WO2023044846A1 - 封装结构、封装结构的制造方法及电子设备 - Google Patents

封装结构、封装结构的制造方法及电子设备 Download PDF

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Publication number
WO2023044846A1
WO2023044846A1 PCT/CN2021/120614 CN2021120614W WO2023044846A1 WO 2023044846 A1 WO2023044846 A1 WO 2023044846A1 CN 2021120614 W CN2021120614 W CN 2021120614W WO 2023044846 A1 WO2023044846 A1 WO 2023044846A1
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WIPO (PCT)
Prior art keywords
lead
substrate
plastic package
plastic
package
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PCT/CN2021/120614
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English (en)
French (fr)
Inventor
童亮
刘立筠
张珊
刘国文
徐斌
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180102139.5A priority Critical patent/CN117981080A/zh
Priority to PCT/CN2021/120614 priority patent/WO2023044846A1/zh
Publication of WO2023044846A1 publication Critical patent/WO2023044846A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

Definitions

  • the embodiments of the present application relate to the technical field of packaging, and in particular, to a packaging structure, a method for manufacturing the packaging structure, and an electronic device.
  • the length and width of the power module are limited under the premise that the PCB board-level size remains unchanged. Therefore, in order to reduce the length and width of the power module, it is generally chosen to integrate different devices into the package to form a package. In the package, due to the height of the device, this will cause the pads on the substrate in the package to be different from the A height difference is formed between the pads on the device.
  • the most commonly used PIN (pin) method to solve the problem of different pad height differences is to arrange solder balls on the substrate so that the solder balls are at the same height as the devices that need to be connected with peripheral circuits.
  • solder balls are spherical in a molten state, which has certain restrictions on the height of the PIN, and is not suitable for packaging structures with large height devices or chips.
  • the embodiment of the present application provides a packaging structure, a manufacturing method of the packaging structure, and an electronic device, which can solve the problem of soldering between pins or between pins and electronic devices in the packaging structure of a device or chip with a large height in the related art. There is a problem of height difference between the disks to achieve high coplanarity.
  • the package structure provided by the embodiment of the present application in addition to the main substrate, it also includes a lead substrate.
  • the lead substrate can assist the main substrate in wiring, reducing The routing pressure of the main substrate improves the design flexibility of the package structure.
  • the manufacturing method of the packaging structure can also reduce the processing cost and improve the production efficiency.
  • Embodiments of the present application provide a packaging structure on the one hand, including: a main substrate, an electronic device, at least one lead plastic package, and a first plastic packaging layer covering the main substrate, the electronic device and the lead plastic package ;
  • the electronic device and the lead plastic package are arranged on the main substrate;
  • the lead plastic package is a prefabricated part, and the lead plastic package includes: at least one metal post and a second plastic packaging layer covering the at least one metal post, one end of the metal post is connected to the main substrate, The other end of the metal post is used for connecting with an external circuit.
  • the package structure provided by the embodiment of the present application can solve the problem of PIN in the package structure of the electronic device with a large height through modularization of the lead plastic package, the electronic device and the main substrate.
  • the lead plastic package can be prefabricated, so that the end of each metal column that needs to be connected to the external circuit is kept flush with the plastic package layer, so as to meet the high coplanarity requirement of the package structure.
  • the plastic sealing layer can cover multiple metal pillars, which can prevent the metal pillars from tilting or toppling during the welding process, and can improve the PIN yield rate compared with the method of welding a single metal pillar.
  • the lead plastic package can realize high-density arrangement of metal pillars, reduce the spacing between metal pillars, and improve signal capability.
  • the high-density arrangement of metal columns can increase the metal ratio per unit cross-sectional area and increase the flow capacity in the vertical direction.
  • the lead plastic package further includes: a lead substrate;
  • One side of the pin substrate is connected to an end of the metal column away from the main substrate, and the other side of the pin substrate is used for connecting with an external circuit.
  • solder balls are disposed on a side of the pin substrate away from the metal pillar.
  • the electronic device includes: at least one of a chip, a capacitor, an inductor, a resistor, or a filter.
  • the metal pillar extends in a direction perpendicular to the surface of the main substrate.
  • Another aspect of the embodiment of the present application provides a method for manufacturing a packaging structure, including:
  • the lead plastic package includes: at least one metal post and a plastic sealing layer covering the at least one metal post;
  • the main plastic package is singulated to form a plurality of packaging structures including the main substrate, the electronic device and at least one lead plastic package.
  • the step of preparing the lead plastic package includes:
  • a plurality of metal pillars are vertically arranged on the pin substrate
  • Solder balls are set at one end;
  • the singulation of the lead plastic package is performed to form a plurality of lead plastic packages including at least one metal post, which specifically includes:
  • a first jig is placed on the lead substrate, the first jig has a plurality of through holes perpendicular to the lead substrate, and a plurality of metal posts are respectively passed through The through hole is vertically arranged on the lead substrate, and the first jig is removed.
  • a first fixture is placed on the lead substrate, the first fixture has a through hole perpendicular to the lead substrate, and a plurality of metal posts are passed through the through hole.
  • the holes are vertically arranged on the lead substrate, and before the step of removing the first jig, it also includes:
  • a second jig is provided, the second jig has a plurality of vertical holes, a plurality of metal pillars are dropped into the vertical holes through vibration, and the metal pillars are sucked out of the vertical holes by using a suction nozzle .
  • the manufacturing method of the package structure provided by the embodiment of the present application can solve the problem of PIN in the package structure of the electronic device with a large height.
  • the metal pillars can be arranged in high density in the plastic encapsulation layer, so as to achieve the purpose of improving the signal output capability and the vertical flow capacity of the package structure.
  • the metal column can be made perpendicular to the lead substrate and the main substrate, thereby improving the yield rate.
  • the above-mentioned manufacturing method has a simple flow process and a high degree of full automation, can reduce processing costs, and has high production efficiency.
  • Still another aspect of the embodiments of the present application provides an electronic device, including: a printed circuit board and the above-mentioned packaging structure disposed on the printed circuit board.
  • the packaging structure is modularized together by the lead plastic package, the electronic device and the main substrate, which can solve the problem of PIN in the packaging structure of the electronic device with a large height.
  • the lead plastic package can be prefabricated, so that the end of each metal column that needs to be connected to the external circuit is kept flush with the plastic package layer, so as to meet the high coplanarity requirement of the package structure.
  • the plastic sealing layer can cover multiple metal pillars, which can prevent the metal pillars from tilting or toppling during the welding process, and can improve the PIN yield rate compared with the method of welding a single metal pillar.
  • the lead plastic package can realize high-density arrangement of metal pillars, reduce the spacing between metal pillars, and improve signal capability.
  • the high-density arrangement of metal columns can increase the metal ratio per unit cross-sectional area and increase the flow capacity in the vertical direction.
  • the package structure provided by the embodiment of the present application in addition to the main substrate, it also includes a pin substrate, which can assist the main substrate in wiring, reduce the wiring pressure of the main substrate, and improve the design flexibility of the package structure. .
  • FIG. 1 is a schematic structural diagram of a packaging structure provided by an embodiment in the related art
  • FIG. 2 is a schematic structural diagram of a packaging structure provided by an embodiment in the related art
  • FIG. 3 is a schematic structural diagram of a packaging structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a packaging structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a packaging structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a manufacturing method of a packaging structure provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of step S11 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of step S12 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of step S13 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of step S14 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a lead plastic package of a packaging structure provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of step S15 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of step S16 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of step S17 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 15 is a schematic diagram of step S18 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 16 is a schematic flowchart of a manufacturing method of a packaging structure provided by an embodiment of the present application.
  • FIG. 17 is a schematic diagram of step S24 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 18 is a schematic structural diagram of a lead plastic package of a packaging structure provided by an embodiment of the present application.
  • FIG. 19 is a schematic diagram of step S25 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 20 is a schematic diagram of step S26 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 21 is a schematic diagram of step S27 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 22 is a schematic diagram of step S28 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 23 is a schematic diagram of steps S11 or S21 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • FIG. 24 is a schematic flowchart of a manufacturing method of a packaging structure provided by an embodiment of the present application.
  • FIG. 25 is a schematic diagram of step S20 of the manufacturing method of the packaging structure provided by an embodiment of the present application.
  • Fig. 1 is a schematic structural diagram of a packaging structure provided by an embodiment of the related art.
  • the PIN solution which is the mainstream of mass production in the industry, is to arrange devices 2 and chips 3 on both sides of the substrate 1, and to arrange the devices 2 and chips 3 on both sides of the substrate 1.
  • Solder balls 4 are set on one side of the pin as pins and then packaged by plastic encapsulation material 5.
  • the solder balls 4 used as pins are spherical in a molten state, which has certain restrictions on the height of the PIN. The height generally does not exceed 300 ⁇ m, which is not suitable for packaging structures with large height devices or chips.
  • one of the solutions is to use copper pillars as pins to output the PIN.
  • the specific solution is shown in Figure 2.
  • the device 2 and the chip 3 are arranged, and copper pillars 6 are provided on one side of the substrate 1 as pins, and then encapsulated by a plastic encapsulation material 5 .
  • this packaging method also has disadvantages: the copper pillars 6 are independently soldered, which is prone to tipping or tilting, and the yield rate is low, and the height between the copper pillars will exceed 200 ⁇ m in extreme cases.
  • the embodiments of the present application provide a packaging structure, a manufacturing method of the packaging structure, and an electronic device, wherein the packaging structure can solve the problem of height difference between pins or between pins and pads of electronic devices. problem, achieve high coplanarity, and high yield.
  • the package structure provided by the embodiment of the present application in addition to the main substrate, it also includes a lead substrate.
  • the lead substrate can assist the main substrate in wiring, reducing the main substrate.
  • the routing pressure of the substrate improves the design flexibility of the package structure.
  • the manufacturing method can lower the processing cost and improve the production efficiency.
  • FIG. 3 is a schematic structural diagram of a package structure 100 provided by an embodiment of the present application.
  • the package structure 100 provided by the embodiment of the present application includes: a main substrate 10, an electronic device 20, and at least one lead plastic package 30 And the first plastic sealing layer 40 covering the main substrate 10 , the electronic device 20 and the lead plastic packaging part 30 .
  • the electronic device 20 and the lead plastic package 30 are disposed on the main substrate 10 , it should be mentioned that the electronic device 20 may include at least one of a chip, a capacitor, an inductor, a resistor and a filter.
  • the main substrate 10 may be a copper clad laminate.
  • the lead plastic package 30 is a prefabricated part, and "prefabricated part” here means that the lead plastic package 30 is prefabricated as a whole.
  • the pin plastic package 30 includes: at least one metal column 31 and a second plastic layer 32 covering the metal column 31, one end of the metal column 31 and the main substrate 10 can be connected through the pad 50, so as to realize the connection between the metal column 31 and the main substrate 10. The other end of the metal post 31 is used to connect with the external circuit.
  • connection in the embodiments of the present application may be a fixed connection, or an indirect connection through an intermediary, or an internal communication between two elements or an interaction relationship between two elements.
  • connection may be a fixed connection, or an indirect connection through an intermediary, or an internal communication between two elements or an interaction relationship between two elements.
  • the first plastic sealing layer 40 and the second plastic sealing layer 32 may use the same material or different materials.
  • the first plastic sealing layer 40 and the second plastic sealing layer 32 adopt different coatings, and are not intended to limit the first plastic sealing layer Layer 40 and second molding layer 32 are the same material.
  • the molding sequence of the first plastic package 40 is different from that of the first plastic package 40 . From the cross-section of the package structure 100 , it can be seen that there is a clear boundary between the first plastic package 40 and the second plastic package 32 .
  • the height of the metal post 31 in the lead plastic package 30 can be pre-selected according to specific working conditions, which can solve the problem of electronic devices with large heights.
  • the package structure 100 of the device 20 has a PIN problem.
  • the lead plastic package 30 can be prefabricated, so that the end of each metal post 31 that needs to be connected to the external circuit is kept flush with the second plastic package layer 32 , so as to meet the high coplanarity requirement of the packaging structure 100 .
  • the multiple metal columns 31 can be injected and molded to form the lead plastic package 30, and then the lead plastic package 30 can be connected with the main body.
  • the soldering of the substrate 10 can prevent the metal post 31 from tilting or toppling during the soldering process, and improve the PIN yield rate, compared with the method of soldering a single metal post 31 to the main substrate 10 .
  • the package structure 100 provided by this application can pre-inject and mold a plurality of metal pillars 31 to form a lead plastic package 30. It can be understood that when a plurality of metal pillars 31 are injected and molded, the multiple metal pillars 31 Keep the spacing as small as possible. Then, the lead plastic package 30 is soldered to the main substrate 10 as a whole, so that the high-density arrangement of the metal pillars 31 can be realized, the distance between the metal pillars 31 can be reduced, and the signal capability can be improved.
  • the densely arranged metal pillars 31 can increase the metal ratio per unit cross-sectional area and increase the flow capacity in the vertical direction.
  • the role of the lead plastic package 30 is not only for the PIN out of the package structure 100, but also for electromagnetic interference shielding and heat dissipation.
  • the metal pillars 31 arranged in a high density can be distributed in a matrix, which is equivalent to a shielding wall , can produce electromagnetic interference shielding effect on other surrounding electronic devices 20 ; the densely arranged metal pillars 31 can also increase the metal ratio of the packaging structure 100 and improve the heat dissipation efficiency of the packaging structure 100 .
  • the metal post 31 can be extended in a direction perpendicular to the surface of the main substrate 10 , which can further improve the PIN yield of the package structure 100 .
  • the metal pillar 31 may use a series of metals such as copper, iron, and alloys with excellent electrical conductivity.
  • the cross-sectional shape of the metal post 31 may be, but not limited to, regular shapes such as circles, ellipses, rectangles, polygons, etc., and of course may also be irregular shapes.
  • the lead plastic package 30 and the electronic device 20 can be fixed on the main substrate 10 by reflow soldering, or can be fixed by silver glue or the like.
  • solder balls 60 may also be provided on the end of the metal post 31 away from the main substrate 10 , so as to facilitate the connection of the metal post 31 to an external circuit.
  • FIG. 4 is a schematic structural diagram of a packaging structure 100 provided by an embodiment of the present application.
  • the electronic device 20 can not only be arranged on one side of the main substrate 10, but also can be arranged on the other side of the main substrate 10 at the same time.
  • the lead plastic package 30 and the electronic device 20 The settings on the main substrate 10 need to be set according to specific working conditions, and there is no limitation on this.
  • FIG. 5 is a schematic structural diagram of a packaging structure 100 provided by an embodiment of the present application.
  • the substrate 33 can be made of the same material as the main substrate 10 , such as a copper clad laminate.
  • one side of the pin substrate 33 is configured to be connected to an end of the metal post 31 away from the main substrate 10 , and the other side of the pin substrate 33 is used to connect to an external circuit.
  • introducing the lead substrate 33 into the lead plastic package 30 can facilitate the positioning and fixing of the metal post 31 during the manufacturing process of the lead plastic package 30 .
  • the pin substrate 33 can assist the main substrate 10 to perform wiring, and reduce the wiring pressure of the main substrate 10 .
  • solder balls 60 may also be provided on the side of the pin substrate 33 away from the metal post 31 , so as to facilitate the connection between the lead plastic package 30 and the external circuit.
  • the embodiment of the present application provides a method for manufacturing the packaging structure 100 , and the schematic diagram of the manufacturing process is shown in FIG. 6 .
  • FIG. 6 is a schematic flowchart of a manufacturing method of the packaging structure 100 provided by an embodiment of the present application. Referring to FIG. 6 , the steps are as follows:
  • the lead plastic package 80 singulates the lead plastic package 80 to form a plurality of lead plastic packages 30 including at least one metal column 31.
  • the lead plastic package 80 is singulated according to the dotted line to form a plurality of lead plastic packages 30 as shown in FIG. 11 .
  • the metal pillars 31 can be arranged in a high density to improve the signal output capability and the flow capability in the vertical direction.
  • the metal pillars 31 can be distributed in a matrix, which can produce acoustic and electromagnetic interference shielding effects on other surrounding devices, and can also improve the heat dissipation efficiency of the packaging structure 100 .
  • S15 as shown in FIG. 12, set the lead plastic package 30 and the electronic device 20 on the main substrate 10.
  • the lead plastic package 30 and the electronic device 20 are arranged on both sides of the main substrate 10 in FIG.
  • the side of the lead plastic package 30 provided with the solder balls 60 is connected to the main substrate 10 .
  • solder balls 60 are disposed on the exposed side, specifically, solder balls 60 are disposed on the end of the metal pillar 31 away from the main substrate 10 , so as to facilitate the connection of the metal pillar 31 to external circuits.
  • the main plastic package body 90 is singulated to form a plurality of packaging structures 100 including the main substrate 10, the electronic device 20 and at least one lead plastic package 30. Exemplarily, as shown in FIG. 15 As shown, the main plastic package 90 is singulated according to the dotted line to form a plurality of package structures 100 as shown in FIG. 4 .
  • the embodiment of the present application also provides a manufacturing method of the packaging structure 100, and its preparation process is shown in Figure 16. Compared with the preparation process in Figure 6, the difference between the preparation process in Figure 16 is that the packaging structure 100 provided in Figure 6 In the manufacturing method of the lead plastic package body 80, a plurality of lead plastic package parts 30 including at least one metal column 31 are formed, while in the manufacturing method of the package structure 100 provided in FIG. 16 , the lead The plastic package 80 is singulated to form a plurality of lead plastic packages 30 including at least one metal post 31 and a lead substrate 33 .
  • FIG. 16 is a schematic flowchart of a manufacturing method of the packaging structure 100 provided by an embodiment of the present application. Referring to FIG. 16 , the steps are as follows:
  • the lead plastic package 80 singulate the lead plastic package 80 to form a plurality of lead plastic packages 30 including at least one metal post 31 and a lead substrate 33.
  • Singling is performed on the lead plastic package 80 according to the dotted line to form a plurality of lead plastic packages 30 as shown in FIG. 18 .
  • the metal pillars 31 can be arranged in a high density to improve the signal output capability and the flow capability in the vertical direction.
  • the metal pillars 31 can be distributed in a matrix, which can produce acoustic and electromagnetic interference shielding effects on other surrounding devices, and can also improve the heat dissipation efficiency of the packaging structure 100 .
  • the lead substrate 33 can assist the main substrate 10 in wiring, reducing the routing pressure of the main substrate 10 .
  • FIG. 19 set the lead plastic package 30 and the electronic device 20 on the main substrate 10.
  • the lead plastic package 30 and the electronic device 20 are arranged on both sides of the main substrate 10
  • the side of the lead plastic package 30 provided with the solder balls 60 is connected to the main substrate 10 .
  • solder balls 60 are arranged on the exposed side, specifically, solder balls 60 are arranged on the end of the lead substrate 33 away from the main substrate 10 , so as to facilitate the connection of the lead substrate 33 and external circuits.
  • the plane height difference of the entire package can be controlled within 20 ⁇ m, reducing the risk of SMT boarding.
  • the main plastic package body 90 is singulated to form a plurality of packaging structures 100 including the main substrate 10, the electronic device 20 and at least one lead plastic package 30. Exemplarily, as shown in FIG. 22 As shown, the main plastic package 90 is singulated according to the dotted line to form a plurality of packaging structures 100 as shown in FIG. 5 .
  • FIG. 23 is a schematic diagram of steps S11 or S21 of the manufacturing method of the packaging structure 100 provided by an embodiment of the present application.
  • a plurality of metal pillars 31 are vertically arranged on the pin substrate 33 , specifically, place the first fixture 200 on the lead substrate 33, the first fixture 200 has a plurality of through holes 201 perpendicular to the lead substrate 33, and pass a plurality of metal posts 31 through the through holes 201 vertically
  • the first jig 200 is removed after being disposed on the lead substrate 33 , for example, after the metal pillar 31 is fixed on the lead substrate 33 by reflow soldering, the first jig 200 is removed.
  • FIG. 24 is a schematic flow chart of the manufacturing method of the packaging structure 100 provided by an embodiment of the present application.
  • the jig 200 has a through hole 201 perpendicular to the pin substrate 33, and a plurality of metal pillars 31 are vertically arranged on the pin substrate 33 through the through hole 201. Before removing the first jig 200, it may also include:
  • the second jig 300 has a plurality of vertical holes 301, a plurality of metal posts 31 fall into the vertical holes 301 by vibration, and use a suction nozzle to suck the metal posts 31 out of the vertical holes 301 (as shown in Figure 25).
  • FIG. 24 is a schematic flowchart based on the manufacturing method of the second packaging structure 100 mentioned above, and it is no doubt that step S20 is moved to the manufacturing method of the first packaging structure 100 A schematic diagram of the process is obtained, which will not be repeated here.
  • the PIN problem of the packaging structure 100 having a large height of the electronic device 20 can be solved, and at the same time, the metal pillars 31 can be arranged in high density in the second plastic packaging layer 32 , to achieve the purpose of improving the signal output capability and the vertical flow capability of the package structure 100 .
  • the metal post 31 can be made to be perpendicular to the pin substrate 33 and the main substrate 10, thereby improving the yield.
  • the above-mentioned manufacturing method has a simple flow process and a high degree of full automation, can reduce processing costs, and has high production efficiency.
  • the embodiment of the present application also provides an electronic device.
  • the electronic device includes a printed circuit board and the above-mentioned packaging structure 100 arranged on the printed circuit board.
  • the packaging structure 100 is connected to the printed circuit board.
  • the technology of the packaging structure The features and technical effects are the same as those described above, and will not be repeated here.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.

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Abstract

本申请实施例提供一种封装结构、封装结构的制造方法及电子设备，其中，封装结构中，通过采用预先制作的引脚塑封件，将引脚塑封件和电子器件设置在主基板上，可解决引脚与引脚之间或者引脚与电子器件焊盘之间具有高度差的问题，实现高共面度，此外，本申请实施例提供的封装结构中，除主基板外，还包括引脚基板，引脚基板可协助主基板进行布线，减小主基板的走线压力，提高封装结构的设计灵活性。并且，其封装结构的制造方法还能降低加工成本，提高生产效率。

Description

封装结构、封装结构的制造方法及电子设备 技术领域
本申请实施例涉及封装技术领域，特别涉及一种封装结构、封装结构的制造方法及电子设备。
背景技术
随着芯片算力和容量持续提升，功耗翻倍，其供电电源需同步提供业界领先的供电解决方案，支撑产品构筑核心竞争力。对于电源管理类芯片，在PCB板级尺寸不变的前提下，电源模块长度和宽度都受到了限制。因此，为了减小电源模块的长度和宽度，一般会选择将不同器件都集成到封装中形成封装体，在封装体中，由于器件具有高度，这样会导致封装体中的基板上的焊盘与器件上的焊盘之间形成高度差。
目前最常用的解决不同焊盘高度差问题的出PIN(引脚)方法为，在基板上设置焊球，使得焊球与需要和外围电路接线的器件等高。
然而，这种方法存在弊端：焊球在熔融状态下为球形，对出PIN的高度具有一定限制，不适用于具有大高度的器件或芯片的封装结构。
发明内容
本申请实施例提供了一种封装结构、封装结构的制造方法及电子设备，可解决相关技术中，具有大高度器件或芯片的封装结构，引脚与引脚之间或者引脚与电子器件焊盘之间具有高度差的问题，实现高共面度，另外，本申请实施例提供的封装结构中，除主基板外，还包括引脚基板，引脚基板可协助主基板进行布线，减小主基板的走线压力，提高封装结构的设计灵活性。并且，其封装结构的制造方法还能降低加工成本，提高生产效率。
本申请实施例一方面提供一种封装结构，包括：主基板、电子器件、至少一个引脚塑封件以及包覆所述主基板、所述电子器件和所述引脚塑封件的第一塑封层；
所述电子器件和所述引脚塑封件设置在所述主基板上；
所述引脚塑封件为预制件，所述引脚塑封件包括：至少一个金属柱以及包覆所述至少一个金属柱的第二塑封层，所述金属柱的一端与所述主基板连接，所述金属柱的另一端用于与外部电路连接。
本申请实施例提供的封装结构，通过引脚塑封件、电子器件和主基板一同模块化，可解决具有大高度的电子器件的封装结构的出PIN问题。同时，引脚塑封件可预先制作，使得每个金属柱需要与外部电路连接的一端都与塑封层保持齐平，实现封装结构的高共面度需求。并且，引脚塑封件中，塑封层可包覆多个金属柱，相比独个金属柱进行焊接的方式，可防止金属柱在焊接过程中发生倾斜或者倾倒，可提高出PIN良率。另外，引脚塑封件可实现金属柱的高密度排布，减小金属柱之间的间距，可提升出信号能力。此外，高密度布置的金属柱可提升单位截面积金属率，提升垂直方向上的通流能力。
在一种可能的实施方式中，所述引脚塑封件还包括：引脚基板；
所述引脚基板的一面与所述金属柱远离所述主基板的一端连接，所述引脚基板的另一面 用于与外部电路连接。
在一种可能的实施方式中，所述引脚基板背离所述金属柱的一面上设置有焊球。
在一种可能的实施方式中，所述电子器件包括：芯片、电容、电感、电阻或滤波器中至少一种。
在一种可能的实施方式中，所述金属柱垂直于所述主基板表面的方向延伸。
本申请实施例另一方面提供一种封装结构的制造方法，包括：
制备引脚塑封件，所述引脚塑封件包括：至少一个金属柱以及包覆所述至少一个金属柱的塑封层；
提供电子器件和主基板，将所述引脚塑封件和所述电子器件设置在所述主基板上；
采用塑封材料将设置有所述引脚塑封件和所述电子器件的主基板进行塑封，形成主塑封体；
对所述主塑封体远离所述主基板的一面进行研磨使所述引脚塑封件露出所述塑封材料，以使所述引脚塑封件可用于与外部电路连接；
对所述主塑封体进行切单，形成多个包括有所述主基板、所述电子器件和至少一个所述引脚塑封件的封装结构。
在一种可能的实施方式中，所述制备引脚塑封件的步骤，包括：
将多个金属柱垂直设置在引脚基板上；
采用塑封材料将设置有所述金属柱的所述引脚基板进行塑封，形成引脚塑封体；
对所述引脚塑封体远离所述引脚基板的一面进行研磨以使所述金属柱露出并与所述引脚塑封体远离所述引脚基板的一面齐平，在所述金属柱露出的一端设置焊球；
对所述引脚塑封体进行切单，形成多个所述引脚塑封件。
在一种可能的实施方式中，所述对所述引脚塑封体进行切单，形成多个包括有至少一个所述金属柱的引脚塑封件，具体包括：
对所述引脚塑封体进行切单，形成多个包括有至少一个所述金属柱和引脚基板的引脚塑封件。
在一种可能的实施方式中，在所述引脚基板上放置第一治具，所述第一治具具有多个垂直于所述引脚基板的通孔，将多个金属柱分别穿过所述通孔垂直设置在所述引脚基板上，撤去所述第一治具。
在一种可能的实施方式中，在所述引脚基板上放置第一治具，所述第一治具具有垂直于所述引脚基板的通孔，将多个金属柱穿过所述通孔垂直设置在所述引脚基板上，撤去所述第一治具的步骤前，还包括：
提供第二治具，所述第二治具具有多个竖直孔，多个金属柱通过震动的方式落入所述竖直孔中，使用吸嘴将所述金属柱吸出所述竖直孔。
本申请实施例提供的封装结构的制造方法，可解决具有大高度的电子器件的封装结构的出PIN问题。同时，可使得金属柱可在塑封层中高密度排布，实现封装结构的提高出信号能力和垂直方向流通能力的目的。并且，可使得金属柱垂直于引脚基板和主基板，提高良率。另外，上述制造方法流程简单，全自动化程度高，可降低加工成本，生产效率高。
本申请实施例再一方面提供一种电子设备，包括：印刷电路板以及设置在所述印刷电路板上的如上所述的封装结构。
本申请实施例提供的电子设备，其中，封装结构通过引脚塑封件、电子器件和主基板一同模块化，可解决具有大高度的电子器件的封装结构的出PIN问题。同时，引脚塑封件可预先 制作，使得每个金属柱需要与外部电路连接的一端都与塑封层保持齐平，实现封装结构的高共面度需求。并且，引脚塑封件中，塑封层可包覆多个金属柱，相比独个金属柱进行焊接的方式，可防止金属柱在焊接过程中发生倾斜或者倾倒，可提高出PIN良率。另外，引脚塑封件可实现金属柱的高密度排布，减小金属柱之间的间距，可提升出信号能力。此外，高密度布置的金属柱可提升单位截面积金属率，提升垂直方向上的通流能力。再者，本申请实施例提供的封装结构中，除主基板外，还包括引脚基板，引脚基板可协助主基板进行布线，减小主基板的走线压力，提高封装结构的设计灵活性。
附图说明
图1为相关技术中一实施例提供的封装结构的结构示意图；
图2为相关技术中一实施例提供的封装结构的结构示意图；
图3为本申请一实施例提供的封装结构的结构示意图；
图4为本申请一实施例提供的封装结构的结构示意图；
图5为本申请一实施例提供的封装结构的结构示意图；
图6为本申请一实施例提供的封装结构的制造方法的流程示意图；
图7为本申请一实施例提供的封装结构的制造方法的步骤S11的示意图；
图8为本申请一实施例提供的封装结构的制造方法的步骤S12的示意图；
图9为本申请一实施例提供的封装结构的制造方法的步骤S13的示意图；
图10为本申请一实施例提供的封装结构的制造方法的步骤S14的示意图；
图11为本申请一实施例提供的封装结构的引脚塑封件的结构示意图；
图12为本申请一实施例提供的封装结构的制造方法的步骤S15的示意图；
图13为本申请一实施例提供的封装结构的制造方法的步骤S16的示意图；
图14为本申请一实施例提供的封装结构的制造方法的步骤S17的示意图；
图15为本申请一实施例提供的封装结构的制造方法的步骤S18的示意图；
图16为本申请一实施例提供的封装结构的制造方法的流程示意图；
图17为本申请一实施例提供的封装结构的制造方法的步骤S24的示意图；
图18为本申请一实施例提供的封装结构的引脚塑封件的结构示意图；
图19为本申请一实施例提供的封装结构的制造方法的步骤S25的示意图；
图20为本申请一实施例提供的封装结构的制造方法的步骤S26的示意图；
图21为本申请一实施例提供的封装结构的制造方法的步骤S27的示意图；
图22为本申请一实施例提供的封装结构的制造方法的步骤S28的示意图；
图23为本申请一实施例提供的封装结构的制造方法步骤S11或S21的示意图；
图24为本申请一实施例提供的封装结构的制造方法的流程示意图；
图25为本申请一实施例提供的封装结构的制造方法步骤S20的示意图。
附图标记说明：
1-基板；
2-器件；
3-芯片；
4-焊球；
5-塑封材料；
6-铜柱；
100-封装结构；
10-主基板；
20-电子器件；
30-引脚塑封件；
31-金属柱；
32-第二塑封层；
33-引脚基板；
40-第一塑封层；
50-焊盘；
60-焊球；
70-塑封材料；
80-引脚塑封体；
90-主塑封体；
200-第一治具；
201-通孔；
300-第二治具；
301-竖直孔。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
图1为相关技术中一实施例提供的封装结构的结构示意图，参考图1所示，作为业内量产主流的出PIN方案，是在基板1的两面布置器件2和芯片3，并在基板1的一面设置焊球4作为引脚后再通过塑封材料5进行封装，但是，这种封装方法中，作为引脚的焊球4在熔融状态下为球形，对出PIN的高度具有一定限制，最大高度一般不超过300μm，不适用于具有大高度的器件或芯片的封装结构。
为此，其中一种解决方法为，通过采用铜柱作为引脚的方式进行出PIN，其具体方案如图2所示，图2为相关技术中一封装结构的结构示意图，在基板1的两面布置器件2和芯片3，并在基板1的一面设置铜柱6作为引脚后再通过塑封材料5进行封装。但是，这种封装方法也存在弊端：铜柱6在焊接时是独立单颗进行的，容易发生倾倒或者倾斜，良率较低，并且铜柱之间在极限情况下会带来超过200μm的高度差；由于受到焊接设备的影响，铜柱间距较大，无法将铜柱排布间距做小；由于铜柱需要单独通过抓取装贴打件实现在基板上的排放，其加工成本高，生产效率低。
为了解决上述问题，本申请实施例提供一种封装结构、封装结构的制造方法及电子设备，其中，封装结构可解决引脚与引脚之间或者引脚与电子器件焊盘之间具有高度差的问题，实现高共面度，并且良率高，此外，本申请实施例提供的封装结构中，除主基板外，还包括引脚基板，引脚基板可协助主基板进行布线，减小主基板的走线压力，提高封装结构的设计灵活性。另外，其制造方法还能较低加工成本，提高生产效率。
下面结合附图对本申请实施例提供的封装结构进行详细说明：
图3为本申请一实施例提供的封装结构100的结构示意图，参考图3所示，本申请实施例提供的封装结构100，包括：主基板10、电子器件20、至少一个引脚塑封件30以及包覆主基板10、电子器件20和引脚塑封件30的第一塑封层40。
其中，电子器件20和引脚塑封件30设置在主基板10上，需要提到的是，电子器件20可以包括：芯片、电容、电感、电阻和滤波器中至少一种。主基板10可采用覆铜箔层压板。
其中，引脚塑封件30为预制件，这里“预制件”是指，引脚塑封件30作为一个整体预先制成。引脚塑封件30包括：至少一个金属柱31和包覆金属柱31的第二塑封层32，金属柱31的一端与主基板10可以通过焊盘50连接，以实现金属柱31与主基板10之间的连接，金属柱31的另一端用于与外部电路连接。
可以理解的是，本申请实施例中“连接”可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解“连接”在本申请实施例中的具体含义。
需要提到的是，本申请实施例中，第一塑封层40和第二塑封层32可以采用相同材料也可以采用不同材料。在本申请实施例提供的附图中，为了区分第一塑封层40和第二塑封层32，第一塑封层40和第二塑封层32采用不同涂层，而并不是意在限定第一塑封层40和第二塑封层32为相同材料。
由于引脚塑封件30作为预制件，与第一塑封层40成型的先后顺序不同，从封装结构100的横截面可以看出，第一塑封层40与第二塑封层32之间存在明显边界。
应理解的是，通过引脚塑封件30、电子器件20和主基板10一同模块化，引脚塑封件30中金属柱31的高度可根据具体工况进行预先选取，可解决具有大高度的电子器件20的封装结构100的出PIN问题。
同时，引脚塑封件30可预先制作，使得每个金属柱31需要与外部电路连接的一端都与第二塑封层32保持齐平，实现封装结构100的高共面度需求。
并且，在预先制作引脚塑封件30时，可将多个金属柱31保持竖直站立后，对多个金属柱31进行注塑塑封形成引脚塑封件30，再将引脚塑封件30与主基板10进行焊接，相比独个金属柱31与主基板10进行焊接的方式，可防止金属柱31在焊接过程中发生倾斜或者倾倒的情况，可提高出PIN良率。
另外，相比相关技术中独个金属柱31与主基板10进行焊接的方式，由于受到焊接设备的影响，将会导致金属柱31之间的间距无法做小，金属柱31之间的间距较大，本申请提供的封装结构100，可预先将多个金属柱31进行注塑塑封形成引脚塑封件30，可以理解的是，在对多个金属柱31进行注塑塑封时，多个金属柱31可保持尽可能小的间距。再将引脚塑封件30作为整体与主基板10进行焊接，可实现金属柱31的高密度排布，减小金属柱31之间的间距，可提升出信号能力。
此外，高密度布置的金属柱31可提升单位截面积金属率，提升垂直方向上的通流能力。
需要说明的是，引脚塑封件30的作用不止可用于封装结构100的出PIN，还可用于电磁干扰屏蔽和散热，例如，高密度排布的金属柱31可呈矩阵分布，相当于屏蔽墙，可对周边的其他电子器件20产生电磁干扰屏蔽效果；高密度排布的金属柱31也可增加封装结构100的金属率，提高封装结构100的散热效率。
需要提到的是，在本申请的一些实施例中，可将金属柱31垂直于主基板10表面的方向延伸设置，可进一步提高封装结构100的出PIN良率。
本申请实施方式中，金属柱31可以采用导电性能优异的铜、铁、合金等一系列金属。其 金属柱31的横截面形状可以但不限于是圆形、椭圆形、长方形、多边形等规则形状，当然也可以是非规则形状。
本申请实施方式中，引脚塑封件30和电子器件20可以采用回流焊接的方式固定在主基板10上，也可以是通过银胶固定等。
需要提到的是，继续参考图3所示，还可以在金属柱31远离主基板10的一端上设置焊球60，便于金属柱31与外部电路连接。
当然，本申请不止于此，图4为本申请一实施例提供的封装结构100的结构示意图，参考图4所示，引脚塑封件30不仅可以设置在主基板10的一面，还可同时设置在主基板10一面相背的另一面，同样，电子器件20不仅可以设置主基板10的一面，还可同时设置在主基板10一面相背的另一面，引脚塑封件30和电子器件20在主基板10上的设置情况需根据具体工况进行设置，对此，不做限制。
图5为本申请一实施例提供的封装结构100的结构示意图，参考图5所示，在本申请的一些实施例中，引脚塑封件30还可以包括：引脚基板33，其中，引脚基板33可采用主基板10相同材质，例如覆铜箔层压板。
具体的，引脚基板33的一面被设置为与金属柱31远离主基板10的一端连接，引脚基板33的另一面用于与外部电路连接。
需要提到的，通常情况下，主基板10与引脚塑封件30中多个金属柱31连接的焊盘50会存在多个电信号，使得引脚塑封件30中的每个金属柱31会有不同的电信号，可克服引脚基板33等电位的问题。
可以理解的是，在引脚塑封件30中引入引脚基板33，一方面，在引脚塑封件30的制作过程中，可有利于金属柱31的定位以及固定。另一方面，引脚基板33可协助主基板10进行布线，减小主基板10的走线压力。
另外，参考图5所示，在本申请的一些实施例中，还可在引脚基板33背离金属柱31的一面上设置焊球60，方便引脚塑封件30与外部电路进行连接。
本申请实施例提供一种封装结构100的制造方法，其制备流程示意图如图6所示。
图6为本申请一实施例提供的封装结构100的制造方法的流程示意图，参考图6所示，其步骤如下：
S11、将多个金属柱31垂直设置在引脚基板33上，例如，如图7所示，将金属柱31焊接在引脚基板33上或者通过银胶固定在引脚基板33上。
S12、如图8所示，采用塑封材料70将设置有金属柱31的引脚基板33进行塑封，形成引脚塑封体80。
S13、如图9所示，对引脚塑封体80远离引脚基板33的一面进行研磨使金属柱31露出，经研磨后，金属柱31露出的一端与引脚塑封体80远离引脚基板33的一面齐平，在金属柱31露出的一端设置焊球60。通过研磨过程，可使得每个金属柱31之间的高度差控制在10μm之内，降低利用表面贴装技术(Surface Mount Technology，SMT)上板的风险。
S14、参考图10所示，对引脚塑封体80进行切单，形成多个包括有至少一个金属柱31的引脚塑封件30，示例性的，如图10所示，对引脚塑封体80按虚线进行切单，形成多个如图11中所示的引脚塑封件30。在引脚塑封件30中，金属柱31可实现高密度排布，提高出信号能力和垂直方向上的通流能力。此外，金属柱31可呈矩阵分布，可对周边其他器件产声电磁干扰屏蔽效果，也可提封装结构100的散热效率。
S15、参考图12所示，将引脚塑封件30和电子器件20设置主基板10上，示例性的，图12 中以引脚塑封件30和电子器件20设置在主基板10的双面进行说明，其中，引脚塑封件30设置有焊球60的一面与主基板10连接。
S16、参考图13所示，采用塑封材料将设置有引脚塑封件30和电子器件20的主基板10进行塑封，形成主塑封体90。
S17、参考图14所示，对主塑封体90远离主基板10的一面进行研磨使引脚塑封件30露出，以使引脚塑封件30可用于与外部电路连接，并在引脚塑封件30露出的一面上设置焊球60，具体的，在金属柱31远离主基板10的一端设置焊球60，便于金属柱31与外部电路连接。通过研磨过程，可使整个封装的平面高度差控制在20μm以内，减小SMT上板风险。
S18、参考图15所示，对主塑封体90进行切单，形成多个包括有主基板10、电子器件20和至少一个引脚塑封件30的封装结构100，示例性的，如图15所示，对主塑封体90按照虚线进行切单，形成多个如图4所示的封装结构100。
本申请实施例还提供一种封装结构100的制造方法，其制备流程如图16所示，图16中制备流程与图6中制备流程相比，其区别点在于：图6提供的封装结构100的制造方法中，对引脚塑封体80进行切单，形成了多个只包括有至少一个金属柱31的引脚塑封件30，而图16提供的封装结构100的制造方法中，对引脚塑封体80进行切单，形成了多个包括有至少一个金属柱31和引脚基板33的引脚塑封件30。
具体的，图16为本申请一实施例提供的封装结构100的制造方法的流程示意图，参考图16所示，其步骤如下：
S21、将多个金属柱31垂直设置在引脚基板33上，例如，将金属柱31焊接在引脚基板33上或者通过银胶固定在引脚基板33上(如图7所示)。
S22、采用塑封材料70将设置有金属柱31的引脚基板33进行塑封，形成引脚塑封体80(如图8所示)。
S23、对引脚塑封体80远离引脚基板33的一面进行研磨使金属柱31露出，经研磨后，金属柱31露出的一端与引脚塑封体80远离引脚基板33的一面齐平，在金属柱31露出的一端设置焊球60(如图9所示)。通过研磨过程，可使得每个金属柱31之间的高度差控制在10μm之内，降低SMT上板风险。
S24、参考图17所示，对引脚塑封体80进行切单，形成多个包括有至少一个金属柱31和引脚基板33的引脚塑封件30，示例性的，如图17所示，对引脚塑封体80按虚线进行切单，形成多个如图18中所示的引脚塑封件30。在引脚塑封件30中，金属柱31可实现高密度排布，提高出信号能力和垂直方向上的通流能力。此外，金属柱31可呈矩阵分布，可对周边其他器件产声电磁干扰屏蔽效果，也可提封装结构100的散热效率。另外，引脚基板33可协助主基板10进行布线，减小主基板10的走线压力。
S25、参考图19所示，将引脚塑封件30和电子器件20设置主基板10上，示例性的，图19中以引脚塑封件30和电子器件20设置在主基板10的双面进行说明，其中，引脚塑封件30设置有焊球60的一面与主基板10连接。
S26、参考图20所示，采用塑封材料将设置有引脚塑封件30和电子器件20的主基板10进行塑封，形成主塑封体90。
S27、参考图21所示，对主塑封体90远离主基板10的一面进行研磨使引脚塑封件30露出，以使引脚塑封件30可用于与外部电路连接，并在引脚塑封件30露出的一面上设置焊球60，具体的，在引脚基板33远离主基板10的一端设置焊球60，便于引脚基板33与外部电路连接。通过研磨过程，可使整个封装的平面高度差控制在20μm以内，减小SMT上板风险。
S28、参考图22所示，对主塑封体90进行切单，形成多个包括有主基板10、电子器件20和至少一个引脚塑封件30的封装结构100，示例性的，如图22所示，对主塑封体90按照虚线进行切单，形成多个如图5所示的封装结构100。
图23为本申请一实施例提供的封装结构100的制造方法步骤S11或S21的示意图，参考图23所示，以上两种制造方法中，将多个金属柱31垂直设置在引脚基板33上，具体可以是，在引脚基板33上放置第一治具200，第一治具200具有多个垂直于引脚基板33的通孔201，将多个金属柱31分别穿过通孔201垂直设置在引脚基板33上，撤去第一治具200，例如，将金属柱31通过回流焊固定在引脚基板33上之后，撤去第一治具200。
图24为本申请一实施例提供的封装结构100的制造方法的流程示意图，参考图24所示，在本申请的一些实施例中，在引脚基板33上放置第一治具200，第一治具200具有垂直于引脚基板33的通孔201，将多个金属柱31穿过通孔201垂直设置在引脚基板33上，撤去第一治具200的步骤前，还可以包括：
S20、提供第二治具300，第二治具300具有多个竖直孔301，多个金属柱31通过震动的方式落入竖直孔301中，使用吸嘴将金属柱31吸出竖直孔301(如图25所示)。
需要说明的是，图24是在上文中提到的第二种封装结构100的制造方法的基础上的流程示意图，其步骤S20移至第一种封装结构100的制造方法中可毫无疑义的得出流程示意图，在此不再一一赘述。
可以理解的是，利用上述封装结构100的制造方法，可解决具有大高度的电子器件20的封装结构100的出PIN问题，同时，可使得金属柱31可在第二塑封层32中高密度排布，实现封装结构100的提高出信号能力和垂直方向流通能力的目的。并且，可使得金属柱31垂直于引脚基板33和主基板10，提高良率。另外，上述制造方法流程简单，全自动化程度高，可降低加工成本，生产效率高。
本申请实施例还提供一种电子设备，电子设备中包括印刷电路板以及设置在印刷电路板上的如上述所示的封装结构100，封装结构100与印刷电路板连接，其中，封装结构的技术特征与技术效果与上文所述相同，在此，不再一一赘述。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (11)

  1. 一种封装结构，其特征在于，包括：主基板、电子器件、至少一个引脚塑封件以及包覆所述主基板、所述电子器件和所述引脚塑封件的第一塑封层；
    所述电子器件和所述引脚塑封件设置在所述主基板上；
    所述引脚塑封件为预制件，所述引脚塑封件包括：至少一个金属柱以及包覆所述至少一个金属柱的第二塑封层，所述金属柱的一端与所述主基板连接，所述金属柱的另一端用于与外部电路连接。
  2. 根据权利要求1所述的封装结构，其特征在于，所述引脚塑封件还包括：引脚基板；
    所述引脚基板的一面与所述金属柱远离所述主基板的一端连接，所述引脚基板的另一面用于与外部电路连接。
  3. 根据权利要求2所述的封装结构，其特征在于，所述引脚基板背离所述金属柱的一面上设置有焊球。
  4. 根据权利要求1-3任一项所述的封装结构，其特征在于，所述电子器件包括：芯片、电容、电感、电阻或滤波器中至少一种。
  5. 根据权利要求1-4任一项所述的封装结构，其特征在于，所述金属柱垂直于所述主基板表面的方向延伸。
  6. 一种封装结构的制造方法，其特征在于，包括：
    制备引脚塑封件，所述引脚塑封件包括：至少一个金属柱以及包覆所述至少一个金属柱的塑封层；
    提供电子器件和主基板，将所述引脚塑封件和所述电子器件设置在所述主基板上；
    采用塑封材料将设置有所述引脚塑封件和所述电子器件的所述主基板进行塑封，形成主塑封体；
    对所述主塑封体远离所述主基板的一面进行研磨使所述引脚塑封件露出所述塑封材料，以使所述引脚塑封件可用于与外部电路连接；
    对所述主塑封体进行切单，形成多个包括有所述主基板、所述电子器件和至少一个所述引脚塑封件的所述封装结构。
  7. 根据权利要求6所述的封装结构的制造方法，其特征在于，
    所述制备引脚塑封件的步骤，包括：
    将多个金属柱垂直设置在引脚基板上；
    采用塑封材料将设置有所述金属柱的所述引脚基板进行塑封，形成引脚塑封体；
    对所述引脚塑封体远离所述引脚基板的一面进行研磨以使所述金属柱露出并与所述引脚塑封体远离所述引脚基板的一面齐平，在所述金属柱露出的一端设置焊球；
    对所述引脚塑封体进行切单，形成多个包括有至少一个所述金属柱的所述引脚塑封件。
  8. 根据权利要求7所述的封装结构的制造方法，其特征在于，所述对所述引脚塑封体进行切单，形成多个包括有至少一个所述金属柱的引脚塑封件，具体包括：
    对所述引脚塑封体进行切单，形成多个包括有至少一个所述金属柱和所述引脚基板的所述引脚塑封件。
  9. 根据权利要求7或8所述的封装结构的制造方法，其特征在于，所述将多个金属柱垂直设置在引脚基板上，具体包括：
    在所述引脚基板上放置第一治具，所述第一治具具有多个垂直于所述引脚基板的通孔， 将多个金属柱分别穿过所述通孔垂直设置在所述引脚基板上，撤去所述第一治具。
  10. 根据权利要求9所述的封装结构的制造方法，其特征在于，在所述引脚基板上放置第一治具，所述第一治具具有垂直于所述引脚基板的通孔，将多个金属柱穿过所述通孔垂直设置在所述引脚基板上，撤去所述第一治具的步骤前，还包括：
    提供第二治具，所述第二治具具有多个竖直孔，多个金属柱通过震动的方式落入所述竖直孔中，使用吸嘴将所述金属柱吸出所述竖直孔。
  11. 一种电子设备，其特征在于，包括：印刷电路板以及设置在所述印刷电路板上的如权利要求1-4任一项所述的封装结构。
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