WO2023079826A1 - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
WO2023079826A1
WO2023079826A1 PCT/JP2022/033373 JP2022033373W WO2023079826A1 WO 2023079826 A1 WO2023079826 A1 WO 2023079826A1 JP 2022033373 W JP2022033373 W JP 2022033373W WO 2023079826 A1 WO2023079826 A1 WO 2023079826A1
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WO
WIPO (PCT)
Prior art keywords
temperature
liquid crystal
light distribution
light
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/033373
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
昌志 高畑
康一 長尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2023557635A priority Critical patent/JP7615346B2/ja
Priority to CN202280073995.7A priority patent/CN118202298A/zh
Publication of WO2023079826A1 publication Critical patent/WO2023079826A1/ja
Priority to US18/656,142 priority patent/US20240288155A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/61—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present disclosure relates to lighting devices.
  • a lighting device that can change the irradiation range of light by providing the direction of the device so that it can be changed (for example, Patent Document 1).
  • the light distribution can be controlled more flexibly. configuration is considered.
  • the liquid crystal panel has a limited temperature range in which it can operate normally, it is necessary to take countermeasures assuming that the temperature of the liquid crystal panel exceeds the temperature range.
  • the present disclosure has been made in view of the above problems, and an object thereof is to provide a lighting device capable of suppressing a temperature rise of a liquid crystal panel provided on an emission path of light from a light source.
  • a lighting device includes a light source that emits light and a liquid crystal panel, and controls the transmittance and transmission range of light that passes through the liquid crystal panel, and controls the light distribution range of the light emitted from the light source to the outside.
  • a temperature information acquisition unit for acquiring information indicating the temperature of the light distribution unit; and suppressing an increase in the temperature of the light distribution unit when the temperature of the light distribution unit is equal to or higher than a predetermined temperature.
  • a control unit that performs a predetermined operation for performing.
  • FIG. 1 is a schematic diagram showing the main configuration of an illumination device.
  • FIG. 2 is a schematic diagram showing a configuration example of a light distribution section and an example of the positional relationship between a temperature sensor and a plurality of liquid crystal panels that constitute the light distribution section.
  • FIG. 3 is a perspective view of the light control panel according to the embodiment;
  • FIG. 4 is a plan view showing wiring of the array substrate according to the embodiment, and is a view of the array substrate viewed from above.
  • FIG. 5 is a plan view showing the wiring of the opposing substrate according to the embodiment, and is a view of the opposing substrate viewed from above.
  • FIG. 6 is a plan view showing the wiring of the light control panel according to the embodiment, and is a view of the light control panel viewed from above.
  • FIG. 7 is a cross-sectional view taken along line VV of FIG. 6.
  • FIG. FIG. 8 is a schematic diagram showing an example of attaching a temperature sensor to a liquid crystal panel.
  • FIG. 9 is a schematic diagram showing a configuration example of a temperature sensor provided integrally with the liquid crystal panel.
  • FIG. 10 is a schematic diagram showing an example of an acquisition range of temperature information on a liquid crystal panel.
  • FIG. 11 is a schematic diagram showing the main configuration and control device of the temperature sensor.
  • FIG. 12 is a diagram showing a voltage dividing circuit composed of a temperature detection resistance element and a reference resistance element.
  • FIG. 13 is a schematic diagram showing an example of operation control performed as temperature rise suppression control.
  • FIG. 14 is a block diagram showing a main configuration example of the system board.
  • FIG. 14 is a block diagram showing a main configuration example of the system board.
  • FIG. 15 is a flow chart showing the processing flow of the operation of the lighting device.
  • FIG. 16 is a flow chart showing an example of the temperature rise suppression process (step S7) shown in FIG.
  • FIG. 17 is a time chart showing the relationship between the operation of the liquid crystal panel and the temperature measurement period.
  • FIG. 18 is a flow chart showing an example of the temperature rise suppression process (step S7) shown in FIG.
  • FIG. 19 is a flow chart showing an example of the temperature rise suppression process (step S7) shown in FIG.
  • FIG. 20 shows an example of correspondence relationships between the temperature measured in the process of step S5, the space between the reflector and the light distribution unit provided with the temperature sensor, the number of revolutions of the fan, and the light emission intensity of the light source. It is a table.
  • FIG. 1 is a schematic diagram showing the main configuration of the illumination device 50.
  • the lighting device 50 includes a housing 51, a light source 52, a reflector 53, a light distribution section 700, a temperature sensor 400, an FPC (Flexible Printed Circuits) 54, a system board 60, and a heat dissipation section 55.
  • the housing 51 is a housing that houses the light source 52 , the reflector 53 , the light distribution section 700 , the temperature sensor 400 , the FPC 54 , the system board 60 and the heat dissipation section 55 .
  • the housing 51 is desirably made of a material (for example, aluminum) having excellent heat dissipation properties.
  • the light source 52 emits light in response to power supply.
  • the light source 52 is, for example, an LED (light emitting diode), but may be another form of electric light.
  • the reflector 53 guides the light emitted from the light source 52 to the light distribution section 700 side.
  • the light distribution unit 700 side of the reflector 53 is the z1 direction side
  • the light source 52 side of the reflector 53 is the z2 direction side.
  • the opposite direction of the z1 direction and the z2 direction is defined as the z direction.
  • the reflector 53 is an optical member whose opening width in a plan view orthogonal to the z-direction expands toward the z1-direction side from the z2-direction side where the light source 52 is located.
  • the reflector 53 guides the light emitted from the light source 52 to the light distribution section 700 side by refraction of a prism or the like or by mirror-finishing of the inner peripheral surface of the flared-out shape.
  • the light distribution unit 700 is provided so that the degree of transmission and the range of transmission of the light emitted from the light source 52 and the light emitted from the light source 52 and guided by the reflector 53 can be changed.
  • the temperature sensor 400 functions as a temperature information acquisition section that acquires information regarding the temperature of the light distribution section 700 .
  • FIG. 2 is a schematic diagram showing a configuration example of the light distribution section 700 and an example of the positional relationship between the temperature sensor 400 and the plurality of liquid crystal panels 1 that constitute the light distribution section 700.
  • the light distribution section 700 has a plurality of liquid crystal panels 1 arranged in the z direction.
  • Examples E1, E2, and E3 in FIG. 2 show a light distribution section 700 having four liquid crystal panels 1 .
  • the temperature sensor 400 may be provided on the z2 direction side of the liquid crystal panel 1 located closest to the z2 direction among the liquid crystal panels 1 of the light distribution section 700 as shown in example E1, or may be provided on the z2 direction side as shown in example E2.
  • liquid crystal panel 1 may be provided between two liquid crystal panels 1 among the plurality of liquid crystal panels 1 of the light distribution section 700, or as shown in example E3, among the plurality of liquid crystal panels 1 of the light distribution section 700 It may be provided on the z1 direction side of the liquid crystal panel 1 located closest to the z1 direction side.
  • the temperature sensor 400 quickly detects an increase in the temperature of the light distribution unit 700, which may rise in temperature due to the radiation heat from the configuration provided on the z2 direction side of the light distribution unit 700. easier.
  • the configuration provided on the z2 direction side with respect to the light distribution unit 700 refers to the light source 52 and a circuit provided on the system substrate 60 described later.
  • the temperature of the light distribution unit 700 due to the environment is increases can be detected more quickly by the temperature sensor 400 .
  • example E2 although it does not specialize in either case of example E1 or example E3 described above, it is possible to deal with both.
  • FIG. 1 the liquid crystal panel 1 included in the light distribution section 700 will be described with reference to FIGS. 3 to 7.
  • FIG. 1 is a diagrammatic representation of the liquid crystal panel 1 included in the light distribution section 700.
  • FIG. 3 is a perspective view of the light control panel according to the embodiment.
  • FIG. 4 is a plan view showing wiring of the array substrate according to the embodiment, and is a view of the array substrate viewed from above.
  • FIG. 5 is a plan view showing the wiring of the opposing substrate according to the embodiment, and is a view of the opposing substrate viewed from above.
  • FIG. 6 is a plan view showing the wiring of the light control panel according to the embodiment, and is a view of the light control panel viewed from above.
  • 7 is a cross-sectional view taken along line VV of FIG. 6.
  • FIG. In addition, in the xyz coordinates shown in FIGS. 3 to 6, the direction along the x1 direction and the x2 direction is referred to as the x direction.
  • the x1 direction and the x2 direction are opposite.
  • a direction along the y1 direction and the y2 direction is referred to as the y direction.
  • the y1 direction and the y2 direction are opposite.
  • the x-direction and the y-direction are orthogonal.
  • a plane along which the x-direction and the y-direction extend is orthogonal to the z-direction.
  • the liquid crystal panel 1 has an array substrate 2 , a counter substrate 3 , a liquid crystal layer 4 and a sealing material 30 .
  • the array substrate (first substrate) 2 is larger than the opposing substrate (second substrate) 3. That is, the area of the counter substrate (second substrate) 3 is smaller than the area of the array substrate (first substrate) 2 .
  • the array substrate 2 has transparent glass 23 (see FIG. 4).
  • the counter substrate 3 has a transparent glass 31 (see FIG. 5).
  • the array substrate 2 and the counter substrate 3 are square when viewed from above, but the shape of the substrate according to the present invention is not limited to square.
  • a first terminal group area 21 and a second terminal group area 22 are provided on the surface 2 a of the array substrate 2 .
  • the first terminal group area 21 is located at the end on the y1 side of the surface 2a of the array substrate 2 .
  • the second terminal group area 22 is located at the end of the surface 2a of the array substrate 2 on the x2 side.
  • the first terminal group area 21 and the second terminal group area 22 have an L shape when viewed from above.
  • the first terminal group 10 is arranged in the first terminal group area 21
  • the second terminal group 20 is arranged in the second terminal group area 22 . Since the area of the counter substrate 3 is smaller than that of the array substrate 2, the first terminal group 10 and the second terminal group 20 are exposed. Further, the first terminal group 10 and the second terminal group 20 are also simply referred to as terminal portions.
  • the first terminal group 10 includes a first terminal 101, a second terminal 102, a third terminal 103, a fourth terminal 104, a first pad 105, and a second terminal.
  • Pad 106 , third pad 107 , fourth pad 108 , fifth pad 109 , sixth pad 110 , seventh pad 111 and eighth pad 112 are included.
  • the seventh pad 111 and the eighth pad 112 are arranged side by side in order from the x1 side to the x2 side in the horizontal direction.
  • the first pad 105 and the eighth pad 112 are electrically connected via the lead wire 113 .
  • the second pad 106 and the seventh pad 111 are electrically connected via the lead wire 113 .
  • the third pad 107 and the sixth pad 110 are electrically connected via the lead wire 113 .
  • the fourth pad 108 and the fifth pad 109 are electrically connected via the lead wire 113 .
  • the second terminal group 20 includes a fifth terminal 201, a sixth terminal 202, a seventh terminal 203, an eighth terminal 204, a ninth pad 205, and a tenth terminal. It includes a pad 206 , an eleventh pad 207 , a twelfth pad 208 , a thirteenth pad 209 , a fourteenth pad 210 , a fifteenth pad 211 and a sixteenth pad 212 .
  • the fifteenth pad 211 and the sixteenth pad 212 are arranged side by side in order in the front-rear direction from the y2 side to the y1 side.
  • the ninth pad 205 and the sixteenth pad 212 are electrically connected via a lead wire 213 .
  • the tenth pad 206 and fifteenth pad 211 are electrically connected via a lead wire 213 .
  • the eleventh pad 207 and the fourteenth pad 210 are electrically connected via a lead wire 213 .
  • the twelfth pad 208 and the thirteenth pad 209 are electrically connected via a lead wire 213 .
  • the counter substrate 3 is arranged above the array substrate 2 (z1 side).
  • a sealing material 30 and a liquid crystal layer 4 are provided between the opposing substrate 3 and the array substrate 2 .
  • the sealing material 30 is annularly provided along the outer periphery of the opposing substrate 3 , and the inside of the sealing material 30 is filled with the liquid crystal layer 4 .
  • the area where the liquid crystal layer 4 is provided is the active area, the outside of the liquid crystal layer 4 is the frame area, and the first terminal group area 21 and the second terminal group area 22 are terminal areas.
  • the wiring of the array substrate 2 and the counter substrate 3 will be described.
  • the wiring is provided on the front surface of the substrate and the rear surface thereof. That is, the surface on which the wiring is provided is defined as the front surface, and the surface opposite to the front surface is defined as the back surface.
  • wiring is provided on the upper surface 2a of the front surface 2a and the rear surface 2b of the array substrate 2, and wiring is provided on the lower surface 3a of the front surface 3a and the rear surface 3b of the counter substrate 3. is provided.
  • the surface 2a of the array substrate 2 and the surface 3a of the counter substrate 3 are arranged to face each other with the liquid crystal layer 4 interposed therebetween.
  • the wiring 24 and the first electrode 25 are provided on the surface 2a of the transparent glass 23 of the array substrate 2.
  • the first terminal 101 and the fifth terminal 201 are electrically connected via the wiring 24 .
  • the second terminal 102 and the sixth terminal 202 are electrically connected via the wiring 24 .
  • the third terminal 103 and the seventh terminal 203 are electrically connected via the wiring 24 .
  • the fourth terminal 104 and the eighth terminal 204 are electrically connected via the wiring 24 .
  • a plurality of first electrodes 25 are connected to the wiring 24 that connects the second terminal 102 and the sixth terminal 202 .
  • a plurality of first electrodes 25 are connected to the wiring 24 that connects the third terminal 103 and the seventh terminal 203 .
  • the wiring 24 is provided with connecting portions C1 and C2.
  • the wiring 32 and the second electrode 33 are provided on the surface 3a of the opposing substrate 3. As shown in FIG. Specifically, wirings 32 are provided on the y1 side and the y2 side, respectively. The wiring 32 extends in the x direction. A second electrode 33 is electrically connected to the wiring 32 . The second electrodes 33 extend in the y direction. The wiring 32 is provided with connection portions C3 and C4. Although the number of the first electrodes 25 and the number of the second electrodes 33 are eight in the examples shown in FIGS. It does not indicate the number of two electrodes 33 . The number of the first electrodes 25 and the number of the second electrodes 33 may be two or more, and naturally may be nine or more.
  • the counter substrate 3 is arranged above the array substrate 2 with a space therebetween.
  • a liquid crystal layer 4 is filled between the array substrate 2 and the counter substrate 3 .
  • the connection portion C1 of the array substrate 2 and the connection portion C3 of the counter substrate 3 are electrically connected via a conductive column (not shown).
  • the connection portion C2 of the array substrate 2 and the connection portion C4 of the counter substrate 3 are electrically connected via a conductive column (not shown).
  • the first terminal 101, the second terminal 102, the third terminal 103, the fourth terminal 104, the first pad 105, the second pad 106, the third pad 107, and the fourth pad 108 are , can be electrically connected to the FPC 54 indicated by a two-dot chain line.
  • the plurality of liquid crystal panels 1 are connected to the D/A converter 64 via, for example, individually provided FPCs 54 .
  • the transmittance and transmittance range control of light passing through the liquid crystal panel 1 is realized by controlling the potentials applied to the first electrode 25 and the second electrode 33 .
  • the transmittance and transmission range of light passing through the liquid crystal panel 1 are controlled. Note that half of the four liquid crystal panels 1 arranged in the z-direction described with reference to FIG. 2 are p-wave polarized liquid crystal cells, and the other half are s-wave polarized liquid crystal cells.
  • alignment films having different rubbing directions are provided on one surface of the array substrate 2 and one surface of the counter substrate 3 which are opposed to each other with the liquid crystal layer 4 interposed therebetween.
  • the rubbing direction of the alignment film provided on one surface of the array substrate 2 is, for example, the y direction.
  • the rubbing direction of the alignment film provided on one surface of the opposing substrate 3 is, for example, the x direction.
  • FIG. 8 is a schematic diagram showing an example of attaching the temperature sensor 400 to the liquid crystal panel 1.
  • the adhesive layer 399 is a sheet-like translucent optical member having double-sided adhesiveness such as OCA (Optical Clear Adhesive). Note that the attachment of the temperature sensor 400 to the liquid crystal panel 1 is not limited to the adhesive layer 399, and may be attached using an adhesive, for example.
  • FIG. 9 is a schematic diagram showing a configuration example of a temperature sensor 400A provided integrally with the liquid crystal panel 1A.
  • a liquid crystal panel 1A integrally provided with the function of the liquid crystal panel 1 and the function of the temperature sensor 400 as shown in FIG. may In this case, temperature sensor 400A functions similarly to temperature sensor 400.
  • the temperature sensor 400A is laminated on the second electrode 33 on the side of the liquid crystal layer 4 of the opposing substrate 3 via an insulating layer, for example.
  • FIG. 10 is a schematic diagram showing an example of an acquisition range of temperature information on the liquid crystal panel 1.
  • temperature detection area SA and partial temperature detection area PA refer to areas where temperature information is acquired by temperature sensor 400 or temperature sensor 400A.
  • a part of the plate surface of the rectangular liquid crystal panel 1, and an area near one of the four corners may be used as the temperature detection area SA.
  • An area covering most of the plate surface of the rectangular liquid crystal panel 1 may be used as the temperature detection area SA.
  • a plurality of partial temperature detection areas PA may be arranged within the plate surface of the rectangular liquid crystal panel 1 .
  • the temperature sensor 400 provided as a configuration corresponding to example P4 in FIG. 10 will be described below with reference to FIG.
  • FIG. 11 is a schematic diagram showing the main configuration and control device of the temperature sensor 400.
  • the temperature sensor 400 has a sensor substrate 402 and a sensor section 403 .
  • the sensor base 402 has a temperature detection area SA and a peripheral area GA.
  • the temperature detection area SA includes a plurality of partial temperature detection areas PA.
  • the plurality of partial temperature detection areas PA are areas in which the plurality of temperature detection resistance elements ER of the sensor section 403 are provided. Note that the z-direction is also the normal direction of the sensor substrate 402 .
  • the temperature detection resistance element ER is an electric resistance made of an alloy, a compound containing a metal (metallic compound), or a metal.
  • the temperature detection resistance element ER may be a laminate in which a plurality of types of materials corresponding to at least one of metals, alloys, and metal compounds are laminated.
  • the term "alloy” or the like refers to a material that can be employed as the composition of the temperature detection resistor element ER.
  • the temperature detection resistor element ER has a configuration in which a plurality of L-shaped wirings having long sides along the y direction are connected in the x direction. In this aspect, a plurality of L-shaped wirings are connected such that the short sides of two L-shaped wirings adjacent to each other in the x-direction are alternated in the y-direction to form the temperature detection resistor element ER. formed.
  • the peripheral area GA is an area between the outer periphery of the temperature detection area SA and the edge of the sensor base 402, and is an area where the temperature detection resistance element ER is not provided.
  • a plurality of reference resistance elements 401 are provided in the peripheral area GA.
  • a temperature sensor is composed of the temperature detection resistance element ER provided in the partial temperature detection area PA and the reference resistance element 401 provided in the peripheral area GA.
  • the temperature detection resistance element ER and the reference resistance element 401 are connected to wiring provided on the FPC 54 .
  • Wiring included in the FPC 54 is connected to the system board 60 .
  • the wiring provided on the FPC 54 includes a ground potential line GND, a signal input line Vin, and a signal output line Vout.
  • a plurality of signal outputs provided corresponding to the number of temperature detection resistance elements ER such as the signal output lines Vout(1), Vout(2), . . . , Vout(15) encompasses lines.
  • a ground potential line GND shown in FIG. 11 is connected to one end of the temperature detection resistance element ER.
  • a ground potential line GND applies a ground potential to the temperature detection resistance element ER.
  • a signal input line Vin is connected to one end of the reference resistance element 401 .
  • the signal output line Vout is connected to the other end of the temperature detection resistance element ER and the other end of the reference resistance element 401 .
  • a drive signal for the temperature sensor 400 is input from the signal input line Vin.
  • the drive signal is output to the signal output line Vout via the temperature sensor 400 .
  • the strength of the signal output from the signal output line Vout depends on the temperature of the temperature detection resistance element ER connected to the signal output line Vout. That is, the temperature of the partial temperature detection area PA provided with the temperature detection resistance element ER can be detected based on the signal output from the signal output line Vout.
  • the number of electrical resistance elements provided as the reference resistance element 401 and the number of signal output lines Vout correspond to the number of temperature detection resistance elements ER.
  • the plurality of electrical resistance elements are connected in parallel to one signal input line Vin.
  • the number of temperature detection resistance elements ER is not limited to 15, and can be changed as appropriate.
  • the specific form of the temperature sensor 400, such as the wiring shape of the temperature detection resistance element ER is not limited to this, and can be changed as appropriate.
  • FIG. 12 is a diagram showing a voltage dividing circuit composed of the temperature detection resistance element ER and the reference resistance element 401.
  • FIG. The temperature detection resistance element ER and the reference resistance element 401 described with reference to FIG. 11 constitute a voltage dividing circuit as shown in FIG.
  • the signal output lines Vout(1), Vout(2), . . . , Vout(15) described above can be regarded as output lines of the voltage dividing circuit. Since the electrical resistance value of the reference resistor element 401 is fixed, the output from the signal output line Vout(k) of the voltage dividing circuit depends on the electrical resistance value of the temperature detection resistor element ER functioning as a variable resistor.
  • the electrical resistance value of the temperature detection resistance element ER corresponds to the temperature of the temperature detection resistance element ER.
  • the magnitude of the output from the signal output line Vout(k) corresponds to the temperature at the location where the temperature detection resistance element ER is provided. Therefore, by providing the temperature sensor 400 including the temperature detecting resistor element ER in the liquid crystal panel 1, the temperature at the location where the temperature detecting resistor element ER is provided can be detected based on the output from the signal output line Vout(k). Get information. Note that k is any natural number equal to or less than j.
  • the analog signal output from the signal output line Vout (k) is converted into a digital signal, and the temperature indicated by the digital signal is derived by software processing or circuit logic based on an algorithm similar to the software processing. Processing is performed by an integrated circuit (for example, an MCU 62 to be described later).
  • an integrated circuit for example, an MCU 62 to be described later.
  • a configuration for converting an analog signal into a digital signal and the integrated circuit may be the same or may be separate.
  • the configuration of the temperature sensor 400 corresponding to the example E4 of FIG. 10 has been described.
  • ER temperature detection resistance element 401
  • j 3.
  • the partial temperature detection area PA temperature detection resistance element ER
  • the sensor substrate 402 of the temperature sensor 400 shown in FIG. 11 is replaced with the substrate of the liquid crystal panel 1 (for example, the opposing substrate 3).
  • the output from the signal output line Vout(k) is transmitted to the circuit provided on the system board 60 via the FPC 54 .
  • the MCU 62 of the system board 60 which will be described later, performs temperature rise suppression control.
  • Temperature rise suppression control is operation control of the illumination device 50 that is performed to suppress a further rise in the temperature of the liquid crystal panel 1 .
  • a multiplexer may be provided on the signal output path from the signal output line Vout(j).
  • the configuration for example, the MCU 62
  • Vout(j) and the configuration may be connected separately.
  • FIG. 13 is a schematic diagram showing an example of operation control performed as temperature rise suppression control. Radiant heat from the configuration provided on the z2 direction side with respect to the light distribution section 700 described above may increase the temperature of the liquid crystal panel 1 included in the light distribution section 700 . Therefore, as shown in FIG. 13, by keeping the configuration away from the light distribution section 700, further temperature rise of the liquid crystal panel 1 due to the radiant heat can be suppressed. In particular, as shown in FIG. 13, by providing a space SP between the base MV and the light distribution unit 700 provided with the temperature sensor 400, the outside air is allowed to flow into the space SP, resulting in a cooling effect. can be generated. Therefore, it becomes easier to lower the temperature of the liquid crystal panel 1 .
  • Base MV includes light source 52 , reflector 53 , heat sink 55 and system board 60 .
  • one of the light distribution unit 700 provided with the temperature sensor 400 and the base MV is provided movably in the z direction with respect to the other. More specifically, the one is installed on the housing 51 via a guide member such as a direct-acting rail. Furthermore, the one is connected to a drive section (for example, a motor 552 to be described later) that operates to apply a moving force in the linear motion direction. The drive changes the z-direction position of the one relative to the other by movement.
  • a predetermined temperature or higher there is no significantly large space such as the space SP, and as shown in FIG. and are abutting or closer to each other.
  • the MCU 62 operates the driving section, and causes the light distribution section 700 provided with the temperature sensor 400 and the reflector 53 to operate. keep away.
  • the FPC 54 shown in FIGS. 1 and 13 includes the wiring connected to the liquid crystal panel 1 of the light distribution section 700, the ground potential line GND and the signal output line Vout(j) described with reference to FIG. Further, the FPC 54 shown in FIG. 13 has a length that can correspond to the positional relationship when the space SP is generated between the light distribution section 700 provided with the temperature sensor 400 and the base MV. Further, the housing 51 is designed in advance so as to accommodate each component other than the housing 51 included in the lighting device 50 even when the space SP is maximized. For example, when one of the light distribution unit 700 provided with the temperature sensor 400 and the base MV is configured to operate, the housing 51 has an extending length in the z direction as shown in FIG. 13 in advance. When the light distribution unit 700 provided with the temperature sensor 400 and the base MV are closer than in the example shown in FIG. A space is generated on the z1 direction side.
  • the heat dissipation unit 55 includes at least one of a configuration for suppressing the temperature rise of the system board 60 and a configuration for operating during temperature rise suppression control.
  • a configuration for suppressing the temperature rise of the system board 60 for example, a heat sink provided between the light source 52 and the system board 60, a fan 551 to be described later, and the like can be cited.
  • the configuration that operates during the temperature rise suppression control is, for example, the drive unit described above, but is not limited to this and can be changed as appropriate.
  • a heat sink provided between the light source 52 and the system board 60 facilitates the radiation of heat generated by at least one of the light source 52 and the system board 60 .
  • the heat sink abuts on at least one of a circuit forming the light source 52 or an outer peripheral surface of the housing of the light source 52 and a circuit provided on the system board 60 .
  • the shape of the heat sink and the arrangement of the heat sink and the fan 551 are determined so that the airflow generated by the operation of the fan 551 cools the heat sink more efficiently.
  • FIG. 14 is a block diagram showing a main configuration example of the system board 60.
  • the system board 60 includes, for example, a communication unit 61, an MCU (Micro Controller Unit) 62, an FPGA (Field Programmable Gate Array) 63, a D (Digital)/A (Analog) conversion unit 64, and a light source drive unit 65. , a connection portion 66 , a fan controller 67 , and a linear drive portion 68 are provided.
  • the communication unit 61 communicates with the external information processing device 300 .
  • the communication unit 61 has, for example, a circuit that functions as a NIC (Network Interface Controller).
  • the communication unit 61 receives a signal including a command regarding the operation of the lighting device 50 transmitted from the information processing device 300 and outputs information indicating the command to the MCU 62 .
  • the information processing device 300 is, for example, a mobile terminal such as a smart phone, but is not limited to this.
  • the information processing device 300 may be a stationary information processing device such as a server or a PC (Personal Computer) provided for controlling the lighting device 50, or information in another form not illustrated here. It may be a processing device.
  • the command related to the operation of the lighting device 50 transmitted from the information processing device 300 is, for example, a command specifying ON/OFF of light irradiation by the lighting device 50, a light irradiation range, a light intensity, and the like. , and any items that can be specified individually within the operation control range of the lighting device 50 can be included in the command.
  • the MCU 62 outputs various signals to the FPGA 63 , the light source drive section 65 and the connection section 66 in accordance with the command regarding the operation of the lighting device 50 obtained from the information processing device 300 via the communication section 61 . That is, the MCU 62 controls various components of the lighting device 50 so that the lighting device 50 operates according to the operation from the information processing device 300 .
  • the MCU 62 acquires the output from the signal output line Vout(k), and when the output indicates that the temperature of the liquid crystal panel 1 has reached or exceeded a predetermined temperature, the MCU 62 performs temperature rise suppression control. .
  • the FPGA 63 Under the control of the MCU 62 , the FPGA 63 performs information processing for controlling the operation of the light distribution section 700 and outputs a signal indicating the result of the information processing to the D/A conversion section 64 . For example, if a command regarding the operation of the lighting device 50 transmitted from the information processing device 300 includes a designation regarding a light irradiation range, the FPGA 63 distributes the light so that the irradiation range corresponding to the designation is irradiated with light. Information processing for operating the unit 700 is performed.
  • the D/A conversion section 64 is configured to output analog signals for operating the plurality of liquid crystal panels 1 included in the light distribution section 700 based on the digital signals from the FPGA 63 .
  • the configuration may consist of one circuit or may include multiple circuits.
  • the light source drive unit 65 is a controller that performs ON/OFF control of the light source 52 and light emission intensity control when the light source 52 is ON under the control of the MCU 62 .
  • the controller may be a single circuit or may include multiple circuits.
  • the connection unit 66 is an interface that connects the MCU 62 and the input/output (ground potential line GND, signal input line Vin, and signal output line Vout described above) of the temperature sensor 400 (or temperature sensor 400A). Also, the connecting portion 66 is connected to the MCU 62 and intervenes in the signal transmission path between the MCU 62 and the temperature sensor 400 .
  • the description regarding temperature sensor 400 also applies to temperature sensor 400A.
  • the fan controller 67 is a controller that performs ON/OFF control of the fan 551 and the rotation speed (rpm) control when the fan is ON.
  • the fan controller 67 controls the rotation speed (rpm) of the fan 551 by, for example, PWM (Pulse Width Modulation) control.
  • the controller may be a single circuit or may include multiple circuits.
  • the direct drive unit 68 is a controller that performs ON/OFF control of the motor 552, rotation speed (rpm) control when ON, and rotation direction control when ON.
  • the controller may be a single circuit or may include multiple circuits.
  • the fan 551 and the motor 552 are shown as components included in the heat radiating section 55, but at least one of the fan 551 and the motor 552 may be omitted. Moreover, when both the fan 551 and the motor 552 are omitted, the structure included in the heat radiation part 55 becomes the heat sink mentioned above. Also, when the fan 551 is omitted, the fan controller 67 is omitted. Further, when the motor 552 is omitted, the direct drive section 68 is omitted.
  • FIG. 15 The flow of processing related to temperature rise suppression control will be described below with reference to FIGS. 15 to 20.
  • FIG. 15 The flow of processing related to temperature rise suppression control will be described below with reference to FIGS. 15 to 20.
  • FIG. 15 is a flowchart showing the processing flow of the operation of the lighting device 50.
  • step S1 each component provided on the system board 60 performs an initial operation (step S2).
  • step S2 the MCU 62 performs processing corresponding to the operation mode so that the lighting device 50 operates in the operation mode (emission intensity, light distribution range, etc.) specified by the signal transmitted from the information processing device 300.
  • the FPGA 63 , the light source driving section 65 and the like start operating under the operation control of the MCU 62 .
  • step S3 the light distribution unit 700 operates (step S3), and the light transmittance of the light distribution unit 700 is controlled so that the light distribution range specified by the operation mode described above is irradiated with light. .
  • step S3 the light source 52 is turned on (step S4).
  • step S5 temperature measurement is performed (step S5). Specifically, the MCU 62 operates the temperature sensor 400 and obtains information about the temperature of the liquid crystal panel 1 by obtaining an output from the signal output line Vout(k). Data indicating the correspondence relationship between the magnitude of the output from the signal output line Vout(k) and the temperature of the liquid crystal panel 1 provided with the temperature sensor 400 is obtained in advance through experiments or the like. held.
  • the MCU 62 determines whether or not a temperature equal to or higher than a predetermined temperature is measured in step S5 (step S6). When the temperature equal to or higher than the predetermined temperature is measured (step S6; Yes), the MCU 62 performs temperature rise suppression processing (step S7).
  • the temperature rise suppression process is not limited to the formation of the space SP described with reference to FIG.
  • by turning off the light source 52 further heating of the liquid crystal panel 1 by the radiant heat from the light source 52 can be suppressed.
  • a case where the process of turning off the light source 52 is employed as the temperature rise suppression process will be described below with reference to FIG. 16 .
  • FIG. 16 is a flowchart showing an example of the flow of temperature rise suppression processing (step S7) shown in FIG.
  • the light source driver 65 turns off the light source 52 (step S11).
  • the operation of the light distribution unit 700 is stopped via the FPGA 63 and the D/A conversion unit 64 under the control of the MCU 62 (step S12). Stopping the operation of the light distribution unit 700 means stopping the operation of the plurality of liquid crystal panels 1 included in the light distribution unit 700 .
  • step S7 After the temperature rise suppression process (step S7) shown in FIG. 15, unless the lighting device 50 is powered off (step S8; No), the process proceeds to step S5 again.
  • step S8; Yes the operation of the lighting device 50 ends.
  • step S6; No if the temperature equal to or higher than the predetermined temperature is not measured (step S6; No), the process of step S7 is not performed and the process proceeds to the branch of step S8.
  • step S5 the implementation period of step S5 described with reference to FIG. 15, that is, the temperature measurement period, is not the entire operation period of the lighting device 50 after the process of step S4.
  • the temperature measurement period will be described below with reference to FIG.
  • FIG. 17 is a time chart showing the relationship between the operation of the liquid crystal panel 1 and the temperature measurement period.
  • one of the adjacent electrodes is 0 volt (V).
  • the other has a potential exceeding 0 volt (V)
  • a state occurs in which the liquid crystal layer 4 is affected by an electric field due to the potential difference between the two adjacent electrodes.
  • the potential applied to each of the two adjacent electrodes is periodically switched. a first state, one at 0 volts (V) and the other at a potential greater than 0 volts (V); A certain second state is periodically switched.
  • 17 shows the operation of the liquid crystal panel 1, which switches from the second state to the first state at switching timings ST1, ST3, and ST5, and switches from the first state to the second state at switching timings ST2, ST4, and ST6.
  • a time chart is shown as an example. 17 shows only the switching timings ST1, . . . , ST6 of the switching timings between the first state and the second state. Similar switching timing occurs periodically.
  • the temperature measurement period by the operation of the temperature sensor 400 is a period that does not overlap with the switching timing between the first state and the second state. Specifically, temperature measurement is performed during the period ST shown in FIG. As a result, it is possible to suppress deterioration in temperature measurement accuracy due to the influence of electrical noise that may occur at the timing of switching between the first state and the second state.
  • FIG. 16 illustrates the case where the process of turning off the light source 52 is adopted as the temperature rise suppression process, but as the temperature rise suppression process, there is a process of further increasing the cooling (air cooling) capacity by the operation of the fan 551. A case where it is performed will be described with reference to FIG. 18 .
  • FIG. 18 is a flowchart showing an example of the flow of temperature rise suppression processing (step S7) shown in FIG.
  • step S13 the process of increasing the rotation speed of the fan 551 is further performed (step S13).
  • the fan controller 67 increases the rotational speed (rpm) of the fan 551 under the control of the MCU62.
  • the increase in the number of revolutions (rpm) here means that the number of revolutions (rpm) of the fan 551 is increased during the period when the temperature rise suppression process is performed rather than during the period when the temperature rise suppression process is not performed. .
  • the fan 551 may not rotate while the temperature rise suppression process is not being performed, and may rotate while the temperature rise suppression process is being performed.
  • the temperature rise suppression process may be performed.
  • the fan 551 rotates at a predetermined number of revolutions (rpm) even during the period when the temperature rise suppression process is not performed.
  • the process of step S13 may be performed in any order with the process of step S11 and the process of step S12, and may be performed in parallel with the process of step S11 and the process of step S12.
  • the predetermined temperature is, for example, a temperature that interferes with the operation of the liquid crystal panel 1 or a temperature that may interfere with the operation of the liquid crystal panel 1 if the temperature further increases.
  • 90° C. is mentioned as a temperature that may interfere with the operation of the liquid crystal panel 1, but the temperature rise suppression process is started at a stage lower than 90° C. (for example, 50° C.).
  • the temperature rise suppression process is started at a stage lower than 90° C. (for example, 50° C.).
  • FIG. 19 is a flowchart showing an example of the flow of temperature rise suppression processing (step S7) shown in FIG.
  • the space SP is controlled according to the temperature measured in the process of step S5 (step S21)
  • the light source 52 is controlled according to the temperature measured in the process of step S5 (step S22)
  • step The light distribution unit 700 is controlled according to the temperature measured in the process of S5 (step S23)
  • the fan 551 is controlled according to the temperature measured in the process of step S5 (step S24).
  • FIG. 20 shows the temperature measured in the process of step S5, the space SP between the reflector 53 and the light distribution unit 700 provided with the temperature sensor 400, the rotation speed of the fan 551, and the light emission intensity of the light source 52.
  • It is a table
  • the predetermined temperature is 50°C
  • the temperature rise suppression process is not performed during the period when the temperature is measured to be less than 50°C.
  • the emission intensity of the light source 52 is the highest (100%).
  • the space SP is set to 3 centimeters (cm) in the process of step S21, and the rotation speed (rpm) of the fan is set to the maximum in the process of step S24. It may be set to 25 percent (%) of the number of revolutions, and the emission intensity of the light source 52 may be set to 75% of the maximum intensity in the process of step S22. Further, when a temperature of 60° C. or more and less than 70° C. is measured in the process of step S5, the space SP is set to 5 centimeters (cm) in the process of step S21, and the rotation speed (rpm) of the fan is set in the process of step S24.
  • the emission intensity of the light source 52 may be set to 50% of the maximum intensity in the process of step S22.
  • the space SP is set to 8 centimeters (cm) in the process of step S21, and the rotation speed (rpm) of the fan is set in the process of step S24.
  • the rotation speed (rpm) of the fan is set in the process of step S24.
  • step S5 the space SP is set to 10 centimeters (cm) in the process of step S21, and the number of revolutions (rpm) of the fan is set to the maximum in the process of step S24. number (100%), and the emission intensity of the light source 52 may be set to 10% in the process of step S23.
  • the control of the light distribution unit 700 in the process of step S23 that is, the control of the plurality of liquid crystal panels 1 included in the light distribution unit 700
  • the space SP is expanded and the space SP is expanded by the temperature rise suppression process.
  • the operation may be performed so as to increase the light transmittance of the liquid crystal panel 1 as much as possible.
  • the light transmittance of the liquid crystal panel 1 may also be increased stepwise, similarly to the stepwise control of the space SP and the light emission intensity according to the temperature shown in FIG.
  • the description with reference to FIGS. 19 and 20 exemplifies the case where the space SP is stepwise controlled according to the temperature measured in the process of step S5, but the control of the space SP is such stepwise control.
  • the control of the space SP is such stepwise control. not limited to For example, when the temperature rise suppression process is not performed, the reflector 53 and the light distribution unit 700 provided with the temperature sensor 400 are brought into contact as shown in FIG. A space SP may be generated between the reflector 53 and the light distribution section 700 provided with the temperature sensor 400 as shown in FIG. Further, when the process of changing the space SP is performed as the temperature rise suppression process, at least one of the rotation speed control of the fan 551 and the emission intensity control of the light source 52 may be omitted.
  • the rotational speed control of the fan 551 when the rotational speed control of the fan 551 is performed as the temperature rise suppression process, at least one of the emission intensity control of the light source 52 and the control of the space SP may be omitted. Further, when the light emission intensity control of the light source 52 is performed as the temperature rise suppression process, at least one of the rotational speed control of the fan 551 and the control of the space SP may be omitted.
  • the illumination device has a light source (light source 52) that emits light and a liquid crystal panel (liquid crystal panel 1), and the light transmitted through the liquid crystal panel is A light distribution unit (light distribution unit 700) that adjusts the light distribution range of light emitted from the light source to the outside by transmittance and transmission range control, and a temperature information acquisition unit that acquires information indicating the temperature of the light distribution unit. (temperature sensor 400); and a control unit (MCU 62) that performs a predetermined operation (temperature rise suppression process) for suppressing temperature rise of the light distribution unit when the temperature of the light distribution unit is equal to or higher than a predetermined temperature. , provided. By performing the predetermined operation, it is possible to suppress further temperature rise of the liquid crystal panel of the light distribution section having the predetermined temperature or higher.
  • a predetermined operation temperature rise suppression process
  • the predetermined operation for suppressing the temperature rise of the light distribution unit is performed by turning the light source (light source 52) on. Including turning off the lights. As a result, it is possible to prevent the temperature of the liquid crystal panel of the light distribution unit from rising due to the radiant heat that accompanies the lighting of the light source.
  • the lighting device (lighting device 50) also includes a fan (fan 551) that generates an airflow that cools at least one of the light source (light source 52) and the control unit (MCU 62). Further, when the temperature of the light distribution unit (light distribution unit 700) is equal to or higher than a predetermined temperature, the predetermined operation (temperature rise suppression process) for suppressing the temperature rise of the light distribution unit is performed by the fan that is not operating. or operating the fan at higher revolutions per hour (rpm). Thereby, it is possible to suppress an increase in the temperature of the liquid crystal panel of the light distribution section by promoting cooling by the airflow generated by the fan.
  • rpm revolutions per hour
  • the illumination device also includes a drive section (motor 552) that changes the distance between the light source (light source 52) and the light distribution section (light distribution section 700) by operation.
  • a drive section motor 552 that changes the distance between the light source (light source 52) and the light distribution section (light distribution section 700) by operation.
  • the predetermined operation temperature rise suppression process for suppressing the temperature rise of the light distribution unit moves the light source and the light distribution unit further apart. Including. As a result, it is possible to prevent the temperature of the liquid crystal panel of the light distribution section from rising due to the radiant heat that accompanies the lighting of the light source.
  • inversion driving is applied to the liquid crystal panel (liquid crystal panel 1) in which the magnitude relationship of the potential difference between adjacent electrodes (first electrodes 25 and second electrodes 33) is periodically switched.
  • the acquisition period (period ST) of information indicating the temperature of the light distribution section (light distribution section 700) does not include timings (switching timings ST1, .
  • the case where the temperature information acquisition unit provided in the lighting device 50 is the temperature sensor 400 is exemplified. may be provided.
  • any one of the temperature sensors 451, 452, 453, and 454 shown in FIG. 1 may be provided.
  • the temperature sensor 451 is provided at a position extremely close to the light distribution section 700 on the FPC 54 . Since the temperature sensor 451 can function very similarly to the temperature sensor 400, when the temperature sensor 451 is arranged, the temperature sensor 400 is omitted and the light distribution unit 700 has the temperature measured by the temperature sensor 451. It may be treated as the temperature of the liquid crystal panel 1 .
  • the temperature sensor 452 is provided at a position in contact with or close to the light source 52 .
  • the temperature rise of the liquid crystal panel 1 can be suppressed by obtaining information about the temperature of the light source 52. As a preliminary operation for this, it becomes easier to take measures such as performing temperature rise suppression processing.
  • the temperature sensor 453 is provided at a position in contact with or close to the circuit provided on the system board 60 .
  • One of the causes of the temperature rise of the liquid crystal panel 1 of the light distribution unit 700 is radiant heat from the circuit provided on the system substrate 60. Therefore, by obtaining information on the temperature of the circuit, the liquid crystal panel 1 As a preliminary operation for suppressing the temperature rise, it becomes easier to take measures such as performing a temperature rise suppression process.
  • a temperature sensor 454 is provided in the housing 51 .
  • the fact that the temperature of the housing 51 is higher than or close to the predetermined temperature suggests that the difficulty of cooling the liquid crystal panel 1 of the light distribution unit 700 is increasing.
  • the predetermined temperature, various percentage values, and the specific size of the space SP illustrated in FIG. 20 are only examples and are not limited to these, and can be changed as appropriate. However, it is desirable that these numerical values are determined such that the higher the temperature measured in the process of step S5, the greater the effect of suppressing the temperature rise of the light distribution section 700.
  • the threshold information indicating the temperature set as the predetermined temperature is held by a configuration that performs processing based on information that can be obtained from the temperature sensor 400, such as the MCU 62, or by a storage device that can be referred to by the configuration. Hold.
  • the item "when the temperature is equal to or higher than a predetermined temperature” may be changed to "when the temperature exceeds the predetermined temperature". In any case, by appropriately setting the predetermined temperature, substantially the same processing becomes possible.
  • the specific structure of the light distribution unit 700 is not limited to the example described with reference to FIG.
  • the light distribution unit 700 may have a liquid crystal panel functioning as a so-called liquid crystal lens, which is provided so as to be able to change the degree of refraction of light directed from one side to the other side by liquid crystal light distribution control. good.
  • liquid crystal panel 50 lighting device 52 light source 400, 451, 452, 453, 454 temperature sensor 55 heat dissipation unit 60 system board 62 MCU 551 fan 552 motor 700 light distribution unit

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