WO2023054178A1 - Film barrière aux gaz, procédé de production de ce dernier, plaque polarisante avec couche barrière aux gaz, dispositif d'affichage d'image et cellule solaire - Google Patents

Film barrière aux gaz, procédé de production de ce dernier, plaque polarisante avec couche barrière aux gaz, dispositif d'affichage d'image et cellule solaire Download PDF

Info

Publication number
WO2023054178A1
WO2023054178A1 PCT/JP2022/035427 JP2022035427W WO2023054178A1 WO 2023054178 A1 WO2023054178 A1 WO 2023054178A1 JP 2022035427 W JP2022035427 W JP 2022035427W WO 2023054178 A1 WO2023054178 A1 WO 2023054178A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas barrier
layer
film
barrier film
silicon oxynitride
Prior art date
Application number
PCT/JP2022/035427
Other languages
English (en)
Japanese (ja)
Inventor
恭太郎 山田
一裕 中島
帆奈美 伊藤
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2023054178A1 publication Critical patent/WO2023054178A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to a gas barrier film, a method for producing the same, a polarizing plate with a gas barrier layer, an image display device, and a solar cell.
  • resin film substrates are being used instead of glass substrates. Since resin films have higher permeability to gases such as water vapor and oxygen than glass, it has been proposed to use a gas barrier film having a gas barrier layer for the purpose of suppressing deterioration of display elements caused by these gases.
  • Organic EL elements may have defects called “dark spots” due to the infiltration of even a small amount of moisture, and high gas barrier properties (water vapor blocking properties) are required.
  • Silicon nitride (SiN) and silicon oxynitride (SiON) are known as materials having excellent gas barrier properties.
  • Patent Document 1 proposes a gas barrier film including a silicon nitride layer and a silicon oxide layer as a gas barrier film with excellent transparency and flexibility.
  • Patent Document 1 has room for improvement in terms of increasing the transparency and gas barrier properties of the gas barrier film.
  • the present invention has been made in view of the above problems, and aims to provide a gas barrier film having excellent transparency and gas barrier properties, a method for producing the same, a polarizing plate with a gas barrier layer using the gas barrier film, an image display device, and a method for producing the same. It is to provide solar cells.
  • the present invention includes the following aspects.
  • a gas barrier film comprising a transparent film substrate and a gas barrier layer disposed directly or indirectly on at least one main surface of the transparent film substrate,
  • the gas barrier layer has a silicon oxynitride layer containing oxygen, nitrogen and silicon as constituent elements
  • the composition ratio O/N is greater than 1.0 when 1/10 of the total etching time has elapsed, and the composition ratio O/N is less than 2.0 when 1/2 of the total etching time has elapsed, and
  • the composition ratio O/N when 9/10 has passed is greater than 1.0,
  • the composition ratio O/N when 1/10 of the total etching time has passed and the composition ratio O/N when 9/10 of the total etching time has passed are both 1/1 of the total etching time.
  • composition ratio O/N when 1/10 of the total etching time has passed and the composition ratio O/N when 9/10 of the total etching time has passed are both greater than 2.0.
  • composition ratio O/N when 1/10 of the total etching time has elapsed and the composition ratio O/N when 9/10 of the total etching time has elapsed are both greater than 10.0.
  • a polarizing plate with a gas barrier layer comprising the gas barrier film according to any one of [1] to [9] above and a polarizer.
  • An image display device comprising the gas barrier film according to any one of [1] to [9] and an image display cell.
  • An image display device comprising the polarizing plate with a gas barrier layer according to [11] and an image display cell.
  • a solar cell comprising the gas barrier film according to any one of [1] to [9] and a solar cell.
  • the present invention it is possible to provide a gas barrier film with excellent transparency and gas barrier properties, a method for producing the same, and a polarizing plate with a gas barrier layer, an image display device, and a solar cell using the gas barrier film.
  • FIG. 1 is a cross-sectional view showing an example of a gas barrier film according to the present invention
  • FIG. FIG. 4 is a cross-sectional view showing another example of the gas barrier film according to the present invention
  • FIG. 4 is a cross-sectional view showing another example of the gas barrier film according to the present invention
  • FIG. 4 is a cross-sectional view showing another example of the gas barrier film according to the present invention
  • FIG. 4 is a cross-sectional view showing another example of the gas barrier film according to the present invention
  • 1 is a configuration diagram showing an example of a film forming apparatus used in a method for producing a gas barrier film according to the present invention
  • FIG. 4 is a graph showing an example of composition analysis results in the thickness direction of the silicon oxynitride layer of the gas barrier film according to the present invention.
  • BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows an example of the polarizing plate with a gas barrier layer which concerns on this invention. It is a sectional view showing an example of an image display device concerning the present invention.
  • the number average primary particle diameter of the particles is the circle of 100 primary particles measured using a scanning electron microscope and image processing software (e.g., "ImageJ” manufactured by the National Institutes of Health), unless otherwise specified. It is a number average value of equivalent diameters (Heywood diameter: diameter of a circle having the same area as the projected area of primary particles).
  • the "principal surface" of a layered product point to the face
  • the numerical value for the "thickness" of the layered material is the "average thickness".
  • the average thickness of the layered material is obtained by observing a cross section of the layered material cut in the thickness direction with an electron microscope, randomly selecting 10 measurement points from the cross-sectional image, and measuring the thickness of the selected 10 measurement points. Arithmetic mean of 10 measurements obtained.
  • Refractive index refers to the refractive index for light with a wavelength of 550 nm in an atmosphere at a temperature of 23°C.
  • the flow rate unit "sccm (Standard Cubic Centimeter per Minute)" is the flow rate unit “mL/min” under standard conditions (temperature: 0°C, pressure: 101.3 kPa).
  • system may be added after the name of the compound to generically refer to the compound and its derivatives.
  • polymer name is expressed by adding "system” after the compound name, it means that the repeating unit of the polymer is derived from the compound or its derivative.
  • Acryl and methacryl may be collectively referred to as "(meth)acryl”.
  • a gas barrier film according to a first embodiment of the present invention has a transparent film substrate and a gas barrier layer directly or indirectly arranged on at least one main surface of the transparent film substrate.
  • the gas barrier layer has a silicon oxynitride layer containing oxygen, nitrogen and silicon as constituent elements. While etching the silicon oxynitride layer under constant conditions using X-ray photoelectron spectroscopy, the composition ratio O/N of oxygen and nitrogen in the thickness direction of the silicon oxynitride layer was measured.
  • the composition ratio O/N is greater than 1.0 when 10 has passed, the composition ratio O/N is less than 2.0 when 1/2 of the total etching time has passed, and 9/10 of the total etching time is The composition ratio O/N is greater than 1.0 over time.
  • the composition ratio O/N when 1/10 of the total etching time has elapsed and the composition ratio O/N when 9/10 of the total etching time has elapsed are both the same when 1/2 of the total etching time has elapsed. is greater than the composition ratio O/N of
  • the method of analyzing the elemental composition in the thickness direction of the silicon oxynitride layer while etching the silicon oxynitride layer under certain conditions using X-ray photoelectron spectroscopy is the same method as in the examples described later or a method based thereon.
  • the phrase "while etching under constant conditions" means “while etching under the same conditions without changing the etching conditions”.
  • the etching conditions for the silicon oxynitride layer the etching conditions that are usually used for composition analysis in the thickness direction of the silicon oxynitride layer can be used.
  • composition ratio O/N means a value obtained by dividing the number of oxygen atoms by the number of nitrogen atoms (number of oxygen atoms/number of nitrogen atoms) at the measurement location of the silicon oxynitride layer.
  • total etching time means the time from the start to the end of etching the silicon oxynitride layer.
  • X-ray photoelectron spectroscopy may be referred to as "XPS".
  • XPS X-ray photoelectron spectroscopy
  • the composition ratio O/N when 1/10 of the total etching time has passed may be described as "1/10 ⁇ O/N”.
  • the composition ratio O/N when 1/2 of the total etching time has passed may be described as "1/2-O/N”.
  • the composition ratio O/N when 9/10 of the total etching time has elapsed is sometimes described as "9/10-O/N".
  • a gas barrier film with excellent transparency and gas barrier properties can be provided. The reason is presumed as follows.
  • the silicon oxynitride layer has a lower refractive index as the oxygen ratio in the layer increases, approaching the refractive index of resins and adhesives.
  • the surface layers on both sides of the silicon oxynitride layer have a relatively high oxygen ratio. Therefore, in the first embodiment, the difference in refractive index between the layer in contact with the silicon oxynitride layer (more specifically, the transparent film substrate, the adhesive layer, etc.) and the silicon oxynitride layer tends to decrease. be. As a result, the gas barrier film according to the first embodiment tends to have high light transmittance. Therefore, according to the first embodiment, a gas barrier film having excellent transparency can be obtained.
  • the silicon oxynitride layer tends to have higher gas barrier properties as the nitrogen ratio in the layer increases.
  • the ratio of nitrogen in the central portion in the thickness direction of the silicon oxynitride layer is relatively high. Therefore, in the first embodiment, there is a tendency for the gas barrier property of the central portion in the thickness direction of the silicon oxynitride layer to be high. Therefore, according to the first embodiment, a gas barrier film having excellent gas barrier properties can be obtained.
  • both 1/10-O/N and 9/10-O/N are preferably greater than 2.0, and 2.5. It is more preferably 3.0 or more, and more preferably 3.0 or more. Further, in the first embodiment, in order to obtain a gas barrier film with more excellent gas barrier properties, 1/2-O/N is preferably less than 1.0, more preferably 0.9 or less, and 0 0.8 or less is more preferable. Therefore, in the first embodiment, it is preferable that both 1/10-O/N and 9/10-O/N are larger than 2.0 or 1/2-O/N is smaller than 1.0.
  • 1/10-O/N and 9/10-O/N are both 2.5 or more, or 1/2-O/N is more preferably 0.9 or less, 1/10 More preferably, both -O/N and 9/10-O/N are 3.0 or more, or 1/2-O/N is 0.8 or less.
  • both 1/10-O/N and 9/10-O/N are preferably less than 10.0 in order to obtain a gas barrier film with more excellent gas barrier properties, and 9.0 It is more preferably 8.0 or less, more preferably 8.0 or less.
  • 1/2-O/N is preferably greater than 0.1, more preferably 0.2 or more, and more preferably 0.3. It is more preferable that it is above.
  • both 1/10-O/N and 9/10-O/N are greater than 2.0 and 1/2-O/ N is preferably greater than 0.5, 1/10-O/N and 9/10-O/N are both 2.5 or more, and 1/2-O/N is 1.0 or more More preferably, 1/10-O/N and 9/10-O/N are both 3.0 or more, and 1/2-O/N is 1.2 or more. .
  • 1/2-O/N is less than 1.0, and 1/10-O/N and 9/10-O/N are Both are preferably less than 5.0, 1/2-O/N is 0.9 or less, and 1/10-O/N and 9/10-O/N are both 4.0 or less More preferably, 1/2-O/N is 0.8 or less, and 1/10-O/N and 9/10-O/N are both 3.0 or less. .
  • FIG. 1 is a cross-sectional view showing an example of the gas barrier film according to the first embodiment.
  • a gas barrier film 10 shown in FIG. 1 is a laminate having a transparent film substrate 11 and a gas barrier layer 12 directly disposed on one main surface 11 a of the transparent film substrate 11 .
  • the gas barrier layer 12 has a single layer structure consisting of a silicon oxynitride layer 13 containing oxygen, nitrogen and silicon as constituent elements.
  • composition ratio O/N of oxygen and nitrogen in the thickness direction of the silicon oxynitride layer 13 was measured while etching the silicon oxynitride layer 13 under constant conditions using XPS, it was found to be 1/10-O/ N is greater than 1.0, 1/2-O/N is less than 2.0, and 9/10-O/N is greater than 1.0. Both 1/10-O/N and 9/10-O/N are greater than 1/2-O/N.
  • the configuration of the gas barrier film according to the first embodiment is not limited to the configuration of the gas barrier film 10 shown in FIG.
  • the gas barrier film according to the first embodiment may have a laminated structure in which the gas barrier layer is composed of a plurality of thin films, like the gas barrier film 20 shown in FIG.
  • the gas barrier layer 21 has the silicon oxynitride layer 13 and the low refractive index layer 22 disposed on the main surface 13a of the silicon oxynitride layer 13 opposite to the transparent film substrate 11 side.
  • the low refractive index layer 22 is a layer having a lower refractive index than the silicon oxynitride layer 13 .
  • the low refractive index layer 22 enhances gas barrier properties together with the silicon oxynitride layer 13, functions as an optical interference layer, and has the effect of reducing light reflection by the gas barrier layer 21 and increasing light transmittance.
  • the gas barrier film according to the first embodiment may have low refractive index layers on both main surfaces of the silicon oxynitride layer.
  • the gas barrier layer may include two or more silicon oxynitride layers, for example, two silicon oxynitride layers and three low refractive index layers. Alternating laminates may also be used.
  • the gas barrier layer may have a laminate structure of four layers or a laminate structure of six or more layers.
  • the gas barrier layer having a four-layer structure may be an alternate laminate in which silicon oxynitride layer/low refractive index layer/silicon oxynitride layer/low refractive index layer are arranged in this order from the transparent film substrate side.
  • the outermost layer is preferably a low refractive index layer.
  • the gas barrier layer which consists of a total of four or more layers, is interposed between the silicon oxynitride layer and the low refractive index layer.
  • a refractive index layer may be included.
  • the gas barrier layer may be an alternately laminated body composed of a total of seven layers, that is, three silicon oxynitride layers and four low refractive index layers, or may be an alternately laminated body composed of eight or more layers.
  • the gas barrier layer may be indirectly arranged on the main surface of the transparent film substrate.
  • the gas barrier film 30 shown in FIG. 3 has a hard coat layer 31 arranged between the transparent film substrate 11 and the gas barrier layer 12 (silicon oxynitride layer 13).
  • the gas barrier layer 12 is indirectly arranged on the main surface of the transparent film substrate 11 .
  • the hard coat layer 31 is a layer that enhances mechanical properties such as hardness and elastic modulus of the gas barrier film 30 . If the main surface of the hard coat layer 31 on the side of the gas barrier layer 12 is smooth, the gas barrier property of the gas barrier layer 12 formed thereon is enhanced, and the water vapor transmission rate tends to decrease.
  • the arithmetic mean height Sa of the main surface of the hard coat layer 31 on the side of the gas barrier layer 12 may be 1.5 nm or less or 1.0 nm or less.
  • the arithmetic mean height Sa is calculated according to ISO 25178 from the three-dimensional surface profile of the range of 1 ⁇ m ⁇ 1 ⁇ m measured by an atomic force microscope (AFM).
  • the hard coat layer 31 may contain particles with a number average primary particle diameter of less than 1.0 ⁇ m (hereinafter sometimes referred to as "nanoparticles").
  • nanoparticles particles with a number average primary particle diameter of less than 1.0 ⁇ m
  • the adhesion between the hard coat layer 31 and the gas barrier layer 12 tends to improve.
  • the adhesion between the hard coat layer 31 and the gas barrier layer 12 tends to be higher.
  • the gas barrier film according to the first embodiment may be provided with gas barrier layers on both main surfaces of the transparent film substrate in order to further improve gas barrier properties.
  • a gas barrier layer having a laminated structure may be provided on each of both main surfaces of the transparent film substrate.
  • the configuration of the gas barrier layer 41 may be the same as or different from the configuration of the gas barrier layer 12 . That is, the gas barrier layer 41 may or may have a silicon oxynitride layer with 1/10-O/N, 1/2-O/N, and 9/10-O/N in the above specific ranges. It doesn't have to be. In order to obtain a gas barrier film having excellent transparency while further improving gas barrier properties, the gas barrier layer 41 has a silicon oxynitride layer, and the silicon oxynitride layer of the gas barrier layer 41 has a ratio of 1/10-O/N. and 9/10-O/N are both greater than 1.0, 1/2-O/N is less than 2.0, and 1/10-O/N and 9/10-O/N are both 1 /2-O/N is preferred.
  • the gas barrier film according to the first embodiment may further have an adhesive layer.
  • the gas barrier film 50 shown in FIG. 5 has an adhesive layer 51 in addition to the configuration of the gas barrier film 40 .
  • an adhesive layer 51 is arranged on the main surface 13a of the gas barrier layer 12 (silicon oxynitride layer 13) on the side opposite to the transparent film substrate 11 side.
  • the silicon oxynitride layer 13 and the adhesive layer 51 are in contact with each other like the gas barrier film 50 shown in FIG.
  • a release liner may be temporarily attached to the main surface of the adhesive layer 51 opposite to the silicon oxynitride layer 13 side.
  • the release liner protects the surface of the pressure-sensitive adhesive layer 51, for example, until the gas barrier film 50 is attached to the polarizing plate 101 (see FIG. 8) described below.
  • Plastic films made of acrylic, polyolefin, cyclic polyolefin, polyester or the like are preferably used as the constituent material of the release liner.
  • the thickness of the release liner is, for example, 5 ⁇ m or more and 200 ⁇ m or less.
  • the surface of the release liner is preferably subjected to release treatment. Examples of release agent materials used in release treatment include silicone-based materials, fluorine-based materials, long-chain alkyl-based materials, fatty acid amide-based materials, and the like.
  • the transparent film substrate 11 is a layer that serves as a base for forming the gas barrier layer.
  • the transparent film substrate 11 may have flexibility.
  • the gas barrier layer can be formed by a roll-to-roll method, so the productivity of the gas barrier layer can be improved.
  • a gas barrier film in which a gas barrier layer is provided on a flexible film also has the advantage of being applicable to flexible devices and foldable devices.
  • the visible light transmittance of the transparent film substrate 11 is preferably 80% or higher, more preferably 90% or higher.
  • the thickness of the transparent film substrate 11 is not particularly limited, but from the viewpoint of strength, handleability, etc., it is preferably 5 ⁇ m or more and 200 ⁇ m or less, more preferably 10 ⁇ m or more and 150 ⁇ m or less, and 30 ⁇ m or more and 100 ⁇ m or less. is more preferred.
  • resin material that constitutes the transparent film substrate 11 a resin material that is excellent in transparency, mechanical strength and thermal stability is preferable.
  • resin materials include cellulose resins such as triacetyl cellulose, polyester resins, polyethersulfone resins, polysulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) Examples include acrylic resins, cyclic polyolefin resins (more specifically, norbornene resins, etc.), polyarylate resins, polystyrene resins, polyvinyl alcohol resins, and mixtures thereof.
  • Corona treatment, plasma treatment, flame treatment, ozone treatment, glow treatment, saponification treatment, and coupling agent are applied to the main surface of the transparent film substrate 11 on which the gas barrier layer is formed, for the purpose of improving adhesion with the gas barrier layer.
  • Surface modification treatment such as treatment with may be applied.
  • the surface layer of the transparent film substrate 11 on which the gas barrier layer is formed may be a primer layer (not shown).
  • the primer layer When the surface layer on which the gas barrier layer is formed is the primer layer, the adhesion between the transparent film substrate 11 and the gas barrier layer tends to be high.
  • Examples of materials constituting the primer layer include metals (or semi-metals) such as silicon, nickel, chromium, tin, gold, silver, platinum, zinc, indium, titanium, tungsten, aluminum, zirconium, and palladium; alloys (or metalloids); oxides, fluorides, sulfides or nitrides of these metals (or metalloids);
  • the thickness of the primer layer is, for example, 1 nm or more and 20 nm or less, preferably 1 nm or more and 15 nm or less, and more preferably 1 nm or more and 10 nm or less.
  • the silicon oxynitride layer 13 is a layer mainly having a gas barrier function in the gas barrier layer, and is a layer made of a material containing silicon, oxygen and nitrogen as main constituent elements.
  • the silicon oxynitride layer 13 may contain a small amount of elements such as hydrogen, carbon, etc. taken in from the raw material at the time of film formation, the transparent film substrate 11 and the external environment.
  • the content of elements other than silicon, oxygen, and nitrogen is preferably 5 atomic % or less, more preferably 3 atomic % or less, and 1 atomic % or less. is more preferred.
  • the total content of silicon, oxygen and nitrogen is preferably 90 atomic % or more, more preferably 95 atomic % or more, and 97 atomic % or more. More preferably, it may be 99 atomic % or more, 99.5 atomic % or more, or 99.9 atomic % or more.
  • the composition of silicon oxynitride in the silicon oxynitride layer 13 is represented by SiO x N y .
  • SiO x N y 0 ⁇ x ⁇ 2 and 0 ⁇ y ⁇ 1.33.
  • x and y in SiO x N y are x and y of the composition ratio at the central portion in the thickness direction of the silicon oxynitride layer 13 (when 1/2 of the total etching time has elapsed). point to Therefore, the ratio x/y is synonymous with 1/2-O/N.
  • x in the general formula SiO x N y may be simply referred to as "x”.
  • y in the general formula SiO x N y may be simply described as "y”.
  • the silicon oxynitride in the silicon oxynitride layer 13 may have a stoichiometric composition or may be a non-stoichiometric composition lacking oxygen or nitrogen.
  • the value of (x/2+3y/4) is preferably 0.70 or more and 1.10 or less.
  • the upper limit of (x/2+3y/4) is 1, but it may show a value greater than 1 due to excessive intake of oxygen or nitrogen. If (x/2+3y/4) is 0.70 or more, transparency and gas barrier properties tend to be enhanced.
  • the value of (x/2+3y/4) is preferably 0.75 or more.
  • the refractive index of the silicon oxynitride layer 13 is generally 1.50 or more and 2.20 or less, preferably 1.55 or more and 2.00 or less, and may be 1.60 or more and 1.90 or less. It may be 1.85 or less, 1.80 or less, 1.75 or less, or 1.70 or less.
  • the silicon oxynitride layer 13 having a refractive index within this range can achieve both excellent gas barrier properties and transparency. Further, when the refractive index is 2.00 or less, there is a tendency for the light transmittance to be improved. The silicon oxynitride layer 13 tends to have a higher refractive index as the nitrogen ratio increases.
  • the density of the silicon oxynitride layer 13 is preferably 2.10 g/cm 3 or more. The higher the density of the silicon oxynitride layer 13, the higher the gas barrier properties tend to be. The silicon oxynitride layer 13 tends to have a higher density as the nitrogen ratio increases.
  • the thickness of the silicon oxynitride layer 13 is preferably 5 nm or more, more preferably 10 nm or more. In order to obtain a gas barrier film with superior transparency, the thickness of the silicon oxynitride layer 13 is preferably 150 nm or less, more preferably 100 nm or less. In order to obtain a gas barrier film with superior gas barrier properties and transparency, the thickness of the silicon oxynitride layer 13 is preferably 5 nm or more and 150 nm or less, more preferably 10 nm or more and 100 nm or less.
  • a method for forming the silicon oxynitride layer 13 is not particularly limited, and may be a dry coating method or a wet coating method.
  • a dry process such as a sputtering method, an ion plating method, a vacuum deposition method, or a chemical vapor deposition method (CVD method) is preferable because a film having a high film density and a high gas barrier property can be easily formed.
  • a CVD method is preferable, and a plasma CVD method is more preferable, because a film having small film stress and excellent bending resistance can be easily formed.
  • a film forming roll constitutes one or both electrodes of a pair of opposed electrodes, and a thin film is formed on the film when the film runs on the film forming roll. be.
  • two film-forming rolls constitute a pair of opposing electrodes, a thin film is formed on each of the film-forming rolls, so the film-forming speed can be doubled.
  • the expression "above” when explaining the film forming method by the CVD method has no relation to the direction in the CVD film forming apparatus, and has the same meaning as "in contact with”.
  • Examples of the silicon source (silicon source) for forming the silicon oxynitride layer 13 by the CVD method include silicon hydride (more specifically, silane, disilane, etc.) and silicon halide (more specifically, hexamethyldisilazane, hexamethyldisiloxane, 1,1,3,3-tetramethyldisiloxane, tetramethylsilane, vinyltrimethoxysilane, vinyltrimethylsilane, dimethyl Silicon such as dimethoxysilane, tetramethoxysilane, methyltrimethoxysilane, dimethyldiethoxysilane, trimethylmethoxysilane, tetraethoxysilane, diethyldiethoxysilane, methyldimethoxysilane, methyldiethoxysiloxane, monosilylamine, disilylamine, trisilylamine, etc. compound. Among these, trisilylamine is preferable because it has low
  • Nitrogen sources include nitrogen and ammonia.
  • Oxygen sources include oxygen, carbon monoxide, carbon dioxide, and the like. Nitrogen (nitrogen gas) is preferable as the nitrogen source, and oxygen (oxygen gas) is preferable as the oxygen source, from the viewpoint of reducing hydrogen and carbon taken into the film.
  • a silicon nitride film formed by a CVD method by introducing a nitrogen source together with trisilylamine as a silicon source has a large amount of hydrogen in the film, and a wave number of 2140 cm ⁇ 1 (range of 2120 cm ⁇ 1 to 2150 cm ⁇ 1 ).
  • a silicon oxynitride film formed by a CVD method by introducing nitrogen and oxygen together with trisilylamine as a silicon source shifts the infrared absorption peak to the high wave number side, and is 2160 cm ⁇ 1 to 2280 cm It exhibits an infrared absorption peak in the range of -1 or less, and exhibits transparency superior to that of silicon nitride films.
  • Oxygen has a strong bonding force with silicon, so it is presumed that the introduction of oxygen suppresses the uptake of hydrogen into the film, which is one of the reasons for the improvement in transparency.
  • the composition of the silicon oxynitride layer 13 can be appropriately adjusted.
  • the amount of oxygen to be introduced is set to 0.05 by volume with respect to the amount of nitrogen to be introduced. It is preferably 0.1 times or more and 5 times or less, more preferably 0.03 times or more and 2 times or less, further preferably 0.04 times or more and 1.5 times or less, and 0.04 times or more and 1 0 times or less, or 0.04 times or more and 0.5 times or less.
  • the amount of oxygen introduced is excessively small, the amount of oxygen introduced into the film tends to be small and the light transmittance of the film tends to decrease. If the amount of oxygen introduced is excessively large, the amount of nitrogen incorporated into the film tends to be small, resulting in insufficient gas barrier properties.
  • a gas other than the silicon source, the nitrogen source, and the oxygen source may be used as the introduced gas when forming the film by the CVD method.
  • a carrier gas may be used to vaporize the liquid and introduce it into the chamber (vacuum chamber).
  • a nitrogen source or an oxygen source may be mixed with a carrier gas and introduced into the vacuum chamber, or a discharge gas may be used to stabilize the plasma discharge.
  • Carrier gas and discharge gas include rare gases such as helium, argon, neon, and xenon, and hydrogen. A rare gas is preferable from the viewpoint of reducing the amount of hydrogen taken into the film and increasing the transparency.
  • the substrate temperature (temperature of the surface of the film-forming roll) is set, for example, within the range of -20°C or higher and 500°C or lower.
  • the substrate temperature (film substrate temperature) when forming a gas barrier layer (for example, silicon oxynitride layer 13) on a film substrate is preferably 150° C. or less from the viewpoint of the heat resistance of the film substrate.
  • the temperature is preferably 100° C. or lower, and more preferably 100° C. or lower.
  • the pressure in the film forming chamber (inside the vacuum chamber) is, for example, 0.001 Pa or more and 50 Pa or less.
  • An AC power supply for example, is used as the power supply for plasma generation.
  • the frequency of the power supply in roll-to-roll CVD film formation is generally in the range of 50 kHz to 500 kHz.
  • the applied power in roll-to-roll CVD film formation is generally 0.1 kW or more and 10 kW or less.
  • the density of the silicon oxynitride layer 13 formed by the CVD method is, for example, 2.10 g/cm 3 or more and 2.50 g/cm 3 or less, and 2.15 g/cm 3 or more and 2.45 g/cm 3 or less. It may be 20 g/cm 3 or more and 2.40 g/cm 3 or less, or 2.25 g/cm 3 or more and 2.35 g/cm 3 or less.
  • the material of the low refractive index layer 22 is not particularly limited as long as it has a lower refractive index than the silicon oxynitride layer 13, and may be an organic layer or an inorganic layer.
  • the inorganic material forming the low refractive index layer 22 include silicon oxide and magnesium fluoride.
  • the refractive index difference between the silicon oxynitride layer 13 and the low refractive index layer 22 is preferably 0.10 or more, and may be 0.13 or more or 0.15 or more.
  • the refractive index difference is generally 1.0 or less, and may be 0.5 or less, 0.4 or less, or 0.3 or less.
  • the refractive index of the low refractive index layer 22 may be 1.30 or more and 1.55 or less, or 1.40 or more and 1.52 or less.
  • the low refractive index layer 22 is preferably a silicon oxide layer.
  • the silicon oxide layer may contain a small amount of elements such as hydrogen, carbon, nitrogen, etc. taken in from raw materials during film formation, the transparent film substrate 11 and the external environment. If the silicon oxide layer contains nitrogen, the nitrogen content is preferably lower than that of the silicon oxynitride layer 13 . In the silicon oxide layer, the content of elements other than silicon and oxygen is preferably 5 atomic % or less.
  • a method for forming the low refractive index layer 22 is not particularly limited, and may be a dry coating method or a wet coating method.
  • the silicon oxynitride layer 13 is formed by the CVD method
  • the low refractive index layer 22 is also preferably formed by the CVD method from the viewpoint of productivity.
  • the silicon source and oxygen source for forming the silicon oxide layer (more specifically, the silicon oxide layer as the low refractive index layer 22) by the CVD method, those exemplified above regarding the formation of the silicon oxynitride layer 13 are used. mentioned.
  • the silicon source organosilicon compounds are preferable because they have low toxicity and can suppress the incorporation of nitrogen into the film. They can suppress the incorporation of impurities into the film, and can form films with high transparency and gas barrier properties.
  • Hexamethyldisiloxane is more preferable because When an organosilicon compound such as hexamethyldisiloxane is used as the silicon source, carbon may be incorporated into the film. good. From the viewpoint of reducing the amount of carbon in the film, oxygen gas is preferable as the oxygen source.
  • the amount of oxygen introduced is preferably at least 10 times the amount of hexamethyldisiloxane (gas) introduced in volume ratio. It may be 15 times or more or 20 times or more. From the viewpoint of appropriately maintaining the film formation rate, the amount of oxygen introduced is preferably 200 times or less, and preferably 100 times or less or 50 times or less, the volume ratio of the amount of hexamethyldisiloxane (gas) introduced. good too.
  • a carrier gas or a discharge gas may be introduced in the CVD film formation of the silicon oxide layer.
  • Various conditions such as substrate temperature, pressure, power supply frequency, and applied power may be appropriately adjusted in the same manner as in the deposition of the silicon oxynitride layer 13 .
  • the density of the silicon oxide layer is preferably 1.80 g/cm 3 or more, and more preferably 1.90 g/cm 3 or more. is more preferably 2.00 g/cm 3 or more and 2.40 g/cm 3 or less, 2.05 g/cm 3 or more and 2.35 g/cm 3 or less, or 2.10 g/cm 3 or more and 2.30 g/cm 3 or less There may be.
  • the thickness of the low refractive index layer 22 is preferably 3 nm or more and 250 nm or less, and may be 5 nm or more and 200 nm or less, or 10 nm or more and 150 nm or less. . It is preferable to set the thickness of the low refractive index layer 22 so that the light reflectance of the gas barrier layer is small and the coloring of the reflected light is suppressed. The properties (spectrum) of reflected light can be accurately evaluated by optical model calculations.
  • the gas barrier layer may include layers (other layers) other than the silicon oxynitride layer 13 and the low refractive index layer 22.
  • “other layers” include inorganic thin films made of ceramic materials such as metal or semi-metal oxides, nitrides or oxynitrides. Oxides, nitrides or oxynitrides of Si, Al, In, Sn, Zn, Ti, Nb, Ce or Zr are preferred because they have both low moisture permeability and transparency.
  • the total thickness of the gas barrier layer is preferably 30 nm or more and 1000 nm or less, more preferably 40 nm or more and 500 nm or less.
  • the hard coat layer 31 contains, for example, a binder resin and nanoparticles.
  • a binder resin curable resins such as thermosetting resins, photocurable resins and electron beam curable resins are preferably used.
  • curable resins include polyester resins, acrylic resins, urethane resins, acrylic urethane resins, amide resins, silicone resins, silicate resins, epoxy resins, melamine resins, and oxetane resins. mentioned.
  • One or more curable resins can be used.
  • acrylic resins acrylic urethane resins, and epoxy resins are preferable because they have high hardness and can be photocured, and acrylic resins and acrylic urethane resins. More preferably, one or more selected from the group consisting of
  • the number average primary particle diameter of the nanoparticles contained in the hard coat layer 31 is preferably 15 nm or more, more preferably 20 nm or more, from the viewpoint of enhancing dispersibility in the binder resin. From the viewpoint of forming fine irregularities that contribute to improved adhesion, the number average primary particle diameter of the nanoparticles contained in the hard coat layer 31 is preferably 90 nm or less, more preferably 70 nm or less. It is more preferably 50 nm or less.
  • Inorganic oxides are preferable as materials for nanoparticles.
  • examples of inorganic oxides include metal (or metalloid) oxides such as silica, titanium oxide, aluminum oxide, zirconium oxide, niobium oxide, zinc oxide, tin oxide, cerium oxide, and magnesium oxide.
  • the inorganic oxide may be a composite oxide of multiple (semi)metals.
  • silica is preferable because it has a high adhesion improving effect. That is, silica particles (nanosilica particles) are preferable as the nanoparticles.
  • a functional group such as an acrylic group or an epoxy group may be introduced into the surface of the inorganic oxide particles as nanoparticles for the purpose of enhancing adhesion and affinity with the resin.
  • the amount of the nanoparticles in the hard coat layer 31 is preferably 5 parts by weight or more, 10 parts by weight or more, 20 parts by weight or more, or 30 parts by weight or more with respect to 100 parts by weight of the total amount of the binder resin and the nanoparticles. may be If the amount of the nanoparticles is 5 parts by weight or more, the adhesion to the gas barrier layer formed on the hard coat layer 31 can be improved.
  • the upper limit of the amount of nanoparticles in the hard coat layer 31 is, for example, 90 parts by weight, preferably 80 parts by weight, and preferably 70 parts by weight with respect to 100 parts by weight of the total amount of the binder resin and the nanoparticles. good too.
  • the thickness of the hard coat layer 31 is not particularly limited, but is preferably 0.5 ⁇ m or more, more preferably 1.0 ⁇ m or more, in order to improve the adhesion to the gas barrier layer while achieving high hardness. It is more preferably 2.0 ⁇ m or more, and even more preferably 3.0 ⁇ m or more. On the other hand, the thickness of the hard coat layer 31 is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and even more preferably 12 ⁇ m or less, in order to suppress a decrease in strength due to cohesive failure.
  • the hard coat layer 31 is formed by applying the hard coat composition onto the transparent film substrate 11, and optionally removing the solvent and curing the resin.
  • the hard coat composition contains, for example, the above binder resin and nanoparticles, and optionally contains a solvent capable of dissolving or dispersing these components.
  • the resin component in the hard coat composition is a curable resin
  • the hard coat composition preferably contains an appropriate polymerization initiator.
  • the resin component in the hard coat composition is a photocurable resin
  • the hard coat composition preferably contains a photopolymerization initiator.
  • the hard coat composition includes particles (microparticles) having a number average primary particle diameter of 1.0 ⁇ m or more, leveling agents, viscosity modifiers (thixotropic agents, thickeners, etc.), antistatic agents, blocking agents, Additives such as inhibitors, dispersants, dispersion stabilizers, antioxidants, UV absorbers, antifoaming agents, surfactants and lubricants may be included.
  • any suitable method such as bar coating, roll coating, gravure coating, rod coating, slot orifice coating, curtain coating, fountain coating, comma coating, etc. can be used. can be adopted.
  • Adhesive layer 51 As a constituent material of the adhesive layer 51, an adhesive having a high visible light transmittance is preferably used.
  • adhesives constituting the adhesive layer 51 include acrylic polymers, silicone polymers, polyesters, polyurethanes, polyamides, polyvinyl ethers, vinyl acetate-vinyl chloride copolymers, modified polyolefins, epoxy resins, and fluorine resins. , natural rubber, synthetic rubber or the like as a base polymer can be appropriately selected and used.
  • the thickness of the adhesive layer 51 is preferably 5 ⁇ m or more and 100 ⁇ m or less.
  • the refractive index of the adhesive layer 51 is, for example, 1.4 or more and 1.5 or less.
  • the water vapor transmission rate of the gas barrier film is preferably 3.0 ⁇ 10 ⁇ 2 g/m 2 ⁇ day or less, more preferably 2.0 ⁇ 10 ⁇ 2 g/m 2 ⁇ day or less. It is more preferably 0 ⁇ 10 ⁇ 2 g/m 2 ⁇ day or less. From the viewpoint of suppressing deterioration of the protection object such as the organic EL element, the lower the water vapor transmission rate, the better. Although the lower limit of the water vapor transmission rate of the gas barrier film is not particularly limited, it is generally 1.0 ⁇ 10 ⁇ 5 g/m 2 ⁇ day. Water vapor transmission rate (WVTR) is measured according to the differential pressure method (Pressure Sensor Method) described in ISO 15106-5 under conditions of a temperature of 40° C. and a relative humidity of 90%.
  • WVTR Water vapor transmission rate
  • the light transmittance of the gas barrier film is preferably 75% or higher, more preferably 80% or higher.
  • Light transmittance is the Y value of the CIE tristimulus values specified in JlS Z8781-3:2016.
  • a method for manufacturing a gas barrier film according to the second embodiment of the present invention is a suitable method for manufacturing the gas barrier film according to the first embodiment described above. Therefore, descriptions of components that overlap with those of the above-described first embodiment may be omitted.
  • a silicon source for example, trisilylamine, etc.
  • a nitrogen source for example, nitrogen
  • an oxygen source for example, oxygen
  • FIG. 6 is a configuration diagram showing an example of a film forming apparatus used in the method for producing a gas barrier film according to the second embodiment.
  • the film forming apparatus shown in FIG. 6 includes a delivery roll 71, transport rolls 72, 73, 74 and 75, film forming rolls 76 and 77 as a pair of opposing electrodes, a winding roll 78, and a film forming gas. and a gas supply port 79 for A plurality of gas supply ports 79 may be provided.
  • a magnetic field generator (not shown) is installed inside each of the film forming rolls 76 and 77 .
  • at least the film forming rolls 76 and 77, the gas supply port 79, and the power source for plasma generation are arranged in a vacuum chamber (not shown).
  • the vacuum chamber is connected to a vacuum pump (not shown), and the pressure in the vacuum chamber can be appropriately adjusted by the vacuum pump.
  • the film forming rolls 76 and 77 are each provided with a power source for plasma generation so that the pair of film forming rolls (film forming rolls 76 and 77) can function as a pair of opposing electrodes. (not shown). Therefore, in the film forming apparatus shown in FIG. 6, by supplying power from the plasma generation power supply, it is possible to discharge the space between the film forming rolls 76 and 77, thereby forming a film. Plasma can be generated in the space between the roll 76 and the film forming roll 77 .
  • the central axes of the pair of film forming rolls (film forming rolls 76 and 77) should be substantially parallel on the same plane. are preferably arranged in the same direction.
  • the gas barrier film according to the first embodiment can be easily formed by adopting various conditions in the plasma CVD method illustrated in the explanation of the gas barrier film according to the first embodiment.
  • a pair of deposition gases (more specifically, a silicon source, an oxygen source, a nitrogen source, etc.) is supplied into the vacuum chamber.
  • the film-forming gas is decomposed by the plasma, and the film-forming region near the film-forming roll 76 and the film-forming region near the film-forming roll 77 are separated.
  • a silicon oxynitride layer 13 (see FIG. 1) is formed on a transparent film substrate 11 (see FIG. 1).
  • the transparent film substrate 11 is conveyed by the delivery roll 71, the conveying roll 72, and the like, and the transparent film substrate 11 is formed by a roll-to-roll continuous film formation process.
  • a silicon oxynitride layer 13 is formed thereon.
  • film deposition apparatus conditions At least one of the embracing angles (hereinafter collectively referred to as “film deposition apparatus conditions”) is changed, the film formation region near the film formation roll 76 and the film formation roll 77 near the film formation roll 77 change.
  • the composition ratio O/N (the number of oxygen atoms/the number of nitrogen atoms) of the silicon oxynitride layer 13 (see FIG. 1) can be changed in the thickness direction by changing at least one of the film forming apparatus conditions. can be done.
  • the "embracing angle” refers to the range of angles in which the film contacts the outer peripheral surface of the film forming roll in the circumferential direction, expressed as the central angle of the film forming roll.
  • the height H of the gas supply port 79 has a high correlation with 1/10-O/N, 1/2-O/N and 9/10-O/N.
  • the gas supply port 79 The height H of is preferably 100 mm or more and 200 mm or less, more preferably 150 mm or more and 180 mm or less.
  • the height H of each of the plurality of gas supply ports 79 may be the same or different.
  • FIG. 7 is a graph showing an example of composition analysis results in the thickness direction of a silicon oxynitride layer formed by the method for producing a gas barrier film according to the second embodiment.
  • the solid line shows the relationship between the etching time and the oxygen content in the thickness direction of the silicon oxynitride layer when composition analysis was performed while etching the silicon oxynitride layer under constant conditions by XPS.
  • the dashed line indicates the relationship between the etching time and the nitrogen content in the thickness direction of the silicon oxynitride layer when composition analysis was performed while etching the silicon oxynitride layer under constant conditions by XPS.
  • FIG. 7 is a graph showing an example of composition analysis results in the thickness direction of a silicon oxynitride layer formed by the method for producing a gas barrier film according to the second embodiment.
  • the solid line shows the relationship between the etching time and the oxygen content in the thickness direction of the silicon oxynitride layer when composition analysis was performed while etching the
  • section A which has a relatively long etching time, is formed in a region having a relatively long distance from the gas supply port 79 in the film forming region near the film forming roll 76 in the film forming apparatus shown in FIG. It is a partition that has been
  • section C which has a relatively short etching time, is a region with a relatively long distance from the gas supply port 79 among the film forming regions near the film forming roll 77 in the film forming apparatus shown in FIG. It is a section where a film is formed.
  • FIG. 7 which has a relatively long etching time
  • section B sandwiched between section A and section C is one of the film forming areas in the vicinity of the film forming roll 76 or the film forming area in the vicinity of the film forming roll 77 in the film forming apparatus shown in FIG. , are regions where the film is formed in a region relatively short from the gas supply port 79 .
  • the etching time for section A includes the etching time for measuring 9/10-O/N.
  • the etch time for the B section includes the etch time when measuring 1/2-O/N.
  • the etch time for the C section includes the etch time when measuring 1/10-O/N.
  • the distribution of the introduced film forming gas changes in each of the film forming region near the film forming roll 76 and the film forming region near the film forming roll 77. Since they change along the circumferential direction of the film-forming roll, the nitrogen content and oxygen content in the silicon oxynitride layer change (in the thickness direction) with the etching time as shown in FIG. 7, for example. Therefore, by changing at least one of the film forming apparatus conditions, the composition ratio O/N can be adjusted in the thickness direction of the silicon oxynitride layer. The composition ratio O/N can also be adjusted by changing the introduction amount ratio (flow rate ratio) of the oxygen source and the nitrogen source.
  • a polarizing plate with a gas barrier layer according to the third embodiment includes the gas barrier film according to the first embodiment and a polarizer.
  • FIG. 8 is a cross-sectional view showing an example of a polarizing plate with a gas barrier layer according to the third embodiment.
  • a polarizing plate 100 with a gas barrier layer shown in FIG. 8 has the gas barrier film 50 described above and a polarizing plate 101 .
  • the polarizing plate 101 is arranged on the main surface 51a of the pressure-sensitive adhesive layer 51 opposite to the silicon oxynitride layer 13 side. That is, the polarizing plate 101 and the silicon oxynitride layer 13 are bonded together with the adhesive layer 51 interposed therebetween.
  • 8 has a gas barrier film 50 (gas barrier film 40), the gas barrier film of the polarizing plate with a gas barrier layer according to the third embodiment is not limited to the gas barrier film 50.
  • it may be the gas barrier film 10, the gas barrier film 20, or the gas barrier film 30.
  • the polarizing plate 101 includes a polarizer (not shown), and generally transparent protective films (not shown) as polarizer protective films are laminated on both main surfaces of the polarizer.
  • a transparent protective film may not be provided on one principal surface or both principal surfaces of the polarizer.
  • a polarizer for example, a hydrophilic polymer film such as a polyvinyl alcohol film is uniaxially stretched after adsorbing a dichroic substance such as iodine or a dichroic dye.
  • a transparent resin film composed of a cellulose resin, a cyclic polyolefin resin, an acrylic resin, a phenylmaleimide resin, a polycarbonate resin, or the like is preferably used.
  • a gas barrier film may be used as the transparent protective film.
  • the polarizing plate 101 may include an optical functional film laminated on one or both main surfaces of a polarizer via an appropriate adhesive layer or pressure-sensitive adhesive layer as necessary.
  • the optical functional film include retardation plates, viewing angle widening films, viewing angle limiting (peep prevention) films, brightness improving films, and the like.
  • the gas barrier layer-attached polarizing plate according to the third embodiment has the gas barrier film according to the first embodiment, and therefore has excellent transparency and gas barrier properties.
  • An image display device includes the gas barrier film according to the first embodiment or the polarizing plate with a gas barrier layer according to the third embodiment, and an image display cell.
  • FIG. 9 is a cross-sectional view showing an example of an image display device according to the fourth embodiment.
  • An image display device 200 shown in FIG. 9 includes a gas barrier layer-attached polarizing plate 100 having a gas barrier film 50 and an image display cell 202 .
  • the image display cell 202 includes a substrate 203 and display elements 204 provided on the substrate 203 .
  • the gas barrier layer 41 and the display element 204 are bonded together with the adhesive layer 201 interposed therebetween.
  • the image display device 200 shown in FIG. 9 has the gas barrier film 50 (gas barrier film 40)
  • the gas barrier film of the image display device according to the fourth embodiment is not limited to the gas barrier film 50.
  • the gas barrier film 10 it may be the gas barrier film 20 or the gas barrier film 30;
  • the same adhesives as those exemplified as the adhesive constituting the adhesive layer 51 described above can be used.
  • the adhesive that forms the adhesive layer 201 and the adhesive that forms the adhesive layer 51 may be of the same type or of different types.
  • the preferable range of the thickness of the adhesive layer 201 is, for example, the same as the preferable range of the thickness of the adhesive layer 51 described above.
  • the thickness of the adhesive layer 201 and the thickness of the adhesive layer 51 may be the same or different.
  • a glass substrate or a plastic substrate is used as the substrate 203 .
  • the substrate 203 does not have to be transparent, and a highly heat-resistant film such as a polyimide film may be used as the substrate 203 .
  • Examples of the display element 204 include an organic EL element, a liquid crystal element, an electrophoretic display element (electronic paper), and the like.
  • a touch panel sensor (not shown) may be arranged on the viewing side of the image display cell 202 .
  • the image display cell 202 is, for example, top emission type.
  • the organic EL element includes, for example, a metal electrode (not shown), an organic light emitting layer (not shown), and a transparent electrode (not shown) in this order from the substrate 203 side.
  • the organic light-emitting layer may include an electron-transporting layer, a hole-transporting layer, etc. in addition to the organic layer that itself functions as a light-emitting layer.
  • the transparent electrode is a metal oxide layer or a metal thin film and transmits light from the organic light emitting layer.
  • a back sheet (not shown) may be provided on the back side of the substrate 203 for the purpose of protecting and reinforcing the substrate 203 .
  • the metal electrode of the organic EL element is light reflective. Therefore, when external light enters the inside of the image display cell 202, the light is reflected by the metal electrodes, and the reflected light is visually recognized as a mirror surface from the outside.
  • a circularly polarizing plate as the polarizing plate 101 on the viewing side of the image display cell 202, the re-emission of light reflected by the metal electrode to the outside is prevented, and the visibility and design of the screen of the image display device 200 are improved. can improve sexuality.
  • the circularly polarizing plate has, for example, a retardation film on the main surface of the polarizer on the image display cell 202 side.
  • the transparent protective film arranged adjacent to the polarizer may be a retardation film.
  • the transparent film substrate 11 of the gas barrier film 50 may be a retardation film. Lamination of the polarizer and the retardation film when the retardation film has a retardation of ⁇ / 4 and the angle formed by the slow axis direction of the retardation film and the absorption axis direction of the polarizer is 45 °
  • the body functions as a circular polarizer for suppressing re-emission of reflected light from the metal electrode.
  • the retardation film that constitutes the circularly polarizing plate may be a laminate of two or more layers of films.
  • a broadband circularly polarizing plate that functions as a circularly polarizing plate over a wide band of visible light is obtained. can get.
  • the image display cell 202 may be of a bottom emission type in which a transparent electrode, an organic light emitting layer and a metal electrode are laminated in this order on a substrate.
  • a transparent substrate is used, and the transparent substrate is arranged on the viewing side.
  • a gas barrier film may be used as the transparent substrate.
  • the image display device includes the gas barrier film according to the first embodiment, it is possible to suppress deterioration of the display element caused by gas (for example, water vapor).
  • gas for example, water vapor
  • a solar cell according to the fifth embodiment includes the gas barrier film according to the first embodiment and a solar cell.
  • the gas barrier film according to the first embodiment and the solar cell are bonded together with a transparent adhesive or a transparent adhesive.
  • the solar cell according to the fifth embodiment includes the gas barrier film according to the first embodiment, deterioration of the solar cell due to gas (for example, water vapor) can be suppressed.
  • gas for example, water vapor
  • Example 1 A 40 ⁇ m-thick cyclic polyolefin film (“Zeonor (registered trademark) film ZF-14” manufactured by Nippon Zeon Co., Ltd.) as a transparent film substrate was set in a film forming apparatus, and the pressure in the vacuum chamber was reduced to 1 ⁇ 10 ⁇ 3 Pa. . Next, while the film was running, a silicon oxynitride layer (gas barrier layer) having a thickness of 50 nm was formed by CVD at a substrate temperature of 12° C. to obtain a gas barrier film of Example 1.
  • the frequency of the power source for plasma generation was set to 80 kHz, and plasma was generated by discharging under the conditions of applied power of 1.0 kW, trisilylamine (TSA): 30 sccm, Under flow conditions of nitrogen: 575 sccm and oxygen: 25 sccm, a gas was introduced between the film-forming rolls (between the electrodes) in the vacuum chamber to form a film at a pressure of 1.0 Pa. Note that TSA was vaporized by heating and introduced into the vacuum chamber.
  • Example 2 A gas barrier film of Example 2 was produced in the same manner as in Example 1, except that the nitrogen flow conditions were set to 550 sccm and the oxygen flow conditions were set to 50 sccm.
  • Example 3 A gas barrier film of Example 3 was produced in the same manner as in Example 1, except that the nitrogen flow conditions were set to 525 sccm and the oxygen flow conditions were set to 75 sccm.
  • Example 4 A gas barrier film of Example 4 was produced in the same manner as in Example 1 except that the nitrogen flow conditions were set to 500 sccm and the oxygen flow conditions were set to 100 sccm.
  • Comparative Example 1 A gas barrier film of Comparative Example 1 was produced in the same manner as in Example 1, except that the nitrogen flow rate was set to 600 sccm and oxygen was not introduced.
  • Comparative Example 2 A gas barrier film of Comparative Example 2 was produced in the same manner as in Example 1, except that the oxygen flow rate was set to 600 sccm and nitrogen was not introduced.
  • composition analysis of Silicon Oxynitride Layer Using an X-ray photoelectron spectrometer equipped with an Ar ion gun ("Quantera SXM" manufactured by ULVAC-Phi, Inc.), the silicon oxynitride layer is exposed to the silicon oxynitride layer from the main surface opposite to the transparent film substrate side under the following conditions. While etching with , composition analysis in the thickness direction of the silicon oxynitride layer was performed by XPS.
  • the light transmittance (Y value) of the gas barrier film was measured with a spectrophotometer ("U4100" manufactured by Hitachi High-Tech Science). When the light transmittance was 75% or more, it was evaluated as “excellent in transparency”. On the other hand, when the light transmittance was less than 75%, it was evaluated as "not excellent in transparency”.
  • the WVTR was 3.0 ⁇ 10 ⁇ 2 g/m 2 ⁇ day or less. Therefore, the gas barrier films of Examples 1 to 4 were excellent in gas barrier properties. In Examples 1 to 4, the light transmittance was 75% or more. Therefore, the gas barrier films of Examples 1 to 4 were excellent in transparency.
  • Comparative Example 1 As shown in Table 1, in Comparative Example 1, the light transmittance was less than 75%. Therefore, the gas barrier film of Comparative Example 1 was not excellent in transparency. In Comparative Example 2, WVTR exceeded 3.0 ⁇ 10 ⁇ 2 g/m 2 ⁇ day. Therefore, the gas barrier film of Comparative Example 2 was not excellent in gas barrier properties.
  • the present invention can provide a gas barrier film with excellent transparency and gas barrier properties.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Un film barrière aux gaz (10) selon la présente invention comprend un matériau de base de film transparent (11) et une couche barrière aux gaz (12). La couche barrière aux gaz (12) présente une couche d'oxynitrure de silicium (13). Si le rapport de composition O/N entre l'oxygène et l'azote dans la direction de l'épaisseur de la couche d'oxynitrure de silicium (13) est mesuré, le rapport de composition O/N lorsque 1/10 du temps total de gravure s'est écoulé est supérieur à 1,0, le rapport de composition O/N lorsque 1/2 du temps total de gravure s'est écoulé est inférieur à 2,0, et le rapport de composition O/N lorsque 9/10 du temps total de gravure se sont écoulés est supérieur à 1,0. Le rapport de composition O/N lorsque 1/10 du temps de gravure total s'est écoulé et le rapport de composition O/N lorsque 9/10 du temps de gravure total se sont écoulés sont supérieurs au rapport de composition O/N lorsque 1/2 du temps de gravure total s'est écoulé.
PCT/JP2022/035427 2021-09-30 2022-09-22 Film barrière aux gaz, procédé de production de ce dernier, plaque polarisante avec couche barrière aux gaz, dispositif d'affichage d'image et cellule solaire WO2023054178A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021160934A JP2023050694A (ja) 2021-09-30 2021-09-30 ガスバリアフィルム及びその製造方法、並びにガスバリア層付き偏光板、画像表示装置及び太陽電池
JP2021-160934 2021-09-30

Publications (1)

Publication Number Publication Date
WO2023054178A1 true WO2023054178A1 (fr) 2023-04-06

Family

ID=85782579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/035427 WO2023054178A1 (fr) 2021-09-30 2022-09-22 Film barrière aux gaz, procédé de production de ce dernier, plaque polarisante avec couche barrière aux gaz, dispositif d'affichage d'image et cellule solaire

Country Status (3)

Country Link
JP (1) JP2023050694A (fr)
TW (1) TW202330254A (fr)
WO (1) WO2023054178A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007237702A (ja) * 2006-03-13 2007-09-20 Fujifilm Corp ガスバリアフィルムおよびこれを用いた有機デバイス
JP2009196155A (ja) * 2008-02-20 2009-09-03 Dainippon Printing Co Ltd ガスバリアフィルム、ガスバリア膜の作製方法及び作製装置
JP2011156752A (ja) * 2010-02-01 2011-08-18 Konica Minolta Holdings Inc ガスバリア性フィルム、ガスバリア性フィルムの製造方法、有機電子デバイス
JP2011183773A (ja) * 2010-03-11 2011-09-22 Konica Minolta Holdings Inc ガスバリア性フィルム、その製造方法及びそのガスバリア性フィルムを用いた有機光電変換素子
JP2012016854A (ja) * 2010-07-07 2012-01-26 Konica Minolta Holdings Inc ガスバリア性フィルム、及び有機光電変換素子、有機エレクトロルミネッセンス素子
JP2012087326A (ja) * 2010-10-15 2012-05-10 Lintec Corp 透明導電性フィルム、その製造方法、電子デバイス用部材及び電子デバイス
WO2015098671A1 (fr) * 2013-12-26 2015-07-02 住友化学株式会社 Film stratifié et dispositif électronique flexible
JP2017185789A (ja) * 2016-03-31 2017-10-12 住友化学株式会社 積層フィルム及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007237702A (ja) * 2006-03-13 2007-09-20 Fujifilm Corp ガスバリアフィルムおよびこれを用いた有機デバイス
JP2009196155A (ja) * 2008-02-20 2009-09-03 Dainippon Printing Co Ltd ガスバリアフィルム、ガスバリア膜の作製方法及び作製装置
JP2011156752A (ja) * 2010-02-01 2011-08-18 Konica Minolta Holdings Inc ガスバリア性フィルム、ガスバリア性フィルムの製造方法、有機電子デバイス
JP2011183773A (ja) * 2010-03-11 2011-09-22 Konica Minolta Holdings Inc ガスバリア性フィルム、その製造方法及びそのガスバリア性フィルムを用いた有機光電変換素子
JP2012016854A (ja) * 2010-07-07 2012-01-26 Konica Minolta Holdings Inc ガスバリア性フィルム、及び有機光電変換素子、有機エレクトロルミネッセンス素子
JP2012087326A (ja) * 2010-10-15 2012-05-10 Lintec Corp 透明導電性フィルム、その製造方法、電子デバイス用部材及び電子デバイス
WO2015098671A1 (fr) * 2013-12-26 2015-07-02 住友化学株式会社 Film stratifié et dispositif électronique flexible
JP2017185789A (ja) * 2016-03-31 2017-10-12 住友化学株式会社 積層フィルム及びその製造方法

Also Published As

Publication number Publication date
JP2023050694A (ja) 2023-04-11
TW202330254A (zh) 2023-08-01

Similar Documents

Publication Publication Date Title
CN107209299B (zh) 波长转换部件及具备该波长转换部件的背光单元、液晶显示装置、波长转换部件的制造方法
JP6333749B2 (ja) 波長変換部材及びそれを備えたバックライトユニット、液晶表示装置、波長変換部材の製造方法
JP7304129B2 (ja) 反射防止フィルムおよびその製造方法、ならびに反射防止層付き偏光板
WO2022172957A1 (fr) Film formant barrière aux gaz, son procédé de production et plaque de polarisation et dispositif d'affichage comprenant une couche formant barrière aux gaz
WO2019107036A1 (fr) Film de revêtement dur, corps optique en couches et dispositif d'affichage d'image
WO2022014569A1 (fr) Film optique avec couche antisalissure
WO2023054178A1 (fr) Film barrière aux gaz, procédé de production de ce dernier, plaque polarisante avec couche barrière aux gaz, dispositif d'affichage d'image et cellule solaire
WO2023054176A1 (fr) Film formant barrière contre les gaz, son procédé de production, plaque de polarisation avec couche formant barrière contre les gaz et dispositif d'affichage d'image
WO2023054175A1 (fr) Film barrière aux gaz et son procédé de production, et plaque polarisante pourvue d'une couche barrière aux gaz et appareil d'affichage d'images
WO2023153307A1 (fr) Film barrière aux gaz, son procédé de production, plaque de polarisation avec couche barrière aux gaz et dispositif d'affichage d'image
WO2023054177A1 (fr) Film barrière aux gaz, son procédé de production, plaque polarisante équipée d'une couche barrière aux gaz et dispositif d'affichage d'images
WO2023153010A1 (fr) Film barrière aux gaz, procédé associé de production, plaque de polarisation à couche barrière aux gaz et dispositif d'affichage d'images
WO2022209829A1 (fr) Corps multicouche optique et dispositif d'affichage d'image
JP6983040B2 (ja) ガスバリア性フィルム及びそれを含むデバイス
WO2022172956A1 (fr) Film barrière contre les gaz, lame polarisante équipée d'une couche barrière contre les gaz et dispositif d'écran
JP4332310B2 (ja) 酸化チタン層の製造方法、この方法により製造された酸化チタン層、及び酸化チタンを用いた反射防止フィルム
JP2004223769A (ja) 透明積層フィルム、反射防止フィルム及びそれを用いた偏光板、液晶表示装置
WO2022014574A1 (fr) Stratifié
WO2022080137A1 (fr) Plaque de polarisation pourvue de couche antireflet et dispositif d'affichage d'image
JP2005224948A (ja) 透明反射基材、カラーフィルタ及び液晶表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22876045

Country of ref document: EP

Kind code of ref document: A1