CN110280914A - A kind of Laser Ultrasonic Technique false impulse laser drilling device and method - Google Patents
A kind of Laser Ultrasonic Technique false impulse laser drilling device and method Download PDFInfo
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- CN110280914A CN110280914A CN201910434176.0A CN201910434176A CN110280914A CN 110280914 A CN110280914 A CN 110280914A CN 201910434176 A CN201910434176 A CN 201910434176A CN 110280914 A CN110280914 A CN 110280914A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of Laser Ultrasonic Technique false impulse laser drilling device and methods, it is related to laser boring field, including vibration module, first pulse laser, computer, second pulse laser controller, second pulse laser, ultrasonic detector and vibration module controller;This method principle is before first pulse laser is to work pieces process, a period of time in process and after processing, workpiece lower surface is acted on using second pulse laser and inspires ultrasonic wave, ultrasonic wave generates the punching of ultrasonic vibration auxiliary laser, ultrasonic vibration is generated using vibration module, so that the focus after first pulse laser output laser focuses is vibrated up and down by certain frequency.The present invention effectively alleviates that current pulse laser punching re cast layer is thicker, heat affected area is larger and there are problems that micro-crack, so that workpiece is had higher processing quality, while punching depth can be improved, and greatly improve processing efficiency.
Description
Technical field
The present invention relates to laser boring field, especially a kind of Laser Ultrasonic Technique false impulse laser drilling device and side
Method.
Background technique
Laser boring is a very important laser processing application technology, is focused by condenser lens to laser beam
The hot spot that can obtain diameter very little forms very high temperature in focal point.Under the action of pulse laser, material constantly melts
And evaporation.Finally, the plasma that gas and punching are formed, which can generate high pressure, blows out hole for impurity, micropore is formed.Relative to
Traditional machine drilling mode, laser boring have unique advantage and irreplaceable role, as high-efficient, precision is high, nothing
Mechanical stress and without tool loss etc., it has also become one of the key technology in modern micro hole machining field.
But material can undergo the complex process of high temperature sintered and cooling condensation in pulse laser drill process, finally exist
Micropore inwall forms re cast layer, heat affected area and micro-crack, this be for the quality of part it is totally unfavorable, also limit simultaneously
The extensive use of pulse laser punching in the industry.A kind of Chinese patent " induced with laser punching of Publication No. CN103521933A
Hit wave auxiliary laser drilling method " a kind of induced with laser shock wave auxiliary laser drilling method is disclosed, swashed by high energy pulse
Light action makes workpiece surface generate molten bath in workpiece surface, and then the high energy pulse laser on the downside of workpiece passes through restraint layer simultaneously
It acts on the explosion of absorbed layer induced plasma and generates shock wave, shock wave is upwardly propagated along workpiece and produced at solid liquid interface
Raw disturbance generates tensile stress in solid liquid interface, and tensile stress forces melted material to separate with workpiece, to keep melted material broken simultaneously
Outside squit hole.The patent accelerates the removal of fusant using the method for induced with laser shock wave, and then improves punching effect
Rate and quality, but restraint layer is arranged in patent the method needs on the downside of workpiece, and technique is relative complex, and can be to workpiece substrate
It causes to damage.The Chinese patent " a kind of ultrasonic vibration auxiliary laser drilling method and device " of Publication No. CN107790897A mentions
A kind of ultrasonic vibration auxiliary laser drilling method and device, while carrying out laser boring, ultrasonic vibration generation unit are supplied
The ultrasonic vibration of generation acts on workpiece with the direction perpendicular to workpiece machining surface.The invention facilitates when laser boring in hole
Molten material discharge, improve microvia quality.But patent the method ultrasonic vibration be not be applied directly on workpiece, and
It is ultrasonic vibration to be transferred on workpiece, this will cause the damage of ultrasonic energy using aqueous medium as ultrasonic wave transmission medium
It loses, reduces the auxiliaring effect of ultrasonic vibration, in addition ultrasonic frequency is relatively low.
Summary of the invention
Current pulse laser punching re cast layer is thicker, heat affected area is larger and asking there are micro-crack in order to solve by the present invention
Topic provides a kind of Laser Ultrasonic Technique false impulse laser drilling device and method.
The technical scheme is that swashing including vibration module, the first plane of reflection mirror, the first beam expander, the first pulse
Light device, first pulse laser controller, computer, second pulse laser controller, second pulse laser, second expand
Device, the second plane of reflection mirror, beam splitter, workpiece, ultrasonic detector, fixture, workbench, workbench controller, vibration mould
Block controller;
First plane of reflection mirror is located at the top, and underface is followed successively by vibration module, workpiece, beam splitter and second
Plane of reflection mirror;The workpiece is fixed on fixture, and fixture is fixed on workbench;The ultrasonic detector is mounted on workpiece
Upside is not contacted with workpiece;One end of the workbench controller is connect with workbench, and the other end is connect with computer;
One end of the vibration module controller is connect with vibration module, and the other end is connect with computer;The ultrasonic detector and meter
The connection of calculation machine.
The first pulse laser, the first beam expander, the first plane of reflection mirror and vibration module are sequentially located at same light
On the road;One end of the first pulse laser controller is connect with first pulse laser, and the other end is connect with computer;
The second pulse laser, the second beam expander, the second plane of reflection mirror and beam splitter are sequentially located at same optical path
On;One end of the second pulse laser controller is connect with second pulse laser, and the other end is connect with computer.
In above scheme, the vibration module includes pedestal, guide rail, sliding shoe, piezoelectric ceramic ultrasonic vibrator and focusing
Lens;Piezoelectric ceramic ultrasonic vibrator is hollow structure, and laser beam can extend there through, and upside is fixedly mounted on the base;It is sliding
Motion block can slide on guide rail, and be hollow structure, and laser beam can extend there through, and it is super that piezoelectric ceramics is mounted on the upside of sliding shoe
The downside of sonic vibrator;Condenser lens is mounted on sliding shoe.
In above scheme, first plane of reflection mirror and horizontal direction are in 45 degree of angles;The first pulse laser hair
The laser beam penetrated passes sequentially through the first beam expander, the first plane of reflection mirror and vibration module and focuses on workpiece surface.
In above scheme, second plane of reflection mirror and horizontal direction are in 135 degree of angles;The second pulse laser hair
The laser beam penetrated passes sequentially through the second beam expander, the second plane of reflection mirror and beam splitter and is applied to workpiece lower surface.
A kind of Laser Ultrasonic Technique false impulse laser boring method, before first pulse laser is to work pieces process,
On the one hand a period of time in process and after processing acts on the excitation of workpiece lower surface using second pulse laser
Ultrasonic wave out, ultrasonic wave generate the punching of ultrasonic vibration auxiliary laser, on the other hand generate ultrasonic vibration using vibration module, so that
First pulse laser exports the focus after laser focuses and vibrates up and down by certain frequency;In addition, using ultrasonic detector reality
When detection act on ultrasonic signal energy on workpiece, and pass computer back.Specifically comprise the following steps:
S1, workpiece upper and lower surface is pre-processed;
S2, workpiece is fixed on fixture, fixture is fixed on workbench;
S3, mobile working platform is controlled using stage controller, adjusts the position of workpiece, and good by computer settings
All Working positions of workpiece;
S4, all Working positions machined parameters by computer and corresponding controller, primary all setting completed;It is logical
Cross output parameter of the first pulse laser controller setting first pulse laser output for the pulse laser beam of processing;It is logical
Cross the defeated of pulse laser beam of the second pulse laser controller setting second pulse laser output for generating ultrasonic vibration
Parameter out;The running parameter of vibration module is set by vibration module controller;
S5, vibration module and ultrasonic detector are opened, opens second pulse laser outgoing laser beam and acts under workpiece
Surface, action time are controlled by computer;
S6, it after effect a period of time, opens first pulse laser and exports pulse laser beam, laser beam passes through vibration module
It is applied to Working position on workpiece, forms aperture in work pieces process region;
After S7, aperture process finishing, closes first pulse laser and close the second pulse after certain interval of time and swash
Light device (8), vibration module and ultrasonic detector;
S8, next position is moved to using workbench controller control mobile working platform;
S9, above step S5-S8 is repeated, the next position of workpiece is processed, until all position process finishings.
In above scheme, the first pulse laser refers to superpower laser, laser function of the output for processing
Rate density > 107W/cm2;The laser power density value of second pulse laser output is lower than the damage of workpiece to be machined lower surface material
Hurt threshold value, workpiece to be machined lower surface is insufficient to allow its material since absorption bombardment with laser beams can cause material local temperature to rise
Material fusing, it is ensured that workpiece lower surface is completely lossless.
In above scheme, in actual processing, various coatings (such as water or oil) can be applied in workpiece lower surface, for improving
Workpiece lower surface absorption coefficient.Simultaneously in actual processing, the relatively narrow laser of setting second pulse laser output pulse width
The energy of ultrasonic signal equally can be improved in beam.
In above scheme, second pulse laser acts on ultrasonic frequency that workpiece lower surface inspires up to GHz amount
Grade.
In above scheme, the vibration frequency of vibration module is greater than 20kHz, i.e., after first pulse laser output laser focuses
Focus vibrate up and down frequency be greater than 20kHz.
Compared with prior art, the beneficial effects of the present invention are:
1. generating thermal energy in workpiece lower surface by laser irradiation in the present invention, therefore high frequency is inspired based on Thermoelastic regime
Ultrasonic wave generates ultrasonic vibration, punches for auxiliary laser;Ultrasonic wave is inspired by second pulse laser heat production, it can be with
Promote the removal of the fusant in laser drilling process, improve laser boring efficiency, reduce micropore inwall re cast layer thickness, reduces
The generation of inner wall micro-crack improves microvia quality;In addition, the ultrasonic frequency that laser is inspired below workpiece of the present invention is reachable
GHz magnitude can significantly improve ultrasonic wave added quality of laser drilling.
2. the present invention is using laser action in workpiece lower surface, the laser power density of output is lower than workpiece to be machined material
Expect the damage threshold on surface, workpiece to be machined surface is insufficient since absorption bombardment with laser beams can cause material local temperature to rise
So that its material melts, it can be ensured that workpiece lower surface is completely lossless;In addition, by being applied to workpiece lower surface after beam splitter
Laser beam more multiple beam distribution is wider, and the ultrasonic vibration inspired in this way is more uniform and range is wider.
3. the present invention generates ultrasonic vibration using vibration module, so that the coke after first pulse laser output laser focusing
It presses certain frequency to vibrate up and down, and vibration frequency is greater than 20kHz, focus can be applied in this way in laser drilling process
The inside of workpiece, and laser energy will not be concentrated and be acted on workpiece, hence it is evident that it improves perforating efficiency and reduces heat affected area.
4. the present invention not only applies ultrasonic vibration on workpiece, while applying ultrasonic vibration on laser Machining head, finally
Cause quality of laser drilling is synchronous with efficiency to improve.In addition, the present invention is using the ultrasound letter in ultrasonic detector detection workpieces
Number energy, and return to computer in real time, can understand the ultrasound intensity in ultrasonic wave added process in workpiece in real time, and for plus
The optimization of work parameter provides reference frame.
5. the degree of automation of the present invention is higher, workpiece need to only be had good positioning, can be realized automatically by computer programming
Change processing.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of Laser Ultrasonic Technique false impulse laser drilling device of an embodiment of the present invention.
In figure, 1. vibration modules, 2. first plane of reflection mirrors, 3. first beam expanders, 4. first pulse lasers, 5. first
Pulse laser controller, 6. computers, 7. second pulse laser controllers, 8. second pulse lasers, 9. second expand
Device, 10. second plane of reflection mirrors, 11. beam splitters, 12. workpiece, 13. ultrasonic detectors, 14. fixtures, 15. workbenches, 16.
Workbench controller, 17. vibration module controllers.
Fig. 2 is a kind of vibration module of Laser Ultrasonic Technique false impulse laser drilling device of an embodiment of the present invention
Schematic diagram.
In figure, 18. pedestals, 19. guide rails, 20. sliding shoes, 21 piezoelectric ceramic ultrasonic vibrators, 22. condenser lenses.
Fig. 3 is a kind of Laser Ultrasonic Technique false impulse laser boring method perforated material removal process signal of the present invention
Figure.
In figure, 23. first laser beams, 24. fusant, 25. heat affected areas, 12. workpiece, 26. ultrasonic vibrations, 27. pass through
Second laser beam after beam splitter.
Specific embodiment
Invention is further described in detail with reference to the accompanying drawings and detailed description, but protection scope of the present invention
It is not limited to this.
Embodiment one:
A kind of Laser Ultrasonic Technique false impulse laser drilling device, which is characterized in that anti-including vibration module 1, first
Penetrate plane mirror 2, the first beam expander 3, first pulse laser 4, first pulse laser controller 5, computer 6, the second pulse
Laser controller 7, the second beam expander 9, the second plane of reflection mirror 10, beam splitter 11, workpiece 12, surpasses second pulse laser 8
Detector of sound 13, fixture 14, workbench 15, workbench controller 16, vibration module controller 17;
First plane of reflection mirror 2 is located at the top, and underface is followed successively by vibration module 1, workpiece 12, beam splitter 11
With the second plane of reflection mirror 10;The workpiece 12 is fixed on fixture 14, and fixture 14 is fixed on workbench 15;The ultrasound
Detector 13 is mounted on 12 upside of workpiece, does not contact with workpiece 12;One end of the workbench controller 16 and workbench
15 connections, the other end are connect with computer 6;One end of the vibration module controller 17 is connect with vibration module 1, the other end with
Computer 6 connects;The ultrasonic detector 13 is connect with computer 6.
The first pulse laser 4, the first beam expander 3, the first plane of reflection mirror 2 and vibration module 1 are sequentially located at together
In one optical path;One end of the first pulse laser controller 5 is connect with first pulse laser 4, and the other end and computer 6 connect
It connects;
The second pulse laser 8, the second beam expander 9, the second plane of reflection mirror 10 and beam splitter 11 are sequentially located at together
In one optical path;One end of the second pulse laser controller 7 is connect with second pulse laser 8, and the other end and computer 6 connect
It connects.By second pulse laser heat production excitation ultrasound wave, the removal of the fusant in laser drilling process can be promoted, improved
Laser boring efficiency reduces micropore inwall re cast layer thickness, reduces the generation of inner wall micro-crack, improves microvia quality;
The vibration module 1 includes pedestal 18, guide rail 19, sliding shoe 20, piezoelectric ceramic ultrasonic vibrator 21 and focuses saturating
Mirror 22;Piezoelectric ceramic ultrasonic vibrator 21 is hollow structure, and laser beam can extend there through, and upside is fixedly mounted on pedestal 18
On;Sliding shoe 20 can slide on rails 19, and be hollow structure, and laser beam can be extended there through, be installed on the upside of sliding shoe 20
In the downside of piezoelectric ceramic ultrasonic vibrator 21;Condenser lens 22 is mounted on sliding shoe 20.
First plane of reflection mirror 2 is in 45 degree of angles with horizontal direction;The laser beam that the first pulse laser 4 emits
It passes sequentially through the first beam expander 3, the first plane of reflection mirror 2 and vibration module 1 and focuses on 12 upper surface of workpiece.
Second plane of reflection mirror 10 is in 135 degree of angles with horizontal direction;The laser that the second pulse laser 8 emits
Beam passes sequentially through the second beam expander 9, the second plane of reflection mirror 10 and beam splitter 11 and is applied to 12 lower surface of workpiece;Pass through beam splitter
The laser beam more multiple beam distribution for being applied to workpiece lower surface afterwards is wider, the ultrasonic vibration inspired in this way it is more uniform and
Range is wider.
Embodiment two:
A kind of Laser Ultrasonic Technique false impulse laser boring method exports first laser beam in first pulse laser 4
Before 23 pairs of processing of workpiece 12, a period of time in process and after processing, second pulse laser 8 is on the one hand used
Second laser beam is exported, the second laser beam 27 after beam splitter acts on 12 lower surface of workpiece, and portion of energy is by material table
Face absorbs and is converted into thermal energy, and material surface temperature is caused to increase rapidly, so that material expands.It is formed by thermoelastic effect
Strain field and stress field, to inspire high-frequency ultrasonic, ultrasonic wave generates the punching of ultrasonic vibration auxiliary laser, and laser is promoted to beat
The removal of fusant in hole improves perforating efficiency, reduces re cast layer thickness and micro-crack, improves drilling quality.On the other hand it shakes
Dynamic model block controller 17 controls piezoelectric ceramic ultrasonic vibrator 21 and works, band of the sliding shoe 20 in piezoelectric ceramic ultrasonic vibrator 21
It is moved up and down in vertical direction under dynamic along guide rail 19, forces condenser lens 22 to move up and down in vertical direction, eventually lead to
Focus after focusing is moved up and down in vertical direction with the travel frequency greater than 20kHz.It is burnt in this way in laser drilling process
Point can be applied to the inside of workpiece 12, and laser energy will not concentrate effect on work piece 12, improve perforating efficiency and reduce
Heat affected area.In addition, the ultrasonic signal energy using 13 real-time detection of ultrasonic detector effect on work piece 12, and pass calculating back
Machine 6.
Specifically comprise the following steps:
S1,12 upper and lower surface of workpiece is pre-processed;
S2, workpiece 12 is fixed on fixture 14, fixture 14 is fixed on workbench 15;
S3, mobile working platform 15 is controlled using stage controller 16, adjusts the position of workpiece 12, and pass through computer
6 set all Working positions of workpiece 12;
S4, all Working positions machined parameters by computer 6 and corresponding controller, primary all setting completed;It is logical
It crosses first pulse laser controller 5 and sets output parameter of the output of first pulse laser 4 for the pulse laser beam of processing;
Second pulse laser 8, which is set, by second pulse laser controller 7 exports the pulse laser beam for generating ultrasonic vibration
Output parameter;The running parameter of vibration module 1 is set by vibration module controller 17;
S5, vibration module 1 and ultrasonic detector 13 are opened, opens 8 outgoing laser beam of second pulse laser and acts on work
12 lower surface of part, action time are controlled by computer 6;
S6, it after effect a period of time, opens first pulse laser 4 and exports pulse laser beam, laser beam passes through vibration mould
Block 1 is applied to Working position on workpiece 12, forms aperture in 12 machining area of workpiece;
After S7, aperture process finishing, closes first pulse laser 4 and close the second pulse after certain interval of time and swash
Light device 8, vibration module 1 and ultrasonic detector 13;
S8, next position is moved to using the control mobile working platform 15 of workbench controller 16;
S9, above step S5-S8 is repeated, the next position of workpiece 12 is processed, until all position process finishings.
The first pulse laser 4 refers to superpower laser, output for processing laser power density >
107W/cm2;The laser power density value that second pulse laser 8 exports is lower than the damage threshold of 12 lower surface material of workpiece to be machined
Value, 12 lower surface of workpiece to be machined are insufficient to allow its material since absorption bombardment with laser beams can cause material local temperature to rise
Fusing, it is ensured that 12 lower surface of workpiece is completely lossless.
In actual processing, various coating such as water or oil can be applied in 12 lower surface of workpiece, for improving workpiece lower surface
Absorption coefficient.Simultaneously in actual processing, the relatively narrow laser beam of setting 8 output pulse width of second pulse laser equally can be with
Improve the energy of ultrasonic signal.
Second pulse laser 8 acts on ultrasonic frequency that 12 lower surface of workpiece inspires up to GHz magnitude.
The vibration frequency of vibration module 1 is greater than 20kHz, i.e. first pulse laser 4 exports in the focus after laser focuses
Lower vibration frequency is greater than 20kHz.
Above-mentioned technical proposal embodies the preferred embodiment of the invention patent, and those skilled in the art are to partial function
It modifies and embodies this patent principle, belong within the scope of this patent.
Claims (10)
1. a kind of Laser Ultrasonic Technique false impulse laser drilling device, which is characterized in that instead including vibration module (1), first
Penetrate plane mirror (2), first pulse laser (4), first pulse laser controller (5), computer (6), the second pulse laser
Device controller (7), second pulse laser (8), the second plane of reflection mirror (10), ultrasonic detector (13) and vibration module control
Device (17);First plane of reflection mirror (2) is located at the top, immediately below be followed successively by vibration module (1), workpiece (12) and the
Two plane of reflection mirrors (10);The workpiece (12) is arranged on fixture (14), and fixture (14) is arranged on workbench (15);Institute
It states ultrasonic detector (13) to be placed on the upside of workpiece (12), and is not contacted with workpiece (12);The workbench controller (16)
One end is connect with workbench (15), and the other end is connect with computer (6);One end of the vibration module controller (17) and vibration
Dynamic model block (1) connection, the other end are connect with computer (6);The ultrasonic detector (13) connect with computer (6);Described
One pulse laser (4), the first plane of reflection mirror (2) and vibration module (1) are sequentially located in same optical path;First pulse
One end of laser controller (5) is connect with first pulse laser (4), and the other end is connect with computer (6);Second pulse
Laser (8), the second plane of reflection mirror (10) are sequentially located in same optical path;The one of the second pulse laser controller (7)
End is connect with second pulse laser (8), and the other end is connect with computer (6).
2. a kind of Laser Ultrasonic Technique false impulse laser drilling device according to claim 1, which is characterized in that described
Vibration module (1) includes pedestal (18), guide rail (19), sliding shoe (20), piezoelectric ceramic ultrasonic vibrator (21) and condenser lens
(22);Piezoelectric ceramic ultrasonic vibrator (21) is hollow structure, and laser beam can be passed through from hollow structure, and end face is mounted on base thereon
On seat (18);Sliding shoe (20) can be slided up and down along guide rail (19), and be hollow structure, and laser beam can extend there through, sliding shoe
(20) upside is mounted on the downside of piezoelectric ceramic ultrasonic vibrator (21);Condenser lens (22) is mounted on sliding shoe (20).
3. a kind of Laser Ultrasonic Technique false impulse laser drilling device according to claim 1, which is characterized in that described
The laser that first pulse laser (4) and second pulse laser (8) issue expands through the first beam expander (3), the second beam expander (9)
Beam.
4. a kind of Laser Ultrasonic Technique false impulse laser drilling device according to claim 3, which is characterized in that described
Second plane of reflection mirror (10) and horizontal direction are in 135 °;The laser beam of second pulse laser (8) transmitting passes sequentially through
Second beam expander (9), the second plane of reflection mirror (10) and beam splitter (11) are applied to workpiece (12) lower surface.
5. a kind of Laser Ultrasonic Technique false impulse laser drilling device according to claim 3, which is characterized in that described
First plane of reflection mirror (2) and horizontal direction are in 45 °;The laser beam of the first pulse laser (4) transmitting passes sequentially through the
One beam expander (3), the first plane of reflection mirror (2) and vibration module (1) focus on workpiece (12) upper surface.
6. a kind of Laser Ultrasonic Technique false impulse laser boring method, which is characterized in that in first pulse laser (4) to work
Part (12) processing before, in process and processing after a period of time, work is acted on using second pulse laser (8)
Part (12) lower surface inspires ultrasonic wave, and ultrasonic wave generates the punching of ultrasonic vibration auxiliary laser;It is generated using vibration module (1) super
Acoustic vibration, so that the focus after first pulse laser (4) output laser focuses is vibrated up and down by certain frequency;In addition, adopting
The ultrasonic signal energy on workpiece (12) is acted on ultrasonic detector (13) real-time detection, and passes computer (6) back;Specific packet
Include following steps:
S1, workpiece (12) upper and lower surface is pre-processed;
S2, workpiece (12) are arranged on fixture (14), fixture (14) is arranged on workbench (15);
S3, mobile working platform (15) are controlled using stage controller (16), so as to adjust the position of workpiece (12), and passed through
All Working positions of computer (6) setting workpiece (12);
S4, all Working positions machined parameters by the primary whole of computer (6) and corresponding controller, setting completed;Specifically
, the pulse laser beam of processing is used for by first pulse laser controller (5) setting first pulse laser (4) output
Output parameter;By second pulse laser controller (7) setting second pulse laser (8) output for generating ultrasonic vibration
Pulse laser beam output parameter;Pass through the running parameter of vibration module controller (17) setting vibration module (1);
S5, vibration module (1) and ultrasonic detector (13) are opened, opens second pulse laser (8) outgoing laser beam and acts on
Workpiece (12) lower surface, action time are controlled by computer (6);
S6, after effect a period of time, first pulse laser (4) is opened and export pulse laser beam, laser beam passes through vibration module
(1) it is applied to Working position on workpiece (12), forms aperture in workpiece (12) machining area;
It after S7, aperture process finishing, closes first pulse laser (4), closes second pulse laser after certain interval of time
(8), vibration module (1) and ultrasonic detector (13);
S8, next position is moved to using workbench controller (16) control mobile working platform (15);
S9, above step S5-S8 is repeated, workpiece (12) next position is processed, until all position process finishings.
7. a kind of Laser Ultrasonic Technique false impulse laser boring method according to claim 6, which is characterized in that described
First pulse laser (4) is for superpower laser, laser power density > 10 of the output for processing7W/cm2;Second arteries and veins
The laser power density value for rushing laser (8) output is lower than the damage threshold of workpiece to be machined (12) lower surface material, is processed
Workpiece (12) lower surface is insufficient to allow its material to melt due to absorbing bombardment with laser beams and material local temperature can be caused to rise, it is ensured that
Workpiece (12) lower surface is completely lossless.
8. a kind of Laser Ultrasonic Technique false impulse laser boring method according to claim 6, which is characterized in that in reality
In the processing of border, various coating such as water or oil can be applied in workpiece (12) lower surface, for improving workpiece lower surface absorption coefficient.
9. a kind of Laser Ultrasonic Technique false impulse laser boring method according to claim 6, which is characterized in that second
Pulse laser (8) acts on ultrasonic frequency that workpiece (12) lower surface inspires up to GHz magnitude.
10. Laser Ultrasonic Technique false impulse laser boring method according to claim 6, which is characterized in that vibration mould
The vibration frequency of block (1) is greater than 20kHz, i.e., the focus after first pulse laser (4) output laser focuses vibrates up and down frequency
Greater than 20kHz.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111889896A (en) * | 2020-07-02 | 2020-11-06 | 松山湖材料实验室 | Ingot stripping method by ultrasonic-laser cooperation |
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CN111889896A (en) * | 2020-07-02 | 2020-11-06 | 松山湖材料实验室 | Ingot stripping method by ultrasonic-laser cooperation |
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CN112024991A (en) * | 2020-08-24 | 2020-12-04 | 长春工业大学 | Thermal-elastic excitation-ultrasonic impact collaborative cutting system and method |
CN112024991B (en) * | 2020-08-24 | 2021-06-01 | 长春工业大学 | Thermal-elastic excitation-ultrasonic impact collaborative cutting system and method |
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CN112276345B (en) * | 2020-10-10 | 2021-06-01 | 深圳市韵腾激光科技有限公司 | Laser processing system and method for monitoring laser power change |
CN113601018A (en) * | 2021-07-08 | 2021-11-05 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
CN114833471A (en) * | 2022-04-08 | 2022-08-02 | 大连理工大学 | Coaxial ultrasonic-assisted ultrafast laser hole making unit and method |
CN114939741A (en) * | 2022-04-13 | 2022-08-26 | 大连理工大学 | Ultrasonic jet assisted femtosecond laser rotary cutting composite processing equipment and method for turbine blade air film cooling hole |
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