WO2023068138A1

WO2023068138A1 - Device tray

Info

Publication number: WO2023068138A1
Application number: PCT/JP2022/038053
Authority: WO
Inventors: 峻有馬
Original assignee: 三井金属鉱業株式会社
Priority date: 2021-10-21
Filing date: 2022-10-12
Publication date: 2023-04-27
Also published as: JPWO2023068138A1; CN220549498U

Abstract

Provided is a device tray that reduces the occurrence of chipping during transport or placement. A device tray (101) comprises: a plurality of linear members (102, 103) intersecting with each other; a plurality of openings (104) formed by the plurality of linear members (102, 103) stacked in layers; and a protrusion (106). The protrusion (106) is integrated with the linear members (102, 103) of the outermost layer via an integration member (107). The linear members (102, 103) of the outermost layer are not embedded in the protrusion (106). The integration member (107) is penetrating into the openings (104).

Description

device tray

The present invention relates to a device tray for storing and heating devices.

Patent Document 1 discloses a jig for chip-shaped electronic components in which a plurality of chip storage portions are arranged in two directions by a plurality of linear members extending in two directions perpendicular to each other. The jig has an outer peripheral edge extending in a direction parallel to the diagonal line of the square formed by the opening of the chip storage section, and along the outer peripheral edge, complete chip storage sections and incomplete chip storage sections are alternately arranged. In the incomplete chip housing portion, the side wall portion forms an opening of a size that allows the chip-like electronic component to be immediately ejected regardless of the posture of the chip-like electronic component.

JP 2021-68767 A

In a conventional jig for chip-shaped electronic components such as that disclosed in Patent Document 1, when the jig is transported or placed, the ends of the filament members are damaged (chipping) due to vibration during transportation or contact with external members. tended to be easy. If the filament member of the jig is damaged, not only is there a possibility that the original function of the jig to stably hold the chip-shaped electronic component is impaired, but the deficient filament member becomes dust and scatters, resulting in chips. Adherence to the electronic component may cause product defects in the chip electronic component. It is desirable to prevent the occurrence of such chipping of the filament member as much as possible.

Therefore, an object of the present invention is to provide a device tray having a structure that is less likely to be damaged during transportation or placement.

In order to solve the above problems, the present invention provides a device tray comprising a plurality of intersecting filament members, a plurality of openings formed by the plurality of stacked filament members, and a projecting portion, the device tray comprising: The portion is integrated with the outermost filament member via an integrated member, the outermost filament member is not embedded in the protruding portion, and the integrated member penetrates into the opening. provide a device tray.

A device tray according to one aspect of the present invention is characterized in that the integrated member is made of ceramics.

A device tray according to an aspect of the present invention is characterized in that the integrated member permeates to the inside of the opening located inside the outermost filament member.

A device tray according to an aspect of the present invention is characterized in that the protrusion is provided along the outer circumference of the outermost filament member.

A device tray according to an aspect of the present invention is characterized by further comprising a second protrusion.

In the device tray according to an aspect of the present invention, the projecting portion is provided at least at one of the corner ends of the lower surface of the lowermost filamentary member, and is a leg portion present at a total of three or more locations. Characterized by

A device tray according to an aspect of the present invention is characterized in that the projecting portion is a bank portion integrated with the upper surface of the uppermost filament member.

ADVANTAGE OF THE INVENTION According to this invention, a device tray can reduce the loss|damage of the edge part of a linear member in the case of transportation or mounting.
Other objects, features and advantages of the present invention will become apparent from the following description of embodiments of the invention taken in conjunction with the accompanying drawings.

1 is a schematic diagram of a device tray viewed from above according to a first embodiment of the present invention; FIG. 1 is a schematic view of a device tray viewed from the side according to a first embodiment of the invention; FIG. FIG. 4 is a schematic view of a device tray viewed from the side as a modification of the first embodiment of the invention; FIG. 4 is a schematic view of a device tray viewed from the side as a modification of the first embodiment of the invention; FIG. 4 is a schematic view of a device tray viewed from the side as a modification of the first embodiment of the invention; 1 is an external view of a device tray as a first embodiment of the invention; FIG. 1 is an external view of a device tray as a first embodiment of the invention; FIG. Fig. 2 is a schematic view of a device tray viewed from the side according to a second embodiment of the invention;

Although the embodiments of the present invention will be described below with reference to the drawings, the present invention is not limited to these embodiments.

FIG. 1 is a schematic diagram of a device tray 101 viewed from above according to the first embodiment of the present invention. The device tray 101 includes a plurality of first linear members 102 extending in parallel in one direction (X direction) and a direction intersecting with the plurality of first linear members 102 (Y direction) extending in parallel. A plurality of second filament members 103 are provided. The plurality of second wire members 103 are arranged on the plurality of first wire members 102 (Z direction). Each of the plurality of openings 104 has a plurality of second filaments arranged in parallel with two adjacent first filament members among the plurality of first filament members 102 arranged in parallel. It is formed so as to be surrounded by two adjacent second filament members of the member 103 . A device 105 can be housed in each of the plurality of openings 104 .

The intersection angle between the plurality of first filamentary members 102 and the plurality of second filamentary members 103 is approximately 90°. good. For example, the intersection angle may be set according to the shape of the device 105 accommodated in the opening 104 of the device tray 101 . Also, the interval between two adjacent first filamentary members and the interval between two adjacent second filamentous members may be set according to the specific application of the device tray 101 .

FIG. 2A is a schematic diagram of the device tray 101 viewed from the side in the Y direction. A plurality of first filamentary members 102 extending parallel to the X direction and a plurality of second filamentary members 103 extending parallel to the Y direction are alternately stacked in the Z direction to form an opening. A device tray 101 having a portion 104 is formed. The device tray 101 has four legs 106 below the first filament member 102 in the bottom layer, and FIG. 2A shows the two legs 106 on the front side of the page. The leg portion 106 is integrated with the lowermost first filament member 102 via an integration member 107 . A constant distance is maintained between the lower surface of the lowermost first wire member 102 and the upper surface of the leg portion 106 , and the lowermost first wire member 102 is buried in the leg portion 106 . do not have. As shown in FIG. 2A, the integrated member 107 penetrates between the first filament member 102 in the second layer from the bottom and the first filament member 102 in the third layer from the bottom, Thereby, the leg portion 106, the first wire member 102, and the second wire member 103 are integrally fixed.

At least one of the plurality of first wire members 102, the plurality of second wire members 103, the legs 106, and the integrated member 107 is connected to the device 105 accommodated in the opening 104 of the device tray 101. device 105 and may be fabricated from a material suitable for heating device 105 . Examples of resins include epoxy resins, acrylic resins, polyimide resins, polyetherimide resins, polyethersulfone resins, liquid crystal polymers, fluorine-based copolymer resins, and the like. Metals include iron, nickel, copper, titanium, tungsten, aluminum, platinum, silver, or alloys thereof (for example, iron-chromium-nickel alloy, etc.). Furthermore, from the viewpoint of improving the heat resistance of the device tray 101, it is necessary to At least one may be manufactured from ceramics. Ceramics include at least one of alumina, silicon carbide, silicon nitride, zirconia, mullite, zircon, cordierite, aluminum titanate, magnesium titanate, magnesia, titanium diboride, boron nitride, boron carbide, and the like. In particular, the ceramics may comprise alumina, mullite, cordierite, zirconia, or silicon carbide. Ceramics as a material has excellent rigidity and heat resistance reliability. And a ceramic device tray 101 having excellent heat resistance and reliability can be obtained. Furthermore, when the ceramic device 105 is stored, the ceramic device tray 101 can be used for high-temperature processes such as repeated application to the firing process of the device 105 . When the device tray 101 is rapidly heated and cooled, the ceramic may contain silicon carbide, and in this case, the surface may be coated with low-reactivity zirconia, yttria, or the like. Some of the plurality of first filament members 102, the plurality of second filament members 103, the legs 106, and the integrated member 107 may be made from the same material, or may be made from different materials. may be manufactured. In particular, when the same material is selected for the first filament member 102, the second filament member 103, the leg portion 106, and the integrated member 107, the difference in thermal expansion between the members becomes small. By reducing the thermal stress that occurs during cooling, the device tray 101 can be made less likely to crack or deform during firing or rapid cooling.

In the first embodiment, the legs 106 are provided at the four corners of the lower surface of the device tray 101. However, the number and installation of the legs 106 can be changed as long as the device tray 101 can be stably placed on a flat surface. The location is not limited to this. For example, the legs 106 may be provided at a total of three locations, i.e., two adjacent corners and the center of one opposing side, or may be provided at a total of three locations, i.e., two adjacent sides and opposing corners. Alternatively, for example, they may be provided at a total of six locations, i.e., the four corners of the lower surface of the device tray 101 and the centers of two opposing sides. Alternatively, one leg portion 106 extending along the outer circumference of the lower surface of the device tray 101 may be used. Thus, the installation positions of the legs 106 are not limited to the four corners of the bottom surface, and the number of legs is not limited to four. Any structure may be used as long as the device tray 101 can be stably placed on a flat surface.

Also, instead of the rectangular device tray 101 as in the first embodiment, it is possible to use a triangular or pentagonal or more polygonal device tray. When the device tray is triangular, stable placement can be achieved by providing the legs at the three corners of the lower surface of the device tray or at the center of each side. When the device tray has a polygonal shape of pentagon or more, the legs may be provided at each corner of the lower surface of the device tray, or may be provided at the center of the sides.

In the first embodiment, the integrated member 107 penetrates between the first filament member 102 in the second layer from the bottom and the first filament member 102 in the third layer from the bottom. However, if the leg portion 106 is stably fixed to the lower surface of the device tray, the integrated member 107 is formed of the first filament member 102 on the third layer from the bottom and the first filament member 102 on the fourth layer from the bottom. It may permeate between the member 102 and the permeation of the integrated member 107 between the first filament member 102 in the lowest layer and the first filament member 102 in the second layer from the bottom. You can stay. When the integrated member 107 deeply penetrates the first filament member 102 and the first filament member 102 , the leg portion 106 can be more firmly integrated with the device tray 101 . Conversely, if the penetration of the integrated member 107 into the first filamentary member 102 and the first filamentary member 102 is shallow, the internal space of the opening 104 becomes large, and a larger device 105 can be accommodated. becomes.

The legs 106 can also serve as spacers between the device trays 101 when stacking a plurality of device trays 101 . This avoids unnecessary contact of the first filament member 102 and the second filament member 103 between the device trays 101, and prevents wear and damage of the first filament member 102 and the second filament member 103. can be prevented.

The device tray 101 may include a secondary leg 106A in addition to the leg 106. FIG. 2B shows a mode in which a secondary leg portion 106A is provided on the lower surface of the leg portion 106 as a modification of the first embodiment. The size of the secondary leg portion 106A in the horizontal direction (XY direction) in FIG. 2B may be equal to or smaller than the size of the leg portion 106 in the horizontal direction (XY direction). The leg portion 106 and the sub-leg portion 106A are stacked in the vertical direction (Z direction) and function like a spring against impact in the vertical direction (Z direction). The device tray 101 is provided with such sub-legs 106A, so that it is possible to improve the impact resistance in the vertical direction during transportation and placement.

FIG. 2C shows, as a modification of the first embodiment, a secondary leg portion 106A provided on the outer side of the leg portion 106 of the device tray 101 in the horizontal direction (XY directions). Although the secondary leg 106A in FIG. 2C is provided on the outside of the leg 106 in the X direction, it may alternatively or additionally be provided on the outside of the leg 106 in the Y direction. Also, the size of the secondary leg portion 106A in the vertical direction (Z direction) may be equal to or smaller than the size of the leg portion 106 in the vertical direction (Z direction). Since the device tray 101 is provided with such a sub-leg portion 106A, when the device tray 101 collides with an external object such as another device tray in the horizontal direction during transportation or placement, the device tray 101 can be streak-shaped. Wear or damage due to direct contact of members can be reduced.

FIG. 2D shows, as a modification of the first embodiment, a secondary leg portion 106A provided at a position different from that of the leg portion 106 on the lower surface of the device tray 101. FIG. In FIG. 2D, the secondary leg 106A is integrally fixed to the device tray 101 via a secondary integrated member 107A. The lower surface of the secondary leg portion 106A is aligned with the lower surface of the leg portion 106 in the vertical direction (Z direction), and when the device tray 101 is placed, it supports the device tray 101 in the same manner as the leg portion 106. can be done. The depth of penetration of the sub-integrated member 107A into the device tray 101 may be the same as the depth of penetration of the integrated member 107, or may be different. The position where the sub-leg portion 106A and the sub-integrated member 107A are provided is not particularly limited as long as it is within the lower surface of the device tray 101, and may be a position along the outer circumference of the lower surface of the device tray 101 or the lower surface of the device tray 101. A position such as the center away from the outer periphery of the . Also, the number of the sub-leg portion 106A and the sub-integrated member 107A may be one set or a plurality of sets. The device tray 101 can further improve the spalling resistance of the device tray 101 by including the sub-leg portion 106A and the sub-integrated member 107A.

The configurations of the sub-leg portion 106A and the sub-integrated member 107A shown in FIGS. 2B to 2D both improve the impact resistance during transportation and placement of the device tray 101, and reduce wear and tear of the linear members. It has the effect of reducing chipping. The configurations of FIGS. 2B to 2D may be applied singly or in combination. Also, the material of the sub-leg portion 106A and the sub-integrated member 107A may be the same as or different from the material of the leg portion 106 and the integrated member 107.

3A and 3B are external views of the device tray 101 of the present invention viewed from above and below. FIG. 3A shows the upper surface side of the device tray 101, in which a plurality of first wire members 102 extending parallel to the X direction and a plurality of second wire members 103 extending parallel to the Y direction are arranged. 3A and 3B show a state in which they are crossed and laminated in the Z direction and an enlarged view thereof. FIG. 3B shows how the legs 106 are fixed to the lower surface side of the device tray 101 and an enlarged side view of the legs 106 .

FIG. 4 is a schematic diagram of the device tray 201 viewed from the side in the Y direction as the second embodiment. As in the first embodiment, a plurality of first wire members 202 extending parallel to the X direction and a plurality of second wire members 203 extending parallel to the Y direction are arranged in the Z direction. A device tray 201 having an opening 204 is formed by stacking them alternately.

The device tray 201 of the second embodiment has an upper embankment 206 above the first filament member 202 of the uppermost layer. The upper embankment 206 is provided along one side of the upper surface of the device tray 201 and is integrated with the uppermost first filament member 202 via an integration member 207 . A constant distance is maintained between the upper surface of the first filament member 202 of the uppermost layer and the lower surface of the upper embankment 206 , and the first filament member 202 of the uppermost layer is buried in the upper embankment 206 . do not have. It permeates between the first filament member 202 on the second layer from the top and the first filament member 202 on the third layer from the top. 202 and the second wire member 203 are integrally fixed.

The device tray 201 of the second embodiment has an upper bank 206, so that when a component is placed on the upper portion of the device tray 201, the article can be prevented from unintentionally falling. Also, similar to the legs 106 of the first embodiment, when stacking a plurality of device trays 201, it can also serve as a spacer between the device trays 201, thereby providing a first line between the device trays 201. It is possible to avoid unnecessary contact between the striated members 202 and the second striated members 203 and prevent wear and damage to the first striated members 202 and the second striated members 203 .

The upper embankment 206 in this embodiment is provided along one side on the upper surface of the device tray 201, but the number and installation locations of the upper embankment 206 are not limited to this. That is, it may be along two sides of the upper surface of the device tray 201 , or may be in the shape of a frame along the four sides of the upper surface of the device tray 201 . In addition, it is not necessarily along the entire length of each side, and may be provided only in the center of each side, or a plurality of discontinuous small upper embankments may be provided on each side.

Although the above description has been made with respect to particular embodiments, it will be apparent to those skilled in the art that the present invention is not limited thereto and that various changes and modifications can be made within the principles of the invention and the scope of the appended claims. be.

101 device tray 102 first wire member 103 second wire member 104 opening 105 device 106 leg 106A sub-leg 107 integrated member 107A sub-integrated member 201 device tray 202 first wire member 203 second 2 wire member 204 opening 205 device 206 upper embankment 207 integrated member

Claims

a plurality of intersecting filament members;
a plurality of openings formed by the plurality of stacked filament members;
a device tray comprising:
The protruding portion is integrated with the filament member of the outermost layer via an integrated member,
The filament member of the outermost layer is not embedded in the protrusion,
The device tray, wherein the integrated member penetrates into the opening.
The device tray according to claim 1, wherein the integrated member is made of ceramics.
The device tray according to claim 1 or 2, wherein the integrated member penetrates into the opening located inside the filament member of the outermost layer.
The device tray according to any one of claims 1 to 3, wherein the protruding portion is provided along the outer circumference of the filament member of the outermost layer.
The device tray according to any one of claims 1 to 4, further comprising a second protrusion provided on the lower surface of said protrusion.
The device tray according to any one of claims 1 to 4, further comprising a second protrusion provided on the side surface of said protrusion.
Further comprising a second projecting portion different from the projecting portion and a second integrated member different from the integrated member,
The second projecting portion is integrated with the filament member of the outermost layer via the second integrated member,
The filament member of the outermost layer is not embedded in the second protrusion,
The second integrated member penetrates into the opening,
A device tray according to any preceding claim, wherein the height of the second protrusion is equal to the height of the protrusion.
8. The protruding portion is provided at least one corner end portion of the lower surface of the filament member in the lowest layer, and is a leg portion present in a total of three or more locations. Device tray as described in section.
The device tray according to any one of claims 1 to 7, wherein the projecting portion is a bank portion integrated with the upper surface of the uppermost filament member.
9. The device tray according to claim 8, wherein said bank portion is provided on at least one side of said upper surface.