KR102378712B1 - Substrate bonding device - Google Patents

Abstract

A substrate bonding apparatus for LED chip transfer is disclosed. The substrate bonding apparatus for LED chip transfer according to the present invention includes a lower chamber in which a chucking unit for chucking a target substrate is provided, and a carrier substrate to which an LED chip to be delivered to the target substrate is attached, which is in contact with the lower chamber to form a vacuum atmosphere in the inner space. A substrate bonding unit having an upper chamber provided with a bonding plate unit for pressing the carrier substrate to the target substrate so as to be bonded to the target substrate, and connected to the lower chamber, the carrier substrate is loaded onto the target substrate and the carrier substrate bonded to the target substrate and a separation unit for loading and separating the carrier substrate from the target substrate by pressing.

Description

LED chip transfer substrate bonding device {Substrate bonding device}

The present invention relates to a substrate bonding apparatus for LED chip transfer, and more particularly, to a substrate bonding apparatus for LED chip transfer capable of transferring a plurality of LED chips to a substrate in bulk at once.

Display devices are increasing in importance with the development of multimedia. In response to this, various types of display devices, such as a liquid crystal display device, a plasma display device, and an organic light emitting display device, have been commercialized.

Among such display devices, liquid crystal display devices and organic light emitting display devices have excellent characteristics such as thinness, light weight, and low power consumption, so they are suitable for use in notebook computers, televisions, tablet computers, monitors, smartphones, portable display devices, and portable information devices. It is widely used as a device.

Meanwhile, in recent years, development of a tile-type display device to which a bezel is minimized, that is, a zero bezel, meaning that there is almost no bezel, is being developed in order to provide a wider screen at the same size.

A tile-type display device 1 will be briefly described with reference to FIG. 1 . Referring to FIG. 1 , a tile-type display device 1 may be applied as a micro LED display device 100 (Micro LED Display Device).

When the tile-type display device 1 is to be manufactured in a large area, it may be manufactured by tiling the tile 100 for display, which is a unit cell, adjacent to each other. When the tiles 100 for display are tiled to be adjacent to each other, the spacing of the tiles 100 for display must be minimized to enable arrangement of tiles at equal intervals such as a pixel pitch, thereby eliminating a blank in the light emitting area. Accordingly, a zero bezel may be realized.

For the implementation of such a zero bezel, a light emitting device is disposed on the front side of the substrate forming the tile-type display device 1, and a driver IC is disposed on the back side, and these are wired, for example, a flexible printed circuit board (FPCB). , a method of connecting with the same wiring as a Flexible Printed Circuit Board) is applied.

However, such a structure, that is, a structure in which a light emitting device and a driver IC are respectively disposed on the front and rear surfaces of the board and connected with wiring such as a flexible printed circuit board (FPCB) can help to reduce the bezel somewhat, but the wiring Due to its physical thickness, it is difficult to implement a practically zero bezel.

In particular, when trying to manufacture a micro LED display device, which is being researched recently, in a large area, it is manufactured by tiling a unit cell (this is called a 'display tile'). , in this case, it is possible to arrange tiles at equal intervals such as a pixel pitch only when the spacing between the tiles for display is minimized.

An anisotropic conductive film (ACF) is attached to the upper surface of a TFT substrate to manufacture the above-described tile for display, and a plurality of LED chips are mounted on the anisotropic conductive film. Here, the anisotropic conductive film refers to a conductive film in which electricity flows in only one direction by mixing fine conductive particles with an adhesive resin (generally thermosetting) to form a film state.

A plurality of LED chips form R (Red), G (Green), and B (Blue) pixels by emitting light by themselves to realize a color image.

In order to manufacture the above-described tile for display, in the related art, each of a plurality of LED chips is individually picked up by a pickup device (not shown) and transferred to a substrate for mounting.

However, the conventional method of individually picking up a plurality of LED chips and transferring them to a substrate has a problem in that it takes a long time to move because it requires a separate time for each LED chip.

Republic of Korea Patent Publication No. 10-2006-0040166, (2006.05.10.)

An object of the present invention is to provide a substrate bonding apparatus for LED chip transfer capable of transferring a plurality of LED chips to a substrate at the same time to quickly transfer the LED chips to the substrate.

According to one aspect of the present invention, a lower chamber in which a chucking unit for chucking a target substrate is provided, and a carrier substrate to which an LED chip to be delivered to the target substrate is attached, which is in contact with the lower chamber to form a vacuum atmosphere in the inner space, is provided. a substrate bonding unit having an upper chamber in which a bonding plate unit for pressing the carrier substrate to the target substrate is provided so as to be bonded to the target substrate; and a loading and separating unit connected to the lower chamber and configured to load the carrier substrate onto the target substrate and press the carrier substrate bonded to the target substrate to separate the carrier substrate from the target substrate. A used substrate bonding apparatus may be provided.

The dual loading separation unit may include a pair of loading separation modules spaced apart from each other.

The pair of dual loading separation modules may be disposed symmetrically with respect to the chucking unit as a center.

The loading and separation module includes: a carrier jig for supporting the carrier substrate; a jig up/down moving part connected to the carrier jig part and moving the carrier jig part in a vertical direction; and a jig sliding moving unit connected to the jig up/down moving unit, and slidingly moving the carrier jig unit in a horizontal direction crossing the vertical direction.

The carrier jig unit may include: a vertical arm unit coupled to the jig up/down moving unit; and a transverse arm unit coupled to the vertical arm unit and connected to the carrier substrate.

A load cell for sensing a load applied to the carrier jig unit in a process of separating the carrier substrate from the target substrate may be mounted on the carrier jig unit.

The transverse arm unit may include a transverse arm unit body; and a supporting jaw provided at the distal end of the horizontal arm unit body and supporting the lower surface of the carrier substrate.

The jig up / down (up / down) moving unit, the jig for the carrier is connected to the up / down (up / down) block unit; a cylinder rod part for a jig to which the up/down (up/down) block part for the jig is coupled; And the cylinder rod part for the jig is slidably connected, and may include a pressure cylinder body part for the jig which moves the cylinder rod part for the jig up/down.

The sliding jig moving unit may include: a sliding block unit for a jig to which the jig up/down moving unit is connected; And it is connected to the sliding block unit for the jig, it may include a sliding movement driving unit for the jig for moving the sliding block unit for the jig in a direction approaching and spaced apart from the chucking unit.

The sliding driving unit for the jig may include: a connecting shaft part for a jig that passes through the chamber wall of the lower chamber and has one end coupled to the sliding block unit for the jig; a connecting block unit for a jig coupled to the other end of the connecting shaft unit for the jig; a connecting block guide part for a jig connected to the connecting block for the jig and guiding the movement of the connecting block for the jig; And it is connected to the connecting block for the jig, it may include a jig power generating unit for moving the connecting block for the jig.

The sliding moving part of the jig may further include a movement guide for a jig supported by the lower chamber and connected to the sliding block for the jig to guide the movement of the sliding block for the jig.

In order to align the carrier substrate with the target substrate, the imaging unit may further include an imaging unit having a vision unit for imaging the carrier mark formed on the carrier substrate and the target mark formed on the target substrate in an upper region of the carrier substrate. .

The imaging unit may further include a moving unit for the vision unit supporting the vision unit and slidingly moving the vision unit in a horizontal direction, and the moving unit for the vision unit may include: a sliding block unit for imaging to which the vision unit is connected; an imaging movement guide unit connected to the imaging sliding block unit to guide the movement of the imaging sliding block unit; and a sliding movement driving unit for imaging connected to the sliding block for imaging to move the sliding block for imaging.

The substrate bonding unit may include an aligning unit for relatively moving the chucking unit with respect to the carrier substrate supported by the loading and separating unit.

The substrate bonding unit may further include an upper chamber moving part for moving the upper chamber in a direction approaching and spaced apart from the lower chamber.

Embodiments of the present invention provide a substrate bonding unit for bonding a carrier substrate to which a plurality of LED chips are attached and a target substrate to transfer the LED chip from the carrier substrate to the target substrate, and loading the carrier substrate to the target substrate and bonding the carrier substrate to the target substrate. By having a loading and separating unit that separates the carrier substrate from the target substrate by pressing the carrier substrate, a plurality of LED chips can be transferred to the substrate at the same time, so that the LED chips can be quickly transferred to the substrate, thereby increasing productivity There is this.

1 is a diagram illustrating a tile-type display device according to the related art.
FIG. 2 is a view showing a target substrate to which an LED chip is received by the substrate bonding apparatus for LED chip transfer according to an embodiment of the present invention.
3 is a view showing a substrate bonding apparatus for LED chip transfer according to an embodiment of the present invention.
FIG. 4 is a view showing the separation unit for loading of FIG. 3 .
FIG. 5 is a view showing the separation module for loading of FIG. 4 .
FIG. 6 is a view showing the upper chamber of FIG. 3 .
7 is a plan view illustrating the imaging unit of FIG. 3 .
FIG. 8 is an operation state diagram for a bonding process of a carrier substrate and a target substrate by the substrate bonding apparatus for LED chip transfer of FIG. 3 .
9 is a view illustrating a mark for a carrier formed on the carrier substrate and a mark for a target formed on the target substrate of FIG. 3 .

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings. However, in describing the present invention, descriptions of known functions or configurations will be omitted in order to clarify the gist of the present invention.

2 is a view showing a target substrate to which the LED chip has been delivered by the substrate bonding apparatus for LED chip transfer according to an embodiment of the present invention, and FIG. 3 is a substrate bonding for LED chip transfer according to an embodiment of the present invention It is a view showing the device, Fig. 4 is a view showing the separation unit combined with the loading of Fig. 3, Fig. 5 is a view showing the separation module combined with the loading of Fig. 4, Fig. 6 is the upper chamber of Fig. 3 is shown 7 is a plan view showing the imaging unit of FIG. 3, and FIG. 8 is an operation state diagram for a bonding process of a carrier substrate and a target substrate by the LED chip transfer substrate bonding apparatus of FIG. 3 is a view showing a mark for a carrier formed on the carrier substrate and a mark for a target formed on the target substrate.

2 to 9, the substrate bonding apparatus for LED chip transfer according to the present embodiment includes a substrate bonding unit 110, a loading separation unit 130, a fork unit (not shown), It includes an imaging unit and a control unit (not shown).

2, an anisotropic conductive film (ACF) is attached to the upper surface of the target substrate (TFT substrate) in this embodiment. A plurality of LED chips are mounted on the anisotropic conductive film.

The plurality of LED chips to be mounted on the target substrate of FIG. 2 are simultaneously transferred from the carrier substrate to the target substrate during the bonding process between the carrier substrate and the target substrate by the substrate bonding unit 110 .

An LED chip to be transferred to the target substrate is attached to the lower surface of the carrier substrate. In this embodiment, the carrier substrate is made of a transparent glass material. The surface of the carrier substrate is coated with adhesive silicon (PDMS) having a slight adhesive so that the LED chip is not separated from the carrier substrate during the transfer of the carrier substrate.

Here, the adhesive strength of the anisotropic conductive film (ACF) of the target substrate is higher than that of the adhesive silicon (PDMS) applied to the surface of the carrier substrate, so in the process of bonding and separating the carrier substrate and the target substrate, the LED chip is attached to the carrier substrate. It does not remain as it is but is transferred to the target substrate.

The substrate bonding unit 110 bonds the carrier substrate and the target substrate. As shown in FIGS. 3 to 9 , the substrate bonding unit 110 includes a lower chamber 111 in which a chucking unit 113 for chucking a target substrate is provided, and a lower chamber 111 in contact with the inner space. The upper chamber 116 is provided with a bonding plate unit 118 for pressing the carrier substrate to the target substrate so as to form a vacuum atmosphere in the air and adhere the carrier substrate to the target substrate, and is connected to the chucking unit 113 and is connected to the chucking unit 113 ) to the aligning part 115 for relatively moving the carrier substrate supported by the loading and separating unit 130, and the upper chamber movement for moving the upper chamber 116 in a direction approaching and spaced apart from the lower chamber 111. part 119 .

The lower chamber 111, as shown in FIGS. 3 to 6, is provided in a box type with an open top. A vacuum line (not shown) is provided in the lower chamber 111 . A vacuum line (not shown) vacuums the inner space between the inner wall of the upper chamber 116 and the inner wall of the lower chamber 111 when the upper chamber 116 is operated down and comes into contact with the lower chamber 111 . plays a role in maintaining

A chucking unit 113 for chucking the substrate is provided inside the lower chamber 111 . 4 illustrates a state in which the target substrate is chucked on the chucking unit 113 .

In the present embodiment, the chucking part 113 supports the electrostatic chuck 113a and the electrostatic chuck 113a and penetrates the alignment through hole 111a formed in the lower chamber 111 for the alignment part 115 . It includes a chucking support bar (113b) coupled to.

The electrostatic chuck 113a serves to fix the target substrate using electrostatic force. A plurality of vacuum holes (not shown) are formed in each of the electrostatic chucks 113a. For convenience, the vacuum hole is not shown, but the vacuum hole serves to fix the target substrate to the chucking unit 113 by vacuum pressure.

As a result, in the present embodiment, the target substrate is fixed to the chucking unit 113 by the vacuum pressure of the vacuum hole provided in the chucking unit 113 in a standby state, and in a vacuum state, the target is applied by the electrostatic force of the electrostatic chuck 113a. The substrate is fixed to the chucking unit 113 . Accordingly, the chucking efficiency of the target substrate may be increased compared to the prior art, and further, it is possible to prevent the target substrate from being displaced or skewed during the bonding process.

The chucking support rod 113b passes through the alignment through hole 111a formed in the lower wall of the lower chamber 111 . The inner diameter of the aligning through-hole 111a is larger than the outer diameter of the chucking supporting rod 113b so that the movement of the chucking support bar 113b does not interfere with the inner circumferential surface of the aligning through-hole 111a during the alignment process. formed in the shape

Also, although not shown in detail in FIGS. 3 to 6 , a sealing member (not shown) is coupled to the lower inner wall of the lower chamber 111 and the lower surface of the electrostatic chuck 113a to maintain a vacuum atmosphere inside the lower chamber 111 . do. The sealing member (not shown) surrounds the alignment through-holes 111a and is provided in a shape similar to a bellows, so that the length is variable and thus the electrostatic chuck 113a can be moved.

The upper chamber 116 is provided in a box shape with an open lower part. As shown in FIGS. 3 and 6 , the upper chamber 116 is provided to be movable up/down with respect to the lower chamber 111 in the upper region of the lower chamber 111 .

In this embodiment, the upper chamber 116 is operated down toward the fixed lower chamber 111 and comes into contact with the lower chamber 111 , so that the carrier substrate and the target substrate are adhered to each other. A vacuum is maintained in the inner space of the upper chamber 116 and the lower chamber 111 that are in contact with each other, in particular, a space around the chucking part 113 .

The upper chamber 116 is provided with a bonding plate unit 118 for pressing the carrier substrate to the target substrate.

The upper chamber moving unit 119 moves the upper chamber 116 in a direction approaching and spaced apart from the lower chamber 111 (up and down direction). The upper chamber moving part 119 may be provided with various mechanisms such as a pressure cylinder (not shown).

The alignment part 115 is coupled to the chucking support rod 113b of the chucking part 113 . The alignment unit 115 moves the chucking unit 113 to relatively move the target substrate with respect to the carrier substrate supported by the loading/separating unit 130 .

As will be described in detail below, before the carrier substrate is adhered to the target substrate, the vision unit 121 to be described later of the imaging unit 120 is in a state in which the carrier substrate is supported by the loading and separating unit 130 and positioned in the upper region of the target substrate. to acquire image information of the carrier substrate and the target substrate and transmit it to a control unit (not shown). The control unit (not shown) receiving the image information aligns the target substrate with the carrier substrate by moving the chucking unit 113 .

In the present embodiment, the aligning unit 115 uses a UVW stage. The alignment part 115 moves the chucking part 113 in the first axial direction u and the second axial direction v perpendicular to the first axial direction, and intersects the first axial direction and the second axial direction. The third axis direction (w) to be rotated as a rotation axis.

On the other hand, the fork unit (not shown) holds the carrier substrate and transfers it to the loading and separating unit 130 . This fork unit (not shown) includes a hand part (not shown) having at least one finger part (not shown) for holding the carrier substrate, and is connected to the hand part (not shown) and moves the hand part (not shown). It includes an articulated robot unit (not shown). A suction hole (not shown) for vacuum adsorbing the carrier substrate is provided in each of the finger portions (not shown).

In the fork unit (not shown) of this embodiment, the carrier substrate is moved between the upper chamber 116 and the lower chamber 111 in a state where the upper chamber 116 is moved to the upper region of the lower chamber 111 to form a carrier substrate. is transferred to the loading and separation unit 130 .

Meanwhile, the loading separation unit 130 is connected to the lower chamber 111 . The loading and separating unit 130 loads the carrier substrate onto the target substrate. In addition, the loading separation unit 130 separates the carrier substrate from the target substrate by pressing the carrier substrate in a direction away from the target substrate after bonding the carrier substrate and the target substrate.

The dual loading separation unit 130 includes a pair of dual loading separation modules 150 , 160 , 170 that are disposed to be spaced apart from each other. These loading and separating modules 150 , 160 , 170 are arranged symmetrically with respect to the chucking part 113 as a center and operate independently of each other.

As described above, the substrate bonding apparatus for LED chip transfer according to the present embodiment is provided with the dual loading separation modules 150 , 160 , 170 independently operated by being symmetrically disposed with respect to the chucking unit 113 as a center, the carrier When the substrate is separated from the target substrate, abrupt separation between the carrier substrate and the target substrate can be prevented by rising from one edge region of the carrier substrate as shown in FIG. Movement along the carrier substrate can be prevented.

As shown in FIGS. 3 to 6, the combined loading separation module 150, 160, and 170 according to the present embodiment includes a carrier jig unit 150 for supporting a carrier substrate, and a carrier jig unit 150. It is connected to the jig up / down (up / down) moving unit 160 for moving the jig unit 150 for the carrier in the vertical direction, and the jig up / down (up / down) moving unit 160 is connected to the carrier It includes a jig sliding unit 170 for sliding the paper jig unit 150 in a horizontal direction crossing the vertical direction.

The carrier jig unit 150 supports the carrier substrate. The carrier jig unit 150 includes a vertical arm unit 151 coupled to the jig up/down moving unit 160 , and a horizontal arm unit 151 coupled to the vertical arm unit 151 and connected to the carrier substrate. It includes an arm portion 153 . In this embodiment, the vertical arm part 151 is provided in the shape of a bar extending in the vertical direction.

The horizontal arm part 153 is detachably coupled to the vertical arm part 151 . A carrier substrate is supported on the transverse arm portion 153 . The transverse arm unit 153 includes a transverse arm unit body 153a and a supporting jaw unit 153b provided at the distal end of the transverse arm unit body 153a and supporting the lower surface of the carrier substrate.

The transverse arm unit body 153a is provided in the shape of a bar extending in the transverse direction. The supporting jaw portion 153b for support is provided to protrude from the distal end of the horizontal arm main body 153a, as shown in detail in FIG. 5 . The supporting jaw portion 153b for supporting supports the lower surface of the carrier substrate.

A load cell (not shown) for sensing a load applied to the transverse arm unit 153 during a process of separating the carrier substrate from the target substrate is mounted on the transverse arm unit 153 . In the present embodiment, the load cell (not shown) may be mounted on the supporting jaw portion 153b.

The load cell is electrically connected to the control unit (not shown) to transmit information about the load applied to the horizontal arm unit 153 to the control unit (not shown).

In the initial stage of separating the carrier substrate from the target substrate, as shown in FIG. 8( d ), it rises from the edge region of one side of the carrier substrate. The lifting from one edge region of the carrier substrate is made by the lifting of the jig unit 150 for one carrier, and the control unit (not shown) controls the carrier jig according to information about the load obtained from the load cell (not shown). By controlling the rising speed of the part 150, it is possible to prevent the carrier substrate from being suddenly separated from the target substrate.

The jig up/down moving unit 160 is connected to the carrier jig unit 150 . The jig up / down (up / down) moving unit 160 moves the carrier jig unit 150 in the vertical direction (Y-axis direction).

The jig up / down (up / down) moving unit 160 according to the present embodiment, as shown in Figs. 4 to 5, the jig for the carrier jig unit 150 is connected up / down (up / down) down) block portion 161 and the jig up / down (up / down) block portion 161 for a jig cylinder rod portion 163, and jig cylinder rod portion 163 for sliding movement It is connected and includes a pressure cylinder body portion 165 for a jig for moving the cylinder rod portion 163 up / down (up / down).

As shown in detail in Figs. 4 and 5 to the up/down block unit 161 for the jig, the vertical arm unit 151 of the jig unit 150 for the carrier is coupled. In this embodiment, the jig up / down (up / down) block unit 161 is provided in a 'L' shape, the scope of the present invention is not limited thereto, and the jig up / down (up / down) The block part 161 may be manufactured in various shapes.

As shown in detail in FIGS. 4 and 5, the cylinder rod part 163 for the jig is slidably connected to the cylinder rod part 163 for the jig. The cylinder rod portion 163 for the jig is relatively moved in the vertical direction (Y-axis direction) with respect to the pressure cylinder body portion 165 for the jig.

The pressure cylinder body part 165 for a jig moves the cylinder rod part 163 for a jig up / down in a vertical direction (Y-axis direction).

As described above, the substrate bonding apparatus for LED chip transfer according to the present embodiment is a jig up/down for moving the carrier jig unit 150 for supporting the carrier substrate up/down in the vertical direction. ) by having the moving unit 160, the carrier substrate can be stably loaded on the upper surface of the target substrate for bonding the carrier substrate and the target substrate, and can be separated from the target substrate by pressing the carrier substrate bonded to the target substrate there is.

The sliding jig moving unit 170 is connected to the jig up/down moving unit 160 . The sliding jig unit 170 slides the carrier jig unit 150 in the horizontal direction (X-axis direction) crossing the vertical direction.

In this embodiment, the sliding jig moving unit 170, as shown in Figs. 4 to 5, the jig up / down (up / down) moving unit 160 is connected to the sliding block unit 171 for the jig and , It is connected to the sliding block unit 171 for the jig and includes a sliding movement driving unit 173 for the jig for moving the sliding block unit 171 for the jig in a direction approaching and spaced apart from the chucking unit 113 .

The sliding movement driving unit 173 for the jig penetrates the chamber wall of the lower chamber 111 and has one end coupled to the sliding block unit 171 for the jig, the connecting shaft portion 173a for the jig, and the connecting shaft portion for the jig ( A connection block for a jig (173b) coupled to the other end of the jig, and a connection block guide for a jig ( 173c), a jig power generation unit (not shown) connected to the jig connection block unit 173b and moving the jig connection block unit 173b, and a sliding block unit supported by the lower chamber 111 and for the jig It is connected to 171 and includes a movement guide portion 175 for a jig for guiding the movement of the sliding block portion 171 for the jig.

In this embodiment, the connecting shaft portion 173a for a jig is provided in a long rod shape. The jig connection shaft part 173a penetrates the chamber wall of the lower chamber 111 , and the outer peripheral surface of the jig connection shaft part 173a is slidably connected to the chamber wall of the lower chamber 111 .

4 and 5, one end of the jig connection shaft portion 173a is coupled to the sliding block portion 171 for the jig and the other end is coupled to the jig connection block portion 173b.

The connecting block guide part 173c for the jig is connected to the connecting block part 173b for the jig. The jig connection block guide part 173c guides the sliding movement of the jig connection block part 173b.

The power generating unit (not shown) for the connecting block is connected to the connecting block unit 173b for the jig. The power generating unit (not shown) for the connecting block moves the connecting block unit 173b for the jig. In this embodiment, the power generating unit (not shown) for the connection block may be provided as a servo motor or an electric actuator.

The movement guide part 175 for the jig is supported by the lower chamber 111 . The movement guide unit 175 for the jig is connected to the sliding block unit 171 for the jig to guide the sliding movement of the sliding block unit 171 for the jig.

The jig power generation unit (not shown) is connected to the jig connection block unit 173b. The jig power generating unit (not shown) moves the jig connection block unit 173b. In this embodiment, the power generating unit (not shown) for the jig may be provided as a servo motor or an electric actuator.

Meanwhile, the imaging unit 120 images the carrier substrate and the target substrate in the upper region of the carrier substrate for alignment of the carrier substrate and the target substrate. The imaging unit 120 includes a vision unit 121 for imaging the carrier mark CM formed on the carrier substrate and the target mark TM formed on the target substrate, and the vision unit 121 supporting the vision unit ( It includes a moving part 123 for the vision part that slides the 121 in the horizontal direction.

As shown in FIG. 7 , four vision units 121 are provided to be spaced apart from each other. As described above, since the carrier substrate is provided as a transparent glass substrate, the vision unit 121 may image both the carrier mark CM and the target mark TM in the upper region of the carrier substrate.

In this embodiment, the mark CM for the carrier has the same shape as Fig. 9 (a), and the mark TM for the target has the same shape as Fig. 9 (b). Figure 9 (c) is a state in which the mark CM for the carrier and the mark TM for the target are aligned. That is, the alignment unit 115 moves the target substrate according to the image information of the vision unit 121 to align the carrier mark CM and the target mark TM, and the carrier mark CM and target The state in which the mark TM is aligned is a state in which the carrier substrate and the target substrate are aligned.

As shown in FIG. 7 , the moving unit 123 for the vision unit is connected to the imaging sliding block unit 123a to which the vision unit 121 is connected, and the imaging sliding block unit 123a to the imaging sliding block. An imaging movement guide unit (not shown) for guiding the movement of the portion 123a, and an imaging sliding movement driving unit 123b connected to the imaging sliding block unit 123a to move the imaging sliding block unit 123a includes

In this embodiment, the imaging sliding driving unit 123b includes a moving nut (not shown) coupled to the imaging sliding block unit 123a, a ball screw (not shown) meshed with the moving nut (not shown), and a ball It is connected to a screw (not shown) and includes a driving motor 123c for rotating the ball screw (not shown).

The control unit (not shown) is electrically connected to the imaging unit 120, the substrate bonding unit 110 and the loading separation unit 130, and the imaging unit 120, the substrate bonding unit 110 and the loading separation unit ( 130) is controlled.

Hereinafter, the operation of the substrate bonding apparatus for LED chip transfer according to the present embodiment will be mainly described with reference to FIGS. 2 to 9 .

First, the carrier substrate is transferred from the fork unit (not shown) to the loading and separating unit 130 . Thereafter, as shown in FIG. 8( a ), the vision unit 121 images the carrier mark CM and the target mark TM from the upper portion of the carrier substrate, and according to a control signal from a control unit (not shown) The alignment unit 115 operates to align the target substrate with the carrier substrate.

Next, as shown in FIG. 8(b) , the carrier substrate on which the loading/separation unit 130 is aligned is seated on the target substrate.

Thereafter, the upper chamber 116 is lowered to bond the carrier substrate and the target substrate. At this time, since the bonding plate unit 118 presses the carrier substrate to the target substrate, air bubbles between the carrier substrate and the target substrate are removed.

Next, the upper chamber 116 rises, and the transverse arm portion 153 of the separating unit 130 for loading is connected to the carrier substrate (refer to FIG. 8(c)).

Thereafter, as shown in FIG. 8( d ), only the one-side transverse arm part 153 is raised to separate the carrier substrate from the target substrate from the one-side edge region.

Next, as shown in Fig. 8(e), both of the transverse arm portions 153 are raised to completely separate the carrier substrate from the target substrate. At this time, it can be seen that the LED chip attached to the carrier substrate is transferred to the target substrate as shown in FIG. 8(e).

As described above, the substrate bonding apparatus for LED chip transfer according to the present invention is a substrate bonding unit 110 for bonding a carrier substrate to which a plurality of LED chips are attached and a target substrate to transfer the LED chip from the carrier substrate to the target substrate; By providing a dual loading separation unit 130 for loading a substrate onto a target substrate and separating the carrier substrate from the target substrate by pressing the carrier substrate bonded to the target substrate, a plurality of LED chips are simultaneously transferred to the substrate to transfer the LED chips to the substrate It has the advantage of being able to deliver it quickly and thus increasing productivity.

Although the present embodiment has been described in detail with reference to the drawings above, the scope of the present embodiment is not limited to the drawings and description described above.

As such, the present invention is not limited to the described embodiments, and it is apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Accordingly, it should be said that such modifications or variations are included in the claims of the present invention.

110: substrate bonding unit 111: lower chamber
113: chucking unit 115: alignment unit
116: upper chamber 118: cementation plate portion
119: upper chamber moving unit 120: imaging unit
121: vision unit 123: moving unit for vision unit
123a: sliding block unit for imaging
123b: sliding movement driving unit for imaging
130: loading combined separation unit 150: carrier jig unit
151: vertical arm part 153: horizontal arm part
153a: transverse arm part main body 153b: support jaw part
160: jig up / down (up / down) moving unit
161: jig up / down (up / down) block portion
163: Cylinder rod part for jig 165: Pressurized cylinder body part for jig
170: jig sliding moving unit 171: sliding block unit for jig
173: sliding movement driving unit for jig 173a: connecting shaft unit for jig
173b: jig connection block portion 173c: jig connection block guide portion
175: movement guide for jig CM: mark for carrier
TM: mark for target

Claims (15)

A lower chamber in which a chucking unit for chucking a target substrate is provided, and a carrier substrate having an LED chip attached thereto, which is in contact with the lower chamber to form a vacuum atmosphere in the inner space, and to be transferred to the target substrate, is adhered to the target substrate. a substrate bonding unit having an upper chamber in which a bonding plate unit for pressing the target substrate is provided; and
a loading and separating unit connected to the lower chamber to load the carrier substrate onto the target substrate and press the carrier substrate bonded to the target substrate to separate the carrier substrate from the target substrate,
The loading combined separation unit,
Including a pair of separation modules for loading and spaced apart from each other,
The loading combined separation module,
a carrier jig for supporting the carrier substrate;
a jig up/down moving part connected to the carrier jig part and moving the carrier jig part in a vertical direction; and
It is connected to the jig up / down (up / down) moving part, comprising a jig sliding moving part for sliding the jig for the carrier in a horizontal direction intersecting the vertical direction,
LED chip transfer substrate bonding apparatus, characterized in that the load cell (load cell) for sensing the load applied to the carrier jig portion in the process of separating the carrier substrate from the target substrate is mounted on the carrier jig unit . delete According to claim 1,
The pair of separation modules for both loading,
A substrate bonding apparatus for LED chip transfer, characterized in that it is symmetrically disposed with respect to the chucking part as a center. delete According to claim 1,
The carrier jig unit,
a vertical arm unit coupled to the jig up/down moving unit; and
and a transverse arm unit coupled to the vertical arm unit and connected to the carrier substrate. delete 6. The method of claim 5,
The horizontal arm portion,
transverse arm body; and
The board bonding apparatus for LED chip transfer is provided at the distal end of the horizontal arm body and includes a support jaw for supporting the lower surface of the carrier substrate. A lower chamber in which a chucking unit for chucking a target substrate is provided, and a carrier substrate having an LED chip attached thereto, which is in contact with the lower chamber to form a vacuum atmosphere in the inner space, and to be transferred to the target substrate, is adhered to the target substrate. a substrate bonding unit having an upper chamber in which a bonding plate unit for pressing the target substrate is provided; and
a loading and separating unit connected to the lower chamber to load the carrier substrate onto the target substrate and press the carrier substrate bonded to the target substrate to separate the carrier substrate from the target substrate,
The loading combined separation unit,
Including a pair of separation modules for loading and spaced apart from each other,
The loading combined separation module,
a carrier jig for supporting the carrier substrate;
a jig up/down moving part connected to the carrier jig part and moving the carrier jig part in a vertical direction; and
It is connected to the jig up / down (up / down) moving part, comprising a jig sliding moving part for sliding the jig for the carrier in a horizontal direction intersecting the vertical direction,
The jig up / down (up / down) moving unit,
an up/down block unit for a jig to which the carrier jig unit is connected;
a cylinder rod part for a jig to which the up/down (up/down) block part for the jig is coupled; and
The jig cylinder rod part is connected to be slidably movable, and the LED chip transfer board bonding apparatus including a pressure cylinder body part for a jig which moves the cylinder rod part for a jig up/down. A lower chamber in which a chucking unit for chucking a target substrate is provided, and a carrier substrate having an LED chip attached thereto, which is in contact with the lower chamber to form a vacuum atmosphere in the inner space, and to be transferred to the target substrate, is adhered to the target substrate. a substrate bonding unit having an upper chamber in which a bonding plate unit for pressing the target substrate is provided; and
a loading and separating unit connected to the lower chamber to load the carrier substrate onto the target substrate and press the carrier substrate bonded to the target substrate to separate the carrier substrate from the target substrate,
The loading combined separation unit,
Including a pair of separation modules for loading and spaced apart from each other,
The loading combined separation module,
a carrier jig for supporting the carrier substrate;
a jig up/down moving part connected to the carrier jig part and moving the carrier jig part in a vertical direction; and
It is connected to the jig up / down (up / down) moving part, comprising a jig sliding moving part for sliding the jig for the carrier in a horizontal direction intersecting the vertical direction,
The jig sliding moving part,
a sliding block unit for a jig to which the jig up/down moving unit is connected; and
and a jig sliding drive unit connected to the sliding block unit for the jig, and configured to move the sliding block unit for the jig in a direction approaching and separating from the chucking unit. 10. The method of claim 9,
The sliding movement driving unit for the jig,
a connecting shaft part for a jig penetrating the chamber wall of the lower chamber and having one end coupled to the sliding block part for the jig;
a connecting block unit for a jig coupled to the other end of the connecting shaft unit for the jig;
a connecting block guide part for a jig connected to the connecting block for the jig and guiding the movement of the connecting block for the jig; and
and a jig power generator connected to the jig connection block unit and configured to move the jig connection block unit. 11. The method of claim 10,
The sliding movement driving unit for the jig,
The substrate bonding apparatus for LED chip transfer further comprising a movement guide part supported by the lower chamber and connected to the sliding block part for the jig to guide the movement of the sliding block part for the jig. 10. The method of any one of claims 1, 8 or 9,
LED further comprising an imaging unit having a vision unit for imaging the carrier mark formed on the carrier substrate and the target mark formed on the target substrate in an upper region of the carrier substrate for alignment of the carrier substrate and the target substrate Board bonding device for chip transfer. 13. The method of claim 12,
The imaging unit,
It supports the vision unit and further includes a moving unit for the vision unit that slides the vision unit in a horizontal direction,
The moving unit for the vision unit,
a sliding block unit for imaging to which the vision unit is connected;
an imaging movement guide unit connected to the imaging sliding block unit to guide the movement of the imaging sliding block unit; and
and a sliding motion driving unit for imaging connected to the sliding block for imaging and moving the sliding block for imaging. 10. The method of any one of claims 1, 8 or 9,
The substrate bonding unit,
and an alignment part for moving the chucking part relative to the carrier substrate supported by the loading and separating unit. 10. The method of any one of claims 1, 8 or 9,
The substrate bonding unit,
The substrate bonding apparatus for LED chip transfer further comprising an upper chamber moving part for moving the upper chamber in a direction approaching and spaced apart from the lower chamber.

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