WO2023062749A1 - Composition de résine contenant un agent antistatique polymère et corps moulé - Google Patents

Composition de résine contenant un agent antistatique polymère et corps moulé Download PDF

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WO2023062749A1
WO2023062749A1 PCT/JP2021/037907 JP2021037907W WO2023062749A1 WO 2023062749 A1 WO2023062749 A1 WO 2023062749A1 JP 2021037907 W JP2021037907 W JP 2021037907W WO 2023062749 A1 WO2023062749 A1 WO 2023062749A1
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resin
resin composition
composition according
antistatic agent
mass
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PCT/JP2021/037907
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English (en)
Japanese (ja)
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正徳 大久保
一正 山崎
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株式会社秋本製作所
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Priority to JP2022523075A priority Critical patent/JP7169037B1/ja
Priority to PCT/JP2021/037907 priority patent/WO2023062749A1/fr
Publication of WO2023062749A1 publication Critical patent/WO2023062749A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Definitions

  • the present invention relates to resin compositions and molded articles.
  • the molded body is used, for example, to store electrical products (e.g., semiconductor elements (transistors, ICs, etc.), other electronic components, etc.), transport the electrical products, or set the electrical products to a mounting device (or inspection device). It is a container (also called a tray) used when
  • FIG. 1 is a perspective view of a state in which a plurality of trays are stacked.
  • FIG. 2 is a sectional view taken along line II of FIG. 1 and 2, 1 is a tray, 2 is a product (component) storage chamber, 3 is a convex edge, 4 is a concave edge, and 6 is an electronic component (see Patent Document 1).
  • JP2005-88995A Patent Document 2 discloses an example of the tray.
  • FIG. 3 is a plan view of the tray. A plurality of these trays may also be stacked when used.
  • 1 is a tray
  • 2 is a product storage chamber
  • 3 is a convex edge portion
  • 4 is a convex portion (see Patent Document 2).
  • Patent Document 3 JP1995-228765A (Patent Document 4), JP2002-212414A (Patent Document 5), JP2010-229348A (Patent Document 6), and JP2012-31395A (Patent Document 7) charge the case. It is proposed to mold with a resin composition containing an inhibitor. Patent Documents 3, 4, 5, 6, and 7 propose using a polyphenylene ether (PPE) resin as the case constituent material.
  • PPE polyphenylene ether
  • Antistatic agents include conductive fillers (carbon black (CP), carbon fiber (CF), carbon nanotubes (CNT), metal powder (MP), metal fiber (MF), etc.), surfactants (Surface Active Agent: SAA), Polymer Antistatic Agent (PAA), etc. are known. It is said that the problem of static electricity generation (electrification) is improved when the case is molded from a resin composition containing an antistatic agent.
  • JP1989-156A Patent Document 8
  • JP1989-65167A Patent Document 9 propose polyphenylene ether (PPE) resin compositions.
  • CP, CF, CNT, MP, MF, SAA, PAA, etc. are known as antistatic agents.
  • the conductive fillers could be blended into many types of resins.
  • Excellent heat resistance heat distortion temperature
  • PPE polyphenylene ether
  • PES polyethersulfone
  • PSU polysulfone
  • PAS polyarylene sulfide
  • the resin composition containing the conductive filler had poor fluidity during molding.
  • the moldability decreased. Poor appearance of the molded product. Problems such as surface peeling and rough skin occurred in the molded product.
  • the resin composition containing the conductive filler is dark (for example, black). Far from bright colors. You don't get different colored trays. For this reason, it is not possible to store electrical appliances in trays of different colors according to the type (model number, etc.) of the electrical appliance.
  • the heat resistance was generally inferior to that when the conductive filler was used. Only products with a low heat distortion temperature (HDT) were obtained. A resin composition having a high HDT as in the case of containing the conductive filler was not obtained.
  • HDT heat distortion temperature
  • the problem to be solved by the present invention is to provide a resin composition suitable for the container (tray).
  • the purpose of the present invention is to provide a resin composition that can be kneaded and molded as a resin compound at, for example, 290° C. or lower.
  • HDT is, for example, to provide a resin composition having a temperature of 135° C. or higher.
  • An object of the present invention is to provide a resin composition having a water absorption of, for example, 0.8% or less. It is to provide a resin composition having a specific gravity of, for example, 1.0 to 1.1.
  • An object of the present invention is to provide a resin composition having a surface electrical resistance value of, for example, 1.0 ⁇ 10 12 ⁇ or less.
  • An object of the present invention is to provide a resin composition having high cleanliness.
  • An object of the present invention is to provide a resin composition having a color (for example, white or bright color) that does not give a molded article dark color (brown or black).
  • the resin composition in which the following requirements (1) to (7) are taken into consideration is the electrical product (electronic component (e.g., semiconductor element (transistor or IC, etc.), other electronic component), etc. ) has been found to be suitable for a container (tray) containing (1) Color of Tray When CP, CF, CNT, MP, and MF are used, the color of the tray becomes black or dark gray, which is unattractive. It was desired that the antistatic agent not be black. A "clean tray" that could be colored (distinguished by color) was desired.
  • the electrical products When storing the electrical products, if the electrical products can be sorted into “clean trays” that are colored in a desired color (distinguishable by color) for each type of the electrical product, sorting will be easy. be. Identification of the electrical product is easy in the manufacturing process and production management of the electrical product. Easy to handle. When the CP, CF, CNT, MP and MF were used, the fluidity of the resin composition was poor. Moldability decreased. On the other hand, the resin composition containing the polymeric antistatic agent is inferior to the resin composition containing the CP in antistatic properties, but the problems such as staining are improved. It was possible to obtain a "clean tray” colored to the desired color (identifiable by color).
  • the stain is determined by ⁇ Pencil hardness (blackness)> described in [Evaluation items and evaluation methods] below.
  • (3) Heat distortion temperature (HDT (Heat Distortion Temperature: heat resistance)) JP1995-228765A (Patent Document 4) has a specific structure with PPE (polyphenylene ether resin), or PPE, HIPS (styrene resin) and MRF (styrene resin modified with glycidyl (meth)acrylate). It discloses that the HDT of the resin composition with an antistatic agent is 93 to 100°C. When the content of the polymeric antistatic agent (PAA) in the resin composition increased, the surface electrical resistance was kept low, but the HDT decreased.
  • PAA polymeric antistatic agent
  • the HDT of the resin composition containing PAA was about 120° C. at the highest.
  • the HDT (according to ISO75) of the resin composition of the tray for housing the electric product preferably was 135° C. or higher. More preferably, it was 140° C. or higher. More preferably, it was 150° C. or higher.
  • the HDT of the resin is as follows.
  • the PAA will decompose.
  • the antistatic effect is lowered.
  • Thermal decomposition of the PAA produces gas.
  • the generated gas deteriorates the appearance of the molded product.
  • the kneading temperature and molding temperature of the resin compound were preferably 290° C. or lower.
  • Antistatic agents such as CP, CF, and CNT have thermal decomposition temperatures of 500° C. or higher. Therefore, the use of CP, CF, CNT, etc. does not cause problems in high-temperature kneading and injection molding processes.
  • the resin has a low HDT.
  • the present inventors have found that when using a polymer type antistatic agent (PAA) that is less likely to cause problems when using CP or the like, the HDT is 135 ° C. or higher and the kneading temperature or molding temperature is 290 ° C. or lower. I repeated examination for developing the resin composition of.
  • PAA polymer type antistatic agent
  • B resin butylene terephthalate resin, ethylene terephthalate resin, acrylic resin, amide resin , carbonate-based resins, propylene-based resins, and one or more resins selected from the group of arylate-based resins
  • the problem of thermal decomposition of PAA is unlikely to occur, and It was found that kneading and molding of the resin compound are possible even at the thermal decomposition starting temperature (285°C).
  • the surface electrical resistance of the resin composition containing conductive fillers is low. Depending on the blending amount, the resin composition may have a surface electrical resistance value of about 10 4 ⁇ . Less problem with static electricity. From this point of view, the use of CP, CF, CNT, MP and MF is advantageous.
  • the surface electrical resistance of a resin composition containing a polymeric antistatic agent (PAA) is higher than that of a resin composition containing CP or the like. Depending on the content of PAA, the surface electrical resistance of the PAA-containing resin composition may be about 10 12 ⁇ . According to the inventor's study, even if the surface electric resistance value is about 10 12 ⁇ , the problem is small.
  • a resin (PPE) and B resin butylene terephthalate resin, ethylene terephthalate resin, acrylic resin, amide
  • PPE polymeric antistatic agent
  • B resin butylene terephthalate resin, ethylene terephthalate resin, acrylic resin, amide
  • One or more resins selected from the group consisting of resins, carbonate-based resins, propylene-based resins, and arylate-based resins was also a decisive factor.
  • (6) Water Absorption The present inventor is not yet aware of any literature that discusses the tray from the viewpoint of water absorption. The water absorption rate of CP, CF, NT, MP, MF, etc. is extremely small. The water absorption rate of CF is 0.05%. The water absorption of the PAA is 2-3%.
  • Patent Document 4 states that "A PPE resin composition containing a large amount of polyalkylene oxide (antistatic agent) is found to have problems of reduced strength, delamination, and impact strength of molded articles.” Dimensional accuracy and dimensional stability are important factors for the tray that houses the electronic product. When the electronic components are housed in the trays for storage or transportation, the trays containing the electronic components are often stacked (several to a dozen or so). Therefore, the dimensional accuracy of each portion such as length (long, short, fitting portion, etc.) and thickness (total height, fitting portion height) is important. Warpage and deformation are required to be as small as possible.
  • the ISO precision class (f) which defines dimensional tolerances, defines the general tolerance as ⁇ 0.2 mm when the dimensions are 120 mm to 400 mm.
  • the dimensional tolerance of products requiring even higher dimensional accuracy is ⁇ 0.15 mm.
  • the dimensional tolerance of the JEDEC standard JEDEC Solid State Technology Association in the United States (the Japanese standard is the JEITA standard)
  • JEDEC Solid State Technology Association in the United States (the Japanese standard is the JEITA standard)
  • the water absorption rate is an important factor for dimensional accuracy and dimensional stability in order to satisfy the above standards.
  • water absorption is a major factor in order to satisfy the dimensional accuracy and dimensional stability of the tray using the resin composition and to prevent appearance defects and deterioration of strength properties.
  • trays made of a resin composition having a water absorption rate of 0.8% or less have solved the above problems.
  • the resin composition had a water absorption of 0.63% or less. More preferably, the resin composition had a water absorption of 0.55% or less. A resin composition having a water absorption of 0.47% or less is particularly preferable.
  • the selection and mixing ratio of the resins constituting the resin composition are extremely important for the water absorption rate.
  • the water absorption was obtained as follows. A substrate of 75 mm x 75 mm x 3 mm (thickness) was fabricated and the water absorption of said substrate was measured under conditions (ISO62). The water absorption rate of the resin is as follows.
  • the resin composition containing PAA was lighter than the resin composition containing CP and the like.
  • the PAA-containing resin composition tray was, for example, about 6 to 27% lighter than the CP-containing resin composition.
  • the specific gravity of the resin is as follows.
  • the present invention was achieved based on such knowledge.
  • the present invention A resin composition containing A resin, B resin and a polymeric antistatic agent,
  • the A resin is a polyphenylene ether resin
  • the resin B is one or more resins selected from the group consisting of butylene terephthalate-based resins, ethylene terephthalate-based resins, acrylic resins, amide-based resins, carbonate-based resins, propylene-based resins, and arylate-based resins. can be,
  • the B resin is 5 to 45 parts by mass with respect to 100 parts by mass of the A resin
  • a resin composition is proposed in which the polymeric antistatic agent is 7 to 35 parts by mass with respect to 100 parts by mass of the A resin.
  • the resin B is preferably one or more resins selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, polymethyl methacrylate, polyamide, polycarbonate, polypropylene, and polyarylate.
  • a resin composition is proposed.
  • the present invention proposes a resin composition in which the polymer type antistatic agent is preferably a polyether type antistatic agent.
  • the present invention proposes a resin composition in which the polymer type antistatic agent preferably has a number average molecular weight of 500 or more.
  • the present invention proposes a resin composition in which the polymeric antistatic agent is preferably 10 to 25 parts by mass with respect to 100 parts by mass of the A resin.
  • the present invention proposes a resin composition in which the A resin is preferably a homopolymer or copolymer of a polymer represented by general formula [I] described below.
  • the present invention preferably proposes a resin composition that further contains a compatibilizer.
  • the present invention proposes a resin composition in which the compatibilizer is preferably a reactive compatibilizer.
  • the present invention proposes a resin composition in which the compatibilizer is preferably 1 to 20 parts by mass with respect to 100 parts by mass of the A resin.
  • the present invention relates to the resin composition, which preferably does not substantially contain carbon black, carbon fiber, carbon nanotube, metal powder, metal fiber, and surfactant having antistatic function. suggest things.
  • the present invention proposes a resin composition having a water absorption rate of preferably 0.8% or less.
  • the present invention proposes a resin composition in which the HDT of the resin composition is preferably 135°C or higher.
  • the present invention proposes a resin composition having a surface electrical resistance value of 1.0 ⁇ 10 12 ⁇ or less.
  • the present invention proposes a resin composition having a specific gravity of preferably 1.0 to 1.1.
  • the present invention proposes a resin composition that can be kneaded and molded, preferably at a temperature of 290°C or lower.
  • the present invention proposes the molded article made of the resin composition.
  • the present invention proposes an electrical product storage tray made of the resin composition.
  • the resin composition of the present invention was suitable as a constituent material of the tray for housing the electric appliance. Kneading and molding of the resin composition were possible at a temperature of 290° C. or lower, for example.
  • the HDT of the tray was, for example, 135° C. or higher.
  • the water absorption rate of the tray was, for example, 0.8% or less.
  • the surface electric resistance value of the tray was, for example, 1.0 ⁇ 10 12 ⁇ or less. Since the resin composition does not substantially contain a black antistatic agent such as CP, problems caused by the CP and the like (for example, staining) have been solved. A tray with high cleanliness was obtained.
  • the specific gravity of the tray was, for example, 1.0 to 1.1.
  • the electric appliances can be sorted into trays colored in a desired color (distinguishable by color) according to their types. Since the sorting is easy, in the manufacturing process and production management of the electric product, the identification of the electric product is easy, so the handling is good.
  • FIG. 1 Perspective view of multiple stacked trays (containers) Cross-sectional view along the II line in FIG. A plan view of a different type of tray (container) from FIG.
  • the first invention is a resin composition.
  • the resin composition contains A resin, B resin, and a polymeric antistatic agent.
  • the A resin is a polyphenylene ether resin (PPE).
  • the resin B is one or more resins selected from the group consisting of butylene terephthalate-based resins, ethylene terephthalate-based resins, acrylic resins, amide-based resins, carbonate-based resins, propylene-based resins, and arylate-based resins. be.
  • the polymeric antistatic agent is used in an amount of 7 to 35 parts by mass with respect to 100 parts by mass of the A resin. Preferably, it was 10 parts by mass or more. More preferably, it was 13 parts by mass or more. More preferably, it was 15 parts by mass or more.
  • the B resin is 5 to 45 parts by mass with respect to 100 parts by mass of the A resin.
  • it was 10 parts by mass or more. More preferably, it was 15 parts by mass or more.
  • it was 35 parts by mass or less. More preferably, it was 30 parts by mass or less. More preferably, it was 25 mass parts or less.
  • the A resin was preferably a resin represented by the following general formula [I].
  • general formula [I] (In general formula [I], R 1 , R 2 , R 3 , and R 4 are a hydrogen atom, a halogen atom, a hydrocarbon group (e.g., an alkyl group), a hydrocarbon oxy group (e.g., an alkoxy group), a halogen atom is a halogenated hydrocarbon group (e.g., a halogenated alkyl group) or a halogenated hydrocarbonoxy group (e.g., a halogenated alkoxy group) having at least two carbon atoms between the and the phenyl ring.
  • R 1 , R 2 , R 3 and R 4 may be the same or different, n is a positive number representing the degree of polymerization. It is an integer, preferably an integer of 20 or more, more preferably an integer of 50 or more.
  • the polyphenylene ether-based resin may be a homopolymer or a copolymer of the polymer represented by the general formula [I].
  • R 1 and R 2 are alkyl groups (having 1 to 4 carbon atoms).
  • R 3 and R 4 are hydrogen atoms or alkyl groups (having 1 to 4 carbon atoms).
  • poly(2,6-dimethyl-1,4-phenylene) ether poly(2,6-diethyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, Poly (2,6-dilauryl-1,4-phenylene) ether, poly (2,6-diphenyl-1,4-phenylene) ether, poly (2,6-dimethoxy-1,4-phenylene) ether, poly ( 2,6-diethoxy-1,4-phenylene) ether, poly(2,6-dichloro-1,4-phenylene) ether, poly(2,6-dibenzyl-1,4-)phenylene) ether, poly(2 ,6-dibromo-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly (2-methyl-6-phenylene)
  • polyphenylene ether copolymers include copolymers containing a portion of alkyl trisubstituted phenol (eg, 2,3,6-trimethylphenol) in the repeating units of polyphenylene ether.
  • a copolymer obtained by grafting a styrene-based compound to the polyphenylene ether-based resin may be used.
  • styrene compounds include styrene, ⁇ -methylstyrene, vinyltoluene, chlorostyrene and the like.
  • a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol may also be used.
  • Polyphenylene ether resins disclosed in JP1989-156A, JP1992-246461A, JP1995-228765A, JP2010-229348A and the like may also be used.
  • the resin used in combination is selected from the group of resin B (butylene terephthalate-based resin, ethylene terephthalate-based resin, acrylic resin, amide-based resin, carbonate-based resin, propylene-based resin, and arylate-based resin. one or more resins).
  • the B resin is preferably polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), polycarbonate (PC), polypropylene (PP), and polyarylate (PAR).
  • One or two or more resins selected from the group of Other resins can be used together.
  • the amount of the resins other than the above A and B is preferably 1/2 or less of the amount of the above resin B. More preferably, the amount was 1/4 or less of the B resin. This is because if the above amount is exceeded, the feature of the combination of (the A resin + the B resin) is lost. The features of the present invention are reduced.
  • Resins other than A and B were preferably thermoplastic resins.
  • the resin composition contains an antistatic agent.
  • the antistatic agent is a polymeric antistatic agent (PAA).
  • PAA polymeric antistatic agent
  • the reason why the polymer type is preferable is that the antistatic agent hardly exudes from the resin composition due to its relatively large molecular weight (long length). From this meaning, the meaning of macromolecular type is interpreted.
  • the concept of prepolymer is also included.
  • antistatic agents having a molecular weight (number average molecular weight: Mn) of 500 or more (more preferably 1000 or more) are preferred.
  • Polymeric antistatic agents include, for example, polyether ester amides (for example, polyether ester amides composed of polyoxyalkylene adducts of bisphenol A (see JP1995-10989A)); polyamideimide elastomers; polyolefin blocks and hydrophilic polymers Block polymer having a repeating structure with 2 to 50 bonding units to the block (see US Pat. No.
  • Block copolymer of polyolefin and polyether Trunk polymer (polyamide) and branch polymer (polyalkylene ether and polyester) copolymer of ⁇ -olefin, maleic anhydride and polyalkylene allyl ether; polymer of polyethylene ether, isocyanate and glycol; polyvalent carboxylic acid component, organic diisocyanate and polyethylene glycol; Copolymer; polyethylene oxide; polyethylene oxide copolymer; polyether ester; polyether amide; polyether ester amide; partially crosslinked polyethylene oxide copolymer; a polymer having an alkali metal salt or a quaternary ammonium salt); a graft polymer obtained by grafting a vinyl (or vinylidene) monomer (e.g., sodium styrene sulfonate) to a rubber copolymer of an alkylene oxide and a conjugated diene compound ; A polymer obtained by forming an
  • Polymeric antistatic agents are well known.
  • the polymeric antistatic agent (PAA) was preferably a polyether antistatic agent.
  • the HDT of the resin composition containing the polymeric antistatic agent was lower than the HDT of the resin composition containing the conductive filler such as CP. Still, the HDT of the resin composition of the present invention was satisfactory.
  • the resin composition preferably further contains a compatibilizer.
  • Various compatibilizers are known.
  • the compatibilizing agent is a compatibilizing agent for the A resin, the B resin, and the polymer type antistatic agent.
  • Preferred compatibilizers were reactive compatibilizers.
  • Examples of the compatibilizing agent include polar functional group-containing polystyrene-based reactive compatibilizing agents. Examples include oxazoline group-containing reactive polystyrene. Hydrogenated styrene-based thermoplastic elastomers (SEBS) of styrene-butadiene copolymers can be mentioned. Random copolymer resins of styrene/maleic anhydride (SMA) may be mentioned. Of course, it is not limited to these.
  • the compatibilizing agent was preferably 1 to 20 parts by mass with respect to 100 parts by mass of the A resin. More preferably, it was 5 parts by mass or more. More preferably, it was 7 parts by mass or more. More preferably, it was 15 mass parts or less. More preferably, it was 13 mass parts or less.
  • the resin composition preferably does not substantially contain CP, CF, CNT, MP, MF and SAA.
  • a resin composition containing a large amount of powders and fibers of the above substances has problems of falling off, falling off of powder, generation of dust, protruding and breaking of fibers and staining.
  • SAA surfactant
  • the resin composition preferably contains substantially no dark gray to black antistatic agents (CP, CF, CNT, MP, MF). This is because if a large amount of a dark gray to black antistatic agent such as CP is contained, its adverse effects are great. However, if there is a small amount, the harmful effect will be small.
  • substantially does not contain means “to the extent that the color of the resin composition based on the substance is not clearly visible”. That is, when CP, CF, CNT, MP, and MF are contained to some extent, the resin composition becomes brown or black. looks bad. specific gravity increases. Detachment, falling powder, generation of dust, protruding and breaking of fibers may occur.
  • the resin composition does not contain coloring substances. However, the inclusion (addition: blending) of coloring substances is not denied. For example, there is no problem if the content is such that discoloration of the resin composition due to heating can be seen.
  • the physical properties (for example, surface electrical resistance) of the resin composition may have changed when the color of the resin composition tray changed due to heating. This is because the discoloration of the resin composition means that the resin composition (particularly, the resin) has deteriorated (denatured). The deterioration of the resin composition is caused, for example, by oxidation of the resin composition (oxidation promoted by heating). By knowing such discoloration, it is possible to determine whether to continue using the tray or to replace it. If the resin composition is heated and the relationship between the discoloration and the surface electrical resistance value is examined in advance, the surface electrical resistance value has exceeded a certain threshold.
  • the HDT of the resin composition was preferably 135° C. or higher. More preferably, it was 140° C. or higher. More preferably, it was 150°C or higher. There are no particular restrictions on the upper limit.
  • the resin composition preferably had a surface electrical resistance value of 1.0 ⁇ 10 12 ⁇ or less. More preferably, it was 1.0 ⁇ 10 11 ⁇ or less. More preferably, it was 1.0 ⁇ 10 10 ⁇ or less. For example, it was 1.0 ⁇ 10 8 ⁇ or more.
  • the resin composition preferably had a water absorption of 0.8% or less. More preferably, the water absorption rate was 0.63% or less. More preferably, the water absorption was 0.55% or less. Especially preferably, the water absorption rate was 0.47% or less.
  • the resin composition preferably had a specific gravity of 1.0 to 1.1. More preferably, it was 1.01 or more. More preferably, it was 1.02 or more. More preferably, it was less than 1.1. More preferably, it was 1.09 or less.
  • the resin composition was preferably able to be kneaded and molded into a resin compound at 290° C. or lower. The physical properties were closely related to the content of the resin composition of the present invention.
  • a second invention is a molded article.
  • the molded body is made of the resin composition.
  • the molded body is, for example, a tray.
  • an IC tray For example, it is a semiconductor element (product) storage tray.
  • an electronic product storage tray For example, an electronic product storage tray.
  • the tray includes, for example, a storage section for electrical products (electronic components are also included in electrical products).
  • the shape (structure) of the tray includes, for example, the shapes (structures) shown in FIGS. Of course, it is not limited to this.
  • the tray is preferably annealed. Heating relieved the residual stress in the tray. Deformation of the tray is prevented. Shape and dimensions are stable.
  • the tray is used when transporting the electric product (or when inspecting the characteristics of the product, when mounting the product, or when storing the product).
  • the tray is used, for example, in a heated atmosphere. For example, it is used in an air atmosphere (under an oxidizing atmosphere).
  • the appearance of the molded substrate is slightly poor (slight swelling, little delamination).
  • x Moldability is poor.
  • the appearance of the molded substrate is poor (large swelling, large delamination).
  • the blackness is represented by a pencil hardness (blackness) of 10H to 10B. If no line was drawn, it is denoted by ND.
  • An IC tray having a shape corresponding to JEDEC was formed by injection molding.
  • a molded product (a molded thin plate product of epoxy resin BGA "CV8710MV” manufactured by Panasonic Corporation) was loaded into the storage chamber of the IC tray.
  • the IC trays were stacked in three stages and bound with bands. 20 sets were put in a cardboard box.
  • a vibration tester (“VIBRATOR GENELATION” FT-10K/80 manufactured by EMIC) was used. It was tested in accordance with JIS Z0238 "Packaged Baggage Vibration Test Method" Level II. A: Cleanliness was maintained.
  • HDT Heat distortion temperature
  • a measuring machine Model 3M-2 (manufactured by Toyo Seiki Seisakusho) was used. HDT was measured under conditions (ISO75 (1.82 MPa)).
  • ⁇ : 150 ° C. or higher ⁇ : 135 ° C. or higher to less than 150 ° C.
  • ⁇ Surface electrical resistance> Measuring instruments Simco-Ion surface resistance meter (Model ST-4), IEC measurement electrode kit for surface resistance meter (manufactured by Simco Japan) were used.
  • Hot air drying was performed using ETAC-HS320 (hot air dryer manufactured by Kusumoto Kasei Co., Ltd.). The drying conditions were 135° C. (hot air blowing temperature) for 500 hours or 150° C. (hot air blowing temperature) for 250 hours.
  • ⁇ Recognition of color change Whether or not heating is possible at 135 ° C./500 hours> It is whether or not the color change can be visually recognized.
  • ⁇ : "500” can recognize a change in color even after 500 hours from the start of heating.
  • ⁇ : "400” can recognize the color change from the start of heating until 400 hours.
  • the resin composition of the present invention was suitable as a constituent material of trays for housing the electrical appliances. Kneading and molding of the resin composition were possible at a temperature of 290° C. or lower, for example.
  • the HDT of the tray was, for example, 135° C. or higher.
  • the water absorption rate of the tray was, for example, 0.8% or less.
  • the surface electric resistance value of the tray was, for example, 1.0 ⁇ 10 12 ⁇ or less. Since the resin composition does not substantially contain a black antistatic agent such as CP, problems caused by the CP and the like (for example, staining) have been solved. A tray with high cleanliness was obtained.
  • the specific gravity of the tray was, for example, 1.0 to 1.1.
  • the electric appliances can be sorted into trays colored in a desired color (distinguishable by color) according to their types. Since the sorting is easy, in the manufacturing process and production management of the electric product, the identification of the electric product is easy, so the handling is good.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine contenant une résine A, une résine B et un agent antistatique polymère, la résine A étant une résine d'éther de polyphénylène ; la résine B étant une ou plusieurs résines choisies dans le groupe constitué par les résines de téréphtalate de butylène, les résines de téréphtalate d'éthylène, les résines acryliques, les résines amides, les résines de carbonate, les résines de propylène et les résines d'arylate ; la résine B étant de 5 à 45 parties en masse pour 100 parties en masse de la résine A ; et l'agent antistatique polymère étant de 7 à 35 parties en masse pour 100 parties en masse de la résine A.
PCT/JP2021/037907 2021-10-13 2021-10-13 Composition de résine contenant un agent antistatique polymère et corps moulé WO2023062749A1 (fr)

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JP2022523075A JP7169037B1 (ja) 2021-10-13 2021-10-13 高分子型帯電防止剤含有樹脂組成物および成形体
PCT/JP2021/037907 WO2023062749A1 (fr) 2021-10-13 2021-10-13 Composition de résine contenant un agent antistatique polymère et corps moulé

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63101452A (ja) * 1986-10-20 1988-05-06 Mitsubishi Petrochem Co Ltd 樹脂組成物の製造方法
JPH10158500A (ja) * 1996-12-05 1998-06-16 Asahi Chem Ind Co Ltd ポリフェニレンエーテル系樹脂組成物
JPH11140299A (ja) * 1997-11-13 1999-05-25 Asahi Chem Ind Co Ltd ポリフェニレンエーテル系樹脂組成物
WO2021006192A1 (fr) * 2019-07-10 2021-01-14 三菱電機株式会社 Composition de résine thermoplastique, article moulé et produit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63101452A (ja) * 1986-10-20 1988-05-06 Mitsubishi Petrochem Co Ltd 樹脂組成物の製造方法
JPH10158500A (ja) * 1996-12-05 1998-06-16 Asahi Chem Ind Co Ltd ポリフェニレンエーテル系樹脂組成物
JPH11140299A (ja) * 1997-11-13 1999-05-25 Asahi Chem Ind Co Ltd ポリフェニレンエーテル系樹脂組成物
WO2021006192A1 (fr) * 2019-07-10 2021-01-14 三菱電機株式会社 Composition de résine thermoplastique, article moulé et produit

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