-08-29 2014-03-06 Broadcom Corporation Hybrid thermal interface material for ic packages with integrated heat spreader
US20140167243A1 (en) * 2012-12-13 2014-06-19 Yuci Shen Semiconductor packages using a chip constraint means
CN108346630A (zh) * 2017-01-25 2018-07-31 矽品精密工业股份有限公司 散热型封装结构
CN110854083A (zh) * 2019-11-22 2020-02-28 海光信息技术有限公司 半导体芯片的封装结构及其封装工艺

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