WO2023095768A1 - Carte de circuit optique - Google Patents

Carte de circuit optique Download PDF

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Publication number
WO2023095768A1
WO2023095768A1 PCT/JP2022/043102 JP2022043102W WO2023095768A1 WO 2023095768 A1 WO2023095768 A1 WO 2023095768A1 JP 2022043102 W JP2022043102 W JP 2022043102W WO 2023095768 A1 WO2023095768 A1 WO 2023095768A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical component
pedestal
optical waveguide
core
Prior art date
Application number
PCT/JP2022/043102
Other languages
English (en)
Japanese (ja)
Inventor
孝之 禰占
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2023095768A1 publication Critical patent/WO2023095768A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present invention relates to an optical circuit board, an optical component mounting structure using the optical component mounting structure, and a method for manufacturing the optical component mounting structure.
  • optical fibers that can transmit large amounts of data at high speed have been used for information communication.
  • Optical signals are transmitted and received between this optical fiber and an optical component (silicon photonics device).
  • an optical component Silicon photonics device.
  • Such an optical component is mounted on a planar lightwave circuit (optical circuit board) as described in Patent Document 1, for example.
  • a pedestal When mounting an optical component on an optical circuit board, a pedestal is provided directly below the optical component in order to match the position (height) between the core of the optical waveguide included in the optical circuit board and the core of the optical component.
  • the optical waveguide and the pedestal are formed in different processes using different materials.
  • An optical circuit board includes a wiring board having an upper surface and an optical waveguide.
  • the wiring board has an optical component mounting area on a part of the upper surface.
  • the optical waveguide is positioned adjacent to the mounting area of the optical component on the wiring board, and includes a lower clad, an optical waveguide core and an upper clad from the upper surface side of the wiring board.
  • At least one pedestal made of the same material as the lower clad is positioned so as to at least partially overlap the mounting area.
  • An optical component mounting structure includes the optical circuit board described above and an optical component including an optical component core positioned in the mounting area, and a portion of the lower surface of the optical component is in contact with the pedestal.
  • a method for manufacturing an optical component mounting structure includes steps of preparing a wiring board having an optical waveguide formation region and a mounting region adjacent to each other; Forming with the same material; forming an optical waveguide core along the upper surface of the lower clad; forming an upper clad covering the upper surface of the lower clad and the optical waveguide core; A step of grinding the end faces of the core and the upper clad to form an optical waveguide; a step of preparing an optical component including the core for the optical component; a step of pressing against and mounting the optical waveguide core and the optical component core with their optical axes aligned.
  • FIG. 1 is a plan view showing an optical component mounting structure in which optical components and electronic components are mounted on an optical circuit board according to an embodiment of the present disclosure
  • FIG. 2 is an enlarged explanatory view for explaining a cross section of a region X shown in FIG. 1
  • FIG. FIG. 3 is a plan view of the region Y shown in FIG. 2 (excluding the optical component and the upper clad of the optical waveguide)
  • FIG. 4 is an explanatory diagram for explaining an arrangement example of a pedestal; It is an explanatory view for explaining a contact part of an optical component and a pedestal. It is an explanatory view for explaining a contact part of an optical component and a pedestal.
  • FIG. 4 is an explanatory diagram for explaining a process of manufacturing an optical component mounting structure according to an embodiment of the present disclosure;
  • the thickness of the lower clad included in the optical waveguide is not formed to a predetermined size, and the positional accuracy of the core of the optical waveguide may be poor. Therefore, even if the optical component is mounted in accordance with the pedestal, the positions of the core of the optical waveguide and the core of the optical component cannot be precisely aligned. As a result, transmission loss increases.
  • the position of the core of the optical waveguide included in the optical circuit board and the core of the optical component can be aligned with high accuracy, and optical signals can be transmitted between the optical waveguide and the optical component.
  • An optical circuit board with less loss is desired.
  • At least one pedestal made of the same material as the lower clad included in the optical waveguide is positioned in the region overlapping the mounting region.
  • FIG. 1 is a plan view showing an optical component mounting structure 10 in which an optical component 4 is mounted on an optical circuit board 1 according to an embodiment of the present disclosure.
  • An optical circuit board 1 includes a wiring board 2 and an optical waveguide 3.
  • a wiring board 2 included in the optical circuit board 1 according to one embodiment, a wiring board generally used for an optical circuit board can be used.
  • such a wiring board 2 includes, for example, a core board and buildup layers laminated on both sides of the core board.
  • the core substrate is not particularly limited as long as it is an insulating material. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • the core substrate usually has through-hole conductors for electrically connecting the upper and lower surfaces of the core substrate.
  • the core substrate may contain a reinforcing material.
  • reinforcing materials include insulating cloth materials such as glass fibers, glass nonwoven fabrics, aramid nonwoven fabrics, aramid fibers, and polyester fibers. Two or more reinforcing materials may be used in combination.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the core substrate.
  • the buildup layer has a structure in which insulating layers and conductor layers are alternately laminated.
  • a part of the conductor layer positioned on the outermost surface (the conductor layer positioned on the upper surface of the wiring board 2) includes a metal layer 21a on which the optical waveguide 3 is positioned.
  • the metal layer 21a is made of metal such as copper.
  • the insulating layer included in the buildup layer is not particularly limited as long as it is an insulating material, like the core substrate. Examples of insulating materials include resins such as epoxy resins, bismaleimide-triazine resins, polyimide resins, and polyphenylene ether resins. These resins may be used in combination of two or more.
  • each insulating layer may be made of the same resin or different resins.
  • the insulating layer and the core substrate included in the buildup layer may be made of the same resin or different resins.
  • the buildup layers usually have via-hole conductors for electrically connecting the layers.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the insulating layer included in the buildup layer.
  • the optical waveguide 3 included in the optical circuit board 1 is located on the surface of the metal layer 21a present on the surface of the wiring board 2.
  • FIG. 2 is an enlarged explanatory view explaining a cross section of the region X shown in FIG.
  • the optical waveguide 3 has a structure in which a lower clad 31, an optical waveguide core 32 and an upper clad 33 are laminated in this order from the metal layer 21a side.
  • the lower clad 31 included in the optical waveguide 3 is located on the surface of the wiring substrate 2, specifically, on the surface of the metal layer 21a existing on the surface of the optical waveguide formation region of the wiring substrate 2.
  • the material forming the lower clad 31 is not limited, and examples thereof include resins such as epoxy resin and silicone resin.
  • the upper clad 33 included in the optical waveguide 3 is also made of resin such as epoxy resin or silicon resin.
  • the lower clad 31 and the upper clad 33 may be made of the same material or different materials.
  • the lower clad 31 and the upper clad 33 may have the same thickness or different thicknesses.
  • the lower clad 31 and the upper clad 33 each have a thickness of approximately 5 ⁇ m or more and 150 ⁇ m or less, for example.
  • the optical waveguide core 32 included in the optical waveguide 3 is a portion through which light entering the optical waveguide 3 propagates. Specifically, the side surface of the optical component core 41 included in the optical component 4 and the side surface of the optical waveguide core 32 of the optical waveguide 3 are positioned to face each other. At this end, optical signals are transmitted and received between the optical waveguide core 32 and the optical component core 41 .
  • the material forming the optical waveguide core 32 is not limited, and is appropriately set in consideration of, for example, light transmittance and wavelength characteristics of propagating light. Examples of materials include resins such as epoxy resins and silicone resins.
  • the optical waveguide core 32 has a thickness of, for example, about 3 ⁇ m or more and 50 ⁇ m or less.
  • the optical circuit board 1 is provided with a pedestal 22 .
  • the pedestal 22 is used to precisely align the optical component core 41 included in the optical component 4 and the optical waveguide core 32 included in the optical waveguide 3 when the optical component 4 is mounted.
  • the pedestal 22 is positioned on the metal layer 21a so as to at least partially overlap the mounting area of the wiring board 2.
  • FIG. 3 is a plan view of the region Y shown in FIG. 2 (excluding the optical component 4 and the upper clad 33 of the optical waveguide 3).
  • the pedestal 22 is made of the same material as the lower clad 31 of the optical waveguide 3 . If the base 22 is made of the same material as the lower clad 31, the base 22 and the lower clad 31 have substantially the same amount of deformation during thermal expansion and contraction. Therefore, alignment (height adjustment) between the optical component core 41 and the optical waveguide core 32 included in the optical waveguide 3 can be facilitated.
  • the position of the pedestal 22 is not limited as long as it at least partially overlaps the mounting area of the wiring board 2 . That is, the pedestal 22 may partially overlap the mounting area, or may overlap the entire mounting area.
  • FIG. 4 shows an arrangement example of the pedestal 22. As shown in FIG. As shown in FIG. 4, a portion where a plurality of pads 21b are located is a mounting area.
  • At least one pedestal 22 may be provided, and one of the pedestals 22 is positioned to face the optical waveguide 3 (optical waveguide core 32) when viewed from above, for example, as shown in FIG. You may have If the pedestal 22 is positioned facing the optical waveguide core 32, it is difficult for the sealing resin to flow between the optical waveguide 3 and the pedestal 22 when using a sealing resin (underfill). Become. As a result, the transmission is less likely to be disturbed by the sealing resin.
  • a plurality of pedestals 22 rather than one pedestal 22 can stably support the optical component 4 and further improve the alignment accuracy.
  • the pedestals 22 may be provided at four corners of the mounting area, or may be positioned on the sides of the rectangular shape.
  • the size of the pedestal 22 is also not limited as long as it is a size that does not interfere with the mounting and transmission of the optical component 4 .
  • the pedestal 22 may be provided so as to be elongated on the side of the square.
  • solder resist may be partially located on the surface of the wiring board 2 .
  • the solder resist is made of a resin such as an acrylic-modified epoxy resin.
  • An optical component mounting structure 10 according to an embodiment of the present disclosure, as shown in FIG. 1, has a structure in which optical components 4 and electronic components 6 are mounted on an optical circuit board 1 according to an embodiment.
  • the optical component 4 mounted on the optical component mounting structure 10 includes an optical component core 41 .
  • Examples of the optical component 4 including such an optical component core 41 include a silicon photonics device.
  • Examples of the electronic component 6 include an ASIC (Application Specific Integrated Circuit) and a driver IC.
  • the optical component 4 is electrically connected to the pad 21b located in the mounting area of the optical component on the wiring board 2 via the solder 7.
  • Pad 21b is part of a conductor layer (metal layer 21a) located on the upper surface of wiring board 2 .
  • a silicon photonics device will be described as an example of the optical component 4 .
  • a silicon photonics device is, for example, a type of optical waveguide having a core made of silicon (Si) and a clad made of silicon dioxide (SiO 2 ).
  • the silicon photonics device includes a Si waveguide as an optical component core 41, and further includes a passivation film, a light source section, a photodetector section, and the like (not shown).
  • the optical component core 41 Si waveguide 41
  • the optical component core 41 is positioned at one end of the optical waveguide 3 so as to face the optical waveguide core 32 included in the optical waveguide 3 .
  • an electrical signal from the wiring board 2 is propagated through the solder 7 to the light source included in the optical component 4 (silicon photonics device).
  • the light source unit that receives the propagated electrical signal emits light.
  • the emitted optical signal is propagated through the optical component core 41 (Si waveguide 41) and the optical waveguide core 32 to the optical fiber 5 connected via the optical connector 5a.
  • part of the lower surface of the optical component 4 is in contact with the pedestal 22 .
  • the lower surface of the optical component 4 is partially in contact with the pedestal 22, so that the optical component 4 can be stabilized. ) can be facilitated.
  • the lower surface of the optical component 4 may be a roughened surface.
  • the resin forming the pedestal 22 is embedded in the concave portion of the roughened surface, and the resin forming the pedestal 22 and the unevenness of the roughened surface are anchored. Effective. As a result, the bonding strength between the optical component 4 and the pedestal 22 is improved, and the optical component 4 can be supported more stably.
  • the roughening treatment can be performed, for example, by plasma treatment using nitrogen gas, and the surface roughness of the roughened surface is Ra (arithmetic mean roughness) defined in JIS B0601:2013, etc., and is 0.1 ⁇ m or more. 0.5 ⁇ m or less is preferable.
  • the lower surface of the optical component 4 may be embedded in the pedestal 22 as shown in FIG. With such a configuration, the optical component 4 can be brought into contact with the pedestal 22 more stably, and the alignment between the optical component core 41 and the optical waveguide core 32 can be performed more accurately.
  • the lower surface of the optical component 4 may be located on the entire upper surface of the pedestal 22 and the area of the upper surface of the pedestal 22 may be larger than the area of the lower surface of the pedestal 22 . That is, in the base 22, the area of the contact portion with the optical component 4 should be larger than the area of the contact portion with the metal layer 21a. Also in such a configuration, the optical component 4 can be more stabilized on the pedestal 22, and the alignment between the optical component core 41 and the optical waveguide core 32 can be performed more accurately.
  • a method for manufacturing the optical component mounting structure according to the present disclosure is not particularly limited as long as the optical component mounting structure 10 can be manufactured so as to have the structure described above.
  • a method for manufacturing an optical circuit board 10 according to an embodiment of the present disclosure includes the following steps (a) to (g).
  • a wiring board 2 is prepared as shown in FIG.
  • the wiring board 2 has a mounting region R1 for the optical component 4 and an optical waveguide forming region R2 adjacent to each other on its upper surface.
  • the optical waveguide forming region R2 of the wiring board 2 includes a metal layer 21a that is part of the conductor layer positioned on the outermost surface (the conductor layer positioned on the upper surface of the wiring board 2).
  • the mounting region R1 of the wiring board 2 includes pads 21b that are part of the conductor layer located on the outermost surface.
  • the metal layer 21a and the pads 21b are made of metal such as copper.
  • step (b) the lower clad 31 is formed in the optical waveguide forming region R2 and the pedestal 22 is formed in the mounting region R1 from the same material. Specifically, a resin layer made of resin such as epoxy resin or silicon resin is laminated so as to cover the optical waveguide forming region R2 and the mounting region R1. Then, it is exposed and developed to form the lower clad 31 and the pedestal 22 at the same time.
  • an optical waveguide core 32 is formed along the upper surface of the lower clad 31 .
  • the optical waveguide core 32 is made of resin such as epoxy resin or silicone resin, as described above.
  • an upper clad 33 covering the upper surface of the lower clad 31 and the optical waveguide core 32 is formed.
  • the upper clad 33 is also made of resin such as epoxy resin or silicon resin.
  • the lower clad 31 and the upper clad 33 may be made of the same material or different materials.
  • the lower clad 31 and the upper clad 33 may have the same thickness or different thicknesses.
  • step (e) as shown in FIG. 7, the end faces of the lower clad 31, the optical waveguide core 32 and the upper clad 33 are ground to form the optical waveguide 3.
  • step (f) the optical component 4 including the optical component core 41 is prepared. Examples of such an optical component 4 include a silicon photonics device and the like, as described above.
  • step (g) the lower surface of the optical component 4 is pressed against the pedestal 22 while the optical component 4 is heated in the mounting region R1, thereby forming the optical waveguide core 32 and the optical component core.
  • 41 and the optical axis are aligned with each other. Specifically, by heating to about 200° C. or higher and 350° C. or lower, the pedestal 22 is softened and the solder 7 is melted. By pressing the optical component 4 against the softened pedestal 22, the optical axes of the optical waveguide core 41 and the optical component core 32 are aligned.
  • the optical component 4 may be embedded in the pedestal 22 when the optical waveguide core 32 and the optical component core 41 are aligned.
  • the lower surface of the optical component 4 may be located on the entire upper surface of the pedestal 22 and the area of the upper surface of the pedestal 22 may be larger than the area of the lower surface of the pedestal 22 .
  • an optical component mounting structure 10 is obtained.
  • the positions (optical axes) of the optical waveguide core 32 of the optical waveguide 3 and the optical component core 41 of the optical component 4 included in the optical circuit board 1 are highly accurate. Matching. Therefore, the optical component mounting structure 10 according to one embodiment can reduce the transmission loss of optical signals.
  • optical circuit board 1 optical circuit board 2 wiring board 21a metal layer 21b pad 22 pedestal 3 optical waveguide 31 lower clad 32 optical waveguide core 33 upper clad 4 optical component 41 optical component core (silicon waveguide (Si waveguide)) 5 optical fiber 5a optical connector 6 electronic component 7 solder 10 optical component mounting structure R1 optical waveguide forming region R2 mounting region

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Une carte de circuit optique (1) selon la présente divulgation comprend une carte de câblage (2) ayant une surface supérieure, et un guide d'ondes optique (3). La carte de câblage (2) a une région de montage pour un composant optique (4) sur une partie de la surface supérieure. Le guide d'ondes optique (3) est situé de manière adjacente à la zone de montage pour le composant optique (4) sur la carte de câblage (2), et comprend une gaine inférieure (31), un noyau (32) pour le guide d'ondes optique, et une gaine supérieure (33) à partir du côté de surface supérieure de la carte de câblage (2). Au moins un socle (22) formé à partir du même matériau que celui de la gaine inférieure (31) est situé de manière à chevaucher au moins partiellement la région de montage.
PCT/JP2022/043102 2021-11-26 2022-11-22 Carte de circuit optique WO2023095768A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-192471 2021-11-26
JP2021192471 2021-11-26

Publications (1)

Publication Number Publication Date
WO2023095768A1 true WO2023095768A1 (fr) 2023-06-01

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PCT/JP2022/043102 WO2023095768A1 (fr) 2021-11-26 2022-11-22 Carte de circuit optique

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007133011A (ja) * 2005-11-08 2007-05-31 Nec Corp 光結合構造およびその製造方法、光モジュール
WO2010106995A1 (fr) * 2009-03-17 2010-09-23 日本電気株式会社 Dispositif de guide d'ondes lumineuses et procédé pour sa fabrication
US20110085760A1 (en) * 2009-10-13 2011-04-14 Electronics And Telecommunications Research Institute Optical devices and methods of fabricating the same
JP2011209516A (ja) * 2010-03-30 2011-10-20 Kyocera Corp 光伝送基板および光モジュール
WO2014118836A1 (fr) * 2013-02-01 2014-08-07 日本電気株式会社 Unité d'intégration de fonction optique et son procédé de production
JP2019186467A (ja) * 2018-04-16 2019-10-24 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2020016780A (ja) * 2018-07-26 2020-01-30 京セラ株式会社 光導波路および光回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007133011A (ja) * 2005-11-08 2007-05-31 Nec Corp 光結合構造およびその製造方法、光モジュール
WO2010106995A1 (fr) * 2009-03-17 2010-09-23 日本電気株式会社 Dispositif de guide d'ondes lumineuses et procédé pour sa fabrication
US20110085760A1 (en) * 2009-10-13 2011-04-14 Electronics And Telecommunications Research Institute Optical devices and methods of fabricating the same
JP2011209516A (ja) * 2010-03-30 2011-10-20 Kyocera Corp 光伝送基板および光モジュール
WO2014118836A1 (fr) * 2013-02-01 2014-08-07 日本電気株式会社 Unité d'intégration de fonction optique et son procédé de production
JP2019186467A (ja) * 2018-04-16 2019-10-24 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2020016780A (ja) * 2018-07-26 2020-01-30 京セラ株式会社 光導波路および光回路基板

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