WO2019190031A1 - Micro-element transfer device and micro-element transfer method - Google Patents

Micro-element transfer device and micro-element transfer method Download PDF

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Publication number
WO2019190031A1
WO2019190031A1 PCT/KR2018/016991 KR2018016991W WO2019190031A1 WO 2019190031 A1 WO2019190031 A1 WO 2019190031A1 KR 2018016991 W KR2018016991 W KR 2018016991W WO 2019190031 A1 WO2019190031 A1 WO 2019190031A1
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WIPO (PCT)
Prior art keywords
adsorption
transfer film
transfer
target substrate
unit
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Application number
PCT/KR2018/016991
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French (fr)
Korean (ko)
Inventor
황보윤
김재현
윤성욱
김경식
김창현
최병익
김정엽
장봉균
김광섭
이학주
Original Assignee
한국기계연구원
재단법인 파동에너지 극한제어 연구단
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Publication of WO2019190031A1 publication Critical patent/WO2019190031A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present invention relates to a micro element transfer apparatus and a micro element transfer method, and more particularly, to a micro element transfer apparatus and a transfer method for transferring a micro element to a target substrate.
  • Displays using micro devices such as LEDs are in the spotlight as the next generation of advanced displays that will replace conventional displays.
  • the key to making these displays is the technology of transferring each LED device to a modular circuit board.
  • Another method is to transfer the device using an electrostatic chuck technique.
  • the device when applied to a thin device, the device may be damaged by static electricity and may be affected by surface contamination of the device. This can be degraded.
  • a thin film device having a very thin thickness may employ a technology of continuously transferring the adhesive force using a micro / nano scale.
  • the micro device array arranged on the source substrate is adhered to the transfer film, and the micro device is adhered to the solder applied to the electrode of the target substrate to transfer the micro device to the target substrate.
  • Such a transfer method may be largely divided into a method using a roller and a method using a pressure plate according to a method of pressing the micro device onto the target substrate.
  • the adhesive force of the solder in order to increase the transfer efficiency of the micro device, must be greater than the adhesive force between the transfer film and the micro device so that the micro device can be easily separated from the transfer film while the micro device is adhered to the target substrate. have.
  • Embodiments of the present invention provide a micro device transfer apparatus and a micro device transfer method capable of improving the transfer process efficiency of the micro device.
  • a micro device transferring apparatus includes: a first adsorption part to which a micro film adhered to a transfer film is adsorbed, a target substrate is seated, and a transfer film provided from the first adsorption part is adsorbed to the micro device; A second adsorption part, a transfer part for transferring the second adsorption part in a first horizontal direction, a pressurizing part for transferring the micro element to the target substrate by pressing the transfer film to be transferred, and the first adsorption part in the first horizontal direction; And a guide part provided at a front end of the pressing part in a transport path of the guide part to guide the transfer film passing through the pressing part away from the target substrate to separate the transfer film from the micro device.
  • the first adsorption part may include a first bed on which the transfer film is adsorbed, a first negative pressure providing groove formed on one surface of the first bed, and providing a negative pressure between the first bed and the transfer film and the transfer film.
  • the micro device may include a rotating part for rotating the first bed to face the target substrate of the second adsorption part.
  • the display device may further include an alignment unit for aligning the position of the second adsorption unit so that the target substrate and the transfer film are aligned.
  • the alignment unit includes a base disposed on the transfer unit, a first slider coupled to the base to be slidable in the first horizontal direction, and sliding to a second horizontal direction perpendicular to the first horizontal direction on the first slider.
  • a rotator provided on the second slider coupled to the second slider and capable of supporting the second adsorption unit, and rotating the second adsorption unit about a vertical axis perpendicular to the first horizontal direction and the second horizontal direction; It may include.
  • a first alignment mark may be formed on the transfer film, and a second alignment mark may be formed on the target substrate, and the photographing unit may further include a photographing unit configured to photograph positions of the first alignment mark and the second alignment mark. have.
  • the first adsorption part is located above the second adsorption part, the first bed is made of an opaque material, a through hole is formed at a position corresponding to the second alignment mark, and the photographing part is the first adsorption part. It is provided on the upper side can take the second alignment mark through the through hole.
  • the first adsorption part is located above the second adsorption part, the first bed is made of a transparent material, and the photographing part is provided on the upper side of the first adsorption part, and passes through the first bed to the second surface. You can shoot inmarks.
  • the second adsorption part may include a second bed having a mounting recess formed on an upper surface of the second substrate to be seated on the target substrate, and the transfer film and the second bed provided on one surface of the second bed. It may include a second negative pressure providing groove for providing a negative pressure therebetween to temporarily adhere the micro device of the transfer film on the target substrate.
  • the guide portion may be moved to adjust a bending angle of bending the transfer film passing through the pressing portion.
  • the pressing unit may include a pressing roller for pressing the transfer film disposed on the second adsorption unit toward the target substrate, and the guide unit may be rotated about a rotation axis of the pressing roller to adjust the bending angle.
  • micro device transfer method the first adsorption step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit, the second adsorption step of adsorbing the target substrate to the second adsorption unit And provisionally attaching the transfer film to the second adsorption part by attaching the micro element of the transfer film to the target substrate, and a transfer unit transfers the second adsorption part in a first horizontal direction.
  • the transfer step the pressing portion presses the transfer film of the second adsorption portion to transfer the micro device to the target substrate and the guide portion provided at the front end of the pressing portion in the transfer path in the first horizontal direction
  • the transfer film is positioned on the first adsorption part, and a negative pressure is provided between the first adsorption part and the transfer film through a first subcompression providing groove to transfer the transfer film to the first adsorption part. Can be adsorbed.
  • the target substrate may be positioned in a seating groove of the second adsorption part, and a negative pressure may be provided between the seating recess and the target substrate to adsorb the target substrate to the second adsorption part.
  • the alignment step may include a rotation step of rotating the first adsorption part such that the micro device adhered to the transfer film of the first adsorption part faces the target substrate, a first alignment mark in which a photographing part is formed on the transfer film;
  • a photographing step of photographing a second alignment mark formed on the target substrate and the alignment unit move the second suction unit in a second horizontal direction perpendicular to the first horizontal direction and the first horizontal direction, and the first horizontal direction.
  • the photographing part is disposed above the first adsorption part made of an opaque material, and marks the second alignment mark positioned below the first adsorption part through a through hole formed in the first adsorption part. You can shoot.
  • the photographing part may be disposed above the first adsorption part made of a transparent material, and may photograph the second alignment mark positioned below the first adsorption part by passing through the first adsorption part.
  • the descending step of lowering the first adsorption part toward the second adsorption part after the positioning step by providing a negative pressure between the transfer film and the second adsorption part disposed in the correct position the transfer film It may include a fixing step for fixing to the second adsorption portion.
  • the guide portion is moved to adjust the bending angle of the transfer film bent past the pressing portion.
  • Embodiments of the present invention can provide a micro device transfer device and a micro device transfer method that can effectively improve the transfer process efficiency of the micro device.
  • FIG. 1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • FIG. 2 is an exemplary view showing a first adsorption part and a second adsorption part of a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • FIG 3 is an operation example showing a center of the first adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG 4 is an operation example showing the first adsorption portion and the second adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG. 5 is an enlarged exemplary view illustrating a micro device and a target substrate of FIG. 4.
  • FIG. 6 is an exemplary view showing a pressing part and a guide part of the micro device transferring apparatus according to the exemplary embodiment of the present invention.
  • Figure 7 is an exemplary view showing an operation example centering on the pressing portion and the guide portion of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG 8 is an exemplary view showing an operation example centering on the guide of the micro device transfer apparatus according to an embodiment of the present invention.
  • FIG. 9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
  • a component when referred to as being 'connected' or 'connected' to another component, the component may be directly connected to or connected to the other component, but in between It will be understood that may exist.
  • a component when referred to as 'directly connected' or 'directly connected' to another component, it should be understood that there is no other component in between.
  • the term 'comprises' or 'having' is only intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more. It is to be understood that it does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, actions, components, parts or combinations thereof.
  • 'and / or' includes any combination of the plurality of listed items or any of the plurality of listed items.
  • 'A or B' may include 'A', 'B', or 'both A and B'.
  • the front / front and rear / rear ends will be described based on the transfer direction of the transfer film 10. That is, when the transfer film 10 is moved from the first point to the second point, it will be described with the first point as the front end / front end and the second point as the rear end / back end.
  • FIG. 1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • the micro device electronic device may include a first adsorption part 100, a second adsorption part 200, an alignment part 300, a transfer part 400, and a pressing part ( 500 and the guide 600.
  • the transfer film 10 to which the micro device is attached may be adsorbed to the first adsorption part 100.
  • the second adsorption part 200 may be provided below the first adsorption part 100, and a target substrate on which the micro device adhered to the transfer film 10 may be adsorbed to the second adsorption part 200. have.
  • the alignment unit 300 may be provided at the lower side of the second adsorption unit 200 to align the positions of the second adsorption unit 200 such that the target substrate and the transfer film 10 are aligned.
  • the transfer unit 400 may transfer the alignment unit 300 and the second adsorption unit 200 in the first horizontal direction.
  • the second adsorption part 200 may be provided in a state where the micro elements of the target substrate 30 and the transfer film 10 are temporarily attached.
  • the pressing unit 500 may be provided on a transfer path in the first horizontal direction in which the second adsorption unit 200 is transferred.
  • the pressing unit 500 may press the transfer film 10 on the upper portion of the second adsorption unit 200 to allow the micro device to be transferred to the target substrate.
  • the guide part 600 may be provided at the front end of the pressing part on a transport path in the first horizontal direction in which the second suction part 200 is transferred.
  • the guide part 600 may guide the transfer film 10 to be bent upwards at a point passing through the pressing part 500.
  • the transfer film 10 may be separated from the micro device being transferred while moving upward. That is, since the micro device is pressed by the pressing unit 500 at the time when the transfer film 10 is separated from the micro device, the micro device may be prevented from sticking back to the transfer film 10 and falling off the target substrate. Can be.
  • the transfer element 10 may be separated from the transferred micro element while the micro element is pressed by the pressing unit 500 to be transferred to the target substrate 30, the transfer film 10 and the micro element may be separated. Stable transfer can be achieved without precise control of adhesion to the liver.
  • the micro device is pressed by the pressing unit 500, so that the micro device is a target substrate even if the transfer film 10 is separated from the micro device.
  • the state transferred to 30 can be effectively maintained.
  • FIG. 2 is an exemplary view showing a first adsorption portion and a second adsorption portion of a micro device transfer apparatus according to an embodiment of the present invention
  • FIG. 3 is a first view of the micro device transfer apparatus according to an embodiment of the present invention.
  • 4 is an operation example showing the adsorption unit
  • FIG. 4 is an operation example showing the first adsorption unit and the second adsorption unit
  • FIG. 5 is a micro diagram of FIG. 4 according to an embodiment of the present invention.
  • the first adsorption part 100 may have a first bed 110, a first negative pressure providing groove 111, and a rotating part 120.
  • the transfer film 10 to which the micro device 20 is adhered may be adsorbed onto the first bed 110.
  • the micro device 20 may be provided in an array form.
  • the first alignment mark 11 may be formed on the transfer film 10. A plurality of first alignment marks 11 may be formed.
  • the first negative pressure providing groove 111 may be formed on an upper surface of the first bed 110. At least a portion of the first negative pressure providing groove 111 may be connected to the lower surface of the first bed 110 through the first bed 110 and may be connected to a negative pressure generating unit (not shown).
  • the negative pressure generated by the negative pressure generating unit may provide a negative pressure between the upper surface and the transfer film 10 placed on the upper surface of the first bed 110 through the first negative pressure providing groove 111. 10 may be adsorbed onto the first bed 110.
  • the negative pressure may include a vacuum pressure.
  • the first negative pressure providing groove 111 may be entirely formed on the upper surface of the first bed 110 so that the adsorption force between the upper surface of the first bed 110 and the transfer film 10 may be stably generated.
  • the rotating part 120 may be provided under the first bed 110 and may rotate the first bed 110.
  • the micro device 20 may be in a state of being adhered to the upper surface of the transfer film 10.
  • the transfer film 10 adsorbed on the upper surface of the first bed 110 moves to the lower portion of the first bed 110.
  • the position is moved, and the micro device 20 adhered to the transfer film 10 may be positioned to face the upper surface of the target substrate 30.
  • the first bed 110 may be made of an opaque material, and the through hole 112 may be formed in the thickness of the first bed 110 in the first bed 110.
  • the second alignment mark 31 may be formed on the target substrate 30 so as to correspond to the first alignment mark 11, and the through hole 112 may include the first alignment mark 11 and the second alignment. It may be formed at a position corresponding to the mark 31.
  • the second adsorption part 200 may have a second bed 210 and a second negative pressure providing groove 212.
  • a mounting groove 211 may be formed in an upper portion of the second bed 210, and a target substrate 30 may be mounted in the mounting groove 211.
  • the second alignment mark 31 may be formed on the upper surface of the target substrate 30.
  • the upper surface of the target substrate 30 may correspond to the upper surface of the second bed 210. That is, the upper surface of the target substrate 30 seated in the seating groove 211 may be disposed on the same plane as the upper surface of the second bed 210.
  • the second negative pressure providing groove 212 may be formed on an upper surface of the second bed 210. Specifically, the second negative pressure providing groove 212 may be formed on the outside of the mounting groove 211. At least a portion of the second negative pressure providing groove 212 may be connected to the lower surface of the second bed 210 through the second bed 210 and may be connected to a negative pressure generating unit (not shown).
  • the micro device transfer device may include a photographing unit 700.
  • the photographing unit 700 may be provided on the upper side of the first adsorption unit 100, and the first adsorption unit 100 is rotated 180 degrees so that the micro device 20 faces the upper surface of the target substrate 30. In the through hole 112, the first alignment mark 11 and the second alignment mark 31 may be photographed.
  • the alignment unit 300 may be provided under the second adsorption unit 200, and may include a base 310, a first slider 320, a second slider 330, and a rotator 340. )
  • the base 310 may be provided at an upper portion of the transfer part 400, and may have a first guide 311 extending in a first horizontal direction (X-axis direction).
  • the first slider 320 is provided on the upper part of the base 310 and slidably coupled to the first guide 311 to reciprocate in the first horizontal direction (X-axis direction), thereby allowing the first slider ( 320 may move the second adsorption part 200 in the first horizontal direction (X-axis direction).
  • the first slider 320 may have a second guide 321 extending in a second horizontal direction (Y-axis direction) perpendicular to the first horizontal direction (X-axis direction).
  • the second slider 330 is provided on the upper part of the first slider 320 and slidably coupled to the second guide 321 to be reciprocated in the second horizontal direction (Y-axis direction).
  • the slider 330 may move the second adsorption part 200 in the second horizontal direction (Y-axis direction).
  • the rotator 340 may be provided at an upper portion of the second slider 330 and may be provided at a lower portion of the second adsorption portion 200.
  • the rotator 340 may be rotated about a vertical axis (Z axis) perpendicular to the first horizontal direction (X axis direction) and the second horizontal direction (Y axis direction). Through this, the rotator 340 may rotate the second adsorption part 200 about the vertical axis (Z axis).
  • the alignment unit 300 moves the second adsorption unit 200 in a first horizontal direction (X-axis) based on the first alignment mark 11 and the second alignment mark 31 photographed by the imaging unit 700.
  • Direction and the second horizontal direction (Y-axis direction) and rotate about the vertical axis (Z-axis) to adjust the position of the target substrate 30.
  • the second alignment mark 31 may be aligned with the first alignment mark 11, and the target substrate 30 and the micro device 20 may be aligned.
  • the first adsorption portion 100 may be lowered along the vertical guide 150.
  • the first bed 110 may be made of a transparent material.
  • the second alignment mark 31 formed on the target substrate 30 may be photographed by the photographing unit 700 through the first bed 110, and the above-described configuration of the through hole may be omitted. Can be.
  • the first terminal 21 of the micro device 20 is aligned on the upper side of the second terminal 32 of the target substrate 30. Can be located.
  • the solder 40 may be provided between the first terminal 21 and the second terminal 32.
  • the supply of the negative pressure is stopped in the first negative pressure providing groove 111, and the second negative pressure providing groove 212 is stopped.
  • negative pressure is formed between the upper surface of the second bed 210 and the transfer film 10 so that the transfer film 10 may be absorbed by the second bed 210.
  • the first terminal 21 and the second terminal 32 may be temporarily attached (see FIG. 5), and the transfer film 10 may be attached to the transfer unit 400 in a state of being adsorbed by the second bed 210. Can be transported by
  • a negative pressure providing groove may be further formed on the bottom surface of the mounting groove 211, and a negative pressure may be formed between the bottom surface of the target substrate 30 and the bottom surface of the mounting groove 211 through the negative pressure providing groove.
  • FIG. 6 is an exemplary view showing a pressing part and a guide of a micro device transferring apparatus according to an exemplary embodiment of the present invention
  • FIG. 7 illustrates a pressing part and a guide of a micro device transferring apparatus according to an embodiment of the present invention
  • 8 is an exemplary view showing an operation example
  • FIG. 8 is an exemplary view showing an operation example centering on a guide of a micro device transfer apparatus according to an exemplary embodiment of the present invention.
  • the pressing unit 500 may have a pressing roller 510 extending in the second horizontal direction (Y-axis direction).
  • the pressure roller 510 may be rotated about the rotation shaft 511 extending in the second horizontal direction (Y-axis direction).
  • the pressure roller 510 may be provided at the front end of the second adsorption part 200 on a transport path in the first horizontal direction (X-axis direction) in which the second adsorption part 200 is transferred.
  • the pressure roller 510 may press the transfer film 10 transferred in the first horizontal direction (X-axis direction).
  • the micro devices provided in the second horizontal direction (Y-axis direction) in the micro device 20 array transferred to the transfer film 10 may be simultaneously pressed by the pressure roller 510, and the target may be simultaneously pressed. It may be transferred to the substrate 30.
  • the guide part 600 may have a first guide roller 610 and a second guide roller 620, and the first guide roller 610 and the second guide roller 620. It may be provided at the front end of the pressure roller 510.
  • the first guide roller 610 may be provided extending in the second horizontal direction (Y-axis direction), and the lower surface of the transfer film 10 transferred in the first horizontal direction (X-axis direction). I can support it.
  • the second guide roller 620 may be provided in parallel with the first guide roller 610 on the upper side of the first guide roller 610, and may be provided spaced apart from the first guide roller 610 in the Z-axis direction. have.
  • a transfer film 10 transferred in the first horizontal direction (X-axis direction) may be inserted between the first guide roller 610 and the second guide roller 620.
  • the first guide roller 610, the second guide roller 620 and the pressure roller 510 may be coupled to the flange 630.
  • the first guide roller 610 and the second guide roller 620 may be rotated in the vertical direction about the rotation axis 511 of the pressure roller 510, through which, as shown in Figure 8 transfer film
  • the bending angle A of 10 may be adjusted.
  • the transfer film 10 It may be introduced between the first guide roller 610 and the second guide roller 620 (see Fig. 7 (a)).
  • the transfer film 10 is pressurized. It may be pressed by the roller 510. At this time, the transfer film 10 may be bent upward at the point passing the pressure roller 510 (see (b) of Figure 7).
  • the micro device 20 adhered to the transfer film 10 may be pressed by the pressure roller 510 to be transferred to the target substrate 30, and the micro device 20 may be transferred to the target substrate 30.
  • the transfer film 10 may be separated from the micro device 20 to be transferred.
  • the microfilm 20 is pressed by the pressure roller 510 and transferred to the target substrate 30, and at the same time, the transfer film 10 may be separated from the microdevice being transferred. Since the transfer film 10 and the micro device 20 can be a stable transfer without the precise level of adhesion control. That is, even when the adhesive force between the transfer film 10 and the micro element 20 is too strong, since the micro element 20 is pressed by the pressure roller 510, the transfer film 10 is the micro element 20. The micro device 20 may be transferred to the target substrate 30 even if the micro device 20 is removed from the target substrate 30.
  • the first guide roller 610 and the second guide roller 620 may adjust the bending angle A of the transfer film 10 according to the size, thickness, and surface state of the micro device 20. That is, since the adhesion between the micro device 20 and the transfer film 10 may vary according to the size, thickness, and surface state of the micro device 20, in order to separate the transfer film 10 from the transferred micro device. According to the adhesive force, appropriate strain strain (Strain Mismatch) of the transfer film 10 is required. If the size, thickness and surface state of the micro device to be transferred and the information on the transfer film 10 are confirmed in advance, the required bending deformation of the transfer film 10 can be calculated, and accordingly, the first guide roller 610. And the rotation angle of the second guide roller 620 may be adjusted.
  • FIG. 9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
  • the micro device transfer method includes a first adsorption step (S810), a second adsorption step (S820), an alignment step (S830), a temporary adhesion step (S840), a transfer step (S850), and a transfer step ( S860) and may include a separation step (S870).
  • the first adsorption step S810 may be a step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit.
  • the transfer film to which the micro device is attached may be placed on the first adsorption part, and a negative pressure may be provided between the first adsorption part and the transfer film to adsorb the transfer film to the first adsorption part.
  • the second adsorption step (S820) may be a step of adsorbing the target substrate to which the micro device is transferred to the second adsorption unit provided under the first adsorption unit.
  • the target substrate may be positioned on the second adsorption unit, and a negative pressure may be provided between the second adsorption unit and the target substrate to adsorb the target substrate to the second adsorption unit.
  • the alignment step S830 may be a step of aligning the position of the second adsorption unit such that the target substrate and the transfer film are aligned.
  • the alignment step S830 may have a rotation step S831, a photographing step S832, and an exact position step S833.
  • the rotating step S831 may be a step of rotating the first adsorption part such that the micro device adhered to the transfer film faces the upper surface of the target substrate.
  • the photographing step (S832) may be a step of photographing the first alignment mark formed on the transfer film and the second alignment mark formed on the target substrate through the first adsorption unit provided on the upper side of the first adsorption unit.
  • the photographing part may photograph the second alignment mark through the through hole formed in the first adsorption part.
  • the photographing part may pass through the first adsorption part to photograph the second alignment mark.
  • the alignment unit reciprocates the second adsorption unit in the first horizontal direction and in the second horizontal direction perpendicular to the first horizontal direction, and rotates the second absorption unit about the vertical axis perpendicular to the first horizontal direction.
  • the alignment mark may be aligned with the first alignment mark so that the target substrate and the micro device may be aligned.
  • the exact position step S833 may be performed simultaneously with the photographing step S832.
  • the temporary adhesion step S840 may be a step of lowering the first adsorption unit and temporarily attaching the micro device to the target substrate.
  • the temporary adhesion step S840 may have a descending step S841 and a fixing step S842.
  • the lowering step S841 may be a step of lowering the first adsorption part after the correct position step S833.
  • the fixing step S842 may be a step of providing and fixing a negative pressure between the second adsorption part and the transfer film in a state in which the first terminal of the micro device is positioned at the second terminal of the target substrate seated in the mounting groove. .
  • the transfer step S850 may be a step of transferring the alignment unit and the second adsorption unit in the first horizontal direction.
  • the transferring step (S860) may be a step of transferring the micro device to the target substrate by pressing the transfer film on the upper portion of the second adsorption portion is conveyed in a state that the pressing portion provided on the transfer path in the first horizontal direction. .
  • the pressing roller extending in the second horizontal direction perpendicular to the first horizontal direction may simultaneously press the micro devices provided in the second horizontal direction in the micro device array supplied.
  • Separation step (S870) is a guide portion provided at the front end of the pressing portion on the transfer path in the first horizontal direction to guide the transfer film is bent to move upwards at the point where the transfer film passes the pressing portion, the transfer film from the transferred micro device It may be a step of separating.
  • the guide portion is moved in the vertical direction to adjust the bending angle of the transfer film bent in the pressing portion.
  • the guide portion can adjust the bending angle of the transfer film according to the size, thickness and surface state of the micro device, and through this, when the micro device is transferred, the transfer film can be effectively removed.
  • transfer film 20 micro device
  • target substrate 100 first adsorption portion
  • first guide roller 620 second guide roller

Abstract

Disclosed are a micro-element transfer device and a micro-element transfer method. A micro-element transfer device according to one embodiment of the present invention comprises: a first suction part on which a transfer film having a micro-element attached thereto is suctioned; a second suction part on which a target substrate is stably placed and on which the transfer film provided from the first suction part is suctioned; a carriage part for carrying the second suction part in a first horizontal direction; a pressing part for pressing the transfer film of the second suction part being carried, so as to transfer the micro-element to the target substrate; and a guide part which is arranged at the front end of the pressing part on a carriage path in the first horizontal direction, and guides the transfer film passing through the pressing part to move away from the target substrate and thus separates the transfer film from the micro-element.

Description

마이크로 소자 전사장치 및 마이크로 소자 전사방법Micro Device Transfer Device and Micro Device Transfer Method
본 발명은 마이크로 소자 전사장치 및 마이크로 소자 전사방법에 관한 것으로서, 마이크로 소자를 타겟기판 등에 전사하는 마이크로 소자 전사장치 및 전사방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro element transfer apparatus and a micro element transfer method, and more particularly, to a micro element transfer apparatus and a transfer method for transferring a micro element to a target substrate.
LED와 같은 마이크로 소자를 사용한 디스플레이는 기존의 디스플레이를 대체할 차세대 첨단 디스플레이로 각광받고 있다. 이러한 디스플레이를 만들기 위해서는 각각의 LED 소자를 모듈화된 회로기판에 전사하는 기술이 핵심이 된다.Displays using micro devices such as LEDs are in the spotlight as the next generation of advanced displays that will replace conventional displays. The key to making these displays is the technology of transferring each LED device to a modular circuit board.
크기가 크고 두꺼운 소자들은 진공척(vacuum chuck)을 이용하여 전사시킬 수 있으나, 마이크로/나노 크기를 갖는 작고 얇은 소자의 경우, 진공척에서 발생하는 압력으로 인해 소자가 파손될 수 있기 때문에 수십 ㎛ 이하의 마이크로 소자에는 진공척을 사용하기 어렵다.Large and thick devices can be transferred using a vacuum chuck, but for small and thin devices with micro / nano size, the device may be damaged by the pressure generated in the vacuum chuck, It is difficult to use a vacuum chuck for micro devices.
다른 방법으로 정전척(electrostatic chuck) 기술을 이용하여 소자를 전사하는 방법이 있지만, 두께가 얇은 소자에 적용할 경우 정전기에 의한 소자 파손이 발생될 수 있으며, 소자의 표면 오염물에 영향을 받아 전사 능력이 저하될 수 있다. 위와 같은 이유로 두께가 매우 얇은 박막 형태의 소자는 마이크로/나노 스케일에서 작용하는 점착력을 이용하여 연속적으로 전사시키는 기술이 이용될 수 있다. Another method is to transfer the device using an electrostatic chuck technique. However, when applied to a thin device, the device may be damaged by static electricity and may be affected by surface contamination of the device. This can be degraded. For the above reason, a thin film device having a very thin thickness may employ a technology of continuously transferring the adhesive force using a micro / nano scale.
점착력을 이용하여 마이크로 소자를 전사하는 방식은 소스기판에 배열된 마이크로 소자 어레이를 전사필름에 점착시키고, 타겟기판의 전극에 도포된 솔더에 점착시켜 마이크로 소자를 타겟기판에 전사시킨다.In the method of transferring the micro device using the adhesive force, the micro device array arranged on the source substrate is adhered to the transfer film, and the micro device is adhered to the solder applied to the electrode of the target substrate to transfer the micro device to the target substrate.
이러한 전사 방식은 마이크로 소자를 타겟기판에 가압하는 방식에 따라, 크게 롤러를 이용한 방식과 가압 플레이트를 이용한 방식으로 구별될 수 있다. 그러나 어떠한 방식에서든, 마이크로 소자의 전사 효율을 높이기 위해서는 솔더의 점착력이 전사필름과 마이크로 소자 간의 점착력보다 크도록 해야 마이크로 소자가 타겟기판에 점착된 상태에서 마이크로 소자가 전사필름에서 분리가 용이하게 이루어질 수 있다.Such a transfer method may be largely divided into a method using a roller and a method using a pressure plate according to a method of pressing the micro device onto the target substrate. In any manner, however, in order to increase the transfer efficiency of the micro device, the adhesive force of the solder must be greater than the adhesive force between the transfer film and the micro device so that the micro device can be easily separated from the transfer film while the micro device is adhered to the target substrate. have.
이처럼 마이크로 소자의 전사공정에서, 타겟기판과의 관계에서 마이크로 소자와 전사필름간의 점착상태 및 분리상태가 적절하게 조절되도록 하는 것은 중요하다.As described above, in the transfer process of the micro device, it is important to properly control the adhesion state and separation state between the micro device and the transfer film in relation to the target substrate.
본 발명의 실시예들은 마이크로 소자의 전사 공정 효율이 개선될 수 있는 마이크로 소자 전사장치 및 마이크로 소자 전사방법을 제공하고자 한다.Embodiments of the present invention provide a micro device transfer apparatus and a micro device transfer method capable of improving the transfer process efficiency of the micro device.
본 발명의 일실시예에 따른 마이크로 소자 전사장치는, 마이크로 소자가 점착된 전사필름이 흡착되는 제1흡착부, 타겟기판이 안착되고, 상기 제1흡착부로부터 제공되는 상기 전사필름이 흡착되는 제2흡착부, 상기 제2흡착부를 제1수평방향으로 이송시키는 이송부, 이송되는 상기 제2흡착부의 상기 전사필름을 가압하여 상기 마이크로 소자를 상기 타겟기판에 전사시키는 가압부 및 상기 제1수평방향으로의 이송경로에서 상기 가압부의 전단에 구비되고, 상기 가압부를 지나는 상기 전사필름을 상기 타겟기판으로부터 멀어지도록 안내하여 상기 전사필름을 상기 마이크로 소자로부터 분리시키는 안내부를 포함한다. In one embodiment, a micro device transferring apparatus includes: a first adsorption part to which a micro film adhered to a transfer film is adsorbed, a target substrate is seated, and a transfer film provided from the first adsorption part is adsorbed to the micro device; A second adsorption part, a transfer part for transferring the second adsorption part in a first horizontal direction, a pressurizing part for transferring the micro element to the target substrate by pressing the transfer film to be transferred, and the first adsorption part in the first horizontal direction; And a guide part provided at a front end of the pressing part in a transport path of the guide part to guide the transfer film passing through the pressing part away from the target substrate to separate the transfer film from the micro device.
상기 제1흡착부는, 상기 전사필름이 흡착되는 제1베드, 상기 제1베드의 일면에 형성되어 상기 제1베드 및 상기 전사필름 사이에 부압을 제공하는 제1부압제공홈 및 상기 전사필름의 상기 마이크로 소자가 상기 제2흡착부의 상기 타겟기판을 마주보도록 상기 제1베드를 회전시키는 회전부를 포함할 수 있다.The first adsorption part may include a first bed on which the transfer film is adsorbed, a first negative pressure providing groove formed on one surface of the first bed, and providing a negative pressure between the first bed and the transfer film and the transfer film. The micro device may include a rotating part for rotating the first bed to face the target substrate of the second adsorption part.
상기 타겟기판과 상기 전사필름이 얼라인되도록 상기 제2흡착부의 위치를 정렬시키는 정렬부를 더 포함할 수 있다.The display device may further include an alignment unit for aligning the position of the second adsorption unit so that the target substrate and the transfer film are aligned.
상기 정렬부는, 이송부상에 배치되는 베이스, 상기 베이스 상부에 상기 제1수평방향으로 슬라이딩 가능하도록 결합되는 제1슬라이더, 상기 제1슬라이더 상부에 상기 제1수평방향에 수직한 제2수평방향으로 슬라이딩 가능하도록 결합되는 제2슬라이더 및 상기 제2슬라이더 상부에 구비되고 상기 제2흡착부를 지지하며, 상기 제1수평방향 및 제2수평방향에 수직한 수직축을 중심으로 상기 제2흡착부를 회전시키는 로테이터를 포함할 수 있다.The alignment unit includes a base disposed on the transfer unit, a first slider coupled to the base to be slidable in the first horizontal direction, and sliding to a second horizontal direction perpendicular to the first horizontal direction on the first slider. A rotator provided on the second slider coupled to the second slider and capable of supporting the second adsorption unit, and rotating the second adsorption unit about a vertical axis perpendicular to the first horizontal direction and the second horizontal direction; It may include.
상기 전사필름에는 제1얼라인마크가 형성되고, 상기 타겟기판에는 제2얼라인마크가 형성되며, 상기 제1얼라인마크 및 상기 제2얼라인마크의 위치를 촬영하는 촬영부를 더 포함할 수 있다.A first alignment mark may be formed on the transfer film, and a second alignment mark may be formed on the target substrate, and the photographing unit may further include a photographing unit configured to photograph positions of the first alignment mark and the second alignment mark. have.
상기 제1흡착부는 상기 제2흡착부의 상측에 위치되고, 상기 제1베드는 불투명 소재로 이루어지며, 상기 제2얼라인마크와 대응되는 위치에 관통공이 형성되고, 상기 촬영부는 상기 제1흡착부의 상측에 구비되어 상기 관통공을 통해 상기 제2얼라인마크를 촬영할 수 있다.The first adsorption part is located above the second adsorption part, the first bed is made of an opaque material, a through hole is formed at a position corresponding to the second alignment mark, and the photographing part is the first adsorption part. It is provided on the upper side can take the second alignment mark through the through hole.
상기 제1흡착부는 상기 제2흡착부의 상측에 위치되고, 상기 제1베드는 투명 소재로 이루어지며, 상기 촬영부는 상기 제1흡착부의 상측에 구비되고, 상기 제1베드를 투과하여 상기 제2얼라인마크를 촬영할 수 있다. The first adsorption part is located above the second adsorption part, the first bed is made of a transparent material, and the photographing part is provided on the upper side of the first adsorption part, and passes through the first bed to the second surface. You can shoot inmarks.
상기 제2흡착부는, 상기 타겟기판이 안착되도록 상면에 함몰 형성되는 안착홈을 가지는 제2베드 및 상기 제2베드의 일면에 형성되어 상기 제1흡착부로부터 제공되는 상기 전사필름 및 상기 제2베드 사이에 부압을 제공하여 상기 전사필름의 상기 마이크로 소자를 상기 타겟기판상에 가점착시키는 제2부압제공홈을 포함할 수 있다. The second adsorption part may include a second bed having a mounting recess formed on an upper surface of the second substrate to be seated on the target substrate, and the transfer film and the second bed provided on one surface of the second bed. It may include a second negative pressure providing groove for providing a negative pressure therebetween to temporarily adhere the micro device of the transfer film on the target substrate.
상기 안내부는 위치가 이동되어 상기 가압부를 지나는 상기 전사필름이 벤딩되는 벤딩각도를 조절할 수 있다. The guide portion may be moved to adjust a bending angle of bending the transfer film passing through the pressing portion.
상기 가압부는, 상기 제2흡착부에 배치된 상기 전사필름을 상기 타겟기판측으로 가압하는 가압롤러를 포함하며, 상기 안내부는 상기 가압롤러의 회전축을 중심으로 회전되어 상기 벤딩각도를 조절할 수 있다.The pressing unit may include a pressing roller for pressing the transfer film disposed on the second adsorption unit toward the target substrate, and the guide unit may be rotated about a rotation axis of the pressing roller to adjust the bending angle.
한편, 본 발명의 일실시예에 따른 마이크로 소자 전사방법은, 마이크로 소자가 점착된 전사필름을 제1흡착부에 흡착시키는 제1흡착단계, 제2흡착부에 타겟기판을 흡착시키는 제2흡착단계, 상기 제1흡착부의 상기 전사필름을 상기 제2흡착부에 제공하여 상기 전사필름의 상기 마이크로 소자를 상기 타겟기판에 가점착시키는 가점착단계, 이송부가 상기 제2흡착부를 제1수평방향으로 이송시키는 이송단계, 가압부가 제2흡착부의 상기 전사필름을 가압하여 상기 마이크로 소자를 상기 타겟기판에 전사시키는 전사단계 및 상기 제1수평방향으로의 이송경로에서 상기 가압부의 전단에 구비되는 안내부가 상기 가압부를 지나는 상기 전사필름을 상기 타겟기판으로부터 멀어지도록 안내하여 상기 전사필름을 상기 마이크로 소자로부터 분리시키는 분리단계를 포함한다.On the other hand, micro device transfer method according to an embodiment of the present invention, the first adsorption step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit, the second adsorption step of adsorbing the target substrate to the second adsorption unit And provisionally attaching the transfer film to the second adsorption part by attaching the micro element of the transfer film to the target substrate, and a transfer unit transfers the second adsorption part in a first horizontal direction. The transfer step, the pressing portion presses the transfer film of the second adsorption portion to transfer the micro device to the target substrate and the guide portion provided at the front end of the pressing portion in the transfer path in the first horizontal direction A separation step of separating the transfer film from the micro device by guiding the transfer film passing through a portion away from the target substrate; Include.
상기 제1흡착단계에서는, 상기 전사필름을 제1흡착부에 위치시키고, 제1부압제공홈을 통해 상기 제1흡착부 및 상기 전사필름 사이에 부압을 제공하여 상기 전사필름을 상기 제1흡착부에 흡착시킬 수 있다.In the first adsorption step, the transfer film is positioned on the first adsorption part, and a negative pressure is provided between the first adsorption part and the transfer film through a first subcompression providing groove to transfer the transfer film to the first adsorption part. Can be adsorbed.
상기 제2흡착단계에서는, 상기 타겟기판을 제2흡착부의 안착홈에 위치시키고, 상기 안착홈 및 상기 타겟기판 사이에 부압을 제공하여 상기 타겟기판을 상기 제2흡착부에 흡착시킬 수 있다.In the second adsorption step, the target substrate may be positioned in a seating groove of the second adsorption part, and a negative pressure may be provided between the seating recess and the target substrate to adsorb the target substrate to the second adsorption part.
상기 정렬단계는, 상기 제1흡착부의 상기 전사필름에 점착된 상기 마이크로 소자가 상기 타겟기판을 마주보도록 상기 제1흡착부를 회전시키는 회전단계, 촬영부가 상기 전사필름에 형성되는 제1얼라인마크 및 상기 타겟기판에 형성되는 제2얼라인마크를 촬영하는 촬영단계 및 정렬부가 상기 제2흡착부를 상기 제1수평방향 및 상기 제1수평방향에 수직한 제2수평방향으로 이동시키고, 상기 제1수평방향 및 상기 제2수평방향에 수직한 수직축을 중심으로 회전시킴으로써, 상기 제1얼라인마크 및 상기 제2얼라인마크를 얼라인시키고 상기 타겟기판과 상기 마이크로 소자를 정위치에 배치시키는 정위치단계를 포함할 수 있다.The alignment step may include a rotation step of rotating the first adsorption part such that the micro device adhered to the transfer film of the first adsorption part faces the target substrate, a first alignment mark in which a photographing part is formed on the transfer film; A photographing step of photographing a second alignment mark formed on the target substrate and the alignment unit move the second suction unit in a second horizontal direction perpendicular to the first horizontal direction and the first horizontal direction, and the first horizontal direction. An alignment step of aligning the first alignment mark and the second alignment mark and arranging the target substrate and the micro device in the right position by rotating about a vertical axis perpendicular to the direction and the second horizontal direction. It may include.
상기 촬영단계에서, 상기 촬영부는 불투명 소재로 이루어지는 상기 제1흡착부의 상측에 배치되고, 상기 제1흡착부에 형성되는 관통공을 통해 상기 제1흡착부의 하측에 위치되는 상기 제2얼라인마크를 촬영할 수 있다.In the photographing step, the photographing part is disposed above the first adsorption part made of an opaque material, and marks the second alignment mark positioned below the first adsorption part through a through hole formed in the first adsorption part. You can shoot.
상기 촬영단계에서, 상기 촬영부는 투명 소재로 이루어지는 상기 제1흡착부의 상측에 배치되고, 상기 제1흡착부를 투과하여 상기 제1흡착부의 하측에 위치되는 상기 제2얼라인마크를 촬영할 수 있다.In the photographing step, the photographing part may be disposed above the first adsorption part made of a transparent material, and may photograph the second alignment mark positioned below the first adsorption part by passing through the first adsorption part.
상기 가점착단계는, 상기 정위치단계 이후 상기 제1흡착부를 상기 제2흡착부를 향해 하강시키는 하강단계, 정위치에 배치된 상기 전사필름과 상기 제2흡착부 사이에 부압을 제공하여 상기 전사필름을 상기 제2흡착부에 고정시키는 고정단계를 포함할 수 있다. In the temporary adhesion step, the descending step of lowering the first adsorption part toward the second adsorption part after the positioning step, by providing a negative pressure between the transfer film and the second adsorption part disposed in the correct position the transfer film It may include a fixing step for fixing to the second adsorption portion.
상기 분리단계에서는, 상기 안내부가 이동되어 상기 가압부를 지나서 벤딩되는 상기 전사필름의 벤딩각도를 조절할 수 있다.In the separating step, the guide portion is moved to adjust the bending angle of the transfer film bent past the pressing portion.
본 발명의 실시예들은 마이크로 소자의 전사 공정 효율이 효과적으로 개선될 수 있는 마이크로 소자 전사장치 및 마이크로 소자 전사방법을 제공할 수 있다.Embodiments of the present invention can provide a micro device transfer device and a micro device transfer method that can effectively improve the transfer process efficiency of the micro device.
도 1은 본 발명의 일실시예에 따른 마이크로 소자 전사장치를 개략적으로 나타낸 구성도이다.1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부 및 제2흡착부를 중심으로 나타낸 예시도이다.2 is an exemplary view showing a first adsorption part and a second adsorption part of a micro device transfer apparatus according to an exemplary embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부를 중심으로 나타낸 작동예시도이다.3 is an operation example showing a center of the first adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부 및 제2흡착부를 중심으로 나타낸 작동예시도이다.4 is an operation example showing the first adsorption portion and the second adsorption portion of the micro device transfer apparatus according to an embodiment of the present invention.
도 5는 도 4의 마이크로 소자 및 타겟기판을 중심으로 나타낸 확대예시도이다.FIG. 5 is an enlarged exemplary view illustrating a micro device and a target substrate of FIG. 4.
도 6은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 가압부 및 안내부를 중심으로 나타낸 예시도이다.6 is an exemplary view showing a pressing part and a guide part of the micro device transferring apparatus according to the exemplary embodiment of the present invention.
도 7은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 가압부 및 안내부를 중심으로 하는 작동예를 나타낸 예시도이다.Figure 7 is an exemplary view showing an operation example centering on the pressing portion and the guide portion of the micro device transfer apparatus according to an embodiment of the present invention.
도 8은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 안내부를 중심으로 하는 작동예를 나타낸 예시도이다.8 is an exemplary view showing an operation example centering on the guide of the micro device transfer apparatus according to an embodiment of the present invention.
도 9는 본 발명의 일실시예에 따른 마이크로 소자 전사방법을 나타낸 흐름도이다.9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
이하, 첨부한 도면을 참조하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.
그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 붙였다.As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.
본 명세서에서, 동일한 구성요소에 대해서 중복된 설명은 생략한다.In this specification, duplicate descriptions of the same components are omitted.
또한 본 명세서에서, 어떤 구성요소가 다른 구성요소에 '연결되어' 있다거나 '접속되어' 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에 본 명세서에서, 어떤 구성요소가 다른 구성요소에 '직접 연결되어' 있다거나 '직접 접속되어' 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다.Also, in the present specification, when a component is referred to as being 'connected' or 'connected' to another component, the component may be directly connected to or connected to the other component, but in between It will be understood that may exist. On the other hand, in the present specification, when a component is referred to as 'directly connected' or 'directly connected' to another component, it should be understood that there is no other component in between.
또한, 본 명세서에서 사용되는 용어는 단지 특정한 실시예를 설명하기 위해 사용되는 것으로써, 본 발명을 한정하려는 의도로 사용되는 것이 아니다. Also, the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
또한 본 명세서에서, 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함할 수 있다. Also, in this specification, the singular forms may include the plural forms unless the context clearly indicates otherwise.
또한 본 명세서에서, '포함하다' 또는 '가지다' 등의 용어는 명세서에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품, 또는 이들을 조합한 것이 존재함을 지정하려는 것일 뿐, 하나 또는 그 이상의 다른 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 할 것이다.Also, as used herein, the term 'comprises' or 'having' is only intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more. It is to be understood that it does not exclude in advance the possibility of the presence or addition of other features, numbers, steps, actions, components, parts or combinations thereof.
또한 본 명세서에서, '및/또는' 이라는 용어는 복수의 기재된 항목들의 조합 또는 복수의 기재된 항목들 중의 어느 항목을 포함한다. 본 명세서에서, 'A 또는 B'는, 'A', 'B', 또는 'A와 B 모두'를 포함할 수 있다.Also in this specification, the term 'and / or' includes any combination of the plurality of listed items or any of the plurality of listed items. In the present specification, 'A or B' may include 'A', 'B', or 'both A and B'.
한편, 이하에서는 설명의 편의상, 전사필름(10)의 이송 방향을 기준으로 전단/전단부, 후단/후단부로 설명한다. 즉, 전사필름(10)이 제1지점에서 제2지점으로 이동되는 경우, 제1지점을 전단/전단부로, 제2지점을 후단/후단부로 하여 설명한다.In the following description, for convenience of explanation, the front / front and rear / rear ends will be described based on the transfer direction of the transfer film 10. That is, when the transfer film 10 is moved from the first point to the second point, it will be described with the first point as the front end / front end and the second point as the rear end / back end.
도 1은 본 발명의 일실시예에 따른 마이크로 소자 전사장치를 개략적으로 나타낸 구성도이다.1 is a schematic view showing a micro device transfer apparatus according to an exemplary embodiment of the present invention.
도 1에서 보는 바와 같이, 본 발명의 일실시예에 따른 마이크로 소자 전자장치는 제1흡착부(100), 제2흡착부(200), 정렬부(300), 이송부(400), 가압부(500) 그리고 안내부(600)를 포함할 수 있다.As shown in FIG. 1, the micro device electronic device according to an exemplary embodiment of the present invention may include a first adsorption part 100, a second adsorption part 200, an alignment part 300, a transfer part 400, and a pressing part ( 500 and the guide 600.
제1흡착부(100)에는 마이크로 소자가 점착된 전사필름(10)이 흡착될 수 있다.The transfer film 10 to which the micro device is attached may be adsorbed to the first adsorption part 100.
제2흡착부(200)는 제1흡착부(100)의 하측에 구비될 수 있으며, 제2흡착부(200)에는 전사필름(10)에 점착된 마이크로 소자가 전사될 타겟기판이 흡착될 수 있다.The second adsorption part 200 may be provided below the first adsorption part 100, and a target substrate on which the micro device adhered to the transfer film 10 may be adsorbed to the second adsorption part 200. have.
정렬부(300)는 제2흡착부(200)의 하측에 구비되고, 타겟기판과 전사필름(10)이 얼라인되도록 제2흡착부(200)의 위치를 정렬시킬 수 있다.The alignment unit 300 may be provided at the lower side of the second adsorption unit 200 to align the positions of the second adsorption unit 200 such that the target substrate and the transfer film 10 are aligned.
이송부(400)는 정렬부(300) 및 제2흡착부(200)를 제1수평방향으로 이송시킬 수 있다. 이때, 제2흡착부(200)에는 타겟기판(30)과 전사필름(10)의 마이크로 소자가 가점착된 상태로 구비될 수 있다.The transfer unit 400 may transfer the alignment unit 300 and the second adsorption unit 200 in the first horizontal direction. In this case, the second adsorption part 200 may be provided in a state where the micro elements of the target substrate 30 and the transfer film 10 are temporarily attached.
가압부(500)는 제2흡착부(200)가 이송되는 제1수평방향으로의 이송경로 상에 구비될 수 있다. 가압부(500)는 제2흡착부(200)의 상부에서 전사필름(10)을 가압하여 마이크로 소자가 타겟기판에 전사되도록 할 수 있다.The pressing unit 500 may be provided on a transfer path in the first horizontal direction in which the second adsorption unit 200 is transferred. The pressing unit 500 may press the transfer film 10 on the upper portion of the second adsorption unit 200 to allow the micro device to be transferred to the target substrate.
안내부(600)는 제2흡착부(200)가 이송되는 제1수평방향으로의 이송경로 상에서 가압부의 전단에 구비될 수 있다. 안내부(600)는 전사필름(10)이 가압부(500)를 지나는 지점에서 상측으로 벤딩되어 이동되도록 안내할 수 있다.The guide part 600 may be provided at the front end of the pressing part on a transport path in the first horizontal direction in which the second suction part 200 is transferred. The guide part 600 may guide the transfer film 10 to be bent upwards at a point passing through the pressing part 500.
이에 따라, 마이크로 소자가 타겟기판에 전사됨과 동시에 전사필름(10)은 상측으로 이동되면서 전사되는 마이크로 소자로부터 분리될 수 있다. 즉, 전사필름(10)이 마이크로 소자에서 분리되는 시점에 마이크로 소자는 가압부(500)에 의해 가압된 상태이기 때문에, 마이크로 소자가 전사필름(10)에 다시 점착되어 타겟기판에서 떨어지는 것이 방지될 수 있다.Accordingly, while the micro device is transferred onto the target substrate, the transfer film 10 may be separated from the micro device being transferred while moving upward. That is, since the micro device is pressed by the pressing unit 500 at the time when the transfer film 10 is separated from the micro device, the micro device may be prevented from sticking back to the transfer film 10 and falling off the target substrate. Can be.
즉, 마이크로 소자가 가압부(500)에 의해 가압되어 타겟기판(30)으로 전사되도록 함과 동시에 전사되는 마이크로 소자로부터 전사필름(10)이 분리될 수 있기 때문에, 전사필름(10)과 마이크로 소자간에 정밀한 수준의 점착력 제어가 없이도 안정적인 전사가 이루어질 수 있다.That is, since the transfer element 10 may be separated from the transferred micro element while the micro element is pressed by the pressing unit 500 to be transferred to the target substrate 30, the transfer film 10 and the micro element may be separated. Stable transfer can be achieved without precise control of adhesion to the liver.
즉, 전사필름(10)과 마이크로 소자 간의 점착력이 너무 강한 경우라도, 가압부(500)에 의해 마이크로 소자가 가압된 상태이기 때문에, 전사필름(10)이 마이크로 소자에서 분리되더라도 마이크로 소자는 타겟기판(30)에 전사된 상태를 효과적으로 유지할 수 있다.That is, even when the adhesive force between the transfer film 10 and the micro device is too strong, the micro device is pressed by the pressing unit 500, so that the micro device is a target substrate even if the transfer film 10 is separated from the micro device. The state transferred to 30 can be effectively maintained.
도 2는 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부 및 제2흡착부를 중심으로 나타낸 예시도이고, 도 3은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부를 중심으로 나타낸 작동예시도이며, 도 4는 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 제1흡착부 및 제2흡착부를 중심으로 나타낸 작동예시도이고, 도 5는 도 4의 마이크로 소자 및 타겟기판을 중심으로 나타낸 확대예시도이다.2 is an exemplary view showing a first adsorption portion and a second adsorption portion of a micro device transfer apparatus according to an embodiment of the present invention, and FIG. 3 is a first view of the micro device transfer apparatus according to an embodiment of the present invention. 4 is an operation example showing the adsorption unit, FIG. 4 is an operation example showing the first adsorption unit and the second adsorption unit, and FIG. 5 is a micro diagram of FIG. 4 according to an embodiment of the present invention. An enlarged view illustrating the device and the target substrate as a center.
도 2 내지 도 5에서 보는 바와 같이, 제1흡착부(100)는 제1베드(110), 제1부압제공홈(111) 및 회전부(120)를 가질 수 있다.2 to 5, the first adsorption part 100 may have a first bed 110, a first negative pressure providing groove 111, and a rotating part 120.
구체적으로, 도 2에 도시된 바와 같이 제1베드(110)에는 마이크로 소자(20)가 점착된 전사필름(10)이 흡착될 수 있다. 마이크로 소자(20)는 어레이 형태로 마련될 수 있다. 또한, 전사필름(10)에는 제1얼라인마크(11)가 형성될 수 있다. 제1얼라인마크(11)는 복수개가 형성될 수 있다.Specifically, as illustrated in FIG. 2, the transfer film 10 to which the micro device 20 is adhered may be adsorbed onto the first bed 110. The micro device 20 may be provided in an array form. In addition, the first alignment mark 11 may be formed on the transfer film 10. A plurality of first alignment marks 11 may be formed.
제1부압제공홈(111)은 제1베드(110)의 상면에 형성될 수 있다. 제1부압제공홈(111)의 적어도 일부분은 제1베드(110)를 관통하여 제1베드(110)의 하면으로 연결될 수 있으며, 부압발생부(미도시)와 연결될 수 있다.The first negative pressure providing groove 111 may be formed on an upper surface of the first bed 110. At least a portion of the first negative pressure providing groove 111 may be connected to the lower surface of the first bed 110 through the first bed 110 and may be connected to a negative pressure generating unit (not shown).
부압발생부에서 발생되는 부압은 제1부압제공홈(111)을 통해 제1베드(110)의 상면 및 상면에 놓인 전사필름(10) 사이에 부압을 제공할 수 있으며, 이를 통해, 전사필름(10)은 제1베드(110)에 흡착될 수 있다. 여기서, 부압은 진공압을 포함할 수 있다. The negative pressure generated by the negative pressure generating unit may provide a negative pressure between the upper surface and the transfer film 10 placed on the upper surface of the first bed 110 through the first negative pressure providing groove 111. 10 may be adsorbed onto the first bed 110. Here, the negative pressure may include a vacuum pressure.
제1베드(110)의 상면 및 전사필름(10) 사이의 흡착력이 안정적으로 발생할 수 있도록, 제1부압제공홈(111)은 제1베드(110)의 상면에 전체적으로 형성될 수 있다.The first negative pressure providing groove 111 may be entirely formed on the upper surface of the first bed 110 so that the adsorption force between the upper surface of the first bed 110 and the transfer film 10 may be stably generated.
회전부(120)는 제1베드(110)의 하부에 구비될 수 있으며, 제1베드(110)를 회전시킬 수 있다. 제1베드(110)의 상면에 전사필름(10)이 흡착되었을 때, 마이크로 소자(20)는 전사필름(10)의 상면에 점착된 상태일 수 있다. The rotating part 120 may be provided under the first bed 110 and may rotate the first bed 110. When the transfer film 10 is adsorbed on the upper surface of the first bed 110, the micro device 20 may be in a state of being adhered to the upper surface of the transfer film 10.
도 3에 도시된 것처럼, 회전부(120)에 의해 제1베드(110)가 180도 회전되면 제1베드(110)의 상면에 흡착된 전사필름(10)은 제1베드(110)의 하부로 위치가 이동되고, 전사필름(10)에 점착된 마이크로 소자(20)는 타겟기판(30)의 상면을 마주보도록 위치될 수 있다. As shown in FIG. 3, when the first bed 110 is rotated 180 degrees by the rotating unit 120, the transfer film 10 adsorbed on the upper surface of the first bed 110 moves to the lower portion of the first bed 110. The position is moved, and the micro device 20 adhered to the transfer film 10 may be positioned to face the upper surface of the target substrate 30.
제1베드(110)는 불투명 소재로 이루어질 수 있으며, 제1베드(110)에는 제1베드(110)의 두께 방향으로 관통공(112)이 형성될 수 있다.The first bed 110 may be made of an opaque material, and the through hole 112 may be formed in the thickness of the first bed 110 in the first bed 110.
타겟기판(30)에는 제1얼라인마크(11)에 대응되도록 제2얼라인마크(31)가 형성될 수 있는데, 관통공(112)은 제1얼라인마크(11) 및 제2얼라인마크(31)에 대응되는 위치에 형성될 수 있다.The second alignment mark 31 may be formed on the target substrate 30 so as to correspond to the first alignment mark 11, and the through hole 112 may include the first alignment mark 11 and the second alignment. It may be formed at a position corresponding to the mark 31.
제2흡착부(200)는 제2베드(210)와 제2부압제공홈(212)을 가질 수 있다.The second adsorption part 200 may have a second bed 210 and a second negative pressure providing groove 212.
제2베드(210)의 상부에는 안착홈(211)이 형성될 수 있으며, 안착홈(211)에는 타겟기판(30)이 안착될 수 있다. 타겟기판(30)의 상면에는 제2얼라인마크(31)가 형성될 수 있다.A mounting groove 211 may be formed in an upper portion of the second bed 210, and a target substrate 30 may be mounted in the mounting groove 211. The second alignment mark 31 may be formed on the upper surface of the target substrate 30.
타겟기판(30)이 안착홈(211)에 안착되었을 때, 타겟기판(30)의 상면은 제2베드(210)의 상면에 대응될 수 있다. 즉, 안착홈(211)에 안착된 타겟기판(30)의 상면은 제2베드(210)의 상면과 동일한 평면에 배치될 수 있다.When the target substrate 30 is seated in the seating groove 211, the upper surface of the target substrate 30 may correspond to the upper surface of the second bed 210. That is, the upper surface of the target substrate 30 seated in the seating groove 211 may be disposed on the same plane as the upper surface of the second bed 210.
제2부압제공홈(212)은 제2베드(210)의 상면에 형성될 수 있다. 구체적으로, 제2부압제공홈(212)은 안착홈(211)의 외측에 형성될 수 있다. 제2부압제공홈(212)의 적어도 일부분은 제2베드(210)를 관통하여 제2베드(210)의 하면으로 연결될 수 있으며, 부압발생부(미도시)와 연결될 수 있다. The second negative pressure providing groove 212 may be formed on an upper surface of the second bed 210. Specifically, the second negative pressure providing groove 212 may be formed on the outside of the mounting groove 211. At least a portion of the second negative pressure providing groove 212 may be connected to the lower surface of the second bed 210 through the second bed 210 and may be connected to a negative pressure generating unit (not shown).
한편, 도 4에 도시된 바와 같이, 마이크로 소자 전사장치는 촬영부(700)를 포함할 수 있다. 촬영부(700)는 제1흡착부(100)의 상측에 구비될 수 있으며, 마이크로 소자(20)가 타겟기판(30)의 상면에 대향되도록 제1흡착부(100)가 180도 회전된 상태에서 관통공(112)을 통해 제1얼라인마크(11)과 제2얼라인마크(31)를 촬영할 수 있다. On the other hand, as shown in Figure 4, the micro device transfer device may include a photographing unit 700. The photographing unit 700 may be provided on the upper side of the first adsorption unit 100, and the first adsorption unit 100 is rotated 180 degrees so that the micro device 20 faces the upper surface of the target substrate 30. In the through hole 112, the first alignment mark 11 and the second alignment mark 31 may be photographed.
다시 도 2를 참고할 때, 정렬부(300)는 제2흡착부(200)의 하부에 구비될 수 있으며, 베이스(310), 제1슬라이더(320), 제2슬라이더(330) 및 로테이터(340)를 가질 수 있다.Referring back to FIG. 2, the alignment unit 300 may be provided under the second adsorption unit 200, and may include a base 310, a first slider 320, a second slider 330, and a rotator 340. )
베이스(310)는 이송부(400)의 상부에 구비될 수 있으며, 그 상부에 제1수평방향(X축 방향)으로 연장되는 제1가이드(311)를 가질 수 있다.The base 310 may be provided at an upper portion of the transfer part 400, and may have a first guide 311 extending in a first horizontal direction (X-axis direction).
제1슬라이더(320)는 베이스(310)의 상부에 구비되고 제1가이드(311)와 슬라이딩 가능하도록 결합되어 제1수평방향(X축 방향)으로 왕복 이동될 수 있으며, 이를 통해 제1슬라이더(320)는 제2흡착부(200)를 제1수평방향(X축 방향)으로 이동시킬 수 있다. 제1슬라이더(320)는 상부에 제1수평방향(X축 방향)에 수직한 제2수평방향(Y축 방향)으로 연장되는 제2가이드(321)를 가질 수 있다.The first slider 320 is provided on the upper part of the base 310 and slidably coupled to the first guide 311 to reciprocate in the first horizontal direction (X-axis direction), thereby allowing the first slider ( 320 may move the second adsorption part 200 in the first horizontal direction (X-axis direction). The first slider 320 may have a second guide 321 extending in a second horizontal direction (Y-axis direction) perpendicular to the first horizontal direction (X-axis direction).
제2슬라이더(330)는 제1슬라이더(320)의 상부에 구비되고 제2가이드(321)와 슬라이딩 가능하도록 결합되어 제2수평방향(Y축 방향)으로 왕복 이동될 수 있으며, 이를 통해 제2슬라이더(330)는 제2흡착부(200)를 제2수평방향(Y축 방향)으로 이동시킬 수 있다.The second slider 330 is provided on the upper part of the first slider 320 and slidably coupled to the second guide 321 to be reciprocated in the second horizontal direction (Y-axis direction). The slider 330 may move the second adsorption part 200 in the second horizontal direction (Y-axis direction).
로테이터(340)는 제2슬라이더(330)의 상부에 구비될 수 있으며, 제2흡착부(200)의 하부에 구비될 수 있다. 로테이터(340)는 제1수평방향(X축 방향) 및 제2수평방향(Y축 방향)에 수직한 수직축(Z축)을 중심으로 회전될 수 있다. 이를 통해 로테이터(340)는 제2흡착부(200)를 수직축(Z축)을 중심으로 회전시킬 수 있다.The rotator 340 may be provided at an upper portion of the second slider 330 and may be provided at a lower portion of the second adsorption portion 200. The rotator 340 may be rotated about a vertical axis (Z axis) perpendicular to the first horizontal direction (X axis direction) and the second horizontal direction (Y axis direction). Through this, the rotator 340 may rotate the second adsorption part 200 about the vertical axis (Z axis).
정렬부(300)는 촬영부(700)에서 촬영되는 제1얼라인마크(11) 및 제2얼라인마크(31)를 기초로, 제2흡착부(200)를 제1수평방향(X축 방향) 및 제2수평방향(Y축 방향)으로 이동시키고 수직축(Z축)을 중심으로 회전시켜 타겟기판(30)의 위치를 조정할 수 있다. 이를 통해 제2얼라인마크(31)가 제1얼라인마크(11)와 얼라인되도록 할 수 있으며, 타겟기판(30)과 마이크로 소자(20)가 정위치 되도록 할 수 있다.The alignment unit 300 moves the second adsorption unit 200 in a first horizontal direction (X-axis) based on the first alignment mark 11 and the second alignment mark 31 photographed by the imaging unit 700. Direction) and the second horizontal direction (Y-axis direction) and rotate about the vertical axis (Z-axis) to adjust the position of the target substrate 30. Through this, the second alignment mark 31 may be aligned with the first alignment mark 11, and the target substrate 30 and the micro device 20 may be aligned.
제1얼라인마크(11) 및 제2얼라인마크(31)가 정위치되면, 제1흡착부(100)는 수직가이드(150)를 따라 하강될 수 있다. When the first alignment mark 11 and the second alignment mark 31 are positioned correctly, the first adsorption portion 100 may be lowered along the vertical guide 150.
한편, 제1베드(110)는 투명 소재로 이루어질 수 있다. 이 경우, 타겟기판(30)에 형성되는 제2얼라인마크(31)는 제1베드(110)를 투과하여 촬영부(700)에 의해 촬영될 수 있으며, 전술한 관통공의 구성은 생략될 수 있다.Meanwhile, the first bed 110 may be made of a transparent material. In this case, the second alignment mark 31 formed on the target substrate 30 may be photographed by the photographing unit 700 through the first bed 110, and the above-described configuration of the through hole may be omitted. Can be.
도 5에 도시된 것처럼, 제1흡착부(100)가 하강하면 마이크로 소자(20)의 제1단자(21)가 타겟기판(30)의 제2단자(32)의 상측에 얼라인된 상태로 위치될 수 있다. 이때, 제1단자(21) 및 제2단자(32)의 사이에는 솔더(40)가 마련된 상태일 수 있다. As shown in FIG. 5, when the first adsorption part 100 descends, the first terminal 21 of the micro device 20 is aligned on the upper side of the second terminal 32 of the target substrate 30. Can be located. In this case, the solder 40 may be provided between the first terminal 21 and the second terminal 32.
제1단자(21)가 솔더(40)에 닿도록 제1흡착부(100)가 하강한 상태에서, 제1부압제공홈(111)에서 부압의 제공이 중지되고, 제2부압제공홈(212)에서 부압이 제공되면, 제2베드(210)의 상면 및 전사필름(10) 사이에 부압이 형성되어 전사필름(10)은 제2베드(210)에 흡착될 수 있다. 이를 통해, 제1단자(21) 및 제2단자(32)는 가점착될 수 있으며(도 5 참조), 전사필름(10)은 제2베드(210)에 흡착된 상태로 이송부(400)에 의해 이송될 수 있다.In the state where the first adsorption portion 100 is lowered so that the first terminal 21 contacts the solder 40, the supply of the negative pressure is stopped in the first negative pressure providing groove 111, and the second negative pressure providing groove 212 is stopped. In the case where negative pressure is provided, negative pressure is formed between the upper surface of the second bed 210 and the transfer film 10 so that the transfer film 10 may be absorbed by the second bed 210. As a result, the first terminal 21 and the second terminal 32 may be temporarily attached (see FIG. 5), and the transfer film 10 may be attached to the transfer unit 400 in a state of being adsorbed by the second bed 210. Can be transported by
한편, 안착홈(211)의 바닥면에도 부압제공홈이 더 형성될 수 있으며, 상기 부압제공홈을 통해 타겟기판(30)의 하면과 안착홈(211)의 바닥면 사이에 부압이 형성될 수 있다. 이를 통해, 타겟기판(30)이 안착홈(211)에 안착된 상태에서 고정될 수 있다.Meanwhile, a negative pressure providing groove may be further formed on the bottom surface of the mounting groove 211, and a negative pressure may be formed between the bottom surface of the target substrate 30 and the bottom surface of the mounting groove 211 through the negative pressure providing groove. have. Through this, the target substrate 30 may be fixed in a state in which the mounting groove 211 is seated.
도 6은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 가압부 및 안내부를 중심으로 나타낸 예시도이고, 도 7은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 가압부 및 안내부를 중심으로 하는 작동예를 나타낸 예시도이고, 도 8은 본 발명의 일실시예에 따른 마이크로 소자 전사장치의 안내부를 중심으로 하는 작동예를 나타낸 예시도이다. 이하에서는 도 6 내지 도 8을 더 포함하여 설명한다.6 is an exemplary view showing a pressing part and a guide of a micro device transferring apparatus according to an exemplary embodiment of the present invention, and FIG. 7 illustrates a pressing part and a guide of a micro device transferring apparatus according to an embodiment of the present invention. 8 is an exemplary view showing an operation example, and FIG. 8 is an exemplary view showing an operation example centering on a guide of a micro device transfer apparatus according to an exemplary embodiment of the present invention. Hereinafter, a description will be made further including FIGS. 6 to 8.
도 6 내지 도 8을 더 포함해서 보는 바와 같이, 가압부(500)는 제2수평방향(Y축 방향)으로 연장되는 가압롤러(510)를 가질 수 있다. 가압롤러(510)는 제2수평방향(Y축 방향)으로 연장된 회전축(511)을 중심으로 회전될 수 있다. 가압롤러(510)는 제2흡착부(200)가 이송되는 제1수평방향(X축 방향)으로의 이송경로 상에서 제2흡착부(200)의 전단에 구비될 수 있다. As further shown in FIGS. 6 to 8, the pressing unit 500 may have a pressing roller 510 extending in the second horizontal direction (Y-axis direction). The pressure roller 510 may be rotated about the rotation shaft 511 extending in the second horizontal direction (Y-axis direction). The pressure roller 510 may be provided at the front end of the second adsorption part 200 on a transport path in the first horizontal direction (X-axis direction) in which the second adsorption part 200 is transferred.
가압롤러(510)는 제1수평방향(X축 방향)으로 이송되는 전사필름(10)을 가압할 수 있다.The pressure roller 510 may press the transfer film 10 transferred in the first horizontal direction (X-axis direction).
따라서, 전사필름(10)에 점착된 상태로 이송되는 마이크로 소자(20) 어레이 중에 제2수평방향(Y축 방향)으로 마련되는 마이크로 소자는 가압롤러(510)에 의해 동시에 가압될 수 있고, 타겟기판(30)에 전사될 수 있다.Therefore, the micro devices provided in the second horizontal direction (Y-axis direction) in the micro device 20 array transferred to the transfer film 10 may be simultaneously pressed by the pressure roller 510, and the target may be simultaneously pressed. It may be transferred to the substrate 30.
한편, 도 6에 도시된 것처럼, 안내부(600)는 제1안내롤러(610) 및 제2안내롤러(620)를 가질 수 있으며, 제1안내롤러(610) 및 제2안내롤러(620)는 가압롤러(510)의 전단에 구비될 수 있다. Meanwhile, as shown in FIG. 6, the guide part 600 may have a first guide roller 610 and a second guide roller 620, and the first guide roller 610 and the second guide roller 620. It may be provided at the front end of the pressure roller 510.
도 7을 참고할 때, 제1안내롤러(610)는 제2수평방향(Y축 방향)으로 연장 구비될 수 있으며, 제1수평방향(X축 방향)으로 이송되는 전사필름(10)의 하면을 지지할 수 있다.Referring to FIG. 7, the first guide roller 610 may be provided extending in the second horizontal direction (Y-axis direction), and the lower surface of the transfer film 10 transferred in the first horizontal direction (X-axis direction). I can support it.
제2안내롤러(620)는 제1안내롤러(610)의 상측에 제1안내롤러(610)와 평행하게 구비될 수 있으며, 제1안내롤러(610)와 Z축 방향으로 이격되어 구비될 수 있다. 제1안내롤러(610) 및 제2안내롤러(620)의 사이로는 제1수평방향(X축 방향)으로 이송되는 전사필름(10)이 삽입될 수 있다. The second guide roller 620 may be provided in parallel with the first guide roller 610 on the upper side of the first guide roller 610, and may be provided spaced apart from the first guide roller 610 in the Z-axis direction. have. A transfer film 10 transferred in the first horizontal direction (X-axis direction) may be inserted between the first guide roller 610 and the second guide roller 620.
제1안내롤러(610), 제2안내롤러(620) 및 가압롤러(510)는 플랜지(630)에 결합될 수 있다. 또한, 제1안내롤러(610) 및 제2안내롤러(620)는 가압롤러(510)의 회전축(511)을 중심으로 상하 방향으로 회전될 수 있으며, 이를 통해, 도 8에 도시된 것처럼 전사필름(10)의 벤딩각도(A)가 조절될 수 있다.The first guide roller 610, the second guide roller 620 and the pressure roller 510 may be coupled to the flange 630. In addition, the first guide roller 610 and the second guide roller 620 may be rotated in the vertical direction about the rotation axis 511 of the pressure roller 510, through which, as shown in Figure 8 transfer film The bending angle A of 10 may be adjusted.
즉, 제2안내롤러(620)가 가압롤러(510)와 동일한 높이에 위치된 상태에서 제2흡착부(200)가 제1수평방향(X축 방향)으로 이송되면, 전사필름(10)은 제1안내롤러(610) 및 제2안내롤러(620)의 사이로 유입될 수 있다(도 7의 (a) 참조).That is, when the second adsorption portion 200 is transferred in the first horizontal direction (X-axis direction) while the second guide roller 620 is positioned at the same height as the pressure roller 510, the transfer film 10 It may be introduced between the first guide roller 610 and the second guide roller 620 (see Fig. 7 (a)).
그리고, 제1안내롤러(610) 및 제2안내롤러(620)가 상향으로 회전되고 제2흡착부(200)가 제1수평방향(X축 방향)으로 계속 이송되면 전사필름(10)은 가압롤러(510)에 의해 가압될 수 있다. 이때, 전사필름(10)은 가압롤러(510)를 지나는 지점에서 상측으로 벤딩될 수 있다(도 7의 (b) 참조). When the first guide roller 610 and the second guide roller 620 are rotated upward and the second suction part 200 continues to be transferred in the first horizontal direction (X-axis direction), the transfer film 10 is pressurized. It may be pressed by the roller 510. At this time, the transfer film 10 may be bent upward at the point passing the pressure roller 510 (see (b) of Figure 7).
따라서, 전사필름(10)에 점착된 마이크로 소자(20)는 가압롤러(510)에 의해 가압되어 타겟기판(30)으로 전사될 수 있으며, 마이크로 소자(20)가 타겟기판(30)으로 전사됨과 동시에 전사필름(10)은 전사되는 마이크로 소자(20)로부터 분리될 수 있다. Therefore, the micro device 20 adhered to the transfer film 10 may be pressed by the pressure roller 510 to be transferred to the target substrate 30, and the micro device 20 may be transferred to the target substrate 30. At the same time, the transfer film 10 may be separated from the micro device 20 to be transferred.
본 발명의 일실시예에 따르면, 가압롤러(510)에 의해 마이크로 소자(20)가 가압되고 타겟기판(30)으로 전사되도록 함과 동시에 전사되는 마이크로 소자로부터 전사필름(10)이 분리되도록 할 수 있기 때문에, 전사필름(10)과 마이크로 소자(20) 간에 정밀한 수준의 점착력 제어가 없이도 안정적인 전사가 이루어질 수 있다. 즉, 전사필름(10)과 마이크로 소자(20) 간의 점착력이 너무 강한 경우에도, 가압롤러(510)에 의해 마이크로 소자(20)가 가압된 상태이기 때문에, 전사필름(10)이 마이크로 소자(20)에서 분리되더라도 마이크로 소자(20)는 타겟기판(30)에 전사된 상태를 유지할 수 있다.According to an embodiment of the present invention, the microfilm 20 is pressed by the pressure roller 510 and transferred to the target substrate 30, and at the same time, the transfer film 10 may be separated from the microdevice being transferred. Since the transfer film 10 and the micro device 20 can be a stable transfer without the precise level of adhesion control. That is, even when the adhesive force between the transfer film 10 and the micro element 20 is too strong, since the micro element 20 is pressed by the pressure roller 510, the transfer film 10 is the micro element 20. The micro device 20 may be transferred to the target substrate 30 even if the micro device 20 is removed from the target substrate 30.
더하여, 제1안내롤러(610) 및 제2안내롤러(620)는 마이크로 소자(20)의 크기, 두께 및 표면상태에 따라 전사필름(10)의 벤딩각도(A)를 조절할 수 있다. 즉, 마이크로 소자(20)의 크기, 두께 및 표면 상태에 따라 마이크로 소자(20)와 전사필름(10)과의 점착력이 달라질 수 있기 때문에, 전사되는 마이크로 소자로부터 전사필름(10)을 분리시키기 위해서는 점착력에 따라 전사필름(10)의 적절한 굽힘 변형(Strain Mismatch)이 필요하다. 전사될 마이크로 소자의 크기, 두께 및 표면상태와, 전사필름(10)에 대한 정보가 미리 확인되면 요구되는 전사필름(10)의 굽힘 변형이 계산될 수 있고, 이에 따라 제1안내롤러(610) 및 제2안내롤러(620)의 회전 각도는 조절될 수 있다.In addition, the first guide roller 610 and the second guide roller 620 may adjust the bending angle A of the transfer film 10 according to the size, thickness, and surface state of the micro device 20. That is, since the adhesion between the micro device 20 and the transfer film 10 may vary according to the size, thickness, and surface state of the micro device 20, in order to separate the transfer film 10 from the transferred micro device. According to the adhesive force, appropriate strain strain (Strain Mismatch) of the transfer film 10 is required. If the size, thickness and surface state of the micro device to be transferred and the information on the transfer film 10 are confirmed in advance, the required bending deformation of the transfer film 10 can be calculated, and accordingly, the first guide roller 610. And the rotation angle of the second guide roller 620 may be adjusted.
이하에서는 마이크로 소자 전사방법에 대해서 설명한다.Hereinafter, the micro device transfer method will be described.
도 9는 본 발명의 일실시예에 따른 마이크로 소자 전사방법을 나타낸 흐름도이다.9 is a flowchart illustrating a method of transferring a micro device according to an embodiment of the present invention.
도 9에서 보는 바와 같이, 마이크로 소자 전사방법은 제1흡착단계(S810), 제2흡착단계(S820), 정렬단계(S830), 가점착단계(S840), 이송단계(S850), 전사단계(S860) 그리고 분리단계(S870)를 포함할 수 있다. As shown in FIG. 9, the micro device transfer method includes a first adsorption step (S810), a second adsorption step (S820), an alignment step (S830), a temporary adhesion step (S840), a transfer step (S850), and a transfer step ( S860) and may include a separation step (S870).
제1흡착단계(S810)는 마이크로 소자가 점착된 전사필름을 제1흡착부에 흡착시키는 단계일 수 있다. The first adsorption step S810 may be a step of adsorbing the transfer film to which the micro device is attached to the first adsorption unit.
제1흡착단계(S810)에서는, 마이크로 소자가 점착된 전사필름을 제1흡착부에 위치시키고, 제1흡착부 및 전사필름 사이에 부압을 제공하여 전사필름을 제1흡착부에 흡착시킬 수 있다.In the first adsorption step (S810), the transfer film to which the micro device is attached may be placed on the first adsorption part, and a negative pressure may be provided between the first adsorption part and the transfer film to adsorb the transfer film to the first adsorption part. .
제2흡착단계(S820)는 제1흡착부의 하측에 구비되는 제2흡착부에 마이크로 소자가 전사될 타겟기판을 흡착시키는 단계일 수 있다. The second adsorption step (S820) may be a step of adsorbing the target substrate to which the micro device is transferred to the second adsorption unit provided under the first adsorption unit.
제2흡착단계(S820)에서는, 타겟기판을 제2흡착부에 위치시키고, 제2흡착부 및 타겟기판 사이에 부압을 제공하여 타겟기판을 제2흡착부에 흡착시킬 수 있다.In the second adsorption step (S820), the target substrate may be positioned on the second adsorption unit, and a negative pressure may be provided between the second adsorption unit and the target substrate to adsorb the target substrate to the second adsorption unit.
정렬단계(S830)는 타겟기판과 전사필름이 얼라인되도록 제2흡착부의 위치를 정렬하는 단계일 수 있다.The alignment step S830 may be a step of aligning the position of the second adsorption unit such that the target substrate and the transfer film are aligned.
정렬단계(S830)는 회전단계(S831), 촬영단계(S832) 그리고 정위치단계(S833)를 가질 수 있다.The alignment step S830 may have a rotation step S831, a photographing step S832, and an exact position step S833.
회전단계(S831)는 전사필름에 점착된 마이크로 소자가 타겟기판의 상면에 대향되도록 제1흡착부를 회전시키는 단계일 수 있다. The rotating step S831 may be a step of rotating the first adsorption part such that the micro device adhered to the transfer film faces the upper surface of the target substrate.
촬영단계(S832)는 제1흡착부의 상측에 구비되는 촬영부가 제1흡착부를 통해 전사필름에 형성되는 제1얼라인마크와 타겟기판에 형성되는 제2얼라인마크를 촬영하는 단계일 수 있다.The photographing step (S832) may be a step of photographing the first alignment mark formed on the transfer film and the second alignment mark formed on the target substrate through the first adsorption unit provided on the upper side of the first adsorption unit.
여기서, 제1흡착부가 불투명 소재로 이루어지는 경우, 촬영부는 제1흡착부에 형성되는 관통공을 통해 제2얼라인마크를 촬영할 수 있다. Here, when the first adsorption part is made of an opaque material, the photographing part may photograph the second alignment mark through the through hole formed in the first adsorption part.
반면, 제1흡착부가 투명 소재로 이루어지는 경우, 촬영부는 제1흡착부를 투과하여 제2얼라인마크를 촬영할 수 있다.On the other hand, when the first adsorption part is made of a transparent material, the photographing part may pass through the first adsorption part to photograph the second alignment mark.
정위치단계(S833)는 정렬부가 제2흡착부를 제1수평방향 및 제1수평방향에 수직한 제2수평방향으로 왕복 이동시키고, 제1수평방향에 수직한 수직축을 중심으로 회전시켜, 제2얼라인마크가 제1얼라인마크와 얼라인됨으로써 타겟기판과 마이크로 소자가 정위치되도록 하는 단계일 수 있다.In the positioning step S833, the alignment unit reciprocates the second adsorption unit in the first horizontal direction and in the second horizontal direction perpendicular to the first horizontal direction, and rotates the second absorption unit about the vertical axis perpendicular to the first horizontal direction. The alignment mark may be aligned with the first alignment mark so that the target substrate and the micro device may be aligned.
정위치 과정은 촬영부에서 촬영되는 얼라인마크의 위치정보를 참고하여 이루어지기 때문에, 정위치단계(S833)는 촬영단계(S832)와 동시에 이루어질 수 있다.Since the exact position process is performed by referring to the position information of the alignment mark photographed by the photographing unit, the exact position step S833 may be performed simultaneously with the photographing step S832.
가점착단계(S840)는 제1흡착부를 하강시키고 타겟기판에 마이크로 소자를 가점착시키는 단계일 수 있다.The temporary adhesion step S840 may be a step of lowering the first adsorption unit and temporarily attaching the micro device to the target substrate.
가점착단계(S840)는 하강단계(S841) 및 고정단계(S842)를 가질 수 있다. The temporary adhesion step S840 may have a descending step S841 and a fixing step S842.
하강단계(S841)는 정위치단계(S833) 이후에 제1흡착부를 하강시키는 단계일 수 있다. The lowering step S841 may be a step of lowering the first adsorption part after the correct position step S833.
고정단계(S842)는 마이크로 소자의 제1단자가 안착홈에 안착된 타겟기판의 제2단자에 정위치되도록 한 상태에서 제2흡착부 및 전사필름 사이에 부압을 제공하여 고정시키는 단계일 수 있다.The fixing step S842 may be a step of providing and fixing a negative pressure between the second adsorption part and the transfer film in a state in which the first terminal of the micro device is positioned at the second terminal of the target substrate seated in the mounting groove. .
이송단계(S850)는 정렬부 및 제2흡착부를 제1수평방향으로 이송시키는 단계일 수 있다.The transfer step S850 may be a step of transferring the alignment unit and the second adsorption unit in the first horizontal direction.
전사단계(S860)는 제1수평방향으로의 이송경로 상에 구비되는 가압부가 가점착된 상태로 이송되는 제2흡착부의 상부에서 전사필름을 가압하여 마이크로 소자를 타겟기판에 전사시키는 단계일 수 있다.The transferring step (S860) may be a step of transferring the micro device to the target substrate by pressing the transfer film on the upper portion of the second adsorption portion is conveyed in a state that the pressing portion provided on the transfer path in the first horizontal direction. .
전사단계(S860)에서, 제1수평방향에 수직한 제2수평방향으로 연장 구비되는 가압롤러는 공급되는 마이크로 소자 어레이 중에 제2수평방향으로 마련되는 마이크로 소자를 동시에 가압할 수 있다.In the transferring step (S860), the pressing roller extending in the second horizontal direction perpendicular to the first horizontal direction may simultaneously press the micro devices provided in the second horizontal direction in the micro device array supplied.
분리단계(S870)는 제1수평방향으로의 이송경로 상에서 가압부의 전단에 구비되는 안내부가 전사필름이 가압부를 지나는 지점에서 전사필름이 상측으로 벤딩되어 이동되도록 안내하여, 전사되는 마이크로 소자로부터 전사필름을 분리시키는 단계일 수 있다.Separation step (S870) is a guide portion provided at the front end of the pressing portion on the transfer path in the first horizontal direction to guide the transfer film is bent to move upwards at the point where the transfer film passes the pressing portion, the transfer film from the transferred micro device It may be a step of separating.
분리단계(S870)에서는 안내부가 상하 방향으로 이동되어 가압부에서 벤딩되는 전사필름의 벤딩각도를 조절할 수 있다.In the separating step (S870), the guide portion is moved in the vertical direction to adjust the bending angle of the transfer film bent in the pressing portion.
분리단계(S870)에서 안내부는 마이크로 소자의 크기, 두께 및 표면상태에 따라 전사필름의 벤딩각도를 조절할 수 있으며, 이를 통해, 마이크로 소자 전사 시, 전사필름의 제거가 효과적으로 이루어질 수 있다.In the separating step (S870), the guide portion can adjust the bending angle of the transfer film according to the size, thickness and surface state of the micro device, and through this, when the micro device is transferred, the transfer film can be effectively removed.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.
본 발명의 범위는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the invention is indicated by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the invention.
- 부호의 설명 -Description of the sign
10: 전사필름 20: 마이크로 소자10: transfer film 20: micro device
30: 타겟기판 100: 제1흡착부30: target substrate 100: first adsorption portion
200: 제2흡착부 300: 정렬부200: second adsorption portion 300: alignment portion
400: 이송부 500: 가압부400: conveying part 500: pressurizing part
510: 가압롤러 600: 안내부510: pressure roller 600: guide portion
610: 제1안내롤러 620: 제2안내롤러610: first guide roller 620: second guide roller
700: 촬영부700: shooting unit

Claims (18)

  1. 마이크로 소자가 점착된 전사필름이 흡착되는 제1흡착부; A first adsorption part to which the transfer film adhered to the micro device is adsorbed;
    타겟기판이 안착되고, 상기 제1흡착부로부터 제공되는 상기 전사필름이 흡착되는 제2흡착부; A second adsorption part on which a target substrate is seated and on which the transfer film provided from the first adsorption part is adsorbed;
    상기 제2흡착부를 제1수평방향으로 이송시키는 이송부;A transfer unit configured to transfer the second suction unit in a first horizontal direction;
    이송되는 상기 제2흡착부의 상기 전사필름을 가압하여 상기 마이크로 소자를 상기 타겟기판에 전사시키는 가압부; 및A pressurizing unit which presses the transfer film to transfer the micro device to the target substrate by pressing the transfer film to be transferred; And
    상기 제1수평방향으로의 이송경로에서 상기 가압부의 전단에 구비되고,It is provided at the front end of the pressing portion in the transport path in the first horizontal direction,
    상기 가압부를 지나는 상기 전사필름을 상기 타겟기판으로부터 멀어지도록 안내하여 상기 전사필름을 상기 마이크로 소자로부터 분리시키는 안내부;를 포함하는 마이크로 소자 전사장치.And a guide part for guiding the transfer film passing through the pressing part away from the target substrate to separate the transfer film from the micro device.
  2. 제1항에 있어서, The method of claim 1,
    상기 제1흡착부는,The first adsorption part,
    상기 전사필름이 흡착되는 제1베드; A first bed to which the transfer film is adsorbed;
    상기 제1베드의 일면에 형성되어 상기 제1베드 및 상기 전사필름 사이에 부압을 제공하는 제1부압제공홈; 및A first negative pressure providing groove formed on one surface of the first bed to provide negative pressure between the first bed and the transfer film; And
    상기 전사필름의 상기 마이크로 소자가 상기 제2흡착부의 상기 타겟기판을 마주보도록 상기 제1베드를 회전시키는 회전부;를 포함하는 마이크로 소자 전사장치.And a rotating part rotating the first bed such that the micro device of the transfer film faces the target substrate of the second adsorption part.
  3. 제1항에 있어서,The method of claim 1,
    상기 타겟기판과 상기 전사필름이 얼라인되도록 상기 제2흡착부의 위치를 정렬시키는 정렬부;를 더 포함하는 마이크로 소자 전사장치.And an alignment unit to align the position of the second adsorption unit so that the target substrate and the transfer film are aligned.
  4. 제3항에 있어서,The method of claim 3,
    상기 정렬부는,The alignment unit,
    이송부상에 배치되는 베이스;A base disposed on the conveying part;
    상기 베이스 상부에 상기 제1수평방향으로 슬라이딩 가능하도록 결합되는 제1슬라이더;A first slider coupled to the upper part of the base so as to slide in the first horizontal direction;
    상기 제1슬라이더 상부에 상기 제1수평방향에 수직한 제2수평방향으로 슬라이딩 가능하도록 결합되는 제2슬라이더; 및A second slider coupled to the first slider so as to be slidable in a second horizontal direction perpendicular to the first horizontal direction; And
    상기 제2슬라이더 상부에 구비되고 상기 제2흡착부를 지지하며, 상기 제1수평방향 및 제2수평방향에 수직한 수직축을 중심으로 상기 제2흡착부를 회전시키는 로테이터;를 포함하는 마이크로 소자 전사장치.And a rotator provided on the second slider and supporting the second adsorption part, and rotating the second adsorption part about a vertical axis perpendicular to the first horizontal direction and the second horizontal direction.
  5. 제1항에 있어서,The method of claim 1,
    상기 전사필름에는 제1얼라인마크가 형성되고,The first alignment mark is formed on the transfer film,
    상기 타겟기판에는 제2얼라인마크가 형성되며,A second alignment mark is formed on the target substrate,
    상기 제1얼라인마크 및 상기 제2얼라인마크의 위치를 촬영하는 촬영부;를 더 포함하는 마이크로 소자 전사장치.And a photographing unit which photographs positions of the first alignment mark and the second alignment mark.
  6. 제5항에 있어서,The method of claim 5,
    상기 제1흡착부는 상기 제2흡착부의 상측에 위치되고, The first adsorption part is located above the second adsorption part,
    상기 제1베드는 불투명 소재로 이루어지며, 상기 제2얼라인마크와 대응되는 위치에 관통공이 형성되고,The first bed is made of an opaque material, the through hole is formed at a position corresponding to the second alignment mark,
    상기 촬영부는 상기 제1흡착부의 상측에 구비되어 상기 관통공을 통해 상기 제2얼라인마크를 촬영하는 마이크로 소자 전사장치.The photographing unit is provided on the upper side of the first adsorption unit micro device transfer apparatus for photographing the second alignment mark through the through hole.
  7. 제5항에 있어서,The method of claim 5,
    상기 제1흡착부는 상기 제2흡착부의 상측에 위치되고, The first adsorption part is located above the second adsorption part,
    상기 제1베드는 투명 소재로 이루어지며,The first bed is made of a transparent material,
    상기 촬영부는 상기 제1흡착부의 상측에 구비되고, 상기 제1베드를 투과하여 상기 제2얼라인마크를 촬영하는 마이크로 소자 전사장치.The photographing unit is provided on the upper side of the first adsorption unit, the micro device transfer device for penetrating the first bed to capture the second alignment mark.
  8. 제1항에 있어서, The method of claim 1,
    상기 제2흡착부는, The second adsorption part,
    상기 타겟기판이 안착되도록 상면에 함몰 형성되는 안착홈을 가지는 제2베드; 및A second bed having a mounting recess formed in an upper surface of the target substrate so as to be seated thereon; And
    상기 제2베드의 일면에 형성되어 상기 제1흡착부로부터 제공되는 상기 전사필름 및 상기 제2베드 사이에 부압을 제공하여 상기 전사필름의 상기 마이크로 소자를 상기 타겟기판상에 가점착시키는 제2부압제공홈;을 포함하는 마이크로 소자 전사장치.A second negative pressure formed on one surface of the second bed to provide a negative pressure between the transfer film and the second bed provided from the first adsorption part to temporarily adhere the micro element of the transfer film onto the target substrate; Micro device transfer apparatus comprising a; groove.
  9. 제1항에 있어서, The method of claim 1,
    상기 안내부는 위치가 이동되어 상기 가압부를 지나는 상기 전사필름이 벤딩되는 벤딩각도를 조절하는 마이크로 소자 전사장치.The guide portion is a micro device transfer device for adjusting the bending angle of the transfer film is bent the transfer film passing through the pressing portion.
  10. 제9항에 있어서, The method of claim 9,
    상기 가압부는, 상기 제2흡착부에 배치된 상기 전사필름을 상기 타겟기판측으로 가압하는 가압롤러;를 포함하며,And a pressurizing part comprising: a pressurizing roller pressurizing the transfer film disposed on the second adsorption part toward the target substrate.
    상기 안내부는 상기 가압롤러의 회전축을 중심으로 회전되어 상기 벤딩각도를 조절하는 마이크로 소자 전사장치.The guide unit is rotated about a rotation axis of the pressing roller to adjust the bending angle micro device transfer device.
  11. 마이크로 소자가 점착된 전사필름을 제1흡착부에 흡착시키는 제1흡착단계;A first adsorption step of adsorbing the transfer film adhered to the micro device to the first adsorption part;
    제2흡착부에 타겟기판을 흡착시키는 제2흡착단계;A second adsorption step of adsorbing the target substrate to the second adsorption part;
    상기 제1흡착부의 상기 전사필름을 상기 제2흡착부에 제공하여 상기 전사필름의 상기 마이크로 소자를 상기 타겟기판에 가점착시키는 가점착단계;Provision-adhesive step of providing the transfer film of the first adsorption part to the second adsorption part to temporarily attach the micro element of the transfer film to the target substrate;
    이송부가 상기 제2흡착부를 제1수평방향으로 이송시키는 이송단계;A transfer step of a transfer unit transferring the second adsorption unit in a first horizontal direction;
    가압부가 제2흡착부의 상기 전사필름을 가압하여 상기 마이크로 소자를 상기 타겟기판에 전사시키는 전사단계; 및A pressurizing unit pressurizing the transfer film of a second adsorption unit to transfer the micro device to the target substrate; And
    상기 제1수평방향으로의 이송경로에서 상기 가압부의 전단에 구비되는 안내부가 상기 가압부를 지나는 상기 전사필름을 상기 타겟기판으로부터 멀어지도록 안내하여 상기 전사필름을 상기 마이크로 소자로부터 분리시키는 분리단계;를 포함하는 마이크로 소자 전사방법.A separating step of separating the transfer film from the micro device by guiding the transfer part provided at the front end of the pressing part in the transfer path in the first horizontal direction away from the target substrate through the transfer film passing through the pressing part. Micro device transfer method.
  12. 제11항에 있어서,The method of claim 11,
    상기 제1흡착단계에서는, 상기 전사필름을 제1흡착부에 위치시키고, 제1부압제공홈을 통해 상기 제1흡착부 및 상기 전사필름 사이에 부압을 제공하여 상기 전사필름을 상기 제1흡착부에 흡착시키는 마이크로 소자 전사방법.In the first adsorption step, the transfer film is positioned on the first adsorption part, and a negative pressure is provided between the first adsorption part and the transfer film through a first subcompression providing groove to transfer the transfer film to the first adsorption part. Micro element transfer method to be adsorbed on.
  13. 제11항에 있어서,The method of claim 11,
    상기 제2흡착단계에서는, 상기 타겟기판을 제2흡착부의 안착홈에 위치시키고, 상기 안착홈 및 상기 타겟기판 사이에 부압을 제공하여 상기 타겟기판을 상기 제2흡착부에 흡착시키는 마이크로 소자 전사방법.In the second adsorption step, the target substrate is positioned in the mounting groove of the second adsorption unit, and a micro element transfer method for adsorbing the target substrate to the second adsorption unit by providing a negative pressure between the mounting groove and the target substrate. .
  14. 제11항에 있어서,The method of claim 11,
    상기 정렬단계는,The sorting step,
    상기 제1흡착부의 상기 전사필름에 점착된 상기 마이크로 소자가 상기 타겟기판을 마주보도록 상기 제1흡착부를 회전시키는 회전단계;A rotation step of rotating the first adsorption part such that the micro device adhered to the transfer film of the first adsorption part faces the target substrate;
    촬영부가 상기 전사필름에 형성되는 제1얼라인마크 및 상기 타겟기판에 형성되는 제2얼라인마크를 촬영하는 촬영단계; 및A photographing step of photographing a first alignment mark formed on the transfer film and a second alignment mark formed on the target substrate; And
    정렬부가 상기 제2흡착부를 상기 제1수평방향 및 상기 제1수평방향에 수직한 제2수평방향으로 이동시키고, 상기 제1수평방향 및 상기 제2수평방향에 수직한 수직축을 중심으로 회전시킴으로써, 상기 제1얼라인마크 및 상기 제2얼라인마크를 얼라인시키고 상기 타겟기판과 상기 마이크로 소자를 정위치에 배치시키는 정위치단계;를 포함하는 마이크로 소자 전사방법.An alignment unit moves the second suction unit in the second horizontal direction perpendicular to the first horizontal direction and the first horizontal direction, and rotates about a vertical axis perpendicular to the first horizontal direction and the second horizontal direction, And an alignment step of aligning the first align mark and the second align mark and arranging the target substrate and the micro element in a correct position.
  15. 제14항에 있어서,The method of claim 14,
    상기 촬영단계에서, 상기 촬영부는 불투명 소재로 이루어지는 상기 제1흡착부의 상측에 배치되고, 상기 제1흡착부에 형성되는 관통공을 통해 상기 제1흡착부의 하측에 위치되는 상기 제2얼라인마크를 촬영하는 마이크로 소자 전사방법.In the photographing step, the photographing part is disposed above the first adsorption part made of an opaque material, and marks the second alignment mark positioned below the first adsorption part through a through hole formed in the first adsorption part. Micro element transfer method to photograph.
  16. 제14항에 있어서,The method of claim 14,
    상기 촬영단계에서, 상기 촬영부는 투명 소재로 이루어지는 상기 제1흡착부의 상측에 배치되고, 상기 제1흡착부를 투과하여 상기 제1흡착부의 하측에 위치되는 상기 제2얼라인마크를 촬영하는 마이크로 소자 전사방법. In the photographing step, the photographing unit is disposed on the upper side of the first adsorption unit made of a transparent material, the micro-element transfer to shoot the second alignment mark that is located below the first adsorption unit through the first adsorption unit Way.
  17. 제14항에 있어서,The method of claim 14,
    상기 가점착단계는,The temporary adhesion step,
    상기 정위치단계 이후 상기 제1흡착부를 상기 제2흡착부를 향해 하강시키는 하강단계;A lowering step of lowering the first adsorption part toward the second adsorption part after the positioning step;
    정위치에 배치된 상기 전사필름과 상기 제2흡착부 사이에 부압을 제공하여 상기 전사필름을 상기 제2흡착부에 고정시키는 고정단계;를 포함하는 마이크로 소자 전사방법. And fixing the transfer film to the second adsorption part by providing a negative pressure between the transfer film and the second adsorption part disposed in position.
  18. 제11항에 있어서, The method of claim 11,
    상기 분리단계에서는, 상기 안내부가 이동되어 상기 가압부를 지나서 벤딩되는 상기 전사필름의 벤딩각도를 조절하는 마이크로 소자 전사방법.In the separating step, the guide portion is moved to adjust the bending angle of the transfer film is bent past the pressing portion micro device transfer method.
PCT/KR2018/016991 2018-03-30 2018-12-31 Micro-element transfer device and micro-element transfer method WO2019190031A1 (en)

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KR102176615B1 (en) * 2020-07-03 2020-11-09 (주)디바이스이엔지 Apparatus and Method for Transferring Disply Element
KR102426343B1 (en) 2020-10-22 2022-07-29 (주)디바이스이엔지 Apparatus and Method for Transferring Micro LED
KR102238491B1 (en) 2020-10-22 2021-04-09 (주)디바이스이엔지 Apparatus for Transferring Display Elements

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