WO2023108732A1 - 柔性 oled 基板及其封装方法 - Google Patents

柔性 oled 基板及其封装方法 Download PDF

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WO2023108732A1
WO2023108732A1 PCT/CN2021/140188 CN2021140188W WO2023108732A1 WO 2023108732 A1 WO2023108732 A1 WO 2023108732A1 CN 2021140188 W CN2021140188 W CN 2021140188W WO 2023108732 A1 WO2023108732 A1 WO 2023108732A1
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Prior art keywords
substrate
flexible
oled
layer
glue
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PCT/CN2021/140188
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English (en)
French (fr)
Inventor
曹蔚然
李金川
储金星
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深圳市华星光电半导体显示技术有限公司
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Priority to US17/624,025 priority Critical patent/US20230200111A1/en
Publication of WO2023108732A1 publication Critical patent/WO2023108732A1/zh

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  • the invention relates to the field of packaging technology and preparation technology, in particular to a flexible OLED substrate and a packaging method thereof.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the organic light-emitting layer is an organic compound film that emits light in response to an electric current.
  • the organic material is sandwiched between two electrodes, at least one of which is a light-transmitting electrode.
  • OLED exhibits high optical activity, high efficiency and requires low driving voltage, therefore, it is a good candidate for use in display screens.
  • using OLEDs for displays requires specific handling, in particular, exposure to moisture or oxygen can severely damage the organic light-emitting layer. Therefore, the encapsulation of OLEDs is critical to protect them from moisture and oxygen.
  • Thin Film packaging (Thin Film) is mainly used for flexible OLED display devices.
  • Encapsulation; TFE) encapsulation method the common method is to prepare inorganic, organic or mixed film layers on OLED devices.
  • Inorganic layers can be deposited by any of a number of standard deposition techniques, including chemical vapor deposition (Chemical Vapor Deposition, CVD), physical vapor deposition (Physical Vapor Deposition, PVD) or atomic layer deposition (Atomic Layer Deposition, ALD), and none of these packaging methods can completely block water and oxygen, so that the device is not affected by moisture and oxygen.
  • CVD chemical Vapor Deposition
  • PVD Physical vapor deposition
  • ALD atomic layer deposition
  • the purpose of the present invention is to provide a flexible OLED substrate and its packaging method, which can completely block water and oxygen, so that the OLED device is free from the influence of moisture and oxygen, thereby effectively improving the packaging effect and prolonging the service life of the OLED device.
  • the present invention provides a flexible OLED substrate, including a flexible substrate, an inorganic barrier layer, an OLED device, and a filling glue layer.
  • the inorganic barrier layer is disposed on the flexible substrate
  • the OLED device is disposed on the inorganic barrier layer
  • the filler layer covers the OLED device and the inorganic barrier layer
  • the flexible substrate further includes a substrate, a curved A folding part and a covering part
  • the substrate is provided with a thin film transistor layer (TFT)
  • TFT thin film transistor layer
  • the bending part connects the substrate and the covering part
  • the covering part is covered with the filling glue layer and is connected with the
  • it also includes setting a frame glue on the glue filling layer and the edge of the OLED device.
  • the frame glue, the filling glue layer and the inorganic barrier layer jointly cover the OLED device.
  • the thickness of the inorganic barrier layer is between 100 nm and 5000 nm, and the constituent materials include one or more of aluminum oxide, titanium oxide, chromium oxide, silicon nitride, silicon oxynitride, and silicon oxide.
  • the present invention also provides a packaging method for a flexible OLED substrate, comprising the following steps:
  • the OLED devices are spaced apart and encase the OLED devices.
  • the step of providing the glass substrate further includes forming a distance between the first substrate part and the second substrate part.
  • the flexible substrate in the step of preparing the flexible substrate, also forms a substrate, a bent portion and a covering portion, the substrate includes a thin film transistor layer connected to and drives the OLED device to emit light, and the bent
  • the folding part connects the substrate and the covering part, and the covering part is covered with the filling glue layer and correspondingly bonded to the substrate, and the distance forms the bending part and is formed by cutting.
  • the step of preparing the filling glue layer it also includes coating a border glue on the edge of the second substrate part, and the border glue connects the filling glue layer, when the flexible substrate is bent and When covering the OLED device, the inorganic barrier layer, the filler layer and the frame glue cover the OLED device together, wherein the filler layer and the frame glue are formed on the OLED device two edges.
  • the glass substrate is separated from the flexible substrate and the flexible substrate is exposed, and the frame glue is cured by ultraviolet light to form a frame glue, thereby completing Encapsulation of the OLED substrate.
  • the thickness of the inorganic barrier layer is between 100 nm and 5000 nm, and the constituent materials include one or more of aluminum oxide, titanium oxide, chromium oxide, silicon nitride, silicon oxynitride, and silicon oxide.
  • the present invention further provides a packaging method for a flexible OLED substrate, comprising the following steps:
  • the OLED devices are spaced apart and encase the OLED devices.
  • the step of providing the glass substrate further includes forming a distance between the first substrate part and the second substrate part.
  • the flexible substrate in the step of preparing the flexible substrate, also forms a substrate, a bent portion and a covering portion, the substrate includes a thin film transistor layer connected to and drives the OLED device to emit light, and the bent
  • the folding part connects the substrate and the covering part, and the covering part is covered with the filling glue layer and correspondingly bonded to the substrate, and the distance forms the bending part and is formed by cutting.
  • the step of preparing the filling glue layer it also includes coating a border glue on the edge of the second substrate part, and the border glue connects the filling glue layer, when the flexible substrate is bent and When covering the OLED device, the flexible substrate is spaced apart from the OLED device by the filling glue layer, and the inorganic barrier layer, the filling glue layer and the frame glue cover the OLED device together, Wherein the filling adhesive layer and the frame adhesive are formed on both edges of the OLED device.
  • the glass substrate is separated from the flexible substrate and the flexible substrate is exposed, and the frame glue is cured by ultraviolet light to form a frame glue, thereby completing Encapsulation of the OLED substrate.
  • the thickness of the inorganic barrier layer is between 100 nm and 5000 nm, and the constituent materials include one or more of aluminum oxide, titanium oxide, chromium oxide, silicon nitride, silicon oxynitride, and silicon oxide.
  • the present invention also has the following effects.
  • the flexible substrate of the present invention itself has an inorganic barrier layer instead of an additionally deposited barrier layer (Barrier Layer), which simplifies the packaging process.
  • the OLED device is prepared on one side of the flexible substrate, and the filling glue layer and the frame glue (Dam glue) are coated on the other side, and then the filling glue layer and the frame glue (Dam glue) are folded by bending the first substrate part or the second substrate part.
  • the frame glue is attached to the OLED device, thereby completing the packaging of the OLED substrate.
  • the filling glue layer in the surface of the OLED substrate and the frame glue on the edge are both water-blocking, and the inorganic barrier layer of the flexible substrate is also water-blocking, it can play a multi-layer and effective packaging role, thereby avoiding
  • the OLED device is protected from the influence of moisture and oxygen, the encapsulation effect is improved and the service life of the OLED substrate is improved.
  • Fig. 1 is a schematic cross-sectional view of a flexible OLED substrate of the present invention
  • Fig. 2 is the first cross-sectional schematic diagram of the packaging method of the flexible OLED substrate of the present invention
  • FIG. 4 is a third schematic cross-sectional view of the packaging method of the flexible OLED substrate of the present invention.
  • FIG. 5 is a schematic diagram of a fourth cross-section of the packaging method of the flexible OLED substrate of the present invention.
  • FIG. 6 is a fifth cross-sectional schematic diagram of the packaging method of the flexible OLED substrate of the present invention.
  • FIG. 7 is a block flow chart of the packaging method of the flexible OLED substrate of the present invention.
  • an embodiment means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention.
  • the same terms appearing in different positions in the specification are not necessarily limited to the same implementation, but should be understood as independent or alternative implementations from other embodiments.
  • FIG. 1 is a schematic cross-sectional view of the flexible OLED substrate of the present invention.
  • the present invention provides a flexible OLED substrate 100 , including a flexible substrate 110 , an inorganic barrier layer 120 , an OLED device 130 and a glue filling layer 140 .
  • the inorganic barrier layer 120 is disposed on the flexible substrate 110
  • the OLED device 130 is disposed on the inorganic barrier layer 120
  • the filling glue layer 140 covers the OLED device 130 and the inorganic barrier layer 120 .
  • the flexible substrate 110 also includes a substrate 112, a bent portion 114 and a covering portion 116, the substrate 112 is provided with a thin film transistor layer (TFT) 118, and the bent portion 114 connects the substrate 112 and the A covering portion 116 , and the covering portion 116 is covered with the filling glue layer 140 and correspondingly attached to the substrate 112 .
  • TFT thin film transistor layer
  • the OLED device 130 covers the periphery of the OLED device 130 together through the inorganic barrier layer 120, the filling glue layer 140 and the border glue 150, wherein the filling glue layer 140 and the border glue It is formed on both edges of the OLED device, thereby improving the encapsulation effect.
  • the flexible substrate 110 itself has an inorganic barrier layer 120 instead of an additional deposited barrier layer (Barrier Layer), which can simplify the packaging process.
  • the material of the flexible substrate 110 itself ie, the inorganic barrier layer 120 ) replaces the additionally deposited barrier layer, which simplifies the packaging process.
  • the material of the flexible substrate 110 is, for example, several common materials such as polyimide (PI), PET, etc., which are not limited in this embodiment.
  • the thickness of the inorganic barrier layer 120 is between 100-5000 nm, and the constituent materials include aluminum oxide (Al x O x ), titanium oxide (TiO x ), chromium oxide (CrO x ), silicon nitride (SiN x ) One or more of silicon oxynitride (SiON x ) and silicon oxide (SiO x ).
  • the present invention also provides a packaging method for a flexible OLED substrate 100, which is characterized in that it includes the following steps: Step S1, providing a glass substrate 200, and the glass substrate 200 is formed There is a first substrate part 210 and a second substrate part 220 connected to each other. Step S2 , providing a flexible substrate 110 on the first substrate part 210 and the second substrate part 220 , and preparing an inorganic barrier layer 120 on a surface of the flexible substrate 110 away from the glass substrate 200 . Step S3 , preparing an OLED device 130 on the inorganic barrier layer 120 corresponding to the first substrate part 210 , and preparing a filling glue layer 140 on the flexible substrate 110 corresponding to the second substrate part 220 .
  • Step S4 bending the first substrate part 210 and pressing the second substrate part 220 or bending the second substrate part 220 and pressing the first substrate part 210, so that the flexible substrate 110 passes through
  • the filling glue layer 140 is spaced apart from the OLED device 130 and covers the OLED device 130 .
  • the flexible substrate 110 also forms a substrate 112, a bent portion 114, and a covering portion 116, and the substrate 112 includes a thin film transistor layer connected to and driving the OLED device 130 to emit light. (TFT) 118 , the bent portion 114 connects the substrate 112 and the covering portion 116 , and the covering portion 116 is covered with the filling glue layer 140 and correspondingly attached to the substrate 112 .
  • the distance 230 forms the bent portion 114 and is formed by cutting or other suitable methods, which is not limited in this embodiment.
  • the step of preparing the filling glue layer S3 it also includes coating a border glue 150 on the edge of the second substrate part 220 , and the border glue 150 is connected to the filling glue layer 140 .
  • the flexible substrate 110 is bent and covers the OLED device 130, the inorganic barrier layer 120, the filler glue layer 140 and the frame glue 150 cover the OLED device 130 together, wherein the filler The glue layer 140 and the frame glue 150 are formed on two edges of the OLED device 130 .
  • the step S4 of bending the first substrate part 210 and the second substrate part 220 or bending the second substrate part 220 and the first substrate part 210 for pressing it also includes peeling off the The glass substrate 200 and the border glue 150 are cured. After the glass substrate 200 is peeled off, the glass substrate 200 is separated from the flexible substrate 110 to expose the flexible substrate 110, and the frame glue 150 is cured by ultraviolet light to form a frame glue, thereby completing the OLED. Encapsulation of the substrate 100 .
  • the thickness of the inorganic barrier layer 120 is between 100-5000 nm, and the constituent materials include aluminum oxide (Al x O x ), titanium oxide (TiO x ), chromium oxide (CrO x ), nitride One or more of silicon (SiN x ), silicon oxynitride (SiON x ), and silicon oxide (SiO x ).
  • the flexible substrate 110 itself has an inorganic barrier layer 120 instead of an additionally deposited barrier layer (Barrier Layer), which simplifies the packaging process.
  • the OLED device 130 is prepared on one side of the flexible substrate 110, and the filling glue layer 140 and the frame glue 150 (Dam glue material) are coated on the other side, and then the first substrate part 210 or the second substrate part 220 is folded. The filling glue layer 140 and the frame glue 150 are bonded to the OLED device 130 , so as to complete the packaging of the OLED substrate 100 .
  • the filling glue layer 140 on the surface of the OLED substrate 100 and the frame glue 150 on the edge have water resistance, and the inorganic barrier layer 120 of the flexible substrate 110 also has water resistance, it can play a multi-layer and effective role.
  • the encapsulation effect prevents the OLED device 130 from being affected by moisture and oxygen, improves the encapsulation effect and increases the service life of the OLED substrate 100 .

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Abstract

一种柔性OLED基板，包括柔性基板、无机阻隔层、OLED器件以及填充胶层。无机阻隔层设置在所述柔性基板上，OLED器件设置在所述无机阻隔层上，填充胶层覆盖在所述OLED器件以及所述无机阻隔层上，其中所述柔性基板还包括衬底、弯折部及覆盖部，所述衬底设置有薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合设置。

Description

柔性OLED基板及其封装方法 技术领域
本发明涉及一种封装工艺及制备技术领域，特别是涉及一种柔性OLED基板及其封装方法。
 背景技术
OLED(Organic Light-Emitting Diode,有机发光二极管)具有有机发光层，其中有机发光层是响应于电流而发光的有机化合物膜。有机材料夹在两个电极之间，至少一个电极是透光电极。OLED呈现高发旋光性、高效率且需要低驱动电压，因此，它是用于显示器屏幕的良好候选。然而，将OLED用于显示器需要特定的处理，具体而言，暴露在湿气或氧气下会对有机发光层产生严重损伤。因此，对OLED的封装十分关键，以使其免受湿气和氧气的影响。
 技术问题
针对柔性OLED显示设备主要采用薄膜封装(Thin Film Encapsulation; TFE)的封装方式，普遍方法是在OLED器件上制备的无机、有机或其混合膜层。无机层可以通过许多标准沉积技术中的任一种进行沉积，包括化学气相沉积(Chemical Vapor Deposition, CVD)、物理气相沉积(Physical Vapor Deposition，PVD)或原子层沉积(Atomic Layer Deposition, ALD)，而这些封装方法均无法完全阻隔水氧，使器件免受湿气和氧气的影响。
 技术解决方案
本发明的目的，在于提供一种柔性OLED基板及其封装方法，能够完全阻隔水氧，使OLED器件免受湿气和氧气的影响，从而有效提升封装效果并且可以延长OLED器件的使用寿命。
为达到本发明前述目的，本发明提供一种柔性OLED基板，包括柔性基板、无机阻隔层、OLED器件以及填充胶层。无机阻隔层设置在所述柔性基板上，OLED器件设置在所述无机阻隔层上，填充胶层覆盖在所述OLED器件以及所述无机阻隔层上，其中所述柔性基板还包括衬底、弯折部及覆盖部，所述衬底设置有薄膜晶体管层(TFT)，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合设置。
优选地，还包括在所述填充胶层以及所述OLED器件的边缘上设置边框胶。
优选地，所述边框胶、所述填充胶层和所述无机阻隔层共同包覆所述OLED器件。
优选地，所述无机阻隔层的厚度介于100nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
本发明还提供一种柔性OLED基板的封装方法，包括如下步骤：
提供玻璃衬底，所述玻璃衬底形成有彼此连接的第一衬底部以及第二衬底部；
在所述第一衬底部以及所述第二衬底部上提供柔性基板，并在所述柔性基板远离所述玻璃衬底的一表面上制备无机阻隔层；
在所述无机阻隔层对应所述第一衬底部上制备OLED器件，并在所述柔性基板对应所述第二衬底部上制备填充胶层；以及
弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合，使所述柔性基板通过所述填充胶层与所述OLED器件间隔开，并包覆所述OLED器件。
优选地，在提供所述玻璃衬底的步骤中，还包括在所述第一衬底部和所述第二衬底部之间形成一间距。
优选地，在制备所述柔性基板的步骤中，所述柔性基板还形成衬底、弯折部及覆盖部，所述衬底包括连接并驱动所述OLED器件发光的薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合，所述间距形成所述弯折部并通过切割形成。
优选地，在制备所述填充胶层的步骤中，还包括在所述第二衬底部的边缘上涂布边框胶，所述边框胶连接所述填充胶层，当所述柔性基板弯折并包覆所述OLED器件时，所述无机阻隔层、所述填充胶层以及所述边框胶共同包覆所述OLED器件，其中所述填充胶层以及所述边框胶形成在所述OLED器件的两边缘。
优选地，在弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合的步骤之后，还包括剥离所述玻璃衬底以及固化所述边框胶，当剥离所述玻璃衬底后，使所述玻璃衬底脱离所述柔性基板并曝露所述柔性基板，所述边框胶通过紫外光照射固化形成框胶，从而完成所述OLED基板的封装。
优选地，所述无机阻隔层的厚度介于100 nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
本发明又提供一种柔性OLED基板的封装方法，包括如下步骤：
提供玻璃衬底，所述玻璃衬底形成有彼此连接的第一衬底部以及第二衬底部；
在所述第一衬底部以及所述第二衬底部上提供柔性基板，并在所述柔性基板远离所述玻璃衬底的一表面上制备无机阻隔层；
在所述无机阻隔层对应所述第一衬底部上制备OLED器件，并在所述柔性基板对应所述第二衬底部上制备填充胶层；以及
弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合，使所述柔性基板通过所述填充胶层与所述OLED器件间隔开，并包覆所述OLED器件。
优选地，在提供所述玻璃衬底的步骤中，还包括在所述第一衬底部和所述第二衬底部之间形成一间距。
优选地，在制备所述柔性基板的步骤中，所述柔性基板还形成衬底、弯折部及覆盖部，所述衬底包括连接并驱动所述OLED器件发光的薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合，所述间距形成所述弯折部并通过切割形成。
优选地，在制备所述填充胶层的步骤中，还包括在所述第二衬底部的边缘上涂布边框胶，所述边框胶连接所述填充胶层，当所述柔性基板弯折并包覆所述OLED器件时，所述柔性基板通过所述填充胶层与所述OLED器件间隔开，所述无机阻隔层、所述填充胶层以及所述边框胶共同包覆所述OLED器件，其中所述填充胶层以及所述边框胶形成在所述OLED器件的两边缘。
优选地，在弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合的步骤之后，还包括剥离所述玻璃衬底以及固化所述边框胶，当剥离所述玻璃衬底后，使所述玻璃衬底脱离所述柔性基板并曝露所述柔性基板，所述边框胶通过紫外光照射固化形成框胶，从而完成所述OLED基板的封装。
优选地，所述无机阻隔层的厚度介于100 nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
 有益效果
本发明还具有以下功效，本发明的柔性基板本身具有无机阻隔层替代额外沉积的阻挡层(Barrier Layer)，简化了封装工艺。再者，在柔性基板的一侧制备OLED器件，另一侧涂布填充胶层及边框胶(Dam胶材)，然后通过弯折第一衬底部或第二衬底部将所述填充胶层及所述边框胶和OLED器件贴合，从而完成OLED基板的封装。由于在OLED基板面内设置有填充胶层以及在边缘处设置有边框胶都具有阻水性，加上柔性基板的无机阻隔层同样具有阻水性，可以起到多层且有效的封装作用，从而避免了OLED器件免受湿气和氧气的影响，提升封装效果并且提高OLED基板的使用寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明柔性OLED基板的横截面示意图；
图2是本发明柔性OLED基板的封装方法的第一横截面示意图；
图3是本发明柔性OLED基板的封装方法的第二横截面示意图；
图4是本发明柔性OLED基板的封装方法的第三横截面示意图；
图5是本发明柔性OLED基板的封装方法的第四横截面示意图；
图6是本发明柔性OLED基板的封装方法的第五横截面示意图；及
图7是本发明柔性OLED基板的封装方法的方块流程图。
 本发明的最佳实施方式
在具体实施方式中提及“实施例”意指结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的不同位置出现的相同用语并非必然被限制为相同的实施方式，而应当理解为与其它实施例互为独立的或备选的实施方式。在本发明提供的实施例所公开的技术方案启示下，本领域的普通技术人员应理解本发明所描述的实施例可具有其他符合本发明构思的技术方案结合或变化。
请参照图1所示，其为本发明柔性OLED基板的横截面示意图。如图所示，本发明提供一种柔性OLED基板100，包括柔性基板110、无机阻隔层120、OLED器件130以及填充胶层140。无机阻隔层120设置在所述柔性基板110上，OLED器件130设置在所述无机阻隔层120上，填充胶层140覆盖在所述OLED器件130以及所述无机阻隔层120上。
在如图1所示的实施例中，还包括在所述填充胶层140以及所述OLED器件130的边缘上设置边框胶150，所述边框胶150、所述填充胶层140和所述无机阻隔层120共同包覆所述OLED器件130。所述柔性基板110还包括衬底112、弯折部114及覆盖部116，所述衬底112设置有薄膜晶体管层(TFT)118，所述弯折部114连接所述衬底112与所述覆盖部116，且所述覆盖部116盖设所述填充胶层140并与所述衬底112对应贴合设置。
具体而言，OLED器件130通过所述无机阻隔层120、所述填充胶层140以及所述边框胶150共同包覆所述OLED器件130的四周，其中所述填充胶层140以及所述边框胶形成在所述OLED器件的两边缘，从而提升封装效果。此外，柔性基板110本身具有无机阻隔层120替代额外沉积的阻挡层(Barrier Layer)，可以简化封装工艺。本实施例的柔性基板110本身具备的材料(即无机阻隔层120)替代需要额外沉积的阻挡层，即简化了封装工艺。所述柔性基板110的材料例如是聚酰亚胺(PI)、PET等几种常见材料，在本实施例中并不局限于此。
所述无机阻隔层120的厚度介于100～5000nm之间，且构成材料包括氧化铝(Al xO x)、氧化钛(TiO x)、氧化铬(CrO x)、氮化硅(SiN x)、氮氧化硅(SiON x)、氧化硅(SiO x)的一种或者多种。
请一并参考图2至图7所示，本发明还提供一种柔性OLED基板100的封装方法，其特征在于，包括如下步骤：步骤S1，提供玻璃衬底200，所述玻璃衬底200形成有彼此连接的第一衬底部210以及第二衬底部220。步骤S2，在所述第一衬底部210以及所述第二衬底部220上提供柔性基板110，并在所述柔性基板110远离所述玻璃衬底200的一表面上制备无机阻隔层120。步骤S3，在所述无机阻隔层120对应所述第一衬底部210上制备OLED器件130，并在所述柔性基板110对应所述第二衬底部220上制备填充胶层140。步骤S4，弯折所述第一衬底部210与所述第二衬底部220压合或弯折所述第二衬底部220与所述第一衬底部210压合，使所述柔性基板110通过所述填充胶层140与所述OLED器件130间隔开，并包覆所述OLED器件130。
在提供所述玻璃衬底的步骤S1中，还包括在所述第一衬底部210和所述第二衬底部220之间形成一间距230，(以便将所述第一衬底部210弯折至第二衬底部220上或所述第二衬底部220弯折至第一衬底部210上)。在制备所述柔性基板的步骤S2中，所述柔性基板110还形成衬底112、弯折部114及覆盖部116，所述衬底112包括连接并驱动所述OLED器件130发光的薄膜晶体管层(TFT)118，所述弯折部114连接所述衬底112与所述覆盖部116，且所述覆盖部116盖设所述填充胶层140并与所述衬底112对应贴合。所述间距230形成所述弯折部114并通过切割或其他适合方式形成，在本实施例中并不限制。
在制备所述填充胶层S3的步骤中，还包括在所述第二衬底部220的边缘上涂布边框胶150，所述边框胶150连接所述填充胶层140。当所述柔性基板110弯折并包覆所述OLED器件130时，所述无机阻隔层120、所述填充胶层140以及所述边框胶150共同包覆所述OLED器件130，其中所述填充胶层140以及所述边框胶150形成在所述OLED器件130的两边缘。
在弯折所述第一衬底部210与所述第二衬底部220压合或弯折所述第二衬底部220与所述第一衬底部210压合的步骤S4之后，还包括剥离所述玻璃衬底200以及固化所述边框胶150。当剥离所述玻璃衬底200后，使所述玻璃衬底200脱离所述柔性基板110并曝露所述柔性基板110，所述边框胶150通过紫外光照射固化形成框胶，从而完成所述OLED基板100的封装。
须说明的是，所述无机阻隔层120的厚度介于100～5000nm之间，且构成材料包括氧化铝(Al xO x)、氧化钛(TiO x)、氧化铬(CrO x)、氮化硅(SiN x)、氮氧化硅(SiON x)、氧化硅(SiO x)的一种或者多种。
本实施例中的柔性基板110本身具有无机阻隔层120替代额外沉积的阻挡层(Barrier Layer)，简化了封装工艺。再者，在柔性基板110的一侧制备OLED器件130，另一侧涂布填充胶层140及边框胶150(Dam胶材)，然后通过弯折第一衬底部210或第二衬底部220将所述填充胶层140及所述边框胶150和OLED器件130贴合，从而完成OLED基板100的封装。由于在OLED基板100面内设置有填充胶层140以及在边缘处设置有边框胶150都具有阻水性，加上柔性基板110的无机阻隔层120同样具有阻水性，可以起到多层且有效的封装作用，从而避免了OLED器件130免受湿气和氧气的影响，提升封装效果并且提高OLED基板100的使用寿命。
综上所述，虽然本发明结合其具体实施例而被描述，应该理解的是，许多替代、修改及变化对于那些本领域的技术人员将是显而易见的。因此，其意在包含落入所附权利要求书的范围内的所有替代、修改及变化。

Claims (16)

  1. 一种柔性OLED基板，包括:
    柔性基板；
    无机阻隔层，设置在所述柔性基板上；
    OLED器件，设置在所述无机阻隔层上；以及
    填充胶层，覆盖在所述OLED器件以及所述无机阻隔层上，
    其中所述柔性基板还包括衬底、弯折部及覆盖部，所述衬底设置有薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合设置。
  2. 如权利要求1所述柔性OLED基板，其中还包括在所述填充胶层以及所述OLED器件的边缘上设置边框胶。
  3. 如权利要求2所述柔性OLED基板，其中所述边框胶、所述填充胶层和所述无机阻隔层共同包覆所述OLED器件。
  4. 如权利要求1所述柔性OLED基板，其中所述无机阻隔层的厚度介于100nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
  5. 一种柔性OLED基板的封装方法，包括如下步骤：
    提供玻璃衬底，所述玻璃衬底形成有彼此连接的第一衬底部以及第二衬底部；
    在所述第一衬底部以及所述第二衬底部上提供柔性基板，并在所述柔性基板远离所述玻璃衬底的一表面上制备无机阻隔层；
    在所述无机阻隔层对应所述第一衬底部上制备OLED器件，并在所述柔性基板对应所述第二衬底部上制备填充胶层；以及
    弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合，使所述柔性基板通过所述填充胶层与所述OLED器件间隔开，并包覆所述OLED器件。
  6. 如权利要求5所述柔性OLED基板的封装方法，其中在提供所述玻璃衬底的步骤中，还包括在所述第一衬底部和所述第二衬底部之间形成一间距。
  7. 如权利要求6所述柔性OLED基板的封装方法，其中在制备所述柔性基板的步骤中，所述柔性基板还形成衬底、弯折部及覆盖部，所述衬底包括连接并驱动所述OLED器件发光的薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合，所述间距形成所述弯折部并通过切割形成。
  8. 如权利要求5所述OLED封装基板的封装方法，其中在制备所述填充胶层的步骤中，还包括在所述第二衬底部的边缘上涂布边框胶，所述边框胶连接所述填充胶层，当所述柔性基板弯折并包覆所述OLED器件时，所述无机阻隔层、所述填充胶层以及所述边框胶共同包覆所述OLED器件，其中所述填充胶层以及所述边框胶形成在所述OLED器件的两边缘。
  9. 如权利要求8所述OLED封装基板的方法，其中在弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合的步骤之后，还包括剥离所述玻璃衬底以及固化所述边框胶，当剥离所述玻璃衬底后，使所述玻璃衬底脱离所述柔性基板并曝露所述柔性基板，所述边框胶通过紫外光照射固化形成框胶，从而完成所述OLED基板的封装。
  10. 如权利要求5所述OLED封装基板的方法，其中所述无机阻隔层的厚度介于100 nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
  11. 一种柔性OLED基板的封装方法，包括如下步骤：
    提供玻璃衬底，所述玻璃衬底形成有彼此连接的第一衬底部以及第二衬底部；
    在所述第一衬底部以及所述第二衬底部上提供柔性基板，并在所述柔性基板远离所述玻璃衬底的一表面上制备无机阻隔层；
    在所述无机阻隔层对应所述第一衬底部上制备OLED器件，并在所述柔性基板对应所述第二衬底部上制备填充胶层；以及
    弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合。
  12. 如权利要求11所述柔性OLED基板的封装方法，其中在提供所述玻璃衬底的步骤中，还包括在所述第一衬底部和所述第二衬底部之间形成一间距。
  13. 如权利要求12所述柔性OLED基板的封装方法，其中在制备所述柔性基板的步骤中，所述柔性基板还形成衬底、弯折部及覆盖部，所述衬底包括连接并驱动所述OLED器件发光的薄膜晶体管层，所述弯折部连接所述衬底与所述覆盖部，且所述覆盖部盖设所述填充胶层并与所述衬底对应贴合，所述间距形成所述弯折部并通过切割形成。
  14. 如权利要求11所述OLED封装基板的封装方法，其中在制备所述填充胶层的步骤中，还包括在所述第二衬底部的边缘上涂布边框胶，所述边框胶连接所述填充胶层，当所述柔性基板弯折并包覆所述OLED器件时，所述柔性基板通过所述填充胶层与所述OLED器件间隔开，所述无机阻隔层、所述填充胶层以及所述边框胶共同包覆所述OLED器件，其中所述填充胶层以及所述边框胶形成在所述OLED器件的两边缘。
  15. 如权利要求14所述OLED封装基板的方法，其中在弯折所述第一衬底部与所述第二衬底部压合或弯折所述第二衬底部与所述第一衬底部压合的步骤之后，还包括剥离所述玻璃衬底以及固化所述边框胶，当剥离所述玻璃衬底后，使所述玻璃衬底脱离所述柔性基板并曝露所述柔性基板，所述边框胶通过紫外光照射固化形成框胶，从而完成所述OLED基板的封装。
  16. 如权利要求11所述OLED封装基板的方法，其中所述无机阻隔层的厚度介于100 nm至5000nm之间，且构成材料包括氧化铝、氧化钛、氧化铬、氮化硅、氮氧化硅、氧化硅的一种或者多种。
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