JPWO2023085099A1 - - Google Patents
Info
- Publication number
- JPWO2023085099A1 JPWO2023085099A1 JP2023559545A JP2023559545A JPWO2023085099A1 JP WO2023085099 A1 JPWO2023085099 A1 JP WO2023085099A1 JP 2023559545 A JP2023559545 A JP 2023559545A JP 2023559545 A JP2023559545 A JP 2023559545A JP WO2023085099 A1 JPWO2023085099 A1 JP WO2023085099A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Finger-Pressure Massage (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021183699 | 2021-11-10 | ||
| PCT/JP2022/040031 WO2023085099A1 (ja) | 2021-11-10 | 2022-10-26 | 発熱性電子部品用カバー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023085099A1 true JPWO2023085099A1 (ja) | 2023-05-19 |
| JPWO2023085099A5 JPWO2023085099A5 (ja) | 2024-07-12 |
Family
ID=86335689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023559545A Pending JPWO2023085099A1 (ja) | 2021-11-10 | 2022-10-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023085099A1 (ja) |
| CN (1) | CN118235243A (ja) |
| TW (1) | TW202324626A (ja) |
| WO (1) | WO2023085099A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572666U (ja) | 1980-06-05 | 1982-01-08 | ||
| JPH0353510U (ja) | 1989-09-29 | 1991-05-23 | ||
| JPH0791468B2 (ja) * | 1991-04-26 | 1995-10-04 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
| JPH0631194U (ja) * | 1992-09-29 | 1994-04-22 | 太陽誘電株式会社 | 混成集積回路装置 |
| JP4591699B2 (ja) | 2005-10-19 | 2010-12-01 | 信越化学工業株式会社 | 発熱性電子部品用カバー及びカバーの装着方法 |
| JP6021253B2 (ja) * | 2012-11-15 | 2016-11-09 | 新電元工業株式会社 | 電子機器 |
-
2022
- 2022-10-26 WO PCT/JP2022/040031 patent/WO2023085099A1/ja active Application Filing
- 2022-10-26 JP JP2023559545A patent/JPWO2023085099A1/ja active Pending
- 2022-10-26 CN CN202280074158.6A patent/CN118235243A/zh active Pending
- 2022-11-01 TW TW111141524A patent/TW202324626A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN118235243A (zh) | 2024-06-21 |
| WO2023085099A1 (ja) | 2023-05-19 |
| TW202324626A (zh) | 2023-06-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240417 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240417 |