WO2023102839A1 - 叠层发光单元及其制备方法和显示面板 - Google Patents

叠层发光单元及其制备方法和显示面板 Download PDF

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Publication number
WO2023102839A1
WO2023102839A1 PCT/CN2021/136839 CN2021136839W WO2023102839A1 WO 2023102839 A1 WO2023102839 A1 WO 2023102839A1 CN 2021136839 W CN2021136839 W CN 2021136839W WO 2023102839 A1 WO2023102839 A1 WO 2023102839A1
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Prior art keywords
light
emitting
electrode
emitting component
chip
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PCT/CN2021/136839
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English (en)
French (fr)
Inventor
樊勇
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厦门市芯颖显示科技有限公司
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Priority to PCT/CN2021/136839 priority Critical patent/WO2023102839A1/zh
Publication of WO2023102839A1 publication Critical patent/WO2023102839A1/zh
Priority to US18/398,436 priority patent/US20240130195A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/82—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/70—OLEDs integrated with inorganic light-emitting elements, e.g. with inorganic electroluminescent elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses

Definitions

  • the present application relates to the field of display technology, and in particular to a laminated light-emitting unit, a method for preparing a laminated light-emitting unit, and a display panel.
  • each light-emitting unit will become a sub-pixel.
  • each pixel includes R (red), G (green) and B (blue).
  • the light-emitting units of the colors correspond to the R/G/B three-color sub-pixels, and the full-color effect can be realized by controlling the light-emitting units corresponding to each sub-pixel, that is, each pixel in the existing RGB three-color display panel needs to be composed of three If it is a display panel with more colors such as four-color display, each pixel needs to be composed of more light points, and the area occupied by each pixel is also larger, and this The structure will have a large color shift in the narrow viewing angle application of the display panel.
  • embodiments of the present application provide a laminated light-emitting unit, a method for manufacturing a laminated light-emitting unit, and a display panel, which have the advantages of improved display resolution, narrow viewing angle display and Features such as low color cast.
  • an embodiment of the present application provides a laminated light emitting unit, comprising: a first light emitting component having opposite top and bottom surfaces, and a plurality of side surfaces located between the top surface and the bottom surface ; a second light emitting component, stacked on the top surface of the first light emitting component; a common electrode, disposed on the first side of the plurality of sides, electrically connected to the first light emitting component and the second light emitting component respectively
  • the negative electrode of the light-emitting component, the common electrode extends to the bottom surface;
  • the second electrode is arranged on the second side of the plurality of sides, the first side and the second side are respectively different sides, so
  • the second electrode is electrically connected to the anode of the second light-emitting component and is insulated from the first light-emitting component, and the second electrode extends to the bottom surface;
  • the first electrode is connected to the common electrode and the second electrode
  • the first electrodes are arranged at intervals, and the first electrodes are electrically connected to the an
  • the stacked light-emitting unit further includes: a third light-emitting component stacked on a side of the second light-emitting component away from the first light-emitting component; a third electrode, connected to the first light-emitting component An electrode, the second electrode, and the common electrode are arranged at intervals, and are arranged on a third side of the plurality of sides, and the third side is a different side from the first side; the third electrode Electrically connected to the anode of the third light emitting component, the third electrode is insulated from the first light emitting component and the second light emitting component, and extends to the bottom surface.
  • the common electrode is electrically connected to the negative electrode of the third light-emitting component; the first electrode and the second electrode are insulated from the third light-emitting component; the first electrode is arranged on the bottom surface.
  • both the first light-emitting component and the second light-emitting component are inorganic light-emitting structures, and the first electrode is arranged on the second side and extends to the bottom surface or is arranged on the the bottom surface; or, the second light-emitting component is an inorganic light-emitting structure, the first light-emitting component is an organic light-emitting structure, and the first electrode is disposed on the bottom surface.
  • the first light-emitting component, the second light-emitting component and the third light-emitting component are all inorganic light-emitting structures.
  • the second light-emitting component and the third light-emitting component are inorganic light-emitting structures, and the first light-emitting component is an organic light-emitting structure.
  • the first light emitting component is a red light emitting component
  • the second light emitting component is a green light emitting component
  • the third light emitting component is a blue light emitting component
  • the second electrode extends to the side adjacent to the second side and extends between the first light-emitting component and the second light-emitting component and the second light-emitting component.
  • the third electrode extends to the side adjacent to the third side and extends between the first light emitting component and the second light emitting component and the first light emitting component Between the second light-emitting component and the third light-emitting component.
  • the first electrode is electrically connected to the anode of the first light-emitting component through an ohmic contact material
  • the second electrode is electrically connected to the anode of the second light-emitting component through an ohmic contact material
  • the common electrode is electrically connected to the negative electrodes of the first light-emitting component and the second light-emitting component through an ohmic contact material.
  • another embodiment of the present application provides a method for manufacturing a stacked light-emitting unit, including: providing a plurality of light-emitting chips, each of which includes: a light-emitting component having opposite top and bottom surfaces, and a Multiple sides between the top surface and the bottom surface, the negative electrode is electrically connected to the negative electrode of the light-emitting component, and is arranged on the first side of the multiple sides of the light-emitting component; the positive electrode is electrically connected to the negative electrode of the light-emitting component.
  • the anode of the light-emitting component; the plurality of light-emitting chips include a first light-emitting chip and a second light-emitting chip, and the first light-emitting chip also includes a first connection electrode, which is arranged on the second side of the plurality of sides, and the The first side and the second side are different sides, the first connection electrode is insulated from the first light-emitting component of the first light-emitting chip, and the positive electrode of the first light-emitting chip extends to the first light-emitting the bottom surface of the chip;
  • the plurality of light-emitting chips further include a third light-emitting chip
  • the first light-emitting chip further includes a second connection electrode spaced apart from the first connection electrode, and the second connection electrode An electrode is insulated from the first light-emitting component of the first light-emitting chip and extends to the bottom surface of the first light-emitting chip
  • the second light-emitting chip further includes a third connection aligned with the second connection electrode electrode
  • the third connection electrode is insulated from the second light-emitting component of the second light-emitting chip
  • the preparation method of the laminated light-emitting unit further includes: stacking the third light-emitting chip on the second light-emitting unit On the side of the chip away from the first light-emitting chip, the second connection electrode, the third connection electrode and the positive electrode of the third light-emitting chip are sequentially stacked to form a third electrode, and the The negative electrode of the third light-emitting chip abuts
  • the first light-emitting chip is an organic light-emitting chip
  • the second light-emitting chip is an inorganic light-emitting chip
  • the method for preparing the laminated light-emitting unit includes: vapor-depositing the first Light-emitting chip: transferring and connecting the prepared second light-emitting chip to the top surface of the first light-emitting chip, so that the second light-emitting chip is stacked on the first light-emitting chip.
  • a display panel comprising: an array substrate; and the laminated light-emitting unit described in any one of the foregoing embodiments is disposed on the array substrate and electrically connected to the array substrate.
  • the display panel further includes a condensing lens, the condensing lens is arranged opposite to the array substrate, and the stacked light-emitting unit is located between the condensing lens and the array substrate. between them, corresponding to the condenser lens.
  • the above-mentioned embodiments of the present application can achieve one or more of the following beneficial effects: stacking multiple light-emitting components in sequence and forming a corresponding electrical connection relationship, so that multiple light-emitting components can emit light at the same position and can be independently controlled Light emitting, so the occupied area of the light emitting unit is reduced, high resolution display can be realized, and the effect of narrow light emission and low color shift can be realized.
  • FIG. 1 is a schematic bottom view of a laminated light-emitting unit provided by an embodiment of the present application.
  • Fig. 2 is 1-1 sectional view of Fig. 1;
  • Fig. 3 is the 2-2 sectional view of Fig. 1;
  • Fig. 4 is another embodiment of 1-1 sectional view of Fig. 1;
  • FIG. 5 is a schematic top view of a second light-emitting chip in an embodiment of the present application.
  • Fig. 6 is the 3-3 sectional view of Fig. 5;
  • Fig. 7 is a sectional view of 4-4 of Fig. 5;
  • FIG. 8 is a schematic bottom view of the first light-emitting chip in an embodiment of the present application.
  • Fig. 9 is a sectional view of 5-5 of Fig. 8;
  • FIG. 10 is a schematic top view of a third light-emitting chip in an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • 100 laminated light-emitting unit; 101: top surface; 102: bottom surface; 103: side surface; 1031: first side; 1032: second side; 1033: third side; 10: first light-emitting component; 20: second light-emitting component; 30: third light-emitting component; 40: common electrode; 50: first electrode; 60: second electrode; 70: third electrode; 200: light-emitting chip; 210: light-emitting component; 220: negative electrode; 230: positive Electrode; 240: first connection electrode; 250: second connection electrode; 260: third connection electrode;
  • 201 first light emitting chip
  • 202 second light emitting chip
  • 203 third light emitting chip
  • 300 display panel
  • 301 array substrate
  • 302 condenser lens
  • FIG. 1 it is a schematic bottom view of a laminated light emitting unit 100 provided by an embodiment of the present application.
  • FIG. 2 is a sectional view of 1-1 in FIG. 1
  • FIG. 3 is a sectional view of 2-2 in FIG. 1
  • a laminated light emitting unit 100 provided by an embodiment of the present application includes a first light emitting component 10 , a second light emitting component 20 , a common electrode 40 , a first electrode 50 and a second electrode 60 .
  • the first light emitting component 10 has a top surface 101 and a bottom surface 102 opposite to each other and a plurality of side surfaces 103 between the top surface 101 and the bottom surface 102 .
  • the second light-emitting component 20 is stacked on the top surface 101 of the first light-emitting component 10, and the common electrode 40 is arranged on the first side 1031 of the plurality of sides 103, respectively connecting and conducting the first light-emitting group 10 and the second light-emitting component 20. negative electrode.
  • the second electrode 60 is arranged on the second side 1032 of the plurality of sides 103.
  • the first side 1031 and the second side 1032 are different sides. Insulated, the second electrode 60 extends to the bottom surface 102 of the first light emitting component 10 .
  • the laminated light emitting unit 100 provided by this embodiment will be further described below with reference to FIG. 1 , FIG. 2 and FIG. 3 .
  • the first light-emitting group 10 is a hexahedral structure with four sides 103 .
  • the first side 1031 and the second side 1032 are two opposite sides.
  • the first side 1031 and the second side 1032 may be adjacent sides, for example, the first side 1031 is the right side 103, and the second side 1032 is the front or rear side 103, This embodiment is not limiting.
  • the first light-emitting component 10 and the second light-emitting component 20, for example, are used to emit light of different colors, including a light-emitting functional layer and an insulating protective layer surrounding the light-emitting functional layer. For example, in FIGS.
  • the unfilled part of the first light-emitting component 10 is The light-emitting functional layer, the part filled with a single slash is an insulating protective layer, through which the second electrode 60 can be insulated from the first light-emitting component 10, and the first electrode 50 can be insulated from the second light-emitting component 20 (the first electrode 50 is located at side 103), openings are provided on the insulating protection layer respectively corresponding to the anode and cathode positions of the first light-emitting component 10 and the second light-emitting component 20, so that the common electrode 40 can communicate with the first light-emitting component 10 and the second light-emitting component 20 through the opening.
  • the negative pole of the first electrode 50 is electrically connected to the positive pole of the first light-emitting component 10 and the second electrode 60 is connected to the positive pole of the second light-emitting component 20 .
  • the first light emitting component 10 can be, for example, an inorganic light emitting structure or an organic light emitting structure
  • the second light emitting component 20 is, for example, an inorganic light emitting structure.
  • the functional layer includes an N-doped semiconductor layer, a quantum well layer and a P-doped semiconductor layer stacked in sequence, wherein the P-doped semiconductor layer is the anode of the first light-emitting component 10, and the N-doped semiconductor layer is the first light-emitting component. 10's negative pole.
  • an ITO film layer is further disposed on the P-doped semiconductor layer and the N-doped semiconductor layer as an ohmic contact material to form an ohmic contact connection.
  • the first light-emitting component 10 is, for example, an organic light-emitting structure
  • its light-emitting functional layer includes a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) and Electron injection layer (EIL), wherein the hole injection layer is the positive pole of the first light emitting component 10, and the electron injection layer is the negative pole of the first light emitting component 10.
  • HIL hole injection layer
  • HTL hole transport layer
  • EML emission layer
  • ETL electron transport layer
  • EIL Electron injection layer
  • the hole injection layer is the positive pole of the first light emitting component 10
  • the electron injection layer is the negative pole of the first light emitting component 10.
  • FIG. 4 the first light emitting component 10 is an organic light emitting structure 1-1 sectional view
  • FIG. 2 is a 1-1 sectional schematic diagram of the first light-emitting component 10 having an inorganic light-emitting structure
  • the first light-emitting component 10 is a
  • the common electrode 40, the first electrode 50 and the second electrode 60 can be common metal electrode materials such as Ni (nickel), Pt (platinum), Au (gold), and can be a single layer or a multilayer. not limited.
  • the first electrode 50 may be located on the bottom surface 102 of the first light emitting component 10 as shown in FIG. 2 and FIG. 3 , or may be located on the side surface 103 (not shown), which is not limited in this embodiment.
  • the structure shown in Fig. 2 and Fig. 3 is a three-layer stacked structure, and the first light-emitting component 10 and the second light-emitting component 20 of this embodiment are respectively the first layer and the second layer of the three-layer stacked structure from bottom to top.
  • the first light-emitting component 10 and the second light-emitting component 20 can refer to the second layer and the third layer of the three-layer stacked structure shown in FIG. 3 from bottom to top, and this embodiment does not not limited.
  • this embodiment does not limit the number of laminated layers of the laminated light emitting unit 100 , which may also include three laminated layers as shown in FIG. 2 and FIG. 3 , or even more laminated layers such as four layers.
  • the common electrode 40 , the first electrode 50 and the second electrode 60 all extend to the bottom surface 102 of the first light-emitting component 10 , which facilitates welding of the laminated light-emitting unit 100 .
  • the first light-emitting component 10 and the second light-emitting component 20 are used to emit light of different colors, for example, the first light-emitting component 10 emits red light, and the second light-emitting Component 20 glows green.
  • the laminated light-emitting unit 100 of this embodiment is working, the common electrode 40 and the first electrode 50 can be energized, and the second electrode 60 is not energized, then the first light-emitting component 10 is energized to emit red light, and the second light-emitting component 20 does not emit light.
  • the laminated light emitting unit 100 can emit red light.
  • the common electrode 40 and the second electrode 60 are energized and the first electrode 50 is not energized, then the first light-emitting component 10 does not emit light, the second light-emitting component 20 emits green light, and the laminated light-emitting unit 100 emits green light.
  • the first electrode 50 and the second electrode 60 are energized with the common electrode 40, then the red light emitted by the first light-emitting component 10 and the green light emitted by the second light-emitting component 20 are mixed so that the laminated light-emitting unit 100 emits a mixture of red and green. Light.
  • the above is just an example, and this embodiment does not limit the specific light-emitting colors of the first light-emitting component 10 and the second light-emitting component 20 .
  • the first light-emitting component 10 and the second light-emitting component 20 are laminated, and the first light-emitting component 10 and the second light-emitting component 20 can be energized and emit light independently, so that each laminated light-emitting unit 100 can realize multiple
  • This light-emitting method can reduce the area occupied by each chip on the display panel compared with the traditional light-emitting structure, which is conducive to the realization of high-resolution display.
  • the stacked light emitting unit 100 further includes, for example, a third light emitting component 30 and a third electrode 70 , and the third light emitting component 30 is stacked on a side of the second light emitting component 20 away from the first light emitting component 10 .
  • the third electrode 70 is arranged at intervals from the first electrode 50 , the second electrode 60 and the common electrode 40 , and is arranged on the third side 1033 among the plurality of sides 103 .
  • the third side 1033 is a different side from the first side 1031 .
  • the third electrode 70 is electrically connected to the positive pole of the third light emitting component 30
  • the common electrode 40 is connected to the negative pole of the third light emitting component 30 .
  • the third electrode 70 is insulated from the first light emitting component 10 and the second light emitting component 20 and extends to the bottom surface 102 of the first light emitting component 10 .
  • the third side 1033 and the second side 1032 can be the same side or different sides, for example, as shown in FIG. 2 and FIG. On the side, referring to the orientation of FIG. 1 , the second electrode 60 is located in the lower left corner of FIG. 1 , for example, and the third electrode 70 is located in the upper left corner of FIG. 1 .
  • the first side 1031 may be the right side of the first light emitting assembly 10
  • the second side 1032 may be the front side of the first light emitting assembly 10
  • the third side 1033 may be the first light emitting
  • the side of the rear side of the component 10 is not limited by this embodiment.
  • the first electrode 50 is, for example, disposed on the bottom surface 102 of the first light-emitting component 10 , of course, it can also be disposed on a side different from the first side 1031 , as long as it is spaced apart from the second electrode 60 and the third electrode 70 .
  • the third light-emitting component 70 is, for example, an inorganic light-emitting structure
  • the first light-emitting component 10 and the second light-emitting component 20 are inorganic light-emitting structures.
  • the two light-emitting components 20 emit light of different colors.
  • the first light-emitting component 10, the second light-emitting component 20 and the third light-emitting component 70 respectively emit one of red light, blue light and green light, Of course other color combinations are also possible.
  • the red inorganic light-emitting structure generally adopts gallium arsenide semiconductor, the light transmittance is poor, so in the RGB combination, it is preferable that the first light-emitting component 10 is a red light-emitting component, the second light-emitting component 20 is a green light-emitting component, and the third light-emitting component 70 is a blue light-emitting component. color light-emitting components to ensure the light emission effect of the laminated light-emitting unit 100.
  • the stacked light-emitting unit 100 of this embodiment to a display panel with RGB three-color display, only one stacked light-emitting unit 100 needs to be installed corresponding to the original three RGB sub-pixel lamp positions, which is equivalent to reducing the area occupied by each pixel position to About one-third of the original, the resolution is increased accordingly, which is conducive to the realization of high-resolution display.
  • the RGB three-color light in each pixel is emitted from the same light point position, which is beneficial to improve the color shift phenomenon caused by the RGB three-color light emitting from different positions in the existing display.
  • This embodiment can also be referred to when the laminated light emitting unit 100 provided in the present application has a laminated structure of four or more layers.
  • the second electrode 60 extends to the side 103 adjacent to the second side 1032 , and extends to the first light emitting component 10 and the second light emitting component 20 Between, and between the second light emitting component 20 and the third light emitting component 30 , it can also extend to a side of the third light emitting component 30 away from the second light emitting component 20 .
  • the third electrode 70 extends to the side adjacent to the third side 1033 , and extends between the first light emitting component 10 and the second light emitting component 20 and between the second light emitting component 20 and the third light emitting component 30 .
  • the common electrode 40 also extends between the first light emitting component 10 and the second light emitting component 20 and between the second light emitting component 20 and the third light emitting component 30 .
  • the second side 1032 is, for example, the side 103 on the left side of the first light-emitting component 10 (lower left in FIG. 1 ), and the second electrode 60 also extends to the side 103 adjacent to the left side (for example, the upper side in FIG. 1 , corresponding to FIG. 2 ).
  • the third side 1033 is, for example, the side 103 on the left side of the first light-emitting component 10 (upper left in FIG. 1 ), and the third electrode 70 also extends to the side 103 adjacent to the left side (the lower side in FIG. later).
  • the areas of the common electrode 40 , the second electrode 60 and the third electrode 70 can be increased, and the conduction effect is better. It should be noted that, for example, when the first electrode 50 is also arranged on the side surface 103 , it can be extended in a manner similar to that of the second electrode 60 or the third electrode 70 , which will not be repeated in this embodiment.
  • the second embodiment of the present application provides a method for preparing a laminated light-emitting unit, for example, including:
  • Step S1 Provide a plurality of light-emitting chips; for example, the light-emitting chips 200 shown in FIG. 5 or FIG.
  • the light emitting component 210 has an opposite top surface 101 and a bottom surface 102 , and a plurality of side surfaces 103 located between the top surface 101 and the bottom surface 102 .
  • the negative electrode 220 is electrically connected to the negative electrode of the light emitting component 210 and is disposed on the first side 1031 of the plurality of sides 103 .
  • the positive electrode 230 is electrically connected to the positive electrode of the light emitting component 210 .
  • the plurality of light-emitting chips 200 include a first light-emitting chip 201 and a second light-emitting chip 202, the first light-emitting chip 201 further includes a first connection electrode 240, and the first connection electrode 240 is arranged on the second side 1032 of the plurality of sides 103, The second side 1032 and the first side 1031 are different sides, the first connection electrode 240 is insulated from the first light-emitting component 10 of the first light-emitting chip 201, and the positive electrode 230 of the first light-emitting chip 201 extends to the bottom of the first light-emitting chip 201. the bottom surface 102 of the first light-emitting component 10;
  • Step S2 Stack the second light-emitting chip 202 on the top surface 101 of the first light-emitting chip 201, make the negative electrode 220 of the first light-emitting chip 201 and the negative electrode 220 of the second light-emitting chip 202 abut and electrically connect to form a common electrode 40 , and making the positive electrode 230 of the second light emitting chip 202 abut and electrically connect with the first connection electrode 240 of the first light emitting chip 201 to form the second electrode 60 .
  • FIG. 8 is a schematic bottom view of the first light-emitting chip 201 provided by an embodiment of the present application.
  • FIG. 9 is a cross-sectional view of 5-5 (or a cross-sectional view of 6-6) in FIG. 6 is a sectional view of 3-3 in FIG. 5
  • FIG. 7 is a sectional view of 4-4 in FIG. 5 .
  • the positive electrode 230 of the first light-emitting chip 201 is, for example, disposed on the bottom surface 102 of the first light-emitting component 10
  • the positive electrode 230 of the second light-emitting chip 202 is, for example, disposed on the second side 1032.
  • the positive electrode 230 of the first light-emitting chip 201 can also be disposed on the side surface 103 , for example.
  • the preparation method of the laminated light-emitting unit provided in this embodiment can be used to prepare the laminated light-emitting unit 100 as described in the first embodiment.
  • the first light-emitting component 10 the second light-emitting component 20, the common electrode 40, the second The description of the electrode 60 can refer to the description in the first embodiment, which will not be repeated here.
  • the positive electrode 230 of the first light-emitting chip 201 is, for example, set on the bottom surface 102 of the first light-emitting component 10, then the second The positive electrode 230 of a light emitting chip 201 is equivalent to the first electrode 50 in the laminated light emitting unit 100 .
  • the positive electrode 230 of the first light-emitting chip 201 is disposed on the side surface 103 of the first light-emitting component 10, it can form the first electrode 50 of the stacked light-emitting unit 100 together with the corresponding electrode material on the second light-emitting chip 202.
  • the first electrode 50 is insulated from the second light emitting component 20 .
  • the plurality of light emitting chips 200 further include a third light emitting chip 203
  • the first light emitting chip 201 further includes a second connection electrode 250 spaced apart from the first connection electrode 240, and the second connection electrode 250 Insulated from the first light-emitting component 10 of the first light-emitting chip 201, and extending to the bottom surface 102 of the first light-emitting chip 201
  • the second light-emitting chip 202 further includes a third connection electrode 260 aligned with the second connection electrode 250
  • the third The connecting electrode 260 is insulated from the second light-emitting component 20 of the second light-emitting chip 202
  • the method for preparing the laminated light-emitting unit further includes step S3: stacking the third light-emitting chip 203 on one side of the second light-emitting chip 202 away from the first light-emitting chip 201 On the side, the second connection electrode 250, the third connection electrode 260, and the positive electrode 230
  • the negative electrode 220 of 202 abuts and is electrically connected.
  • FIG. 10 which is a schematic top view of the third light-emitting chip 203 in an embodiment of the present application, it can be seen that its positive electrode 230 is aligned with the third connection electrode 260 in the second light-emitting chip 202 .
  • the first light-emitting chip 201 can be an organic light-emitting chip such as an OLED chip, or an inorganic light-emitting chip such as a Micro-LED chip
  • the second light-emitting chip 202 and the third light-emitting chip 203 are, for example, Inorganic light-emitting chip
  • the preparation method of the laminated light-emitting unit includes:
  • Step S11 evaporating the first light-emitting chip on the substrate
  • Step S21 Transfer and connect the prepared second light-emitting chip to the top surface of the first light-emitting chip, so that the second light-emitting chip is stacked on the first light-emitting chip.
  • step S31 may also be included: transferring and connecting the prepared third light-emitting chip to the top surface of the second light-emitting chip away from the first light-emitting chip, so that the third light-emitting chip is stacked on the second light-emitting chip.
  • the substrate in step S11 is, for example, an array substrate of a display panel, on which a driving circuit layer for driving the stacked light-emitting units to emit light is arranged.
  • the hole injection layer (HIL), hole transport layer (HTL), light emitting layer (EML), electron transport layer (ETL) and electron injection layer (EIL) can be formed sequentially by evaporation process.
  • the second embodiment of the present application can be used to prepare the laminated light-emitting unit 100 as described in the first embodiment, which has the same beneficial effects as the first embodiment, and the process is simple.
  • the present application provides a display panel 300, including an array substrate 301 and a laminated light-emitting unit 100.
  • the laminated light-emitting unit 100 can be any one of the above-mentioned first embodiments, and is arranged on the array substrate 301 and electrically The array substrate 301 is connected.
  • a driving circuit layer for driving the laminated light-emitting unit 100 is provided on the array substrate 301.
  • the driving circuit layer may include, for example, wiring (such as a data line, a scanning line), a TFT (Thin Film Transistor) thin film transistor, and a capacitor, etc. element. Referring to FIG. 11 , it shows three stacked light emitting units 100 disposed on the base substrate 301 .
  • this embodiment is only for illustration and does not limit the number of stacked light emitting units 100 .
  • the installation direction is such that the first light-emitting component 10 is adjacent to the array substrate 301, and the second light-emitting component 10 is located on the side of the first light-emitting component 10 away from the array substrate 301.
  • the part of the light emitting unit 100 extending to the bottom surface 102 of the first light emitting component 10 through the common electrode 40, the first electrode 50 and the second electrode 60 is respectively electrically connected to the driving circuit layer on the array substrate 301, such as the first electrode 50 and the second electrode 60 They are respectively electrically connected to different TFT thin film transistors, and the common electrode 40 is connected to the common electrode on the driving circuit layer, so as to control and drive the first light-emitting component 10 and the second light-emitting component 20 respectively.
  • the laminated light emitting unit 100 also has the third light emitting component 30 and the third electrode 70
  • the part of the third electrode 70 extending to the bottom surface 102 of the first light emitting component 10 is electrically connected to another different TFT on the driving circuit layer on the array substrate 301
  • the thin film transistors are used to control and drive the first light-emitting component 10 , the second light-emitting component 20 and the third light-emitting component 30 respectively.
  • the first light-emitting component 10 is a red light-emitting component
  • the second light-emitting component 20 is a green light-emitting component
  • the third light-emitting component 30 is a blue light-emitting component, so that the corresponding display
  • the position of each laminated light-emitting unit 100 on the panel 300 can realize red light, green light, blue light, red-green mixed light, blue-green mixed light, red-blue mixed light, white light, etc. by independently controlling different light-emitting components to emit light. color effect.
  • each pixel position of the existing RGB display panel three light points R, G, and B need to be set, but the display panel 300 provided in this embodiment only needs to set one laminated light-emitting unit 100 at each pixel position to realize full RGB lighting.
  • Color effect the area occupied by the light point at each pixel position is about one-third of the original area, which can achieve higher resolution display.
  • the structure of each pixel position of the existing RGB display panel emits three colors of light from three positions, and the mixing effect of the three colors of light is different under different viewing angles (left, right, or centered), and the color shift is relatively large.
  • the three colors of light are emitted from the same position, which can greatly reduce the color shift.
  • the embodiment of the present application does not limit the number of layers of the laminated light emitting unit 100 , and a larger number of layers can also achieve a smaller occupied area and higher resolution.
  • the display panel 300 further includes a condenser lens 302. As shown in FIG. It is disposed between the array substrate 301 and corresponding to the condenser lens 302 .
  • the positions of the three laminated light emitting units 100 shown in FIG. 11 correspond to a condenser lens 302 respectively, and the light emitting angle of the laminated light emitting unit 100 can be further limited by the condenser lens 302 to achieve a narrow light emitting effect.
  • the third embodiment of the present application adopts the laminated light-emitting unit 100 provided by the first embodiment, which has at least the same beneficial effects as the first embodiment, and will not be repeated here.

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Abstract

本申请实施例公开的一种叠层发光单元，包括：第一发光组件，具有相对的顶面和底面，以及位于顶面和底面之间的多个侧面；第二发光组件，堆叠于第一发光组件的顶面；共电极，设置在多个侧面中的第一侧面，分别电连接第一发光组件和第二发光组件的负极，共电极延伸至底面；第二电极，设置在多个侧面中的第二侧面，第一侧面和第二侧面分别为不同的侧面，第二电极电连接第二发光组件的正极且与第一发光组件绝缘，第二电极延伸至底面；第一电极，与共电极和第二电极间隔设置，第一电极电连接第一发光组件的正极且与第二发光组件绝缘。本申请公开的叠层发光单元具有提高显示分辨率、窄视角显示和低色偏等特点。

Description

叠层发光单元及其制备方法和显示面板 技术领域
本申请涉及显示技术领域，尤其涉及一种叠层发光单元、一种叠层发光单元制备方法和一种显示面板。
背景技术
由于具有自发光无需背光源的特性，越来越多的显示面板选择采用例如Micro-LED(Micro Light-Emitting Diode,微米发光二极管)显示和OLED(Organic Light-Emitting Diode,有机发光二极管)显示等新型显示技术。这类显示技术中每一个发光单元都会变成一个子像素点，现有的例如RGB彩色显示面板中，每个像素点中包括R(红色)、G(绿色)和B(蓝色)三种颜色的发光单元，分别对应R/G/B三色子像素，通过控制各个子像素对应的发光单元可实现全彩效果，即现有的RGB三色显示面板中每个像素点需要由三个灯点(发光单元)组成，如果是四色显示等更多颜色的显示面板，则每个像素点需要由更多的灯点组成，每个像素点所占用的面积也较大，并且这种结构在显示面板的窄视角应用中会存在较大的色偏。
因此，亟需提供一种新的显示面板，以改善现有显示面板的显示效果。
发明内容
因此，为克服现有技术中的至少部分缺陷，本申请实施例提供了一种叠层发光单元、一种叠层发光单元制备方法和一种显示面板，具有提高显示分辨率、窄视角显示和低色偏等特点。
具体地，一方面，本申请一个实施例提供一种叠层发光单元，包括：第一发光组件，具有相对的顶面和底面，以及位于所述顶面和所述底面之间的多个侧面；第二发光组件，堆叠于所述第一发光组件的所述顶面；共电极，设置在所述多个侧面中的第一侧面，分别电连接所述第一发光组件和所述第二发光组件的负极，所述共电极延伸至所述底面；第二电极，设置在所述多个侧面中的第二侧面，所述第一侧面和所述第二侧面分别为不同的侧面，所述第二电极电连接所述第二发光组件的正极且与所述第一发光组件绝缘，所述第二电极延伸至所述底面；第一电极，与所述共电极和所述第二电极间隔设置，所述第一电极电连接所述第一发光组件的正极且与所述第二发光组件绝缘。
在本申请的一个实施例中，所述叠层发光单元还包括：第三发光组件，堆叠于所述第二发光组件远离所述第一发光组件的一侧；第三电极，与所述第一电极、所述第二电极和所述共电极间隔设置，设置在所述多个侧面中的第三侧面，所述第三侧面与所述第一侧面为不同的侧面；所述第三电极电连接所述第三发光组件的正极，所述第三电极与所述第一发光组件和所述第二发光组件绝缘，且延伸至所述底面。所述共电极电连接所述第三发光组件的负极；所述第一电极和所述第二电极与所述第三发光组件绝缘；所述第一电极设置在所述底面上。
在本申请的一个实施例中，所述第一发光组件和所述第二发光组件均为无机发光结构，所述第一电极设置在所述第二侧面且延伸至所述底面或设置在所述底面；或者，所述第二发光组件为无机发光结构，所述第一发光组件为有机发光结构，所述第一电极设置在所述底面。
在本申请的一个实施例中，所述第一发光组件、所述第二发光组件和所述第三发光组件均为无机发光结构。
在本申请的一个实施例中，所述第二发光组件和所述第三发光组件为无机发光结构，所述第一发光组件为有机发光结构。
在本申请的一个实施例中，所述第一发光组件为红色发光组件、所述第二发光组件为绿色发光组件，所述第三发光组件为蓝色发光组件。
在本申请的一个实施例中，所述第二电极延伸至与所述第二侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间；所述第三电极延伸至与所述第三侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间。
在本申请的一个实施例中，所述第一电极通过欧姆接触材料与所述第一发光组件的正极电连接，所述第二电极通过欧姆接触材料与所述第二发光组件的正极电连接，所述共电极通过欧姆接触材料与所述第一发光组件和所述第二发光组件的负极电连接。
另一方面，本申请另一个实施例提供一种叠层发光单元制备方法，包括：提供多个发光芯片，每个所述发光芯片分别包括：发光组件，具有相对的顶面和底面，以及位于所述顶面和所述底面之间的多个侧面，负电极，电连接所述发光组件的负极，设置在所述发光组件的多个侧面中的第一侧面；正电极，电连接所述发光组件的正极；所述多个发光芯片包括第一发光芯片和第二发光芯片，所述第一发光芯片还包括第一连接电极，设置在所述多个侧面中的第二侧面，所述第一侧面和所述第二侧面为不同的侧面，所述第一连接电极与所述第一发光芯片的第一发光组件绝缘，所述第一发光芯片的正电极延伸至所述第一发光芯片的底面；
将所述第二发光芯片堆叠于所述第一发光芯片的所述顶面上，使所述第一发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接，形成共电极；以及使所述第二发光芯片的所述正电极与所述第一发光芯片的所述第一连接电极抵接并电连接，形成第二电极。
在本申请的一个实施例中，所述多个发光芯片还包括第三发光芯片，所述第一发光芯片还包括与所述第一连接电极间隔设置的第二连接电极，所述第二连接电极与所述第一发光芯片的所述第一发光组件绝缘且延伸至所述第一发光芯片的所述底面，所述第二发光芯片还包括与所述第二连接电极对齐的第三连接电极，所述第三连接电极与所述第二发光芯片的所述第二发光组件绝缘，所述叠层发光单元的制备方法还包括：将所述第三发光芯片堆叠于所述第二发光芯片远离所述第一发光芯片的一侧，使所述第二连接电极、所述第三连接电极与所述第三发光芯 片的所述正电极依次叠层，形成第三电极，且使所述第三发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接。
在本申请的一个实施例中，所述第一发光芯片为有机发光芯片，所述第二发光芯片为无机发光芯片，所述叠层发光单元制备方法包括：在基板上蒸镀所述第一发光芯片；将制备好的第二发光芯片转移并连接至所述第一发光芯片的所述顶面上，以使所述第二发光芯片堆叠于所述第一发光芯片。
另一方面，本申请另一个实施例提供一种显示面板，包括：阵列基板；前述任一实施例所述的叠层发光单元，设置在所述阵列基板上，且电连接所述阵列基板。
在本申请的一个实施例中，所述显示面板还包括聚光透镜，所述聚光透镜与所述阵列基板相对设置，且所述叠层发光单元位于所述聚光透镜和所述阵列基板之间、与所述聚光透镜对应设置。
由上可知，本申请上述实施例可以达成以下一个或多个有益效果：将多个发光组件依次堆叠，并形成对应的电连接关系，使得多个发光组件可以位于同位置发光，且能独立控制发光，因此减少了发光单元的占用面积，可实现高分辨率显示，且能实现窄发光低色偏的效果。
通过以下参考附图的详细说明，本申请的其它方面和特征变得明显。但是应当知道，该附图仅仅为解释的目的设计，而不是作为本申请的范围的限定。还应当知道，除非另外指出，不必要依比例绘制附图，它们仅仅力图概念地说明此处描述的结构和流程。
附图说明
下面将结合附图，对本申请的具体实施方式进行详细的说明。
图1为本申请一个实施例提供的一种叠层发光单元的仰视结构示意图。
图2为图1的1-1剖面图；
图3为图1的2-2剖面图；
图4为图1的1-1剖面图的另一种实施例；
图5为本申请一个实施例中第二发光芯片的俯视结构示意图；
图6为图5的3-3剖面图；
图7为图5的4-4剖面图；
图8为本申请一个实施例中第一发光芯片的仰视结构示意图；
图9为图8的5-5剖面图；
图10为本申请一个实施例中第三发光芯片的俯视结构示意图；
图11为本申请一个实施例提供的一种显示面板的结构示意图。
【附图标记说明】
100：叠层发光单元；101：顶面；102：底面；103：侧面；1031：第一侧面；1032：第二侧 面；1033：第三侧面；10：第一发光组件；20：第二发光组件；30：第三发光组件；40：共电极；50：第一电极；60：第二电极；70：第三电极；200：发光芯片；210：发光组件；220：负电极；230：正电极；240：第一连接电极；250：第二连接电极；260：第三连接电极；
201：第一发光芯片；202：第二发光芯片；203：第三发光芯片；300：显示面板；301：阵列基板；302：聚光透镜。
具体实施方式
为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。
为了使本领域普通技术人员更好地理解本申请的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本申请保护的范围。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应当理解这样使用的术语在适当情况下可以互换，以便这里描述的本申请实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其他步骤或单元。
还需要说明的是，本申请中多个实施例的划分仅是为了描述的方便，不应构成特别的限定，各种实施例中的特征在不矛盾的情况下可以相结合，相互引用。
【第一实施例】
如图1所示，其为本申请一个实施例提供的一种叠层发光单元100的仰视结构示意图，图2为图1的1-1剖面图，图3为图1的2-2剖面图，本申请一个实施例提供的一种叠层发光单元100包括第一发光组件10、第二发光组件20、共电极40、第一电极50和第二电极60。第一发光组件10具有相对的顶面101和底面102以及位于顶面101和底面102之间的多个侧面103。第二发光组件20堆叠于第一发光组件10的顶面101上，共电极40设置在多个侧面103的第一侧面1031，分别连接并导通第一发光组10和第二发光组件20的负极。第二电极60设置在多个侧面103的第二侧面1032，第一侧面1031和第二侧面1032为不同的侧面，第二电极60电连接第二发光组件20的正极且与第一发光组件10绝缘，第二电极60延伸至第一发光组件10的底面102。以下参照图1、图2和图3对本实施例提供的叠层发光单元100进行进一步的描述。
例如参照图1、图2和图3，第一发光组10件为六面体结构，具有四个侧面103，例如参照图2第一侧面1031为第一发光组件10右边的侧面103，第二侧面1032为第一发光组件10左边的侧面103，第一侧面1031和第二侧面1032为相对的两个侧面。当然在另一些实施例中，第一侧面1031和第二侧面1032例如可以是相邻的侧面，具体的例如第一侧面1031为右边的侧面103，第二侧面1032为前面或后面的侧面103，本实施例并不限制。
第一发光组件10和第二发光组件20例如用于发出不同颜色的光，包括发光功能层和包围发光功能层的绝缘保护层，例如图2、图3中第一发光组件10无填充部分为发光功能层，单斜线填充部分为绝缘保护层，通过绝缘保护层可以实现第二电极60和第一发光组件10绝缘，以及第一电极50和第二发光组件20绝缘(第一电极50位于侧面103时)，绝缘保护层上分别对应第一发光组件10和第二发光组件20的正极和负极位置设置有开口，使得共电极40通过开口实现与第一发光组件10和第二发光组件20的负极电连接、第一电极50与第一发光组件10的正极连接和第二电极60与第二发光组件20的正极连接。其中第一发光组件10例如可以是无机发光结构也可以是有机发光结构，第二发光组件20例如为无机发光结构，第一发光组件10或第二发光组件20例如为无机发光结构时，其发光功能层包括依次叠层的N掺杂半导体层、量子阱层和P掺杂半导体层，其中P掺杂半导体层即为第一发光组件10的正极，N掺杂半导体层即为第一发光组件10的负极。P掺杂半导体层和N掺杂半导体层上例如还设置有ITO膜层作为欧姆接触材料以形成欧姆接触连接。第一发光组件10例如为有机发光结构时，其发光功能层包括依次叠层的空穴注入层(HIL)、空穴传输层(HTL)、发光层(EML)、电子传输层(ETL)和电子注入层(EIL)，其中空穴注入层则为第一发光组件10的正极，电子注入层则为第一发光组件10的负极，参照图4，其为第一发光组件10为有机发光结构时1-1剖面图，图2为第一发光组件10为无机发光结构的1-1剖面示意图，第一发光组件10为倒装结构。当然此处为对第一发光组件10结构的一些举例说明，并不能作为理解本实施例的限制条件。
共电极40、第一电极50和第二电极60例如可以为Ni(镍)、Pt(铂)、Au(金)等常用金属电极材料，可以是单层也可以是多层，本实施例并不限制。第一电极50例如可以是如图2和图3所示的位于第一发光组件10的底面102，也可以位于侧面103(未示出)，本实施例并不限制。例如图2和图3所示的结构为三层叠层的结构，本实施例的第一发光组件10和第二发光组件20分别为该三层叠层结构从下至上的第一层和第二层，当然，在本申请的其他实施例中，第一发光组件10和第二发光组件20可以参考图3所示该三层叠层结构从下至上的第二层和第三层，本实施例并不限制。当然本实施例也不限制叠层发光单元100的叠层数量，其还可以包括如图2、图3所示的三层叠层，甚至四层等更多叠层。共电极40、第一电极50和第二电极60均延伸至第一发光组件10的底面102，有利于叠层发光单元100的焊接。
本实施例提供的叠层发光单元100中，第一发光组件10和第二发光组件20例如用于发出 不同颜色的光，举例而言，例如第一发光组件10例如发红光，第二发光组件20发绿光。本实施例的叠层发光单元100工作时，可以使共电极40和第一电极50通电，第二电极60不通电，则第一发光组件10通电发出红光，第二发光组件20不发光，叠层发光单元100可发出红光。或者，使共电极40和第二电极60通电，第一电极50不通电，则第一发光组件10不发光，第二发光组件20发出绿光，叠层发光单元100发绿光。再或者使第一电极50和第二电极60都与共电极40通电，则第一发光组件10发出的红光和第二发光组件20发出的绿光混合使得叠层发光单元100发出红绿混合的光。当然以上只是举例说明，本实施例并不限制第一发光组件10和第二发光组件20的具体发光颜色。本实施例通过将第一发光组件10和第二发光组件20叠层的结构，且第一发光组件10和第二发光组件20可单独通电发光，使得每一个叠层发光单元100均能实现多种发光方式，相比于传统发光结构而言可缩小每个芯片在显示面板上占用的面积，有利于实现高分辨率显示。
进一步的，在一个实施例中，叠层发光单元100例如还包括第三发光组件30和第三电极70，第三发光组件30堆叠于第二发光组件20远离第一发光组件10的一侧。第三电极70与第一电极50、第二电极60和共电极40均间隔设置，设置在多个侧面103中的第三侧面1033，第三侧面1033与第一侧面1031为不同的侧面。第三电极70电连接第三发光组件30的正极，共电极40连接第三发光组件30的负极。第三电极70与第一发光组件10和第二发光组件20绝缘且延伸至第一发光组件10的底面102。第三侧面1033与第二侧面1032可以是相同的侧面也可以是不同的侧面，例如如图2和图3所示，第三侧面1033与第二侧面1032同为第一发光组件10的左边的侧面，参照图1的方位，第二电极60例如位于图1的左下角，第三电极70例如位于图1的左上角。在本申请其他的一些实施例中，也可以是例如第一侧面1031为第一发光组件10右边的侧面，第二侧面1032为第一发光组件10前边的侧面，第三侧面1033为第一发光组件10后边的侧面，本实施例并不限制。第一电极50例如设置在第一发光组件10的底面102，当然也还可以设置在与第一侧面1031不同的侧面，只需要满足与第二电极60和第三电极70间隔设置即可。其中第三发光组件70例如为无机发光结构，可参考上述第一发光组件10和第二发光组件20为无机发光结构的描述，第三发光组件70例如用于发出与第一发光组件10、第二发光组件20不同颜色的光。具体的，例如应用于RGB三色全彩显示面板中时，第一发光组件10、第二发光组件20和第三发光组件70三者各自对应发出红光、蓝光和绿光中的一种，当然也可以是其他颜色组合。由于红色无机发光结构一般采用砷化镓半导体，透光性较差，因此RGB组合中优选第一发光组件10为红色发光组件、第二发光组件20为绿色发光组件，第三发光组件70为蓝色发光组件，以保证叠层发光单元100的光出射效果。将本实施例的叠层发光单元100应用于RGB三色显示的显示面板中，对应原来RGB三个子像素灯点位置只需要设置一个层叠发光单元100，相当于每个像素位置占用的面积缩小到原来的三分之一左右，分辨率则相 应的提高，有利于实现高分辨率显示。且每个像素中RGB三色的光从同一个灯点位置发出，有利于改善现有显示中RGB三色的光从不同位置发出造成的色偏现象。本申请提供的叠层发光单元100为四层或者更多层叠层结构时也可参考本实施例。
进一步的，在一个实施例中，参照图1、图2和图3，第二电极60延伸至与第二侧面1032相邻的侧面103，且延伸至第一发光组件10与第二发光组件20之间，和第二发光组件20与第三发光组件30之间，还可延伸至第三发光组件30远离第二发光组件20的一侧。第三电极70延伸至与第三侧面1033相邻的侧面，且延伸至第一发光组件10与第二发光组件20之间和第二发光组件20与第三发光组件30之间。共电极40例如也延伸至第一发光组件10与第二发光组件20之间和第二发光组件20与第三发光组件30之间。第二侧面1032例如为第一发光组件10左边(图1左下)的侧面103，则第二电极60还延伸至与左边相邻的的侧面103(例如图1中的上边，对应图2即为前面)，第三侧面1033例如为第一发光组件10左边(图1左上)的侧面103，则第三电极70还延伸至与左边相邻的侧面103(图1中的下边，对应图3的后面)。本实施例可以增大共电极40、第二电极60和第三电极70的面积，导电效果更佳。需要注意的是，第一电极50例如也设置在侧面103时，可采用与第二电极60或第三电极70类似的延伸方式，本实施例不再赘述。
【第二实施例】
本申请第二实施例提供一种叠层发光单元制备方法，例如包括：
步骤S1：提供多个发光芯片；例如为图5或图8所示的发光芯片200，每个发光芯片200分别包括发光组件210，负电极220和正电极230。发光组件210具有相对的顶面101底面102，以及位于顶面101和底面102之间的多个侧面103。负电极220电连接发光组件210的负极，设置在多个侧面103中的第一侧面1031。正电极230电连接发光组件210的正极。其中多个发光芯片200包括第一发光芯片201和第二发光芯片202，第一发光芯片201还包括第一连接电极240，第一连接电极240设置在多个侧面103中的第二侧面1032，第二侧面1032和第一侧面1031为不同的侧面，第一连接电极240与第一发光芯片201的第一发光组件10绝缘，第一发光芯片201的正电极230延伸至第一发光芯片201的第一发光组件10的底面102；
步骤S2：将第二发光芯片202堆叠于第一发光芯片201的顶面101上，使第一发光芯片201的负电极220与第二发光芯片202的负电极220抵接并电连接，形成共电极40，以及使第二发光芯片202的正电极230与第一发光芯片201的第一连接电极240抵接并电连接，形成第二电极60。
请参照图8，其为本申请一个实施例提供的第一发光芯片201的仰视结构示意图，图9为图8中的5-5剖视图(或者6-6剖视图)，图5为本申请一个实施例提供的第二发光芯片202的俯视结构示意图，图6为图5的3-3剖视图，图7为图5的4-4剖视图。可以看出第一发光芯 片201的正电极230例如设置在第一发光组件10的底面102上，而第二发光芯片202的正电极230例如设置在第二侧面1032，当然，本实施例并不限制，在一些实施例中第一发光芯片201的正电极230例如也可以设置在侧面103上。本实施例提供的叠层发光单元制备方法，可以用于制备如第一实施例中所述的叠层发光单元100，关于第一发光组件10、第二发光组件20、共电极40、第二电极60的描述可以参照第一实施例中的描述，在此不再赘述，本实施例制备方法中第一发光芯片201的正电极230例如设置在第一发光组件10的底面102上，则第一发光芯片201的正电极230相当于叠层发光单元100中的第一电极50。第一发光芯片201的正电极230例如设置在第一发光组件10的侧面103上时，其可以与第二发光芯片202上对应位置电极材料共同形成叠层发光单元100的第一电极50，当然第一电极50与第二发光组件20绝缘。
进一步的，在一个实施例中，多个发光芯片200例如还包括第三发光芯片203，第一发光芯片201还包括与第一连接电极240间隔设置的第二连接电极250，第二连接电极250与第一发光芯片201的第一发光组件10绝缘，且延伸至第一发光芯片201的底面102，第二发光芯片202例如还包括与第二连接电极250对齐的第三连接电极260，第三连接电极260与第二发光芯片202的第二发光组件20绝缘，叠层发光单元的制备方法还包括步骤S3：将第三发光芯片203堆叠于第二发光芯片202远离第一发光芯片201的一侧，使第二连接电极250、第三连接电极260与第三发光芯片203的正电极230依次叠层，形成第三电极70，且使第三发光芯片203的负电极220与第二发光芯片202的负电极220抵接并电连接。例如参照图10，其为本申请一个实施例中第三发光芯片203的俯视结构示意图，可以看出，其正电极230与第二发光芯片202中的第三连接电极260对齐设置。
进一步的，本申请的一些实施例中，第一发光芯片201可以为有机发光芯片例如OLED芯片，也可以为无机发光芯片例如Micro-LED芯片，第二发光芯片202和第三发光芯片203例如为无机发光芯片，则该叠层发光单元制备方法包括：
步骤S11：在基板上蒸镀第一发光芯片；
步骤S21：将制备好的第二发光芯片转移并连接至第一发光芯片的顶面上，以使第二发光芯片堆叠于第一发光芯片。
例如还可以包括步骤S31：将制备好的第三发光芯片转移并连接至第二发光芯片远离第一发光芯片的顶面上，以使第三发光芯片堆叠于第二发光芯片。
步骤S11中的基板例如为显示面板的阵列基板，其上设置有用于驱动叠层发光单元发光的驱动电路层，第一发光芯片的第一发光组件例如为有机发光组件，包括依次叠层的空穴注入层(HIL)、空穴传输层(HTL)、发光层(EML)、电子传输层(ETL)和电子注入层(EIL)，可通过蒸镀工艺依次形成。
本申请第二实施例可用于制备如第一实施例所述的叠层发光单元100，其具有与第一实施 例相同的有益效果，且工艺简单。
【第三实施例】
参照图11，本申请提供一种显示面板300，包括阵列基板301和叠层发光单元100，叠层发光单元100可以是上述第一实施例中的任意一种，设置在阵列基板301上且电连接阵列基板301。阵列基板301上例如设置有用于驱动叠层发光单元100的驱动电路层，驱动电路层例如可包括走线(例如数据线、扫描线)、TFT(Thin Film Transistor)薄膜晶体管以及电容等其它合适的元件。参照图11，示出了设置在衬底基板301上的三个叠层发光单元100，当然，本实施例仅为举例说明，并不限制叠层发光单元100的数量。叠层发光单元100设置在阵列基板301上时，安装方向例如为第一发光组件10与阵列基板301相邻，第二发光组件10位于第一发光组件10远离阵列基板301的一侧，叠层发光单元100通过共电极40、第一电极50和第二电极60延伸至第一发光组件10底面102的部分分别电连接阵列基板301上的驱动电路层，例如第一电极50和第二电极60分别电连接至不同的TFT薄膜晶体管，共电极40连接至驱动电路层上的公共电极，以实现对第一发光组件10和第二发光组件20的分别控制驱动。叠层发光单元100还具有第三发光组件30和第三电极70时，第三电极70延伸至第一发光组件10底面102的部分电连接阵列基板301上的驱动电路层上另一个不同的TFT薄膜晶体管上，以实现第一发光组件10、第二发光组件20和第三发光组件30的分别控制驱动。具体的，以RGB显示为例，在一个实施例中，例如第一发光组件10为红色发光组件、第二发光组件20为绿色发光组件以及第三发光组件30为蓝色发光组件，如此对应显示面板300上每一个叠层发光单元100位置，通过独立控制不同的发光组件分别发光可实现红光、绿光、蓝光、红绿混合光、蓝绿混合光、红蓝混合光、白光等多种颜色效果。对于现有RGB显示面板每个像素位置需要设置R、G、B三个灯点而言，本实施例提供的显示面板300每个像素位置只需要设置一个叠层发光单元100即可实现RGB全彩效果，每个像素位置的灯点占用面积约为原来的三分之一，可实现更高分辨率显示。并且，现有RGB显示面板每个像素位置分别从三个位置发出三种颜色光的结构，在不同视角(偏左、偏右或者居中)下三种颜色光的混合效果不同，色偏较大。而本申请实施例提供的显示面板300三种颜色光从同一位置发出，可大大降低色偏。当然，本申请实施例中并不限制叠层发光单元100的层数，层数更多也可实现更小的占用面积和更高的分辨率。
进一步的，在本申请另一个实施例中，显示面板300还包括聚光透镜302，如图11所示，聚光透镜302与阵列基板301相对设置，且叠层发光单元100位于聚光透镜302和阵列基板301之间、与聚光透镜302对应设置。例如图11中示出的三个叠层发光单元100位置分别对应一个聚光透镜302，通过聚光透镜302可进一步限制叠层发光单元100的发光角度，实现窄发光效果。
本申请第三实施例采用第一实施例提供的叠层发光单元100，至少具有与第一实施例相同 的有益效果，在此不再赘述。
以上所述，仅是本申请的较佳实施例而已，并非对本申请作任何形式上的限制，虽然本申请已以较佳实施例揭露如上，然而并非用以限定本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本申请技术方案内容，依据本申请的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本申请技术方案的范围内。

Claims (13)

  1. 一种叠层发光单元，包括：
    第一发光组件，具有相对的顶面和底面，以及位于所述顶面和所述底面之间的多个侧面；
    第二发光组件，堆叠于所述第一发光组件的所述顶面；
    共电极，设置在所述多个侧面中的第一侧面，分别电连接所述第一发光组件和所述第二发光组件的负极，所述共电极延伸至所述底面；
    第二电极，设置在所述多个侧面中的第二侧面，所述第一侧面和所述第二侧面分别为不同的侧面，所述第二电极电连接所述第二发光组件的正极且与所述第一发光组件绝缘，所述第二电极延伸至所述底面；
    第一电极，与所述共电极和所述第二电极间隔设置，所述第一电极电连接所述第一发光组件的正极且与所述第二发光组件绝缘。
  2. 如权利要求1所述的叠层发光单元，还包括：
    第三发光组件，堆叠于所述第二发光组件远离所述第一发光组件的一侧；
    第三电极，与所述第一电极、所述第二电极和所述共电极间隔设置，设置在所述多个侧面中的第三侧面，所述第三侧面与所述第一侧面为不同的侧面；所述第三电极电连接所述第三发光组件的正极，所述第三电极与所述第一发光组件和所述第二发光组件绝缘，且延伸至所述底面。
    所述共电极电连接所述第三发光组件的负极；所述第一电极和所述第二电极与所述第三发光组件绝缘；所述第一电极设置在所述底面上。
  3. 如权利要求1所述的叠层发光单元，其中，所述第一发光组件和所述第二发光组件均为无机发光结构，所述第一电极设置在所述第二侧面且延伸至所述底面或设置在所述底面；或者，
    所述第二发光组件为无机发光结构，所述第一发光组件为有机发光结构，所述第一电极设置在所述底面。
  4. 如权利要求2所述的叠层发光单元，其中，所述第一发光组件、所述第二发光组件和所述第三发光组件均为无机发光结构。
  5. 如权利要求2所述的叠层发光单元，其中，所述第二发光组件和所述第三发光组件为无机发光结构，所述第一发光组件为有机发光结构。
  6. 如权利要求2所述的叠层发光单元，其中，所述第一发光组件为红色发光组件、所述第二发光组件为绿色发光组件，所述第三发光组件为蓝色发光组件。
  7. 如权利要求2所述的叠层发光单元，其中，所述第二电极延伸至与所述第二 侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间；所述第三电极延伸至与所述第三侧面相邻的侧面且延伸至所述第一发光组件与所述第二发光组件之间和所述第二发光组件与所述第三发光组件之间。
  8. 如权利要求1所述的叠层发光单元，其中，所述第一电极通过欧姆接触材料与所述第一发光组件的正极电连接，所述第二电极通过欧姆接触材料与所述第二发光组件的正极电连接，所述共电极通过欧姆接触材料与所述第一发光组件和所述第二发光组件的负极电连接。
  9. 一种叠层发光单元制备方法，其包括：
    提供多个发光芯片，每个所述发光芯片分别包括：发光组件，具有相对的顶面和底面，以及位于所述顶面和所述底面之间的多个侧面，负电极，电连接所述发光组件的负极，设置在所述发光组件的多个侧面中的第一侧面；正电极，电连接所述发光组件的正极；所述多个发光芯片包括第一发光芯片和第二发光芯片，所述第一发光芯片还包括第一连接电极，设置在所述多个侧面中的第二侧面，所述第一侧面和所述第二侧面为不同的侧面，所述第一连接电极与所述第一发光芯片的第一发光组件绝缘，所述第一发光芯片的正电极延伸至所述第一发光芯片的底面；
    将所述第二发光芯片堆叠于所述第一发光芯片的所述顶面上，使所述第一发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接，形成共电极；以及使所述第二发光芯片的所述正电极与所述第一发光芯片的所述第一连接电极抵接并电连接，形成第二电极。
  10. 如权利要求9所述的叠层发光单元制备方法，其中，所述多个发光芯片还包括第三发光芯片，所述第一发光芯片还包括与所述第一连接电极间隔设置的第二连接电极，所述第二连接电极与所述第一发光芯片的所述第一发光组件绝缘且延伸至所述第一发光芯片的所述底面，所述第二发光芯片还包括与所述第二连接电极对齐的第三连接电极，所述第三连接电极与所述第二发光芯片的所述第二发光组件绝缘，所述叠层发光单元的制备方法还包括：
    将所述第三发光芯片堆叠于所述第二发光芯片远离所述第一发光芯片的一侧，使所述第二连接电极、所述第三连接电极与所述第三发光芯片的所述正电极依次叠层，形成第三电极；且使所述第三发光芯片的所述负电极与所述第二发光芯片的所述负电极抵接并电连接。
  11. 如权利要求9所述的叠层发光单元制备方法，其中，所述第一发光芯片为有机发光芯片，所述第二发光芯片为无机发光芯片，所述叠层发光单元制备方法包括：
    在基板上蒸镀所述第一发光芯片；
    将制备好的第二发光芯片转移并连接至所述第一发光芯片的所述顶面上，以使所述第二发光芯片堆叠于所述第一发光芯片。
  12. 一种显示面板，其包括：
    阵列基板；
    如权利要求1-8所述的叠层发光单元，设置在所述阵列基板上，且电连接所述阵列基板。
  13. 如权利要求12所述的显示面板，还包括聚光透镜，所述聚光透镜与所述阵列基板相对设置，且所述叠层发光单元位于所述聚光透镜和所述阵列基板之间、与所述聚光透镜对应设置。
PCT/CN2021/136839 2021-12-09 2021-12-09 叠层发光单元及其制备方法和显示面板 WO2023102839A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN107342352A (zh) * 2016-04-04 2017-11-10 三星电子株式会社 发光二极管光源模块和显示设备
CN110192276A (zh) * 2017-11-27 2019-08-30 首尔伟傲世有限公司 用于显示器的led单元和具有该led单元的显示设备
CN110785841A (zh) * 2017-11-27 2020-02-11 首尔伟傲世有限公司 用于显示器的led单元和具有该led单元的显示设备
CN110828504A (zh) * 2019-12-11 2020-02-21 苏州大学 像素结构、制作方法及面板

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Publication number Priority date Publication date Assignee Title
CN107342352A (zh) * 2016-04-04 2017-11-10 三星电子株式会社 发光二极管光源模块和显示设备
CN110192276A (zh) * 2017-11-27 2019-08-30 首尔伟傲世有限公司 用于显示器的led单元和具有该led单元的显示设备
CN110785841A (zh) * 2017-11-27 2020-02-11 首尔伟傲世有限公司 用于显示器的led单元和具有该led单元的显示设备
CN110828504A (zh) * 2019-12-11 2020-02-21 苏州大学 像素结构、制作方法及面板

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