WO2020190088A1

WO2020190088A1 - Bonding pad and apparatus for manufacturing bond

Info

Publication number: WO2020190088A1
Application number: PCT/KR2020/003866
Authority: WO
Inventors: 장성우; 최원석; 정병욱; 노승욱
Original assignee: 엘지전자 주식회사
Priority date: 2019-03-21
Filing date: 2020-03-20
Publication date: 2020-09-24
Also published as: CN113597368B; KR20210118943A; CN113597368A

Abstract

A bonding pad comprises: a first bonding portion; a first inner surface extending inward from the first bonding portion; a second bonding portion; and a second inner surface extending inward from the second bonding portion, and contacting a first inner side portion in a contact area. Each of the first bonding portion and the second bonding portion may include at least one curved surface. Each of the first inner surface and the second inner surface may have an acute angle with respect to a horizontal line.

Description

Cementation pad and cementation manufacturing device

The embodiment relates to a cementation pad and a cementation manufacturing apparatus.

It is very important to efficiently perform bonding between different members to prevent bonding failure. When the different members face each other, bonding is relatively easy. On the other hand, it is not easy to attach other members to a region having a curved surface.

Recently, in electronic devices such as mobile phones, the area of the display panel is maximized by configuring a curved surface at the edge.

In this case, it is not easy to attach the panel to the edge portion of the substrate.

As an example, bonding may be performed using a roller method. As shown in Fig. 1, after the panel 1 including the adhesive member 2 is positioned on the substrate 4, the roller 3 is rotated so that the panel 1 is transferred to the substrate 4 in one direction. Can be cemented on. However, since the radius of curvature of the edge portion 4a of the substrate 4 and the radius of curvature of the roller 3 are different, even if the roller 3 presses the edge portion 4a of the substrate 4, the panel 1 A bonding failure occurs that is spaced apart without being bonded to the edge portion 4a of the substrate 4.

As another example, cementation may be performed using a batch method. As shown in FIG. 2, a pressing member 5 capable of covering the entire area including the edge portion 4a of the substrate 4 is provided. When the pressing member 5 is pressed, the panel 1 is bonded to the entire area of the substrate 4, that is, the central portion and the peripheral portion simultaneously. However, as the flat area (near the center) and the edge 4a of the substrate 4 are simultaneously bonded by the pressing member 5, the air existing between the panel 1 and the flat area of the substrate 4 Bubbles are formed between the planar regions of the panel 1 and the substrate 4 without being able to escape, resulting in poor bonding due to these bubbles.

The embodiment provides a bonding pad and a bonding manufacturing apparatus in which a panel can be uniformly and easily bonded to all areas of a substrate regardless of the shape of the substrate.

The embodiment provides a bonding pad and a bonding manufacturing apparatus in which a panel can be bonded to all areas of a substrate without defects such as bubbles, regardless of the shape of the substrate.

According to an embodiment, the bonding pad includes a first bonding portion; A first inner surface extending inward from the first bonding portion; A second bonding portion; And a second inner surface extending inward from the second bonding portion and in contact with the first inner portion in a contact area. Each of the first bonding portion and the second bonding portion may include at least one curved surface, and each of the first inner surface and the second inner surface may have an acute angle with respect to a horizontal line.

According to another embodiment, a bonding manufacturing apparatus includes: a first bonding unit for aligning a panel to a substrate and temporarily bonding a portion of the panel to a portion of a first area that is a plane of the substrate; A second bonding unit for bonding the panel to the first area of the substrate using a first bonding pad; And a third bonding unit for bonding the panel to the second area of the substrate using a second bonding pad. The second region of the substrate may contact both sides of the first region.

According to the embodiment, the panel is sequentially bonded to the first region (flat surface) of the first substrate and the second region (curved surface) extending to both sides of the first region, so that the air existing between the panel and the first substrate is removed from the outside. It is smoothly exhausted to prevent the generation of air bubbles.

According to an embodiment, the bonding pad includes bonding portions equal to or smaller than the radius of curvature of the second area positioned on both sides of the first area of the first substrate, and the panel is uniform in the second area of the substrate by using the bonding portion. It is easily bonded to prevent poor bonding.

According to the embodiment, a groove (formed by the first inner surface and the second inner surface) is provided between the first bonding portion and the second bonding portion of the bonding pad, so that even if the bonding pad is pressed, the lower side of the bonding pad is first Since the first region of the substrate is not pressed, it is possible to prevent damage to the substrate due to pressure on the lower side of the bonding pad. In addition, the bonding pad may more intensively press the second region of the substrate to improve bonding performance.

According to an embodiment, by providing at least one recess between the first bonding portion and the second bonding portion of the bonding pad, when the bonding pad is pressed, the lower direction and the outer side generated in the first bonding portion and the second bonding portion Due to the expansion in the direction, the panel may more smoothly adhere to the second region of the substrate.

1 is an exemplary view showing a conventional bonding manufacturing apparatus.

2 is another exemplary view showing a conventional cementation manufacturing apparatus.

3 shows a cementation manufacturing apparatus according to an embodiment.

4 is a cross-sectional view showing a substrate according to an embodiment.

5 is a flow chart illustrating a bonding process according to an embodiment.

6A to 6F show a temporary bonding process in the first bonding unit of FIG. 3.

7A to 7D show a first main bonding process in the second bonding unit of FIG. 3.

8A to 8E show a second main bonding process in the third bonding unit of FIG. 3.

9 shows a first bonding device provided in the second bonding unit of FIG. 3.

10 shows a second bonding device provided in the third bonding unit of FIG. 3.

11A and 11B show a second bonding pad according to the first embodiment.

12 is an enlarged view showing area A of FIG. 9A.

13A and 13B show a second bonding pad according to the second embodiment.

14A and 14B show a second bonding pad according to the third embodiment.

15 to 18 show a state in which a panel is bonded to a substrate using a second bonding pad.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to some embodiments to be described, but may be implemented in various different forms, and within the scope of the technical idea of the present invention, one or more of the constituent elements may be selectively selected between the embodiments. It can be combined with and substituted for use. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention are generally understood by those of ordinary skill in the art, unless explicitly defined and described. It can be interpreted as a meaning, and terms generally used, such as terms defined in a dictionary, may be interpreted in consideration of the meaning in the context of the related technology. In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, the singular form may include the plural form unless specifically stated in the phrase, and when described as “at least one (or more than one) of B and (and) C”, it may be combined with A, B, and C. It may contain one or more of all possible combinations. In addition, terms such as first, second, A, B, (a), and (b) may be used in describing the constituent elements of the embodiment of the present invention. These terms are only for distinguishing the component from other components, and are not limited to the nature, order, or order of the component by the term. And, if a component is described as being'connected','coupled' or'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also the component and The case of being'connected','coupled', or'connected' due to another element between the other elements may also be included. In addition, when it is described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other. It also includes a case in which the above other component is formed or disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

3 shows a cementation manufacturing apparatus according to an embodiment.

3, the bonding manufacturing apparatus according to the embodiment may include a first bonding unit 100, a second bonding unit 200, and a third bonding unit 300. The first bonding unit 100 and the second bonding unit 200 may be provided in the same space, and the third bonding unit 300 may be provided in different spaces, but this is not limited thereto.

4 is a cross-sectional view showing a substrate according to an embodiment.

Referring to FIG. 4, a panel (20 in FIG. 6) may be bonded to the substrate 10. The panel 20 may include, for example, an LCD panel, an OLED panel, and the like, but is not limited thereto. The panel 20 may be freely transformed in shape due to its flexible characteristics. The substrate 10 may be made of a transparent material. For example, the substrate 10 may be made of a transparent glass or a transparent plastic material. When the panel 20 is driven, an image or information output from the panel 20 may be displayed to a user through the substrate 10.

The substrate 10 may include a first region 11, second regions 13a and 13b, and third regions 15a and 15b.

The first region 11 may be a planar region located in the center of the substrate 10. That is, the first area 11 may be a parallel area along the horizontal direction. For example, the top surface of the first region 11 may have a horizontal plane parallel to the horizontal direction.

The second regions 13a and 13b may be located on both sides of the first region 11. For example, the second area may include a 2-1 area 13a extending from one side of the first area 11 and a 2-2 area 13b extending from the other side of the first area 11. . For example, the second regions 13a and 13b may have an edge shape or a round shape having at least one radius of curvature. For example, the 2-1 area 13a may have an edge shape or a round shape from one side of the first area 11 toward an upper direction. For example, the 2-2 region 13b may have an edge shape or a round shape from the other side of the first region 11 toward an upper direction.

The boundary point between the first area 11 and the 2-1 area 13a may be 17a, and the boundary point between the first area 11 and the 2-2 area 13b may be 17b. have.

The third regions 15a and 15b are the third region 15a extending in the vertical direction from the 2-1 region 13a and the third region 15a extending in the vertical direction from the second region 13b. It may include a region 3-2 (15b). The third regions 15a and 15b may have a vertical plane parallel to the horizontal direction.

5 is a flow chart illustrating a bonding process according to an embodiment.

3 to 5, the first bonding unit 100 may perform a temporary bonding process of bonding a part of the panel 20 to the substrate 10 (S510 ).

The second bonding unit 200 may perform a process of bonding the panel 20 to the first region 11 of the substrate 10 (S520).

The third bonding unit 300 may perform a process of bonding the panel 20 to the second regions 13a and 13b of the substrate 10 (S530 ).

Hereinafter, a bonding process according to an embodiment will be described in detail with reference to FIGS. 6 to 8.

6A to 6F show a temporary bonding process in the first bonding unit of FIG. 3.

The first bonding unit 100 is located on the jig 501 and the jig 501 and is located on the first driving means 111 and the jig 501 equipped with a plurality of

adsorption pads

110a and 110b, It may include a second driving means 121 on which the temporary bonding pad 120 positioned on the adsorption pad is mounted. For example, the first drive means 111 is configured in the second drive means 121.

The substrate 10 may be fixed to the jig 501. The plurality of

adsorption pads

110a and 110b may suction-fix or release the panel 20 by moving up and down in the z-axis and moving and rotating in the x-axis and y-axis by the second driving means.

The temporary bonding pad 120 and the

adsorption pads

110a and 110b can be moved up and down by the second driving means 121 and the panel 20 can be locally bonded to the substrate.

A protrusion 122 may be provided under the bonding pad 120. The protrusion 122 may have a round shape.

For example, the height h of the protrusion 122 may be 0.5 to 10 mm. For example, when the height h of the protrusion 122 is less than 0.5 mm, a large area of the panel 20 may be adhered to the substrate 10. For example, when the height h of the round-shaped protrusion 122 exceeds 10 mm, a small area of the panel 20 is adhered to the substrate 10, and the panel 20 is transferred to the substrate 10 when moving to the next process. Can be detached from

6A, when the panel 20 is put into the first bonding unit 100, the plurality of adsorption pads 110a and 1110b and the temporary bonding pad 120 are formed by the second driving means 121. It can be lowered at the same time to fix the panel 20. In this case, the release film 22 may be attached to the panel 20 with an adhesive member (not shown) therebetween. The adhesive member may be, for example, OCA (Optically Clear Adhesive), but is not limited thereto. The release film 22 can prevent contamination of the adhesive member.

As shown in FIG. 6B, the release film 22 is removed from the panel 20 so that the adhesive member may be exposed to the outside. As will be described later, the panel 20 may be bonded to the substrate 10 using an adhesive member.

As shown in FIG. 6C, the substrate 10 is loaded, and the second driving means 121 moves and rotates in the x- and y-axes to align the position of the panel 20 with respect to the substrate 10. .

As shown in FIG. 6D, as the plurality of

adsorption parts

110a and 110b rise and move by the first driving means 111, the panel 20 is at the lowest point of the protrusion 122 of the temporary bonding pad 120. It can be accessed locally.

As shown in FIG. 6E, the plurality of adsorption units 110a and 1110b and the temporary bonding pad 120 move downward at the same time by the second driving means 121, and the protrusion 122 of the temporary bonding pad 120 The panel 20 corresponding to may be in contact with the substrate 10. Thereafter, the second driving means 121 additionally moves downward and presses the temporary bonding pad 120 so that the panel 20 corresponding to the protrusion 122 of the temporary bonding pad 120 is locally bonded to the substrate. I can.

As shown in Fig. 6F, the panel 20 is detached from the plurality of

suction pads

110a and 110b by the suction release by the plurality of

suction pads

110a and 110b, and the first driving means 111 2 The plurality of

adsorption pads

110a and 110b and the temporary bonding pad 120 can be moved upwardly to their original position by the driving means 121.

Accordingly, the central region of the panel 20 may be bonded to the substrate 10, and the remaining region of the panel 20 may be placed on the substrate 10. Accordingly, the panel is bonded to a part of the first area 11 of the substrate 10 and not bonded to the rest of the first area 11 and the second areas 13a and 13b of the substrate 10.

The second bonding unit 200 and the third bonding unit 300 sequentially cover the rest of the panel 20 with the rest of the first area 11 and the second areas 13a and 13b of the substrate 10. A process of bonding can be performed.

The second bonding unit 200 may include a jig 503, a vacuum chamber 505 positioned on the jig 503 and capable of vertical movement, and a driving means 217 equipped with a first bonding pad 212. have. The first bonding pad 212 may be fastened to the driving means 217 through the jig 211. The first bonding pad 212 may be attached to the jig 211 using an adhesive material.

Although not shown, the jig 503 may be installed on the stage.

The first bonding pad 212 may have a protrusion 215. The protrusion 215 may have a round shape. The protrusion 215 protrudes to the outside and its surface may have a curved surface. When the first bonding pad 212 is pressed, the curved surface of the protrusion 215 may contact the panel 20. That is, as the central portion of the curved surface first contacts the panel 20 and the first bonding pad 212 is gradually pressed, the panel 20 may be contacted in order from the central portion of the curved surface to the peripheral portion. When the peripheral portion of the curved surface contacts the panel 20, a stronger pressure is applied to the central portion of the curved surface, so that the panel 20 may adhere to the central portion of the first region 11 of the substrate 10 at the central portion of the curved surface. Thereafter, a strong pressure is also applied to the periphery of the curved surface, and the panel 20 adheres to the periphery of the first region 11 of the substrate 10 at the periphery of the curved surface, so that the panel 20 is attached to the first region of the substrate 10. (11) can be cemented to the whole.

The height h of the protrusion 215 may be 0.2 to 6 mm. When the height h of the round-shaped protrusion 215 is less than 0.2 mm, the panel 20 is bonded to the center and the peripheral portion of the first region 11 of the substrate 10 at the same time by the first bonding pad 212 Air bubbles may occur. When the height h of the round-shaped protrusion 215 exceeds 6 mm, even if the first bonding pad 212 is applied at a predetermined pressure, elastic pressure is not well applied to the periphery of the protrusion 215, so that the panel 20 ) May not adhere to the periphery of the first region 11 of the substrate 10. In addition, when the height h of the round protrusion 215 exceeds 6 mm, when the first bonding pad 212 is pressed and the first bonding pad 212 is bonded to the periphery, the substrate 10 Cracks may occur due to strong pressing force in the center.

As shown in FIG. 7A, when the substrate 10 to which the panel 20 is locally bonded is received by the process in the first bonding unit 100, the substrate 10 is fixed to the jig 503. I can.

After the vacuum chamber 505 moves downward and comes into close contact with the jig 503, the vacuum chamber 505 and the air in the space formed by the jig 503 are exhausted through the exhaust unit 218, and the vacuum chamber 505 and A vacuum may be formed by the jig 503.

As shown in FIG. 7C, the driving means 217 moves downward so that the lowest point of the protrusion 215 of the first bonding pad 212 may contact the panel 20. Thereafter, the driving means 217 additionally moves downward to pressurize the first bonding pad 212, and the panel corresponding to the center of the first bonding pad 212 by pressing at the center of the first bonding pad 212 The panel 20 is bonded to the center of the first region 11 of the substrate 10, and thereafter, the panel 20 is attached to the substrate 10 by pressing in order from the center of the first bonding pad 212 to the peripheral portion. It may be sequentially bonded from the center of the first region 11 to the periphery. Accordingly, the panel 20 may be adhered to the entire first region 11 of the substrate 10 by the first bonding pad 212.

The panel 20 is bonded in order from the center of the first area 11 of the substrate 10 to the peripheral area by the first bonding pad 212, so that the panel 20 and the first area 11 of the substrate 10 are bonded together. The air between) is moved from the center of the first region 11 of the substrate 10 to the peripheral portion and is exhausted to the outside, so that the generation of air bubbles can be prevented.

As shown in FIG. 7D, the exhaust unit 218 is opened so that atmospheric air is supplied to the vacuum chamber 505, so that the vacuum chamber 505 may be in a standby state. Thereafter, the vacuum chamber 505 and the driving means 217 may move upward to their original positions.

The third bonding unit 300 may include a jig 508, a vacuum chamber 507 positioned on the jig 508 and capable of vertical movement, and a driving means 317 equipped with a second bonding pad 312. have. The second bonding pad 212 may be fastened to the driving means 317 through the jig 311. The second bonding pad 312 may be attached to the jig 311 using an adhesive material. The jig 508 may be installed on the stage 507.

The shape of the second bonding pad will be described later in detail.

As shown in FIG. 8A, when a substrate having a panel bonded to the first region is received by a process in the second bonding unit 300, the substrate 10 may be fixed to the jig 508.

As shown in FIG. 8B, by moving the stage 507 in the U-direction, V-direction, and W-direction, the position of the substrate 10 may be aligned with the second bonding pad 312.

As shown in FIG. 8C, after the vacuum chamber 507 moves downward and comes into close contact with the jig 508, air in the space formed by the vacuum chamber 507 and the jig 508 is removed through the exhaust unit 318. By evacuating, a vacuum may be formed by the vacuum chamber 507 and the jig 508.

As shown in FIG. 8D, the first and second bonding portions (321, 322 in FIG. 11A) located on both sides of the second bonding pad 312 are moved downwardly to the panel 20. I can touch it. Thereafter, the driving means 317 additionally moves downward and presses the second bonding pad 312, so that the second bonding pad 312 is pressed against the first and second bonding portions (321, 322 in FIG. 11A). As a result, the panel 20 corresponding to the first and second bonding portions (321, 322 in FIG. 11A) of the second bonding pad 312 may be bonded to the second regions 13a, 13b of the substrate 10. . Specifically, as shown in FIG. 4, when the second bonding pad 312 is gradually pressed, the first bonding pad 212 is formed in the first area 11 and the second area 13a of the substrate 10. , 13b) in contact with the panel 20 corresponding to the

boundary points

17a and 17b, pressing the panel 20 so that the panel 20 is formed in the first region 11 and the second region of the substrate 10. It may be bonded to the

boundary points

17a and 17b between the regions 13a and 13b. As another example, when the second bonding pad 312 is gradually pressed, the second bonding pad 312 is positioned at the

boundary points

17a and 17b and the center direction of the substrate 10 from the

boundary points

17a and 17b. As a result, it is possible to contact the panel 20 corresponding to a point in the area between points separated by a predetermined distance. The certain distance may be less than 3 millimeters, for example. Thereafter, the panel 20 moves from the

boundary points

17a and 17b between the first region 11 and the second regions 13a and 13b of the substrate 10 to the second region of the substrate 10 ( 13a, 13b) can be cemented. As another example, the panel 20 is a region between the

boundary points

17a and 17b of the substrate 10 and a point spaced apart from the

boundary points

17a and 17b in the direction of the center of the substrate 10 by 3 mm or less. It may be adhered to the second regions 13a and 13b of the substrate 10 in an order from the point to the outside. This may be possible due to the geometric shape of the second bonding pad 312. The second bonding pad 312 will be described in detail later.

According to the embodiment, after the panel 20 is bonded to the first area 11 of the substrate 10, bubbles are generated by sequential bonding so that the panel 20 is bonded to the second areas 13a and 13b of the substrate 10. It can prevent bonding failure by fundamentally blocking.

According to the embodiment, the shape of the second bonding pad 312 is made to correspond to the shape of the second regions 13a and 13b of the substrate 10 so that the panel 20 is formed in the second region 13a and 13b of the substrate 10. It is adhered to the entire 13b) so that it is uniformly and easily adhered between the panel 20 and the second regions 13a and 13b of the substrate 10 without lifting, thereby preventing a bonding failure.

As shown in FIG. 8E, after air is injected into the space between the vacuum chamber 507 and the jig 508 to bring the air into the standby state, the vacuum chamber 507 and the driving means 317 can move upward to their original positions. have.

Meanwhile, the temporary bonding pad 120 of the first bonding unit 100, the first bonding pad 212 of the second bonding unit 200 and/or the second bonding pad 312 of the third bonding unit 300 May be formed of an elastic material. For example, the temporary bonding pad 120, the first bonding pad 212 and/or the second bonding pad 312 may be formed of one of silicone, rubber, and resin materials such as silicone or epoxy. The resin material may include, for example, an epoxy resin.

9 shows a first bonding device provided in the second bonding unit of FIG. 3.

The first bonding device 210 according to the embodiment may be provided in the second bonding unit 200.

The first bonding device 210 may include a jig 211, a first bonding pad 212 mounted on the jig 211, and first and second

deformation inhibiting blocks

213 and 214.

The first bonding device 210 may be pressed in the vertical direction by a pressing device (not shown). For example, when the first bonding device 210 is located under the panel 20, the first bonding device 210 is pressed upward by the pressing device, so that the panel 20 is 1 can be bonded to the area (11).

The jig 211 serves to support the first bonding device 210 as a whole. The jig 211 may be provided with a mounting portion (not shown), and the first bonding pad 212 may be mounted on the mounting portion using an adhesive material.

When the first bonding pad 212 is pressed, the first and second deformation suppression blocks 213 and 214 suppress elastic deformation in the vertical direction generated by the first bonding pad 212 to prevent elastic deformation in the left and right directions. Can be promoted. For example, when the first bonding pad 212 is pressed, elastic deformation may occur in an upper direction, a lower direction, a left direction, and a right direction of the first bonding pad 212. Here, the elastic deformation may be defined as a force pushing in a specific direction. For example, the elastic deformation of the first bonding pad 212 in the vertical direction may be a force that the first bonding pad 212 pushes in the vertical direction.

The embodiment suppresses the elastic deformation generated in the vertical direction of the first bonding pad 212 as described above, and converts the elastic deformation generated in the vertical direction of the first bonding pad 212 in the left and right directions. The converted elastic deformation may be added to the elastic deformation generated in the left and right directions of the 212, so that the elastic deformation of the first bonding pad 212 in the left and right directions may be enhanced. By using the increased elastic deformation in the left and right directions as described above, the panel 20 can be more strongly and uniformly bonded to the entire first region 11 of the substrate 10 by the first bonding pad 212. have.

10 shows a second bonding device provided in the third bonding unit of FIG. 3.

The second bonding device 310 according to the embodiment may be provided in the third bonding unit 300.

The second bonding device 310 may include a jig 311, a second bonding pad 312 mounted on the jig 311, and first and second

deformation inhibiting blocks

313 and 314.

The second bonding device 310 may be pressed in the vertical direction by a pressing device (not shown). For example, when the second bonding device 310 is positioned under the panel 20, the second bonding device 310 is pressed upward by the pressing device, so that the panel 20 is It may be bonded to the two regions 13a and 13b.

The jig 311 serves to support the second bonding device 310 as a whole. A mounting part (not shown) is provided on the jig 311, and a second bonding pad 312 may be mounted on the mounting part using an adhesive material. When the second bonding pad 312 is pressed, the first and second deformation suppression blocks 313 and 314 suppress elastic deformation in the vertical direction generated by the second bonding pad 312 to prevent elastic deformation in the left and right directions Can be promoted. For example, when the second bonding pad 312 is pressed, elastic deformation may occur in an upper direction, a lower direction, a left direction, and a right direction of the second bonding pad 312. In this case, since the second regions 13a and 13b of the second substrate 10 to which the panel 20 is to be bonded, that is, the edge portions, do not exist on the upper and lower sides of the second bonding pad 312, the second bonding pad ( The elastic deformation generated in the vertical direction of 312) can act as a wasted factor.

The embodiment suppresses the elastic deformation generated in the vertical direction of the second bonding pad 312 as described above, and converts the elastic deformation generated in the vertical direction of the second bonding pad 312 in the left and right directions, so that the second bonding pad The converted elastic deformation may be added to the elastic deformation generated in the left-right direction of the 312, so that the elastic deformation in the left-right direction of the second bonding pad 312 may be enhanced. By using the increased elastic deformation in the left and right directions as described above, the panel 20 is more strongly and uniformly adhered to the entire second area 13a, 13b of the substrate 10 by the second bonding pad 312 Can be.

11A and 11B show a second bonding pad according to the first embodiment.

The second bonding pad 312 according to the first embodiment may include a first bonding portion 321 and a second bonding portion 322.

As shown in FIG. 12, the first bonding portion 321 and the second bonding portion 322 may be disposed to be spaced apart from each other. For example, the first bonding portion 321 may be located below the first side of the second bonding pad 312, and the second bonding portion 322 may be located below the second side of the second bonding pad 312. have. For example, a distance between the first bonding portion 321 and the second bonding portion 322 may be smaller than the distance between the 3-1 region 15a and the 3-2 region 15b of the substrate 10.

Each of the first bonding portion 321 and the second bonding portion 322 may include at least one

curved surface

323 and 324.

The first curved surface 323 may be located outside each of the first bonding portion 321 and the second bonding portion 322. The first curved surface 323 may have, for example, a first radius of curvature that is at least smaller than that of the second regions 13a and 13b of the substrate 10. When the second bonding pad 312 is pressed, the first curved surface 323 of each of the first bonding portion 321 and the second bonding portion 322 increases in an outward direction, so that the first curved surface 323 The panel 20 may be bonded to the second regions 13a and 13b of the substrate 10 by pressing ).

The first curved surface 323 may be formed between the 1-1th point 323a and the 1-2th point 323b positioned inside.

The second curved surface 324 may be located inside each of the first bonding portion 321 and the second bonding portion 322. The second curved surface 324 may contact the first curved surface 323. Specifically, the second curved surface 324 may contact the 1-1 point 323a of the first curved surface 323.

The second curved surface 324 may have a second radius of curvature that is larger than the first radius of curvature of the first curved surface 323. The second curved surface 324 may be formed between the 2-1 point 324a and the 2-2 point 324b positioned inside. In this case, the 2-2 point 324b of the second curved surface 324 may contact the 1-1 point 323a of the first curved surface 323.

The 2-1 point 324a of the second curved surface 324 is the panel 20 at the

boundary points

17a, 17b between the first region 11 and the second regions 13a, 13b of the substrate 10. You can touch it through. Accordingly, bonding from the

boundary points

17a, 17b between at least the first region 11 and the second regions 13a, 13b of the panel 20 of the panel 20 by pressing the second curved surface 324 It may be, after bonding is made between the panel 20 and the first region 11 of the substrate 10 by pressing the first bonding pad 212, the first bonding portion of the second bonding pad 312 ( The boundary between the first region 11 and the second region 13a, 13b of the substrate 10 by the pressing of the second curved surface 324 of each of the 321 and second bonding portions 322 From the

points

17a and 17b, the entire second regions 13a and 13b may be sequentially bonded.

As another example, the 2-1 point 324a of the second curved surface 324 is separated from the

boundary points

17a and 17b and the

boundary points

17a and 17b in the direction of the center of the substrate 10 by 3 mm or less. The panel 20 may be in contact at one point in the area between the points. Accordingly, between the

boundary points

17a and 17b of the panel 20 by pressing the second curved surface 324 and a point spaced apart from the

boundary points

17a and 17b in the direction of the center of the substrate 10 by 3 mm or less. Since it can be bonded from one point of the area of, the second bonding pad 312 is bonded between the panel 20 and the first area 11 of the substrate 10 by pressing the first bonding pad 212. ) Of the first bonding portion 321 and the second bonding portion 322 by pressing the second curved surface 324 of each of the panel 20 to the boundary points (17a, 17b) and the boundary points (17a, 17b) From a point in the area between points spaced apart by 3 millimeters or less in the center direction of the substrate 10, the second areas 13a and 13b may be sequentially bonded together.

On the other hand, the gap between the first bonding portion 321 and the 3-1 region 15a of the first substrate 10 or the second bonding portion 322 and the 3-2 region of the first substrate 10 ( The interval between 15b) may be changed according to the elastic deformation pressure of the second bonding pad 312.

The first bonding portion 321 of the second bonding pad 312 may be spaced apart from a boundary point between the 2-1 area 13a and the 3-1 area 15a of the substrate 10. For example, the outermost end of the first bonding portion 321, that is, the 1-2 point 323b of the first curved surface 323 is the 2-1 area 13a and the 3-1 area of the substrate 10 It can be separated from the boundary between (15a). For example, the 1-2 point 323b of the first curved surface 323 is 0.3 mm to 3 mm from the boundary point between the 2-1 area 13a and the 3-1 area 15a of the substrate 10 Can be separated.

The second bonding portion 322 of the second bonding pad 312 may be spaced apart from a boundary point between the 2-2nd area 13b and the 3-2nd area 15b of the substrate 10. For example, the outermost end of the second bonding portion 322, that is, the 1-2 point 323b of the first curved surface 323 is the 2-1 area 13a and the 3-2 area of the substrate 10 (15b) can be separated from the boundary point between. The 1-2 point 323b of the first curved surface 323 may be spaced from 0.3 mm to 3 mm from the boundary point between the 2-2 area 13b and the 3-2 area 15b of the substrate 10. I can.

As such, the 1-2 point 323b of the first curved surface 323 is spaced apart from the boundary point between the 2-1 area 13a and the 3-1 area 15a of the substrate 10, and the second The first-second point 323b of the curved surface 324 is spaced apart from the boundary point between the second-second region 13b and the third-second region 15b of the substrate 10, so that the second bonding pad 312 ) May be easily moved up and down through the region 3-1 (15a) and region 3-2 (15b) of the substrate 10. In addition, when the second bonding pad 312 is pressed after being lowered, the first curved surface 323 of the first bonding portion 321 and the first curved surface 323 of the second bonding portion 322 move outward. It is elastically deformed so that the first-second point 323b of the first curved surface 323 has the panel 20 interposed therebetween, and the second-first region 13a and the second-second region 13b of the substrate 10 are respectively You can touch one area of

The second bonding pad 312 according to the first embodiment may include a first inner side 325 and a second inner side 326.

The first inner surface 325 and the second inner surface 326 may be symmetrical with respect to the center of the second bonding pad 312, but this is not limited thereto.

The first inner surface 325 may extend inwardly from the first bonding portion 321. The first inner surface 325 may have an acute angle with respect to the horizontal line. For example, the first inner surface 325 may have an angle of 5 to 30 degrees with respect to the horizontal line. Accordingly, the first inner surface 325 may be a surface extending in a diagonal direction with an angle of 5 to 30 degrees from the first bonding portion 321.

The second inner surface 326 may extend inwardly from the second bonding portion 322. The second inner surface 326 may have an acute angle with respect to the horizontal line. For example, the second inner surface 326 may have an angle of 5 to 30 degrees with respect to the horizontal line. Accordingly, the second inner surface 326 may be a surface extending in a diagonal direction with an angle of 5 to 30 degrees from the first bonding portion 321.

The first inner surface 325 and the second inner surface 326 may meet at the center of the second bonding pad 312, and a point where they meet each other may be defined as a contact area (329 in FIG. 13A ). In this contact area 329, an angle between the first inner surface 325 and the second inner surface 326 may have an obtuse angle. For example, an angle between the first inner surface 325 and the second inner surface 326 in the contact area 329 may be 120 degrees to 170 degrees.

In this case, a groove portion 350 that enters into the horizontal line may be formed by the first inner surface 325 and the second inner surface 326. Even if the first bonding pad 212 is pressed by the groove portion 350, the panel 20 is not bonded to the first region 11 of the substrate 10, and the first bonding portion 321 and the second bonding pad are bonded. It may be adhered to only the second regions 13a and 13b of the substrate 10 by the portion 322.

The second bonding pad 312 according to the first embodiment may include a first outer surface 327 and a second outer surface 328.

The first outer surface 327 and the second outer surface 328 may be symmetrical with respect to the center of the second bonding pad 312, but this is not limited thereto.

The first outer surface 327 may extend outward from the first bonding portion 321. The first outer surface 327 may have an acute angle with respect to a vertical line. For example, the first outer surface 327 may have an angle of 3 degrees to 35 degrees with respect to a vertical line. Accordingly, the first outer surface 327 may be a surface extending in a diagonal direction with an angle of 3 to 35 degrees from the first bonding portion 321.

The second outer surface 328 may extend outward from the second bonding portion 322. The second outer surface 328 may have an acute angle with respect to a vertical line. For example, the second outer surface 328 may have an angle of 3 degrees to 35 degrees with respect to the vertical line. Accordingly, the second outer surface 328 may be a surface extending in a diagonal direction with an angle of 3° to 35° from the second bonding portion 322.

The upper region of the second bonding pad 312 may be mounted on the mounting portion of the second bonding device 310. Each of the first outer surface 327 and the second outer surface 328 may contact an upper region of the second bonding pad 312.

Meanwhile, a recess 331 may be provided in a region where the first inner surface 325 and the second inner surface 326 meet, that is, the contact region 329.

When the second bonding pad 312 is pressed, the recess 331 may further reinforce the elastic deformation of the first bonding portion 321 and the second bonding portion 322 in an outward direction. That is, when the second bonding pad 312 is pressed, the recess 331 further expands in the transverse direction, and the first bonding portion 321 and the first bonding portion 321 and The second bonding portion 322 is further reinforced with elastic deformation in the outer direction, so that the second bonding portion 322 may be more strongly bonded to the second regions 13a and 13b of the substrate 10 of the panel 20. In addition, when the second bonding pad 312 is pressed by the recess 331, it is possible to prolong the life by preventing tearing to the bonding pad 312 or generating a strong load when the recess 331 is not present. have.

The recess 331 may be a groove recessed inward. The recess 331 may have a hemispherical shape, but is not limited thereto. The recess 331 may have a radius of curvature of 2.5 to 5 mm, for example.

The recess 331 may be elongated along the length direction of the second bonding pad 312.

Although not shown, the recesses 331 may be provided in plural spaced apart from each other along the length direction of the second bonding pad 312.

13A and 13B show a second bonding pad according to the second embodiment.

The second embodiment is the same as the first embodiment except for at least two or

more recesses

332 and 333. Accordingly, in the second embodiment, components having the same shape, structure, and/or function as in the first embodiment are denoted by the same reference numerals, and detailed descriptions are omitted.

At least one or more recesses 332 may be formed on the first inner surface 325. At least one or more recesses 333 may be formed on the second inner surface 326.

The

recesses

332 and 333 may be equal to or smaller than the radius of curvature of the recess 331 according to the first embodiment.

The

recesses

332 and 333 may be formed to be elongated along the length direction of the second bonding pad 312.

Although not shown, the

recesses

332 and 333 may be provided in plural spaced apart from each other along the length direction of the second bonding pad 312.

14A and 14B show a second bonding pad according to the third embodiment.

The third embodiment may be a combination of the recess 331 of the first embodiment and the

recesses

332 and 333 of the second embodiment. Accordingly, in the third embodiment, components having the same shape, structure and/or function as in the first embodiment and/or the second embodiment are denoted by the same reference numerals, and detailed descriptions are omitted.

A recess 331 is provided in a region where the first inner surface 325 and the second inner surface 326 meet, that is, the contact area 329, and at least one or more recesses on the first inner surface 325 ( 332) may be provided, and at least one or more recesses 333 may be provided on the second inner surface 326.

The

recesses

331, 332, and 333 may be formed to be elongated along the length direction of the second bonding pad 312.

Although not shown, the

recesses

331, 332, and 333 may be provided in plural spaced apart from each other along the length direction of the second bonding pad 312.

As shown in FIGS. 5 and 15, the second bonding pad 312 is pressed so that the 2-1 point of the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 The 324a may contact the

boundary points

17a and 17b between the first region 11 and the second region 13a and 13b of the substrate 10 with the panel 20 therebetween.

As another example, the second bonding pad 312 is pressed so that the 2-1 point 324a of the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 is the panel 20 ), the

boundary points

17a and 17b of the substrate 10 and a point spaced apart from the

boundary points

17a and 17b by 3 millimeters or less may be contacted.

3 and 4, in the second bonding unit 200, the panel 20 may be bonded to the first region 11 of the substrate 10. That is, the panel 20 is at the

boundary points

17a, 17b between the first region 11 and the second regions 13a and 13b of the substrate 10 from the center of the first region 11 of the substrate 10 Can be cemented up to. In the third bonding unit 300 provided with the second bonding pad 312, which is a later process, it may be bonded to the second areas 13a and 13b of the substrate 10 of the panel 20. In particular, the panel 20 is at least the

boundary points

17a, 17b between the first region 11 and the second regions 13a, 13b of the substrate 10 or the

boundary points

17a, 17b of the substrate 10 And the

boundary points

17a, 17b should be bonded in the order of the outside from one point in the region between the points spaced apart from the

boundary points

17a, 17b or less, so that excellent bonding quality without generation of bubbles can be obtained. Therefore, according to the embodiment, through the change in the shape of the second bonding pad 312, the second curved surface of each of the first bonding portion 321 and the second bonding portion 322 when the second bonding pad 312 is pressed The boundary points 17a, 17b between the first region 11 and the second region 13a, 13b of the substrate 10 with the 2-1 point 324a of 324 interposed between the panel 20 You can touch

According to the embodiment, through a change in the shape of the second bonding pad 312, the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 when the second bonding pad 312 is pressed. ), the area between the

boundary points

17a and 17b of the substrate 10 and a point separated by less than 3 mm from the

boundary points

17a and 17b with the panel 20 interposed therebetween You can touch one point of

5 and 16, when the second bonding pad 312 is additionally pressed, the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 is elastic. It can be expanded in the lower direction and/or the outer direction by deformation. Accordingly, the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 is arranged in the order of the 2-1 point 324a to the 2-2 point 324b. ) Is pressed, so that a portion of the second regions 13a and 13b of the substrate 10 corresponding to the second curved surface 324 of the panel 20 may be bonded.

5 and 17, the first curved surface 323 and the second curved surface 324 of each of the first bonding portion 321 and the second bonding portion 322 may contact each other. That is, the 1-1 point 323a of the first curved surface 323 and the 2-2nd point 324b of the second curved surface 324 may be the same point.

When the second bonding pad 312 is additionally pressed, the panel 20 may be bonded to the corresponding portion of the substrate 10 corresponding to the 1-1 point 323a of the first curved surface 323.

5 and 18, when the second bonding pad 312 is additionally pressed, the first curved surfaces 323 of each of the first bonding portion 321 and the second bonding portion 322 are elastic. It can be expanded in the lower direction and/or the outer direction by deformation. Accordingly, the panel 20 in the order of the 1-1 point 323a to the 2-2 point 324b of the first curved surface 323 of each of the first bonding portion 321 and the second bonding portion 322 ) Is pressed, so that other portions of the second regions 13a and 13b of the substrate 10 corresponding to the first curved surface 323 of the panel 20 may be bonded together.

The embodiments can be applied to fields requiring bonding between different members, for example, electronic devices.

Claims

A first bonding portion;

A first inner surface extending inward from the first bonding portion;

A second bonding portion; And

And a second inner surface extending inward from the second bonding portion and in contact with the first inner portion in a contact area,

Each of the first bonding portion and the second bonding portion includes at least one curved surface,

Each of the first inner side and the second inner side has an acute angle with respect to the horizontal line.

Cementation pad.
The method of claim 1,

The substrate includes a first region that is a horizontal plane, a second region that is in contact with both sides of the first region, and a third region that is a vertical plane that is in contact with the second region,

The at least one curved surface,

A first curved surface having a first radius of curvature that is at least smaller than a radius of curvature of the second region of the substrate,

The first curved surface,

Including a first curved surface having a point 1-1 and a point 1-2 spaced apart from the point 1-1

Cementation pad.
The method of claim 2,

The first-second point of the first curved surface is spaced apart from the third area of the substrate

Cementation pad.
The method of claim 3,

The first-second point of the first curved surface is spaced from 0.3 mm to 3 mm from the boundary point between the second area and the third area of the substrate.

Cementation pad.
The method of claim 2,

The at least one curved surface,

The panel is interposed between the panel at a point located inside the first curved surface and at a boundary point between the first region and the second region of the substrate, or at a region between the boundary point and a point spaced 3 mm or less from the boundary point. And a second curved surface spaced apart from the point 2-1 in contact and the point 2-1 and having a point 2-2 in contact with the point 1-1 of the first curved surface

Cementation pad.
The method of claim 5,

The second curved surface has a second radius of curvature greater than the first radius of curvature of the first curved surface

Cementation pad.
The method of claim 1,

Each of the first inner side and the second inner side has an angle of 5 to 30 degrees with respect to the horizontal line.

Cementation pad.
The method of claim 1,

The contact area has a hemispherical recess

Cementation pad.
The method of claim 8,

The recess has a radius of curvature of 2.5 mm to 5 mm

Cementation pad.
The method of claim 1,

The first inner surface and the second inner surface have at least two hemispherical recesses

Cementation pad.
The method of claim 1,

A first outer surface extending outward from the first bonding portion; And

Comprising a second outer surface extending outward from the second bonding portion

Cementation pad.
The method of claim 11,

Each of the first outer surface and the second outer surface has an acute angle with respect to a vertical line.

Cementation pad.
The method of claim 12,

Each of the first outer surface and the second outer surface has an angle of 3 degrees to 35 degrees with respect to the vertical line.

Cementation pad.
The method of claim 11,

The first bonding portion, the second bonding portion, the first inner surface, the second inner surface, the first outer surface and the second outer surface are integrally formed of one of silicone, rubber, and resin materials.

Cementation pad.
A first bonding unit for aligning the panel to the substrate and temporarily bonding a portion of the panel to a portion of the first area that is a plane of the substrate;

A second bonding unit for bonding the panel to the first area of the substrate using a first bonding pad; And

A third bonding unit for bonding the panel to a second region of the substrate using a second bonding pad,

The second region of the substrate is in contact with both sides of the first region.

Cementation manufacturing device.
The method of claim 15,

The first bonding pad includes a round-shaped protrusion,

The protrusion height of the protrusion is 0.2 to 6 mm

Cementation manufacturing device.
The method of claim 16,

When the first bonding pad is pressed, the panel is bonded to the first area of the substrate in order from the center of the round-shaped protrusion of the first bonding pad to the peripheral portion.

Cementation manufacturing device.
The method of claim 15,

The second bonding pad,

A first bonding portion;

A first inner surface extending inward from the first bonding portion;

A second bonding portion; And

And a second inner surface extending inward from the second bonding portion and in contact with the first inner portion in a contact area,

Each of the first bonding portion and the second bonding portion includes a first curved surface positioned on the outside and a second curved surface positioned inside and in contact with the first curved surface.

Cementation manufacturing device.
The method of claim 18, wherein when the second bonding pad is pressed, the panel is bonded to a boundary point between the first area and the second area by a first point of the second curved surface, and the second curved surface The panel is adhered to the second area of the substrate in the order of a second point of, a first point of the first curved surface, and a second point of the first curved surface.

Cementation manufacturing device.
The method of claim 15,

The second bonding unit,

Including first and second deformation suppression blocks disposed above and below the first bonding pad to change the elastic deformation of the first bonding pad,

The third bonding unit,

Including first and second deformation suppression blocks disposed above and below the second bonding pad to change the elastic deformation of the second bonding pad

Cementation manufacturing device.