WO2023040976A1 - 设备测试方法、装置、可读介质及电子设备 - Google Patents

设备测试方法、装置、可读介质及电子设备 Download PDF

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WO2023040976A1
WO2023040976A1 PCT/CN2022/119077 CN2022119077W WO2023040976A1 WO 2023040976 A1 WO2023040976 A1 WO 2023040976A1 CN 2022119077 W CN2022119077 W CN 2022119077W WO 2023040976 A1 WO2023040976 A1 WO 2023040976A1
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environment
target
tested
test
parameter
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PCT/CN2022/119077
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English (en)
French (fr)
Inventor
葛士建
刘显
张宇
聂海涛
许晓菡
袁帅
李琛琛
王亚彬
彭亮
王剑
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北京字节跳动网络技术有限公司
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Publication of WO2023040976A1 publication Critical patent/WO2023040976A1/zh

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2205Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2289Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing by configuration test
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/36Preventing errors by testing or debugging software
    • G06F11/3664Environments for testing or debugging software

Definitions

  • the present disclosure relates to the field of computer technology, and in particular, relates to a device testing method, device, readable medium and electronic device.
  • the stress test can be carried out in a high-temperature and high-humidity environment.
  • the high-temperature and high-humidity environment can make it easier for problematic modules to expose problems. For example, memory modules are difficult to find problems in a normal environment, but it is easier to test them in a high-temperature and high-humidity environment.
  • the structure of the high-temperature and high-humidity environment is relatively complicated, resulting in high test cost and low test efficiency.
  • the present disclosure provides a device testing method, the method comprising:
  • the target device is tested according to the target parameter value in the current environment to obtain a test result of the target device in the environment to be tested, and the current environment is different from the environment to be tested.
  • the present disclosure provides an equipment testing device, the device comprising:
  • a test parameter acquisition module configured to acquire device test parameters corresponding to the target device
  • a parameter value acquisition module configured to acquire the target parameter value corresponding to the device test parameter in the environment to be tested
  • a device testing module configured to test the target device in the current environment according to the target parameter value, so as to obtain a test result of the target device in the environment to be tested, the current environment and the to-be-tested
  • the environments are different environments.
  • the present disclosure provides a computer-readable medium on which a computer program is stored, and when the program is executed by a processing device, the steps of the method described in the first aspect of the present disclosure are implemented.
  • an electronic device including:
  • a processing device configured to execute the computer program in the storage device to implement the steps of the method described in the first aspect of the present disclosure.
  • the device test parameters corresponding to the target device by obtaining the device test parameters corresponding to the target device; obtaining the target parameter value corresponding to the device test parameter in the environment to be tested; and then testing the target device according to the target parameter value in the current environment to obtain A test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments.
  • simulating the device test under the environment to be tested such as a high temperature and high humidity environment
  • Fig. 1 is a flowchart showing a device testing method according to an exemplary embodiment.
  • Fig. 2 is a flowchart of step S103 according to the embodiment shown in Fig. 1 .
  • Fig. 3 is a flow chart showing another device testing method according to an exemplary embodiment.
  • Fig. 4 is a block diagram of a device testing device according to an exemplary embodiment.
  • Fig. 5 is a block diagram of another device testing device according to an exemplary embodiment.
  • Fig. 6 is a block diagram of an electronic device according to an exemplary embodiment.
  • the term “comprise” and its variations are open-ended, ie “including but not limited to”.
  • the term “based on” is “based at least in part on”.
  • the term “one embodiment” means “at least one embodiment”; the term “another embodiment” means “at least one further embodiment”; the term “some embodiments” means “at least some embodiments.” Relevant definitions of other terms will be given in the description below.
  • the present disclosure can be applied to equipment testing scenarios, such as stress testing of target servers.
  • stress testing can be performed in a high-temperature and high-humidity environment.
  • High-temperature and high-humidity environments can make problematic modules more easily exposed.
  • the memory module of the target server is difficult to find the problem in the normal environment, but it is easier to detect the problem in the high temperature and high humidity environment.
  • in related technologies in order to perform tests in high-temperature and high-humidity environments, it is necessary to construct a professional temperature and humidity test room, and use the temperature and humidity of the paper temperature and humidity test room to construct a high-temperature and high-humidity environment for testing. In this method, the structure and temperature and humidity control of the temperature and humidity test room are relatively complicated, and generally professional test equipment is required to construct the test environment, which leads to high test cost and low test efficiency.
  • the present disclosure provides a device testing method, device, readable medium and electronic device, by obtaining the device test parameters corresponding to the target device; obtaining the target parameter value corresponding to the device test parameters in the environment to be tested ; Then test the target device according to the target parameter value in the current environment, so as to obtain the test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments. In this way, by setting the target parameter values of the device test parameters in the current conventional environment, simulating the device test in the environment to be tested, and obtaining the same test effect as in the actual environment to be tested, so as to find device problems more efficiently and reduce It reduces the test cost and improves the test efficiency.
  • Fig. 1 is a device testing method shown according to an exemplary embodiment. As shown in Fig. 1, the method includes:
  • Step 101 acquire device test parameters corresponding to the target device.
  • Step 102 acquiring the target parameter value corresponding to the device test parameter in the environment to be tested.
  • Step 103 Test the target device according to the target parameter value in the current environment to obtain a test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments.
  • the target device may be a target server, terminal or other electronic devices.
  • the target device can include a processor and a memory
  • the processor can be a CPU (Central Processing Unit, central processing unit) or a GPU (Graphics Processing Unit, an image processor)
  • the memory can be a memory or a hard disk;
  • the above-mentioned device test parameters can include Device parameters for processor or memory.
  • device test parameters may include memory refresh rate, voltage, or other parameters.
  • the above-mentioned environment to be tested may be a high-temperature and high-humidity environment, a high-temperature environment, a high-humidity or low-temperature environment, etc.
  • the above-mentioned current environment may be a conventional environment with moderate temperature and humidity.
  • a test environment with a temperature of 18 to 30 degrees Celsius and a humidity of 30% to 60% may be used as a routine environment. It should be noted that the temperature and humidity are moderate.
  • the device test parameters corresponding to the target device by obtaining the device test parameters corresponding to the target device; obtaining the target parameter value corresponding to the device test parameter in the environment to be tested; and then testing the target device according to the target parameter value in the current environment to obtain the The test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments.
  • simulating the device test under the environment to be tested such as a high temperature and high humidity environment
  • different target parameter values are preset for different environments to be tested, which may specifically include any of the following methods:
  • the environment to be tested includes a high-temperature and high-humidity environment.
  • the high-temperature and high-humidity environment is a test environment in which the ambient temperature is greater than or equal to a preset temperature threshold and the ambient humidity is greater than or equal to a preset humidity threshold.
  • the first target parameter value corresponding to the high-temperature and high-humidity environment can be obtained according to the preset parameter environment correspondence relationship; wherein, the preset parameter environment correspondence relationship includes Target parameter values of device test parameters corresponding to different environments to be tested.
  • the aforementioned preset temperature threshold can be 40 degrees Celsius, 60 degrees Celsius or 85 degrees Celsius, and the aforementioned preset humidity threshold can be 60%, 70% or 85%; the ambient temperature is greater than or equal to the preset temperature threshold and the ambient humidity is greater than or
  • the test environment equal to the preset humidity threshold is used as the high temperature and high humidity environment.
  • the above-mentioned device test parameters can include memory tREF (Refresh Period, refresh cycle), tWR (Write Recovery Time, write recovery delay), VDD (Voltage Drain-to-Drain, power supply voltage ).
  • the above-mentioned first target parameter value is an example, and the corresponding relationship of the preset parameter environment corresponding to different device types may be different.
  • different corresponding relationship of the preset parameter environment may be preset according to different memory models. .
  • the target parameter value of the device test parameter corresponding to the high-temperature and high-humidity environment can be obtained through the above-mentioned preset parameter environment correspondence relationship, and the target device can be tested according to the target parameter value in the current environment (such as a normal temperature environment), and high temperature can be simulated.
  • high-humidity environment so as to obtain the test results of the target device in the high-temperature and high-humidity environment, improve the fault detection rate of the target device, and also improve the test efficiency.
  • the environment to be tested may include a high temperature environment, and the high temperature environment is a test environment in which the ambient temperature is greater than or equal to a preset temperature threshold.
  • the second target parameter value corresponding to the high temperature environment can be obtained according to the corresponding relationship of the preset parameter environment; wherein, the corresponding relationship of the preset parameter environment includes different parameters to be tested.
  • the above preset temperature threshold may be 40 degrees Celsius, 60 degrees Celsius or 85 degrees Celsius; an environment greater than or equal to the preset temperature threshold is regarded as a high temperature environment.
  • the above-mentioned device test parameters may include tREF, tWR, and VDD of the memory.
  • the above-mentioned second target parameter value is an example, and the corresponding relationship of the preset parameter environment corresponding to different device types may be different.
  • different corresponding relationship of the preset parameter environment may be preset according to different memory models. .
  • the target parameter value of the equipment test parameter corresponding to the high temperature environment can be obtained through the above-mentioned preset parameter environment correspondence relationship, and the target device can be tested according to the target parameter value in the current environment (normal temperature environment), and the high temperature environment can be simulated, thereby The test result of the target device in the high temperature environment is obtained, the fault detection rate of the target device is improved, and the test efficiency is also improved.
  • the environment to be tested may include a high-humidity environment, and the high-humidity environment is a test environment in which the ambient humidity is greater than or equal to a preset humidity threshold.
  • the environment to be tested is the high-humidity environment, according to the preset parameter environment correspondence, the third target parameter value corresponding to the high-humidity environment is obtained; wherein, the preset parameter environment correspondence includes different The target parameter value of the device test parameter corresponding to the test environment.
  • the preset humidity threshold may be 60%, 70% or 85%, and an environment greater than or equal to the preset humidity threshold may be regarded as a high humidity environment.
  • the above-mentioned first target parameter value is an example, and the corresponding relationship of the preset parameter environment corresponding to different device types may be different.
  • different corresponding relationship of the preset parameter environment may be preset according to different memory models. .
  • the target parameter value of the device test parameter corresponding to the high-humidity environment can be obtained through the above-mentioned preset parameter environment correspondence relationship, and the target device can be tested according to the target parameter value in the current environment to simulate the high-humidity environment, thereby obtaining the
  • the test result of the target device in the high-humidity environment improves the fault detection rate of the target device and also improves the test efficiency.
  • testing the target device according to the target parameter value in the current environment may include the following steps:
  • the value of the device test parameter of the target device is set as the target parameter value.
  • the tREF of the memory can be set to 15.6 microseconds, the tWR is set to 10 nanoseconds, and the VDD is set to 1.2 volts through the above-mentioned preset parameter environment correspondence; then in the current environment Test the target device in .
  • the target device can be tested by simulating the environment to be tested by changing the value of the device test parameter, thereby improving the fault detection rate of the target device and improving the test efficiency.
  • the target parameter value of each device test parameter may be set sequentially, and multiple tests are performed on the target device in the current environment.
  • Fig. 2 is a kind of flowchart of step S103 shown according to the embodiment shown in Fig. 1, as shown in Fig. 2, under the situation that the device test parameter of this target device comprises above-mentioned tREF, tWR and VDD, above-mentioned step 103 is in current Testing the target device according to the target parameter value in the environment may include the following steps:
  • Step 1031 Set the device test parameters as default values, and test the target device in the current environment.
  • Step 1032 Set tREF as a preset tREF test value, and test the target device in the current environment.
  • the preset tREF test value may be 7.8 microseconds.
  • tREF can also be set to change back and forth between 7.8 microseconds and 15.6 microseconds according to a preset period.
  • Step 1033 Set tREF as the first preset tWR test value, and test the target device in the current environment.
  • the first preset tWR test value may be 8 nanoseconds or 10 nanoseconds.
  • the value of tWR can also be set to change back and forth between 8 nanoseconds and 10 nanoseconds according to a preset period.
  • Step 1034 Set tREF as the first preset VDD test value, and test the target device in the current environment.
  • the first preset VDD test value may be any value within the range of 1.2V ⁇ 10%.
  • Step 1035 Set tREF as the second preset VDD test value, and set tREF as the second preset VDD test value, and test the target device in the current environment.
  • the second preset VDD test value may be any value within the range of 1.2V ⁇ 10%; the second preset tWR test value may be 8 nanoseconds.
  • the fault detection rate of the target device can be further improved by setting the target parameter values of multiple device test parameters and performing multiple rounds of testing.
  • the manner of testing the target device in the current environment may include: in the current environment, running a target load program through the target device, so as to test the target device; wherein, the target load program includes Programs for operating systems and target business systems.
  • the test in the high-temperature and high-humidity environment in the related technology is the test in the Pre-OS (Pre Operating System, no operating system) mode, that is, the test is performed on equipment that does not deploy an operating system and business system. It is a simple test in a high temperature and high humidity environment through a fixed test program or code stream. This method is difficult to simulate the actual target load program, which will lead to failure to find problems during the test, but it is more prone to problems when the target load program is actually run, which leads to a high rate of undetected problems in the test.
  • Pre-OS Pre Operating System, no operating system
  • the target load program can be run by the target device in the current environment, and the target load program is a program including an operating system and a target business system.
  • the target load program is a program including an operating system and a target business system.
  • the program can carry out targeted tests, and it is easier to find problems in the actual operation of the equipment, thereby improving the accuracy of the target equipment test.
  • the way to test the target device in the current environment may include: in the current environment, run a memory read and write test program through the target device, so as to test the target device; wherein, the memory read and write The test program is used to repeatedly read and write to the target memory location in a preset order.
  • the memory reading and writing test program can be run in an environment without an operating system.
  • the memory reading and writing program can include:
  • the target device can be tested through the memory read and write test program when the operating system and the real business system are not deployed on the target device.
  • the target device is a target server; before acquiring the target parameter value corresponding to the test parameter of the device in the environment to be tested, the method may further include: according to the startup parameters of the target server, Determine the environment to be tested.
  • the startup parameters of the target server may include preset parameters of the motherboard BIOS (Basic Input Output System, Basic Input Output System) of the target server, and the preset parameters may be used to determine the environment to be tested.
  • the value of the preset parameter can be 1 to indicate that the environment to be tested is a high temperature and high humidity environment, a value of 2 indicates that the environment to be tested is a high temperature environment, a value of 3 indicates that the environment to be tested is a high humidity environment, and a value of 4 indicates that the environment to be tested is a high humidity environment.
  • the test environment is a low temperature environment.
  • the startup parameter of the target server may also include the pin voltage of the preset pin of the startup chip of the mainboard of the target server.
  • the preset pin can be one or more pins of the mainboard to start the chip. This pin voltage can be used to determine the environment to be tested.
  • the environment to be tested is determined through the startup parameters, which can realize automated testing and improve testing efficiency.
  • Fig. 3 is another device testing method shown according to an exemplary embodiment. As shown in Fig. 3, the method may include:
  • Step 301 the target device is turned on.
  • Step 302 the underlying platform components of the target device are initialized.
  • DDR SDRAM Double Data Rate Synchronous Dynamic Random Access Memory, double data rate synchronous dynamic random access memory
  • PCIe Peripheral Component Interconnect express, high-speed serial computer expansion bus standard
  • Step 303 acquiring the startup parameters of the target device, and determining the environment to be tested according to the startup parameters.
  • the startup parameter may be a preset parameter of the BIOS (Basic Input Output System) of the motherboard of the target server, or a pin voltage of a preset pin of a startup chip of the motherboard of the target server.
  • BIOS Basic Input Output System
  • Step 304 acquiring device test parameters corresponding to the target device.
  • Step 305 according to the environment to be tested, obtain the target parameter value corresponding to the test parameter of the device in the environment to be tested.
  • Step 306 Set the value of the device test parameter of the target device as the target parameter value.
  • Step 307 in the current environment, start the operating system in the target load program through the target device.
  • Step 308 in the current environment, run the target business system in the target load program through the target device to obtain the test result of the target device in the environment to be tested.
  • the device test parameters corresponding to the target device by obtaining the device test parameters corresponding to the target device; obtaining the target parameter value corresponding to the device test parameter in the environment to be tested; Test, to obtain the test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments.
  • simulating the device test under the environment to be tested such as a high temperature and high humidity environment
  • the same test effect as in the actual environment to be tested can be obtained, thereby more Efficiently discover equipment problems, reduce test costs, and improve test efficiency.
  • Fig. 4 is a block diagram of a device testing device according to an exemplary embodiment. As shown in Figure 4, the equipment testing device includes:
  • a test parameter acquisition module 401 configured to acquire device test parameters corresponding to the target device
  • a parameter value acquisition module 402 configured to acquire the corresponding target parameter value of the device test parameter in the environment to be tested;
  • a device testing module 403 configured to test the target device according to the target parameter value in the current environment, so as to obtain a test result of the target device in the environment to be tested, the current environment and the environment to be tested are different environments .
  • the environment to be tested includes a high-temperature and high-humidity environment
  • the high-temperature and high-humidity environment is a test environment in which the ambient temperature is greater than or equal to a preset temperature threshold and the ambient humidity is greater than or equal to a preset humidity threshold
  • the parameter value acquisition module 402 It is used to obtain the first target parameter value corresponding to the high temperature and high humidity environment according to the preset parameter environment correspondence relationship when the environment to be tested is the high temperature and high humidity environment; wherein the preset parameter environment correspondence relationship includes different The target parameter value of the device test parameter corresponding to the environment to be tested.
  • the device testing module 403 is configured to set the value of the device test parameter of the target device as the target parameter value; and test the target device in the current environment.
  • the device testing module 403 is configured to run a target load program through the target device in the current environment, so as to test the target device; wherein, the target load program is a program including an operating system and a target business system program.
  • Fig. 5 is a block diagram showing a device testing device according to an exemplary embodiment. As shown in Figure 5, the equipment testing device also includes:
  • the environment to be tested determination module 501 is configured to determine the environment to be tested according to the start parameters of the target server.
  • the startup parameters of the target server include preset parameters of the mainboard basic input and output system of the target server.
  • the startup parameters of the target server include pin voltages of preset pins of the startup chip of the mainboard of the target server.
  • FIG. 6 it shows a schematic structural diagram of an electronic device 600 suitable for implementing an embodiment of the present disclosure.
  • the terminal equipment in the embodiment of the present disclosure may include but not limited to such as mobile phone, notebook computer, digital broadcast receiver, PDA (personal digital assistant), PAD (tablet computer), PMP (portable multimedia player), vehicle terminal (such as mobile terminals such as car navigation terminals) and fixed terminals such as digital TVs, desktop computers and the like.
  • the electronic device shown in FIG. 6 is only an example, and should not limit the functions and application scope of the embodiments of the present disclosure.
  • an electronic device 600 may include a processing device (such as a central processing unit, a graphics processing unit, etc.) 601, which may be randomly accessed according to a program stored in a read-only memory (ROM) 602 or loaded from a storage device 608.
  • a processing device such as a central processing unit, a graphics processing unit, etc.
  • RAM memory
  • various appropriate actions and processes are executed by programs in the memory (RAM) 603 .
  • RAM 603 In the RAM 603, various programs and data necessary for the operation of the electronic device 600 are also stored.
  • the processing device 601 , ROM 602 and RAM 603 are connected to each other through a bus 604 .
  • An input/output (I/O) interface 605 is also connected to the bus 604 .
  • the following devices can be connected to the I/O interface 605: input devices 606 including, for example, a touch screen, touchpad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; including, for example, a liquid crystal display (LCD), speaker, vibration an output device 607 such as a computer; a storage device 608 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 609.
  • the communication means 609 may allow the electronic device 600 to communicate with other devices wirelessly or by wire to exchange data. While FIG. 6 shows electronic device 600 having various means, it should be understood that implementing or having all of the means shown is not a requirement. More or fewer means may alternatively be implemented or provided.
  • embodiments of the present disclosure include a computer program product, which includes a computer program carried on a non-transitory computer readable medium, where the computer program includes program code for executing the method shown in the flowchart.
  • the computer program may be downloaded and installed from a network via communication means 609 , or from storage means 608 , or from ROM 602 .
  • the processing device 601 When the computer program is executed by the processing device 601, the above-mentioned functions defined in the methods of the embodiments of the present disclosure are performed.
  • the above-mentioned computer-readable medium in the present disclosure may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two.
  • a computer readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to, electrical connections with one or more wires, portable computer diskettes, hard disks, random access memory (RAM), read-only memory (ROM), erasable Programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above.
  • a computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.
  • a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave carrying computer-readable program code therein. Such propagated data signals may take many forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing.
  • a computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which can transmit, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device .
  • Program code embodied on a computer readable medium may be transmitted by any appropriate medium, including but not limited to wires, optical cables, RF (radio frequency), etc., or any suitable combination of the above.
  • the client and the server can communicate using any currently known or future network protocols such as HTTP (HyperText Transfer Protocol, Hypertext Transfer Protocol), and can communicate with digital data in any form or medium
  • HTTP HyperText Transfer Protocol
  • the communication eg, communication network
  • Examples of communication networks include local area networks (“LANs”), wide area networks (“WANs”), internetworks (e.g., the Internet), and peer-to-peer networks (e.g., ad hoc peer-to-peer networks), as well as any currently known or future developed network of.
  • the above-mentioned computer-readable medium may be included in the above-mentioned electronic device; it may also exist independently without being incorporated into the electronic device.
  • the above-mentioned computer-readable medium carries one or more programs.
  • the electronic device executes the above-mentioned one or more programs.
  • the electronic device by obtaining the device test parameters corresponding to the target device; The corresponding target parameter value in the environment; then test the target device according to the target parameter value in the current environment, so as to obtain the test result of the target device in the environment to be tested.
  • the current environment and the environment to be tested are different environments.
  • Computer program code for carrying out operations of the present disclosure may be written in one or more programming languages, or combinations thereof, including but not limited to object-oriented programming languages—such as Java, Smalltalk, C++, and Includes conventional procedural programming languages - such as "C" or similar programming languages.
  • the program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server.
  • the remote computer may be connected to the user computer through any kind of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (for example, using an Internet service provider to connected via the Internet).
  • LAN local area network
  • WAN wide area network
  • Internet service provider for example, using an Internet service provider to connected via the Internet.
  • each block in a flowchart or block diagram may represent a module, program segment, or portion of code that contains one or more logical functions for implementing specified executable instructions.
  • the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved.
  • each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations can be implemented by a dedicated hardware-based system that performs the specified functions or operations , or may be implemented by a combination of dedicated hardware and computer instructions.
  • test parameter acquisition module may also be described as "a module for obtaining the device test parameters corresponding to the target device".
  • FPGAs Field Programmable Gate Arrays
  • ASICs Application Specific Integrated Circuits
  • ASSPs Application Specific Standard Products
  • SOCs System on Chips
  • CPLD Complex Programmable Logical device
  • a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device.
  • a machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium.
  • a machine-readable medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing.
  • machine-readable storage media would include one or more wire-based electrical connections, portable computer discs, hard drives, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM or flash memory), optical fiber, compact disk read only memory (CD-ROM), optical storage, magnetic storage, or any suitable combination of the foregoing.
  • RAM random access memory
  • ROM read only memory
  • EPROM or flash memory erasable programmable read only memory
  • CD-ROM compact disk read only memory
  • magnetic storage or any suitable combination of the foregoing.
  • Example 1 provides a device testing method, the method including:
  • the target device is tested according to the target parameter value in the current environment to obtain a test result of the target device in the environment to be tested, and the current environment is different from the environment to be tested.
  • Example 2 provides the method of Example 1, the environment to be tested includes a high-temperature and high-humidity environment, and the high-temperature and high-humidity environment is that the ambient temperature is greater than or equal to a preset temperature threshold and the ambient humidity is The test environment is greater than or equal to the preset humidity threshold; the acquisition of the target parameter value corresponding to the device test parameter in the environment to be tested includes:
  • the environment to be tested is the high temperature and high humidity environment
  • the preset parameter environment correspondence relationship obtain the first target parameter value corresponding to the high temperature and high humidity environment; wherein, the preset parameter environment correspondence relationship Target parameter values of device test parameters corresponding to different environments to be tested are included.
  • Example 3 provides the method of Example 1, the testing the target device according to the target parameter value in the current environment includes:
  • the target device is tested in the current environment.
  • Example 4 provides the method of Example 3, wherein the testing the target device in the current environment includes:
  • the target load program is run by the target device, so as to test the target device; wherein, the target load program is a program including an operating system and a target service system.
  • Example 5 provides the method described in any one of Example 1 to Example 4, wherein the target device is a target server; when acquiring the test parameters of the device in the environment to be tested Before the corresponding target parameter value, the method also includes:
  • the environment to be tested is determined according to the startup parameters of the target server.
  • Example 6 provides the method of Example 5, wherein the startup parameters of the target server include preset parameters of a mainboard basic input and output system of the target server.
  • Example 7 provides the method of Example 5, wherein the boot parameters of the target server include a pin voltage of a preset pin of a boot chip of a motherboard of the target server.
  • Example 8 provides an equipment testing device, the device comprising:
  • a test parameter acquisition module configured to acquire device test parameters corresponding to the target device
  • a parameter value acquisition module configured to acquire the target parameter value corresponding to the device test parameter in the environment to be tested
  • a device testing module configured to test the target device in the current environment according to the target parameter value, so as to obtain a test result of the target device in the environment to be tested, the current environment and the to-be-tested
  • the environments are different environments.
  • Example 9 provides a computer-readable medium on which a computer program is stored, and when the program is executed by a processing device, the steps of the methods described in Example 1 to Example 7 are implemented.
  • Example 10 provides an electronic device, including: a storage device, on which a computer program is stored; a processing device, configured to execute the computer program in the storage device, to Implement the steps of the method described in Example 1 to Example 7.

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Abstract

一种设备测试方法、装置、可读介质及电子设备。方法包括:通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。

Description

设备测试方法、装置、可读介质及电子设备
相关申请的交叉引用
本申请基于申请号为202111082941.0、申请日为2021年9月15日、名称为“设备测试方法、装置、可读介质及电子设备”的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及计算机技术领域,具体地,涉及一种设备测试方法、装置、可读介质及电子设备。
背景技术
随着互联网技术的发展进步,需要用到很多目标服务器向用户提供服务,为了保证目标服务器的可靠性和可用性,在目标服务器开发和生产的时候会做较多的压力测试。但是,在常规环境下对目标服务器进行压力测试后,在实际使用中还是会出现目标服务器的故障率较高的问题。为了能够通过压力测试更好的发现目标服务器的故障,可以在高温高湿环境下进行压力测试,高温高湿环境可以使有问题的模块更加容易的暴露问题。例如内存模块,在常规环境下很难发现问题,但在高温高湿环境下就会比较容易测试出问题。但是,在相关技术中,高温高湿环境的构造较为复杂,导致测试成本较高,测试效率低下。
发明内容
提供该发明内容部分以便以简要的形式介绍构思,这些构思将在后面的具体实施方式部分被详细描述。该发明内容部分并不旨在标识要求保护的技术方案的关键特征或必要特征,也不旨在用于限制所要求的保护的技术方案的范围。
第一方面,本公开提供了一种设备测试方法,所述方法包括:
获取目标设备对应的设备测试参数;
获取所述设备测试参数在待测试环境中对应的目标参数值;
在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备 在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
第二方面,本公开提供了一种设备测试装置,所述装置包括:
测试参数获取模块,用于获取目标设备对应的设备测试参数;
参数值获取模块,用于获取所述设备测试参数在待测试环境中对应的目标参数值;
设备测试模块,用于在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
第三方面,本公开提供一种计算机可读介质,其上存储有计算机程序,该程序被处理装置执行时实现本公开第一方面所述方法的步骤。
第四方面,本公开提供一种电子设备,包括:
存储装置,其上存储有计算机程序;
处理装置,用于执行所述存储装置中的所述计算机程序,以实现本公开第一方面所述方法的步骤。
采用上述技术方案,通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境(例如高温高湿环境)下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。
本公开的其他特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
结合附图并参考以下具体实施方式,本公开各实施例的上述和其他特征、优点及方面将变得更加明显。贯穿附图中,相同或相似的附图标记表示相同或相似的元素。应当理解附图是示意性的,原件和元素不一定按照比例绘制。在附图中:
图1是根据一示例性实施例示出的一种设备测试方法的流程图。
图2是根据图1所示实施例示出的一种S103步骤的流程图。
图3是根据一示例性实施例示出的另一种设备测试方法的流程图。
图4是根据一示例性实施例示出的一种设备测试装置的框图。
图5是根据一示例性实施例示出的另一种设备测试装置的框图。
图6是根据一示例性实施例示出的一种电子设备的框图。
具体实施方式
下面将参照附图更详细地描述本公开的实施例。虽然附图中显示了本公开的某些实施例,然而应当理解的是,本公开可以通过各种形式来实现,而且不应该被解释为限于这里阐述的实施例,相反提供这些实施例是为了更加透彻和完整地理解本公开。应当理解的是,本公开的附图及实施例仅用于示例性作用,并非用于限制本公开的保护范围。
应当理解,本公开的方法实施方式中记载的各个步骤可以按照不同的顺序执行,和/或并行执行。此外,方法实施方式可以包括附加的步骤和/或省略执行示出的步骤。本公开的范围在此方面不受限制。
本文使用的术语“包括”及其变形是开放性包括,即“包括但不限于”。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”;术语“另一实施例”表示“至少一个另外的实施例”;术语“一些实施例”表示“至少一些实施例”。其他术语的相关定义将在下文描述中给出。
需要注意,本公开中提及的“第一”、“第二”等概念仅用于对不同的装置、模块或单元进行区分,并非用于限定这些装置、模块或单元所执行的功能的顺序或者相互依存关系。
需要注意,本公开中提及的“一个”、“多个”的修饰是示意性而非限制性的,本领域技术人员应当理解,除非在上下文另有明确指出,否则应该理解为“一个或多个”。
本公开实施方式中的多个装置之间所交互的消息或者信息的名称仅用于说明性的目的,而并不是用于对这些消息或信息的范围进行限制。
首先,对本公开的应用场景进行说明。本公开可以应用于设备测试场景,例如目标服务器的压力测试。为了能够通过压力测试更好的发现设备故障,可以在高温高湿环境下进行压力测试,高温高湿环境可以使有问题的模块更加容易的暴露问题。例如目标服务器的内存模块,在常规环境下测试很难发现问题,但在高温高湿环境下测试就会比较容易测出问题。在相关技术中,为了进行高温高湿环境下的测试,需要构造专业的温湿度测试房,通过那个纸温湿度测试房的温度和湿度来构造高温高湿环境进行测试。该方法中,温湿度测试房的构造及温湿度控制较为复杂,一般需要专业的测试设备构造该测试环境,这样导致测试成本较高,测试效率低下。
为了解决上述问题,本公开提供了一种设备测试的方法、装置、可读介质及电子设备, 通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。
以下结合附图对本公开的具体实施方式进行详细说明。
图1是根据一示例性实施例示出的一种设备测试方法,如图1所示,该方法包括:
步骤101、获取目标设备对应的设备测试参数。
步骤102、获取该设备测试参数在待测试环境中对应的目标参数值。
步骤103、在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。
其中,该当前环境与该待测试环境为不同的环境。
示例地,该目标设备可以为目标服务器、终端或其他电子设备。该目标设备中可以包括处理器和存储器,处理器可以是CPU(Central Processing Unit,中央处理器)或GPU(Graphics Processing Unit,图像处理器),存储器可以是内存或硬盘;上述设备测试参数可以包括处理器或存储器的器件参数。例如,设备测试参数可以包括内存的刷新率、电压或其他参数。
进一步地,上述待测试环境可以为高温高湿环境、高温环境、高湿或低温环境等,上述当前环境可以为温度和湿度适中的常规环境。示例地,可以将温度为18到30摄氏度且湿度为30%至60%的测试环境作为常规环境。需要说明的是,在温度和湿度适中的常规。
采用上述方法,通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境(例如高温高湿环境)下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。
在本公开的另一实施例中,针对不同的待测试环境预先设置不同的目标参数值,具体可以包括以下方式中的任意一种:
方式一、该待测试环境包括高温高湿环境,该高温高湿环境为环境温度大于或等于预 设温度阈值且环境湿度大于或等于预设湿度阈值的测试环境。这样,可以在该待测试环境为该高温高湿环境的情况下,根据预设参数环境对应关系,获取该高温高湿环境对应的第一目标参数值;其中,该预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
示例地,上述预设温度阈值可以为40摄氏度、60摄氏度或85摄氏度,上述预设湿度阈值可以为60%、70%或85%;将环境温度大于或等于预设温度阈值且环境湿度大于或等于预设湿度阈值的测试环境作为该高温高湿环境。在上述目标设备包括内存的情况下,上述设备测试参数可以包括内存的tREF(Refresh Period,刷新周期)、tWR(Write Recovery Time,写恢复延时)、VDD(Voltage Drain-to-Drain,电源电压)。通过上述预设参数环境对应关系可以获取该高温环境下的设备测试参数的第一目标参数值包括:tREF=15.6微秒,tWR=10纳秒,VDD=1.2伏。
需要说明的是,上述第一目标参数值为举例,不同的设备类型对应的该预设参数环境对应关系可以不相同,例如,可以根据不同的内存型号预先设置不同的该预设参数环境对应关系。
这样,通过上述预设参数环境对应关系可以得到高温高湿环境对应的设备测试参数的目标参数值,在当前环境(例如常温环境)中按照该目标参数值对该目标设备进行测试,可以模拟高温高湿环境,从而得到该目标设备在该高温高湿环境中的测试结果,提高目标设备的故障检出率,也提高了测试效率。
方式二、该待测试环境可以包括高温环境,该高温环境为环境温度大于或等于预设温度阈值的测试环境。这样,可以在该待测试环境为该高温环境的情况下,可以根据预设参数环境对应关系,获取该高温环境对应的第二目标参数值;其中,该预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
同样地,上述预设温度阈值可以为40摄氏度、60摄氏度或85摄氏度;将大于或等于该预设温度阈值的环境作为高温环境。在上述目标设备包括内存的情况下,上述设备测试参数可以包括内存的tREF、tWR、VDD。通过上述预设参数环境对应关系可以获取该高温环境下的设备测试参数的第二目标参数值包括:tREF=7.8微秒,tWR=10纳秒,VDD=1.2伏。
需要说明的是,上述第二目标参数值为举例,不同的设备类型对应的该预设参数环境对应关系可以不相同,例如,可以根据不同的内存型号预先设置不同的该预设参数环境对应关系。
这样,通过上述预设参数环境对应关系可以得到高温环境对应的设备测试参数的目标参数值,在当前环境(常温环境)中按照该目标参数值对该目标设备进行测试,可以模拟高温环境,从而得到该目标设备在该高温环境中的测试结果,提高目标设备的故障检出率,也提高了测试效率。
方式二、该待测试环境可以包括高湿环境,该高湿环境为环境湿度大于或等于预设湿度阈值的测试环境。这样,在该待测试环境为该高湿环境的情况下,根据预设参数环境对应关系,获取该高湿环境对应的第三目标参数值;其中,该预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
示例地,上述预设湿度阈值可以为60%、70%或85%,可以将大于或等于该预设湿度阈值的环境作为高湿环境。在上述目标设备包括内存的情况下,通过上述预设参数环境对应关系可以获取该高湿环境下的设备测试参数的第三目标参数值包括:tREF=7.8微秒,tWR=10纳秒,VDD=1.21伏。
需要说明的是,上述第一目标参数值为举例,不同的设备类型对应的该预设参数环境对应关系可以不相同,例如,可以根据不同的内存型号预先设置不同的该预设参数环境对应关系。
这样,通过上述预设参数环境对应关系可以得到高湿环境对应的设备测试参数的目标参数值,在当前环境中按照该目标参数值对该目标设备进行测试,可以模拟高湿环境,从而得到该目标设备在该高湿环境中的测试结果,提高目标设备的故障检出率,也提高了测试效率。
在本公开的另一实施例中,上述步骤103在当前环境中按照该目标参数值对该目标设备进行测试可以包括以下步骤:
首先,将该目标设备的设备测试参数的值设置为该目标参数值。
然后,在当前环境中对该目标设备进行测试。
同样示例地,在上述目标设备包括内存的情况下,通过上述预设参数环境对应关系可以将内存的tREF设置为15.6微秒,tWR设置为10纳秒,VDD设置为1.2伏;然后在当前环境中对该目标设备进行测试。
这样,可以通过改变设备测试参数的值,模拟待测试环境,对目标设备进行测试,提高目标设备的故障检出率,也提高了测试效率。
进一步地,在该目标设备的设备测试参数为多个的情况下,可以依次将每个设备测试参数的目标参数值进行设置,并在当前环境中对该目标设备进行多次测试。
图2是根据图1所示实施例示出的一种S103步骤的流程图,如图2所示,在该目标设备的设备测试参数包括上述tREF、tWR和VDD的情况下,上述步骤103在当前环境中按照该目标参数值对该目标设备进行测试可以包括以下步骤:
步骤1031、将设备测试参数设置为默认值,在当前环境中对该目标设备进行测试。
步骤1032、将tREF设置为预设tREF测试值,在当前环境中对该目标设备进行测试。
示例地,该预设tREF测试值可以为7.8微秒。
进一步地,还可以将tREF的值设置为按照预设周期在7.8微秒和15.6微秒来回变化。
步骤1033、将tREF设置为第一预设tWR测试值,在当前环境中对该目标设备进行测试。
示例地,该第一预设tWR测试值可以为8纳秒或10纳秒。
同样的,也可以将tWR的值设置为按照预设周期在8纳秒和10纳秒来回变化。
步骤1034、将tREF设置为第一预设VDD测试值,在当前环境中对该目标设备进行测试。
示例地,该第一预设VDD测试值可以为1.2V±10%范围内的任意值。
步骤1035、将tREF设置为第二预设VDD测试值,并将tREF设置为第二预设VDD测试值,在当前环境中对该目标设备进行测试。
示例地,该第二预设VDD测试值可以为1.2V±10%范围内的任意值;该第二预设tWR测试值可以为8纳秒。
这样,通过设备多个设备测试参数的目标参数值,并进行多轮测试,可以进一步提高目标设备的故障检出率。
进一步地,在该当前环境中对该目标设备进行测试的方式可以包括:在该当前环境中,通过该目标设备运行目标负载程序,以便对该目标设备进行测试;其中,该目标负载程序为包括操作系统和目标业务系统的程序。
需要说明的是,相关技术中在高温高湿环境下的测试为Pre-OS(Pre Operating System,无操作系统)模式下的测试,也就是使用没有部署操作系统和业务系统的设备进行测试,仅仅是通过固定的测试程序或码流,在高温高湿环境进行简单测试。该方式难以模拟实际的目标负载程序,会导致测试时无法发现问题,但在实际运行目标负载程序时反而较容易出现问题,也就导致测试的问题漏检率较高。而采用本公开中的该方法,可以在当前环境中通过该目标设备运行目标负载程序,该目标负载程序为包括操作系统和目标业务系统的 程序,这样,通过运行实际的操作系统和目标业务系统程序,可以进行针对性的测试,更容易发现设备实际运行中的问题,从而提高了目标设备测试的准确性。
进一步地,在该当前环境中对该目标设备进行测试的方式可以包括:在该当前环境中,通过该目标设备运行内存读写测试程序,以便对该目标设备进行测试;其中,该内存读写测试程序用于按照预设顺序对目标内存位置进行反复读写操作。
该内存读写测试程序可以在无操作系统的环境下运行,示例地,该内存读写程序可以包括:
按照预设顺序对目标内存位置进行多次读写操作,通过将读取的数据与写入的数据进行对比,确定该内存位置是否故障。或者,
对目标内存位置及该目标内存位置的相邻位置进行多次读写操作,通过将读取的数据与写入的数据进行对比,确定该内存位置及相邻位置是否故障。
这样,在目标设备未部署操作系统和真实业务系统的情况下,可以通过内存读写测试程序,对目标设备进行测试。
在本公开的另一实施例中,该目标设备为目标服务器;在该获取该设备测试参数在待测试环境中对应的目标参数值之前,该方法还可以包括:根据该目标服务器的启动参数,确定该待测试环境。
其中,该目标服务器的启动参数可以包括该目标服务器的主板BIOS(Basic Input Output System,基础输入输出系统)的预设参数,该预设参数可以用于确定待测试环境。示例地,可以通过预设参数的值为1表征待测试环境为高温高湿环境,值为2表征待测试环境为高温环境,值为3表征待测试环境为高湿环境,值为4表征待测试环境为低温环境。
进一步地,该目标服务器的启动参数还可以包括该目标服务器的主板启动芯片的预设引脚的引脚电压。该预设引脚可以为主板启动芯片的一个或多个引脚。该引脚电压可以用于确定待测试环境。
这样,通过该启动参数确定待测试环境,可以实现自动化测试,提高测试效率。
图3是根据一示例性实施例示出的另一种设备测试方法,如图3所示,该方法可以包括:
步骤301、目标设备开机。
步骤302、目标设备底层平台组件初始化。
示例地,包括DDR SDRAM(Double Data Rate Synchronous Dynamic Random Access  Memory,双倍数据率同步动态随机存取存储器)、PCIe(Peripheral Component Interconnect express,高速串行计算机扩展总线标准)等各种平台组件的初始化。
步骤303、获取目标设备的启动参数,根据该启动参数确定待测试环境。
示例地,该启动参数可以是目标服务器的主板BIOS(Basic Input Output System,基础输入输出系统)的预设参数,或者,目标服务器的主板启动芯片的预设引脚的引脚电压。
步骤304、获取目标设备对应的设备测试参数。
步骤305、根据待测试环境,获取该设备测试参数在待测试环境中对应的目标参数值。
步骤306、将该目标设备的设备测试参数的值设置为该目标参数值。
步骤307、在当前环境中,通过目标设备启动目标负载程序中的操作系统。
步骤308、在当前环境中,通过目标设备运行目标负载程序中的目标业务系统,以得到该目标设备在该待测试环境中的测试结果。
综上所述,采用上述方案,通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境(例如高温高湿环境)下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。
图4是根据一示例性实施例示出的一种设备测试装置的框图。如图4所示,该设备测试装置包括:
测试参数获取模块401,用于获取目标设备对应的设备测试参数;
参数值获取模块402,用于获取该设备测试参数在待测试环境中对应的目标参数值;
设备测试模块403,用于在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果,该当前环境与该待测试环境为不同的环境。
可选地,该待测试环境包括高温高湿环境,该高温高湿环境为环境温度大于或等于预设温度阈值且环境湿度大于或等于预设湿度阈值的测试环境;该参数值获取模块402,用于在该待测试环境为该高温高湿环境的情况下,根据预设参数环境对应关系,获取该高温高湿环境对应的第一目标参数值;其中,该预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
可选地,该设备测试模块403,用于将该目标设备的设备测试参数的值设置为该目标参数值;在该当前环境中对该目标设备进行测试。
可选地,该设备测试模块403,用于在该当前环境中,通过该目标设备运行目标负载程序,以便对该目标设备进行测试;其中,该目标负载程序为包括操作系统和目标业务系统的程序。
图5是根据一示例性实施例示出的一种设备测试装置的框图。如图5所示,该设备测试装置还包括:
待测试环境确定模块501,用于根据该目标服务器的启动参数,确定该待测试环境。
可选地,该目标服务器的启动参数包括该目标服务器的主板基础输入输出系统的预设参数。
可选地,该目标服务器的启动参数包括该目标服务器的主板启动芯片的预设引脚的引脚电压。
采用上述装置,可以通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。这样,可以通过在当前的常规环境设置设备测试参数的目标参数值,模拟待测试环境下的设备测试,得到与在实际的待测试环境中相同的测试效果,从而更加高效的发现设备问题,降低了测试成本,也提高了测试效率。
下面参考图6,其示出了适于用来实现本公开实施例的电子设备600的结构示意图。本公开实施例中的终端设备可以包括但不限于诸如移动电话、笔记本电脑、数字广播接收器、PDA(个人数字助理)、PAD(平板电脑)、PMP(便携式多媒体播放器)、车载终端(例如车载导航终端)等等的移动终端以及诸如数字TV、台式计算机等等的固定终端。图6示出的电子设备仅仅是一个示例,不应对本公开实施例的功能和使用范围带来任何限制。
如图6所示,电子设备600可以包括处理装置(例如中央处理器、图形处理器等)601,其可以根据存储在只读存储器(ROM)602中的程序或者从存储装置608加载到随机访问存储器(RAM)603中的程序而执行各种适当的动作和处理。在RAM603中,还存储有电子设备600操作所需的各种程序和数据。处理装置601、ROM602以及RAM603通过总线604彼此相连。输入/输出(I/O)接口605也连接至总线604。
通常,以下装置可以连接至I/O接口605:包括例如触摸屏、触摸板、键盘、鼠标、摄像头、麦克风、加速度计、陀螺仪等的输入装置606;包括例如液晶显示器(LCD)、扬声器、振动器等的输出装置607;包括例如磁带、硬盘等的存储装置608;以及通信装 置609。通信装置609可以允许电子设备600与其他设备进行无线或有线通信以交换数据。虽然图6示出了具有各种装置的电子设备600,但是应理解的是,并不要求实施或具备所有示出的装置。可以替代地实施或具备更多或更少的装置。
特别地,根据本公开的实施例,上文参考流程图描述的过程可以被实现为计算机软件程序。例如,本公开的实施例包括一种计算机程序产品,其包括承载在非暂态计算机可读介质上的计算机程序,该计算机程序包含用于执行流程图所示的方法的程序代码。在这样的实施例中,该计算机程序可以通过通信装置609从网络上被下载和安装,或者从存储装置608被安装,或者从ROM602被安装。在该计算机程序被处理装置601执行时,执行本公开实施例的方法中限定的上述功能。
需要说明的是,本公开上述的计算机可读介质可以是计算机可读信号介质或者计算机可读存储介质或者是上述两者的任意组合。计算机可读存储介质例如可以是——但不限于——电、磁、光、电磁、红外线、或半导体的系统、装置或器件,或者任意以上的组合。计算机可读存储介质的更具体的例子可以包括但不限于:具有一个或多个导线的电连接、便携式计算机磁盘、硬盘、随机访问存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑磁盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。在本公开中,计算机可读存储介质可以是任何包含或存储程序的有形介质,该程序可以被指令执行系统、装置或者器件使用或者与其结合使用。而在本公开中,计算机可读信号介质可以包括在基带中或者作为载波一部分传播的数据信号,其中承载了计算机可读的程序代码。这种传播的数据信号可以采用多种形式,包括但不限于电磁信号、光信号或上述的任意合适的组合。计算机可读信号介质还可以是计算机可读存储介质以外的任何计算机可读介质,该计算机可读信号介质可以发送、传播或者传输用于由指令执行系统、装置或者器件使用或者与其结合使用的程序。计算机可读介质上包含的程序代码可以用任何适当的介质传输,包括但不限于:电线、光缆、RF(射频)等等,或者上述的任意合适的组合。
在一些实施方式中,客户端、服务器可以利用诸如HTTP(HyperText Transfer Protocol,超文本传输协议)之类的任何当前已知或未来研发的网络协议进行通信,并且可以与任意形式或介质的数字数据通信(例如,通信网络)互连。通信网络的示例包括局域网(“LAN”),广域网(“WAN”),网际网(例如,互联网)以及端对端网络(例如,ad hoc端对端网络),以及任何当前已知或未来研发的网络。
上述计算机可读介质可以是上述电子设备中所包含的;也可以是单独存在,而未装配 入该电子设备中。
上述计算机可读介质承载有一个或者多个程序,当上述一个或者多个程序被该电子设备执行时,使得该电子设备:通过获取目标设备对应的设备测试参数;获取该设备测试参数在待测试环境中对应的目标参数值;然后在当前环境中按照该目标参数值对该目标设备进行测试,以得到该目标设备在该待测试环境中的测试结果。其中,该当前环境与该待测试环境为不同的环境。
可以以一种或多种程序设计语言或其组合来编写用于执行本公开的操作的计算机程序代码,上述程序设计语言包括但不限于面向对象的程序设计语言—诸如Java、Smalltalk、C++,还包括常规的过程式程序设计语言——诸如“C”语言或类似的程序设计语言。程序代码可以完全地在用户计算机上执行、部分地在用户计算机上执行、作为一个独立的软件包执行、部分在用户计算机上部分在远程计算机上执行、或者完全在远程计算机或服务器上执行。在涉及远程计算机的情形中,远程计算机可以通过任意种类的网络——包括局域网(LAN)或广域网(WAN)——连接到用户计算机,或者,可以连接到外部计算机(例如利用因特网服务提供商来通过因特网连接)。
附图中的流程图和框图,图示了按照本公开各种实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上,流程图或框图中的每个方框可以代表一个模块、程序段、或代码的一部分,该模块、程序段、或代码的一部分包含一个或多个用于实现规定的逻辑功能的可执行指令。也应当注意,在有些作为替换的实现中,方框中所标注的功能也可以以不同于附图中所标注的顺序发生。例如,两个接连地表示的方框实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这依所涉及的功能而定。也要注意的是,框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合,可以用执行规定的功能或操作的专用的基于硬件的系统来实现,或者可以用专用硬件与计算机指令的组合来实现。
描述于本公开实施例中所涉及到的模块可以通过软件的方式实现,也可以通过硬件的方式来实现。其中,模块的名称在某种情况下并不构成对该模块本身的限定,例如,测试参数获取模块还可以被描述为“获取目标设备对应的设备测试参数的模块”。
本文中以上描述的功能可以至少部分地由一个或多个硬件逻辑部件来执行。例如,非限制性地,可以使用的示范类型的硬件逻辑部件包括:现场可编程门阵列(FPGA)、专用集成电路(ASIC)、专用标准产品(ASSP)、片上系统(SOC)、复杂可编程逻辑设备(CPLD)等等。
在本公开的上下文中,机器可读介质可以是有形的介质,其可以包含或存储以供指令执行系统、装置或设备使用或与指令执行系统、装置或设备结合地使用的程序。机器可读介质可以是机器可读信号介质或机器可读储存介质。机器可读介质可以包括但不限于电子的、磁性的、光学的、电磁的、红外的、或半导体系统、装置或设备,或者上述内容的任何合适组合。机器可读存储介质的更具体示例会包括基于一个或多个线的电气连接、便携式计算机盘、硬盘、随机存取存储器(RAM)、只读存储器(ROM)、可擦除可编程只读存储器(EPROM或快闪存储器)、光纤、便捷式紧凑盘只读存储器(CD-ROM)、光学储存设备、磁储存设备、或上述内容的任何合适组合。
根据本公开的一个或多个实施例,示例1提供了一种设备测试方法,所述方法包括:
获取目标设备对应的设备测试参数;
获取所述设备测试参数在待测试环境中对应的目标参数值;
在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
根据本公开的一个或多个实施例,示例2提供了示例1的方法,所述待测试环境包括高温高湿环境,所述高温高湿环境为环境温度大于或等于预设温度阈值且环境湿度大于或等于预设湿度阈值的测试环境;所述获取所述设备测试参数在待测试环境中对应的目标参数值包括:
在所述待测试环境为所述高温高湿环境的情况下,根据预设参数环境对应关系,获取所述高温高湿环境对应的第一目标参数值;其中,所述预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
根据本公开的一个或多个实施例,示例3提供了示例1的方法,所述在当前环境中按照所述目标参数值对所述目标设备进行测试包括:
将所述目标设备的设备测试参数的值设置为所述目标参数值;
在所述当前环境中对所述目标设备进行测试。
根据本公开的一个或多个实施例,示例4提供了示例3的方法,所述在所述当前环境中对所述目标设备进行测试包括:
在所述当前环境中,通过所述目标设备运行目标负载程序,以便对所述目标设备进行测试;其中,所述目标负载程序为包括操作系统和目标业务系统的程序。
根据本公开的一个或多个实施例,示例5提供了示例1至示例4中任一项所述的方法,所述目标设备为目标服务器;在所述获取所述设备测试参数在待测试环境中对应的目 标参数值之前,所述方法还包括:
根据所述目标服务器的启动参数,确定所述待测试环境。
根据本公开的一个或多个实施例,示例6提供了示例5的方法,所述目标服务器的启动参数包括所述目标服务器的主板基础输入输出系统的预设参数。
根据本公开的一个或多个实施例,示例7提供了示例5的方法,所述目标服务器的启动参数包括所述目标服务器的主板启动芯片的预设引脚的引脚电压。
根据本公开的一个或多个实施例,示例8提供了一种设备测试装置,所述装置包括:
测试参数获取模块,用于获取目标设备对应的设备测试参数;
参数值获取模块,用于获取所述设备测试参数在待测试环境中对应的目标参数值;
设备测试模块,用于在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
根据本公开的一个或多个实施例,示例9提供了一种计算机可读介质,其上存储有计算机程序,该程序被处理装置执行时实现示例1至示例7中所述方法的步骤。
根据本公开的一个或多个实施例,示例10提供了一种电子设备,包括:存储装置,其上存储有计算机程序;处理装置,用于执行所述存储装置中的所述计算机程序,以实现示例1至示例7中所述方法的步骤。
以上描述仅为本公开的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解,本公开中所涉及的公开范围,并不限于上述技术特征的特定组合而成的技术方案,同时也应涵盖在不脱离上述公开构思的情况下,由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本公开中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。
此外,虽然采用特定次序描绘了各操作,但是这不应当理解为要求这些操作以所示出的特定次序或以顺序次序执行来执行。在一定环境下,多任务和并行处理可能是有利的。同样地,虽然在上面论述中包含了若干具体实现细节,但是这些不应当被解释为对本公开的范围的限制。在单独的实施例的上下文中描述的某些特征还可以组合地实现在单个实施例中。相反地,在单个实施例的上下文中描述的各种特征也可以单独地或以任何合适的子组合的方式实现在多个实施例中。
尽管已经采用特定于结构特征和/或方法逻辑动作的语言描述了本主题,但是应当理解所附权利要求书中所限定的主题未必局限于上面描述的特定特征或动作。相反,上面所 描述的特定特征和动作仅仅是实现权利要求书的示例形式。关于上述实施例中的装置,其中各个模块执行操作的具体方式已经在有关该方法的实施例中进行了详细描述,此处将不做详细阐述说明。

Claims (10)

  1. 一种设备测试方法,其特征在于,所述方法包括:
    获取目标设备对应的设备测试参数;
    获取所述设备测试参数在待测试环境中对应的目标参数值;
    在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
  2. 根据权利要求1所述的方法,其特征在于,所述待测试环境包括高温高湿环境,所述高温高湿环境为环境温度大于或等于预设温度阈值且环境湿度大于或等于预设湿度阈值的测试环境;所述获取所述设备测试参数在待测试环境中对应的目标参数值包括:
    在所述待测试环境为所述高温高湿环境的情况下,根据预设参数环境对应关系,获取所述高温高湿环境对应的第一目标参数值;其中,所述预设参数环境对应关系包括不同的待测试环境对应的设备测试参数的目标参数值。
  3. 根据权利要求1所述的方法,其特征在于,所述在当前环境中按照所述目标参数值对所述目标设备进行测试包括:
    将所述目标设备的设备测试参数的值设置为所述目标参数值;
    在所述当前环境中对所述目标设备进行测试。
  4. 根据权利要求3所述的方法,其特征在于,所述在所述当前环境中对所述目标设备进行测试包括:
    在所述当前环境中,通过所述目标设备运行目标负载程序,以便对所述目标设备进行测试;其中,所述目标负载程序为包括操作系统和目标业务系统的程序。
  5. 根据权利要求1至4中任一项所述的方法,其特征在于,所述目标设备为目标服务器;在所述获取所述设备测试参数在待测试环境中对应的目标参数值之前,所述方法还包括:
    根据所述目标服务器的启动参数,确定所述待测试环境。
  6. 根据权利要求5所述的方法,其特征在于,所述目标服务器的启动参数包括所述目标服务器的主板基础输入输出系统的预设参数。
  7. 根据权利要求5所述的方法,其特征在于,所述目标服务器的启动参数包括所述目标服务器的主板启动芯片的预设引脚的引脚电压。
  8. 一种设备测试装置,其特征在于,所述装置包括:
    测试参数获取模块,用于获取目标设备对应的设备测试参数;
    参数值获取模块,用于获取所述设备测试参数在待测试环境中对应的目标参数值;
    设备测试模块,用于在当前环境中按照所述目标参数值对所述目标设备进行测试,以得到所述目标设备在所述待测试环境中的测试结果,所述当前环境与所述待测试环境为不同的环境。
  9. 一种计算机可读介质,其上存储有计算机程序,其特征在于,该程序被处理装置执行时实现权利要求1至7中任一项所述方法的步骤。
  10. 一种电子设备,其特征在于,包括:
    存储装置,其上存储有计算机程序;
    处理装置,用于执行所述存储装置中的所述计算机程序,以实现权利要求1至7中任一项所述方法的步骤。
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