WO2023071026A1 - 冷却装置以及电子设备 - Google Patents

冷却装置以及电子设备 Download PDF

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Publication number
WO2023071026A1
WO2023071026A1 PCT/CN2022/081044 CN2022081044W WO2023071026A1 WO 2023071026 A1 WO2023071026 A1 WO 2023071026A1 CN 2022081044 W CN2022081044 W CN 2022081044W WO 2023071026 A1 WO2023071026 A1 WO 2023071026A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
module
accommodating cavity
dissipation module
cooling device
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PCT/CN2022/081044
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English (en)
French (fr)
Inventor
范皓龙
刘帆
李振杰
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中兴智能科技南京有限公司
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Application filed by 中兴智能科技南京有限公司 filed Critical 中兴智能科技南京有限公司
Publication of WO2023071026A1 publication Critical patent/WO2023071026A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the embodiments of the present application relate to the technical field of cooling devices, and in particular, to a cooling device and electronic equipment.
  • the transmission capacity and transmission rate of the communication network are also constantly increasing. Since the mutual conversion between the optical signal and the electrical signal in the communication network transmission process is realized through the optical module, the optical module is also developing towards a highly integrated direction, and the power and heat flux of the optical module are also gradually increasing. As a result, the heat generation rate of the optical module increases significantly during operation.
  • the method for dissipating heat from the optical module is: sticking the heat dissipating module on the surface of the optical module cage for accommodating the optical module, so as to dissipate heat from the optical module inside the optical module cage.
  • the inventors of the present application have found that when two optical modules are accommodated in the optical module cage at the same time and the two optical modules are running, the heat between the two optical modules cannot pass through the surface of the optical module cage.
  • the heat dissipation module dissipates quickly, causing the two optical modules to be easily burned.
  • An embodiment of the present application provides a cooling device, including: an optical module cage, the surface of the optical module cage is provided with a first opening, and the optical module cage is provided with a first accommodating cavity, a second accommodating cavity and A third accommodating cavity communicating with the outside of the optical module cage via the first opening, the third accommodating cavity is located between the first accommodating cavity and the second accommodating cavity, the first accommodating cavity Both the first accommodating cavity and the second accommodating cavity are used to accommodate the optical module; the first heat dissipation module is provided with a first fitting block and a first heat dissipation part, and the first fitting The block is fixed to the first heat dissipation part, and the first fitting block is embedded in the third accommodating cavity through the first opening.
  • the embodiment of the present application also provides an electronic device, including: two optical modules and the above-mentioned cooling device; one of the optical modules is disposed in the first accommodating cavity and the second accommodating cavity.
  • Fig. 1 is a schematic diagram of a partial structure of a cooling device provided by some embodiments of the present application
  • Fig. 2 is a schematic diagram of a partial structural decomposition of the cooling device provided by some embodiments of the present application;
  • Fig. 3 is a schematic diagram of a cooling device provided in some embodiments of the present application when cooperating with a circuit board, a first component and a second component;
  • Fig. 4 is a sectional view cut along the A-A direction in Fig. 3;
  • Fig. 5 is a sectional view cut along the B-B direction in Fig. 3;
  • Fig. 6 is a cross-sectional view of a cooling device provided in some embodiments of the present application when it cooperates with a circuit board and a first component.
  • the main purpose of the embodiments of the present application is to provide a cooling device and electronic equipment.
  • Some embodiments of the present application provide a cooling device, including: an optical module cage, the surface of the optical module cage is provided with a first opening, and the optical module cage is provided with a first accommodating cavity, a second accommodating cavity and A third accommodating cavity communicating with the outside of the optical module cage via the first opening, the third accommodating cavity is located between the first accommodating cavity and the second accommodating cavity, the first accommodating cavity Both the first accommodating cavity and the second accommodating cavity are used to accommodate the optical module; the first heat dissipation module is provided with a first fitting block and a first heat dissipation part, and the first fitting The block is fixed to the first heat dissipation part, and the first fitting block is embedded in the third accommodating cavity through the first opening.
  • the first fitting block can be positioned between the two The heat between the two optical modules is transferred to the first heat dissipation part, so that the heat between the two optical modules can be quickly dissipated, thereby preventing the two optical modules from being burned.
  • the cooling device provided by some embodiments of the present application includes: an optical module cage 110, the surface of the optical module cage 110 is provided with a first opening 111, and the optical module cage 110 is provided with a first accommodating cavity (not shown in the figure), the second accommodating cavity (not shown in the figure) and the third accommodating cavity (not shown in the figure) communicating with the outside of the optical module cage 110 via the first opening 111, the third accommodating cavity
  • the cavity is located between the first accommodation cavity and the second accommodation cavity, and both the first accommodation cavity and the second accommodation cavity are used to accommodate the optical module;
  • the first heat dissipation module 120, the first heat dissipation module 120 is provided with a first The fitting block 121 and the first heat dissipation portion 122 , the first fitting block 121 is fixed to the first heat dissipation portion 122 , and the first fitting block 121 is embedded in the third accommodating cavity through the first opening 111 .
  • the first heat dissipation portion 122 includes a heat conduction substrate 123 and a plurality of fins 124 , and the first fitting block 121 and the plurality of fins 124 are fixed on the heat conduction substrate 123 .
  • the plurality of fins 124 can increase the contact area between the first heat dissipation part 122 and the air, so that when the first fitting block 121 absorbs the heat generated by the optical module during operation and transfers it to the first heat dissipation part 122, The first heat dissipation portion 122 can quickly dissipate heat.
  • the first heat dissipation part 122 may not include the heat conduction substrate 123 and the plurality of fins 124, as long as the first heat dissipation part 122 can be used to transfer the first fitting block 121 to It is only necessary to dissipate the heat on the first heat dissipation portion 122 .
  • the first heat dissipation part 122 is a liquid cooling heat dissipation module.
  • the cooling device further includes: a second heat dissipation module 130; the optical module cage 110 is provided with a first side 112 and a second side 113, and the first opening 111 is located on the first side 112 ;
  • the second cooling module 130 is fixed on the second side 113 . In this way, adding the second heat dissipation module 130 can increase the heat dissipation efficiency of the cooling device.
  • the first heat dissipation part 122 and the second heat dissipation module 130 can dissipate heat on different sides of the optical module cage 110, That is, the first heat dissipation part 122 dissipates heat to the first side 112 of the optical module cage 110 , and the second heat dissipation module 130 dissipates heat to the second side 113 of the optical module cage 110 .
  • the second side 113 is provided with a second opening 114
  • the optical module cage 110 is also provided with a fourth accommodating chamber (not shown in the figure) communicating with the outside of the optical module cage 110 through the second opening 114 , the fourth accommodating cavity is arranged adjacent to the first accommodating cavity
  • the second heat dissipation module 130 is provided with a second fitting block (not shown in the figure) and a second heat dissipation part (not shown in the figure), and the second The fitting block is fixed to the second heat dissipation part, and the second fitting block is embedded in the fourth accommodating cavity through the second opening 114 .
  • the second fitting block since the second fitting block is embedded in the fourth accommodating cavity through the second opening 114, and the fourth accommodating cavity is located in the optical module cage 110, after the optical module cage 110 accommodates the optical module, and the light When the module is running, the second fitting block can directly transfer the heat inside the optical module cage 110 to the second heat dissipation part, thereby accelerating the rate of heat dissipation inside the optical module cage 110 .
  • the fourth accommodating cavity is adjacent to the first accommodating cavity, the rate of heat dissipation inside the first accommodating cavity can be further accelerated.
  • the first side 112 is connected to the second side 113 , so that the second heat dissipation module 130 can be attached to the first heat dissipation portion 122 .
  • the second heat dissipation module 130 is a liquid-cooled heat dissipation module. Since the heat dissipation efficiency of the liquid-cooled heat dissipation module is higher than the heat dissipation efficiency of the plurality of fins 124 of the first heat dissipation portion 122, the second heat dissipation module 130 After bonding with the first heat dissipation portion 122 , the heat dissipation efficiency of the first heat dissipation portion 122 can also be accelerated.
  • the first side 112 may not be connected to the second side 113, at this time, the first side 112 may be arranged opposite to the second side 113, so that the first heat dissipation module 120 is opposite to the second heat dissipation module 130 .
  • the second heat dissipation module 130 may not be a liquid-cooled heat dissipation module.
  • the second heat dissipation module 130 may include a heat conduction substrate (not shown in the figure) and a plurality of fins fixed on the heat conduction substrate (not shown in the figure), and the second fitting block can be fixed on the heat conduction substrate of the second heat dissipation module 130 .
  • the optical module cage 110 is further provided with a third opening 115 and a fourth opening 116, the first accommodating cavity communicates with the outside of the optical module cage 110 through the third opening 115, and the second accommodating cavity communicates with the outside of the optical module cage 110 through the fourth opening 116 communicates with the outside of the optical module cage 110 , so that an optical module can be embedded in the first accommodation cavity through the third opening 115 , and an optical module can be embedded in the second accommodation cavity through the fourth opening 116 .
  • the optical module cage 110 is further provided with a front surface 117 , and both the third opening 115 and the fourth opening 116 are located on the front surface 117 .
  • the optical module interferes with the first heat dissipation module 120 and the second heat dissipation module 130 .
  • the first side 112 is connected to the front 117
  • the second side 113 is also connected to the front 117 .
  • a first through hole (not shown in the figure) and a second through hole (not shown in the figure) are provided on the cavity wall of the first accommodating cavity, and the first accommodating cavity passes through the first through hole.
  • the hole communicates with the third accommodating cavity, and the first accommodating cavity communicates with the fourth accommodating cavity via the second through hole; the wall of the second accommodating cavity is provided with a third through hole (not shown in the figure),
  • the second accommodating cavity communicates with the fourth accommodating cavity through the third through hole.
  • the modules fit together, thereby speeding up the rate at which the optical module dissipates heat.
  • the first fitting block 121 can fit the optical module accommodated in the second accommodating cavity through the third through hole, thereby speeding up the heat dissipation of the optical module. rate.
  • the optical module cage 110 also has a third side (not shown in the figure) opposite to the second side 113 , and the third side is used for fixing on the circuit board 140 . In this way, when the optical module cage 110 is installed on the circuit board 140 , interference between the first heat dissipation module 120 or the second heat dissipation module 130 and the circuit board 140 can be avoided.
  • the cooling device further includes: a fixing plate 151 and a fixing piece 152; the fixing plate 151 is located on the side of the second heat dissipation module 130 away from the optical module cage 110; the fixing piece 152 is fixed to the fixing plate 151, and the fixing piece 152 It is also used for fixing on the circuit board 140 , so that the fixing plate 151 is fixed on the circuit board 140 via the fixing piece 152 , and the second heat dissipation module 130 is clamped between the fixing plate 151 and the optical module cage 110 . In this way, the stability when the second heat dissipation module 130 is fixed can be improved.
  • the fixing member 152 is a spring screw. In this way, the second heat dissipation module 130 can move toward and away from the circuit board 140 to ensure that the second heat dissipation module 130 is attached to the first heat dissipation portion 122 .
  • the cooling device further includes: a third heat dissipation module 161; the third heat dissipation module 161 is used to place the first component 171 fixed on the circuit board 140 on the side away from the circuit board 140, and A component 171 dissipates heat. In this way, it is convenient for the third heat dissipation module 161 to absorb the heat generated by the first component 171 during operation, so as to prevent the first component 171 from being burned.
  • the first component 171 may be a chip, an inductor, a capacitor, and the like.
  • the cooling device further includes: a first circulation pipeline 181, at least part of which is a flexible pipeline; both the second heat dissipation module 130 and the third heat dissipation module 161 are liquid-cooled heat dissipation Modules; the second heat dissipation module 130 and the third heat dissipation module 161 communicate through the first circulation pipeline 181 .
  • the first circulation pipeline 181 is located between the second heat dissipation module 130 and the third heat dissipation module 130 .
  • Part of the pipelines between the modules 161 are flexible pipelines, and the flexible pipelines are deformed to ensure that the second heat dissipation module 130 and the third heat dissipation module 161 can communicate through the first circulation pipeline 181 .
  • the cooling device may further include: a fourth heat dissipation module 162; the fourth heat dissipation module 162 is a liquid-cooled heat dissipation module; the fourth heat dissipation module 162 is used to place the second components 172 fixed on the circuit board 140 The side away from the circuit board 140 is used to dissipate heat from the second component 172 ; the second heat dissipation module 130 , the third heat dissipation module 161 and the fourth heat dissipation module 162 are connected through the first circulation pipeline 181 .
  • the second component 172 can be a chip, an inductor, a capacitor, and the like.
  • the first circulation pipeline 181 is located between the second heat dissipation module 130 and the fourth heat dissipation module 130 .
  • Part of the pipeline between the modules 162 is a flexible pipeline, and the flexible pipeline is deformed to ensure that the second heat dissipation module 130 and the fourth heat dissipation module 162 can communicate through the first circulation pipeline 181; and when the third heat dissipation module 161 and the circuit board 140 and the distance between the fourth heat dissipation module 162 and the circuit board 140 are different, so that the first circulation pipeline 181 is located in the part of the pipe between the third heat dissipation module 161 and the fourth heat dissipation module 162
  • the path is a flexible pipeline, and the flexible pipeline is deformed to ensure that the third heat dissipation module 161 and the fourth heat dissipation module 162 can communicate through the first circulation pipeline 181 . Therefore, it is ensured that the second heat dissipation module 130 , the third heat dissipation module 161 and the fourth heat dissipation module 162 are communicated through the first circulation pipeline 181 .
  • the above-mentioned flexible pipeline may be a pipeline with a flexible bending effect such as a non-metallic hose, a metal bellows, a metal hose, which is not limited in this embodiment of the present application.
  • the above-mentioned electronic equipment may not be provided with the first circulation pipeline 181 , and the second heat dissipation module 130 may not be a liquid cooling heat dissipation module.
  • the above-mentioned electronic equipment includes: a fifth heat dissipation module 163 and a second circulation pipeline 182; both the third heat dissipation module 161 and the fifth heat dissipation module 163 are liquid-cooled heat dissipation modules, and the fifth heat dissipation module 163 is located on the side of the third heat dissipation module 161 close to the second heat dissipation module 130 , and the fifth heat dissipation module 163 is fixed to the second heat dissipation module 130 ; the third heat dissipation module 161 and the fifth heat dissipation module 163 communicate through the second circulation pipeline 182 . In this way, the second heat dissipation module 130 can transfer heat to
  • the second heat dissipation module 130 can be a flexible heat pipe.
  • the second heat dissipation module 130 and the fifth heat dissipation module 163 can be fixed by soldering or epoxy glue.
  • the above-mentioned liquid-cooled heat dissipation module can be a liquid-cooled heat dissipation module with a liquid circulation channel, such as a milling groove cold plate, a micro-channel cold plate, and a buried copper tube cold plate, wherein the liquid flowing in the liquid-cooled heat dissipation module
  • the working medium can be a single-phase cooling medium such as fluorinated liquid, deionized water or ethylene glycol aqueous solution, or R134a (1,1,1,2-tetrafluoroethane), HFO-1234yf (2,3, 3,3-tetrafluoropropene), HFO-1234ze (1,3,3,3-tetrafluoropropene) and other phase change working fluids.
  • Some embodiments of the present application provide an electronic device, including: two optical modules and a cooling device.
  • the cooling device includes: an optical module cage, the surface of the optical module cage is provided with a first opening, the optical module cage is provided with a first accommodating cavity, a second accommodating cavity and communicates with the outside of the optical module cage through the first opening
  • the third accommodating cavity, the third accommodating cavity is located between the first accommodating cavity and the second accommodating cavity, both the first accommodating cavity and the second accommodating cavity are used to accommodate the optical module;
  • the first heat dissipation module is provided with a first fitting block and a first heat dissipation part, the first fitting block is fixed to the first heat dissipation part, and the first fitting block is embedded in the third accommodating cavity through the first opening.
  • an optical module is disposed in the first accommodating cavity and the second accommodating cavity.
  • the first fitting block can transfer the heat between the two optical modules to the first heat sink, so that the heat between the two optical modules can be quickly dissipated, thereby avoiding Two optical modules were burned.
  • the cooling device included in the electronic equipment provided in the embodiment of the present application is the same as the cooling device provided in some of the above-mentioned embodiments. Therefore, the cooling device provided in the embodiment of the present application has the same The technical effect will not be repeated here.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种冷却装置以及电子设备。冷却装置包括：光模块笼子(110)，光模块笼子(110)的表面设有第一开口(111)，光模块笼子(110)内设有第一容置腔、第二容置腔以及经由第一开口(111)与光模块笼子(110)外部连通的第三容置腔，第三容置腔位于第一容置腔与第二容置腔之间，第一容置腔与第二容置腔均用于容置光模块；第一散热模块(120)，第一散热模块(120)设有第一嵌合块(121)以及第一散热部(122)，第一嵌合块(121)与第一散热部(122)固定，第一嵌合块(121)经由第一开口(111)嵌装在第三容置腔内。

Description

冷却装置以及电子设备
相关申请的交叉引用
本申请基于申请号为“202111241567.4”、申请日为2021年10月25日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此以引入方式并入本申请。
技术领域
本申请实施例涉及冷却装置技术领域，特别涉及一种冷却装置以及电子设备。
背景技术
随着科学技术的发展，通信网络的传输容量和传输速率也在不断的增涨。而由于通信网络传输过程中的光信号与电信号之间的相互转换是通过光模块实现的，从而使得光模块也朝着高度集成化的方向发展，进而使得光模块的功率和热流密度也逐步提高，致使光模块运行时的产热速率大幅增加。
目前，用于对光模块进行散热的方式为：将散热模块贴敷在用于容置光模块的光模块笼子表面上，从而对置于光模块笼子内部的光模块进行散热。然而，经本申请发明人分析发现，当光模块笼子中同时容置两个光模块、且两个光模块运行时，位于两个光模块之间的热量无法通过贴敷在光模块笼子表面的散热模块快速消散，从而致使两个光模块易被烧毁。
因此，亟须提供一种冷却装置以及电子设备，当光模块笼子中同时容置两个光模块、且两个光模块运行时，使得位于两个光模块之间的热量能够快速消散，从而避免两个光模块被烧毁。
发明内容
本申请实施例提供了一种冷却装置，包括：光模块笼子，所述光模块笼子的表面设有第一开口，所述光模块笼子内设有第一容置腔、第二容置腔以及经由所述第一开口与所述光模块笼子外部连通的第三容置腔，所述第三容置腔位于所述第一容置腔与所述第二容置腔之间，所述第一容置腔与所述第二容置腔均用于容置光模块；第一散热模块，所述第一散热模块设有第一嵌合块以及第一散热部，所述第一嵌合块与所述第一散热部固定，所述第一嵌合块经由所述第一开口嵌装在所述第三容置腔内。
本申请实施例还提供了一种电子设备，包括：两个光模块以及上述的冷却装置；所述第一容置腔以及所述第二容置腔内均设有一个所述光模块。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一些实施例提供的冷却装置部分结构的示意图；
图2是本申请一些实施例提供的冷却装置部分结构分解后的示意图；
图3是本申请一些实施例提供的冷却装置与电路板、第一元器件以及第二元器件配合时的示意图；
图4是沿图3中A-A方向剖切的剖视图；
图5是沿图3中B-B方向剖切的剖视图；
图6是本申请一些实施例提供的冷却装置与电路板以及第一元器件配合时的剖视图。
具体实施方式
本申请实施例的主要目的在于提出一种冷却装置以及电子设备，当光模块笼子中同时容置两个光模块、且两个光模块运行时，使得位于两个光模块之间的热量能够快速消散，从而避免两个光模块被烧毁。
本申请一些实施例提供一种冷却装置，包括：光模块笼子，所述光模块笼子的表面设有第一开口，所述光模块笼子内设有第一容置腔、第二容置腔以及经由所述第一开口与所述光模块笼子外部连通的第三容置腔，所述第三容置腔位于所述第一容置腔与所述第二容置腔之间，所述第一容置腔与所述第二容置腔均用于容置光模块；第一散热模块，所述第一散热模块设有第一嵌合块以及第一散热部，所述第一嵌合块与所述第一散热部固定，所述第一嵌合块经由所述第一开口嵌装在所述第三容置腔内。如此，当所述第一容置腔以及所述第二容置腔内均设有一个光模块、且两个光模块运行时，由于所述第三容置腔位于所述第一容置腔与所述第二容置腔之间，且所述第一嵌合块经由所述第一开口嵌装在所述第三容置腔内，因此，所述第一嵌合块可将位于两个光模块之间的热量传递至所述第一散热部，使得两个光模块之间的热量之间的热量能够快速消散，进而避免两个光模块被烧毁。
为使本申请一些实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请一些实施例进行详细的阐述。
参见图1与图2，本申请一些实施例提供的冷却装置，包括：光模块笼子110，光模块笼子110的表面设有第一开口111，光模块笼子110内设有第一容置腔(图中未示出)、第二容置腔(图中未示出)以及经由第一开口111与光模块笼子110外部连通的第三容置腔(图中未示出)，第三容置腔位于第一容置腔与第二容置腔之间，第一容置腔与第二容置腔均用于容 置光模块；第一散热模块120，第一散热模块120设有第一嵌合块121以及第一散热部122，第一嵌合块121与第一散热部122固定，第一嵌合块121经由第一开口111嵌装在第三容置腔内。
在一些实施例中，第一散热部122包括导热基板123以及多个翅片124，第一嵌合块121以及多个翅片124均固定在导热基板123上。如此，多个翅片124可增加第一散热部122与空气的接触面积，从而在第一嵌合块121吸收由光模块运行时产生的热量后、并传递至第一散热部122上时，第一散热部122可快速消散热量。需要说明的是，在其他可替代性的实施例中，第一散热部122也可不包括导热基板123以及多个翅片124，只要第一散热部122可用于将第一嵌合块121传递至第一散热部122上的热量消散即可。在一实施例中，第一散热部122为液冷散热模块。
同时参见图3至图5，在一些实施例中，冷却装置还包括：第二散热模块130；光模块笼子110设有第一侧面112以及第二侧面113，第一开口111位于第一侧面112；第二散热模块130固定于第二侧面113。如此，增设第二散热模块130可增加冷却装置的散热效率。
此外，由于第一开口111位于第一侧面112，第二散热模块130固定于第二侧面113，因此，第一散热部122与第二散热模块130可对光模块笼子110不同的侧面进行散热，即第一散热部122对光模块笼子110的第一侧面112进行散热，第二散热模块130对光模块笼子110的第二侧面113进行散热。
在一些实施例中，第二侧面113设有第二开口114，光模块笼子110内还设有经由第二开口114与光模块笼子110外部连通的第四容置腔(图中未示出)，第四容置腔与第一容置腔相邻设置；第二散热模块130设有第二嵌合块(图中未示出)以及第二散热部(图中未示出)，第二嵌合块与第二散热部固定，第二嵌合块经由第二开口114嵌装在第四容置腔内。
如此，由于第二嵌合块经由第二开口114嵌装在第四容置腔内、且第四容置腔位于光模块笼子110内，从而在光模块笼子110容置光模块后、且光模块运行时，第二嵌合块可直接将光模块笼子110内部的热量传递至第二散热部上，进而加快光模块笼子110内部消散热量的速率。此外，由于第四容置腔与第一容置腔相邻设置，因此，可进一步加快第一容置腔内部消散热量的速率。
在一些实施例中，第一侧面112与第二侧面113相连，如此，可将第二散热模块130与第一散热部122贴合。在一实施例中，第二散热模块130为液冷散热模块，由于液冷散热模块的散热效率高于第一散热部122的多个翅片124的散热效率，因此，将第二散热模块130与第一散热部122贴合后，还可加快第一散热部122的散热效率。
在一实施例中，第一侧面112也可不与第二侧面113相连，此时，第一侧面112可与第 二侧面113相对设置，从而使得第一散热模块120与第二散热模块130相对设置。在一实施例中，第二散热模块130也可不为液冷散热模块，此时，第二散热模块130可包括导热基板(图中未示出)以及固定在导热基板上的多个翅片(图中未示出)，并可将第二嵌合块固定在第二散热模块130的导热基板上。
在一些实施例中，光模块笼子110还设有第三开口115以及第四开口116，第一容置腔经由第三开口115与光模块笼子110外部连通，第二容置腔经由第四开口116与光模块笼子110外部连通，如此，可通过第三开口115向第一容置腔内嵌装光模块，通过第四开口116向第二容置腔内嵌装光模块。
在一些实施例中，光模块笼子110还设有正面117，第三开口115以及第四开口116均位于正面117。如此，由于第一开口111位于第一侧面112，第二开口114位于第二侧面113，第三开口115以及第四开口116均位于正面117，可避免在向第一容置腔以及第二容置腔中安装光模块时，光模块与第一散热模块120以及第二散热模块130产生干涉。
在一些实施例中，第一侧面112与正面117相连、且第二侧面113也与正面117相连。
在一些实施例中，第一容置腔的腔壁上设有第一通孔(图中未示出)以及第二通孔(图中未示出)，第一容置腔经由第一通孔与第三容置腔连通，第一容置腔经由第二通孔与第四容置腔连通；第二容置腔的腔壁上设有第三通孔(图中未示出)，第二容置腔经由第三通孔与第四容置腔连通。如此，在第一容置腔容置光模块后，第一嵌合块121以及第二嵌合块可分别经由第一通孔以及第二通孔与容置在第一容置腔中的光模块相贴合，进而加快该光模块消散热量时的速率。在第二容置腔容置光模块后，第一嵌合块121可经由第三通孔与容置在第二容置腔中的光模块相贴合，进而加快该光模块消散热量时的速率。
在一些实施例中，光模块笼子110还设有与第二侧面113相对设置的第三侧面(图中未示出)，第三侧面用于固定于电路板140上。如此，可避免将光模块笼子110安装至电路板140上时，第一散热模块120或第二散热模块130与电路板140发生干涉。
在一些实施例中，冷却装置还包括：固定板151以及固定件152；固定板151位于第二散热模块130远离光模块笼子110的一侧；固定件152与固定板151固定、且固定件152还用于固定于电路板140上，以使固定板151经由固定件152固定于电路板140、并使第二散热模块130被夹持在固定板151与光模块笼子110之间。如此，可提升第二散热模块130固定时的稳定性。
在一些实施例中，固定件152为弹簧螺钉。如此，可使得第二散热模块130可沿靠近以及远离电路板140的方向移动，以确保第二散热模块130与第一散热部122相贴合。
在一些实施例中，冷却装置还包括：第三散热模块161；第三散热模块161用于放置在 固定于电路板140上的第一元器件171远离电路板140的一侧，并对该第一元器件171进行散热。如此，可便于第三散热模块161吸收第一元器件171在运行时产生的热量，避免第一元器件171被烧毁。其中，第一元器件171可为芯片、电感、电容等。
在一些实施例中，冷却装置还包括：第一循环管路181，第一循环管路181的至少部分管路为柔性管路；第二散热模块130以及第三散热模块161均为液冷散热模块；第二散热模块130以及第三散热模块161通过第一循环管路181连通。
如此，当第二散热模块130与电路板140之间的间距和第三散热模块161与电路板140之间的间距不同时，使得第一循环管路181位于第二散热模块130与第三散热模块161之间的部分管路为柔性管路、并使柔性管路发生形变，以确保第二散热模块130以及第三散热模块161可通过第一循环管路181连通。
在一些实施例中，冷却装置还可包括：第四散热模块162；第四散热模块162为液冷散热模块；第四散热模块162用于放置在固定于电路板140上的第二元器件172远离电路板140的一侧，并对该第二元器件172进行散热；第二散热模块130、第三散热模块161以及第四散热模块162通过第一循环管路181连通。其中，第二元器件172可为芯片、电感、电容等。
如此，当第二散热模块130与电路板140之间的间距和第四散热模块162与电路板140之间的间距不同时，使得第一循环管路181位于第二散热模块130与第四散热模块162之间的部分管路为柔性管路、并使柔性管路发生形变，以确保第二散热模块130以及第四散热模块162可通过第一循环管路181连通；且当第三散热模块161与电路板140之间的间距和第四散热模块162与电路板140之间的间距不同时，使得第一循环管路181位于第三散热模块161与第四散热模块162之间的部分管路为柔性管路、并使柔性管路发生形变，以确保第三散热模块161以及第四散热模块162可通过第一循环管路181连通。从而确保第二散热模块130、第三散热模块161以及第四散热模块162通过第一循环管路181连通。
在一些实施例中，上述柔性管路可为非金属软管、金属波纹管、金属软管等具有柔性折弯效果的管路，本申请实施例对此不做限定。
需要说明的是，上述电子设备也可不设有第一循环管路181，且第二散热模块130也可不为液冷散热模块。参见图6，在一些实施例中，上述电子设备包括：第五散热模块163以及第二循环管路182；第三散热模块161以及第五散热模块163均为液冷散热模块，第五散热模块163位于第三散热模块161靠近第二散热模块130的一侧，第五散热模块163与第二散热模块130固定；第三散热模块161以及第五散热模块163通过第二循环管路182连通。如此，第二散热模块130可将热量传递至第五散热模块163上。
在一些实施例中，第二散热模块130可为柔性热管，此时，可通过锡膏焊焊接或环氧树 脂胶粘接将第二散热模块130与第五散热模块163固定。
另外，需要说明的是，上述的液冷散热模块可以是铣槽冷板、微通道冷板、埋铜管冷板等具备液体流通通道的液冷散热模块，其中，液冷散热模块中流通的工质可以是氟化液、去离子水或乙二醇水溶液等单相冷却工质，也可以是R134a(1，1，1，2-四氟乙烷)、HFO-1234yf(2,3,3,3-四氟丙烯)、HFO-1234ze(1,3,3,3-四氟丙烯)等相变工质。
本申请一些实施例提供一种电子设备，包括：两个光模块以及冷却装置。
具体的，冷却装置包括：光模块笼子，光模块笼子的表面设有第一开口，光模块笼子内设有第一容置腔、第二容置腔以及经由第一开口与光模块笼子外部连通的第三容置腔，第三容置腔位于第一容置腔与第二容置腔之间，第一容置腔与第二容置腔均用于容置光模块；第一散热模块，第一散热模块设有第一嵌合块以及第一散热部，第一嵌合块与第一散热部固定，第一嵌合块经由第一开口嵌装在第三容置腔内。
更具体的，第一容置腔以及第二容置腔内均设有一个光模块。如此，当电子设备运行时，第一嵌合块可将位于两个光模块之间的热量传递至第一散热部，使得两个光模块之间的热量之间的热量能够快速消散，进而避免两个光模块被烧毁。
事实上，本申请实施例提供的电子设备包括的冷却装置与上述的一些实施例提供的冷却装置相同，因此，本申请实施例提供的冷却装置与上述的一些实施例提供的冷却装置具有相同的技术效果，在此不再赘述。
还需说明的是，本领域的普通技术人员可以理解，在本申请各实施例中，为了使读者更好地理解本申请而提出了许多技术细节。但是，即使没有这些技术细节和基于以上各实施例的种种变化和修改，也可以实现本申请所要求保护的技术方案。以上各个实施例的划分是为了描述方便，不应对本申请的具体实现方式构成任何限定，各个实施例在不矛盾的前提下可以相互结合相互引用。

Claims (13)

  1. 一种冷却装置，包括：
    光模块笼子(110)，所述光模块笼子(110)的表面设有第一开口(111)，所述光模块笼子(110)内设有第一容置腔、第二容置腔以及经由所述第一开口(111)与所述光模块笼子(110)外部连通的第三容置腔，所述第三容置腔位于所述第一容置腔与所述第二容置腔之间，所述第一容置腔与所述第二容置腔均用于容置光模块；
    第一散热模块(120)，所述第一散热模块(120)设有第一嵌合块(121)以及第一散热部(122)，所述第一嵌合块(121)与所述第一散热部(122)固定，所述第一嵌合块(121)经由所述第一开口(111)嵌装在所述第三容置腔内。
  2. 根据权利要求1所述的冷却装置，其中，所述第一散热部(122)包括导热基板(123)以及多个翅片(124)，所述第一嵌合块(121)以及所述多个翅片(124)均固定在所述导热基板(123)上。
  3. 根据权利要求1所述的冷却装置，其中，还包括：第二散热模块(130)；
    所述光模块笼子(110)设有第一侧面(112)以及第二侧面(113)，所述第一开口(111)位于所述第一侧面(112)；
    所述第二散热模块(130)固定于所述第二侧面(113)。
  4. 根据权利要求3所述的冷却装置，其中，
    所述第二侧面(113)设有第二开口(114)，所述光模块笼子(110)内还设有经由所述第二开口(114)与所述光模块笼子(110)外部连通的第四容置腔，所述第四容置腔与所述第一容置腔相邻设置；
    所述第二散热模块(130)设有第二嵌合块以及第二散热部，所述第二嵌合块与所述第二散热部固定，所述第二嵌合块经由所述第二开口(114)嵌装在所述第四容置腔内。
  5. 根据权利要求3或4所述的冷却装置，其中，
    所述第一侧面(112)与所述第二侧面(113)相连；
    所述第二散热模块(130)与所述第一散热部(122)相贴合。
  6. 根据权利要求5所述的冷却装置，其中，
    所述光模块笼子(110)还设有与所述第二侧面(113)相对设置的第三侧面，所述第三侧面用于固定于电路板(140)上。
  7. 根据权利要求6所述的冷却装置，其中，还包括：固定板(151)以及固定件(152)；
    所述固定板(151)位于所述第二散热模块(130)远离所述光模块笼子(110)的一侧；
    所述固定件(152)与所述固定板(151)固定、且所述固定件(152)还用于固定于电路板(140)上，以使所述固定板(151)经由所述固定件(152)固定于电路板(140)、并使所述第二散热模块(130)被夹持在所述固定板(151)与所述光模块笼子(110)之间。
  8. 根据权利要求7所述的冷却装置，其中，所述固定件(152)为弹簧螺钉。
  9. 根据权利要求6所述的冷却装置，其中，还包括：第三散热模块(161)；
    所述第三散热模块(161)用于放置在固定于电路板(140)上的第一元器件(171)远离电路板(140)的一侧，并对该第一元器件(171)进行散热。
  10. 根据权利要求9所述的冷却装置，其中，还包括：第一循环管路(181)，所述第一循环管路(181)的至少部分管路为柔性管路；
    所述第二散热模块(130)以及所述第三散热模块(161)均为液冷散热模块；
    所述第二散热模块(130)以及所述第三散热模块(161)通过所述第一循环管路(181)连通。
  11. 根据权利要求10所述的冷却装置，其中，还包括：第四散热模块(162)；
    所述第四散热模块(162)为液冷散热模块；
    所述第四散热模块(162)用于放置在固定于电路板(140)上的第二元器件(172)远离电路板(140)的一侧，并对该第二元器件(172)进行散热；
    所述第二散热模块(130)、所述第三散热模块(161)以及所述第四散热模块(162)通过所述第一循环管路(181)连通。
  12. 根据权利要求9所述的冷却装置，其中，还包括：第五散热模块(163)以及第二循环管路(182)；
    所述第三散热模块(161)以及所述第五散热模块(163)均为液冷散热模块，所述第五散热模块(163)位于所述第三散热模块(161)靠近所述第二散热模块(130)的一侧，所述第五散热模块(163)与所述第二散热模块(130)固定；
    所述第三散热模块(161)以及所述第五散热模块(163)通过所述第二循环管路(182)连通。
  13. 一种电子设备，包括：两个光模块以及如上述权利要求1-12任一项所述的冷却装置；所述第一容置腔以及所述第二容置腔内均设有一个所述光模块。
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