WO2023077729A1 - 净尘胶层及其制造方法、净尘膜及其制造方法和贴膜方法以及净尘膜套装 - Google Patents

净尘胶层及其制造方法、净尘膜及其制造方法和贴膜方法以及净尘膜套装 Download PDF

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Publication number
WO2023077729A1
WO2023077729A1 PCT/CN2022/087160 CN2022087160W WO2023077729A1 WO 2023077729 A1 WO2023077729 A1 WO 2023077729A1 CN 2022087160 W CN2022087160 W CN 2022087160W WO 2023077729 A1 WO2023077729 A1 WO 2023077729A1
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Prior art keywords
dust
layer
cleaning
film
screen
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PCT/CN2022/087160
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English (en)
French (fr)
Inventor
魏伟
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深圳市蓝禾技术有限公司
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Publication date
Priority claimed from CN202122685457.9U external-priority patent/CN218811481U/zh
Priority claimed from CN202111301151.7A external-priority patent/CN113980595A/zh
Application filed by 深圳市蓝禾技术有限公司 filed Critical 深圳市蓝禾技术有限公司
Publication of WO2023077729A1 publication Critical patent/WO2023077729A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate

Definitions

  • the present invention relates to the technical field of dust-cleaning film, in particular, to a dust-cleaning adhesive layer and a manufacturing method thereof, a dust-cleaning film with dust-cleaning and defoaming functions, a manufacturing method thereof, a film-attaching method, and a dust-cleaning film set.
  • tempered films are mainly made of tempered glass. When it is dropped or scratched, the tempered film will protect the touch screen due to its hardness and prevent it from being damaged.
  • the present invention is completed in view of the above problems, and provides a dust-cleaning adhesive layer and its manufacturing method, a dust-cleaning film with dust-cleaning and defoaming functions, its manufacturing method, a film-attaching method, and a dust-cleaning film set, which can effectively prevent Bubbles are generated during the bonding process, and can be quickly bonded to the screen of the electronic device.
  • the present invention provides a dust-cleaning glue layer, which includes a base material layer and an OCA glue layer and a dust-cleaning layer respectively arranged on both sides of the base material layer, wherein the dust-cleaning layer has bubble function.
  • the dust-cleaning layer has fluidity, and the Brookfield viscosity of the dust-cleaning layer is in the range of 400cps-500cps.
  • the dust-cleaning layer is used to stick on the screen of the electronic device, and realizes the defoaming function by wrapping foreign matter on the screen of the electronic device.
  • the material of the dust-cleaning layer includes the following components mixed by weight: 28%-35% methyl vinyl silicone rubber, 55%-65% ethyl acetate, 8%-12 % xylene and 1.5%-2.5% ethylbenzene.
  • the substrate layer has a thickness ranging from 48 um to 52 um
  • the OCA adhesive layer has a thickness ranging from 37 um to 43 um
  • the dust cleaning layer has a thickness ranging from 37 um to 43 um.
  • the present invention provides a dust-cleaning film with dust-cleaning and defoaming functions
  • the dust-cleaning film includes a protective layer and the above-mentioned dust-cleaning glue layer, and the protective layer is attached to the On the OCA glue layer.
  • the protective layer is a glass layer, and the thickness of the protective layer ranges from 0.05 mm to 0.85 mm.
  • the dust-cleaning film further includes a release layer, and the release layer is attached to the surface of the dust-cleaning layer away from the substrate layer.
  • the release layer has a thickness ranging from 48um to 52um.
  • the present invention provides a method for manufacturing the dust-cleaning adhesive layer, the manufacturing method comprising: providing a softened substrate layer; coating a silica gel material on the first surface of the substrate layer, and Curing by an oven to form a clean dust layer on the first surface of the base material layer; compounding the first release layer on the surface of the clean dust layer; coating OCA glue on the second surface of the base material layer, And carry out ultraviolet curing to form an OCA adhesive layer on the second surface of the base material layer; and compound a second release layer on the surface of the OCA adhesive layer to obtain the clean dust adhesive layer, wherein the clean The dust layer has the function of cleaning dust and defoaming.
  • the temperature of the oven tunnel is in the range of 150°C to 180°C.
  • the time for curing the dust-cleaning adhesive layer in the oven is 2-3 minutes.
  • the present invention provides a method for manufacturing a dust-cleaning film with dust-cleaning and defoaming functions, the manufacturing method comprising: providing a base material layer; coating silica gel on the first surface of the base material layer material, and is cured by an oven to form a clean dust layer on the first surface of the base material layer; a release layer is compounded on the surface of the clean dust layer; OCA glue is coated on the second surface of the base material layer , and carry out ultraviolet curing to form an OCA adhesive layer on the second surface of the base material layer; and attach a protective layer on the surface of the OCA adhesive layer.
  • the temperature of the oven is set at 150°C-180°C.
  • the time for curing the dust-cleaning adhesive layer in the oven is 2-3 minutes.
  • the present invention provides a film-attaching method of a dust-cleaning film with dust-cleaning and defoaming functions.
  • the film-attaching method includes: tearing off the release layer on the surface of the dust-cleaning layer; The side with the dust-cleaning layer is facing the screen of the electronic device; the dust-cleaning film is placed on the screen of the electronic device; fit.
  • the dust-cleaning film after pressing the dust-cleaning film to make it exhaust and attach it to the screen of the electronic device, it further includes: If there is foreign matter, the dust-cleaning film is separated from the screen of the electronic device; the foreign matter is cleaned; and the dust-cleaning film is re-attached on the screen of the electronic device.
  • the cleaning of the foreign matter includes: if the foreign matter is on the screen of the electronic device, removing the foreign matter by wiping or sticking a dust sticker; On the dust-cleaning layer of the dust film, the foreign matter is removed through the dust-cleaning film repair sticker.
  • the present invention provides a dust-cleaning film set, comprising: the above-mentioned dust-cleaning film; and a dust-cleaning film repair sticker, the dust-cleaning film repairing sticker includes a body and a repair layer arranged on the surface of the body , the repair layer is used to be pasted on the dust-cleaning layer of the dust-cleaning film to repair the dust-cleaning layer of the dust-cleaning film.
  • the viscosity of the repair layer is greater than the viscosity of the dust-cleaning layer.
  • the repair layer is also used to be pasted on the dust-cleaning layer of the dust-cleaning film, so as to replace the foreign matters stuck on the dust-cleaning layer.
  • the material of the repair layer includes the following components mixed by weight: 28%-35% methyl vinyl silicone rubber, 55%-65% ethyl acetate, 8%-12% xylene and 1.5%-2.5% ethylbenzene.
  • the dust-cleaning glue layer provided by the present invention includes a dust-cleaning layer with functions of dust-cleaning and defoaming.
  • the dust-cleaning layer and the screen are directly Contact, can quickly clean dust and eliminate air bubbles during the film application process, so that no air bubbles will be generated during the film application process.
  • Fig. 1 is an exploded schematic view of the dust-cleaning adhesive layer of the present invention.
  • Fig. 2 is a schematic flow chart of the manufacturing method of the dust-cleaning adhesive layer shown in Fig. 1 .
  • Fig. 3 is an exploded schematic view of the dust-cleaning film of the present invention.
  • Fig. 4 is a schematic flow chart of the manufacturing method of the dust-cleaning film shown in Fig. 3 .
  • Fig. 5 is a schematic flow chart of the film sticking method of the dust-cleaning film of the present invention.
  • Fig. 6 is a schematic flow chart of another embodiment of the film sticking method of the dust-cleaning film of the present invention.
  • Fig. 7 is an exploded schematic diagram of a dust-cleaning film set according to an embodiment of the present invention.
  • Fig. 8 is an exploded schematic diagram of a dust-cleaning film set according to another embodiment of the present invention.
  • Fig. 9 is a photo of the screen of the electronic device before the film is applied.
  • Fig. 10 is a photograph of the screen of the electronic device before the film is applied.
  • Fig. 11 is a photo of the screen of the electronic device before the film is applied.
  • Fig. 12 is a photograph of the screen of the electronic device before the film is applied.
  • Fig. 13 is a photograph of the screen of the electronic device before the film is applied.
  • Fig. 14 is a photograph of the screen of the electronic device before the film is applied.
  • Fig. 15 is an effect diagram of using the dust-cleaning film of the present invention pasted on the screen of an electronic device.
  • Fig. 16 is an effect diagram of using the dust-cleaning film of the present invention pasted on the screen of an electronic device.
  • Fig. 17 is an effect diagram of using the dust-cleaning film of the present invention pasted on the screen of an electronic device.
  • Fig. 18 is an effect diagram of using an existing protective film on the screen of an electronic device.
  • Figure 19 shows the use of existing
  • Fig. 20 is an effect diagram of pasting the existing protective film on the screen of the electronic device.
  • Fig. 21 is an effect diagram of using an existing protective film on the screen of an electronic device.
  • Figure 22 shows the use of existing
  • the present invention provides a dust-cleaning adhesive layer 10 , the dust-cleaning adhesive layer 10 can be applied to a dust-cleaning film, and the dust-cleaning film can be but not limited to a soft film or a hard film.
  • the dust-cleaning glue layer 10 includes a base material layer 11 , and an OCA glue layer 12 and a dust-cleaning layer 13 respectively disposed on two sides of the base material layer 11 .
  • the dust-cleaning layer 13 has dust-cleaning and defoaming functions.
  • the dust-cleaning layer 13 is attached to the screen of the electronic device and directly contacts with the screen. During the process, the dust cleaning layer 13 can quickly clean dust and defoam, so that no air bubbles will be generated during the film sticking process.
  • the dust-cleaning layer 13 realizes dust-cleaning and defoaming functions by wrapping foreign matter on the screen of the electronic device.
  • the dust-cleaning layer 13 has fluidity, so that when there are foreign objects such as dust, oil stains, fingerprints and the like on the screen of the electronic device during the film sticking process, the dust-cleaning layer 13 will wrap these foreign objects, Therefore, no air bubbles will be generated during the film sticking process, so as to realize the functions of dust removal and defoaming.
  • Brookfield viscosity range of the clean dust layer 13 is 400cps-500cps, wherein, cps is a viscosity unit, which is often used for fluid viscosity.
  • the dust-cleaning layer 13 may be a silica gel layer.
  • the material of the dust-cleaning layer 13 includes the following components mixed by weight: 28%-35% methyl vinyl silicone rubber, 55%-65% ethyl acetate, 8%-12% xylene And 1.5%-2.5% ethylbenzene.
  • the dust-cleaning layer 13 can also be made of other materials, which is not limited here.
  • the air bubbles generated during the film sticking process are mainly due to the existence of dust, oil, fingerprints and other foreign objects on the screen of the electronic device. There are gaps formed between the films, which lead to the generation of air bubbles.
  • the dust-cleaning layer 13 since the dust-cleaning layer 13 has a certain fluidity, when the dust-cleaning film is attached to the screen of the electronic device, if there is, for example, oily dirt on the screen When there are foreign objects such as dust, fingerprints, etc., the fluidity of the dust-cleaning layer 13 quickly wraps foreign objects such as dust, oil, fingerprints, etc., and fills them in the gap or gap formed between the foreign objects and the dust-cleaning film, which can eliminate the dust caused by the presence of dust.
  • the air bubbles generated by foreign matter can be removed, so as to realize the functions of dust removal and defoaming, and make the picture quality of electronic equipment more high-definition.
  • the material of the base material layer 11 is polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the substrate layer 11 may also be made of other materials, which is not limited here.
  • the base material layer 11 has undergone softening treatment to make it have a certain degree of flexibility, and the details of the softening treatment will be described later.
  • the softness of the substrate layer 11 is greater than that of the dust-cleaning layer 13 .
  • the substrate layer 11 can also have fluidity comparable to that of the dust-cleaning layer 13.
  • the OCA glue layer 12 can be made of OCA glue. Certainly, in other embodiments, the OCA adhesive layer 12 may also be replaced by a layer made of other materials, which is not limited here.
  • the substrate layer 11 has a thickness ranging from 48um to 52um
  • the OCA adhesive layer 12 has a thickness ranging from 37um to 43um
  • the dust cleaning layer 13 has a thickness ranging from 37um to 43um.
  • the dust-cleaning glue layer 10 provided by the present invention includes a dust-cleaning layer 13 with functions of dust-cleaning and defoaming.
  • the dust-cleaning layer 13 In direct contact with the screen, it can quickly remove dust and defoam during the film application process, so that no air bubbles will be generated during the film application process.
  • the present invention also provides a kind of manufacturing method of above-mentioned clean dust adhesive layer, and this manufacturing method comprises:
  • Step S101 providing a softened substrate layer
  • Step S102 coating the silica gel material on the first surface of the substrate layer, and curing it in an oven to form a dust-cleaning layer on the first surface of the substrate layer;
  • Step S103 compounding the first release layer on the surface of the dust-cleaning layer
  • Step S104 coating OCA glue on the second surface of the substrate layer, and performing ultraviolet curing to form an OCA glue layer on the second surface of the substrate layer;
  • Step S105 compounding a second release layer on the surface of the OCA adhesive layer to prepare a dust-cleaning adhesive layer.
  • the temperature range of the oven tunnel is 150°C to 180°C.
  • the time for curing the dust-cleaning adhesive layer through the oven is 2 to 3 minutes.
  • the dust-cleaning glue layer obtained by the manufacturing method provided by the present invention includes a dust-cleaning layer with functions of dust-cleaning and defoaming.
  • the dust layer is in direct contact with the screen, which can quickly remove dust and defoam during the film application process, so that no air bubbles will be generated during the film application process.
  • the present invention also provides a dust-cleaning film 100
  • the dust-cleaning film 100 can be but not limited to a soft film, a hard film, in this embodiment, the dust-cleaning film 100 is a hard film as an example Be explained.
  • the dust-cleaning film 100 has the functions of cleaning dust and eliminating air bubbles.
  • the dust-cleaning film 100 includes a protective layer 30 and the above-mentioned dust-cleaning adhesive layer 10 , and the protective layer 30 is attached to the OCA adhesive layer 12 in the dust-cleaning adhesive layer 10 .
  • the composition of the dust-cleaning glue layer 10 is the same as that of the above-mentioned dust-cleaning glue layer 10 , and will not be repeated here.
  • the protective layer 30 is a glass layer, and the thickness of the protective layer 30 ranges from 0.05 mm to 0.85 mm.
  • the dust-cleaning film 100 also includes a first release layer 40, the first release layer 40 is attached to the surface of the dust-cleaning layer 13 away from the substrate layer 11, and the thickness of the first release layer 40 ranges from 48um to 52um.
  • the dust-cleaning layer 13 in the dust-cleaning adhesive layer 10 can be protected.
  • the dust-cleaning layer 13 can be pasted on the screen of the electronic device after the molded layer 40 is torn off.
  • the dust-cleaning film 100 provided by the present invention has the above-mentioned dust-cleaning glue layer 10, which includes a dust-cleaning layer 13 with dust-cleaning and defoaming functions.
  • the dust-cleaning layer 13 is in direct contact with the screen, and can quickly remove dust and defoam during the film-attaching process so that no air bubbles will be generated during the film-attaching process.
  • the present invention also provides a method for manufacturing a dust-cleaning film with dust-cleaning and defoaming functions, the manufacturing method comprising:
  • Step S201 providing a substrate layer
  • Step S202 coating the silica gel material on the first surface of the substrate layer, and curing it in an oven, so as to form a dust-cleaning layer on the first surface of the substrate layer;
  • Step S203 compounding a release layer on the surface of the dust-cleaning layer
  • Step S204 coating OCA glue on the second surface of the substrate layer, and performing ultraviolet curing to form an OCA glue layer on the second surface of the substrate layer;
  • Step S205 attaching a protective layer on the surface of the OCA adhesive layer.
  • the temperature of the oven tunnel is set at 150°C to 180°C.
  • the time for curing the dust-cleaning adhesive layer through the oven is 2 to 3 minutes.
  • the dust-cleaning film obtained by the manufacturing method provided by this embodiment has the above-mentioned dust-cleaning rubber layer, which includes a dust-cleaning layer with dust-cleaning and defoaming functions.
  • the dust-cleaning layer is in direct contact with the screen, and it can quickly clean dust and defoam during the film-sticking process, so that no air bubbles will be generated during the film-sticking process.
  • the present invention also provides a method for attaching a dust-cleaning film 100 with dust-cleaning and defoaming functions, the film-attaching method includes:
  • Step S301 tearing off the first release layer 40 on the surface of the dust cleaning layer 13;
  • Step S302 aligning the side of the dust-cleaning film 100 with the dust-cleaning layer 13 on the screen of the electronic device
  • Step S303 placing the dust-cleaning film 100 on the screen of the electronic device.
  • Step S304 pressing the dust-cleaning film 100 to exhaust the dust-cleaning film 100 and attach it to the screen of the electronic device.
  • Step S305 if there is a foreign matter between the dust-cleaning film 100 and the screen of the electronic device after bonding, separate the dust-cleaning film 100 from the screen of the electronic device;
  • Step S306 cleaning the foreign matter
  • Step S307 re-attach the dust-cleaning film 100 on the screen of the electronic device.
  • the step of cleaning the foreign matter specifically includes
  • the foreign matter is on the dust-cleaning layer 13 of the dust-cleaning film 100, the foreign matter is removed by the dust-cleaning film repair sticker.
  • the film sticking method provided in this embodiment because the dust-cleaning film 100 used has the function of dust cleaning and defoaming, can quickly eliminate air bubbles in the process of film sticking, so that no air bubbles will be generated during the film sticking process. bubble.
  • the dust-cleaning film 100 can quickly wrap the foreign matter to avoid the occurrence of air bubbles, thereby achieving an excellent defoaming function.
  • the dust-cleaning film 100 can be separated from the screen of the electronic device, and then the foreign matter is cleaned, and the dust-cleaning film 100 can be pasted on the screen of the electronic device again.
  • the dust-cleaning film 100 provided in this embodiment not only has the functions of dust-cleaning and defoaming, but also has the special fluidity of the dust-cleaning layer, which can be repeatedly pasted and used compared with the existing protective film. During the separation process of the screen of the electronic device, even if the surface of the dust-cleaning layer is stained with foreign matter such as dust, it will not affect the reattachment of the dust-cleaning film 100 to the screen of the electronic device.
  • the present invention also provides a dust-cleaning film set 200, the dust-cleaning film suit 200 includes a dust-cleaning film repair sticker 50 (please refer to FIG.
  • the repair layer 52 provided on the surface of the main body 51 is used to paste the dust-cleaning layer 13 of the dust-cleaning film 100 to repair the dust-cleaning layer 13 of the dust-cleaning film 100 .
  • the viscosity of the repair layer 52 is greater than that of the dust-cleaning layer 13 .
  • repair layer 52 when the viscosity of the repair layer 52 is greater than that of the dust-cleaning layer 13, the repair layer 52 is also used to stick on the dust-cleaning layer to replace the foreign matter stuck on the dust-cleaning layer, thereby removing the dust from the cleaning layer. Repairing the layer 13 can effectively prolong the service life of the dust-cleaning film 100 .
  • the material of the repair layer includes the following components mixed by weight ratio: 28%-35% of methyl vinyl silicone rubber, 55%-65% of ethyl acetate, 8%-12% of Toluene and 1.5%-2.5% ethylbenzene.
  • the key to enhancing the adsorption force of silica gel is to increase its active unit structure.
  • the patented MA-enhance TM -adsorption enhancement technology can be used to generate strong pressure at the moment of contact between the repair layer 52 and the dust-cleaning film 100, and the strong and weak glue will attract each other to generate a chemical activation reaction, and quickly activate the silica gel molecules of the dust-cleaning film 100 The activity makes the active unit structure of the molecule more active, thereby enhancing its adsorption property and making the dust-cleaning film 100 have a better automatic adsorption effect.
  • the dust cleaning film repair sticker 50 also includes a second release layer 53 , and the second release layer 53 is pasted on the repair layer 52 .
  • the second release layer 53 can be protected, and when repairing the clean dust layer 13, only the second release layer on the repair layer 52 53 can be torn off.
  • the dust cleaning film repair sticker 50 includes a plurality of second release layers 53 , and the plurality of second release layers 53 are arranged on the repair layer 52 .
  • the user can also temporarily paste the dust-cleaning film 100 on the repair layer 52 without using the dust-cleaning film 100, and stick the dust-cleaning film 100 again when needed. onto the screen of an electronic device.
  • the dust-cleaning adhesive layer 10 of the dust-cleaning film set 200 provided in this embodiment includes a dust-cleaning layer 13 with functions of dust-cleaning and defoaming.
  • the dust-cleaning layer 13 When it is on the screen, the dust-cleaning layer 13 is in direct contact with the screen of the electronic device, and can quickly clean dust and defoam during the film-sticking process, so that no air bubbles will be generated during the film-sticking process.
  • the dust-cleaning adhesive layer 10 is made of silica gel, which is a polymer with a highly elastic porous structure. When dust, wool, oil, and other stains adhere, its surface tension will increase, thereby affecting its leveling effect.
  • the repair layer 52 can repair the dust-cleaning layer 13, and quickly replace the dust, wool, oil stains and other stains on the dust-cleaning film 100 through the viscosity difference between the repairing layer 52 and the dust-cleaning layer 13, and repair the dust-cleaning layer 13.
  • the dents and slip marks in the dust-cleaning glue layer 10 reduce the surface tension of the dust-cleaning glue layer 10, and realize rapid and traceless leveling, so that the dust-cleaning glue in the repaired dust-cleaning film 100 has a strong wrapping property again. Air bubbles will not be generated when attached to electronic equipment, so the dust-cleaning film 100 can be recycled and has a longer service life.
  • the repairing process comprises the following two ways: the first, because the viscosity of the repairing layer 52 is greater than the viscosity of the dust-cleaning layer 13, when the repairing layer 52 is pasted on the surface of the dust-cleaning layer 13, the repairing layer 52 can hold the dust-cleaning layer 13 surface stained with foreign matter such as dust is replaced, making the surface of the clean dust layer cleaner; second, because the surface of the clean dust layer 13 is stuck with foreign matter, it will cause the surface of the clean dust layer to be uneven, by pasting the repair layer 52 on the On the dust-cleaning layer 13, its fluidity and the fluidity of the dust-cleaning layer can repair the unevenness of the surface of the dust-cleaning layer, so that the dust-cleaning film 100 can be reused to improve its utilization rate.
  • Figures 9 to 14 are photos of the screen of the electronic device before the film is pasted
  • Figures 15 to 17 are renderings of using the dust-cleaning film 100 of the present invention on the screen of the electronic device. The rendering of the protective film attached to the screen of the electronic device.

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Abstract

本发明提供一种净尘胶层及其制造方法、具有消泡功能的净尘膜及其制造方法、贴膜方法及净尘膜套装，其中，该净尘胶层包括基材层及分别设置于所述基材层两侧的OCA胶层以及净尘层，其中，所述净尘层具备净尘及消泡功能。相较于现有技术，本发明提供的净尘胶层中包括具备净尘及消泡功能的净尘层，在将净尘膜贴设在电子设备的屏幕上时，净尘层与屏幕直接接触，在贴膜的过程中能够快速消泡，以在贴膜的过程中不会产生气泡。

Description

净尘胶层及其制造方法、净尘膜及其制造方法和贴膜方法以及净尘膜套装 技术领域
本发明涉及净尘膜技术领域，特别地，涉及一种净尘胶层及其制造方法、具有净尘及消泡功能的净尘膜及其制造方法和贴膜方法以及净尘膜套装。
背景技术
随着社会的不断发展及进步，智能手机、平板电脑等得到广泛的应用。但是，这些产品的屏幕通常都是裸露在外面，在受到强烈撞击时很容易被破坏，因此，使用者们通常在屏幕上贴附保护膜来保护屏幕。
现有的保护膜一般分为软膜和钢化膜，其中，以钢化膜为例，其主要是用钢化玻璃制成，通过将钢化玻璃贴合至触摸屏幕上，在智能手机、平板电脑等掉落或者刮损时，钢化膜由于其硬度会保护触摸屏幕，防止其损坏。
但是，市售的钢化膜在贴合在触摸屏幕上前，需将触摸屏幕上的污渍等擦除，稍微留有一点灰尘、油污或者指纹等异物就容易产生气泡，影响使用者的使用，且贴合前需花费较多的时间去擦拭，使得贴膜的体验较差。
发明内容
本发明是鉴于上述问题而完成的，提供一种净尘胶层及其制造方法、具有净尘及消泡功能的净尘膜及其制造方法和贴膜方法以及净尘膜套装，能够有效地防止在贴合的过程中产生气泡，且能够快速地贴合到电子设备的屏幕上。
为解决上述技术问题，本发明提供一种净尘胶层，其包括基材层及分别设置于所述基材层两侧的OCA胶层以及净尘层，其中，所述净尘层具备消泡功能。
在一实施方式中，所述净尘层具有流动性，所述净尘层的布氏粘度范围为400cps-500cps。
在一实施方式中，所述净尘层用于贴设在电子设备的屏幕上，并通过包裹所述电子设备的屏幕上的异物来实现消泡功能。
在一实施方式中，所述净尘层的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。
在一实施方式中，所述基材层的厚度范围为48um～52um，所述OCA胶层的厚度范围为37um～43um，所述净尘层的厚度范围为37um～43um。
为解决上述技术问题，本发明提供一种具有净尘及消泡功能的净尘膜，所述净尘膜包括保护层及上述所述的净尘胶层，所述保护层贴附在所述OCA胶层上。
在一实施方式中，所述保护层为玻璃层，所述保护层的厚度范围为0.05mm-0.85mm。
在一实施方式中，所述净尘膜还包括离型层，所述离型层贴设在所述净尘层背离所述基材层的表面。
在一实施方式中，所述离型层的厚度范围为48um～52um。
为解决上述技术问题，本发明提供一种净尘胶层的制造方法，所述制造方法包括：提供经软化处理的基材层；在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在所述基材层的第一表面形成净尘层；在所述净尘层表面复合第一离型层；在所述基材层的第二表面涂布OCA胶，且进行紫外线固化，以在所述基材层的第二表面形成OCA胶层；以及在所述OCA胶层表面复合第二离型层，制得所述净尘胶层，其中，所述净尘层具备净尘及消泡功能。
在一实施方式中，所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述烘箱的烘道温度范围为150℃～180℃。
在一实施方式中，所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
为解决上述技术问题，本发明提供一种具有净尘及消泡功能的净尘膜的制造方法，所述制造方法包括：提供基材层；在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在所述基材层的第一表面形成净尘层；在所述净尘层表面复合离型层；在所述基材层的第二表面涂布OCA胶，且进行紫外线固化，以在所述基材层的第二表面形成OCA胶层；在所述OCA胶层表面贴设保护层。
在一实施方式中，所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述烘箱的温度设置为150℃～180℃。
在一实施方式中，所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
为解决上述技术问题，本发明提供一种具有净尘及消泡功能的净尘膜的贴膜方法， 所述贴膜方法包括：撕去净尘层表面的离型层；将所述净尘膜贴设有所述净尘层的一面对准电子设备的屏幕；将所述净尘膜放置于所述电子设备屏幕上；按压所述净尘膜使其排气并与所述电子设备的屏幕贴合。
在一实施方式中，所述按压所述净尘膜使其排气并与所述电子设备的屏幕贴合之后，还包括：若贴合之后所述净尘膜与所述电子设备屏幕之间存在异物，则将所述净尘膜与所述电子设备屏幕分离；对所述异物进行清洁；将所述净尘膜重新贴设于所述电子设备的屏幕上。
在一实施方式中，所述对所述异物进行清洁，包括：若所述异物在所述电子设备的屏幕上，则通过擦拭或者粘尘贴清除所述异物；若所述异物在所述净尘膜的所述净尘层上，则通过净尘膜修复贴纸清除所述异物。
为解决上述技术问题，本发明提供一种净尘膜套装，包括：上述所述的净尘膜；以及净尘膜修复贴纸，所述净尘膜修复贴纸包括本体和设于本体表面的修复层，所述修复层用于粘贴在所述净尘膜的所述净尘层上，以修复所述净尘膜的所述净尘层。
在一实施方式中，所述修复层的粘性大于所述净尘层的粘性。
在一实施方式中，所述修复层还用于粘贴在所述净尘膜的所述净尘层上，以置换出所述净尘层上粘有的异物。
在一实施方式中，所述修复层的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。
相较于现有技术，本发明提供的净尘胶层中包括具备净尘及消泡功能的净尘层，在将净尘膜贴设在电子设备的屏幕上时，净尘层与屏幕直接接触，在贴膜的过程中能够快速净尘及消除气泡，以在贴膜的过程中不会产生气泡。
附图说明
为了更清楚地说明本申请实施方式或现有技术中的技术方案，下面将对实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明的净尘胶层的分解示意图。
图2是图1所示的净尘胶层的制造方法的流程示意图。
图3是本发明的净尘膜的分解示意图。
图4是图3所示的净尘膜的制造方法的流程示意图。
图5是本发明的净尘膜的贴膜方法的流程示意图。
图6是本发明的净尘膜的贴膜方法的另一实施方式的流程示意图。
图7是本发明一实施方式的净尘膜套装的分解示意图。
图8是本发明另一实施方式的净尘膜套装的分解示意图。
图9是贴膜前电子设备的屏幕的照片。
图10是贴膜前电子设备的屏幕的照片。
图11是贴膜前电子设备的屏幕的照片。
图12是贴膜前电子设备的屏幕的照片。
图13是贴膜前电子设备的屏幕的照片。
图14是贴膜前电子设备的屏幕的照片。
图15是使用本发明的净尘膜贴设在电子设备的屏幕上的效果图。
图16是使用本发明的净尘膜贴设在电子设备的屏幕上的效果图。
图17是使用本发明的净尘膜贴设在电子设备的屏幕上的效果图。
图18为使用现有的保护膜贴设在电子设备的屏幕上的效果图。图19为使用现有
的保护膜贴设在电子设备的屏幕上的效果图。
图20为使用现有的保护膜贴设在电子设备的屏幕上的效果图。
图21为使用现有的保护膜贴设在电子设备的屏幕上的效果图。图22为使用现有
的保护膜贴设在电子设备的屏幕上的效果图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整的描述，显然，所描述的实施方式仅是本申请的一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
以下结合附图实施例对本发明作进一步详细描述。
请参阅图1，本发明提供一种净尘胶层10，该净尘胶层10可应用于净尘膜， 该净尘膜可为但不限于为软膜或硬膜。
净尘胶层10包括基材层11及分别设置于基材层11两侧的OCA胶层12以及净尘层13。其中，净尘层13具备净尘及消泡功能，在将净尘膜贴设在电子设备的屏幕上时，净尘层13贴设在电子设备的屏幕上并与屏幕直接接触，在贴膜的过程中净尘层13能够快速净尘及消泡，如此，在贴膜的过程中不会产生气泡。
具体地，净尘层13通过包裹所述电子设备的屏幕上的异物来实现净尘及消泡功能。
在本实施方式中，净尘层13具有流动性，以在贴膜的过程中，电子设备的屏幕上存在灰尘、油污、指纹印等异物的情况下，该净尘层13将这些异物包裹住，从而在贴膜的过程中不会产生气泡，以实现净尘及消泡功能。
其中，净尘层13的布氏粘度范围为400cps-500cps，其中，cps是一种粘度单位，常用于流体粘度。
在本实施方式中，净尘层13可为硅胶层。进一步地，净尘层13的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。当然，净尘层13也可以由其它材料制成，在此不作限定。
可以理解，在贴膜过程中所产生的气泡主要是因为电子设备的屏幕上存在灰尘、油污、指纹印等异物，这些异物与净尘膜接触导致净尘膜的表面不平整，从而异物与净尘膜之间形成有空隙，从而导致气泡的产生，在本实施方式中，由于净尘层13具有一定的流动性，在将净尘膜贴设到电子设备的屏幕时，若屏幕上有例如油污、灰尘、指纹印等异物时，通过该净尘层13的流动性快速包裹灰尘、油污、指纹印等异物，并填充于异物与净尘膜之间形成的间隙或者空隙内，能够消除因存在异物而产生的气泡，从而实现净尘及消泡功能，使得电子设备的画质更高清。
在本实施方式中，基材层11的材料为聚对苯二甲酸乙二醇酯(PET)。当然，在其它实施方式中，基材层11也可以是其它的材料，在此不作限定。
在本实施方式中，基材层11经过了软化处理，使其具有一定的柔软性，对于软化处理的详情将后述。
进一步地，基材层11的柔软性大于净尘层13的柔软性。当然，在别的实施 方式中，基材层11也可以具有与净尘层13相当的流动性。
可以理解，在净尘层13将油污、灰尘、指纹印等异物包裹时，在基材层11的与包裹的位置对应的部分会稍微鼓起，此时，因基材层11具有一定的柔软性，则能够使得与净尘层13中鼓起位置对应的位置的基材层11保持平坦，进而能够有效确保整个净尘膜的平坦性。
进一步地，OCA胶层12可由OCA胶制成。当然，在其它实施方式中，OCA胶层12也可以由其它材料制成的层来代替，在此不作限定。
在本实施方式中，基材层11的厚度范围为48um～52um，OCA胶层12的厚度范围为37um～43um，净尘层13的厚度范围为37um～43um。
相较于现有技术，本发明提供的净尘胶层10中包括具备净尘及消泡功能的净尘层13，在将净尘膜贴设在电子设备的屏幕上时，净尘层13与屏幕直接接触，在贴膜的过程中能够快速净尘及消泡，以在贴膜的过程中不会产生气泡。
请参阅图2，本发明还提供一种上述的净尘胶层的制造方法，该制造方法包括：
步骤S101，提供经软化处理的基材层；
步骤S102，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在基材层的第一表面形成净尘层；
步骤S103，在净尘层表面复合第一离型层；
步骤S104，在基材层的第二表面涂布OCA胶，且进行紫外线固化，以在基材层的第二表面形成OCA胶层；以及
步骤S105，在OCA胶层表面复合第二离型层，制得净尘胶层。
进一步地，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，烘箱的烘道温度范围为150℃～180℃。
进一步地，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
相较于现有技术，本发明提供的制造方法所获得的净尘胶层中包括具备净尘及消泡功能的净尘层，在将净尘膜贴设在电子设备的屏幕上时，净尘层与屏幕直接接触，在贴膜的过程中能够快速净尘及消泡，以在贴膜的过程中不会产生气泡。
请参阅图3，本发明还提供一种净尘膜100，该净尘膜100可为但不限于为 软膜、硬膜，在本实施方式中，以该净尘膜100为硬膜为例进行说明。该净尘膜100具有净尘及消除气泡的功能。
该净尘膜100包括保护层30及上述的净尘胶层10，保护层30贴附在净尘胶层10中的OCA胶层12上。其中，净尘胶层10的构成与上述所述的净尘胶层10的构成相同，在此不再赘述。
在本实施方式中，保护层30为玻璃层，保护层30的厚度范围为0.05mm-0.85mm。
进一步地，净尘膜100还包括第一离型层40，该第一离型层40贴设在净尘层13背离基材层11的表面，第一离型层40的厚度范围为48um～52um。
可以理解，通过在净尘层13背离基材层11的表面贴设一第一离型层40，可对净尘胶层10中的净尘层13进行保护，在贴膜前，将第一离型层40撕下就可以将该净尘层13贴设到电子设备的屏幕上。
相较于现有技术，本发明提供的净尘膜100具有上述所述的净尘胶层10，该净尘胶层10中包括具备净尘及消泡功能的净尘层13，在将净尘膜100贴设在电子设备的屏幕上时，净尘层13与屏幕直接接触，在贴膜的过程中能够快速净尘及消泡，以在贴膜的过程中不会产生气泡。
请参阅图4，本发明还提供一种具有净尘及消泡功能的净尘膜的制造方法，该制造方法包括：
步骤S201，提供基材层；
步骤S202，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在基材层的第一表面形成净尘层；
步骤S203，在净尘层表面复合离型层；
步骤S204，在基材层的第二表面涂布OCA胶，且进行紫外线固化，以在基材层的第二表面形成OCA胶层；
步骤S205，在OCA胶层表面贴设保护层。
进一步地，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，烘箱的烘道温度设置为150℃～180℃。
进一步地，在基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
相较于现有技术，本实施方式提供的制造方法所获得的净尘膜具有上述所述的净尘胶层，该净尘胶层中包括具备净尘及消泡功能的净尘层，在将净尘膜贴设在电子设备的屏幕上时，净尘层与屏幕直接接触，在贴膜的过程中能够快速净尘及消泡，以在贴膜的过程中不会产生气泡。
请参阅图5，本发明还提供一种具有净尘及消泡功能的净尘膜100的贴膜方法，该贴膜方法包括：
步骤S301，撕去净尘层13表面的第一离型层40；
步骤S302，将净尘膜100贴设有净尘层13的一面对准电子设备的屏幕；
步骤S303，将净尘膜100放置于电子设备屏幕上；以及
步骤S304，按压净尘膜100使净尘膜100排气并与电子设备的屏幕贴合。
在一实施方式中，请参阅图6，按压净尘膜100使该净尘膜100排气并与电子设备的屏幕贴合之后，还包括：
步骤S305，若贴合之后净尘膜100与电子设备屏幕之间存在异物，则将净尘膜100与电子设备屏幕分离；
步骤S306，对异物进行清洁；以及
步骤S307，将净尘膜100重新贴设于电子设备的屏幕上。
其中，对异物进行清洁的步骤具体包括；
若异物在电子设备的屏幕上，则通过擦拭或者粘尘贴清除异物；以及
若异物在净尘膜100的净尘层13上，则通过净尘膜修复贴纸清除异物。
相较于现有技术，本实施方式提供的贴膜方法，因所使用的净尘膜100具备净尘及消泡功能，在贴膜的过程中能够快速消除气泡，以在贴膜的过程中不会产生气泡。另外，在电子设备的屏幕上残留有异物的情况下，净尘膜100能够快速将该异物包裹，以避免出现气泡的情况，从而实现优异的消泡的功能。
同时，若电子设备的屏幕上残留有异物体积较大时，还可通过将净尘膜100与电子设备屏幕分离，然后对异物清洁，再次将净尘膜100贴设在电子设备屏幕上。本实施例中提供的净尘膜100不仅具备净尘及消泡功能，同时净尘层的特殊流动性使其相较于现有的保护膜，能够重复粘贴使用，在将净尘膜100与电子设备屏幕分离的过程中，即使净尘层表面沾上了灰尘等异物，也不会影响净尘膜100与电子设备屏幕的再 次贴合。
本发明还提供一种净尘膜套装200，该净尘膜套装200包括净尘膜修复贴纸50(请参照图7)以及上述所述净尘膜100，净尘膜修复贴纸50包括本体51和设于本体51表面的修复层52，修复层52用于粘贴净尘膜100的净尘层13上，以修复净尘膜100的净尘层13。
进一步地，修复层52的粘性大于净尘层13的粘性。
可以理解，在修复层52的粘性大于净尘层13的粘性的情况下，修复层52还用于粘贴在净尘层上，以置换出净尘层上所粘有的异物，从而将净尘层13修复，能够有效延长净尘膜100的使用寿命。
在本实施方式中，修复层的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。
可以理解，增强硅胶吸附力的关键，是增加其活泼型单元结构。在本发明中，采用专利MA-enhance TM-吸附增强技术，可在修复层52与净尘膜100接触瞬间产生强压，强弱胶相吸产生化学激活反应，快速激活净尘膜100的硅胶分子活性，使其分子的活泼型单元结构更加活跃，从而增强其吸附性，使净尘膜100自动吸附效果更好。
进一步地，净尘膜修复贴纸50还包括第二离型层53，第二离型层53贴设在修复层52上。
可以理解，通过在修复层52上设置第二离型层53，能够对第二离型层53进行保护，且在修复净尘层13时，只需将修复层52上的第二离型层53撕下即可。
当然，请参阅图8，在其它实施方式中，净尘膜修复贴纸50包括多个第二离型层53，多个第二离型层53排列设置在修复层52上。
可以理解，通过在净尘膜修复贴纸50上设置多个第二离型层53，用户能够根据需求选择性地撕除所需量的第二离型层53。
当然，在其它实施方式中，用户也可以在不需使用净尘膜100等情况下，将净尘膜100暂时贴设于修复层52上，待需要使用时再次将该净尘膜100贴设到电子设备的屏幕上。
相较于现有技术，本实施方式提供的净尘膜套装200的净尘胶层10中包括具备 净尘及消泡功能的净尘层13，在将净尘膜100贴设在电子设备的屏幕上时，净尘层13与电子设备的屏幕直接接触，在贴膜的过程中能够快速净尘及消泡，以在贴膜的过程中不会产生气泡。净尘胶层10由硅胶材料制成，硅胶为一种高弹性多孔结构聚合物，粘附灰尘、毛丝、油污等污渍后，其表面张力会增大，进而影响其流平效果。在本发明中，修复层52可以对净尘层13进行修复，通过修复层52与净尘层13之间的粘性差快速置换净尘膜100上的灰尘、毛丝、油污等污渍，修复净尘胶层10中的凹痕滑痕，缩小净尘胶层10的表面张力，实现快速无痕流平，使得修复后的净尘膜100中的净尘胶重新具备较强的包裹性，再次贴合在电子设备上也不会产生气泡，如此净尘膜100可循环使用，使用寿命更持久。
其中，修复的过程包括以下两种方式：第一，由于修复层52的粘性大于净尘层13的粘性，在将修复层52贴在净尘层13表面时，修复层52能够将净尘层13表面沾有的灰尘等异物置换出来，使得净尘层表面更清洁；第二，由于净尘层13表面粘有异物，会导致净尘层的表面不平整，通过将修复层52贴设在净尘层13上，其流动性及净尘层的流动性会修复净尘层表面的不平整，如此，净尘膜100可以重复使用，提高其使用率。
以下，对本发明的净尘膜100贴膜效果进行说明。
图9～图14为贴膜前电子设备的屏幕的照片，图15～图17为使用本发明的净尘膜100贴设在电子设备的屏幕上的效果图，图18～图22为使用现有的保护膜贴设在电子设备的屏幕上的效果图。
由图9～图14可看到，在贴膜前电子设备的屏幕上有灰尘，使用现有的保护膜贴设在电子设备的屏幕后产生了很多气泡，而使用本发明的净尘膜100贴设在电子设备的屏幕后并未产生气泡。对比可知，本发明的净尘膜100的净尘及消泡功能优异。
最后应说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。

Claims (21)

  1. 一种净尘胶层，其特征在于，其包括基材层及分别设置于所述基材层两侧的OCA胶层以及净尘层，其中，所述净尘层具备净尘及消除气泡的功能。
  2. 根据权利要求1所述的净尘胶层，其特征在于，所述净尘层具有流动性，所述净尘层的布氏粘度范围为400cps-500cps。
  3. 根据权利要求1或2所述的净尘胶层，其特征在于，所述净尘层用于贴设在电子设备的屏幕上，并通过包裹所述电子设备的屏幕上的异物来实现净尘及消泡功能。
  4. 根据权利要求1所述的净尘胶层，其特征在于，
    所述净尘层的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。
  5. 根据权利要求1所述的净尘胶层，其特征在于，
    所述基材层的厚度范围为48um～52um，所述OCA胶层的厚度范围为37um～43um，所述净尘层的厚度范围为37um～43um。
  6. 一种净尘膜，其特征在于，所述净尘膜包括保护层及权利要求1～5中任一项所述的净尘胶层，所述保护层贴附在所述OCA胶层上。
  7. 根据权利要求6所述的净尘膜，其特征在于，
    所述保护层为玻璃层，所述保护层的厚度范围为0.05mm-0.85mm。
  8. 根据权利要求6所述的净尘膜，其特征在于，
    所述净尘膜还包括离型层，所述离型层贴设在所述净尘层背离所述基材层的表面；
    所述离型层的厚度范围为48um～52um。
  9. 一种净尘胶层的制造方法，其特征在于，所述制造方法包括：
    提供经软化处理的基材层；
    在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在所述基材层的第一表面形成净尘层；
    在所述净尘层表面复合第一离型层；
    在所述基材层的第二表面涂布OCA胶，且进行紫外线固化，以在所述基材层的第二表面形成OCA胶层；以及
    在所述OCA胶层表面复合第二离型层，制得所述净尘胶层，
    其中，所述净尘层具备净尘及消除气泡的功能。
  10. 根据权利要求9所述的净尘胶层的制造方法，其特征在于，
    所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述烘箱的温度范围为150℃～180℃。
  11. 根据权利要求10所述的净尘胶层的制造方法，其特征在于，
    所述在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
  12. 一种净尘膜的制造方法，其特征在于，所述制造方法包括：
    提供基材层；
    在所述基材层的第一表面涂布硅胶材料，并通过烘箱进行固化，以在所述基材层的第一表面形成净尘层；
    在所述净尘层表面复合离型层；
    在所述基材层的第二表面涂布OCA胶，且进行紫外线固化，以在所述基材层的第二表面形成OCA胶层；
    在所述OCA胶层表面贴设保护层。
  13. 根据权利要求12所述的具有消泡功能的净尘膜的制造方法，其特征在于，所述在所述基材层的第一表面涂布净尘层，并通过烘箱进行固化的步骤中，所述烘箱的烘道温度设置为150℃～180℃。
  14. 根据权利要求12所述的具有消泡功能的净尘膜的制造方法，其特征在于，所述在所述基材层的第一表面涂布净尘层，并通过烘箱进行固化的步骤中，所述净尘胶层通过烘箱进行固化的时间为2～3分钟。
  15. 一种净尘膜的贴膜方法，其特征在于，所述贴膜方法包括：
    撕去净尘层表面的离型层；
    将所述净尘膜贴设有所述净尘层的一面对准电子设备的屏幕；
    将所述净尘膜放置于所述电子设备屏幕上；
    按压所述净尘膜使其排气并与所述电子设备的屏幕贴合。
  16. 根据权利要求15所述的贴膜方法，其特征在于，所述按压所述净尘膜使其排气并与所述电子设备的屏幕贴合之后，还包括：
    若贴合之后所述净尘膜与所述电子设备屏幕之间存在异物，则将所述净尘膜与所述电子设备屏幕分离；
    对所述异物进行清洁；
    将所述净尘膜重新贴设于所述电子设备的屏幕上。
  17. 根据权利要求15所述的贴膜方法，其特征在于，所述对所述异物进行清洁，包括：
    若所述异物在所述电子设备的屏幕上，则通过擦拭或者粘尘贴清除所述异物；
    若所述异物在所述净尘膜的所述净尘层上，则通过净尘膜修复贴纸清除所述异物。
  18. 一种净尘膜套装，其特征在于，包括：
    权利要求6～8中任一项所述的净尘膜；以及
    净尘膜修复贴纸，所述净尘膜修复贴纸包括本体和设于本体表面的修复层，所述修复层用于粘贴在所述净尘膜的所述净尘层上，以修复所述净尘膜的所述净尘层。
  19. 根据权利要求18所述的净尘膜套装，其特征在于，所述修复层的粘性大于所述净尘层的粘性。
  20. 根据权利要求19所述的净尘膜套装，其特征在于，所述修复层还用于粘贴在所述净尘膜的所述净尘层上，以置换出所述净尘层上粘有的异物。
  21. 根据权利要求20所述的净尘膜套装，其特征在于，所述修复层的材料包括按重量比混合的以下组分：28％-35％的甲基乙烯基硅橡胶、55％-65％的乙酸乙酯、8％-12％的二甲苯以及1.5％-2.5％的乙基苯。
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