WO2023092681A1 - Oled显示面板和oled显示装置 - Google Patents

Oled显示面板和oled显示装置 Download PDF

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Publication number
WO2023092681A1
WO2023092681A1 PCT/CN2021/136880 CN2021136880W WO2023092681A1 WO 2023092681 A1 WO2023092681 A1 WO 2023092681A1 CN 2021136880 W CN2021136880 W CN 2021136880W WO 2023092681 A1 WO2023092681 A1 WO 2023092681A1
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WO
WIPO (PCT)
Prior art keywords
layer
filling
filling layer
oled display
common electrode
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PCT/CN2021/136880
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English (en)
French (fr)
Inventor
练文东
曹蔚然
李金川
苗洋
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/621,680 priority Critical patent/US20240057447A1/en
Publication of WO2023092681A1 publication Critical patent/WO2023092681A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes

Definitions

  • the present application relates to the field of display technology, in particular to an OLED display panel and an OLED display device.
  • OLED Organic Light Emitting Diode
  • OLED display devices are widely used due to the advantages of self-illumination, fast response, ultra-thin, low power consumption, etc.
  • an auxiliary cathode is provided in the top-emitting OLED display device. By overlapping the auxiliary cathode and the transparent cathode, the voltage drop of the cathode layer is reduced and the display effect is improved.
  • the current design of the auxiliary electrode is to design the undercut structure in the OLED display device, so that when the transparent cathode is formed, the transparent cathode can be plated into the lateral etched part, overlap with the lower auxiliary cathode, and then form an encapsulation layer on the top , to complete the preparation process of the OLED display device.
  • the inorganic layer in the encapsulation layer will be formed by chemical vapor deposition, the inorganic layer may be broken at the undercut, and the breakage of the inorganic layer will lead to encapsulation failure, resulting in water and oxygen intrusion, and The risk is further exacerbated when the OLED display device is bent.
  • the existing OLED display device has the technical problem of encapsulation failure caused by fracture of the inorganic layer in the encapsulation layer at the undercut.
  • the embodiments of the present application provide an OLED display panel and an OLED display device, which are used to alleviate the technical problem of encapsulation failure caused by fracture of the inorganic layer in the encapsulation layer at the undercut of the existing OLED display device.
  • An embodiment of the present application provides an OLED display panel, and the OLED display panel includes:
  • a driving circuit layer disposed on one side of the substrate
  • a light-emitting functional layer disposed on a side of the drive circuit layer away from the substrate, the light-emitting functional layer including a common electrode layer and a light-emitting material layer;
  • a support layer disposed on a side of the luminescent material layer away from the common electrode layer, and the OLED display panel has an undercut structure formed in the region where the support layer is disposed;
  • auxiliary electrode layer disposed on a side of the support layer away from the common electrode layer, the auxiliary electrode layer is connected to the common electrode layer at the undercut structure;
  • An encapsulation layer disposed on a side of the light-emitting functional layer away from the driving circuit layer;
  • the OLED display panel further includes a filling layer, the filling layer is arranged in the undercut structure, and in the undercut structure, the filling layer is arranged on the common electrode layer away from the auxiliary electrode side of the layer.
  • the common electrode layer has a via hole formed in a region corresponding to the undercut structure, and the filling layer extends from the undercut structure to the via hole.
  • the filling layer is in contact with the common electrode layers on both sides, and the surface of the filling layer on the side away from the auxiliary electrode layer is in contact with the common electrode layer on both sides of the via hole.
  • the height of the surface of the common electrode layer is uniform.
  • the filling layer extends from the undercut structure to the outside of the via hole, and outside the via hole of the common electrode layer, the filling layer is disposed between the common electrode layer and the via hole. between encapsulation layers.
  • the filling layer includes a first filling layer and a second filling layer, and the first filling layer is disposed between the second filling layer and the common electrode layer.
  • the material of the first filling layer is a conductive material
  • the material of the second filling layer is a non-conductive material
  • the second filling layer covers the first filling layer in the undercut structure. on a filling layer.
  • the thickness of the second filling layer is greater than the thickness of the first filling layer.
  • the filling layer further includes a third filling layer, the third filling layer is arranged between the first filling layer and the second filling layer, and the third filling layer and the The contact angle of the second filling layer is smaller than the contact angle of the third filling layer and the first filling layer.
  • the auxiliary electrode layer includes an auxiliary electrode
  • the driving circuit layer includes a source-drain layer
  • the auxiliary electrode is disposed on the source-drain layer.
  • an embodiment of the present application provides an OLED display device, the OLED display device includes:
  • An OLED display panel includes a substrate, a driving circuit layer, a light-emitting functional layer, a supporting layer, an auxiliary electrode layer and a packaging layer, the driving circuit layer is arranged on one side of the substrate, and the light-emitting functional layer is arranged on the driving The side of the circuit layer away from the substrate, the light-emitting functional layer includes a common electrode layer and a light-emitting material layer, the supporting layer is arranged on the side of the light-emitting material layer away from the common electrode layer, and the OLED display The panel is formed with an undercut structure in the area where the supporting layer is disposed, the auxiliary electrode layer is disposed on a side of the supporting layer away from the common electrode layer, and the auxiliary electrode layer and the common electrode layer are on the bottom The encapsulation layer is arranged on the side of the light-emitting functional layer away from the driving circuit layer, wherein the OLED display panel further includes a filling layer, and the filling layer is arranged in the undercut structure , and
  • the electronic components are arranged on one side of the OLED display panel.
  • the common electrode layer has a via hole formed in a region corresponding to the undercut structure, and the filling layer extends from the undercut structure to the via hole.
  • the filling layer is in contact with the common electrode layers on both sides, and the surface of the filling layer on the side away from the auxiliary electrode layer is in contact with the common electrode layer on both sides of the via hole.
  • the height of the surface of the common electrode layer is uniform.
  • the filling layer extends from the undercut structure to the outside of the via hole, and outside the via hole of the common electrode layer, the filling layer is disposed between the common electrode layer and the via hole. between encapsulation layers.
  • the filling layer includes a first filling layer and a second filling layer, and the first filling layer is disposed between the second filling layer and the common electrode layer.
  • the material of the first filling layer is a conductive material
  • the material of the second filling layer is a non-conductive material
  • the second filling layer covers the first filling layer in the undercut structure. on a filling layer.
  • the thickness of the second filling layer is greater than the thickness of the first filling layer.
  • the filling layer further includes a third filling layer, the third filling layer is arranged between the first filling layer and the second filling layer, and the third filling layer and the The contact angle of the second filling layer is smaller than the contact angle of the third filling layer and the first filling layer.
  • the auxiliary electrode layer includes an auxiliary electrode
  • the driving circuit layer includes a source-drain layer
  • the auxiliary electrode is disposed on the source-drain layer.
  • the support layer includes a support unit
  • the light-emitting functional layer includes a pixel electrode layer
  • the support unit is disposed on the pixel electrode layer.
  • the driving circuit layer includes a planarization layer and a passivation layer
  • the auxiliary electrode layer is disposed between the planarization layer and the passivation layer.
  • the application provides an OLED display panel and an OLED display device;
  • the OLED display panel includes a substrate, a driving circuit layer, a light-emitting functional layer, a supporting layer, an auxiliary electrode layer and a packaging layer, and the driving circuit layer is arranged on one side of the substrate to emit light.
  • the functional layer is arranged on the side of the driving circuit layer away from the substrate, the light-emitting functional layer includes a common electrode layer and a light-emitting material layer, the support layer is arranged on the side of the light-emitting material layer away from the common electrode layer, and the OLED display panel is formed in the area where the support layer is set There is an undercut structure, the auxiliary electrode layer is arranged on the side of the support layer away from the common electrode layer, the auxiliary electrode layer and the common electrode layer are connected at the undercut structure, and the packaging layer is arranged on the side of the light-emitting functional layer away from the driving circuit layer, wherein
  • the OLED display panel further includes a filling layer, the filling layer is arranged in the undercut structure, and in the undercut structure, the filling layer is arranged on the side of the common electrode layer away from the auxiliary electrode layer.
  • a filling layer is provided in the undercut structure, and the filling layer is arranged on the side of the common electrode layer away from the auxiliary electrode layer, so that the filling layer reduces the depth of the undercut structure or fills the undercut structure to eliminate the level difference of the undercut structure , when the encapsulation layer is formed on the common electrode layer, the depth of the contact area of the inorganic layer in the encapsulation layer is relatively low or relatively flat, so as to avoid breakage of the inorganic layer and thereby avoid encapsulation failure.
  • FIG. 1 is a schematic diagram of a first type of OLED display panel provided by an embodiment of the present application.
  • FIG. 2 is a second schematic diagram of an OLED display panel provided by an embodiment of the present application.
  • FIG. 3 is a third schematic diagram of an OLED display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of an OLED display device provided by an embodiment of the present application.
  • the embodiments of the present application aim at the technical problem of encapsulation failure caused by breakage of the inorganic layer in the encapsulation layer at the undercut in the existing OLED display device, and provide an OLED display panel and an OLED display device to alleviate the above technical problem.
  • an embodiment of the present application provides an OLED display panel
  • the OLED display panel includes:
  • a driving circuit layer 12 disposed on one side of the substrate 11;
  • the supporting layer 16 is disposed on the side of the luminescent material layer 133 away from the common electrode layer 134, and the OLED display panel has an undercut structure 181 formed in the area where the supporting layer 16 is disposed;
  • the auxiliary electrode layer 17 is disposed on a side of the support layer 16 away from the common electrode layer 134, and the auxiliary electrode layer 17 is connected to the common electrode layer 134 at the undercut structure 181;
  • the encapsulation layer 15 is disposed on the side of the light-emitting functional layer 13 away from the driving circuit layer 12;
  • the OLED display panel further includes a filling layer 14, the filling layer 14 is arranged in the undercut structure 181, and in the undercut structure 181, the filling layer 14 is arranged in the common electrode layer 134 is away from the side of the auxiliary electrode layer 17 .
  • An embodiment of the present application provides an OLED display panel.
  • a filling layer is arranged in the undercut structure, and the filling layer is arranged on the side of the common electrode layer away from the auxiliary electrode layer, so that the filling layer will have the depth of the undercut structure. Reduce or fill in the undercut structure and eliminate the step difference of the undercut structure.
  • the depth of the contact area of the inorganic layer in the encapsulation layer is relatively low or relatively flat, so as to avoid the breakage of the inorganic layer and thus avoid encapsulation. invalidated.
  • the height of the filling layer in the undercut structure is equal to the height of the supporting layer.
  • the filling layer can be set in the undercut structure, by filling the undercut structure to be flush with the support layer, so that in the corresponding area of the undercut structure, there will only be a process formed by the film layer on the support layer. holes, and the depth of these via holes is small, so that even if these via holes are not filled, when the inorganic layer of the encapsulation layer is formed, because the level difference of the undercut structure is eliminated, and the height difference of the inorganic layer in different regions is small, the inorganic Layers are less likely to fracture or even not fractured, reducing the possibility of encapsulation layer failure.
  • the filling layer when the filling layer is arranged in the undercut structure, by arranging the filling layer in each undercut structure, the filling layer is respectively arranged in a plurality of undercut structures, and the undercut structure is filled up, thereby avoiding the inorganic layer Breakage occurs to avoid OLED display panel packaging failure.
  • the common electrode layer has a via hole formed in a region corresponding to the undercut structure, and the filling layer extends from the undercut structure to the via hole.
  • the filling layer can also fill the via hole in the corresponding area of the undercut structure, so that in the corresponding area of the undercut structure, only There will be some vias or even no vias, reducing the depth of vias or holes at the undercut, thereby reducing the height difference when the inorganic layer is formed in the encapsulation layer, reducing the risk of fracture of the inorganic layer, and improving the encapsulation effect of the OLED display panel .
  • the filling layer can be extended upward from the common electrode layer at the bottom of the undercut structure, so that the filling layer fills the via holes on the undercut structure and the film layer, thereby reducing the height difference between the undercut structure and other positions, and forming the encapsulation layer
  • the inorganic layer is used, the height difference between different regions of the inorganic layer is reduced, thereby avoiding encapsulation failure and improving the encapsulation effect of the OLED display panel.
  • the filling layer 14 is in contact with the common electrode layer 134 on both sides, and the filling layer 14 is away from the auxiliary electrode layer 17 by one Side surfaces of the common electrode layer 134 on both sides of the via hole 182 have the same height.
  • the holes and vias in the position are filled and leveled, so that the inorganic layer in the encapsulation layer can be formed directly on the flat surface, and the inorganic layer will not form an uneven structure at the corresponding position of the undercut structure, thereby eliminating the height difference of the inorganic layer and reducing the thickness of the inorganic layer.
  • the risk of fracture can improve the encapsulation effect of the OLED display panel, and during the setting process of the filling layer, since the filling layer is set at the undercut structure and the via hole, it will not exceed the common electrode layer and will not increase the thickness of the OLED display panel.
  • the filling layer can fill the undercut structure and the via hole of each film layer, thereby eliminating the via hole.
  • the filling layers are respectively arranged in a plurality of undercut structures, and when the OLED display panel forms a plurality of undercut structures to reduce the voltage drop of the common electrode layer, the filling layers are respectively arranged in a plurality of undercut structures, so that each filling If the layers are separated but filled into each undercut structure, the filling layer will not be placed on the common electrode layer in other areas, the thickness of the OLED display panel will not be increased, and the step difference at the undercut structure will avoid the inorganic layer in the encapsulation layer. Fracture problem.
  • the filling layer 14 extends from the undercut structure 181 to the outside of the via hole 182 , and outside the via hole 182 of the common electrode layer 134 , the The filling layer 14 is disposed between the common electrode layer 134 and the encapsulation layer 15 .
  • the via hole or level difference formed in other areas of the OLED display panel is filled by the filling layer, so that when the inorganic layer is formed, Each area of the OLED display panel is flat, so the formation of the inorganic layer will not encounter via holes or step differences, and there will be no breakage caused by the via holes and step differences, which improves the packaging effect of the OLED display panel.
  • the filling layer is formed on the entire surface, so that the filling layer is filled in the undercut structure at each undercut structure and extends to the outside of the via hole, so that the filling layer is in each area of the OLED display panel.
  • the height of the surface is consistent, and the filling layer fills and leveles each undercut structure in the OLED display panel.
  • the filling layer 14 includes a first filling layer 141 and a second filling layer 142, and the first filling layer 141 is arranged between the second filling layer 142 and the between the common electrode layers 134 .
  • the first filling layer and the second filling layer can complement each other, and the bottom The cut structure and the via hole are filled and leveled, so as to avoid breakage during the formation of the inorganic layer and improve the packaging effect of the OLED display panel.
  • the material of the first filling layer 141 is a conductive material
  • the material of the second filling layer 142 is a non-conductive material
  • the second filling layer 142 is in the The undercut structure 181 covers the first filling layer 141 .
  • the first filling layer can further reduce the voltage drop of the common electrode layer, and the first filling layer can avoid the second filling layer In contact with the common electrode layer, when the second filling layer is invaded by water and oxygen, it prevents water and oxygen from intruding into the common electrode layer, and the second filling layer can fill up the undercut structure and via holes, thereby avoiding the level difference at the undercut structure.
  • the problem of fracture of the inorganic layer in the encapsulation layer improves the encapsulation effect of the OLED display panel.
  • the material of the first filling layer includes indium zinc oxide.
  • the material of the second filling layer is an organic material, because the flexibility of the organic material is good, and the organic layer can be formed by inkjet printing or other methods of solidifying the liquid to form a film layer after forming the organic material, and using the liquid fluidity, the liquid flows into the undercut structure and fills the via hole, then the undercut structure and the via hole can be filled and leveled, avoiding the step difference or height difference between the undercut structure and the via hole when the inorganic layer is formed Fracture occurs, and since the second filling layer is made of organic material, the flexibility of the OLED display panel can be further improved.
  • the first filling layer 141 will be disconnected at the undercut structure 181, so that the first filling layer 141 covers the common electrode layer 134, preventing the second filling layer 142 from being directly connected to the common electrode layer.
  • Contact so as to prevent water oxygen or other substances existing in the second filling layer from invading into the luminescent material layer through the common electrode layer, resulting in failure of luminescence.
  • organic components such as solvents, photoinitiators, leveling agents, and gases that exist after the organic layer is cured.
  • the organic components and gases will flow from the common electrode layer.
  • the thickness of the second filling layer is greater than the thickness of the first filling layer.
  • the thickness of the first filling layer will not be thicker, because the OLED display
  • the length of the light-emitting cavity in the panel is determined by the distance between the two electrodes.
  • the first filling layer is a conductive material. When the thickness is too thick, it will affect the cavity length of each pixel of the OLED display panel, resulting in the display effect of the OLED display panel being different from the expected one. Set the display effect to be different.
  • the thickness of the second filling layer is made greater than the thickness of the second filling layer, thereby avoiding the impact of the first filling layer on the cavity of the light-emitting pixels of the OLED display panel. long-term impact.
  • the thickness of the first filling layer is less than 50 nanometers, and by reducing the thickness of the first filling layer, it is avoided that the first filling layer affects the length of the light-emitting cavity of the light-emitting pixels of the OLED display panel.
  • the filling layer 14 further includes a third filling layer 143, and the third filling layer 143 is arranged on the first filling layer 141 and the second filling layer 142. Between, the contact angle between the third filling layer 143 and the second filling layer 142 is smaller than the contact angle between the third filling layer 143 and the first filling layer 141 .
  • the third filling layer is arranged between the first filling layer and the second filling layer, and the contact angle between the third filling layer and the second filling layer is smaller than that between the third filling layer and the first filling layer.
  • the contact angle of the second filling layer can be quickly leveled when the second filling layer is formed, and the problem of unevenness of the second filling layer can be avoided.
  • the material of the third filling layer includes an inorganic material.
  • the inorganic material to form the third filling layer By using the inorganic material to form the third filling layer, when the second filling layer is formed, the contact angle between the liquid corresponding to the second filling layer and the third filling layer is small, which accelerates The liquid leveling corresponding to the second filling layer speeds up the production efficiency of the OLED display panel; at the same time, the third filling layer is arranged between the first filling layer and the second filling layer to further prevent the second filling layer from contacting the common electrode layer , and the third filling layer adopts inorganic materials, which can improve the ability of the OLED display panel to block water and oxygen.
  • the auxiliary electrode layer 17 includes an auxiliary electrode
  • the driving circuit layer 12 includes a source-drain layer 127
  • the auxiliary electrode is disposed on the source-drain layer 127 .
  • the OLED display panel includes a display area and a non-display area, the undercut structure is disposed in the non-display area, and the auxiliary electrode is disposed in the non-display area. Since the undercut structure is arranged in the non-display area, when forming the auxiliary electrode layer, the auxiliary electrode can be formed by designing the source and drain layers, and the auxiliary electrode will not occupy the position of the source and drain layer in the display area, and the setting The method does not need to increase the process, and reduces the thickness of the OLED display panel.
  • auxiliary electrode disposed on the source and drain layers.
  • the embodiment of the present application is not limited thereto, and the auxiliary electrode may be disposed on other film layers.
  • the auxiliary electrode layer may be disposed on the source and drain layers.
  • the driving circuit layer further includes a passivation layer, and the auxiliary electrode layer is disposed under the passivation layer.
  • the supporting layer 16 includes a supporting unit
  • the light-emitting functional layer 13 includes a pixel electrode layer 131
  • the supporting unit is disposed on the pixel electrode layer 131 .
  • the above embodiments are described in detail by taking the supporting layer disposed on the pixel electrode layer as an example, but the embodiments of the present application are not limited thereto, for example, the supporting layer may be disposed under the pixel electrode layer.
  • the driving circuit layer 12 includes an active layer 121, a first gate insulating layer 122, a first metal layer 123, a second gate insulating layer 124, a second metal layer 125 , an interlayer insulating layer 126 , a source-drain layer 127 , and a planarization layer 128 .
  • the luminescent material layer includes a hole injection layer, a hole transport layer, an electron transport layer and an electron injection layer.
  • the electron transport layer is disposed on the entire surface, and the hole injection layer and the hole transport layer are disposed in the pixel area defined by the pixel definition layer.
  • the encapsulation layer 15 includes a first inorganic layer 151 , an organic layer 152 and a second inorganic layer 153 .
  • the embodiment of the present application provides a method for manufacturing an OLED display panel, the method for manufacturing an OLED display panel includes:
  • a driving circuit layer is formed on the substrate;
  • the driving circuit layer includes a source-drain layer and a planarization layer, and the source-drain layer includes an auxiliary electrode layer;
  • the pixel electrode layer includes a supporting layer
  • the auxiliary electrode layer is connected to the common electrode layer at the undercut structure;
  • the filling layer is disposed in the undercut structure
  • An encapsulation layer is formed on the filling layer.
  • An embodiment of the present application provides a method for preparing an OLED display panel.
  • the OLED display panel prepared by the OLED display panel preparation method is provided with a filling layer in the undercut structure, and the filling layer is provided on the side of the common electrode layer away from the auxiliary electrode layer.
  • the filling layer reduces the depth of the undercut structure or fills the undercut structure to eliminate the level difference of the undercut structure.
  • the encapsulation layer is formed on the common electrode layer, the depth of the contact area of the inorganic layer in the encapsulation layer is relatively low or relatively flat. Avoid cracks in the inorganic layer, thereby avoiding package failure.
  • the step of forming a filling layer on the common electrode layer includes:
  • the material of the first filling layer includes a conductive material
  • the material of the third filling layer includes an inorganic material
  • a second filling layer is formed on the third filling layer by inkjet printing; a material of the second filling layer includes an organic material.
  • an embodiment of the present application provides an OLED display device
  • the OLED display device includes:
  • An OLED display panel includes a substrate 11, a driving circuit layer 12, a light-emitting functional layer 13, a supporting layer 16, an auxiliary electrode layer 17, and an encapsulation layer 15.
  • the driving circuit layer 12 is arranged on one side of the substrate 11, and the The luminescent functional layer 13 is disposed on the side of the driving circuit layer 12 away from the substrate 11, the luminescent functional layer 13 includes a common electrode layer 134 and a luminescent material layer 133, and the supporting layer 16 is disposed on the luminescent material layer 13.
  • layer 133 away from the side of the common electrode layer 134, the OLED display panel is formed with an undercut structure 181 in the area where the support layer 16 is set, and the auxiliary electrode layer 17 is set on the support layer 16 away from the common electrode layer.
  • the auxiliary electrode layer 17 is connected to the common electrode layer 134 at the undercut structure 181, the encapsulation layer 15 is disposed on the light emitting functional layer 13 away from the driving circuit layer 12
  • the OLED display panel further includes a filling layer 14, the filling layer 14 is arranged in the undercut structure 181, and in the undercut structure 181, the filling layer 14 is arranged in the The side of the common electrode layer 134 away from the auxiliary electrode layer 17;
  • the electronic component 41 is arranged on one side of the OLED display panel.
  • An embodiment of the present application provides an OLED display device, the OLED display device includes an OLED display panel and electronic components, the OLED display panel is provided with a filling layer in the undercut structure, and the filling layer is provided at the common electrode layer away from the auxiliary electrode layer On the one hand, the filling layer reduces the depth of the undercut structure or fills up the undercut structure to eliminate the level difference of the undercut structure.
  • the encapsulation layer is formed on the common electrode layer, the depth of the area where the inorganic layer in the encapsulation layer contacts is low or It is relatively flat to avoid fracture of the inorganic layer, thereby avoiding package failure.
  • a via hole is formed in the common electrode layer in a region corresponding to the undercut structure, and the filling layer extends from the undercut structure to the via hole.
  • the filling layer is in contact with the common electrode layers on both sides, and the surface of the filling layer is far away from the auxiliary electrode layer.
  • the height is consistent with the surface height of the common electrode layer located on both sides of the via hole.
  • the filling layer extends from the undercut structure to the outside of the via hole, and outside the via hole of the common electrode layer, the filling layer is arranged between the common electrode layer and the encapsulation layer.
  • the filling layer includes a first filling layer and a second filling layer, and the first filling layer is arranged between the second filling layer and the common electrode layer. between.
  • the material of the first filling layer is a conductive material
  • the material of the second filling layer is a non-conductive material
  • the second filling layer is in the The undercut structure overlies the first filling layer.
  • the thickness of the second filling layer is greater than the thickness of the first filling layer.
  • the filling layer further includes a third filling layer, the third filling layer is disposed between the first filling layer and the second filling layer, A contact angle between the third filling layer and the second filling layer is smaller than a contact angle between the third filling layer and the first filling layer.
  • the auxiliary electrode layer includes an auxiliary electrode
  • the driving circuit layer includes a source-drain layer
  • the auxiliary electrode is disposed on the source-drain layer.
  • the support layer includes a support unit
  • the light-emitting functional layer includes a pixel electrode layer
  • the support unit is disposed on the pixel electrode layer.
  • the driving circuit layer includes a planarization layer and a passivation layer
  • the auxiliary electrode layer is disposed between the planarization layer and the passivation layer.
  • Embodiments of the present application provide an OLED display panel and an OLED display device;
  • the OLED display panel includes a substrate, a driving circuit layer, a light-emitting functional layer, a supporting layer, an auxiliary electrode layer, and a packaging layer, and the driving circuit layer is disposed on one side of the substrate
  • the light-emitting functional layer is arranged on the side of the driving circuit layer away from the substrate
  • the light-emitting functional layer includes a common electrode layer and a light-emitting material layer
  • the supporting layer is arranged on the side of the light-emitting material layer away from the common electrode layer
  • the OLED display panel is arranged on the supporting layer
  • An undercut structure is formed in the area, the auxiliary electrode layer is arranged on the side of the support layer away from the common electrode layer, the auxiliary electrode layer and the common electrode layer are connected at the undercut structure, and the packaging layer is arranged on the side of the light emitting functional layer away from the driving circuit layer
  • the OLED display panel further
  • a filling layer is provided in the undercut structure, and the filling layer is arranged on the side of the common electrode layer away from the auxiliary electrode layer, so that the filling layer reduces the depth of the undercut structure or fills the undercut structure to eliminate the level difference of the undercut structure , when the encapsulation layer is formed on the common electrode layer, the depth of the contact area of the inorganic layer in the encapsulation layer is relatively low or relatively flat, so as to avoid breakage of the inorganic layer and thereby avoid encapsulation failure.

Abstract

一种OLED显示面板和OLED显示装置，OLED显示面板通过在底切结构（181）内设置填充层（14），且填充层（14）设置于公共电极层（134）远离辅助电极层（17）的一侧，使得填充层（14）将底切结构（181）的深度降低或者填平底切结构（181），消除底切结构（181）的段差，则在公共电极层（134）上形成封装层（15）时，避免无机层出现断裂，从而避免封装失效。

Description

OLED显示面板和OLED显示装置 技术领域
本申请涉及显示技术领域，尤其是涉及一种OLED显示面板和OLED显示装置。
 背景技术
OLED（Organic Light Emitting Diode，有机发光二极管）显示器件由于自发光、响应速度快、超轻薄、低功耗等优点被广泛应用。当前OLED显示器件为了降低压降，会在顶发光OLED显示器件中设置辅助阴极，通过辅助阴极和透明阴极的搭接，降低阴极层的压降，提高显示效果。具体的，当前辅助电极的设计是通过在OLED显示器件中设计底切结构，使得在透明阴极形成时，透明阴极可以镀入侧向蚀刻部分，与下方辅助阴极搭接，然后在上方形成封装层，完成OLED显示器件的制备过程。但这一过程中，由于封装层中的无机层会采用化学气相沉积的方式形成，导致无机层可能在底切处出现断裂，而无机层的断裂会导致封装失效，从而出现水氧入侵，且在OLED显示器件弯折时进一步加剧风险。
所以，现有OLED显示器件存在底切处的封装层中的无机层断裂所导致的封装失效的技术问题。
 技术问题
本申请实施例提供一种OLED显示面板和OLED显示装置，用以缓解现有OLED显示器件存在底切处的封装层中的无机层断裂所导致的封装失效的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种OLED显示面板，该OLED显示面板包括：
衬底；
驱动电路层，设置于所述衬底一侧；
发光功能层，设置于所述驱动电路层远离所述衬底的一侧，所述发光功能层包括公共电极层和发光材料层；
支撑层，设置于所述发光材料层远离所述公共电极层的一侧，所述OLED显示面板在所述支撑层设置区域形成有底切结构；
辅助电极层，设置于所述支撑层远离所述公共电极层的一侧，所述辅助电极层与所述公共电极层在所述底切结构处连接；
封装层，设置于所述发光功能层远离所述驱动电路层的一侧；
其中，所述OLED显示面板还包括填充层，所述填充层设置于所述底切结构内，且在所述底切结构内，所述填充层设置于所述公共电极层远离所述辅助电极层的一侧。
在一些实施例中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。
在一些实施例中，在所述过孔处，所述填充层与两侧的公共电极层接触，且所述填充层远离所述辅助电极层一侧的表面与位于所述过孔两侧的公共电极层的表面的高度一致。
在一些实施例中，所述填充层从所述底切结构延伸至所述过孔外，且在所述公共电极层的过孔外，所述填充层设置在所述公共电极层和所述封装层之间。
在一些实施例中，所述填充层包括第一填充层和第二填充层，所述第一填充层设置于所述第二填充层与所述公共电极层之间。
在一些实施例中，所述第一填充层的材料为导电材料，所述第二填充层的材料为非导电材料，且所述第二填充层在所述底切结构内覆盖在所述第一填充层上。
在一些实施例中，所述第二填充层的厚度大于所述第一填充层的厚度。
在一些实施例中，所述填充层还包括第三填充层，所述第三填充层设置于所述第一填充层和所述第二填充层之间，所述第三填充层与所述第二填充层的接触角小于所述第三填充层与所述第一填充层的接触角。
在一些实施例中，所述辅助电极层包括辅助电极，所述驱动电路层包括源漏极层，所述辅助电极设置于所述源漏极层。
同时，本申请实施例提供一种OLED显示装置，该OLED显示装置包括：
OLED显示面板，包括衬底、驱动电路层、发光功能层、支撑层、辅助电极层和封装层，所述驱动电路层设置于所述衬底一侧，所述发光功能层设置于所述驱动电路层远离所述衬底的一侧，所述发光功能层包括公共电极层和发光材料层，所述支撑层设置于所述发光材料层远离所述公共电极层的一侧，所述OLED显示面板在所述支撑层设置区域形成有底切结构，所述辅助电极层设置于所述支撑层远离所述公共电极层的一侧，所述辅助电极层与所述公共电极层在所述底切结构处连接，所述封装层设置于所述发光功能层远离所述驱动电路层的一侧，其中，所述OLED显示面板还包括填充层，所述填充层设置于所述底切结构内，且在所述底切结构内，所述填充层设置于所述公共电极层远离所述辅助电极层的一侧；
电子元件，设置于所述OLED显示面板一侧。
在一些实施例中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。
在一些实施例中，在所述过孔处，所述填充层与两侧的公共电极层接触，且所述填充层远离所述辅助电极层一侧的表面与位于所述过孔两侧的公共电极层的表面的高度一致。
在一些实施例中，所述填充层从所述底切结构延伸至所述过孔外，且在所述公共电极层的过孔外，所述填充层设置在所述公共电极层和所述封装层之间。
在一些实施例中，所述填充层包括第一填充层和第二填充层，所述第一填充层设置于所述第二填充层与所述公共电极层之间。
在一些实施例中，所述第一填充层的材料为导电材料，所述第二填充层的材料为非导电材料，且所述第二填充层在所述底切结构内覆盖在所述第一填充层上。
在一些实施例中，所述第二填充层的厚度大于所述第一填充层的厚度。
在一些实施例中，所述填充层还包括第三填充层，所述第三填充层设置于所述第一填充层和所述第二填充层之间，所述第三填充层与所述第二填充层的接触角小于所述第三填充层与所述第一填充层的接触角。
在一些实施例中，所述辅助电极层包括辅助电极，所述驱动电路层包括源漏极层，所述辅助电极设置于所述源漏极层。
在一些实施例中，所述支撑层包括支撑单元，所述发光功能层包括像素电极层，所述支撑单元设置于所述像素电极层。
在一些实施例中，所述驱动电路层包括平坦化层和钝化层，所述辅助电极层设置于所述平坦化层和所述钝化层之间。
 有益效果
本申请提供一种OLED显示面板和OLED显示装置；该OLED显示面板包括衬底、驱动电路层、发光功能层、支撑层、辅助电极层和封装层，驱动电路层设置于衬底一侧，发光功能层设置于驱动电路层远离衬底的一侧，发光功能层包括公共电极层和发光材料层，支撑层设置于发光材料层远离公共电极层的一侧，OLED显示面板在支撑层设置区域形成有底切结构，辅助电极层设置于支撑层远离公共电极层的一侧，辅助电极层与公共电极层在底切结构处连接，封装层设置于发光功能层远离驱动电路层的一侧，其中，OLED显示面板还包括填充层，填充层设置于底切结构内，且在底切结构内，填充层设置于公共电极层远离辅助电极层的一侧。本申请通过在底切结构内设置填充层，且填充层设置于公共电极层远离辅助电极层的一侧，使得填充层将底切结构的深度降低或者填平底切结构，消除底切结构的段差，则在公共电极层上形成封装层时，封装层中的无机层接触的区域深度较低或者较为平坦，避免无机层出现断裂，从而避免封装失效。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的OLED显示面板的第一种示意图。
图2为本申请实施例提供的OLED显示面板的第二种示意图。
图3为本申请实施例提供的OLED显示面板的第三种示意图。
图4为本申请实施例提供的OLED显示装置的示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例针对现有OLED显示器件存在底切处的封装层中的无机层断裂所导致的封装失效的技术问题，提供一种OLED显示面板和OLED显示装置，用以缓解上述技术问题。
如图1所示，本申请实施例提供一种OLED显示面板，该OLED显示面板包括：
衬底11；
驱动电路层12，设置于所述衬底11一侧；
发光功能层13，设置于所述驱动电路层12远离所述衬底11的一侧，所述发光功能层13包括公共电极层134和发光材料层133；
支撑层16，设置于所述发光材料层133远离所述公共电极层134的一侧，所述OLED显示面板在所述支撑层16设置区域形成有底切结构181；
辅助电极层17，设置于所述支撑层16远离所述公共电极层134的一侧，所述辅助电极层17与所述公共电极层134在所述底切结构181处连接；
封装层15，设置于所述发光功能层13远离所述驱动电路层12的一侧；
其中，所述OLED显示面板还包括填充层14，所述填充层14设置于所述底切结构181内，且在所述底切结构181内，所述填充层14设置于所述公共电极层134远离所述辅助电极层17的一侧。
本申请实施例提供一种OLED显示面板，该OLED显示面板通过在底切结构内设置填充层，且填充层设置于公共电极层远离辅助电极层的一侧，使得填充层将底切结构的深度降低或者填平底切结构，消除底切结构的段差，则在公共电极层上形成封装层时，封装层中的无机层接触的区域深度较低或者较为平坦，避免无机层出现断裂，从而避免封装失效。
在一种实施例中，所述填充层在所述底切结构内的高度与所述支撑层的高度相等。在设置填充层时，可以将填充层设置在底切结构内，通过将底切结构填充至与支撑层平齐，使得在底切结构对应区域，只会存在支撑层上的膜层形成的过孔，而这些过孔的深度较小，使得即使不将这些过孔填平，封装层的无机层形成时，由于底切结构的段差消除，且不同区域的无机层的高度差较小，无机层出现断裂的可能性较小甚至不会断裂，从而降低了封装层失效的可能性。
具体的，在填充层设置在底切结构内时，通过将填充层设置在各个底切结构内，使填充层分别设置在多个底切结构中，将底切结构填平，从而避免无机层出现断裂，避免OLED显示面板封装失效。
在一种实施例中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。通过将底切结构延伸至公共电极层的过孔，使得填充层除了填充底切结构外，填充层还能将底切结构对应区域的过孔进行填充，从而使得在底切结构对应区域，仅会存在部分过孔甚至无过孔，降低底切处的过孔或者孔的深度，从而减小封装层中无机层形成时的高度差，降低无机层的断裂风险，提高OLED显示面板的封装效果。
具体的，在底切结构对应区域，会存在底切结构形成的过孔、位于支撑层上的膜层形成的过孔，例如像素定义层形成的过孔、公共电极层形成的过孔，则可以使得填充层从底切结构底部公共电极层上向上延伸，使填充层填充至底切结构和膜层上的过孔，从而降低底切结构处与其他位置的高度差，在形成封装层中无机层时，减小无机层不同区域的高度差，从而避免封装失效，提高OLED显示面板的封装效果。
在一种实施例中，如图2所示，在所述过孔182处，所述填充层14与两侧的公共电极层134接触，且所述填充层14远离所述辅助电极层17一侧的表面位于所述过孔182两侧的公共电极层134的表面的高度一致。通过在底切结构处，将填充层从底切结构内延伸至公共电极层的过孔处，并使得填充层的上表面与公共电极层的上表面平齐，则填充层将底切结构对应位置的孔和过孔填平，使得封装层中无机层能够直接在平整表面上形成，无机层在底切结构对应位置不会形成高低不平的结构，从而消除无机层的高度差，降低无机层断裂的风险，提高OLED显示面板的封装效果，且在填充层的设置过程中，由于填充层设置在底切结构和过孔处，不会超出公共电极层，不会增加OLED显示面板的厚度。
具体的，如图2所示，在底切结构181对应区域，会存在底切结构181的过孔，像素定义层132的过孔，发光材料层133的过孔和公共电极层134的过孔，而多个过孔的叠加会导致底切结构对应区域的孔的深度较大，在形成无机层时，无机层会在此处发生断裂，且底切结构的存在会导致无机层无法在此处连接上，而本申请实施例通过将底切结构和过孔填充，具体可以使填充层将底切结构和每一膜层的过孔填平，从而消除过孔。
具体的，填充层分别设置在多个底切结构内，在OLED显示面板形成多个底切结构降低公共电极层的压降时，将填充层分别设置在多个底切结构内，使得各个填充层分离但填充至各个底切结构中，则填充层不会设置在其他区域的公共电极层上，不会增加OLED显示面板的厚度，且避免了底切结构处的段差导致封装层中无机层断裂的问题。
针对OLED显示面板的底切结构外的其他区域也会存在过孔或者段差，导致无机层出现断裂可能的问题。在一种实施例中，如图1所示，所述填充层14从所述底切结构181延伸至所述过孔182外，且在所述公共电极层134的过孔182外，所述填充层14设置在所述公共电极层134和所述封装层15之间。通过将填充层填充至底切结构内，并使得填充层延伸至公共电极层，对于OLED显示面板的其他区域形成的过孔或者段差，通过填充层将其填平，使得无机层在形成时，OLED显示面板的各个区域均为平面，则无机层形成时不会遇到过孔或者段差，则不会出现过孔和段差导致的断裂，提高OLED显示面板的封装效果。
具体的，在形成填充层时，通过整面形成填充层，使得填充层在各底切结构处填充在底切结构内并延伸至过孔外，从而使得填充层在OLED显示面板的各个区域的表面的高度一致，且填充层将OLED显示面板中的各个底切结构填平。
在一种实施例中，如图3所示，所述填充层14包括第一填充层141和第二填充层142，所述第一填充层141设置于所述第二填充层142与所述公共电极层134之间。通过将填充层划分为第一填充层和第二填充层，使得第一填充层和第二填充层填充底切结构和过孔时，第一填充层和第二填充层能够相互补充，将底切结构和过孔填平，从而避免无机层形成时出现断裂，提高OLED显示面板的封装效果。
在一种实施例中，如图3所示，所述第一填充层141的材料为导电材料，所述第二填充层142的材料为非导电材料，且所述第二填充层142在所述底切结构181内覆盖在所述第一填充层141上。通过使第一填充层的材料为导电材料，第二填充层的材料为非导电材料，则第一填充层能够进一步减小公共电极层的压降，且第一填充层能够避免第二填充层与公共电极层接触，在第二填充层被水氧入侵时，阻挡水氧入侵至公共电极层，而第二填充层能够填平底切结构和过孔，从而避免了底切结构处的段差导致封装层中无机层断裂的问题，提高OLED显示面板的封装效果。
具体的，第一填充层的材料包括氧化铟锌。
具体的，所述第二填充层的材料为有机材料，由于有机材料的柔性较好，且在形成有机材料可以采用喷墨打印的方式或者其他液体固化形成膜层的方式形成有机层，利用液体的流动性，将液体流入至底切结构内，且填充至过孔处，则可以将底切结构和过孔填平，避免底切结构和过孔处的段差或者高度差导致无机层形成时出现断裂，且由于第二填充层为有机材料，可以进一步提高OLED显示面板的柔性。
具体的，如图3所示，第一填充层141在底切结构181处会出现断开，使得第一填充层141覆盖在公共电极层134上，避免第二填充层142与公共电极层直接接触，从而避免第二填充层中存在的水氧或者其他物质通过公共电极层入侵至发光材料层，导致发光失效。例如，有机层形成时会存在溶剂、光引发剂、流平剂等有机成分以及有机层固化后存在的气体，在有机层与公共电极层直接接触时，会导致有机成分和气体从公共电极层入侵至发光材料层，导致发光材料失效，从而使得OLED显示面板失效；且在水氧从第二填充层的侧面入侵时，由于第一填充层的阻隔，水氧也只能入侵第二填充层，而不会进入到发光材料层中，从而提高封装效果。
在一种实施例中，所述第二填充层的厚度大于所述第一填充层的厚度。通过使得第二填充层的厚度大于第一填充层的厚度，且第一填充层在底切结构中会设置在第二填充层上，则第一填充层的厚度不会较厚，由于OLED显示面板中发光腔长由两个电极之间的距离决定，第一填充层为导电材料，在厚度过厚时会影响OLED显示面板的各像素的腔长，从而导致OLED显示面板的显示效果与预设显示效果不同。因此，在通过第一填充层阻隔第二填充层和公共电极层的同时，使第二填充层的厚度大于第二填充层的厚度，从而避免第一填充层对OLED显示面板的发光像素的腔长产生影响。
具体的，所述第一填充层的厚度小于50纳米，通过减小第一填充层的厚度，避免第一填充层影响OLED显示面板的发光像素的发光腔长。
在一种实施例中，如图3所示，所述填充层14还包括第三填充层143，所述第三填充层143设置于所述第一填充层141和所述第二填充层142之间，所述第三填充层143与所述第二填充层142的接触角小于所述第三填充层143与所述第一填充层141的接触角。通过设置第三填充层，使得第三填充层设置在第一填充层和第二填充层之间，且使得第三填充层与第二填充层的接触角小于第三填充层与第一填充层的接触角，则第二填充层在形成时，第二填充层能够较快的流平，且避免第二填充层出现不平的问题。
具体的，第三填充层的材料包括无机材料，通过采用无机材料形成第三填充层，使得第二填充层形成时，第二填充层对应的液体与第三填充层的接触角较小，加快第二填充层对应的液体流平，加快OLED显示面板的制备效率；同时，采用第三填充层设置在第一填充层和第二填充层之间，进一步避免第二填充层与公共电极层接触，且第三填充层采用无机材料，可以提高OLED显示面板的阻隔水氧的能力。
在一种实施例中，如图1所示，所述辅助电极层17包括辅助电极，所述驱动电路层12包括源漏极层127，所述辅助电极设置于所述源漏极层127。通过将辅助电极设置在源漏极层，则无需另外设置辅助电极层，从而降低OLED显示面板的厚度。
具体的，所述OLED显示面板包括显示区和非显示区，所述底切结构设置于非显示区，所述辅助电极设置于所述非显示区。由于底切结构设置在非显示区，使得在形成辅助电极层时，可以通过对源漏极层进行设计形成辅助电极，而辅助电极不会占用源漏极层在显示区的位置，且该设置方式无需增加工艺，且降低了OLED显示面板的厚度。
上述实施例以辅助电极设置于源漏极层进行了详细说明。但本申请实施例不限于此，辅助电极可以设置在其他膜层，例如为了减小过孔的深度，辅助电极层可以设置在源漏极层上。
在一种实施例中，所述驱动电路层还包括钝化层，所述辅助电极层设置于所述钝化层下。通过将辅助电极层设置在钝化层下，降低了底切结构处的过孔的深度。
在一种实施例中，如图1所示，所述支撑层16包括支撑单元，所述发光功能层13包括像素电极层131，所述支撑单元设置于所述像素电极层131。通过将支撑单元设置在像素电极层，从而无需另外设置支撑层，降低了OLED显示面板的厚度。
上述实施例以支撑层设置在像素电极层为例进行了详细说明，但本申请实施例不限于此，例如支撑层可以设置在像素电极层下。
在一种实施例中，如图1所示，所述驱动电路层12包括有源层121、第一栅极绝缘层122、第一金属层123、第二栅极绝缘层124、第二金属层125、层间绝缘层126、源漏极层127、平坦化层128。
在一种实施例中，发光材料层包括空穴注入层、空穴传输层、电子传输层和电子注入层。
在一种实施例中，电子传输层整面设置，空穴注入层、空穴传输层设置在像素定义层定义的像素区域。
在一种实施例中，如图1所示，所述封装层15包括第一无机层151、有机层152和第二无机层153。
同时，本申请实施例提供一种OLED显示面板制备方法，该OLED显示面板制备方法包括：
提供衬底；
在所述衬底上形成驱动电路层；所述驱动电路层包括源漏极层和平坦化层，所述源漏极层包括辅助电极层；
在所述驱动电路层上形成像素电极层；所述像素电极层包括支撑层；
在所述像素电极层上形成像素定义层，并刻蚀像素定义层形成像素区域；
刻蚀所述像素定义层和所述平坦化层形成底切结构；
在所述像素定义层形成发光材料层；
在所述发光材料层上形成公共电极层；所述辅助电极层与所述公共电极层在所述底切结构处连接；
在所述公共电极层上形成填充层；所述填充层设置于所述底切结构内；
在所述填充层上形成封装层。
本申请实施例提供一种OLED显示面板制备方法，该OLED显示面板制备方法制备的OLED显示面板通过在底切结构内设置填充层，且填充层设置于公共电极层远离辅助电极层的一侧，使得填充层将底切结构的深度降低或者填平底切结构，消除底切结构的段差，则在公共电极层上形成封装层时，封装层中的无机层接触的区域深度较低或者较为平坦，避免无机层出现断裂，从而避免封装失效。
在一种实施例中，所述在所述公共电极层上形成填充层的步骤包括：
在所述公共电极层上溅射镀膜形成第一填充层；所述第一填充层的材料包括导电材料；
在所述第一填充层上通过化学气相沉积形成第三填充层；所述第三填充层的材料包括无机材料；
在所述第三填充层上通过喷墨打印形成第二填充层；所述第二填充层的材料包括有机材料。
同时，如图4所示，本申请实施例提供一种OLED显示装置，该OLED显示装置包括：
OLED显示面板，包括衬底11、驱动电路层12、发光功能层13、支撑层16、辅助电极层17和封装层15，所述驱动电路层12设置于所述衬底11一侧，所述发光功能层13设置于所述驱动电路层12远离所述衬底11的一侧，所述发光功能层13包括公共电极层134和发光材料层133，所述支撑层16设置于所述发光材料层133远离所述公共电极层134的一侧，所述OLED显示面板在所述支撑层16设置区域形成有底切结构181，所述辅助电极层17设置于所述支撑层16远离所述公共电极层134的一侧，所述辅助电极层17与所述公共电极层134在所述底切结构181处连接，所述封装层15设置于所述发光功能层13远离所述驱动电路层12的一侧，其中，所述OLED显示面板还包括填充层14，所述填充层14设置于所述底切结构181内，且在所述底切结构181内，所述填充层14设置于所述公共电极层134远离所述辅助电极层17的一侧；
电子元件41，设置于所述OLED显示面板一侧。
本申请实施例提供一种OLED显示装置，该OLED显示装置包括OLED显示面板和电子元件，该OLED显示面板通过在底切结构内设置填充层，且填充层设置于公共电极层远离辅助电极层的一侧，使得填充层将底切结构的深度降低或者填平底切结构，消除底切结构的段差，则在公共电极层上形成封装层时，封装层中的无机层接触的区域深度较低或者较为平坦，避免无机层出现断裂，从而避免封装失效。
在一种实施例中，在所述OLED显示装置中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。
在一种实施例中，在所述OLED显示装置中，在所述过孔处，所述填充层与两侧的公共电极层接触，且所述填充层远离所述辅助电极层一侧的表面与位于所述过孔两侧的公共电极层的表面的高度一致。
在一种实施例中，在所述OLED显示装置中，所述填充层从所述底切结构延伸至所述过孔外，且在所述公共电极层的过孔外，所述填充层设置在所述公共电极层和所述封装层之间。
在一种实施例中，在所述OLED显示装置中，所述填充层包括第一填充层和第二填充层，所述第一填充层设置于所述第二填充层与所述公共电极层之间。
在一种实施例中，在所述OLED显示装置中，所述第一填充层的材料为导电材料，所述第二填充层的材料为非导电材料，且所述第二填充层在所述底切结构内覆盖在所述第一填充层上。
在一种实施例中，在所述OLED显示装置中，所述第二填充层的厚度大于所述第一填充层的厚度。
在一种实施例中，在所述OLED显示装置中，所述填充层还包括第三填充层，所述第三填充层设置于所述第一填充层和所述第二填充层之间，所述第三填充层与所述第二填充层的接触角小于所述第三填充层与所述第一填充层的接触角。
在一种实施例中，在所述OLED显示装置中，所述辅助电极层包括辅助电极，所述驱动电路层包括源漏极层，所述辅助电极设置于所述源漏极层。
在一种实施例中，所述支撑层包括支撑单元，所述发光功能层包括像素电极层，所述支撑单元设置于所述像素电极层。
在一种实施例中，所述驱动电路层包括平坦化层和钝化层，所述辅助电极层设置于所述平坦化层和所述钝化层之间。
根据上述实施例可知：
本申请实施例提供一种OLED显示面板和OLED显示装置；该OLED显示面板包括衬底、驱动电路层、发光功能层、支撑层、辅助电极层和封装层，驱动电路层设置于衬底一侧，发光功能层设置于驱动电路层远离衬底的一侧，发光功能层包括公共电极层和发光材料层，支撑层设置于发光材料层远离公共电极层的一侧，OLED显示面板在支撑层设置区域形成有底切结构，辅助电极层设置于支撑层远离公共电极层的一侧，辅助电极层与公共电极层在底切结构处连接，封装层设置于发光功能层远离驱动电路层的一侧，其中，OLED显示面板还包括填充层，填充层设置于底切结构内，且在底切结构内，填充层设置于公共电极层远离辅助电极层的一侧。本申请通过在底切结构内设置填充层，且填充层设置于公共电极层远离辅助电极层的一侧，使得填充层将底切结构的深度降低或者填平底切结构，消除底切结构的段差，则在公共电极层上形成封装层时，封装层中的无机层接触的区域深度较低或者较为平坦，避免无机层出现断裂，从而避免封装失效。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种OLED显示面板和OLED显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种OLED显示面板，其包括：
    衬底；
    驱动电路层，设置于所述衬底一侧；
    发光功能层，设置于所述驱动电路层远离所述衬底的一侧，所述发光功能层包括公共电极层和发光材料层；
    支撑层，设置于所述发光材料层远离所述公共电极层的一侧，所述OLED显示面板在所述支撑层设置区域形成有底切结构；
    辅助电极层，设置于所述支撑层远离所述公共电极层的一侧，所述辅助电极层与所述公共电极层在所述底切结构处连接；
    封装层，设置于所述发光功能层远离所述驱动电路层的一侧；
    其中，所述OLED显示面板还包括填充层，所述填充层设置于所述底切结构内，且在所述底切结构内，所述填充层设置于所述公共电极层远离所述辅助电极层的一侧。
  2. 如权利要求1所述的OLED显示面板，其中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。
  3. 如权利要求2所述的OLED显示面板，其中，在所述过孔处，所述填充层与两侧的公共电极层接触，且所述填充层远离所述辅助电极层一侧的表面与位于所述过孔两侧的公共电极层的表面的高度一致。
  4. 如权利要求2所述的OLED显示面板，其中，所述填充层从所述底切结构延伸至所述过孔外，且在所述公共电极层的过孔外，所述填充层设置在所述公共电极层和所述封装层之间。
  5. 如权利要求4所述的OLED显示面板，其中，所述填充层包括第一填充层和第二填充层，所述第一填充层设置于所述第二填充层与所述公共电极层之间。
  6. 如权利要求5所述的OLED显示面板，其中，所述第一填充层的材料为导电材料，所述第二填充层的材料为非导电材料，且所述第二填充层在所述底切结构内覆盖在所述第一填充层上。
  7. 如权利要求6所述的OLED显示面板，其中，所述第二填充层的厚度大于所述第一填充层的厚度。
  8. 如权利要求5所述的OLED显示面板，其中，所述填充层还包括第三填充层，所述第三填充层设置于所述第一填充层和所述第二填充层之间，所述第三填充层与所述第二填充层的接触角小于所述第三填充层与所述第一填充层的接触角。
  9. 如权利要求1所述的OLED显示面板，其中，所述辅助电极层包括辅助电极，所述驱动电路层包括源漏极层，所述辅助电极设置于所述源漏极层。
  10. 一种OLED显示装置，其包括：
    OLED显示面板，包括衬底、驱动电路层、发光功能层、支撑层、辅助电极层和封装层，所述驱动电路层设置于所述衬底一侧，所述发光功能层设置于所述驱动电路层远离所述衬底的一侧，所述发光功能层包括公共电极层和发光材料层，所述支撑层设置于所述发光材料层远离所述公共电极层的一侧，所述OLED显示面板在所述支撑层设置区域形成有底切结构，所述辅助电极层设置于所述支撑层远离所述公共电极层的一侧，所述辅助电极层与所述公共电极层在所述底切结构处连接，所述封装层设置于所述发光功能层远离所述驱动电路层的一侧，其中，所述OLED显示面板还包括填充层，所述填充层设置于所述底切结构内，且在所述底切结构内，所述填充层设置于所述公共电极层远离所述辅助电极层的一侧；
    电子元件，设置于所述OLED显示面板一侧。
  11. 如权利要求10所述的OLED显示装置，其中，所述公共电极层在所述底切结构对应区域形成有过孔，所述填充层从所述底切结构延伸至所述过孔。
  12. 如权利要求11所述的OLED显示装置，其中，在所述过孔处，所述填充层与两侧的公共电极层接触，且所述填充层远离所述辅助电极层一侧的表面与位于所述过孔两侧的公共电极层的表面的高度一致。
  13. 如权利要求11所述的OLED显示装置，其中，所述填充层从所述底切结构延伸至所述过孔外，且在所述公共电极层的过孔外，所述填充层设置在所述公共电极层和所述封装层之间。
  14. 如权利要求13所述的OLED显示装置，其中，所述填充层包括第一填充层和第二填充层，所述第一填充层设置于所述第二填充层与所述公共电极层之间。
  15. 如权利要求14所述的OLED显示装置，其中，所述第一填充层的材料为导电材料，所述第二填充层的材料为非导电材料，且所述第二填充层在所述底切结构内覆盖在所述第一填充层上。
  16. 如权利要求15所述的OLED显示装置，其中，所述第二填充层的厚度大于所述第一填充层的厚度。
  17. 如权利要求14所述的OLED显示装置，其中，所述填充层还包括第三填充层，所述第三填充层设置于所述第一填充层和所述第二填充层之间，所述第三填充层与所述第二填充层的接触角小于所述第三填充层与所述第一填充层的接触角。
  18. 如权利要求10所述的OLED显示装置，其中，所述辅助电极层包括辅助电极，所述驱动电路层包括源漏极层，所述辅助电极设置于所述源漏极层。
  19. 如权利要求10所述的OLED显示装置，其中，所述支撑层包括支撑单元，所述发光功能层包括像素电极层，所述支撑单元设置于所述像素电极层。
  20. 如权利要求10所述的OLED显示装置，其中，所述驱动电路层包括平坦化层和钝化层，所述辅助电极层设置于所述平坦化层和所述钝化层之间。
PCT/CN2021/136880 2021-11-24 2021-12-09 Oled显示面板和oled显示装置 WO2023092681A1 (zh)

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