Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
  • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
  • C08L71/12—Polyphenylene oxides
  • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
  • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
  • C08G65/48—Polymers modified by chemical after-treatment
  • C08G65/485—Polyphenylene oxides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/12—Unsaturated polyimide precursors
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/51—Phosphorus bound to oxygen
  • C08K5/52—Phosphorus bound to oxygen only
  • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
  • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
  • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
  • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
  • C08L71/12—Polyphenylene oxides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
  • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Definitions

• the content of the filler (E) is 10 to 300 parts by mass with respect to 100 parts by mass of the resin solid content,
• Ar represents an aromatic hydrocarbon linking group. * represents a bonding position.
• R M1 , R M2 , R M3 , and R M4 each independently represent a hydrogen atom or an organic group.
• R M5 and R M6 each independently represent a hydrogen atom or an alkyl group.
• the content of the thermoplastic elastomer (A) in the resin composition of the present embodiment is preferably 1 part by mass or more, more preferably 2 parts by mass or more, with respect to 100 parts by mass of the resin solid content. It is more preferably at least 8 parts by mass, even more preferably at least 12 parts by mass, even more preferably at least 16 parts by mass, further preferably 20 parts by mass. parts or more, particularly preferably 25 parts by mass or more.
• the content is at least the above lower limit, low dielectric loss tangent property, crack resistance, low thermal expansion property, especially low thermal expansion property tend to be further improved.
• the upper limit of the content of the thermoplastic elastomer (A) is preferably 40 parts by mass or less, more preferably 35 parts by mass or less, with respect to 100 parts by mass of the resin solid content. It may be 30 parts by mass or less, 25 parts by mass or less, 21 parts by mass or less, or 18 parts by mass or less depending on the application. When the content is equal to or less than the upper limit, the crack resistance tends to be further improved.
• the resin composition of the present embodiment may contain only one type of thermoplastic elastomer (A), or may contain two or more types. When two or more types are included, the total amount is preferably within the above range.
• the compatible thermosetting resin (B) is preferably a thermosetting resin containing an aromatic ring and a vinyl group. By using such a resin, it tends to be compatible with the styrene monomer units contained in the thermoplastic elastomer (A), and the compatibility tends to be further improved.
• the compatible thermosetting resin (B) has a number average molecular weight Mn of preferably 300 or more, more preferably 500 or more, even more preferably 1,000 or more. , 500 or more.
• the upper limit is preferably 130,000 or less, more preferably 120,000 or less, even more preferably 110,000 or less, even more preferably 100,000 or less. When two or more thermosetting resins (B) are included, the number average molecular weight of the mixture is preferably within the above range.
• the structure of the chain end of the polymer having the structural unit represented by the formula (V) is not particularly limited, but the group derived from the divinyl aromatic compound may have the structure of the following formula (E1). mentioned.
• the excellent low dielectric properties of the polymer having the structural unit represented by the formula (V), especially Df and dielectric properties after moisture absorption, are effectively applied to the cured product of the resin composition.
• the upper limit of the weight average molecular weight Mw is preferably 160,000 or less, more preferably 150,000 or less, even more preferably 140,000 or less, and even more preferably 130,000 or less. .
• the thickness is equal to or less than the above upper limit, there is a tendency that poor embedding is less likely to occur when the prepreg or resin sheet is laminated on the circuit board.
• the vinyl group equivalent weight of the polymer having the structural unit represented by formula (V) is 200 g/eq. 230 g/eq. more preferably 250 g/eq. It is more preferable that it is above. Moreover, the equivalent weight of the vinyl group is 1200 g/eq. It is preferably less than or equal to 1000 g/eq. It is more preferably less than or equal to 800 g/eq. 600 g/eq. 400 g/eq. Below, 300g/eq. It may be below. When the amount is at least the above lower limit, the storage stability of the resin composition tends to improve, and the fluidity of the resin composition tends to improve.
• the upper limit of the content of the polymer having the structural unit represented by formula (V) is preferably 45 parts by mass or less when the resin solid content in the resin composition is 100 parts by mass. It is more preferably 40 parts by mass or less, and even more preferably 35 parts by mass or less. Moreover, the metal foil peel strength of the obtained hardened
• the polymer having the structural unit represented by formula (V) may be contained in the resin composition either singly or in combination of two or more. When two or more types are included, the total amount is preferably within the above range.
• the modified polyphenylene ether compound (g) in the present embodiment is preferably a compound represented by formula (OP-2).
• -(O-X-O)- is the formula (OP-3):
• R 4 , R 5 , R 6 , R 10 and R 11 may be the same or different and are an alkyl group having 6 or less carbon atoms or a phenyl group.
• a polyphenylene ether compound having a carbon-carbon unsaturated double bond at its end may be produced by a known method, or a commercially available product may be used.
• Commercially available products include, for example, "SA9000” manufactured by SABIC Innovative Plastics Co., Ltd. as a modified polyphenylene ether compound having a methacryl group at the end.
• modified polyphenylene ether compounds having a terminal vinylbenzyl group include "OPE-2St1200” and "OPE-2st2200” manufactured by Mitsubishi Gas Chemical.
• Such other resin (C) is not necessarily an essential component for achieving the effect of the present invention, but by blending these components, various physical properties can be imparted to the resin composition or cured product. , the dielectric properties, moisture absorption and heat resistance of the resin composition or cured product can be further improved.
• a cyanate ester compound having a naphthol aralkyl skeleton, a naphthylene ether skeleton, a xylene skeleton, a trisphenolmethane skeleton, or an adamantane skeleton has a relatively large number of functional group equivalents, and the number of unreacted cyanate ester groups is small. Therefore, a cured product of a resin composition using these tends to be even more excellent in low water absorption. Also, mainly due to having an aromatic skeleton or adamantane skeleton, the plating adhesion tends to be further improved.
• R 1 M7 and R 1 M8 are each independently an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group.
• mx is 1 or 2, preferably 2;
• lx is 0 or 1, preferably 1;
• R M9 and R M10 each independently represent a hydrogen atom or an alkyl group, more preferably an alkyl group.
• the compound represented by formula (M1-1) is preferably a compound represented by formula (M1-2) below.
• R M21 , R M22 , R M23 and R M24 each independently represent a hydrogen atom or an organic group
• R M25 and R M26 each independently represent a hydrogen atom or an alkyl
• R M27 , R M28 , R M29 and R M30 each independently represent a hydrogen atom or an organic group
• R M31 and R M32 each independently represent a hydrogen atom or an alkyl group
• R M33 , RM34 , RM35 and RM36 each independently represent a hydrogen atom or an organic group
• RM37 , RM38 and RM39 each independently represent a hydrogen atom or an alkyl group
• nx is represents an integer of 1 or more and 20 or less.
• the resin composition in the present embodiment may contain only one type of epoxy compound, or may contain two or more types. When two or more types are included, the total amount is preferably within the above range. In addition, the resin composition in the present embodiment can also be configured so as not to substantially contain an epoxy compound.
• the resin composition of the present embodiment preferably contains a filler (E).
• a filler (E) By including the filler (E), physical properties such as dielectric properties (low dielectric constant, low dielectric loss tangent, etc.), flame resistance, and low thermal expansion of the resin composition and its cured product can be further improved.
• the filler (E) used in the present embodiment preferably has excellent low dielectric properties.
• the filler (E) used in the present embodiment preferably has a dielectric constant (Dk) of 8.0 or less, more preferably 6.0 or less, measured according to the cavity resonator perturbation method. It is more preferably 4.0 or less.
• the lower limit value of the dielectric constant is practically 2.0 or more, for example.
• the compound (F1) used in this embodiment is also preferably composed only of atoms selected from carbon atoms, hydrogen atoms, oxygen atoms and silicon atoms, and from carbon atoms, hydrogen atoms and oxygen atoms More preferably, it is composed only of selected atoms.
• the compound (F1) used in this embodiment may or may not have a polar group.
• the compound (F1) used in this embodiment preferably does not have a polar group.
• Polar groups are exemplified by amino groups, carboxyl groups, hydroxy groups and nitro groups.
• Substantially free means that the content of the active ester compound is less than 1 part by mass, preferably less than 0.1 part by mass, with respect to 100 parts by mass of the resin solid content in the resin composition. More preferably, it is less than 0.01 part by mass.
• the metal foil-clad laminate of the present embodiment preferably has a low coefficient of thermal expansion (CTE) measured using a laminate from which the metal foil has been removed by etching.
• CTE is preferably 10.0 ppm/°C or less.
• 0 is ideal, but 0.001 ppm/°C or more is practical.
• the measurement of CTE follows description of the Example mentioned later.
• Examples of the support used here include polyethylene film, polypropylene film, polycarbonate film, polyethylene terephthalate film, ethylenetetrafluoroethylene copolymer film, and a release film obtained by applying a release agent to the surface of these films, Organic film substrates such as polyimide films, conductor foils such as copper foils and aluminum foils, glass plates, SUS (Steel Use Stainless) plates, FRP (Fiber-Reinforced Plastics) and other plate-like substrates. It is not particularly limited.
• the physical properties (peel strength, dielectric loss tangent, post-curing appearance, coefficient of thermal expansion (CTE)) of the resulting copper-clad laminate were evaluated according to the methods described later.
• a test piece (30 mm ⁇ 150 mm ⁇ 0.8 mm) was prepared by removing the copper foil from the obtained copper foil clad laminate by etching, and the dielectric loss tangent (Df) at 10 GHz was measured using a perturbation method cavity resonator. bottom. The measurement temperature was 23°C.
• the perturbation method cavity resonator used was Agilent 8722ES, a product of Agilent Technologies. It was evaluated as follows. A: Less than 0.0025 B: 0.0025 or more
• Comparative example 8 In Example 3, the modified polyphenylene ether compound was not blended, and the amount of the maleimide compound (MIR-3000-70MT manufactured by Nippon Kayaku Co., Ltd., corresponding to the compound represented by formula (M3)) was changed to 55 parts by mass. changed and others did as well.
• MIR-3000-70MT manufactured by Nippon Kayaku Co., Ltd. corresponding to the compound represented by formula (M3)

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• Reinforced Plastic Materials (AREA)

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• 2022
  • 2022-09-13 KR KR1020247012995A patent/KR20240065288A/ko active Pending
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