WO2023065311A1 - Composition adhésive thermofusible et son utilisation - Google Patents

Composition adhésive thermofusible et son utilisation Download PDF

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Publication number
WO2023065311A1
WO2023065311A1 PCT/CN2021/125743 CN2021125743W WO2023065311A1 WO 2023065311 A1 WO2023065311 A1 WO 2023065311A1 CN 2021125743 W CN2021125743 W CN 2021125743W WO 2023065311 A1 WO2023065311 A1 WO 2023065311A1
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WO
WIPO (PCT)
Prior art keywords
styrene
weight
hot melt
adhesive composition
melt adhesive
Prior art date
Application number
PCT/CN2021/125743
Other languages
English (en)
Inventor
Minrui CHEN
Fan Yang
Original Assignee
Henkel Ag & Co. Kgaa
Henkel (China) Investment Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa, Henkel (China) Investment Co., Ltd. filed Critical Henkel Ag & Co. Kgaa
Priority to PCT/CN2021/125743 priority Critical patent/WO2023065311A1/fr
Publication of WO2023065311A1 publication Critical patent/WO2023065311A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes

Definitions

  • the present invention relates to a hot melt adhesive and use thereof.
  • Hot melt adhesives especially those comprising a thermoplastic copolymer which contains styrene blocks, have been widely used for bonding low surface energy (e.g., no more than 34 dyne) surfaces.
  • Low surface energy surfaces are usually smooth and therefore difficult to be bonded.
  • films with low surface energy surfaces include a polyethylene terephthalate (PET) film with a surface energy of about 34 dynes or below, and an oriented polypropylene (OPP) film with a surface energy of about 32 dynes or below.
  • PET polyethylene terephthalate
  • OPP oriented polypropylene
  • thermoplastic copolymers containing styrene blocks include styrene-butadiene-styrene (SBS) block copolymers, styrene-isoprene-styrene (SIS) block copolymers, and their hydrogenated products styrene-ethylene-butylene-styrene (SEBS) block copolymers and styrene-ethylene-propylene-styrene (SEPS) block copolymers.
  • SBS styrene-butadiene-styrene
  • SEBS hydrogenated products
  • SEBS styrene-ethylene-butylene-styrene
  • SEPS styrene-ethylene-propylene-styrene
  • the present invention provides a hot melt adhesive composition, comprising:
  • thermoplastic block copolymer (a) from 30 to 45%by weight of at least one thermoplastic block copolymer
  • the present invention also provides a use of the hot melt adhesive composition according to the present invention for bonding two substrates, wherein the two substrates are identical with or different from each other, and are independently selected from the group consisting of a polyethylene terephthalate (PET) film, a polypropylene (PP) film such as an oriented polypropylene (OPP) film, a polyethylene (PE) film, a woven fabric, a nonwoven fabric, a rubber, a resin, tissue, and combination thereof.
  • PET polyethylene terephthalate
  • PP polypropylene
  • OPP oriented polypropylene
  • PE polyethylene
  • the hot melt adhesive composition according to the present invention exhibits excellent resistance to high temperatures and good adhesion to substrates with low surface energy.
  • hot melt adhesive composition adhesive composition
  • composition adhesive composition
  • the present invention provides a hot melt adhesive composition, comprising:
  • thermoplastic block copolymer (a) from 30 to 45%by weight of at least one thermoplastic block copolymer
  • the hot melt adhesive composition according to the present invention exhibits excellent resistance to high temperatures and good adhesion to substrates with low surface energy.
  • the hot melt adhesive composition comprises (a) from 30 to 45%by weight, preferably from more than 30 to no more than 45%by weight, more preferably from 30.5 to 45%by weight, still more preferably from 31 to 44%by weight, even more preferably from 32 to 42%by weight, even still more preferably from 33 to 40%by weight, and most preferably from 33 to 38 by weight of at least one thermoplastic block copolymer.
  • Component (a) physically crosslinks into a three-dimensional thermoplastic network upon curing, and imparts excellent adhesion, especially excellent adhesion to substrates with low surface energy, and imparts heat resistance and low temperature flexibility to the adhesive composition.
  • the hot melt adhesive composition exhibits excellent adhesion, especially excellent adhesion to substrates with low surface energy, and imparts heat resistance and low temperature flexibility to the adhesive composition upon curing.
  • component (a) at least one thermoplastic block copolymer comprises styrene blocks.
  • component (a) is selected from thermoplastic styrene-butadiene-styrene block copolymers, thermoplastic styrene-isoprene-styrene block copolymers, and their combination.
  • component (a) is a thermoplastic styrene-butadiene-styrene block copolymer; or a combination of a thermoplastic styrene-butadiene-styrene block copolymer and a thermoplastic styrene-isoprene-styrene block copolymer.
  • component (a) at least one thermoplastic block copolymer is selected from:
  • thermoplastic styrene-butadiene-styrene block copolymer (a1) from 30 to 45%by weight of at least one thermoplastic styrene-butadiene-styrene block copolymer
  • thermoplastic styrene-butadiene-styrene block copolymer (a2) a combination of from 25 to 45%by weight of at least one thermoplastic styrene-butadiene-styrene block copolymer, and from more than 0%to no more than 20%by weight of at least one thermoplastic styrene-isoprene-styrene block copolymer,
  • thermoplastic styrene-butadiene-styrene block copolymer has a solution viscosity of no more than 200 cps, and has a styrene content of no less than 40%by weight and a di-block ratio of more than 50%by weight, based on the total weight of the thermoplastic styrene-butadiene-styrene block copolymer, and
  • thermoplastic styrene-isoprene-styrene block copolymer has a solution viscosity of from 100 to 300 cps, and has a styrene content of no less than 40%by weight, based on the total weight of the thermoplastic styrene-isoprene-styrene block copolymer.
  • solution viscosity is a Brookfield viscosity measured at room temperature (i.e., about 25 °C) with 25%by weight of thermoplastic block copolymer dissolved in 75%by weight of toluene, based on the total weight of the thermoplastic block copolymer and toluene.
  • Component (a1) Thermoplastic SBS block copolymer
  • component (a) at least one thermoplastic block copolymer is component (a1) from 30 to 45%by weight, preferably from more than 30 to no more than 45%by weight, more preferably from 30.5 to 45%by weight, still more preferably from 31 to 44%by weight, even more preferably from 32 to 42%by weight, even still more preferably from 33 to 40%by weight, and most preferably from 33 to 38 by weight of at least one thermoplastic styrene-butadiene-styrene block copolymer (SBS) , based on the total weight of the hot melt adhesive composition, wherein the thermoplastic styrene-butadiene-styrene block copolymer has a solution viscosity of no more than 200 cps (such as from 100 to 200 cps, preferably from 120 to 180 cps, such as 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, and 200 cps) , and has a
  • Component (a1) thermoplastic styrene-butadiene-styrene block copolymer (SBS) , physically crosslinks into a three-dimensional thermoplastic network upon curing, and imparts excellent adhesion, especially excellent adhesion to substrates with low surface energy, and imparts heat resistance and low temperature flexibility to the adhesive composition.
  • SBS thermoplastic styrene-butadiene-styrene block copolymer
  • the hot melt adhesive composition exhibits excellent adhesion, especially excellent adhesion to substrates with low surface energy, and exhibits heat resistance and low temperature flexibility to the adhesive composition upon curing.
  • Examples of commercially available styrene-butadiene-styrene block copolymers (a1) include, but are not limited to, Asaprene T439 from Asahi, and Globalprene 3545 from LCY.
  • Component (a2) Combination of thermoplastic styrene-butadiene-styrene (SBS) block copolymer and thermoplastic styrene-isoprene-styrene (SIS) block copolymer
  • component (a) at least one thermoplastic block copolymer is component (a2) from 25 to 45%by weight, preferably from 26 to 44%by weight, more preferably from 28 to 42%by weight, still more preferably from 30 to 40%of at least one thermoplastic styrene-butadiene-styrene block copolymer, and from more than 0%to no more than 20%by weight, preferably from 1 to 18%, more preferably from 3 to 15%, still more preferably from 5 to 13%by weight of at least one thermoplastic styrene-isoprene-styrene block copolymer, based on the total weight of the hot melt adhesive composition; wherein the thermoplastic styrene-butadiene-styrene block copolymer has a solution viscosity of no more than 200 cps (such as from 100 to 200 cps, preferably from 120 to 180 cps, such as 100, 110, 120, 130, 140, 150, 160
  • Component (a2) combination of thermoplastic SBS and SIS, physically crosslinks into a three-dimensional thermoplastic network upon curing, and imparts excellent adhesion, especially excellent adhesion to substrates with low surface energy, and imparts heat resistance and low temperature flexibility to the adhesive composition.
  • the hot melt adhesive composition exhibits excellent adhesion, especially excellent adhesion to substrates with low surface energy, and imparts heat resistance and low temperature flexibility to the adhesive composition upon curing.
  • SBS block copolymers examples include, but are not limited to, Asaprene T439 from Asahi, and Globalprene 3545 from LCY.
  • SIS block copolymers examples include, but are not limited to, D 1162 from Kraton, and Globalprene 5562 from LCY
  • the hot melt adhesive composition comprises from 0.1 to 5%, preferably from 1 to 4.5%, more preferably from 2 to 4%by weight of component (b) at least one wax having a melting point of no less than 100 °C, more preferably from 100 to 200 °C, and even more preferably from 105 to 155 °C.
  • Component (b) at least one wax having a melting point of no less than 100°C, provides good adhesion at high temperature, and reduces melt viscosity of the hot melt adhesive composition.
  • the hot melt adhesive composition exhibits excellent adhesion at high temperatures, and has a relatively low melt viscosity which makes it easy to apply.
  • the wax may be selected from paraffin waxes, microcrystalline waxes, polyethylene waxes, polypropylene waxes, Fischer-Tropsch waxes, oxidized Fischer-Tropsch waxes, fatty amide waxes, and functionalized derivatives thereof.
  • waxes examples include, but are not limited to, Sasaolwax H1 from Sasol Wax; AC-400 from Honeywell; MC-400 from Marcus Oil Company; Epolene C-18 from Eastman Chemical; LC 503 NC from Lion Chemtech; Licocene PE 4201 from Clariant; and AC-575P from Honeywell.
  • the hot melt adhesive composition comprises from 5 to 20%, preferably from 6 to 18%, more preferably from 8 to 16%by weight of component (c) at least one plasticizer.
  • Component (c) the plasticizer decreases melt viscosity, imparts flexibility, and improve wettability of the hot melt adhesive composition.
  • the hot melt adhesive composition has relatively low melt viscosity, good flexibility, and good wettability.
  • the plasticizer is selected from the groups consisting of paraffin oils, naphthene oils, liquid polyisobutylene, liquid hydrogenated hydrocarbons, and any combination thereof.
  • plasticizers examples include, but are not limited to, KN 4006, KN 4008, and KN 4010 from PetroChina Lubricant Company; LP 150 and LP 350 from Kukdong Oil &Chemicals; Nyflex 222B from Nynas; and PB 950 and PB 1300 from Daelim, Wingtack 10 from Cray Valley.
  • the hot melt adhesive composition comprises from 20%to 55%, preferably from 30 to 50%, more preferably from 35 to 45%by weight of component (d) at least one aliphatic tackifier.
  • Component (d) provides good adhesion to the hot melt adhesive composition.
  • the hot melt adhesive composition has good adhesion upon curing.
  • the aliphatic tackifier is selected from the groups consisting of dicyclopentadiene (DCPD) and its derivatives; copolymers of DCPD and C8-C10 olefins containing benzene rings (such as styrene, ⁇ -methyl styrene, and derivatives thereof) , wherein the content of C8-C10 olefins containing benzene rings is no more than 20%, preferably no more than 15%, and more preferably no more than 10%by weight of the copolymers; copolymers of C5-C9 olefins (such as terpene, pinene, and derivatives thereof) ; and combination thereof.
  • DCPD dicyclopentadiene
  • copolymers of DCPD and C8-C10 olefins containing benzene rings such as styrene, ⁇ -methyl styrene, and derivatives thereof
  • Examples of commercially available aliphatic tackifier include, but are not limited to, HD 1100 (DCPD) and HD1120 (DCPD) available from Luhua, and SU 400 (DCPD-C9 olefin copolymer) available from Kolon.
  • the hot melt adhesive composition comprises from 2%to 15%, preferably from 5 to 13%, more preferably from 8 to 11%by weight of at least one aromatic tackifier.
  • Component (e) not only provides good adhesion to the hot melt adhesive composition, but also enhances adhesion of the composition at high temperature.
  • the hot melt adhesive composition has excellent adhesion, especially excellent adhesion at high temperature.
  • the aromatic tackifier is selected from the groups consisting of styrene and derivatives thereof, such as ⁇ -methylstyrene, ethylstyrene; indene and derivatives thereof, and combination thereof.
  • aromatic tackifier examples include, but are not limited to, Kristalex 5140 available from Eastman.
  • the hot melt adhesive composition may optionally comprise (f) from 0.1 to 2%, preferably from 0.5 to 1.5%, such as about 1%by weight of at least one antioxidant.
  • Component (f) protects the hot melt adhesive composition from degradation during preparing and processing the composition.
  • the hot melt adhesive composition has good resistance to degradation during its preparation and processing.
  • the antioxidant is selected from the groups consisting of hindered phenols, phosphites, thiodipropionates, and any combination thereof.
  • Examples of commercially available aromatic antioxidant include, but are not limited to, Evernox 10GF and Evernox 1726 from Everspring Chemical; Irganox 1010 and Irganox 1726 from BASF; Thanox 1010G and Thanox 1726 from Rianlon; Everfos 168 from Everspring Chemical; Iragafos 168 from BASF; Thanox 168 from Rianlon; Thanox 412S and Thanox DSTP from Rianlon; ADK AO 412S from Adeka; and Sumilizer TP-D from Sumitomo Chemical.
  • the hot melt adhesive composition further comprises one or more additives different from component (a) to component (f) , wherein the additives are preferably selected from the group consisting of adhesion promoters, curing accelerators, coupling agents, solvents, pigments, plasticizers, rheological additives, fillers, and any combination thereof.
  • the additives are preferably selected from the group consisting of adhesion promoters, curing accelerators, coupling agents, solvents, pigments, plasticizers, rheological additives, fillers, and any combination thereof.
  • the hot melt adhesive composition may optionally comprise at least one pigment.
  • the pigment includes, but is not limited to, titanium oxide, carbon black, and any combination thereof.
  • the hot melt adhesive composition may optionally include at least one rheology modifier.
  • the rheology modifier includes, but is not limited to, fumed silica, polyacrylates, and any combination thereof.
  • the hot melt adhesive composition may optionally include at least one filler.
  • the filler includes, but is not limited to, mica, calcium carbonate, kaolin, talc, silicon dioxide, and any combination thereof.
  • the present invention provides a hot melt adhesive composition, comprising:
  • thermoplastic block copolymer (a) from 30 to 45%by weight of at least one thermoplastic block copolymer
  • the hot melt adhesive composition may have a melt viscosity of from 4,000 to 20,000 cps at 160 °C, preferably from 4,300 to 18,000 cps 160 °C, more preferably from 4,500 to 15,000 cps at 160 °C, wherein the melt viscosity is a Brookfield viscosity measured with a Brookfield hotmelt viscosity tester and 27#spindle.
  • the hot melt adhesive composition of the present invention has a peel strength of greater than 1 N per inch, which is acceptable from practical point of view, but preferably greater than 5 N per inch at 70°C when being applied at 100 gsm for adhering PET film to PET film or PET film to OPP film, wherein each of the PET film and the OPP film has a surface energy of no greater than 34 dyne.
  • the hot melt adhesive composition of the present invention has a peel strength of greater than 30 N per inch at 23°C when being applied at 100 gsm (g/square meter) for adhering PET film to PET film or PET film to OPP film, wherein each of the PET film and the OPP film has a surface energy of no greater than 34 dyne.
  • the hot melt adhesive composition of the present invention has a peel strength of greater than 30 N per inch at 10°C when being applied at 100 gsm for adhering PET film to PET film or PET film to OPP film, wherein each of the PET film and the OPP film has a surface energy of no more than 34 dyne.
  • the hot melt adhesive composition of the present invention has a softening point of from 100 to 150 °C, preferably from 100 to 130 °C, wherein the softening point is measured with a Ring &Ball softening point tester.
  • the hot melt adhesive composition according to the present invention may be prepared by mixing all components at a temperature of from 130 to 160°C, so that all components can be fully melt and well mixed.
  • the hot melt adhesive composition according to the present invention may be used in bonding two substrates, wherein the two substrates are identical with or different from each other, and are independently selected from the group consisting of a polyethylene terephthalate (PET) film, a polypropylene (PP) film such as an oriented polypropylene (OPP) film, a polyethylene (PE) film, a woven fabric, a nonwoven fabric, a rubber, a resin, paper tissue, and combination thereof.
  • PET polyethylene terephthalate
  • PP polypropylene
  • OPP oriented polypropylene
  • PE polyethylene
  • One or both of the two substrates have low surface energy, for example, surface energy of no more than 34 dyne.
  • surface energy for example, surface energy of no more than 34 dyne.
  • any commonly used method is suitable, for example, by using a surface energy pen or contact angle machine.
  • the hot melt adhesive composition is used in food packages such as plastic food packages, air filters, or electronic devices such as protection films for electronic devices.
  • the hot melt adhesive composition may be heated to a temperature of from 150 to 200 °C, and applied onto at least a part of a surface of one adherend or both adherends, the two adherends are bonded to each other, and the two bonded adherends are then exposed to room temperature (i.e., about 25 °C) for curing.
  • the weight of each component is expressed in a unit of weight part.
  • Asaprene T439 SBS, solution viscosity of 170 cps, styrene content of 44%by weight and di-block ratio of 60%by weight, available from Asahi.
  • Globalprene 3522 SBS, solution viscosity of 1100 cps, styrene content of 23%by weight and di-block ratio of 78%by weight, available from Asahi.
  • Kraton D 1162 SIS, solution viscosity of 120 cps, styrene content of 45%by weight and di-block ratio of 0%by weight, available from Kraton.
  • SX 105 melting point of 111 °C, available from Shell.
  • Evernox 10 GF available from Everspring Chemical.
  • Evernox 168 GF available from Everspring Chemical.
  • compositions were prepared by the following steps:
  • the viscosity of the hot melt adhesive composition obtained above was measured at 140 °C, 160 °C and 180 °C, respectively, with a Brookfield hotmelt viscosity tester and 27#spindle.
  • the softening point of the hot melt adhesive composition obtained above was measured with a Ring &Ball softening point tester.
  • the hot melt adhesive sample was immersed in glycerine and raised temperature from room temperature at a rate of 5 °C/min. The end time when the hot melt adhesive softened to cause steel ball to drop was recorded as the softening point of the hot melt adhesive sample.
  • Two PET films were adhered together to form a laminate sample by applying the hot melt adhesive composition obtained above therebetween at 100 gsm via a hot presser with a pressure of 0.1 MPa and pressing time of 2 seconds.
  • the T-peel test was made to the laminate sample at least 24 hours after the hot melt adhesive was applied.
  • the T-peel test was carried out at 50%relative humidity and 10 °C, 23 °C, or 70 °C.
  • the PET laminate samples were peeled from one another at an angle of 180° and with a rate of 50 mm/min, 50 mm/min, or 300 mm/min, respectively, using an Instron tensile strength tester.
  • the force used to pull the PET laminate samples 10cm apart was recorded as the T-peel strength of the hot melt adhesive for adhering PET film to PET film.
  • the hot melt adhesive compositions according to the present invention exhibited acceptable T-peel strength (1.2 N/inch or more) at 70°C, and thus achieved good resistance to high temperatures, and showed good adhesion to substrates (e.g., PET films) with low surface energy.
  • component (a1) SBS had a styrene content of no less than 40%by weight
  • the hot melt adhesive compositions according to the present invention exhibited high T-peel strength (5.6 N/inch or more) at 70°C, and thus achieved excellent resistance to high temperatures, and showed good adhesion to substrates (e.g., PET films) with low surface energy.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une composition adhésive thermofusible, comprenant : (a) de 30 à 45 % en poids d'au moins un copolymère séquencé thermoplastique ; (b) de 0,1 à 5 % en poids d'au moins une cire ayant un point de fusion inférieur ou égal à 100 °C ; (c) de 5 % à 20 % en poids d'au moins un plastifiant ; (d) de 20 % à 55 % en poids d'au moins un agent collant aliphatique ; et (e) de 2 à 15 % en poids d'au moins un agent poisseux aromatique, sur la base du poids total de la composition adhésive thermofusible. L'invention concerne également une utilisation de la composition adhésive thermofusible.
PCT/CN2021/125743 2021-10-22 2021-10-22 Composition adhésive thermofusible et son utilisation WO2023065311A1 (fr)

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PCT/CN2021/125743 WO2023065311A1 (fr) 2021-10-22 2021-10-22 Composition adhésive thermofusible et son utilisation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/125743 WO2023065311A1 (fr) 2021-10-22 2021-10-22 Composition adhésive thermofusible et son utilisation

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034159A (en) * 1995-01-06 2000-03-07 H.B. Fuller Licensing & Financing, Inc. Fast setting multipurpose bookbinding adhesive with excellent flexibility
CN102277112A (zh) * 2011-05-23 2011-12-14 波士胶芬得利（中国）粘合剂有限公司 含蜡热熔胶和一次性吸收制品
CN101331203B (zh) * 2005-10-14 2012-04-25 伯斯蒂克公司 低施涂温度的热熔粘合剂
CN1970670B (zh) * 2005-11-21 2012-08-08 汉高股份有限及两合公司 含嵌段共聚物的胶粘剂
US20160068721A1 (en) * 2014-09-09 2016-03-10 H.B. Fuller Company Elastic hot melt adhesive composition and an elastic composite made with the same
CN107109173A (zh) * 2014-12-17 2017-08-29 H.B.富乐公司 用于粘结成包塑料容器的热熔粘合剂组合物
CN113330088A (zh) * 2018-11-15 2021-08-31 博斯蒂克股份公司 用于制造一次性卫生产品的改进的热熔粘合剂

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034159A (en) * 1995-01-06 2000-03-07 H.B. Fuller Licensing & Financing, Inc. Fast setting multipurpose bookbinding adhesive with excellent flexibility
CN101331203B (zh) * 2005-10-14 2012-04-25 伯斯蒂克公司 低施涂温度的热熔粘合剂
CN1970670B (zh) * 2005-11-21 2012-08-08 汉高股份有限及两合公司 含嵌段共聚物的胶粘剂
CN102277112A (zh) * 2011-05-23 2011-12-14 波士胶芬得利（中国）粘合剂有限公司 含蜡热熔胶和一次性吸收制品
US20160068721A1 (en) * 2014-09-09 2016-03-10 H.B. Fuller Company Elastic hot melt adhesive composition and an elastic composite made with the same
CN107109173A (zh) * 2014-12-17 2017-08-29 H.B.富乐公司 用于粘结成包塑料容器的热熔粘合剂组合物
CN113330088A (zh) * 2018-11-15 2021-08-31 博斯蒂克股份公司 用于制造一次性卫生产品的改进的热熔粘合剂

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