CN112024991B - Thermal-elastic excitation-ultrasonic impact collaborative cutting system and method - Google Patents
Thermal-elastic excitation-ultrasonic impact collaborative cutting system and method Download PDFInfo
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Abstract
The invention is suitable for the technical field of precision machining and provides a thermal elastic excitation-ultrasonic impact collaborative cutting system and a method. The system comprises a cutting tool and a machine tool body; an ultrasonic vibration assembly; the cutting tool being excited by the ultrasonic vibratory assembly to generate an ultrasonic shock wave in a chip forming region; a pulsed laser assembly for emitting pulsed laser radiation to a chip forming domain to induce thermo-elastic excitation within the chip forming domain; an additional clamp for connecting the ultrasonic vibration assembly and the pulsed laser assembly so that a spot of the pulsed laser always radiates a chip forming domain. The invention improves the processing performance of the workpiece to be cut based on the phenomena of Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization generated by the synergistic action of two ultrasonic energy fields of thermal-elastic excitation and ultrasonic shock waves on a chip forming domain.
Description
Technical Field
The invention belongs to the technical field of precision machining, and particularly relates to a thermal elastic excitation-ultrasonic impact collaborative cutting system and method.
Background
Advanced composite materials generally refer to composite materials that are obtained by optimally combining two or more materials through physical or chemical methods and have excellent performances in various aspects such as rigidity, strength, density, toughness, wear resistance, heat resistance, corrosion resistance and the like, and have great application potential in the aspects of bearing, transmitting power, enhancing mechanical surface or interface behaviors and the like and under extreme service conditions. With the development of science and technology, the application of advanced composite materials in the fields of aerospace, automobiles, national defense, biomedical treatment and the like is increasingly wide. Taking a SiC/Al composite material as an example, the SiC/Al composite material is an important advanced composite material, has the advantages of high temperature resistance, high strength and high hardness of a ceramic material and good toughness of a metal material, and can be used in severe environments such as impact, abrasion and high temperature. For example, the SiC/Al composite material prepared at present is successfully applied to Tiangong I, Tiangong II and Fengyun IV. However, the SiC/Al composite material has poor workability due to its characteristics such as high strength, high hardness, and good toughness, and is considered to be a difficult-to-process material. The method is embodied in three aspects:
(1) the cutter is seriously abraded;
(2) the quality of the processed surface is poor;
(3) causing subsurface damage.
At present, the processing methods of the SiC/Al composite material comprise laser processing, electric spark processing, electrochemical processing, free abrasive particle ultrasonic vibration processing, ultrasonic vibration auxiliary processing, laser auxiliary processing and the like. These methods, while improving the processability of ceramic particle reinforced metal matrix composites to some extent, have certain limitations. For example, the laser processing is difficult to obtain ideal processing precision, the electric spark processing cannot regulate and control the processing precision and the processing efficiency, and a solution with large difference of laser absorption rate and thermal response characteristics of different materials is not found in the laser auxiliary processing process. In addition, the ultrasonic vibration assists in processing the ceramic particle reinforced metal matrix composite material, and the problems of secondary damage (scratching, plowing, hollowing and the like) to the processed surface caused by the whole pulling-out and partial fracture of the ceramic particles are difficult to avoid.
In the field of cutting processing of composite materials, the fiber reinforced composite material cutting method is mainly used at present, and the method is not suitable for processing ceramic particle reinforced metal matrix composite materials. The method also aims at the ultrasonic vibration and laser auxiliary cooperative processing of the end face precision processing of the hard and brittle material, and achieves the purposes of reducing cutting force and reducing cutter abrasion by utilizing the intermittent cutting characteristics of laser heating to-be-cut workpiece surface softening and ultrasonic vibration. However, the problem of large difference of laser absorption rate and thermal response characteristics of different materials and the problem of secondary damage of ceramic particles to the surface of a workpiece still cannot be solved in the process of processing the SiC/Al composite material. Therefore, the improvement of the processability of the SiC/Al composite material is an urgent engineering problem to be solved in the field of current mechanical processing.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a thermoelastic excitation-ultrasonic impact collaborative cutting system, which aims to solve the problems mentioned in the background art.
The embodiment of the invention is realized by that a thermoelastic excitation-ultrasonic impact cooperative cutting system comprises a cutting tool and a machine tool body for mounting a workpiece to be cut, and the system also comprises:
an ultrasonic vibration assembly; the cutting tool being excited by the ultrasonic vibratory assembly to generate an ultrasonic shock wave in a chip forming region; the ultrasonic shock wave acts on a cutting tool-chip contact area in the form of a mechanical shock wave;
a pulsed laser assembly for emitting pulsed laser radiation to a chip forming domain to induce thermo-elastic excitation within the chip forming domain;
an additional clamp for connecting the ultrasonic vibration assembly and the pulsed laser assembly so that a spot of the pulsed laser always radiates a chip forming domain.
Preferably, the ultrasonic vibration component is electrically connected with an ultrasonic power supply.
Preferably, the pulsed laser assembly includes:
a pulse laser head; the pulse laser head is arranged on the additional clamp;
a nanosecond pulsed laser; the pulse laser head is connected with the nanosecond pulse laser through an optical fiber.
Preferably, the system further comprises:
a cooling system; the cooling system is connected with the nanosecond pulse laser.
Preferably, the system further comprises a detection mechanism; the detection mechanism includes:
a high-speed camera; the high-speed camera is arranged on one side of a workpiece to be cut;
an image acquisition card; the image acquisition card is electrically connected with the high-speed camera;
a force sensor; the force sensor is arranged on the ultrasonic vibration assembly;
a signal collector; the force sensor is electrically connected with the signal collector;
a charge amplifier; the signal collector is electrically connected with the charge amplifier;
a computer; the charge amplifier and the image acquisition card are electrically connected with the computer.
It is another object of an embodiment of the present invention to provide a thermoelastic excitation-ultrasonic impact collaborative cutting method, which is based on the thermoelastic excitation-ultrasonic impact collaborative cutting system described in any one of the above, and the method includes the following steps:
installing a workpiece to be cut on a main shaft of a machine tool body, and rotating the workpiece to be cut around the axial lead of the main shaft to form main cutting motion;
the ultrasonic vibration component is arranged on a guide rail of the machine tool body, and the pulse laser component is connected with the ultrasonic vibration component through an additional clamp;
mounting a cutting tool on the ultrasonic vibration assembly and finishing tool setting;
adjusting the incident angle of the pulse laser so that the pulse laser directly irradiates the surface of the workpiece to be cut;
the parameters of the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are set, the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are started, and the workpiece to be cut completes cutting operation under the synergistic action of two energy fields of thermal elastic excitation and ultrasonic shock waves.
Preferably, the workpiece to be cut is made of a ceramic particle reinforced metal matrix composite.
Preferably, the workpiece to be cut is made of a SiC/Al composite material.
Preferably, the power density of the pulse laser is 105W/cm2-106W/cm2The pulse repetition frequency is not less than 20kHz, and the incident angle is 30-90 degrees; the cutting tool is excited by the ultrasonic vibration component to generate vibration with the frequency not less than 20kHz and the vibration amplitude of 5-7 mu m.
The embodiment of the invention provides a thermal elastic excitation-ultrasonic impact collaborative cutting system, which is based on the fact that two ultrasonic energy fields (thermal elastic excitation and ultrasonic impact waves generated by a pulse laser component and an ultrasonic vibration component respectively inducing a chip forming domain) cooperatively act on the chip forming domain to generate the Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization phenomena, and provides a system and a method for processing a ceramic particle reinforced metal matrix composite workpiece (especially a SiC/Al composite workpiece), wherein the system and the method have the following advantages:
(1) the pulse laser induces a chip forming domain of the SiC/Al composite workpiece to generate a thermoelastic stress wave in the cutting process, the pulse laser with short pulse width, high repetition frequency and high pulse power density acts on the chip forming domain to generate thermoelastic excitation and is conducted in the chip forming domain in the form of ultrasonic thermoelastic stress wave, the average power density of the laser is small, and ablation cannot be generated on the surface of the workpiece. The pulsed laser is commonly used in the field of nondestructive testing, and is mainly based on the 'nondestructive' characteristic of thermo-elastic excitation on the surface of a workpiece, but for the micron-sized range of the surface layer of the workpiece, the temperature gradient generated by the thermo-elastic excitation is equivalent to an ultrasonic source embedded into the workpiece, and the generated thermo-elastic stress wave with ultrasonic frequency can cause the change of the surface stress of the workpiece, thereby being beneficial to improving the machinability of the SiC/Al composite material;
(2) the ultrasonic vibration assembly vibrates the cutting tool at an ultrasonic frequency in the direction of the cutting speed, and an ultrasonic shock wave induced by the cutting tool acts on the bottom of a cantilever beam (unseparated portion of the chip) in the chip formation zone and is conducted in the form of an ultrasonic shock wave in the chip formation zone. The mechanical shock wave with ultrasonic frequency acts on a cutter-chip contact area, namely ultrasonic vibration is applied to the bottom of the cantilever beam, so that the flow stress of a chip forming area in the cutting process is changed, and the machinability of the SiC/Al composite workpiece is improved;
(3) ultrasonic frequency thermoelastic stress waves generated by nanosecond pulse laser induction and ultrasonic shock waves generated by cutting tool induction are cooperatively acted on a chip forming region of a workpiece, and the chip forming region of the SiC/Al composite workpiece is induced to generate Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization under the synergistic action of the two energy fields, so that the internal flow stress of the SiC/Al composite workpiece is reduced, and the machinability of the SiC/Al composite workpiece is improved.
Drawings
FIG. 1 is a schematic structural diagram of a thermoelastic excitation-ultrasonic impact cooperative cutting system according to an embodiment of the present invention;
FIG. 2 is a diagram of a near-field stress model of a workpiece to be machined irradiated with laser pulses according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a method of thermal-elastic excitation-ultrasonic impact collaborative cutting according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a method of thermal-elastic excitation-ultrasonic impact collaborative cutting according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an incident angle of a pulsed laser according to an embodiment of the present invention.
In the drawings: 1. a main shaft; 2. a workpiece holder; 3. a workpiece to be cut; 4. an additional clamp; 5. a pulse laser head; 6. an optical fiber; 7. a nanosecond pulsed laser; 8. a cooling system; 9. a high-speed camera; 10. an image acquisition card; 11. an ultrasonic power supply; 12. an ultrasonic vibration assembly; 13. a force sensor; 14. a signal collector; 15. a charge amplifier; 16. a computer; 17. a cutting tool.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
Example 1
As shown in fig. 1, an embodiment of the present invention provides a thermoelastic excitation-ultrasonic impact cooperative cutting system, which comprises a cutting tool 17 and a machine tool body for mounting a workpiece 3 to be cut, and the system further comprises:
an ultrasonic vibration assembly 12; the cutting tool 17 is excited by the ultrasonic vibration assembly 12 to generate an ultrasonic shock wave in a chip forming region; the ultrasonic shock wave acts on the cutting tool 17-chip contact zone in the form of a mechanical shock wave;
a pulsed laser assembly for emitting pulsed laser radiation to a chip forming domain to induce thermo-elastic excitation within the chip forming domain;
an additional clamp 4 for connecting the ultrasonic vibration assembly 12 and the pulsed laser assembly so that the spot of the pulsed laser always radiates a chip forming field.
In actual production, the chip refers to the excess material to be cut off from the workpiece 3 to be cut in the cutting process, the chip formation is a complex process, the chip formation mechanism is different under different conditions, and the chip can also present different forms. The region where the chips are generated is called the chip formation region, and the contact region with the chips when the cutting tool 17 cuts the workpiece 3 to be cut is called the cutting tool 17-chip contact region. Pulsed laser radiation chip-forming regions in which a thermoelastic stress wave of ultrasonic frequency is induced, referred to simply as thermoelastic excitation, is conducted in the chip-forming region in the form of a stress wave.
When the tool setting device is used, a workpiece 3 to be cut is firstly installed on a main shaft 1 of a machine tool body through a workpiece clamp 2, then an ultrasonic vibration component 12 is also installed on the machine tool body, a pulse laser component is connected with the ultrasonic vibration component 12 through an additional clamp 4, and a cutting tool 17 finishes tool setting and is connected with the ultrasonic vibration component 12. After the system is started, the ultrasonic vibration component 12 excites the cutting tool 17 to generate ultrasonic shock waves in a chip forming area, the generated ultrasonic shock waves act on a chip contact area of the cutting tool in a mechanical shock wave mode, namely ultrasonic vibration is applied to the bottom of a cantilever beam (the part of the chip connected with the workpiece 3 to be cut when the chip is not separated from the workpiece 3 to be cut), and the flow stress of the chip forming area in the cutting process is changed; the pulse laser component simultaneously emits pulse laser radiation cutting forming domains, the workpiece 3 to be cut rapidly absorbs energy after being irradiated by the pulse laser, the heat generated by the absorbed laser energy is not diffused in time in the near-field surface area of the workpiece 3 to be cut to form a large temperature gradient, the temperature gradient generated by the thermal elastic excitation is equivalent to an ultrasonic source embedded in the near-field surface of the workpiece 3 to be cut, and the thermal elastic ultrasonic generated after being heated and expanded can cause the near-field stress of the surface of the workpiece 3 to be cut to change, as shown in figure 2. The two ultrasonic energy fields cooperate to jointly induce the chip forming domain to generate the Blaha effect, the local nonlinear resonance, the particle thinning and the nanocrystallization phenomena, the flow stress of the chip forming domain is jointly changed, and the machinability of the workpiece 3 to be cut is improved.
Before cutting, parameters of the ultrasonic vibration unit 12, parameters of the pulse laser unit (laser output power, spot diameter, pulse width, pulse repetition frequency, etc.), and machine tool cutting parameters (spindle 1 rotation speed, feed amount, cutting depth, etc.) are set. In the cutting process, a workpiece 3 to be cut is driven by a machine tool spindle 1 to rotate to form main cutting motion, the direction of feed motion and the direction of cutting depth mainly depend on the cutting form (the turning end face and the turning excircle) of the workpiece 3 to be cut, and a cutting tool 17 which performs ultrasonic vibration and a pulse laser head 5 of a pulse laser assembly cooperate along the direction of feed motion, so that the thermal-elastic excitation-ultrasonic impact two energy fields of the workpiece 3 to be cut are cut in a cooperation manner.
As shown in fig. 1, the ultrasonic vibration component 12 is electrically connected to an ultrasonic power source 11 as a preferred embodiment of the present invention.
Specifically, an ultrasonic power source 11 provides a source of energy for the ultrasonic vibration assembly 12.
As shown in fig. 1, as a preferred embodiment of the present invention, the pulsed laser assembly includes:
a pulse laser head 5; the pulse laser head 5 is arranged on the additional clamp 4;
a nanosecond pulse laser 7; the pulse laser head 5 is connected with the nanosecond pulse laser 7 through an optical fiber 6.
Specifically, a pulse laser head 5 is connected with an ultrasonic vibration assembly 12 through an additional clamp 4, laser generated by a nanosecond pulse laser 7 is transmitted to the pulse laser head 5 through an optical fiber 6, and then is radiated on a workpiece 3 to be cut through the pulse laser head 5.
As shown in fig. 1, as a preferred embodiment of the present invention, the system further includes:
a cooling system 8; the cooling system 8 is connected to the nanosecond pulsed laser 7.
Specifically, the cooling system 8 is used for cooling the nanosecond pulse laser 7, and damage caused by overheating of the nanosecond pulse laser 7 is avoided.
As shown in fig. 1, as a preferred embodiment of the present invention, the system further comprises a detection mechanism; the detection mechanism includes:
a high-speed camera 9; the high-speed camera 9 is arranged on one side of the workpiece 3 to be cut;
an image acquisition card 10; the image acquisition card 10 is electrically connected with the high-speed camera 9;
a force sensor 13; the force sensor 13 is arranged on the ultrasonic vibration component 12;
a signal collector 15; the force sensor 13 is electrically connected with the signal collector 15;
a charge amplifier 15; the signal collector 15 is electrically connected to the charge amplifier 15;
a computer 16; the charge amplifier 15 and the image acquisition card 10 are electrically connected to the computer 16.
Specifically, the high-speed camera 9 is used for shooting the cutting process of the workpiece 3 to be cut, the shot picture is transmitted into the computer 16 through the image acquisition card 10, and the temperature distribution condition in the chip forming area is obtained through the calculation of the computer 16; the force sensor 13 is used for measuring the vibration force of the ultrasonic vibration component 12, the obtained data is collected by the signal collector 15, amplified by the charge amplifier 15 and then transmitted to the computer 16, and the cutting stability of the workpiece 3 to be cut in the cutting process is obtained through calculation of the computer 16. The Blaha effect, the local nonlinear resonance, the particle refinement and the nanocrystallization phenomena generated by the workpiece 3 to be cut under two energy fields are further verified through the temperature distribution condition and the cutting stability.
Example 2
An embodiment of the present invention further provides a thermoelastic excitation-ultrasonic impact collaborative cutting method, which is based on the thermoelastic excitation-ultrasonic impact collaborative cutting system described in any one of the above, and the method includes the following steps:
mounting a ceramic particle reinforced metal matrix composite workpiece on a main shaft of a machine tool body, and rotating the ceramic particle reinforced metal matrix composite workpiece around the axial lead of the main shaft to form main cutting motion;
the ultrasonic vibration component is arranged on a guide rail of the machine tool body, and the pulse laser component is connected with the ultrasonic vibration component through an additional clamp;
mounting a cutting tool on the ultrasonic vibration assembly and finishing tool setting;
adjusting the incident angle of the pulse laser so that the pulse laser directly irradiates the surface of the ceramic particle reinforced metal matrix composite workpiece;
the parameters of the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are set, the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are started, and the workpiece to be cut completes cutting operation under the synergistic action of two energy fields of thermal elastic excitation and ultrasonic shock waves.
Specifically, the cutting tool can be a diamond tool, the ultrasonic vibration assembly is horizontally arranged on a guide rail of the machine tool body and is excited out of phase along the axial direction of the amplitude transformer by two piezoelectric ceramic elements, so that the diamond tool generates ultrasonic vibration along the cutting speed direction. During cutting, the ultrasonic vibration component excites the diamond cutter to generate ultrasonic shock waves in a chip forming region, the generated ultrasonic shock waves act on a chip contact region of the cutting cutter in a mechanical shock wave mode, namely ultrasonic vibration is applied to the bottom of the cantilever beam (the connection part of chips and a ceramic particle reinforced metal matrix composite material workpiece when the chips are not separated from the ceramic particle reinforced metal matrix composite material workpiece), and the flow stress of the chip forming region in the cutting process is changed; the pulse laser component simultaneously emits pulse laser radiation cutting chips to form a domain, the ceramic particle reinforced metal matrix composite workpiece quickly absorbs energy after being irradiated by the pulse laser, the heat generated by the absorbed laser energy is not diffused in the near-field surface area of the ceramic particle reinforced metal matrix composite workpiece to form a great temperature gradient, the temperature gradient generated by the thermoelastic excitation is equivalent to an ultrasonic source embedded into the near-field surface of the ceramic particle reinforced metal matrix composite workpiece, and the thermoelastic ultrasonic generated after the thermoelastic expansion can cause the change of the near-field stress on the surface of the ceramic particle reinforced metal matrix composite workpiece. The two ultrasonic energy fields cooperate to induce the chip forming domain to generate Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization phenomena, the flowing stress of the chip forming domain is changed together, and the machinability of the ceramic particle reinforced metal matrix composite workpiece is improved, wherein the principle is shown in figure 3.
The incidence angle of the pulse laser refers to the angle between the incident beam and the rake face of the diamond tool, as shown in fig. 5. The parameters (laser output power, spot diameter, pulse width, pulse repetition frequency and the like) of the nanosecond pulse laser, the parameters of the ultrasonic vibration component and the parameters (spindle rotating speed, feed amount, cutting depth and the like) of the machine tool body have different range values according to the ceramic particle reinforced metal matrix composite material made of different materials, and can be set according to actual cutting requirements. In the cutting process, a workpiece to be cut is driven by a machine tool spindle to rotate to form main cutting motion, the direction of feed motion and the direction of cutting depth mainly depend on the cutting form (the turning end face and the turning excircle) of the ceramic particle reinforced metal matrix composite workpiece, and the diamond cutter which performs ultrasonic vibration and the pulse laser head of the pulse laser assembly perform synergistic action along the direction of feed motion, so that the thermal elastic excitation-ultrasonic impact two energy fields of the ceramic particle reinforced metal matrix composite workpiece are cut in a synergistic manner.
Compared with the defects and shortcomings of the prior art, the invention has the following advantages:
(1) the pulse laser induces and generates thermoelastic stress waves in a chip forming domain of a ceramic particle reinforced metal matrix composite workpiece in a cutting process, nanosecond pulse laser with short pulse width, high repetition frequency and high pulse power density acts on the chip forming domain to generate thermoelastic excitation and conduct in the chip forming domain in the form of ultrasonic thermoelastic stress waves, and the average power density of the pulse laser is small, so that ablation cannot be generated on the surface of the workpiece. The pulse laser is commonly used in the field of nondestructive detection, mainly based on the 'nondestructive' characteristic of thermo-elastic excitation on the surface of a workpiece, but for the micron-scale range of the surface layer of the workpiece, the temperature gradient generated by the thermo-elastic excitation is equivalent to an ultrasonic source embedded into the workpiece, and the generated thermo-elastic stress wave with ultrasonic frequency can cause the change of the surface stress of the workpiece, thereby being beneficial to improving the machinability of the ceramic particle reinforced metal matrix composite workpiece;
(2) the ultrasonic vibration component makes the diamond cutter generate ultrasonic frequency vibration along the cutting speed direction, and ultrasonic shock wave induced by the cutter acts on the bottom of a cantilever beam (a part without separating chips) in a chip forming domain and is conducted in the form of ultrasonic shock wave in the chip forming domain; the mechanical shock wave with ultrasonic frequency acts on a cutter-chip contact area, namely ultrasonic vibration is applied to the bottom of the cantilever beam, so that the flow stress of a chip forming area in the cutting process is changed, and the machinability of the ceramic particle reinforced metal matrix composite workpiece is improved; on the other hand, the intermittent removal of workpiece materials is realized, the average cutting force in the machining process is effectively reduced, the discharge of cutting chips is facilitated, and the surface machining quality is improved;
(3) ultrasonic frequency thermoelastic stress waves generated by nanosecond pulse laser induction and ultrasonic shock waves generated by diamond cutter induction are acted on a chip forming region of a workpiece in a synergistic manner, and under the synergistic effect of the two energy fields, the chip forming region of the metal-based composite workpiece reinforced by ceramic particles is induced to generate the phenomena of Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization, so that the internal flow stress of the workpiece is reduced, and the machinability of the metal-based composite workpiece reinforced by the ceramic particles is improved.
Example 3
An embodiment of the present invention further provides a thermoelastic excitation-ultrasonic impact collaborative cutting method, which is based on the thermoelastic excitation-ultrasonic impact collaborative cutting system described in any one of the above, and the method includes the following steps:
installing a SiC/Al composite material workpiece (the volume percentage is 20%) on a main shaft of a machine tool body, and enabling the SiC/Al composite material workpiece to rotate around the axial lead of the main shaft to form main cutting motion;
the ultrasonic vibration component is arranged on a guide rail of the machine tool body, and the pulse laser component is connected with the ultrasonic vibration component through an additional clamp;
mounting a cutting tool on the ultrasonic vibration assembly and finishing tool setting;
adjusting the incident angle of the pulse laser so that the pulse laser directly irradiates the surface of the SiC/Al composite material workpiece;
the parameters of the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are set, the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are started, and the workpiece to be cut completes cutting operation under the synergistic action of two energy fields of thermal elastic excitation and ultrasonic shock waves.
Specifically, the cutting tool can be a diamond tool, the ultrasonic vibration assembly is horizontally arranged on a guide rail of the machine tool body and is excited out of phase along the axial direction of the amplitude transformer by two piezoelectric ceramic elements, so that the diamond tool generates ultrasonic vibration along the cutting speed direction. The incident angle of the pulse laser is the angle between the incident beam and the rake face of the cutting tool, as shown in fig. 5. The power density of the pulse laser is 105W/cm2-106W/cm2The pulse repetition frequency is not less than 20kHz, and the incident angle is 30-90 degrees; the frequency of vibration generated by the diamond cutter excited by the ultrasonic vibration component is not less than 20kHz, and the vibration amplitude is 5-7 mu m. Preferably, the power density of the pulsed laser is 106W/cm2The pulse repetition frequency is 20kHz, the incident angle is 30 degrees, and the pulse laser emitted by the pulse laser head irradiates right in front of the tool tip of the diamond tool; the ultrasonic vibration device drives the diamond cutter on the ultrasonic vibration device to vibrate at an ultrasonic frequency along the cutting speed direction, the vibration frequency is 20kHz, and the vibration amplitude is 6 mu m.
During cutting, the ultrasonic vibration component excites the diamond cutter to generate ultrasonic shock waves in a chip forming region, the generated ultrasonic shock waves act on a chip contact region of the cutting cutter in a mechanical shock wave mode, namely ultrasonic vibration is applied to the bottom of a cantilever beam (the part where chips are connected with a SiC/Al composite workpiece when the chips are not separated from the SiC/Al composite workpiece), and the flow stress of the chip forming region in the cutting process is changed; the pulse laser component simultaneously emits pulse laser radiation cutting forming domains, the SiC/Al composite workpiece quickly absorbs energy after being irradiated by the pulse laser, heat generated by the absorbed laser energy is not diffused in a near-field surface region of the SiC/Al composite workpiece in time to form a large temperature gradient, the temperature gradient generated by the thermoelastic excitation is equivalent to an ultrasonic source embedded in the near-field surface of the SiC/Al composite workpiece, and thermoelastic ultrasonic waves generated after thermal expansion can cause the change of the near-field stress of the surface of the SiC/Al composite workpiece. The two ultrasonic energy fields cooperate to induce the chip forming domain to generate Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization phenomena, the flow stress of the chip forming domain is changed together, and the machinability of the SiC/Al composite workpiece is improved, wherein the principle is shown in figure 4.
In the cutting process, the SiC/Al composite workpiece is driven by a machine tool spindle to rotate to form main cutting motion, the feeding motion direction and the cutting depth direction mainly depend on the cutting form (turning end face and turning excircle) of the SiC/Al composite workpiece, and the diamond cutter performing ultrasonic vibration and the pulse laser head of the pulse laser assembly perform synergistic action along the feeding motion direction, so that the thermal elastic excitation-ultrasonic impact two energy fields of the SiC/Al composite workpiece are cut in a coordinated mode.
Compared with the defects and shortcomings of the prior art, the invention has the following advantages:
(1) the pulse laser induces a chip forming domain of the SiC/Al composite workpiece to generate thermoelastic stress waves in the cutting process, the nanosecond pulse laser with short pulse width, high repetition frequency and high pulse power density acts on the chip forming domain to generate thermoelastic excitation and is conducted in the chip forming domain in the form of ultrasonic thermoelastic stress waves, the average power density of the pulse laser is small, and ablation cannot be generated on the surface of the workpiece. The pulsed laser is commonly used in the field of nondestructive testing, and is mainly based on the 'nondestructive' characteristic of thermo-elastic excitation on the surface of a workpiece, but for the micron-sized range of the surface layer of the workpiece, the temperature gradient generated by the thermo-elastic excitation is equivalent to an ultrasonic source embedded into the workpiece, and the generated thermo-elastic stress wave with ultrasonic frequency can cause the change of the surface stress of the workpiece, thereby being beneficial to improving the machinability of the SiC/Al composite workpiece;
(2) the ultrasonic vibration component makes the diamond cutter generate ultrasonic frequency vibration along the cutting speed direction, and ultrasonic shock wave induced by the cutter acts on the bottom of a cantilever beam (a part without separating chips) in a chip forming domain and is conducted in the form of ultrasonic shock wave in the chip forming domain; the mechanical shock wave with ultrasonic frequency acts on a cutter-chip contact area, namely ultrasonic vibration is applied to the bottom of the cantilever beam, so that the flow stress of a chip forming area in the cutting process is changed, and the machinability of the SiC/Al composite workpiece is improved; on the other hand, the intermittent removal of workpiece materials is realized, the average cutting force in the machining process is effectively reduced, the discharge of cutting chips is facilitated, and the surface machining quality is improved;
(3) ultrasonic frequency thermoelastic stress waves generated by nanosecond pulse laser induction and ultrasonic shock waves generated by diamond cutter induction are acted on a chip forming region of a workpiece in a synergistic manner, and the chip forming region of the SiC/Al composite workpiece is induced to generate Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization under the synergistic effect of the two energy fields, so that the internal flow stress of the workpiece is reduced, and the machinability of the SiC/Al composite workpiece is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A thermoelastic excitation-ultrasonic impact collaborative cutting system comprising a cutting tool and a machine tool body for mounting a workpiece to be cut, characterized in that the system further comprises:
an ultrasonic vibration assembly; the cutting tool being excited by the ultrasonic vibratory assembly to generate an ultrasonic shock wave in a chip forming region; the ultrasonic shock wave acts on a cutting tool-chip contact area in the form of a mechanical shock wave;
a pulsed laser assembly for emitting pulsed laser radiation to a chip forming domain to induce thermo-elastic excitation within the chip forming domain;
an additional clamp for connecting the ultrasonic vibration assembly and the pulsed laser assembly so that a spot of the pulsed laser always radiates a chip forming domain;
the chip forming domain generates Blaha effect, local nonlinear resonance, particle refinement and nanocrystallization phenomena under the common induction of the ultrasonic shock wave and the thermoelastic excitation.
2. The thermoelastic excitation-ultrasonic impact collaborative cutting system according to claim 1, wherein the ultrasonic vibration assembly is electrically connected with an ultrasonic power source.
3. The thermoelastic excitation-ultrasonic impact collaborative cutting system according to claim 1, wherein the pulsed laser assembly comprises:
a pulse laser head; the pulse laser head is arranged on the additional clamp;
a nanosecond pulsed laser; the pulse laser head is connected with the nanosecond pulse laser through an optical fiber.
4. The thermoelastic stimulation-ultrasonic impact collaborative cutting system according to claim 3, further comprising:
a cooling system; the cooling system is connected with the nanosecond pulse laser.
5. The thermoelastic excitation-ultrasonic impact collaborative cutting system according to claim 1, further comprising a detection mechanism; the detection mechanism includes:
a high-speed camera; the high-speed camera is arranged on one side of a workpiece to be cut;
an image acquisition card; the image acquisition card is electrically connected with the high-speed camera;
a force sensor; the force sensor is arranged on the ultrasonic vibration assembly;
a signal collector; the force sensor is electrically connected with the signal collector;
a charge amplifier; the signal collector is electrically connected with the charge amplifier;
a computer; the charge amplifier and the image acquisition card are electrically connected with the computer.
6. A thermo-elastic excitation-ultrasonic impact collaborative cutting method based on the thermo-elastic excitation-ultrasonic impact collaborative cutting system according to any one of claims 1-5, characterized by comprising the following steps:
installing a workpiece to be cut on a main shaft of a machine tool body, and rotating the workpiece to be cut around the axial lead of the main shaft to form main cutting motion;
the ultrasonic vibration component is arranged on a guide rail of the machine tool body, and the pulse laser component is connected with the ultrasonic vibration component through an additional clamp;
mounting a cutting tool on the ultrasonic vibration assembly and finishing tool setting;
adjusting the incident angle of the pulse laser so that the pulse laser directly irradiates the surface of the workpiece to be cut;
the parameters of the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are set, the pulse laser assembly, the ultrasonic vibration assembly and the machine tool body are started, and the workpiece to be cut completes cutting operation under the synergistic action of two energy fields of thermal elastic excitation and ultrasonic shock waves.
7. The thermoelastic excitation-ultrasonic impact collaborative cutting method according to claim 6, wherein the material of the workpiece to be cut is a ceramic particle reinforced metal matrix composite.
8. The thermoelastic excitation-ultrasonic impact collaborative cutting method according to claim 7, characterized in that the material of the workpiece to be cut is a SiC/Al composite material.
9. The thermoelastic excitation-ultrasonic impact collaborative cutting method according to claim 8, wherein the power density of the pulse laser is in a range of 105W/cm2-106W/cm2The pulse repetition frequency is not less than 20kHz, and the incident angle is 30-90 degrees; the cutting tool is excited by the ultrasonic vibration component to generate vibration with the frequency not less than 20kHz and the vibration amplitude of 5-7 mu m.
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