WO2023055083A1 - Vacuum equipment - Google Patents

Vacuum equipment Download PDF

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Publication number
WO2023055083A1
WO2023055083A1 PCT/KR2022/014583 KR2022014583W WO2023055083A1 WO 2023055083 A1 WO2023055083 A1 WO 2023055083A1 KR 2022014583 W KR2022014583 W KR 2022014583W WO 2023055083 A1 WO2023055083 A1 WO 2023055083A1
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WO
WIPO (PCT)
Prior art keywords
unit
vacuum
pair
substrate
lower chamber
Prior art date
Application number
PCT/KR2022/014583
Other languages
French (fr)
Korean (ko)
Inventor
박태영
강석주
이준희
Original Assignee
삼성디스플레이 주식회사
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Publication of WO2023055083A1 publication Critical patent/WO2023055083A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present disclosure relates to a vacuum facility including a substrate transfer unit, and more particularly, to a vacuum facility having a substrate transfer unit capable of discharging finished products therein.
  • LCD liquid crystal display
  • PDP plasma display panel
  • OLED device organic light emitting diode device
  • FED field effect display
  • electrophoretic display device an electrophoretic display device
  • a substrate used in a manufacturing facility for a flat panel display uses a mother substrate of a large size combined with a plurality of substrates for a flat panel display, and processes such as forming each layer and attaching a film are performed.
  • Such large-sized substrates require care during transfer, and there is a disadvantage in that processing time is prolonged during the manufacture of the substrate.
  • Embodiments are to provide a vacuum facility including a substrate transfer unit capable of reducing process time.
  • Vacuum equipment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit includes a vacuum holding unit in close contact with a lower surface of the lower chamber; a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber; a pair of width control units connected to the rotating unit; a pair of arm parts, one of which is connected to one of the pair of width adjusting parts and the other of which is connected to the other of the pair of width adjusting parts; and a plurality of suction parts located at one end of the pair of arm parts.
  • the rotation unit rotates the substrate to which the lower material located in the lower chamber and the upper material located in the upper chamber are bonded together, and discharges the substrate to the outside.
  • the substrate transport unit includes a support column located inside the vacuum maintaining unit; And it is connected to the end of the support column, it may further include a first body for supporting the rotating part.
  • the substrate transfer unit may further include a pair of vertical movement units positioned at both ends of the first body to vertically move the substrate transfer unit.
  • the pair of arm parts each include a first connection part connected to a corresponding width adjusting part among the pair of width adjusting parts; And it may include an adsorption unit support that is fastened to and supported by the plurality of adsorption units.
  • the pair of width adjusting units each include a cylinder for linear movement; and an operation unit whose length is adjusted according to the operation of the cylinder and whose end has a width extended in a circular structure.
  • the operating unit is connected to the first connection unit, and a gap may be formed between the operation unit and the first connection unit.
  • the gap may be 0.1 mm or more and 0.3 mm or less.
  • the substrate transfer unit may further include a second body positioned between the rotating unit and the pair of width adjusting units.
  • the substrate transfer unit may further include a guide unit positioned on the second body and including a rail.
  • Each of the pair of arm parts may further include a second connection part connected to the guide part.
  • the rotating part the pair of width adjusting parts, the pair of arm parts, the plurality of adsorption parts, the first body, the second body, the pair of vertical moving parts, and the guide part are the lower parts. It may be located within the chamber.
  • Vacuum equipment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit includes a vacuum holding unit in close contact with a lower surface of the lower chamber; a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber; an arm part connected to the rotating part and having a bent linear structure; and a plurality of adsorption parts positioned at one end of the arm part.
  • the arm part may have a bent linear bar structure.
  • the substrate transfer unit may further include a vertical movement unit that connects the rotation unit and the arm unit and vertically and linearly moves the arm unit.
  • the substrate transport unit includes a support column located inside the vacuum maintaining unit; And it is connected to the end of the support column, it may further include a body supporting the rotating part.
  • the plurality of adsorption units adsorb the central portion of the substrate where the lower material located in the lower chamber and the upper material located in the upper chamber are bonded, and the substrate transfer unit rotates the adsorbed substrate to discharge it to the outside. .
  • Vacuum equipment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit has a pair of linear transfer units, and each of the pair of linear transfer units has a lower surface of the lower chamber.
  • a vacuum holding unit that is in close contact with; a body connected to the vacuum maintaining unit and positioned inside the lower chamber; a first width adjusting unit and a second width adjusting unit connected to the body; an arm portion connected to an end of the first width adjusting portion; and a plurality of adsorption parts positioned at one end of the arm part.
  • the pair of linear transfer units may further include a pair of vertical moving units connected to the body and vertically moving the body.
  • At least one of the first width adjusting unit and the second width adjusting unit may include a cylinder.
  • the substrate transfer unit is formed inside the vacuum facility so that the substrate on which the upper material and the lower material are bonded can be rapidly discharged and transferred when the vacuum facility is opened, thereby shortening the process time.
  • the bonded substrate can be quickly discharged, the upper material and the lower material are quickly transferred to the vacuum facility, thereby reducing the overall process time.
  • FIGS. 1 and 2 are schematic diagrams of a vacuum facility according to an embodiment.
  • FIG. 3 is an operation explanatory diagram of a substrate transfer unit according to an exemplary embodiment.
  • FIGS. 4 and 5 are schematic diagrams of a delivery unit that respectively delivers an upper material and a lower material in a vacuum facility according to an embodiment.
  • FIG. 6 is a perspective view of a substrate transfer unit according to an embodiment.
  • FIG. 7 to 14 are views showing each part of the substrate transfer unit according to the embodiment of FIG. 6 .
  • FIG. 15 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 6 .
  • 16 is a perspective view of a substrate transfer unit according to another embodiment.
  • FIG. 17 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 16 .
  • FIG. 18 is a perspective view of a substrate transfer unit according to another embodiment.
  • FIG. 19 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 18 .
  • a part such as a layer, film, region, plate, etc.
  • another part is in the middle.
  • a part is said to be “directly on” another part, it means that there is no other part in between.
  • being “above” or “on” a reference part means being located above or below the reference part, and does not necessarily mean being located “above” or “on” in the opposite direction of gravity. .
  • planar image it means when the target part is viewed from above, and when it is referred to as “cross-sectional image”, it means when a cross section of the target part cut vertically is viewed from the side.
  • FIGS. 1 to 5 the overall vacuum equipment will be described through FIGS. 1 to 5.
  • FIGS. 1 and 2 are schematic diagrams of a vacuum facility according to an embodiment
  • FIG. 3 is an operation explanatory diagram of a substrate transfer unit according to an embodiment
  • FIGS. 4 and 5 are an upper material in a vacuum facility according to an embodiment.
  • it is a schematic diagram of the conveying part which respectively conveys the lower material.
  • a vacuum facility largely includes a lower chamber 100 and an upper chamber 200 .
  • the vacuum facility may perform various processes on the internal substrate.
  • a process of bonding an upper material and a lower material may be performed.
  • a process performed in a vacuum facility may be, for example, a process of forming an adhesive layer on one side of a substrate on which transistors, capacitors, etc. are formed, or a process of attaching a window to a substrate to which an adhesive layer is attached.
  • the substrate may flow into an upper material and the adhesive layer may flow into a lower material.
  • the window may flow into the upper material, and the substrate to which the adhesive layer is attached may flow into the lower material.
  • the substrate on which the process of bonding the upper material and the lower material and discharging them out of the vacuum facility has been performed may be a substrate with an adhesive layer attached in the process of forming an adhesive layer on the substrate, and a substrate with a window attached in the process of attaching a window.
  • the upper chamber 200 may include a window so that an internal vacuum state and process state may be checked.
  • the upper chamber 200 has a structure that can be lifted upward, and is opened upward to break the vacuum state and the substrate 30 therein can be discharged to the outside.
  • a substrate transfer unit 300 for discharging the processed substrate 30 is formed in the vacuum facility. More specifically, the substrate transfer unit 300 is located in the lower chamber 100 of a vacuum facility according to an embodiment.
  • the substrate transfer unit 300 Since the substrate transfer unit 300 is located in a vacuum facility in a vacuum state, it starts to operate before or at the same time as the vacuum of the vacuum facility is broken, and adsorbs and discharges the substrate 30 . In this way, it is possible to start discharging the substrate 30 on which the process has been performed through the substrate transfer unit 300 in advance, thereby reducing the overall process time.
  • the substrate transfer unit 300 may be set to start operating after the vacuum state is broken.
  • the substrate transfer unit 300 lifts and rotates the processed substrate 30 in a suction manner and discharges the substrate 30 from the original position 30-1 to the outside of the vacuum facility.
  • the structure of the substrate transfer unit 300 will be reviewed through FIGS. 6 to 19 to be described later.
  • the upper material delivery unit 400 and the lower material delivery unit 500 are located outside the vacuum equipment.
  • the upper material delivery unit 400 and the lower material delivery unit 500 may each move along the rail 450 to approach the vacuum facility.
  • the upper material delivery unit 400 places the upper material 40 on the upper side, approaches the vacuum equipment along the rail 450, and then pushes the upper material 40 toward the upper chamber 200 to the upper chamber ( An upper material 40 may be provided in 200 .
  • the lower material delivery unit 500 places the lower material 50 on the lower side, approaches the vacuum equipment along the rail 450, and pushes the lower material 50 toward the lower chamber 100 to lower the chamber ( A lower material 50 may be provided in 100 .
  • the vision unit 600 By aligning the positions of the material 40 and the lower material 50, it is possible to prevent misalignment from occurring when they are finally bonded to the substrate 30.
  • Figures 1 to 5 are arranged based on the process sequence of the vacuum equipment. That is, in FIG. 1, the lower chamber 100 and the upper chamber 200 of the vacuum facility are attached so that the inside is in a vacuum state so that the upper material 40 and the lower material 50 are bonded in a vacuum state to form a final substrate. It is a drawing in which the forming process proceeds.
  • 2 shows a state in which the vacuum is broken by separating the lower chamber 100 and the upper chamber 200 after completing the substrate 30 to which the upper material 40 and the lower material 50 are bonded.
  • FIG. 3 shows a state in which the substrate 30 to which the upper material 40 and the lower material 50 are bonded is discharged out of the vacuum facility through the substrate transfer unit 300 .
  • 4 and 5 show a state in which the lower material 50 and the upper material 40 are respectively provided to the lower chamber 100 and the upper chamber 200 of the vacuum equipment for the next process.
  • the lower material 50 and the upper material 40 can be provided at the same time, so the process time can be shortened.
  • the substrate 30 on which the process has been completed can be immediately discharged out of the vacuum facility by the substrate transfer unit 300 located in the vacuum facility, so that the lower material 50 and the upper material 40 to be used in the next process are quickly transported to the vacuum facility. process time can be shortened.
  • FIGS. 6 to 19 various embodiments and detailed structures and operations of a substrate transfer unit located in a vacuum facility will be described through FIGS. 6 to 19 .
  • FIGS. 2 and 3 First, the structure and operation of the substrate transfer unit 300 shown in FIGS. 2 and 3 will be reviewed through FIGS. 6 to 15 .
  • FIG. 6 is a perspective view of a substrate transfer unit according to an exemplary embodiment
  • FIGS. 7 to 14 are views illustrating each part of the substrate transfer unit according to the exemplary embodiment of FIG. 6
  • FIG. 15 is a substrate transfer unit according to the exemplary embodiment of FIG. 6 . It is a diagram showing the operation of
  • the substrate transfer unit 300 includes a driving unit 310, a vertical moving unit 320, a rotating unit 330, a width adjusting unit 340, an adsorption unit 360, an arm unit 370, and a bellows 380. ) may be included.
  • the driving unit 310 may operate the substrate transfer unit 300 as a whole, and may drive the substrate transfer unit 300 to vertically move as a whole.
  • the driving unit 310 may provide power so that each part of the substrate transfer unit 300 may operate.
  • the drive unit 310 is located outside the vacuum facility and is not located within the vacuum.
  • the driving unit 310 is connected to the first body 312 through a support pillar 311 .
  • the first body 312 is located in a vacuum facility, and at least a part of the support pillar 311 may be located in a vacuum facility.
  • a first body 312 is positioned at an upper end of the support pillar 311, and the first body 312 has a bar-type structure extending horizontally.
  • a pair of up and down moving parts 320 are positioned at both ends of the first body 312 .
  • the pair of vertical moving parts 320 may include a motor that moves the first body 312 in the vertical direction, and may include a part that moves vertically along a guide such as a rail by the operation of the motor. there is.
  • the pair of up and down moving parts 320 may be fixed to the inner bottom of the lower chamber 100 to change the height of the first body 312 from the inner bottom surface of the lower chamber 100 .
  • the support pillar 311 also moves up and down together so that the overall height of the first body 312 can be constantly changed.
  • the rotating part 330 is positioned on the first body 312, and the second body 335 is connected to the rotating part 330.
  • the rotation unit 330 serves to rotate the second body 335 positioned above the first body 312 and may include a rotating cylinder that performs a rotational operation.
  • the rotating cylinder may be rotated by hydraulic pressure or by a motor.
  • the second body 335 may have a bar-type structure extending horizontally like the first body 312 .
  • a pair of width adjusting parts 340 and a guide part 350 are formed on the upper surface of the second body 335 .
  • a pair of arm parts 370 are fixed to the pair of width adjusting parts 340 and the guide part 350 .
  • the pair of width control units 340 include cylinders that move linearly and are arranged along the longitudinal direction of the second body 335 (hereinafter referred to as the first direction).
  • the width adjusting unit 340 lengthens or shortens the second body 335 in the longitudinal direction by the movement of the cylinder.
  • the width adjusting unit 340 may have a structure in which a linear movement is performed by a motor instead of a cylinder, so that the width adjustment may be performed by the operation of the motor.
  • guides such as rails are arranged along the longitudinal direction of the second body 335 .
  • the pair of arm parts 370 fixed to the pair of width adjusting parts 340 and the guide part 350 are connected according to the first connection part 371 fixed to the width adjusting part 340 and the guide part 350. It includes a moving second connection part 372 and an adsorption part support 373 on which an adsorption part 360 capable of adsorbing the substrate 30 is located.
  • the first connection part 371 is connected to the end of the cylinder of the width adjusting part 340 and has a structure in which the cylinder moves along with it when the cylinder makes a linear motion.
  • the end of the cylinder of the width adjusting part 340 has a circular structure, and the first connection part 371 provides a gap (a gap of about 0.2 mm) to the circular structure. It is formed in a structure that encloses and can be formed so that there is no restriction on movement.
  • the second connection part 372 has a structure capable of linear movement along the guide part 350 and has a structure that moves along the rail by having a groove corresponding to the rail structure of the guide part 350 .
  • the second connection part 372 is connected to the first connection part 371 and moves together when the first connection part 371 moves according to the linear motion of the cylinder of the width adjusting part 340 .
  • the suction part support 373 extends long in a direction perpendicular to the longitudinal direction of the second body 335 (hereinafter referred to as a second direction), and a plurality of suction parts 360 are positioned at regular intervals.
  • the suction part support 373 is connected to the first connection part 371 and the second connection part 372, so that when the first connection part 371 moves according to the linear movement of the cylinder of the width adjusting part 340, it moves together. In this way, when the pair of width control units 340 are linearly moved, the pair of arm units 370 also move, and the adsorption unit 360 positioned on the arm unit 370 according to the width of the substrate 30 in the second direction position can be moved.
  • the adsorbing unit 360 may adsorb the substrate 30 located in the downward direction by having suction holes arranged in a downward direction.
  • three adsorption units 360 are formed on one side, and various numbers may be included according to the size of the substrate 30 to be adsorbed.
  • the bellows 380 is also called a bellows valve or a vacuum retainer, and has excellent sealing performance so that the vacuum of the vacuum equipment can be maintained even if a part of the substrate transfer unit 300 is located outside the vacuum equipment.
  • the bellows 380 may have a double sealing structure.
  • the bellows 380 is located on one side of the drive unit 310, and a support pillar 311 is located inside the bellows 380, and the support pillar 311 also moves up and down together according to the operation of the up and down movement unit 320. It can have a movable structure. At this time, the operation of the support pillar 311 may be configured to linearly move up and down by the driving unit 310 .
  • FIG. 7 the structure of the vertical moving unit 320 is shown enlarged.
  • the vertical movement unit 320 includes a rail, and is connected to the support unit 322 fixed to the bottom of the lower chamber 100 and the first body 312 to move the first body 312 up and down along the rail. It may include a linear motor unit 321 that can be. According to the operation of the linear motor unit 321, the first body 312 and other parts connected to the first body 312 (rotator 330, second body 335, width adjusting unit 340, guide The part 350, the arm part 370, the suction part 360, etc.) are also moved up and down together. Depending on the embodiment, the operation of the vertical moving unit 320 may be operated by hydraulic pressure instead of by a motor.
  • FIG. 8 the structure of the rotation unit 330 is shown enlarged.
  • the rotation unit 330 may include a support unit 332 connected to the first body 312 and a rotation cylinder 331 connected to the second body 335 to rotate the second body 335 .
  • the part protruding from the support part 332 may be a part that receives an external input to control the rotational motion of the rotating cylinder 331 .
  • the operation of the rotating cylinder 331 may be operated by a motor or hydraulic pressure.
  • the width adjusting unit 340 includes a cylinder 341 that moves linearly and an operating unit 342 whose length is adjusted according to the operation of the cylinder 341 .
  • the end of the operating unit 342 has a circular structure and has an extended width. 9(A) and 9(B), the cylinder 341 is fixed to the second body 335, the cylinder 341 does not move during operation of the cylinder 341, and the operating unit ( 342 protrudes from the cylinder 341 in the first direction is adjusted.
  • the protruding length of the operation unit 342 is adjusted so that the positions of the arm unit 370 and the adsorption unit 360 are adjusted.
  • the operation of the cylinder 341 may be operated by a motor or hydraulic pressure.
  • the guide part 350 includes a rail 351 arranged along the longitudinal direction (first direction) of the second body 335 and a plurality of moving parts 352 moving along the rail 351 .
  • the rail 351 is fixed to the second body 335, and the plurality of moving parts 352 are separated into two groups and connected to a pair of second connection parts 372, so that the second connection parts 372 are connected to the rails. Let it move linearly along (351).
  • the second connection part 372 is connected to the first connection part 371 and is formed to linearly move along with the linear motion of the first connection part 371 .
  • the structure of the adsorption unit 360 is shown enlarged.
  • the adsorption unit 360 includes suction ports 362 arranged in a downward direction and a body 361 that sucks air from the suction ports 362 and fixes the suction ports 362 .
  • air may be removed from the body 361 to form a vacuum in the suction hole 362 to adsorb and fix the upper surface of the substrate 30 positioned below.
  • FIG. 12 a structure in which the end of the operation unit 342 is connected between the first connection unit 371 and the width adjusting unit 340 is shown enlarged, and a cross section is shown in FIG. 12 .
  • An end of the operation unit 342 of the width adjusting unit 340 has a circular structure, and the first connection unit 371 has a groove corresponding to the circular structure.
  • a gap g is formed between the groove of the first connection part 371 and the end of the operation part 342 of the width adjusting part 340, and in one embodiment, the gap g may be 0.2 mm. Depending on the embodiment, it may have a clearance of 0.1 mm or more and 0.3 mm or less. According to this structure, the end of the operating unit 342 can rotate without friction within the groove of the first connection unit 371, so that the linear motion of the width adjusting unit 340 is transferred to the first connection unit 371 without loss. It can be.
  • the second connection part 372 has a structure fixed to the suction part support 373 by having a groove 374 .
  • the groove 374 of the second connection part 372 is formed long in the first direction.
  • the suction unit support 373 has a groove 375 so that a pair of suction units 360 can be fixed.
  • the groove 375 is formed long in the longitudinal direction (second direction) of the suction part support 373 so that the pair of suction parts 360 may be fixed at different positions in the second direction.
  • the first connection part 371 is located on the opposite side of the suction part support 373 in the second direction from the second connection part 372 .
  • the entire structure of the substrate transfer unit 300 is illustrated centering on the structures of the bellows 380 and the lower chamber 100 .
  • the bellows 380 is in close contact with the lower surface of the lower chamber 100 so that the vacuum equipment can maintain a vacuum.
  • the lower chamber 100 has a hole located at a portion corresponding to the support pillar 311 located inside the bellows 380 so that some structures of the substrate transfer unit 300 are positioned in a vacuum.
  • the bellows 380 and the driving unit 310 are located outside the vacuum, and the parts located inside the vacuum include the vertical moving unit 320, the rotating unit 330, the width adjusting unit 340, and the adsorption unit. 360 , arm 370 , support pillar 311 , first body 312 , and second body 335 .
  • FIGS. 15(A) and 15(B) show that the pair of arm parts 370 linearly move to fit the size of the substrate 30, and FIGS. 15(C) and 15(D) show the arm parts ( 370) is a view showing a process in which the adsorption unit 360 is adsorbed to the upper surface of the substrate 30 by moving up and down, and FIG. It is a drawing showing the process of discharging to the outside of the vacuum facility.
  • the linear movement of the pair of arm parts 370 is due to the linear motion of the width adjusting part 340.
  • the vertical movement of the arm part 370 shown in FIGS. 15(C) and 15(D) is performed while the vertical moving part 320 and the support pillar 311 move up and down by the vertical movement of the up and down moving part 320. is carried out
  • FIG. 15(B) and FIG. 15(C) may be a perspective view and a side view at the same timing, and the operation of the substrate transfer unit 300 is shown in FIG. 15(B) and FIG. 15(A) in FIG.
  • the substrate 30 is adsorbed through the step of FIG. 15(D), and rotated in the original position shown at 30-1 as shown in FIG. 15(E) so that the substrate 30 is vacuumed. discharged out of the facility.
  • FIGS. 16 to 19 the structure and operation of the substrate transfer unit according to another embodiment will be described through FIGS. 16 to 19, and first, the structure of the substrate transfer unit 300-1 according to another embodiment through FIGS. 16 and 17 and look at the operation.
  • FIG. 16 is a perspective view of a substrate transfer unit according to another embodiment
  • FIG. 17 is a view illustrating an operation of the substrate transfer unit according to the embodiment of FIG. 16 .
  • a schematic structure of a substrate transfer unit 300-1 according to another embodiment is as follows.
  • a substrate transfer unit 300-1 includes a body 310-1, a rotation unit 330-1, a vertical movement unit 320-1, an adsorption unit 360-1, and an arm unit 370-1. ), and in FIG. 16, only the parts different from those of FIG. 6 are shown, so the bellows 380 and the support pillar 311 are not shown. That is, although not shown in FIG. 16, the substrate transfer unit 300-1 moves along the body 310-1 through the bellows 380 and the support pillar 311 located inside the bellows 380, as shown in FIG. It is connected to, and may further include a driving unit 310 according to the embodiment.
  • the substrate transfer unit 300-1 of FIG. 16 also has a portion located in a vacuum facility, and all of the portions shown in FIG. 16 may be located in a vacuum facility, that is, the lower chamber 100.
  • the body 310-1 is a part that connects the rotating part 330-1 and the support pillar 311 located below it, and is located in the vacuum equipment.
  • the rotating part 330-1 serves to rotate the up-and-down moving part 320-1, the arm part 370-1, and the suction part 360-1 located at the upper part with respect to the body 310-1, It may include a rotating cylinder that performs a rotating operation.
  • the rotating cylinder may be rotated by hydraulic pressure or by a motor.
  • the vertical movement unit 320-1 located on one side of the rotation unit 330-1 allows the arm unit 370-1 and the adsorption unit 360-1 connected thereto to move up and down. As a result, the adsorption unit 360 - 1 moves downward from the top of the substrate 30 to be adsorbed to the upper surface of the substrate 30 .
  • the vertical moving unit 320-1 includes a motor capable of moving in the vertical direction, and may include a part that moves vertically along a guide such as a rail by operation of the motor.
  • the arm part 370-1 extends to the vertical moving part 320-1 and may have a bent linear bar structure.
  • An end of the arm 370-1 includes an adsorption unit 360-1 capable of adsorbing the upper surface of the substrate 30, and one adsorption unit 360-1 may include a plurality of adsorption units as shown in FIG. 11. can
  • FIG. 17 the operation of the substrate transfer unit 300-1 of FIG. 16 is shown.
  • 17(A) and 17(B) show that one arm part 370-1 is positioned at the end of the substrate 30, and then the rotating part 330-1 rotates to form a suction part 360-1 in the center of the substrate 30. 1) is rotated to position, and FIG. 17(C) shows that the arm part 370-1 is moved up and down by the up-and-down moving part 320-1 and is adsorbed to the center of the upper surface of the substrate 30.
  • 17(D) is a diagram showing a process in which the unit 360-1 is adsorbed, and in FIG. 17(D), the rotating unit 330-1 rotates in the opposite direction to FIGS. 30) is a diagram showing the process of discharging the vacuum equipment.
  • the substrate transfer part 300-1 since the substrate transfer part 300-1 according to the embodiment of FIG. 16 has only one arm part 370-1, it has a structure in which the center part of the substrate 30 is not attached to the sides of the substrate 30.
  • the substrate transfer unit 300-1 rotates from the step of FIG. 17(A) to the center of the substrate 30 as in the step of FIG. 17(B), and then through the step of FIG. 17(C).
  • the substrate 30 is adsorbed and rotated in the original position shown at 30-1 as in the step of FIG. 17(D), and the substrate 30 is discharged out of the vacuum equipment.
  • FIG. 18 is a perspective view of a substrate transfer unit according to another embodiment
  • FIG. 19 is a view illustrating an operation of the substrate transfer unit according to the embodiment of FIG. 18 .
  • the schematic structure of the substrate transfer unit 300-2 according to another embodiment is different from the above substrate transfer units 300 and 300-1, which discharges the substrate 30 to the outside of the vacuum facility using only linear motion.
  • An example is shown. Looking at the substrate transfer unit 300-2 according to the embodiment of FIG. 18, it is as follows.
  • the substrate transfer unit 300-2 is composed of a pair of linear transfer units, and each linear transfer unit includes a body 310-2, width adjusting units 340-1 and 340-2, and a vertical moving unit. (320-2), an adsorption part 360-2 and an arm part 370-2.
  • FIG. 18 as in FIG. 16, only parts different from those in FIG. 6 are shown, and thus the bellows 380 and the support pillar 311 are not shown. That is, although not shown in FIG. 18, the pair of linear conveyors are connected to the body 310-1 through the bellows 380 and the support pillar 311 located inside the bellows 380, as shown in FIG. 6, respectively. It is connected, and may further include a driving unit 310 according to embodiments.
  • the substrate transfer unit 300-2 of FIG. 18 also has a portion located in the vacuum facility, and all of the portions shown in FIG. 18 may be located in the vacuum facility, that is, the lower chamber 100.
  • a pair of up and down moving parts 320-2 and two width adjusting parts 340-1 and 340-2 are formed in one body 310-2.
  • a support pillar 311 is located under the body 310-2 and is located in a vacuum facility.
  • the pair of up and down moving parts 320-2 include a motor that moves the body 310-2 in the up and down direction, and includes a part that moves up and down along a guide such as a rail by the operation of the motor. can do.
  • the pair of up and down moving parts 320-2 are fixed to the inner bottom of the lower chamber 100 and can change the height of the body 310-2 from the inner bottom surface of the lower chamber 100.
  • the support pillar 311 also moves up and down together, so that the height of the body 310-2 as a whole can be constantly changed.
  • the two width adjusting units 340-1 and 340-2 are composed of a first width adjusting unit 340-1 and a second width adjusting unit 340-2.
  • the two width adjusting units 340-1 and 340-2 may each include a cylinder that moves linearly, and is arranged along the longitudinal direction of the body 310-2.
  • the length of the second body 335 is increased by the movement of the cylinders of the two width control units 340-1 and 340-2.
  • the end of the first width adjusting part 340-1 is connected to the arm part 370-2, and when both width adjusting parts 340-1 and 340-2 are long, the arm part 370-2 is a vacuum facility. is moved from the inside to the outside.
  • at least one of the two width adjusting units 340-1 and 340-2 may include a rail.
  • the arm part 370-2 may have a linear bar structure extending from an end of the first width adjusting part 340-1 in a direction perpendicular to the extending direction of the first width adjusting part 340-1.
  • the end of the arm portion 370-2 has a bent structure and includes a suction portion 360-2 capable of adsorbing the upper surface of the substrate 30.
  • a suction portion 360-2 is shown in FIG. 11 and A plurality of the same adsorption unit may be included.
  • FIG. 19 a linear motion of the substrate transfer unit 300-2 of FIG. 18 is shown.
  • both of the width control units 340-1 and 340-2 are lengthened, and at this time, the substrate 30 is discharged out of the vacuum facility from the original position shown at 30-1.
  • one of the two width adjusting units 340-1 and 340-2 has a short structure, it may be in a standby state without any operation in the vacuum facility, and the two width adjusting units 340-1 and 340-2 When all of them have a short structure, it may be time to perform an operation of adsorbing the substrate 30 .
  • the two width control units 340-1 and 340-2 may be in a standby state when both have a short structure, and may perform an adsorption operation when only one has a short structure.
  • the present invention relates to a display device.

Abstract

According to embodiments, vacuum equipment comprises: a lower chamber; an upper chamber which is coupled to the lower chamber to make a vacuum state; and a substrate transfer part which is at least partially disposed in the lower chamber and discharges a substrate out of the lower chamber, wherein the substrate transfer part comprises: a vacuum maintaining portion which is in close contact with the bottom surface of the lower chamber; a rotary portion which is connected to the vacuum maintaining portion and disposed within the lower chamber; a pair of width adjustment portions which are connected to the rotary portion; a pair of arm portions one of which is connected to one of the pair of width adjustment portions and the other of which is connected to the other of the pair of width adjustment portions; and a plurality of suction portions which are disposed at one end of the pair of arm portions.

Description

진공 설비vacuum equipment
본 개시는 기판 이송부를 포함하는 진공 설비에 관한 것으로서, 보다 구체적으로 완제품의 배출이 가능한 기판 이송부를 내부에 가지는 진공 설비에 관한 것이다.The present disclosure relates to a vacuum facility including a substrate transfer unit, and more particularly, to a vacuum facility having a substrate transfer unit capable of discharging finished products therein.
평판 표시 장치로서, 액정 표시 장치(liquid crystal display: LCD), 플라즈마 표시 장치(plasma display panel: PDP), 유기 발광 표시 장치(organic light emitting diode device: OLED device), 전계 효과 표시 장치(field effect display: FED), 전기 영동 표시 장치(electrophoretic display device) 등이 알려져 있다.As a flat panel display device, a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode device (OLED device), a field effect display : FED), an electrophoretic display device, and the like are known.
평판 표시 장치가 포함되는 다양한 전자 기기가 개발되면서, 평판 표시 장치가 형성되는 기판의 크기도 다양해지고 있다. 또한, 평판 표시 장치용 제조 설비에서 사용되는 기판은 복수의 평판 표시 장치용 기판을 합한 큰 사이즈의 모 기판을 사용하여 각 층을 형성하고 필름을 부착하는 등의 공정을 진행한다. 이와 같은 큰 사이즈의 기판은 이송시 주의가 필요하며, 기판의 제조시 공정 시간이 길어지는 단점이 있다.As various electronic devices including the flat panel display are developed, the size of a substrate on which the flat panel display is formed is also diversified. In addition, a substrate used in a manufacturing facility for a flat panel display uses a mother substrate of a large size combined with a plurality of substrates for a flat panel display, and processes such as forming each layer and attaching a film are performed. Such large-sized substrates require care during transfer, and there is a disadvantage in that processing time is prolonged during the manufacture of the substrate.
실시예들은 공정 시간을 단축할 수 있는 기판 이송부를 포함하는 진공 설비를 제공하기 위한 것이다. Embodiments are to provide a vacuum facility including a substrate transfer unit capable of reducing process time.
일 실시예에 따른 진공 설비는 하부 챔버; 상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및 상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, 상기 기판 이송부는 상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부; 상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 회전부; 상기 회전부와 연결되어 있는 한 쌍의 폭 조절부; 하나가 상기 한 쌍의 폭 조절부 중 하나와 연결되고, 다른 하나가 상기 한 쌍의 폭 조절부 중 다른 하나와 연결되어 있는 한 쌍의 암부; 및 상기 한 쌍의 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함한다.Vacuum equipment according to an embodiment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit includes a vacuum holding unit in close contact with a lower surface of the lower chamber; a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber; a pair of width control units connected to the rotating unit; a pair of arm parts, one of which is connected to one of the pair of width adjusting parts and the other of which is connected to the other of the pair of width adjusting parts; and a plurality of suction parts located at one end of the pair of arm parts.
상기 회전부는 상기 하부 챔버에 위치하는 하부 재료와 상기 상부 챔버에 위치하는 상부 재료가 합착된 상기 기판을 회전시켜 외부로 배출시킬 수 있다.The rotation unit rotates the substrate to which the lower material located in the lower chamber and the upper material located in the upper chamber are bonded together, and discharges the substrate to the outside.
상기 기판 이송부는 상기 진공 유지부의 내부에 위치하는 지지 기둥; 및 상기 지지 기둥의 끝에 연결되어 있으며, 상기 회전부를 지지하는 제1 몸체를 더 포함할 수 있다.The substrate transport unit includes a support column located inside the vacuum maintaining unit; And it is connected to the end of the support column, it may further include a first body for supporting the rotating part.
상기 기판 이송부는 상기 제1 몸체의 양끝에 각각 위치하여 상기 기판 이송부를 상하로 이동시키는 한 쌍의 상하 이동부를 더 포함할 수 있다.The substrate transfer unit may further include a pair of vertical movement units positioned at both ends of the first body to vertically move the substrate transfer unit.
상기 한 쌍의 암부는 각각 상기 한 쌍의 폭 조절부 중 해당하는 폭 조절부와 연결되어 있는 제1 연결부; 및 상기 복수의 흡착부와 체결되어 지지하는 흡착부 지지대를 포함할 수 있다.The pair of arm parts each include a first connection part connected to a corresponding width adjusting part among the pair of width adjusting parts; And it may include an adsorption unit support that is fastened to and supported by the plurality of adsorption units.
상기 한 쌍의 폭 조절부는 각각 선형 운동하는 실린더; 및 상기 실린더의 동작에 따라서 길이가 조절되며, 끝단이 원형 구조로 확장된 폭을 가지는 동작부를 포함할 수 있다.The pair of width adjusting units each include a cylinder for linear movement; and an operation unit whose length is adjusted according to the operation of the cylinder and whose end has a width extended in a circular structure.
상기 동작부는 상기 제1 연결부와 연결되어 있으며, 상기 동작부와 상기 제1 연결부의 사이에는 유격이 형성될 수 있다.The operating unit is connected to the first connection unit, and a gap may be formed between the operation unit and the first connection unit.
상기 유격은 0.1mm이상 0.3mm이하일 수 있다.The gap may be 0.1 mm or more and 0.3 mm or less.
상기 기판 이송부는 상기 회전부 및 상기 한 쌍의 폭 조절부의 사이에 위치하는 제2 몸체를 더 포함할 수 있다.The substrate transfer unit may further include a second body positioned between the rotating unit and the pair of width adjusting units.
상기 기판 이송부는 상기 제2 몸체의 위에는 위치하며 레일을 포함하는 가이드부를 더 포함할 수 있다.The substrate transfer unit may further include a guide unit positioned on the second body and including a rail.
상기 한 쌍의 암부는 각각 상기 가이드부에 연결되어 있는 제2 연결부를 더 포함할 수 있다.Each of the pair of arm parts may further include a second connection part connected to the guide part.
상기 기판 이송부 중 상기 회전부, 상기 한 쌍의 폭 조절부, 상기 한 쌍의 암부, 상기 복수의 흡착부, 상기 제1 몸체, 상기 제2 몸체, 상기 한 쌍의 상하 이동부 및 상기 가이드부는 상기 하부 챔버의 내에 위치할 수 있다.Among the substrate conveying parts, the rotating part, the pair of width adjusting parts, the pair of arm parts, the plurality of adsorption parts, the first body, the second body, the pair of vertical moving parts, and the guide part are the lower parts. It may be located within the chamber.
일 실시예에 따른 진공 설비는 하부 챔버; 상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및 상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, 상기 기판 이송부는 상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부; 상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 회전부; 상기 회전부와 연결되어 있으며, 꺾인 선형 구조를 가지는 암부; 및 상기 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함한다.Vacuum equipment according to an embodiment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit includes a vacuum holding unit in close contact with a lower surface of the lower chamber; a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber; an arm part connected to the rotating part and having a bent linear structure; and a plurality of adsorption parts positioned at one end of the arm part.
상기 암부는 꺾인 선형 바 구조를 가질 수 있다.The arm part may have a bent linear bar structure.
상기 기판 이송부는 상기 회전부와 상기 암부를 연결시키며, 상기 암부를 상하 선형 운동시키는 상하 이동부를 더 포함할 수 있다.The substrate transfer unit may further include a vertical movement unit that connects the rotation unit and the arm unit and vertically and linearly moves the arm unit.
상기 기판 이송부는 상기 진공 유지부의 내부에 위치하는 지지 기둥; 및 상기 지지 기둥의 끝에 연결되어 있으며, 상기 회전부를 지지하는 몸체를 더 포함할 수 있다.The substrate transport unit includes a support column located inside the vacuum maintaining unit; And it is connected to the end of the support column, it may further include a body supporting the rotating part.
상기 복수의 흡착부는 상기 하부 챔버에 위치하는 하부 재료와 상기 상부 챔버에 위치하는 상부 재료가 합착된 상기 기판의 중앙부를 흡착하며, 상기 기판 이송부는 흡착된 상기 기판을 회전시켜 외부로 배출시킬 수 있다.The plurality of adsorption units adsorb the central portion of the substrate where the lower material located in the lower chamber and the upper material located in the upper chamber are bonded, and the substrate transfer unit rotates the adsorbed substrate to discharge it to the outside. .
일 실시예에 따른 진공 설비는 하부 챔버; 상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및 상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, 상기 기판 이송부는 한 쌍의 선형 이송부를 가지며, 상기 한 쌍의 선형 이송부는 각각 상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부; 상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 몸체; 상기 몸체와 연결되어 있는 제1 폭 조절부 및 제2 폭 조절부; 상기 제1 폭 조절부의 끝에 연결되어 있는 암부; 및 상기 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함한다.Vacuum equipment according to an embodiment includes a lower chamber; an upper chamber combining with the lower chamber to create a vacuum state; and a substrate transfer unit located at least partially within the lower chamber and discharging a substrate out of the lower chamber, wherein the substrate transfer unit has a pair of linear transfer units, and each of the pair of linear transfer units has a lower surface of the lower chamber. a vacuum holding unit that is in close contact with; a body connected to the vacuum maintaining unit and positioned inside the lower chamber; a first width adjusting unit and a second width adjusting unit connected to the body; an arm portion connected to an end of the first width adjusting portion; and a plurality of adsorption parts positioned at one end of the arm part.
상기 한 쌍의 선형 이송부는 각각 상기 몸체에 연결되어 있으며, 상기 몸체를 상하로 이동시키는 한 쌍의 상하 이동부를 더 포함할 수 있다.The pair of linear transfer units may further include a pair of vertical moving units connected to the body and vertically moving the body.
상기 제1 폭 조절부 및 상기 제2 폭 조절부 중 적어도 하나는 실린더를 포함할 수 있다.At least one of the first width adjusting unit and the second width adjusting unit may include a cylinder.
실시예들에 따르면, 기판 이송부를 진공 설비의 내부에 형성하여 상부 재료와 하부 재료를 합착한 기판을 진공 설비가 열리면 빠르게 배출하고 이송할 수 있도록 하여 공정 시간을 단축할 수 있다. 또한, 합착한 기판을 빠르게 배출할 수 있어 후속하여 진공 설비로 상부 재료와 하부 재료가 빠르게 전달되어 전체적인 공정 시간을 단축할 수 있다.According to embodiments, the substrate transfer unit is formed inside the vacuum facility so that the substrate on which the upper material and the lower material are bonded can be rapidly discharged and transferred when the vacuum facility is opened, thereby shortening the process time. In addition, since the bonded substrate can be quickly discharged, the upper material and the lower material are quickly transferred to the vacuum facility, thereby reducing the overall process time.
도 1 및 도 2는 일 실시예에 따른 진공 설비의 개괄도이다.1 and 2 are schematic diagrams of a vacuum facility according to an embodiment.
도 3은 일 실시예에 따른 기판 이송부의 동작 설명도이다.3 is an operation explanatory diagram of a substrate transfer unit according to an exemplary embodiment.
도 4 및 도 5는 일 실시예에 따른 진공 설비에서 상부 재료 및 하부 재료를 각각 전달하는 전달부의 개괄도이다.4 and 5 are schematic diagrams of a delivery unit that respectively delivers an upper material and a lower material in a vacuum facility according to an embodiment.
도 6은 일 실시예에 따른 기판 이송부의 사시도이다.6 is a perspective view of a substrate transfer unit according to an embodiment.
도 7 내지 도 14는 도 6의 실시예에 따른 기판 이송부의 각 부분을 도시한 도면이다.7 to 14 are views showing each part of the substrate transfer unit according to the embodiment of FIG. 6 .
도 15는 도 6의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.15 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 6 .
도 16은 또 다른 실시예에 따른 기판 이송부의 사시도이다.16 is a perspective view of a substrate transfer unit according to another embodiment.
도 17은 도 16의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.17 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 16 .
도 18은 또 다른 실시예에 따른 기판 이송부의 사시도이다.18 is a perspective view of a substrate transfer unit according to another embodiment.
도 19은 도 18의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.19 is a diagram illustrating an operation of a substrate transfer unit according to the embodiment of FIG. 18 .
이하, 첨부한 도면을 참고로 하여 본 발명의 여러 실시예들에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예들에 한정되지 않는다.Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. This invention may be embodied in many different forms and is not limited to the embodiments set forth herein.
본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조 부호를 붙이도록 한다.In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.
또한, 도면에서 나타난 각 구성의 크기 및 두께는 설명의 편의를 위해 임의로 나타내었으므로, 본 발명이 반드시 도시된 바에 한정되지 않는다. 도면에서 여러 층 및 영역을 명확하게 표현하기 위하여 두께를 확대하여 나타내었다. 그리고 도면에서, 설명의 편의를 위해, 일부 층 및 영역의 두께를 과장되게 나타내었다.In addition, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, the present invention is not necessarily limited to the shown bar. In the drawings, the thickness is shown enlarged to clearly express the various layers and regions. And in the drawings, for convenience of explanation, the thicknesses of some layers and regions are exaggerated.
또한, 층, 막, 영역, 판 등의 부분이 다른 부분 "위에" 또는 "상에" 있다고 할 때, 이는 다른 부분 "바로 위에" 있는 경우뿐 아니라 그 중간에 또 다른 부분이 있는 경우도 포함한다. 반대로 어떤 부분이 다른 부분 "바로 위에" 있다고 할 때에는 중간에 다른 부분이 없는 것을 뜻한다. 또한, 기준이 되는 부분 "위에" 또는 "상에" 있다고 하는 것은 기준이 되는 부분의 위 또는 아래에 위치하는 것이고, 반드시 중력 반대 방향 쪽으로 "위에" 또는 "상에" 위치하는 것을 의미하는 것은 아니다.In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" or "on" another part, this includes not only the case where it is "directly on" the other part, but also the case where another part is in the middle. . Conversely, when a part is said to be "directly on" another part, it means that there is no other part in between. In addition, being "above" or "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "above" or "on" in the opposite direction of gravity. .
또한, 명세서 전체에서, 어떤 부분이 어떤 구성요소를 "포함" 한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.In addition, throughout the specification, when a certain component is said to "include", it means that it may further include other components without excluding other components unless otherwise stated.
또한, 명세서 전체에서, "평면상"이라 할 때, 이는 대상 부분을 위에서 보았을 때를 의미하며, "단면상"이라 할 때, 이는 대상 부분을 수직으로 자른 단면을 옆에서 보았을 때를 의미한다.In addition, throughout the specification, when it is referred to as "planar image", it means when the target part is viewed from above, and when it is referred to as "cross-sectional image", it means when a cross section of the target part cut vertically is viewed from the side.
이하에서는 도 1 내지 도 5를 통하여 전체적인 진공 설비에 대하여 살펴본다.Hereinafter, the overall vacuum equipment will be described through FIGS. 1 to 5.
도 1 및 도 2는 일 실시예에 따른 진공 설비의 개괄도이고, 도 3은 일 실시예에 따른 기판 이송부의 동작 설명도이고, 도 4 및 도 5는 일 실시예에 따른 진공 설비에서 상부 재료 및 하부 재료를 각각 전달하는 전달부의 개괄도이다.1 and 2 are schematic diagrams of a vacuum facility according to an embodiment, FIG. 3 is an operation explanatory diagram of a substrate transfer unit according to an embodiment, and FIGS. 4 and 5 are an upper material in a vacuum facility according to an embodiment. And it is a schematic diagram of the conveying part which respectively conveys the lower material.
일 실시예에 따른 진공 설비는 크게 하부 챔버(100)와 상부 챔버(200)를 포함한다.A vacuum facility according to an embodiment largely includes a lower chamber 100 and an upper chamber 200 .
하부 챔버(100)와 상부 챔버(200)가 결합하면 내부가 밀폐되고 공기를 빼내어 내부 진공 상태를 가지도록 한다. 진공 상태에서 진공 설비는 내부의 기판에 다양한 공정을 진행할 수 있다. 일 실시예에 따른 진공 설비에서는 상부 재료와 하부 재료를 합착하는 공정을 진행할 수 있다. 진공 설비에서 진행되는 공정은, 예를 들면, 트랜지스터, 커패시터 등이 형성되어 있는 기판의 일측면에 접착층을 형성하는 공정이나, 접착층이 부착된 기판에 윈도우를 부착하는 공정일 수 있다. 기판에 접착층을 형성하는 공정은 상부 재료로 기판이 유입될 수 있으며, 하부 재료로 접착층이 유입될 수 있다. 한편, 윈도우를 부착하는 공정의 경우 윈도우가 상부 재료로 유입되고, 접착층이 부착된 기판이 하부 재료로 유입될 수 있다. 상부 재료와 하부 재료를 합착하여 진공 설비 외로 배출하는 공정이 진행된 기판은 기판에 접착층을 형성하는 공정에서는 접착층이 부착된 기판일 수 있으며, 윈도우를 부착하는 공정에서는 윈도우가 부착된 기판일 수 있다.When the lower chamber 100 and the upper chamber 200 are combined, the inside is sealed and air is removed to have an internal vacuum state. In a vacuum state, the vacuum facility may perform various processes on the internal substrate. In a vacuum facility according to an embodiment, a process of bonding an upper material and a lower material may be performed. A process performed in a vacuum facility may be, for example, a process of forming an adhesive layer on one side of a substrate on which transistors, capacitors, etc. are formed, or a process of attaching a window to a substrate to which an adhesive layer is attached. In the process of forming the adhesive layer on the substrate, the substrate may flow into an upper material and the adhesive layer may flow into a lower material. Meanwhile, in the case of a process of attaching a window, the window may flow into the upper material, and the substrate to which the adhesive layer is attached may flow into the lower material. The substrate on which the process of bonding the upper material and the lower material and discharging them out of the vacuum facility has been performed may be a substrate with an adhesive layer attached in the process of forming an adhesive layer on the substrate, and a substrate with a window attached in the process of attaching a window.
도 1의 실시예에 따른 상부 챔버(200)는 창을 포함하여 내부의 진공 상태 및 공정 상태를 확인할 수 있도록 형성될 수 있다.The upper chamber 200 according to the embodiment of FIG. 1 may include a window so that an internal vacuum state and process state may be checked.
도 2를 참고하면, 상부 챔버(200)는 상부로 들어 올려질 수 있는 구조를 가지며, 상부로 열려 진공 상태가 깨어지고 내부의 기판(30)이 외부로 배출될 수 있는 상태가 된다. Referring to FIG. 2 , the upper chamber 200 has a structure that can be lifted upward, and is opened upward to break the vacuum state and the substrate 30 therein can be discharged to the outside.
진공 설비의 내에는 공정이 진행된 기판(30)을 배출하기 위한 기판 이송부(300)가 형성되어 있다. 보다 구체적으로 일 실시예에 따른 진공 설비의 하부 챔버(100)내에 기판 이송부(300)가 위치한다. A substrate transfer unit 300 for discharging the processed substrate 30 is formed in the vacuum facility. More specifically, the substrate transfer unit 300 is located in the lower chamber 100 of a vacuum facility according to an embodiment.
기판 이송부(300)는 진공 상태의 진공 설비 내에 위치하고 있어 진공 설비의 진공이 깨어지기 전 또는 진공이 깨어짐과 동시에 동작을 시작하여 기판(30)을 흡착하고 배출하는 동작을 진행할 수 있다. 이와 같이 미리 기판 이송부(300)를 통하여 공정이 진행된 기판(30)을 배출하기 시작할 수 있어 전체적인 공정 시간을 줄일 수 있다. 실시예에 따라서는 진공 상태가 깨어진 이후에 기판 이송부(300)가 동작을 시작하도록 세팅할 수도 있다.Since the substrate transfer unit 300 is located in a vacuum facility in a vacuum state, it starts to operate before or at the same time as the vacuum of the vacuum facility is broken, and adsorbs and discharges the substrate 30 . In this way, it is possible to start discharging the substrate 30 on which the process has been performed through the substrate transfer unit 300 in advance, thereby reducing the overall process time. Depending on the embodiment, the substrate transfer unit 300 may be set to start operating after the vacuum state is broken.
도 3을 참고하면, 일 실시예에 따른 기판 이송부(300)는 공정이 진행된 기판(30)을 흡착하는 방식으로 들어서 회전시켜 30-1로 도시된 원래의 위치에서 진공 설비 밖으로 배출한다. 기판 이송부(300)의 구조는 후술하는 도 6 내지 도 19를 통하여 살펴본다.Referring to FIG. 3 , the substrate transfer unit 300 according to an embodiment lifts and rotates the processed substrate 30 in a suction manner and discharges the substrate 30 from the original position 30-1 to the outside of the vacuum facility. The structure of the substrate transfer unit 300 will be reviewed through FIGS. 6 to 19 to be described later.
도 3과 같이 공정이 진행된 기판(30)이 배출된 진공 설비로는 도 4 및 도 5에서 도시하고 있는 바와 같이, 상부 재료 전달부(400) 및 하부 재료 전달부(500)가 각각 상부 재료(40) 및 하부 재료(50)를 진공 설비 내로 전달한다.As shown in FIG. 3, in the vacuum facility from which the processed substrate 30 is discharged, as shown in FIGS. 40) and the underlying material 50 into the vacuum facility.
도 4 및 도 5에서 도시하고 있는 바와 같이 상부 재료 전달부(400) 및 하부 재료 전달부(500)는 진공 설비의 외부에 위치한다. 상부 재료 전달부(400) 및 하부 재료 전달부(500)는 각각 레일(450)을 따라서 이동하여 진공 설비로 접근하는 구조를 가질 수 있다. As shown in FIGS. 4 and 5 , the upper material delivery unit 400 and the lower material delivery unit 500 are located outside the vacuum equipment. The upper material delivery unit 400 and the lower material delivery unit 500 may each move along the rail 450 to approach the vacuum facility.
상부 재료 전달부(400)는 상부 재료(40)를 상측에 위치시켜 레일(450)을 따라 진공 설비에 접근한 후 상부 챔버(200)를 향하여 상부 재료(40)를 밀어 올리는 방식으로 상부 챔버(200) 내에 상부 재료(40)를 제공할 수 있다.The upper material delivery unit 400 places the upper material 40 on the upper side, approaches the vacuum equipment along the rail 450, and then pushes the upper material 40 toward the upper chamber 200 to the upper chamber ( An upper material 40 may be provided in 200 .
하부 재료 전달부(500)는 하부 재료(50)를 하측에 위치시켜 레일(450)을 따라 진공 설비에 접근한 후 하부 챔버(100)를 향하여 하부 재료(50)를 밀어 내리는 방식으로 하부 챔버(100) 내에 하부 재료(50)를 제공할 수 있다.The lower material delivery unit 500 places the lower material 50 on the lower side, approaches the vacuum equipment along the rail 450, and pushes the lower material 50 toward the lower chamber 100 to lower the chamber ( A lower material 50 may be provided in 100 .
상부 재료 전달부(400) 및 하부 재료 전달부(500)에 의하여 상부 재료(40) 및 하부 재료(50)가 상부 챔버(200) 및 하부 챔버(100)로 전달되면 비전부(600)는 상부 재료(40) 및 하부 재료(50)의 위치를 정렬하여 최종적으로 기판(30)으로 합착시 오정렬이 발생되지 않도록 할 수 있다.When the upper material 40 and the lower material 50 are transferred to the upper chamber 200 and the lower chamber 100 by the upper material delivery unit 400 and the lower material delivery unit 500, the vision unit 600 By aligning the positions of the material 40 and the lower material 50, it is possible to prevent misalignment from occurring when they are finally bonded to the substrate 30.
도 1 내지 도 5는 진공 설비의 공정 순서에 기초하여 도면이 배열되어 있다. 즉, 도 1에서는 진공 설비의 하부 챔버(100) 및 상부 챔버(200)가 부착되어 내부가 진공 상태를 가져 상부 재료(40)와 하부 재료(50)를 진공 상태에서 합착하여 최종 완성되는 기판을 형성하는 공정이 진행되는 도면이다. 도 2는 상부 재료(40)와 하부 재료(50)가 합착된 기판(30)을 완성 한 후 하부 챔버(100)와 상부 챔버(200)가 분리되어 진공이 깨어진 상태를 도시한다. 도 3은 상부 재료(40)와 하부 재료(50)가 합착된 기판(30)을 기판 이송부(300)를 통하여 진공 설비 외로 배출하는 상태를 도시한다. 도 4 및 도 5는 다음 공정을 위하여 진공 설비의 하부 챔버(100) 및 상부 챔버(200)로 각각 하부 재료(50)와 상부 재료(40)를 제공하는 상태를 도시한다.Figures 1 to 5 are arranged based on the process sequence of the vacuum equipment. That is, in FIG. 1, the lower chamber 100 and the upper chamber 200 of the vacuum facility are attached so that the inside is in a vacuum state so that the upper material 40 and the lower material 50 are bonded in a vacuum state to form a final substrate. It is a drawing in which the forming process proceeds. 2 shows a state in which the vacuum is broken by separating the lower chamber 100 and the upper chamber 200 after completing the substrate 30 to which the upper material 40 and the lower material 50 are bonded. FIG. 3 shows a state in which the substrate 30 to which the upper material 40 and the lower material 50 are bonded is discharged out of the vacuum facility through the substrate transfer unit 300 . 4 and 5 show a state in which the lower material 50 and the upper material 40 are respectively provided to the lower chamber 100 and the upper chamber 200 of the vacuum equipment for the next process.
이상과 같은 진공 설비에서는 하부 재료(50)와 상부 재료(40)가 동시에 제공될 수 있어 공정 시간이 단축될 수 있다. 또한, 진공 설비 내에 위치하는 기판 이송부(300)에 의하여 공정이 완료된 기판(30)을 바로 진공 설비 외로 배출시킬 수 있어 다음 공정에서 사용될 하부 재료(50)와 상부 재료(40)가 빠르게 진공 설비로 제공될 수 있어 공정 시간이 단축될 수 있다.In the vacuum equipment as described above, the lower material 50 and the upper material 40 can be provided at the same time, so the process time can be shortened. In addition, the substrate 30 on which the process has been completed can be immediately discharged out of the vacuum facility by the substrate transfer unit 300 located in the vacuum facility, so that the lower material 50 and the upper material 40 to be used in the next process are quickly transported to the vacuum facility. process time can be shortened.
이하에서는 도 6 내지 도 19를 통하여 진공 설비 내에 위치하는 기판 이송부의 다양한 실시예 및 상세 구조 및 동작에 대하여 살펴본다.Hereinafter, various embodiments and detailed structures and operations of a substrate transfer unit located in a vacuum facility will be described through FIGS. 6 to 19 .
먼저, 도 6 내지 도 15를 통하여 도 2 및 도 3에 도시된 기판 이송부(300)의 구조 및 동작에 대하여 살펴본다.First, the structure and operation of the substrate transfer unit 300 shown in FIGS. 2 and 3 will be reviewed through FIGS. 6 to 15 .
도 6은 일 실시예에 따른 기판 이송부의 사시도이고, 도 7 내지 도 14는 도 6의 실시예에 따른 기판 이송부의 각 부분을 도시한 도면이고, 도 15는 도 6의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.6 is a perspective view of a substrate transfer unit according to an exemplary embodiment, FIGS. 7 to 14 are views illustrating each part of the substrate transfer unit according to the exemplary embodiment of FIG. 6 , and FIG. 15 is a substrate transfer unit according to the exemplary embodiment of FIG. 6 . It is a diagram showing the operation of
도 6을 통하여 일 실시예에 따른 기판 이송부(300)의 개략적인 구조를 살펴보면 다음과 같다.Looking at the schematic structure of the substrate transfer unit 300 according to an embodiment through Figure 6 is as follows.
일 실시예에 따른 기판 이송부(300)는 구동부(310), 상하 이동부(320), 회전부(330), 폭 조절부(340), 흡착부(360), 암부(370), 및 벨로우즈(380)를 포함할 수 있다.The substrate transfer unit 300 according to an embodiment includes a driving unit 310, a vertical moving unit 320, a rotating unit 330, a width adjusting unit 340, an adsorption unit 360, an arm unit 370, and a bellows 380. ) may be included.
구동부(310)는 기판 이송부(300)를 전체적으로 동작시킬 수 있으며, 기판 이송부(300)가 전체적으로 상하 이동하도록 구동시킬 수 있다. 구동부(310)는 기판 이송부(300)의 각 부분이 동작할 수 있도록 전원을 제공할 수 있다. 구동부(310)는 진공 설비의 외부에 위치하여 진공 내에 위치하지 않는다. 구동부(310)는 지지 기둥(311)을 통하여 제1 몸체(312)와 연결되어 있다. 여기서, 제1 몸체(312)는 진공 설비 내에 위치하며, 지지 기둥(311)의 적어도 일부는 진공 설비 내에 위치할 수 있다. 지지 기둥(311)의 상측 끝에는 제1 몸체(312)가 위치하고, 제1 몸체(312)는 수평으로 연장되어 있는 바 타입 구조를 가진다. 제1 몸체(312)의 양측 끝단에는 한 쌍의 상하 이동부(320)가 위치한다.The driving unit 310 may operate the substrate transfer unit 300 as a whole, and may drive the substrate transfer unit 300 to vertically move as a whole. The driving unit 310 may provide power so that each part of the substrate transfer unit 300 may operate. The drive unit 310 is located outside the vacuum facility and is not located within the vacuum. The driving unit 310 is connected to the first body 312 through a support pillar 311 . Here, the first body 312 is located in a vacuum facility, and at least a part of the support pillar 311 may be located in a vacuum facility. A first body 312 is positioned at an upper end of the support pillar 311, and the first body 312 has a bar-type structure extending horizontally. A pair of up and down moving parts 320 are positioned at both ends of the first body 312 .
한 쌍의 상하 이동부(320)는 상하 방향으로 제1 몸체(312)를 이동시킬 수 있도록 하는 모터를 포함하며, 모터의 동작에 의하여 레일과 같은 가이드를 따라 상하로 이동하는 부분을 포함할 수 있다. 한 쌍의 상하 이동부(320)는 하부 챔버(100)의 내부 바닥에 고정되어 하부 챔버(100)의 내부 바닥면에서부터 제1 몸체(312)의 높이를 변경시킬 수 있다. 한 쌍의 상하 이동부(320)가 상하로 이동할 때, 지지 기둥(311)도 함께 상하로 이동하여 제1 몸체(312)가 전체적으로 일정하게 높이가 변경될 수 있다.The pair of vertical moving parts 320 may include a motor that moves the first body 312 in the vertical direction, and may include a part that moves vertically along a guide such as a rail by the operation of the motor. there is. The pair of up and down moving parts 320 may be fixed to the inner bottom of the lower chamber 100 to change the height of the first body 312 from the inner bottom surface of the lower chamber 100 . When the pair of up and down moving parts 320 move up and down, the support pillar 311 also moves up and down together so that the overall height of the first body 312 can be constantly changed.
제1 몸체(312)의 위에는 회전부(330)가 위치하며, 회전부(330)의 위에는 제2 몸체(335)가 연결되어 있다. The rotating part 330 is positioned on the first body 312, and the second body 335 is connected to the rotating part 330.
회전부(330)는 제1 몸체(312)를 기준으로 상부에 위치하는 제2 몸체(335)를 회전시키는 역할을 하며 회전 동작을 수행하는 회전 실린더를 포함할 수 있다. 회전 실린더는 유압에 의하여 회전하거나 모터에 의하여 회전될 수 있다.The rotation unit 330 serves to rotate the second body 335 positioned above the first body 312 and may include a rotating cylinder that performs a rotational operation. The rotating cylinder may be rotated by hydraulic pressure or by a motor.
제2 몸체(335)는 제1 몸체(312)와 같이 수평으로 연장되어 있는 바 타입 구조를 가질 수 있다. 제2 몸체(335)의 상부면에는 한 쌍의 폭 조절부(340)와 가이드부(350)가 형성되어 있다. 한 쌍의 폭 조절부(340)와 가이드부(350)에는 한 쌍의 암부(370)가 고정되어 있다.The second body 335 may have a bar-type structure extending horizontally like the first body 312 . A pair of width adjusting parts 340 and a guide part 350 are formed on the upper surface of the second body 335 . A pair of arm parts 370 are fixed to the pair of width adjusting parts 340 and the guide part 350 .
한 쌍의 폭 조절부(340)는 선형 운동하는 실린더를 포함하며, 제2 몸체(335)의 길이 방향(이하 제1 방향이라고 함)을 따라서 배열되어 있다. 폭 조절부(340)는 실린더의 운동에 의하여 제2 몸체(335)의 길이 방향으로 길어지거나 짧아지도록 한다. 실시예에 따라서 폭 조절부(340)는 실린더 대신 모터에 의하여 선형 운동하는 구조를 가질 수 있어 폭 조절이 모터의 동작에 의하여 이루어 질 수도 있다. The pair of width control units 340 include cylinders that move linearly and are arranged along the longitudinal direction of the second body 335 (hereinafter referred to as the first direction). The width adjusting unit 340 lengthens or shortens the second body 335 in the longitudinal direction by the movement of the cylinder. Depending on the embodiment, the width adjusting unit 340 may have a structure in which a linear movement is performed by a motor instead of a cylinder, so that the width adjustment may be performed by the operation of the motor.
가이드부(350)는 제2 몸체(335)의 길이 방향을 따라서 레일과 같은 가이드가 배열되어 있다.In the guide unit 350 , guides such as rails are arranged along the longitudinal direction of the second body 335 .
한 쌍의 폭 조절부(340)와 가이드부(350)에 고정되어 있는 한 쌍의 암부(370)는 폭 조절부(340)에 고정되는 제1 연결부(371), 가이드부(350)에 따라서 움직이는 제2 연결부(372), 및 기판(30)을 흡착할 수 있는 흡착부(360)가 위치하는 흡착부 지지대(373)를 포함한다. The pair of arm parts 370 fixed to the pair of width adjusting parts 340 and the guide part 350 are connected according to the first connection part 371 fixed to the width adjusting part 340 and the guide part 350. It includes a moving second connection part 372 and an adsorption part support 373 on which an adsorption part 360 capable of adsorbing the substrate 30 is located.
제1 연결부(371)는 폭 조절부(340)의 실린더의 끝 부분과 연결되어 실린더가 선형 운동을 할 때, 따라서 함께 움직이는 구조를 가진다. 실시예에 따라서는 도 12에서 도시하고 있는 바와 같이, 폭 조절부(340)의 실린더 끝 부분이 원형 구조를 가지고, 제1 연결부(371)가 해당 원형 구조를 유격(0.2mm 정도의 유격)을 두고 둘러 싸는 구조로 형성되어 움직이는데 제한이 없도록 형성될 수 있다. The first connection part 371 is connected to the end of the cylinder of the width adjusting part 340 and has a structure in which the cylinder moves along with it when the cylinder makes a linear motion. Depending on the embodiment, as shown in FIG. 12, the end of the cylinder of the width adjusting part 340 has a circular structure, and the first connection part 371 provides a gap (a gap of about 0.2 mm) to the circular structure. It is formed in a structure that encloses and can be formed so that there is no restriction on movement.
제2 연결부(372)는 가이드부(350)를 따라서 선형 이동할 수 있는 구조를 가지며, 가이드부(350)의 레일 구조에 대응하는 홈을 가져 레일을 따라 이동하는 구조를 가진다. 제2 연결부(372)는 제1 연결부(371)와 연결되어 제1 연결부(371)가 폭 조절부(340)의 실린더의 선형 운동에 따라서 이동할 때 같이 움직인다.The second connection part 372 has a structure capable of linear movement along the guide part 350 and has a structure that moves along the rail by having a groove corresponding to the rail structure of the guide part 350 . The second connection part 372 is connected to the first connection part 371 and moves together when the first connection part 371 moves according to the linear motion of the cylinder of the width adjusting part 340 .
흡착부 지지대(373)는 제2 몸체(335)의 길이 방향에 수직하는 방향(이하 제2 방향이라고도 함)으로 길게 연장되어 있으며, 일정 간격으로 복수의 흡착부(360)가 위치한다. 흡착부 지지대(373)는 제1 연결부(371) 및 제2 연결부(372)와 연결되어 있어 제1 연결부(371)가 폭 조절부(340)의 실린더의 선형 운동에 따라서 이동할 때 같이 움직인다. 이와 같이, 한 쌍의 폭 조절부(340)가 선형 운동하면 한 쌍의 암부(370)도 같이 움직여 기판(30)의 제2 방향의 폭에 맞추어 암부(370)에 위치하는 흡착부(360)의 위치를 이동시킬 수 있다. The suction part support 373 extends long in a direction perpendicular to the longitudinal direction of the second body 335 (hereinafter referred to as a second direction), and a plurality of suction parts 360 are positioned at regular intervals. The suction part support 373 is connected to the first connection part 371 and the second connection part 372, so that when the first connection part 371 moves according to the linear movement of the cylinder of the width adjusting part 340, it moves together. In this way, when the pair of width control units 340 are linearly moved, the pair of arm units 370 also move, and the adsorption unit 360 positioned on the arm unit 370 according to the width of the substrate 30 in the second direction position can be moved.
흡착부(360)는 아랫 방향으로 배열된 흡착구를 가져 아랫 방향에 위치하는 기판(30)을 흡착할 수 있다. 도 6에서는 일측에 3개의 흡착부(360)가 형성되어 있으며, 흡착되는 기판(30)의 크기에 따라서 다양한 개수를 포함시킬 수 있다.The adsorbing unit 360 may adsorb the substrate 30 located in the downward direction by having suction holes arranged in a downward direction. In FIG. 6 , three adsorption units 360 are formed on one side, and various numbers may be included according to the size of the substrate 30 to be adsorbed.
벨로우즈(380)는 벨로우즈 밸브 또는 진공 유지부라고도 하며, 밀봉 성능이 뛰어나 기판 이송부(300)의 일부가 진공 설비 외에 위치하더라도 진공 설비의 진공이 유지될 수 있도록 한다. 벨로우즈(380)는 이중 밀봉 구조를 가질 수 있다.The bellows 380 is also called a bellows valve or a vacuum retainer, and has excellent sealing performance so that the vacuum of the vacuum equipment can be maintained even if a part of the substrate transfer unit 300 is located outside the vacuum equipment. The bellows 380 may have a double sealing structure.
벨로우즈(380)는 구동부(310)의 일측에 위치하며, 벨로우즈(380)의 내부에는 지지 기둥(311)이 위치하며, 지지 기둥(311)도 상하 이동부(320)의 동작에 따라서 함께 상하로 이동할 수 있는 구조를 가질 수 있다. 이 때, 지지 기둥(311)의 동작은 구동부(310)에 의하여 상하로 선형 이동하도록 구성될 수 있다.The bellows 380 is located on one side of the drive unit 310, and a support pillar 311 is located inside the bellows 380, and the support pillar 311 also moves up and down together according to the operation of the up and down movement unit 320. It can have a movable structure. At this time, the operation of the support pillar 311 may be configured to linearly move up and down by the driving unit 310 .
이하에서는 도 7 내지 도 14를 통하여 각 부분의 구조를 상세하게 살펴본다.Hereinafter, the structure of each part will be examined in detail through FIGS. 7 to 14 .
도 7을 참고하면, 상하 이동부(320)의 구조가 확대 도시되어 있다.Referring to FIG. 7 , the structure of the vertical moving unit 320 is shown enlarged.
상하 이동부(320)는 레일을 포함하며, 하부 챔버(100)의 바닥에 고정되어 있는 지지부(322)와 제1 몸체(312)와 연결되어 레일을 따라서 제1 몸체(312)를 상하로 이동시킬 수 있는 선형 모터부(321)를 포함할 수 있다. 선형 모터부(321)의 동작에 따라서 제1 몸체(312)와 제1 몸체(312)에 연결되어 있는 다른 부분(회전부(330), 제2 몸체(335), 폭 조절부(340), 가이드부(350), 암부(370), 흡착부(360) 등)도 함께 상하로 이동된다. 실시예에 따라서 상하 이동부(320)의 동작은 모터로 동작하지 않고 유압에 의하여 동작할 수도 있다.The vertical movement unit 320 includes a rail, and is connected to the support unit 322 fixed to the bottom of the lower chamber 100 and the first body 312 to move the first body 312 up and down along the rail. It may include a linear motor unit 321 that can be. According to the operation of the linear motor unit 321, the first body 312 and other parts connected to the first body 312 (rotator 330, second body 335, width adjusting unit 340, guide The part 350, the arm part 370, the suction part 360, etc.) are also moved up and down together. Depending on the embodiment, the operation of the vertical moving unit 320 may be operated by hydraulic pressure instead of by a motor.
도 8을 참고하면, 회전부(330)의 구조가 확대 도시되어 있다.Referring to FIG. 8 , the structure of the rotation unit 330 is shown enlarged.
회전부(330)는 제1 몸체(312)에 연결되어 있는 지지부(332)와 제2 몸체(335)에 연결되어 제2 몸체(335)를 회전시키는 회전 실린더(331)를 포함할 수 있다. 도 8에서 지지부(332)에서 돌출되어 있는 부분은 회전 실린더(331)의 회전 동작을 제어하기 위하여 외부의 입력을 받는 부분일 수 있다. 회전 실린더(331)의 동작은 모터나 유압에 의하여 동작할 수 있다.The rotation unit 330 may include a support unit 332 connected to the first body 312 and a rotation cylinder 331 connected to the second body 335 to rotate the second body 335 . In FIG. 8 , the part protruding from the support part 332 may be a part that receives an external input to control the rotational motion of the rotating cylinder 331 . The operation of the rotating cylinder 331 may be operated by a motor or hydraulic pressure.
도 9를 참고하면, 폭 조절부(340)의 구조 및 동작이 확대 도시되어 있다.Referring to FIG. 9 , the structure and operation of the width adjusting unit 340 are shown enlarged.
폭 조절부(340)는 선형 운동하는 실린더(341)와 실린더(341)의 동작에 따라서 길이가 조절되는 동작부(342)를 포함한다. 동작부(342)의 끝단은 원형 구조를 가지며, 폭이 확장되어 있다. 도 9(A)와 도 9(B)를 참고하면, 실린더(341)는 제2 몸체(335)에 고정되어 있으며, 실린더(341)의 동작시 실린더(341)는 움직이지 않으며, 동작부(342)가 실린더(341)로부터 제1 방향으로 돌출되는 길이가 조절된다. 동작부(342)의 돌출되는 길이가 조절되어 암부(370) 및 흡착부(360)의 위치가 조절된다. 실린더(341)의 동작은 모터나 유압에 의하여 동작할 수 있다.The width adjusting unit 340 includes a cylinder 341 that moves linearly and an operating unit 342 whose length is adjusted according to the operation of the cylinder 341 . The end of the operating unit 342 has a circular structure and has an extended width. 9(A) and 9(B), the cylinder 341 is fixed to the second body 335, the cylinder 341 does not move during operation of the cylinder 341, and the operating unit ( 342 protrudes from the cylinder 341 in the first direction is adjusted. The protruding length of the operation unit 342 is adjusted so that the positions of the arm unit 370 and the adsorption unit 360 are adjusted. The operation of the cylinder 341 may be operated by a motor or hydraulic pressure.
도 10을 참고하면, 가이드부(350)의 구조 및 동작이 확대 도시되어 있다.Referring to FIG. 10 , the structure and operation of the guide unit 350 are shown enlarged.
가이드부(350)는 제2 몸체(335)의 길이 방향(제1 방향)을 따라서 배열된 레일(351)과 레일(351)을 따라서 이동하는 복수의 이동부(352)를 포함한다. 레일(351)은 제2 몸체(335)에 고정되어 있으며, 복수의 이동부(352)는 두 그룹으로 분리되어 각각 한 쌍의 제2 연결부(372)와 연결되어 제2 연결부(372)가 레일(351)을 따라서 선형 이동하도록 한다. 제2 연결부(372)는 제1 연결부(371)와 연결되어 제1 연결부(371)의 선형 운동시 함께 선형 운동하도록 형성되어 있다.The guide part 350 includes a rail 351 arranged along the longitudinal direction (first direction) of the second body 335 and a plurality of moving parts 352 moving along the rail 351 . The rail 351 is fixed to the second body 335, and the plurality of moving parts 352 are separated into two groups and connected to a pair of second connection parts 372, so that the second connection parts 372 are connected to the rails. Let it move linearly along (351). The second connection part 372 is connected to the first connection part 371 and is formed to linearly move along with the linear motion of the first connection part 371 .
도 11을 참고하면, 흡착부(360)의 구조가 확대 도시되어 있다.Referring to FIG. 11 , the structure of the adsorption unit 360 is shown enlarged.
흡착부(360)는 아랫 방향으로 배열된 흡착구(362)와 흡착구(362)에서 공기를 흡입하며, 흡착구(362)를 고정시키는 몸체(361)를 포함한다. 도 11에서 몸체(361)에서 공기를 빼내어 흡착구(362)에 진공을 형성하여 하부에 위치하는 기판(30)의 상부면을 흡착 고정시킬 수 있다.The adsorption unit 360 includes suction ports 362 arranged in a downward direction and a body 361 that sucks air from the suction ports 362 and fixes the suction ports 362 . In FIG. 11 , air may be removed from the body 361 to form a vacuum in the suction hole 362 to adsorb and fix the upper surface of the substrate 30 positioned below.
도 12를 참고하면, 제1 연결부(371)와 폭 조절부(340) 중 동작부(342)의 끝단이 연결되는 구조가 확대 도시되어 있으며, 도 12에서는 단면이 도시되어 있다.Referring to FIG. 12 , a structure in which the end of the operation unit 342 is connected between the first connection unit 371 and the width adjusting unit 340 is shown enlarged, and a cross section is shown in FIG. 12 .
폭 조절부(340) 중 동작부(342)의 끝단은 원형 구조를 가지며, 제1 연결부(371)는 원형 구조에 대응하는 홈이 형성되어 있다. 제1 연결부(371)의 홈과 폭 조절부(340) 중 동작부(342)의 끝단 사이에는 유격(g)이 형성되며, 일 실시예에서 유격(g)은 0.2mm일 수 있다. 실시예에 따라서는 0.1mm이상 0.3mm이하의 유격을 가질 수 있다. 이와 같은 구조에 의하면, 동작부(342)의 끝단이 제1 연결부(371)의 홈 내에서 마찰 없이 회전할 수 있어 폭 조절부(340)의 선형 운동이 손실 없이 제1 연결부(371)로 전달될 수 있다.An end of the operation unit 342 of the width adjusting unit 340 has a circular structure, and the first connection unit 371 has a groove corresponding to the circular structure. A gap g is formed between the groove of the first connection part 371 and the end of the operation part 342 of the width adjusting part 340, and in one embodiment, the gap g may be 0.2 mm. Depending on the embodiment, it may have a clearance of 0.1 mm or more and 0.3 mm or less. According to this structure, the end of the operating unit 342 can rotate without friction within the groove of the first connection unit 371, so that the linear motion of the width adjusting unit 340 is transferred to the first connection unit 371 without loss. It can be.
도 13을 참고하면, 암부(370) 중 흡착부 지지대(373) 및 제2 연결부(372)의 일부가 확대 도시되어 있다.Referring to FIG. 13 , parts of the suction part support 373 and the second connection part 372 of the arm part 370 are enlarged.
제2 연결부(372)는 홈(374)을 가져 흡착부 지지대(373)와 고정되는 구조를 가진다. 제2 연결부(372)의 홈(374)은 제1 방향으로 길게 형성되어 있다. The second connection part 372 has a structure fixed to the suction part support 373 by having a groove 374 . The groove 374 of the second connection part 372 is formed long in the first direction.
흡착부 지지대(373)는 홈(375)을 가져 한 쌍의 흡착부(360)가 고정될 수 있도록 하는 구조를 가진다. 홈(375)은 흡착부 지지대(373)의 길이 방향(제2 방향)으로 길게 형성되어 한 쌍의 흡착부(360)가 제2 방향으로 다른 위치에 고정될 수도 있도록 한다.The suction unit support 373 has a groove 375 so that a pair of suction units 360 can be fixed. The groove 375 is formed long in the longitudinal direction (second direction) of the suction part support 373 so that the pair of suction parts 360 may be fixed at different positions in the second direction.
제2 연결부(372)에서 제2 방향으로 흡착부 지지대(373)의 반대측에는 제1 연결부(371)가 위치한다.The first connection part 371 is located on the opposite side of the suction part support 373 in the second direction from the second connection part 372 .
도 14를 참고하면, 벨로우즈(380) 및 하부 챔버(100)의 구조를 중심으로 기판 이송부(300)의 전체 구조가 도시되어 있다.Referring to FIG. 14 , the entire structure of the substrate transfer unit 300 is illustrated centering on the structures of the bellows 380 and the lower chamber 100 .
벨로우즈(380)는 하부 챔버(100)의 하부면과 밀착되어 진공 설비가 진공이 유지될 수 있도록 한다. 또한, 하부 챔버(100)는 벨로우즈(380)의 내측에 위치하는 지지 기둥(311)에 대응하는 부분에 홀이 위치하여 기판 이송부(300) 중 일부 구조가 진공 내에 위치하도록 한다. 기판 이송부(300) 중 벨로우즈(380) 및 구동부(310)는 진공의 외부에 위치하며, 진공 내에 위치하는 부분은 상하 이동부(320), 회전부(330), 폭 조절부(340), 흡착부(360), 암부(370), 지지 기둥(311), 제1 몸체(312), 및 제2 몸체(335)일 수 있다.The bellows 380 is in close contact with the lower surface of the lower chamber 100 so that the vacuum equipment can maintain a vacuum. In addition, the lower chamber 100 has a hole located at a portion corresponding to the support pillar 311 located inside the bellows 380 so that some structures of the substrate transfer unit 300 are positioned in a vacuum. Among the substrate conveying unit 300, the bellows 380 and the driving unit 310 are located outside the vacuum, and the parts located inside the vacuum include the vertical moving unit 320, the rotating unit 330, the width adjusting unit 340, and the adsorption unit. 360 , arm 370 , support pillar 311 , first body 312 , and second body 335 .
도 15에서는 도 6의 기판 이송부(300)의 동작을 도시되어 있다.15 shows the operation of the substrate transfer unit 300 of FIG. 6 .
도 15(A) 및 도 15(B)는 한 쌍의 암부(370)가 기판(30)의 크기에 맞도록 선형 이동하는 것을 도시하며, 도 15(C) 및 도 15(D)는 암부(370)가 상하로 이동하여 기판(30)의 상부면에 흡착부(360)가 흡착되는 과정을 도시한 도면이며, 도 15(E)는 회전부(330)가 회전하여 흡착된 기판(30)을 진공 설비 밖으로 배출하는 과정을 도시한 도면이다 15(A) and 15(B) show that the pair of arm parts 370 linearly move to fit the size of the substrate 30, and FIGS. 15(C) and 15(D) show the arm parts ( 370) is a view showing a process in which the adsorption unit 360 is adsorbed to the upper surface of the substrate 30 by moving up and down, and FIG. It is a drawing showing the process of discharging to the outside of the vacuum facility.
도 15(A) 및 도 15(B)에서 한 쌍의 암부(370)의 선형 이동은 폭 조절부(340)의 선형 동작에 의한 것이다. 도 15(C) 및 도 15(D)에서 도시된 암부(370)의 상하 이동은 상하 이동부(320)의 상하 동작에 의하여 상하 이동부(320) 및 지지 기둥(311)이 상하로 이동하면서 수행된다. In FIGS. 15(A) and 15(B), the linear movement of the pair of arm parts 370 is due to the linear motion of the width adjusting part 340. The vertical movement of the arm part 370 shown in FIGS. 15(C) and 15(D) is performed while the vertical moving part 320 and the support pillar 311 move up and down by the vertical movement of the up and down moving part 320. is carried out
도 15에서 도 15(B)와 도 15(C)는 동일한 타이밍의 사시도 및 측면도일 수 있으며, 기판 이송부(300)의 동작은 도 15(A)의 단계에서 도 15(B)와 도 15(C)의 단계를 거친 후, 도 15(D)의 단계를 통하여 기판(30)을 흡착하고, 도 15(E)와 같이 30-1로 도시된 원래의 위치에서 회전하여 기판(30)이 진공 설비 밖으로 배출된다.In FIG. 15, FIG. 15(B) and FIG. 15(C) may be a perspective view and a side view at the same timing, and the operation of the substrate transfer unit 300 is shown in FIG. 15(B) and FIG. 15(A) in FIG. After going through the step C), the substrate 30 is adsorbed through the step of FIG. 15(D), and rotated in the original position shown at 30-1 as shown in FIG. 15(E) so that the substrate 30 is vacuumed. discharged out of the facility.
이하에서는 도 16 내지 도 19를 통하여 또 다른 실시예에 따른 기판 이송부의 구조 및 동작에 대하여 살펴보며, 먼저, 도 16 및 도 17을 통하여 또 다른 실시예에 따른 기판 이송부(300-1)의 구조 및 동작을 살펴본다.Hereinafter, the structure and operation of the substrate transfer unit according to another embodiment will be described through FIGS. 16 to 19, and first, the structure of the substrate transfer unit 300-1 according to another embodiment through FIGS. 16 and 17 and look at the operation.
도 16은 또 다른 실시예에 따른 기판 이송부의 사시도이고, 도 17은 도 16의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.16 is a perspective view of a substrate transfer unit according to another embodiment, and FIG. 17 is a view illustrating an operation of the substrate transfer unit according to the embodiment of FIG. 16 .
도 16을 통하여 또 다른 실시예에 따른 기판 이송부(300-1)의 개략적인 구조를 살펴보면 다음과 같다.Referring to FIG. 16, a schematic structure of a substrate transfer unit 300-1 according to another embodiment is as follows.
또 다른 실시예에 따른 기판 이송부(300-1)는 몸체(310-1), 회전부(330-1), 상하 이동부(320-1), 흡착부(360-1) 및 암부(370-1)를 포함하며, 도 16에서는 도 6과 차이가 있는 부분만 도시하여 벨로우즈(380) 및 지지 기둥(311)은 도시하지 않았다. 즉, 도 16에서는 도시하고 있지 않지만, 기판 이송부(300-1)는 도 6에서와 같이 벨로우즈(380) 및 벨로우즈(380)의 내측에 위치하는 지지 기둥(311)을 통하여 몸체(310-1)와 연결되어 있으며, 실시예에 따라서는 구동부(310)를 더 포함할 수 있다. 도 16의 기판 이송부(300-1)도 진공 설비내에 위치하는 부분을 가지며, 도 16에서 도시된 부분은 모두 진공 설비, 즉 하부 챔버(100)내에 위치할 수 있다.A substrate transfer unit 300-1 according to another embodiment includes a body 310-1, a rotation unit 330-1, a vertical movement unit 320-1, an adsorption unit 360-1, and an arm unit 370-1. ), and in FIG. 16, only the parts different from those of FIG. 6 are shown, so the bellows 380 and the support pillar 311 are not shown. That is, although not shown in FIG. 16, the substrate transfer unit 300-1 moves along the body 310-1 through the bellows 380 and the support pillar 311 located inside the bellows 380, as shown in FIG. It is connected to, and may further include a driving unit 310 according to the embodiment. The substrate transfer unit 300-1 of FIG. 16 also has a portion located in a vacuum facility, and all of the portions shown in FIG. 16 may be located in a vacuum facility, that is, the lower chamber 100.
도 16의 기판 이송부(300-1) 중 도 6과 차이가 있는 부분만 살펴보면 아래와 같다.Among the substrate transfer unit 300-1 of FIG. 16, only the parts that are different from those of FIG. 6 are as follows.
몸체(310-1)는 회전부(330-1)와 그 하부에 위치하는 지지 기둥(311)을 연결하는 부분으로 진공 설비 내에 위치한다. The body 310-1 is a part that connects the rotating part 330-1 and the support pillar 311 located below it, and is located in the vacuum equipment.
회전부(330-1)는 몸체(310-1)를 기준으로 상부에 위치하는 상하 이동부(320-1), 암부(370-1) 및 흡착부(360-1)를 회전시키는 역할을 하며, 회전 동작을 수행하는 회전 실린더를 포함할 수 있다. 회전 실린더는 유압에 의하여 회전하거나 모터에 의하여 회전될 수 있다.The rotating part 330-1 serves to rotate the up-and-down moving part 320-1, the arm part 370-1, and the suction part 360-1 located at the upper part with respect to the body 310-1, It may include a rotating cylinder that performs a rotating operation. The rotating cylinder may be rotated by hydraulic pressure or by a motor.
회전부(330-1)의 일측에 위치하는 상하 이동부(320-1)는 이에 연결되어 있는 암부(370-1) 및 흡착부(360-1)를 상하 이동할 수 있도록 한다. 그 결과 흡착부(360-1)가 기판(30)의 위에서 아래로 이동하여 기판의 상부면과 흡착될 수 있도록 한다. 상하 이동부(320-1)는 상하 방향으로 이동시킬 수 있도록 하는 모터를 포함하며, 모터의 동작에 의하여 레일과 같은 가이드를 따라 상하로 이동하는 부분을 포함할 수 있다. The vertical movement unit 320-1 located on one side of the rotation unit 330-1 allows the arm unit 370-1 and the adsorption unit 360-1 connected thereto to move up and down. As a result, the adsorption unit 360 - 1 moves downward from the top of the substrate 30 to be adsorbed to the upper surface of the substrate 30 . The vertical moving unit 320-1 includes a motor capable of moving in the vertical direction, and may include a part that moves vertically along a guide such as a rail by operation of the motor.
암부(370-1)는 상하 이동부(320-1)에 연장되며 꺾인 선형 바 구조를 가질 수 있다.The arm part 370-1 extends to the vertical moving part 320-1 and may have a bent linear bar structure.
암부(370-1)의 끝에는 기판(30)의 상부면을 흡착할 수 있는 흡착부(360-1)를 포함하며, 하나의 흡착부(360-1)는 도 11과 같은 흡착부를 복수개 포함할 수 있다.An end of the arm 370-1 includes an adsorption unit 360-1 capable of adsorbing the upper surface of the substrate 30, and one adsorption unit 360-1 may include a plurality of adsorption units as shown in FIG. 11. can
도 17에서는 도 16의 기판 이송부(300-1)의 동작을 도시되어 있다.In FIG. 17, the operation of the substrate transfer unit 300-1 of FIG. 16 is shown.
도 17(A) 및 도 17(B)는 하나의 암부(370-1)가 기판(30)의 끝에 위치하다가 회전부(330-1)가 회전하여 기판(30)의 중앙에 흡착부(360-1)가 위치하도록 회전하는 것을 도시한 도면이고, 도 17(C)는 암부(370-1)가 상하 이동부(320-1)에 의하여 상하로 이동하여 기판(30)의 상부면 중앙에 흡착부(360-1)가 흡착되는 과정을 도시한 도면이며, 도 17(D)는 회전부(330-1)가 도 17(A) 및 도 17(B)와 반대 방향으로 회전하여 흡착된 기판(30)을 진공 설비 밖으로 배출하는 과정을 도시한 도면이다.17(A) and 17(B) show that one arm part 370-1 is positioned at the end of the substrate 30, and then the rotating part 330-1 rotates to form a suction part 360-1 in the center of the substrate 30. 1) is rotated to position, and FIG. 17(C) shows that the arm part 370-1 is moved up and down by the up-and-down moving part 320-1 and is adsorbed to the center of the upper surface of the substrate 30. 17(D) is a diagram showing a process in which the unit 360-1 is adsorbed, and in FIG. 17(D), the rotating unit 330-1 rotates in the opposite direction to FIGS. 30) is a diagram showing the process of discharging the vacuum equipment.
도 16의 실시예에 따른 기판 이송부(300-1)는 하나의 암부(370-1)만을 가지므로 기판(30)의 변쪽을 흡착하지 않고 중앙부를 흡착하는 구조를 가진다.Since the substrate transfer part 300-1 according to the embodiment of FIG. 16 has only one arm part 370-1, it has a structure in which the center part of the substrate 30 is not attached to the sides of the substrate 30.
도 17에서 기판 이송부(300-1)의 동작은 도 17(A)의 단계에서 도 17(B)의 단계와 같이 기판(30)의 중앙부로 회전한 후, 도 17(C)의 단계를 통하여 기판(30)을 흡착하고, 도 17(D)의 단계와 같이 30-1로 도시된 원래의 위치에서 회전하여 기판(30)이 진공 설비 밖으로 배출된다. In FIG. 17, the substrate transfer unit 300-1 rotates from the step of FIG. 17(A) to the center of the substrate 30 as in the step of FIG. 17(B), and then through the step of FIG. 17(C). The substrate 30 is adsorbed and rotated in the original position shown at 30-1 as in the step of FIG. 17(D), and the substrate 30 is discharged out of the vacuum equipment.
이하에서는 도 18 및 도 19를 통하여 또 다른 실시예에 따른 기판 이송부(300-2)의 구조 및 동작을 살펴본다.Hereinafter, the structure and operation of the substrate transfer unit 300-2 according to another embodiment will be reviewed through FIGS. 18 and 19.
도 18은 또 다른 실시예에 따른 기판 이송부의 사시도이고, 도 19은 도 18의 실시예에 따른 기판 이송부의 동작을 도시한 도면이다.18 is a perspective view of a substrate transfer unit according to another embodiment, and FIG. 19 is a view illustrating an operation of the substrate transfer unit according to the embodiment of FIG. 18 .
도 18을 통하여 또 다른 실시예에 따른 기판 이송부(300-2)의 개략적인 구조는 이상의 기판 이송부(300, 300-1)와 달리 선형 운동만을 이용하여 기판(30)을 진공 설비 외부로 배출하는 실시예를 도시하고 있다. 도 18의 실시예에 따른 기판 이송부(300-2)를 살펴보면 다음과 같다.18, the schematic structure of the substrate transfer unit 300-2 according to another embodiment is different from the above substrate transfer units 300 and 300-1, which discharges the substrate 30 to the outside of the vacuum facility using only linear motion. An example is shown. Looking at the substrate transfer unit 300-2 according to the embodiment of FIG. 18, it is as follows.
또 다른 실시예에 따른 기판 이송부(300-2)는 한 쌍의 선형 이송부로 구성되며, 각 선형 이송부는 몸체(310-2), 폭 조절부(340-1, 340-2), 상하 이동부(320-2), 흡착부(360-2) 및 암부(370-2)를 포함한다. 또한, 도 18에서는 도 16에서와 같이, 도 6과 차이가 있는 부분만 도시하여 벨로우즈(380) 및 지지 기둥(311)은 도시하지 않았다. 즉, 도 18에서는 도시하고 있지 않지만, 한 쌍의 선형 이송부는 각각 도 6에서와 같이 벨로우즈(380) 및 벨로우즈(380)의 내측에 위치하는 지지 기둥(311)을 통하여 몸체(310-1)와 연결되어 있으며, 실시예에 따라서는 구동부(310)를 더 포함할 수 있다. 도 18의 기판 이송부(300-2)도 진공 설비내에 위치하는 부분을 가지며, 도 18에서 도시된 부분은 모두 진공 설비, 즉 하부 챔버(100)내에 위치할 수 있다.The substrate transfer unit 300-2 according to another embodiment is composed of a pair of linear transfer units, and each linear transfer unit includes a body 310-2, width adjusting units 340-1 and 340-2, and a vertical moving unit. (320-2), an adsorption part 360-2 and an arm part 370-2. In addition, in FIG. 18, as in FIG. 16, only parts different from those in FIG. 6 are shown, and thus the bellows 380 and the support pillar 311 are not shown. That is, although not shown in FIG. 18, the pair of linear conveyors are connected to the body 310-1 through the bellows 380 and the support pillar 311 located inside the bellows 380, as shown in FIG. 6, respectively. It is connected, and may further include a driving unit 310 according to embodiments. The substrate transfer unit 300-2 of FIG. 18 also has a portion located in the vacuum facility, and all of the portions shown in FIG. 18 may be located in the vacuum facility, that is, the lower chamber 100.
도 18의 기판 이송부(300-2) 중 도 6과 차이가 있는 부분만 살펴보면 아래와 같다. 이하에서는 한 쌍의 선형 이송부 중 하나의 구조만을 기술한다. Of the substrate transfer unit 300-2 of FIG. 18, only the parts that are different from those of FIG. 6 are as follows. Hereinafter, only the structure of one of the pair of linear transfer units will be described.
하나의 몸체(310-2)에는 한 쌍의 상하 이동부(320-2) 및 두 개의 폭 조절부(340-1, 340-2)가 형성되어 있다. 몸체(310-2)의 하부에는 지지 기둥(311)이 위치하여 진공 설비 내에 위치한다. A pair of up and down moving parts 320-2 and two width adjusting parts 340-1 and 340-2 are formed in one body 310-2. A support pillar 311 is located under the body 310-2 and is located in a vacuum facility.
한 쌍의 상하 이동부(320-2)는 상하 방향으로 몸체(310-2)를 이동시킬 수 있도록 하는 모터를 포함하며, 모터의 동작에 의하여 레일과 같은 가이드를 따라 상하로 이동하는 부분을 포함할 수 있다. 한 쌍의 상하 이동부(320-2)는 하부 챔버(100)의 내부 바닥에 고정되어 하부 챔버(100)의 내부 바닥면에서부터 몸체(310-2)의 높이를 변경시킬 수 있다. 상하 이동부(320-2)가 상하로 이동할 때, 지지 기둥(311)도 함께 상하로 이동하여 몸체(310-2)가 전체적으로 일정하게 높이가 변경될 수 있다.The pair of up and down moving parts 320-2 include a motor that moves the body 310-2 in the up and down direction, and includes a part that moves up and down along a guide such as a rail by the operation of the motor. can do. The pair of up and down moving parts 320-2 are fixed to the inner bottom of the lower chamber 100 and can change the height of the body 310-2 from the inner bottom surface of the lower chamber 100. When the vertical movement part 320-2 moves up and down, the support pillar 311 also moves up and down together, so that the height of the body 310-2 as a whole can be constantly changed.
두 개의 폭 조절부(340-1, 340-2)는 제1 폭 조절부(340-1) 및 제2 폭 조절부(340-2)로 구성되어 있다.The two width adjusting units 340-1 and 340-2 are composed of a first width adjusting unit 340-1 and a second width adjusting unit 340-2.
두 폭 조절부(340-1, 340-2)는 각각 선형 운동하는 실린더를 포함할 수 있으며, 몸체(310-2)의 길이 방향을 따라서 배열되어 있다. 두 폭 조절부(340-1, 340-2)의 실린더의 운동에 의하여 제2 몸체(335)의 길이 방향으로 길어지도록 한다. 제1 폭 조절부(340-1)의 끝단은 암부(370-2)와 연결되어 있으며, 두 폭 조절부(340-1, 340-2)가 모두 길어진 경우 암부(370-2)가 진공 설비의 내측에서 외측으로 이동되게 된다. 한편, 실시예에 따라서 두 폭 조절부(340-1, 340-2) 중 적어도 하나는 레일을 포함할 수 있다. The two width adjusting units 340-1 and 340-2 may each include a cylinder that moves linearly, and is arranged along the longitudinal direction of the body 310-2. The length of the second body 335 is increased by the movement of the cylinders of the two width control units 340-1 and 340-2. The end of the first width adjusting part 340-1 is connected to the arm part 370-2, and when both width adjusting parts 340-1 and 340-2 are long, the arm part 370-2 is a vacuum facility. is moved from the inside to the outside. Meanwhile, according to embodiments, at least one of the two width adjusting units 340-1 and 340-2 may include a rail.
암부(370-2)는 제1 폭 조절부(340-1)의 끝단에서 제1 폭 조절부(340-1)의 연장 방향에 수직하는 방향으로 길게 형성되어 있는 선형 바 구조를 가질 수 있다.The arm part 370-2 may have a linear bar structure extending from an end of the first width adjusting part 340-1 in a direction perpendicular to the extending direction of the first width adjusting part 340-1.
암부(370-2)의 끝은 꺾인 구조를 가지며, 기판(30)의 상부면을 흡착할 수 있는 흡착부(360-2)를 포함하며, 하나의 흡착부(360-2)는 도 11과 같은 흡착부를 복수개 포함할 수 있다.The end of the arm portion 370-2 has a bent structure and includes a suction portion 360-2 capable of adsorbing the upper surface of the substrate 30. One suction portion 360-2 is shown in FIG. 11 and A plurality of the same adsorption unit may be included.
도 19에서는 도 18의 기판 이송부(300-2)의 선형 동작을 도시되어 있다.In FIG. 19, a linear motion of the substrate transfer unit 300-2 of FIG. 18 is shown.
도 19에서는 두 폭 조절부(340-1, 340-2) 모두가 길어진 경우가 도시되어 있으며, 이 때, 기판(30)은 30-1로 도시된 원래의 위치에서 진공 설비 밖으로 배출된다. 두 폭 조절부(340-1, 340-2) 하나가 짧은 구조를 가지는 경우에는 진공 설비 안에 아무런 동작을 하지 않는 대기 상태일 때 일 수 있으며, 두 폭 조절부(340-1, 340-2) 모두가 짧은 구조를 가지는 경우에는 기판(30)을 흡착하는 동작을 할 때일 수 있다. 실시예에 따라서는 두 폭 조절부(340-1, 340-2) 모두가 짧은 구조를 가질 때 대기 상태일 수 있으며, 하나만 짧은 구조를 가질 때 흡착 동작을 할 수도 있다.19 shows a case in which both of the width control units 340-1 and 340-2 are lengthened, and at this time, the substrate 30 is discharged out of the vacuum facility from the original position shown at 30-1. When one of the two width adjusting units 340-1 and 340-2 has a short structure, it may be in a standby state without any operation in the vacuum facility, and the two width adjusting units 340-1 and 340-2 When all of them have a short structure, it may be time to perform an operation of adsorbing the substrate 30 . Depending on the embodiment, the two width control units 340-1 and 340-2 may be in a standby state when both have a short structure, and may perform an adsorption operation when only one has a short structure.
이상에서 본 발명의 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concept of the present invention defined in the following claims are also included in the scope of the present invention. that fall within the scope of the right.
본 발명은 표시 장치에 관한 것이다. The present invention relates to a display device.

Claims (20)

  1. 하부 챔버;lower chamber;
    상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및an upper chamber combining with the lower chamber to create a vacuum state; and
    상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, A substrate transfer unit positioned at least partially in the lower chamber and discharging the substrate out of the lower chamber;
    상기 기판 이송부는 The substrate conveying unit
    상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부;a vacuum maintaining unit in close contact with the lower surface of the lower chamber;
    상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 회전부;a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber;
    상기 회전부와 연결되어 있는 한 쌍의 폭 조절부;a pair of width control units connected to the rotating unit;
    하나가 상기 한 쌍의 폭 조절부 중 하나와 연결되고, 다른 하나가 상기 한 쌍의 폭 조절부 중 다른 하나와 연결되어 있는 한 쌍의 암부; 및a pair of arm parts, one of which is connected to one of the pair of width adjusting parts and the other of which is connected to the other of the pair of width adjusting parts; and
    상기 한 쌍의 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함하는 진공 설비.A vacuum facility comprising a plurality of adsorption parts located at one end of the pair of arm parts.
  2. 제1항에서,In paragraph 1,
    상기 회전부는 상기 하부 챔버에 위치하는 하부 재료와 상기 상부 챔버에 위치하는 상부 재료가 합착된 상기 기판을 회전시켜 외부로 배출시키는 진공 설비.The rotating unit rotates the substrate to which the lower material located in the lower chamber and the upper material located in the upper chamber are bonded to each other and discharges the substrate to the outside.
  3. 제2항에서,In paragraph 2,
    상기 기판 이송부는The substrate conveying unit
    상기 진공 유지부의 내부에 위치하는 지지 기둥; 및a support pillar positioned inside the vacuum maintaining unit; and
    상기 지지 기둥의 끝에 연결되어 있으며, 상기 회전부를 지지하는 제1 몸체를 더 포함하는 진공 설비.A vacuum facility further comprising a first body connected to an end of the support pillar and supporting the rotating part.
  4. 제3항에서,In paragraph 3,
    상기 기판 이송부는The substrate conveying unit
    상기 제1 몸체의 양끝에 각각 위치하여 상기 기판 이송부를 상하로 이동시키는 한 쌍의 상하 이동부를 더 포함하는 진공설비.Vacuum equipment further comprising a pair of vertical moving parts positioned at both ends of the first body to vertically move the substrate conveying part.
  5. 제4항에서,In paragraph 4,
    상기 한 쌍의 암부는 각각Each of the pair of arm parts
    상기 한 쌍의 폭 조절부 중 해당하는 폭 조절부와 연결되어 있는 제1 연결부; 및a first connection part connected to a corresponding width adjusting part among the pair of width adjusting parts; and
    상기 복수의 흡착부와 체결되어 지지하는 흡착부 지지대를 포함하는 진공 설비.A vacuum facility including an adsorption unit supporter engaged with and supported by the plurality of adsorption units.
  6. 제5항에서,In paragraph 5,
    상기 한 쌍의 폭 조절부는 각각The pair of width control units are respectively
    선형 운동하는 실린더; 및Cylinders with linear motion; and
    상기 실린더의 동작에 따라서 길이가 조절되며, 끝단이 원형 구조로 확장된 폭을 가지는 동작부를 포함하는 진공 설비.A vacuum facility comprising an operating unit whose length is adjusted according to the operation of the cylinder and whose end has an extended width in a circular structure.
  7. 제6항에서,In paragraph 6,
    상기 동작부는 상기 제1 연결부와 연결되어 있으며,The operation unit is connected to the first connection unit,
    상기 동작부와 상기 제1 연결부의 사이에는 유격이 형성되어 있는 진공 설비.A vacuum facility in which a gap is formed between the operating unit and the first connection unit.
  8. 제7항에서,In paragraph 7,
    상기 유격은 0.1mm이상 0.3mm이하인 진공 설비.The gap is 0.1 mm or more and 0.3 mm or less of vacuum equipment.
  9. 제5항에서,In paragraph 5,
    상기 기판 이송부는The substrate conveying unit
    상기 회전부 및 상기 한 쌍의 폭 조절부의 사이에 위치하는 제2 몸체를 더 포함하는 진공 설비.Vacuum equipment further comprising a second body positioned between the rotation unit and the pair of width control units.
  10. 제9항에서,In paragraph 9,
    상기 기판 이송부는The substrate conveying unit
    상기 제2 몸체의 위에는 위치하며 레일을 포함하는 가이드부를 더 포함하는 진공 설비.Vacuum equipment further comprising a guide portion located on the second body and including a rail.
  11. 제10항에서,In paragraph 10,
    상기 한 쌍의 암부는 각각Each of the pair of arm parts
    상기 가이드부에 연결되어 있는 제2 연결부를 더 포함하는 진공 설비.Vacuum equipment further comprising a second connection portion connected to the guide portion.
  12. 제10항에서,In paragraph 10,
    상기 기판 이송부 중 상기 회전부, 상기 한 쌍의 폭 조절부, 상기 한 쌍의 암부, 상기 복수의 흡착부, 상기 제1 몸체, 상기 제2 몸체, 상기 한 쌍의 상하 이동부 및 상기 가이드부는 상기 하부 챔버의 내에 위치하는 진공 설비.Among the substrate conveying parts, the rotating part, the pair of width adjusting parts, the pair of arm parts, the plurality of adsorption parts, the first body, the second body, the pair of vertical moving parts, and the guide part are the lower parts. A vacuum facility located inside the chamber.
  13. 하부 챔버;lower chamber;
    상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및an upper chamber combining with the lower chamber to create a vacuum state; and
    상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, A substrate transfer unit positioned at least partially in the lower chamber and discharging the substrate out of the lower chamber;
    상기 기판 이송부는 The substrate conveying unit
    상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부;a vacuum maintaining unit in close contact with the lower surface of the lower chamber;
    상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 회전부;a rotating part connected to the vacuum maintaining part and positioned inside the lower chamber;
    상기 회전부와 연결되어 있으며, 꺾인 선형 구조를 가지는 암부; 및an arm part connected to the rotating part and having a bent linear structure; and
    상기 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함하는 진공 설비.A vacuum facility comprising a plurality of adsorption parts located at one end of the arm part.
  14. 제13항에서,In paragraph 13,
    상기 암부는 꺾인 선형 바 구조를 가지는 진공 설비.The arm portion is a vacuum facility having a bent linear bar structure.
  15. 제13항에서,In paragraph 13,
    상기 기판 이송부는 The substrate conveying unit
    상기 회전부와 상기 암부를 연결시키며, 상기 암부를 상하 선형 운동시키는 상하 이동부를 더 포함하는 진공 설비.A vacuum equipment further comprising a vertical movement unit connecting the rotating unit and the arm unit and vertically and linearly moving the arm unit.
  16. 제15항에서,In clause 15,
    상기 기판 이송부는 The substrate conveying unit
    상기 진공 유지부의 내부에 위치하는 지지 기둥; 및a support pillar positioned inside the vacuum maintaining unit; and
    상기 지지 기둥의 끝에 연결되어 있으며, 상기 회전부를 지지하는 몸체를 더 포함하는 진공 설비.A vacuum facility further comprising a body connected to an end of the support pillar and supporting the rotating part.
  17. 제13항에서,In paragraph 13,
    상기 복수의 흡착부는 상기 하부 챔버에 위치하는 하부 재료와 상기 상부 챔버에 위치하는 상부 재료가 합착된 상기 기판의 중앙부를 흡착하며,The plurality of adsorption parts adsorb the central portion of the substrate where the lower material located in the lower chamber and the upper material located in the upper chamber are bonded together;
    상기 기판 이송부는 흡착된 상기 기판을 회전시켜 외부로 배출시키는 진공 설비.The substrate transfer unit rotates the adsorbed substrate and discharges it to the outside.
  18. 하부 챔버;lower chamber;
    상기 하부 챔버와 결합하여 진공 상태를 만드는 상부 챔버; 및an upper chamber combining with the lower chamber to create a vacuum state; and
    상기 하부 챔버 내에 적어도 일부 위치하며 기판을 상기 하부 챔버의 밖으로 배출시키는 기판 이송부를 포함하며, A substrate transfer unit positioned at least partially in the lower chamber and discharging the substrate out of the lower chamber;
    상기 기판 이송부는 한 쌍의 선형 이송부를 가지며,The substrate transfer unit has a pair of linear transfer units,
    상기 한 쌍의 선형 이송부는 각각Each of the pair of linear transfer units
    상기 하부 챔버의 하부면에 밀착되어 있는 진공 유지부;a vacuum maintaining unit in close contact with the lower surface of the lower chamber;
    상기 진공 유지부와 연결되어 있으며, 상기 하부 챔버의 내부에 위치하는 몸체;a body connected to the vacuum maintaining unit and positioned inside the lower chamber;
    상기 몸체와 연결되어 있는 제1 폭 조절부 및 제2 폭 조절부;a first width adjusting unit and a second width adjusting unit connected to the body;
    상기 제1 폭 조절부의 끝에 연결되어 있는 암부; 및an arm portion connected to an end of the first width adjusting portion; and
    상기 암부의 일측 끝단에 위치하는 복수의 흡착부를 포함하는 진공 설비.A vacuum facility comprising a plurality of adsorption parts located at one end of the arm part.
  19. 제18항에서,In paragraph 18,
    상기 한 쌍의 선형 이송부는 각각Each of the pair of linear transfer units
    상기 몸체에 연결되어 있으며, 상기 몸체를 상하로 이동시키는 한 쌍의 상하 이동부를 더 포함하는 진공 설비.Vacuum equipment further comprising a pair of vertical moving parts connected to the body and vertically moving the body.
  20. 제18항에서,In paragraph 18,
    상기 제1 폭 조절부 및 상기 제2 폭 조절부 중 적어도 하나는 실린더를 포함하는 진공 설비.At least one of the first width adjusting unit and the second width adjusting unit includes a cylinder.
PCT/KR2022/014583 2021-09-28 2022-09-28 Vacuum equipment WO2023055083A1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2021-0128223 2021-09-28
KR1020210128223A KR20230045749A (en) 2021-09-28 2021-09-28 Vacuum chamber having transferring unit for substrate
CN202210461791.2 2022-04-28
CN202221011232.3U CN217376428U (en) 2021-09-28 2022-04-28 Vacuum equipment
CN202210461791.2A CN115872155A (en) 2021-09-28 2022-04-28 Vacuum equipment
CN202221011232.3 2022-04-28

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060050206A (en) * 2004-10-08 2006-05-19 퀀타 디스플레이 인크 Substrate assembling method and device
KR100860522B1 (en) * 2002-03-23 2008-09-26 엘지디스플레이 주식회사 Conveying apparatus of liquid crystal display panel
KR20100136680A (en) * 2009-06-19 2010-12-29 주식회사 티이에스 Substrate transferring apparatus for use in vacuum chamber
KR101032340B1 (en) * 2004-11-22 2011-05-06 엘지디스플레이 주식회사 substrate transporting robot for flat panel display device
KR20200107168A (en) * 2019-03-06 2020-09-16 주식회사 에스에프에이 Vacuum laminator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100860522B1 (en) * 2002-03-23 2008-09-26 엘지디스플레이 주식회사 Conveying apparatus of liquid crystal display panel
KR20060050206A (en) * 2004-10-08 2006-05-19 퀀타 디스플레이 인크 Substrate assembling method and device
KR101032340B1 (en) * 2004-11-22 2011-05-06 엘지디스플레이 주식회사 substrate transporting robot for flat panel display device
KR20100136680A (en) * 2009-06-19 2010-12-29 주식회사 티이에스 Substrate transferring apparatus for use in vacuum chamber
KR20200107168A (en) * 2019-03-06 2020-09-16 주식회사 에스에프에이 Vacuum laminator

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