WO2023035395A1

WO2023035395A1 - Machining apparatus having multiple pulse width laser, and method

Info

Publication number: WO2023035395A1
Application number: PCT/CN2021/129349
Authority: WO
Inventors: 王成勇; 王军; 杜策之; 郑李娟
Original assignee: 广东工业大学
Priority date: 2021-09-10
Filing date: 2021-11-08
Publication date: 2023-03-16
Also published as: CN113814560A; CN113814560B

Abstract

The present application relates to a machining apparatus having a multiple pulse width laser, and a method. The apparatus comprises: a multiple pulse width laser output assembly, a jet nozzle, an ultrasonic vibration assembly, a machining platform, and a controller; the controller is separately electrically connected to the multiple pulse width laser output assembly, the jet nozzle, and the ultrasonic vibration assembly; the machining platform is used for placement of a workpiece to be machined; the multiple pulse width laser output assembly is arranged above a material placement surface of the machining platform; the multiple pulse width laser output assembly comprises: a first laser emission device, a second laser emission device, and a beam coupling device; the beam coupling device is used for coupling lasers emitted by the first laser emission device and the second laser emission device and forming a laser beam of a common path; the jet nozzle is arranged at a side of the machining platform, and the jet nozzle faces the machining platform; the ultrasonic vibration assembly is arranged below the material placement surface of the machining platform and drives the machining platform to vibrate by means of ultrasonic waves. A solution provided in the present application can achieve highly efficient and damage-free machining.

Description

Multi-pulse width laser processing device and method

technical field

The present application relates to the technical field of laser processing, in particular to a multi-pulse width laser processing device and method.

Background technique

With the rapid development of 3C electronics, automobiles, moulds, energy and aerospace and other fields, in the face of major demands for chips, high-frequency circuit boards, aero-engines, medical equipment and materials and parts processing tools in various industries, monocrystalline silicon, ultra- High value-added hard and brittle materials such as hard ceramics and polycrystalline diamond are widely used, and the market's requirements for processing quality and processing efficiency continue to increase, especially for non-damage processing. Polycrystalline diamond tools with special edge structure and rake surface microstructure can significantly improve the machining accuracy of materials and reduce the thermal impact of processing. However, large-scale mass production of polycrystalline diamond tools with special structures requires high-efficiency and high-precision processing equipment and process support. Knives are expensive to produce.

Therefore, in related technologies, non-contact processing techniques, such as ion beam, electric spark, laser, etc., are used for material processing. It is difficult to achieve efficient and damage-free processing. For example, ultrashort pulse laser can significantly reduce the processing heat affected zone of hard and brittle materials, but it still has heat accumulation phenomenon during high frequency pulse processing, while low frequency pulse processing efficiency is too low to meet the requirements of efficient processing. Therefore, it is still difficult to balance the relationship between processing efficiency and thermal influence in the existing technology to achieve efficient and damage-free processing.

Contents of the invention

In order to overcome the problems existing in related technologies, the present application provides a multi-pulse width laser processing device and method, which can balance the relationship between processing efficiency and thermal influence, and realize efficient and damage-free processing.

The first aspect of the present application provides a multi-pulse width laser processing device, including:

Multi-pulse width laser output component 10, jet nozzle 20, ultrasonic vibration component 30, processing platform 40 and controller 50;

The controller 50 is electrically connected to the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30 respectively;

The processing platform 40 is used to place the workpiece 60 to be processed; the multi-pulse width laser output assembly 10 is arranged above the object surface of the processing platform 40; the multi-pulse width laser output assembly 10 includes: a first laser emitter 101. The second laser transmitter 102 and the beam coupling device 103; the beam coupling device 103 is used to couple the laser light emitted by the first laser transmitter 101 and the second laser transmitter 102 to form a common laser beam bundle;

The jet nozzle 20 is arranged on the side of the processing platform 40, and the jet nozzle 20 faces the processing platform 40;

The ultrasonic vibration assembly 30 is arranged under the storage surface of the processing platform 40 , and drives the processing platform 40 to vibrate through ultrasonic waves.

In one embodiment, the value range of the included angle between the central axis of the jet nozzle 20 and the processing platform 40 is 10° to 85°; the pressure range of the jet generated by the jet nozzle 20 is 10MPa to 50Mpa, the distance between the incident point and the action point of the common laser beam is less than 30mm.

In one embodiment, the vibration direction of the ultrasonic vibration component 30 is adjustable; the ultrasonic vibration frequency of the ultrasonic vibration component 30 is greater than 20 kHz, and the amplitude is greater than 2 μm.

In one implementation manner, the beam coupling device 103 includes: a dichroic prism.

The second aspect of the present application provides a multi-pulse width laser processing method, which is realized based on the multi-pulse width laser processing device described in any one of the above, including:

Obtain the fracture toughness parameters of the workpiece to be processed;

According to the comparison result of the fracture toughness parameter and the fracture toughness threshold, the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are set;

The multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are turned on for a preset processing time, and the processing is completed.

In one embodiment, the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are set according to the comparison result of the fracture toughness parameter and the fracture toughness threshold, including:

Judging whether the fracture toughness parameter is less than the fracture toughness threshold, if so, setting the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component according to the first processing strategy;

If not, obtain the workpiece thickness of the workpiece to be processed, judge whether the workpiece thickness is less than the thickness threshold, and if so, perform the multi-pulse width laser output assembly, the jet nozzle and the ultrasonic wave according to the second processing strategy. The vibration component is set;

If not, the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are set according to a third processing strategy.

In one embodiment, the fracture toughness threshold is 4 MPa/m ² ; the thickness threshold is 500 μm.

In one embodiment, the first processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, so The value range of the pulse width of the second laser emitter is 10fs to 500fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 10μs to 200μs; the jet nozzle The value range of the included angle between the central axis and the processing platform is 10° to 50°, the pressure range of the jet flow generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz , the amplitude is greater than 3 μm, and the ultrasonic vibrating component vibrates in concert in two directions.

In one embodiment, the second processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter is less than 10 ps, and the second laser emitter The pulse width is less than 500fs, and the laser emission interval of the first laser emitter and the second laser emitter ranges from 100μs to 1ms; the angle between the central axis of the jet nozzle and the processing platform The value range is 10° to 50°, the pressure range of the jet generated by the jet nozzle is 10MPa to 30Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 20kHz, and the amplitude is greater than 3 μm. vibrate in one direction.

In one embodiment, the third processing strategy includes: the power of the multi-pulse width laser output component is greater than 20W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, so The value range of the pulse width of the second laser emitter is 10fs to 500fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 1 μs to 100 μs; the jet nozzle The value range of the included angle between the central axis and the processing platform is 50° to 80°, the pressure range of the jet flow generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz , the amplitude is greater than 5 μm, and the ultrasonic vibration component vibrates in concert along three directions.

The technical solution provided by this application may include the following beneficial effects:

The application provides a multi-pulse width laser processing device, which includes a multi-pulse width laser output assembly, a jet nozzle, an ultrasonic vibration assembly, a processing platform, and a controller; The ultrasonic vibration component is electrically connected, because the multi-pulse width laser output component includes a first laser emitter, a second laser emitter and a beam coupling device, and the beam coupling device can combine the laser light emitted by the first laser emitter and the second laser emitter Coupling to form a common laser beam, so that under the control of the controller, the first laser emitter and the second laser emitter can respectively output laser pulses with different pulse widths at a certain interval to the workpiece to be processed on the processing platform. Processing is performed at the same position, and laser pulses with different pulse widths are used to process alternately to prevent excessive heat-affected areas caused by continuous high-frequency processing; at the same time, the controller controls the jet nozzle to spray water jets from the side of the processing platform towards the workpiece to be processed. Under the impact of the water jet, the workpiece to be processed is further processed, and a part of the heat generated by the processing is taken away by the water flow to reduce the thermal damage of the processing. Detach from the top to improve processing efficiency.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Description of drawings

The above and other objects, features and advantages of the present application will become more apparent by describing the exemplary embodiments of the present application in more detail with reference to the accompanying drawings, wherein, in the exemplary embodiments of the present application, the same reference numerals generally represent same parts.

Fig. 1 is a schematic structural diagram of a multi-pulse width laser processing device shown in an embodiment of the present application;

2 is a schematic flow diagram of a multi-pulse width laser processing method shown in an embodiment of the present application;

Fig. 3 is another schematic flowchart of the multi-pulse width laser processing method shown in the embodiment of the present application.

Detailed ways

Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of this application to those skilled in the art.

The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms "first", "second", "third" and so on may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of the present application, first information may also be called second information, and similarly, second information may also be called first information. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

Embodiment one

In related technologies, non-contact processing techniques, such as ion beams, electric sparks, lasers, etc., are used for material processing. Although this processing technology has good processing accuracy and processing efficiency, it still has a large heat-affected zone. It is difficult to achieve efficient and damage-free processing. For example, ultrashort pulse laser can significantly reduce the processing heat affected zone of hard and brittle materials, but it still has heat accumulation phenomenon during high frequency pulse processing, while low frequency pulse processing efficiency is too low to meet the requirements of efficient processing.

In view of the above problems, the embodiment of the present application provides a multi-pulse width laser processing device, which can balance the relationship between processing efficiency and thermal influence, and realize efficient and damage-free processing.

The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a multi-pulse width laser processing device shown in an embodiment of the present application.

Referring to Fig. 1, the multi-pulse width laser processing device includes:

Wherein, the controller 50 is electrically connected to the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30 respectively, and controls the pulses output by the multi-pulse width laser output assembly 10 according to the processing instructions, and the water jet formed by the jet nozzle 20 pressure, incident angle and incident point position, and the vibration frequency and amplitude of the ultrasonic vibrating component 30 .

In the embodiment of the present application, the controller 50 sets the working parameters of the above-mentioned multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30, and can adjust each working parameter according to the material characteristics of the workpiece to be processed, so that Process it with a set of processing schemes that match the material characteristics of the workpiece to be processed, and then complete efficient processing without damaging the workpiece to be processed.

The processing platform 40 is used to place the workpiece 60 to be processed; the multi-pulse width laser output assembly 10 is arranged above the storage surface of the processing platform 40;

The multi-pulse width laser output assembly 10 includes: a first laser emitter 101, a second laser emitter 102 and a beam coupling device 103; the beam coupling device 103 is used to connect the first laser emitter 101 and the The laser emitted by the second laser transmitter 102 is coupled to form a common path laser beam;

In the embodiment of the present application, the beam coupling device 103 includes: a dichroic prism. The dichroic prism can adjust the direction of propagation of the laser light emitted by the laser emitter, for example, the first laser emitter and the second laser emitter are set at 90°, so that the laser light emitted by the first laser emitter and the second laser emitter are mutually Vertically, by setting the dichroic prism, the propagation path of the laser light emitted by the first laser emitter is bent by 90°, so that the laser light emitted by the first laser emitter and the second laser emitter propagate along the same path, forming a common road laser beam.

In the embodiment of the present application, the first laser emitter and the second laser emitter are laser emitters with different pulse widths. In practical applications, both the first laser emitter and the second laser emitter can be picosecond lasers Any one of transmitters, femtosecond laser transmitters and nanosecond laser transmitters, and the pulse width of the laser generated by the first laser transmitter and the second laser transmitter is adjustable.

It should be noted that the above description of the first laser emitter and the second laser emitter is only an example in the embodiment of the present application, and in practical applications, the first laser emitter and the second laser emitter can also be The microsecond laser emitters, that is, the selection of the first laser emitter and the second laser emitter does not constitute the only limitation to the present application.

Further, in order to prevent the position of the workpiece to be processed from shifting under impact during processing, a limit structure can be set on the processing platform, including but not limited to: suction cups or adjustable limit blocks; wherein, the suction cups use atmospheric pressure to move the workpiece to be processed The workpiece is adsorbed on the processing platform; the adjustable limit block can adjust its position according to the size of the workpiece to be processed, thereby limiting the movement of the workpiece to be processed, and achieving the effect of fixing the workpiece to be processed on the processing platform.

In the embodiment of the present application, the jet nozzle 20 sprays water jets under the control of the controller 50. Since the water jets have a certain pressure, after the area to be processed of the workpiece 60 to be processed is softened by the laser, the water jets can further refine the area to be processed. Processing, expand the processing degree of the area to be processed, and then remove the processing debris generated by low-frequency laser.

In the embodiment of the present application, the ultrasonic wave generated by the ultrasonic vibration component is used to drive the processing platform to vibrate at high frequency, and then the processing debris attached to the surface of the workpiece to be processed is vibrated and removed, so as not to affect the processing effect of laser and water jet.

In the embodiment of the present application, the direction of the ultrasonic vibration component is adjustable; for example, the plane where the processing platform is located is used as the plane formed by the x-axis and the z-axis, and the direction perpendicular to the processing platform is used as the y-axis direction to establish a three-dimensional coordinate system, The ultrasonic vibration component can generate ultrasonic waves propagating along one or more directions of x-axis, y-axis and z-axis, so that the processing platform can vibrate along any one or more directions.

In the embodiment of the present application, the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 20 kHz, and the amplitude is greater than 2 μm; the specific values of the ultrasonic vibration frequency and amplitude can be adjusted according to actual conditions, and are not limited here.

The embodiment of the present application provides a multi-pulse width laser processing device, which includes a multi-pulse width laser output assembly, a jet nozzle, an ultrasonic vibration assembly, a processing platform, and a controller; The nozzle is electrically connected to the ultrasonic vibrating assembly. Since the multi-pulse width laser output assembly includes a first laser emitter, a second laser emitter and a beam coupling device, the beam coupling device can transmit the first laser emitter and the second laser emitter. The lasers are coupled to form a common laser beam, so that under the control of the controller, the first laser emitter and the second laser emitter can respectively output laser pulses with different pulse widths to the processing platform on the processing platform. The same position of the workpiece is processed, and laser pulses with different pulse widths are used to process alternately to prevent the heat-affected area from being too large due to continuous high-frequency processing; at the same time, the controller controls the jet nozzle to spray water jets from the side of the processing platform towards the workpiece to be processed , under the impact of the water jet, the workpiece to be processed is further processed, and a part of the heat generated by the processing is taken away by the water flow to reduce the thermal damage of the processing. The processing workpiece is detached to improve processing efficiency.

Embodiment two

Although the laser processing technology has good processing accuracy and processing efficiency, it still has the problem of a large processing heat-affected zone. In order to reduce the heat impact brought by the processing technology, it is often necessary to sacrifice processing efficiency and reduce the laser frequency. Not only can the water flow reduce the heat impact of processing, but also the high-pressure water jet has a certain processing capacity. Therefore, the embodiment of the present application is based on the multi-pulse width laser processing device shown in the first embodiment above, and the working parameters of the jet nozzle are adjusted. The design makes it possible to perform secondary processing on the workpiece to be processed while reducing the heat impact of processing.

The multi-pulse width laser processing device shown in the embodiment of the present application includes:

The controller 50 is electrically connected to the multi-pulse width laser output assembly 10, the jet nozzle 20 and the ultrasonic vibration assembly 30 respectively; the processing platform 40 is used to place the workpiece 60 to be processed; the multi-pulse width The laser output assembly 10 is arranged above the storage surface of the processing platform 40; the multi-pulse width laser output assembly 10 includes: a first laser emitter 101, a second laser emitter 102 and a beam coupling device 103; the beam coupling The device 103 is used to couple the laser light emitted by the first laser emitter 101 and the second laser emitter 102 to form a common laser beam; the ultrasonic vibration assembly 30 is arranged on the object surface of the processing platform 40 Below, the processing platform 40 is driven to vibrate by ultrasonic waves;

The jet nozzle 20 is arranged on the side of the processing platform 40, and the jet nozzle faces the processing platform; wherein, the value range of the angle between the central axis of the jet nozzle and the processing platform is 10° to 85°; the pressure range of the jet generated by the jet nozzle is 10MPa to 50Mpa, and the distance between the incident point and the action point of the common laser beam is less than 30mm.

In the embodiment of the present application, the value range of the angle between the central axis of the jet nozzle and the processing platform is 10° to 85°, which is the value range of the angle between the water jet formed by the jet nozzle and the processing platform 10° to 85°, preferably, the value range of the included angle between the central axis of the jet nozzle and the processing platform is 60°.

In the embodiment of the present application, the controller controls the water jet formed by the jet nozzle to be in a high pressure state of 10 MPa to 50 MPa. After the workpiece to be processed is processed by laser, the processing area of the workpiece to be processed is in a softened state, and the impact of the high-pressure water jet expands the damage, and then completes the processing. Since the laser frequency requirement for softening the workpiece to be processed is low, it will not If the heat-affected zone is too large, after being impacted by the high-pressure water jet, the heat-affected area will be reduced, and the workpiece to be processed will be processed.

It should be noted that, in practical applications, the pressure of the water jet can be adjusted according to the material and thickness of the workpiece to be processed, which is not limited here.

An embodiment of the present application provides a multi-pulse width laser processing device, which includes a multi-pulse width laser output component, a jet nozzle, an ultrasonic vibration component, a processing platform, and a controller; the controller controls the jet nozzle from the side of the processing platform Spray high-pressure water jets with a pressure in the range of 10MPa to 50Mpa toward the workpiece to be processed. After the workpiece is roughly processed by the laser to soften it, the workpiece to be processed is further processed by the impact of the water jet, and part of it is taken away by the water flow. The heat generated by processing can reduce the thermal damage of processing; thereby reducing the thermal damage caused by laser processing without sacrificing processing efficiency; and by adjusting the incident angle of the water jet, the debris generated by processing The jet is flushed away so as not to affect the processing in the processing area.

Embodiment Three

Corresponding to the foregoing device embodiments, the present application also provides a multi-pulse width laser processing method and corresponding embodiments.

FIG. 2 is a schematic flowchart of a multi-pulse width laser processing method shown in an embodiment of the present application.

Referring to Fig. 2, the multi-pulse width laser processing method includes:

201. Obtain the fracture toughness parameter of the workpiece to be processed;

In the embodiment of the present application, the fracture toughness parameters of the workpiece to be processed can be acquired through real-time detection by a fracture toughness testing machine, or based on the processing information imported by the processing personnel.

It can be understood that the acquisition process of the above-mentioned fracture toughness parameters is not intended to limit the present application.

202. According to the comparison result of the fracture toughness parameter and the fracture toughness threshold, set the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component;

In the embodiment of the present application, the value of the fracture toughness threshold is 4MPa/m ² , if the fracture toughness parameter of the workpiece to be processed is greater than or equal to the fracture toughness threshold, it indicates the critical stress required for the unstable crack propagation of the workpiece to be processed Larger, that is, the ability to prevent crack propagation is strong. Therefore, it can be processed with higher frequency laser and higher pressure water jet to improve processing efficiency; if the fracture toughness parameter of the workpiece to be processed is less than the fracture toughness threshold , indicating that the critical stress required for the unstable crack propagation of the workpiece to be processed is small, that is, the ability to prevent crack propagation is weak. Therefore, it is necessary to use a lower frequency laser and a lower pressure water jet to process it to avoid damage to the The workpiece to be machined causes additional damage.

203. Turn on the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component to reach a preset processing time, and complete the processing.

In the embodiment of the present application, the preset processing duration can be adjusted according to actual conditions, which is not limited here.

The embodiment of the present application provides a multi-pulse width laser processing method. The fracture toughness parameter of the workpiece to be processed is compared with the fracture toughness threshold value, and the fracture toughness parameter is greater than or equal to the fracture toughness threshold value of the workpiece to be processed, that is, the ability to prevent crack propagation For stronger workpieces to be processed, higher-frequency lasers and higher-pressure water jets are used for processing, thereby reducing the time required for processing; while for workpieces whose fracture toughness parameters are less than the fracture toughness threshold, it is necessary to prevent cracks from expanding. Workpieces to be processed with weaker capabilities are processed with lower-frequency lasers and lower-pressure water jets to avoid excessive processing damage to the workpieces to be processed, so that different processing schemes can be adopted for materials with different characteristics, and the processing process is more efficient. precise.

Embodiment Four

The embodiment of the present application designs step 202 in the third embodiment above, and the technical solution of the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

Please refer to Figure 3, a multi-pulse width laser processing method, including:

301. Determine whether the fracture toughness parameter is less than a fracture toughness threshold;

If yes, go to step 302; if not, go to step 303.

In the embodiment of the present application, the value of the fracture toughness threshold is 4 MPa/m ² .

302. Set the multi-pulse width laser output component, the jet nozzle, and the ultrasonic vibration component according to the first processing strategy;

In the embodiment of the present application, the first processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, and the first The value range of the pulse width of the two laser emitters is 10fs to 500fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 10μs to 200μs; the middle of the jet nozzle The value range of the included angle between the axis and the processing platform is 10° to 50°, the pressure value range of the jet generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz, and the amplitude is Above 3 μm, the ultrasonic vibrating assembly vibrates cooperatively in two directions.

It should be noted that the value range of the pulse width of the first laser emitter and the second laser emitter can be reversed, that is, the value range of the pulse width of the first laser emitter is 10 fs to 500 fs, and the value range of the second laser emitter The value range of the pulse width is 6ps to 10ps.

Preferably, the power of the multi-pulse width laser output component is 20W, wherein the value range of the pulse width of the first laser emitter is 8ps, the value range of the pulse width of the second laser emitter is 300fs, and the first laser emits The value range of the laser emission interval of the device and the second laser emitter is 150 μs; the value range of the included angle between the central axis of the jet nozzle and the processing platform is 35°, and the value range of the jet flow produced by the jet nozzle is 40Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is 100kHz, the amplitude is 6μm, and the ultrasonic vibration component vibrates cooperatively along two directions.

In the embodiment of the present application, the workpiece to be processed whose fracture toughness parameter is less than the fracture toughness threshold has a weak ability to prevent crack propagation, so it is necessary to control the pulse width values of the first laser emitter and the second laser emitter, and the first laser The value of the laser emission interval between the emitter and the second laser emitter, and the value of the jet flow generated by the jet nozzle are within a certain range, so as to avoid excessive processing damage to the workpiece to be processed caused by excessively high energy laser and water jet.

303. Obtain the workpiece thickness of the workpiece to be processed, and determine whether the workpiece thickness is smaller than a thickness threshold;

If yes, go to step 304; if not, go to step 305.

In the embodiment of the present application, the value of the thickness threshold is 500 μm.

304. Set the multi-pulse width laser output component, the jet nozzle, and the ultrasonic vibration component according to the second processing strategy;

In the embodiment of the present application, the second processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter is less than 10 ps, and the pulse width of the second laser emitter is The width is less than 500 fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 100 μs to 1 ms; the value of the angle between the central axis of the jet nozzle and the processing platform The range is 10° to 50°, the pressure of the jet generated by the jet nozzle ranges from 10MPa to 30Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 20kHz, and the amplitude is greater than 3μm, and the ultrasonic vibration component is in two directions Synergistic vibration.

In the embodiment of the present application, the workpiece to be processed whose fracture toughness parameter is greater than or equal to the fracture toughness threshold has a stronger ability to prevent crack propagation, but when the thickness of the workpiece is less than the thickness threshold, it indicates that the workpiece to be processed is relatively thin. The demand is low; therefore, preferably, the power of the multi-pulse width laser output component is 25W, wherein the value range of the pulse width of the first laser emitter is 6ps, and the value range of the pulse width of the second laser emitter is 200fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 300μs; the value range of the angle between the central axis of the jet nozzle and the processing platform is 30°, the jet flow generated by the jet nozzle The range of the pressure is 20Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is 50kHz, the amplitude is 6μm, and the ultrasonic vibration component vibrates cooperatively in two directions.

305. Set the multi-pulse width laser output component, the jet nozzle, and the ultrasonic vibration component according to a third processing strategy.

In the embodiment of the present application, the third processing strategy includes: the power of the multi-pulse width laser output component is greater than 20W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, and the first The value range of the pulse width of the two laser emitters is 10 fs to 500 fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 1 μs to 100 μs; the middle of the jet nozzle The value range of the angle between the axis and the processing platform is 50° to 80°, the pressure range of the jet generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz, and the amplitude is Greater than 5 μm, the ultrasonic vibration components vibrate cooperatively in three directions.

In the embodiment of the present application, for workpieces to be processed whose fracture toughness parameters are greater than or equal to the fracture toughness threshold and whose thickness is greater than or equal to the thickness threshold of the party feathers, too low laser energy or too low water jet pressure will lead to too long processing time, It is not conducive to the improvement of processing efficiency. Therefore, preferably, the power of the multi-pulse width laser output component is 50W, wherein the value range of the pulse width of the first laser emitter is 6ps, and the value range of the pulse width of the second laser emitter is The value range is 100fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 50μs; the value range of the included angle between the central axis of the jet nozzle and the processing platform is 65°, the jet nozzle The pressure range of the generated jet is 40Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is 100kHz, and the amplitude is 8 μm, and the ultrasonic vibration component vibrates cooperatively along three directions.

In the embodiment of the present application, the workpieces to be processed are classified according to the fracture toughness parameters and the thickness of the workpieces to be processed, and processing schemes with different processing intensities are adopted for different types of workpieces to be processed, so that the processing of workpieces to be processed under each category During the process, the relationship between processing efficiency and thermal influence can be balanced, and the processing efficiency will not be reduced due to thermal influence, or the workpiece will be scrapped due to excessive processing damage due to the pursuit of processing efficiency.

The solution of the present application has been described in detail above with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of each embodiment have their own emphases, and for parts not described in detail in a certain embodiment, reference may be made to relevant descriptions of other embodiments. Those skilled in the art should also know that the actions and modules involved in the description are not necessarily required by the present application. In addition, it can be understood that the order of the steps in the method of the embodiment of the present application can be adjusted, combined and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be combined, divided and deleted according to actual needs.

Those of skill would also appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the applications herein may be implemented as electronic hardware, computer software, or combinations of both.

The flowchart and block diagrams in the figures show the architecture, functions and operations of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code that includes one or more Executable instructions. It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. It should also be noted that each block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by a dedicated hardware-based system that performs the specified functions or operations , or may be implemented by a combination of dedicated hardware and computer instructions.

Having described various embodiments of the present application above, the foregoing description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and alterations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principle of each embodiment, practical application or improvement of technology in the market, or to enable other ordinary skilled in the art to understand each embodiment disclosed herein.

Claims

A multi-pulse width laser processing device, characterized in that it comprises:

Multi-pulse width laser output component (10), jet nozzle (20), ultrasonic vibration component (30), processing platform (40) and controller (50);

The controller (50) is electrically connected to the multi-pulse width laser output assembly (10), the jet nozzle (20) and the ultrasonic vibration assembly (30);

The processing platform (40) is used to place the workpiece (60) to be processed; the multi-pulse width laser output assembly (10) is arranged above the storage surface of the processing platform (40); the multi-pulse width laser output assembly (10) comprising: a first laser transmitter (101), a second laser transmitter (102) and a beam coupling device (103); the beam coupling device (103) is used to use the first laser transmitter (101) ) and the laser emitted by the second laser emitter (102) are coupled to form a common path laser beam;

The jet nozzle (20) is arranged on the side of the processing platform (40), and the jet nozzle (20) faces the processing platform (40);

The ultrasonic vibrating component (30) is arranged under the storage surface of the processing platform (40), and drives the processing platform (40) to vibrate through ultrasonic waves.
The multi-pulse width laser processing device according to claim 1, characterized in that,

The value range of the included angle between the central axis of the jet nozzle (20) and the processing platform (40) is 10° to 85°; the pressure range of the jet produced by the jet nozzle is 10MPa to 50Mpa, The distance between the incident point and the action point of the common laser beam is less than 30mm.
The multi-pulse width laser processing device according to claim 1, characterized in that,

The vibration direction of the ultrasonic vibration component (30) is adjustable; the ultrasonic vibration frequency of the ultrasonic vibration component (30) is greater than 20 kHz, and the amplitude is greater than 2 μm.
The multi-pulse width laser processing device according to claim 1, characterized in that,

The beam coupling device (103) includes: a dichroic prism.
A multi-pulse width laser processing method, realized based on the multi-pulse width laser processing device described in any one of claims 1-4, characterized in that it includes:

Obtain the fracture toughness parameters of the workpiece to be processed;

According to the comparison result of the fracture toughness parameter and the fracture toughness threshold value, the multi-pulse width laser output assembly, the jet nozzle and the ultrasonic vibration assembly are set;

The multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are turned on for a preset processing time, and the processing is completed.
The multi-pulse width laser processing method according to claim 5, wherein,

According to the comparison result of the fracture toughness parameter and the fracture toughness threshold, the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are set, including:

Judging whether the fracture toughness parameter is less than the fracture toughness threshold, if so, setting the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component according to the first processing strategy;

If not, obtain the workpiece thickness of the workpiece to be processed, judge whether the workpiece thickness is less than the thickness threshold, and if so, perform the multi-pulse width laser output assembly, the jet nozzle and the ultrasonic wave according to the second processing strategy. The vibration component is set;

If not, the multi-pulse width laser output component, the jet nozzle and the ultrasonic vibration component are set according to a third processing strategy.
The multi-pulse width laser processing method according to claim 6, wherein,

The value of the fracture toughness threshold is 4 MPa/m 2 ; the value of the thickness threshold is 500 μm.
The multi-pulse width laser processing method according to claim 6, wherein,

The first processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, and the pulse width of the second laser emitter The value range of the pulse width is 10fs to 500fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 10μs to 200μs; the central axis of the jet nozzle and the processing The range of the included angle of the platform is 10° to 50°, the pressure range of the jet generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz, and the amplitude is greater than 3μm. Ultrasonic vibrating components vibrate in concert in two directions.
The multi-pulse width laser processing method according to claim 6, wherein,

The second processing strategy includes: the power of the multi-pulse width laser output component is greater than 10W, wherein the pulse width of the first laser emitter is less than 10 ps, and the pulse width of the second laser emitter is less than 500 fs, so The value range of the laser emission interval between the first laser emitter and the second laser emitter is 100 μs to 1 ms; the value range of the included angle between the central axis of the jet nozzle and the processing platform is 10° to 50°, the pressure of the jet generated by the jet nozzle ranges from 10MPa to 30Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 20kHz, the amplitude is greater than 3μm, and the ultrasonic vibration component vibrates cooperatively in two directions.
The multi-pulse width laser processing method according to claim 6, wherein,

The third processing strategy includes: the power of the multi-pulse width laser output component is greater than 20W, wherein the pulse width of the first laser emitter ranges from 6 ps to 10 ps, and the pulse width of the second laser emitter The value range of the pulse width is 10fs to 500fs, the value range of the laser emission interval between the first laser emitter and the second laser emitter is 1μs to 100μs; the central axis of the jet nozzle and the processing The range of the included angle of the platform is 50° to 80°, the pressure range of the jet generated by the jet nozzle is 20MPa to 50Mpa; the ultrasonic vibration frequency of the ultrasonic vibration component is greater than 50kHz, and the amplitude is greater than 5μm. The ultrasonic vibrating components vibrate in concert in three directions.