WO2023085099A1 - Cover for heat generating electronic component - Google Patents
Cover for heat generating electronic component Download PDFInfo
- Publication number
- WO2023085099A1 WO2023085099A1 PCT/JP2022/040031 JP2022040031W WO2023085099A1 WO 2023085099 A1 WO2023085099 A1 WO 2023085099A1 JP 2022040031 W JP2022040031 W JP 2022040031W WO 2023085099 A1 WO2023085099 A1 WO 2023085099A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat
- cover
- electronic component
- generating electronic
- silicone rubber
- Prior art date
Links
- 239000000203 mixture Substances 0.000 claims description 47
- 229920002379 silicone rubber Polymers 0.000 claims description 43
- 239000004945 silicone rubber Substances 0.000 claims description 43
- 229920001296 polysiloxane Polymers 0.000 claims description 21
- 239000011231 conductive filler Substances 0.000 claims description 18
- 238000006116 polymerization reaction Methods 0.000 claims description 17
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 230000015556 catabolic process Effects 0.000 claims description 5
- 230000001629 suppression Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- -1 dimethylvinylsilyl group Chemical group 0.000 description 10
- 238000010292 electrical insulation Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007348 radical reaction Methods 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 description 1
- PFMVDWMJBIKZEB-UHFFFAOYSA-N 2,3-ditert-butylbenzenecarboperoxoic acid Chemical compound CC(C)(C)C1=CC=CC(C(=O)OO)=C1C(C)(C)C PFMVDWMJBIKZEB-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000003544 oxime group Chemical group 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to covers for heat-generating electronic components.
- a typical power transistor T has a configuration as shown in FIG.
- the transistor in FIG. 4 has a transistor body 11 and a terminal 12 projecting from one end surface of the transistor body 11 . Further, a plate-like radiator plate 13 is attached so as to be flush with the bottom surface 11a of the power transistor body 11 . One end of the radiator plate is inserted into a notch 11b formed by cutting the transistor main body 11, and the other end is installed in a direction opposite to the projecting direction of the terminal 12. As shown in FIG. One of the plurality of terminals 12 is connected to a plate-like radiator plate 13 inside the power transistor main body 11 . Heat generated in the power transistor is conducted to the outside through the thermally conductive material sandwiched between the radiator plate 13 and an external heat sink such as a metal chassis.
- thermally conductive materials liquid materials such as heat dissipating grease and molded products such as heat dissipating sheets are used from the viewpoint of insulation and assembly.
- the creepage distance for electrical insulation (the distance from other electronic components and the external heat sink) becomes large.
- Patent Documents 1 and 2 A method of three-dimensionally wrapping an electronic component by molding a hollow cover having an opening has been devised (Patent Documents 1 and 2).
- a tube-shaped cover is used as shown in FIG.
- a hollow cover 18 having an opening on one side is shaped to have an opening 19 as shown in FIG. 6, through which a transistor T is inserted.
- Patent Document 3 a structure has been proposed in which the thickness of each surface of the hollow cover is varied.
- the structure is such that heat dissipation can be improved by grounding the thick surface on the side of the heat sink where current leakage is likely to occur and reducing the thickness of the opposing surface.
- thermally conductive moldings are designed according to the cross-sectional dimensions of the power transistors, which has the advantage of being easily attached to the transistors.
- vibrations during transportation and processing in the manufacturing process can easily cause it to fall off or shift its position. , there is a problem that work efficiency and product yield are deteriorated.
- the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat-generating electronic component cover capable of suppressing falling off of an electronic component such as a transistor.
- the present invention provides a heat-generating electronic component cover comprising a hollow structure having one or more openings for inserting an electronic circuit component, wherein the hollow structure Provided is a heat-generating electronic component cover characterized by having at least one convex shape on an inner wall surface of a heat-generating electronic component.
- the height of the convex shape is in the range of 0.1 to 1 mm.
- the height of the convex shape is within this range, it is possible to sufficiently prevent falling off and misalignment during substrate manufacturing, and it is possible to smoothly insert transistors and the like.
- the heat-generating electronic component cover of the present invention is made of a cured product of a silicone rubber composition containing silicone rubber and a thermally conductive filler.
- the material forming the cover has thermal conductivity, electrical insulation, and is a soft elastic material. It has sufficient heat resistance so that it can be used even if it is exposed to high temperatures due to the generated heat.
- the cured product of the silicone rubber composition preferably has a thermal conductivity of 0.5 W/m ⁇ K or more.
- heat dissipation from heat-generating electronic components such as power transistors can be sufficiently promoted.
- the dielectric breakdown voltage in air at a thickness of 0.45 mm of the cured product of the silicone rubber composition is 4.5 kV or more.
- the silicone rubber composition contains the following (A) to (D) (A) an organopolysiloxane having an average degree of polymerization of 3,000 to 10,000: 100 parts by mass; (B) an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain: 10 to 100 parts by mass; (C) a thermally conductive filler: 500 to 2,700 parts by mass; and (D) a curing agent: an effective amount.
- thermally conductive silicone rubber composition is more preferable as the thermally conductive filler-containing silicone rubber composition that serves as the matrix of the heat-generating electronic component cover of the present invention.
- the total content of diorganocyclopolysiloxanes having 3 to 10 silicon atoms contained in component (A) is 500 ppm or less relative to the total amount of component (A). is preferred.
- Such a thermally conductive silicone rubber composition is more preferable as the silicone rubber composition that forms the matrix of the heat-generating electronic component cover of the present invention.
- FIG. 1 is a perspective view showing an embodiment of a heat-generating electronic component cover of the present invention
- FIG. It is a figure which shows the shape of the cover for exothermic electronic components with a convex-shaped part of an Example.
- FIG. 5 is a diagram showing the shape of a heat-generating electronic component cover without a convex portion in a comparative example
- 1 is a perspective view of an example of a power transistor
- FIG. 11 is a perspective view showing an example of use of a tubular cover
- FIG. 10 is a perspective view showing an example of use of the hollow cover;
- the inventors of the present invention conducted intensive studies to achieve the above object, and found that the inner wall surface of a hollow structure having one or more openings has one or more protrusions, thereby enabling attachment to a transistor. can be easily performed, and it is possible to suppress drop-off and displacement from the transistor, leading to the present invention.
- the present invention provides a heat-generating electronic component cover comprising a hollow structure having one or more openings for inserting an electronic circuit component, wherein one or more openings are provided on the inner wall surface of the hollow structure.
- a cover for an exothermic electronic component characterized in that it has a convex shape of at least one point.
- the heat-generating electronic component cover of the present invention comprises a hollow structure having one or more openings for inserting electronic circuit components, and one or more projections on the inner wall surface of the hollow structure. It is characterized by having a shape part.
- the heat-generating electronic component is not particularly limited as long as it is an electronic component that generates heat during use, such as a power transistor. A power transistor will be described below as an example of a heat-generating electronic component.
- FIG. 1 shows a heat-generating electronic component cover according to one embodiment of the present invention.
- This cover is suitable for use as a power transistor cover as previously shown in FIG.
- the exothermic electronic component cover of the present invention has a convex shape 3 on the inner wall for preventing the transistor T from coming off after the transistor T is inserted.
- the convex shape 3 will come into contact with the transistor after insertion, and the transistor will be pressurized, thereby preventing the cover 1 from coming off.
- the width of the opening of the heat-generating electronic component cover is sufficient as long as it is wide enough to insert the power transistor. or the width and height are usually 0.1 to 3 mm, preferably 0.3 to 2 mm, particularly 0.5 to 1 mm larger than the maximum width and maximum height.
- the cover of the present invention is installed in an electronic device. The placement of the power transistors does not result in excess space around the transistors. Further, the depth (depth) of the heat-generating electronic component cover should be such that at least 1/2, more preferably at least 4/5 of the terminals protrude from the opening 2 when attached to the power transistor. is preferred.
- the thickness of the heat-generating electronic component cover of the present invention is preferably 0.1 to 2.0 mm, more preferably 0.1 to 1.0 mm. If it is 0.1 mm or more, the withstand voltage strength is sufficiently high. For example, when a metal chassis or a metal heat radiation fin is used as an external heat radiation plate, short circuit does not occur and the self-supporting force is sufficient. Yes, shape is maintained. On the other hand, if the thickness of the plate portion (cover) is 2.0 mm or less, the heat dissipation effect is excellent.
- the convex shape of the inner wall surface of the heat-generating electronic component cover of the present invention is characterized by having one or more convex shapes, preferably 1 to 10, more preferably 1 to 5. If the number of protrusions is 10 or less, the space between the power transistor and the power transistor is sufficiently small and does not interfere with heat conduction.
- the shape of the convex portion of the present invention includes a columnar shape such as a square columnar shape, a triangular columnar shape, and a cylindrical columnar shape, and a frustum shape such as a square pyramidal shape, a triangular pyramidal shape, and a conical shape.
- the height of the convex shape of the inner wall surface of the heat-generating electronic component cover of the present invention is preferably in the range of 0.1 to 1 mm, more preferably 0.2 to 0.5 mm. If the height of the convex shape is 0.1 mm or more, it is possible to sufficiently suppress drop-off and displacement during substrate manufacturing.
- Each dimension of the inner wall surface of the heat-generating electronic component cover of the present invention is preferably larger than the dimension of the electronic component to be covered within the range of 0 to 1.0 mm, more preferably 0.1 to 0.8 mm. preferable. If the size of the inner wall surface of the heat-generating electronic component cover, which is to be increased relative to the size of the electronic component, is 1.0 mm or less, the effect of suppressing falling off due to the convex shape can be effectively obtained. If it is larger than the dimension, it becomes easier to insert electronic components.
- the material forming the heat-generating electronic component cover may be any material that has thermal conductivity and electrical insulation. Furthermore, a soft elastic material such as rubber is preferable in consideration of damage during insertion of electronic components and ease of insertion. In addition, it is preferable to use a silicone rubber composition in which a thermally conductive filler is incorporated into the silicone rubber, since there is a possibility that the electronic component may be exposed to high temperatures due to the heat generated by the electronic component.
- the thermally conductive filler-containing silicone rubber composition that serves as the matrix of the heat-generating electronic component cover of the present invention comprises the following components (A) to (D): (A) an organopolysiloxane having an average degree of polymerization of 3,000 to 10,000: 100 parts by mass; (B) an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain: 10 to 100 parts by mass; (C) Thermally conductive filler: 500 to 2,700 parts by mass, and (D) Curing agent: Effective amount and, if necessary, a thermally conductive silicone rubber composition containing additional components. preferable.
- Component (A) is the main component of the silicone rubber composition, and preferably has an average composition formula represented by the following formula (1).
- R is independently a monovalent hydrocarbon group having 1 to 8 carbon atoms, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, a vinyl group, an alkenyl group such as an allyl group, Aryl groups such as a phenyl group and a tolyl group, cycloalkyl groups such as a cyclohexyl group and a cyclopentyl group, and the like can be mentioned. Moreover, those obtained by substituting some or all of the hydrogen atoms directly attached to the carbon atoms of these groups with halogen atoms such as chlorine and fluorine may also be used. A methyl group, a phenyl group, a trifluoropropyl group and a vinyl group are preferred. Also, a is a positive number between 1.85 and 2.10.
- the organopolysiloxane preferably has a linear molecular structure, but may have a partially branched structure in the molecule. Furthermore, the organopolysiloxane preferably has a molecular chain end capped with a triorganosilyl group or a hydroxyl group. Examples of the triorganosilyl group include trimethylsilyl group, dimethylvinylsilyl group, trivinylsilyl group, methylphenylvinylsilyl group, methyldiphenylsilyl group, dimethylphenylsilyl group and dimethylhydroxysilyl group.
- the average degree of polymerization of component (A) is 3,000 to 10,000, preferably 5,000 to 10,000.
- the average degree of polymerization referred to in this specification refers to the average degree of polymerization determined from the number average molecular weight using tetrahydrofuran (THF) as a solvent and polystyrene as a standard substance by gel permeation chromatography (GPC). and
- the total content of diorganocyclopolysiloxanes having 3 to 10 silicon atoms contained in component (A) is preferably 500 ppm (by mass) or less relative to the total amount of component (A).
- the lower limit is preferably as low as possible and is not particularly limited, but may be, for example, 10 ppm or more.
- Component (B) is a component that undergoes a cross-linking reaction in the silicone rubber composition. It is an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain.
- the alkenyl group is preferably an alkenyl group having 2 to 8 carbon atoms, such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl and the like.
- the (B) component organopolysiloxane may be used singly or in combination of two or more having different average degrees of polymerization.
- the average degree of polymerization of component (B) is 2 to 2,000, preferably 10 to 2,000.
- the blending amount of component (B) is preferably 10 to 100 parts by mass, more preferably 30 to 70 parts by mass, per 100 parts by mass of component (A).
- Component (C) is a component used as a filler that imparts thermal conductivity in the silicone rubber composition.
- the component (C) may have thermal conductivity, and preferably has electrical insulation.
- examples include metal oxides such as alumina, silica, magnesia, red iron oxide, beryllia, titania, and zirconia; metal nitrides such as aluminum nitride, silicon nitride, and boron nitride; metal hydroxides such as magnesium hydroxide; Substances generally regarded as thermally conductive fillers, such as synthetic diamond or silicon carbide, can be used.
- the shape of the thermally conductive filler is not particularly limited, and may be crushed, spherical, or the like, if necessary.
- the average particle size (volume average particle size) of the thermally conductive filler is preferably 0.1 to 100 ⁇ m, more preferably 0.5 to 50 ⁇ m, as measured by a laser diffraction/scattering method (microtrack method). is more preferable, and 1 to 45 ⁇ m is even more preferable.
- the blending amount of component (C) is preferably 500 to 2,700 parts by mass, more preferably 600 to 2,500 parts by mass, per 100 parts by mass of component (A).
- thermally conductive fillers include silane coupling agents or partial hydrolysates thereof, alkylalkoxysilanes or partial hydrolysates thereof, organic silazanes, organopolysiloxane oils, and hydrolyzable functional group-containing organopolysiloxanes. It may be surface-treated with a surface treatment agent (wetter) such as. Examples of surface treatment agents include polysiloxanes having an alkoxy group or a hydroxy group in the molecule, such as dimethylpolysiloxane having one-end trialkoxysilyl group-blocked. can be random. These treatments may be carried out in advance on the thermally conductive filler itself, or may be carried out at the time of mixing the organopolysiloxane of component (A) or component (B) with the thermally conductive filler (C). .
- a surface treatment agent wetter
- surface treatment agents include polysiloxanes having an alkoxy group or a hydroxy group in the molecule, such as
- Component (D) is a component for curing the silicone rubber composition.
- the curing agent is appropriately selected according to the mechanism of the cross-linking reaction of the composition.
- organic peroxides are used, specifically benzoyl peroxide, monochlorobenzoyl peroxide, bis-2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, p-methylbenzoyl peroxide.
- Peroxide, di(t-butyl)perbenzoate, dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, di(t-butyl)peroxide and the like are exemplified.
- the organic peroxide is preferably added in an amount of 0.1 to 10 parts by weight, particularly 0.2 to 5 parts by weight, per 100 parts by weight of the total organopolysiloxane of components (A) and (B).
- an organohydrogensiloxane containing two or more hydrogen atoms directly bonded to a silicon atom per molecule and an effective amount (catalytic amount) of a platinum group element (preferably platinum) or compounds are used.
- the organopolysiloxane must contain two or more alkenyl groups per molecule.
- the organohydrogenpolysiloxane should be used in such an amount that hydrogen atoms directly bonded to silicon atoms are 0.5 to 5 times, especially 0.6 to 3 times the alkenyl groups contained in components (A) and (B). Blending is preferred.
- the hydrolyzable silane or siloxane containing two or more, preferably three or more hydrolyzable groups such as an alkoxy group, an acetoxy group, and an oxime group in one molecule is a cross-linking agent ( hardener).
- the amount to be added is 1 to 20 parts by weight, particularly 2 to 10 parts by weight per 100 parts by weight of the total amount of organopolysiloxane of components (A) and (B).
- organometallic compounds such as Sn, Ti, Fe, and Co as catalysts. In this case, both ends of the molecular chain of the organopolysiloxane must be blocked with hydroxyl groups or alkoxy groups.
- the blending amount of the curing agent may be an effective amount, and can be adjusted as appropriate according to the type and blending ratio of other components.
- Other examples include radical reactions using ultraviolet irradiation and electron beam irradiation, but the curing method is not limited to these.
- the silicone rubber composition of the present invention may be blended with the surface treatment agent described above and other components.
- optional components such as heat resistance improvers such as iron oxide and cerium oxide; viscosity modifiers such as silica; colorants; and internal release agents such as methylphenylpolysiloxane can be blended.
- the above silicone rubber composition can be produced by mixing the above components.
- a known method may be adopted for the production method, and is not particularly limited.
- a silicone rubber composition can be produced as follows. (1) The above components (A) to (C) and the optional surface treatment agent and internal release agent are put into a 5 L heat treatment kneader and mixed at 25 to 40° C. for 30 minutes. Then, after confirming that the temperature of the composition reached 170° C. by heating the inside of the kneader, heating and stirring are further carried out for 2 hours. (2) After heating and stirring, the mixture is cooled to about room temperature (25° C.) and the kneaded compound is taken out. Furthermore, using a twin roll, a curing agent is added to the compound and kneaded to obtain a thermally conductive silicone rubber composition.
- Molding of the heat-generating electronic component cover of the present invention is preferably carried out by mold molding in which the silicone rubber composition is injected into a molding mold and cured by heating. Molding is preferable from the viewpoint of dimensional accuracy of the molded product and mass productivity.
- the pressure of the silicone rubber composition into the mold is preferably 100 to 300 kgf/cm 2 . If the injection pressure is 300 kgf/cm 2 or less , the oily component of the silicone rubber composition and the thermally conductive filler will not separate. Curing does not progress. Also, in order to release the molded heat-generating electronic component cover from the mold, it is effective to apply and spray a surface active agent onto the surface of the mold.
- the heat-generating electronic component cover of the present invention preferably comprises a cured silicone rubber composition containing a silicone rubber and a thermally conductive filler.
- the material forming the cover has thermal conductivity and electrical insulation and is a soft elastic material, it is easy to insert electronic components without causing damage when the electronic components are inserted.
- it has sufficient heat resistance so that it can be used even when it is exposed to high temperatures due to heat generated by electronic components.
- the cured product of the silicone rubber composition preferably has a thermal conductivity of 0.5 W/m ⁇ K or higher.
- Such a structure can sufficiently promote the heat dissipation of heat-generating electronic components such as power transistors.
- the upper limit is preferably as high as possible and is not particularly limited, but may be, for example, 10 W/m ⁇ K or less.
- TPA-501 manufactured by Kyoto Electronics Industry Co., Ltd.
- TPA-501 manufactured by Kyoto Electronics Industry Co., Ltd.
- the dielectric breakdown voltage in air at a thickness of 0.45 mm of the cured product of the above silicone rubber composition is 4.5 kV or more.
- the upper limit is preferably as high as possible and is not particularly limited, but may be, for example, 10 kV or less.
- Dielectric breakdown measurement in air at a thickness of 0.45 mm of the cured product (molded product) is performed by attaching the measurement target to the electrode, applying a voltage of 4.5 kV in the air for 10 seconds, and measuring the presence or absence of leakage current. do it.
- Component (A) Dimethylpolysiloxane having vinyl groups at both ends and an average degree of polymerization of 8,000: 100 parts by mass
- (E) Component As the surface treatment agent (wetter component) of component (C), a one-end trialkoxysilyl group-blocked dimethylpolysiloxane represented by the following formula (E-1): 19 parts by mass; And a vinyl-containing dimethylpolysiloxane represented by the following formula (E-2): 6 parts by mass (The connection state of the siloxane units may be block or random.)
- Methylphenylpolysiloxane represented by the following formula as an internal release agent: 7 parts by mass (The connection state of the siloxane units may be block or random.)
- Thermal conductivity measurement The resulting thermally conductive silicone rubber composition was poured into a flat plate mold with a depth of 6 mm, and press-cured at 165° C. and 100 kgf/cm 2 for 10 minutes using a high-pressure press (manufactured by Shoji Iron Works Co., Ltd.). A thick sheet was produced. Using two 6 mm thick sheets prepared, TPA-501 (manufactured by Kyoto Electronics Industry Co., Ltd.) was used to measure the thermal conductivity at 25 ° C. by the hot disk method in accordance with ISO 22007-2. The conductivity was 2.8 W/m ⁇ K.
- Example 1 As described above, the thermally conductive silicone rubber composition was molded to form a heat-generating electronic component cover having the shape shown in Fig. 2 (with a convex portion). Dimensions (unit: mm) are shown in the figure.
- thermoly conductive silicone rubber composition was molded to form a heat-generating electronic component cover having the shape shown in Fig. 3 (without convex portions). Dimensions (unit: mm) are shown in the figure.
- Example 1 [Dropout test] The moldings produced in the shapes of Example 1 and Comparative Example 1 were mounted on a TO-247 type transistor (Fig. 4, CLA 50 E 1200 HB manufactured by IXYS) fixed to a vibration base with the terminal part facing upward, and the gravity Vibration with an amplitude of 10 cm and a frequency of 10 Hz was applied in the direction for 5 minutes, and the presence or absence of falling off from the transistor was confirmed. Table 1 shows the results.
- the exothermic electronic component cover can be prevented from falling off from the transistor by providing the convex shape.
- the present invention is not limited to the above embodiments.
- the above-described embodiment is an example, and any device having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect is the present invention. included in the technical scope of
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Abstract
Description
しかしながら、簡便に取り付けられることが可能であるが故に、ヒートシンクのような外部放熱板に固定されるまでは製造工程の搬送や加工作業時の振動で容易に脱落、位置ズレが発生する場合があり、作業効率や製品歩留まりを悪化させてしまう問題があった。 The internal dimensions of these thermally conductive moldings are designed according to the cross-sectional dimensions of the power transistors, which has the advantage of being easily attached to the transistors.
However, because it can be easily attached, until it is fixed to an external heat sink such as a heat sink, vibrations during transportation and processing in the manufacturing process can easily cause it to fall off or shift its position. , there is a problem that work efficiency and product yield are deteriorated.
(A)平均重合度が3,000~10,000であるオルガノポリシロキサン:100質量部、
(B)平均重合度が2~2,000であり、分子鎖両末端にのみアルケニル基を有するオルガノポリシロキサン:10~100質量部、
(C)熱伝導性充填材:500~2,700質量部、及び
(D)硬化剤:有効量
を含有する熱伝導性シリコーンゴム組成物であることが好ましい。 In addition, the silicone rubber composition contains the following (A) to (D)
(A) an organopolysiloxane having an average degree of polymerization of 3,000 to 10,000: 100 parts by mass;
(B) an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain: 10 to 100 parts by mass;
(C) a thermally conductive filler: 500 to 2,700 parts by mass; and (D) a curing agent: an effective amount.
以下、発熱性電子部品として電力トランジスタを例に挙げて説明する。 The heat-generating electronic component cover of the present invention comprises a hollow structure having one or more openings for inserting electronic circuit components, and one or more projections on the inner wall surface of the hollow structure. It is characterized by having a shape part. The heat-generating electronic component is not particularly limited as long as it is an electronic component that generates heat during use, such as a power transistor.
A power transistor will be described below as an example of a heat-generating electronic component.
(A)平均重合度が3,000~10,000であるオルガノポリシロキサン:100質量部、
(B)平均重合度が2~2,000であり、分子鎖両末端にのみアルケニル基を有するオルガノポリシロキサン:10~100質量部、
(C)熱伝導性充填材:500~2,700質量部、及び
(D)硬化剤:有効量
と、必要に応じて更なる成分を含有する熱伝導性シリコーンゴム組成物であることがより好ましい。 The thermally conductive filler-containing silicone rubber composition that serves as the matrix of the heat-generating electronic component cover of the present invention comprises the following components (A) to (D):
(A) an organopolysiloxane having an average degree of polymerization of 3,000 to 10,000: 100 parts by mass;
(B) an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain: 10 to 100 parts by mass;
(C) Thermally conductive filler: 500 to 2,700 parts by mass, and (D) Curing agent: Effective amount and, if necessary, a thermally conductive silicone rubber composition containing additional components. preferable.
(A)成分は、前記シリコーンゴム組成物の主剤となるものであり、下記式(1)で示される平均組成式を有するものが好ましい。
RaSiO(4-a)/2 (1) [(A) Organopolysiloxane having an average degree of polymerization of 3,000 to 10,000]
Component (A) is the main component of the silicone rubber composition, and preferably has an average composition formula represented by the following formula (1).
R a SiO (4-a)/2 (1)
(B)成分は、前記シリコーンゴム組成物において、架橋反応に供される成分である。平均重合度が2~2,000であり、分子鎖両末端にのみアルケニル基を有するオルガノポリシロキサンである。アルケニル基としては、炭素原子数2~8のアルケニル基が好ましく、例えば、ビニル基、アリル基、プロペニル基、イソプロペニル基、ブテニル基、ヘキセニル基、シクロヘキセニル基等が挙げられる。中でもビニル基、アリル基等炭素原子数2~4の低級アルケニル基が好ましく、特に好ましくはビニル基である。この(B)成分のオルガノポリシロキサンは、1種単独でも、平均重合度が異なる2種以上を組み合わせて用いてもよい。 [(B) Alkenyl Group-Containing Organopolysiloxane with an Average Degree of Polymerization of 2 to 2,000]
Component (B) is a component that undergoes a cross-linking reaction in the silicone rubber composition. It is an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain. The alkenyl group is preferably an alkenyl group having 2 to 8 carbon atoms, such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl and the like. Among them, lower alkenyl groups having 2 to 4 carbon atoms such as vinyl group and allyl group are preferred, and vinyl group is particularly preferred. The (B) component organopolysiloxane may be used singly or in combination of two or more having different average degrees of polymerization.
(C)成分は、前記シリコーンゴム組成物おいて、熱伝導性を付与する充填材として用いられる成分である。前記(C)成分は、熱伝導性を有するものであればよく、さらに電気絶縁性を備えることが好ましい。特に限定されないが、例えば、アルミナ、シリカ、マグネシア、ベンガラ、ベリリア、チタニア、ジルコニア等の金属酸化物、窒化アルミニウム、窒化ケイ素、窒化硼素等の金属窒化物、水酸化マグネシウム等の金属水酸化物、人工ダイヤモンドあるいは炭化ケイ素等の一般に熱伝導性充填材とされる物質を用いることができる。
熱伝導性充填材の形状は特に限定されず、必要に応じて破砕状、球状などとすることができる。
熱伝導性充填材の平均粒径(体積平均粒径)は、レーザー回折・散乱法(マイクロトラック法)による測定値で、0.1~100μmであることが好ましく、0.5~50μmであることがより好ましく、1~45μmであることが更に好ましい。 [(C) Thermally conductive filler]
Component (C) is a component used as a filler that imparts thermal conductivity in the silicone rubber composition. The component (C) may have thermal conductivity, and preferably has electrical insulation. Although not particularly limited, examples include metal oxides such as alumina, silica, magnesia, red iron oxide, beryllia, titania, and zirconia; metal nitrides such as aluminum nitride, silicon nitride, and boron nitride; metal hydroxides such as magnesium hydroxide; Substances generally regarded as thermally conductive fillers, such as synthetic diamond or silicon carbide, can be used.
The shape of the thermally conductive filler is not particularly limited, and may be crushed, spherical, or the like, if necessary.
The average particle size (volume average particle size) of the thermally conductive filler is preferably 0.1 to 100 μm, more preferably 0.5 to 50 μm, as measured by a laser diffraction/scattering method (microtrack method). is more preferable, and 1 to 45 μm is even more preferable.
(D)成分は、前記シリコーンゴム組成物を硬化するための成分である。前記硬化剤は組成物の架橋反応の機構により適宜選択される。 [(D) Curing agent]
Component (D) is a component for curing the silicone rubber composition. The curing agent is appropriately selected according to the mechanism of the cross-linking reaction of the composition.
本発明のシリコーンゴム組成物には、必要に応じて、上述した表面処理剤や、更に他の成分を配合してもよい。例えば、酸化鉄、酸化セリウム等の耐熱性向上剤;シリカ等の粘度調整剤;着色剤;メチルフェニルポリシロキサンなどの内添離型剤等の任意成分を配合することができる。 [Other ingredients]
If necessary, the silicone rubber composition of the present invention may be blended with the surface treatment agent described above and other components. For example, optional components such as heat resistance improvers such as iron oxide and cerium oxide; viscosity modifiers such as silica; colorants; and internal release agents such as methylphenylpolysiloxane can be blended.
上記シリコーンゴム組成物は、上記成分を混合して製造することができる。製造方法は公知の方法を採用すればよく、特に限定されない。例えば、以下のようにしてシリコーンゴム組成物を製造することができる。
(1)上記(A)~(C)成分、及び任意成分である表面処理剤及び内添離型剤を5Lの熱処理用ニーダー内に投入し、25~40℃で30分間混合する。その後、ニーダー内を加熱し組成物の温度が170℃になったことを確認した後、加熱撹拌を更に2時間行う。
(2)加熱攪拌後に、室温(25℃)付近まで冷却し、混練したコンパウンドを取り出す。さらに、二本ロールを用いて、前記コンパウンドに硬化剤を添加、混練して熱伝導性シリコーンゴム組成物とする。 [Manufacture of silicone rubber composition]
The above silicone rubber composition can be produced by mixing the above components. A known method may be adopted for the production method, and is not particularly limited. For example, a silicone rubber composition can be produced as follows.
(1) The above components (A) to (C) and the optional surface treatment agent and internal release agent are put into a 5 L heat treatment kneader and mixed at 25 to 40° C. for 30 minutes. Then, after confirming that the temperature of the composition reached 170° C. by heating the inside of the kneader, heating and stirring are further carried out for 2 hours.
(2) After heating and stirring, the mixture is cooled to about room temperature (25° C.) and the kneaded compound is taken out. Furthermore, using a twin roll, a curing agent is added to the compound and kneaded to obtain a thermally conductive silicone rubber composition.
本発明の発熱性電子部品用カバーの成型は、成型用金型に前記シリコーンゴム組成物を注入して加熱硬化させる金型成型が好ましく、特に熱軟化させた原料を型に注入し硬化させるトランスファー成型が成型物の寸法精度や量産性の観点から好ましい。トランスファー成型で成型を行う場合、金型へのシリコーンゴム組成物の圧入圧力は、100~300kgf/cm2が好ましい。圧入圧力が300kgf/cm2以下であれば、シリコーンゴム組成物のオイル状成分と熱伝導性充填材とが分離することがなく、100kgf/cm2以上であれば、圧入に時間がかかり原料の硬化が進行してしまうこともない。また、成型した発熱性電子部品用カバーを金型から脱型するために、金型表面に界面活性剤を塗布、スプレーすることが効果的である。 [Molding method (manufacturing method of heat-generating electronic component cover)]
Molding of the heat-generating electronic component cover of the present invention is preferably carried out by mold molding in which the silicone rubber composition is injected into a molding mold and cured by heating. Molding is preferable from the viewpoint of dimensional accuracy of the molded product and mass productivity. When molding is performed by transfer molding, the pressure of the silicone rubber composition into the mold is preferably 100 to 300 kgf/cm 2 . If the injection pressure is 300 kgf/cm 2 or less , the oily component of the silicone rubber composition and the thermally conductive filler will not separate. Curing does not progress. Also, in order to release the molded heat-generating electronic component cover from the mold, it is effective to apply and spray a surface active agent onto the surface of the mold.
本発明の発熱性電子部品用カバーは、シリコーンゴムと熱伝導性充填材を含むシリコーンゴム組成物の硬化物からなるものであることが好ましい。
このようなものであれば、カバーを形成する素材が、熱伝導性及び電気絶縁性を有し、柔らかい弾性材料であるため、電子部品挿入時にダメージを与えず、挿入も容易である。また、電子部品で発生した熱により高温に曝されても使用できる十分な耐熱性を備えている。 [Cured Product of Silicone Rubber Composition]
The heat-generating electronic component cover of the present invention preferably comprises a cured silicone rubber composition containing a silicone rubber and a thermally conductive filler.
In this case, since the material forming the cover has thermal conductivity and electrical insulation and is a soft elastic material, it is easy to insert electronic components without causing damage when the electronic components are inserted. In addition, it has sufficient heat resistance so that it can be used even when it is exposed to high temperatures due to heat generated by electronic components.
(1)下記に示す(A)~(C)成分、及び任意成分である(E)及び(F)成分を5Lの熱処理用ニーダー(井上製作所製)内に投入し、25~40℃で30分間混合した。その後、ニーダー内を加熱し組成物の温度が170℃になったことを確認した後、加熱撹拌を更に2時間おこなった。 [Preparation of Thermally Conductive Silicone Composition]
(1) The components (A) to (C) shown below and the optional components (E) and (F) are put into a 5 L heat treatment kneader (manufactured by Inoue Seisakusho) and heated at 25 to 40 ° C. for 30 Mix for a minute. Then, after confirming that the temperature of the composition reached 170° C. by heating the inside of the kneader, heating and stirring were further performed for 2 hours.
両末端にビニル基を有し、平均重合度が8,000であるジメチルポリシロキサン:100質量部
(B-1)両末端にビニル基を有し、平均重合度が500であるジメチルポリシロキサン:27質量部
熱伝導性充填材:
(C-1)平均粒径:1μm:破砕状アルミナ 1080質量部
(C-2)平均粒径:1μm:球状アルミナ 385質量部
(C-3)平均粒径:10μm:球状アルミナ 462質量部
(C-4)平均粒径:45μm:球状アルミナ 231質量部
(平均粒径はレーザー回折・散乱法により測定した体積平均粒径である。) (C) Component Thermally Conductive Filler:
(C-1) Average particle size: 1 μm: Crushed alumina 1080 parts by mass (C-2) Average particle size: 1 μm: Spherical alumina 385 parts by mass (C-3) Average particle size: 10 μm: Spherical alumina 462 parts by mass ( C-4) Average particle size: 45 μm: 231 parts by mass of spherical alumina (The average particle size is the volume average particle size measured by a laser diffraction/scattering method.)
前記(C)成分の表面処理剤(ウエッター成分)として、下記式(E-1)で表される片末端トリアルコキシシリル基封鎖ジメチルポリシロキサン:19質量部、
内添離型剤として下記式で表されるメチルフェニルポリシロキサン:7質量部
得られた熱伝導性シリコーンゴム組成物を深さ6mmの平板金型に流し込み、高圧プレス機(庄司鉄工(株)製)を用いて165℃、100kgf/cm2で10分間プレスキュアし、6mm厚のシートを作製した。
作製した6mm厚のシートを2枚使用し、TPA-501(京都電子工業(株)製)を用いて、ISO22007-2に準拠するホットディスク法により25℃における熱伝導率を測定した結果、熱伝導率は2.8W/m・Kであった。 [Thermal conductivity measurement]
The resulting thermally conductive silicone rubber composition was poured into a flat plate mold with a depth of 6 mm, and press-cured at 165° C. and 100 kgf/cm 2 for 10 minutes using a high-pressure press (manufactured by Shoji Iron Works Co., Ltd.). A thick sheet was produced.
Using two 6 mm thick sheets prepared, TPA-501 (manufactured by Kyoto Electronics Industry Co., Ltd.) was used to measure the thermal conductivity at 25 ° C. by the hot disk method in accordance with ISO 22007-2. The conductivity was 2.8 W/m·K.
混錬後の熱伝導性シリコーンゴム組成物をピストン、ポット、中型、下型からなるトランスファー成型機((株)ピーアールシー製)を用い165℃、100kgf/cm2で10分間加熱プレスすることで成型した。成型物を脱型後150℃/1時間の二次加硫をおこない、発熱性電子部品用カバーを作製した。発熱性電子部品用カバーの形状は下記実施例1および比較例1に示すとおりである。 [Molding of cover for exothermic electronic parts]
The thermally conductive silicone rubber composition after kneading is hot-pressed at 165° C. and 100 kgf/cm 2 for 10 minutes using a transfer molding machine (manufactured by PRC Co., Ltd.) consisting of a piston, a pot, a medium mold, and a lower mold. Molded. After demolding, the molded product was subjected to secondary vulcanization at 150° C./1 hour to produce a heat-generating electronic component cover. The shape of the heat-generating electronic component cover is as shown in Example 1 and Comparative Example 1 below.
15mm×4.5mm×高さ20mmの電極((株)セーフ製)に実施例1および比較例1で作製した発熱性電子部品用カバーを装着し、4.5kVの電圧を10秒間印加し、リーク電流の有無を測定した。結果を表1に示す。 [Measurement of dielectric breakdown of molding]
A 15 mm × 4.5 mm × height 20 mm electrode (manufactured by Safe Co., Ltd.) was fitted with the exothermic electronic component cover prepared in Example 1 and Comparative Example 1, and a voltage of 4.5 kV was applied for 10 seconds, The presence or absence of leakage current was measured. Table 1 shows the results.
実施例1および比較例1の形状で作製した成型物を、端子部分を上に向け振動台座に固定したTO-247型トランジスタ(図4、IXYS社製CLA 50 E 1200 HB)に装着し、重力方向へ振幅10cm、振動数10Hzの振動を5分間与え、トランジスタからの脱落の有無を確認した。その結果を表1に示す。 [Dropout test]
The moldings produced in the shapes of Example 1 and Comparative Example 1 were mounted on a TO-247 type transistor (Fig. 4, CLA 50 E 1200 HB manufactured by IXYS) fixed to a vibration base with the terminal part facing upward, and the gravity Vibration with an amplitude of 10 cm and a frequency of 10 Hz was applied in the direction for 5 minutes, and the presence or absence of falling off from the transistor was confirmed. Table 1 shows the results.
Claims (7)
- 電子回路部品を挿入するための1か所以上の開口部を持つ中空状構造体からなる発熱性電子部品用カバーであって、前記中空状構造体の内壁面に1か所以上の凸形状を持つものであることを特徴とする発熱性電子部品用カバー。 A heat-generating electronic component cover comprising a hollow structure having one or more openings for inserting electronic circuit components, wherein the inner wall surface of the hollow structure has one or more convex shapes. A cover for heat-generating electronic components, characterized in that it has a cover.
- 前記凸形状の高さが0.1~1mmの範囲であることを特徴とする請求項1に記載の発熱性電子部品用カバー。 The heat-generating electronic component cover according to claim 1, wherein the height of the convex shape is in the range of 0.1 to 1 mm.
- 前記発熱性電子部品用カバーが、シリコーンゴムと熱伝導性充填材を含むシリコーンゴム組成物の硬化物からなるものであることを特徴とする請求項1または請求項2に記載の発熱性電子部品用カバー。 3. The heat-generating electronic component according to claim 1, wherein the heat-generating electronic component cover is made of a cured silicone rubber composition containing silicone rubber and a thermally conductive filler. cover for.
- 前記シリコーンゴム組成物の硬化物が0.5W/m・K以上の熱伝導率を持つものであることを特徴とする請求項3に記載の発熱性電子部品用カバー。 The heat-generating electronic component cover according to claim 3, wherein the cured product of the silicone rubber composition has a thermal conductivity of 0.5 W/m·K or more.
- 前記シリコーンゴム組成物の硬化物の厚さ0.45mmにおける空気中での絶縁破壊電圧が4.5kV以上であることを特徴とする請求項3または請求項4に記載の発熱性電子部品用カバー。 5. The cover for heat-generating electronic parts according to claim 3, wherein a cured product of said silicone rubber composition having a thickness of 0.45 mm has a dielectric breakdown voltage in air of 4.5 kV or higher. .
- 前記シリコーンゴム組成物が、下記(A)~(D)
(A)平均重合度が3,000~10,000であるオルガノポリシロキサン:100質量部、
(B)平均重合度が2~2,000であり、分子鎖両末端にのみアルケニル基を有するオルガノポリシロキサン:10~100質量部、
(C)熱伝導性充填材:500~2,700質量部、及び
(D)硬化剤:有効量
を含有する熱伝導性シリコーンゴム組成物であることを特徴とする請求項3から請求項5のいずれか1項に記載の発熱性電子部品用カバー。 The silicone rubber composition contains the following (A) to (D)
(A) an organopolysiloxane having an average degree of polymerization of 3,000 to 10,000: 100 parts by mass;
(B) an organopolysiloxane having an average degree of polymerization of 2 to 2,000 and having alkenyl groups only at both ends of the molecular chain: 10 to 100 parts by mass;
(C) a thermally conductive filler: 500 to 2,700 parts by mass; and (D) a curing agent: an effective amount of the thermally conductive silicone rubber composition. The cover for exothermic electronic components according to any one of Claims 1 to 3. - 前記シリコーンゴム組成物において、前記(A)成分に含有されるケイ素原子数3~10のジオルガノシクロポリシロキサンの合計含有量が、前記(A)成分の全体量に対して500ppm以下であることを特徴とする請求項6に記載の発熱性電子部品用カバー。 In the silicone rubber composition, the total content of diorganocyclopolysiloxanes having 3 to 10 silicon atoms contained in component (A) is 500 ppm or less relative to the total amount of component (A). The heat-generating electronic component cover according to claim 6, characterized by:
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CN202280074158.6A CN118235243A (en) | 2021-11-10 | 2022-10-26 | Cover for heat-generating electronic component |
JP2023559545A JPWO2023085099A1 (en) | 2021-11-10 | 2022-10-26 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572666U (en) | 1980-06-05 | 1982-01-08 | ||
JPH0353510U (en) | 1989-09-29 | 1991-05-23 | ||
JPH04328163A (en) * | 1991-04-26 | 1992-11-17 | Shin Etsu Chem Co Ltd | Heat conductive silicone rubber composition |
JPH0631194U (en) * | 1992-09-29 | 1994-04-22 | 太陽誘電株式会社 | Hybrid integrated circuit device |
JP2007115816A (en) | 2005-10-19 | 2007-05-10 | Shin Etsu Chem Co Ltd | Mounting method of cover for heat generating electronic parts, and cover |
JP2014099550A (en) * | 2012-11-15 | 2014-05-29 | Shindengen Electric Mfg Co Ltd | Electronic apparatus |
-
2022
- 2022-10-26 WO PCT/JP2022/040031 patent/WO2023085099A1/en active Application Filing
- 2022-10-26 JP JP2023559545A patent/JPWO2023085099A1/ja active Pending
- 2022-10-26 CN CN202280074158.6A patent/CN118235243A/en active Pending
- 2022-11-01 TW TW111141524A patent/TW202324626A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572666U (en) | 1980-06-05 | 1982-01-08 | ||
JPH0353510U (en) | 1989-09-29 | 1991-05-23 | ||
JPH04328163A (en) * | 1991-04-26 | 1992-11-17 | Shin Etsu Chem Co Ltd | Heat conductive silicone rubber composition |
JPH0631194U (en) * | 1992-09-29 | 1994-04-22 | 太陽誘電株式会社 | Hybrid integrated circuit device |
JP2007115816A (en) | 2005-10-19 | 2007-05-10 | Shin Etsu Chem Co Ltd | Mounting method of cover for heat generating electronic parts, and cover |
JP2014099550A (en) * | 2012-11-15 | 2014-05-29 | Shindengen Electric Mfg Co Ltd | Electronic apparatus |
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JPWO2023085099A1 (en) | 2023-05-19 |
TW202324626A (en) | 2023-06-16 |
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